A bidirectional heat dissipation W-band packaged antenna and assembly line

Abstract

The application discloses a bidirectional heat dissipation W-waveband packaging antenna and an assembly line, relates to the field of W-waveband packaging antennas, and comprises a packaging substrate, an SOC chip and a metal cover plate. A blind groove is formed in the top of the packaging substrate, the SOC chip is installed in the blind groove, the bottom surface of the SOC chip is provided with an antenna patch, the bottom surface of the SOC chip is deposited with an insulating heat-conducting film, the insulating heat-conducting film wraps the antenna patch, an insulating column is connected to the insulating heat-conducting film, the insulating column is hollow, the inner hole of the insulating column is used for arranging a suspended microstrip line of the SOC chip, the suspended microstrip line is led out from the packaging substrate, the insulating column is used for supporting the SOC chip in a suspended state, the blind groove is filled with liquid gold material, the liquid gold material covers the top surface and the bottom surface of the SOC chip at the same time, and the metal cover plate is installed on the top surface of the packaging substrate and is used for sealing the blind groove. The liquid gold material is used for coating the top surface and the bottom surface of the SOC chip at the same time, an upper and lower bidirectional heat dissipation channel is formed, and the problem of local hotspot gathering of a W-waveband high-power density chip is effectively solved.

Description

Technical Field

[0001] This invention relates to the field of W-band packaged antennas, specifically a bidirectional heat-dissipating W-band packaged antenna and assembly line. Background Technology

[0002] The W-band (75-110 GHz), as the core application range of the millimeter-wave frequency band, has been widely used in high-end electronic systems such as 5G millimeter-wave communication, automotive millimeter-wave radar, integrated aerospace detection, and precision guidance due to its advantages of short wavelength, wide bandwidth, and high resolution. In the design of two-dimensional densely packed phased array antennas in the W-band, the short wavelength results in small spacing between antenna elements and high wiring density between antenna elements and the TR chip, making design and fabrication difficult and requiring high precision in design and process route selection. Currently, the integration of high-density W-band antennas and multifunctional SOC chips is achieved using packaged substrate technology, which features high integration and strong manufacturability.

[0003] However, the short wavelength characteristics of the W band lead to a sharp increase in wiring density between the antenna array elements and the TR chip (linewidth / spacing is often less than 50μm). Traditional packaging solutions struggle to balance integration density, hermeticity, heat dissipation, and signal integrity, specifically in the following aspects: 1. Risk of Airtightness Failure: As a core functional device, the SOC chip's internal transistors and metal interconnects are extremely sensitive to oxygen and moisture in the air. Moisture penetration can lead to oxidation and corrosion of metal wiring and breakdown of the gate dielectric layer, while oxygen can accelerate the aging and failure of the chip packaging interface. In existing solutions, the SOC chip is directly interconnected with the packaging substrate through the SMT process. However, the organic packaging substrate itself has a microporous structure and high hygroscopicity, which cannot form an effective airtight barrier. Even with the use of a metal casing for auxiliary packaging, the interconnect interface between the chip and the substrate, and the assembly gap between the substrate and the casing, can still become channels for moisture / oxygen penetration, resulting in poor long-term operational stability of the chip and making it difficult to meet the reliability requirements of extreme environments such as military and aerospace applications.

[0004] 2. Fatal Flaw of Insufficient Heat Dissipation Efficiency: The multi-functional integration of W-band SOC chips leads to a significant increase in power density, typically reaching 100-200 W / cm², far exceeding that of conventional microwave chips. Existing heat dissipation solutions mainly rely on a unidirectional heat dissipation path of "chip back - soft thermally conductive material - heat sink," but this has multiple limitations: First, SOC chips are brittle semiconductor materials and cannot directly contact rigid heat sinks. They require transition through soft materials such as thermally conductive silicone and thermal pads, but the thermal conductivity of these materials is only 1-10 W / (m·K), significantly increasing the interface thermal resistance. Second, the high-density array element arrangement results in extremely small chip spacing, limiting the installation space for heat sinks and further exacerbating the accumulation of local hot spots. This ultimately leads to excessively high chip junction temperatures (exceeding 85°C), causing problems such as frequency drift, gain attenuation, and noise figure deterioration, severely affecting the beam pointing accuracy and signal processing capabilities of phased array antennas. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a bidirectional heat dissipation W-band packaged antenna and assembly line to solve the shortcomings of the prior art.

[0006] The objective of this invention is achieved through the following technical solution: a bidirectional heat dissipation W-band packaged antenna, comprising a packaged substrate, a SOC chip, and a metal cover plate. A blind slot is formed on the top of the packaged substrate, and the SOC chip is installed within the blind slot. An antenna patch is disposed on the bottom surface of the SOC chip. An insulating and thermally conductive film is deposited on the bottom surface of the SOC chip, and the insulating and thermally conductive film wraps around the antenna patch. An insulating pillar is connected to the insulating and thermally conductive film. The insulating pillar is hollow, and its inner hole is used to arrange a suspended microstrip line of the SOC chip. The suspended microstrip line extends from the packaged substrate. The insulating pillar supports the SOC chip in a suspended state. The blind slot is filled with liquid metal material, which simultaneously covers both the top and bottom surfaces of the SOC chip. The metal cover plate is installed on the top surface of the packaged substrate to seal the blind slot.

[0007] Furthermore, the packaging substrate has a large-diameter hole and a small-diameter wiring hole sequentially formed from top to bottom at the position corresponding to the insulating pillar. The insulating pillar is inserted into the large-diameter hole, and the diameter of the insulating pillar is larger than the diameter of the small-diameter wiring hole. The suspended microstrip line passes through the small-diameter wiring hole. An elastic sealing body is fixedly sleeved on the insulating pillar. The elastic sealing body contacts the inner bottom wall of the blind groove. The top of the packaging substrate has an injection hole that communicates with the large-diameter hole for filling sealant between the insulating pillar and the large-diameter hole.

