An enhanced dual-sided 3D POP packaging device and method

Abstract

The application discloses an enhanced double-sided 3D POP packaging device and method, relates to the technical field of 3D POP packaging, and comprises a workbench, wherein a feeding module for conveying a to-be-stacked packaging chip body is arranged on the workbench; a stacking module is arranged on one side of the conveying end of the feeding module, and the stacking module is used for stacking and arranging a plurality of chip bodies in a vertical direction to form a stacked chip; a first reflow soldering furnace and a second reflow soldering furnace are symmetrically arranged on the workbench, a hot air blower is arranged in the first reflow soldering furnace and the second reflow soldering furnace, and the first reflow soldering furnace and the second reflow soldering furnace are used for reflow soldering and packaging processing of the stacked chip; wherein a heat preservation mechanism is arranged on the first reflow soldering furnace and the second reflow soldering furnace, and the heat preservation mechanism is used for isolating high-temperature gas in the furnace from low-temperature gas outside the furnace; the first reflow soldering furnace and the second reflow soldering furnace are subjected to heat preservation processing by the heat preservation mechanism to isolate the high-temperature gas in the furnace from the low-temperature gas outside the furnace.

Description

Technical Field

[0001] This invention relates to the field of 3DPOP packaging technology, specifically to an enhanced double-sided 3DPOP packaging device and method. Background Technology

[0002] With the rapid development of portable electronic products, various related products are gradually moving towards higher density, higher performance, and thinner, smaller sizes, thus providing a broad application space for 3D packaging technology. Packaging stacking technology, as one of the important solutions for realizing 3D packaging, forms a 3D system-level package by stacking multiple pre-packaged packages vertically, enabling higher integration density and multi-functional integration within a limited space. Among them, double-sided packaging structures (double-sided electrode packaging or double-sided packaging) are widely used in PoP technology due to their ability to perform electrical interconnection on both the top and bottom surfaces.

[0003] In existing PoP (Package on Board) packaging processes, the electrical connection and mechanical fixation between the upper and lower layers of stacked chips (i.e., the packages to be stacked) are achieved through reflow soldering, a technique commonly used in the industry. Reflow ovens typically use hot air heating, where a heating fan heats the air inside the oven to a set temperature, and the hot air circulation creates a uniform temperature field within the oven chamber, thereby heating the stacked chips and melting the solder balls to achieve a reliable connection.

[0004] However, the applicant discovered the following technical problems with the existing reflow soldering process: Because reflow ovens require continuous loading and unloading during production, the frequent opening of the oven door inevitably leads to heat exchange between the high-temperature environment inside the oven and the external environment. On the one hand, the entry of cold outside air lowers the oven temperature; on the other hand, the heat loss during the opening of the oven door disrupts the established thermal equilibrium. The combined effect of these factors makes it difficult to maintain a uniform and stable temperature inside the reflow oven. Even if the oven temperature control system can compensate for heating after the oven door is closed, the lag in heat replenishment means that different batches, and even different locations within the same batch of chips entering the oven, experience different heating temperature profiles, resulting in varying heating temperatures experienced by each chip during the reflow soldering process.

[0005] The most direct consequence of uneven temperature is inconsistent solder ball melting states on each stacked chip. Some solder balls may have fully melted and formed good wetting, while others may not have fully melted or have prematurely entered the cooling phase. This temperature difference significantly affects the consistency of soldering quality. More seriously, industry research shows that when the temperatures of the upper and lower solder balls are respectively above and below the solder melting temperature, ball-and-socket defects, a common defect type unique to high-density ball grid array devices, severely weaken the mechanical strength of the solder joint and the reliability of the electrical connection.

[0006] Furthermore, uneven temperature distribution within the reflow oven can lead to inconsistent thermal expansion of the packages, further exacerbating warpage. In PoP (PoS) packaging, the warpage matching between the upper and lower packages is a key factor directly affecting board-level assembly yield. Summary of the Invention

[0007] The purpose of this invention is to provide an enhanced double-sided 3DPOP packaging device and method to solve the technical problem in the prior art of how to avoid uneven temperature inside the furnace caused by the loading and unloading operations of the reflow oven.

