Packaging structure

Abstract

The present disclosure relates to a package structure. The package structure includes a first semiconductor component, a second semiconductor component disposed above the first semiconductor component, a plurality of alignment leads disposed on the second semiconductor component, and an encapsulant encapsulating the first semiconductor component, the second semiconductor component, and the plurality of alignment leads. The encapsulant has a top surface that exposes a top surface of the plurality of alignment leads. In a top view, the top surface of the plurality of alignment leads constitutes an alignment pattern.

Description

Technical Field

[0001] This disclosure generally relates to a packaging structure, and more specifically, to a semiconductor packaging structure that utilizes vertical leads as alignment marks. Background Technology

[0002] Vertical fan-out (VFO) configurations in package structures use wire bonding for vertical electrical connections. This structure enables vertical connections for transmitting electrical signals between the die or IC and the redistribution layer (RDL) disposed thereon. However, after grinding to form the RDL, only the wire endpoints are retained, and because the wires are of uniform size and shape, it can be difficult to accurately capture the correct position during subsequent alignment, potentially leading to misalignment. Therefore, an improved package structure is needed. Summary of the Invention

[0003] In some embodiments, a package structure includes: a first semiconductor component; a second semiconductor component disposed above the first semiconductor component; a plurality of alignment leads disposed on the second semiconductor component; and an encapsulation body encapsulating the first semiconductor component, the second semiconductor component, and the plurality of alignment leads. The encapsulation body has a top surface that exposes the top surfaces of the plurality of alignment leads. In a top view, the top surfaces of the plurality of alignment leads form an alignment pattern.

[0004] In some embodiments, a package structure includes a first die, a second die, an encapsulation body, a plurality of first conductive leads, a plurality of second conductive leads, and a plurality of first alignment leads. The first die has a first active surface, and the second die is disposed below the first die and has a second active surface. The encapsulation body encapsulates the first and second dies and has a first surface, the first surface including a first region, a second region, and an alignment region between the first and second regions. The plurality of first conductive leads are disposed on the second active surface of the second die and encapsulated by the encapsulation body, and the top surfaces of the plurality of first conductive leads are exposed in the first region of the encapsulation body. The plurality of second conductive leads are disposed on the second active surface of the second die and encapsulated by the encapsulation body, and the top surfaces of the plurality of second conductive leads are exposed in the second region of the encapsulation body. The plurality of first alignment leads extend between the first active surface of the first die and the first surface of the encapsulation body, and the top surfaces of the plurality of first alignment leads are exposed in the alignment region and form first alignment marks.

[0005] In some embodiments, a packaging structure includes an electronic component having an active surface, alignment leads disposed on the active surface, conductive leads disposed on the active surface, and an encapsulation body encapsulating the electronic component, the alignment leads, and the conductive leads. The top surfaces of the alignment leads and the conductive leads are exposed by the encapsulation body. The conductive leads are closer to the edge of the electronic component than the alignment leads. Attached Figure Description

[0006] A better understanding of the various aspects of this disclosure will be achieved by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that the features may not be drawn to scale, and their dimensions may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1 This is a cross-section of a packaging structure according to some embodiments of the present disclosure.

[0008] Figure 2A According to some embodiments of this disclosure Figure 1 An enlarged view of area "2A" in the image.

[0009] Figure 2B According to some embodiments of this disclosure Figure 1 A magnified view of area "2B" in the image.

[0010] Figure 2C According to some embodiments of this disclosure Figure 1 A magnified view of area "2C" in the image.

[0011] Figure 3 This is a top view of the packaging structure according to some embodiments of the present disclosure.

[0012] Figure 4A According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image.

[0013] Figure 4B According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image.

[0014] Figure 4C According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image.

[0015] Figure 4D According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image.

[0016] Figure 5 This is a cross-section of a packaging structure according to some embodiments of the present disclosure.

[0017] Figure 6 This is a top view of the packaging structure according to some embodiments of the present disclosure.

[0018] Figure 7A , Figure 7B , Figure 7C , Figure 7D , Figure 7E , Figure 7F and Figure 7G This describes one or more operations of a method for manufacturing a packaging structure according to some embodiments of the present disclosure.

[0019] The same or similar elements are indicated using common reference numerals throughout the drawings and detailed description. This disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation

[0020] The following disclosure provides various embodiments or instances for implementing different features of the provided subject matter. Specific instances of components and embodiments are described herein. Of course, these are merely examples and are not intended to be limiting. In this disclosure, references to the formation of a first feature over or on a second feature in the following description may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features may be formed between the first and second features such that the first and second features are not in direct contact. Reference numerals and / or letters may be repeated in various instances in this disclosure. This repetition is for the purpose of simplicity and clarity and does not in itself define the relationship between the various embodiments and / or configurations discussed.

[0021] Embodiments of this disclosure are described in detail below. However, it should be understood that this disclosure provides many applicable concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative and do not limit the scope of this disclosure.

[0022] Figure 1 This is a cross-section of a package structure 1 according to some embodiments of the present disclosure. The package structure 1 may include a substrate 10, one or more electronic components (or semiconductor components) 21, 22, 23 and 24, alignment marks 31 and 32, conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47 and 48, an encapsulation 50, a redistribution layer (RDL) 60, and one or more electrical contacts 70.

[0023] The package structure 1 may be or include memory stacks, interposers, stacked package (PoP), fan-out package, fan-out wafer-level package (FOWLP), etc.

[0024] Embodiments of this disclosure constitute a package structure that includes one or more wire bonds (e.g., alignment leads 311 and 312) as alignment marks on a die to be molded. After grinding, alignment marks arranged in a specific pattern can be easily identified, thereby enhancing alignment to form a redistribution layer thereon. Furthermore, the spacing and size of the wire bonds serving as alignment marks can differ from the spacing and size of other wire bonds for better identification. These differences enhance identification and recognition during alignment, thereby improving yield. In addition, the wire bonds can have a low aspect ratio, for example, 1:20. This characteristic is advantageous because it allows these leads to be integrated into thicker structures, thereby expanding the potential applications and versatility of the package structure. Incorporating vertical wire bonds as alignment marks not only enhances the accuracy of the alignment process but also facilitates vertical electrical connections. This approach improves the manufacturing efficiency and performance of electronic devices.

[0025] Substrate 10 may comprise, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. Substrate 10 may comprise interconnect structures, such as multiple conductive traces and / or multiple conductive vias. In some embodiments, substrate 10 comprises a ceramic material, a metal plate, an organic substrate, or a leadframe. In some embodiments, substrate 10 may comprise a bilayer substrate comprising a core layer and conductive materials and / or structures disposed on an upper surface and a bottom surface of substrate 10. The conductive materials and / or structures may comprise multiple conductive traces. Substrate 10 may comprise a top surface 101 and a bottom surface 102 opposite to the top surface 101. In some embodiments, substrate 10 includes one or more pads 10p exposed by the top surface 101 or the bottom surface 102.

[0026] Electronic components 21, 22, 23, and 24 may be disposed on the top surface 101 of substrate 10. Electronic components 21, 22, 23, and 24 may be stacked. In some embodiments, electronic component 24 may be disposed between electronic component 23 and substrate 10. Electronic component 24 may be attached to substrate 10 via adhesive layer 24h. In some embodiments, electronic component 23 may be disposed between electronic component 22 and electronic component 24. Electronic component 23 may be attached to electronic component 24 via adhesive layer 23h. In some embodiments, electronic component 22 may be disposed between electronic component 21 and electronic component 23. Electronic component 22 may be disposed between electronic component 21 and substrate 10. Electronic component 22 may be attached to electronic component 23 via adhesive layer 22h. In some embodiments, electronic component 21 may be disposed on electronic component 22. Electronic component 21 may be attached to electronic component 22 via adhesive layer 21h.

[0027] Each of electronic components 21, 22, 23, and 24 may be a chip or die, comprising a semiconductor substrate, one or more integrated circuit devices, and one or more overlay interconnect structures. The integrated circuit devices may comprise active devices such as transistors and / or passive devices such as resistors, capacitors, inductors, or combinations thereof. In some arrangements, electronic components 21, 22, 23, and 24 comprise active devices, such as ASICs, PMICs, etc. For example, electronic components 21, 22, 23, and 24 may be or comprise storage components or memories, such as dynamic random access memory (DRAM).