[0008] Furthermore, the side wall of the blind groove is provided with an error compensation groove, and a compensation piston is provided in the error compensation groove. The compensation piston is used to push the liquid metal material in the error compensation groove into the blind groove, so that the liquid metal material contacts the metal cover plate and the packaging substrate.

[0009] Furthermore, the compensation piston includes a piston threaded rod, a piston disc, and an elastic sleeve. The side wall of the packaging substrate has a threaded hole that communicates with the error compensation groove. The piston threaded rod is threaded to fit into the threaded hole, and one end of the piston threaded rod is connected to the piston disc. The elastic sleeve is fixedly sleeved on the piston disc and is interference-fitted into the error compensation groove.

[0010] Furthermore, a sealing groove is formed around the blind groove on the top surface of the packaging substrate. The sealing groove is connected to the blind groove. An annular sealing groove is formed on the step formed by the blind groove and the sealing groove. The annular sealing groove is filled with glass powder slurry. The metal cover plate is assembled in the sealing groove. The glass powder slurry is fused together at high temperature to form a dense and airtight layer between the metal cover plate and the packaging substrate.

[0011] Furthermore, a closed welding surface is formed between the edge of the metal cover plate and the encapsulation substrate. Several reinforcing grooves are provided on the side wall of the sealing groove. The reinforcing grooves pass through the top surface of the encapsulation substrate. Welding wire is inserted into the reinforcing groove. The welding wire melts at the melting temperature of the glass powder slurry, so that the welding wire solidifies and forms a reinforcing welding surface on the side of the metal cover plate.

[0012] A bidirectional heat dissipation W-band packaged antenna assembly line, utilizing the aforementioned bidirectional heat dissipation W-band packaged antenna, includes an assembly cabinet. Along the assembly direction of the W-band packaged antenna, the assembly cabinet is sequentially equipped with a glue applicator, a liquid metal filling machine, a glass powder dispensing machine, a welding wire insertion mechanism, and a welding arm. The glue applicator fills the large-diameter hole with sealant through the glue injection hole. The liquid metal filling machine is used to fill the blind slot with liquid metal material. The glass powder dispensing machine is used to inject glass powder into the annular sealing groove. The welding wire insertion mechanism inserts welding wire into each reinforcing groove. The welding arm is used to weld the edge of the metal cover plate to the packaged substrate.

[0013] Furthermore, the welding wire insertion mechanism includes a lifting column, a sealing plate, and a wire feeding assembly. The sealing plate is fixed to the bottom of the lifting column, and the lifting column has the freedom to move along the height direction of the assembly cabinet. An electric heating plate is embedded in the bottom of the sealing plate. Wire feeding assemblies are provided on all four side walls of the sealing plate. The wire feeding assembly includes a wire-fixing plate, a wire-cutting plate, and a wire feeding frame. The wire-fixing plate is fixedly connected to the sealing plate. Multiple guide grooves for welding wire to pass through are opened on the wire-fixing plate. A wire-cutting groove is opened at the end of the wire-fixing plate away from the sealing plate. The wire-cutting groove is connected to the guide groove. The wire-cutting plate is slidably disposed in the wire-cutting groove. A cutting edge is formed at the end of the wire-cutting plate near the guide groove. The wire feeding frame is fixed to the lifting column. A wire feeding shaft is rotatably disposed on the wire feeding frame. Multiple welding wire reels are mounted on the wire feeding shaft. A motor is installed on the wire feeding frame, and the output shaft of the motor is connected to the wire feeding shaft.

[0014] Furthermore, the wire feeding assembly also includes a winding shaft, a winding cavity is provided inside the lifting column, the winding shaft is rotatably disposed inside the winding cavity, the axis of the winding shaft is vertically arranged, springs are connected to both ends of the slicing plate, the end of the spring away from the slicing plate is connected to a fixed wire plate, a traction wire is connected to the middle of the slicing plate, the traction wire moves through the fixed wire plate and is wound on the winding shaft, multiple fixed pulleys are arranged on the path of the traction wire to guide the movement of the traction wire, a slicing motor is installed inside the winding cavity, the output shaft of the slicing motor is connected to a drive gear, a driven gear is mounted on the lifting column, and the driven gear meshes with the drive gear through a gear set.

[0015] Furthermore, a linear conveyor module is installed on the assembly cabinet. The conveying direction of the linear conveyor module is parallel to the assembly direction of the W-band packaged antenna. A support base plate is installed on the slide of the linear conveyor module. A hollow tooling body is installed on the support base plate. The packaged substrate is tooled in the hollow tooling body. Electric push rods are installed on both sides of the hollow tooling body on the support base plate. The telescopic shaft of the electric push rod is connected to a tooling pressure plate. A tooling opening is provided on the hollow tooling body for the tooling pressure plate to pass through.

[0016] The beneficial effects of this invention are: 1. Liquid metal is used to simultaneously cover the top and bottom surfaces of the SOC chip, forming a bidirectional heat dissipation channel. This eliminates the need for high-resistivity soft transition layers such as thermally conductive silicone and thermal pads in traditional solutions. Utilizing the high thermal conductivity of liquid metal, the heat generated by the chip is quickly conducted to the metal cover and packaging substrate. The SOC chip is suspended by insulating pillars, leaving ample space for the liquid metal material on the bottom surface to maximize the heat dissipation contact area. The SOC chip is electrically insulated by an insulating thermally conductive film, and the suspended microstrip lines are protected by insulating pillars to prevent short circuits, pad corrosion, and high-frequency circuit failure. This effectively solves the problem of local hot spot accumulation in high-power-density W-band chips, suppresses excessively high chip junction temperatures, avoids performance degradation issues such as frequency drift and gain attenuation, and ensures the beam pointing accuracy and signal processing stability of the phased array antenna.

[0017] 2. By placing glass powder slurry between the packaging substrate and the metal cover plate, the glass powder slurry is fused at high temperature to form a continuous and dense airtight layer. The gap between the insulating pillar and the large-diameter hole is filled with sealant to form a double sealing structure, which completely blocks external oxygen and moisture from entering the blind slot. This solves the problems of moisture absorption and air permeability and leakage in assembly gaps of traditional organic packaging substrates. It can effectively avoid oxidation and corrosion of chip metal wiring and gate dielectric breakdown, enabling the packaged antenna to meet the long-term stable working requirements of harsh environments such as military and aerospace, and significantly extending the service life of the device.

