A power module with uniform temperature and reinforced disturbance heat dissipation structure

Abstract

The application discloses a power module with a uniform temperature and a reinforced disturbance heat dissipation structure, comprising a heat dissipation bottom plate, a heat dissipation panel, an insulating substrate and a plurality of power chips. The heat dissipation bottom plate is provided with a cooling liquid groove, the middle part of the groove bottom is provided with a water inlet, and both sides are provided with water outlets; the side of the heat dissipation panel facing the cooling liquid groove is provided with two groups of symmetrical spoiler plates. The spoiler plates and the cooling liquid groove jointly form a main flow channel, a branch flow channel, a circular arc heat exchange part, a backflow channel and a circulation channel, and the branch flow channel and the circular arc heat exchange part correspond to the projection area of the power chip. The cooling liquid is divided into two sides from the center, and is repeatedly turned, divided and converged between the circular arc spoiler structures and then discharged, so that uniform temperature heat dissipation, reinforced heat exchange and low flow resistance are considered.

Description

Technical Field

[0001] This invention belongs to the field of power semiconductor modules and liquid cooling technology, and specifically relates to a power module with a uniform temperature and enhanced disturbance heat dissipation structure. Background Technology

[0002] As new energy vehicles, power electronic conversion devices, rail transit, and energy storage equipment develop towards higher power density and miniaturization, the heat flux density generated by power modules during operation continues to increase. If heat cannot be transferred to the cooling medium in a timely and uniform manner, large temperature differences can easily form between different power chips, creating hot spots in localized areas, which in turn affects the output performance and lifespan of the power module.

[0003] Existing liquid-cooled power modules typically have straight flow channels, serpentine flow channels, or pin-fin flow channels machined inside the metal heat sink. A single-sided inlet / outlet flow pattern can easily cause a temperature rise in the coolant along the flow path, resulting in higher chip temperatures near the outlet. While densely arranging turbulence columns or microstructures throughout the flow field can improve the local heat transfer coefficient, it also significantly increases flow resistance, increases external pumping power consumption, and may lead to uneven flow distribution and localized stagnation.

[0004] Furthermore, when directly fabricating complex closed flow channels using a single heat sink, channel forming, cleaning, and quality inspection are quite difficult, and the channel shape is not easily adjusted according to the chip layout. How to create a multi-stage perturbation flow field that matches the chip position using a structure that is easy to manufacture and assemble, while maintaining a centrally symmetrical liquid supply and a low total pressure drop, is a technical problem that needs to be solved in this field. Summary of the Invention

[0005] The present invention provides a power module with a uniform temperature and enhanced disturbance heat dissipation structure, which aims to solve the problems pointed out in the background art.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A power module with a uniform temperature and enhanced perturbation heat dissipation structure includes a heat dissipation base plate, a heat dissipation panel, an insulating substrate, and a power chip arranged sequentially. A coolant tank is formed between the heat dissipation base plate and the heat dissipation panel, connecting an inlet and an outlet. A baffle plate extending into the coolant tank is provided on the side of the heat dissipation panel facing the coolant tank. The baffle plate includes multiple arc-shaped baffle plate segments staggered along the coolant flow direction to form a continuously turning heat exchange channel in the coolant tank. At least a portion of the heat exchange channel is located below the projection area of ​​the power chip.

[0007] Furthermore, the inlet is located in the middle of the coolant tank, and there are two outlets located on both sides of the coolant tank, so that the coolant flows from the middle to both sides.

[0008] Furthermore, the power chip is divided into two chip groups located on both sides of the water inlet, and the baffle includes two baffle groups respectively corresponding to the two chip groups, with the two baffle groups symmetrically arranged about the water inlet.

[0009] Furthermore, each of the aforementioned baffle plate groups includes an outer peripheral guide plate segment and a plurality of arc-shaped baffle plate segments disposed inside the outer peripheral guide plate segment. The outer peripheral guide plate segment, the arc-shaped baffle plate segments, and the coolant tank together define a main channel, a branch channel branched from the main channel, and a return channel connected to the corresponding outlet.

[0010] Furthermore, the arc-shaped baffle segments are C-shaped, U-shaped, or crescent-shaped, and adjacent arc-shaped baffle segments are staggered to form a continuous arc heat exchange section along the coolant flow direction of the branch channel.