[0028] In some embodiments, electronic component 21 may have an active surface 211 and a back surface 212 opposite to the active surface 211. The active surface 211 may face away from the substrate 10. The back surface 212 may be attached to the active surface 221 of electronic component 22 via an adhesive layer 21h.

[0029] In some embodiments, each of electronic components 22, 23, and 24 may have active surfaces 221, 231, and 241 facing electronic component 21. Electronic components 21, 22, 23, and 24 may have different sizes (e.g., thickness and / or width). For example, the thicknesses of electronic components 21, 22, 23, and 24 may differ. In some embodiments, the lower electronic component closer to the substrate 10 may be larger. In some embodiments, electronic component 22 may be larger than electronic component 21. Electronic component 23 may be larger than electronic component 22. Electronic component 24 may be larger than electronic component 23.

[0030] refer to Figure 1 Both sides of the active surface 221 of electronic component 22 may be exposed by electronic component 21. Both sides of the active surface 231 of electronic component 23 may be exposed by electronic component 22. Both sides of the active surface 241 of electronic component 24a may be exposed by electronic component 23. Therefore, one or more conductive leads 41, 42, 43, 44, 45, 46 and 46' may be disposed in the exposed portions of active surfaces 221, 231 and 241.

[0031] In another embodiment, electronic components 21, 22, 23, and 24 may be substantially the same size. For example, electronic components 21, 22, 23, and 24 may have the same width and / or thickness. In this case, electronic components 21, 22, 23, and 24 may be staggered (not shown) such that a portion of the active surface of electronic components 22, 23, and 24 is exposed to facilitate vertical electrical connections. For example, electronic components 21 and 22 may be staggered such that an exposed portion of electronic component 22 is exposed by electronic component 21. Thus, conductive leads may be located at the exposed portions.

[0032] RDL 60 may be disposed on substrate 10 and electronic components 21, 22, 23, and 24. In some embodiments, RDL 60 includes a dielectric layer 60d and a conductive layer 60c at least partially covered by the dielectric layer 60d. The conductive layer 60c may include conductive traces, pads, and conductive vias. The conductive layer 60c may be or contain a conductive material, such as aluminum (Al), copper (Cu), chromium (Cr), tin (Sn), gold (Au), silver (Ag), nickel (Ni), stainless steel, mixtures, alloys, or other combinations thereof. In some embodiments, the width of RDL 60 may be substantially the same as the width of substrate 10.

[0033] Alignment marks 31 may be disposed on and connected to the active surface 211 of the electronic component 21. In some embodiments, alignment marks 31 may include alignment leads 311 and 312 extending between the RDL 60 and the active surface 211 of the electronic component 21. Alignment leads 311 and 312 may be disposed on and connected to a pad of the electronic component 21, respectively. In some embodiments, alignment leads 311 and 312 are connected to the same pad of the electronic component 21. A dielectric layer 60d may cover the top surface of alignment leads 311 and 312. Alignment lead 311 may be connected to a conductive layer 60c of the RDL 60 to provide a vertical electrical connection between the RDL 60 and the electronic component 21. Alignment lead 312 may be adjacent to alignment lead 311 and connected to the dielectric layer 60d of the RDL 60. In some embodiments, alignment lead 311 may be substantially parallel to alignment lead 312. In some embodiments, alignment lead 311 may be substantially identical to alignment lead 312. In some embodiments, the diameter of alignment lead 311 may be substantially the same as the diameter of alignment lead 312.

[0034] Similarly, alignment marks 32 may be disposed on and connected to the active surface 211 of the electronic component 21. Alignment marks 32 may be spaced apart from alignment marks 31. In some embodiments, alignment marks 31 and 32 may be disposed on opposite sides of the electronic component 21. For example, alignment marks 31 and 32 may be disposed adjacent to opposite edges of the electronic component 21 such that the boundary of the electronic component 21 is identifiable when the RDL 60 is formed. In some embodiments, alignment marks 31 and 32 may be disposed at corners of the electronic component 21.

[0035] In some embodiments, alignment marks 32 may include one or more alignment leads 321 extending between the RDL 60 and the active surface 211 of the electronic component 21. Alignment leads 321 may be disposed on and connected to a pad of the electronic component 21. A dielectric layer 60d may cover the top surface of the alignment leads 321. Alignment leads 321 may be electrically connected to one of the conductive layers 60c of the RDL 60. In other embodiments, alignment leads 321 may be connected to the dielectric layer 60d of the RDL 60. In some embodiments, alignment leads 321 may be substantially parallel to alignment leads 311 and / or 312. In some embodiments, alignment leads 321 may be substantially the same as alignment leads 311. In some embodiments, the diameter of alignment leads 321 may be substantially the same as the diameter of alignment leads 311. In other embodiments, the diameter of alignment leads 321 may be different from the diameter of alignment leads 311.

[0036] In some embodiments, alignment leads 311, 312, and 321 may be formed by vertical wire bonding. Alignment leads 311, 312, and 321 may be or contain conductive pillars or other suitable conductive interconnects. Alignment leads 311, 312, and 321 may be or contain conductive materials, such as copper (Cu), aluminum (Al), chromium (Cr), tin (Sn), gold (Au), silver (Ag), nickel (Ni), platinum (Pt), mixtures, alloys, or other combinations thereof.

[0037] Conductive lead 40 may be connected to the active surface 211 of electronic component 21. Conductive lead 40 may be connected to a pad (not shown) of electronic component 21. In some embodiments, conductive lead 40 may extend between RDL 60 and the active surface 211 of electronic component 21. Conductive lead 40 may be electrically connected to one of the conductive layers 60c of RDL 60. Conductive lead 40 may be spaced apart from alignment lead 311. Alignment mark 31 may be disposed between alignment mark 32 and conductive lead 40. Conductive lead 40 is closer to the edge of electronic component 21 than alignment lead 311. In some embodiments, conductive lead 40 is electrically connected to the active surface 211 of electronic component 21. In some embodiments, conductive lead 40 may be substantially the same as alignment leads 311, 312, and 321. The diameter of conductive lead 40 may be different from the diameter of alignment leads 311, 312, and 321. For example, the diameter of conductive lead 40 may be smaller than the diameter of alignment lead 311. In some embodiments, the diameter of the conductive lead 40 may be about 18 to 25 μm. The diameter of the alignment lead 311 may be about 18 to 60 μm, preferably 40 to 60 μm.

[0038] Conductive leads 41 and 42 may be disposed on opposite sides of the active surface 221 of the electronic component 22 exposed by the electronic component 21. Conductive leads 41 and 42 may extend between the RDL 60 and the active surface 221. Conductive leads 41 and 42 may be connected to a pad (not shown) of the electronic component 22. Conductive leads 41 and 42 may be electrically connected to one of the conductive layers 60c of the RDL 60.

[0039] The conductive lead 41 may be spaced apart from the alignment lead 311 by a certain distance. The conductive lead 41 may be spaced apart from the conductive lead 40. The conductive lead 40 may be placed between the alignment mark 31 and the conductive lead 41.

[0040] Conductive lead 42 may be spaced apart from alignment lead 321 by a certain distance. Alignment mark 31 may be placed between conductive leads 41 and 42. That is, alignment leads 311 and 312 may be placed between conductive leads 41 and 42. Conductive lead 42 may be close to the edge of electronic component 22.

[0041] In some embodiments, the lengths of conductive leads 41 and 42 may differ from the lengths of alignment leads 311, 312, and 321 and conductive lead 40. For example, the lengths of conductive leads 41 and 42 may be greater than the lengths of alignment leads 311, 312, and 321 and conductive lead 40. In some embodiments, the bottom end of alignment lead 311 may be closer to the top surface 501 (i.e., the polished surface) of the encapsulation 50 than the bottom ends of conductive leads 41 and 42. The diameters of conductive leads 41 and 42 may be substantially the same as the diameter of conductive lead 40.