[0018] 3. After the liquid gold material is poured into the blind tank and the error compensation tank, the liquid gold material in the error compensation tank is pushed into the blind tank by the compensation piston. This allows the liquid gold material to contact the metal cover plate and form a good heat transfer. With the error compensation tank, the filling accuracy of the liquid gold material can be reduced, the requirements on the liquid gold material filling equipment can be reduced, and the liquid gold material can form a good heat transfer contact surface. Attached Figure Description

[0019] Figure 1 A schematic cross-section of a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 1 ; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 A schematic cross-section of a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 2 ; Figure 4 This is a schematic diagram of the assembly line for a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 1 ; Figure 5 This is a schematic diagram of the assembly line for a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 2 ; Figure 6 for Figure 5 Enlarged view at point B in the middle; Figure 7 This is a schematic diagram of the assembly line for a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 3 ; Figure 8 This is a schematic diagram of the internal structure of the lifting column in the assembly line of a bidirectional heat dissipation W-band packaged antenna according to the present invention. Figure 9 This is a schematic diagram of the structure of Embodiment 9 of a bidirectional heat dissipation W-band packaged antenna assembly line of the present invention; In the diagram, 1-packaging substrate, 2-SOC chip, 3-metal cover plate, 4-blind slot, 5-antenna patch, 6-insulating and thermally conductive film, 7-insulating pillar, 8-suspended microstrip line, 9-liquid metal material, 10-large diameter hole, 11-small diameter wiring hole, 12-elastic sealant, 13-insulation hole, 14-error compensation groove, 15-compensation piston, 16-piston threaded rod, 17-piston disc, 18-elastic sleeve, 19-sealing groove, 20-annular sealing groove, 21-glass slurry, 22-reinforcement groove, 23-welding wire, 24-assembly cabinet, 25-glue applicator, 26-liquid metal filling machine, 27-glass slurry dispensing machine, 28-welding arm, 29-lifting column, 30-sealing plate, 31- - Electric heating plate, 32-Fixed wire plate, 33-Cut wire plate, 34-Wire feeding frame, 35-Guide groove, 36-Cut wire groove, 37-Wire feeding shaft, 38-Welding wire reel, 39-Motor, 40-Spring, 41-Traction wire, 42-Winding shaft, 43-Winding cavity, 44-Fixed pulley, 45-Drive gear, 46-Driven gear, 47-Linear conveyor module, 48-Support base plate, 49-Hollow tooling body, 50-Electric push rod, 51-Tooling pressure plate, 52-Tooling opening, 53-Swivel cap, 54-Glue injection needle tube, 55-Conveyor plate, 56-Active wire feeding wheel, 57-Driven wire feeding wheel, 58-Steering motor, 59-First gear, 60-Second gear. Detailed Implementation

[0020] Example 1 like Figures 1 to 3 As shown, a bidirectional heat dissipation W-band packaged antenna includes a package substrate 1, a SOC chip 2, and a metal cover plate 3. A blind slot 4 is formed on the top of the package substrate 1, and the SOC chip 2 is installed within the blind slot 4. An antenna patch 5 is disposed on the bottom surface of the SOC chip 2. An insulating and thermally conductive film 6 is deposited on the bottom surface of the SOC chip 2, covering the antenna patch 5. An insulating post 7 is connected to the insulating and thermally conductive film 6. The insulating post 7 is hollow, and its inner hole is used to arrange a suspended microstrip line 8 of the SOC chip 2. The suspended microstrip line 8 extends from the package substrate 1 and connects to the package substrate. The packaging substrate 1 and the SOC chip 2 are interconnected by a suspended microstrip line 8. Insulating pillars 7 are also fitted onto the bump copper pillars at the bottom of the SOC chip. The bump copper pillars are soldered to the packaging substrate 1 to ensure the stability of the SOC chip installation. The insulating pillars 7 support the SOC chip 2 in a suspended state. The blind slot 4 is filled with liquid metal material 9, which covers both the top and bottom surfaces of the SOC chip 2. A metal cover plate 3 is installed on the top surface of the packaging substrate 1 to seal the blind slot 4. Liquid metal material 9 is injected into the blind slot 4 using a liquid metal filling machine 26. The liquid metal material 9 is preferably gallium silicon (GaSi). 80 Si 20Under the action of the insulating pillar 7, the SOC chip 2 is suspended, allowing the liquid metal material 9 to simultaneously wrap the top and bottom surfaces of the SOC chip 2. Since the back of the SOC chip 2 needs to accommodate circuitry, direct contact between the liquid metal material 9 and the back of the SOC chip 2 would cause short circuits, corrosion of the solder pads, and damage to high-frequency circuits. Therefore, an insulating thermally conductive film 6 is deposited on the back of the SOC chip 2. This film isolates the liquid metal material 9 from the circuitry of the SOC chip 2. Furthermore, the insulating thermally conductive film 6 has high thermal conductivity, achieving insulation while also effectively dissipating the heat generated by the SOC chip 2. The heat generated by the chip is quickly transferred to the liquid metal material 9. The insulating pillar 7 keeps the SOC chip 2 in a suspended state and is used to arrange the suspended microstrip line 8, which protects the suspended microstrip line 8. This eliminates the need for high-resistivity soft transition layers such as thermally conductive silicone and thermal pads in traditional solutions. By utilizing the high thermal conductivity of the liquid metal material 9, the heat generated by the chip is quickly transferred to the metal cover plate 3 and the packaging substrate 1. This effectively solves the problem of local hot spot accumulation in high-power-density chips in the W-band, suppresses excessively high chip junction temperature, avoids performance degradation problems such as frequency drift and gain attenuation, and ensures the beam pointing accuracy and signal processing stability of the phased array antenna. In practice, the SOC chip 2 and the antenna patch 5 adopt a chip-level integrated interconnection design. Specifically, the antenna patch 5 is directly formed on the bottom metallization layer of the SOC chip 2 using sputtering and photolithography. The material is gold or copper with high conductivity, and the thickness is controlled at 2-3μm. The active circuit area of ​​the antenna patch 5 and the SOC chip 2 are isolated by the chip's own SiO2 insulating layer. When the insulating and thermally conductive film 6 covers the surface of the antenna patch 5, a signal coupling area is reserved at the edge of the patch to ensure that the antenna radiation performance is not affected.

