Chip heat dissipation device, electronic component, and electronic device

Abstract

The application relates to the technical field of chip packaging, and discloses a chip heat dissipation device, an electronic element and an electronic equipment, which comprise a substrate loaded with at least one chip; an outer heat dissipation shell connected with the substrate and forming a first containing cavity with the substrate; the outer heat dissipation shell is provided with a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are communicated with the first containing cavity; the first liquid inlet is used for allowing a first cooling medium to flow into the first containing cavity, and the first liquid outlet is used for allowing the first cooling medium to flow out of the first containing cavity; at least one inner heat dissipation structure is located in the first containing cavity; the inner heat dissipation structure comprises an inner heat dissipation shell and a second cooling medium; the inner heat dissipation shell is connected with the substrate and forms a second containing cavity with the substrate; the second cooling medium and the chip are located in the second containing cavity, and the second cooling medium at least immerses the chip. The chip heat dissipation device, the electronic element and the electronic equipment improve heat dissipation efficiency and energy efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to a chip heat dissipation device, electronic components, and electronic devices. Background Technology

[0002] Against the backdrop of rapid development in information technology, chip integration and performance continue to leap forward, but the resulting challenges in thermal management are becoming increasingly severe. Especially in fields such as high-performance computing, artificial intelligence, and cloud computing, chip power density is rising sharply, placing higher demands on heat dissipation solutions. Traditional heat dissipation methods, such as heat sinks and fans, are no longer sufficient to meet the heat dissipation needs of high-power chips, especially in ultra-thin devices and highly integrated chips, where the contradiction between space constraints and heat dissipation efficiency is becoming increasingly prominent.

[0003] To overcome this bottleneck, advanced heat dissipation technologies have emerged. Among them, liquid cooling technology, which absorbs heat by encapsulating a heat sink and introducing flowing coolant, has achieved some results, but it is still difficult to meet the heat dissipation requirements of today's highly integrated chips. Summary of the Invention

[0004] One objective of this invention is to provide a chip heat dissipation device to solve the problem that the heat dissipation effect of existing liquid cooling technology is poor and cannot meet the heat dissipation requirements of current highly integrated chips; another objective is to provide an electronic component; and a third objective is to provide an electronic device.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A chip heat dissipation device includes: a substrate on which at least one chip is mounted; an outer heat dissipation shell connected to the substrate and forming a first accommodating cavity therebetween; the outer heat dissipation shell having a first liquid inlet and a first liquid outlet, both of which are connected to the first accommodating cavity; the first liquid inlet for allowing a first cooling medium to flow into the first accommodating cavity, and the first liquid outlet for allowing the first cooling medium to flow out of the first accommodating cavity; at least one inner heat dissipation structure located within the first accommodating cavity; the inner heat dissipation structure including an inner heat dissipation shell and a second cooling medium; the inner heat dissipation shell connected to the substrate and forming a second accommodating cavity therebetween; the second cooling medium and the chip are located within the second accommodating cavity, and the second cooling medium at least submerges the chip.

[0007] According to the aforementioned technical means, the internal heat dissipation structure uses a second cooling medium to immerse the chip, and in conjunction with the inner heat dissipation shell, quickly transfers heat to the outer heat dissipation shell. Inside the outer heat dissipation shell, a flowing first cooling medium rapidly removes the heat. This solution utilizes the flow and immersion design of the cooling medium to significantly improve the heat dissipation effect of liquid cooling technology. By rationally controlling the flow rate of the first cooling medium and the immersion of the chip by the second cooling medium, the stable operation of the chip heat dissipation device under high power consumption conditions is ensured, which is not possible with traditional heat dissipation systems. Especially for a single high-power chip, the chip heat dissipation device of this application can effectively meet the heat dissipation requirements. Furthermore, the chip heat dissipation device of this solution utilizes a flowing first cooling medium and a second cooling matrix immersing the chip for heat dissipation. Compared with traditional heat dissipation systems, the additional energy consumption of the chip cooling device in this solution is low, saving energy and improving energy efficiency.

[0008] Furthermore, it includes a first fin group; the first fin group includes a plurality of first fins; the plurality of first fins are located within the first accommodating cavity and are spaced apart on the inner heat dissipation shell.

[0009] According to the above-mentioned technical means, setting the first fin group on the outside of the inner heat dissipation shell can further enhance the heat transfer effect of the inner heat dissipation structure, thereby improving the heat dissipation efficiency.

[0010] Furthermore, the first fin is prismatic; and / or, the first fin includes a first surface exposed within the first receiving cavity, the area of ​​which is greater than 90 cm². 2 .

[0011] According to the above technical means, the prismatic first fin has a large contact area with the first cooling medium, resulting in good heat dissipation and improved heat dissipation efficiency; and reasonable control of the area of ​​the first surface in the first fin can further ensure the heat dissipation effect, enabling the chip heat dissipation device to cool down more efficiently, thereby ensuring the stable operation of the chip.

[0012] Furthermore, it includes a second fin group; the second fin group includes multiple second fins; the multiple second fins are located in the second accommodating cavity and are arranged at intervals or continuously on the inner heat dissipation shell.

[0013] According to the above-mentioned technical means, a second fin group is provided on the inner side of the inner heat dissipation shell. The second fin group cooperates with the first fin group to further enhance the heat transfer effect of the inner heat dissipation structure, thereby improving the heat dissipation efficiency.