[0042] Conductive leads 43 and 44 may be disposed on opposite sides of the active surface 231 of the electronic component 23 exposed by the electronic component 22. Conductive leads 43 and 44 may extend between the RDL 60 and the active surface 231. Conductive leads 43 and 44 may be disposed on and connected to a pad (not shown) of the electronic component 23. Conductive leads 43 and 44 may be electrically connected to one of the conductive layers 60c of the RDL 60.

[0043] Conductive lead 43 may be spaced apart from conductive lead 41 by a certain distance. Conductive lead 41 may be positioned between alignment lead 311 and conductive lead 43. Conductive lead 43 may be close to the edge of electronic component 23. Conductive lead 44 may be spaced apart from conductive lead 42 by a certain distance. Conductive lead 42 may be positioned between alignment lead 321 and conductive lead 44. Conductive lead 44 may be close to the edge of electronic component 23.

[0044] In some embodiments, the lengths of conductive leads 43 and 44 may differ from the lengths of alignment leads 311, 312, and 321, and conductive leads 40, 41, and 42. For example, the lengths of conductive leads 43 and 44 may be greater than the lengths of alignment leads 311, 312, and 321, and conductive leads 40, 41, and 42. Conductive leads 43 and 44 may be longer than conductive leads 41 and 42. The diameters of conductive leads 43 and 44 may be substantially the same as the diameter of conductive lead 40.

[0045] Conductive leads 45 may be disposed on one side of the active surface 241 of the electronic component 24 exposed by the electronic component 23, and conductive leads 46 and 46' may be disposed on the opposite side of the active surface 241 of the electronic component 24 exposed by the electronic component 23. Conductive leads 45, 46, and 46' may extend between the RDL 60 and the active surface 241. Conductive leads 45, 46, and 46' may be disposed on and connected to a pad (not shown) of the electronic component 24. Conductive lead 45 may be electrically connected to one of the conductive layers 60c of the RDL 60. Conductive lead 46 may be electrically connected to one of the conductive layers 60c of the RDL 60. Conductive lead 46' may be electrically connected to one of the conductive layers 60c of the RDL 60.

[0046] Conductive lead 45 may be spaced apart from conductive lead 43 by a certain distance. Conductive lead 43 may be positioned between conductive lead 41 and conductive lead 45. Conductive lead 45 may be close to the edge of electronic component 24. Conductive lead 46 may be spaced apart from conductive lead 44 by a certain distance. Conductive lead 44 may be positioned between conductive lead 42 and conductive lead 46. Conductive lead 46 may be close to the edge of electronic component 24. Conductive lead 46' may be spaced apart from conductive lead 46 by a certain distance. Conductive lead 46 may be positioned between conductive lead 44 and conductive lead 46'. Conductive lead 46' may be close to the edge of electronic component 24. Conductive lead 46' is closer to the edge of electronic component 24 than conductive lead 46.

[0047] In some embodiments, the lengths of conductive leads 45, 46, and 46' may differ from the lengths of alignment leads 311, 312, and 321 and conductive leads 40 to 44. For example, the lengths of conductive leads 45, 46, and 46' may be greater than the lengths of alignment leads 311, 312, and 321 and conductive leads 40 to 44. Conductive leads 45, 46, and 46' may be longer than conductive leads 43 and 44. The diameters of conductive leads 45, 46, and 46' may be substantially the same as the diameter of conductive lead 40.

[0048] Conductive leads 47 and 48 may be disposed on opposite sides of the top surface 101 of the substrate 10. Conductive leads 47 and 48 may extend between the RDL 60 and the top surface 101 of the substrate 10. Conductive leads 47 and 48 may be electrically connected to the pad 10p of the substrate 10. Conductive leads 47 and 48 may be electrically connected to one of the conductive layers 60c of the RDL 60.

[0049] Conductive lead 47 may be spaced apart from conductive lead 45 by a certain distance. Conductive lead 45 may be placed between conductive lead 43 and conductive lead 47. Conductive lead 48 may be spaced apart from conductive lead 46' by a certain distance. Conductive lead 46' may be placed between conductive lead 46 and conductive lead 48.

[0050] In some embodiments, the lengths of conductive leads 47 and 48 may differ from the lengths of alignment leads 311, 312, and 321 and conductive leads 40 to 46'. For example, the lengths of conductive leads 47 and 48 may be greater than the lengths of alignment leads 311, 312, and 321 and conductive leads 40 to 46'. Conductive leads 47 and 48 may be longer than conductive leads 45, 46, and 46'. The diameters of conductive leads 47 and 48 may be substantially the same as the diameter of conductive lead 40.

[0051] Conductive leads 40 to 48 may be disposed above the top surface 101 of the substrate 10 and connected to the RDL 60. Conductive leads 40 to 48 may be formed by vertical wire bonding. In some embodiments, conductive leads 40 to 48 may have the same diameter. Conductive leads 40 to 48 may be or comprise conductive pillars or other suitable conductive interconnects. Conductive leads 40 to 48 may be or comprise conductive materials, such as copper (Cu), aluminum (Al), chromium (Cr), tin (Sn), gold (Au), silver (Ag), nickel (Ni), platinum (Pt), mixtures, alloys, or other combinations thereof. Because conductive leads 40 to 48 can be connected to different electronic components, the lengths of these conductive leads may vary accordingly.

[0052] Encapsulation 50 encapsulates electronic components 21, 22, 23, and 24, alignment leads 311, 312, and 321, and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48. In some embodiments, the top surfaces / ends of alignment leads 311, 312, and 321 and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48 may be exposed by the top surface 501 of encapsulation 50. Encapsulation 50 may expose the ends (terminals) of alignment leads 311, 312, and 321 for process identification and positioning. Since alignment leads 311, 312, and 321 are formed by wire bonding, the encapsulation structure 1 may be located within the pad of electronic component 21 (see...). Figure 2A and 2BThere is no seed layer between the conductive leads 40 to 48 and the alignment leads 311, 312, or 321. Similarly, since the conductive leads 40 to 48 are formed by wire bonding, there is no seed layer between the conductive leads 40 to 48 and the pads to which they are attached in the package structure 1. Furthermore, the wire bonding technology provides alignment leads 311, 312, and 321 with a low aspect ratio (e.g., a ratio of 1:20), which allows these leads to be integrated into thicker structures. The encapsulation 50 may have a top surface 501 that is substantially coplanar with the ends of the alignment leads 311, 312, and 321. After performing a polishing process on the encapsulation to form a flat top surface 501, the RDL 60 may be placed over the top surface 501 (polished surface) of the encapsulation 50.

[0053] In some embodiments, the encapsulation 50 may comprise an epoxy resin in which fillers are dispersed, a molding material (e.g., epoxy molding material or other molding material), PI, a phenolic compound or material, a polymeric material in which silicone is dispersed, or a combination thereof.

[0054] In some embodiments, the electrical contact 70 may be disposed on the conductive layer 60c of the RDL 60. The electrical contact 70 may be disposed on the side of the RDL 60 opposite to the encapsulation 50. The electrical contact 70 may include conductive bumps, solder elements, solder balls, etc.

[0055] This disclosure provides a package structure 1 incorporating one or more wire bonding elements, such as alignment leads 311 and 312 acting as alignment marks. These alignment marks, arranged in a specific pattern, can be easily identified by a machine after a polishing process, thereby improving the alignment required to form a redistribution layer. Furthermore, the spacing and size of the wire bonds used as alignment marks can differ from the spacing and size of other wire bonds for better identification. In current practice, conductive elements for vertical connections are typically formed by electroplating processes, which require long process times and are costly. Wire bonding technology can shorten process time and reduce manufacturing costs. Using vertical wire bonds as alignment marks not only improves the accuracy of the alignment process but also facilitates the establishment of vertical electrical connections. Furthermore, this provides a more efficient manufacturing process and enhances the performance of semiconductor devices.

