Bga chip packaging structure and packaging process thereof

Abstract

The application belongs to the technical field of chip packaging, and discloses a BGA chip packaging structure and a packaging process thereof, which comprise a multilayer ceramic substrate made of high-frequency low-loss ceramic material, the inside of which is integrated with multilayer interconnection wiring, and the surface of which is provided with signal vias; an upper cover connected to the outside of the multilayer ceramic substrate for electromagnetic shielding and mechanical protection, and the inside of which is provided with a cavity reserving a chip mounting space; and a chip connected to the middle part of the multilayer ceramic substrate; and heat-conducting resin connected between the chip and the upper cover.The application has the beneficial effect that repulsion is generated between the electromagnet and the magnet block after the electromagnet is electrified, the chip is rapidly separated from the substrate, the traditional heating disassembly mode is completely abandoned, damage to the chip and the substrate caused by high temperature is avoided, the disassembly time is greatly shortened, the efficiency and convenience of chip maintenance are significantly improved, and the user can conveniently and rapidly replace or repair the chip.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, and particularly relates to a BGA chip packaging structure and its packaging process. Background Technology

[0002] With the rapid development of electronic technology, the integration of chips is constantly improving, and the requirements for chip packaging technology are becoming increasingly stringent. BGA (Ball Grid Array) technology has been widely used in the field of integrated circuit packaging due to its many advantages, such as providing higher pin density, improving electrical performance and enhancing heat dissipation. In various electronic devices, BGA chips have become one of the core components and play a key role in the performance of the devices. Existing BGA chips are typically connected to the substrate using soldering, such as fixing the solder joints on the bottom of the chip to the corresponding pads on the substrate with solder balls. While this connection method can ensure the electrical stability and mechanical strength of the connection between the chip and the substrate to a certain extent, it has a significant drawback: it makes it difficult to disassemble the chip from the substrate. If the chip malfunctions or needs to be upgraded or replaced, the disassembly process becomes extremely difficult due to the strong bond of the solder joints. If conventional disassembly methods such as heating are used, irreversible damage can be caused to the chip or the substrate, resulting in problems such as chip pin deformation and substrate pad detachment. This can affect the performance of the entire electronic device or even render it unusable. This not only increases the maintenance cost and difficulty of the product but also limits the repairability and upgradeability of the electronic device. Summary of the Invention

[0003] This invention addresses the problem in existing technologies where chip malfunctions or requires upgrades or replacements, where the strong bond of the solder joints makes disassembly extremely difficult. Conventional disassembly methods, such as heating, can cause irreversible damage to the chip or substrate, leading to chip pin deformation, substrate pad detachment, and ultimately affecting the performance of the entire electronic device or even rendering it unusable. The invention proposes the following technical solution: A BGA chip packaging structure includes: a multilayer ceramic substrate made of high-frequency, low-loss ceramic material, with multilayer interconnect wiring integrated inside and signal vias on the surface; The top cover is connected to the outside of the multilayer ceramic substrate and is used for electromagnetic shielding and mechanical protection. The internal cavity is reserved for chip installation space. The chip is connected to the middle of the multilayer ceramic substrate; Thermally conductive resin is used to connect the chip and the top cover; Pins are connected to the chip and used to connect the chip and the multilayer ceramic substrate; The mounting structure includes a mounting frame, magnet blocks, electromagnets, a pressing and fixing structure, and a connecting structure; The mounting frame is connected to the chip, the magnet is connected to the mounting frame, the electromagnet is connected to the multilayer ceramic substrate, and when the electromagnet is energized, it drives the chip and the multilayer ceramic substrate to separate through the mounting frame and the magnet. The extrusion fixing structure is connected to the electromagnet and extrudes and fixes the chip. The connection structure is connected to the bottom of the multilayer ceramic substrate.

[0004] As a preferred embodiment of the above technical solution, the extrusion fixing structure includes: A limiting frame, connected to the multilayer ceramic substrate, is used for placing the electromagnet; A connector strip is attached to the limiting frame; An extrusion plate is inserted into the connector strip and the limiting frame, and the extrusion plate drives the connector strip to move horizontally inside the limiting frame.

