Electronics packaging tape

Abstract

The present application provides an electronic device packaging tape, which can inhibit the phenomenon of bending and indentation of the metal layer caused by the edge portion of the movable stage of the pickup device when picking up the metal layer of the tape adhesive layer from the adhesive tape. The electronic device packaging tape (1) of the present application has an adhesive tape (5) and a laminate composed of an adhesive layer (4) and a metal layer (3), the adhesive tape (5) has a substrate film (51) and an adhesive layer (52), the laminate is arranged on the side opposite to the substrate film (51) of the adhesive layer (52), the adhesive tape (5) has a label part (5a) covering the adhesive layer and arranged in contact with the substrate film around the adhesive layer, and a peripheral part (5b) surrounding the outer side of the label part, the adhesion of the adhesive layer (52) of the adhesive tape (5) in the state of picking up the laminate is 2-200 kPa, and the loss elastic modulus of the adhesive layer (4) under the condition of 25°C and 50% RH is 50 MPa or less.

Description

[0001] This application is a divisional application of the original PCT international application with international filing date of November 25, 2016, which entered the Chinese national phase with application number 201680083843.X and invention title "Packaging Tape for Electronic Devices". Technical Field

[0002] This invention relates to a packaging tape for electronic devices, and more particularly to a packaging tape for electronic devices having a metal layer. Background Technology

[0003] In recent years, electronic devices such as mobile phones and laptops have been required to be further thinner and smaller. To achieve this, in order to reduce the thinness and miniaturization of electronic device packages, such as semiconductor packages mounted in electronic devices, the number of electrodes on the electronic devices and circuit boards has been increased, and the spacing has been narrowed. Such electronic device packages include, for example, flip-chip (FC) mounting packages.

[0004] In flip-chip mount packages, the increase in the number of electrodes or the narrowing of their pitch, as described above, leads to a problem of increased heat generation. Therefore, as a heat dissipation structure for flip-chip mount packages, a scheme has been proposed to provide a metal layer on the back side of the electronic device via an adhesive layer (see, for example, Patent Document 1).

[0005] Furthermore, in flip-chip mounted packages, the linear expansion coefficient of the electronic device sometimes differs significantly from that of the circuit board. In this case, during the manufacturing process of the electronic device package, differences in the amount of expansion and contraction between the electronic device and the circuit board occur when intermediate products are heated and cooled. This difference causes the electronic device package to warp. As a structure to suppress this warping, a scheme has been proposed to provide a metal layer on the back side of the electronic device via an adhesive layer (see, for example, Patent Document 2).

[0006] Furthermore, in flip-chip mounted packages, a scheme is proposed to set a metal layer on the back of the electronic device through an adhesive layer and to use the metal layer as a protective layer for laser masks (for example, see Patent Document 3).

[0007] Furthermore, in recent years, it has become common to stack other semiconductor chips of the same size on a semiconductor chip for three-dimensional mounting. In this case, in order to stack other semiconductor chips of the same size on the semiconductor chip, spacers need to be pre-stacked between them. This is because other semiconductor chips are also stacked on the electrode pads of the semiconductor chip. As the aforementioned spacers, a solution using a metal layer with an adhesive layer has been proposed (see, for example, Patent Document 4). Patent Document 4 describes the process of setting the spacers through the following steps: attaching a spacer having a metal layer containing an adhesive layer on at least one side to a dicing sheet using an adhesive sheet with the adhesive layer as the bonding surface; cutting the spacer using the adhesive sheet to form a chip-shaped spacer with an adhesive layer; lifting the spacer using a pin and peeling the lifted spacer and adhesive layer from the dicing sheet using a pick-up device used when peeling the semiconductor chip and adhesive layer together; and fixing the spacer to the substrate via the adhesive layer.

[0008] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2007-235022 Patent Document 2: Japanese Patent No. 5487847 Patent Document 3: Japanese Patent No. 5419226 Patent Document 4: Japanese Patent No. 4954569 Summary of the Invention

[0009] (The problem that the invention aims to solve) As mentioned above, metal layers with adhesive layers are useful for various electronic device packages, but from a productivity point of view, as disclosed in Patent Document 4, it is desirable to use existing devices for picking up and fixing to the object.

[0010] However, since metals are prone to plastic deformation due to metallic bonds, there is a risk of leaving pin marks if a pin is used to push the chip upwards for pickup. Therefore, for example, it is possible to consider using a pickup device that peels and picks up the semiconductor chip from the dicing wafer instead of using the pin described in Japanese Patent Application Publication No. 2010-114157.

[0011] Here, based on Figure 9 , 10 A pickup device that does not use a pin (needle-less method) will be described. Figure 9 This is a cross-sectional view used to schematically illustrate the use of a pickup device without using a pin. Figure 10 This is a top view schematically illustrating the positional relationship between the stage of the pickup device and the semiconductor chip. For example... Figure 9 As shown, the pick-up device without a pin includes a stage ST, which holds a dicing die 101 to which a semiconductor chip C is attached. Furthermore, the stage ST has a fixed stage ST1 and a movable stage ST2 fitted into the fixed stage ST1. The movable stage ST2 is configured such that its upper surface protrudes beyond the upper surface of the fixed stage ST1. Therefore, a gap 102 is formed between the movable stage ST2 and the dicing die 101 at the outer periphery. Furthermore, in the stage ST, as... Figure 10 As shown, an suction hole ST3 is provided that communicates with the gap 102.

[0012] Next, the method for picking up the semiconductor chip C using the aforementioned pickup device will be described. First, as... Figure 9 As shown in (A), the movable stage ST2 is positioned below the semiconductor chip C. At this time, the movable stage ST2 is positioned so that one end of the semiconductor chip C protrudes from one end face of the movable stage ST2. Then, with the semiconductor chip C held (adsorbed) from above by the clamp (adsorption clamp) K, the cutting disc 101 is drawn downwards through the suction hole ST3. As a result, the air in the gap 102 is drawn in, and the cutting disc 101 around the movable stage ST2 is drawn in, causing the cutting disc 101 to peel off at the outer edge of the semiconductor chip C.

[0013] After that, as Figure 9 As shown in (B), the movable stage ST2 is moved in the direction of arrow X. This reduces the area of ​​the semiconductor chip C supported by the movable stage ST2, increases the area of ​​the dicing die 101 attracted, and ultimately, as shown... Figure 9 As shown in (C), the semiconductor chip C can be completely peeled off from the dicing piece 101.

[0014] However, when using the aforementioned slider-type pickup device to pick up the metal layer and adhesive layer from the adhesive sheet such as the cutting disc, if the adhesive sheet cannot be properly peeled off from the metal layer and adhesive layer when the movable stage ST2 is configured to attract the adhesive sheet from the suction hole ST3, the metal layer and adhesive layer will be pulled by the adhesive sheet, resulting in the following problem: bending and marks will occur on the metal layer at the edge of the movable stage ST2.

[0015] Therefore, the object of the present invention is to provide a tape for packaging electronic devices that can suppress the phenomenon of bending and imprinting of the metal layer with adhesive layer due to the edge portion of the movable stage of the pickup device when picking up the metal layer with adhesive layer from the adhesive tape.

[0016] (Technical solutions used to address the problem) To address the above issues, the electronic device packaging tape of the present invention has the following features: Adhesive tape having a substrate film and an adhesive layer; and The laminate consisting of the adhesive layer and the metal layer is configured to be laminated on the side of the adhesive layer opposite to the substrate film. The adhesive layer of the above-mentioned adhesive layer in the state of picking up the above-mentioned laminate from the above-mentioned adhesive tape has an adhesion force of 2 to 200 kPa, and the loss elastic modulus of the above-mentioned adhesive layer under the conditions of 25°C and 50% RH is less than 50 MPa.

[0017] The aforementioned electronic device packaging tape preferably has a loss modulus of elasticity of 0.2 MPa or higher under the conditions of 25°C and 50%RH.

[0018] The aforementioned electronic device packaging tape preferably contains copper or aluminum in the aforementioned metal layer.

[0019] The tape used for packaging the above-mentioned electronic devices is preferably made of metal with a thickness of 5 μm or more and less than 200 μm.

[0020] In addition, the aforementioned electronic device packaging tape is preferably made of adhesive layer containing (A) epoxy resin, (B) curing agent, (C) acrylic resin or phenoxy resin, and (D) surface-treated inorganic filler material.

[0021] In addition, the tape for packaging electronic devices preferably contains an acrylic polymer in the adhesive layer described above. The acrylic polymer is composed of an acrylate containing CH2=CHCOOR (where R is an alkyl group with 4 to 18 carbon atoms), a hydroxyl-containing monomer, and an isocyanate compound having a free radical reactive carbon-carbon double bond in the molecule.

[0022] (Invention effect) According to the present invention, when picking up a metal layer with an adhesive layer from an adhesive tape, it is possible to suppress the phenomenon of bending or imprinting on the metal layer due to the edge portion of the movable stage of the picking device. Attached Figure Description

[0023] Figure 1 A cross-sectional view illustrating the structure of an electronic device packaging strip according to an embodiment of the present invention.

[0024] Figure 2 In the diagram, (a) is a top view schematically illustrating the structure of the electronic device packaging strip according to an embodiment of the present invention, and (b) is a cross-sectional view thereof.

[0025] Figure 3 A perspective view illustrating the structure of an electronic device packaging strip according to an embodiment of the present invention.

[0026] Figure 4 The explanatory diagrams illustrating the manufacturing method of the electronic device packaging tape according to the embodiments of the present invention are as follows: (A) is a longitudinal sectional view showing the bonding process of the metal layer; (B) is a longitudinal sectional view showing the bonding process of the adhesive layer; (C) is a transverse sectional view showing the pre-cutting process; and (D) is a perspective view showing the removal process of the unwanted parts.

