Packaging method

Abstract

A packaging method for further shortening a tact time in a packaging apparatus that performs a temporary press bonding process and a final press bonding process with a packaging head. The packaging method includes: a temporary press bonding process of moving the packaging head that sucks and holds a semiconductor chip relative to a bonding stage on which a substrate is placed, and temporarily press bonding the semiconductor chip to a package; a final press bonding process of performing final press bonding of the temporarily press-bonded semiconductor chip and the package by a protective film that is provided across in a column direction and is arranged at an intermediate position directly above the semiconductor chip that is a final press bonding target; and a feeding step of driving the protective film in a row direction by a distance of at least a width of the protective film at the end of a plurality of the final press bonding processes in the column direction, moving the protective film to a position above a new plurality of package regions, and feeding the protective film by a distance corresponding to the column.

Description

[0001] This application is a divisional application of the original application, application number 201880072856.6, filed on November 28, 2018, entitled "Encapsulation Device". Technical Field

[0002] This specification relates to a packaging method and a packaging apparatus for encapsulating a semiconductor chip onto a substrate or other semiconductor chip as the encapsulated object via an adhesive material. Background Technology

[0003] Previously, flip chip bonding technology was widely known, which encapsulates a semiconductor chip onto a substrate or other semiconductor chip without wires. In this flip chip bonding, sometimes an adhesive material containing a thermosetting resin is pre-coated onto the substrate, and the semiconductor chip is then fixed to the substrate via this adhesive material. However, when the semiconductor chip is heated and pressurized using a bonding head, the adhesive material extruded from the semiconductor chip can sometimes spread upwards and adhere to the bonding head. Furthermore, even when it does not adhere to the bonding head, fume gas generated from the heated adhesive material can sometimes intrude into the bonding head.

[0004] Patent Document 1 discloses a packaging device that uses a film component (cover film) to cover the bottom surface of the heat-pressing tool to prevent adhesive material from adhering to the heat-pressing tool (packaging head). Specifically, the packaging device in Patent Document 1 includes a film component conveying mechanism on the bonding head that sequentially feeds the heat-pressing tool and the film component. According to this packaging device, adhesion of adhesive material to the heat-pressing tool can be effectively prevented.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-35493

[0008] Patent Document 2: Japanese Patent Application Publication No. 2004-165536 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, in the prior art of Patent Document 1, the semiconductor chip is held by suction on the bottom surface of the thermoforming tool, but the suction surface is always covered by a thin film component. Furthermore, the thin film component must be replaced with a new one each time a semiconductor chip is pressed. As a result, in the prior art, suction holes must be formed on the thin film component before the semiconductor chip is suctioned. Here, the time required for opening the holes in the thin film component or for feeding the thin film component is several to ten times longer than the time required to heat and pressurize the semiconductor chip to bond it to the packaged object. Therefore, the prior art of Patent Document 1, etc., leads to an increase in cycle time.

[0011] Furthermore, Patent Document 2 discloses a packaging apparatus in which a resin film (protective film) is separately disposed from a bonding tool. However, in the packaging apparatus of Patent Document 2, the resin film is used to protect the chip (semiconductor chip) from the vibration of the bonding tool, rather than to prevent adhesive material from adhering to the bonding tool. Additionally, although the bonding tool in Patent Document 2 presses down on the temporarily placed chip, it does not hold the chip in place by suction. Therefore, the technology of Patent Document 2 is difficult to apply to packaging apparatuses that use a single packaging head for both temporary and final bonding of semiconductor chips.

[0012] Therefore, this specification discloses a packaging device that uses a packaging head to perform temporary crimping and formal crimping processes, and can further shorten cycle time.

[0013] Technical means to solve the problem

[0014] The packaging apparatus disclosed in this specification encapsulates a semiconductor chip onto a substrate or other semiconductor chip, which serves as the encapsulated object, via an adhesive material. The packaging apparatus includes: a bonding stage for holding the substrate; a base for supporting the bonding stage; a packaging head for performing temporary pressing and formal pressing processes, wherein the temporary pressing process involves suctioning and holding the semiconductor chip and temporarily pressing it onto the encapsulated object, and the formal pressing process involves formally pressing the temporarily pressed semiconductor chip; a film placement mechanism disposed on the bonding stage or the base, which, during the formal pressing process, mediates a protective film between the temporarily pressed semiconductor chip and the packaging head; and a control unit for controlling the driving of the packaging head and the film placement mechanism, wherein the film placement mechanism includes: a film delivery mechanism having a pair of rollers on which the protective film is mounted, the film delivery mechanism sequentially delivering new protective films; and a film moving mechanism for moving the protective film horizontally relative to the substrate.

[0015] With the configuration described above, since the protective film is separate from the encapsulation head, there is no need for openings in the protective film. As a result, cycle time can be reduced, and contamination of the encapsulation head due to adhesive materials can be effectively prevented.

[0016] The control unit can also control the film moving mechanism so that the protective film is located in a retracted position in the horizontal direction away from the packaging partition where the semiconductor chip is temporarily pressed during the temporary pressing process, and in an intermediate position directly above the semiconductor chip that is the object of the formal pressing process during the formal pressing process.

[0017] By configuring the above structure, interference between the protective film and the package head is prevented during temporary crimping, and during formal crimping, the protective film is placed between the package head and the semiconductor chip, thus effectively preventing contamination of the package head caused by adhesive materials.