[0008] The technical problem to be solved by the present invention can be achieved by the following technical solution: an enhanced double-sided 3DPOP packaging device, including a worktable, wherein the worktable is provided with a feeding module for conveying the chip body to be stacked and packaged; A stacking module is provided on one side of the conveying end of the feeding module. The stacking module is used to stack and arrange multiple chip bodies in a vertical direction to form a stacked chip. The workbench is symmetrically equipped with a first reflow oven and a second reflow oven. The first and second reflow ovens are equipped with hot air blowers and are used to perform reflow soldering and encapsulation processing on stacked chips. Both the first and second reflow ovens are equipped with heat preservation mechanisms to isolate the high-temperature gas inside the oven from the low-temperature gas outside the oven.

[0009] Preferably, the stacking module includes a transfer mechanism for transferring the chip body conveyed to the stacking end. The transfer mechanism includes a transfer plate, and the transfer plate is provided with a gripping part for gripping the chip body to be stacked. The workbench is also equipped with a horizontal electric cylinder, the drive end of which is fixedly connected to the transfer plate.

[0010] Preferably, the gripping part includes a lifting electric cylinder fixed to the transfer plate. The driving end of the lifting electric cylinder is fixedly connected to the gripping plate. A first vacuum pump, a second vacuum pump, a third vacuum pump, and a fourth vacuum pump are arranged at equal intervals on the gripping plate. Each vacuum pump is connected to a vacuum adsorption tube. The worktable is also provided with a first support corresponding to the first vacuum pump, a second support corresponding to the second vacuum pump, and a third support corresponding to the third vacuum pump. Positioning platforms are fixedly arranged on the first, second, and third supports, and positioning grooves corresponding to the size of the chip body are opened on the positioning platforms.

[0011] Preferably, the stacking module includes a guide plate fixed to the workbench, a groove is formed on the guide plate, and a slide plate for conveying stacked chips is slidably arranged in the groove; The guide plate is also provided with a translation mechanism, which is used to drive the slide plate to move in the direction of the first reflow oven or the second reflow oven.

[0012] Preferably, a support seat is fixedly arranged on the skateboard, and several sets of support grooves for supporting stacked chips are respectively opened on both sides of the support seat.

[0013] Preferably, the bottom of the first reflow oven or the second reflow oven is respectively provided with a material trough. The heat preservation module includes guide grooves on both sides of the material trough. A sealing plate for closing the material trough is slidably arranged in the guide groove. A support is fixedly arranged at one end of the bottom of the sealing plate. A guide rod is fixedly arranged on the support. The other end of the guide rod is slidably inserted into a U-shaped frame fixedly arranged at the bottom of the reflow oven. A return spring is provided on the guide rod.

[0014] Preferably, a support plate is slidably arranged in each of the support grooves, and the support plate is connected to a lifting part that drives it to move up and down along the support groove.

[0015] Preferably, the lifting part includes a lifting rod fixed to the bottom of the bearing plate, the other end of the lifting rod sliding through the bottom of the groove and the end of the lifting rod being rotatably arranged with a guide wheel, wherein a first linear guide plate is also fixedly arranged at the bottom of the guide plate, and the bottom of the first reflow oven and the second reflow oven are respectively fixedly arranged with first inclined guide plates fixedly connected to both ends of the first linear guide plate, the two sides of the first inclined guide plates are respectively inclined towards the direction of the reflow oven, and the other end of the first inclined guide plate is fixedly connected to the second linear guide plate.

[0016] Preferably, two sets of second inclined guide plates are symmetrically fixedly arranged on the first linear guide plate below the fourth vacuum pump, and a third linear guide plate is fixedly arranged between the two sets of second inclined guide plates. A deflector plate is fixedly arranged on one side of the vacuum adsorption tube of the fourth vacuum pump, and an inclined guide plate is also fixedly arranged along the side edge of the guide plate.

[0017] An enhanced double-sided 3DPOP packaging method, applied to the aforementioned enhanced double-sided DPOP packaging device, includes the following steps: Place the chip body to be stacked and packaged at the starting loading end of the loading module; The feeding module sequentially delivers the chip bodies to the stacking end; The stacking module stacks multiple chip bodies along the vertical direction; After the stacking is completed, the stacked chips are transferred to the first reflow oven or the second reflow oven for reflow soldering and encapsulation.

