A partitioned liquid supply manifold jet microchannel cold plate and method of manufacturing the same

Abstract

The application discloses a partition liquid supply manifold jet micro-channel cold plate, which comprises a total liquid inlet distribution layer, a partition liquid supply layer, a jet manifold layer and a micro-channel layer arranged in sequence from top to bottom. The partition liquid supply manifold jet micro-channel cold plate integrates the total liquid inlet distribution layer, the partition liquid supply layer, the jet manifold layer and the micro-channel layer, so that the total liquid can enter local liquid supply cavities corresponding to multiple heat source areas after being distributed by multiple stages, and then the liquid is discharged through the jet hole, the inlet manifold, the micro-channel, the outlet manifold and the confluence cavity to complete the intensified heat exchange and confluence, thereby improving the liquid supply uniformity and local heat dissipation capacity of the multiple heat source high-power electronic device.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology for electronic devices, specifically to a partitioned liquid supply manifold jet microchannel cold plate and its manufacturing method. Background Technology

[0002] With the development of high-power chips, power modules, advanced packaged devices, and other high heat flux density electronic devices, the distribution of internal heat sources is gradually evolving from the traditional single centralized type to a multi-heat source form with multiple discrete hot spots coexisting. For such high-power electronic devices, different heat source regions often differ in terms of spatial location, heating intensity, and heat flux density distribution, which makes the traditional cold plate structure designed for a single heat exchange area face new heat dissipation challenges under multi-heat source conditions.

[0003] Microchannel cold plates are widely used in the thermal management of high heat flux density electronic devices due to their high heat transfer capacity and short heat diffusion distance. Furthermore, manifold jet microchannel cold plates, by incorporating jet holes, inlet manifolds, outlet manifolds, and microchannel structures, can improve liquid distribution and enhance local heat transfer to a certain extent, while also controlling thermal resistance and pressure drop. However, most existing manifold jet microchannel cold plates are designed around a single, integrated heat transfer area. The upstream liquid supply method typically involves the liquid entering a single supply chamber through a main inlet and then being introduced into the heat transfer layer via a downstream structure. When the object being cooled consists of multiple heat sources or heat source arrays, this type of integrated liquid supply structure struggles to achieve directional liquid supply based on the location distribution of different hot spots.

[0004] Especially in high-power electronic devices with multiple heat sources, if the coolant flows within a large, interconnected cavity before entering the downstream heat exchange layer, it is often affected by differences in flow resistance, path length, and local pressure drop coupling effects. This leads to uneven coolant supply between different heat source areas, causing problems such as localized overheating, uneven temperature distribution, and insufficient cooling capacity in some areas. While increasing the total flow rate can alleviate these phenomena to some extent, it also results in higher pumping power consumption and overall pressure drop, which is detrimental to system engineering applications.

[0005] On the other hand, while using multiple completely independent cooling circuits to correspond to multiple heat source areas can improve the directional liquid supply capacity, it will significantly increase the complexity of the cold plate structure, manufacturing difficulty, and sealing requirements, thereby increasing the system cost. Therefore, how to achieve multi-stage diversion and zoned liquid supply of the total incoming liquid before it enters the downstream manifold jet microchannel heat exchange structure while maintaining the overall compactness of the cold plate structure is a key technical problem that urgently needs to be solved in the field of heat dissipation for high-power electronic devices with multiple heat sources.

[0006] Existing technologies include numerous solutions for microchannel cold plates, jet cooling, and multi-heat source heat dissipation. For example, patent CN115768045B, "Heat Radiator and Electronic Equipment," discloses a heat sink structure comprising a base plate, a jet plate, and a cover plate. The base plate has a microchannel structure, and the jet plate is equipped with jet channels and manifold structures to form staggered manifold inlets and outlets, utilizing microjet flow and manifold microchannels to achieve enhanced cooling. This solution effectively leverages the heat transfer enhancement provided by microjet flow and the pressure drop reduction provided by manifold microchannels. However, it primarily targets a single, overall heat transfer area and does not incorporate upstream multi-stage flow distribution structures for multiple heat sources, nor does it create independent local liquid supply chambers corresponding to each heat source region. Therefore, in high-power electronic devices with multiple heat sources, issues such as uneven liquid supply to different heat source regions and insufficient directional cooling capacity may still exist.

