Wafer pressing equipment

Abstract

The wafer pressing equipment comprises a lifting assembly, a lower die assembly, an upper die assembly and a turnover assembly, a lower die plate is arranged on a base, a bearing groove is formed on the lower die plate, and a pressing groove is formed on an upper die plate, so that the wafer and the glass sheet are located in corresponding groove bodies respectively; the bearing groove and the pressing groove respectively adsorb and position the wafer and the glass sheet after feeding, so as to reduce the position shift of the workpiece in work. The turnover assembly is rotatably connected to opposite sides of the upper die plate, so that the pressing groove can be switched between a feeding posture and a pressing posture; after the pressing groove is rotated to the pressing posture, the mounting plate drives the upper die plate to descend, so that the pressing groove is aligned and pressed with the bearing groove. The glass sheet is always carried and adsorbed by the upper die plate during the posture change and the approach to the wafer, which is beneficial to maintaining the stable alignment relationship between the wafer and the glass sheet, improving the consistency of the glue layer spreading after pressing, and reducing the labor intensity and improving the product output efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor processing technology, and more specifically, to a wafer bonding apparatus. Background Technology

[0002] Wafer bonding refers to the process of applying adhesive between a wafer and a cover material such as a glass plate, and then applying pressure to spread the adhesive evenly between the contact surfaces to form a stable adhesive layer. This process is widely used in semiconductor packaging and wafer-level fabrication, and it has high requirements for the precision of the bonding position between the wafer and the glass plate, as well as the uniformity of the adhesive layer thickness, to ensure the stability of subsequent curing and device performance.

[0003] Existing wafer bonding equipment typically uses upper and lower fixtures to support the wafer and glass sheet respectively for bonding. After the glass sheet or wafer is loaded, a mechanical structure gradually brings them closer together in the vertical direction to complete the bonding. In some applications, the glass sheet needs to be repositioned before bonding to adapt to the loading and bonding positional relationship. However, during the posture switching and approaching the wafer, the workpiece relies on the fixture for support and positioning, making it susceptible to the combined effects of clamping and positioning errors, inertial disturbances during movement, and the initial flow resistance of the adhesive material. This reduces the relative positional stability between the wafer and the glass sheet.

[0004] During the aforementioned process, as the lamination action proceeds, minute positional shifts between the wafer and the glass sheet can further affect the uniformity of adhesive spreading, potentially leading to inconsistent adhesive layer thickness or misalignment, thus impacting the overall lamination quality. Therefore, maintaining a stable alignment between the wafer and the glass sheet during workpiece orientation changes and the lamination process remains a key technical challenge in existing wafer lamination processes. Summary of the Invention

[0005] The main objective of this disclosure is to provide a wafer bonding apparatus that aims to solve the technical problem mentioned in the background art of insufficient alignment stability between the wafer and the glass sheet during posture changes and bonding processes.

[0006] The present invention adopts the following technical solution: A wafer bonding apparatus, comprising: A lifting assembly, the lifting assembly including a base, and a mounting plate that can be lifted and lowered along a first direction is provided above the base; The lower mold assembly includes a lower template disposed on the upper surface of the base, and the upper surface of the lower template is formed with a support groove for placing a wafer. The upper mold assembly includes an upper mold plate disposed above the lower mold plate, and one end face of the upper mold plate is formed with a pressing groove corresponding to the bearing groove for placing a glass sheet; A flipping assembly is fixedly connected to the bottom end of the mounting plate, and the flipping assembly is rotatably connected to the opposite sides of the upper template to drive the pressing groove to flip between the feeding posture and the pressing posture. Both the bearing groove and the pressing groove are connected to the vacuum generating device. When the pressing groove rotates to the pressing posture, the mounting plate drives the upper template to descend so that the pressing groove and the bearing groove are aligned and pressed together.

[0007] Furthermore, the flipping assembly includes a first support base and a second support base disposed at the bottom end of the mounting plate, the first support base and the second support base being located on opposite sides of the upper template, respectively; A rotary drive component is fixedly connected to the side of the first support base away from the second support base. A speed reducer is installed in the first support base. The output end of the rotary drive component is fixedly connected to the input end of the speed reducer. The output end of the speed reducer is connected to one side of the upper template. A connecting shaft is inserted through the second support base, and the connecting shaft is rotatably connected to the second support base. The connecting shaft is connected to the side of the upper template away from the first support base.

[0008] Furthermore, the axes of the connecting shaft and the reducer both extend along the second direction, and the connecting shaft and the reducer are coaxially arranged. The axes of the connecting shaft and the reducer are both parallel to the end face of the upper template where the pressing groove is formed.

[0009] Furthermore, the output shaft of the reducer is fixedly connected to a first connecting block, the first connecting block forming a first flipping surface, the first flipping surface being fixedly connected to the upper mold assembly, the first flipping surface being parallel to the axis of the reducer, and the axis of the reducer being separate from the first flipping surface; The connecting shaft is rotatably connected to the second support base via a bearing. A second connecting block is fixedly connected to one end of the connecting shaft facing the first support base. The second connecting block forms a second flipping surface. The second flipping surface is fixedly connected to the upper mold assembly, and the second flipping surface and the first flipping surface are distributed on the same plane.

[0010] Furthermore, the upper mold assembly also includes a flipping base plate, which is fixedly connected to the first flipping surface and the second flipping surface; An upper heat insulation plate and an upper heating plate are stacked sequentially on one end face of the flip-top plate, and the end face of the upper heating plate away from the flip-top plate is fixedly connected to the upper template. The upper heat insulation plate is provided in multiple ways, and a heat dissipation gap is formed between two adjacent upper heat insulation plates. The flip-up bottom plate is provided with a through vent hole corresponding to the heat dissipation gap.

[0011] Furthermore, the pressing groove is recessed in a cross shape on one end face of the upper template away from the flipping base plate. The bottom of the pressing groove is provided with multiple upper adsorption holes, which are arranged in an array along the second direction and the third direction. The upper template is provided with a number of first vacuum holes on opposite sides along the third direction, and the first vacuum holes are connected to the upper adsorption holes.

