Micro-channel cold plate and heat dissipation device for flow boiling heat dissipation of power device

Abstract

The application discloses a micro-channel cold plate and heat dissipation device for flow boiling heat dissipation of a power device, and belongs to the technical field of power device thermal management and micro-scale two-phase enhanced heat exchange, and comprises a cold plate base body, at least one micro-channel formed in the cold plate base body, a cooling working medium inlet and a cooling working medium outlet arranged on the left and right sides of the micro-channel respectively, an upper wall trapezoidal sawtooth and a lower wall trapezoidal sawtooth arranged on the upper wall and the lower wall of the micro-channel respectively, and a bottom rewetting groove protruding outward from the lower wall arranged behind the lower wall trapezoidal sawtooth; and a power device unit is further connected to the bottom of the cold plate base body. The lower wall trapezoidal sawtooth, the upper wall staggered trapezoidal sawtooth and the rewetting groove behind the sawtooth are matched in space, and the local vaporization, the vapor phase structure regulation and control, the vapor phase migration and the liquid back supply are connected as a continuous action process, which is beneficial to latent heat utilization, gas-liquid interface renewal and heated wall rewetting.

Description

Technical Field

[0001] This invention relates to the field of power device thermal management and microscale two-phase enhanced heat transfer technology, and particularly to a microchannel cold plate and heat dissipation device for flow boiling heat dissipation of power devices. Background Technology

[0002] Power devices generally refer to semiconductor devices or modules used for power conversion, power control, and electric drive. Typical devices include power MOSFETs, IGBTs, power diodes, SiC MOSFETs, and GaNHEMTs. High-power devices can be understood as power devices and modules operating under higher voltage, current, or power density conditions. Common forms include IGBT power modules, SiC power modules, high-current rectifier modules, and power modules used in main drive inverters for new energy vehicles, photovoltaic and energy storage converters, and industrial motor drives. These devices generate conduction and switching losses during operation, which are released as heat. Therefore, their high heat flux density regions require efficient and stable thermal management methods.

[0003] As the integration and power density of power semiconductor chips, power modules, and high heat flux density electronic components continue to increase, the heat flux distribution on the device surface exhibits a significant non-uniform characteristic, with local hot spots potentially appearing at the front, middle, rear, or other locations of the cooling channel. Smooth microchannels have a large heat transfer area, but their geometric reinforcement along the flow direction is basically uniform, making it difficult to implement differentiated thermal management for hot spots of different locations and intensities.

[0004] Incorporating serrations, ribs, or protrusions within microchannels can enhance local disturbances, but traditional fixed-parameter structures typically employ the same tooth height, tooth spacing, and tooth root shape throughout the entire channel. If strong disturbance parameters are used based on the highest heat load, non-hotspot areas may incur unnecessary flow resistance; conversely, using weaker uniform parameters may fail to adequately suppress local hotspots. Therefore, it is necessary to establish the correspondence between heat source location, local heat load, and allowable pressure drop, and to translate this into manufacturable and quantifiable zonal geometric parameters.

[0005] On the other hand, while fluid boiling can enhance heat dissipation by utilizing the latent heat of phase change during liquid vaporization, the vapor phase or bubbles within the confined space of microchannels are prone to growth, coalescence, and occupation of local flow cross-sections. When large-scale vapor phases cover the vicinity of the heated wall surface for extended periods, it weakens near-wall liquid replenishment and increases the risk of localized drying. Individually setting turbulence teeth or grooves can typically only enhance disturbance or improve one aspect of localized liquid storage, making it difficult to achieve continuous, structured control over vaporization generation, bubble growth, vapor phase migration, and liquid replenishment. Summary of the Invention

[0006] The purpose of this invention is to provide a microchannel cold plate and heat dissipation device for flow boiling heat dissipation of power devices, so as to solve the problems of fixed parameter microchannels being difficult to adapt to non-uniform hot spots, and insufficient vapor phase control and liquid replenishment of heated wall surface during flow boiling.

[0007] To achieve the above objectives, the present invention provides a microchannel cold plate for flow boiling heat dissipation of power devices, comprising a cold plate substrate and at least one microchannel formed in the cold plate substrate. The left and right sides of the microchannel are respectively provided with a cooling medium inlet and a cooling medium outlet. The upper wall and lower wall of the microchannel are respectively provided with inwardly recessed upper wall trapezoidal serrations and lower wall trapezoidal serrations. Behind the lower wall trapezoidal serrations, a bottom rewetting groove protruding to the outer side of the lower wall is provided. The bottom of the cold plate substrate is also connected to a power device unit.