[0007] Patent CN109524376A, "A Multi-Jet Microchannel Chip Liquid Cooling Device," discloses a heat dissipation device combining an array of jet nozzles with a microchannel. Coolant is rapidly impacted against the bottom surface of the microchannel through openings in the array of jet nozzles at the top of the microchannel, and then flows along the microchannel for heat exchange. The design also includes a recovery layer, a recovery hole layer, a jet nozzle layer, and a microchannel layer to enhance the heat dissipation capacity of the chip's heat sources. While this technology focuses on the superimposed enhancement of heat exchange between the array of jets and the microchannel, its liquid supply structure primarily serves the overall cooling area, lacking a general liquid inlet distribution layer and zoned liquid supply layers for multiple heat source arrays. This makes it difficult to achieve relatively independent and controllable localized liquid supply between multiple heat source areas.

[0008] For heat dissipation from multiple heat sources, patent CN105118811A, "A Temperature Equalization Device for Heat Dissipation of Multiple Heat Source Devices Using a Heat Spreader and Microchannels," proposes placing a heat spreader above a substrate containing at least two heat sources, and setting microchannels above the heat spreader in the same number as the heat sources. This aims to solve the problems of uneven heat dissipation in high heat flux density electronic devices with multiple heat sources and large temperature gradients caused by temperature rise along the parallel microchannels. While this solution can diffuse heat through the heat spreader and combine it with microchannels for heat dissipation, it primarily relies on the heat diffusion capability of the heat spreader to improve temperature uniformity. The coolant is not introduced into independent local supply chambers corresponding to the heat source areas through a multi-stage flow distribution structure before entering the heat exchange layer, nor is it combined with a jet manifold microchannel structure to achieve localized enhanced heat transfer.

[0009] Furthermore, patent CN118315353B, "A Multi-Chip Array Liquid Distribution Structure for Internal Chip Cooling," discloses a two-stage liquid distribution channel and a two-stage liquid collection channel structure for multi-chip arrays. This structure achieves parallel flow channels between multiple chips and uniform flow distribution among chips through primary and secondary liquid distribution channels, thereby improving the temperature uniformity of the multi-chip array. While this solution is somewhat related to the problem of multi-heat source flow distribution, it primarily focuses on internal chip cooling and chip-level liquid distribution structures. Its structural form and application scenarios differ from external cold plate heat dissipation. Additionally, this solution does not employ a downstream enhanced heat exchange structure that couples jet holes, inlet manifolds, outlet manifolds, and manifold cavities with microchannels, making it difficult to directly address the collaborative design problem of "zoned liquid supply—jet introduction—manifold microchannel heat exchange—manifold discharge" within a compact cold plate.

[0010] Some existing microchannel cooling plate solutions focus on shortening the flow path and reducing pressure drop. For example, patent CN111328245B, "Folded-back Jet Microchannel Radiator and Heat Dissipation Method," divides a longer microchannel into multiple shorter flow units by alternating jet inlet holes and return holes, thereby reducing the working fluid temperature rise, improving bottom wall temperature uniformity, and decreasing the overall pressure drop. This type of solution demonstrates that the jet inlet and return structures have a positive effect on improving microchannel pressure drop and temperature uniformity; however, it still mainly focuses on dividing the flow units within a single heat exchange surface, without establishing a one-to-one correspondence between multiple local liquid supply chambers and multiple heat source regions, nor does it set up a total liquid inlet diversion layer and cylindrical liquid supply units upstream to achieve directional liquid supply to multiple heat sources.

