Electronic device

Abstract

An electronic device capable of operating in a first state and a second state is provided. The electronic device includes a stretchable patterned substrate, a first protruding unit, and a second protruding unit. The stretchable patterned substrate has a first portion, a second portion, and a connecting portion connected between the first portion and the second portion. The first protruding unit is disposed on the first portion, and the second protruding unit is disposed on the second portion. The first protruding unit and the second protruding unit have a first distance D1 in the first state, and have a second distance D2 in the second state, and the first distance D1 and the second distance D2 satisfy the following relationship: 1 < D2 / D1 < 2.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having raised units disposed on a stretchable patterned substrate. Background Technology

[0002] In traditional electronic devices, raised units are typically provided on the substrate to support or position light-emitting or sensing units during the manufacturing process. Although electronic devices with stretchable properties have been developed in recent years, the space on their patterned substrates is limited, so how to set the raised units on the patterned substrates remains an important issue in the field. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic device to solve the above-mentioned problems.

[0004] This invention provides an electronic device capable of operating in a first state and a second state. The electronic device includes a stretchable patterned substrate, a first electronic unit and a first protrusion unit, and a second electronic unit and a second protrusion unit. The stretchable patterned substrate has a first portion, a second portion, and a connecting portion connecting the first portion and the second portion. The first electronic unit and the first protrusion unit are disposed on the first portion, and the second electronic unit and the second protrusion unit are disposed on the second portion. The first protrusion unit and the second protrusion unit are higher than the first electronic unit and the second electronic unit in a normal direction of the electronic device. When the electronic device extends from the first state to the second state along a stretching direction, the first protrusion unit and the second protrusion unit have a first distance D1 in the stretching direction in the first state, and a second distance D2 in the stretching direction in the second state, and the first distance D1 and the second distance D2 satisfy the following relationship: 1 <D2 / D1<2。

[0005] In the electronic device of the present invention, since the distance between the protruding units disposed in different island-shaped portions can be increased after stretching, the electronic device can have a significant dimensional change after stretching, which can be easily identified by the human eye, thus enabling the electronic device to have a stretching effect. Attached Figure Description

[0006] Figure 1 The diagram shown is a top view of the electronic device in the first embodiment of the present invention operating in the first state and the second state.

[0007] Figure 2 The diagram shown is a top view of an electronic device operating in a first state and a second state, according to a variation of the first embodiment of the present invention.

[0008] Figure 3 The diagram shown is a top view of the electronic device of the second embodiment of the present invention in its first state.

[0009] Figure 4 As shown Figure 3 A cross-sectional view along section line A-A'.

[0010] Figure 5 As shown Figure 3 A cross-sectional view along section line B-B'.

[0011] Figure 6 The diagram shown is a top view of the electronic device according to the third embodiment of the present invention in its first state.

[0012] Figure 7 As shown Figure 6 A cross-sectional view along section line C-C'.

[0013] Figure 8 The diagram shown is a top view of the electronic device of the fourth embodiment of the present invention in its first state.

[0014] Figure 9 The diagram shown is a cross-sectional view of an electronic device according to a fifth embodiment of the present invention.

[0015] Figure 10 The diagram shown is a top view of the electronic device according to the sixth embodiment of the present invention in its first state.

[0016] Explanation of reference numerals: 1, 1a, 2, 3, 4, 5, 6 - Electronic device; 12 - Stretchable patterned substrate; 12a - Inflexible portion; 12b - Flexible portion; 12c - Stretchable portion; 14AL - Active layer; 14CR - Corner; 161, 14P - Center point; 16BS, IN5B - Bottom surface; 16P1 - First part; 16P2 - Second part; 16S, IN5S - Side; 18 - Inorganic layer; 18a - Inorganic island; 22, 22a - Transistor; 24 - Flexible substrate; 26 - Sensing electrode; 26a - Annular portion; 26b, 16CP - Connecting portion; 28, 28a, 28b, 28c - Optical element; 30 - Protective layer; 32 - Light-shielding layer; 36 - Filler Layer; 38 - Cover layer; 40, 40a, 40b, 40c, 14, 14a, 14b, 14c - Electronic units; 42, 16, 16a, 16b, 16c, 16d, 16e, 16f, 16g - Raised units; 44 - Flexible circuit board; 46, 34 - Bonding pads; 48 - Control elements; AL - Adhesive layer; BS - Lower surface; CA - Central axis; CD1 - Clockwise direction; CD2 - Counterclockwise direction; CH - Channel area; CL1, CL2, CL3 - Conductive layers; CP - Connection part; CR1, CR2, CR3, CR4 - Central area; D1, D2 - Distance; D3, D4, D5, D6, D7 - Minimum distance; DR1, DR2, DR3 - Direction E - Edge; E1 - Source (Drain) Electrode; E2 - Drain (Source) Electrode; E3, E4, E5, E6, E11, E12, E13, E14 - Electrode; E7 - Lower Electrode; E8 - Upper Electrode; E9, E10 - Pad; ED1, ED2 - Extension Direction; FR - Flexible Area; H1, H2 - Height; IN1, IN2, IN3, IN4, IN5, IN6, IN7, IN8 - Insulating Layer; IS - Island Structure; L1, L2 - Virtual Line; L3 - Connection; LD1, LD2 - Long Axis Direction; LE1, LE2, LE3 - Length; LL - Light Emitting Layer; LS1, LS2 - Long Side; MP, MPa, MPb - Partial; NFR - Non-Flexible Area; OP1, OP 2, OP3, OP4, OP5 - Openings; P1, P2, P7, P8, P9 - Endpoints; P3, P10 - Intersections; P4 - Boundary points; P5, P6 - Points; PN1 - Plane; R1, R2, R3 - Minimum rectangles; Ra, Rb - Regions; S1 - First state; S2 - Second state; SD - Stretching direction; SD1 - Minor axis direction; SEM, 14S1, 14S2 - Semiconductor layers; SR - Stretched area; SS1, SS2 - Short sides; T1, T2 - Thickness; TH1, TH2, TH3 - Through holes; TS - Top surface; W1, W2, W4, W5, W6, W7 - Maximum width; W3 - Width; θ1 - Rotation angle; θ2, θ3, θ4, θ5 - Acute angles. Detailed Implementation

[0017] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings. To make the invention clearer and easier to understand, the accompanying drawings are simplified schematic diagrams, and the elements therein may not be drawn to scale. Furthermore, the number and dimensions of the elements in the drawings are merely illustrative and are not intended to limit the scope of the invention.

[0018] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements, and this invention is not intended to distinguish between elements that have the same function but different names. In this specification and claims, terms such as "containing" and "comprising" are open-ended terms and should therefore be interpreted as "containing but not limited to...".

[0019] The use of ordinal numbers, such as "first" and "second," in the specification and claims of this invention to modify the elements of the claims does not imply or represent any prior ordinal number of the claimed element, nor does it represent the order of one claimed element with another, or the order of manufacturing methods. The use of such ordinal numbers is only to enable a claim element with a certain name to be clearly distinguished from another claim element with the same name.

[0020] The directional terms used in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention.

[0021] Furthermore, when an element or membrane is referred to as being on or above another element or membrane, or as being connected to another element or membrane, it should be understood that the element or membrane is directly located on or directly connected to the other element or membrane, or that there may be other elements or membranes (indirectly) between them. Conversely, when an element or membrane is referred to as being "directly" on or "directly connected" to another element or membrane, it should be understood that there are no inserted elements or membranes between them. Additionally, the terms "electrical connection" or "coupling" include any direct and indirect means of electrical connection.

[0022] In this invention, the terms "about," "substantially," "approximately," or "identical" generally indicate a range within 20%, 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value. The quantities given here are approximate, meaning that the terms "about," "substantially," "approximately," or "identical" may be implied even without specific mention of them.

[0023] It should be understood that the following embodiments can be modified by replacing, recombining, or mixing features from multiple different embodiments to complete other embodiments without departing from the spirit of the invention. Features from different embodiments can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with it.

[0024] In this invention, the thickness, area, width, height and distance can be measured by optical microscope (OM), electron microscope (e.g., scanning electron microscope (SEM)) or other methods, and can be determined by the same photograph or two or more photographs, but is not limited thereto.

