Chip structure, circuit board and manufacturing method thereof

Abstract

A chip structure, a circuit board and a manufacturing method thereof, the chip structure comprising a metal piece, an anti-static protective layer and a chip. The metal piece comprises a recess; the anti-static protective layer is coated on the whole surface of the metal piece, the anti-static protective layer comprises a glass cloth and an anti-static coating, the glass cloth is bonded to the surface of the metal piece through the anti-static coating; the chip is arranged in the recess, and a working surface of the chip is exposed by an opening of the recess. The chip structure provided by the application can effectively avoid the generation and transmission of static electricity, reduce the risk of chip damage and improve the service life by embedding the chip in the metal piece with the anti-static protective layer.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a chip structure, a circuit board and a method for manufacturing the same. Background Technology

[0002] Static electricity poses a serious threat to electronic components in electronic products. For example, static electricity easily attracts dust, reduces the insulation resistance of components, and thus shortens their lifespan. Moreover, electrostatic discharge may cause crystal breakdown in components, leading to permanent damage. At the same time, electrostatic discharge also generates electromagnetic pulses, which can cause circuit errors.

[0003] However, existing methods for preventing static electricity in electronic products are insufficient to effectively reduce static interference, and sudden static electricity can easily be generated, which can still damage the electronic components inside the products. Summary of the Invention

[0004] In view of this, in order to solve at least one of the above problems, it is necessary to provide a chip structure.

[0005] In addition, this application also needs to provide a circuit board using the aforementioned chip structure and a method for manufacturing the circuit board.

[0006] This application provides a chip structure, including: a metal component, an antistatic protective layer, and a chip. The metal component includes a first surface and a second surface disposed opposite to each other, with a groove formed by the first surface recessing towards the second surface; the antistatic protective layer covers the entire surface of the metal component, the antistatic protective layer including fiberglass cloth and an antistatic coating, the antistatic coating being located on two opposite surfaces of the fiberglass cloth and extending into the interior of the fiberglass cloth, the fiberglass cloth being bonded to the surface of the metal component through the antistatic coating; the chip is disposed within the groove, and the working surface of the chip is exposed through the opening of the groove.

[0007] In some possible embodiments, the dielectric constant of the antistatic protective layer is 2.0 to 7.0, and the surface resistance of the antistatic protective layer is 10^6 to 10^16 Ω.

[0008] In some possible embodiments, the antistatic coating is formed by curing an antistatic paint, the antistatic paint comprising: a resin and an organic antistatic material, the organic antistatic material comprising at least one of an acrylic complex and a phosphate complex, the organic antistatic material containing at least one of an alkyl group, a hydroxyl group and a carboxyl group in its structure; and / or, the resin comprising an epoxy resin.

[0009] In some possible embodiments, a connection layer is provided between the chip and the antistatic protective layer; and / or, the depth of the groove is greater than or equal to the thickness of the chip.

[0010] In some possible embodiments, the thickness of the antistatic protective layer is 0.1 mm to 0.3 mm.

[0011] This application also provides a circuit board, including: a circuit board substrate and a chip structure as described above. The circuit board substrate has a built-in cavity; the chip structure is located within the cavity, the working surface of the chip is electrically connected to the circuit board substrate, and the second surface of the metal component is electrically connected to the circuit board substrate through a metal block.

[0012] This application also provides a method for manufacturing a circuit board, comprising: forming an opening on a substrate; disposing a chip structure as described above within the opening; forming a first metal layer and a second metal layer on opposite surfaces of the substrate, wherein the first metal layer covers the working surface of the chip; and patterning the first metal layer and the second metal layer to form a first circuit layer and a second circuit layer, wherein the first circuit layer is electrically connected to the working surface, and the second circuit layer is electrically connected to the second surface through a metal block, thereby obtaining the circuit board.

[0013] In some possible embodiments, the method of fabricating the chip structure includes: forming the groove on the metal part; covering the entire surface of the metal part with fiberglass cloth; impregnating the metal part covered with the fiberglass cloth with an antistatic coating; curing the fiberglass cloth impregnated with the antistatic coating to form the antistatic protective layer covering the surface of the metal part; and fixing the chip in the groove to obtain the chip structure.