[0008] Preferably, the microchannel is divided into at least two flow regions along the cooling medium flow direction, including at least two of a front heating region, a middle heating region, and a rear heating region, each region comprising a tooth height h. i Tooth pitch or spacing L i and the radius R of the tooth root fillet on the airflow side fi Sawtooth parameter group P i And the sawtooth parameter group P in different regions i At least one parameter has a different value.

[0009] Preferably, the upper wall trapezoidal saw teeth and the lower wall trapezoidal saw teeth are arranged alternately along the flow direction or have a predetermined relative offset, so that a local constraint zone is formed between the lowest part of the upper wall trapezoidal saw teeth and the lower wall trapezoidal saw teeth, which is less than the flow height of the area without saw teeth.

[0010] Preferably, each of the upper wall trapezoidal sawtooth and the lower wall trapezoidal sawtooth has a front-flow side tooth root fillet and a back-flow side tooth root fillet; R fi The radius of the frontal tooth root fillet in the i-th partition is represented as the sawtooth parameter group P. i Adaptive variables in R; bi The radius of the backflow side tooth root fillet in the i-th partition is not included in the sawtooth parameter group P. i An adaptive variable is set, and it remains the same or is set to a predetermined fixed value in each flow direction region.

[0011] Preferably, the bottom rewetting tank is an asymmetrical tank that protrudes outward from the lower wall; along the flow direction from the cooling medium inlet to the cooling medium outlet, the front-flow side wall of the bottom rewetting tank is an inclined wall, and the back-flow side wall is a straight wall.

[0012] Preferably, the power device unit includes a heated wall surface disposed at the bottom of the cold plate substrate, and a power device is connected below the heated wall surface.

[0013] Preferably, the power device includes at least one of a power semiconductor chip, a power module, a converter module, and a high heat flux density electronic component.

[0014] The present invention also provides a heat dissipation device for flow boiling heat dissipation of power devices, including a microchannel cold plate, wherein the cooling medium inlet and cooling medium outlet on both sides of the microchannel cold plate are connected to a cooling medium circulation system.

[0015] Preferably, the cooling medium circulation system includes a cooling medium circulation loop connected between the cooling medium outlet and the cooling medium inlet. The cooling medium circulation loop is equipped with a circulation pump, a condenser, and a liquid storage section. After the cooling medium flows out of the cooling medium outlet, it flows through the cooling medium circulation loop in sequence through the condenser and the liquid storage section. Finally, after being pressurized by the circulation pump, it enters the interior of the microchannel cold plate through the cooling medium inlet, forming a circulation.

[0016] The beneficial effects of the microchannel cold plate and heat dissipation device for flow boiling heat dissipation of power devices described above are: the flow regions such as the front, middle, and rear are connected to P... i =(h i L i R fi Establish a clear correspondence to directly convert hotspot information into quantifiable geometric parameters, and use allowable pressure drop as a parameter selection constraint to avoid uniformly adopting overly strong or weak turbulence structures throughout the entire channel; only the tooth root fillet R on the upstream side is adjusted. fi Incorporate adaptive parameter sets and make the backflow side fillet R bi By maintaining a fixed or predetermined setting, the design variables are reduced while preserving the local flow regulation capability, thus improving the feasibility of parametric design and manufacturing. Through the spatial coordination of the lower wall trapezoidal serrations, the upper wall trapezoidal serrations, and the bottom rewetting groove, local vaporization, growth vapor phase structure regulation, vapor phase migration, and liquid replenishment are connected into a continuous process, which is beneficial for the utilization of latent heat of phase change, gas-liquid interface renewal, and rewetting of heated wall surfaces.