[0018] Alternatively, the film delivery mechanism can also mount the protective film at the intermediate position, such that the protective film covers multiple packaging partitions. If the formal pressing of the semiconductor chip is completed in all of the multiple packaging partitions covered by the protective film, the control unit drives the film moving mechanism to move the protective film to a position covering the new multiple packaging partitions, and the control unit drives the film delivery mechanism to feed the protective film a distance corresponding to the multiple packaging partitions.

[0019] By configuring it as described above, the number of times the protective film is fed can be reduced, thus further reducing the cycle time.

[0020] At this time, the substrate may also have packaging partitions for packaging semiconductor chips in a two-dimensional array. The film delivery mechanism uses a column-by-column method to cover the two-dimensional array of packaging partitions and then erects the protective film.

[0021] The protective film covers the encapsulation partitions in columns, which simplifies the feed / movement control of the protective film.

[0022] In addition, the control unit can also enable the packaging head to continuously perform formal pressing of the semiconductor chips after the semiconductor chips have been temporarily pressed in multiple packaging partitions.

[0023] By configuring it as described above, the number of times the film moving mechanism moves the protective film can be reduced, thus further reducing the cycle time.

[0024] In addition, the film placement mechanism may also include a lifting mechanism for raising and lowering the protective film relative to the bonding stage.

[0025] By configuring the structure as described above, the protective film can more reliably separate from the upper surface of the semiconductor chip. Furthermore, in the case of stacked packaging of semiconductor chips, the placement height of the protective film can be varied depending on the number of stacked layers, thus improving the versatility of the packaging device.

[0026] Alternatively, the film delivery mechanism may also include an interference member that supports the elimination of the bending by interfering with a portion of the protective film that is bent downwards by being pressed by the encapsulation head.

[0027] If configured as described above, not only is the structure simple, but the protective film can also more reliably leave the upper surface of the semiconductor chip.

[0028] The effects of the invention

[0029] According to the packaging apparatus disclosed in this specification, since the protective film is separate from the packaging head, there is no need for openings in the protective film. As a result, cycle time can be reduced, and contamination of the packaging head due to adhesive materials can be effectively prevented. Attached Figure Description

[0030] Figure 1 This is a diagram showing the configuration of the packaging device.

[0031] Figure 2 This is a schematic plan view of the packaging device.

[0032] Figure 3 This is a side view showing a temporary crimped connection.

[0033] Figure 4 This is a side view showing the actual crimping process.

[0034] Figure 5 This is a plan view showing a temporary pressing situation.

[0035] Figure 6 This is a plan view showing a temporary pressing situation.

[0036] Figure 7 This is a plan view showing the actual crimping process.

[0037] Figure 8 This is a plan view showing the actual crimping process.

[0038] Figure 9A This is a side view showing the actual crimping process.

[0039] Figure 9B This is a side view showing the actual crimping process.

[0040] Figure 10 This is a graph comparing the processing time of existing technologies with that of this example.

[0041] Figure 11A This is a diagram illustrating an example of another packaging device.

[0042] Figure 11B It means Figure 11A A diagram showing another state of the packaging device.

[0043] Figure 12A This is a three-dimensional view of the interference component used in another packaging device.

[0044] Figure 12B It means to use Figure 12A A diagram of an example of an encapsulation device for an interference component.

[0045] Figure 13 This is a diagram illustrating an example of another packaging device.

[0046] Figure 14 This is a plan view of the case where a circular substrate is used.

[0047] Figure 15 This is a side view of a semiconductor chip being stacked and packaged.

[0048] Figure 16 This is a diagram illustrating an example of another packaging device.

[0049] Figure 17 This is a diagram illustrating an example of an existing packaging device.

[0050] [Explanation of Symbols]

[0051] 10: Packaging device

[0052] 12: Packaging head

[0053] 14: Joining platform

[0054] 16: Abutment

[0055] 18: Thin film preparation mechanism

[0056] 20: Control Department

[0057] 22: Suction hole

[0058] 24: Film delivery mechanism

[0059] 28a: Feed roller

[0060] 28b: Winding roller

[0061] 30: Thin film moving mechanism

[0062] 40: Interference components

[0063] 42: Rectangular hole

[0064] 48: XY Platform

[0065] 70: Needle

[0066] 100: Semiconductor chip

[0067] 102: Bump

[0068] 104: Substrate

[0069] 105: Electrode

[0070] 106: Encapsulation Partition

[0071] 108: Adhesive Material

[0072] 110: Protective film

[0073] 120: Temporary laminate Detailed Implementation

[0074] The configuration of the packaging device 10 will now be described with reference to the accompanying drawings. Figure 1 This is a schematic diagram showing the configuration of the packaging device 10. Additionally, Figure 2 This is a schematic plan view of the packaging device 10. Additionally, Figure 3 This diagram illustrates a temporary crimping process. Figure 4 This diagram illustrates the formal crimping process.

[0075] The packaging apparatus 10 is an apparatus for manufacturing a semiconductor device by packaging a plurality of semiconductor chips 100 onto a substrate 104 or other semiconductor chips 100 (hereinafter, without distinction, referred to as "packaged objects"). The semiconductor chips 100 are packaged onto the substrate 104 using flip-chip bonding technology. Specifically, on the bottom surface of each semiconductor chip 100, a protrusion containing conductive material, called a bump 102, is formed. The semiconductor chip 100 is electrically connected to the substrate 104 by bonding the bump 102 to an electrode 105 formed on the surface of the substrate 104.