[0027] Figure 5 The explanatory diagrams illustrating the manufacturing method of the electronic device packaging tape according to the embodiments of the present invention are as follows: (A) is a cross-sectional view showing the bonding process of the adhesive tape, (B) is a cross-sectional view showing the pre-cutting process, and (C) is a cross-sectional view showing the removal process of unwanted portions.

[0028] Figure 6 A cross-sectional view illustrating the method of using the electronic device packaging tape according to an embodiment of the present invention.

[0029] Figure 7 A cross-sectional view illustrating the method of using the electronic device packaging tape according to an embodiment of the present invention.

[0030] Figure 8 A cross-sectional view is shown to schematically illustrate the structure of an electronic device package using an electronic device packaging strip according to an embodiment of the present invention.

[0031] Figure 9 This is an illustration showing how to use a slider-type pickup device.

[0032] Figure 10 This is a top view schematically showing the positional relationship between the stage and the semiconductor chip of the slider-type pickup device. Detailed Implementation

[0033] The embodiments of the present invention will now be described in detail.

[0034] Figure 1 This is a cross-sectional view showing an electronic device packaging tape 1 according to an embodiment of the present invention. The electronic device packaging tape 1 has an adhesive tape 5 comprising a substrate film 51 and an adhesive layer 52 disposed on the substrate film 51, and a laminate consisting of an adhesive layer 4 and a metal layer 3 is disposed on the adhesive layer 52. In this embodiment, the adhesive layer 4 and a metal layer 3 are laminated on the adhesive layer 52. The laminate consisting of the adhesive layer 4 and the metal layer 3 is indirectly laminated, separated by a primer layer or similar material to ensure good adhesion between the two.

[0035] The electronic device packaging of the present invention preferably uses a strip 1 as shown in the figure. Figure 2 and Figure 3 Cut the adhesive tape 5 into the ring frame R as shown (refer to...). Figure 7 The metal layer 3 and the adhesive layer 4 are cut into the corresponding shapes (pre-cutting process) in this embodiment.

[0036] The electronic device packaging tape 1 of the present invention is preferably as follows: Figure 2 and Figure 3 As shown, the substrate strip 2, which forms a multi-layered body consisting of a metal layer 3, an adhesive layer 4, and an adhesive strip 5 (label part 5a) cut into a shape corresponding to the ring frame R, is wound into a roll. Although it is wound into a roll in this embodiment, it can also be a form in which the multi-layered body provided on the substrate strip 2 is cut one by one.

[0037] When pre-cut and wound into a roll, such as Figure 2 and Figure 3 As shown, the electronic device packaging tape 1 has a substrate tape 2, on which are provided: a metal layer 3 having a given planar shape, an adhesive layer 4 having a given planar shape and being stacked with the metal layer 3 on the side opposite to the substrate tape 2 side of the metal layer 3, and an adhesive tape 5 having a given planar shape covering the adhesive layer 4 and being disposed around the adhesive layer 4 in contact with the substrate tape 2, and a peripheral portion 5b surrounding the outer side of the label portion 5a.

[0038] The label portion 5a has a shape corresponding to the cutting ring frame R. The shape corresponding to the cutting ring frame R is preferably a similar shape to the inner side of the ring frame R, but larger in size than the inner side of the ring frame R. It is not necessarily circular, but a shape close to a circle is preferred, and even more preferably circular. The peripheral portion 5b includes a shape that completely surrounds the outer side of the label portion 5a and a shape that does not completely surround it, as shown in the illustration. Furthermore, the peripheral portion 5b may not be provided, but if it is provided, the tension applied to the label portion 5a during winding can be dispersed when it is wound into a roll.

[0039] The adhesive layer 4 has a given planar shape, which is a shape that fits the ring frame R around the periphery of the label portion 5a of the adhesive tape 5, and is smaller than the label portion 5a so that it can be lifted by the abutment member of the pickup device. The adhesive layer 4 is preferably a similar shape to the label portion 5a but smaller in size. The adhesive layer 4 does not necessarily have to be circular, but a shape close to a circle is preferred, and more preferably circular.

[0040] The metal layer 3 and the adhesive layer 4 have the same shape, and the adhesive layer 4 is stacked on top of the metal layer 3. The stacking mentioned here only requires stacking the main parts; the metal layer 3 and the adhesive layer 4 do not necessarily need to be the same size, but for ease of manufacturing, it is preferable that they are approximately the same shape. The constituent elements will be explained below.

[0041] <Substrate Belt 2> The substrate tape 2 can also be made of a known separator, but a pre-cut substrate tape used for electronic device packaging tape can also be used directly. When using a pre-cut substrate tape used for electronic device packaging tape, the substrate tape 2 needs to keep the metal layer 3 adhered during the pre-cutting process. Therefore, for example, a tape having a resin film and an adhesive layer for the substrate tape disposed on one side of the resin film can be preferably used.

[0042] The raw materials for the resin film constituting the substrate strip 2 can be known materials, but examples include polyester (PET, PBT, PEN, PBN, PTT) based, polyolefin (PP, PE) based, copolymer (EVA, EEA, EBA) based, and films in which a portion of these materials is replaced to further improve adhesion or mechanical strength. Alternatively, a laminate of these films can be used. From the perspectives of heat resistance, smoothness, and ease of acquisition, polyethylene terephthalate, polypropylene, and high-density polyethylene are preferred.

[0043] The thickness of the resin film constituting the substrate strip 2 is not particularly limited and can be set appropriately, but is preferably 10 to 150 μm.

[0044] The resin used as the adhesive layer for the substrate tape can be a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, etc., but an acrylic adhesive based on an acrylic polymer is preferred.

[0045] Examples of acrylic polymers include acrylic polymers that use one or more of the following monomer components: alkyl methacrylates (e.g., methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, isopentyl methacrylate, hexyl methacrylate, heptyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, isooctyl methacrylate, nonyl methacrylate, decyl methacrylate, isodecanyl methacrylate, undecyl methacrylate, dodecyl methacrylate, tridecyl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, eicosyl methacrylate, etc., which are straight-chain or branched alkyl esters with 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms) and cycloalkyl methacrylates (e.g., cyclopentyl methacrylate, cyclohexyl methacrylate, etc.). Furthermore, "(meth)acrylate" refers to acrylates and / or methacrylates, and has the exact same meaning as "(methyl)" in this invention.

[0046] Acrylic polymers, intended to modify cohesiveness, heat resistance, etc., may contain units corresponding to the aforementioned alkyl (meth)acrylates or other monomers capable of copolymerizing with cycloalkyl esters, as needed. Examples of such monomers include: acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and other carboxyl-containing monomers; maleic anhydride, itaconic anhydride, and other anhydride monomers; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, and methpropylene (meth)acrylate. Monomers containing hydroxyl groups, such as 10-hydroxydecyl methacrylate, 12-hydroxylaurate (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; monomers containing sulfonic acid groups, such as styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, propyl methacrylate sulfonate, and (meth)acryloyloxynaphthalene sulfonic acid; monomers containing phosphate groups, such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile, etc. One or more of these copolymerizable monomers may be used. The preferred amount of these copolymerizable monomers is less than 40% by weight of the total monomer composition.

[0047] Furthermore, for crosslinking purposes, acrylic polymers may also contain polyfunctional monomers as copolymerizing monomers as needed. Examples of such polyfunctional monomers include: hexanediol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, neopentyl glycol dimethacrylate, pentaerythritol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexamethacrylate, epoxy methacrylate, polyester methacrylate, and urethane methacrylate. One or more of these polyfunctional monomers may be used. Regarding the amount of polyfunctional monomer used, from the perspective of adhesive properties, it is preferable to use 30% by weight or less of the total monomer content.

[0048] The preparation of acrylic polymers can be carried out, for example, in a mixture of one or more component monomers using appropriate methods such as solution polymerization, emulsion polymerization, bulk polymerization, or suspension polymerization. From the viewpoint of preventing wafer contamination, the adhesive layer for the substrate tape preferably suppresses the presence of low molecular weight substances. From the above perspective, it is preferable to use an acrylic polymer with a weight-average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, as the main component. Therefore, the adhesive can also be configured with an appropriate crosslinking type based on internal or external crosslinking methods.

[0049] In addition, to control the crosslinking density of the adhesive layer for the substrate tape and improve the peelability with the adhesive tape 5, appropriate external crosslinking agents can be used for crosslinking treatment, such as polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metal salt compounds, metal chelate compounds, amino resin compounds, or peroxides. Alternatively, appropriate methods can be used, such as mixing low-molecular-weight compounds with two or more carbon-carbon double bonds and crosslinking them by irradiation with energy rays. When using an external crosslinking agent, its amount is appropriately determined based on the balance with the base polymer to be crosslinked, and further, based on its intended use as an adhesive. Generally, it is preferable to use about 20 parts by weight or less relative to 100 parts by weight of the base polymer, and more preferably 0.1 to 20 parts by weight.

[0050] The thickness of the adhesive layer for the substrate tape can be appropriately determined without particular limitations, generally ranging from 5 to 200 μm. Furthermore, the adhesive layer for the substrate tape can consist of a single layer or multiple layers.

[0051] <Adhesive Tape 5> There are no particular limitations on the adhesive tape 5; any existing adhesive tape can be used. For example, an adhesive tape with an adhesive layer 52 provided on the substrate film 51 may be preferred as the adhesive tape 5.

[0052] As for the substrate film 51, any known substrate film can be used without particular restrictions. However, when using a radiation-curable material as the adhesive layer 52 described later, a substrate film with radiation permeability is preferred.