[0011] Furthermore, the number and position of the arc heat exchange sections correspond to the arrangement of the power chips, and at least one arc heat exchange section is provided below the projection area of ​​each power chip.

[0012] Furthermore, an aerodynamic channel is formed between the outer peripheral guide plate section and the inner wall of the coolant tank, surrounding the two baffle plate groups, and the aerodynamic channel is connected to the two water outlets.

[0013] Furthermore, the free end of the baffle plate abuts or is fixedly connected to the bottom of the coolant tank to separate adjacent heat exchange channels; the heat dissipation base plate and the heat dissipation panel are connected by welding or sealing to form a sealed coolant cavity, and pipe joints are respectively connected to the inlet and the outlet.

[0014] Furthermore, the inlet is located in the middle of the coolant tank, and the two outlets are located on both sides of the coolant tank respectively; the baffle includes two baffle groups symmetrically arranged about the inlet, each baffle group and the coolant tank together forming a main channel, a branch channel, an arc heat exchange section and a return channel, and the outer side of the two baffle groups is provided with a circulation channel communicating with the two outlets.

[0015] Compared with the prior art, the present invention has the following technical effects: 1. The present invention adopts a split structure of heat dissipation base plate and heat dissipation panel. A relatively simple coolant tank is formed on the heat dissipation base plate, and the baffle on the heat dissipation panel and the coolant tank together form a complex flow field, which is convenient for separate processing, cleaning, inspection and assembly, and also facilitates the replacement of different baffle patterns according to the chip layout.

[0016] 2. This invention employs a central water inlet, two side water outlets, and two symmetrical baffle plate assemblies. This allows the low-temperature coolant to be distributed approximately evenly from the center of the overall power chip layout to both sides, reducing the flow rate difference and temperature rise difference between the two chip groups, thereby improving the overall temperature uniformity of the module. The staggered arc-shaped baffle plate segments cause the coolant to continuously change direction, contract, expand, split, and converge within the arc-shaped heat exchange section. This continuously disrupts the near-wall thermal boundary layer and enhances local convective heat transfer below the chip projection area. Compared to densely arranging baffle columns throughout the entire flow field, this structure concentrates the enhanced disturbance in the main heat exchange area, which is beneficial for controlling the total pressure drop.

[0017] 3. The main flow channel, branch flow channel, return flow channel, and peripheral circulation channel constitute a multi-stage parallel and return flow path. The return flow channel can orderly collect the coolant after heat absorption, and the circulation channel can form peripheral bypass cooling and mitigate flow bias, reducing dead zones in the flow field and heat accumulation at the edge of the module. The arc heat exchange section can be matched to the position according to the number of power chips, the arrangement, and the distribution of hot spots, thus adapting to modules with different numbers of chips and different power levels, while taking into account heat dissipation performance, structural strength, and manufacturing cost. Attached Figure Description

[0018] Figure 1 This is an isometric view of the power module described in this invention. Figure 2 This is a lower isometric view of the power module described in this invention; Figure 3 This is a side view of the power module described in this invention; Figure 4 This is a schematic diagram of the structure of the heat dissipation base plate described in this invention; Figure 5 This is a schematic diagram of the structure of the heat dissipation panel facing the heat dissipation base plate according to the present invention; Figure 6 This is a planar schematic diagram of the flow channel formed by the heat dissipation base plate and the baffle plate described in this invention; Figure 7 This is a schematic diagram showing the relationship between the flow channel and the projected position of the power chip described in this invention.

[0019] In the picture: 1. Heat dissipation base plate; 101. Coolant tank; 102. Inlet; 103. Outlet; 104. Main flow channel; 105. Branch flow channel; 106. Arc-shaped heat exchange section; 107. Return flow channel; 108. Circulation channel; 2. Heat dissipation panel; 201. Spoiler plate; 3. Insulating substrate; 4. Power chip; 5. Pipe joints. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present application and with reference to the accompanying drawings.