[0076] On substrate 104, encapsulation partitions 106 for packaging semiconductor chip 100 are defined in a two-dimensional array. In the example shown, 15 encapsulation partitions 106 are defined in 3 rows and 5 columns on one substrate 104. On the surface of each encapsulation partition 106, a plurality of electrodes 105 electrically connected to bumps 102 of semiconductor chip 100 are formed. In addition, an adhesive material 108, called non-conductive paste (NCP) or non-conductive film (NCF), is pre-coated on each encapsulation partition 106. The adhesive material 108 contains a thermosetting resin that is insulating and thermosetting. The semiconductor chip 100 is placed on the adhesive material 108 and pressed against substrate 104, and the semiconductor chip 100 is heated, thereby hardening the adhesive material 108 and mechanically adhering and fixing the semiconductor chip 100 to substrate 104. Furthermore, the method of pre-coating the adhesive material 108 on the substrate 104 is generally referred to as the "pre-coating method".

[0077] The packaging apparatus 10 temporarily presses each semiconductor chip 100 and then performs a formal press, thereby encapsulating them onto the substrate 104. Temporary pressing involves temporarily placing the semiconductor chip 100 in the corresponding packaging partition 106 (adhesive material 108) within the substrate 104. The formal press involves heating and pressurizing the temporarily pressed semiconductor chip 100, thereby mechanically / electrically connecting the semiconductor chip 100 to the packaged object (substrate 104 or other semiconductor chip 100). During the formal press, the semiconductor chip 100 is heated to a temperature above the hardening temperature of the adhesive material 108 and above the melting temperature of the bump 102. In this example, after continuously performing temporary pressing of the semiconductor chips 100 in multiple packaging partitions 106, the formal press of the multiple temporarily pressed semiconductor chips 100 is performed consecutively.

[0078] The packaging apparatus 10 is an apparatus for packaging a semiconductor chip 100 onto a substrate 104 (the packaged object) according to the process described above. The packaging apparatus 10 includes a bonding stage 14, a packaging head 12, a base 16, a thin film placement mechanism 18, and a control unit 20 for controlling the drive of these components.

[0079] The bonding stage 14 is a stage for placing the substrate 104. The bonding stage 14 may include, for example, a suction hole (not shown) for holding the substrate 104, or a heater (not shown) for heating the substrate 104. The bonding stage 14 is supported by a base 16.

[0080] The encapsulation head 12 is positioned facing the bonding stage 14 and can move horizontally and vertically relative to the bonding stage 14. The encapsulation head 12 performs temporary pressing and formal pressing processes. In the temporary pressing process, the encapsulation head 12 picks up semiconductor chips 100 from a chip supply source (not shown) and transports them, placing each semiconductor chip 100 on its corresponding encapsulation partition 106, followed by heating and pressurization to perform temporary pressing. Ideally, the heating temperature during temporary pressing is above the temperature at which the adhesive material 108 begins to soften and below the hardening temperature of the adhesive material 108. In the formal pressing process, the encapsulation head 12 presses and heats the semiconductor chips 100 temporarily pressed onto the substrate 104 to perform formal pressing. Ideally, the heating temperature during formal pressing is above the melting temperature of the bump 102 and above the hardening temperature of the adhesive material 108. Furthermore, the pressure applied during formal pressing is greater than the pressure applied during temporary pressing.

[0081] like Figure 3 As shown, a suction hole 22 for suction and holding the semiconductor chip 100 is formed on the bottom surface of the encapsulation head 12. The suction hole 22 is connected to a suction pump (not shown), and the semiconductor chip 100 is suctioned and held on the bottom surface of the encapsulation head 12 by means of the negative pressure generated by the suction pump. Additionally, a heater (not shown) is built into the encapsulation head 12 to heat the semiconductor chip 100 during temporary and formal pressing. Furthermore, in this example, the encapsulation head 12 moves in a horizontal direction, but it could also be configured such that the bonding stage 14 moves in a horizontal direction, as will be explained later.

[0082] Furthermore, as described above, during the formal pressing process, the packaging head 12 presses the semiconductor chip 100 against the substrate 104. At this time, as... Figure 4 As shown, a portion of the adhesive material 108 extruded to the outside by the semiconductor chip 100 may sometimes protrude and spread upwards. If the upwardly spreading adhesive material 108 adheres to the encapsulation head 12, subsequent encapsulation processing may not be able to be performed properly. In addition, even when the adhesive material 108 is not adhered to the encapsulation head 12, fumes generated from the heated adhesive material 108 may sometimes enter the suction port 22 of the encapsulation head 12, thereby contaminating the encapsulation head 12.

[0083] Therefore, in the packaging apparatus 10 disclosed in this specification, during formal pressing, a protective film 110 is disposed between the packaging head 12 and the semiconductor chip 100. For example... Figure 4 As shown, by setting the protective film 110, the adhesion of the adhesive material 108 to the encapsulation head 12 and the intrusion of smoke gas into the suction hole 22 of the encapsulation head 12 can be effectively prevented.

[0084] A film placement mechanism 18 is provided on the base 16 of the packaging device 10. During the formal pressing process, the film placement mechanism 18 places a protective film 110 between the temporarily pressed semiconductor chip 100 and the packaging head 12. In this example, a unidirectional long strip-shaped protective film 110 is used. Suitable raw materials for the protective film 110 are those with excellent heat resistance and high peelability of the adhesive material 108. Therefore, fluoropolymers such as polytetrafluoroethylene (PTFE) and polytetrafluoroethylene-perfluoroalkyl vinyl ether (PFA) can be used as raw materials for the protective film 110.