[0014] In some possible embodiments, the antistatic coating comprises: a resin and an organic antistatic material, wherein the organic antistatic material comprises at least one of an acrylic complex and a phosphate complex, and the structure of the organic antistatic material contains at least one of an alkyl group, a hydroxyl group, and a carboxyl group; and / or, the resin comprises an epoxy resin.

[0015] In some possible embodiments, the concentration of the antistatic coating is 60 wt% to 80 wt%.

[0016] Compared to existing technologies, the chip structure provided in this application combines a metal component with an anti-static protective layer. The entire surface of the metal component is covered with an anti-static protective layer, which is composed of fiberglass cloth and an anti-static coating. This enhances the adhesion between the anti-static protective layer and the metal component, and simultaneously forms an effective anti-static protective layer on the chip surface. This effectively prevents the generation and transmission of static electricity, thereby reducing the risk of chip structure damage and extending service life. Furthermore, combining the metal component with the anti-static protective layer allows for timely dissipation of chip heat, improving heat dissipation. By embedding the aforementioned chip structure within a circuit board, damage to the chip from static electricity is reduced, and the chip's heat is effectively dissipated, improving heat dissipation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the chip structure provided in an embodiment of this application.

[0018] Figure 2 A flowchart illustrating a method for fabricating a chip structure according to an embodiment of this application.

[0019] Figures 3A to 3H This is a schematic diagram illustrating the fabrication process of a chip structure provided in an embodiment of this application.

[0020] Figure 4 This is a schematic diagram of the circuit board structure provided in one embodiment of this application.

[0021] Figure 5 A flowchart illustrating a method for manufacturing a circuit board according to an embodiment of this application.

[0022] Figures 6A to 6G This is a schematic diagram of the fabrication process of a circuit board provided in an embodiment of this application.

[0023] Explanation of main component symbols

[0024] Circuit board 100 First insulating layer 54

[0025] Chip structure 10 Third circuit layer 55

[0026] Metal component 1 First circuit layer 6

[0027] First surface 11 Second circuit layer 7

[0028] Second surface 12 Covering film 8

[0029] Groove 13, Metal Block 9

[0030] Antistatic protective layer 2 Circuit board 20

[0031] Fiberglass cloth 21, cavity 201

[0032] Antistatic coating 22, antistatic paint 30

[0033] Chip 3 Copper paste layer 40

[0034] Working surface 31, release film 50

[0035] Non-working surface 32 First copper clad laminate 60

[0036] Pin 33 First metal layer 61

[0037] Connecting layer 4 Second insulating layer 62

[0038] Substrate 5 Second copper-clad laminate 70

[0039] Opening 51 Second metal layer 71

[0040] Third surface 52 Third insulating layer 72

[0041] Fourth surface 53 Fixture 80

[0042] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0043] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0044] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0045] Please see Figure 1As shown in Figure 3, this application embodiment provides a chip structure 10 with excellent antistatic effect. The chip structure 10 includes a metal component 1, an antistatic protective layer 2, and a chip 3. The metal component 1 includes a first surface 11 and a second surface 12 disposed opposite to each other, with a groove 13 formed by recesses from the first surface 11 toward the second surface 12. The antistatic protective layer 2 covers the entire surface of the metal component 1. The chip 3 is disposed in the groove 13, and the working surface 31 of the chip 3 is exposed through the opening of the groove 13 to facilitate the circuit connection of the chip 3. The antistatic protective layer 2 includes a fiberglass cloth 21 and an antistatic coating 22. The antistatic coating 22 is located on the two opposite surfaces of the fiberglass cloth 21 and extends into the interior of the fiberglass cloth 21. The fiberglass cloth 21 is bonded to the surface of the metal component 1 by the antistatic coating 22.