[0056] Figure 2A According to some embodiments of this disclosure Figure 1 A magnified view of area "2A" in the image. (Reference) Figure 2AAlignment leads 311 and 312 may not be perpendicular to the active surface 211 of the electronic component 21 (or the top surface 101 of the substrate 10). Alignment leads 311 and 312 may be straight and inclined or skewed. In some embodiments, alignment lead 312 may be inclined or skewed in a different direction than alignment lead 311. Alignment leads 311 and 312 may be skewed in different directions with the same degree of skew (angle). In some embodiments, conductive lead 40 may be straight and substantially parallel to alignment lead 311. Conductive lead 40 may be inclined or skewed in the same direction as alignment lead 311. Conductive lead 40 and alignment leads 311 and 312 may be formed in the same process. In another embodiment, conductive lead 40 and alignment leads 311 and 312 may all be inclined in the same direction. Conductive lead 40 and alignment leads 311 and 312 may have the same length / height. In some embodiments, conductive lead 40 may include a row of conductive leads formed in the same process and thus tilted or skewed in the same direction.

[0057] Alignment lead 311 may have a body 311b and a tail 311t connected to the body 311b. The body 311b of alignment lead 311 may be attached to a conductive pad 21p of active surface 211. In some embodiments, the conductive pad 21p may be covered by an encapsulation 50. The width w1 of the body 311b may be greater than the width w2 of the tail 311t. The body 311b may be circular, such as spherical or round. The tail 311t may be a cylindrical column, cylinder, etc. In some embodiments, the diameter w1 of the body 311b may be greater than the diameter w2 of the tail 311t. Alignment lead 312 may have a body 312b and a tail 312t connected to the body 311b, and includes a structure similar to that of alignment lead 311.

[0058] Similar to alignment lead 311, conductive lead 40 may have a body 40b and a tail 40t connected to the body 40b. The body 40b of conductive lead 40 may be attached to a conductive pad 21p of active surface 211. The width w3 of body 40b may be greater than the width w4 of tail 40t. In some embodiments, the diameter (i.e., width w3) of body 40b may be greater than the diameter (i.e., width w4) of tail 40t. In some embodiments, the width w3 of body 40b may be different from the width w1 of body 311b. For example, width w3 may be smaller than width w1. In some embodiments, the diameter w4 of body 40b may be different from the diameter w2 of tail 40t. For example, diameter w4 may be smaller than diameter w2.

[0059] Figure 2B According to some embodiments of this disclosure Figure 1 A magnified view of area "2B" in the image. (Reference) Figure 2BAlignment lead 321 may not be perpendicular to the active surface 211 of electronic component 21 (or the top surface 101 of substrate 10). Alignment lead 321 may be straight and tilted or deflected in a direction different from alignment lead 312. Alignment lead 321 may be tilted or deflected in the same direction as alignment lead 311.

[0060] In some embodiments, the conductive lead 42 may be electrically connected to the conductive pad 22p of the electronic component 22. In some embodiments, the conductive lead 42 may be tilted or deflected in the same direction as the alignment lead 321 but at a different tilt angle (i.e., skewness). For example, the skewness of the alignment lead 321 is less than the skewness of the conductive lead 42. The conductive lead 42 may be longer than the alignment lead 321. In other embodiments, the conductive lead 42 may be tilted or deflected in a different direction than the alignment lead 321. The first angle formed by the alignment lead 321 and the top surface 501 is closer to 90° than the second angle formed by the conductive lead 42 and the top surface 501. That is, the first angle is more perpendicular to or orthogonal to the top surface 501 than the second angle.

[0061] In some embodiments, conductive lead 44 may be electrically connected to conductive pad 23p of electronic component 23. In some embodiments, conductive lead 44 may be tilted or deflected in the same direction as conductive lead 42 but at a different tilt angle (i.e., skewness). For example, the skewness of conductive lead 42 is less than the skewness of conductive lead 44. Conductive lead 44 may be longer than conductive lead 42. In other embodiments, conductive lead 44 may be tilted or deflected in a different direction than conductive lead 42. The second angle formed by conductive lead 42 and top surface 501 is closer to 90° than the third angle formed by conductive lead 44 and top surface 501. That is, the second angle is more perpendicular or orthogonal to top surface 501 than the third angle.

[0062] In some embodiments, conductive leads 46, 46' are connected to the conductive pad 24p of the electronic component 24. Conductive lead 46 may be tilted or deflected in the same direction as alignment lead 321 and conductive leads 42 and 44, but at different tilt angles (i.e., skewness). Conductive lead 46 may be longer than alignment lead 321 and conductive leads 42 and 44. That is, alignment lead 321, conductive leads 42, 44, and 46 may be tilted or deflected in the same direction but at different tilt angles (i.e., skewness). In some embodiments, the longer conductive lead may have a greater skewness. The third angle formed by conductive lead 44 and top surface 501 is closer to 90° than the fourth angle formed by conductive lead 46 and top surface 501. That is, the third angle is more perpendicular or orthogonal to top surface 501 than the fourth angle.

[0063] Conductive lead 46' may be tilted or deflected in a different direction and at a different angle (i.e., skew) than aligned lead 321. The length of conductive lead 46' may be the same as that of conductive lead 46. Conductive leads 46 and 46' may be tilted or deflected in different directions and at the same angle (i.e., skew).

[0064] Similar to alignment lead 311, alignment lead 321 may have a body 321b and a tail 321t connected thereto. The body 321b of alignment lead 321 may be attached to the conductive pad 21p of electronic component 21.

[0065] Similar to conductive lead 40, conductive lead 42 may have a body 42b and a tail 42t connected to the body 42b. The body 42b of conductive lead 42 may be attached to the conductive pad 22p of electronic component 22. Similar to conductive lead 40, conductive lead 44 may have a body 44b and a tail 44t connected to the body 44b. The body 44b of conductive lead 44 may be attached to the conductive pad 23p of electronic component 23. Similar to conductive lead 40, conductive lead 46 may have a body 46b and a tail 46t connected to the body 46b. The body 46b of conductive lead 46 may be attached to the conductive pad 24p of electronic component 24. Similar to conductive lead 46, conductive lead 46' may have a body 46'b and a tail 46't connected to the body 46'b. The body 46'b of conductive lead 46' may be attached to the conductive pad 24p of electronic component 24.

[0066] In some embodiments, the widths of the bodies 42b, 44b, 46b, and 46'b may differ from the width of the body 321b. For example, the diameters of the bodies 44b, 46b, and 46'b may be smaller than the diameter of the body 321b. In some embodiments, the diameters of the tails 42t, 44t, 46t, and 46't may differ from the diameter of the tail 321t. For example, the diameters of the tails 42t, 44t, 46t, and 46't may be smaller than the diameter of the tail 321t.

[0067] Figure 2C According to some embodiments of this disclosure Figure 1 A magnified view of area "2C" in the image. (Reference) Figure 2C The encapsulation 50 may contain various fillers, and the RDL 60 may have a curved side surface 601. In some embodiments, the side surface 601 of the RDL 60 may be recessed from the side surface of the encapsulation 50. That is, the width of the RDL 60 may be smaller than the width of the encapsulation 50.

[0068] Each filler in the encapsulation 50 may have a different filler size. In some embodiments, the filler may contact the conductive lead 47 and be covered by the dielectric layer 60d. The encapsulation 50 may include fillers 511, 512, and 513. In some embodiments, filler 511 is incomplete because a portion is removed by a grinding process. The removed portion of filler 511 may be less than 50% of the original amount. The top surface of filler 511 is formed to be substantially flat by a grinding process. Similar to filler 511, filler 512 is also incomplete. The removed portion of filler 512 may be greater than or equal to 50% of the original amount. The top surface of filler 512 is formed to be substantially flat by a grinding process. In some embodiments, filler 513 may have a relatively large diameter. For example, the diameter of filler 513 may be equal to or greater than the thickness of one dielectric layer 60d.

[0069] In some embodiments, the encapsulation 50 may have one or more recesses 521 recessed from the top surface 501, since some of the filler may be completely removed in a polishing process. A portion of the dielectric layer 60d may fill the recesses 521. Thus, a portion of the dielectric layer 60d may laterally (or horizontally) overlap with the conductive leads 47 (or alignment marks 31 and 32).