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure and local partition geometric parameters of the microchannel cold plate in an embodiment of the present invention; Figure 2 This is a schematic diagram showing the correspondence between the front, middle, and rear regions of the microchannel cold plate of the present invention and parameter groups P1, P2, and P3; Figure 3 This is a schematic diagram illustrating the principle of the asymmetric groove structure used in the bottom rewetting tank of this invention. Figure 4This is a schematic diagram of the four-stage synergistic mechanism of boiling heat dissipation in the heated zone of the present invention; Figure 5 A schematic diagram of a heat dissipation device used for flow boiling heat dissipation of power devices; Figure 6 The diagram shows a comparison of the temperature distribution in the middle heating zone of a fixed-parameter sawtooth structure and an adaptive sawtooth structure under the same 8W heat load; where (a) represents the fixed-parameter sawtooth structure and its middle heating temperature distribution, and (b) represents the adaptive sawtooth structure and its middle heating temperature distribution. Figure 7 The figures show a comparison of the volume fraction distribution of the second phase vapor phase under different heat load conditions for the final structure; where (a) is the volume fraction distribution of the second phase vapor phase under the 4.5W condition, (b) is the volume fraction distribution of the second phase vapor phase under the 6W condition, and (c) is the volume fraction distribution of the second phase vapor phase under the 10W condition.

[0019] Figure Labels 1. Cold plate substrate; 2. Microchannel; 3. Upper wall trapezoidal serrations; 4. Lower wall trapezoidal serrations; 5. Bottom rewetting tank; 6. Power device; 7. Heated wall surface; 8. Cooling medium inlet; 9. Cooling medium outlet; 10. Front heating zone; 11. Middle heating zone; 12. Rear heating zone; 13. Cooling medium circulation loop; 14. Circulation pump; 15. Condenser; 16. Liquid storage section; 17. Hot spot area; 18. Cooling medium flow direction. Detailed Implementation

[0020] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] In this application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. In case of any inconsistency, the meaning set forth in this specification or derived from the content described herein shall prevail. Furthermore, the terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit the scope of this application.

[0022] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0023] Example 1: like Figure 1 and Figure 2 As shown, this embodiment provides a microchannel cold plate for flow boiling heat dissipation of power devices, including an external cold plate substrate 1 and a microchannel 2 formed inside the cold plate substrate 1. The typical characteristic dimensions of the microchannel 2 are: length L = 30 mm, width W = 2.00 mm, and height H = 2.00 mm. Cooling medium inlets 8 and outlets 9 are respectively provided on the left and right sides of the microchannel 2. The cooling medium enters the microchannel 2 through the cooling medium inlets 8 along the flow direction 18, flows through each heated area, and is discharged through the cooling medium outlets 9. A power device unit is provided at the bottom of the cold plate substrate 1. The power device unit includes a heated wall surface 7 disposed at the bottom of the cold plate substrate 1. A power device 6 is connected below the heated wall surface 7. The power device 6 includes at least one of a power semiconductor chip, a power module, a converter module, and a high heat flux density electronic component.

[0024] In this embodiment, along the flow direction of the cooling medium, the microchannel 2 is divided into three continuous flow regions: a front heating zone 10, a middle heating zone 11, and a rear heating zone 12. The length ratio of each region can be flexibly adjusted according to the actual heat source location. Each region is independently configured with a set of trapezoidal sawtooth geometric parameters Pi=(hi, Li, R). fi This is to adapt to varying local heat loads along the path. Where hi represents the area using a system that includes tooth height, Li represents the tooth pitch or spacing, and R... fi Let R be the radius of the fillet at the tooth root on the upstream side. Furthermore, the radius of the fillet at the tooth root on the downstream side of each upper trapezoidal sawtooth 3 and lower trapezoidal sawtooth 4 is denoted as R. bi And keep the same or set according to a predetermined fixed value in each flow direction area.

[0025] Within each flow region, the upper wall of the microchannel 2 is provided with upper wall trapezoidal serrations 3 that are recessed into the channel, and the lower wall of the microchannel 2 is provided with lower wall trapezoidal serrations 4 that are recessed into the channel. The cross-section of each upper wall trapezoidal serration 3 and lower wall trapezoidal serration 4 is an isosceles or non-isosceles trapezoid, with a top plane, two sloping sides, and a root rounded corner. The upper wall trapezoidal serrations 3 and lower wall trapezoidal serrations 4 are staggered along the flow direction, with a specific stagger of half a pitch, so that the lowest point of the upper wall trapezoidal serration 3 is located directly above the backflow zone downstream of the lower wall trapezoidal serration 4. This spatially staggered arrangement ensures that the large-sized vapor phase structure growing from the lower wall heated surface and drifting upwards can encounter the local contraction section of the upper wall trapezoidal serrations 3 during its ascent, thereby being subjected to acceleration, shearing, and deformation.