[0005] As a preferred embodiment of the above technical solution, the extrusion fixing structure further includes: Side plate, connected to the plug strip; An arc-shaped memory metal sheet is connected to the side plate; The bottom plate is connected between the arc-shaped memory metal sheet and the limiting frame. The arc-shaped memory metal sheet drives the plug strip to move horizontally through the side plate.

[0006] As a preferred embodiment of the above technical solution, the connection structure includes: A tapered hole is provided at the bottom of the multilayer ceramic substrate; Solder is used to connect the multilayer ceramic substrate; Solder ball, attached to the solder.

[0007] As a preferred embodiment of the above technical solution, the outer side of the mounting frame is provided with a plug-in hole for connecting with the plug-in strip, and the bottom edge of the mounting frame is provided with an inclined angle.

[0008] As a preferred embodiment of the above technical solution, a reset spring is provided between the two arc-shaped memory metal sheets, and the reset spring is used to reset the two arc-shaped memory metal sheets.

[0009] As a preferred embodiment of the above technical solution, the diameter of the top end of the conical hole is smaller than the diameter of the bottom end, and the bottom end of the conical hole is in the shape of a ring.

[0010] As a preferred embodiment of the above technical solution, the inner side of the tapered hole and the outer side of the solder are attached, and the bottom end of the solder is flush with the bottom end of the multilayer ceramic substrate.

[0011] A packaging process suitable for BGA chip packaging structures includes the following steps: Step 1: Substrate pretreatment: Select high-frequency low-loss ceramic material to make a multilayer ceramic substrate, integrate multilayer interconnect wiring inside the substrate, open solder ball array and signal via on the surface, process a conical hole with a top diameter smaller than the bottom diameter and a circular bottom end on the bottom of the substrate, and fill the conical hole with solder so that the bottom end of the solder is flush with the bottom end of the multilayer ceramic substrate. Step 2, Chip Assembly: Fix the mounting frame to the outside of the chip, install a magnet on the mounting frame, and install an electromagnet at the corresponding position on the multilayer ceramic substrate. Then, make a preliminary connection between the chip and the middle of the multilayer ceramic substrate through the pins. Step 3: Chip Fixation: After chip installation, it is initially fixed by a compression fixing structure; Step 4, Top Cover Installation: Apply thermally conductive resin to the chip surface and connect the top cover to the outside of the multilayer ceramic substrate. The internal cavity of the top cover accommodates the chip, while ensuring that the thermally conductive resin fills the space between the chip and the top cover. This achieves heat dissipation for the chip and electromagnetic shielding and mechanical protection functions for the top cover. At the same time, the chip is fixed a second time using an extrusion plate. Step 5: Solder ball connection: Solder balls are soldered to the bottom of the filled solder to complete the electrical connection between the multilayer ceramic substrate and the external circuit, forming a complete BGA chip package structure.

[0012] The beneficial effects of this invention are as follows: (1) The present invention generates a repulsive force between the electromagnet and the magnet block after the electromagnet is energized, which drives the chip to separate from the substrate quickly. This completely eliminates the traditional heating disassembly method, avoids damage to the chip and substrate caused by high temperature, greatly shortens the disassembly time, significantly improves the efficiency and convenience of chip maintenance, and makes it convenient for users to quickly replace or repair chips. Attached Figure Description

[0013] Figure 1 The diagram shown is a schematic diagram of a BGA chip packaging structure in Embodiment 1; Figure 2 The diagram shown is a cross-sectional view of the top cover in Embodiment 1; Figure 3 The diagram shown is a schematic of the pin mounting structure in Embodiment 1; Figure 4 What is shown is Figure 3 Schematic diagram of the structure of region A in the middle; Figure 5 The diagram shown is a schematic of the installation structure of the magnet block in Embodiment 1; Figure 6 The diagram shown is a schematic of the electromagnet installation structure in Example 1; Figure 7 The diagram shown is a schematic of the installation structure of the extrusion plate in Embodiment 1; Figure 8 What is shown is Figure 7Schematic diagram of the structure of region B in the middle; Figure 9 The diagram shown is a schematic of the solder mounting structure in Example 1.