[0085] The film placement mechanism 18 includes a film delivery mechanism 24 that sequentially delivers a strip of protective film 110 onto a substrate 104. The film delivery mechanism 24 includes a delivery roller 28a and a winding roller 28b (hereinafter referred to as "feed rollers" without distinguishing between the delivery rollers / winding rollers 28a and 28b) positioned on both sides of the bonding platform 14. The protective film 110 is positioned between the pair of feed rollers. The film is delivered in a predetermined delivery direction via the delivery roller 28a. Figure 1 As the feed roller 28a rotates (in the direction of arrow A), new protective films 110 are sequentially fed out. Additionally, in conjunction with the feed roller 28a, the winding roller 28b rotates in the same direction as the feed roller 28a, thereby winding the used protective films 110 onto the winding roller 28b for recycling. In other words, the protective films 110 are fed by a pair of feed rollers rotating in the same direction.

[0086] Here, as described above, a pair of feed rollers are disposed on both sides of the bonding stage 14, so that the protective film 110 will cross-cut the substrate 104 in a unidirectional direction. In addition, the width of the protective film 110 is sufficiently wider than the width of the encapsulation partitions 106. Therefore, the protective film 110 can cover the top of one column of the encapsulation partitions 106 arranged in 3 rows and 5 columns, i.e., multiple (three in the example) encapsulation partitions 106.

[0087] The winding roller 28b is a drive roller connected to a drive source such as a motor and rotates in tandem with the drive of the motor. The feed roller 28a can be either a drive roller that rotates independently of the winding roller 28b, or a driven roller that rotates in tandem with the rotation of the winding roller 28b. When the feed roller 28a is a driven roller, it is ideal to provide a force-applying member that applies force to the feed roller 28a in the opposite direction to the feed direction, so as to impart appropriate tension to the protective film 110. Furthermore, it is ideal, in either configuration, to provide a sensor that senses the amount of protective film 110 wound around each feed roller near at least one of the two feed rollers. Moreover, the replacement period of the protective film 110 can be estimated or the rotation speed of the feed rollers can be adjusted based on the detection results of the sensor. In particular, the feed / winding distance (feed amount) of the protective film 110 per turn of the feed roller varies depending on the amount of protective film 110 wound onto each feed roller (more precisely, the diameter of the film roll 110a on which the protective film 110 is wound onto each feed roller). Therefore, in order to properly control the feed amount of the protective film 110, the tension of the protective film 110, etc., it is ideal to adjust the rotational speed of the feed roller according to the amount of protective film 110 wound onto each feed roller.

[0088] The film placement mechanism 18 also includes a film moving mechanism 30, which moves the protective film 110 horizontally in relation to each of the film delivery mechanisms 24. The film moving mechanism 30 has a pair of rails 32 extending along a first direction (in the example, the direction of the long side of the rectangular substrate 104) and a block 34 that slides along the rails 32. The pair of rails 32 are positioned on both sides, sandwiching the bonding stage 14. A feed roller is provided on the block 34, and as the block 34 slides, the feed roller and the protective film 110 move along the first direction. Furthermore, the two blocks 34 mounted on the two rails 32 move in conjunction with the delivery roller 28a and the winding roller 28b, whose relative positions are always fixed. By moving the feed roller along the first direction via the film moving mechanism 30, the encapsulation partition 106 (semiconductor chip 100) covered by the protective film 110 is sequentially changed. Furthermore, the mechanism for sliding the movable block 34 can be, for example, a mechanism combining a motor (rotary motor) and a ball spline, or a mechanism using a direct-acting drive source such as a hydraulic cylinder or a linear motor.

[0089] The film placement mechanism 18 also includes a film lifting mechanism (not shown), which raises and lowers the protective film 110 corresponding to each film delivery mechanism 24. The film lifting mechanism is not particularly limited as long as it allows for variable height of the feed roller. Therefore, for example, a cam member that rotates while abutting against the rotation axis of the feed roller may be used as the film lifting mechanism. Alternatively, the film lifting mechanism may be configured to have a moving body connected to the rotation axis of the feed roller and movable vertically by a drive source such as a motor or hydraulic cylinder. In any case, the protective film 110 is positioned in the height direction relative to the substrate 104 and the semiconductor chip 100 by the film lifting mechanism.

[0090] The control unit 20 controls the driving of the encapsulation head 12 or the film placement mechanism 18 and the bonding stage 14. The control unit 20 includes, for example, a central processing unit (CPU) that performs various calculations and a memory that stores various data and programs. The control unit 20 receives detection results from various sensors and performs driving control of each component based on these results. More specifically, the control unit 20 controls the movement of the encapsulation head 12, the temperature of the heaters of the encapsulation head 12 and the bonding stage 14, and the driving control of the suction mechanism. Additionally, the control unit 20 also controls the driving of the film placement mechanism 18 to position the protective film 110 appropriately.

[0091] Next, refer to Figures 3-8 This will illustrate the packaging process of this packaging device 10 for semiconductor chips 100. Figures 5-8 This is a schematic plan view showing the situation during the encapsulation process. Figure 5 , Figure 6 This indicates a temporary crimping situation. Figure 7 , Figure 8 This indicates the formal pressing process. When packaging the semiconductor chip 100, the substrate 104 is placed on the bonding stage 14. An adhesive material 108 is applied to the packaging partition 106 of the substrate 104 beforehand or after it is placed on the bonding stage 14.