[0018] Compared with the prior art, the beneficial effects of this application are as follows: 1. In this invention, the chip body to be stacked and packaged is first placed at the starting feeding end of the feeding module. The feeding module sequentially transports the chip body to the stacking end. Then, the stacking module stacks multiple sets of chip bodies in the vertical direction. After stacking, the stacked chips are transferred to the first reflow oven or the second reflow oven. The stacked chips are then reflow soldered and packaged in the first reflow oven or the second reflow oven. During the input or output of the stacked chips into the first reflow oven or the second reflow oven, the first reflow oven and the second reflow oven can be kept warm by the heat preservation mechanism to isolate the high-temperature gas inside the oven from the low-temperature gas outside the oven.

[0019] 2. This invention, through the combination of a stacking module and a reflow soldering module, not only achieves the technical effect of automatically stacking multiple chip bodies, but also performs reflow soldering encapsulation on the stacked chips through a first or second reflow soldering furnace. During the encapsulation process, the first and second reflow soldering furnaces can be kept warm by a heat preservation mechanism to prevent the high-temperature air inside the furnace from diffusing outside, thereby ensuring the uniformity of the temperature inside the furnace. This results in higher and more uniform encapsulation quality when processing stacked chips in batches. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of an enhanced double-sided 3DPOP packaging device according to the present invention. Figure 1 ; Figure 2 This is a top view of an enhanced double-sided 3DPOP packaging device according to the present invention; Figure 3 This is a three-dimensional structural diagram of an enhanced double-sided 3DPOP packaging device according to the present invention. Figure 2 ; Figure 4 This is a front view structural schematic diagram of an enhanced double-sided 3DPOP packaging device according to the present invention; Figure 5This is a schematic diagram of the translation motor in an enhanced double-sided 3DPOP packaging device of the present invention; Figure 6 This is a schematic diagram of the slide plate in an enhanced double-sided 3DPOP packaging device of the present invention; Figure 7 This is a schematic diagram of the vacuum adsorption tube in an enhanced double-sided 3DPOP packaging device of the present invention; Figure 8 This is a schematic diagram of the reflow oven in an enhanced double-sided 3DPOP packaging device of the present invention; Figure 9 This is a schematic diagram of the carrier plate in an enhanced double-sided 3DPOP packaging device of the present invention.

[0021] Explanation of reference numerals in the attached figures: 1. Workbench; 2. Conveyor frame; 201. Baffle; 202. Conveyor belt; 203. Conveyor trough; 3. Chip body; 4. Gripping plate; 401. First vacuum pump; 402. Second vacuum pump; 403. Third vacuum pump; 404. Fourth vacuum pump; 405. Horizontal electric cylinder; 407. Vacuum adsorption tube; 409. First support; 410. Second support; 411. Third support; 412. Positioning table; 413. Pulley; 414. Transfer plate; 415. Lifting electric cylinder; 416. Positioning trough; 5. First reflow oven; 502. Hot air blower; 503. Material trough; 504. Guide trough; 505. Sealing plate 506. Plate; 507. Support; 508. Guide rod; 509. Return spring; 5000. U-shaped frame; 6. Guide plate; 601. Inclined guide plate; 602. Translation motor; 603. Slide groove; 604. Main gear; 605. Secondary gear; 606. Drive wheel; 607. Drive pin; 7. Slide plate; 701. Bearing groove; 702. Drive hole; 703. Bearing plate; 704. Lifting rod; 705. Guide wheel; 706. Bearing seat; 8. First linear guide plate; 801. First inclined guide plate; 802. Second linear guide plate; 803. Second inclined guide plate; 804. Third linear guide plate; 9. Second reflow oven. Detailed Implementation

[0022] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0023] Example 1 Because reflow ovens require continuous loading and unloading during production, the frequent opening of the furnace door inevitably leads to heat exchange between the high-temperature environment inside the furnace and the external environment. On the one hand, the entry of cold air from outside will lower the furnace temperature; on the other hand, the heat loss during the moment the furnace door is opened will disrupt the thermal equilibrium state established inside the furnace.