[0070] Figure 3 This is a top view of the packaging structure 1 according to some embodiments of the present disclosure. Figure 1 It is the packaging structure 1 along Figure 3 The cross-section of line A-A'. For clarity, Figure 3 RDL 60 and electrical contact 70 are omitted. (See reference.) Figure 3 The package structure 1 may include one or more alignment marks 31, 32, 33 and 34 and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47 and 48. That is to say, Figure 3 It is a perspective view of alignment marks 31, 32, 33 and 34 and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47 and 48 exposed by the top surface 501 of the encapsulation 50.

[0071] In some embodiments, the top surface 501 may include an alignment region A1 and two electrical connection regions E1 and E2. Alignment region A1 is surrounded by and adjacent to electrical connection regions E1 and E2. Alignment region A1 lies between electrical connection regions E1 and E2. Electrical connection regions E1 or E2 are closer to a corner of the encapsulation 50 than alignment region A1. Alignment marks 31, 32, 33, and 34 may be disposed in alignment region A1. The top surfaces of alignment marks 31, 32, 33, and 34 may be present in alignment region A1. In some embodiments, alignment marks 32 and 33 may be near a corner of electrical connection region E1, and alignment marks 31 and 34 may be near a corner of electrical connection region E2. Conductive leads 42, 44, 46, 46', and 48 are disposed in electrical connection region E1. The top surfaces of conductive leads 42, 44, 46, 46', and 48 may be present in electrical connection region E1. Conductive leads 40, 41, 43, 45, and 47 are disposed in the electrical connection region E2. The top surfaces of conductive leads 40, 41, 43, 45, and 47 may exist in the electrical connection region E2.

[0072] The top surfaces / ends of conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48 may define or form a conductive pattern, which may be geometrically different from the alignment pattern (i.e., alignment marks 31, 32, 33, and 34). For example, conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48 may be arranged in rows or arrays. In some embodiments, conductive leads 40, 41, 43, 45, and 47 may be five parallel rows. Conductive leads 42, 44, 46, 46', and 48 may be five parallel rows. Conductive leads 40, 41, 43, 45, and 47 may be disposed on one side of package structure 1, and conductive leads 42, 44, 46, 46', and 48 may be disposed on the other side of package structure 1. In some embodiments, conductive leads 40 and 42 may be two parallel rows on opposite sides of alignment marks 31, 32, 33 and 34 (i.e., electronic component 21).

[0073] In some embodiments, conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48 may have a spacing P1 between any two adjacent leads, which may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 40 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 41 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 43 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 45 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 47 may be spaced apart by a spacing P1 along the Y-axis. Adjacent rows of conductive leads (e.g., conductive leads 40 and 41) may be spaced apart by a spacing P1 along the X-axis. Adjacent leads 42 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 44 may be spaced apart by a spacing P1 along the Y-axis. Adjacent leads 46 may be spaced apart by a spacing P1 along the Y-axis. Two adjacent conductive leads 46' may be spaced apart by a distance P1 along the Y-axis. Two adjacent conductive leads 48 may be spaced apart by a distance P1 along the Y-axis. Two adjacent conductive leads 42 and 44 may be spaced apart by a distance P1 along the X-axis.

[0074] In some embodiments, alignment marks 31, 32, 33, and 34 may be disposed between conductive leads 41 and 42. Alignment marks 31, 32, 33, and 34 may be disposed above the active surface (not shown) of electronic component 21. Alignment marks 31, 32, 33, and 34 may be geometrically different from conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48. Alignment marks 31, 32, 33, and 34 may be spaced apart from each other. Alignment marks 31, 32, 33, and 34 may be disposed at corners of electronic component 21. Each of alignment marks 31, 32, 33, and 34 may include a predetermined pattern defined by a plurality of alignment leads. In particular, the top surface / end of the alignment leads of alignment marks 31, 32, 33, and 34 may define or form an alignment pattern. The predetermined pattern may include a cross, L-shape, stepped shape, triangle, rectangle, or other suitable shape. In some embodiments, alignment marks 31, 32, 33 and 34 may include at least three alignment leads.

[0075] Alignment marks 31 may include six alignment leads 311, 312, 313, 314, 315, and 316, which cooperatively define a pattern (alignment pattern), such as a stepped pattern. In some embodiments, alignment leads 311, 312, and 313 may define an alignment pattern, such as an L-shape. Alignment lead 312 may be spaced apart from alignment lead 311 along the X-axis, and alignment lead 313 may be spaced apart from alignment lead 311 along the Y-axis. In some embodiments, alignment leads 311, 313, and 314 may be arranged in a straight line as a first row. Alignment leads 312 and 315 may be arranged in a straight line as a second row adjacent to the first row. Alignment lead 316 may be arranged as a third row adjacent to the second row. Imaginary lines of alignment leads 311, 313, and 314 may intersect with imaginary lines of alignment leads 314, 315, and 316.

[0076] Two adjacent leads along the X-axis or Y-axis of alignment leads 311, 312, 313, 314, 315, and 316 may have a spacing P2. For example, alignment leads 311 and 312 may be spaced apart by a spacing P2. Alignment leads 311 and 313 may be spaced apart by a spacing P2. In some embodiments, the spacing P1 between two adjacent leads in conductive leads 40 to 48 may be the same as the spacing P2 between two adjacent leads in alignment leads 311 to 316.

[0077] In some embodiments, the diameters of the alignment leads 311 to 316 of the alignment mark 31 may differ from the diameters of the conductive leads 40 to 48. The diameters of the alignment leads 311 to 316 of the alignment mark 31 may be larger than the diameters of the conductive leads 40 to 48. For example, the diameters of the alignment leads 311 to 316 may be 1.1 times, 1.2 times, 1.5 times, 1.8 times, or twice or more the diameters of the conductive leads 40 to 48. In another embodiment, the diameters of the alignment leads 311 to 316 of the alignment mark 31 may be substantially the same as the diameters of the conductive leads 40 to 48.

[0078] Some of the alignment leads 311, 312, 313, 314, 315, and 316 are electrically connected to the conductive layer 60c of the RDL 60, and the other alignment leads are electrically connected to the dielectric layer 60d. That is, some of the alignment leads can simultaneously serve as alignment marks and vertical conductive leads for electrical connections, while some alignment leads can serve only as alignment marks. In some cases, all alignment leads of alignment mark 31 can be connected to the dielectric layer 60d (for alignment only). Therefore, alignment mark 31 can be flexible to provide electrical connections.

[0079] Alignment mark 32 may include five (5) alignment leads 321, 322, 323, 324, and 325, which cooperate to define a pattern (alignment pattern), such as an L-shape. Alignment leads 322 and 323 may be spaced apart from alignment lead 321 along the Y-axis. In some embodiments, alignment leads 321, 322, and 323 may be arranged in a straight line along the Y-axis as a first row. Alignment leads 323, 324, and 325 may be arranged in a straight line along the X-axis as a second row. The second row may be perpendicular to and intersect the first row to form an L-shape.

[0080] In some embodiments, two adjacent leads of alignment leads 321, 322, 323, 324, and 325 along the X-axis or Y-axis may have a spacing P2 that is substantially the same as the spacing P1. For example, alignment leads 321 and 322 may be spaced apart by spacing P2. In another embodiment, spacing P2 may be different from (e.g., smaller than) spacing P1. In some embodiments, the diameters of alignment leads 321 to 325 of alignment mark 32 may be different from the diameters of conductive leads 40 to 48. The diameters of alignment leads 321 to 325 of alignment mark 32 may be larger than the diameters of conductive leads 40 to 48. For example, the diameters of alignment leads 321 to 325 may be 1.2 times, 1.5 times, 1.8 times, or twice or more the diameters of conductive leads 40 to 48. In some embodiments, the diameters of alignment leads 321 to 325 may be larger than the diameters of alignment leads 311 to 316.

[0081] Alignment mark 33 may include five (5) alignment leads 331, 332, 333, 334, and 335, which cooperate to define a pattern (alignment pattern), such as a cross. Alignment lead 331 may be surrounded by alignment leads 332, 333, 334, and 335. Alignment leads 332 and 334 may be spaced apart from alignment lead 331 along the Y-axis. Alignment leads 333 and 335 may be spaced apart from alignment lead 331 along the X-axis. In some embodiments, alignment leads 331, 332, and 334 may be arranged in a straight line along the Y-axis as a first row. In some embodiments, alignment leads 331, 333, and 335 may be arranged in a straight line along the X-axis as a second row, wherein the second row may be perpendicular to and intersect the first row to form a cross.