[0014] Furthermore, the second fin is pyramidal in shape; and / or, the second fin includes a second surface exposed within the second receiving cavity, the area of ​​which is greater than 4.5 cm². 2 .

[0015] According to the above technical means, the pyramidal second fin occupies little space and has a large contact area with the second cooling medium, resulting in good heat dissipation and further improving heat dissipation efficiency; while reasonable control of the area of ​​the second surface in the second fin can further ensure the heat dissipation effect, enabling the chip heat dissipation device to cool down more efficiently, thereby ensuring the stable operation of the chip.

[0016] Furthermore, it includes a substrate heat dissipation structure; the substrate heat dissipation structure and the internal heat dissipation structure are located on opposite sides of the substrate in the thickness direction.

[0017] Based on the above technical means, the internal heat dissipation structure and the substrate heat dissipation structure are located on both sides of the substrate thickness direction, respectively, realizing double-layer cooling of the substrate and further enhancing the heat dissipation efficiency of the chip heat dissipation device.

[0018] Furthermore, the substrate heat dissipation structure includes a substrate heat dissipation shell, which is connected to the substrate and forms a third accommodating cavity with the substrate; the substrate heat dissipation shell has a second liquid inlet and a second liquid outlet, both of which are connected to the third accommodating cavity; the second liquid inlet is used to allow the first cooling medium to flow into the third accommodating cavity, and the second liquid outlet is used to allow the first cooling medium to flow out of the third accommodating cavity.

[0019] Based on the above technical means, the substrate heat dissipation structure uses a flowing first cooling medium to remove heat, which has high heat dissipation efficiency and low additional energy consumption, thus improving energy efficiency.

[0020] Furthermore, the substrate heat dissipation structure includes multiple third fins, which are located within a third accommodating cavity and are spaced apart on the substrate.

[0021] According to the above-mentioned technical means, a third fin is provided in the third accommodating cavity, which increases the contact area with the first cooling medium, enhances the heat dissipation effect on the substrate, and further improves the heat dissipation efficiency of the chip heat dissipation device.

[0022] Furthermore, the outer heat sink, inner heat sink, first fin group, and substrate heat sink are made of aluminum; and / or, the second fin group is made of copper.

[0023] Based on the above technical means, some structures use aluminum, which has excellent thermal conductivity and is inexpensive, as the heat dissipation material, while other structures use copper, which has better thermal conductivity but is more expensive than aluminum, as the heat dissipation material. By rationally constructing an aluminum-copper gradient material system, the cost can be saved to the maximum extent while ensuring heat dissipation efficiency, thereby improving economy and practicality.

[0024] Furthermore, the chip heat dissipation device includes at least one of a first heat dissipation component, a second heat dissipation component, and a third heat dissipation component; the first heat dissipation component includes an internal heat dissipation structure; the second heat dissipation component includes an internal heat dissipation structure, a first fin group, and a second fin group; the third heat dissipation component includes an internal heat dissipation structure, a first fin group, a second fin group, and a substrate heat dissipation structure.

[0025] Based on the above technical means, traditional chip heat dissipation systems are often designed for a single chip. However, this solution, by setting up a first heat dissipation component, a second heat dissipation component, and a third heat dissipation component with different structures, can reasonably configure the heat dissipation components according to the chip's energy consumption, forming a configurable chip heat dissipation device that can simultaneously meet the heat dissipation needs of high, medium, and low power chips, thereby improving the flexibility and applicability of the chip heat dissipation device.

[0026] Furthermore, the chip heat dissipation device includes a first cooling medium; when the chip is a low-power chip, the flow rate of the first cooling medium is less than or equal to 0.5 × 10⁻⁶. -9 L / s; or, when the chip is a medium-power chip, the flow rate of the first cooling medium is between 0.5 × 10 L / s. -9 L / s and 2.0×10 -9 Between; or, when the chip is a high-power chip, the flow rate of the first cooling medium is greater than or equal to 2.0 × 10⁻⁶. -9 L / s.

[0027] Based on the above technical means, by reasonably controlling the flow rate of the first cooling medium according to the power consumption of the chip, it is possible to ensure that the chip heat dissipation device meets the heat dissipation requirements of chips with varying power consumption, ensuring the stable operation of the chip, especially high-power chips, and further improving the flexibility and applicability of the chip heat dissipation device.

[0028] An electronic component includes a chip heat dissipation device as described above.

[0029] An electronic device includes a chip heat dissipation device as described above; or, includes electronic components as described above.

[0030] The beneficial effects of this invention are:

[0031] (1) The internal heat dissipation structure of this invention employs a second cooling medium to immerse the chip, and in conjunction with the inner heat dissipation shell, rapidly transfers heat to the outer heat dissipation shell. The outer heat dissipation shell then uses a flowing first cooling medium to quickly remove the heat. This solution utilizes the flow and immersion design of the cooling medium to significantly improve the heat dissipation effect of liquid cooling technology. By rationally controlling the flow rate of the first cooling medium and the immersion of the chip by the second cooling medium, the stable operation of the chip heat dissipation device under high power consumption conditions is ensured, which is not possible with traditional heat dissipation systems. Especially for a single high-power chip, the chip heat dissipation device of this application can effectively meet the heat dissipation requirements.