[0024] like Figures 1 to 5 In this embodiment, an enhanced double-sided 3DPOP packaging device includes a worktable 1, on which a feeding module for conveying the chip bodies 3 to be stacked and packaged is provided. Specifically, in this embodiment, the processed single chip bodies 3 can be transferred to the starting feeding end of the feeding module by a feeding robot, and the chip bodies 3 can be conveyed sequentially toward the stacking end by the feeding module.

[0025] In this embodiment, a stacking module is provided on one side of the conveying end of the feeding module. The stacking module is used to stack and arrange multiple sets of chip bodies 3 in the vertical direction to form a stacked chip. Specifically, in this embodiment, the specific number of chip bodies 3 in a set of stacked chips is not limited, as long as it meets the actual application requirements. In this embodiment, a set of stacked chips includes three sets of chip bodies 3. Accordingly, after the feeding module in this embodiment transports the chip body 3 to the stacking end, the stacking module can automatically stack the three sets of chip bodies 3.

[0026] As a further embodiment, a first reflow oven 5 and a second reflow oven 9 are symmetrically arranged on the workbench 1. A hot air blower 502 is provided in the first reflow oven 5 and the second reflow oven 9. The first reflow oven 5 and the second reflow oven 9 are used to perform reflow soldering and packaging processing on the stacked chips. Specifically, after the chip body 3 is stacked, it can be transferred to the first reflow oven 5 or the second reflow oven 9, and the stacked chips are reflow soldered and packaged by the reflow oven. Furthermore, both the first reflow oven 5 and the second reflow oven 9 are equipped with a heat preservation mechanism, which is used to isolate the high-temperature gas inside the oven from the low-temperature gas outside the oven. The working principle of this embodiment is as follows: First, the chip body 3 to be stacked and packaged is placed at the starting feeding end of the feeding module. The feeding module sequentially transports the chip body 3 to the stacking end. Then, the stacking module stacks multiple sets of chip bodies 3 in the vertical direction. After stacking, the stacked chips are transferred to the first reflow oven 5 or the second reflow oven 9. The stacked chips are then reflow soldered and packaged in the first reflow oven 5 or the second reflow oven 9. During the input or output process of the stacked chips into the first reflow oven 5 and the second reflow oven 9, the first reflow oven 5 and the second reflow oven 9 can be kept warm by the heat preservation mechanism to isolate the high-temperature gas inside the furnace from the low-temperature gas outside the furnace.

[0027] It should be emphasized that the core improvement of this embodiment lies in the fact that, through the combination of the stacking module and the reflow soldering module, this embodiment can not only achieve the technical effect of automatically stacking multiple chip bodies 3, but also perform reflow soldering encapsulation processing on the stacked chips through the first reflow soldering furnace 5 or the second reflow soldering furnace 9. During the encapsulation process, the first reflow soldering furnace 5 and the second reflow soldering furnace 9 can be kept warm by the heat preservation mechanism to prevent the high-temperature air inside the furnace from diffusing outside the furnace, thereby ensuring the uniformity of the temperature inside the furnace. This results in higher and more uniform encapsulation quality when processing stacked chips in batches.

[0028] It should be noted that, such as Figures 1-3 The feeding module includes conveyor frames 2 symmetrically fixed on the workbench 1. Conveyor belts 202 are provided in the two conveyor frames 2. Baffles 201 are fixedly arranged on the two sets of conveyor frames 2 respectively. A conveying groove 203 for limiting the chip body 3 is formed between the two sets of baffles 201. Specifically, in this embodiment, when conveying the chip body 3, the chip body 3 can be placed in the conveying groove 203. The conveyor belt 202 is driven by the conveyor motor to drive the chip body 3 to be conveyed synchronously along the conveying groove 203 towards the stacking end.

[0029] It should be noted that, such as Figures 1-4 as well as Figure 7 The stacking module includes a transfer mechanism for transferring the chip bodies 3 conveyed to the stacking end. The transfer mechanism includes a transfer plate 414 with a gripping part for gripping the chip bodies 3 to be stacked. A horizontal electric cylinder 405 is also fixedly arranged on the worktable 1, and the driving end of the horizontal electric cylinder 405 is fixedly connected to the transfer plate 414. It can be explained that when stacking the chip bodies 3, the horizontal electric cylinder 405 can first drive the transfer plate 414 to move towards the feeding module to move the gripping part to the stacking end of the conveyor belt 202. Then, the gripping part grips the chip bodies 3. Finally, the horizontal electric cylinder 405 can drive the transfer plate 414 to move away from the feeding module to stack multiple sets of chip bodies 3.