[0053] Examples of materials include: homopolymers or copolymers of α-olefins such as polyethylene, polypropylene, ethylene-propylene copolymers, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene-methyl acrylate copolymers, ethylene-acrylic acid copolymers, ionomers, etc., or mixtures thereof; thermoplastic elastomers such as polyurethane, styrene-ethylene-butene or pentene copolymers, polyamide-polyol copolymers, etc., and mixtures thereof. Furthermore, the substrate film can be a substrate film composed of a mixture of two or more materials selected from these groups, and these substrate films can be single-layered or multi-layered.

[0054] The thickness of the substrate film 51 is not particularly limited and can be set appropriately, but it is preferably 50 to 200 μm.

[0055] To improve the adhesion between the substrate film 51 and the adhesive layer 52, the surface of the substrate film 51 can be subjected to chemical or physical surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high voltage electric shock exposure, or ionization radiation treatment.

[0056] In addition, in this embodiment, the adhesive layer 52 is directly provided on the substrate film 51, but it can also be provided indirectly through a primer layer for improving adhesion or an anchoring layer, stress relaxation layer, antistatic layer, etc. for improving cutting performance.

[0057] The resin used as the adhesive layer 52 of the adhesive tape 5 is not particularly limited, and known adhesives such as chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, and epoxy resin can be used. However, acrylic adhesives based on acrylic polymers are preferred.

[0058] Examples of acrylic polymers include acrylic polymers that use one or more of the following monomer components: alkyl methacrylates (e.g., methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, isopentyl methacrylate, hexyl methacrylate, heptyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, isooctyl methacrylate, nonyl methacrylate, decyl methacrylate, isodecanyl methacrylate, undecyl methacrylate, dodecyl methacrylate, tridecyl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, eicosyl methacrylate, etc., which are straight-chain or branched alkyl esters with 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms) and cycloalkyl methacrylates (e.g., cyclopentyl methacrylate, cyclohexyl methacrylate, etc.). Furthermore, "(meth)acrylate" refers to acrylates and / or methacrylates, and has the same meaning as "(methyl)" in this invention.

[0059] Acrylic polymers, for the purpose of modifying cohesiveness, heat resistance, etc., may contain units corresponding to other monomer components that can copolymerize with the aforementioned alkyl or cycloalkyl methacrylates, as needed. Examples of such monomer components include: acrylic acid, methacrylic acid, carboxyethyl methacrylate, carboxypentyl methacrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and other carboxyl-containing monomers; maleic anhydride, itaconic anhydride, and other anhydride monomers; 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate, 8-hydroxyoctyl methacrylate, and other monomers containing carboxyl groups. Monomers containing hydroxyl groups, such as 10-hydroxydecyl acrylate, 12-hydroxylaurate (meth)acrylate, and methyl (4-hydroxymethylcyclohexyl) acrylate; monomers containing sulfonic acid groups, such as styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, propyl methacrylate sulfonate, and (meth)acryloyloxynaphthalene sulfonic acid; monomers containing phosphate groups, such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile, etc. One or more of these copolymerizable monomers may be used. The preferred amount of these copolymerizable monomers is less than 40% by weight of the total monomer composition.

[0060] Furthermore, for crosslinking purposes, acrylic polymers may also contain polyfunctional monomers as copolymerizing monomers as needed. Examples of such polyfunctional monomers include: hexanediol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, neopentyl glycol dimethacrylate, pentaerythritol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexamethacrylate, epoxy methacrylate, polyester methacrylate, and urethane methacrylate. One or more of these polyfunctional monomers may be used. From the perspective of adhesive properties, the amount of polyfunctional monomer used is preferably 30% by weight or less of the total monomer composition.

[0061] The preparation of acrylic polymers can be carried out, for example, in a mixture of one or more component monomers using appropriate methods such as solution polymerization, emulsion polymerization, bulk polymerization, or suspension polymerization. The adhesive layer 52 preferably suppresses the presence of low molecular weight substances. From the above perspective, it is preferable to use an acrylic polymer with a weight-average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, as the main component. Therefore, the adhesive can also be configured with an appropriate crosslinking type based on internal or external crosslinking methods.

[0062] In addition, to control the crosslinking density of the adhesive layer 52 and improve its pick-up properties, appropriate external crosslinking agents can be used for crosslinking treatment, such as polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metal salt compounds, metal chelate compounds, amino resin compounds, or peroxides. Alternatively, low-molecular-weight compounds with two or more carbon-carbon double bonds can be mixed and crosslinked by irradiation with energy rays. When using an external crosslinking agent, its amount is appropriately determined based on the balance with the base polymer to be crosslinked, and further, based on its intended use as an adhesive. Generally, it is preferable to use about 20 parts by weight or less relative to 100 parts by weight of the base polymer, and more preferably 0.1 to 20 parts by weight. Furthermore, from the viewpoint of preventing degradation, various adhesive additives, anti-aging agents, and other additives besides the above-mentioned components can be used in the adhesive as needed.

[0063] As the adhesive constituting the adhesive layer 52, a radiation-curing adhesive is preferred. Examples of radiation-curing adhesives include additive-type radiation-curing adhesives in which a radiation-curing monomeric component or a radiation-curing oligomer component is incorporated into the aforementioned adhesive.

[0064] Examples of suitable radiocurable monomers include: urethane (meth)acrylates, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and 1,4-butanediol di(meth)acrylate. One or more of these monomers may be used.

[0065] Furthermore, various oligomers such as polyurethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers can be used as the radiation-curable component, but substances with a molecular weight in the range of approximately 100 to 30,000 are suitable. The amount of radiation-curable monomer or oligomer component can be appropriately determined based on the type of adhesive layer 52 to reduce the adhesive strength of the adhesive layer 52. Generally, it is approximately 5 to 500 parts by weight, preferably 70 to 150 parts by weight, relative to 100 parts by weight of the base polymer such as acrylic polymer constituting the adhesive.

[0066] In addition to the aforementioned additive-type radiation-curing adhesives, intrinsic-type radiation-curing adhesives, which use substances with carbon-carbon double bonds in the polymer side chains or main chains or at the ends of the main chains as the base polymer, are also examples of radiation-curing adhesives. Intrinsic-type radiation-curing adhesives do not require the presence of oligomer components as low-molecular-weight components, or because they are not present in large quantities, the oligomer components do not migrate within the adhesive over time, thus forming a stable layered adhesive layer 52, which is therefore preferable.

[0067] There are no particular limitations on the base polymer having carbon-carbon double bonds; any substance having carbon-carbon double bonds and adhesive properties can be used. As such a base polymer, polymers with an acrylic polymer as their basic backbone are preferred. Examples of acrylic polymers exemplified above can be cited as examples of the basic backbone of acrylic polymers.

[0068] There are no particular limitations on the methods for introducing carbon-carbon double bonds into acrylic polymers, and various methods can be used. However, introducing carbon-carbon double bonds into the polymer side chains is relatively easy in terms of molecular design. Examples include: after copolymerizing a monomer with functional groups onto the acrylic polymer, a compound with functional groups that can react with those functional groups and carbon-carbon double bonds is subjected to a condensation or addition reaction while maintaining the radioactive curability of the carbon-carbon double bonds.

[0069] Examples of combinations of these functional groups include: carboxylic acid group and epoxy group, carboxylic acid group and aziridinyl group, hydroxyl group and isocyanate group, etc. Among these combinations of functional groups, the combination of hydroxyl group and isocyanate group is preferred from the perspective of ease of reaction tracking. In addition, as long as the above-mentioned combination of acrylic polymers having carbon-carbon double bonds is generated by using the combination of these functional groups, the functional group can be either the acrylic polymer or the above-mentioned compound, but in the preferred combination described above, the case where the acrylic polymer has a hydroxyl group and the above-mentioned compound has an isocyanate group is preferred. In this case, examples of isocyanate compounds having carbon-carbon double bonds include: methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, etc. In addition, as acrylic polymers, substances formed by copolymerizing the hydroxyl-containing monomers mentioned above or ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, etc., can be used.

[0070] Intrinsic radiation-curing adhesives can use the aforementioned base polymers (especially acrylic polymers) with carbon-carbon double bonds alone, but can also be combined with photopolymerizable compounds such as the aforementioned radiation-curing monomer components or oligomer components to a degree that does not degrade the properties. The amount of the photopolymerizable compound is typically in the range of 30 parts by weight or less relative to 100 parts by weight of the base polymer, preferably in the range of 0 to 10 parts by weight.

[0071] In radiation-curing adhesives, it is preferable that a photopolymerization initiator is contained when the adhesive is cured using ultraviolet light or the like.

[0072] Among the above-mentioned acrylic polymers, acrylic polymer A, which is composed of an acrylate represented by CH2=CHCOOR (where R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl-containing monomer, and an isocyanate compound having a free radical reactive carbon-carbon double bond in the molecule, is particularly preferred.

[0073] If the number of carbon atoms in the alkyl group of the alkyl acrylate is less than 4, the polarity is sometimes high and the peeling force is too large, resulting in reduced pick-up. On the other hand, if the number of carbon atoms in the alkyl group of the alkyl acrylate exceeds 18, the glass transition temperature of the adhesive layer 52 is too high, and the bonding properties at room temperature are reduced. As a result, the metal layer 3 and the adhesive layer 4 sometimes peel off during cutting and expansion.

[0074] The aforementioned acrylic polymer A may contain units corresponding to other monomer components, as needed.

[0075] In acrylic polymer A, an isocyanate compound having a radical-reactive carbon-carbon double bond is used. That is, the acrylic polymer preferably has a structure formed by an addition reaction between the isocyanate compound containing the double bond and a polymer based on a monomer composition such as an acrylate or a hydroxyl-containing monomer. Therefore, the acrylic polymer preferably has a radical-reactive carbon-carbon double bond within its molecular structure. This allows for the creation of an active energy ray-cured adhesive layer (UV-cured adhesive layer, etc.) that is cured by irradiation with active energy rays (ultraviolet light, etc.), thereby reducing the peel strength between the metal layer 3 and the adhesive layer 52.