[0012] Furthermore, the lower mold assembly also includes an adjustment base plate disposed on the upper end surface of the base, and a support base plate is disposed on the upper end surface of the adjustment base plate, the support base plate being movable relative to the adjustment base plate along the second direction; The upper end face of the supporting base plate is stacked with a lower heat insulation plate and a lower heating plate in sequence, and the upper end face of the lower heating plate is fixedly connected to the lower template. Multiple lower heat insulation plates are provided, and the lower heat insulation plates extend along the second direction. A heat dissipation channel is formed between two adjacent lower heat insulation plates. A heat dissipation plate is provided in the heat dissipation channel. A plurality of heat dissipation fins are formed on the end face of the heat dissipation plate facing away from the lower heating plate. The plurality of heat dissipation fins extend along the second direction.

[0013] Furthermore, the bearing groove is recessed in a cross shape on the upper end face of the lower template, and a circular clearance groove is formed at the bottom of the bearing groove, which corresponds to the edge region of the wafer. The bottom of the bearing groove is provided with a plurality of lower adsorption holes, which are arranged in an array along the second direction and the third direction, and are distributed within the range of the clearance groove. The lower template is provided with a plurality of second vacuum holes on opposite sides along the third direction, and the second vacuum holes are connected to the lower adsorption holes.

[0014] Furthermore, the lifting assembly also includes a plurality of guide columns fixedly disposed on the upper surface of the base, and a fixing plate is fixedly connected to the upper surface of the plurality of guide columns, and the mounting plate is distributed between the base and the fixing plate. An electric cylinder is provided on the fixed plate, and the output end of the electric cylinder passes through the fixed plate in a first direction and is connected to the mounting plate. The mounting plate is provided with a plurality of guide sleeves, and the plurality of guide sleeves are slidably engaged with a plurality of guide posts.

[0015] Furthermore, both the lower mold assembly and the upper mold assembly are provided with a temperature control component, which includes a plurality of heating rods and cooling channels, and the plurality of heating rods and cooling channels are inserted into the lower heating plate and the upper heating plate along the second direction; The temperature control component also includes a plurality of temperature probes, which are inserted into the upper and lower templates along the second direction.

[0016] Beneficial effects: In this invention, a lower template is set on the base, and a support groove for placing the wafer is formed on the lower template. Simultaneously, a pressing groove for placing the glass sheet is formed on the upper template, so that the wafer and glass sheet are respectively located in their corresponding grooves. Both the support groove and the pressing groove are connected to a vacuum generator, allowing for adsorption and positioning of the wafer and glass sheet after loading, thereby reducing workpiece movement during operation. A flipping assembly is fixed to the bottom of a mounting plate that moves up and down in a first direction and is rotatably connected to the opposite sides of the upper template, enabling the pressing groove to switch between loading and pressing postures. By feeding material upwards into the pressing groove in the loading posture, and then rotating the pressing groove to the pressing posture, the mounting plate drives the upper template downwards, aligning and pressing the pressing groove with the support groove. Throughout the posture change and approach to the wafer, the glass sheet is always supported and positioned by the upper template, while the wafer is supported and positioned by the lower template. This helps maintain a stable alignment between the wafer and the glass sheet, improves the consistency of the adhesive layer after pressing, reduces manual labor intensity, and increases product output efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a wafer bonding device according to the present invention; Figure 2 This is a schematic diagram of the installation structure of the flipping component and the upper mold component of the present invention; Figure 3 This is a partial structural schematic diagram of the flipping component of the present invention; Figure 4 This is a schematic diagram of the upper mold assembly of the present invention; Figure 5 This is a schematic diagram of the upper template of the present invention; Figure 6 This is a schematic diagram of the lower mold assembly of the present invention; Figure 7 This is a schematic diagram of the lower template of the present invention; Figure 8 This is a schematic diagram of the overall structure of the present invention with a protective frame; in: 1. Lifting assembly; 11. Base; 12. Mounting plate; 13. Guide column; 14. Fixing plate; 15. Electric cylinder; 16. Guide sleeve; 2. Lower mold assembly; 21. Lower template; 211. Bearing groove; 212. Clearance groove; 213. Lower suction hole; 214. Second vacuum hole; 22. Adjusting base plate; 23. Supporting base plate; 24. Lower heat insulation plate; 25. Lower heating plate; 26. Heat dissipation channel; 27. Heat dissipation plate; 3. Upper mold assembly; 31. Upper template; 311. Pressing groove; 312. Upper suction hole; 313. First vacuum hole; 32. Flipping base plate; 321. Ventilation hole; 33. Upper heat insulation plate; 34. Upper heating plate; 35. Heat dissipation gap; 4. Tilting assembly; 41. First support base; 42. Second support base; 43. Rotation drive component; 44. Reducer; 45. Connecting shaft; 46. First connecting block; 461. First tilting surface; 47. Second connecting block; 471. Second tilting surface; 5. Temperature control components; 51. Heating rod; 52. Cooling channel; 53. Temperature probe; 6. Slip ring fixing plate; 7. Water slip ring; 8. Protective frame; 81. Frame base plate; 82. Outer cover body; 83. Protective door; 84. Top cover plate; 85. Fan filter unit; The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] Reference Figures 1 to 8 This invention proposes a wafer bonding apparatus, comprising: The lifting assembly 1 includes a base 11, and a mounting plate 12 that moves up and down in a first direction is provided above the base 11. The lower mold assembly 2 includes a lower template 21 disposed on the upper end face of the base 11, and the upper end face of the lower template 21 is formed with a support groove 211 for placing the wafer; The upper mold assembly 3 includes an upper mold 31 disposed above the lower mold 21. One end face of the upper mold 31 is formed with a pressing groove 311 corresponding to the bearing groove 211 for placing a glass sheet. The flipping component 4 is fixedly connected to the bottom end of the mounting plate 12, and the flipping component 4 is rotatably connected to the opposite sides of the upper template 31 to drive the pressing groove 311 to flip between the feeding posture and the pressing posture. The bearing groove 211 and the pressing groove 311 are both connected to the vacuum generating device. When the pressing groove 311 rotates to the pressing posture, the mounting plate 12 drives the upper template 31 to descend so that the pressing groove 311 is aligned and pressed with the bearing groove 211.