[0082] In some embodiments, two adjacent leads along the X-axis or Y-axis among alignment leads 331, 332, 333, 334, and 335 may have a spacing P3 different from the spacing P1. For example, spacing P3 may be smaller than spacing P1. Spacing P3 may be smaller than spacing P2. In some embodiments, alignment leads 331 and 333 may be spaced apart by spacing P3. In some embodiments, conductive leads 40 to 48 may be misaligned with alignment leads 331 to 335 of alignment mark 33. For example, refer to Figure 3An imaginary line L1 extending along the X-axis connects the centers of conductive leads 42, 44, 46, 46' and 48, while line L1 does not pass through the center of aligned lead 334.

[0083] In some embodiments, the diameter of the alignment leads 331 to 335 of the alignment mark 33 may be different from the diameter of the conductive leads 40 to 48. The diameter of the alignment leads 331 to 335 of the alignment mark 33 may be larger than the diameter of the conductive leads 40 to 48. For example, the diameter of the alignment leads 331 to 335 may be 1.2 times, 1.5 times, 1.8 times, or twice or more the diameter of the conductive leads 40 to 48.

[0084] In some embodiments, alignment mark 33 may be spaced apart from conductive lead 42 by a distance or gap region CLR. That is, the gap region CLR is between alignment leads 331 to 335 and conductive lead 42. In some embodiments, the width of the gap region CLR (along the X-axis) may be greater than the diameter of the top surface of the alignment lead of alignment mark 33. Having a gap region CLR between the conductive lead (e.g., conductive lead 42) and the alignment mark (e.g., alignment mark 33) facilitates the identification of the alignment mark. In some embodiments, the gap region CLR may be arranged between any alignment mark and conductive lead.

[0085] Alignment marks 34 may include eight alignment leads 341, 342, 343, 344, 345, 346, 347, and 348, which cooperatively define a pattern (alignment pattern), such as a rectangle. In some embodiments, alignment leads 341, 342, and 343 may be arranged in a straight line along the X-axis as a first row. Alignment leads 343, 345, and 348 may be arranged in a straight line along the Y-axis as a second row, wherein the second row may be perpendicular to and intersect the first row. Alignment leads 346, 347, and 348 may be arranged in a straight line along the X-axis as a third row, wherein the third row may be perpendicular to and intersect the second row. Alignment leads 341, 344, and 346 may be arranged in a straight line along the Y-axis as a fourth row, wherein the fourth row may be perpendicular to and intersect the first and third rows.

[0086] In some embodiments, two adjacent leads along the X-axis or Y-axis among alignment leads 341, 342, 343, 344, 345, 346, 347, and 348 may have a spacing P4 different from the spacing P1. For example, the spacing P4 may be smaller than the spacing P1. The spacing P4 may be smaller than the spacing P3. In some embodiments, alignment leads 341 and 342 may be spaced apart by the spacing P4. In some embodiments, conductive leads 40 to 48 may be misaligned with alignment leads 341 to 348 of alignment mark 34.

[0087] In some embodiments, the diameter of the alignment leads 341 to 348 of the alignment mark 34 may be different from the diameter of the conductive leads 40 to 48. The diameter of the alignment leads 341 to 348 of the alignment mark 34 may be smaller than the diameter of the conductive leads 40 to 48. For example, the diameter of the alignment leads 341 to 345 may be 0.9 times, 0.7 times, or 0.5 times or less the diameter of the conductive leads 40 to 48.

[0088] Similar to alignment mark 31, alignment marks 32, 33, and 34 may have leads that simultaneously provide alignment and electrical connection between electronic component 21 and RDL 60. The exposed ends (top surfaces) of the alignment leads of alignment marks 31, 32, 33, and 34 may be configured to indicate the position (or boundary) of electronic component 21 encapsulated by encapsulation 50 during the manufacture of RDL 60 for process identification and positioning. Alignment marks may be easily identifiable and also provide a specific patterned arrangement for electrical connection. Furthermore, the alignment leads and conductive leads of the alignment marks may have different spacing and / or different diameters, allowing the alignment marks to be easily distinguished from the conductive leads to identify the boundaries of the molded electronic component. Additionally, alignment marks may include a gap region CLR between the alignment leads and the conductive leads for better identification.

[0089] Figure 3 Several embodiments of alignment patterns are provided. In some embodiments, the alignment marks of package structure 1 may be the same pattern. Alternatively, the alignment marks of package structure 1 may be different for a specific purpose (e.g., positioning of critical components).

[0090] Figure 4A According to some embodiments of this disclosure Figure 3 A magnified view of area "4" in the image. (Reference) Figure 4A Conductive leads 40 and 41, and alignment leads 311 to 316, may be elliptical. In some embodiments, alignment lead 311 may have substantially the same shape as conductive lead 40. Alignment leads 311 to 316 may extend along the same orientation. Conductive leads 40 and 41 may be parallel. In some embodiments, the major axis of alignment leads 311 to 316 and conductive leads 40 and 41 may be parallel to the X-axis. Each of alignment leads 311 to 316 may be aligned along the X-axis with one of conductive leads 40 and 41.

[0091] In some embodiments, the size of the alignment leads 311 to 316 of the alignment mark 31 may differ from the size of the conductive leads 40 and 41. The size of the alignment leads 311 to 316 of the alignment mark 31 may be larger than the size of the conductive leads 40 to 48. For example, the width of the alignment leads 311 to 316 may be 1.1 times, 1.2 times, 1.5 times, 1.8 times, or twice or more the width of the conductive leads 40 to 48. In another embodiment, the size of the alignment leads 311 to 316 of the alignment mark 31 may be substantially the same as the size of the conductive leads 40 to 48.

[0092] Figure 4B According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image. Figure 4B Similar to Figure 4A The difference lies in the shape of the conductive leads 40 and 41, and the alignment leads 311 to 316. (See reference) Figure 4B The conductive leads 40 and 41 and the alignment leads 311 to 316 may be irregularly circular, such as teardrop-shaped.

[0093] Figure 4C According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image. Figure 4C Similar to Figure 4A The difference lies in the orientation and size of the conductive leads 40 and 41 and the alignment leads 311 to 316.

[0094] refer to Figure 4C The alignment leads located inside (i.e., near the center of electronic component 21) may have a larger area on their top surface. That is, the area of ​​alignment lead 316 (in the first row) may be larger than the area of ​​alignment leads 311 to 315. The areas of alignment leads 312 and 315 (in the second row) may be larger than the areas of alignment leads 311, 313 and 314 (in the third row).

[0095] Furthermore, the orientation of alignment leads 311 to 316 can vary. In some embodiments, each vertical row of alignment leads can be oriented in different directions, while alignment leads in the same row can have the same orientation. That is, alignment leads 312 and 315 can have the same orientation, and alignment leads 311, 313, and 314 can have the same orientation. Alignment leads 316 in the first row and alignment leads 312 and 315 in the second row can be oriented in different directions. In other words, the major axes of alignment leads 312 and 315 in the second row extend in a direction different from the major axis of alignment lead 316 in the first row. Alignment leads 311, 313, and 314 in the third row and alignment leads 312 and 315 in the second row can be oriented in different directions. In other words, the major axes of alignment leads 312 and 315 in the second row extend in a direction different from the major axes of alignment leads 311, 313, and 314 in the third row.

[0096] Similar to alignment leads, conductive leads located internally (i.e., near the center of electronic component 21) may have a larger area on their top surface. That is, the area of ​​conductive lead 40 may be larger than the area of ​​conductive lead 41. Furthermore, the orientation of conductive leads 40 and 41 may vary. In some embodiments, each vertical row of conductive leads 40 and 41 may be oriented in different directions, while conductive leads in the same row may have the same orientation. Conductive leads 40 may have the same orientation. Conductive leads 41 may have the same orientation. Conductive leads 40 may be oriented differently from conductive leads 41.