[0026] A bottom rewetting groove 5 is provided on the rear side of each trapezoidal sawtooth 4 on the lower wall. This groove has an asymmetrical groove structure (the use of a symmetrical groove structure has some shortcomings, such as...). Figure 3 As shown, the upstream side of the tank wall is inclined, which helps guide the backflow liquid behind the teeth to smoothly enter the tank; the downstream side of the tank wall is straight, which helps to form a local low-speed liquid accumulation zone in the tank and prevents the liquid from being quickly washed away. After the cooling medium passes the trapezoidal sawtooth 4 on the lower wall, the local flow channel changes from contraction to expansion, and a flow separation, low-speed backflow, and reattachment area is easily formed behind the teeth. Arranging small-scale grooves in the area behind the trapezoidal sawtooth 4 on the lower wall can couple the liquid backflow in the tank with the tailflow behind the teeth, and promote the redevelopment of the near-wall thermal boundary layer through reattachment at the tank outlet, while providing local space for the liquid to collect and rewet after vapor migration. Therefore, arranging the grooves behind the teeth is more conducive to forming a continuous action relationship of tooth disturbance, backflow behind the teeth, reattachment, and liquid replenishment than placing the grooves in front of the teeth or at the tooth top.

[0027] like Figure 4 As shown, the four-stage synergistic mechanism indicates that when the cooling medium flows through the lower wall trapezoidal sawtooth 4, it leads to local vaporization and bubble initiation, bubble growth, and migration into the channel. The upper wall trapezoidal sawtooth 3 provides local regulation of the growing vapor phase structure, and the bottom rewetting tank 5 provides liquid replenishment. Local vaporization conditions are first formed in the area adjacent to the lower wall trapezoidal sawtooth 4 and the bottom rewetting tank 5. When the growing vapor phase structure enters the local constraint zone formed by the upper wall trapezoidal sawtooth 3, geometric constraints, local acceleration, and shearing effects promote its deformation, stretching, necking, splitting, and migration. After the vapor phase migrates away from the vicinity of the heated wall surface 7, the liquid in the bottom rewetting tank 5 can replenish the adjacent heated area and participate in vaporization and heat absorption again, thus forming a cyclical process of vaporization generation, vapor phase regulation, liquid replenishment, and re-vaporization.

[0028] Based on the aforementioned microchannel cold plate, this embodiment also constructs a heat dissipation device for flow boiling heat dissipation of power devices. The flow direction of the cooling working fluid in the heat dissipation device is as follows: Figure 5As indicated by the arrows, the cooling medium flows from the liquid storage section 16 into the circulation pump 14. After being pressurized by the circulation pump, it enters the microchannel 2 through the cooling medium inlet 8. In the heated area, it absorbs the heat transmitted from the power device 6 and undergoes flow boiling. Subsequently, it flows out from the cooling medium outlet 9 and enters the condenser 15. After condensation, it returns to the liquid storage section 16, forming a closed loop.

[0029] The following is a simulation analysis of the microchannel flow direction region of a microchannel cold plate and heat dissipation device used for flow boiling heat dissipation of power devices: like Figure 6 As shown, to verify the effect of the partition parameters on the central heated zone 11 in this embodiment, a fixed-parameter sawtooth structure and an adaptive sawtooth structure were constructed and compared under the same working conditions. Figure 6 (a) in the diagram represents a sawtooth structure with fixed parameters. Figure 6 (b) shows an adaptive sawtooth structure. The fixed-parameter sawtooth structure uses the same reference parameters P0 = (0.45mm, 3.00mm, 0.08mm) along the front heating zone 10, middle heating zone 11, and rear heating zone 12. The adaptive sawtooth structure keeps the parameters of the front heating zone 10 and rear heating zone 12 unchanged, only adjusting the parameters of the middle heating zone 11 to P2 = (0.60mm, 2.40mm, 0.04mm). Both structures retain the same bottom rewetting groove 5 and maintain the backflow side tooth root radius R. b Since the value remains constant at 0.15mm, the differences between the two lie in the partition adaptive parameters h, L, and R. f Configuration.