[0021] like Figures 1 to 7 As shown, this embodiment provides a power module with a uniform temperature and enhanced disturbance heat dissipation structure, including a heat dissipation base plate 1, a heat dissipation panel 2, an insulating substrate 3, multiple power chips 4, and pipe connectors 5. The heat dissipation panel 2 is sealed to the heat dissipation base plate 1, the insulating substrate 3 is fixed on the side of the heat dissipation panel 2 away from the heat dissipation base plate 1, and the multiple power chips 4 are disposed on the insulating substrate 3 to form two symmetrical chip groups.

[0022] The heat dissipation base plate 1 and the heat dissipation panel 2 together constitute the liquid cooling heat sink of the power module. The heat dissipation base plate 1 can be formed by processing copper, copper alloy, aluminum or aluminum alloy sheet; in addition to serving as a closed coolant tank 101, the heat dissipation panel 2 also serves as a heat-conducting bearing surface of the insulating substrate 3 to shorten the heat transfer path between the power chip 4 and the coolant.

[0023] like Figure 4 As shown, a coolant tank 101 is provided on the side of the heat dissipation base plate 1 facing the heat dissipation panel 2. The coolant tank 101 can be an oblong or rectangular tank with rounded corners, with an inlet 102 in the center of the bottom and an outlet 103 on each of the left and right sides of the bottom. The three interfaces are arranged along the length of the heat dissipation base plate 1, with the inlet 102 located between the two outlets 103. A pipe connector 5 is installed at the end of each interface away from the coolant tank 101 for connection to an external coolant circulation system.

[0024] like Figure 5 As shown, a downwardly protruding baffle 201 is provided on the side of the heat dissipation panel 2 facing the coolant tank 101. The baffle 201 can be integrally processed with the heat dissipation panel 2, or it can be manufactured separately from several arc-shaped plates and outer peripheral plates and then fixed to the heat dissipation panel 2 by brazing, diffusion welding or laser welding. In this embodiment, the baffle 201 includes two baffle groups symmetrical about the inlet 102, and each baffle group corresponds to one chipset.

[0025] Each spoiler assembly includes an outer peripheral guide vane segment and multiple arc-shaped spoiler segments located inside the outer peripheral guide vane segment. The outer peripheral guide vane segment extends around the projection area of ​​the corresponding chipset and retains a fluid communication area near the inlet 102 and outlet 103. The internal arc-shaped spoiler segments are approximately C-shaped or crescent-shaped and are arranged in stages along the direction of coolant flow from the inlet 102 to the outlet 103.

[0026] When the heat dissipation panel 2 is closed onto the heat dissipation base plate 1, the baffle 201 extends into the coolant tank 101, with its free end preferably abutting or fixedly connected to the bottom of the coolant tank 101. Thus, the bottom and inner wall of the coolant tank 101, the lower surface of the heat dissipation panel 2, and the baffle 201 together define a closed flow channel with a defined flow direction. The periphery of the heat dissipation base plate 1 and the heat dissipation panel 2 can be sealed by brazing, diffusion welding, laser welding, friction stir welding, or sealing ring compression.

[0027] like Figure 6 As shown, the flow channel includes a main flow channel 104, multiple branch flow channels 105, multiple arc-shaped heat exchange sections 106, a return flow channel 107, and an annular flow channel 108. The main flow channel 104 extends from the inlet 102 to the left and right sides. After the low-temperature coolant enters through the inlet 102, it is first divided into two streams in the main flow channel 104, which then enter the heat exchange areas corresponding to the two baffle assemblies.

[0028] Branch channels 105 branch off from the main channel 104 towards the corresponding outlet 103. The ends and arc surfaces of adjacent arc-shaped baffle sections are staggered, so that the branch channels 105 are not straight lines but form continuous deflection paths. When the coolant passes through the gaps between adjacent sections, the flow is divided and accelerated; after entering a wider area, it diffuses and merges again, thus forming velocity gradients and secondary flows multiple times within a short flow path.

[0029] The arc-shaped heat exchange section 106 is formed in the region where the branch channel 105 bypasses the arc-shaped baffle section. The arc-shaped heat exchange section 106 has a continuous curvature, which can avoid excessive local resistance caused by sharp right-angle turns while allowing the coolant to continuously change direction along the arc surface. The inertial effect, centrifugal effect, and confluence of adjacent flow streams in the arc-shaped path can enhance near-wall disturbance and weaken the thermal boundary layer on the cooling side of the heat dissipation panel 2.