[0025] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0026] The electronic device of the present invention may be a bendable, stretchable, and / or flexible electronic device, but is not limited thereto. The electronic device may include, for example, a sensing device, a light-emitting device, a display device, an antenna device, a touch device, a splicing device, or other suitable electronic devices, but is not limited thereto. The sensing device of the present invention is primarily an optical sensing device, but is not limited thereto. The sensing device may be, for example, a sensing device for detecting changes in capacitance, light, heat, or ultrasound, but is not limited thereto. The sensing device may include, for example, a biosensor, a touch sensor, a fingerprint sensor, other suitable sensors, or combinations of the above types of sensors, but is not limited thereto. The display device may be applied, for example, to laptops, public displays, splicing displays, automotive displays, touch displays, televisions, monitors, smartphones, tablets, light source modules, lighting equipment, or, for example, electronic devices applied to the above products, but is not limited thereto. The display device may include, for example, a light-emitting element, a fluorescent material, a phosphorescent material, other suitable display media, or combinations thereof, but is not limited thereto. The light-emitting element may include, for example, an organic light-emitting diode (OLED), a miniLED, a microLED, or a quantum dot (QD, such as QLED or QDLED), or other suitable materials or any arrangement and combination of the above materials, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna or other types of antennas, but is not limited thereto. The splicing device may include, for example, a splicing display device or a splicing antenna device, but is not limited thereto. Furthermore, the shape of the electronic device may be, for example, rectangular, circular, polygonal, a shape with curved edges, curved, or other suitable shapes. The electronic device may have peripheral systems such as a driving system, a control system, a light source system, a shelving system, etc. The electronic device may include electronic components, which may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, sensors, etc. It should be noted that the electronic device of the present invention may be various combinations of the above devices, but is not limited thereto.

[0027] The following diagram shows directions DR1, DR2, and DR3. Direction DR3 can be the normal direction of the electronic device, such as... Figure 1 Direction DR3 can be perpendicular to an upper surface of the stretchable patterned substrate 12. Directions DR1 and DR2 can be horizontal and perpendicular to direction DR3, such as... Figure 1Directions DR1 and DR2 can be parallel to the upper surface of the stretchable patterned substrate 12. The following figures can be used to describe the spatial relationship of the structure based on directions DR1, DR2 and DR3.

[0028] Please refer to Figure 1 The diagram shown is a top view of the electronic device according to the first embodiment of the present invention operating in a first state and a second state. Figure 1 As shown, the electronic device 1 has a first state S1 and a second state S2. In other words, the electronic device 1 can transition from the first state S1 to the second state S2 or from the second state S2 to the first state S1. According to this embodiment, the electronic device 1 can transition from the first state S1 to the second state S2, for example, by stretching, but is not limited thereto. Figure 1 The first state S1 shown on the left can be the unstretched state of electronic device 1. Figure 1 The second state S2 shown on the right side can be a stretched state of electronic device 1, but is not limited to this. Electronic device 1 can extend from the first state S1 to the second state S2, for example, along a stretching direction SD, but is not limited to this. In this invention, the stretching direction SD can refer to a direction that macroscopically changes the size of electronic device 1. In other words, the stretching direction SD can be, for example, a direction in which a force is applied to electronic device 1, causing a macroscopic change in the size of electronic device 1 in that direction. According to this embodiment, the stretching direction SD can be, for example, a direction DR1 and a direction opposite to direction DR1. In some embodiments, the stretching direction SD is not limited. Figure 1 The direction shown can be any other direction. In some embodiments, the electronic device 1 may operate in any state other than the first state S1 and the second state S2.

[0029] Specifically, the electronic device 1 includes a stretchable patterned substrate 12 with stretchable properties, enabling the electronic device 1 to change states. According to this embodiment, the stretchable patterned substrate 12 may have a plurality of portions MP and a plurality of connecting portions CP, wherein at least one of the connecting portions CP can be connected between two adjacent portions MP. The portions MP may be configured to have electronic units (e.g., electronic unit 14 hereinafter), inorganic layers (e.g., inorganic layer 18 hereinafter), active elements, or other suitable elements disposed thereon, wherein the active elements may, for example (but not limited to), include channel regions of transistors in a circuit layer (e.g.,...). Figure 4 and Figure 5 The channel region CH is shown. The connecting portion CP can be configured to change the distance between two adjacent portions MP to which it is connected. In other words, the portion MP can provide support for the electronic units disposed thereon, while the connecting portion CP can provide a stretching effect for the stretchable patterned substrate 12 itself.

[0030] like Figure 1 As shown, each portion MP can be island-shaped and has an edge E connecting multiple connecting portions CP. In this invention, the edge E of a portion MP can refer to the entire outer contour of the portion MP. For example, a portion MP can have a rectangular shape, and the edge E can be formed by connecting four sides, while the connecting portions CP can have a strip shape, but is not limited thereto. According to this embodiment, each portion MP can be connected to four connecting portions CP, but is not limited thereto. Furthermore, the width of the side of the portion MP adjacent to the connected connecting portion CP can be greater than the width of the portion where the connecting portion CP is connected to the portion MP. In other words, the stretchable patterned substrate 12 can also have multiple openings OP1, and each opening OP1 can be formed, for example, by sequentially and alternately connecting and surrounding four portions MP and four connecting portions CP, but is not limited thereto. When the electronic device 1 is deformed (e.g., stretched), the connecting portions CP can deform, and the size (e.g., length) of the connecting portions CP can change due to the deformation, thus changing the distance between the portions MP connected to both ends of the connecting portions CP. Alternatively, by different patterning designs, connecting portions CP with different sizes can be designed, thereby changing the distance between adjacent portions MP. In some embodiments, the shape of a portion of the MP can be adjusted according to actual needs.

[0031] The stretchable patterned substrate 12 may, for example, comprise a flexible substrate or be at least partially a flexible substrate. The material of the stretchable patterned substrate 12 may include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), poly(methyl methacrylate) (PMMA), rubber, ABS resin (acrylonitrile butadiene styrene, ABS), stretchable material, or other suitable materials, or combinations thereof, wherein the stretchable material may, for example, include graphene or other suitable materials. The stretchable patterned substrate 12 may, for example, be a single-layer or multi-layer structure.

[0032] like Figure 1As shown, the electronic device 1 may further include a plurality of electronic units 14 and a plurality of protruding units 16, wherein the electronic units 14 and the protruding units 16 may be disposed on corresponding portions of MP. For example, a portion of MP may include a portion of MPa and a portion of MPb, and the protruding units 16 may include protruding units 16a and 16b. Furthermore, one of the electronic units 14 and the protruding unit 16a may be disposed on a portion of MPa, and another of the electronic units 14 and the protruding unit 16b may be disposed on a portion of MPb, and one of the connecting portions of CP is connected between portions of MPa and MPb. According to this embodiment, a portion of MP may be provided with a plurality of electronic units 14 and a protruding unit 16, but is not limited thereto. In some embodiments, a portion of MP may be provided with at least one electronic unit 14 and at least one protruding unit 16.

[0033] Electronic unit 14 may include, for example, a chip, a light-emitting diode (LED), a variable capacitor, a variable resistor, a varactor diode, other suitable electronic components, or combinations thereof, and the invention is not limited thereto. The LED may include organic LEDs or inorganic LEDs. According to this embodiment, electronic unit 14 is exemplified by an organic LED; in this case, electronic device 1 may be, for example, a self-emissive display device, but is not limited thereto. Electronic unit 14 may include, for example, a plurality of electronic units 14a, a plurality of electronic units 14b, and a plurality of electronic units 14c, wherein electronic units 14a, electronic units 14b, and electronic units 14c may be used to generate light of different colors, for example, to generate red, green, and blue light, respectively, but are not limited thereto. Figure 1 In some embodiments, an electronic unit 14a, an electronic unit 14b, and an electronic unit 14c may be disposed on a portion of MP and each serve as a sub-pixel, such that electronic units 14a, 14b, and 14c disposed on the same portion of MP can constitute a pixel, but are not limited thereto. In this case, the protruding unit 16 disposed on the same portion of MP as electronic units 14a, 14b, and 14c may be surrounded by electronic units 14a, 14b, and 14c, but are not limited thereto. In this invention, the term "surrounded" by multiple elements may mean that the multiple elements are located at least on different sides of the element, without necessarily completely surrounding the element. In some embodiments, the number of electronic units 14a, 14b, and 14c disposed on the same portion of MP may be, for example, at least one each, but are not limited thereto.

[0034] The protruding unit 16 may have a supporting or positioning effect, for example, it is used to support a mask for forming the electronic unit 14 or to position the electronic unit 14 during the manufacturing process, but is not limited thereto. The protruding unit 16 may be located at the geometric center of part of the MP, so as to have a good supporting effect on the mask used for forming the electronic unit 14, and the protruding unit 16 can have better support on the premise of occupying the smallest area, or provide a better positioning effect (positioning the placement area of the electronic unit 14) through the protruding unit 16 when transferring the electronic unit 14. The protruding unit 16 may include, for example, an organic material or other suitable materials, wherein the organic material may include a transparent organic material, a light-shielding material or other suitable organic materials, and the transparent organic material may include, for example, photosensitive polyimide (PSPI) or other suitable materials. When the protruding unit 16 includes a light-shielding material, stray light in the electronic device 1 can be reduced.

