Package structure, circuit board assembly, electronic device, substrate and manufacturing method thereof

Abstract

The embodiment of the application discloses a packaging structure, a circuit board assembly, an electronic device, a substrate and a manufacturing method thereof, relates to the field of packaging technology, and reduces the problem that the chip with small-pitch bumps is prone to bridge short circuit when being connected with a buried circuit board. The substrate comprises a substrate body, a first pad and a second pad. The substrate body has a first surface, and the first surface is provided with a first groove structure. The first pad is arranged in the first groove structure. The second pad is arranged on the first pad and protrudes outward from the first surface. The substrate of the application is additionally provided with the second pad, and the height of the original pad is increased. When the substrate is connected with the chip with small-pitch bumps, the second pad can increase the climbing height of the solder at the end of the bump, and the solder at the periphery of the pad is reduced. Therefore, the risk of bridge short circuit between the bump and the circuit of the buried circuit board and between the bumps can be reduced.

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