[0030] like Figure 7 As shown, the branch channel 105 and the arc-shaped heat exchange section 106 are arranged below the projected area of ​​the power chip 4. In this embodiment, each chip group includes two rows of power chips 4, and the arc-shaped baffle plate segments are also arranged in two rows, with multiple arc-shaped heat exchange sections 106 corresponding to each power chip 4. In actual design, the arc-shaped heat exchange section 106 can be aligned with the chip center, chip edge, near the bonding area, or simulated hot spot location according to the chip loss distribution.

[0031] The return channel 107 is located on the outer side of each baffle assembly and is used to receive coolant flowing from multiple branch channels 105. The return channel 107 extends along the outer periphery of the baffle assembly and forms a large confluence area near the corresponding outlet 103. The multiple streams of coolant, after absorbing heat, first reduce their local velocity and mix in this confluence area before being discharged from the outlet 103, which can reduce the additional resistance caused by the direct impact between the branch channel outlets.

[0032] A circulation channel 108 is formed between the outer periphery of the baffle assembly and the inner wall of the coolant tank 101, and extends circumferentially along the coolant tank 101. The circulation channel 108 communicates with the outlets 103 on both sides, allowing some coolant to form a bypass heat exchange path along the periphery of the module. On the one hand, the circulation channel 108 utilizes the remaining cooling capacity to provide auxiliary cooling to the edge area of ​​the radiator; on the other hand, when there is a deviation in the local resistance of the two baffle assemblies, the peripheral flow path can alleviate the pressure difference on both sides and improve the overall flow distribution.

[0033] In this embodiment, the arc-shaped spoiler segments are preferably arranged in a staggered manner. Viewed along the direction from the main flow channel 104 to the return flow channel 107, the ends of adjacent arc-shaped spoiler segments are not on the same straight line, preventing the coolant from short-circuiting along a single straight line and requiring it to continuously turn between adjacent segments. This structure can achieve a high disturbance frequency without significantly increasing the number of independent spoiler columns, while retaining sufficient flow area.

[0034] The thickness, height, spacing between adjacent plate segments, and radius of curvature of the baffle 201 can be determined based on the heat load, coolant flow rate, and allowable pressure drop of the power module. The plate height is preferably matched to the effective depth of the coolant tank 101 to ensure reliable flow isolation between the free end of the baffle 201 and the bottom of the tank. In embodiments where a small amount of crossflow is permitted to balance pressure, controlled connecting gaps or connecting holes may also be provided at localized locations.

[0035] To ensure mechanical strength and sealing reliability, a welding area or sealing clamping area that mates with the heat dissipation base plate 1 can be provided around the periphery of the heat dissipation panel 2. When the spoiler 201 is integrally formed with the heat dissipation panel 2, it can be manufactured by milling, stamping, precision casting or additive manufacturing; when the spoiler 201 is an independent component, the plate segment can be processed first, and then fixed by positioning groove, positioning boss or tooling before welding.

[0036] The insulating substrate 3 can be a copper-clad ceramic substrate, a metallized ceramic substrate, or other substrates that combine electrical insulation and thermal conductivity. The power chip 4 can be an IGBT chip, a MOSFET chip, a diode chip, or a power device made of wide-bandgap semiconductor materials such as silicon carbide or gallium nitride. The insulating substrate 3 can be fixed to the heat dissipation panel 2 by solder, sintered silver, or a thermally conductive bonding layer.

[0037] During operation, external coolant enters the center of the coolant tank 101 through the inlet 102 and splits into two streams in the main channel 104. The two streams then enter their respective branch channels 105, where they undergo continuous deflection, acceleration, diffusion, splitting, and merging as they pass through multiple arc-shaped heat exchange sections 106, carrying away the heat transferred from the power chip 4 to the heat dissipation panel 2. The coolant then enters the return channel 107 and merges with the peripheral coolant in the circulation channel 108, finally exiting through the outlets 103 on both sides.

[0038] Because the two baffle assemblies are symmetrically arranged about the inlet 102, and the two outlets 103 are located on both sides, the main flow paths and local resistances on the left and right sides are approximately the same, enabling the two chip groups to obtain relatively similar coolant flow rates. At the same time, the enhanced disturbance of the coolant in the arc heat exchange section 106 is mainly concentrated in the chip projection area, avoiding excessive increase in resistance in non-primary heat exchange areas, thereby achieving a balance between temperature uniformity and pumping power consumption.