[0035] As Figure 1 shown, when the electronic device 1 is in the first state S1, there may be a distance D1 between two adjacent protruding units 16 in the stretching direction SD, and when the electronic device 1 is in the second state S2, there may be another distance D2 between the two adjacent protruding units 16 in the stretching direction SD, and the distance D1 is different from the distance D2. In the present invention, the distance between two adjacent protruding units 16 (such as the distance D1 or the distance D2) is obtained by measuring the distance between the corresponding same positions of the two protruding units 16, for example, the distance from the right side of one protruding unit 16 to the right side of the other protruding unit 16, or the distance from the center point 161 of one protruding unit 16 to the center point 161 of the other protruding unit 16. According to this embodiment, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the distance D2 may be greater than the distance D1, so that the dimension of the electronic device 1 in the stretching direction SD can be increased. For example, the distance D1 and the distance D2 may satisfy the following relationship: 1<D2 / D1<2, so that the electronic device can have a significant dimensional change after being stretched, which can be easily recognized by the human eye.

[0036] In this embodiment, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the distance between two adjacent protruding units 16 in the direction DR2 perpendicular to the stretching direction SD can also be increased, so that the size of the electronic device 1 in the direction DR2 can also be increased. In other words, when the electronic device 1 is in the first state S1, the line connecting the center points 161 of the four protruding units 16 can surround the region Ra. When the electronic device 1 extends to the second state S2, the region surrounded by the line connecting the center points 161 of the four protruding units 16 becomes the region Rb, and the area of ​​the region Rb is greater than the area of ​​the region Ra. In some embodiments, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the size of the electronic device 1 in the direction DR2 can also remain unchanged or be slightly reduced as needed. In some embodiments, the area A1 of the region Ra and the area A2 of the region Rb can satisfy the following relationship: 1 <A2 / A1<4。

[0037] like Figure 1 In the second state S2 shown on the right, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the rotation directions of adjacent protruding units 16 (e.g., protruding units 16a and 16b arranged in direction DR1) may be different. For example, protruding unit 16a rotates clockwise in direction CD1 when the electronic device 1 extends from the first state S1 to the second state S2, while protruding unit 16b rotates counterclockwise in direction CD2, and protruding unit 16d arranged in direction DR2 with protruding unit 16b rotates clockwise in direction CD1 when the electronic device 1 extends from the first state S1 to the second state S2. In this invention, clockwise direction CD1 and counterclockwise direction CD2 are determined according to the right-hand rule. When the thumb is pointing towards the normal direction of the electronic device 1 (e.g., direction DR3), the direction in which the four fingers bend is considered counterclockwise direction CD2, while the direction opposite to the bend of the four fingers is considered clockwise direction CD1. Alternatively, the stresses of different connecting parts CP connected to the same part MP under the same external force can be adjusted to be different, so that some adjacent parts MP can rotate in the same direction of rotation when transitioning from the first state S1 to the second state S2, for example, simultaneously rotating in clockwise direction CD1 or counterclockwise direction CD2. Figure 2As shown, in a variation embodiment, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the rotation directions of adjacent protrusion units 16 may be the same. For example, protrusion units 16b and 16d, which are arranged in a direction DR2 perpendicular to the stretching direction SD and are adjacent to each other, may both rotate counterclockwise in the direction CD2 when the electronic device 1 extends from the first state S1 to the second state S2, or protrusion units 16a and 16c may both rotate clockwise in the direction CD1. In some embodiments, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, some MP may not rotate.

[0038] According to this embodiment, as Figure 1 As shown, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the rotation angle θ1 of the protruding unit 16 relative to the electronic unit 14 can be greater than 0. Taking the protruding unit 16a and the corresponding electronic unit 14c as an example, there can be a virtual line L1 between the center point 161 of the protruding unit 16a and the center point 14P of the electronic unit 14c in the first state S1, and a virtual line L2 between the center point 161 of the protruding unit 16a and the center point 14P of the electronic unit 14c in the second state S2. When the virtual line L1 is not parallel to the virtual line L2, it means that the rotation angle θ1 is greater than 0. Furthermore, the angle between the extension direction ED1 of the virtual line L1 and the extension direction ED2 of the virtual line L2 can be the rotation angle θ1. The rotation angle θ1 can be, for example, greater than 0 degrees and less than or equal to 45 degrees (i.e., 0° < θ1 ≤ 45°). Here, "the direction of extension of the virtual line" can refer to the direction from the center point 161 of the protruding unit 16 toward the center point 14P of the electronic unit 14, but is not limited to this.

[0039] To clearly show electronic device 1, part of the label of electronic device 1 is displayed on Figure 2 In the middle, and not with Figure 1 The above is a limited description. For example... Figure 2 As shown, in some embodiments, when the electronic device 1 is in the first state S1, adjacent protrusion units 16 are arranged along longitudinal directions that are not parallel to each other. For example, as Figure 2 The protruding unit 16c is positioned along the major axis direction LD1, and the protruding unit 16d is positioned along the major axis direction LD2, which is not parallel to the major axis direction LD1. The term "major axis direction" can refer to a direction along or parallel to the major axis of the object. The major axis can be a line extending longitudinally through the center of the object. Figure 2In the example of an elliptical protrusion 16, the major axis almost corresponds to the maximum longitudinal dimension of the ellipse. For instance, protrusion 16 may have endpoints P1 and P2, and also a central axis CA, which is parallel to the major axis and passes through endpoints P1 and P2, but is not limited thereto. In some embodiments, for objects without a defined major axis or with irregular shapes, the major axis is the major axis of the smallest rectangle R1 that can enclose the object, and the direction of the major axis may be parallel to the long side of the smallest rectangle R1. For example, such as... Figure 2 As shown in the enlarged view of the protruding unit 16 on the upper left, the protruding unit 16 can be surrounded by a minimum rectangle R1, such that the minimum rectangle R1 can cover the entire protruding unit 16, and the direction along or parallel to the long side is the major axis direction. The minimum rectangle R1 can be derived, for example, by software OpenCV or other suitable software. In some embodiments, the top view shape of the protruding unit 16 can also be, for example, triangular, circular (e.g., Figure 6 As shown), T-shaped (e.g.) Figure 8 As shown), X-shaped (e.g.) Figure 3 (as shown), rectangle, polygon, L-shape, irregular shape, or other suitable shape. In some embodiments, when the minimum rectangle R1 is a square, the direction of the major axis may, for example, be the direction parallel to either side of the minimum rectangle R1.

[0040] In some embodiments, when the electronic device 1 extends from the first state S1 to the second state S2 along the stretching direction SD, the acute angle θ2 between the major axis direction LD1 and the stretching direction SD may be different from the acute angle θ3 between the major axis direction LD2 and the stretching direction SD, but is not limited thereto. In some embodiments, when the major axis direction LD1 is not parallel to the major axis direction LD2, the acute angle θ2 may also be the same as the acute angle θ3.

[0041] In some embodiments, the protruding unit 16 has a maximum width W1, and the distance D1 may be, for example, greater than the maximum width W1, so that the protruding units 16 located on different portions MP have a larger spacing, thereby reducing the difficulty of structural design, and the electronic device 1 can have a significant size change after being stretched from the first state S1 to the second state S2. In this invention, the maximum width W1 of the protruding unit 16 refers to the maximum width of the smallest rectangle R1 that can surround the protruding unit 16, wherein the maximum width of the smallest rectangle R1 refers to the width of the largest side of the smallest rectangle R1, that is, the width of its long side. In some embodiments, the distance D1 may be, for example, greater than the maximum width W2 of a portion MP, wherein the maximum width W2 of a portion MP in this invention also refers to the maximum width of the smallest rectangle that can surround the portion MP (for example, the smallest rectangle R3 hereinafter), that is, the width of the long side of the smallest rectangle, which can be referred to below and will not be repeated here.

[0042] In some embodiments, the protruding unit 16 may have a minimum distance D3 in one direction from the edge E of the partial MP, and the minimum distance D3 and the maximum width satisfy the following relationship: 0<D3≤W1. For example, the minimum distance D3 may be greater than or equal to 0.01 micrometers (μm). It should be noted that when the minimum distance D3 between the protruding unit 16 and the edge E (or the opening OP1) of the partial MP is smaller, the problem of poor yield is prone to occur in the quality of fabricating the protruding unit 16, and when the minimum distance D3 is larger, the supporting effect of the protruding unit 16 is easily affected. Therefore, by making the minimum distance D3 conform to the above relationship, the supporting effect of the protruding unit 16 can be improved while maintaining a certain yield of the protruding unit 16. In some embodiments, the minimum distance D3 between the end point P1 and the edge E of the partial MP may be the same as or different from another minimum distance D4 between the end point P2 and the edge E of the partial MP, but is not limited thereto.