[0023] In the above embodiment, a lifting assembly 1, a lower mold assembly 2, an upper mold assembly 3, and a tilting assembly 4 are included. The lifting assembly 1 uses a base 11 as its mounting base. A mounting plate 12 capable of moving along a first direction is provided above the base 11. The first direction is the direction in which the upper mold 31 moves closer to or further away from the lower mold 21. In this embodiment, it is the vertical lifting direction. The lower mold assembly 2 is mounted on the base 11. A bearing groove 211 is formed on the upper end face of the lower mold 21, and the wafer is placed in the bearing groove 211. The upper mold assembly 3 is located above the lower mold assembly 2. A pressing groove 311 corresponding to the bearing groove 211 is formed on one end face of the upper mold 31, and a glass sheet is placed in the pressing groove 311. The tilting assembly 4 is fixedly connected to the bottom end of the mounting plate 12 and rotatably connected to the opposite sides of the upper mold 31, so that the upper mold 31 can switch its posture relative to the mounting plate 12 with the tilting assembly 4, and can also be lifted and lowered as a whole with the mounting plate 12. Both the carrier tank 211 and the pressing tank 311 are connected to the vacuum generating device. After the wafer and the glass sheet are placed into the corresponding tanks, the negative pressure at the carrier tank 211 and the pressing tank 311 can act on the wafer and the glass sheet respectively, so that they are adsorbed and held in their respective positions.

[0024] The boundary of the support groove 211 provides an initial placement range for the wafer, while the bottom area of ​​the groove restricts planar slippage of the wafer relative to the lower template 21 through negative pressure adsorption. Similarly, the pressing groove 311 provides a corresponding placement position for the glass sheet. After the glass sheet is placed in the pressing groove 311 in the loading posture, the vacuum generator causes the pressing groove 311 to adsorb and hold the glass sheet. Since the flipping assembly 4 is connected to opposite sides of the upper template 31, when the upper template 31 switches between the loading posture and the pressing posture, its rotational support positions are distributed on both sides of the upper template 31. The glass sheet flips with the upper template 31, rather than changing its posture independently in an unconstrained state. Therefore, the glass sheet always uses the pressing groove 311 as the bearing reference during posture switching and maintains its relative position through negative pressure adsorption at the pressing groove 311, which can reduce the offset caused by posture changes, motion inertia, or the weight of the workpiece.

[0025] When the pressing groove 311 rotates to the pressing posture, the pressing groove 311 and the bearing groove 211 form a relative relationship in the first direction, and the mounting plate 12 descends along the first direction. Since the flipping component 4 is fixed to the bottom of the mounting plate 12, the upper template 31 is not temporarily pushed by a separate pressure head, but moves closer to the lower template 21 as a whole with the mounting plate 12 and the flipping component 4. The relative positional relationship between the pressing groove 311 and the bearing groove 211 can remain continuous during the descent. The wafer is adsorbed and positioned by the bearing groove 211, and the glass sheet is adsorbed and positioned by the pressing groove 311. Before approaching and contacting the adhesive, both are already confined in their respective grooves. During continued pressing, the adhesive is squeezed and begins to spread. Even if the adhesive generates a certain lateral resistance to the wafer and glass sheet, this resistance needs to overcome the holding effect of the groove positioning and vacuum adsorption on the workpiece, so it is not easy for the wafer or glass sheet to fall off the original placement reference.

[0026] After the pressing groove 311 and the bearing groove 211 are aligned and pressed together, the relative position between the wafer and the glass sheet is defined by the lifting paths of the lower template 21, the upper template 31, and the mounting plate 12. In other words, the position of the wafer is mainly determined by the bearing groove 211 on the lower template 21 and its vacuum adsorption state, while the position of the glass sheet is mainly determined by the pressing groove 311 on the upper template 31 and its vacuum adsorption state. The direction of approach between the two is determined by the lifting movement of the mounting plate 12 along the first direction. This continuous fit between the above structures ensures that the glass sheet does not need to be removed from the upper template 31 for relocation or repositioning during the process from loading to posture change and then to approaching the wafer; the wafer also remains within the bearing groove 211 of the lower template 21. Therefore, the relative movement of the wafer and glass sheet during posture change and pressing is reduced, which helps maintain a stable alignment between them and allows the adhesive to be pressed and spread in a relatively stable relative position, thereby improving the consistency of the adhesive layer after pressing.

[0027] In one embodiment, the flipping assembly 4 includes a first support base 41 and a second support base 42 disposed at the bottom end of the mounting plate 12, wherein the first support base 41 and the second support base 42 are respectively located on opposite sides of the upper template 31; A rotary drive component 43 is fixedly connected to the side of the first support base 41 away from the second support base 42. A reducer 44 is installed in the first support base 41. The output end of the rotary drive component 43 is fixedly connected to the input end of the reducer 44. The output end of the reducer 44 is connected to one side of the upper template 31. A connecting shaft 45 is provided in the second support base 42. The connecting shaft 45 is rotatably connected to the second support base 42 and is connected to the side of the upper template 31 away from the first support base 41.

[0028] In the above embodiment, the flipping assembly 4 includes a first support base 41 and a second support base 42 connected to the bottom end of the mounting plate 12. These two supports are distributed on opposite sides of the upper template 31, thus providing support to both sides of the upper template 31. A rotary drive 43 is provided on one side of the first support base 41, and a reducer 44 passes through the first support base 41. The output end of the rotary drive 43 is connected to the input end of the reducer 44, and the output end of the reducer 44 is then connected to one side of the upper template 31. The rotary drive 43 can be a servo motor. A connecting shaft 45 passes through the second support base 42, rotatably engaging with the second support base 42 and connecting to the other side of the upper template 31. This structure ensures that when the upper template 31 flips, one side is provided with torque by the rotary drive 43 and the reducer 44, while the other side is supported by the connecting shaft 45. The weight of the upper template 31 and the off-center load generated during the flipping process will not be concentrated on a single connecting position. The reducer 44 makes the rotation output of the rotary drive 43 smoother, while the connecting shaft 45 restricts the movement trajectory of the other side of the upper template 31, allowing the upper template 31 to rotate around a stable support relationship during posture switching. When the glass sheet is adsorbed in the pressing groove 311 and rotates synchronously with the upper template 31, the upper template 31 is less prone to shaking or tilting, thereby reducing the disturbance of the glass sheet relative to the pressing groove 311; after the pressing groove 311 rotates to the pressing posture, its relative position with the bearing groove 211 is also easier to maintain stability, which facilitates subsequent approach to the wafer along the first direction.