[0011] In summary, although existing technologies have explored aspects such as enhanced heat transfer in jet microchannels, multi-stage flow distribution, multi-heat source temperature equalization, and multi-chip liquid distribution, the following shortcomings still exist: First, most manifold jet microchannel cold plates are mainly oriented towards a single overall heat exchange area, making it difficult to adapt to multiple heat sources; second, some multi-heat source heat dissipation solutions rely on heat spreaders or internal liquid distribution structures within the chips, lacking zoned liquid supply structures suitable for compact cold plates; third, existing multi-stage flow splitting or short-path microchannel structures usually do not establish a direct correspondence with the spatial distribution of heat sources, making it difficult to achieve directional liquid supply at the heat source level and localized enhanced cooling. Summary of the Invention

[0012] Purpose of the invention: The first purpose of this invention is to provide a partitioned liquid supply manifold jet microchannel cold plate that integrates a main liquid inlet distribution layer, a partitioned liquid supply layer, a jet manifold layer, and a microchannel layer into one unit. This allows the main liquid to be split into multiple local liquid supply chambers corresponding to multiple heat source areas after multi-stage distribution. Then, enhanced heat exchange and drainage are completed through jet holes, inlet manifolds, microchannels, outlet manifolds, and manifolds, thereby improving the liquid supply uniformity and local heat dissipation capacity of high-power electronic devices with multiple heat sources. The second objective is to provide a manufacturing method for the aforementioned partitioned liquid supply manifold jet microchannel cold plate, so as to ensure accurate forming, stable assembly and reliable connection of the multi-layer structure.

[0013] Technical solution: The partitioned liquid supply manifold jet microchannel cold plate provided by the present invention includes a main liquid inlet distribution layer, a partitioned liquid supply layer, a jet manifold layer and a microchannel layer arranged sequentially from top to bottom; The upper surface of the main liquid inlet diversion layer is provided with a main liquid inlet, and the lower surface is provided with multiple diversion grooves that communicate with the main liquid inlet; The partitioned liquid supply layer is provided with multiple vertically connected liquid supply units and multiple independent local liquid supply chambers. Each local liquid supply chamber is connected to the diversion channel through the liquid supply unit, and the bottom of the local liquid supply chamber is an open structure. The upper surface of the jet manifold layer is provided with multiple jet holes, and the lower surface is provided with an inlet manifold, an outlet manifold, and a manifold cavity communicating with the outlet manifold. A coolant outlet communicating with the manifold cavity is opened on the side of the jet manifold layer. The local liquid supply cavity is placed on the jet manifold layer, dividing the jet holes into multiple local areas. The upper end of the jet hole is connected to the local liquid supply cavity, and the lower end is connected to the inlet manifold. The upper surface of the microchannel layer is provided with multiple microchannels, and the back of the microchannel is provided with multiple heat source areas. The heat source areas correspond one-to-one with the local liquid supply chambers on the plane projection. After the coolant enters through the main inlet, it passes through the diversion channel, the liquid supply unit, the local liquid supply chamber, the jet hole, the inlet manifold, the microchannel, the outlet manifold and the junction chamber in sequence, and finally exits from the coolant outlet, realizing zoned liquid supply and directional cooling for multiple heat source areas.

[0014] Furthermore, the main liquid inlet is located in the middle region of the main liquid inlet diversion layer, and the multiple diversion channels are arranged radially with the main liquid inlet as the starting point.

[0015] Furthermore, the number of liquid supply units is the same as that of the local liquid supply chambers, and they correspond one-to-one.

[0016] Furthermore, the multiple local liquid supply chambers are independently separated from each other, and their horizontal projection shape is consistent with the corresponding heat source area.

[0017] Furthermore, the inlet manifold and outlet manifold are distributed adjacent to each other, and the microchannels are respectively connected to the adjacent inlet manifolds and outlet manifolds. The extension direction of the microchannels is perpendicular to the inlet manifolds and outlet manifolds.

[0018] Furthermore, the multiple heat source regions are arranged in an array at the bottom of the microchannel layer.

[0019] Furthermore, the main liquid inlet distribution layer, the zoned liquid supply layer, the jet manifold layer, and the microchannel layer are sealed together by welding and / or diffusion connection.