[0097] Figure 4D According to some embodiments of this disclosure Figure 3 A magnified view of region "4" in the image. Figure 4D Similar to Figure 4C The difference lies in the shape of the conductive leads 40 and 41, and the alignment leads 311 to 316. (See reference) Figure 4D The conductive leads 40 and 41 and the alignment leads 311 to 316 may be irregularly circular, such as teardrop-shaped.

[0098] Figure 5 This is a cross-section of the packaging structure 3 according to some embodiments of the present disclosure. The packaging structure 3 is similar to... Figure 1 The package structure 1 differs from the package structure 1 in the arrangement of electronic components and conductive leads, as well as the inclusion of additional components. Package structure 3 may include a substrate 10, electronic components 21 and 80, alignment marks 31 and 32, conductive leads 41, 42, 43 and 44, an encapsulation 50, a redistribution layer (RDL) 60, and a carrier 90. Compared to package structure 1, package structure 3 includes only one electronic component 21 encapsulated by the encapsulation 50, additional electronic components 80 connected to the electronic component via the RDL 60, and a carrier 90 supporting the substrate 10.

[0099] refer to Figure 5 The carrier 90 may be disposed below the bottom surface 102 of the substrate 10. The carrier 90 may comprise, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. The carrier 90 may include interconnect structures, such as multiple conductive traces and / or multiple conductive vias. In some embodiments, the carrier 90 comprises a ceramic material, a metal plate, an organic substrate, or a lead frame. In some embodiments, the carrier 90 may comprise a bilayer substrate comprising a core layer and conductive materials and / or structures disposed on the upper and bottom surfaces of the carrier 90. The conductive materials and / or structures may comprise multiple conductive traces. In some embodiments, the carrier 90 includes one or more conductive pads 90p exposed from the top surface.

[0100] The conductive pads 90p of the carrier 90 can be connected to the conductive pads 10c protruding from the bottom surface 102 of the substrate 10 via solder elements 90s. The solder elements 90s may include conductive bumps, solder balls, etc. In some embodiments, the size of the carrier 90 may differ from the size of the substrate 10. The carrier 90 may be wider and thicker than the substrate 10.

[0101] In some embodiments, electronic component 21 is attached to the top surface 101 of substrate 10 via adhesive layer 21h. In some embodiments, alignment marks 31 and 32 may be disposed on and connected to the active surface 211 of electronic component 21. Alignment marks 31 and 32 may be disposed adjacent to opposite sides or edges of electronic component 21. In some embodiments, alignment marks 31 and 32 may be disposed at corners of electronic component 21. Alignment mark 31 may include alignment leads 311 and 312 extending between RDL 60 and active surface 211 and connected to conductive pad 21p. Alignment mark 32 may include alignment lead 321 extending between RDL 60 and active surface 211 and connected to conductive pad 21p.

[0102] Conductive leads 41, 42, 43, and 44 may be disposed on substrate 10. Conductive leads 41 and 43 may be located on one side of substrate 10, and conductive leads 42 and 44 may be located on the opposite side of substrate 10 relative to electronic component 21. Conductive leads 41, 42, 43, and 44 may extend between RDL 60 and the top surface 101 of substrate 10. Conductive leads 41, 42, 43, and 44 may be electrically connected to a pad (not shown) of substrate 10.

[0103] In some embodiments, conductive lead 41 is spaced apart from alignment mark 31 (i.e., alignment leads 311 and 312). Conductive lead 42 is spaced apart from alignment mark 32 (i.e., alignment lead 321). In some embodiments, the lengths of conductive leads 41, 42, 43, and 44 may differ from (e.g., be longer than) the lengths of alignment leads 311, 312, and 321. Conductive leads 41, 42, 43, and 44 may have substantially the same length. Conductive leads 41, 42, 43, and 44 may be parallel. Figure 5 The conductive leads 41 to 44 in the middle are similar to Figure 1 The conductive leads in the middle are 40 to 48, differing only in their position and length.

[0104] In some embodiments, electronic component 80 may be mounted on RDL 60 and electrically connected to electronic component 21. Electronic component 80 may include one or more conductive pads 80p facing RDL 60. The conductive pads 80p of electronic component 80 may be connected to the conductive layer 60c of RDL 60 via solder elements 80s. Solder elements 80s may include conductive bumps, solder balls, etc. In some embodiments, electronic component 80 may be electrically connected to carrier 90 via RDL 60, conductive leads 41 to 44 and substrate 10.

[0105] In some embodiments, the size of electronic component 80 may differ from the size of RDL 60. The width of electronic component 80 may be smaller than the width of RDL 60. The size of electronic component 80 may differ from the size of electronic component 21, for example, being wider and / or thicker.

[0106] Electronic component 80 may be a chip or die, comprising a semiconductor substrate, one or more integrated circuit devices, and one or more overlay interconnect structures. The integrated circuit devices may comprise active devices such as transistors and / or passive devices such as resistors, capacitors, inductors, or combinations thereof. In some arrangements, electronic component 80 includes active devices, such as ASICs, PMICs, etc.

[0107] Figure 6 This is a top view of the packaging structure 3 according to some embodiments of the present disclosure. Figure 5 It is the packaging structure 3 along Figure 6 The cross-section of line C-C'. For clarity, Figure 6 Electronic components 80 and RDL 60 are omitted. Package structure 3 is similar to... Figure 3 The difference in package structure 1 lies in the distance between adjacent rows of conductive leads. (See reference...) Figure 6Adjacent conductive leads 41 may be spaced apart by a distance P1 along the Y-axis. Adjacent conductive leads 41 and 43 in different rows may be spaced apart by a distance P11 along the X-axis. The distance P11 may be different from (e.g., greater than) the distance P1. Additionally, alignment marks 33 may be spaced apart from conductive leads 42 by a gap region CLR', which is greater than... Figure 3 The gap region CLR in the middle.

[0108] Package structures 1, 2, and 3 provide different configurations for achieving electrical connection using vertical conductive leads and for using vertical conductive leads as alignment marks.

[0109] Figure 7A , Figure 7B , Figure 7C , Figure 7D , Figure 7E , Figure 7F and Figure 7G This describes one or more operations of a method for manufacturing a package structure 1 according to some embodiments of the present disclosure.

[0110] refer to Figure 7A The substrate 10 is provided with a plurality of electronic components 21, 22, 23, and 24 attached to the substrate 10. In some embodiments, the substrate 10 has a top surface 101 and a bottom surface 102 opposite thereto. The substrate 10 has a pad 10p exposed from the top surface 101. Electronic component 24 can be attached to the top surface 101 of the substrate via an adhesive layer 24h. Electronic component 23 can be attached to electronic component 24 via an adhesive layer 23h. Electronic component 22 can be attached to electronic component 23 via an adhesive layer 22h. Electronic component 21 can be attached to electronic component 22 via an adhesive layer 21h. In some embodiments, electronic components 21, 22, 23, and 24 can be stacked on top of each other. Electronic components 21, 22, 23, and 24 can have different sizes (e.g., widths).

[0111] refer to Figure 7B Wire bonding processes are performed on electronic components 21, 22, 23, and 24 to form alignment leads for alignment marks 31 and 32, and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48. Alignment marks 31 and 32 and conductive lead 40 may be formed on the active surface 211 of electronic component 21. Conductive leads 41 and 42 may be formed on the active surface 221 of electronic component 22. Conductive leads 43 and 44 may be formed on the active surface 231 of electronic component 23. Conductive leads 45, 46, and 46' may be formed on the active surface 241 of electronic component 24. Conductive leads 47 and 48 may be formed on a pad 10p exposed on the top surface 101 of substrate 10.

[0112] refer to Figure 7CAn encapsulation 50 may be formed on the substrate 10 to encapsulate electronic components 21, 22, 23, and 24, alignment marks 31 and 32, and conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47, and 48. The encapsulation 50 may be disposed on and cover the top surface 101 of the substrate 10. The encapsulation 50 may be formed by a molding process.

[0113] refer to Figure 7D The abrasive encapsulator 50 can be ground to form a flat top surface 501 and expose the alignment marks 31 and 32 and the exposed ends of conductive leads 40, 41, 42, 43, 44, 45, 46, 46', 47 and 48.