[0029] In one example, the axes of the connecting shaft 45 and the reducer 44 both extend along the second direction, and the connecting shaft 45 and the reducer 44 are coaxially arranged. The axes of the connecting shaft 45 and the reducer 44 are parallel to the end face of the upper template 31 where the pressing groove 311 is formed.

[0030] In the above embodiment, the axes of the connecting shaft 45 and the reducer 44 both extend along the second direction, and the connecting shaft 45 and the reducer 44 are arranged coaxially, with their axes parallel to the end face of the upper template 31 where the pressing groove 311 is formed. The connecting shaft 45 and the reducer 44 are located on opposite sides of the upper template 31. If their axes deviate, the upper template 31 is prone to twisting or swaying during rotation, which in turn causes a change in the spatial posture of the pressing groove 311. By setting the connecting shaft 45 and the reducer 44 coaxially, the two sides of the upper template 31 switch postures around the same rotation center, making the path of the pressing groove 311 from the feeding posture to the pressing posture more definite. This axis is also parallel to the end face forming the pressing groove 311, ensuring that the pressing groove 311 maintains a rotational relationship based on this end face during the flipping process, rather than forming an oblique sway. When the glass sheet is held in the pressing groove 311, its position relative to the upper template 31 is defined by both the pressing groove 311 and the negative pressure. After the rotation axis of the upper template 31 is stabilized, the process of the glass sheet changing its posture with the upper template 31 becomes smoother. When the pressing groove 311 enters the pressing posture, the groove opening can more reliably face the bearing groove 211, making it easier to maintain the pressing relationship between the upper template 31 and the lower template 21 in the predetermined position when the mounting plate 12 descends.

[0031] In one example, the output shaft of the reducer 44 is fixedly connected to a first connecting block 46, the first connecting block 46 forming a first flipping surface 461, the first flipping surface 461 being fixedly connected to the upper mold assembly 3, the first flipping surface 461 being parallel to the axis of the reducer 44, and the axis of the reducer 44 being separate from the first flipping surface 461. The connecting shaft 45 is rotatably connected to the second support base 42 via a bearing. A second connecting block 47 is fixedly connected to one end of the connecting shaft 45 facing the first support base 41. The second connecting block 47 forms a second flipping surface 471. The second flipping surface 471 is fixedly connected to the upper mold assembly 3, and the second flipping surface 471 and the first flipping surface 461 are distributed on the same plane.

[0032] In the above embodiment, the output shaft of the reducer 44 is fixedly connected to the first connecting block 46, which forms a first flipping surface 461. The first flipping surface 461 is fixedly connected to the upper mold assembly 3. The connecting shaft 45 is rotatably connected to the second support base 42 via a bearing. The end of the connecting shaft 45 facing the first support base 41 is fixedly connected to the second connecting block 47, which forms a second flipping surface 471. The second flipping surface 471 is fixedly connected to the upper mold assembly 3, and the second flipping surface 471 and the first flipping surface 461 are located on the same plane. The first flipping surface 461 and the second flipping surface 471 are the mounting reference surfaces on both sides of the upper mold assembly 3, so that the output shaft of the reducer 44 and the connecting shaft 45 are not directly connected to the upper mold assembly 3 in a point or line manner, but are fixed to the upper mold assembly 3 through a connecting surface with a certain area. This can increase the connection area and reduce the assembly misalignment caused by the concentration of force at local connection positions. The axis of the reducer 44 is separated from the first flipping surface 461, creating a defined spatial distance between the connecting surface of the upper mold assembly 3 and the rotation axis. This allows the upper mold assembly 3 to rotate around the axis with a defined radius during flipping. With both flipping surfaces on the same plane, the connection height and connection reference on both sides of the upper mold assembly 3 remain consistent, reducing the tilt caused by inconsistent installation references on both sides of the upper mold plate 31. When the glass sheet is within the pressing groove 311, the more stable the flipping posture of the upper mold plate 31, the less susceptible the glass sheet is to additional swaying. Furthermore, when the mounting plate 12 lowers the upper mold plate 31, the alignment between the pressing groove 311 and the bearing groove 211 is more easily maintained.

[0033] In one example, the upper mold assembly 3 further includes a flipping base plate 32, which is fixedly connected to the first flipping surface 461 and the second flipping surface 471; An upper heat insulation plate 33 and an upper heating plate 34 are stacked sequentially on one end face of the flipping base plate 32, and the end face of the upper heating plate 34 away from the flipping base plate 32 is fixedly connected to the upper template 31. Multiple upper heat insulation plates 33 are provided, and a heat dissipation gap 35 is formed between two adjacent upper heat insulation plates 33. The flip-top base plate 32 is provided with a through vent 321 corresponding to the heat dissipation gap 35.

[0034] In the above embodiment, the upper mold assembly 3 includes a flipping base plate 32, which is fixedly connected to the first flipping surface 461 and the second flipping surface 471. An upper heat insulation plate 33 and an upper heating plate 34 are sequentially stacked on one end face of the flipping base plate 32. The end face of the upper heating plate 34 away from the flipping base plate 32 is fixedly connected to the upper template 31. The flipping base plate 32 serves as a connecting component between the upper mold assembly 3 and the flipping assembly 4, allowing the rotational force transmitted by the connecting blocks on both sides to first act on the larger plate-like structure, and then the flipping base plate 32 drives the upper heat insulation plate 33, the upper heating plate 34, and the upper template 31 to flip as a whole. The upper template 31 does not directly bear the localized tension of the connecting parts on both sides, which helps maintain its mounting plane. Multiple upper heat insulation plates 33 are provided, with heat dissipation gaps 35 formed between adjacent upper heat insulation plates 33. The flipping base plate 32 has through-holes 321 corresponding to the heat dissipation gaps 35. Since the upper heating plate 34 may be heated during the pressing process, if a large amount of heat is transferred to the flip base plate 32 and the connection positions on both sides, it may cause thermal deformation or thermal expansion differences in the connection reference. The multi-layer heat insulation board, heat dissipation gap 35, and vent 321 can reduce the concentrated heat transfer to the flip base plate 32, keeping the flip base plate 32 and its connection area with the flip assembly 4 relatively stable. When the upper template 31 changes posture and descends for pressing with the flip assembly 4, its spatial position is less likely to deviate due to heat, and the bearing reference of the glass sheet in the pressing groove 311 is also easier to keep consistent.

