A chip integration module cooled by dry ice microparticle fluid jet.

Abstract

This invention provides a chip integration module utilizing dry ice microparticle fluid jet cooling, comprising a support substrate, a liquid distribution and gas collection plate, a packaging cover, and a chip assembly. The chip assembly, comprising multiple chips, is mounted on the upper surface of the support substrate. Each chip has an internal cavity, and each chip's sidewall has a through hole communicating with the cavity. The liquid distribution and gas collection plate has an exhaust channel and a liquid supply channel. A gas collection cavity is formed between the liquid distribution and gas collection plate and the chips, with an exhaust pipe communicating with the gas collection cavity, which in turn communicates with the exhaust channel. At least some chips have injection holes on their tops communicating with the cavities, and a nozzle is provided on the liquid distribution and gas collection plate corresponding to each injection hole, with each nozzle communicating with the liquid supply channel. In this invention, each chip has a built-in cavity serving as a heat dissipation chamber. The dry ice microparticle fluid is directly injected into the cavity, effectively shortening the heat transfer path, reducing thermal resistance, and achieving high heat dissipation efficiency.

Description

Technical Field

[0001] This invention belongs to the field of thermal management technology for electronic devices, and in particular relates to a chip integration module that utilizes dry ice microparticle fluid jet cooling. Background Technology

[0002] With the exponential growth in computing power demands from fields such as artificial intelligence, high-performance computing, and autonomous driving, multi-chip heterogeneous integration has become a core path to overcome the physical performance bottlenecks of single chips and improve the overall computing power of systems. However, it has also brought unprecedented thermal management challenges. The heat flux per unit area of ​​integrated chips has increased dramatically, far exceeding the heat dissipation limits of traditional air cooling and conventional water cooling. Moreover, the power consumption differences of multi-chip functional units can easily lead to highly uneven heat distribution. The physical spacing of tens of micrometers between chips can induce significant thermal crosstalk effects. Coupled with the stringent limitations on heat dissipation space imposed by the compact packaging structure, this further exacerbates the risk of local hotspot overheating and hardware failure. Existing cooling technologies are insufficient to meet the heat dissipation requirements of multi-chip integrated modules, and the development of efficient cooling technologies has become a key research focus in the field of thermal management of electronic devices. Summary of the Invention

[0003] In view of this, the present invention aims to overcome the deficiencies in the prior art and proposes a chip integration module that utilizes dry ice microparticle fluid jet cooling.

[0004] To achieve the above objectives, the technical solution created by this invention is implemented as follows: A chip integration module that utilizes dry ice microparticle fluid jet cooling includes a support substrate, a liquid distribution and gas collection plate, a package cover, and a chip assembly. The support substrate is located at the bottom layer, and the chip assembly is mounted on its upper surface. The chip assembly includes multiple chips, each chip has a cavity inside, and each chip has a through hole on its side wall that communicates with the cavity. The through holes between two adjacent chips are connected by a connecting pipe, and the through holes on the side walls that are not connected to adjacent chips by a connecting pipe are connected to an air outlet pipe. The liquid-distributing and gas-collecting plate is located above the chip assembly and has an exhaust channel and a liquid supply channel inside. A gas collection cavity is formed between the liquid-distributing and gas-collecting plate and the chip. The gas outlet pipe is connected to the gas collection cavity, and the gas collection cavity is connected to the exhaust channel. At least some chips have injection holes on their tops that are connected to the cavity. Even chips without injection holes are connected to the cavity of adjacent chips through connecting pipes. A nozzle is provided on the liquid-distributing and gas-collecting plate for each injection hole, and each nozzle is connected to the liquid supply channel. The nozzles are used to throttle, depressurize, and cool the liquid CO2 that is introduced into the liquid supply channel through the liquid supply channel, forming dry ice microparticle fluid, which is then impacted and injected into the cavity of the corresponding chip. The encapsulation cover is an open-bottomed cover structure that covers the outside of the liquid distribution and gas collection plate and is sealed to the support substrate. The chip assembly is located inside the encapsulation cover.