[0014] In the diagram: 1. Multilayer ceramic substrate; 2. Top cover; 3. Chip; 4. Thermally conductive resin; 5. Pin; 6. Mounting frame; 7. Magnet block; 8. Electromagnet; 91. Limiting frame; 92. Connecting strip; 93. Extrusion plate; 94. Side plate; 95. Arc-shaped memory metal sheet; 96. Bottom plate; 97. Pressing spring; 98. Reset spring; 101. Tapered hole; 102. Solder; 103. Solder ball. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0016] Example 1 This invention provides a BGA chip packaging structure and its packaging process, such as... Figures 1 to 9 As shown, the package includes: a multilayer ceramic substrate 1, a top cover 2, a chip 3, thermally conductive resin 4, and pins 5. The multilayer ceramic substrate 1 is made of high-frequency, low-loss ceramic material, with integrated multilayer interconnect wiring and signal vias on its surface. The top cover 2 is connected to the outside of the multilayer ceramic substrate 1 for electromagnetic shielding and mechanical protection, and its internal cavity provides space for the chip 3. The chip 3 is connected to the middle of the multilayer ceramic substrate 1 and serves as the core component of the entire package structure, undertaking data processing and signal transmission functions. The thermally conductive resin 4 connects the chip 3 and the top cover 2 to accelerate the heat dissipation of the chip 3. The pins 5 are connected to the chip 3 and are used for connection... The chip 3 and the multilayer ceramic substrate 1 are connected; the mounting structure includes a mounting frame 6, a magnet 7, an electromagnet 8, a pressing and fixing structure, and a connecting structure; the mounting frame 6 is connected to the chip 3, and the outer side of the mounting frame 6 is provided with a plug hole 10 for connecting with a plug strip 92. The bottom edge of the mounting frame 6 is provided with an inclined angle. The magnet 7 is connected to the mounting frame 6, and the electromagnet 8 is connected to the multilayer ceramic substrate 1. After the electromagnet 8 is energized, it drives the chip 3 and the multilayer ceramic substrate 1 to separate through the mounting frame 6 and the magnet 7. The pressing and fixing structure is connected to the electromagnet 8 and presses and fixes the chip 3. The connecting structure is connected to the bottom of the multilayer ceramic substrate 1.

[0017] Conventional disassembly methods, such as heating, can cause irreversible damage to the chip or substrate, leading to chip pin deformation and substrate pad detachment. Therefore, the disassembly method is modified by replacing the existing heating and soldering method with a plug-in method. This new method eliminates the need for heating and other disassembly methods. Furthermore, during disassembly, when the electromagnet 8 is energized and its magnetic poles are aligned with those of the magnet block 7, the magnet block 7 is driven to rise. This rise of the magnet block 7 causes the chip 3 to rise as well, enabling rapid disassembly between the chip 3 and the multilayer ceramic substrate 1. This improves disassembly efficiency and facilitates chip 3 repair, thus enhancing repair efficiency.

[0018] In use, connect chip 3 and mounting frame 6, then connect chip 3 along the inner side of mounting frame 6 to the top of multilayer ceramic substrate 1. At this time, pin 5 enters the signal via. Then, thermally conductive resin 4 is applied to the top of chip 3. Next, install the top cover 2 and multilayer ceramic substrate 1. At this time, the top cover 2 drives the extrusion fixing structure to operate, so that the extrusion fixing structure fixes chip 3, making chip 3 more stable. Finally, the operator can install the connection structure at the bottom of multilayer ceramic substrate 1 to the circuit board.

[0019] Specifically, a signal via is provided at the top of the multilayer ceramic substrate 1, and a pin 5 is inserted inside the signal via. The pin 5 is made of highly conductive metal material, one end of which is soldered to the pin of the chip 3, and the other end is connected to the internal wiring of the multilayer ceramic substrate 1. The same chip 3 is fixedly connected between the tops of multiple pins 5. A mounting frame 6 is glued to the bottom edge of the chip 3. A hole is provided inside the mounting frame 6, and a magnet 7 is inserted inside the hole. An extrusion fixing structure is installed on the top of the multilayer ceramic substrate 1 outside the mounting frame 6. An electromagnet 8 is fixedly installed inside the extrusion fixing structure. A connection structure is embedded at the bottom of the multilayer ceramic substrate 1. The top cover 2 is fixed to the outside of the multilayer ceramic substrate 1 by welding or sealing process. The top cover 2 has a reserved mounting cavity for the chip 3. The top cover 2, made of metal material, has both electromagnetic shielding and mechanical protection functions, isolating external electromagnetic interference and resisting physical impact. Thermally conductive resin 4 is filled between the chip 3 and the top cover 2. With its high thermal conductivity, the heat generated by the operation of the chip 3 is conducted to the top cover 2 and released through the heat dissipation path of the top cover 2, ensuring the stable operation of the chip 3.