[0046] Specifically, the antistatic coating 22 wraps around the fiberglass cloth 21 and penetrates into the fiber gaps of the fiberglass cloth 21, improving the adhesion between the antistatic coating 22 and the fiberglass cloth 21. This results in a more uniform distribution of the antistatic coating 22 on the fiberglass cloth 21, enhancing the overall antistatic effect of the antistatic protective layer 2. Furthermore, the antistatic coating 22 bonds the fiberglass cloth 21 to the surface of the metal part 1, effectively improving the bonding strength between them. The fiberglass cloth 21 itself has good insulation and antistatic properties. Combined with the antistatic coating 22 to form the antistatic protective layer 2, this enhances the overall insulation and antistatic properties of the antistatic protective layer 2, while also achieving adhesion between the fiberglass cloth 21 and the metal part 1. This effectively prevents the generation and transmission of static electricity, thereby reducing the risk of damage to the chip structure 10 and extending its service life.

[0047] The antistatic coating 22 can be formed by curing an antistatic paint. Specifically, by immersing the metal part 1 covered with fiberglass cloth 21 in the antistatic paint, the antistatic paint can be fully and uniformly impregnated into the interior of the fiberglass cloth 21. After curing the antistatic paint, the bonding force between the antistatic coating 22 and the fiberglass cloth 21, as well as between the fiberglass cloth 21 and the metal part 1, can be further improved, so as to form a complete and uniform antistatic protective layer 2 on the entire surface of the metal part 1. By setting a metal part 1 with an antistatic protective layer 2 outside the chip 3, the insulation can be effectively improved while improving the antistatic effect.

[0048] In some embodiments, the antistatic coating comprises a resin and an organic antistatic material, wherein the organic antistatic material contains at least one of alkyl, hydroxyl, and carboxyl groups. By introducing alkyl, hydroxyl, and carboxyl groups into the organic antistatic material, the hydrophilicity of the organic antistatic material can be improved, adhesion can be enhanced, thereby increasing the compatibility between the organic antistatic material and the resin. Simultaneously, it can disperse charge, reduce static electricity accumulation within the antistatic protective layer 2, and improve the antistatic properties of the antistatic coating. In some embodiments, the organic antistatic material comprises at least one of acrylic acid complexes and phosphate complexes, and the acrylic acid complexes and phosphate complexes have cationic groups, which can be P, As, Fe, Sn, Bi, Al, Ca, Ti, Zn, Mg, etc. In some embodiments, the resin comprises epoxy resin. After thermosetting with epoxy resin as an adhesive, the fiberglass cloth 21 can be firmly bonded to the surface of the metal part 1, forming an antistatic protective layer 2 with good insulation, high mechanical strength at high temperatures, and good electrical performance stability under high humidity.

[0049] In some embodiments, the dielectric constant of the antistatic protective layer 2 can be 2.0 to 7.0. The antistatic protective layer 2 has good insulation properties and can effectively achieve insulation between the metal part 1 and the chip 3, as well as between the metal part 1 and other circuits.

[0050] In some embodiments, the surface resistance of the antistatic protective layer 2 can be 10^6 to 10^16 Ω. The high surface resistance of the antistatic protective layer 2 can effectively improve the insulation resistance of the chip 3 surface and achieve a good antistatic effect.

[0051] In some embodiments, the thickness of the antistatic protective layer 2 can be 0.1mm to 0.3mm, for example, it can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm or any two of the above values.

[0052] A connecting layer 4 is provided between the chip 3 and the antistatic protective layer 2, which can further improve the heat dissipation effect. Specifically, the connecting layer 4 can be copper paste.

[0053] The depth of the groove 13 is greater than or equal to the thickness of the chip 3, so that the chip 3 can be embedded in the groove 13 as a whole, with only the working surface 31 exposed for circuit lead-out, thereby improving the overall anti-static performance of the chip 3.

[0054] Please see Figure 2 As shown, please refer to the following: Figures 3A to 3H As shown, this application embodiment also provides a method for manufacturing the aforementioned chip structure 10, specifically including the following steps:

[0055] Step S11, as follows Figure 3A As shown, a groove 13 is formed on the metal part 1. The metal part 1 includes a first surface 11 and a second surface 12 disposed opposite to each other, and the groove 13 is formed by recessing from the first surface 11 toward the second surface 12.

[0056] Step S12, as follows Figure 3B and Figure 3C As shown, the entire surface of the metal part 1 is covered with fiberglass cloth 21.