[0035] In one example, the pressing groove 311 is recessed in a cross shape on the end face of the upper template 31 away from the flipping base plate 32. The bottom of the pressing groove 311 is provided with a plurality of upper adsorption holes 312. The plurality of upper adsorption holes 312 are arranged in an array along the second direction and the third direction. The upper template 31 is provided with a plurality of first vacuum holes 313 on opposite sides along the third direction. The first vacuum holes 313 are connected to the upper adsorption holes 312.

[0036] In the above embodiment, the pressing groove 311 is formed in a cross-shaped recess on the end face of the upper template 31 away from the flipping base plate 32. Multiple upper adsorption holes 312 are provided at the bottom of the pressing groove 311, and these holes are arrayed along the second and third directions. Several first vacuum holes 313 are opened on opposite sides of the upper template 31 along the third direction, and these holes communicate with the upper adsorption holes 312. The cross-shaped recess can form a directionally extending receiving area on the surface of the upper template 31. After the glass sheet is placed, it has a clear contact and positioning range with the pressing groove 311. The multiple upper adsorption holes 312 are arrayed along the second and third directions, so that the negative pressure is not concentrated on a single point, but dispersed to multiple areas of the glass sheet, wherein the first, second, and third directions are all perpendicular to each other.

[0037] When the glass sheet is flipped along with the upper template 31, distributed adsorption reduces the possibility of localized warping or slippage of the glass sheet. When the upper template 31 descends and brings the glass sheet closer to the wafer, the glass sheet remains in the reference position provided by the lamination groove 311. The first vacuum holes 313 are located on both sides of the upper template 31 along a third direction, facilitating the introduction of negative pressure channels from the side of the upper template 31 and distributing the negative pressure to multiple upper adsorption holes 312 at the bottom of the groove. Since the vacuum passage is located inside or on the side of the upper template 31, there is no need to set additional clamping components on the front side of the glass sheet, and the bonding surface of the glass sheet can maintain a relatively complete lamination state, which is beneficial for the spread of adhesive between the wafer and the glass sheet during lamination.

[0038] In one embodiment, the lower mold assembly 2 further includes an adjustment base plate 22 disposed on the upper end surface of the base 11, and a support base plate 23 disposed on the upper end surface of the adjustment base plate 22, the support base plate 23 being movable relative to the adjustment base plate 22 along a second direction; The upper end face of the supporting base plate 23 is sequentially stacked with a lower heat insulation plate 24 and a lower heating plate 25, and the upper end face of the lower heating plate 25 is fixedly connected to the lower template 21. Multiple lower heat insulation plates 24 are provided. The lower heat insulation plates 24 extend along the second direction. A heat dissipation channel 26 is formed between two adjacent lower heat insulation plates 24. A heat dissipation plate 27 is provided in the heat dissipation channel 26. A plurality of heat dissipation fins are formed on one end face of the heat dissipation plate 27 facing away from the lower heating plate 25. The plurality of heat dissipation fins extend along the second direction.

[0039] In the above embodiment, the lower mold assembly 2 includes an adjustment base plate 22 disposed on the upper end face of the base 11, and a support base plate 23 disposed on the adjustment base plate 22. The support base plate 23 is movable relative to the adjustment base plate 22 in a second direction. The lower template 21, the lower heating plate 25, and the lower heat insulation plate 24 are all supported by the support base plate 23. Therefore, the positional change of the support base plate 23 relative to the adjustment base plate 22 can drive the lower template 21 to adjust its position in the second direction. After the upper template 31 enters the pressing posture through the flipping assembly 4, its pressing groove 311 and the bearing groove 211 of the lower template 21 need to form a good correspondence before pressing. The adjustable structure of the support base plate 23 allows the position of the lower template 21 to be corrected according to the actual pressing position of the upper template 31, reducing the impact of assembly errors or small deviations after long-term use on the pressing alignment.

[0040] A lower heat insulation plate 24 and a lower heating plate 25 are sequentially arranged on the support base plate 23. The lower heating plate 25 is fixedly connected to the lower template 21, providing a stable support foundation for the wafer's bearing groove 211. Multiple lower heat insulation plates 24 extend along a second direction, forming a heat dissipation channel 26 between adjacent lower heat insulation plates 24. A heat dissipation plate 27 is arranged in the heat dissipation channel 26, with heat dissipation fins extending along the second direction formed on the end face of the heat dissipation plate 27 facing away from the lower heating plate 25. This structure can reduce the heat transferred from the lower heating plate 25 to the support base plate 23 and the adjustment base plate 22 during operation, reducing the positional changes of the support reference caused by heating. The more stable the position of the bearing groove 211, the clearer the reference of the wafer during the lamination process, and the easier it is to maintain the alignment relationship with the lamination groove 311 of the upper template 31.

[0041] In one embodiment, the support groove 211 is recessed in a cross shape on the upper end face of the lower template 21, and a circular clearance groove 212 is formed at the bottom of the support groove 211, the clearance groove 212 corresponding to the edge region of the wafer; The bottom of the bearing groove 211 is provided with a plurality of lower adsorption holes 213, which are arranged in an array along the second direction and the third direction, and are distributed within the range of the clearance groove 212. The lower template 21 is provided with a plurality of second vacuum holes 214 on opposite sides along the third direction, and the second vacuum holes 214 are connected to the lower adsorption holes 213.