[0032] (2) The chip heat dissipation device of this solution uses a flowing first cooling medium and a second cooling matrix immersed in the chip for heat dissipation. Compared with the traditional heat dissipation system, the chip cooling device of this solution has low additional energy consumption, saves energy consumption, and improves energy efficiency. Attached Figure Description

[0033] Figure 1 This is a cross-sectional view of the chip heat dissipation device of the present invention;

[0034] Figure 2 This is a top view of the chip heat dissipation device of the present invention;

[0035] Figure 3 This is a cross-sectional view of the first heat dissipation component in the chip heat dissipation device of the present invention;

[0036] Figure 4 This is a cross-sectional view of the second heat dissipation component in the chip heat dissipation device of the present invention;

[0037] Figure 5 This is a cross-sectional view of the third heat dissipation component in the chip heat dissipation device of the present invention.

[0038] The following are the labels: 1-substrate; 2-chip; 21-low power chip; 22-medium power chip; 23-high power chip; 3-outer heat sink; 30-first accommodating cavity; 31-first liquid inlet; 32-first liquid outlet; 4-internal heat dissipation structure; 40-second accommodating cavity; 41-inner heat sink; 42-second cooling medium; 5-first fin group; 51-first fin; 511-first surface; 512-second surface; 513-third surface; 6-second fin group; 61-second fin; 7-substrate heat sink; 70-third accommodating cavity; 71-second liquid inlet; 72-second liquid outlet; 8-third fin; 9-first cooling medium; 100-first heat dissipation component; 200-second heat dissipation component; 300-third heat dissipation component. Detailed Implementation

[0039] The embodiments of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention and not for limiting the scope of protection of the present invention.

[0040] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0041] This embodiment proposes a chip heat dissipation device, such as... Figures 1-5 As shown, the system includes: a substrate 1, at least one chip 2 mounted on the substrate 1, an external heat dissipation structure, and at least one internal heat dissipation structure 4. Specifically, the external heat dissipation structure includes an external heat dissipation shell 3 and a first cooling medium 9. The external heat dissipation shell 3 is connected to the substrate 1 and forms a first accommodating cavity 30 between itself and the substrate 1. The external heat dissipation shell 3 has a first liquid inlet 31 and a first liquid outlet 32, both of which are connected to the first accommodating cavity 30. The first liquid inlet 31 is used to allow the first cooling medium 9 to flow into the first accommodating cavity 30, and the first liquid outlet 32 ​​is used to allow the first cooling medium 9 to flow out of the first accommodating cavity 30. The at least one internal heat dissipation structure 4 is located within the first accommodating cavity 30, and the internal heat dissipation structure 4 includes an internal heat dissipation shell 41 and a second cooling medium 42. The internal heat dissipation shell 41 is connected to the substrate 1 and forms a second accommodating cavity 40 between itself and the substrate 1. The second cooling medium 42 and the chip 2 are located in the second accommodating cavity 40. The second cooling medium 42 at least submerges the chip 2, and preferably, the second cooling medium 42 fills the second accommodating cavity 40.

[0042] In this embodiment, the inner heat dissipation structure 4 uses a second cooling medium 42 to immerse the chip 2, and works in conjunction with the inner heat dissipation shell 41 to quickly transfer heat to the outer heat dissipation shell 3. Inside the outer heat dissipation shell 3, a flowing first cooling medium 9 rapidly removes the heat. This embodiment utilizes the flow and immersion design of the cooling medium to significantly improve the heat dissipation effect of liquid cooling technology. By rationally controlling the flow rate of the first cooling medium 9 and the immersion of the chip 2 by the second cooling medium 42, the stable operation of the chip heat dissipation device under high power consumption is ensured, which is not possible with traditional heat dissipation systems. Especially for a single high-power chip 23, the chip heat dissipation device of this application can effectively meet the heat dissipation requirements. Furthermore, the chip heat dissipation device of this embodiment utilizes the flowing first cooling medium 9 and the second cooling matrix immersing the chip 2 for heat dissipation. Compared with traditional heat dissipation systems, the additional energy consumption of the chip 2 cooling device in this solution is low, saving energy and improving energy efficiency.

[0043] For example, such as Figure 1 and Figure 2As shown, multiple chips 2 are spaced apart on the substrate 1. Each chip 2 can be a single bare chip or a group of bare chips. Correspondingly, multiple internal heat dissipation structures 4 are provided, all located within the first accommodating cavity 30. The internal heat dissipation shells 41 of the multiple internal heat dissipation structures 4 respectively cover the outer sides of the multiple chips 2 and are connected to the top of the substrate 1, such as through welding or adhesive bonding. The external heat dissipation shells 3 cover the outer sides of the multiple internal heat dissipation structures 4 and are connected to the substrate 1, such as through welding or adhesive bonding. It is understood that the number of internal heat dissipation structures 4 can be the same as or different from the number of chips 2. In some special cases, some chips 2 have lower power and do not require additional internal heat dissipation structures 4; in this case, the number of chips 2 can be greater than the number of internal heat dissipation structures 4.

[0044] Furthermore, the first cooling medium 9 can be a gaseous or liquid cooling medium, preferably a liquid cooling medium. In application, the first cooling medium 9 enters the first accommodating cavity 30 through the first inlet 31 and flows out of the first accommodating cavity 30 through the first outlet 32, exhibiting a fluid dynamic to remove heat and ensure the working state of the chip 2. For example, the first cooling medium 9 can be a 30%-40% concentration ethylene glycol solution, which has high thermal conductivity, corrosion resistance, and electrical insulation. For example, the first cooling medium 9 can also be a fluorinated liquid, which has excellent electrical insulation and thermal conductivity, and strong chemical stability.