[0005] Furthermore, it also includes a liquid supply pipe, the liquid supply channel including multiple liquid branches, the nozzle on the top of the chip is connected to its corresponding liquid branch, each liquid branch is connected to the liquid supply pipe, and the liquid supply pipe extends out of the liquid distribution and gas collection plate.

[0006] Furthermore, it also includes an exhaust manifold, the exhaust passage being connected to the exhaust manifold, and the encapsulation cover extending beyond the exhaust manifold. Furthermore, the encapsulation cover is a hollow structure with an open bottom, including a top plate and a vertical plate arranged around the bottom side of the top plate. The top plate has a perforated hole through which the exhaust manifold passes. The inner wall of the vertical plate is sealed to the outer wall of the supporting substrate, or the lower surface of the vertical plate is sealed to the upper surface of the supporting substrate.

[0007] Furthermore, both the exhaust channel and the liquid supply channel are disposed on the liquid distribution and gas collection plate, with the liquid supply channel disposed near the lower surface of the top plate and the exhaust channel disposed near the upper surface of the chip assembly.

[0008] Furthermore, the chips are arranged in an array, including a central chip at the center, corner chips at the four corners, and side chips at the center of the four sides; at least the central chip and corner chips are provided with the nozzles on their tops; the side chips are not provided with nozzles on their tops, and their cavities are connected to the cavities of adjacent chips through the connecting pipes.

[0009] Furthermore, the through hole of the central chip is connected to the through holes of each side chip through a connecting pipe, and the through hole of the corner chip is connected to the through hole of the adjacent side chip through a connecting pipe; the through holes of the side chips facing away from the side wall of the adjacent central chip and the through holes of the corner chips facing away from the side wall of the adjacent side chip are connected to the gas collection chamber through the gas outlet pipe.

[0010] Furthermore, the through holes are provided on all four side walls of the cavity of each chip.

[0011] Furthermore, the lower side of the liquid-dispensing and gas-collecting plate is provided with a protruding portion, which includes a main body and a sealing structure that seals with the outer wall of the chip. The main body structure and the chip assembly form the gas collection cavity.

[0012] Furthermore, the lower side of the liquid-dispensing and gas-collecting plate is provided with protrusions around the chip assembly, and the main structure of each protrusion forms a gas collection cavity with the chip assembly.

[0013] Compared with existing technologies, the present invention has the following advantages: Each chip in this invention has a built-in cavity serving as a heat dissipation chamber. The liquid distribution and gas collection plate integrates liquid supply and exhaust functions, and the entire package is covered, resulting in a compact structure and small package size. Dry ice microparticle fluid is directly injected into the cavity, effectively shortening the heat transfer path and reducing thermal resistance. Liquid CO2 is throttled, depressurized, and cooled using nozzles to form dry ice microparticle fluid. This achieves synergistic cooling of gas-solid two-phase flow impact heat transfer and dry ice sublimation latent heat within the chip's cavity, resulting in high heat dissipation efficiency. Furthermore, all CO2 is ultimately discharged as a gas, leaving no liquid residue and eliminating the risk of leakage, ensuring a safe and reliable system. Attached Figure Description

[0014] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 A schematic diagram of the structure of an embodiment of the present invention; Figure 2 for Figure 1 Structural cross-sectional view along the AA direction; Figure 3 for Figure 1 Structural cross-sectional view along the BB direction; Figure 4 for Figure 1 Cross-sectional view of the structure in the CC direction.