[0076] Examples of isocyanate compounds containing double bonds include: methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, and m-isopropenyl-α,α-dimethylbenzyl isocyanate. Two or more isocyanate compounds containing double bonds can be used alone or in combination.

[0077] Furthermore, in active energy ray-cured adhesives, external crosslinking agents can be appropriately used to adjust the adhesive strength before or after active energy ray irradiation. Specific methods for external crosslinking include adding so-called crosslinking agents such as polyisocyanate compounds, epoxy compounds, aziridine compounds, and melamine-based crosslinking agents to induce a reaction.

[0078] When using an external crosslinking agent, its amount is appropriately determined based on the balance with the base polymer to be crosslinked and the intended use as an adhesive. Generally, the amount of external crosslinking agent used is 20 parts by weight or less (preferably 0.1 to 10 parts by weight) relative to 100 parts by weight of the base polymer. Furthermore, in active energy ray-cured adhesives, in addition to the above-mentioned components, various conventionally known additives such as tackifiers, anti-aging agents, and foaming agents may be further added as needed.

[0079] The thickness of the adhesive layer 52 is not particularly limited and can be appropriately determined, generally ranging from 5 to 200 μm. Furthermore, the adhesive layer 52 can be composed of a single layer or multiple layers.

[0080] The tack force of the adhesive layer 52 at 25°C in the state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is 2 to 200 kPa. Since the tack force of the adhesive layer 52 is in the state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is composed of a radiation-curing adhesive. When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive tape 5 has been irradiated with radiation and the adhesive force has decreased, this refers to the tack force after radiation irradiation.

[0081] The adhesive force of the adhesive layer 52 is the peak value in the probe adhesion test. The probe adhesion can be measured using, for example, the TAC-II adhesion testing machine from Rhesca Corporation. Regarding the test mode, a "Constant Load" mode is used, where the probe is pressed into the test chamber to a set pressure value and continuously controlled to maintain that pressure value until a set time has elapsed. With the adhesive layer 52 of the adhesive tape 5 facing upwards, the cylindrical probe is brought into contact from above and peeled upwards, and the force required for peeling is measured.

[0082] The adhesive force of the adhesive layer 52 significantly contributes to the cohesive force of the adhesive layer and the interfacial adhesion, and can be controlled by adjusting the balance between the two. Furthermore, it can also be varied by adjusting the thickness of the adhesive layer, the elastic modulus of the substrate film, or its thickness.

[0083] If the adhesive force of the adhesive layer 52 in the state where the laminate of the adhesive layer 4 and the metal layer 3 is picked up from the adhesive tape 5 is 200 kPa or less, then when the movable stage ST2 is positioned below the metal layer 3 and the adhesive layer 4 to be picked up and the adhesive sheet 5 is attracted from the suction hole ST3, the adhesive sheet 5 can be effectively peeled off from the metal layer 3 and the adhesive layer 4. Therefore, it is possible to prevent the metal layer 3 and the adhesive layer 4 from being pulled by the adhesive sheet 5, resulting in bending or marks on the metal layer 3 at the edge of the movable stage ST2. Furthermore, if the adhesive force is 2 kPa or more, when picking up the metal layer 3 and the adhesive layer 4, it is possible to prevent the outer edge of the metal layer 3 with the adhesive layer 4 from peeling off and warping when the adhesive sheet 5 is extended, thus preventing creases from forming on the metal layer 3.

[0084] <Metal Layer 3> The metal constituting the metal layer 3 is not particularly limited. For example, from the perspective of heat dissipation and preventing warping of the electronic device package 8, at least one selected from stainless steel, aluminum, iron, titanium, tin, nickel, and copper is preferred. Among these, copper is particularly preferred from the viewpoint of achieving high thermal conductivity and heat dissipation. Furthermore, aluminum is particularly preferred from the viewpoint of preventing warping of the electronic device package 8.

[0085] The thickness of metal layer 3 is 5 μm or more and less than 200 μm. By setting it to 5 μm or more, the thickness of the movable stage ST2 (see reference) can be suppressed. Figure 7 The edge of (C) can cause bending and imprinting in the metal layer 3. In addition, if it is less than 200μm, it is easy to process and can suppress the phenomenon of wrinkles caused by excessive toughness of the metal layer when it needs to be bent along the core or bonding roller during winding or bonding.

[0086] As such a metal layer 3, a metal foil can be used, which can be an electrolytic foil or a rolled foil.

[0087] <Adhesive layer 4> Adhesive layer 4 is an adhesive layer in which the adhesive has been pre-filmed.

[0088] The adhesive layer 4 is formed of at least a thermosetting resin, preferably at least a thermosetting resin and a thermoplastic resin.

[0089] Examples of thermoplastic resins include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resins such as 6-nylon or 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET (polyethylene terephthalate) or PBT (polybutylene terephthalate), polyamide-imide resins, or fluoropolymers. Thermoplastic resins can be used alone or in combination of two or more. Among these thermoplastic resins, acrylic resins are particularly preferred because they have fewer ionic impurities and excellent stress relaxation properties, which easily ensure the reliability of semiconductor devices. Phenoxy resins are particularly preferred because they balance flexibility and strength while also providing high toughness, which easily ensures the reliability of semiconductor devices.

[0090] The term "acrylic resin" is not particularly limited, and examples include polymers containing one or more of the following: acrylic acid or methacrylic acid esters having straight-chain or branched alkyl groups having 30 or fewer carbon atoms (preferably 1 to 18 carbon atoms). That is, in this invention, "acrylic resin" has a broad meaning that also includes methacrylic acid resins. Examples of the aforementioned alkyl groups include, for instance, methyl, ethyl, propyl, isopropyl, n-butyl, tert-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl, 2-ethylhexyl, octyl, isooctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, stearyl, octadecyl, etc.

[0091] In addition, there are no particular limitations on other monomers used to form acrylic resins (monomers other than alkyl esters of acrylic acid or methacrylic acid with alkyl groups having 30 or fewer carbon atoms), and examples include: various carboxyl-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, or crotonic acid; various acid anhydride monomers such as maleic anhydride or itaconic anhydride; 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, and 4-hydroxybutyl methacrylate. 6-Hydroxyhexyl ester, (meth)acrylate-8-hydroxyoctyl ester, (meth)acrylate-10-hydroxydecyl ester, (meth)acrylate-12-hydroxylaurate, or (4-hydroxymethylcyclohexyl) methyl acrylate, and other monomers containing hydroxyl groups; styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, (meth)acrylate sulfonate propyl ester, or (meth)acryloyloxynaphthalene sulfonic acid, and other monomers containing sulfonic acid groups; or 2-hydroxyethylacryloyl phosphate, and other monomers containing phosphate groups, etc. Furthermore, (meth)acrylate refers to acrylic acid and / or methacrylic acid, and the (methyl) in this invention has the same meaning throughout.

[0092] In addition to epoxy resins and phenolic resins, other thermosetting resins include amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. Thermosetting resins can be used alone or in combination of two or more. Epoxy resins, which contain relatively few ionic impurities that corrode semiconductor devices, are particularly suitable as thermosetting resins. Furthermore, phenolic resins are suitable as curing agents for epoxy resins.

[0093] There are no particular limitations on the epoxy resin used. For example, difunctional or polyfunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol Novolak type epoxy resin, o-cresol Novolak type epoxy resin, trihydroxyphenylmethane type epoxy resin, and tetraphenol ethane type epoxy resin can be used; or hydantoin type epoxy resin, triglycidyl isocyanurate type epoxy resin, or glycidylamine type epoxy resin can be used.

[0094] As epoxy resins, the Novolak type epoxy resin, biphenyl type epoxy resin, trihydroxyphenylmethane type epoxy resin, and tetraphenol ethane type epoxy resin, as exemplified, are particularly preferred. This is because these epoxy resins are highly reactive with phenolic resins, which serve as curing agents, and also possess excellent heat resistance and other properties.

[0095] Furthermore, phenolic resins are those that function as curing agents for epoxy resins. Examples include: phenol novolak resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolak resin, nonylphenol novolak resin, and other novolak-type phenolic resins; resol-type phenolic resins; and polyhydroxystyrene, such as poly(p-hydroxystyrene). Phenolic resins can be used alone or in combination of two or more. Among these phenolic resins, phenol novolak resin and phenol aralkyl resin are particularly preferred. This is because they can improve the connection reliability of semiconductor devices.

[0096] Regarding the blending ratio of epoxy resin and phenolic resin, a suitable ratio is one in which the hydroxyl groups in the phenolic resin are in an amount of 0.5 to 2.0 equivalents relative to each equivalent of epoxy groups in the epoxy resin component. More suitable is a ratio of 0.8 to 1.2 equivalents. This is because if the blending ratio is outside the above range, a sufficient curing reaction cannot occur, and the properties of the cured epoxy resin product are easily deteriorated.

[0097] Alternatively, thermosetting accelerators for epoxy resins and phenolic resins can also be used. There are no particular limitations on the thermosetting accelerator; it can be appropriately selected from known thermosetting accelerators. Thermosetting accelerators can be used alone or in combination of two or more. Examples of thermosetting accelerators that can be used include amine-based curing accelerators, phosphorus-based curing accelerators, imidazole-based curing accelerators, boron-based curing accelerators, and phosphorus-boron-based curing accelerators.

[0098] Phenolic resin is preferred as the curing agent for epoxy resin as described above, but known curing agents such as imidazole, amine, and acid anhydride can also be used.

[0099] It is important that the adhesive layer 4 has adhesive (sealing) properties to the adhered objects 9, such as electronic devices. Therefore, to pre-crosslink the adhesive layer 4 to a certain extent, a multifunctional compound that reacts with functional groups at the ends of the polymer molecular chains can be added as a crosslinking agent. This improves the adhesive properties at high temperatures and enhances heat resistance.