[0030] like Figures 1 to 7In this embodiment, the gripping part includes a lifting electric cylinder 415 fixed on the transfer plate 414. The driving end of the lifting electric cylinder 415 is fixedly connected to the gripping plate 4. A first vacuum pump 401, a second vacuum pump 402, a third vacuum pump 403, and a fourth vacuum pump 404 are arranged at equal intervals on the gripping plate 4. Each vacuum pump is connected to a vacuum adsorption tube 407. The workbench 1 is also provided with a first support 409 corresponding to the first vacuum pump 401, a second support 410 corresponding to the second vacuum pump 402, and a third support 411 corresponding to the third vacuum pump 403. Positioning platforms 412 are fixedly arranged on the first support 409, the second support 410, and the third support 411, respectively. The 12 has a positioning groove 416 corresponding to the size of the chip body 3. It can be explained that in this embodiment, when the chip body 3 is stacked by the feeding module to the stacking end, the horizontal electric cylinder 405 drives the transfer plate 414 to move towards the feeding module, so that the first vacuum pump 401 moves to the top of the chip body 3 to be grasped. As the lifting electric cylinder 415 drives the grasping plate 4 to descend, the vacuum adsorption tube 407 of the first vacuum pump 401 can descend to contact the chip body 3. The first vacuum pump 401 is started, so that the chip body 3 can be adsorbed and fixed. As the horizontal electric cylinder 405 drives the transfer plate 414 to reset, the first vacuum pump 401 can transfer the chip body 3 into the positioning groove 416 on the first support 409. Correspondingly, when the horizontal electric cylinder 405 drives the transfer plate 414 to grab the chip body 3 again, the second vacuum pump 402 can move to the first support 409, and then the chip body 3 on the first support 409 can be grabbed by the vacuum suction tube 407 of the second vacuum pump 402 to be transferred to the positioning groove 416 on the second support 410. Further, the chip body 3 on the second support 410 can be transferred to the third support 411 by the third vacuum pump 403. Finally, the chip body 3 on the third support 411 can be removed by the fourth vacuum pump 404 and stacked. Based on this, this embodiment uses multiple sets of vacuum pumps to transfer the chip body 3. For cases with long transfer distances, if only one set of vacuum pumps is used for transfer, the horizontal movement distance of each pump is too long. However, by using multiple sets of vacuum pumps working together, the horizontal movement distance of each set of vacuum pumps can be significantly shortened, thereby reducing the time consumed in the transfer and improving the transfer efficiency.

[0031] As one implementation method of this embodiment, please refer to Figures 6-9The stacking module includes a guide plate 6 fixed on the workbench 1. A slide groove 603 is provided on the guide plate 6, and a slide plate 7 for conveying stacked chips is slidably arranged in the slide groove 603. The guide plate 6 is also provided with a translation mechanism, which is used to drive the slide plate 7 to move in the direction of the first reflow oven 5 or the second reflow oven 9. It should be noted that in this embodiment, the fourth vacuum pump 404 transfers the chip body 3 on the third support 411 to the slide plate 7, and then drives the slide plate 7 to move in the direction of the first reflow oven 5 or the second reflow oven 9 through the translation mechanism, so as to transfer the stacked chips to the first reflow oven 5 or the second reflow oven 9 for reflow soldering connection.

[0032] Specifically, for positioning and transporting the stacked chips, please refer to... Figures 6-9 In this embodiment, a support seat 706 is fixedly arranged on the slide plate 7, and several sets of support grooves 701 for supporting stacked chips are respectively opened on both sides of the support seat 706. Specifically, when the fourth vacuum pump 404 of this embodiment removes the chip body 3, it can transfer the chip body 3 into the support groove 701 for secondary positioning, so that multiple sets of chip bodies 3 can be accurately aligned when stacked.