[0042] In the above embodiment, the bearing groove 211 is formed in a cross-shaped recess on the upper end surface of the lower template 21, and a circular relief groove 212 is provided at the bottom of the bearing groove 211. The position of the relief groove 212 corresponds to the edge area of ​​the wafer. The cross-shaped recess can form a bearing area with intersecting extension directions on the surface of the lower template 21, so that the wafer can obtain a clear planar bearing reference after placement; the circular relief groove 212 is set around the edge area of ​​the wafer, so that the edge of the wafer does not completely rely on the flat bottom of the groove for bearing pressure. The wafer is a thin and brittle workpiece, and the edge area is relatively easy to be affected by local contact or small particles, resulting in stress concentration. After the relief groove 212 corresponds to the edge area of ​​the wafer, it can reduce the direct impact of the bottom of the groove on the edge of the wafer, so that the wafer is more stably placed in the predetermined position within the bearing groove 211.

[0043] The bottom of the support groove 211 is provided with multiple lower adsorption holes 213, which are arranged in an array along the second and third directions and located within the clearance groove 212. The lower template 21 has second vacuum holes 214 on opposite sides along the third direction, which communicate with the lower adsorption holes 213, allowing external negative pressure to enter from the side of the lower template 21 and be distributed to the bottom of the support groove 211. The multiple lower adsorption holes 213 disperse the action on the lower side of the wafer, avoiding insufficient local fixation caused by single-point adsorption, and preventing the wafer from sliding relative to the lower template 21 during dispensing, glass sheet approach, and adhesive spreading under pressure. The wafer position is defined by the range of the support groove 211 and the array adsorption. When the upper template 31 descends, the contact and pressing action between the glass sheet and the wafer can be performed on a relatively stable wafer reference, thus helping to maintain the alignment between them.

[0044] In one embodiment, the lifting assembly 1 further includes a plurality of guide columns 13 fixedly disposed on the upper end face of the base 11, and a fixing plate 14 is fixedly connected to the upper end face of the plurality of guide columns 13, and the mounting plate 12 is distributed between the base 11 and the fixing plate 14. An electric cylinder 15 is provided on the fixing plate 14, and the output end of the electric cylinder 15 passes through the fixing plate 14 in the first direction and is connected to the mounting plate 12. The mounting plate 12 is provided with a plurality of guide sleeves 16, and the plurality of guide sleeves 16 are slidably engaged with a plurality of guide posts 13.

[0045] In the above embodiment, the lifting assembly 1 includes several guide posts 13 fixedly disposed on the upper surface of the base 11. The upper ends of the guide posts 13 are connected to a fixing plate 14, and a mounting plate 12 is located between the base 11 and the fixing plate 14. The fixing plate 14 serves as an upper support member for mounting an electric cylinder 15. The output end of the electric cylinder 15 passes through the fixing plate 14 along a first direction and connects to the mounting plate 12, causing the mounting plate 12 to move closer to or away from the base 11 under the drive of the electric cylinder 15. Several guide sleeves 16 are disposed on the mounting plate 12, and the guide sleeves 16 slide in cooperation with the corresponding guide posts 13. Since the flipping assembly 4 is connected to the bottom end of the mounting plate 12, and the upper template 31 is connected to the mounting plate 12 through the flipping assembly 4, the movement path of the mounting plate 12 directly affects the relative position of the pressing groove 311 when it approaches the bearing groove 211.

[0046] The cooperation of guide post 13 and guide sleeve 16 can constrain the lifting direction of mounting plate 12, so that mounting plate 12 is not only moved by the traction of the output end of electric cylinder 15, but is also restricted at multiple guide positions. If mounting plate 12 wobbles during descent, upper template 31 tilts accordingly, and the correspondence between pressing groove 311 and bearing groove 211 may change; through the multi-point sliding guide formed by guide post 13 and guide sleeve 16, the lateral sway of mounting plate 12 when moving in the first direction is restricted, and upper template 31 can approach lower template 21 with a more stable path after entering the pressing posture. The wafer is adsorbed by bearing groove 211 and glass sheet is adsorbed by pressing groove 311. When the two approach each other, the stability of the lifting path can reduce the alignment error caused by the movement deviation of the entire platform, making the pressing action closer to the preset direction.

[0047] In one embodiment, a temperature control component 5 is provided in both the lower mold assembly 2 and the upper mold assembly 3. The temperature control component 5 includes a plurality of heating rods 51 and cooling channels 52, which are inserted into the lower heating plate 25 and the upper heating plate 34 along a second direction.

[0048] In the above embodiment, both the lower mold assembly 2 and the upper mold assembly 3 are equipped with temperature control components 5. The temperature control components 5 include several heating rods 51 and cooling channels 52, which extend along a second direction through the lower heating plate 25 and the upper heating plate 34. The upper heating plate 34 is located on one side of the upper mold 31, and the lower heating plate 25 is located on one side of the lower mold 21, allowing heat to be transferred from a position near the pressing groove 311 and the bearing groove 211 to the glass sheet, the wafer, and the adhesive material between them. The heating rods 51 extend along the second direction, enabling the heating area to cover the main pressing width of the mold, reducing the possibility of heat sources concentrating in only a localized area and causing temperature distribution differences. The cooling channels 52 also extend through the corresponding heating plates, allowing the cooling medium to flow inside the mold and carry away the heat accumulated after heating.

[0049] After the wafer and glass sheet are laminated, the adhesive material is in a compressed and spreadable state. If the heating area is too localized, the curing process of different areas of the adhesive material may be inconsistent, and the adhesive layer may exhibit flow differences due to local viscosity variations before it stabilizes. By arranging heating rods 51 in the upper and lower heating plates 25 and ensuring that both the upper and lower mold assemblies 2 have temperature control structures, heat input can be provided to the adhesive material on both the side closer to the wafer and the side closer to the glass sheet. The cooling channel 52 provides a cooling path for the template after heating, allowing the lamination area to complete subsequent processing within a more controllable temperature range. With a more stable temperature, the alignment relationship and adhesive layer state already formed during the lamination process are less susceptible to additional disturbances from localized thermal differences.

[0050] In one embodiment, the temperature control component 5 further includes a plurality of temperature probes 53, which are inserted into the upper template 31 and the lower template 21 along a second direction.