[0015] Explanation of reference numerals in the attached figures: 1. Supporting substrate; 2. Liquid distribution and gas collection plate; 3. Encapsulation cover; 4. Gas collection chamber body; 5. First nozzle; 6. Liquid supply pipe; 7. Gas collection chamber; 8. Protruding part; 9. Cavity; 10. First gas outlet pipe; 11. First connecting pipe; 12. Second connecting pipe; 13. Second gas outlet pipe; 14. First chip; 15. Second chip; 16. Third chip; 17. Fourth chip; 18. Fifth chip; 19. Sixth chip; 20. Seventh chip; 21. Eighth chip; 22. Ninth chip; 23. Second nozzle; 24. Third nozzle; 25. Fourth nozzle; 26. Fifth nozzle; 27. Third liquid channel; 28. Second liquid channel; 29. ​​Fourth liquid channel; 30. Exhaust main pipe; 31. First liquid channel. Detailed Implementation

[0016] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0017] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0018] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0019] The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] like Figures 1 to 4 As shown, this embodiment provides a chip integration module cooled by dry ice microparticle fluid jet cooling. The support substrate 1 is located at the bottom layer, serving as the mechanical support foundation for the entire module. A chip assembly is mounted on the upper surface of the support substrate 1. The chip assembly includes nine chips arranged in a 3×3 array: first chip 14, second chip 15, third chip 16, fourth chip 17, fifth chip 18, sixth chip 19, seventh chip 20, eighth chip 21, and ninth chip 22. Each chip has an internal cavity 9, forming a built-in heat dissipation cavity. Each chip has through holes communicating with the cavities on its four sidewalls, and at least some chips have injection holes communicating with the cavities on their tops.

[0021] The liquid-distributing and gas-collecting plate 2 is located above the chip assembly and is in close contact with the top surface of each chip. The liquid-distributing and gas-collecting plate 2 has an exhaust channel and a liquid supply channel inside. The liquid supply channel includes a first liquid supply channel 31, a second liquid channel 28, a third liquid channel 27, and a fourth liquid channel 29. One end of each liquid branch is connected to a nozzle on the top of the corresponding chip, and the other end is connected to a liquid supply pipe 6. The exhaust channel includes a gas collecting chamber body 4 located within the top plate of the liquid-distributing and gas-collecting plate 2, and a gas collecting chamber 7 formed by a protruding portion on the lower side of the liquid-distributing and gas-collecting plate 2 and four side walls. The gas collecting chamber is connected to the gas collecting chamber body, and the gas collecting chamber body is connected to the exhaust manifold 30.

[0022] The lower side of the liquid-separating and gas-collecting plate 2 has a protruding portion 8, which includes a main body and a sealing structure that seals with the outer wall of the chip. A gas collecting cavity is formed between the main body structure and the chip assembly. As an example, the lower side of the liquid-separating and gas-collecting plate 2 has protruding portions around the chip assembly, and the main body structure of each protruding portion forms a gas collecting cavity with the chip assembly. They are arranged around the chip assembly to facilitate comprehensive gas collection.

[0023] Nozzles are provided on the liquid-dispensing and gas-collecting plate 2 corresponding to each injection hole. For example, the top of the fifth chip 18 corresponds to the first nozzle 5; the top of the first chip 14 corresponds to the second nozzle 23; the top of the third chip 16 corresponds to the third nozzle 24; the top of the seventh chip 20 corresponds to the fourth nozzle 25; and the top of the ninth chip 22 corresponds to the fifth nozzle 26. Each nozzle is connected to the corresponding liquid branch in the liquid supply channel. The nozzles are used to throttle, depressurize, and cool the liquid CO2, forming dry ice microparticles that are then injected into the cavity of the corresponding chip. Working principle: Liquid carbon dioxide undergoes a Joule-Thomson throttling expansion effect through the nozzle orifice, reaching a low-pressure environment. After the pressure drops sharply, some of the liquid vaporizes instantly, absorbing a large amount of latent heat of phase change, while the temperature of the remaining liquid drops sharply to below -78.5℃, directly solidifying into dry ice microparticles.