[0020] like Figure 1 , Figure 2 and Figure 9As shown, the connection structure includes: a tapered hole 101, solder 102, and solder ball 103. The tapered hole 101 is located at the bottom of the multilayer ceramic substrate 1; the solder 102 is connected to the multilayer ceramic substrate 1; the solder ball 103 is connected to the solder 102; the diameter of the top end of the tapered hole 101 is smaller than the diameter of the bottom end, the bottom end of the tapered hole 101 is in the shape of a ring, the inner side of the tapered hole 101 is in contact with the outer side of the solder 102, and the bottom end of the solder 102 is flush with the bottom end of the multilayer ceramic substrate 1.

[0021] Since the solder balls 103 need to be installed on the circuit board, it is necessary to ensure that the position of the solder balls 103 is accurate. Therefore, a connection structure is used to limit the position of the solder balls 103, so that the solder balls 103 are evenly distributed on the bottom of the multilayer ceramic substrate 1, making the solder balls 103 more uniform on the bottom of the multilayer ceramic substrate 1.

[0022] In use, the bottom of the multilayer ceramic substrate 1 of the BGA chip package structure is aligned with the corresponding position of the external circuit board. Since the top diameter of the tapered hole 101 is smaller than the bottom diameter and the bottom is in a ring shape, during the soldering process, the molten solder 102 will stably fill the tapered hole 101 due to surface tension and the guiding effect of the tapered hole 101. Its outer side is closely attached to the inner side of the tapered hole 101, ensuring that the solder 102 is evenly distributed at the bottom of the multilayer ceramic substrate 1. At the same time, the design that the bottom of the solder 102 is flush with the bottom of the multilayer ceramic substrate 1 allows the solder ball 103 to contact the pad on the external circuit board with precise height and position.

[0023] Specifically, a tapered hole 101 is provided at the bottom of the multilayer ceramic substrate 1, the tapered hole 101 is filled with solder 102, and solder balls 103 are welded to the bottom of the solder 102.

[0024] like Figures 1 to 8 As shown, the extrusion fixing structure includes: a limiting frame 91, a connector strip 92, an extrusion plate 93, a side plate 94, an arc-shaped memory metal sheet 95, and a bottom plate 96. The limiting frame 91 is connected to the multilayer ceramic substrate 1 and is used for placing the electromagnet 8. The connector strip 92 is connected to the limiting frame 91. The extrusion plate 93 is inserted between the connector strip 92 and the limiting frame 91. The extrusion plate 93 drives the connector strip 92 to move horizontally inside the limiting frame 91. The side plate 94 is connected to the connector strip 92. The arc-shaped memory metal sheet 95 is connected to the side plate 94. A reset spring 98 is provided between the two arc-shaped memory metal sheets 95 for resetting the two arc-shaped memory metal sheets 95. The bottom plate 96 is connected between the arc-shaped memory metal sheet 95 and the limiting frame 91. The arc-shaped memory metal sheet 95 drives the connector strip 92 to move horizontally through the side plate 94.

[0025] Because the above-mentioned chip 3 is installed by plugging, the chip 3 is unstable. Therefore, it is necessary to use a compression fixing structure to compress and fix the chip 3 to prevent the chip 3 from shaking during operation, thereby ensuring the stability of the chip 3 operation.

[0026] In use, the mounting frame 6 is inserted into the limiting frame 91. At this time, the drive connector 92 moves, which in turn moves the side plate 94. When the side plate 94 moves, it causes the arc-shaped memory metal sheet 95 to press against the bottom plate 96. Because the bottom plate 96 is limited by the limiting frame 91, the arc-shaped memory metal sheet 95 is bent by the force. The bending of the arc-shaped memory metal sheet 95 causes the connector 92 to shift. Then, when the connector 92 enters the connector hole 10, the restoring force of the arc-shaped memory metal sheet 95 drives the connector 92 to be inserted into the mounting frame 6. At the same time, when the upper cover 2 is fixed, it drives the pressing plate 93 to move. When the pressing plate 93 moves, it presses the connector 92, keeping the position of the connector 92 stable. This allows the connector 92 to clamp the chip 3 and fix the chip 3.