[0020] The manufacturing method of the above-mentioned partitioned liquid supply manifold jet microchannel cold plate includes the following steps: S1. Provide a first substrate for forming a total liquid inlet distribution layer, a second substrate for forming a zoned liquid supply layer, a third substrate for forming a jet manifold layer, and a fourth substrate for forming a microchannel layer; S2. The first substrate is processed to form a main liquid inlet and a distribution channel; the second substrate is processed to form multiple liquid supply units and local liquid supply chambers; the third substrate is processed to form jet holes, inlet manifolds, outlet manifolds, manifolds and coolant outlets; the fourth substrate is processed to form multiple microchannels and correspondingly form multiple heat source areas at its bottom. S3. Assemble the main liquid inlet distribution layer, the zoned liquid supply layer, the jet manifold layer and the microchannel layer in alignment, so that the distribution groove, the cylindrical liquid supply unit, the local liquid supply cavity, the jet hole, the inlet manifold, the microchannel, the outlet manifold and the junction cavity are connected in sequence. S4. The assembled structure is sealed by welding and / or diffusion connection to obtain the partitioned liquid supply manifold jet microchannel cold plate.

[0021] The manufacturing method of the partitioned liquid supply manifold jet microchannel cold plate according to claim 8 is characterized in that: the main liquid inlet distribution layer, the partitioned liquid supply layer, the jet manifold layer and the microchannel layer are positioned and calibrated before being assembled and connected.

[0022] Beneficial effects: Compared with the prior art, the significant advantages of this invention are: 1. This invention achieves primary diversion of the total incoming liquid through a total liquid inlet diversion layer, and then achieves secondary zoned liquid supply through multiple liquid supply units and local liquid supply chambers in the zoned liquid supply layer, so that the coolant can be directionally delivered to the local heat exchange areas corresponding to multiple heat source areas, which is beneficial to improving the uniformity of liquid supply under multiple heat source conditions. 2. By mapping multiple local liquid supply chambers to multiple heat source areas on a plane projection, directional liquid supply and local enhanced heat dissipation can be achieved for multiple heat sources, which helps to reduce local thermal resistance. 3. This invention retains the downstream manifold jet microchannel heat exchange structure and introduces an upstream multi-stage diversion and zoned liquid supply design, which can improve the heat dissipation capacity of multiple heat sources without significantly increasing the complexity of the downstream heat exchange body. 4. By setting inlet manifolds, outlet manifolds and manifolds in the jet manifold layer, the present invention can construct a complete fluid introduction, heat exchange and manifold discharge path, which is beneficial to improving the smoothness of drainage and optimizing the overall flow organization. 5. This invention combines upper jet liquid supply, lower manifold structure and microchannel heat exchange, so that the coolant enters the inlet manifold after being distributed by jet, and then flows laterally through the microchannel into the adjacent outlet manifold and is quickly discharged, thereby improving flow distribution, shortening the flow path of the fluid in the heat exchange area, reducing thermal resistance and reducing pressure drop. 6. The manufacturing method provided by the present invention can realize the layered processing and high-precision assembly of the main liquid inlet distribution layer, the zoned liquid supply layer, the jet manifold layer and the microchannel layer, which is beneficial to improving the forming accuracy, connection reliability and sealing performance of the overall structure. Attached Figure Description

[0023] Figure 1 This is an exploded view of the entire invention; Figure 2 This is an overall sectional view of the present invention; Figure 3 This is a top view of the jet manifold layer of the present invention; Figure 4 This is a top view of the jet manifold layer of the present invention. Detailed Implementation

[0024] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] like Figure 1-4 The partitioned liquid supply manifold jet microchannel cold plate shown is used for heat dissipation of high-power electronic devices with multiple heat sources.

[0026] The structure comprises, from top to bottom, a main liquid inlet distribution layer 1, a zoned liquid supply layer 2, a jet manifold layer 3, and a microchannel layer 4. Multiple heat source areas 5 are correspondingly located at the bottom of the microchannel layer 4. The main liquid inlet distribution layer 1, the zoned liquid supply layer 2, the jet manifold layer 3, and the microchannel layer 4 are assembled into an integral cold plate structure via welding and / or diffusion connections. A coolant outlet 10 is provided on the side of the jet manifold layer 3.