[0092] The control unit 20 drives the packaging head 12, temporarily pressing the semiconductor chip 100 onto each packaging partition 106 of the substrate 104. Specifically, the packaging head 12 moves to a chip supply source (not shown) and uses its bottom surface to pick up and hold new semiconductor chips. Then, the packaging head 12 moves directly above the corresponding packaging partition 106. Subsequently, the packaging head 12... Figure 3As shown, the package head 12 descends toward the substrate 104, pressing the held semiconductor chip 100 against the corresponding packaging partition 106 (or even the adhesive material 108), thereby temporarily bonding the semiconductor chip 100. Once one semiconductor chip 100 can be temporarily bonded, the package head 12 rises after releasing the suction of the semiconductor chip 100. Subsequently, the package head 12 sequentially performs the same process for temporarily bonding all semiconductor chips 100. Figure 5 , Figure 6 In the diagram, the numbers labeled 100 on each semiconductor chip indicate the temporary bonding sequence. Figure 5 , Figure 6 As can be seen in the example diagram, the semiconductor chip 100 is temporarily crimped starting from the lower left corner. Moreover, for each column, the semiconductor chip 100 is temporarily crimped in a zigzag pattern while reversing the direction of travel.

[0093] Here, during the temporary bonding process, the control unit 20 drives the thin film moving mechanism 30 to move the protective film 110 to a retraction position. The retraction position refers to the position in the horizontal direction away from the packaging partition 106 where the semiconductor chip 100 is temporarily bonded. This retraction position can be a specific fixed position or a variable position that changes with the change of the packaging partition 106 being temporarily bonded. For example, if the protective film 110 can be moved to the outside of the substrate 104, then the outside of the substrate 104 can be set as the retraction position. If the protective film 110 is located on the outside of the substrate 104, then regardless of which packaging partition 106 is temporarily bonded to, the protective film 110 will move away from the temporarily bonded packaging partition 106 in the horizontal direction. Therefore, the outside of the substrate 104 becomes a retraction position with a fixed position.

[0094] On the other hand, due to limitations such as the size of the packaging device 10, it is sometimes impossible to move the protective film 110 to the outside of the substrate 104. In this case, it is sufficient to set the position directly above the packaging section 106 that has not yet been temporarily pressed at the current time as the retracted position. For example, it is also possible to... Figure 5 As shown, the packaging partition 106 of the substrate 104 is divided into three columns on one side (the three columns on the lower side of the figure) and two columns on the opposite side (the two columns on the upper side of the figure). During the period of temporary pressing of the three columns on one side, the area directly above the two columns on the opposite side is set as a retraction position (see reference). Figure 5 During the temporary pressing of the two columns on the opposite side, the area directly above the three columns on one side is set to a retraction position (see reference). Figure 6That is, during the temporary pressing of the three columns on one side, the film moving mechanism 30 moves the protective film 110 to directly above the two columns on the opposite side. Once the temporary pressing of the three columns on one side is complete, the moving block 34 slides to move the protective film 110 directly above the three columns on the opposite side. In any case, during the temporary pressing process, by moving the protective film 110 horizontally away from the packaging partition 106 to be temporarily pressed, interference between the protective film 110 and the packaging head 12 can be prevented, and the semiconductor chip 100 can be properly temporarily pressed.

[0095] If the temporary bonding of all semiconductor chips 100 is completed, the control unit 20 then causes the packaging head 12 to perform the formal bonding process. Specifically, the packaging head 12 sequentially applies pressure and heats the temporarily bonded semiconductor chips 100 to formally bond them to the substrate 104. Figure 7 , Figure 8 The numbers labeled 100 on each semiconductor chip indicate the order of the formal crimping. In the example shown, the formal crimping also starts from the bottom left corner, just like the temporary crimping. Then, for each column, the process proceeds in a zigzag pattern while reversing the direction of travel.

[0096] Here, during the formal pressing process, the control unit 20 drives the thin film moving mechanism 30 to move the protective film 110 to the intermediate position. The intermediate position refers to the position directly above the semiconductor chip 100, which is the object of the formal pressing, and between the semiconductor chip 100 and the package head 12. By positioning the protective film 110 at this position, during the formal pressing process, as... Figure 4 As shown, the protective film 110 will be placed between the semiconductor chip 100 and the package head 12. Moreover, this can effectively prevent the adhesion of the upward-spreading adhesive material 108 to the package head 12, or the intrusion of atomized gas into the package head 12.

[0097] Here, the semiconductor chips 100, which are the targets of the formal pressing process, change sequentially. Therefore, the position of the protective film 110 must also change sequentially according to the progress of the formal pressing process. However, in this example, the protective film 110 is set up to cover a row (three) of semiconductor chips 100 (package partition 106). Therefore, the film moving mechanism 30 does not move the protective film 110 until the formal pressing of the row (three) of semiconductor chips 100 located directly below the protective film 110 is completed. Once all the formal pressing of the semiconductor chips 100 located directly below the protective film 110 is completed, the protective film 110 is moved to the position directly above the next adjacent row. Figure 7 , Figure 8 For example, during the formal pressing of the second row of semiconductor chips 100 counted from above in the attached figure, the thin film moving mechanism 30, as... Figure 7As shown, the protective film 110 is positioned directly above the second column of packaging partitions 106. Furthermore, once the formal pressing of the second column of semiconductor chips 100 is complete, the film moving mechanism 30 moves as follows... Figure 8 As shown, the protective film 110 is positioned directly above the first column of encapsulation partitions 106, counting from the top of the figure.

[0098] Furthermore, the horizontal movement of the protective film 110 is coordinated using the thin film moving mechanism 30, and the thin film delivery mechanism 24 feeds the protective film 110. Specifically, once the formal pressing of a row of semiconductor chips 100 is completed, the thin film delivery mechanism 24 feeds the protective film 110 to a distance corresponding to a row of the packaging partition 106. Figure 7 In the example, position P1 on the protective film 110 is located near one end of the column of the encapsulation partition 106, and position P2 on the protective film 110 is located near the other end of the column. The distance from position P1 to position P2 is the feed distance for one cycle.