[0100] There are no particular limitations on the crosslinking agent used; any known crosslinking agent can be used. Specifically, examples include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Isocyanate-based or epoxy-based crosslinking agents are suitable as crosslinking agents. Furthermore, two or more of the above-mentioned crosslinking agents can be used alone or in combination.

[0101] Furthermore, in this invention, crosslinking treatment can be performed by irradiation with electron beams or ultraviolet light, or by using a crosslinking agent instead of a crosslinking agent.

[0102] Other additives may be appropriately incorporated into the adhesive layer 4 as needed. Examples of such additives include fillers, flame retardants, silane coupling agents, ion traps, extenders, anti-aging agents, antioxidants, and surfactants.

[0103] As a filler, it can be either an inorganic or organic filler, but an inorganic filler is more suitable. By combining it with fillers such as inorganic fillers, the thermal conductivity and elastic modulus of the adhesive layer 4 can be improved. Examples of inorganic fillers include: ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, and silicon nitride; metals or alloys such as aluminum, copper, silver, gold, nickel, chromium, lead, tin, zinc, palladium, and solder; and various inorganic powders containing carbon, etc. Fillers can be used alone or in combination of two or more. Silica or alumina are particularly suitable fillers, and fused silica is especially suitable as silica. Furthermore, the average particle size of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured, for example, using a laser diffraction-type particle size distribution measuring device.

[0104] The amount of filler (especially inorganic filler) is preferably 98% by weight or less (0% to 98% by weight) relative to the organic resin component. In the case of silica, 0% to 70% by weight is suitable, and in the case of functional inorganic fillers such as those for thermal conductivity or electrical conductivity, 10% to 98% by weight is suitable.

[0105] In addition, examples of flame retardants include antimony trioxide, antimony pentoxide, and brominated epoxy resins. Flame retardants can be used alone or in combination of two or more. Examples of silane coupling agents include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-epoxypropoxypropyltrimethoxysilane, and γ-epoxypropoxypropylmethyldiethoxysilane. Silane coupling agents can be used alone or in combination of two or more. Examples of ion scavengers include hydrotalcite and bismuth hydroxide. Ion scavengers can be used alone or in combination of two or more.

[0106] From the viewpoint of adhesion and reliability, adhesive layer 4 is particularly preferably composed of (A) epoxy resin, (B) curing agent, (C) acrylic resin or phenoxy resin, and (D) surface-treated inorganic filler material.

[0107] By using (A) epoxy resin, high adhesion, water resistance, and heat resistance are obtained. The epoxy resin can be any epoxy resin known above. (B) Curing agent can be any curing agent known above.

[0108] (C) Acrylic resins combine flexibility and strength with high toughness. Preferred acrylic resins are cross-linked (meth)acrylic acid copolymers obtained by polymerizing monomers with epoxy, glycidyl, alcoholic hydroxyl, phenolic hydroxyl, or carboxyl groups as cross-linking functional groups, with a Tg (glass transition temperature) of -50°C to 50°C. Further inclusion of acrylonitrile or similar compounds to exhibit rubber-like properties results in even higher toughness.

[0109] Furthermore, regarding (C) phenoxy resins, phenoxy resins have long molecular chains and a structure similar to epoxy resins. They function as flexible materials in compositions with high crosslinking density and impart high toughness, thus resulting in compositions with high strength and toughness. Preferred phenoxy resins are those with a bisphenol A-type backbone. Additionally, commercially available phenoxy resins such as bisphenol F-type phenoxy resins, bisphenol A / F mixed-type phenoxy resins, and brominated phenoxy resins are also preferred.

[0110] As an inorganic filler material after surface treatment (D), examples include inorganic fillers surface-treated with coupling agents. As the inorganic filler material, the aforementioned known inorganic fillers, such as silica and alumina, can be used. By surface treatment with a coupling agent, the dispersibility of the inorganic filler is improved. Therefore, an adhesive layer 4 with excellent flowability is obtained, thereby improving the adhesion to the metal layer 3. Furthermore, since a high filling rate of inorganic filler can be achieved, the water absorption rate can be reduced, thus improving moisture resistance.

[0111] For example, the surface treatment of inorganic filler materials using silane coupling agents is carried out in the following way: the inorganic filler material is dispersed in a silane coupling agent solution using a known method, thereby causing the hydroxyl groups present on the surface of the inorganic filler to react with the silanol groups obtained by hydrolysis of the alkoxy groups and other hydrolytic groups of the silane coupling agent, and thus generating Si-O-Si bonds on the surface of the inorganic filler.

[0112] The thickness of the adhesive layer 4 is not particularly limited, but from a general operational point of view, it is preferably 3 μm or more, more preferably 5 μm or more, and to facilitate the thinning of semiconductor packaging, it is preferably 150 μm or less, more preferably 100 μm or less. The adhesive layer 4 can be composed of a single layer or multiple layers.

[0113] Furthermore, the loss modulus of elasticity G" of the adhesive layer 4 under conditions of 25°C and 50% RH is 50 MPa or less. Moreover, it is preferable that the loss modulus of elasticity G" under conditions of 25°C and 50% RH is 0.2 MPa or more.

[0114] The loss modulus of elasticity "G" is measured using a dynamic viscoelasticity measuring device, starting from 10°C and increasing at a rate of 5°C / min, with a measurement frequency of 1Hz, until it reaches 25°C.

[0115] If the loss modulus of elasticity G” of the adhesive layer 4 under the conditions of 25°C and 50%RH is 50MPa or less, then when the movable stage ST2 is positioned below the metal layer 3 and adhesive layer 4 of the object to be picked up and the adhesive sheet 5 is attracted through the suction hole ST3, the adhesive sheet 5 can be well peeled off from the metal layer 3 and adhesive layer 4. Therefore, it is possible to suppress the phenomenon that the metal layer 3 and adhesive layer 4 are pulled by the adhesive sheet 5, resulting in bending or imprinting on the metal layer 3 at the edge of the movable stage ST2. In addition, if the loss modulus of elasticity G” is 0.2MPa or more, then when picking up the metal layer 3 and adhesive layer 4, the following phenomenon can be suppressed: when the adhesive sheet 5 is extended, peeling occurs at the interface between the adhesive layer 4 and the metal layer 3, resulting in warping of the outer edge of the metal layer 3 or the inability to pick it up.

[0116] Furthermore, the adhesive layer 4 preferably has a peel force of 0.3N or more with the metal layer 3 at stage B (uncured or semi-cured state) (23°C, peel angle 180°, linear speed 300mm / min). If the peel force is less than 0.3N, peeling may occur between the adhesive layer 4 and the metal layer 3 during single-piece cutting.

[0117] The water absorption rate of adhesive layer 4 is preferably less than 1.5 vol%. The method for determining the water absorption rate is as follows. That is, an adhesive layer 4 (film adhesive) with a size of 50×50 mm is used as a sample. The sample is dried in a vacuum dryer at 120°C for 3 hours. After it is allowed to cool naturally in the dryer, the dried mass is measured and recorded as M1. After the sample is immersed in distilled water at room temperature for 24 hours, it is taken out, the sample surface is wiped with filter paper, and it is weighed quickly and recorded as M2. The water absorption rate is calculated according to the following formula (1).

[0118] Water absorption rate (vol%) = [(M2 - M1) / (M1 / d)] × 100 (1) Here, d is the density of the membrane.

[0119] If the water absorption rate exceeds 1.5 vol%, there is a risk of encapsulation cracks during soldering reflow due to the absorbed moisture.

[0120] The saturated moisture absorption rate of adhesive layer 4 is preferably below 1.0 vol%. The method for determining the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film adhesive) with a diameter of 100 mm is used as a sample. The sample is dried in a vacuum dryer at 120°C for 3 hours. After it is allowed to cool naturally in the dryer, the dried mass is measured and recorded as M1. After the sample is placed in a constant temperature and humidity bath at 85°C and 85% RH for 168 hours to absorb moisture, it is taken out and weighed quickly and recorded as M2. The saturated moisture absorption rate is calculated according to the following formula (2).

[0121] Saturated moisture absorption rate (vol%) = [(M2 - M1) / (M1 / d)] × 100 (2) Here, d is the density of the membrane.

[0122] If the saturated moisture absorption rate exceeds 1.0 vol%, the vapor pressure will increase due to moisture absorption during reflux, posing a risk of not obtaining good reflux characteristics.

[0123] The residual volatile components of the adhesive layer 4 are preferably less than 3.0 wt%. The method for determining the residual volatile components is as follows. That is, using an adhesive layer 4 (film adhesive) with a size of 50×50 mm as a sample, the initial mass of the sample is determined as M1. After heating the sample in a hot air circulating constant temperature bath at 200°C for 2 hours, it is weighed as M2. The residual volatile components are calculated according to the following formula (3).

[0124] Residual volatile matter (wt%) = [(M2-M1) / M1] × 100 (3) If the residual volatile components exceed 3.0 wt%, there is a risk that the solvent may evaporate due to heating during encapsulation, creating voids inside the adhesive layer 4 and resulting in encapsulation cracks.

[0125] Next, the manufacturing method of the electronic device packaging strip 1 according to this embodiment will be described. First, a strip of metal layer 3 is prepared. As the metal layer 3, commercially available metal foil can be used. Next, as... Figure 4 As shown in (A), a bonding roller r is used to bond the metal layer 3 on the bonding surface of the long strip of substrate 2.

[0126] A separate elongated film-like adhesive layer 4 is formed. The adhesive layer 4 can be formed using a resin composition prepared by conventional methods for forming film-like layers. Specifically, examples include methods such as coating the resin composition onto a suitable diaphragm (release paper, etc.) and drying it (in cases requiring heat curing, heat treatment and drying may be performed as needed) to form the adhesive layer 4. The resin composition can be a solution or a dispersion.