[0024] The encapsulation cover 3 is an open-bottomed structure, including a top plate and a vertical plate surrounding the bottom of the top plate. The encapsulation cover 3 covers the outside of the liquid distribution and gas collection plate 2, and the chip assembly is located inside the encapsulation cover 3. The inner wall of the vertical plate is sealed to the outer wall of the supporting substrate 1. For example, the inner wall of the vertical plate and the outer wall of the supporting substrate 1 are sealed by interference fit or welding, which is suitable for applications with high airtightness requirements. Alternatively, the lower surface of the vertical plate is sealed to the upper surface of the supporting substrate 1 to ensure a sealed cooling environment inside the module. For example, a sealing gasket is placed between the lower surface of the vertical plate and the upper surface of the supporting substrate 1, and the seal is achieved by bolt tightening, which facilitates the disassembly and maintenance of the module.

[0025] The top plate of the encapsulation cover 3 has a perforated hole through which the exhaust manifold 30 passes. The exhaust manifold 30 extends out of the encapsulation cover 3 to discharge gas from the module.

[0026] In one alternative design, multiple chips are arranged in a 3×3 array, where, Central chip: Chip 18, the fifth chip, is located at the center of the array; Corner chips: Chip 14, chip 16, chip 20, and chip 22 are located at the four corners respectively; Side chips: Second chip 15, fourth chip 17, sixth chip 19, and eighth chip 21 are located at the center of the four sides respectively.

[0027] The four sidewall through holes of the fifth chip 18 are connected to the corresponding sidewall through holes of the second chip 15, the fourth chip 17, the sixth chip 19, and the eighth chip 21 through the first connecting pipe 11 and the second connecting pipe 12.

[0028] The first chip 14, the third chip 16, the seventh chip 20, and the ninth chip 22 have sidewall through holes facing the adjacent side chip, which are connected to the side through holes of the adjacent side chip through connecting pipes.

[0029] The through holes of the second chip 15, the fourth chip 17, the sixth chip 19, and the eighth chip 21, which are opposite to the sidewalls of the adjacent central chip, and the through holes of the first chip 14, the third chip 16, the seventh chip 20, and the ninth chip 22, which are opposite to the sidewalls of the adjacent side chips, are connected to the gas collection chamber through the first vent pipe 10 and the second vent pipe 13. It should be noted that, in this invention application, the sidewall opposite to the adjacent central chip refers to the sidewall that is not connected to the adjacent central chip through a connecting pipe, and the sidewall opposite to the adjacent side chip refers to the sidewall that is not connected to the adjacent side chip through a connecting pipe.

[0030] The cooling process of this invention is as follows: High-pressure liquid CO2 supplied by an external system enters the liquid supply channel within the liquid distribution and gas collection plate 2 via the liquid supply pipe 6, and flows to the corresponding nozzles through each liquid branch. Typically, the liquid CO2 supply pressure ranges from 0.7 to 1 MPa, the temperature ranges from -50 to -44℃, and the flow rate is related to the nozzle orifice diameter. As a distance, the nozzle adopts a variable diameter structure, with an inlet inner diameter of approximately 3 mm and an outlet inner diameter of approximately 1.5 mm, and a flow rate range of approximately 0.5 to 0.6 kg / min. The flow rate increases with increasing orifice diameter.

[0031] Liquid CO2 is throttled and depressurized through the first nozzle 5, the second nozzle 23, the third nozzle 24, the fourth nozzle 25, and the fifth nozzle 26. Due to the sudden pressure drop, the liquid CO2 undergoes flash evaporation and partial condensation, forming a mixed fluid of dry ice particles and gaseous CO2, namely, dry ice particle fluid.

[0032] Dry ice microparticles are injected into the cavities of the fifth chip 18, the first chip 14, the third chip 16, the seventh chip 20, and the ninth chip 22. Inside the cavities, the dry ice microparticles undergo gas-solid two-phase flow impact heat exchange with the inner wall of the cavity, while the dry ice sublimates and absorbs a large amount of latent heat, directly cooling the chips.