[0027] The upper surface of the main liquid inlet distribution layer 1 is provided with a main liquid inlet 6, which is located in the middle region of the main liquid inlet distribution layer 1. The lower surface of the main liquid inlet distribution layer 1 is provided with a plurality of distribution channels 7 communicating with the main liquid inlet 6, which are used to perform primary distribution of the coolant entering the main liquid inlet 6. In this embodiment, the plurality of distribution channels 7 are arranged radially around the main liquid inlet 6, preferably four distribution channels 7; the number of distribution channels 7 can be two, three, four, six or more, and their shape can also be a straight channel, an arc channel, a bifurcated channel or other channel structure suitable for realizing the primary distribution function.

[0028] The partitioned liquid supply layer 2 is located below the main liquid inlet distribution layer 1. The upper surface of the partitioned liquid supply layer 2 has multiple vertically connected liquid supply units 8, and the lower surface has multiple independent local liquid supply chambers 9. In this embodiment, the number of liquid supply units 8 is the same as the number of local liquid supply chambers 9, and they are arranged in a one-to-one correspondence; the multiple local liquid supply chambers 9 are preferably four independently separated rectangular cavities. Each liquid supply unit 8 is connected to a corresponding distribution channel 7 and a local liquid supply chamber 9, thereby introducing the coolant after the first-stage distribution into multiple local liquid supply chambers 9. Thus, the partitioned liquid supply layer 2 realizes the function of transforming upstream point-type distribution and transportation into downstream surface-type local liquid supply.

[0029] The jet manifold layer 3 is located below the partitioned liquid supply layer 2. The upper surface of the jet manifold layer 3 has multiple jet holes 12, and the lower surface of the jet manifold layer 3 has adjacently distributed inlet manifolds 13 and outlet manifolds 14. The multiple outlet manifolds 14 are connected to a manifold cavity 15, which is further connected to a coolant outlet 10 located on the side of the jet manifold layer 3. Coolant from each local liquid supply cavity 9 first enters the inlet manifold 13 through the jet holes 12, then is introduced into the downstream microchannel 11 for heat exchange. After heat exchange, the coolant flows through the outlet manifolds 14 into the manifold cavity 15, and is finally discharged from the coolant outlet 10.

[0030] The microchannel layer 4 is disposed below the jet manifold layer 3. Multiple microchannels 11 are disposed in the central region of the microchannel layer 4, and the multiple microchannels 11 are arranged in parallel with each other. The microchannels 11 can be rectangular cross-section microchannels; in other embodiments, they can also be sawtooth microchannels, Tesla microchannels, or other microchannel structures that can achieve enhanced heat transfer.

[0031] The bottom of the microchannel layer 4 is provided with multiple heat source regions 5, which are arranged in an array. In this embodiment, multiple local liquid supply chambers 9 correspond one-to-one with multiple heat source regions 5 on the plane projection and have the same shape. That is, each local liquid supply chamber 9 mainly corresponds to one heat source region 5 below, thereby enabling the coolant to be supplied directionally to multiple heat source regions.

[0032] The overall flow path of this invention is as follows: The coolant first enters the main inlet distribution layer 1 through the main inlet 6, then undergoes primary distribution through the distribution channel 7, and then enters multiple cylindrical supply units 8 in the zoned supply layer 2. After being transported downwards by the supply units 8, the coolant enters multiple independent local supply chambers 9, and then is guided downwards from each local supply chamber 9 into the jet manifold layer 3, and enters the inlet manifold 13 through the jet holes 12. The coolant then flows into the microchannels 11 in the microchannel layer 4 for heat exchange, and the heat-exchanged coolant flows into the manifold 15 through the outlet manifold 14, and is finally discharged from the coolant outlet 10. Through the above structure, the coolant can be multi-stage distributed and zoned according to the heat source area, thereby achieving directional cooling for multiple heat source areas.