[0045] Furthermore, the second cooling medium 42 can be a gaseous, liquid, or solid cooling medium, preferably a liquid cooling medium. In application, the second cooling medium 42 directly immerses the chip 2, quickly transferring heat to the first cooling medium 9 to ensure heat dissipation efficiency. For example, the second cooling medium 42 can be a fluorocarbon coolant, which has high specific heat capacity, boiling point, and thermal conductivity, is non-corrosive to metals, does not easily volatilize, and has a long lifespan. It can quickly absorb and transfer heat, enabling the cooling system to cool more efficiently. The thermal conductivity of fluorocarbon coolants is typically in the range of 0.1–0.2 W / (m·K). For example, the second cooling medium 42 can also be a perfluorocarbon coolant, which has better thermal conductivity, is non-conductive, and does not corrode metals, making it suitable for efficient heat dissipation.

[0046] In some embodiments, the chip heat dissipation device further includes a first fin group 5, which includes a plurality of first fins 51. The plurality of first fins 51 are located within the first accommodating cavity 30 and are spaced apart on the inner heat dissipation shell 41. In this embodiment, the first fin group 5 is positioned on the outer side of the inner heat dissipation shell 41 to further enhance the heat transfer effect of the inner heat dissipation structure 4. The spaced arrangement of the plurality of first fins 51 in the first fin group 5 increases the contact area between the first fins 51 and the first cooling medium 9, thereby improving heat dissipation efficiency. Specifically, the outer side of the inner heat dissipation shell 41 refers to the side of the inner heat dissipation shell 41 facing the first accommodating cavity 30.

[0047] Furthermore, the first fin 51 is prismatic in shape. The prismatic first fin 51 has a large contact area with the first cooling medium 9, resulting in good heat dissipation and improved heat dissipation efficiency.

[0048] Furthermore, the first fin 51 includes a first surface exposed within the first receiving cavity 30, the area of ​​which is greater than 90 cm². 2 Reasonably controlling the area of ​​the first surface in the first fin 51 can further ensure the heat dissipation effect, enabling the chip heat dissipation device to cool down more efficiently, thereby ensuring the stable operation of chip 2.

[0049] For example, the inner heat dissipation shell 41 has a hemispherical shell structure and an outer surface. A plurality of first fins 51 are connected to this outer surface and are spaced apart along its diameter. Figure 4 As shown, the first fin 51 has a first surface 511, a third surface 513, a second surface 512, and a fourth surface connected in sequence. The fourth surface is attached to and connected to the outer surface, such as by welding or adhesive bonding, or the first fin 51 and the inner heat sink 41 are integrally formed. The first surface 511, the second surface 512, and the third surface 513 are exposed within the first accommodating cavity 30, and the area of ​​the first surface is the sum of the areas of the first surface 511, the second surface 512, and the third surface 513.

[0050] For example, the first surface 511 and the second surface 512 can be inclined surfaces, and the third surface 513 can be an arc-shaped surface. For example, the angle between the first surface 511 or the second surface 512 and the outer surface can be any value between 45° and 60°, such as 45°, 50°, 55°, 45°, etc. Within this range, convection efficiency can be improved, thereby improving heat dissipation efficiency. It is understood that the angle between the first surface 511 and the outer surface specifically refers to the angle between the first surface 511 and the tangent of the outer surface at the junction of the first surface 511 and the outer surface, and the angle between the second surface 512 and the outer surface specifically refers to the angle between the second surface 512 and the tangent of the outer surface at the junction of the second surface 512 and the outer surface.

[0051] In some embodiments, the chip heat dissipation device further includes a second fin group 6, which includes a plurality of second fins 61. The plurality of second fins 61 are located within the second accommodating cavity 40 and are spaced apart or continuously disposed on the inner heat dissipation shell 41. In this embodiment, the second fin group 6 is disposed on the inner side of the inner heat dissipation shell 41. The second fin group 6 cooperates with the first fin group 5 to further enhance the heat transfer effect of the inner heat dissipation structure 4, thereby improving heat dissipation efficiency. Specifically, the inner side of the inner heat dissipation shell 41 refers to the side of the inner heat dissipation shell 41 facing the second accommodating cavity 40.

[0052] Furthermore, the second fin 61 is pyramidal in shape. The pyramidal second fin 61 occupies little space and has a large contact area with the second cooling medium 42, resulting in good heat dissipation and further improving heat dissipation efficiency.

[0053] Furthermore, the second fin 61 includes a second surface exposed within the second receiving cavity 40, the area of ​​which is greater than 4.5 cm². 2 By properly controlling the area of ​​the second surface in the second fin 61, the heat dissipation effect can be further guaranteed, enabling the chip heat dissipation device to cool down more efficiently, thereby ensuring the stable operation of chip 2.

[0054] For example, the inner heat dissipation shell 41 has a hemispherical shell structure and an inner surface. Multiple second fins 61 are connected to this inner surface. Each second fin 61 is pyramidal in shape, having a polygonal base and at least three triangular sides. The base is attached to and connected to the inner surface, such as by welding, adhesive bonding, or the second fin 61 is integrally formed with the inner heat dissipation shell 41. This configuration ensures that the sides of the multiple second fins 61, whether spaced apart or continuous, can fully contact the second cooling medium 42, guaranteeing effective heat dissipation. For example, the second fins 61 can be triangular, quadrangular, or pentagonal pyramidal. The sides of the second fins 61 are exposed within the second receiving cavity 40, and the area of ​​the second surface is the sum of the areas of all the sides of the second fin 61. For example, the multiple second fins 61 of the second fin group 6 can be arranged in an array, a gradient arrangement, or an irregular arrangement.