[0033] In this embodiment, the translation mechanism includes translation motors 602 symmetrically arranged on both sides of the guide plate 6. The driving end of the translation motors 602 is fixedly connected to the main gear 604. The bottom of the guide plate 6 is also symmetrically arranged with drive wheels 606. Several sets of drive pins 607 are fixedly arranged in a circumferential array on the outer edge of the drive wheels 606. A secondary gear 605 for meshing with the main gear 604 is also fixedly arranged on one side of the drive wheels 606. The two sides of the slide plate 7 are evenly provided with drive pins 607 for meshing with the main gear 604. 07. The drive hole 702 is used for insertion; It should be noted that in this embodiment, when the stacked chip in the carrier groove 701 is transported to the first reflow oven 5 or the second reflow oven 9, the translation motor 602 can be started to drive the main gear 604 to rotate. The main gear 604 drives the drive wheel 606 to rotate by meshing with the secondary gear 605. The drive pin 607 on the drive wheel 606 can drive the slide plate 7 to translate in the direction of the first reflow oven 5 or the second reflow oven 9 by inserting and engaging with the drive hole 702.

[0034] In order to transport the stacked chips in the carrier trough 701 to the first reflow oven 5 or the second reflow oven 9, in this embodiment, the bottom of the first reflow oven 5 or the second reflow oven 9 is respectively provided with a material trough 503. The heat preservation module includes guide grooves 504 provided on both sides of the material trough 503. A sealing plate 505 for closing the material trough 503 is slidably arranged in the guide groove 504. A support 506 is fixedly arranged at one end of the bottom of the sealing plate 505. A guide rod 507 is fixedly arranged on the support 506. The other end of the guide rod 507 is slidably inserted into a U-shaped frame 509 fixedly arranged at the bottom of the reflow oven. A return spring 508 is provided on the guide rod 507. One end of the return spring 508 is fixedly connected to the support 506, and the other end is fixedly connected to the U-shaped frame 509. It can be explained that after the chip body 3 is stacked in the carrier groove 701, the upper surface of the chip body 3 at the top is flush with the upper surface of the slide plate 7. When the translation mechanism drives the slide plate 7 to move towards the reflow oven, the two ends of the slide plate 7 can be slidably embedded in the guide groove 504. At the same time, the slide plate 7 can push the sealing plate 505 to slide in the material groove 503. The sealing plate 505 can compress the reset spring 508 through the guide rod 507 and generate elastic force. When the stacked chips in each carrier groove 701 are completely transported to the reflow oven, the movement stops. Then, the stacked chips can be reflow soldered in the reflow oven. Correspondingly, after the reflow soldering is completed, the translation mechanism can drive the slide plate 7 to reset, and the reset spring 508 can drive each component to reset under the action of elastic force.

[0035] Example 2 It is understandable that in Embodiment 1, although the carrier groove 701 of this embodiment can achieve the effect of positioning the stacked chip, when the slide plate 7 moves into the reflow oven, since the stacked chip is placed in the carrier groove 701, the heating range of the stacked chip is greatly reduced, which not only affects the reflow soldering quality, but also reduces efficiency.

[0036] like Figures 5 to 9 In order to solve the above problems, each bearing groove 701 in this embodiment is slidably arranged with a bearing plate 703, and the bearing plate 703 is connected to the lifting part that drives it to move up and down along the bearing groove 701.

[0037] The working principle of this embodiment is as follows: Before the carrier tank 701 moves into the reflow oven, the carrier plate 703 is located at the bottom of the carrier tank 701, so that the upper surface of the chip body 3 at the top is flush with the upper surface of the slide plate 7. This is to avoid interference with the side wall of the reflow oven when entering it, and to keep the reflow oven warm and prevent the leakage of high-temperature air inside the oven. After the carrier tank 701 enters the oven, the lifting part drives the carrier plate 703 to push out the stacked chip in the carrier tank 701 and expose it completely inside the oven.

[0038] It should be emphasized that the core improvement of this embodiment is that by setting a liftable carrier plate 703, the relative height of the stacked chip in the carrier groove 701 can be adjusted. When the stacked chip is in the furnace, it is pushed out and fully exposed to the furnace, which makes its heating uniformity higher and the reflow soldering efficiency is also improved.

