Bonding device

Abstract

The application relates to a bonding device, comprising a beam, a slide and a bonding head. The beam comprises a first split beam and a second split beam arranged in an upper and lower interval. The slide comprises a first slide and a second slide arranged in an upper and lower interval. The first slide is arranged on the first split beam, and the second slide is arranged on the second split beam. The bonding head comprises a first bonding head and a second bonding head arranged in a vertical direction in sequence. The first bonding head is arranged on the first slide, and the second bonding head is arranged on the second slide. The second bonding head is decoupled from a bonding force load path at an architecture level, so that the elastic deformation and thermal deformation of a bonding force structure chain are not propagated to the second bonding head through any rigid mechanical path, thereby preventing defects such as displacement or attitude error, and improving bonding precision.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to bonding devices. Background Technology

[0002] In advanced semiconductor packaging manufacturing, especially in thermo-press bonding (TCB) and hybrid bonding, electronic components (such as chips) must be placed on the substrate with in-plane mounting precision on the order of hundreds of nanometers, while bonding forces on the order of tens to hundreds of Newtons are applied to the electronic components via bonding tools.

[0003] Bonding devices in related technologies typically include a bonding head, a carriage, and a crossbeam. The bonding head is a single-piece design and slides along the Z-axis on the carriage, which is a single-piece design and slides along the X-axis on the crossbeam. The X-axis can be understood as horizontal, and the Z-axis as vertical. The bonding head is equipped with an actuator and a bonding tool. During bonding, after the bonding head is aligned with the electronic component below, the actuator provides Z-axis pressure, which is applied to the electronic component by the bonding tool, causing the electronic component to bond to the substrate. However, defects such as displacement and orientation errors may occur in the electronic components of the bonded electronic product, resulting in lower product quality and failure to meet requirements. Summary of the Invention

[0004] Therefore, it is necessary to provide a bonding device that can reduce the displacement or orientation error of electronic components in electronic products and improve the bonding accuracy of the products, thereby addressing at least one problem in the related technologies.

[0005] This application provides a bonding device, comprising:

[0006] The crossbeam includes a first split beam and a second split beam arranged at an interval between the upper and lower parts, with the first split beam located above the second split beam;

[0007] A carriage, comprising a first sliding frame and a second sliding frame arranged vertically at intervals, wherein the first sliding frame is slidably disposed on the first split beam along the length direction of the crossbeam, and the second sliding frame is slidably disposed on the second split beam along the length direction; and

[0008] A bonding head, comprising a first bonding head and a second bonding head arranged sequentially in a vertical direction; the first bonding head is correspondingly disposed on the first sliding frame, and the second bonding head is correspondingly disposed on the second sliding frame; the first bonding head can transmit bonding force to the second bonding head in a vertical direction; the second bonding head can apply the bonding force to the electronic component below.

[0009] In one embodiment, the bonding head further includes a force transmitter disposed between the first bonding head and the second bonding head to transmit the bonding force applied by the first bonding head to the second bonding head in the vertical direction; and the force transmitter does not provide mechanical constraints in any other direction besides the vertical direction.

[0010] In one embodiment, the force transmission member includes a first limiting part and a second limiting part. The first limiting part is connected to the first bonding head, and the second limiting part is connected to the second bonding head. The first limiting part and the second limiting part are mutually limitingly engaged along the length direction, and the first limiting part and the second limiting part can also abut against each other in the vertical direction to transmit the bonding force.

[0011] In one embodiment, one of the first limiting portion and the second limiting portion is provided with a limiting protrusion, and the other of the first limiting portion and the second limiting portion is provided with a limiting recess. The limiting protrusion is disposed in the limiting recess, and the limiting protrusion is in clearance fit with the limiting recess along the length direction.