[0051] In the above embodiment, the temperature control component 5 further includes a plurality of temperature probes 53, which are inserted into the upper template 31 and the lower template 21 along a second direction. The temperature probes 53 are positioned inside the templates, rather than only at external locations far from the pressing area, allowing the detection position to be closer to the pressing area where the wafer, glass sheet, and adhesive material are located. Since the upper template 31 and the lower template 21 are in contact with the glass sheet and the wafer respectively, the temperature change of the templates themselves will affect the heating state of the adhesive material. Inserting the temperature probes 53 into the templates along the second direction allows for the acquisition of temperature information more relevant to the pressing area within the templates. The arrangement of multiple temperature probes 53 also allows for coverage of different locations within the templates, facilitating the reflection of the internal temperature distribution of the templates.

[0052] When the temperature probe 53 is used in conjunction with the heating rod 51 and the cooling channel 52, it can be controlled by referring to the internal temperature state of the template. For wafer bonding, the wafer and the glass sheet are already aligned through the carrier groove 211, the pressing groove 311, and vacuum adsorption; if the temperature is too high, too low, or the local difference is too large, the viscosity and spreading state of the adhesive may change unevenly. The temperature probe 53 is set in the upper template 31 and the lower template 21, which helps to make the temperature control process revolve around the actual pressing area, reduce the impact of temperature deviation on the state of the adhesive, and thus maintain the stability of the adhesive layer formation process based on the existing mechanical alignment.

[0053] In another embodiment, a U-shaped slip ring fixing plate 6 is fixedly connected to one side of the second support base 42, and a water slip ring 7 is fixedly connected to the inner side of the slip ring fixing plate 6. The water slip ring 7 is coaxially arranged with the connecting shaft 45 and communicates with the cooling channel 52.

[0054] In the above embodiment, a U-shaped slip ring fixing plate 6 is fixedly connected to one side of the second support base 42, and a water slip ring 7 is fixedly connected to the inner side of the slip ring fixing plate 6. The water slip ring 7 is coaxially arranged with the connecting shaft 45 and communicates with the cooling channel 52. The upper template 31 is driven by the flipping component 4 to switch between the feeding posture and the pressing posture. If the cooling pipe is directly connected to the component that flips with the upper template 31, the pipe is prone to twisting, pulling or tangling during repeated flipping. These external forces may be transmitted to the upper template 31 or its connecting structure, affecting the stability of the rotation of the upper template 31. After the water slip ring 7 is coaxially arranged with the connecting shaft 45, the cooling medium can enter the cooling channel 52 on the flipping side through the coaxial rotational connection, and the pipe does not need to be twisted as a whole with the upper template 31.

[0055] The U-shaped slip ring fixing plate 6 provides a fixed position for the water slip ring 7, and its inner space can accommodate the water slip ring 7, keeping the water slip ring 7 near the axis of the connecting shaft 45. Since the water slip ring 7 is connected to the cooling channel 52, the cooling medium can maintain a flow path before and after the upper template 31 is flipped. Since the water slip ring 7 is coaxial with the connecting shaft 45, when the flipping action occurs, the relative rotation at the water channel connection is closer to the actual rotation center of the upper template 31, which is less likely to generate eccentric tension. This can reduce the additional interference of the cooling pipes to the flipping assembly 4, and keep the upper template 31 stable during attitude switching.

[0056] In another embodiment, the outer side of the base 11 is covered with a protective frame 8, the protective frame 8 including a frame base plate 81, an outer cover body 82, a protective door 83 and a top cover plate 84; The base 11 is fixedly connected to the upper end face of the frame base plate 81, the outer cover body 82 is fixedly connected to the upper end face of the frame base plate 81 and surrounds the outside of the lifting assembly 1, an operation port is opened on one side of the outer cover body 82, and the protective door 83 is set at the operation port. The top cover plate 84 is located at the upper end of the outer cover body 82. An air inlet is provided on the top cover plate 84, and a fan filter unit 85 is installed in the air inlet.

[0057] In the above embodiment, a protective frame 8 is provided on the outside of the base 11. The protective frame 8 includes a frame base plate 81, an outer cover body 82, a protective door 83, and a top cover plate 84. The base 11 is fixed to the upper surface of the frame base plate 81. The outer cover body 82 is also connected to the frame base plate 81 and surrounds the outside of the lifting assembly 1, so that the lifting assembly 1, the upper mold assembly 3, the lower mold assembly 2, and the tilting assembly 4 are in relatively independent equipment spaces. An operation port is opened on one side of the outer cover body 82, and the protective door 83 is located at the operation port. The operator can complete the loading, unloading, or maintenance through the operation port. When the protective door 83 is closed, it can reduce the impact of external airflow, impurities, or accidental contact on the moving parts inside the equipment. The top cover plate 84 is located on the upper end of the outer cover body 82. A fan filter unit 85 is installed in the air inlet of the top cover plate 84 so that the airflow entering the equipment is filtered.

[0058] During the lamination process, wafers and glass sheets are highly sensitive to particles and external disturbances, especially during glass sheet orientation changes, the descent of the upper template 31, and the adhesive spreading stage. External particles falling into the lamination area or airflow fluctuations in the operating space can affect the surface condition of the workpiece. The protective frame 8 does not directly participate in the lamination action, but it encloses the lamination-related components in a relatively stable space, reducing the interference of the external environment on the bearing groove 211, the lamination groove 311, and the workpiece surface. The fan filter unit 85 provides filtered airflow into the outer casing 82, making it easier to maintain the cleanliness of the air inside the equipment. The more stable the surface condition of the workpiece, the less likely it is that alignment deviations or adhesive layer abnormalities will occur between the wafer and glass sheet due to foreign object elevation or abnormal local contact, thus contributing to a stable lamination process.

[0059] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A wafer bonding equipment, characterized in that, include: The lifting assembly (1) includes a base (11) and a mounting plate (12) that moves up and down in a first direction is provided above the base (11). The lower mold assembly (2) includes a lower template (21) disposed on the upper surface of the base (11), and the upper surface of the lower template (21) is formed with a carrier groove (211) for placing the wafer. The upper mold assembly (3) includes an upper mold plate (31) disposed above the lower mold plate (21), and one end face of the upper mold plate (31) is formed with a pressing groove (311) corresponding to the bearing groove (211) for placing glass sheets; The flipping component (4) is fixedly connected to the bottom end of the mounting plate (12), and the flipping component (4) is rotatably connected to the opposite sides of the upper template (31) to drive the pressing groove (311) to flip between the feeding posture and the pressing posture. The bearing groove (211) and the pressing groove (311) are both connected to the vacuum generating device. When the pressing groove (311) rotates to the pressing posture, the mounting plate (12) drives the upper template (31) to descend so that the pressing groove (311) and the bearing groove (211) are aligned and pressed together.