[0021] Preferably, the packaging substrate 1 is a multilayer Al2O3 plate prepared by casting and high-temperature co-firing process, which has higher thermal conductivity and achieves efficient heat dissipation.

[0022] Example 2 Based on Example 1, such as Figure 1 and Figure 3As shown, a sealing groove 19 is formed around the blind groove 4 on the top surface of the encapsulation substrate 1. The sealing groove 19 connects to the blind groove 4. An annular sealing groove 20 is formed on the step formed by the blind groove 4 and the sealing groove 19. The annular sealing groove 20 is filled with glass powder slurry 21. A metal cover plate 3 is assembled in the sealing groove 19. The glass powder slurry 21 is fused together with the metal cover plate 3 and the encapsulation substrate 1 at high temperature to form a dense and airtight layer. The glass powder slurry 21 is injected into the annular sealing groove 20 by a glass powder slurry dispensing machine 27. During dispensing, attention should be paid to the continuity of the glass powder slurry 21. Then, the metal cover plate 3 is assembled into the sealing groove 19. The metal cover plate 3 is heated at high temperature to fused together with the glass powder slurry 21 at high temperature. Between the metal cover plate 3 and the packaging substrate 1, a continuous and dense airtight layer is formed by high-temperature fusion sealing of glass powder slurry. Compared with traditional welding sealing, this greatly enhances the sealing performance between the metal cover plate 3 and the packaging substrate 1. Finally, the metal cover plate 3 and the packaging substrate 1 are welded together by the welding arm 28. The welding surfaces of the metal cover plate 3 and the packaging substrate 1 are connected end to end around the edge of the metal cover plate 3 to form a ring, which increases the welding area between the metal cover plate 3 and the packaging substrate 1. This results in a higher connection strength between the metal cover plate 3 and the packaging substrate 1, and ensures that the force between the metal cover plate 3 and the packaging substrate 1 is applied to the welding surface, preventing the separation of the airtight layer and ensuring that the sealing performance of the packaged antenna is not affected.

[0023] Example 3 Based on Example 2, such as Figures 1 to 3As shown, a closed welding surface is formed between the edge of the metal cover plate 3 and the packaging substrate 1. Several reinforcing grooves 22 are provided on the side wall of the sealing groove 19. The reinforcing grooves 22 pass through the top surface of the packaging substrate 1. Welding wire 23 is inserted into the reinforcing groove 22. The welding wire 23 melts at the melting temperature of the glass powder slurry 21. This is used to form a reinforcing welding surface on the side of the metal cover plate 3 after the welding wire 23 solidifies. In later applications, the airtightness of the packaged antenna is put to a greater test due to the harsh working environment. For example, large vibrations during equipment operation or environmental vibrations have a significant impact on the packaged antenna. Frequent vibrations will continuously weaken the connection strength between the metal cover plate 3 and the packaging substrate 1. When the stress point is on the melting surface of the glass powder slurry 21, the sealing performance of the packaged antenna will be affected. External gases and impurities will enter the blind groove 4 and affect the SOC chip 2. Therefore, the packaging substrate 1 has multiple reinforcing grooves 22 on the side wall of the sealing groove 19. Before melting the glass powder slurry 21, each reinforcing groove 22 is first filled with a reinforcing wire. A welding wire 23 is inserted, and then the metal cover plate 3 is heated to seal the glass powder slurry 21. The sealing temperature of the glass powder slurry 21 is 350℃-400℃. The welding wire 23 is a lead-free solder wire with a melting point of 218-227℃. Thus, when sealing the glass powder slurry 21, the temperature of the metal cover plate 3 can simultaneously melt the welding wire 23. At the same time, the welding wire 23 fills the reinforcing groove 22 and connects to the encapsulation substrate 1 from the side of the metal cover plate 3. Finally, the edge of the metal cover plate 3 is welded to the encapsulation substrate 1, forming an annular welding surface along the edge of the metal cover plate 3. This strengthens the connection and seals the reinforcing groove 22, forming a weld seal between the edge of the metal cover plate 3 and the encapsulation substrate 1. Combined with the airtight layer of the glass powder slurry 21, the airtightness of the encapsulated antenna is greatly improved. Furthermore, the side welding of the metal cover plate 3 further increases the area of ​​the welding surface, strengthens the connection between the metal cover plate 3 and the encapsulation substrate 1, and enables the structure of the encapsulated antenna to adapt to harsh working environments. In practice, the metal cover plate 3 is pre-oxidized before fusion sealing to form a thin oxide layer, which improves the bonding force with the glass. During fusion sealing, it is first dried at low temperature and kept at 150-200℃ for 30 minutes to evaporate the solvent and prevent rapid boiling. Then, the adhesive is removed at high temperature and kept at 350-400℃ for 60 minutes to completely decompose the organic adhesive and avoid the generation of bubbles during sealing.