[0012] In one embodiment, the bonding device further includes two first power mechanisms, which are mounted on the crossbeam. One of the first power mechanisms is connected to the first sliding frame, and the other is connected to the second sliding frame. One of the first power mechanisms is used to drive the first sliding frame to move along the first split beam, and the other is used to drive the second sliding frame to move along the second split beam. When the first sliding frame and the second sliding frame move under the power of their respective first power mechanisms, the first limiting part and the second limiting part always maintain synchronous movement and clearance fit.

[0013] In one embodiment, the bonding device further includes a support structure, to which both the first split beam and the second split beam are connected.

[0014] In one embodiment, there are two support structures, with the two ends of the first split beam and the second split beam respectively connected to the two support structures one-to-one.

[0015] In one embodiment, the support structure includes a first support member and a second support member spaced apart, the first support member being connected to the first split beam, and the second support member being connected to the second split beam.

[0016] In one embodiment, the bonding device further includes a slide, the bottom of the support structure is connected to the slide, and the top of the support structure is connected to the first split beam and the second split beam.

[0017] In one embodiment, the slide includes a first slide and a second slide arranged at intervals; the first support is connected to the first slide, and the second support is connected to the second slide.

[0018] In one embodiment, the first bonding head includes a first slider, a first worktable, and an actuator. The first slider is slidably disposed on the first sliding frame along the vertical direction. The first worktable is connected to the first slider and can drive the first slider to move and adjust its position along the vertical direction. The actuator is connected to the first worktable or the first slider and can apply a downward bonding force to the first worktable. The force transmission element is disposed at the bottom of the first worktable.

[0019] In one embodiment, the second bonding head includes a second slider, a second worktable, and a bonding tool; the second slider is slidably disposed on the second sliding frame along the vertical direction, the second worktable is connected to the second slider, the second worktable can drive the second slider to move and adjust its position along the vertical direction, the force transmission element is disposed on the top of the second worktable, the bonding tool is installed on the bottom of the second worktable, and the bonding tool is used to adsorb and hold the electronic component.

[0020] In one embodiment, the first bonding head further includes at least two off-axis vertical force applicators, each of which is connected to at least one of the first slider and the first worktable. The off-axis vertical force applicators are offset from the central axis of the first worktable and can apply a bonding force in the vertical direction to the first worktable.

[0021] In one embodiment, at least two of the off-axis vertical force applicators are symmetrically arranged about the central axis of the first worktable.

[0022] In one embodiment, the force transmission element includes one or more combinations of a voice coil motor, a linear motor, a flexible hinge, an elastomer, a pneumatic diaphragm force applicator, and a multi-degree-of-freedom linkage mechanism.

[0023] In one embodiment, the ratio of the stiffness of the force transmission member in the vertical direction to its stiffness in the horizontal direction is greater than 100, and when the first bonding head applies the maximum bonding force in the vertical direction, the deflection of the second bonding head relative to the first bonding head in the horizontal direction is less than 100 nm.

[0024] In one embodiment, the bonding apparatus further includes a stage located below the second bonding head, the stage being used to support the substrate and electronic components.

[0025] In the aforementioned bonding device, the crossbeam, carriage, and bonding head are not designed as a single unit, but rather as separate units. This allows the first bonding head to provide downward bonding force during bonding, which is then transmitted to the electronic component below via the second bonding head, thus completing the bonding between the electronic component and the substrate. Furthermore, during the bonding process, the bonding force load path primarily transmits through the second bonding head, first bonding head, first carriage, and first separate beam sequentially to the first separate beam. The bonding force load path does not transmit to the second carriage or second separate beam, effectively preventing torsional deformation of the second bonding head, second carriage, and second separate beam. In other words, by decoupling the second bonding head from the bonding force load path at the structural level, the elastic and thermal deformation of the bonding force-bearing structural chain does not propagate to the second bonding head via any rigid mechanical path. This prevents displacement or orientation errors of the electronic component during the bonding process, improving the bonding accuracy of electronic products. Attached Figure Description

[0026] Figure 1 This is a structural diagram of the bonding device according to the first embodiment of this application.

[0027] Figure 2 This is a side view of the bonding device according to the first embodiment of this application.