2. The wafer bonding equipment according to claim 1, characterized in that, The flipping assembly (4) includes a first support base (41) and a second support base (42) disposed at the bottom end of the mounting plate (12), wherein the first support base (41) and the second support base (42) are respectively located on opposite sides of the upper template (31); A rotary drive (43) is fixedly connected to the side of the first support (41) away from the second support (42). A speed reducer (44) is installed in the first support (41). The output end of the rotary drive (43) is fixedly connected to the input end of the speed reducer (44). The output end of the speed reducer (44) is connected to one side of the upper template (31). A connecting shaft (45) is provided in the second support (42), and the connecting shaft (45) is rotatably connected to the second support (42). The connecting shaft (45) is connected to the side of the upper template (31) away from the first support (41).

3. The wafer bonding equipment according to claim 2, characterized in that, The axes of the connecting shaft (45) and the reducer (44) both extend along the second direction, and the connecting shaft (45) and the reducer (44) are coaxially arranged. The axes of the connecting shaft (45) and the reducer (44) are both parallel to one end face of the upper template (31) where the pressing groove (311) is formed.

4. The wafer bonding equipment according to claim 2, characterized in that, The output shaft of the reducer (44) is fixedly connected to a first connecting block (46), the first connecting block (46) forms a first flipping surface (461), the first flipping surface (461) is fixedly connected to the upper mold assembly (3), the first flipping surface (461) is parallel to the axis of the reducer (44), and the axis of the reducer (44) is away from the first flipping surface (461). The connecting shaft (45) is rotatably connected to the second support base (42) via a bearing. A second connecting block (47) is fixedly connected to one end of the connecting shaft (45) facing the first support base (41). The second connecting block (47) forms a second flipping surface (471). The second flipping surface (471) is fixedly connected to the upper mold assembly (3), and the second flipping surface (471) and the first flipping surface (461) are distributed on the same plane.

5. The wafer bonding equipment according to claim 4, characterized in that, The upper mold assembly (3) also includes a flip base plate (32), which is fixedly connected to the first flip surface (461) and the second flip surface (471); An upper heat insulation plate (33) and an upper heating plate (34) are stacked sequentially on one end face of the flip-top plate (32), and the end face of the upper heating plate (34) away from the flip-top plate (32) is fixedly connected to the upper template (31); The upper heat insulation plate (33) is provided in multiple ways, and a heat dissipation gap (35) is formed between two adjacent upper heat insulation plates (33). The flip-top plate (32) is provided with a through vent (321) corresponding to the heat dissipation gap (35).

6. The wafer bonding equipment according to claim 5, characterized in that, The pressing groove (311) is recessed in a cross shape on one end face of the upper template (31) away from the flipping base plate (32). The bottom of the pressing groove (311) is provided with a plurality of upper adsorption holes (312). The plurality of upper adsorption holes (312) are arranged in an array along the second direction and the third direction. The upper template (31) is provided with a plurality of first vacuum holes (313) on opposite sides along the third direction. The first vacuum holes (313) are connected to the upper adsorption holes (312).

7. The wafer bonding equipment according to claim 5, characterized in that, The lower mold assembly (2) also includes an adjustment base plate (22) disposed on the upper surface of the base (11), and a support base plate (23) is disposed on the upper surface of the adjustment base plate (22). The support base plate (23) can move relative to the adjustment base plate (22) along the second direction. The upper end face of the supporting base plate (23) is stacked with a lower heat insulation plate (24) and a lower heating plate (25), and the upper end face of the lower heating plate (25) is fixedly connected to the lower template (21). Multiple lower heat insulation plates (24) are provided. The lower heat insulation plates (24) extend along the second direction. A heat dissipation channel (26) is formed between two adjacent lower heat insulation plates (24). A heat dissipation plate (27) is provided in the heat dissipation channel (26). A plurality of heat dissipation fins are formed on one end face of the heat dissipation plate (27) facing away from the lower heating plate (25). The plurality of heat dissipation fins extend along the second direction.

8. The wafer bonding equipment according to claim 1, characterized in that, The bearing groove (211) is recessed in a cross shape on the upper end face of the lower template (21), and a circular clearance groove (212) is formed at the bottom of the bearing groove (211), which corresponds to the edge area of ​​the wafer. The bottom of the support groove (211) is provided with a plurality of lower adsorption holes (213), which are arranged in an array along the second direction and the third direction, and the lower adsorption holes (213) are distributed within the range of the clearance groove (212). The lower template (21) is provided with a plurality of second vacuum holes (214) on opposite sides along the third direction, and the second vacuum holes (214) are connected to the lower adsorption holes (213).

9. The wafer bonding equipment according to claim 1, characterized in that, The lifting assembly (1) also includes a plurality of guide columns (13) fixedly disposed on the upper surface of the base (11), and a fixing plate (14) is fixedly connected to the upper surface of the plurality of guide columns (13), and the mounting plate (12) is distributed between the base (11) and the fixing plate (14). An electric cylinder (15) is provided on the fixed plate (14), and the output end of the electric cylinder (15) passes through the fixed plate (14) in the first direction and is connected to the mounting plate (12); The mounting plate (12) is provided with a plurality of guide sleeves (16), and the plurality of guide sleeves (16) and the plurality of guide posts (13) slide in corresponding cooperation.

10. A wafer bonding apparatus according to claim 7, characterized in that, Temperature control components (5) are provided in both the lower mold assembly (2) and the upper mold assembly (3). The temperature control components (5) include a plurality of heating rods (51) and cooling channels (52). The plurality of heating rods (51) and cooling channels (52) are inserted into the lower heating plate (25) and the upper heating plate (34) along the second direction. The temperature control component (5) also includes a number of temperature probes (53), which are inserted into the upper template (31) and the lower template (21) along the second direction.

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