[0057] The entire surface of the metal part 1, including the inner surface of the groove 13, is wrapped with fiberglass cloth 21. Then, the fiberglass cloth 21 in the groove 13 is pressed by the fixture 80 so that the fiberglass cloth 21 is tightly attached to the inner surface of the groove 13. In this way, the shape of the groove 13 with the fiberglass cloth 21 attached is basically the same as the shape of the groove 13 without the fiberglass cloth 21 attached.

[0058] In some embodiments, the thickness of the fiberglass cloth 21 can be 0.1mm to 0.3mm, for example, it can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm or any two of the above values.

[0059] Step S13, as follows Figure 3D As shown, the metal part 1 covered with the fiberglass cloth 21 is immersed in the antistatic coating 30. This allows the antistatic coating 30 to completely encapsulate the fiberglass cloth 21, ensuring that the coating is fully and evenly applied between the fiberglass cloth 21 and the metal part 1, and also penetrating the gaps between the fibers of the fiberglass cloth 21. This immersion method increases the load and uniformity of the antistatic coating 30 on the fiberglass cloth 21, thereby improving its antistatic properties.

[0060] The antistatic coating 30 comprises a resin and an organic antistatic material, wherein the organic antistatic material contains at least one of alkyl, hydroxyl, and carboxyl groups. In some embodiments, the organic antistatic material comprises at least one of an acrylic acid complex and a phosphate complex, and the acrylic acid complex and the phosphate complex have cationic groups, which may be P, As, Fe, Sn, Bi, Al, Ca, Ti, Zn, Mg, etc. In some embodiments, the resin comprises an epoxy resin.

[0061] Specifically, the antistatic coating 30 comprises: epoxy resin, organic antistatic material, and solvent. The concentration of the antistatic coating 30 can be 60wt% to 80wt%. In some embodiments, the solvent can be alcohols such as methanol, ethanol, isopropanol, butanol, and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; or esters such as ethyl acetate, butyl acetate, ethyl lactate, γ-butyrolactone, propylene glycol-methyl ether acetate, and propylene glycol-ethyl ether acetate.

[0062] Step S14, as follows Figure 3E and Figure 3F As shown, the fiberglass cloth 21 impregnated with the antistatic coating 30 is cured to form the antistatic protective layer 2 covering the surface of the metal part 1.

[0063] Specifically, the curing method can be selected according to the type of resin used. In this embodiment, epoxy resin is used and cured by heating. After curing, the antistatic coating 30 will form an antistatic coating 22, which can uniformly cover the surface of the fiberglass cloth 21 and penetrate into the interior of the fiberglass cloth 21. The fiberglass cloth 21 has a strong bond with the antistatic coating 22 and a strong bond with the metal part 1.

[0064] Step S15, as follows Figure 3G and Figure 3H As shown, please refer to the following: Figure 1 As shown, the chip 3 is fixed in the groove 13 to obtain the chip structure 10.

[0065] Specifically, firstly, such as Figure 3G As shown, a copper paste layer 40 is formed on the inner wall of the groove 13 covered with the antistatic protective layer 2; then, as... Figure 3H As shown, chip 3 is implanted into groove 13 and mounted on copper paste layer 40. Chip 3 includes a working surface 31 and a non-working surface 32 arranged opposite each other. Multiple pins 33 are provided on the working surface 31. After chip 3 is placed in groove 13, the non-working surface 32 faces the bottom of groove 13 and contacts copper paste layer 40. The working surface 31 is exposed through the opening of groove 13, thus exposing the pins 33. Finally, as... Figure 1 As shown, the copper paste layer 40 is cured to form the connecting layer 4, thereby obtaining the chip structure 10. Using copper paste to fix the chip 3 can further improve antistatic properties and also improve heat dissipation.

[0066] The chip structure 10 and its manufacturing method provided in this application embodiment combine a metal component 1 with an antistatic protective layer 2. An antistatic protective layer 2 is applied to the entire surface of the metal component 1. The antistatic protective layer 2 is composed of fiberglass cloth 21 and an antistatic coating 22, which can improve the bonding force between the antistatic protective layer 2 and the metal component 1. At the same time, it can form an effective antistatic protective layer on the surface of the chip 3, which can effectively prevent the generation and transmission of static electricity, thereby reducing the risk of damage to the chip structure 10 and improving its service life. In addition, combining the metal component 1 with the antistatic protective layer 2 can also dissipate the heat of the chip 3 in a timely manner, improving the heat dissipation effect.