[0028] Figure 3 This is a structural diagram of the bonding device according to the second embodiment of this application.

[0029] Figure 4 This is a side view of the bonding device according to the second embodiment of this application.

[0030] Figure 5 This is a structural diagram of the bonding device according to the third embodiment of this application.

[0031] Figure 6 This is a side view of the bonding device according to the third embodiment of this application.

[0032] Figure 7 This is a structural diagram of the bonding device according to the fourth embodiment of this application.

[0033] Figure 8 This is a side view of the bonding device according to the fourth embodiment of this application.

[0034] Figure 9 This is a structural diagram of the bonding device according to the fifth embodiment of this application.

[0035] Figure 10 This is a side view of the bonding device according to the fifth embodiment of this application.

[0036] Figure 11This is a structural diagram of the bonding device according to the sixth embodiment of this application.

[0037] Figure 12 This is a side view of the bonding device according to the sixth embodiment of this application.

[0038] Figure 13 This is a structural diagram of a force transmission component according to an embodiment of this application.

[0039] Figure 14 This is a structural diagram of a force transmission component according to another embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10. Crossbeam; 11. First split beam; 111. First guide rail; 12. Second split beam; 121. Second guide rail; 20. Carriage; 21. First sliding carriage; 22. Second sliding carriage; 30. Keying head; 31. First keying head; 311. First slider; 312. First worktable; 313. Actuator; 314. Off-axis vertical force applicator; 32. Second keying head; 321. Second slider; 322. Second worktable; 323. Keying tool; 324. 33. Support; 33. Force transmission component; 331. First limiting part; 3311. Limiting protrusion; 332. Second limiting part; 3321. Limiting recess; 40. Support structure; 41. First support member; 42. Second support member; 50. Slide; 51. First sliding seat; 52. Second sliding seat; 60. Stage; 100. Electronic component; 200. Substrate; F. Bonding force load path; O. Central axis; X. First direction; Y. Second direction; Z. Third direction. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] As described in the background section, electronic components in bonded electronic products often exhibit displacement and orientation errors. This is because, during the bonding process, the bonding force load path passes sequentially through the bonding head, carriage, and crossbeam, causing torsional deformation in the crossbeam. This, in turn, leads to displacement and orientation errors of the electronic components held below the bonding tool relative to the substrate. Furthermore, the heat generated by the actuator and heater of the bonding head is conducted to the carriage and crossbeam, easily causing thermal expansion and deformation of the crossbeam, which in turn leads to displacement and orientation errors of the electronic components held below the bonding tool relative to the substrate. There is no structural decoupling between the thermal expansion of the bonding force-bearing structure and the position of the bonding tool.

[0044] For the reasons mentioned above, this application provides a bonding device that can reduce the displacement or orientation error of electronic components in electronic products and improve the bonding accuracy of the products.

[0045] The following will combine Figures 1 to 14 A bonding apparatus according to an embodiment of this application will be described in detail.

[0046] See Figure 1 and Figure 2 One embodiment of this application provides a bonding device, including a crossbeam 10, a slide 20, and a bonding head 30.

[0047] For example, the crossbeam 10 includes a first split beam 11 and a second split beam 12 arranged vertically at intervals. The first split beam 11 is located above the second split beam 12.

[0048] For example, the carriage 20 includes a first sliding frame 21 and a second sliding frame 22 arranged vertically at intervals. The first sliding frame 21 is slidably disposed on the first split beam 11 along the length direction of the crossbeam 10, and the first split beam 11 serves to support and guide the first sliding frame 21 along the length direction. The second sliding frame 22 is slidably disposed on the second split beam 12 along the length direction, and the second split beam 12 serves to support and guide the second sliding frame 22 along the length direction. Optionally, the first split beam 11 is provided with a first guide rail 111 extending along the length direction, and the first sliding frame 21 is slidably disposed on the first guide rail 111. The second split beam 12 is provided with a second guide rail 121 extending along the length direction, and the second sliding frame 22 is slidably disposed on the second guide rail 121.