[0114] refer to Figure 7E A redistribution layer (RDL) 60 can be formed on the top surface 501 of the encapsulation 50. The RDL 60 includes a dielectric layer 60d and a conductive layer 60c at least partially covered by the dielectric layer 60d. Alignment marks 31 and 32 can be easily identified, thereby enhancing alignment to form the RDL 60.

[0115] refer to Figure 7F One or more electrical contacts 70 may be formed on the RDL 60. The electrical contacts 70 may be formed on and connected to the conductive layer 60c of the RDL 60. In some embodiments, the electrical contacts 70 may be solder balls.

[0116] refer to Figure 7G , Figure 7F The resulting structure can be individually divided. In some embodiments, a dicing operation can be performed on the wafer or panel. In some embodiments, the dicing operation can be a sawing process, such as laser sawing. Then, a structure as shown in the reference is formed. Figure 1 The encapsulation structure described and illustrated is 1.

[0117] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “above,” “below,” etc., are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein may be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure are not deviated from by such arrangements.

[0118] As used herein, the terms “approximately,” “substantially,” “basically,” and “about” are used to describe and explain minor variations. When used in conjunction with an event or situation, the terms may refer to examples of events or situations that occurred precisely or very approximately. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value may be considered “substantially” the same as or equal to the second numerical value. For example, “basically” vertical can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0119] If the displacement between two surfaces is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the two surfaces are considered to be coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the surface is considered substantially flat.

[0120] As used herein, unless the context clearly indicates otherwise, the singular terms “a,” “an,” and “the” may include multiple references.

[0121] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials typically indicate materials that offer little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Generally, conductive materials are those with a conductivity greater than approximately 10. 4 S / m (e.g., at least 10) 5 S / m or at least 10 6 A material with conductivity of S / m. The conductivity of the material may vary with temperature. Unless otherwise specified, the conductivity of the material is measured at room temperature.

[0122] Additionally, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted to include not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0123] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and substitutions for equivalents can be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in this disclosure and actual equipment. Other embodiments of this disclosure may exist that are not specifically described. This specification and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Accordingly, unless specifically indicated herein, the order and grouping of operations are not a limitation of this disclosure.

Claims

1. A packaging structure comprising: First semiconductor component; A second semiconductor component is disposed above the first semiconductor component; Multiple alignment leads are positioned above the second semiconductor component; as well as An encapsulation body that encapsulates the first semiconductor component, the second semiconductor component, and the plurality of alignment leads, wherein the encapsulation body has a top surface that exposes the top surfaces of the plurality of alignment leads. In the top view, the top surfaces of the plurality of alignment leads form an alignment pattern.

2. The packaging structure according to claim 1, further comprising: A plurality of conductive leads are disposed on the first semiconductor assembly and encapsulated by the encapsulation, wherein the top surfaces of the plurality of conductive leads are exposed by the top surface of the encapsulation. The top surface of the encapsulation comprises a first region and a second region, wherein the top surface of the plurality of alignment leads is presented in the first region and the top surface of the plurality of conductive leads is presented in the second region, and wherein, in the top view, the plurality of conductive leads form a conductive pattern, and wherein the alignment pattern is geometrically different from the conductive pattern.

3. The packaging structure according to claim 2, further comprising a gap region in the top view between the alignment pattern and the conductive pattern.

4. The packaging structure according to claim 3, wherein, in the top view, the width of the gap region is greater than the diameter of one of the top surfaces of the plurality of alignment leads.

5. The packaging structure of claim 2, wherein the shape of one of the top surfaces of the plurality of alignment leads is substantially the same as the shape of one of the top surfaces of the plurality of conductive leads.

6. The packaging structure of claim 2, wherein the length of the plurality of alignment leads is less than the length of the plurality of conductive leads, wherein in a cross-sectional view, the first of the plurality of alignment leads forms a first angle with the top surface of the encapsulation, wherein in the cross-sectional view, the first of the plurality of conductive leads forms a second angle with the top surface of the encapsulation, and wherein in the cross-sectional view, the first angle is closer to 90° than the second angle.

7. The packaging structure of claim 6, wherein, in the cross-sectional view, the first of the plurality of alignment leads and the first of the plurality of conductive leads are skewed in different directions.

8. The packaging structure of claim 1, further comprising a redistribution layer RDL disposed above the top surface of the encapsulation, wherein the RDL comprises a conductive layer and a dielectric layer covering the conductive layer, wherein the dielectric layer covers the top surface of the plurality of alignment leads.

9. The packaging structure according to claim 1, wherein, in the top view, the alignment pattern comprises a cross.

10. A packaging structure comprising: The first bare wafer has a first active surface; The second die is disposed below the first die and has a second active surface; An encapsulation body that encapsulates the first die and the second die and has a first surface, wherein the first surface of the encapsulation body includes a first region, a second region, and an alignment region between the first region and the second region; A plurality of first conductive leads are disposed on the second active surface of the second die and encapsulated by the encapsulation, wherein the top surfaces of the plurality of first conductive leads are exposed in the first region of the encapsulation; A plurality of second conductive leads are disposed on the second active surface of the second die and encapsulated by the encapsulation, wherein the top surfaces of the plurality of second conductive leads are exposed in the second region of the encapsulation; as well as A plurality of first alignment leads extend between the first active surface of the first die and the first surface of the encapsulation, wherein the top surfaces of the plurality of first alignment leads are exposed in the alignment region and form first alignment marks.

11. The packaging structure of claim 10, wherein the first alignment mark is located near the corner of the first region.

12. The packaging structure of claim 10, wherein, in a top view, one of the top surfaces of the plurality of first alignment leads is elliptical in shape.

13. The packaging structure of claim 10, wherein the first and second of the top surfaces of the plurality of first alignment leads are elliptical, wherein the major axis of the first extends in a direction different from the major axis of the second.

14. The packaging structure according to claim 10, further comprising: A third die is disposed below the second die and has a third active surface; as well as A plurality of third conductive leads are disposed on the third active surface of the third die and encapsulated by the encapsulation, wherein the top surfaces of the plurality of third conductive leads are exposed in the first region of the encapsulation. In a cross-sectional view, the first of the plurality of first conductive leads and the top surface of the encapsulation form a first angle, and in the same cross-sectional view, the first of the plurality of third conductive leads and the top surface of the encapsulation form a second angle, wherein the first angle is closer to 90° than the second angle.

15. The packaging structure of claim 10, further comprising a plurality of second alignment leads extending between the first active surface of the first die and the first surface of the encapsulation, wherein the top surfaces of the plurality of second alignment leads are exposed in the alignment region and form second alignment marks, wherein the second alignment marks are spaced apart from the first alignment marks, and wherein the pattern of the first alignment marks is different from the pattern of the second alignment marks.

16. The packaging structure of claim 10, further comprising a redistribution layer RDL disposed above the top surface of the encapsulation, wherein the first alignment mark is configured to indicate the position of the first die during the fabrication of the RDL.

17. The packaging structure of claim 16, wherein the encapsulation comprises a plurality of fillers, wherein the dielectric layer comprises a portion filling a recess in the encapsulation from the first surface, wherein, in the cross-sectional view, the portion of the dielectric layer overlaps with one of the plurality of first alignment leads in a direction parallel to the first surface of the encapsulation.

18. A packaging structure comprising: Electronic components that have active surfaces; Align the lead wire, which is positioned on the active surface; Conductive leads are disposed on the active surface; as well as An encapsulation body that encapsulates the electronic component, the alignment lead, and the conductive lead, wherein the top surfaces of the alignment lead and the conductive lead are exposed by the encapsulation body. The conductive lead is closer to the edge of the electronic component than the alignment lead.

19. The packaging structure of claim 18, further comprising a redistribution layer RDL disposed above the alignment lead, wherein the RDL comprises a conductive layer and a dielectric layer partially covering the conductive layer, wherein the dielectric layer contacts the alignment lead.

20. The packaging structure of claim 18, wherein the electronic component has a pad on the active surface, and wherein the packaging structure does not contain a seed layer between the first alignment lead and the pad of the electronic component.

Images