[0043] In some embodiments, the maximum width W1 of the protruding unit 16 may be greater than or equal to 0.3 times the maximum width W2 of the partial MP, so that the protruding unit 16 has sufficient or better support performance. Moreover, when the protruding unit 16 is too close to the edge E of the partial MP, the problem of poor yield of the protruding unit 16 is prone to occur. By making the maximum width W1 of the protruding unit 16 less than or equal to 0.98 times the maximum width W2 of the partial MP, it can help improve the yield problem. For example, the maximum width W1 may be greater than or equal to 0.3 times the maximum width W2 of the partial MP and less than or equal to 0.98 times the maximum width W2 of the partial MP (that is, 0.3W2≤W1≤0.98W2). Alternatively, the maximum width W1 may be greater than or equal to 0.6 times the maximum width W2 of the partial MP and less than or equal to 0.9 times the maximum width W2 of the partial MP (that is, 0.6W2≤W1≤0.9W2), but is not limited thereto.

[0044] In some embodiments, the electronic device 1 may further include a plurality of connection wires disposed on the stretchable patterned substrate 12, and configured to electrically connect the electronic units 14 and / or active elements disposed on two adjacent partial MPs. Specifically, at least one connection wire may be disposed on two adjacent partial MPs and the connection portion CP connected therebetween, but is not limited thereto.

[0045] The electronic device of the present invention is not limited to the above embodiments, and may have other modified embodiments or other embodiments. To simplify the description, the same reference numerals will be used hereinafter in other modified embodiments or other embodiments to designate the same elements as in the above embodiments. To easily compare the differences between the above embodiments and other modified embodiments or other embodiments, the differences between the embodiments will be highlighted below, and repeated parts will not be described again.

[0046] Please refer to Figure 3As shown, this is a top view schematic diagram of the electronic device of the second embodiment of the present invention in a first state. In the electronic device 2 provided in this embodiment, Figure 3 The top view shape of the protruding unit 16 is illustrated using an X-shape as an example, but it is not limited thereto. In some embodiments, the top view shape of the protruding unit 16 may also be replaced by any of the shapes described above. According to this embodiment, the number of electronic units 14 disposed on the same portion of the MP may be, for example, four, to facilitate the placement of the corresponding protruding units 16 on the same portion of the MP, but it is not limited thereto. In this case, a portion of the protruding unit 16 may be disposed between any two adjacent electronic units 14. For example, the electronic units 14 disposed on the same portion of the MP may include one electronic unit 14a, two electronic units 14b, and one electronic unit 14c to constitute a pixel, but it is not limited thereto. In some embodiments, Figure 3 The configuration of the electronic unit 14 located on the same part of the MP can also be adopted. Figure 1 or Figure 2 The configuration of the embodiment or other suitable configurations may be used, but are not limited thereto.

[0047] According to this embodiment, the protruding unit 16 can at least partially overlap the central region CR1 of a portion of the MP, so that the protruding unit 16 can have a certain supporting effect. Furthermore, as... Figure 3 As shown in the enlarged diagram of the upper right portion of the MP, this portion of the MP can be enclosed by the smallest rectangle R2. For example, calculated from one short side SS1 of the smallest rectangle R2, the central region CR1 can be located within a range of 0.2 to 0.8 times the maximum width W2 of the long side LS1. Similarly, calculated from one long side LS1 of the smallest rectangle R2, the central region CR1 can be located within a range of 0.2 to 0.8 times the width W3 of the short side SS1. In other words, the distance between the central region CR1 and any long side LS1 of the smallest rectangle R2 can be 0.2 times the width W3 of the short side SS1 of the smallest rectangle R2, and the distance between the central region CR1 and any short side SS1 of the smallest rectangle R2 can be 0.2 times the maximum width W2 of the long side LS1 of the smallest rectangle R2. In this case, the width of the long side of the central region CR1 can be, for example, 0.6 times the maximum width W2 of the long side LS1 of the smallest rectangle R2, and the width of the short side of the central region CR1 can be, for example, 0.6 times the width W3 of the short side SS1 of the smallest rectangle R2. In this embodiment, the maximum width W4 of the central region CR1 can be the width of the long side of the central region CR1, but is not limited thereto. In some embodiments, when the smallest rectangle R2 is a square, the central region CR1 can be a square, and its maximum width W4 can be the width of any one of its sides. In some embodiments, the structure in which the protruding unit 16 at least partially overlaps the central region CR1 can also be applied to any of the embodiments described above or below.

[0048] In some embodiments, the protruding unit 16 may be surrounded by a minimum rectangle R1, and the maximum width W1 of the minimum rectangle R1 may be greater than or equal to the maximum width W5 of another central area CR2 of a portion of MP, so that the protruding unit 16 has a better support effect and can provide better support while occupying a minimal area. The endpoints P1 and P2 of the protruding unit 16 may, for example, be located at the corners of an X-shape. Furthermore, as... Figure 3 As shown in the enlarged diagram of the lower right portion of MP, the central region CR2, calculated from one short side SS1 of the smallest rectangle R2, can be located, for example, within a region ranging from 0.33 times to 0.67 times the maximum width W2 of the long side LS1. Similarly, calculated from one long side LS1 of the smallest rectangle R2, the central region CR2 can be located, for example, within a region ranging from 0.33 times to 0.67 times the width W3 of the short side SS1. In other words, the distance between the central region CR2 and any long side LS1 of the smallest rectangle R2 can be one-third of the width W3 of the short side SS1 of the smallest rectangle R2, and the distance between the central region CR2 and any short side SS1 of the smallest rectangle R2 can be one-third of the maximum width W2 of the long side LS1 of the smallest rectangle R2. In this case, the width of the long side of the central region CR2 can be one-third of the maximum width W2 of the long side LS1 of the smallest rectangle R2, and the width of the short side of the central region CR2 can be one-third of the width W3 of the short side SS1 of the smallest rectangle R2. The widths of both the long and short sides of the central region CR2 can be greater than 0, and the maximum width W5 of the central region CR2 can be its long side width. In some embodiments, when the smallest rectangle R2 is a square, the central region CR2 can be a square, and its maximum width W5 can be the width of any one of its sides. In some embodiments, a structure where the maximum width W1 is greater than or equal to the maximum width W5 can also be applied to any of the embodiments described above or below.

[0049] In some embodiments, the smallest rectangle R1 may also have a central region CR3, and the portion of the protruding unit 16 located in the central region CR3 may overlap with the central region CR2 of the smallest rectangle R2 to improve the support effect of the protruding unit 16 and achieve better support with minimal area. In some embodiments, the structure in which the portion of the protruding unit 16 located in the central region CR3 overlaps with the central region CR2 may also be applied to any of the embodiments described above or below.

[0050] According to this embodiment, the electronic device 1 may further include an inorganic layer 18 disposed on a portion of the MP. For example... Figure 3as shown, the inorganic layer 18 may include a plurality of inorganic islands 18a respectively disposed on the corresponding portions MP, and the inorganic islands 18a are separated from each other. Since the inorganic layer 18 includes an inorganic insulating material and has a large stress, it cannot withstand multiple stretches. Therefore, by separating the inorganic islands 18a from each other and disposing them on the portions MP respectively, damage to the inorganic layer 18 during the state transformation process can be reduced. The inorganic layer 18 of this embodiment can be applied to any of the embodiments described above or below.

[0051] as Figure 3 shown, the protruding unit 16 may overlap the central region CR4 of the inorganic island 18a, so that the protruding unit 16 can have better support performance while occupying the minimum area. In this case, the maximum width W1 of the protruding unit 16 may be, for example, greater than or equal to the maximum width W6 of the central region CR4 of the inorganic island 18a. Specifically, as Figure 3 shown in the enlarged schematic view of the inorganic island 18a on the lower side, the inorganic island 18a may be enclosed by a minimum rectangle R3, and the minimum rectangle R3 may have a central region CR4. Calculated from a short side SS2 of the minimum rectangle R3, the central region CR4 may, for example, be located in a region ranging from a position 0.33 times (or one third) of the maximum width W7 of the long side LS2 of the minimum rectangle R3 to a position 0.67 times (or two thirds) thereof, and calculated from a long side LS2 of the minimum rectangle R3, the central region CR4 may, for example, be located in a region ranging from a position 0.33 times (or one third) of the width of the short side SS2 of the minimum rectangle R3 to a position 0.67 times (or two thirds) thereof. In other words, the distance between the central region CR4 and any long side LS2 of the minimum rectangle R3 may be one third of the width of the short side SS2 of the minimum rectangle R3, and the distance between the central region CR4 and any short side SS2 of the minimum rectangle R3 may be one third of the maximum width W7 of the long side LS2 of the minimum rectangle R3. The maximum width W6 of the central region CR4 may be the width of the long side of the central region CR4 and is greater than 0. In some embodiments, when the maximum width W1 is greater than or equal to the maximum width W6, the maximum width W7 of the minimum rectangle R3 may also be greater than or equal to the maximum width W1 of the protruding unit 16, and / or the maximum width W7 of the minimum rectangle R3 may be less than or equal to the maximum width W2 of the minimum rectangle R2 (i.e., 0<W6≤W1≤W7≤W2). In some embodiments, the structure in which the protruding unit 16 overlaps the central region CR4 of the inorganic island 18a and / or the relationship among the maximum width W1, the maximum width W6, the maximum width W7 and the maximum width W2 may be applied to any of the embodiments described above or below.