[0127] Next, as Figure 4As shown in (B), an adhesive layer 4 peeled off from the diaphragm is bonded to the metal layer 3 bonded to the substrate strip 2 using a bonding roller r or the like.

[0128] Furthermore, in the above-mentioned case, after the metal layer 3 is bonded to the substrate strip 2, the adhesive layer 4 is bonded to the metal layer 3. However, it is also possible to bond the side of the metal layer 3 to the substrate strip 2 after bonding the metal layer 3 and the adhesive layer 4.

[0129] Next, as Figure 4 As shown in (C), the adhesive layer 4 and the metal layer 3 are pre-cut into a given shape (in this case, a circular shape) using a guillotine cutter or similar tool, as shown in (C). Figure 4 As shown in (D), the unwanted portion 6 at the edge is peeled off and removed from the substrate strip 2. At this time, the adhesive layer 4 and the metal layer 3 can also be pre-monolithized to a given size, such as the size corresponding to the semiconductor chip C, using a guillotine cutter with a circular outer edge and a grid pattern.

[0130] Furthermore, the method for forming a metal layer 3 and an adhesive layer 4 of a given shape on the substrate strip 2 is not limited to the above. Either a long strip of metal layer 3 can be adhered to a long strip of substrate strip 2, punched into a given shape and the unwanted portion 6 removed, and then an adhesive layer 4 of the given shape can be adhered to the metal layer 3 of the given shape. Alternatively, the metal layer 3 and adhesive layer 4, each pre-formed into a given shape, can be adhered to the substrate strip 2. From the perspective of simplicity in the manufacturing process, the method described above is preferred. Figure 4 The manufacturing process is shown in (A) to (D).

[0131] In addition, an adhesive tape 5 is separately manufactured. The substrate film can be manufactured using existing known film-forming methods. Examples of such film-forming methods include calendering, casting in organic solvents, blow extrusion in a closed system, T-die extrusion, co-extrusion, and dry lamination. Next, an adhesive layer composition is coated onto the substrate film and dried (or heated for cross-linking if necessary) to form an adhesive layer 52. Examples of coating methods include roller coating, screen coating, and gravure coating. Alternatively, the adhesive layer composition can be directly coated onto the substrate film to form the adhesive layer 52 on the substrate film 51. Or, the adhesive layer composition can be coated onto a release paper with a peel-off treatment to form the adhesive layer 52, and then the adhesive layer 52 can be transferred onto the substrate film 51. Thus, an adhesive tape 5 with an adhesive layer 52 formed on the substrate film 51 is manufactured.

[0132] After that, as Figure 5 As shown in (A), the adhesive tape 5 is laminated on the adhesive layer 4 side of the metal layer 3 and the adhesive layer 4 of a given shape disposed on the substrate tape 2, such that the adhesive layer 52 side of the adhesive tape 5 is joined together.

[0133] Next, as Figure 5 As shown in (B), the adhesive tape 5 is pre-cut into a given shape using a guillotine cutter, as follows: Figure 5 As shown in (C), the electronic device packaging tape 1 is manufactured by removing the unwanted peripheral portion 7 from the substrate tape 2. Furthermore, the substrate tape 2 used for pre-cutting can then be peeled off, and a known diaphragm can be bonded to the adhesive layer 52 of the adhesive tape 5.

[0134] <How to Use> Next, refer to Figures 6-8 The method for manufacturing an electronic device package 8 using the electronic device packaging tape 1 of this embodiment will be described. Furthermore, in this embodiment, a semiconductor chip C flip-chip bonded to an adhesive 9 will be used as an example of the electronic device package 8.

[0135] [Assembly process of semiconductor wafer W] First, prepare a separate cut strip D, identical to the adhesive tape 5 of the electronic device packaging tape 1 of the present invention, with the central portion of the cut strip D as shown in the figure. Figure 6 As shown in (A), the semiconductor wafer W is bonded together to maintain adhesion and fixation (the mounting process of the semiconductor wafer W), while a ring frame R is bonded to the periphery of the dicing tape D. At this time, the dicing tape D is bonded to the back side of the semiconductor wafer W. The back side of the semiconductor wafer W refers to the side opposite to the circuit surface (also called the non-circuit surface, non-electrode forming surface, etc.). There is no particular limitation on the bonding method, but a heat-pressing method is preferred. Typically, pressing is performed while pressing using an extrusion unit such as a pressing roller.

[0136] [Semiconductor wafer W dicing process] Next, as Figure 6 As shown in (B), the semiconductor wafer W is diced. This cuts the semiconductor wafer W to a given size, making it into individual wafers (miniaturized), and thus manufacturing the semiconductor chip C. The dicing is performed, for example, from the circuit surface side of the semiconductor wafer W using conventional methods. Alternatively, in this process, a dicing method called a full cut, where the cut extends to the dicing tape D, can be used. There are no particular limitations on the dicing apparatus used in this process; any existing known dicing apparatus can be used. Furthermore, when extending the adhesive tape D, this extension can be performed using existing known extension apparatus.

[0137] [Pick-up process of semiconductor chip C] like Figure 6As shown in (C), the semiconductor chip C is picked up, peeling it from the dicing tape D. There are no particular limitations on the picking method, and various known methods can be used. For example, the dicing tape D, with the semiconductor chip C and the ring frame R attached, is placed on the stage S of the picking device with the substrate film side facing down. With the ring frame R fixed, the hollow cylindrical abutment member T is raised, expanding the dicing tape D. In this state, methods such as lifting each semiconductor chip C from the substrate film side of the dicing tape D using a needle N, and picking up the lifted semiconductor chip C using the picking device, are examples.

[0138] [Flip Chip Connection Process] Picked semiconductor chip C, such as Figure 6 As shown in (D), a flip-chip bonding method (flip-chip mounting method) is used to fix the semiconductor chip C to the substrate or other object 9. Specifically, the semiconductor chip C is fixed to the object 9 in a conventional manner with its circuit surface (also called surface, circuit pattern forming surface, electrode forming surface, etc.) facing the object 9. For example, firstly, flux is applied to the bumps 10 formed on the circuit surface side of the semiconductor chip C as connecting parts. Then, while the bumps 10 of the semiconductor chip C are brought into contact with and pressed against the conductive material 11 (solder, etc.) for bonding the connecting pads attached to the object 9, the bumps 10 and the conductive material 11 are melted, thereby ensuring electrical conduction between the semiconductor chip C and the object 9, and fixing the semiconductor chip C to the object 9 (flip-chip bonding process). At this time, a gap is formed between the semiconductor chip C and the object 9, and the gap distance is generally about 30 μm to 300 μm. The flux remaining on the opposing surfaces or gaps between the semiconductor chip C and the adhered object 9 is cleaned and removed.

[0139] As the substrate 9, various substrates such as lead frames and circuit boards (wiring circuit boards, etc.) can be used. There are no particular limitations on the material of such substrates; examples include ceramic substrates and plastic substrates. Examples of plastic substrates include epoxy resin substrates, bismaleimide triazine substrates, and polyimide substrates. Furthermore, by using other semiconductor chips as the substrate 9 and flip-chip bonding the aforementioned semiconductor chip C, a chip-on-chip structure can also be fabricated.

[0140] Next, as Figure 7 As shown in (A), the substrate strip 2 of the electronic device packaging strip 1 according to this embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive strip 5, and the periphery of the adhesive layer 52 is fixed to the ring frame R.

[0141] Next, as Figure 7As shown in (B), the metal layer 3 and the adhesive layer 4 are cut into wafers corresponding to the size of the semiconductor chip C. The cutting can be performed using the same process as the cutting process for the semiconductor wafer W described above. Furthermore, this process is not performed if a pre-cutting process is carried out to pre-wafer the metal layer 3 and the adhesive layer 4.

[0142] Next, the monolithized metal layer 3 and adhesive layer 4 are picked up and peeled off from the adhesive tape 5. For example... Figure 7 As shown in (C), pickup is performed using a slider-type pickup device. The slider-type pickup device can be used for pickup... Figure 9 , 10 The device is an existing semiconductor chip C as shown. That is, as... Figure 7 As shown in (C), when the metal layer 3 and the adhesive layer 4 are held in place by the clamp (adsorption clamp) K from above, the metal layer 3 and the adhesive layer 4 are held together by the suction hole ST3 (see reference). Figure 10 The adhesive tape 5 is drawn downwards. As a result, the adhesive tape 5 around the movable stage ST2 is attracted, and the adhesive tape 5 is peeled off at the outer edge of the individual pieces of the metal layer 3 and the adhesive layer 4. Afterwards, the movable stage ST2 is... Figure 7 The movable stage ST2 moves to the left. As a result, the bearing area of ​​the individual metal layer 3 and adhesive layer 4 supported by the movable stage ST2 decreases, while the area attracted by the adhesive tape 5 increases. Ultimately, the individual metal layer 3 with adhesive layer 4 is completely peeled off from the adhesive tape 5. At this time, since the adhesive force of the adhesive layer 52 is 2–200 kPa, and the loss modulus of elasticity of the adhesive layer 4 under 25°C and 50% RH conditions is less than 50 MPa, when the movable stage ST2 is positioned below the individual metal layer 3 and adhesive layer 4 and the adhesive tape 5 is attracted, the individual metal layer 3 with adhesive layer 4 can be effectively peeled off from the adhesive tape 5. As a result, bending and imprinting on the metal layer 3 caused by the edge portion of the movable stage ST2 of the pickup device can be suppressed.