[0049] For example, the bonding head 30 includes a first bonding head 31 and a second bonding head 32 arranged sequentially in a vertical direction. The first bonding head 31 is correspondingly disposed on the first sliding frame 21, and the second bonding head 32 is correspondingly disposed on the second sliding frame 22. The first bonding head 31 can transmit the bonding force to the second bonding head 32 in the vertical direction. The second bonding head 32 can apply the bonding force to the electronic component 100 below. The electronic component 100 includes, but is not limited to, a chip.

[0050] In the aforementioned bonding device, the crossbeam 10, slide 20, and bonding head 30 are not designed as a single unit, but rather as separate units. This allows the first bonding head 31 to provide a downward bonding force during bonding operations, which is then transmitted to the electronic component 100 below via the second bonding head 32, thereby completing the bonding between the electronic component 100 and the substrate 200. Furthermore, a bonding force load path F is generated during the bonding process; the bonding force load path F can be found in [reference needed]. Figure 1 The dotted lines in the diagram represent the bonding force load path F. The load is transmitted sequentially through the second bonding head 32, the first bonding head 31, the first sliding frame 21, and the first split beam 11 to the first split beam 11, but not to the second sliding frame 22 and the second split beam 12. This effectively prevents torsional deformation of the second bonding head 32, the second sliding frame 22, and the second split beam 12. In other words, the second bonding head 32 is decoupled from the bonding force load path F at the structural level, ensuring that the elastic and thermal deformation of the bonding force-bearing structural chain does not propagate to the second bonding head 32 via any rigid mechanical path. This prevents displacement or attitude errors in the electronic component 100 during the bonding process, improving the bonding accuracy of the electronic product.

[0051] Furthermore, the bonding device can operate at maximum bonding force without requiring feedforward or calibration table compensation for deformation of the upper link caused by bonding force.

[0052] Furthermore, based on the decoupling of the first bonding head 31 and the second bonding head 32 in the lateral direction, the first bonding head 31 can be designed for high bond force bearing capacity without considering its dynamic mass. The second bonding head 32 can be designed for low mass and high motion bandwidth without considering its bond force bearing capacity.

[0053] Please see Figure 1 and Figure 2 The bonding head 30 includes a force transmission element 33 disposed between the first bonding head 31 and the second bonding head 32 to transmit the bonding force applied by the first bonding head 31 to the second bonding head 32 in the vertical direction. The force transmission element 33 does not provide mechanical constraints in any directions other than the vertical direction, so that no rigid mechanical constraint is applied between the first bonding head 31 and the second bonding head 32 in the lateral direction.

[0054] Please see Figure 1 , Figure 13 or Figure 14 The force transmission component 33 includes a first limiting part 331 and a second limiting part 332. The first limiting part 331 is connected to the first bonding head 31, and the second limiting part 332 is connected to the second bonding head 32. The first limiting part 331 and the second limiting part 332 are engaged along the length direction to effectively prevent them from disengaging. Furthermore, the first limiting part 331 and the second limiting part 332 can also abut against each other in the vertical direction to transmit the bonding force. Thus, the bonding force of the first bonding head 31 in the vertical direction can be transmitted to the second bonding head 32 through the first limiting part 331 and the second limiting part 332.

[0055] Please see Figure 13 or Figure 14 Based on the aforementioned embodiments, one of the first limiting portion 331 and the second limiting portion 332 is provided with a limiting protrusion 3311, and the other of the first limiting portion 331 and the second limiting portion 332 is provided with a limiting recess 3321. The limiting protrusion 3311 is disposed within the limiting recess 3321, and the limiting protrusion 3311 is clearance-fitted with the limiting recess 3321 along its length direction. Optionally, the limiting protrusion 3311 can be spherical, square, or other regular or irregular shapes. The limiting recess 3321 can be an arc-shaped recess, a cubic recess, or other regular or irregular shapes.