[0027] Specifically, the limiting frame 91 is bonded to the top of the multilayer ceramic substrate 1. A connecting strip 92 is movably connected to the inside of the limiting frame 91. One end face of the connecting strip 92 has chamfers at both the top and bottom of the insertion hole 10. The chamfer at the top has an inclination angle of 45 degrees, and the chamfer at the bottom has an inclination angle of 60 degrees. The size of the top chamfer is smaller than that of the bottom chamfer. The inclination surface of the bottom chamfer is flush with the bottom of the insertion hole 10, and the top inclination angle is completely submerged inside the insertion hole 10. The horizontal surface of the top of the connecting strip 92 is flush with the top of the inner wall of the insertion hole 10. A side plate 94 is integrally formed at one end of the connecting strip 92. An arc-shaped memory metal sheet 95 is symmetrically welded to one end face. The same bottom plate 96 is welded to one end face of the two arc-shaped memory metal sheets 95. One end face of the bottom plate 96 is fitted to the inside of the limiting frame 91. An extrusion plate 93 is sleeved on the top of the insertion strip 92. The top of the insertion strip 93 is fixedly connected to the bottom of the inner wall of the upper cover 2. The bottom end of the extrusion plate 93 has a tooth. A protrusion is welded to the top of the insertion strip 92. The maximum width of the protrusion is equal to the maximum width of the tooth. A reset spring 98 is welded between the two arc-shaped memory metal sheets 95. A pressing spring 97 is symmetrically welded to one end face of the bottom plate 96. The pressing spring 97 is located at the top of the arc-shaped memory metal sheet 95.

[0028] A packaging process suitable for BGA chip packaging structures includes the following steps: Step 1: Substrate pretreatment: A multilayer ceramic substrate 1 is made using high-frequency, low-loss ceramic material. Multilayer interconnect wiring is integrated inside the substrate. A solder ball array and signal vias are opened on the surface. A tapered hole 101 with a top diameter smaller than the bottom diameter and a circular bottom is processed at the bottom of the substrate. Solder 102 is filled into the tapered hole 101 so that the bottom of the solder 102 is flush with the bottom of the multilayer ceramic substrate 1. Step 2, chip assembly: Fix the mounting frame 6 to the outside of the chip 3, install the magnet block 7 on the mounting frame 6, and install the electromagnet 8 at the corresponding position on the multilayer ceramic substrate 1. Then, make a preliminary connection between the chip 3 and the middle of the multilayer ceramic substrate 1 through the pin 5. Step 3, Chip Fixing: After chip 3 is installed, it is initially fixed by a compression fixing structure; Step 4, Top Cover Installation: Apply thermally conductive resin 4 to the surface of chip 3, connect top cover 2 to the outside of multilayer ceramic substrate 1, so that the internal cavity of top cover 2 can accommodate chip 3, and at the same time ensure that thermally conductive resin 4 is filled between chip 3 and top cover 2, so as to realize the heat dissipation of chip 3 and the electromagnetic shielding and mechanical protection functions of top cover 2. After chip 3 is inserted into multilayer ceramic substrate 1, when top cover 2 is pre-installed, the extrusion plate 93 is triggered to push the insertion strip 92 to complete the fixation. Step 5: Solder ball connection: Solder balls 103 are soldered to the bottom of the filled solder 102 to complete the electrical connection between the multilayer ceramic substrate 1 and the external circuit, forming a complete BGA chip package structure.