[0055] Understandably, the areas of the first surface of the first fin 51 and the second surface of the second fin 61 are essentially the areas of the vertical surfaces of the fins. The area of ​​the vertical surfaces of the fins determines the speed and optimal state of heat absorption and dissipation from the device. If the selected area of ​​the vertical surface of the fin is too small, the expected cooling may not be achieved; if it is too large, it will affect the compactness and cost of the electronic circuitry. This invention, by reasonably setting the areas of the vertical surfaces of the first fin 51 and the second fin 61, facilitates the control of the compactness and cost of the electronic circuitry while ensuring that the expected cooling effect is achieved.

[0056] Based on thermodynamic formulas and simulation results, the following can be derived: ΔTi=T1-T2,WJ=A·ΔT_i·4 / 990; where T1 is the highest consolidation temperature of the device, taken as 80℃; T2 is the ambient temperature, taken as 25℃; A is the area of ​​the vertical surface of the fin; and WJ is the heat dissipation power.

[0057] When the area of ​​the vertical surface of the fin is greater than 90 cm² 2 When, according to the formula, its WJ1>20w; when the area of ​​the vertical surface of the fin is greater than 4.5cm². 2According to the formula, WJ2 > 1W. Therefore, when the outer and inner sides of the inner heat sink 41 are respectively provided with the first fin group 5 and the second fin group 6, and the area of ​​the first surface of the first fin 51 is greater than 90cm2 and the area of ​​the second surface of the second fin 61 is greater than 4.5cm2, the heat dissipation power generated by the two is WJ = WJ1 + WJ2 > 21W. The power consumption of the high-power chip 23 is usually 20W, the power consumption of the medium-power chip 22 is usually between 1 and 20W, and the power consumption of the low-power chip 21 is usually less than 1W. At this time, the heat dissipation power generated by the first fin group 5 and the second fin group 6 can meet the heat dissipation needs of the low-power chip 21, the medium-power chip 22, and even some of the high-power chips 23.

[0058] In some embodiments, such as Figure 1 As shown, the chip heat dissipation device also includes a substrate heat dissipation structure. The substrate heat dissipation structure and the inner heat dissipation structure 4 are located on opposite sides of the substrate 1 in the thickness direction. In this embodiment, the inner heat dissipation structure 4 and the substrate heat dissipation structure are located on opposite sides of the substrate 1 in the thickness direction, achieving double-layer cooling of the substrate 1 and further enhancing the heat dissipation efficiency of the chip heat dissipation device.

[0059] Furthermore, the substrate heat dissipation structure includes a substrate heat dissipation shell 7, which is connected to the substrate 1, such as by welding or adhesive bonding, and forms a third accommodating cavity 70 between the substrate heat dissipation shell 7 and the substrate 1. The substrate heat dissipation shell 7 has a second liquid inlet 71 and a second liquid outlet 72, both of which are connected to the third accommodating cavity 70. The second liquid inlet 71 is used to allow the first cooling medium 9 to flow into the third accommodating cavity 70, and the second liquid outlet 72 is used to allow the first cooling medium 9 to flow out of the third accommodating cavity 70. In this embodiment, the substrate heat dissipation structure uses the flowing first cooling medium 9 to remove heat, resulting in high heat dissipation efficiency and low additional energy consumption, thus improving energy efficiency.

[0060] Furthermore, the substrate heat dissipation structure includes a plurality of third fins 8, which are located within the third accommodating cavity 70 and spaced apart on the substrate 1. In this embodiment, the placement of the third fins 8 within the third accommodating cavity 70 increases the contact area with the first cooling medium 9, enhances the heat dissipation effect on the substrate 1, and further improves the heat dissipation efficiency of the chip heat dissipation device.

[0061] For example, the first fin 51 can be prism-shaped, such as a tetragonal prism, a pentagonal prism, a hexagonal prism, etc. The first fin 51 is connected to the substrate 1, such as by welding, bonding with insulating adhesive, etc.

[0062] Furthermore, the outer heat sink 3, inner heat sink 41, first fin group 5, and substrate heat sink 7 can be made of aluminum. Of course, the outer heat sink 3, inner heat sink 41, first fin group 5, and substrate heat sink 7 can also be made of copper, gold, or other materials with good thermal conductivity.

[0063] Furthermore, the material of the second fin group 6 can be copper. Of course, the material of the second fin group 6 can also be aluminum, gold, or other materials with good thermal conductivity.

[0064] In some embodiments, the outer heat sink 3, inner heat sink 41, first fin group 5, and substrate heat sink 7 are made of aluminum, while the second fin group 6 is made of copper. In this case, some structures use aluminum, a metal with excellent thermal conductivity and low cost, as the heat dissipation material, while others use copper, which has better thermal conductivity but is more expensive than aluminum. This rationally constructs a gradient material system of aluminum and copper, ensuring heat dissipation efficiency while maximizing cost savings and improving economic efficiency and practicality.

[0065] Furthermore, traditional chip heat dissipation devices are often designed only for a single chip 2, making it difficult to simultaneously meet the heat dissipation needs of chips 2 with different power ratings, or resulting in insufficient heat dissipation or excessive additional power consumption. This invention provides a rational configuration for the heat dissipation device of chip 2, enabling it to simultaneously address the heat dissipation needs of high, medium, and low power chips, thus improving the flexibility and applicability of the chip heat dissipation device.