[0099] When viewed from above the attached diagram, the protective film 110 moves from the second column to the first column (from...). Figure 7 The state change is Figure 8 When in the state of film delivery mechanism 24 Figure 8 As shown, the protective film 110 is fed in such a way that position P2 on the protective film 110 is near one end of the column of the encapsulation partition 106.

[0100] Furthermore, when the semiconductor chip 100 is heated and pressurized using the packaging head 12 via the protective film 110, such as Figure 4 As shown, the protective film 110 is tightly attached to the upper surface of the semiconductor chip 100, and a portion of the upwardly extending adhesive material 108 contacts the protective film 110. If the protective film 110 remains tightly attached to the upper surface of the semiconductor chip 100, the protective film 110 cannot be properly fed.

[0101] Therefore, the protective film 110 can also be raised or lowered using a film lifting mechanism as needed. Specifically, during the formal pressing of the semiconductor chip 100, such as... Figure 9A As shown, a thin-film lifting mechanism is used to lower the protective film 110 so that it is at approximately the same height as the upper surface of the semiconductor chip 100. Additionally, when feeding the protective film 110, as... Figure 9B As shown, a thin-film lifting mechanism is used to raise the protective film 110 so that the protective film 110 leaves the upper surface of the semiconductor chip 100.

[0102] That is, during the formal crimping process, it is necessary to configure the protective film 110 in the appropriate position each time a formal crimping of a row of encapsulation partitions 106 is completed. The configuration process of the protective film 110 includes raising the protective film 110, feeding the protective film 110, moving the protective film 110 horizontally, and lowering the protective film 110. In these processes, the feeding and horizontal movement of the protective film 110 can also be performed in parallel.

[0103] Furthermore, as can be clearly seen from the description so far, in the packaging apparatus 10 disclosed in this specification, the film placement mechanism 18 is disposed on the base 16. Additionally, the protective film 110 is configured to simultaneously cover multiple packaging sections 106. The reasons for this configuration will be explained in comparison with the prior art.

[0104] Several types of packaging devices 10 have been proposed before, which separate the protective film 110 between the packaging head 12 and the semiconductor chip 100. Figure 17 This diagram illustrates an example of such a conventional packaging device 10. (As shown...) Figure 17 As shown, existing packaging devices 10 typically place the protective film 110 on the packaging head 12. That is, a feed roller for feeding the protective film 110 is installed on the packaging head 12. In this case, the weight of the packaging head 12, which requires high-speed and high-precision movement, increases, leading to problems such as larger size and higher cost of the moving mechanism that moves the packaging head 12.

[0105] Furthermore, in the configuration where the protective film 110 is mounted on the encapsulation head 12, the protective film 110 will always cover the bottom surface of the encapsulation head 12. In this case, the suction hole 22 of the encapsulation head 12 will be covered by the protective film 110, thus preventing the semiconductor chip 100 from being suctioned and held through the suction hole 22. Therefore, in the conventional encapsulation apparatus 10, before suctioning and holding the semiconductor chip 100, a hole is formed in the protective film 110 at the location corresponding to the suction hole 22 using a needle 70 or the like. Additionally, in the configuration where the protective film 110 is mounted on the encapsulation head 12, the protective film 110 must be fed after each formal pressing of a semiconductor chip 100 is completed. This hole-opening and feeding process is time-consuming, thus increasing the cycle time. For example, the time required for hole-opening and feeding processes is several times to ten times longer than the time required for a single bonding operation (temporary pressing, formal pressing). In the existing packaging apparatus 10, the opening process is generated, and the number of feed processes increases, thus increasing the cycle time of semiconductor device manufacturing.

[0106] On the other hand, in the packaging apparatus 10 disclosed in this specification, as described so far, the thin film placement mechanism 18 is disposed on the base 16. As a result, the packaging head 12 can be made lightweight, and the packaging head 12 can be moved at high speed and with high precision even using a relatively small and inexpensive moving mechanism.

[0107] Furthermore, by providing the thin-film placement mechanism 18 on the base 16, the protective film 110 can be separated from the packaging head 12. Therefore, even without opening a hole in the protective film 110, the semiconductor chip 100 can be held and sucked up using the packaging head 12. As a result, time-consuming hole-opening processing is eliminated, significantly reducing cycle time. In addition, the complex mechanism for hole opening can be eliminated, thus reducing the price of the packaging device 10.

[0108] Furthermore, in the packaging apparatus 10 of this example, the protective film 110 is configured to cover multiple semiconductor chips 100 during the formal pressing process. Therefore, the number of feeds of the protective film 110 can be significantly reduced compared to the prior art, and even the cycle time can be significantly reduced.

[0109] To illustrate this, let's take a specific example. Figure 10 This is an example of a timing diagram showing a semiconductor chip 100 packaged in a 3x5 arrangement. Figure 10 In this document, conditions 1 and 2 represent the timing diagrams in the existing packaging apparatus 10, and condition 3 represents the timing diagrams in the packaging apparatus 10 disclosed herein. Figure 10 In the example, the time required for bonding (temporary or permanent bonding) of a semiconductor chip 100 is set to 1 second, the time required for opening the protective film 110 is set to 3 seconds, and the time required for feeding the protective film 110 is set to 2 seconds. Additionally, Figure 10 In the diagram, temporary pressing is illustrated with light ink, formal pressing is illustrated with dark ink, opening is illustrated with oblique shadow lines, and feeding is illustrated with cross shadow lines.