[0024] Example 4 Based on Example 3, such as Figure 1 and Figure 2As shown, the packaging substrate 1 has a large-diameter hole 10 and a small-diameter wiring hole 11 sequentially formed from top to bottom at the position corresponding to the insulating post 7. The insulating post 7 is inserted into the large-diameter hole 10, and the diameter of the insulating post 7 is larger than the diameter of the small-diameter wiring hole 11. The suspended microstrip line 8 passes through the small-diameter wiring hole 11. An elastic sealing body 12 is fixedly sleeved on the insulating post 7, and the elastic sealing body 12 contacts the inner bottom wall of the blind groove 4. The top of the packaging substrate 1 has a glue injection hole 13 that connects to the large-diameter hole 10, which is used to fill the space between the insulating post 7 and the large-diameter hole 10 with sealant. The SOC chip 2 is placed in the blind groove 4, so that the insulating post 7 corresponds to the large-diameter hole 10 and is inserted into the large-diameter hole 10. When the insulating post 7 contacts the step between the large-diameter hole 10 and the small-diameter wiring hole 11, Once the SOC chip 2 is assembled, the elastic sealing body 12 contacts the inner bottom wall of the blind slot 4, sealing the top opening of the large-diameter hole 10. This ensures that the sealant will not enter the blind slot 4 through the large-diameter hole 10 during glue injection. The glue applicator 25 injects the sealant into the large-diameter hole 10 through the glue injection hole 13, sealing the gap between the insulating post 7 and the large-diameter hole 10. The suspended microstrip line 8 is led out through the insulating post 7 and the small-diameter wiring hole 11, thus achieving sealing without affecting the antenna wiring. The insulating post 7 is glued to the insulating and thermally conductive film 6, preventing external gas from entering the blind slot 4 through the insulating post 7. Alternatively, sealant can be injected into the small-diameter wiring hole 11 to eliminate the gap between the small-diameter wiring hole 11 and the suspended microstrip line 8. It should be noted that the bottom surface of the SOC chip 2 has a reserved RF pad (100×100μm in size), which is connected to the antenna patch 5 via a microstrip line branch (branch width 50-80μm, characteristic impedance 50Ω). One end of the suspended microstrip line 8 is soldered to the RF pad with gold solder (AuSn20), and the other end passes through the hollow inner hole of the insulating post 7 and the small-diameter wiring hole 11 of the packaging substrate 1, connecting to the RF transmission line (microstrip line or coplanar waveguide) inside the packaging substrate 1. The insulating post 7 is made of polytetrafluoroethylene (PTFE) or silicon nitride (Si3N4) material, with a length of 2-3mm, and its inner diameter is larger than that of the suspended microstrip line 8. The outer diameter is 0.2-0.3mm larger, and the gap is filled with polyimide (PI) sealant (dielectric constant ≤3.0), which not only fixes the suspended microstrip line 8, but also avoids RF signal leakage. The suspended microstrip line 8 is made of gold-plated copper strip (thickness 50μm, width 80μm), and the surface is covered with a polyimide shielding layer to reduce parasitic coupling with liquid gold material 9. It also relies on the wiring layer of the bump copper pillar and the packaging substrate 1 to build a reliable power supply / control interconnection channel.

[0025] Example 5 The filling accuracy of the liquid metal material 9 is high. It needs to be sufficient to ensure adequate heat dissipation by contacting the metal cover plate 3, while also avoiding excessive amounts to prevent overflow and contamination during metal cover plate 3 assembly. Furthermore, the assembly of the SOC chip 2 into the blind slot 4 affects its volume, making it impossible to accurately determine its actual volume. This places even higher precision requirements on the subsequent liquid metal filling machine 26. Therefore, based on Example 4, as... Figure 1 As shown, the blind groove 4 has an error compensation groove 14 on its side wall. A compensation piston 15 is installed in the error compensation groove 14. The compensation piston 15 is used to push the liquid metal material 9 in the error compensation groove 14 into the blind groove 4, so that the liquid metal material 9 contacts the metal cover plate 3 and the packaging substrate 1. The compensation piston 15 includes a piston threaded rod 16, a piston disc 17, and an elastic sleeve 18. The side wall of the packaging substrate 1 has a threaded hole that communicates with the error compensation groove 14. The piston threaded rod 16 is threaded to fit into the threaded hole, and one end of the piston threaded rod 16 is connected to the piston disc 17. The elastic sleeve 18 is fixedly sleeved on the piston disc 17 and is interference-fitted into the error compensation groove 14. When the liquid metal material 9 is filled, the compensation piston 15 moves away from the blind groove 4, so that the error compensation groove 14 has a larger capacity, and the filling amount of liquid metal material is greater than that of the blind groove. The actual volume of the blind groove 4 is less than the sum of the actual volume of the blind groove 4 and the volume of the error compensation groove 14. This allows the liquid metal material 9 to be stored in the blind groove 4 and the error compensation groove 14. After the metal cover plate 3 is welded, the piston thread rod 16 is screwed in, causing the piston disc 17 to drive the elastic sleeve 18 to move closer to the blind groove 4. This pushes the liquid metal material 9 in the error compensation groove 14 into the blind groove 4, raising the liquid metal material level in the blind groove 4 and allowing it to contact the metal cover plate 3. This allows for a larger filling range of the liquid metal material 9, ensuring that the liquid metal material 9 will not overflow when the metal cover plate 3 is assembled. After the metal cover plate 3 is assembled, the liquid metal material 9 can contact the metal cover plate 3 to form high heat dissipation. An airtight layer has been formed between the metal cover plate 3 and the packaging substrate 1, ensuring that the liquid pushing action of the compensation piston 15 will not cause the liquid metal material 9 to overflow. During the movement of the piston disc 17, the elastic sleeve 18 is always interference-fitted with the error compensation groove 14, so that the liquid metal material 9 can flow stably between the error compensation groove 14 and the blind groove 4, while preventing the liquid metal material 9 from overflowing from the connection of the piston threaded rod 16.

[0026] Example 6 Based on Example 5, such as Figure 1As shown, the error compensation groove 14 is frustum-shaped, and its diameter gradually increases along the direction close to the blind groove 4, which facilitates the installation of the compensation piston 15. The compensation piston 15 is assembled into the error compensation groove 14 through the blind groove 4. The piston thread rod 16 is screwed out from the threaded hole and connected to the screw cap 53. The screw cap 53 can be rotated from the outside to move the compensation piston 15 in the error compensation groove 14, which facilitates the installation of the compensation piston 15. Secondly, the elastic sleeve 18 is also frustum-shaped, and the diameter of the small diameter end is smaller than the diameter of the large diameter end of the error compensation groove 14, so that the small diameter end of the elastic sleeve 18 can enter the error compensation groove 14. When the compensation piston 15 is fully inserted into the error compensation groove 14, the elastic sleeve 18 needs to be squeezed to produce deformation. Since the side wall of the elastic sleeve 18 is conical, it can adapt to the deformation when the piston disc 17 is moved into the error compensation groove 14, thereby interfering with the installation of the compensation piston 15 in the error compensation groove 14.