[0039] It should be noted that the lifting unit includes a lifting rod 704 fixed to the bottom of the bearing plate 703. The other end of the lifting rod 704 slides through the bottom of the groove and a guide wheel 705 is rotatably arranged at the end. A first linear guide plate 8 is also fixedly arranged at the bottom of the guide plate 6. The bottoms of the first reflow oven 5 and the second reflow oven 9 are respectively fixedly arranged with first inclined guide plates 801 fixedly connected to both ends of the first linear guide plate 8. The first inclined guide plates 801 on both sides are inclined towards the reflow oven. The other end of the first inclined guide plate 801 is connected to the second linear guide plate 805. The plate 802 is fixedly connected; it can be explained that when the support plate 703 is located at the bottom of the support groove 701, the guide wheel 705 is supported by the first linear guide plate 8. As the translation mechanism drives the slide plate 7 to move into the first reflow oven 5 and the second reflow oven 9, based on the setting of the first inclined guide plate 801, the lifting rod 704 and the support plate 703 can be automatically driven to rise, thereby pushing the stacked chip above the support groove 701. Correspondingly, when the translation mechanism drives the slide plate 7 to reset, the support plate 703 automatically resets under the action of gravity.

[0040] It should be noted that, after the stacked chips complete reflow soldering, in order to automatically unload the stacked chips in the carrier groove 701, in this embodiment, two sets of second inclined guide plates 803 are symmetrically fixedly arranged on the first linear guide plate 8 below the fourth vacuum pump 404, and a third linear guide plate 804 is fixedly arranged between the two sets of second inclined guide plates 803. A baffle plate 413 is fixedly arranged on one side of the vacuum suction tube 407 of the fourth vacuum pump 404, and an inclined guide plate 601 is also fixedly arranged along the side edge of the guide plate 6. It can be explained that when the translation mechanism drives any set of carrier grooves 701... When the device moves to below the fourth vacuum pump 404, the carrier plate 703 can be driven to rise again by the second inclined guide plate 803 to push the reflow soldered stacked chips to the outside of the carrier groove 701. When the fourth vacuum pump 404 loads a new set of chips into the carrier groove 701, as the fourth vacuum pump 404 moves toward the carrier groove 701, the soldered stacked chips can be pushed to the inclined guide plate 601 by the dial plate 413 to complete the automatic unloading. Based on this, this embodiment does not require the setting of other servo equipment for unloading, which not only reduces costs but also improves stability.

[0041] An enhanced double-sided 3DPOP packaging method includes the following steps: Please refer to Figures 1-5S1. Place the chip body 3 to be stacked and packaged at the starting loading end of the loading module; S2. The feeding module sequentially transports the chip body 3 to the stacking end; S3, The stacking module stacks multiple chip bodies 3 in the vertical direction; S4. After the stacking is completed, the stacked chip is transferred to the first reflow soldering furnace 5 or the second reflow soldering furnace 9, where the stacked chip is reflow soldered and packaged.

[0042] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed application.

Claims

1. An enhanced double-sided 3DPOP packaging device, comprising a worktable (1), wherein the worktable (1) is provided with a feeding module for conveying the chip body (3) to be stacked and packaged; Its features are, The feeding module is provided with a stacking module on one side of the conveying end. The stacking module is used to stack and arrange multiple chip bodies (3) in the vertical direction to form stacked chips. The workbench (1) is symmetrically equipped with a first reflow oven (5) and a second reflow oven (9). The first reflow oven (5) and the second reflow oven (9) are equipped with hot air blowers (502). The first reflow oven (5) and the second reflow oven (9) are used to perform reflow soldering and packaging processes on stacked chips. Both the first reflow oven (5) and the second reflow oven (9) are equipped with heat preservation mechanisms, which are used to isolate the high-temperature gas inside the oven from the low-temperature gas outside the oven.

2. The enhanced double-sided 3DPOP packaging device as described in claim 1, characterized in that, The stacking module includes a transfer mechanism for transferring the chip body (3) delivered to the stacking end. The transfer mechanism includes a transfer plate (414) with a gripping part on the transfer plate (414) for gripping the chip body (3) to be stacked. The workbench (1) is also fixedly equipped with a horizontal electric cylinder (405), and the driving end of the horizontal electric cylinder (405) is fixedly connected to the transfer plate (414).