[0066] Specifically, in some embodiments, the chip heat dissipation device includes at least one of a first heat dissipation component 100, a second heat dissipation component 200, and a third heat dissipation component 300. The first heat dissipation component 100 includes an internal heat dissipation structure 4. The second heat dissipation component 200 includes an internal heat dissipation structure 4, a first fin group 5, and a second fin group 6. The third heat dissipation component 300 includes an internal heat dissipation structure 4, a first fin group 5, a second fin group 6, and a substrate heat dissipation structure. In this embodiment, by setting the first heat dissipation component 100, the second heat dissipation component 200, and the third heat dissipation component 300 with different compositions, the heat dissipation components can be rationally configured according to the power consumption of the chip 2, forming a configurable chip heat dissipation device that can simultaneously meet the heat dissipation needs of high, medium, and low power chips, thereby improving the flexibility and applicability of the chip heat dissipation device.

[0067] For example, such as Figure 1 and Figure 2 As shown, a plurality of chips 2 are mounted on the substrate 1, including at least one low-power chip 21, at least one medium-power chip 22 and at least one high-power chip 23.

[0068] Among them, the low-power chip 21 is typically applicable to a power range of less than 1W, and has a relatively low heat dissipation requirement. In this case, a first heat dissipation component 100 is configured for the low-power chip 21. For example... Figure 3 As shown, the first heat dissipation component 100 includes a low-power chip 21 and an internal heat dissipation structure 4. The low-power chip 21 is connected to the substrate 1 via multiple solder balls. The internal heat dissipation structure 4 has an inner heat dissipation shell 41 covering the low-power chip 21 and fixedly connected to the substrate 1. The inner heat dissipation shell 41 and the substrate 1 form the aforementioned second accommodating cavity 40, which is filled with a second cooling medium 42. In this way, while meeting the heat dissipation requirements of the low-power chip 21, the structure can be simplified and materials can be saved.

[0069] Among them, the medium power consumption chip 22 is typically applicable to a power range between 1-20W, with moderate heat dissipation requirements. In this case, a second heat dissipation component 200 is configured for the medium power consumption chip 22. For example Figure 4 As shown, the second heat dissipation assembly 200 includes a medium-power chip 22, an internal heat dissipation structure 4, a first fin group 5, and a second fin group 6. The medium-power chip 22 is connected to the substrate 1 via multiple solder balls. The internal heat dissipation shell 41 of the internal heat dissipation structure 4 covers the medium-power chip 22 and is fixedly connected to the substrate 1. The second accommodating cavity 40 is formed between the internal heat dissipation shell 41 and the substrate 1, and the second accommodating cavity 40 is filled with a second cooling medium 42. Multiple first fins 51 of the first fin group 5 are uniformly disposed on the outer side of the internal heat dissipation shell 41, and multiple second fins 61 of the second fin group 6 are uniformly disposed on the inner side of the internal heat dissipation shell 41. In this way, the heat dissipation requirements of the medium-power chip 22 can be fully met.

[0070] Among them, the high-power chip 23 is typically applicable to a power range greater than 20W, requiring significant heat dissipation. Therefore, a third heat dissipation component 300 is configured for the high-power chip 23. For example... Figure 5 As shown, the third heat dissipation component 300 includes a high-power chip 23, an internal heat dissipation structure 4, a first fin group 5, a second fin group 6, and a substrate heat dissipation structure. The high-power chip 23 is connected to the substrate 1 via multiple solder balls. The inner heat dissipation shell 41 of the internal heat dissipation structure 4 covers the high-power chip 23 and is fixedly connected to the substrate 1. The second accommodating cavity 40 is formed between the inner heat dissipation shell 41 and the substrate 1, and the second accommodating cavity 40 is filled with a second cooling medium 42. Multiple first fins 51 of the first fin group 5 are uniformly disposed on the outer side of the inner heat dissipation shell 41, and multiple second fins 61 of the second fin group 6 are uniformly disposed on the inner side of the inner heat dissipation shell 41. In the thickness direction of the substrate 1, the substrate heat dissipation structure and the internal heat dissipation structure 4 are arranged opposite to each other, dissipating heat on both sides of the substrate 1 to achieve double-layer cooling. In this way, the heat dissipation requirements of the high-power chip 23 can be fully met.

[0071] Understandably, in this embodiment, the chip heat dissipation device also includes the aforementioned external heat dissipation structure. The external heat dissipation shell 3 of the external heat dissipation structure is disposed on the outside of the internal heat dissipation structure 4, the first fin group 5, and the second fin group 6 of the first heat dissipation component 100, the second heat dissipation component 200, and the third heat dissipation component 300, which will not be described in detail here.

[0072] Understandably, in this embodiment, the number of the first heat dissipation component 100, the second heat dissipation component 200, and the third heat dissipation component 300 and their positions on the substrate 1 can be adjusted according to the power consumption of the chip 2 to achieve configurability of the chip heat dissipation device.

[0073] Furthermore, in some embodiments, when chip 2 is a low-power chip 21, the flow rate of the first cooling medium 9 is less than or equal to 0.5 × 10⁻⁶. -9 L / s. Alternatively, when chip 2 is a medium-power chip 22, the flow rate of the first cooling medium 9 is between 0.5 × 10 L / s. -9 L / s and 2.0×10 -9 Between. Or, when chip 2 is a high-power chip 23, the flow rate of the first cooling medium 9 is greater than or equal to 2.0 × 10. -9 L / s. In this embodiment, by reasonably controlling the flow rate of the first cooling medium 9 according to the power consumption of chip 2, it is possible to ensure that the chip heat dissipation device meets the heat dissipation requirements of each power consumption chip 2, ensuring the stable operation of chip 2, especially high power consumption chip 23, and further improving the flexibility and applicability of the chip heat dissipation device.