[0027] Example 7 Based on Example 6, such as Figures 1 to 4As shown, an assembly line for a bidirectional heat-dissipating W-band packaged antenna includes an assembly cabinet 24. Along the assembly direction of the W-band packaged antenna, the assembly cabinet 24 is sequentially equipped with a glue applicator 25, a liquid metal filling machine 26, a glass powder dispensing machine 27, a welding wire insertion mechanism, and a welding arm 28. The glue applicator 25 fills the large-diameter hole 10 with sealant through the glue injection hole 13. The liquid metal filling machine 26 fills the blind groove 4 with liquid metal material 9. The glass powder dispensing machine 27 injects glass powder 21 into the annular sealing groove 20. The welding wire insertion mechanism inserts welding wire 23 into each reinforcing groove 22. The welding arm 28 welds the edge of the metal cover plate 3 to the packaged substrate 1. A straight... The linear conveyor module 47 has a conveying direction parallel to the assembly direction of the W-band packaged antenna. A support base plate 48 is mounted on the slide of the linear conveyor module 47, and a hollow tooling body 49 is mounted on the support base plate 48. The packaged substrate 1 is installed inside the hollow tooling body 49. Electric push rods 50 are mounted on both sides of the hollow tooling body 49 on the support base plate 48. The telescopic shaft of the electric push rods 50 is connected to a tooling pressure plate 51. A tooling opening 52 is provided on the hollow tooling body 49 for the tooling pressure plate 51 to pass through. The packaged substrate 1 and the SOC chip 2 can be automatically fed by a six-axis robotic arm. A substrate tray and a chip tray are set within the working range of the six-axis robotic arm. The packaged substrate 1 is placed on the substrate tray, and the SOC chip 2 is placed on the chip tray. On the wafer tray, a six-axis robotic arm uses negative pressure adsorption to place the packaging substrate 1 into the hollow fixture 49. An electric push rod 50 moves the fixture pressure plate 51 closer to the packaging substrate 1, clamping it between the two fixture pressure plates 51. Then, the six-axis robotic arm assembles the SOC chip 2 into the blind slot 4 of the packaging substrate 1. Next, the linear conveyor module 47 transports the packaging substrate 1 to the working range of the glue applicator 25, aligning the glue injection needle 54 with the glue injection hole 13. The glue injection needle 54 moves downwards and inserts into the glue injection hole 13, injecting sealant into the large-diameter hole 10 to seal the gap between the insulating post 7 and the large-diameter hole 10. Finally, the packaging substrate 1 is transported to the working range of the liquid metal filling machine 26, where it is processed by the liquid metal filling machine. 26. Liquid metal material 9 is filled into the blind groove 4. Then, the encapsulation substrate 1 is transported to the working range of the glass powder dispensing machine 27. The glass powder dispensing machine 27 injects glass powder 21 into the annular sealing groove 20. Then, the metal cover plate 3 is assembled into the sealing groove 19 of the encapsulation substrate 1 by the robotic arm. Next, the encapsulation substrate 1 is transported to the working range of the welding wire insertion mechanism. The welding wire insertion mechanism places a welding wire 23 into each reinforcing groove 22. Then, the welding wire insertion mechanism heats the metal cover plate 3, causing the glass powder 21 to melt and form an airtight layer. The melting temperature is used to melt the welding wire 23, and the encapsulation substrate 1 is welded from the side of the metal cover plate 3. After the glass powder 21 is melted and sealed, the temperature of the metal cover plate 3 is allowed to drop below 150°C.The packaging substrate 1 is transported to the working range of the welding arm 28, where the edge of the metal cover plate 3 is welded to the packaging substrate 1. Finally, the robotic arm completes the unloading of the packaged antenna, thus completing the assembly of the packaged antenna.

[0028] Example 8 Based on Example 7, such as Figures 1 to 7 As shown, the welding wire insertion mechanism includes a lifting column 29, a welding seal plate 30, and a wire feeding assembly. The welding seal plate 30 is fixed to the bottom of the lifting column 29. The lifting column 29 has the freedom to move along the height direction of the assembly cabinet 24. An electric heating plate 31 is embedded in the bottom of the welding seal plate 30. Wire feeding assemblies are provided on all four side walls of the welding seal plate 30. The wire feeding assembly includes a wire fixing plate 32, a wire cutting plate 33, and a wire feeding frame 34. The wire fixing plate 32 is fixedly connected to the welding seal plate 30, and the wire is fed through the wire feeding frame. The plate 32 has multiple guide grooves 35 for the welding wire 23 to pass through. A wire-cutting groove 36 is formed at the end of the wire-fixing plate 32 away from the sealing plate 30, and the wire-cutting groove 36 connects to the guide grooves 35. The wire-cutting plate 33 is slidably disposed within the wire-cutting groove 36, and a cutting edge is formed at the end of the wire-cutting plate 33 near the guide groove 35. The wire feeder 34 is fixed to the lifting column 29, and a wire feed shaft 37 is rotatably mounted on the wire feeder 34. Multiple welding wire reels 38 are mounted on the wire feed shaft 37. A motor 39 is installed on the wire frame 34. The output shaft of the motor 39 is connected to the wire feeding shaft 37. When the encapsulation substrate 1 is transported to the bottom of the sealing plate 30, multiple guide grooves 35 correspond one-to-one with multiple reinforcing grooves 22. The motor 39 drives the wire feeding shaft 37 to rotate, which in turn drives all the welding wire reels 38 on it to rotate, so that the welding wire reels 38 release the welding wire 23. Under the guidance of the guide grooves 35, the welding wire 23 is accurately inserted into the reinforcing groove 22. Then, the wire cutter 33 moves close to the wire stationary plate 32 to cut the welding wire 23. At the same time, the welding wire 23 is injected into multiple reinforcing grooves 22. The length of the welding wire 23 is greater than the depth of the reinforcing groove 22, so that the welding wire 23 can fully fill the reinforcing groove 22 when it melts, achieving good welding. After the welding wire 23 is inserted, the electric heating plate 31 is energized to heat the metal cover plate 3, melt the glass powder slurry 21, and melt the welding wire 23 to form a lateral welding surface. In practice, the wire insertion mechanism also includes a frame and a cylinder. The frame is installed on the assembly cabinet 24, and the cylinder is installed vertically on the frame. The telescopic shaft of the cylinder is connected to the lifting column 29. The lifting column 29 moves up and down through the cylinder, so that the sealing plate 30 contacts the metal cover plate 3 to complete the sealing, wire insertion and wire melting operations.