[0110] In the existing packaging apparatus 10, there are generally two processes for packaging semiconductor chips 100. One process is to use the packaging head 12 to transport and place the semiconductor chip 100 on the substrate 104, and then immediately perform formal pressing without temporary pressing. Figure 10 Condition 1 represents the timeline in the process. At this time, whenever a semiconductor chip 100 is formally pressed, the protective film 110 must be opened (slanted lines) and fed (crosshairs). Therefore, the overall packaging process takes a very long time.

[0111] As another process, similar to the packaging apparatus 10 disclosed in this specification, there is a process in which all semiconductor chips 100 are temporarily pressed together one after another, and then all semiconductor chips 100 are formally pressed together one after another. Figure 10 Condition 2 represents the timing diagram in the process. In this case, the opening of the protective film 110 only needs to be performed once before temporarily pressing the first semiconductor chip 100, thus significantly reducing the total time required for opening (shaded lines) compared to the first-stage process. However, in this case, the protective film 110 also needs to be fed (crosshairs) each time a semiconductor chip 100 is formally pressed. In other words, the protective film 110 needs to be fed the same number of times as the number of semiconductor chips 100. As a result, the overall packaging process time cannot be significantly reduced.

[0112] On the other hand, in the packaging apparatus 10 disclosed in this specification, as explained so far, openings (slanted lines) in the protective film 110 are completely unnecessary. Furthermore, the protective film 110 simultaneously covers multiple (three in this example) packaging sections 106. Therefore, feeding (crosshairs) of the protective film 110 is sufficient only once every three formal pressing operations. In other words, in this example, when the number of packaging sections 106 simultaneously covered by the protective film 110 is set to N, the number of feeds of the protective film 110 is (total number of packaging sections 106 / N). That is, according to this example, the number of feeds of the protective film 110 can be significantly reduced compared to the prior art, and even the overall packaging process time can be significantly reduced. Furthermore, here, for ease of explanation, the number N of the packaging sections 106 covered by the protective film 110, that is, the number N of the packaging sections 106 arranged in a row on the substrate 104, is set to three. However, in practice, in most cases, the number N of packaging partitions 106 arranged in a row in the substrate 104 is greater. Moreover, the larger the number N, the fewer the feeds are. Therefore, it can be seen that the larger the substrate 104 and the larger the number of packaging partitions 106, the greater the effect of shortening the cycle time.

[0113] Furthermore, the description up to this point is just one example. As long as a film placement mechanism 18 for positioning the protective film 110 is provided, at least on the bonding stage 14 or the base 16 supporting the bonding stage 14, other configurations can be appropriately modified. For example, in the description, a film lifting mechanism is provided to raise and lower the protective film 110 in order to allow the protective film 110 to contact / separate from the upper surface of the semiconductor chip 100. However, as long as the protective film 110 can be isolated from the upper surface of the semiconductor chip 100 during feeding, a film lifting mechanism may not be necessary. For example, it can also be configured such that the elasticity of the protective film 110 allows it to return from a state of contact with the semiconductor chip 100 to a state of separation. Specifically, as... Figure 11B As shown, the protective film 110 is positioned at a height above the upper surface of the semiconductor chip 100. Furthermore, during the actual pressing process, as... Figure 11AAs shown, the protective film 110 is bent and contacts the upper surface of the semiconductor chip 100 by pressing with the encapsulation head 12. At this time, as long as the protective film 110 has sufficient elasticity (adhesion) and appropriate tension, when the pressing of the encapsulation head 12 is released, the protective film 110 will automatically return to its pre-bending state, i.e., the state of being separated from the semiconductor chip 100, thanks to the elastic restoring force. Furthermore, if it reaches this state, only feeding of the protective film 110 is required. With this configuration, it is not necessary to raise or lower the protective film 110 each time it is fed, thus simplifying the control of the encapsulation process.

[0114] Additionally, to more reliably separate the semiconductor chip 100 from the protective film 110, an interference member 40 may be provided. This interference member 40 interferes with a portion of the protective film 110 that is bent downwards by the packaging head 12. It is required that the interference member 40 interferes with the portion of the downwardly bent protective film 110, but on the other hand, the interference member 40 does not interfere with the packaging head 12 descending toward the semiconductor chip 100. Therefore, as the interference member 40, for example, a generally ladder-shaped member can be used, such as... Figure 12A As shown, a rectangular hole 42, larger than the bottom surface of the encapsulation head 12, is formed with the arrangement intervals of the encapsulation partitions 106. When the interference member 40 is provided, as... Figure 12B As shown, compared to the case without interference member 40, the protective film 110 pressed by the encapsulation head 12 will bend at a steeper angle, and the elastic recovery force will play a stronger role. As a result, the protective film 110 will separate from the semiconductor chip 100 more reliably. Furthermore, Figure 12A , Figure 12B The shape of the interference member 40 shown is one example, but it can also be other shapes.

[0115] Furthermore, in the description up to this point, the width of the protective film 110 has been set to the width of one column of the encapsulation partition 106, but the width of the protective film 110 can also be larger. For example, it can also be as follows: Figure 13 As shown, the protective film 110 has a width of two columns of encapsulation partitions 106. By configuring it as described, the number of encapsulation partitions 106 that can be simultaneously covered by the protective film 110 can be increased, thus further reducing the number of feeds and even further shortening the cycle time. Furthermore, to simplify the configuration control of the protective film 110, ideally, the film delivery mechanism 24 sets up the protective film 110 in such a way that the protective film 110 covers the two-dimensional array of encapsulation partitions 106 in columns.