[0074] According to the water cooling heat dissipation formula, ΔT = Tout - Tin, and P power = Cp·ρ·q·ΔT. Where Tout is the temperature of the first cooling medium 9 after it flows out of the first and third accommodating cavities 30 and 70; Tin is the temperature of the first cooling medium 9 before it flows into the first and third accommodating cavities 30 and 70; q is the flow rate of the first cooling medium 9 at the first inlet 31 or the second inlet 71; P power is the heat dissipation power of the entire chip heat dissipation device; ρ is the density of the first cooling medium 9; and Cp is the specific heat capacity of the first cooling medium 9. The coolant temperature rise ΔT = Tout - Tin, and the measured ΔT is 4℃.

[0075] Taking a chip heat dissipation device that only contains a high-power chip 23 with a power of 20W as an example, the high-power chip 23 is equipped with the aforementioned external heat dissipation device. The first cooling medium 9 is an ethylene glycol solution with a density of 1.113 g / ml (at an ambient temperature of 25°C), a specific heat capacity of 2.35 × 10^3 J / (kg*°C), and a boiling point of 195–198°C. The flow rate of the first cooling medium 9 at the first inlet 31 or the second inlet 71 is 2.0 × 10^(-9) L / s. According to the formula, P power = 20.92 W > 20 W, which means that the heat dissipation power of the entire chip heat dissipation device is greater than the power of the high-power chip 23. Therefore, when the flow rate of the first cooling medium 9 is greater than 2.0 × 10^(-9) L / s, the heat dissipation power is greater than the power of the high-power chip 23. -9 L / s can meet the heat dissipation requirements of the high-power chip 23.

[0076] When chip 2 is a low-power chip 21 or a medium-power chip 22, the verification process is similar and will not be repeated here.

[0077] Understandably, in this embodiment, the flow rate of the first cooling medium 9 can be adaptively adjusted according to the type of chip 2 to meet the heat dissipation requirements of chip 2. When the aforementioned internal heat dissipation structure 4 is added, the flow rate of the first cooling medium 9 can be adaptively increased.

[0078] The novel heat dissipation device of this invention can solve the heat dissipation problem of Chiplet / SiP chips 2, especially meeting the heat dissipation requirements of high-power chips 23. It can also provide a configurable, high-efficiency chip heat dissipation system for chips 2 with different power consumption levels (high, medium, and low), and can be applied to different packaging environments. Its configuration can be found in Table 1. Chiplet is a technology that combines multiple small integrated circuit modules (chips). SiP (System in Package) is a technology that integrates multiple chips into a small package.

[0079]

[0080] Table 1

[0081] The battery cell heat dissipation device of the present invention has at least the following advantages:

[0082] 1. Thermodynamic simulation and experimental verification have demonstrated the effectiveness of the cell heat dissipation device of this invention under different power consumption conditions. Specifically, the structural temperature rise of the cell heat dissipation device of this invention is less than or equal to 15°C, while traditional heat dissipation structures typically exceed 35°C. The additional energy consumption of the cell heat dissipation device of this invention is 2.1W (measured data), while traditional heat dissipation structures, such as those using thermoelectric coolers, consume as much as 3.8W per thermoelectric cooler, resulting in a total additional energy consumption of 19W when the system contains 5 chips. Compared to this heat dissipation structure, the energy efficiency ratio of the cell heat dissipation device of this invention is improved by 89.5%. Therefore, the cell heat dissipation device of this invention has high heat dissipation efficiency, low additional energy consumption, and high energy efficiency.

[0083] 2. The optimized cooling medium flow and immersion design effectively meets the heat dissipation requirements of chip 2, especially for a single high-power chip 2. By rationally controlling the flow rate of the first cooling medium 9 and the immersion of the chip 2 by the second cooling medium 42, the stable operation of the chip heat dissipation device under high power consumption conditions is ensured, which is not available in traditional heat dissipation systems.

[0084] 3. High-efficiency heat dissipation device design: The heat dissipation structure of the present invention, including the design and material selection of the first fin 51 and the second fin 61, can effectively improve heat dissipation efficiency. In particular, the use of fluorocarbon coolant in the second cooling medium 42, and the area design of the vertical surfaces of the first fin 51 and the second fin 61, enable the chip heat dissipation device to cool down more efficiently, thereby ensuring the stable operation of the chip 2.

[0085] 4. Creating a gradient heat dissipation material system: Aluminum is used as the heat dissipation material in some parts of the structure, while copper is used in others, rationally constructing a gradient material system of aluminum (thermal conductivity 237 W / mK) and copper (401 W / mK). Actual testing shows that the thermal resistance of the traditional structure is 12.5℃ / W, while the thermal resistance of the cell heat dissipation device of this invention is 4.2℃ / W, a reduction of 66.4%.

[0086] 5. Flexible configuration of multi-chip heat dissipation system: Traditional chip heat dissipation systems are often designed for a single chip, while the chip heat dissipation device of the present invention is configurable. By reasonably configuring the heat dissipation components, it can simultaneously meet the heat dissipation needs of high, medium and low power chips, thereby improving the flexibility and applicability of the chip heat dissipation device.