[0029] Furthermore, to facilitate the replacement of the welding wire reel 38, the wire feeder 34 includes two spaced-apart wire feeder side plates. The motor 39 is mounted on one of the wire feeder side plates, while the other wire feeder side plate is detachably mounted. This side plate has a through hole, through which one end of the wire feeder shaft 37 passes, allowing both ends of the shaft to be supported by the two side plates. The detachably mounted side plate can be installed on the lifting column 29 with screws, or it can be installed on the lifting column 29 using a combination of a sliding groove and a sliding bar, with the sliding bar fixed. On the wire feeding side plate, a chute is formed on the lifting column 29, and the cross-section of both the slide bar and the chute is T-shaped. The side wall of the welding wire reel 38 is threaded with a screw rod, and the tail of the screw rod abuts against the wire feeding shaft 37, thereby fixing the welding wire reel 38 and the wire feeding shaft 37 together. After the welding wire 23 on the welding wire reel 38 is fed out, the detachable wire feeding side plate is removed, the screw rod is unscrewed, the welding wire reel 38 is removed along the axial direction of the wire feeding shaft 37, and then a fully loaded welding wire reel 38 is replaced, the screw rod is tightened, and finally the removed wire feeding side plate is installed.

[0030] Example 9 Based on Example 8, such as Figures 1 to 9 As shown, to ensure stable feeding of the welding wire 23 into the reinforcement trough 22, a welding wire feeding assembly is installed on the top of the wire guide plate 32. Each guide trough 35 is equipped with a welding wire feeding assembly, which includes a feeding plate 55, a drive feeding wheel 56, and a driven feeding wheel 57. Feeding plates 55 are fixed on both sides of the reinforcement trough 22. The drive feeding wheel 56 and the driven feeding wheel 57 are rotatably mounted between the two feeding plates 55. The welding wire 23 passes between the drive feeding wheel 56 and the driven feeding wheel 57. A servo motor 58 is installed on one of the feeding plates 55. The output shaft of the servo motor 58 is connected to the active wire feed wheel 56. The active wire feed wheel 56 and the driven wire feed wheel 57 are respectively equipped with a first gear 59 and a second gear 60. The first gear 59 meshes with the second gear 60. The servo motor 58 drives the active wire feed wheel 56 to rotate. The active wire feed wheel 56 drives the driven wire feed wheel 57 to rotate through the meshing of the first gear 59 and the second gear 60. Thus, the welding wire 23 is fed into the guide groove 35 through the cooperation of the active wire feed wheel 56 and the driven wire feed wheel 57. Then, the welding wire is fed into the reinforcement groove 22 through the guidance of the guide groove 35.

[0031] Example 10 Based on Example 9, such as Figures 1 to 8As shown, the wire feeding assembly also includes a winding shaft 42. A winding cavity 43 is provided inside the lifting column 29. The winding shaft 42 is rotatably mounted within the winding cavity 43, and its axis is vertical. Springs 40 are connected to both ends of the slicing plate 33. The end of the spring 40 away from the slicing plate 33 is connected to a fixed wire plate 32. A traction wire 41 is connected to the middle of the slicing plate 33. The traction wire 41 moves through the fixed wire plate 32 and winds around the winding shaft 42. Multiple fixed pulleys 44 are provided along the path of the traction wire 41 to guide its movement. A slicing motor is installed inside the winding cavity 43. The output shaft of the slicing motor is connected to a drive gear 45. A driven gear 46 is mounted on the lifting column 29. The driven gear 46 meshes with the drive gear 45 through a gear set, and the traction wire 41 moves through the fixed wire plate 32. The pulley 44 guides the traction wire 41, causing it to wind around the winding shaft 42. Preferably, two fixed pulleys 44 are installed, one on the sealing plate 30 and the other on the lifting column 29. The traction wire 41 passes over the two fixed pulleys 44 and is driven by the wire cutting motor to rotate the drive gear 45. The drive gear 45 drives the driven gear 46 to rotate through the gear set. The driven gear 46 drives the winding shaft 42 to rotate. During wire cutting, the winding shaft 42 winds the traction wire 41, causing the traction wire 41 to pull the wire cutting plate 33 closer to the fixed wire plate 32. This causes the wire cutting plate 33 to compress the spring 40 and cut the welding wire 23. Then, the wire cutting motor rotates in the opposite direction, causing the winding shaft 42 to release the traction wire 41, and the wire cutting plate 33 to return to its original position under the reaction force of the spring 40.

Claims

1. A bidirectional heat-dissipating W-band packaged antenna, characterized in that, The package includes a packaging substrate, a SOC chip, and a metal cover plate. A blind slot is formed on the top of the packaging substrate, and the SOC chip is mounted within the blind slot. An antenna patch is disposed on the bottom surface of the SOC chip. An insulating and thermally conductive film is deposited on the bottom surface of the SOC chip, covering the antenna patch. An insulating pillar is connected to the insulating and thermally conductive film, and the insulating pillar is hollow. The inner hole of the insulating pillar is used to arrange the suspended microstrip line of the SOC chip, which extends from the packaging substrate. The insulating pillar supports the SOC chip in a suspended state. The blind slot is filled with liquid metal material, which simultaneously covers both the top and bottom surfaces of the SOC chip. The metal cover plate is mounted on the top surface of the packaging substrate to seal the blind slot.