[0067] Please see Figure 4 As shown, please refer to the following: Figure 1 As shown, this application embodiment also provides a circuit board 100 applying the aforementioned chip structure 10. The circuit board 100 includes a circuit board 20 and the chip structure 10 as described above. The circuit board 20 has a built-in cavity 201, and the chip structure 10 is located within the cavity 201. The working surface 31 of the chip 3 is electrically connected to the circuit board 20, and the second surface 12 of the metal component 1 is electrically connected to the circuit board 20 through a metal block 9. The pins 33 of the chip 3 are located on the working surface 31, enabling electrical connection with the circuit board 20. In addition, the metal component 1 is electrically connected to the circuit board 20 through the metal block 9, which can achieve grounding, thereby further improving the anti-static effect and improving the heat dissipation effect.

[0068] The number of circuit layers in the circuit board 20 can be designed according to actual needs. Specifically, the circuit board 20 may include multiple circuit layers to meet the needs of multifunctional electronic devices.

[0069] Please see Figure 5 As shown, please refer to the following: Figures 6A to 6G As shown, this application embodiment also provides a method for manufacturing the aforementioned circuit board 100, specifically including the following steps:

[0070] Step S21, as follows Figure 6A and Figure 6B As shown, an opening 51 is formed on the substrate 5.

[0071] Specifically, the substrate 5 includes a third surface 52 and a fourth surface 53 disposed opposite to each other, and the opening 51 is formed through the third surface 52 and the fourth surface 53.

[0072] In some embodiments, the substrate 5 includes a first insulating layer 54 and a third circuit layer 55 located on at least one surface of the first insulating layer 54. Depending on actual needs, the substrate 5 may also have multiple circuit layers.

[0073] In some embodiments, the thickness of the substrate 5 is approximately the same as the thickness of the chip structure 10, so that the chip structure 10 can be embedded in the opening 51 without protruding from the surface of the substrate 5.

[0074] Step S22, as follows Figure 6C and Figure 6D As shown, a chip structure 10 as described above is provided within the opening 51.

[0075] Specifically, such as Figure 6C As shown, a release film 50 is attached to the fourth surface 53 of the substrate 5 where the opening 51 is provided, and the release film 50 forms the bottom of the opening 51. Figure 6D As shown, the chip structure 10 is placed in the opening 51, and the chip structure 10 can be supported by adding a release film 50.

[0076] Step S23, as Figure 6E and Figure 6F As shown, a first metal layer 61 and a second metal layer 71 are formed on opposite surfaces of the substrate 5, and the first metal layer 61 covers the working surface 31 of the chip 3.

[0077] Specifically, a first copper-clad laminate 60 is laminated onto the third surface 52 of the substrate 5. The first copper-clad laminate 60 includes a second insulating layer 62 and a first metal layer 61 stacked together. After laminating the first copper-clad laminate 60, the release film 50 on the fourth surface 53 can be removed. Then, a second copper-clad laminate 70 is laminated onto the fourth surface 53. The second copper-clad laminate 70 includes a third insulating layer 72 and a second metal layer 71 stacked together. By laminating two single-sided copper-clad laminates, the opening 51 can form a cavity 201, thereby burying the chip structure 10 within the cavity 201.

[0078] Step S24, as Figure 6G and Figure 4 As shown, the first metal layer 61 and the second metal layer 71 are graphically represented to form the first circuit layer 6 and the second circuit layer 7, respectively. The first circuit layer 6 is electrically connected to the working surface 31, and the second circuit layer 7 is electrically connected to the second surface 12 through the metal block 9, thereby obtaining the circuit board 100.

[0079] Specifically, the working surface 31 of chip 3 is provided with multiple pins 33. The first circuit layer 6 is electrically connected to the pins 33, thereby realizing the electrical lead-out of chip 3. The second circuit layer 7 can be a grounding line. The metal component 1 can be grounded through the metal block 9 and the second circuit layer 7, thereby further improving the anti-static properties. In addition, the metal block 9 has good thermal conductivity. Combined with the metal component 1, it can dissipate the heat of chip 3 in a timely manner, improving the heat dissipation effect.