3. The enhanced double-sided 3DPOP packaging device as described in claim 2, characterized in that, The gripping part includes a lifting electric cylinder (415) fixed on the transfer plate (414). The driving end of the lifting electric cylinder (415) is fixedly connected to the gripping plate (4). The gripping plate (4) is provided with a first vacuum pump (401), a second vacuum pump (402), a third vacuum pump (403) and a fourth vacuum pump (404) arranged at equal intervals. Each vacuum pump is connected to a vacuum adsorption tube (407). The worktable (1) is also provided with a first support (409) corresponding to the first vacuum pump (401), a second support (410) corresponding to the second vacuum pump (402) and a third support (411) corresponding to the third vacuum pump (403). The first support (409), the second support (410) and the third support (411) are respectively fixedly provided with positioning platforms (412). The positioning platforms (412) are provided with positioning grooves (416) corresponding to the size of the chip body (3).

4. An enhanced double-sided 3DPOP packaging device as described in claim 3, characterized in that, The stacking module includes a guide plate (6) fixed on the workbench (1), a slide groove (603) is provided on the guide plate (6), and a slide plate (7) for conveying stacked chips is slidably arranged in the slide groove (603). The guide plate (6) is also provided with a translation mechanism, which is used to drive the slide plate (7) to move in the direction of the first reflow oven (5) or the second reflow oven (9).

5. An enhanced double-sided 3DPOP packaging device as described in claim 4, characterized in that, The slide plate (7) is fixedly provided with a support seat (706), and several sets of support grooves (701) for supporting stacked chips are respectively opened on both sides of the support seat (706).

6. An enhanced double-sided 3DPOP packaging device as described in claim 4, characterized in that, The bottom of the first reflow oven (5) or the second reflow oven (9) is respectively provided with a material trough (503). The heat preservation module includes guide grooves (504) on both sides of the material trough (503). A sealing plate (505) for closing the material trough (503) is slidably arranged in the guide groove (504). A support (506) is fixedly arranged at one end of the bottom of the sealing plate (505). A guide rod (507) is fixedly arranged on the support (506). The other end of the guide rod (507) is slidably inserted into a U-shaped frame (509) fixedly arranged at the bottom of the reflow oven. A return spring (508) is provided on the guide rod (507).

7. An enhanced double-sided 3DPOP packaging device as described in claim 5, characterized in that, Each of the aforementioned bearing grooves (701) has a bearing plate (703) slidably arranged in it, and the bearing plate (703) is connected to a lifting part that drives it to move up and down along the bearing groove (701).

8. An enhanced double-sided 3DPOP packaging device as described in claim 7, characterized in that, The lifting unit includes a lifting rod (704) fixed to the bottom of the bearing plate (703). The other end of the lifting rod (704) slides through the bottom of the groove and the end is provided with a guide wheel (705). The bottom of the guide plate (6) is also fixedly provided with a first linear guide plate (8). The bottoms of the first reflow oven (5) and the second reflow oven (9) are respectively fixedly provided with a first inclined guide plate (801) fixedly connected to both ends of the first linear guide plate (8). The two sides of the first inclined guide plate (801) are inclined towards the direction of the reflow oven. The other end of the first inclined guide plate (801) is fixedly connected to the second linear guide plate (802).

9. An enhanced double-sided 3DPOP packaging device as described in claim 8, characterized in that, Two sets of second inclined guide plates (803) are symmetrically fixed on the first linear guide plate (8) below the fourth vacuum pump (404), and a third linear guide plate (804) is fixedly arranged between the two sets of second inclined guide plates (803). Among them, a baffle plate (413) is fixedly arranged on one side of the vacuum adsorption tube (407) of the fourth vacuum pump (404), and an inclined guide plate (601) is also fixedly arranged on the side of the guide plate (6).

10. An enhanced double-sided 3DPOP packaging method, characterized in that, An enhanced double-sided (3) DPOP packaging device as described in any one of claims 1-9 includes the following steps: Place the chip body (3) to be stacked and packaged at the starting loading end of the loading module; The feeding module sequentially transports the chip body (3) to the stacking end; The stacking module stacks multiple chip bodies (3) in the vertical direction; After the stacking is completed, the stacked chip is transferred to the first reflow oven (5) or the second reflow oven (9) for reflow soldering and encapsulation.

Images