2. The bidirectional heat dissipation W-band packaged antenna according to claim 1, characterized in that, The packaging substrate has a large-diameter hole and a small-diameter wiring hole sequentially formed from top to bottom at the position corresponding to the insulating pillar. The insulating pillar is inserted into the large-diameter hole, and the diameter of the insulating pillar is larger than the diameter of the small-diameter wiring hole. The suspended microstrip line passes through the small-diameter wiring hole. An elastic sealing body is fixedly sleeved on the insulating pillar. The elastic sealing body contacts the inner bottom wall of the blind groove. The top of the packaging substrate has a glue injection hole that communicates with the large-diameter hole for filling the space between the insulating pillar and the large-diameter hole with sealant.

3. The bidirectional heat dissipation W-band packaged antenna according to claim 1, characterized in that, The blind slot has an error compensation groove on its side wall, and a compensation piston is provided in the error compensation groove. The compensation piston is used to push the liquid metal material in the error compensation groove into the blind slot, so that the liquid metal material contacts the metal cover plate and the packaging substrate.

4. A bidirectional heat dissipation W-band packaged antenna according to claim 3, characterized in that, The compensation piston includes a piston threaded rod, a piston disc, and an elastic sleeve. The side wall of the packaging substrate has a threaded hole that communicates with the error compensation groove. The piston threaded rod is threaded to fit into the threaded hole, and one end of the piston threaded rod is connected to the piston disc. The elastic sleeve is fixedly sleeved on the piston disc and is interference-fitted into the error compensation groove.

5. A bidirectional heat dissipation W-band packaged antenna according to claim 2, characterized in that, The top surface of the packaging substrate has a sealing groove around the blind groove, the sealing groove is connected to the blind groove, and an annular sealing groove is formed on the step formed by the blind groove and the sealing groove. The annular sealing groove is filled with glass powder slurry, and the metal cover plate is assembled in the sealing groove. The glass powder slurry is fused at high temperature to form a dense airtight layer between the metal cover plate and the packaging substrate.

6. A bidirectional heat dissipation W-band packaged antenna according to claim 5, characterized in that, The edge of the metal cover plate forms a closed welding surface with the packaging substrate. The side wall of the sealing groove is provided with several reinforcing grooves. The reinforcing grooves pass through the top surface of the packaging substrate. Welding wire is inserted into the reinforcing grooves. The welding wire melts at the sealing temperature of the glass powder slurry, so that the welding wire solidifies and forms a reinforcing welding surface on the side of the metal cover plate.

7. A bidirectional heat-dissipating W-band packaged antenna assembly line, utilizing the bidirectional heat-dissipating W-band packaged antenna as described in claim 6, characterized in that, The assembly cabinet includes a glue applicator, a liquid metal filling machine, a glass powder dispensing machine, a welding wire insertion mechanism, and a welding arm arranged sequentially along the assembly direction of the W-band packaged antenna. The glue applicator fills the large-diameter hole with sealant through the glue injection hole. The liquid metal filling machine is used to fill the blind groove with liquid metal material. The glass powder dispensing machine is used to inject glass powder into the annular sealing groove. The welding wire insertion mechanism inserts welding wire into each reinforcing groove. The welding arm is used to weld the edge of the metal cover plate to the packaged substrate.

8. The bidirectional heat dissipation W-band packaged antenna assembly line according to claim 7, characterized in that, The welding wire insertion mechanism includes a lifting column, a sealing plate, and a wire feeding assembly. The sealing plate is fixed to the bottom of the lifting column, and the lifting column has the freedom to move along the height direction of the assembly cabinet. An electric heating plate is embedded in the bottom of the sealing plate. Wire feeding assemblies are provided on all four side walls of the sealing plate. The wire feeding assembly includes a wire-fixing plate, a wire-cutting plate, and a wire feeding frame. The wire-fixing plate is fixedly connected to the sealing plate. Multiple guide grooves for welding wire to pass through are formed on the wire-fixing plate. A wire-cutting groove is formed at the end of the wire-fixing plate away from the sealing plate. The wire-cutting groove is connected to the guide groove. The wire-cutting plate is slidably disposed in the wire-cutting groove. A cutting edge is formed at the end of the wire-cutting plate near the guide groove. The wire feeding frame is fixed to the lifting column. A wire feeding shaft is rotatably disposed on the wire feeding frame. Multiple welding wire reels are mounted on the wire feeding shaft. A motor is installed on the wire feeding frame, and the output shaft of the motor is connected to the wire feeding shaft.

9. The bidirectional heat dissipation W-band packaged antenna assembly line according to claim 8, characterized in that, The wire feeding assembly also includes a winding shaft. The lifting column has a winding cavity, and the winding shaft is rotatably mounted in the winding cavity. The axis of the winding shaft is vertically arranged. Springs are connected to both ends of the slicing plate. The end of the spring away from the slicing plate is connected to a fixed wire plate. A traction wire is connected to the middle of the slicing plate. The traction wire moves through the fixed wire plate and is wound around the winding shaft. Multiple fixed pulleys are arranged on the path of the traction wire to guide its movement. A slicing motor is installed in the winding cavity. The output shaft of the slicing motor is connected to a drive gear. A driven gear is mounted on the lifting column. The driven gear meshes with the drive gear through a gear set.

10. The bidirectional heat dissipation W-band packaged antenna assembly line according to claim 7, characterized in that, A linear conveyor module is installed on the assembly cabinet. The conveying direction of the linear conveyor module is parallel to the assembly direction of the W-band packaged antenna. A support base plate is installed on the slide of the linear conveyor module. A hollow tooling body is installed on the support base plate. The packaged substrate is tooled in the hollow tooling body. Electric push rods are installed on both sides of the hollow tooling body on the support base plate. The telescopic shaft of the electric push rod is connected to a tooling pressure plate. A tooling opening is provided on the hollow tooling body for the tooling pressure plate to pass through.

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