[0052] Please refer to Figure 4 and Figure 5 , Figure 4 which shows Figure 3 a schematic cross-sectional view taken along the section line A-A', Figure 5 which shows Figure 3 A sectional view along section line B-B'. (See diagram.) Figure 4 As shown, the protruding unit 16 may be higher than the electronic unit 14 in the normal direction (e.g., direction DR3) of the electronic device 2. Here, "higher than" one element refers to a comparison of the distances between the upper surfaces of the protruding unit 16 and the upper surfaces of the other element relative to the same reference plane. For example, when the upper surface of the protruding unit 16 is arc-shaped, the height H1 of the protruding unit 16 may refer to the height of the apex of the upper surface of the protruding unit 16, that is, the distance between the apex of the upper surface of the protruding unit 16 and the lower surface BS of the stretchable patterned substrate 12, while the height H2 of the electronic unit 14 may refer to the distance between the top surface of the electronic unit 14 and the lower surface BS of the stretchable patterned substrate 12, wherein the height H1 of the protruding unit 16 may be greater than the height H2 of the electronic unit 14.

[0053] like Figure 4 and Figure 5 As shown, the electronic device 2 may further include multiple insulating layers disposed on the stretchable patterned substrate 12. At least one of the insulating layers may include an inorganic insulating material and serve as... Figure 3 The inorganic layer 18 is included. According to this embodiment, the insulating layer may, for example, include insulating layers IN1, IN2, IN3, IN4, and IN5, wherein insulating layer IN1 may, for example, include a multilayer structure, and the multilayer structure may include a stack of inorganic material layers and organic material layers. In other words, since insulating layer IN1 includes inorganic insulating material, it can serve as... Figure 3 At least a portion of the inorganic layer 18, and the edge of the inorganic layer 18 may be defined by the edge of the insulating layer IN1, but is not limited thereto. In some embodiments, the number of insulating layers may be adjusted as needed.

[0054] In this embodiment, the electronic device 2 may include multiple island-shaped structures IS, each corresponding to Figure 3 The inorganic islands 18a allow island-shaped structures IS to be respectively disposed on corresponding portions MP of the stretchable patterned substrate 12. For clarity, Figure 4 and Figure 5 Displaying an island-like structure IS, but not limited to this. For example... Figure 4 and Figure 5 As shown, the island structure IS may include a portion of insulating layer IN1, a portion of insulating layer IN2, a portion of insulating layer IN3, a portion of insulating layer IN4, and a portion of insulating layer IN5. In the island structure IS, insulating layers IN1, IN2, IN3, IN4, and IN5 may be sequentially disposed on the corresponding portions MP.

[0055] According to this embodiment, the island structure IS may further include a plurality of transistors 22 disposed on the insulating layer IN1, and at least one transistor 22 may be electrically connected to at least one electronic unit 14 and serve as a driving element and / or switching element of the electronic unit 14, but is not limited thereto. For example, transistor 22 may include transistor 22a electrically connected to the corresponding electronic unit 14.

[0056] In this embodiment, the insulating layer IN1 can serve as a buffer layer, for example, to reduce the possibility of damage to the transistor 22 and / or electronic unit 14 caused by moisture and / or oxygen passing through the stretchable patterned substrate 12. Figure 4 and Figure 5 The transistor 22 shown is an example of a top-gate thin-film transistor, but is not limited thereto. In this case, the island structure IS may also include a semiconductor layer SEM, a conductive layer CL1, a conductive layer CL2, and a conductive layer CL3. The semiconductor layer SEM is disposed on the insulating layer IN1 and includes multiple semiconductors. The two ends of each semiconductor may be doped with dopants, serving as the source (drain) E1 and drain (source) E2 of the transistor 22, respectively. The portion of the semiconductor located between the source (drain) E1 and drain (source) E2 may serve as the channel region CH of the transistor 22. The material of the semiconductor layer SEM includes, for example, silicon or metal oxide, such as low-temperature poly-silicon (LTPS) semiconductor, amorphous silicon (a-Si) semiconductor, indium gallium zinc oxide (IGZO) semiconductor, or other suitable semiconductors, but is not limited thereto.

[0057] An insulating layer IN2 is disposed on the semiconductor layer SEM and the insulating layer IN1, and serves as the gate insulating layer of the transistor 22. A conductive layer CL1 is disposed on the insulating layer IN2 and may include multiple electrodes E3, each corresponding to a channel region CH, serving as the gate of the transistor 22. In some embodiments, the conductive layer CL1 may also selectively include electrodes E4, signal lines (e.g., scan lines), or other conductive elements, but is not limited thereto.

[0058] An insulating layer IN3 is disposed on conductive layers CL1 and IN2, and conductive layer CL2 is disposed on insulating layer IN3. Insulating layers IN2 and IN3 may have multiple vias TH1, corresponding to the source (drain) E1 and drain (source) E2 of transistor 22, respectively. Conductive layer CL2 may include multiple electrodes E5 and multiple electrodes E6, which are disposed in the corresponding vias TH1, such that electrodes E5 and E6 can be electrically connected to the source (drain) E1 and drain (source) E2 of transistor 22, respectively.

[0059] An insulating layer IN4 is disposed on the insulating layer IN3 and the conductive layer CL2, and has a through-hole TH2 corresponding to the electrode E5. Furthermore, the electronic unit 14 can be disposed on the insulating layer IN4 and electrically connected to the corresponding electrode E5 through the through-hole TH2, thereby being electrically connected to the corresponding transistor 22a. In some embodiments, the conductive layer CL2 may selectively include electrodes, signal lines (e.g., data lines), or other conductive elements, but is not limited thereto. The conductive layers CL1, CL2, and CL3 may each comprise metal or other suitable conductive materials.

[0060] An insulating layer IN5 is disposed on the insulating layer IN4 and has multiple openings OP2, with electronic units 14 respectively disposed corresponding to each opening OP2. For example, the openings OP2 can be used to define the positions of pixels or sub-pixels of the electronic device 2, and the insulating layer IN5 can be called a pixel definition layer, but is not limited thereto. The insulating layer IN5 may, for example, include a transparent insulating material, a light-shielding material, or other suitable material. In this embodiment, such as Figure 4 As shown, the protruding unit 16 can be disposed on the insulating layer IN5, and in the normal direction (e.g., direction DR3), the thickness T1 of the protruding unit 16 can be greater than or equal to the thickness T2 of the insulating layer IN5, and the thickness T2 of the insulating layer IN5 is greater than 0 (i.e., 0 < thickness T2 ≤ thickness T1), but is not limited thereto. The thickness T1 of the protruding unit 16 can, for example, be the maximum thickness of the protruding unit 16 in the normal direction. The thickness T2 of the insulating layer IN5 can, for example, be the maximum thickness of the insulating layer IN5 in the normal direction. For example, the thickness T1 is 1.28 micrometers, and the thickness T2 is 0.9 micrometers.

[0061] According to this embodiment, as Figure 4 and Figure 5 As shown, the electronic unit 14 may include a lower electrode E7, a light-emitting layer LL, and an upper electrode E8. The lower electrode E7 is disposed between insulating layers IN4 and IN5 and corresponds to the opening OP2. The lower electrode E7 can be electrically connected to the electrode E5 through the through-hole TH2. The light-emitting layer LL is disposed in the corresponding opening OP2, and the upper electrode E8 is disposed on the corresponding light-emitting layer LL and insulating layer IN5. In this embodiment, the upper electrodes E8 of different electronic units 14 may, for example, be connected to each other at a position that does not overlap with the protruding unit 16 to form the same electrode, but are not limited thereto.

[0062] In this embodiment, the electronic device 2 may further include an insulating layer IN6, wherein the insulating layer IN6 may be disposed on and cover the electronic unit 14 to protect the electronic unit 14, transistor 22, wires and / or other components of the electronic device 2, but is not limited thereto. In this embodiment, the insulating layer IN6 may be disposed between two adjacent island structures IS, and the insulating layer IN6 may be disposed in the opening OP1. The insulating layer IN6 may, for example, serve as an encapsulation layer. The insulating layer IN6 may include any suitable organic insulating material, such as PMMA, epoxy resin, siloxane material, silicone gel material, other suitable protective materials or combinations thereof, but is not limited thereto.

[0063] In some embodiments, insulating layers IN5, IN4, IN3, IN2, and IN1 may comprise a single-layer or multi-layer structure and may comprise any suitable organic or inorganic material. Organic materials may include, for example, PMMA, epoxy resin, siloxane, silicone gel, other suitable materials, or combinations thereof. Inorganic materials may include silicon nitride, silicon oxide, silicon oxynitride, liquid glass, glass glue, titanium oxide, aluminum oxide, other suitable materials, or combinations thereof. In some embodiments, when insulating layers IN5, IN4, IN3, IN2, and IN1 are multi-layer structures, each may comprise a stacked structure of multiple layers of inorganic materials or multiple layers of organic materials, or a structure of alternating stacks of inorganic and organic materials; the invention is not limited thereto.