[0143] Next, the adhesive layer 4 of the picked-up metal layer 3 and adhesive layer 4 is placed sideways as follows: Figure 8 As shown, it is attached to the back side of the flip-chip bonded semiconductor chip C. Then, a sealant (such as a sealing resin) is filled into the edges of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the substrate 9 to seal it. Sealing is performed using conventional methods. At this time, because the metal layer 3 is provided on the back side of the semiconductor chip C, the warping caused by the difference in thermal expansion rates between the semiconductor chip C and the substrate 9 during the flip-chip bonding process is offset by the difference in thermal expansion rates between the semiconductor chip C and the metal layer 3. Furthermore, because the metal layer 3 is provided on the back side of the semiconductor chip C, the heat generated during use as an electronic device is dissipated through the metal layer 3.

[0144] Furthermore, the above description describes a packaging structure in which the metal layer 3 is directly disposed on the back side of the semiconductor chip C via the adhesive layer 4, and the metal layer 3 is also sealed together with the semiconductor chip C. Alternatively, the metal layer 3 can be disposed on the upper surface of the sealing body via the adhesive layer 4 after the semiconductor chip C is sealed. Since the electronic device package 8 also warps during sealing, the metal layer 3 disposed on the upper surface of the sealing body can counteract this warping.

[0145] Furthermore, in the above description, the example of a semiconductor chip C flip-chip bonded to an adhesive 9 is used as the electronic device package 8, but it is not limited to this. For example, the metal layer 3 of the electronic device package strip 1 of the present invention can be used as a spacer between two chips in an electronic device package structure in which other semiconductor chips of the same size are stacked on the semiconductor chip, so that the metal layer 3 is provided on the lower semiconductor chip via the adhesive layer 4.

[0146] In this embodiment, the adhesive layer 52, the adhesive layer 4, and the metal layer 3 are sequentially provided. However, the adhesive layer 52, the metal layer 3, and the adhesive layer 4 can also be sequentially provided. In this case, the semiconductor wafer can be bonded to the adhesive layer 4, and the semiconductor wafer, the metal layer 3, and the adhesive layer 4 can be cut and picked up together. However, similarly as described above, the semiconductor wafer, the metal layer 3, and the adhesive layer 4 can be cut and picked up separately. After flip-chip bonding of the semiconductor chip, the metal layer 3 is bonded to the semiconductor chip via the adhesive layer 4. In this case, since the adhesive force of the adhesive layer 52 is 2 to 200 kPa, and the loss modulus of elasticity of the adhesive layer 4 at 25°C and 50% RH is less than 50 MPa, when picking up the metal layer 3 with the adhesive layer 4 from the adhesive tape 5, the phenomenon of bending and imprinting on the metal layer due to the edge portion of the movable stage ST2 of the picking device can be suppressed.

[0147] <Example> Next, in order to further clarify the effects of the present invention, the embodiments and comparative examples will be described in detail. However, the present invention is not limited to these embodiments.

[0148] (1) Making adhesive tape <Adhesive layer composition (1)> As an acrylic copolymer with functional groups (A1), a copolymer comprising 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and methacrylic acid, wherein the ratio of 2-ethylhexyl acrylate is 80 mol%, and the mass-average molecular weight is 700,000, was prepared. Next, 14 mol% of 2-isocyanate methacrylate was added to prepare an acrylic copolymer (a-1) with a glass transition temperature of -70°C.

[0149] A mixture containing 10 parts by weight of Coronate L (manufactured by Tosoh Corporation, trade name) as a polyisocyanate and 3 parts by weight of Irgacure-184 (manufactured by BASF Corporation, trade name) as a photopolymerization initiator was added to 100 parts by weight of the acrylic copolymer (a-1) and dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (1).

[0150] <Adhesive layer composition (2)> As an acrylic copolymer with functional groups (A1), a copolymer comprising 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, methyl acrylate, and methacrylic acid, wherein the proportion of 2-ethylhexyl acrylate is 26 mol%, and the mass-average molecular weight is 500,000, was prepared. Next, 10 mol% of 2-isocyanate methacrylate was added to prepare an acrylic copolymer (a-2) with a glass transition temperature of -20°C.

[0151] The mixture containing 2 parts by weight of Coronate L (manufactured by Tosoh Corporation, trade name) as a polyisocyanate and 3 parts by weight of Irgacure-651 (manufactured by BASF Corporation, trade name) as a photopolymerization initiator, relative to 100 parts by weight of the acrylic copolymer (a-2), was dissolved in ethyl acetate and stirred to obtain the adhesive layer composition (2).

[0152] <Adhesive layer composition (3)> As an acrylic copolymer with functional groups (A1), an acrylic copolymer (a-3) containing 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, methyl acrylate and methacrylic acid, with the proportion of 2-ethylhexyl acrylate being 26 mol%, the mass-average molecular weight being 500,000, and the glass transition temperature being -11°C was prepared.

[0153] A mixture containing 2 parts by weight of Coronate L (manufactured by Tosoh Corporation, trade name) as a polyisocyanate and 3 parts by weight of Irgacure-651 (manufactured by BASF Corporation, trade name) as a photopolymerization initiator was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (3).

[0154] The following substrate films are produced as substrate films.

[0155] <Substrate film (1)> The resin particles of zinc ionomer of ethylene-methacrylic acid copolymer (methacrylic acid content 13%, softening point 72℃, melting point 90℃) were melted at 140℃ and extruded into a long strip film with a thickness of 90μm to make a substrate film (1).

[0156] <Substrate film (2)> Low-density polyethylene (LDPE, density 0.92 g / cm³) 3 Resin particles with a melting point of 110℃ are melted at 200℃ and extruded into a long strip film with a thickness of 150μm to make a substrate film (2).

[0157] <Adhesive tape (1)> The adhesive layer composition (1) is applied to a release liner made of a polyethylene-terephthalate film after demolding treatment in such a way that the dried thickness reaches 20 μm. After drying at 110°C for 3 minutes, the adhesive layer is formed and then bonded to the substrate film (1) to form an adhesive tape (1).

[0158] <Adhesive tape (2)> Except for changing the thickness of the adhesive layer to 35 μm, adhesive tape (2) was made in the same way as adhesive tape (1).

[0159] <Adhesive tape (3)> In addition to using the adhesive layer composition (2) and the substrate film (2), the adhesive tape (3) was made in the same manner as the adhesive tape (1).

[0160] <Adhesive tape (4)> Except for changing the thickness of the adhesive layer to 35 μm, adhesive tape (4) was made in the same way as adhesive tape (3).

[0161] <Adhesive tape (5)> In addition to using the adhesive layer composition (3), the adhesive tape (5) was made in the same way as the adhesive tape (2).

[0162] <Adhesive tape (6)> Except for changing the thickness of the adhesive layer to 5 μm, adhesive tape (6) was made in the same way as adhesive tape (1).

[0163] (2) Preparation of adhesive layer <Adhesive layer (1)> An adhesive layer composition solution was prepared by dissolving 80 parts by weight of acrylic resin (manufactured by Nagase ChemteX Co., Ltd., trade name "Teisan Resin SG-P3", Mw 850,000, Tg 12℃), 10 parts by weight of naphthalene-type epoxy resin (manufactured by DIC Co., Ltd., trade name "HP-4700"), and 10 parts by weight of phenolic resin (manufactured by Meiwa Kasei Co., Ltd., trade name "MEH7851") as a curing agent in methyl ethyl ketone. This adhesive layer composition solution was then applied to a release film (release liner) of polyethylene terephthalate film with a thickness of 50 μm after silicone release treatment, and dried at 130℃ for 5 minutes. This resulted in an adhesive layer (1) with a thickness of 20 μm.

[0164] <Adhesive layer (2)> An adhesive layer composition solution was prepared by dissolving or dispersing 100 parts by weight of acrylic resin (manufactured by Nagase ChemteX Co., Ltd., trade name "Teisan Resin SG-70L", Mw 850,000, Tg 12℃), 353 parts by weight of cresol novolak type epoxy resin (manufactured by Nippon Chemical Co., Ltd., trade name "EOCN-1020", epoxy equivalent 198, softening point 64℃), 46 parts by weight of liquid bisphenol A type epoxy resin (Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YD-128", Mw 400, epoxy equivalent 190), 3 parts by weight of imidazole (manufactured by Shikoku Chemical Co., Ltd., trade name "2PHZ-PW") as a curing agent, and 330 parts by weight of silica filler (manufactured by Admatechs Co., Ltd., trade name "SO-C2", average particle size 0.5μm) in methyl ethyl ketone. Using the adhesive layer composition solution, an adhesive layer (2) with a thickness of 20 μm was prepared using the same method as adhesive layer (1).

[0165] <Adhesive layer (3)> A solution of adhesive layer composition was prepared by dissolving or dispersing 100 parts by weight of bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YP-50S", Mw 60,000, Tg 84℃), 40 parts by weight of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name "EOCN-1020", epoxy equivalent 198, softening point 64℃), 100 parts by weight of liquid bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YD-128", Mw 400, epoxy equivalent 190), 1.5 parts by weight of imidazole (manufactured by Shikoku Kasei Corporation, trade name "2PHZ-PW") as a curing agent, and 200 parts by weight of silica filler (manufactured by Admatechs Co., Ltd., trade name "SO-C2", average particle size 0.5μm) in methyl ethyl ketone. Using the adhesive layer composition solution, an adhesive layer (3) with a thickness of 20 μm was prepared using the same method as adhesive layer (1).

[0166] <Adhesive layer (4)> A solution of adhesive layer composition was prepared by dissolving 10 parts by weight of nitrile rubber (acrylonitrile content 40% by mass), 17 parts by weight of Novolac epoxy resin (DIC Corporation, trade name "N-775", epoxy equivalent 195, softening point 78°C), 40 parts by weight of liquid bisphenol A epoxy resin (Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YD-128", Mw400, epoxy equivalent 190), and 32 parts by weight of phenolic resin (Maywa Chemical Co., Ltd., trade name "H-4") as a curing agent in methyl ethyl ketone. Using this adhesive layer composition solution, an adhesive layer (4) with a thickness of 20 μm was prepared by the same method as adhesive layer (1).