[0080] The circuit board 20 consists of substrate 5, second insulating layer 62, first circuit layer 6, third insulating layer 72 and second circuit layer 7.

[0081] In some embodiments, after forming the first line layer 6 and the second line layer 7, more line layers can be formed by adding layers.

[0082] In some embodiments, a pressure-bonded cover film 8 may also be formed on the outermost layer of the circuit board 100.

[0083] The circuit board 100 and its manufacturing method provided in this application can effectively improve the anti-static performance of the chip 3 by embedding the aforementioned chip structure 10 in the circuit substrate 20. At the same time, the use of the metal part 1 to achieve electrical connection with the circuit substrate 20 can realize the grounding of the chip structure 10, which can further reduce the damage of static electricity to the chip 3. Meanwhile, the metal part 1 and the metal block 202 on the outside of the chip 3 can both play a good heat dissipation role.

Claims

1. A chip structure, characterized in that, include: A metal part includes a first surface and a second surface disposed opposite to each other, with the first surface recessed toward the second surface to form a groove; An antistatic protective layer covers the entire surface of the metal parts; as well as A chip is disposed within the groove, and the working surface of the chip is exposed through the opening of the groove; The antistatic protective layer includes fiberglass cloth and an antistatic coating. The antistatic coating is located on two opposite surfaces of the fiberglass cloth and extends into the interior of the fiberglass cloth. The fiberglass cloth is bonded to the surface of the metal part through the antistatic coating.

2. The chip structure as described in claim 1, characterized in that, The dielectric constant of the antistatic protective layer is 2.0 to 7.0, and the surface resistance of the antistatic protective layer is 10^6 to 10^16 Ω.

3. The chip structure as described in claim 1, characterized in that, The antistatic coating is formed by curing an antistatic paint, which comprises: a resin and an organic antistatic material, wherein the organic antistatic material comprises at least one selected from acrylic acid complexes and phosphate complexes, and the structure of the organic antistatic material contains at least one selected from alkyl, hydroxyl, and carboxyl groups; and / or The resin includes epoxy resin.

4. The chip structure as described in claim 1, characterized in that, A connection layer is provided between the chip and the anti-static protective layer; and / or The depth of the groove is greater than or equal to the thickness of the chip.

5. The chip structure as described in claim 1, characterized in that, The thickness of the antistatic protective layer is 0.1mm to 0.3mm.

6. A circuit board, characterized in that, include: The circuit board has a built-in cavity; as well as The chip structure as described in any one of claims 1 to 5 is located within the cavity, the working surface of the chip is electrically connected to the circuit board, and the second surface of the metal component is electrically connected to the circuit board via a metal block.

7. A method for manufacturing a circuit board, characterized in that, include: An opening is formed on the substrate; The chip structure as described in claim 1 is disposed within the opening; A first metal layer and a second metal layer are formed on opposite surfaces of the substrate, respectively, with the first metal layer covering the working surface of the chip; as well as The first metal layer and the second metal layer are patterned to form a first circuit layer and a second circuit layer, respectively, wherein the first circuit layer is electrically connected to the working surface, and the second circuit layer is electrically connected to the second surface through a metal block, thereby obtaining the circuit board.

8. The method for manufacturing a circuit board as described in claim 7, characterized in that, The method for fabricating the chip structure includes: The groove is formed on the metal part; The entire surface of the metal part is covered with fiberglass cloth; The metal part covered with the fiberglass cloth is immersed in an antistatic coating. The fiberglass cloth impregnated with the antistatic coating is cured to form the antistatic protective layer covering the surface of the metal part; and The chip is fixed in the groove to obtain the chip structure.

9. The method for manufacturing a circuit board as described in claim 8, characterized in that, The antistatic coating comprises: a resin and an organic antistatic material, wherein the organic antistatic material comprises at least one selected from acrylic acid complexes and phosphate complexes, and the structure of the organic antistatic material contains at least one selected from alkyl, hydroxyl, and carboxyl groups; and / or The resin includes epoxy resin.

10. The method for manufacturing a circuit board as described in claim 9, characterized in that, The concentration of the antistatic coating is 60wt% to 80wt%.

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