[0064] According to this embodiment, as Figure 5As shown in a cross-sectional view, the acute angle θ4 between the side 16S of the protruding unit 16 and the surface of a portion of the MP (e.g., the upper surface TS) is smaller than the acute angle θ5 between the side of the insulating layer IN5 (e.g., the sidewall of the opening OP2) and the surface of a portion of the MP. For example, the acute angle θ4 is greater than or equal to 0 degrees and less than or equal to the acute angle θ5, and the acute angle θ5 is less than or equal to 90 degrees (i.e., 0°≤θ4≤θ5≤90°). In this invention, the "acute angle" is measured using the intersection of the side of the corresponding element and a plane located at 50% of its thickness as a reference point. In this embodiment, the side 16S may be, for example, a curved surface, but is not limited thereto. In this case, the side 16S of the protruding unit 16 may have an intersection point P3 in the cross-sectional view, intersecting with the plane PN1 located at half the thickness of the protruding unit 16, and the side 16S of the protruding unit 16 may have an intersection point P4 connecting with the bottom surface 16BS. The acute angle θ4 may be the angle between the line connecting the intersection point P3 and the intersection point P4 in the cross-sectional view and the plane parallel to the bottom surface 16BS of the protruding unit 16 (e.g., the upper surface TS of part of MP), but is not limited thereto. Additionally, the side IN5S of the insulating layer IN5 may be, for example, a plane, and may have an intersection point P10, intersecting with the plane PN2 located at half the thickness of the insulating layer IN5. The acute angle θ5 is the angle between the plane of the side IN5S of the insulating layer IN5 at the intersection point P10 and the plane parallel to the bottom surface IN5B of the insulating layer IN5 (e.g., the upper surface TS of part of MP), but is not limited thereto.

[0065] In some embodiments, such as Figure 4 and Figure 5 As shown, the electronic device 2 may further include a flexible substrate 24 disposed on the lower surface BS of the stretchable patterned substrate 12 to protect the stretchable patterned substrate 12. The flexible substrate 24 may be, for example, a non-patterned substrate, and may overlap with the opening OP1 of the stretchable patterned substrate 12 in the direction DR3. The flexible substrate 24 may include, for example, PI, PC, PET, PMMA, rubber, ABS resin, other suitable materials, or any combination thereof. Figure 4 and Figure 5 The cross-sectional structure of the electronic device 2 shown can also be applied to... Figure 1 Electronic device 1. Other parts of electronic device 2 in this embodiment may be the same as or similar. Figure 1 or Figure 2 The electronic device 1 is described above and will not be repeated here.

[0066] Please refer to Figure 6 and Figure 7 , Figure 6 The diagram shown is a top view of the electronic device according to a third embodiment of the present invention in its first state. Figure 7 As shown Figure 6A cross-sectional view along section line C-C'. The electronic device 3 provided in this embodiment and... Figure 3 One of the main differences between the electronic device 2 and the electronic device 3 is that the electronic device 3 may also include a sensing electrode 26 disposed on a portion of the MP, wherein the sensing electrode 26 surrounds the electronic unit 14 and the protruding unit 16. In other words, the sensing electrode 26 has an opening OP5, and the electronic units 14a, 14b, 14c and the protruding unit 16 disposed on the same portion of the MP are disposed in the opening OP5. According to this embodiment, the sensing electrode 26 may have a plurality of annular portions 26a and a plurality of connecting portions 26b, wherein the annular portions 26a may be respectively disposed on corresponding portions of the MP, and the connecting portions 26b may be disposed on connecting portions CP for electrically connecting the annular portions 26a disposed on two adjacent portions of the MP. Figure 6 In this embodiment, at least one electronic unit 14 may be located between the annular portion 26a and the protruding unit 16, but is not limited thereto. It should be noted that since the sensing electrode 26 and the protruding unit 16 do not overlap in the top view, the impact of surface unevenness caused by the protruding unit 16 on the quality of the sensing electrode 26 can be reduced. In this embodiment, the sensing element is represented by the sensing electrode 26, but the actual structure of the sensing element is not represented by this. Figure 6 and Figure 7 The indications are for illustrative purposes only. Sensing elements may include touch sensing, biosensing, distance sensing, electromagnetic wave sensing, or other suitable sensing applications. Sensing electrodes 26 may include conductive materials, such as metals or other suitable conductive materials. In some embodiments, the annular portion 26a may not be limited to a closed surround of the electronic unit 14 and the protruding unit 16, but may have an open opening, or the annular portion 26a may partially surround the electronic unit 14 and the protruding unit 16.

[0067] like Figure 7 As shown, the electronic device 3 may further include a protective layer 30 disposed on the electronic unit 14, the raised unit 16, and the insulating layer IN5 to reduce the possibility of damage to the electronic unit 14 caused by moisture or oxygen. The electronic device 3 may also optionally include an insulating layer IN7 disposed between the protective layer 30 and the sensing electrode 26, such that the stacking of the protective layer 30 and the insulating layer IN7 helps to planarize the upper surface. The protective layer 30 and the insulating layer IN7 may, for example, comprise a stack of at least one inorganic material layer and at least one organic material layer, or multiple inorganic material layers; the invention is not limited thereto. The inorganic material layers may, for example, comprise silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable protective materials, or any combination of the above inorganic materials, but are not limited thereto. Different inorganic material layers may comprise the same material or different materials. The organic material layers may have the effect of planarizing the upper surface, for example, comprising resin or other suitable materials, but are not limited thereto.

[0068] In some embodiments, the electronic device 3 may optionally include an insulating layer IN8 disposed on the sensing electrode 26 to protect the sensing electrode 26. The insulating layer IN8 may, for example, comprise a single-layer structure or a multi-layer structure, and may include any suitable organic or inorganic material described above. At least one of the sensing electrode 26, protective layer 30, insulating layer IN7, and insulating layer IN8 of this embodiment may be applicable to any of the embodiments described above or below.

[0069] like Figure 6 and Figure 7 As shown, the electronic device 3 may optionally include an optical element 28 disposed on one of the electronic units 14 and at least partially overlapping one of the protruding units 16. The optical element 28 may serve as, for example, an anti-reflective layer to reduce the impact of ambient light on the image produced by the electronic device 3, but is not limited thereto. According to this embodiment, the electronic device 3 may include multiple optical elements 28 disposed on the insulating layer IN8. The optical elements 28 may include, for example, multiple optical elements 28a, multiple optical elements 28b, and multiple optical elements 28c, wherein optical elements 28a may overlap with electronic units 14a, optical elements 28b may overlap with electronic units 14b, and optical elements 28c may overlap with electronic units 14c. Optical elements 28a, 28b, and 28c may, for example, include quantum dot materials, color filter materials, or other materials capable of changing the wavelength of light. Furthermore, depending on the material, optical elements 28a, 28b, and 28c may each have different colors or produce different colors of light. For example, when electronic units 14a, 14b, and 14c are used to generate red light, green light, and blue light, respectively, optical elements 28a, 28b, and 28c can be, for example, red filters, green filters, and blue filters, but are not limited thereto.

[0070] In this embodiment, a protruding unit 16 may simultaneously overlap optical elements 28 of different colors, such as simultaneously overlapping at least two of optical elements 28a, 28b, and 28c, but is not limited thereto. In some embodiments, optical elements 28 of different colors may have different areas. For example, optical elements 28a, 28b, and 28c may have different areas. In some embodiments, the overlapping areas of at least two of optical elements 28a, 28b, and 28c with the protruding unit 16 may be the same or different.

[0071] like Figure 7As shown, according to this embodiment, adjacent optical elements 28 can be separated from each other in a top view. In this case, the electronic device 3 may also include a light-shielding layer 32 disposed between adjacent optical elements 28. For example, the light-shielding layer 32 may be disposed on the insulating layer IN8 and has a plurality of openings OP3, which correspond to the electronic unit 14 in the top view. Furthermore, the optical elements 28 may be disposed in the openings OP3 respectively. In other words, the light-shielding layer 32 may be disposed on the protruding unit 16. According to this embodiment, the light-shielding layer 32 may overlap or cover the sensing electrode 26 in the top view to shield the sensing electrode 26. The light-shielding layer 32 may include, for example, metal, black resin, black pigment, black dye or other suitable materials, but is not limited thereto. In some embodiments, the electronic device 3 may not include the light-shielding layer 32. In this case, adjacent optical elements 28 may overlap each other, and their overlapping portions may overlap with the protruding unit 16. For example, optical element 28a may overlap with optical element 28c, and their overlapping portions are disposed on the protruding unit 16. The optical element 28 and / or the light-shielding layer 32 of this embodiment can be applied to any of the embodiments described above or below. In some embodiments, when the electronic device 3 includes the sensing electrode 26, the electronic device 3 may not include the optical element 28 and / or the light-shielding layer 32. Alternatively, when the electronic device 3 includes the optical element 28 and / or the light-shielding layer 32, the electronic device 3 may not include the sensing electrode 26.