[0056] Please see Figure 1 and Figure 2 Based on the aforementioned embodiments, the bonding device further includes a support structure 40. Both the first split beam 11 and the second split beam 12 are connected to the support structure 40. The support structure 40 provides stable support for the first split beam 11 and the second split beam 12. Specifically, there are two support structures 40, with each end of the first split beam 11 and the second split beam 12 connected to one of the two support structures 40 respectively. Thus, the crossbeam 10 and the two support structures 40 constitute a gantry structure.

[0057] Please see Figures 1 to 6 In some embodiments, the support structure 40 can be configured as a single unit, that is, the support structure 40 adopts a single support beam, support column or support rod.

[0058] It is understandable that when the support structure 40 supports the first split beam 11 and the second split beam 12, the bonding force load path F is also transmitted to the support structure 40 via the first split beam 11, and then to the ground by the support structure 40. To further optimize the bonding force load transmission path and completely decouple the load transmission path from the second bonding head 32, for example, the support structure 40 in this embodiment is designed as a split structure. Please refer to... Figures 7 to 12For example, the support structure 40 includes a first support member 41 and a second support member 42 spaced apart. The first support member 41 and the second support member 42 may be, but are not limited to, support beams, support columns, or support rods; no particular limitation is imposed here, and they can be flexibly adjusted and set according to actual needs. The first support member 41 is connected to the first split beam 11, serving to bear and support the first split beam 11. The second support member 42 is connected to the second split beam 12, serving to bear and support the second split beam 12. Thus, the bonding force load path F is transmitted through the first split beam 11 to the first support member 41, but not to the second support member 42, preventing the load force transmission path from being transmitted through the first split beam 11 and the support structure 40 to the second bonding head 32.

[0059] Please see Figure 7 , Figure 9 and Figure 11 Based on the aforementioned embodiment, there are two support structures 40. Two first support members 41 are connected to the two ends of the first split beam 11, and two second support members 42 are connected to the two ends of the second split beam 12. The combined structure of the two first support members 41 and the first split beam 11, and the combined structure of the two second support members 42 and the second split beam 12 are stacked or nested. Specifically, along the first direction X, both second support members 42 are located between the two first support members 41.

[0060] Please see Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11 In any of the aforementioned embodiments, the bonding device further includes a slide 50. The slide 50 is slidably disposed on the ground, for example. The sliding direction of the slide 50 is perpendicular to the vertical direction and the length direction of the beam 10. In this embodiment, for ease of understanding and description, the length direction of the beam 10 is designated as the first direction X, which is also as follows: Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11 As shown by the X arrow in any of the diagrams. Let the sliding direction of slide 50 be defined as the second direction Y, which is also as shown in the diagram. Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11 As shown by the Y-arrow in any of the images. Let the vertical direction be the third direction Z, which is also as shown... Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11 The Z-arrow is shown in any one of the images.

[0061] Please continue reading. Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11 In any one of the sets, the bottom of the support structure 40 is connected to the slide 50, and the top of the support structure 40 is connected to the first split beam 11 and the second split beam 12. Under the sliding action of the slide 50, the support structure 40, the crossbeam 10, and the bonding head 30 can be moved and adjusted in the second direction Y.