[0030] To ensure that the numerical verification corresponds to a specific power device application, this embodiment selects a SiCMOSFET power chip as a representative heat source. SiCMOSFETs are suitable for high power density scenarios such as inverters and power converters in new energy vehicles. The internal electro-thermal coupling process of the chip is not elaborated in the simulation; instead, the chip's operating loss is equivalent to the thermal load applied to the central heated area 11. In the comparative operating condition of this embodiment, the equivalent heat dissipation power of the chip is taken as 8W to evaluate the difference in heat dissipation between the fixed-parameter sawtooth structure and the adaptive sawtooth structure under the same thermal input conditions. When a total heat load of 8W is applied to the central heating zone 11, the area-weighted average temperature of the fixed-parameter sawtooth structure heating wall 7 is 412.40695K, the highest temperature is 578.75531K, and the pressure drop is approximately 70.39315Pa; the area-weighted average temperature of the adaptive sawtooth structure is 400.01807K, the highest temperature is 568.02618K, and the pressure drop is approximately 95.53104Pa. The actual total heat inputs for the two groups are 7.9999294W and 7.9998531W, respectively.

[0031] As a result, the average wall temperature of the adaptive sawtooth structure decreased by 12.38888 K and the maximum wall temperature decreased by 10.72913 K, while the pressure drop increased by approximately 35.71%. This result indicates that the design goal of the adaptive sawtooth structure is not to pursue maximum turbulence throughout the entire channel, but rather to achieve a comprehensive balance between hotspot temperature, local reinforcement level, and allowable pressure drop. Figure 6 (a) and Figure 6 (b) uses a uniform temperature color scale, which is mainly used to observe the difference in the distribution of the central heating zone 11 between the fixed parameter sawtooth structure and the adaptive sawtooth structure. The quantitative judgment is based on the above monitoring values.

[0032] To verify the cooling effect of the boiling phase change in the same final structure, the same adaptive upper wall trapezoidal teeth 3 and lower wall trapezoidal teeth 4, and bottom rewetting groove 5 structure were used. Under the conditions of a total heat load of 4.5W, an inlet velocity of 0.1m / s, an inlet temperature of 293.15K, and the same SSTk-ω turbulence model, single-phase calculations without phase change and EuLerian-RPI calculations with phase change were performed respectively. The area-weighted average temperature of the heated wall surface 7 in the group without phase change was 352.95458K, the highest temperature was 447.47961K, and the actual total heat input was 4.500002W. After entering the steady transient time window, the area-weighted average temperature of the heated wall surface 7 in the group with phase change was 331.05540K, the highest temperature was 390.96393K, and the actual total heat input was 4.5009329W.

[0033] Compared to the case without phase change, the average wall temperature decreased by 21.89918 K and the maximum wall temperature decreased by 56.51568 K, representing approximately 6.20% and 12.63%, respectively. Since the structure, total heat load, and turbulence model remained consistent, these results demonstrate that the latent heat of phase change absorbed by liquid vaporization after the participation of the flow boiling phase change significantly improves the hotspot heat dissipation state of the final structure.

[0034] like Figure 7 As shown, under the condition of keeping the final structure, inlet conditions and SST-RPI two-phase model settings consistent, the volume fraction distribution of the second phase (phase-2) vapor phase under heat loads of 4.5W, 6W and 10W is compared respectively. Figure 7 In (a), the local vapor phase preferentially appears in the area adjacent to the bottom of the rewetting tank 5 behind the trapezoidal sawtooth 4 teeth on the lower wall; Figure 7 In (b) of the diagram, as the heat load increases to 6W, the vapor phase region gradually expands from the vicinity of the rewetting groove 5 at the bottom of the tooth to the surrounding area. Figure 7 In (c) of the equation, when the heat load increases to 10W, the vapor phase region further expands and extends into the channel. Under the corresponding operating condition, the total vapor phase volume obtained by the solver through volume integration of the vapor phase volume fraction across the entire fluid domain is 8.3374146 × 10⁻⁶. -11 m3 1.534392×10 -10 m 3 and 7.2346587×10 -10 m 3 It shows a clear increasing trend.