[0029] Working principle: A multilayer ceramic substrate 1 is made of high-frequency, low-loss ceramic material. Multilayer interconnect wiring is integrated inside the multilayer ceramic substrate 1. Signal vias are processed on the surface. A tapered hole 101 is opened at the bottom and filled with solder 102 so that the bottom end of the solder 102 is flush with the bottom surface of the multilayer ceramic substrate 1. Finally, solder balls 103 are soldered to the bottom of the solder 102 to complete the fabrication of the connection structure of the multilayer ceramic substrate 1. At the same time, the chip 3, the top cover 2, the thermally conductive resin 4, the pins 5, and the various components of the mounting structure are prepared. Next, the magnet 7 is embedded into the hole inside the mounting frame 6. Then, the mounting frame 6 and the bottom of the chip 3 are fixed together. Then, one end of the pin 5 is firmly connected to the pin of the chip 3 through a soldering process. Then, the chip 3 together with the pin 5 is inserted into the top of the multilayer ceramic substrate 1 along the inside of the mounting frame 6, so that the pin 5 accurately enters the signal via, realizing the initial electrical connection between the chip 3 and the multilayer ceramic substrate 1. Then, the mounting frame 6 is inserted into the limiting frame 91. At this time, the mounting frame 6 pushes the side plate 94, which causes the arc-shaped memory metal sheet 95 to press against the bottom plate 96. Since the bottom plate 96 is limited by the limiting frame 91, the arc-shaped memory metal sheet 95 is bent by force, which in turn drives the insertion strip 92 to move horizontally within the limiting frame 91. When the insertion strip 92 moves to align with the insertion hole 10 on the outside of the mounting frame 6, the restoring force of the arc-shaped memory metal sheet 95 causes the insertion strip 92 to insert into the insertion hole 10, completing the initial pressing and fixing of the chip 3. Then, thermally conductive resin 4 is uniformly coated on the surface of chip 3. The top cover 2 is fixed to the outside of the multilayer ceramic substrate 1 by welding or sealing process, so that the internal cavity of the top cover 2 completely accommodates chip 3. During the installation of the top cover 2, the extrusion plate 93 is moved down. The teeth at the bottom of the extrusion plate 93 and the protrusion at the top of the connector strip 92 interlock with each other, further extruding the connector strip 92 to ensure that chip 3 is firmly clamped. At the same time, thermally conductive resin 4 is filled between chip 3 and top cover 2 to achieve heat dissipation function. The top cover 2 also plays the role of electromagnetic shielding and mechanical protection. Then, the bottom of the multilayer ceramic substrate 1 with the packaged BGA chip structure is precisely aligned with the corresponding position of the external circuit board. Through soldering processes such as reflow soldering, the solder balls 103 are melted and connected to the solder pads of the external circuit board, thus completing the electrical connection between the entire package structure and the external circuit. During equipment operation, chip 3, as the core component, performs data processing and signal transmission. The interconnect wiring and signal vias inside the multilayer ceramic substrate 1 ensure stable signal transmission. The thermally conductive resin 4 quickly conducts the heat generated by chip 3 to the top cover 2, and then dissipates it to the outside world, maintaining chip 3 at a suitable operating temperature. The top cover 2 continuously plays an electromagnetic shielding role, preventing external electromagnetic interference from affecting the operation of chip 3. At the same time, it provides mechanical protection for the packaging structure and resists external physical impacts. The extrusion fixing structure and connection structure ensure a stable connection between chip 3 and the substrate, and between the substrate and the external circuit board, ensuring the stable operation of the entire packaging structure. When chip 3 needs to be repaired, electromagnet 8 is energized so that the magnetic poles of electromagnet 8 and magnet block 7 are the same on opposite sides. The repulsive force between them drives magnet block 7 to rise. Magnet block 7 drives mounting frame 6 and chip 3 to rise synchronously, thereby realizing the rapid separation of chip 3 from multilayer ceramic substrate 1. This avoids irreversible damage to chip pins and substrate pads caused by traditional heating disassembly methods. After chip 3 is disassembled, it can be tested and repaired. After the repair is completed, chip 3 is reinstalled back into multilayer ceramic substrate 1 according to the packaging and installation process to restore the normal function of the BGA chip packaging structure.

[0030] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it.

Claims

1. A BGA chip packaging structure, characterized in that, include: The multilayer ceramic substrate (1) is made of high-frequency low-loss ceramic material, with multilayer interconnect wiring integrated inside and signal vias on the surface; The chip (3) is connected to the middle of the multilayer ceramic substrate (1); Pin (5) is connected to the chip (3) and is used to connect the chip (3) and the multilayer ceramic substrate (1). The mounting structure includes a mounting frame (6), a magnet block (7), an electromagnet (8), a compression fixing structure, and a connection structure; The mounting frame (6) is connected to the chip (3), the magnet (7) is connected to the mounting frame (6), the electromagnet (8) is connected to the multilayer ceramic substrate (1), and after the electromagnet (8) is energized, it drives the chip (3) and the multilayer ceramic substrate (1) to separate through the mounting frame (6) and the magnet (7). The extrusion fixing structure is connected to the electromagnet (8), and the extrusion fixing structure extrudes and fixes the chip (3). The connection structure is connected to the bottom end of the multilayer ceramic substrate (1).