[0116] Furthermore, the description so far has only illustrated packaging for a generally rectangular substrate 104, but the substrate 104 is not limited to a rectangle and can also be other shapes, such as circular. Therefore, the packaging apparatus 10 disclosed in this specification can also be applied to chip-on-wafer (CoW) packaging where a semiconductor chip 100 is bonded to a generally circular wafer. Moreover, in the case of a circular substrate 104, as... Figure 14 As shown, the number of encapsulation partitions 106 that the protective film 110 can simultaneously cover varies depending on the horizontal position of the protective film 110. In this case, the feed distance of the protective film 110 can also be varied according to the horizontal position of the protective film 110 (the number of encapsulation partitions 106 that can be simultaneously covered). With this configuration, the loss of the protective film 110 can be reduced. Alternatively, as another embodiment, the feed distance of the protective film 110 can be fixed to a maximum value, that is, equivalent to the diameter of the substrate 104. In this case, the number of unused protective films 110 that are wound increases, but the feed control of the protective film 110 can be simplified.

[0117] Furthermore, so far, only the configuration of packaging the semiconductor chip 100 layer by layer on the substrate 104 has been illustrated, but it is also possible to do so as follows: Figure 15 As shown, two or more semiconductor chips 100 are stacked along the thickness direction for encapsulation. That is, for the first semiconductor chip 100, the substrate 104 is the encapsulated object, and for the second semiconductor chip 100, the first semiconductor chip 100 becomes the encapsulated object.

[0118] In the temporary bonding process, a temporary laminate 120 is first formed in each packaging partition 106, where multiple semiconductor chips 100 are temporarily bonded together along the thickness direction. Then, in the formal bonding process, the upper surface of the temporary laminate 120 is heated and pressurized using the packaging head 12, thereby uniformly bonding the multiple semiconductor chips 100 constituting the temporary laminate 120. In this manufacturing configuration, the protective film 110 is simply retracted to a retracted position during the temporary bonding process, and positioned at an intermediate position between the semiconductor chip 100 to be bonded and the packaging head 12 during the formal bonding process.

[0119] Furthermore, up to this point, a configuration in which the encapsulation head 12 moves in the horizontal direction has been illustrated, but it is also possible to configure a configuration in which the engagement stage 14 moves in the horizontal direction instead of the encapsulation head 12. Figure 16This diagram illustrates an example of a packaging apparatus 10 in which the bonding stage 14 moves horizontally. In this example, the bonding stage 14 includes an XY platform 48, which allows movement in a first direction (the direction of the long side of the substrate 104) and in a second direction (the direction of the short side of the substrate 104). At this time, the control unit 20 drives the XY platform 48 to move the bonding stage 14 horizontally, so that the packaging partition 106, which is to be temporarily and permanently pressed, is located directly below the packaging head 12. Furthermore, by lowering the packaging head 12 directly downwards, the semiconductor chip 100 is temporarily or permanently pressed onto the packaging partition 106. Moreover, since the packaging head 12 only moves up and down without horizontal movement, it is ideal to provide a supply mechanism for supplying new semiconductor chips 100 in the packaging head 12. Additionally, it is ideal to have a thin film placement mechanism 18 provided on the bonding stage 14 so that it can move horizontally in conjunction with the substrate 104.

[0120] Furthermore, this description so far illustrates a pre-coating method where adhesive material 108 is pre-coated onto the encapsulation partition 106. However, the encapsulation apparatus 10 disclosed in this specification is not limited to the pre-coating method. Other bonding methods can also be applied as long as the semiconductor chip 100 is encapsulated in the encapsulated body via adhesive material 108. For example, instead of encapsulating the encapsulated body, an adhesive called a die-attach film (DAF) can be attached to the back of the semiconductor chip 100, and the DAF can be heat-cured to encapsulate the semiconductor chip 100 in the encapsulated body. In this case, by having a protective film 110 mediate between the semiconductor chip 100 and the encapsulation head 12, the intrusion of atomized gases into the encapsulation head 12 can also be effectively prevented.

Claims

1. A packaging method for encapsulating a semiconductor chip onto a substrate or other semiconductor chip serving as a packaged object via an adhesive material, the packaging method comprising: Temporary pressing process, in which the encapsulation head of the semiconductor chip is held by suction moves relative to the bonding stage on which the substrate is placed, and temporarily presses the semiconductor chip into the encapsulated body, wherein the encapsulation partition on the substrate is defined as a two-dimensional array having multiple rows and multiple columns. The formal pressing process involves formally pressing the semiconductor chip and the packaged body, which have been temporarily pressed, through a protective film positioned across the column direction and located directly above the semiconductor chip to be formally pressed. as well as In the feeding step, at the end of the multiple formal crimping processes in the column direction, the protective film is driven along the row direction by a distance at least the width of the protective film, so that the protective film is moved to a position covering the new plurality of encapsulation partitions, and the protective film is fed a distance corresponding to the column.

2. The encapsulation method according to claim 1, wherein the protective film is held by a pair of rollers disposed on a base supporting the bonding stage, and moves along the row direction by the pair of rollers during the feeding step.

3. The encapsulation method according to claim 1, wherein in the temporary pressing process, the protective film is moved to a retracted position by a pair of rollers to perform the temporary pressing process, and after the temporary pressing process, the protective film is moved to a position of the column where the temporary pressing process is completed by the pair of rollers to perform the formal pressing process on the temporarily pressed object.

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