[0087] This embodiment also proposes an electronic component, including the chip heat dissipation device as described above.

[0088] This embodiment also proposes an electronic device, including the chip heat dissipation device as described above; or, including the electronic components as described above.

[0089] The electronic components and electronic devices of the present invention include the above-mentioned chip heat dissipation device, which realizes the heat dissipation effect of liquid cooling technology by utilizing the flow and immersion design of cooling medium, and has low additional energy consumption, is configurable, and can meet the heat dissipation needs of chips 2 with different power consumption.

[0090] The above embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention.

Claims

1. A chip heat dissipation device, characterized in that, include: A substrate (1) on which at least one chip (2) is mounted; An outer heat dissipation shell (3) is connected to the substrate (1) and forms a first accommodating cavity (30) between the outer heat dissipation shell (3) and the substrate (1); the outer heat dissipation shell (3) has a first liquid inlet (31) and a first liquid outlet (32), both of which are connected to the first accommodating cavity (30); the first liquid inlet (31) is used to allow the first cooling medium (9) to flow into the first accommodating cavity (30), and the first liquid outlet (32) is used to allow the first cooling medium (9) to flow out of the first accommodating cavity (30); At least one internal heat dissipation structure (4) is located within the first accommodating cavity (30); the internal heat dissipation structure (4) includes an internal heat dissipation shell (41) and a second cooling medium (42); the internal heat dissipation shell (41) is connected to the substrate (1) and forms a second accommodating cavity (40) with the substrate (1); the second cooling medium (42) and the chip (2) are located within the second accommodating cavity (40), and the second cooling medium (42) at least submerges the chip (2).

2. The chip heat dissipation device according to claim 1, characterized in that: It includes a first fin group (5); the first fin group (5) includes a plurality of first fins (51); the plurality of first fins (51) are located in the first accommodating cavity (30) and are spaced apart on the inner heat dissipation shell (41).

3. The chip heat dissipation device according to claim 2, characterized in that: The first fin (51) is prismatic; and / or, The first fin (51) includes a first surface exposed within the first receiving cavity (30), the area of ​​the first surface being greater than 90 cm². 2 .

4. The chip heat dissipation device according to claim 2, characterized in that: It includes a second fin group (6); the second fin group (6) includes a plurality of second fins (61); the plurality of second fins (61) are located in the second accommodating cavity (40) and are arranged at intervals or continuously on the inner heat dissipation shell (41).

5. The chip heat dissipation device according to claim 4, characterized in that: The second fin (61) is pyramidal; and / or, The second fin (61) includes a second surface exposed within the second receiving cavity (40), the area of ​​which is greater than 4.5 cm². 2 .

6. The chip heat dissipation device according to claim 4, characterized in that: It includes a substrate heat dissipation structure; the substrate heat dissipation structure and the internal heat dissipation structure (4) are located on both sides of the thickness direction of the substrate (1) and are arranged opposite to each other.

7. The chip heat dissipation device according to claim 6, characterized in that: The substrate heat dissipation structure includes a substrate heat dissipation shell (7), which is connected to the substrate (1) and forms a third accommodating cavity (70) with the substrate (1). The substrate heat dissipation shell (7) has a second liquid inlet (71) and a second liquid outlet (72), both of which are connected to the third accommodating cavity (70). The second liquid inlet (71) is used to allow the first cooling medium (9) to flow into the third accommodating cavity (70), and the second liquid outlet (72) is used to allow the first cooling medium (9) to flow out of the third accommodating cavity (70).

8. The chip heat dissipation device according to claim 7, characterized in that: The heat dissipation structure of the substrate includes a plurality of third fins (8), which are located in the third accommodating cavity (70) and are spaced apart on the substrate (1).

9. The chip heat dissipation device according to claim 7, characterized in that: The outer heat dissipation shell (3), the inner heat dissipation shell (41), the first fin group (5), and the substrate heat dissipation shell (7) are made of aluminum; and / or, The material of the second fin group (6) is copper.

10. The chip heat dissipation device according to any one of claims 6-9, characterized in that: The chip heat dissipation device includes at least one of a first heat dissipation component (100), a second heat dissipation component (200), and a third heat dissipation component (300); The first heat dissipation component (100) includes the aforementioned internal heat dissipation structure (4); The second heat dissipation component (200) includes an internal heat dissipation structure (4), a first fin group (5), and a second fin group (6); The third heat dissipation component (300) includes an internal heat dissipation structure (4), a first fin group (5), a second fin group (6), and a substrate heat dissipation structure.

11. The chip heat dissipation device according to any one of claims 1-9, characterized in that: The chip heat dissipation device includes the first cooling medium (9); When the chip (2) is a low-power chip (21), the flow rate of the first cooling medium (9) is less than or equal to 0.5 × 10⁻⁶. -9 L / s; or, When the chip (2) is a medium-power chip (22), the flow rate of the first cooling medium (9) is between 0.5 × 10⁻⁶. -9 L / s and 2.0×10 -9 Between; or, When the chip (2) is a high-power chip (23), the flow rate of the first cooling medium (9) is greater than or equal to 2.0 × 10⁻⁶. -9 L / s.

12. An electronic component, characterized in that: Includes the chip heat dissipation device as described in any one of claims 1-11.

13. An electronic device, characterized in that: It includes the chip heat dissipation device as described in any one of claims 1-11; or, it includes the electronic component as described in claim 12.

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