[0033] After absorbing heat, the fluid (low-temperature gas and incompletely sublimated dry ice particles) enters the cavities of adjacent chips 15, 17, 19, and 21 through the through-holes and connecting pipes on the chip sidewall. Since the side chips do not have independent nozzles, their cooling mainly relies on the residual cooling of the fluid from the adjacent chips. The fluid continues to absorb heat in the cavities of the side chips, and the remaining dry ice particles sublimate, causing the gas temperature to gradually increase.

[0034] Finally, the heated gas enters the gas collection chamber through each outlet pipe, then flows into the main body of the gas collection chamber, and is discharged from the integrated module through the exhaust manifold 30, returning to the external system for recycling.

[0035] It should be noted that the above scheme is designed for the central chip (fifth chip 18) and corner chips (first chip 14, third chip 16, seventh chip 20, and ninth chip 22) where the heat flux density is relatively high, and they are cooled directly by receiving dry ice microparticle fluid sprayed from the nozzle. The side chips (second chip 15, fourth chip 17, sixth chip 19, and eighth chip 21) have relatively low heat flux density and do not have independent nozzles; they are cooled by the residual cooling of the fluid after it has been cooled by adjacent chips.

[0036] In summary, nozzles can be set for chips with relatively high heat flux densities based on the actual heat flux density differences of each chip. The flow rate of each nozzle can also be controlled by adjusting the nozzle selection or parameters, so that the central and corner chips can obtain cooling capacity that matches their heat load, achieving on-demand distribution and efficient utilization of cooling capacity.

[0037] The chip assembly can be expanded to a larger number of arrays, such as 4×4, 5×5, etc., or an asymmetrical layout can be adopted according to actual packaging requirements. Correspondingly, the layout of the liquid supply and exhaust channels, the number and position of nozzles, and the arrangement of connecting pipes and exhaust pipes within the liquid distribution and gas collection plate 2 are adjusted accordingly. The layout of the chip assembly is not limited to a symmetrical array; an asymmetrical layout can also be adopted according to actual packaging requirements. Regardless of the number and layout of chips, the core design principle remains unchanged: based on the heat flux density distribution of each chip, nozzles are placed on the top of chips with higher unit heat generation, allowing them to directly receive dry ice microparticle fluid for cooling; chips with lower unit heat generation do not have nozzles, but are connected to the cavities of adjacent chips through connecting pipes, utilizing the residual cooling heat from the fluid cooled by adjacent chips for cooling. Through this method, the cooling medium can be distributed on demand among different chips, ensuring heat dissipation while improving the utilization efficiency of the cooling medium and reducing system energy consumption.

[0038] Each chip in this invention has a built-in cavity serving as a heat dissipation chamber. Dry ice microparticle fluid is directly injected through nozzles into the cavity wall of the chip, which has injection holes. This achieves zero-distance heat exchange between the heat-generating chip and the cooling medium, effectively shortening the heat transfer path and significantly reducing thermal resistance. The liquid distribution and gas collection plate integrates liquid supply and exhaust functions, and the entire package is covered, resulting in a compact structure and small package size. Liquid CO2 is throttled, depressurized, and cooled through nozzles to form dry ice microparticle fluid. This achieves synergistic cooling of gas-solid two-phase flow impact heat exchange and the latent heat of dry ice sublimation within the chip's cavity. Compared to traditional external cooling methods, the heat dissipation efficiency per unit area is effectively improved. Furthermore, all CO2 is ultimately discharged as gas during the heat exchange process, leaving no liquid residue inside the module and eliminating the risk of leakage, ensuring system safety and reliability. Simultaneously, nozzles can be flexibly placed on the top of chips with higher heat generation, based on the actual heat flux density differences of each chip. Chips with lower heat generation can obtain residual cooling from adjacent chips through connecting pipes, achieving on-demand distribution and efficient utilization of cooling capacity.