[0072] According to this embodiment, the lower electrode E7 of at least one of the electronic units 14 (e.g., electronic unit 14c) may at least partially overlap with the protruding unit 16, but is not limited thereto. The structure of the lower electrode E7 overlapping the protruding unit 16 in this embodiment can be applied to any of the embodiments described above or below. In some embodiments, Figure 7 The lower electrode E7 may not overlap with the raised unit 16.

[0073] In addition, Figure 6 In this embodiment, the top view shape of the protruding unit 16 is circular. The protruding unit 16 has points P5 and P6 and a central axis CA, and the central axis CA passes through points P5 and P6, wherein points P5 and P6 are located on the edge (i.e., the circumference) of the protruding unit 16. The circular protruding unit 16 can be applied to any of the embodiments described above or below. Other parts of the electronic device 3 in this embodiment can be the same or similar. Figure 1 or Figure 2 Electronic device 1 or Figure 3 The electronic device 2 is described above and will not be repeated here.

[0074] Please refer to Figure 8 As shown, this is a top view schematic diagram of the electronic device of the fourth embodiment of the present invention in a first state. The electronic device 4 provided in this embodiment and... Figure 1One of the main differences in the electronic device 1 is that the top view shape of the protruding unit 16 can be irregular. For example, such as Figure 8 As shown in the enlarged view of the protruding unit 16 on the upper right side, one of the protruding units 16e may have an asymmetrical shape, for example, having a connecting portion 16CP, a first portion 16P1, and a second portion 16P2, wherein the first portion 16P1 and the second portion 16P2 are connected to the connecting portion 16CP, the extension direction of the first portion 16P1 is not parallel to the extension direction of the second portion 16P2, and the length LE1 of the first portion 16P1 is different from the length LE2 of the second portion 16P2. According to this embodiment, the protruding unit 16e may also have a third portion 16P3, connected to the connecting portion 16CP, and the extension direction of the third portion 16P3 may be parallel to the extension direction of the first portion 16P1. In this case, the protruding unit 16e may be surrounded by a minimum rectangle R1, such that the minimum rectangle R1 can cover the entire protruding unit 16. Since the sum of the length LE1 of the first part 16P1 and the length LE3 of the third part 16P3 can be greater than the length LE2 of the second part 16P2, the major axis direction LD1 of the protruding unit 16e can be parallel to the extension direction of the first part 16P1, and the minor axis direction SD1 of the protruding unit 16e can be parallel to the extension direction of the second part 16P2, but is not limited thereto. In this embodiment, the connecting part 16CP can refer to the junction of the first part 16P1 and the second part 16P2, and the connecting part 16CP is the part of the protruding unit 16e that begins to have a width different from that of the first part 16P1 (or the second part 16P2 or the third part 16P3), for example, the part where the width begins to gradually increase.

[0075] In some embodiments, the first portion 16P1, the second portion 16P2, and the third portion 16P3 of the protrusion unit 16e may have endpoints P7, P8, and P9, respectively, and the minimum distance D5 between endpoint P7 and the edge E of the portion MP may be different from another minimum distance D6 between endpoint P8 and the edge E of the portion MP. In some embodiments, the other minimum distance D7 between endpoint P9 and the edge E of the portion MP may be different from the minimum distances D5 and D6, but is not limited thereto.

[0076] In some embodiments, the edges of the protruding unit 16e corresponding to endpoints P7, P8, and / or P9 in a top view may selectively have curved surfaces, but are not limited thereto. In some embodiments, such as Figure 8As shown in the enlarged view on the lower right, when the edge of the protruding unit 16e has a curved surface, the radius of curvature of the curved surface of the edge of the protruding unit 16e can be greater than the radius of curvature of one of the corners of the electronic unit 14 (e.g., corner 14CR of the electronic unit 14a), but is not limited thereto. In some embodiments, when the protruding unit 16e has a corner, the radius of curvature of the corner of the protruding unit 16e can be greater than the radius of curvature of corner 14CR of the electronic unit 14a, but is not limited thereto.

[0077] In some embodiments, the electronic device 4 may further include a plurality of protruding units 16f disposed on the same portion MP. For example, the protruding unit 16f may be formed by separating the second portion 16P2 of the protruding unit 16e from the connecting portion 16CP and connecting the first portion 16P1 and the third portion 16P3, but is not limited thereto. In some embodiments, the electronic device 4 may further include a plurality of protruding units 16g disposed on the same portion MP, wherein the protruding unit 16g may be formed by separating the first portion 16P1, the second portion 16P2 and the third portion 16P3 of the protruding unit 16e from each other, but is not limited thereto. Figure 8 The protruding units 16e, 16f, and / or 16g can be applied to any of the embodiments described above or below. Other parts of the electronic device 4 in this embodiment can be the same as or similar to the electronic devices in the above embodiments, and therefore can be referred to above, and will not be repeated here.

[0078] Please refer to Figure 9 As shown, this is a cross-sectional schematic diagram of an electronic device according to a fifth embodiment of the present invention. The electronic device 5 provided in this embodiment is... Figure 4 One of the main differences in electronic devices is that the electronic unit 14 can be, for example, an inorganic light-emitting diode, disposed in the opening OP2 of the insulating layer IN5. For example... Figure 9 As shown, the electronic unit 14 may include, for example, a semiconductor layer 14S1, a semiconductor layer 14S2, an active layer 14AL, a contact pad E9, and a contact pad E10, wherein the active layer 14AL is located between the semiconductor layers 14S1 and 14S2, the contact pad E9 is disposed on the surface of the semiconductor layer 14S1, and the contact pad E10 is disposed on the surface of the semiconductor layer 14S2, but is not limited thereto. In this case, the conductive layer CL3 may include electrodes E11 and E12, and the contact pads E9 and E10 of the electronic unit 14 may be electrically connected and bonded to electrodes E11 and E12 respectively through the bonding pad 34. According to this embodiment, electrode E11 may also be electrically connected to electrode E5 through a through-hole TH2, so that the electronic unit 14 may be electrically connected to transistor 22a through electrodes E11 and E5, but is not limited thereto.

[0079] In some embodiments, the conductive layer CL3 may further include electrodes E13 and E14, and the insulating layers IN3 and IN4 may further have a through-hole TH3, allowing electrode E13 to be electrically connected to electrode E4 through the through-hole TH3. Furthermore, electrode E14 may be electrically connected to electrode E6 through another through-hole TH2. The electrical connection structure between the electronic unit 14 and the transistor 22 of the present invention is not limited to the above and can be adjusted accordingly as needed.

[0080] like Figure 9 As shown, the electronic device 5 in this embodiment may optionally include a filler layer 36 disposed in the opening OP2 of the insulating layer IN5. Additionally, the electronic device 5 may optionally include a cover layer 38 disposed on the electronic unit 14. According to this embodiment, as... Figure 9 As shown, the insulating layer IN5 may also have an opening OP4 disposed between adjacent electronic units 14. The opening OP4 may penetrate the insulating layer IN5, exposing the insulating layer IN4, and the protruding unit 16 may be disposed in the opening OP4 and located on the insulating layer IN4. The protruding unit 16 may protrude beyond the opening OP4, that is, the thickness of the protruding unit 16 may be greater than the thickness of the insulating layer IN5, so that the protruding unit 16 may be higher than the electronic unit 14 in the normal direction (e.g., direction DR3), that is, the height H1 of the protruding unit 16 is greater than the height H2 of the electronic unit 14, but is not limited thereto.

[0081] exist Figure 9 In addition, the electronic device 5 may also include an adhesive layer AL for attaching the stretchable patterned substrate 12 to the flexible substrate 24. Figure 9 The electronic unit 14 can be applied to any of the embodiments described above or below. Other parts of the electronic device 5 in this embodiment can be the same as or similar to the electronic devices in the above embodiments, and therefore can be referred to above, and will not be repeated here.

[0082] Please refer to Figure 10The diagram shows a top view of the electronic device according to the sixth embodiment of the present invention in its first state. The electronic device 6 provided in this embodiment may have a non-flexible region NFR and at least one stretchable region SR, wherein the non-flexible region NFR may not have bending or folding characteristics, while the stretchable region SR may have stretchable and bendable characteristics. According to this embodiment, the electronic device 6 may have four stretchable regions SR and may also have four flexible regions FR, wherein the flexible regions FR are connected to the four sides of the non-flexible region NFR, and the stretchable regions SR may be respectively connected to two adjacent flexible regions FR and disposed at the corners corresponding to the non-flexible regions NFR. For example, the stretchable patterned substrate 12 may include a non-flexible portion 12a, a plurality of flexible portions 12b, and a plurality of stretchable portions 12c, wherein the non-flexible portion 12a may be disposed in the non-flexible region NFR, the flexible portions 12b are respectively disposed in the flexible regions FR, and the stretchable portions 12c are respectively disposed in the stretchable regions SR, but is not limited thereto. According to this embodiment, the stretchable portion 12c may, for example, have a fringe shape, but is not limited thereto.