[0033] The enhanced heat transfer mechanism of this invention is as follows: the upstream total liquid inlet diversion layer 1 first performs directional initial diversion of the total incoming liquid, reducing the disordered diffusion in the traditional integral liquid supply cavity; the zoned liquid supply layer 2 further establishes multiple independent liquid supply units through multiple liquid supply units 8 and local liquid supply cavities 9, so that different heat source areas can obtain relatively independent local liquid supply; in the downstream jet manifold layer 3, the coolant is introduced into the inlet manifold 13 through the jet hole 12, and completes enhanced heat exchange in the microchannel 11. After heat exchange, the coolant enters the manifold 15 through the outlet manifold 14 and is discharged from the coolant outlet 10. Thus, a coordinated heat dissipation path of "first-level diversion - second-level zoned liquid supply - local jet introduction - microchannel enhanced heat exchange - manifold discharge" is formed, which is beneficial to improve the uniformity of liquid supply under multi-heat source conditions, reduce local thermal resistance and improve overall heat dissipation performance.

[0034] In this embodiment, the manufacturing method of the cold plate of the partitioned liquid supply manifold jet microchannel is as follows: First, a first substrate for forming the main inlet distribution layer 1, a second substrate for forming the zoned liquid supply layer 2, a third substrate for forming the jet manifold layer 3, and a fourth substrate for forming the microchannel layer 4 are provided respectively. Each substrate can be made of copper, copper alloy, aluminum, aluminum alloy, or other materials with good thermal conductivity and machinability, with copper or copper alloy being preferred.

[0035] Subsequently, the first substrate is processed to form a main liquid inlet 6 and a diversion channel 7 communicating with the main liquid inlet 6. The main liquid inlet 6 and the diversion channel 7 can be formed by machining, laser processing, electrical discharge machining, etching, or a combination thereof.

[0036] Next, the second substrate is processed to form multiple vertically connected liquid supply units 8 and multiple independent local liquid supply cavities 9. The liquid supply units 8 and local liquid supply cavities 9 can be formed by machining, laser processing, electrical discharge machining, etching, or a combination thereof.

[0037] Then, the third substrate is processed to form the jet manifold layer 3 structure; specifically, it can be processed to form jet holes 12, inlet manifolds 13, outlet manifolds 14, manifolds 15, and coolant outlets 10. The fourth substrate is processed to form multiple microchannels 11, and multiple heat source regions 5 are correspondingly formed at its bottom. The microstructures in the jet manifold layer 3 and the microchannel layer 4 can be formed by milling, drilling, etching, laser processing, electrical discharge machining, embossing, or a combination thereof.

[0038] After completing the processing of each layer, the main liquid inlet distribution layer 1, the zoned liquid supply layer 2, the jet manifold layer 3, and the microchannel layer 4 are cleaned and surface treated, and then positioned, calibrated, and assembled to ensure that the distribution tank 7, the liquid supply unit 8, the local liquid supply chamber 9, the jet hole 12, the inlet manifold 13, the microchannel 11, the outlet manifold 14, and the junction chamber 15 are connected in sequence, while ensuring the correspondence between the local liquid supply chamber 9 and the heat source area 5.

[0039] Finally, the assembled multi-layer structure is sealed using welding and / or diffusion welding to form an integral, zoned liquid supply manifold jet microchannel cold plate. The welding connection can be brazing, fusion welding, diffusion welding, or other processes suitable for connecting multi-layer metal structures.

[0040] In other embodiments, the number, shape, and size of the diversion channels 7, the number and layout of the liquid supply units 8, the shape and area of ​​the local liquid supply chambers 9, the number and arrangement of the heat source regions 5, and the specific structural forms of the jet manifold layer 3 and the microchannel layer 4 can all be adjusted according to specific application requirements without departing from the concept of this invention. Corresponding processing techniques, assembly techniques, and connection techniques can also be adapted accordingly.