[0039] In other embodiments, the inlet 102 can be configured as multiple adjacent inlets, and the outlet 103 can also be configured as two or more depending on the number of chipsets; the two baffle groups can be expanded into multiple baffle groups distributed around the water inlet area. As long as the baffle 201 on the heat dissipation panel 2 cooperates with the coolant tank 101 on the heat dissipation base plate 1 to form a flow field with central flow splitting, local arc disturbance and peripheral return, it is all an equivalent variation of the present invention.

[0040] In other embodiments, the arc-shaped baffle section can be C-shaped, U-shaped, S-shaped, wavy, or a structure formed by smoothly connecting multiple arc segments; the number, spacing, and curvature of the arc heat exchange section 106 can be kept consistent along the flow direction, or can be changed step by step according to the temperature rise of the coolant to adjust the flow rate and heat exchange intensity of each region.

[0041] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A power module with a uniform temperature and enhanced disturbance heat dissipation structure, comprising a heat dissipation base plate (1), a heat dissipation panel (2), an insulating substrate (3), and a power chip (4) arranged sequentially, characterized in that: A coolant tank (101) is formed between the heat dissipation base plate (1) and the heat dissipation panel (2) to connect the inlet (102) and the outlet (103); the heat dissipation panel (2) is provided with a baffle plate (201) extending into the coolant tank (101) on the side facing the coolant tank (101). The baffle plate (201) includes a plurality of arc-shaped baffle plate segments arranged in a staggered manner along the coolant flow direction to form a continuously turning heat exchange channel in the coolant tank (101). At least part of the heat exchange channel is located below the projection area of ​​the power chip (4).

2. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 1, characterized in that, The inlet (102) is located in the middle of the coolant tank (101), and there are two outlets (103) respectively located on both sides of the coolant tank (101) so that the coolant flows from the middle to both sides.

3. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 2, characterized in that, The power chip (4) is divided into two chip groups located on both sides of the water inlet (102). The baffle (201) includes two baffle groups respectively corresponding to the two chip groups. The two baffle groups are symmetrically arranged about the water inlet (102).

4. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 3, characterized in that, Each of the aforementioned baffle plate groups includes an outer peripheral guide plate segment and a plurality of arc-shaped baffle plate segments disposed inside the outer peripheral guide plate segment. The outer peripheral guide plate segment, the arc-shaped baffle plate segments, and the coolant tank (101) together define a main channel (104), a branch channel (105) branched from the main channel (104), and a return channel (107) connected to the corresponding outlet (103).

5. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 4, characterized in that, The arc-shaped baffle section is C-shaped, U-shaped or crescent-shaped, and adjacent arc-shaped baffle sections are staggered to form a continuous arc heat exchange section (106) along the coolant flow direction of the branch channel (105).

6. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 5, characterized in that, The number and position of the arc heat exchange section (106) correspond to the arrangement of the power chip (4), and at least one arc heat exchange section (106) is provided below the projection area of ​​each power chip (4).

7. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 6, characterized in that, The outer peripheral guide plate section and the inner sidewall of the coolant tank (101) form an aerodynamic channel (108) surrounding the outside of the two baffle plate groups, and the aerodynamic channel (108) is connected to the two outlets (103).

8. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 7, characterized in that, The free end of the baffle (201) abuts or is fixedly connected to the bottom of the coolant tank (101) to separate the adjacent heat exchange channels; the heat dissipation base plate (1) and the heat dissipation panel (2) are connected by welding or sealing to form a sealed coolant cavity; the inlet (102) and the outlet (103) are respectively connected to pipe joints (5).

9. A power module with a uniform temperature and enhanced disturbance heat dissipation structure according to claim 8, characterized in that, The inlet (102) is located in the middle of the coolant tank (101), and the two outlets (103) are located on both sides of the coolant tank (101). The baffle (201) includes two baffle groups symmetrically arranged about the inlet (102). Each baffle group and the coolant tank (101) together form a main channel (104), a branch channel (105), an arc heat exchange section (106), and a return channel (107). The outer side of the two baffle groups is provided with a circulation channel (108) that communicates with the two outlets (103).

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