[0039] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip integration module using dry ice microparticle fluid jet cooling, characterized in that: This includes a support substrate, a liquid distribution and gas collection plate, a packaging cover, and chip components; The support substrate is located at the bottom layer, and the chip assembly is mounted on its upper surface. The chip assembly includes multiple chips, each chip has a cavity inside, and each chip has a through hole on its side wall that communicates with the cavity. The through holes between two adjacent chips are connected by a connecting pipe, and the through holes on the side walls that are not connected to adjacent chips by a connecting pipe are connected to an air outlet pipe. The liquid-distributing and gas-collecting plate is located above the chip assembly and has an exhaust channel and a liquid supply channel inside. A gas collection cavity is formed between the liquid-distributing and gas-collecting plate and the chip. The gas outlet pipe is connected to the gas collection cavity, and the gas collection cavity is connected to the exhaust channel. At least some chips have injection holes on their tops that are connected to the cavity. Each injection hole on the liquid-distributing and gas-collecting plate is equipped with a nozzle, and each nozzle is connected to the liquid supply channel. The nozzle is used to throttle, depressurize, and cool liquid CO2 to form dry ice microparticle fluid, which is then injected into the cavity of the corresponding chip. The encapsulation cover is an open-bottomed cover structure that covers the outside of the liquid distribution and gas collection plate and the chip assembly, and is sealed to the support substrate.

2. The chip integration module using dry ice microparticle fluid jet cooling according to claim 1, characterized in that: It also includes a liquid supply pipe, the liquid supply channel includes multiple liquid branches, the nozzle on the top of each chip is connected to its corresponding liquid branch, each liquid branch is connected to the liquid supply pipe, and the liquid supply pipe extends out of the liquid distribution and gas collection plate.

3. A chip integration module using dry ice microparticle fluid jet cooling according to claim 1, characterized in that: It also includes an exhaust manifold, the exhaust passage is connected to the exhaust manifold, and the exhaust manifold extends out of the encapsulation cover.

4. A chip integration module using dry ice microparticle fluid jet cooling according to claim 3, characterized in that: The encapsulation cover is a hollow structure with an open bottom, including a top plate and a vertical plate arranged around the bottom side of the top plate. The top plate has a perforated hole through which the exhaust manifold passes. The inner wall of the vertical plate is sealed to the outer wall of the supporting substrate, or the lower surface of the vertical plate is sealed to the upper surface of the supporting substrate.

5. A chip integration module using dry ice microparticle fluid jet cooling according to claim 4, characterized in that: Both the exhaust channel and the liquid supply channel are located on the liquid distribution and gas collection plate, with the liquid supply channel located near the lower surface of the top plate and the exhaust channel located near the chip assembly.

6. A chip integration module using dry ice microparticle fluid jet cooling according to claim 1, characterized in that: The chips are arranged in an array, including a central chip at the center, corner chips at the four corners, and side chips at the center of the four sides; at least the central chip and corner chips have nozzles on their tops; the side chips do not have nozzles on their tops, and their cavities are connected to the cavities of adjacent chips through the connecting pipes.

7. A chip integration module using dry ice microparticle fluid jet cooling according to claim 6, characterized in that: The through hole of the central chip is connected to the through holes of each side chip through a connecting pipe, and the through hole of the corner chip is connected to the through hole of the adjacent side chip through a connecting pipe; the through holes of the side chips facing away from the side wall of the adjacent central chip and the through holes of the corner chips facing away from the side wall of the adjacent side chip are connected to the gas collection chamber through the gas outlet pipe.

8. A chip integration module using dry ice microparticle fluid jet cooling according to claim 1, characterized in that: Each chip's cavity has through holes on all four side walls.

9. A chip integration module using dry ice microparticle fluid jet cooling according to any one of claims 1 to 8, characterized in that: The lower side of the liquid-dispensing and gas-collecting plate is provided with a protruding part, which includes a main body and a sealing structure that seals with the outer wall of the chip. The main body structure and the chip assembly form the gas collection cavity.

10. A chip integration module using dry ice microparticle fluid jet cooling according to claim 9, characterized in that: The lower side of the liquid-dispensing and gas-collecting plate is provided with protrusions around the chip assembly, and the main structure of each protrusion forms a gas collection cavity with the chip assembly.

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