Claims

1. A partitioned liquid supply manifold jet microchannel cold plate, characterized in that, It includes a total liquid inlet distribution layer (1), a zoned liquid supply layer (2), a jet manifold layer (3), and a microchannel layer (4) arranged from top to bottom. The upper surface of the total liquid inlet diversion layer (1) is provided with a total liquid inlet (6), and the lower surface is provided with a plurality of diversion grooves (7) connected to the total liquid inlet (6). The partitioned liquid supply layer (2) is provided with multiple vertically connected liquid supply units (8) and multiple independent local liquid supply chambers (9). Each local liquid supply chamber (9) is connected to the diversion channel (7) through the liquid supply unit (8). The bottom of the local liquid supply chamber (9) is an open structure. The upper surface of the jet manifold layer (3) is provided with multiple jet holes (12), and the lower surface is provided with an inlet manifold (13), an outlet manifold (14) and a manifold cavity (15) connected to the outlet manifold. A coolant outlet (10) connected to the manifold cavity (15) is opened on the side of the jet manifold layer (3). The local liquid supply cavity (9) is placed on the jet manifold layer (3) to divide the jet holes (12) into multiple local areas. The upper end of the jet hole (12) is connected to the local liquid supply cavity (9), and the lower end is connected to the inlet manifold (13). The microchannel layer (4) has multiple microchannels (11) on its upper surface and multiple heat source areas (5) on the back of the microchannels (11). The heat source areas (5) correspond one-to-one with the local liquid supply chambers (9) on the plane projection. After the coolant enters through the main inlet (6), it passes through the diversion channel (7), the liquid supply unit (8), the local liquid supply chamber (9), the jet hole (12), the inlet manifold (13), the microchannels (11), the outlet manifold (14), and the confluence chamber (15) in sequence, and is finally discharged from the coolant outlet (10), so as to realize the zoned liquid supply and directional cooling for multiple heat source areas (5).

2. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: The main inlet (6) is located in the middle region of the main inlet diversion layer (1), and the multiple diversion channels (7) are arranged radially with the main inlet (6) as the starting point.

3. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: The number of liquid supply units (8) is the same as that of the local liquid supply chambers (9), and they correspond one-to-one.

4. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: Multiple local liquid supply chambers (9) are independently separated from each other, and their horizontal projection shape is consistent with the corresponding heat source area (5).

5. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: The inlet manifold (13) and outlet manifold (14) are distributed adjacent to each other, and the microchannel (11) connects the adjacent inlet manifold (13) and outlet manifold (14) respectively. The extension direction of the microchannel (11) is perpendicular to the inlet manifold (13) and outlet manifold (14).

6. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: Multiple heat source regions (5) are arrayed at the bottom of the microchannel layer (4).

7. The partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that: The main liquid inlet distribution layer (1), the zoned liquid supply layer (2), the jet manifold layer (3), and the microchannel layer (4) are sealed together by welding and / or diffusion connection.

8. The method for manufacturing the partitioned liquid supply manifold jet microchannel cold plate according to claim 1, characterized in that, Includes the following steps: S1. Provide a first substrate for forming a total liquid inlet distribution layer, a second substrate for forming a zoned liquid supply layer, a third substrate for forming a jet manifold layer, and a fourth substrate for forming a microchannel layer; S2. The first substrate is processed to form a main liquid inlet and a distribution channel; the second substrate is processed to form multiple liquid supply units and local liquid supply chambers; the third substrate is processed to form jet holes, inlet manifolds, outlet manifolds, manifolds and coolant outlets; the fourth substrate is processed to form multiple microchannels and correspondingly form multiple heat source areas at its bottom. S3. Assemble the main liquid inlet distribution layer, the zoned liquid supply layer, the jet manifold layer and the microchannel layer in alignment, so that the distribution groove, the cylindrical liquid supply unit, the local liquid supply cavity, the jet hole, the inlet manifold, the microchannel, the outlet manifold and the junction cavity are connected in sequence. S4. The assembled structure is sealed by welding and / or diffusion connection to obtain the partitioned liquid supply manifold jet microchannel cold plate.

9. The method for manufacturing the partitioned liquid supply manifold jet microchannel cold plate according to claim 8, characterized in that: The main liquid inlet distribution layer, zoned liquid supply layer, jet manifold layer, and microchannel layer are positioned and calibrated before assembly and connection.

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