[0167] <Adhesive layer (5)> An adhesive layer composition solution was prepared by dissolving or dispersing 100 parts by weight of acrylic resin (manufactured by Nagase ChemteX Co., Ltd., trade name "Teisan Resin SG-708-6", Tg 6℃), 280 parts by weight of solid bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name "1004", softening point 97℃), 306 parts by weight of phenolic resin (manufactured by Mitsui Chemicals Co., Ltd., trade name "Milex XLC-4L", melting point 62℃) as a curing agent, and 237 parts by weight of silica filler (manufactured by Admatechs Co., Ltd., trade name "SO-C2", average particle size 0.5μm) in methyl ethyl ketone. Using this adhesive layer composition solution, an adhesive layer (5) with a thickness of 20μm was prepared by the same method as adhesive layer (1).

[0168] The following metal layers were prepared as metal layers.

[0169] <Metal layer (1)> 1085 (manufactured by UACJ Corporation, aluminum foil, 150μm thickness) <Metal layer (2)> 1085 (manufactured by UACJ Corporation, aluminum foil, 20μm thickness) <Metal layer (3)> F0-WS (Product name, manufactured by Furukawa Electric Industries, Ltd., copper foil, 6μm thickness) (5) Fabrication of tapes for electronic device packaging <Example 1> The adhesive layer (1) and metal layer (1) formed on the release liner are bonded together at a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm / s to form a single-sided adhesive film. The single-sided adhesive film is pre-cut into a circular shape smaller than the adhesive tape (1) in a manner that allows the adhesive tape (1) to be bonded to the ring frame. The adhesive layer (1) exposed after the release molding process of the single-sided adhesive film is bonded to the adhesive layer of the adhesive tape (1) in such a manner that the adhesive layer is exposed around the single-sided adhesive film to form a single-sided adhesive film. Figure 1 The electronic device packaging tape shown in Embodiment 1.

[0170] <Examples 2-8, Comparative Examples 1-3> Except that the combination of adhesive tape, adhesive layer composition and metal layer is set as described in Table 1, the electronic device packaging tapes of Examples 2 to 8 and Comparative Examples 1 to 3 were produced by the same method as in Example 1.

[0171] <Example 9> Using the combination of adhesive tape, adhesive layer, and metal layer described in Table 1, except that the adhesive layer of the adhesive tape is bonded to the metal layer side of the single-sided adhesive film, the electronic device packaging tape of Example 9 was manufactured by the same method as in Example 1.

[0172] The electronic device packaging tapes described in Examples 1-9 and Comparative Examples 1-3 were subjected to the following measurements and evaluations. The results are shown in Table 1.

[0173] (Determination of adhesion) Using the Rhesca TAC-II adhesion testing machine from Rhesca Corporation, the adhesive strength of the adhesive layers of the adhesive tapes involved in each example and comparative example was measured as follows. For electronic device packaging tapes other than Comparative Example 2 that require ultraviolet irradiation before pickup, before measurement, the adhesive layer was irradiated from the substrate film side to the adhesive layer using an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 10 cm) at a rate of 200 mJ / cm². 2The ultraviolet light was used. Regarding the measurement mode, a "Constant Load" mode was used, where the probe was pressed into a set pressure value and continuously controlled to maintain that pressure value until a set time elapsed. With the adhesive layer of the adhesive tape involved in each embodiment and comparative example facing upwards, a 3.0 mm diameter SUS304 probe was brought into contact from above. The speed at which the probe contacted the test sample was 0.5 mm / s, and the contact load was 694 mN / mm². 2 The contact time was set to 10 seconds. Afterward, the probe was peeled upwards at a peeling speed of 10 mm / s, the force required for peeling was measured, and its peak value was recorded. The probe temperature and plate temperature were both set to 25℃. The measurement results were set as the average value for n=5.

[0174] (Determination of loss elastic modulus) The adhesive layers involved in each embodiment and comparative example were cut into 5.0cm × 5.0cm pieces, stacked, and bonded using a hand roller on a 70°C hot plate to obtain a test piece with a thickness of approximately 1.0mm. The test piece was then heated using a Haake rheometer (trade name "RS6000") at a temperature range of 10–150°C and a heating rate of 5°C / min to determine the loss modulus of elasticity G at 25°C. Measurements were performed at 50% RH and a measurement frequency of 1Hz.

[0175] (Pickup test) By monolithizing the metal layer and adhesive layer of the electronic device packaging tape involved in the above embodiments and comparative examples, multiple samples of 5mm × 5mm in size can be fabricated. Then, for the adhesive tape that requires ultraviolet irradiation before pickup, the adhesive layer is irradiated with 200mJ / cm² from the substrate film side using an air-cooled high-pressure mercury lamp (80W / cm², irradiation distance 10cm). 2 Ultraviolet light. For 250 single-piece samples with a central portion used in electronic device packaging, a chip pickup device (trade name "CAP-300II") manufactured by CANON MACHINERY Co., Ltd. was used to pick them up under the following conditions to confirm their pickup capability. Samples with a pickup rate of 98% or higher were defined as qualified and rated as ○, while those with a rate of less than 98% were defined as unqualified and rated as ×. The evaluation results are shown in Table 1. Furthermore, the condition where no single-piece sample was picked up and the device stopped was defined as "pickable".

[0176] Furthermore, regarding metal layers with adhesive layers that are objects to be picked up regardless of the aforementioned pickability, samples without visible bending or marks on the metal layer are considered successful samples, and the pick-up success rate is calculated. In this calculation, samples with a success rate of 99% or higher are designated as optimal and rated ◎; samples with a success rate of 90% or higher but less than 99% are designated as acceptable and rated ○; samples with a success rate of 70% or higher but less than 90% are designated as permissible and rated △; and samples with a success rate less than 70% are designated as unacceptable and rated ×. The evaluation results are shown in Table 1.

[0177] <Pickup Conditions> Fixture: Backlash-free type Fixture dimensions: 5mm × 5mm Pickup method: Slider type (needle-less type) Width of the slider (movable stage): 5mm Extension (the amount by which one end of a single sample protrudes from the slider end face): 0.3mm Extension: 3mm slider speed 20mm / second [Table 1]

[0178] As shown in Table 1, for the electronic device packaging tapes involved in Examples 1 to 9, the adhesive force of the adhesive layer in the state of picking up the laminate composed of the adhesive layer and the metal layer from the adhesive tape is 2.2 to 162 kPa, which is within the range of 2 to 200 kPa specified in the technical solution of the present invention. The loss elastic modulus of the adhesive layer under the conditions of 25°C and 50% RH is less than 43 MPa, which is less than 50 MPa specified in the technical solution of the present invention. Therefore, it shows good results in the evaluation of whether it can be picked up and the success rate of picking up.

[0179] In contrast, regarding the electronic device packaging tape involved in Comparative Example 1, since the loss modulus of the adhesive layer exceeds 50 MPa under the conditions of 25°C and 50% RH, it is still not possible to successfully peel off the laminate composed of the adhesive layer and the metal layer from the adhesive tape, resulting in poor results in the evaluation of whether it can be picked up and the success rate of picking up.

[0180] In Comparative Example 2, the adhesive layer of the electronic device packaging tape has an adhesion force exceeding 200 kPa when the tape is picked up from the laminate of adhesive layer and metal layer. Therefore, it is still not possible to successfully peel the laminate of adhesive layer and metal layer from the tape, and the evaluation results of whether it can be picked up and the success rate of picking up are poor.

[0181] In Comparative Example 3, the adhesive layer of the electronic device packaging tape has an adhesion force of less than 2 kPa when the tape is picked up from the state of the laminate consisting of the adhesive layer and the metal layer. Therefore, the laminate consisting of the adhesive layer and the metal layer can be peeled off from the tape. However, when the tape is extended, the outer edge of the metal layer with the adhesive layer peels off and warps, leaving creases on more than half of the metal layer.

[0182] (Label Explanation) 1: Packaging tape for electronic devices 2: Substrate tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label Section 5b: Peripheral Department.

Claims

1. A tape for packaging electronic devices, characterized in that, have: Adhesive tape having a substrate film and an adhesive layer; and A laminate consisting of an adhesive layer and a metal layer is configured to be laminated on the side of the adhesive layer opposite to the substrate film. The adhesive tape has the following characteristics: A label portion that covers the adhesive layer and is disposed around the adhesive layer in a manner that contacts the substrate film; and The peripheral portion, which surrounds the outer side of the label portion, The adhesive layer has an adhesion strength of 2 to 200 kPa when the laminate is picked up from the adhesive tape, and the loss modulus of elasticity of the adhesive layer is less than 50 MPa under the conditions of 25°C and 50% RH.

2. The electronic device packaging tape according to claim 1, characterized in that, The adhesive layer has a loss modulus of elasticity of 0.2 MPa or higher under conditions of 25°C and 50% RH.

3. The electronic device packaging tape according to claim 1 or 2, characterized in that, The metal layer contains copper or aluminum.

4. The electronic device packaging tape according to claim 1 or 2, characterized in that, The thickness of the metal layer is greater than 5 μm and less than 200 μm.

5. The electronic device packaging tape according to claim 1 or 2, characterized in that, The adhesive layer contains (A) epoxy resin, (B) curing agent, (C) acrylic resin or phenoxy resin, and (D) surface-treated inorganic filler material.

6. The electronic device packaging tape according to claim 1 or 2, characterized in that, The adhesive layer contains an acrylic polymer, which is configured to include an acrylate represented by CH2=CHCOOR, a hydroxyl-containing monomer, and an isocyanate compound having an intramolecular free radical reactive carbon-carbon double bond, wherein, in the formula CH2=CHCOOR, R is an alkyl group having 4 to 18 carbon atoms.

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