[0083] like Figure 10 As shown in the enlarged view of the non-flexible region NFR on the upper right side, the non-flexible portion 12a does not have an opening OP1, and the electronic device 6 may include multiple electronic units 40 and multiple protruding units 42 disposed on the non-flexible portion 12a. The electronic units 40 may, for example, include multiple electronic units 40a, multiple electronic units 40b, and multiple electronic units 40c, wherein electronic units 40a, electronic units 40b, and electronic units 40c can be used to generate light of different colors, for example, to generate red light, green light, and blue light respectively, but are not limited thereto. Figure 10 In this embodiment, the protruding unit 42 may be disposed on the inflexible portion 12a where no electronic unit 40 is disposed, for example, it may be located between adjacent electronic units 40. Since the electronic unit 40 may be the same as or similar to the electronic unit 14, it can be referred to above and will not be described in detail here. The top view shape of the protruding unit 42 in this embodiment may be, for example, circular or other suitable shapes, but is not limited thereto.

[0084] exist Figure 10 In the enlarged view of the stretchable region SR on the lower right side, the stretchable portion 12c may have multiple openings OP1. In this embodiment, the stretchable portion 12c and... Figure 1 The main difference in the stretchable patterned substrate 12 shown lies in the shape and arrangement of the opening OP1; the remaining structure is as described above and will not be repeated here. Furthermore, the protrusion unit 16 in this embodiment may be the same as... Figure 8The protruding unit 16e is described above and will not be repeated here. In some embodiments, the protruding unit 16 may also be replaced by the protruding unit 16 of any of the above embodiments. According to this embodiment, the line L3 connecting the centers of the openings OP1 on the two opposite sides of the stretchable portion 12c may coincide with the long axis direction LD1 of the protruding unit 16 to facilitate stretching.

[0085] In some embodiments, the top view shape of the protruding unit 16 in the stretchable region SR may differ from the top view shape of the protruding unit 42 in the non-flexible region NFR, allowing the shapes of the protruding unit 16 and the protruding unit 42 to be adjusted according to different requirements. In some embodiments, the height of the protruding unit 16 in the stretchable region SR (e.g., Figure 4 or Figure 9 The height H1 shown may differ from the height of the protrusion unit 42 in the non-flexible region NFR; for example, the height of the protrusion unit 16 may be smaller than the height of the protrusion unit 42. In some embodiments, the top view area of ​​the protrusion unit 16 in the stretchable region SR may be smaller than the top view area of ​​the protrusion unit 16 in the non-flexible region NFR to facilitate the placement of the protrusion unit 16, but is not limited thereto. In some embodiments, the pixel definition layer in the stretchable region SR (e.g., Figure 4 The height of the insulating layer IN5 can be smaller than the pixel definition layer in the non-flexible region NFR (e.g., Figure 4 The height of the insulating layer IN5), but not limited to this.

[0086] like Figure 10 As shown, the electronic device 6 may also include a flexible circuit board 44, a bonding pad 46, and a control element 48, wherein the flexible circuit board 44 is connected to one of the flexible portions 12b, the bonding pad 46 may be disposed on the flexible circuit board 44, and the control element 48 may be bonded to the flexible circuit board 44, but the present invention is not limited thereto. Figure 10 The non-flexible region NFR and the flexible region FR can be applied to any of the above embodiments. Other parts of the electronic device 6 in this embodiment can be the same as or similar to the electronic devices in the above embodiments, and therefore can be referred to above, and will not be repeated here.

[0087] In summary, in the electronic device of the present invention, since the distance between the protruding units disposed in different island-shaped portions can increase after stretching, the electronic device can have a significant dimensional change after stretching, which is easily discernible to the human eye, thus enabling the electronic device to have a stretching effect. Furthermore, by disposing at least a portion of the protruding units in the central region of the island-shaped portions of the stretchable patterned substrate, the protruding units can have a better support effect, and the protruding units can have better support while occupying a minimal area.

[0088] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, The electronic device has a first state and a second state, and the electronic device includes: A stretchable patterned substrate has a first portion, a second portion, and a connecting portion connecting the first portion and the second portion; A first electronic unit and a first protrusion unit are disposed on the first portion; and A second electronic unit and a second protrusion unit are disposed on the second part. Wherein the first protruding unit and the second protruding unit are higher than the first electronic unit and the second electronic unit in a normal direction of the electronic device, and When the electronic device extends from the first state to the second state along a stretching direction, the first protruding unit and the second protruding unit have a first distance D1 in the stretching direction in the first state, and a second distance D2 in the stretching direction in the second state, and the first distance D1 and the second distance D2 satisfy the following relationship: 1 <D2 / D1<2。 2. The electronic device according to claim 1, characterized in that, When the electronic device extends from the first state to the second state along the stretching direction, the rotation directions of the first protrusion unit and the second protrusion unit are different.

3. The electronic device according to claim 1, characterized in that, When the electronic device extends from the first state to the second state along the stretching direction, the first protrusion unit and the second protrusion unit rotate in the same direction.

4. The electronic device according to claim 1, characterized in that, When the electronic device extends from the first state to the second state along the stretching direction, the rotation angle of the first protruding unit relative to the first electronic unit is greater than 0.

5. The electronic device according to claim 1, characterized in that, When the electronic device is in the first state, the first protrusion unit is arranged along a first major axis direction, and the second protrusion unit is arranged along a second major axis direction that is not parallel to the first major axis direction.

6. The electronic device according to claim 5, characterized in that, When the electronic device extends from the first state to the second state along the stretching direction, a first acute angle between the first major axis direction and the stretching direction is different from a second acute angle between the second major axis direction and the stretching direction.

7. The electronic device according to claim 1, characterized in that, It also includes a third electronic unit and a fourth electronic unit disposed on the first portion, wherein the first protruding unit is surrounded by the first electronic unit, the third electronic unit and the fourth electronic unit.

8. The electronic device according to claim 1, characterized in that, The first protruding unit has a minimum distance D3 between itself and an edge of the first portion in one direction, the first protruding unit has a maximum width W1, and the minimum distance D3 and the maximum width satisfy the following relationship: 0 <D3≤W1。 9. The electronic device according to claim 1, characterized in that, The first protrusion unit has a first endpoint and a second endpoint, and a minimum distance between the first endpoint and an edge of the first portion is different from another minimum distance between the second endpoint and the edge of the first portion.

10. The electronic device according to claim 9, characterized in that, The first protrusion unit is arranged along a long axis direction, the first protrusion unit has a central axis, and the central axis is parallel to the long axis direction and passes through the first end point and the second end point.

11. The electronic device according to claim 1, characterized in that, The first protrusion unit has a first point, a second point, and a central axis, and the central axis passes through the first point and the second point.

12. The electronic device according to claim 1, characterized in that, The first protrusion unit has a connecting portion, a first portion and a second portion, the first portion and the second portion are connected to the connecting portion, the extension direction of the first portion is not parallel to the extension direction of the second portion, and the length of the first portion is different from the length of the second portion.

13. The electronic device according to claim 1, characterized in that, It also includes a sensing electrode disposed on the first portion, wherein the sensing electrode surrounds the first electronic unit and the first protrusion unit.

14. The electronic device according to claim 13, characterized in that, It also includes a third electronic unit disposed on the first portion, wherein the sensing electrode has an opening, and the first electronic unit, the third electronic unit and the first protrusion unit are disposed in the opening.

15. The electronic device according to claim 1, characterized in that, It also includes a first optical element disposed on the first electronic unit and at least partially overlapping the first protruding unit.

16. The electronic device according to claim 15, characterized in that, It also includes a sensing electrode disposed on the first portion and surrounding the first electronic unit, the first optical element and the first protrusion unit.

17. The electronic device according to claim 1, characterized in that, The first electronic unit has a lower electrode that at least partially overlaps the first protrusion unit.

18. The electronic device according to claim 1, characterized in that, It also includes an insulating layer disposed on the first portion, wherein the first protrusion unit is disposed on the insulating layer, and in the normal direction, the thickness of the first protrusion unit is greater than the thickness of the insulating layer.

19. The electronic device according to claim 1, characterized in that, It also includes an insulating layer disposed on the first portion, wherein the first protruding unit is disposed on the insulating layer, and in a cross-sectional view, the acute angle between the side of the first protruding unit and the surface of the first portion is smaller than the acute angle between the side of the insulating layer and the surface of the first portion.

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