2. The BGA chip packaging structure according to claim 1, characterized in that, The top cover (2) is connected to the outside of the multilayer ceramic substrate (1) for electromagnetic shielding and mechanical protection, and the internal cavity reserves space for chip (3) installation. Thermally conductive resin (4) is connected between the chip (3) and the top cover (2).

3. The BGA chip packaging structure according to claim 2, characterized in that, The extrusion fixing structure includes: A limiting frame (91) is connected to the multilayer ceramic substrate (1) for placing the electromagnet (8); A connector (92) is connected to the limiting frame (91); An extrusion plate (93) is inserted into the connector strip (92) and the limiting frame (91), and the extrusion plate (93) drives the connector strip (92) to move horizontally inside the limiting frame (91).

4. The BGA chip packaging structure according to claim 3, characterized in that, The extrusion fixing structure further includes: Side plate (94) is connected to the plug strip (92); An arc-shaped memory metal sheet (95) is connected to the side plate (94). The bottom plate (96) is connected between the arc-shaped memory metal sheet (95) and the limiting frame (91). The arc-shaped memory metal sheet (95) drives the plug strip (92) to move horizontally through the side plate (94).

5. A BGA chip packaging structure according to claim 4, characterized in that, The connection structure includes: A tapered hole (101) is provided at the bottom of the multilayer ceramic substrate (1); Solder (102) is attached to the multilayer ceramic substrate (1). Solder ball (103) is attached to the solder (102).

6. A BGA chip packaging structure according to claim 5, characterized in that, The mounting frame (6) has a plug hole (10) on its outer side for connecting with the plug strip (92), and the bottom edge of the mounting frame (6) has an inclined angle.

7. A BGA chip packaging structure according to claim 6, characterized in that, A reset spring (98) is provided between the two arc-shaped memory metal sheets (95), and the reset spring (98) is used to reset the two arc-shaped memory metal sheets (95).

8. A BGA chip packaging structure according to claim 7, characterized in that, The top diameter of the conical hole (101) is smaller than the bottom diameter, and the bottom of the conical hole (101) is in the shape of a ring.

9. A BGA chip packaging structure according to claim 8, characterized in that, The inner side of the tapered hole (101) is attached to the outer side of the solder (102), and the bottom end of the solder (102) is flush with the bottom end of the multilayer ceramic substrate (1).

10. A packaging process suitable for the BGA chip packaging structure of claim 9, characterized in that, Includes the following steps: Step 1: Substrate pretreatment: A multilayer ceramic substrate (1) is made using high-frequency low-loss ceramic material. Multilayer interconnect wiring is integrated inside the substrate. A solder ball array and signal vias are opened on the surface. A conical hole (101) with a top diameter smaller than the bottom diameter and a circular bottom is processed at the bottom of the substrate. Solder (102) is filled into the conical hole (101) so that the bottom of the solder (102) is flush with the bottom of the multilayer ceramic substrate (1). Step 2, chip assembly: Fix the mounting frame (6) to the outside of the chip (3), install the magnet block (7) on the mounting frame (6), and install the electromagnet (8) at the corresponding position on the multilayer ceramic substrate (1). Then, make a preliminary connection between the chip (3) and the middle of the multilayer ceramic substrate (1) through the pin (5). Step 3, chip fixing: After the chip (3) is installed, it is initially fixed by the extrusion fixing structure; Step 4, Top cover installation: Apply thermally conductive resin (4) to the surface of chip (3), connect the top cover (2) to the outside of the multilayer ceramic substrate (1), so that the internal cavity of the top cover (2) can accommodate chip (3), while ensuring that the thermally conductive resin (4) is filled between chip (3) and top cover (2), so as to realize the heat dissipation of chip (3) and the electromagnetic shielding and mechanical protection functions of top cover (2), and use extrusion plate (93) to fix chip (3) for a second time; Step 5: Solder ball connection: Solder balls (103) are soldered to the bottom of the filled solder (102) to complete the electrical connection between the multilayer ceramic substrate (1) and the external circuit, forming a complete BGA chip package structure.

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