[0035] Combination Figure 1 The arrangement of the back-tooth separation reflux and the bottom rewetting groove 5, as shown, can be considered as follows: the bottom rewetting groove 5 protrudes outwards from the lower wall, providing favorable space for local vaporization and forming spatial coupling with the back-tooth reflux area. As the heat load increases, the degree of local vaporization intensifies, and the vapor phase gradually expands from the area adjacent to the bottom rewetting groove 5 towards the back of the tooth and into the channel. The above results are used to illustrate the preferential formation location of the vapor phase and its expansion trend with increasing heat load, and are not intended to assert that the bottom rewetting groove 5 necessarily produces more vapor phase compared to a structure without a bottom rewetting groove 5.

[0036] Therefore, the microchannel cold plate and heat dissipation device for flow boiling heat dissipation of power devices described in this invention are used to solve the problems of fixed parameter microchannels being difficult to adapt to non-uniform hot spots, and insufficient vapor phase control and liquid replenishment of heated wall surfaces during flow boiling.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A microchannel cold plate for flow boiling heat dissipation in power devices, characterized in that: The device includes a cold plate substrate and at least one microchannel formed within the cold plate substrate. The microchannel has a cooling medium inlet and a cooling medium outlet on its left and right sides, respectively. The upper and lower walls of the microchannel are respectively provided with inwardly recessed upper trapezoidal serrations and lower trapezoidal serrations. Behind the lower trapezoidal serrations, there is a bottom rewetting groove protruding to the outer side of the lower wall. The bottom of the cold plate substrate is also connected to a power device unit.

2. The microchannel cold plate for flow boiling heat dissipation of power devices according to claim 1, characterized in that: The microchannel is divided into at least two flow regions along the cooling medium flow direction, including at least two of the following: a front heating region, a middle heating region, and a rear heating region. Each region adopts a design incorporating a tooth height h. i Tooth pitch or spacing L i and the radius R of the tooth root fillet on the airflow side fi Sawtooth parameter group P i And the sawtooth parameter group P in different regions i At least one parameter has a different value.

3. A microchannel cold plate for flow boiling heat dissipation of power devices according to claim 1, characterized in that: The upper and lower trapezoidal sawtooth teeth are arranged alternately along the flow direction or have a predetermined relative offset, so that a local constraint zone with a flow height less than that of the area without sawtooth teeth is formed between the lowest part of the upper trapezoidal sawtooth teeth and the lower trapezoidal sawtooth teeth.

4. A microchannel cold plate for flow boiling heat dissipation of power devices according to claim 3, characterized in that: Each of the upper and lower trapezoidal sawtooth teeth has a front-flow side tooth root fillet and a back-flow side tooth root fillet; R fi The radius of the frontal tooth root fillet in the i-th partition is represented as the sawtooth parameter group P. i Adaptive variables in R; bi The radius of the backflow side tooth root fillet in the i-th partition is not included in the sawtooth parameter group P. i An adaptive variable is set, and it remains the same or is set to a predetermined fixed value in each flow direction region.

5. A microchannel cold plate for flow boiling heat dissipation of power devices according to claim 1, characterized in that: The bottom rewetting tank is an asymmetrical tank that protrudes outward from the lower wall; along the flow direction from the cooling medium inlet to the cooling medium outlet, the front side wall of the bottom rewetting tank is an inclined wall, and the back side wall is a straight wall.

6. A microchannel cold plate for flow boiling heat dissipation of power devices according to claim 1, characterized in that: The power device unit includes a heated wall surface disposed at the bottom of the cold plate substrate, and a power device is connected below the heated wall surface.

7. A microchannel cold plate for flow boiling heat dissipation of power devices according to claim 6, characterized in that: The power device includes at least one of a power semiconductor chip, a power module, a converter module, and a high heat flux density electronic component.

8. A heat dissipation device for flow boiling heat dissipation of power devices, characterized in that: The microchannel cold plate as described in any one of claims 1-7 is provided, wherein the cooling medium inlets and outlets on both sides of the microchannel cold plate are connected to a cooling medium circulation system.

9. A heat dissipation device for flow boiling heat dissipation of power devices according to claim 8, characterized in that: The cooling medium circulation system includes a cooling medium circulation loop connected between the cooling medium outlet and the cooling medium inlet. The cooling medium circulation loop is equipped with a circulation pump, a condenser, and a liquid storage section. After the cooling medium flows out of the cooling medium outlet, it flows through the cooling medium circulation loop in sequence through the condenser and the liquid storage section. Finally, after being pressurized by the circulation pump, it enters the interior of the microchannel cold plate through the cooling medium inlet, forming a circulation.

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