Substrate, power device, and design method of substrate

Abstract

The application provides a substrate, a power device and a design method of the substrate, and the substrate comprises a bottom plate, at least one lining plate located on an upper surface of the bottom plate, and the lining plate comprises an upper metal layer, an insulating layer and a lower metal layer arranged in sequence from top to bottom; wherein an average thermal expansion coefficient of the bottom plate satisfies a formula: 0.5 <= <= 1.5; a target value of the average thermal expansion coefficient satisfies a formula: =; a thermal response model parameter of the i-th lining plate satisfies a formula: =. Through the technical scheme provided in the application, the problem that the warping behavior of the lining plate-bottom plate structure as a whole easily causes the interface failure between the lining plate and the bottom plate in the related art can be solved.

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