[0062] To enable the bonding head 30 to move and adjust its position along the first direction X on the crossbeam 10, and the slide 50 to move and adjust its position along the second direction Y on the ground, the bonding device may, for example, include a first power mechanism and a second power mechanism. The first power mechanism and the second power mechanism may each be, but are not limited to, a linear motor. The first power mechanism is mounted on the crossbeam and connected to the slide 20 to drive the slide 20 to move and adjust its position along the first direction X. Specifically, there are two first power mechanisms: one is mounted on the first split beam 11 and connected to the first sliding frame 21 to drive the first sliding frame 21 to move and adjust its position along the first direction X, thereby causing the first bonding head 31 to move and adjust its position along the first direction X; the other is mounted on the second split beam 12 and connected to the second sliding frame 22 to drive the second sliding frame 22 to move and adjust its position along the first direction X, thereby causing the second bonding head 32 to move and adjust its position along the first direction X. In practical implementation, after the positions of the first split beam 11 and the second split beam 12 along the first direction X are simultaneously adjusted by the two first power mechanisms, the first bonding head 31 applies a bonding force along the third direction Z. The bonding force is transmitted to the electronic components below via the force transmission member 33 and the second bonding head 32 to achieve bonding. Specifically, when it is necessary to adjust the position of the bonding head 30 along the first direction X, the two first power mechanisms operate synchronously. One first power mechanism drives the first sliding frame 21 to move and adjust its position along the first direction X, and the other first power mechanism drives the second sliding frame 22 to move and adjust its position synchronously along the first direction X. This ensures that the first limiting part 331 and the second limiting part 332 always maintain synchronous movement and clearance fit, so that the first bonding head 31 and the second bonding head 32 do not affect each other when they move, improving product accuracy. It can also prevent the vibration generated when the first bonding head 31 moves from affecting the movement of the second bonding head 32, further reducing and optimizing the deformation of the second bonding head 32 and the second split beam 12 it is located in, and ensuring the working stability and high precision of the second bonding head 32.

[0063] For example, the second power mechanism is connected to the slide 50 to drive the slide 50 to move along the second direction Y to adjust its position. When the slide 50 is configured as a first slide 51 and a second slide 52, there are two second power mechanisms, one of which is connected to the first slide 51 and the other is connected to the second slide 52.

[0064] Please see Figure 7 , Figure 9 and Figure 11 In some embodiments, when the support structure 40 specifically includes a first support member 41 and a second support member 42, the bottom of each of the beams of the first support member 41 and the second support member 42 is connected to the slide block 50, and is supported by the slide block 50 and driven to move along the second direction Y.

[0065] To further optimize the bonding force load transmission path and completely decouple the load transmission path from the second bonding head 32, the slide 50 in this embodiment is, for example, designed as a split unit. For details, please refer to... Figure 7 and Figure 11 The slide 50 includes a first slide 51 and a second slide 52. The first slide 51 and the second slide 52 are spaced apart and slide along the ground. The bottom of the first split beam 11 is connected to the first slide 51, and the bottom of the second split beam 12 is connected to the second slide 52.

[0066] Please refer to the following: Figure 7 and Figure 11 Wherein, when the slide 50 includes a first slide 51 and a second slide 52, the first slide 51 and the second slide 52 can be arranged at the same height position along the third direction Z (e.g., Figure 7 As shown), it can also be arranged at different heights along the third direction Z (e.g. Figure 11 As shown in the figure, no special restrictions are imposed here, and the specific settings can be flexibly adjusted and configured according to actual needs.

[0067] Please refer to the following: Figure 1 , Figure 3 and Figure 9 Alternatively, the slide 50 can be designed as a single unit. That is, the slide 50 is not divided into a first slide 51 and a second slide 52, but a single slide 50 is used, which can support the support structure 40 and drive the support structure 40 to slide along the second direction Y.

[0068] Please see Figure 5 ,and Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 11In contrast, a key difference is that in some embodiments, the slide 50 can be omitted. That is, the support structure 40 is directly fixed to the ground or other various support surfaces.

[0069] Please continue reading. Figure 5 Based on the aforementioned embodiments, in order to facilitate the adjustment of the positions of the bonding head 30 and the electronic component 100 along the second direction Y, the bonding apparatus further includes a stage 60. The stage 60 is located below the second bonding head 32 and is used to support the substrate 200 and the electronic component 100. The stage 60 is movable along the second direction Y, thereby allowing the electronic component 100 to be adjusted in position along the second direction Y.

[0070] Please see Figure 1 and Figure 2 In some embodiments, the first bonding head 31 includes a first slider 311, a first worktable 312, and an actuator 313. The first slider 311 is slidably mounted on the first sliding frame 21 in the vertical direction. The first worktable 312 is connected to the first slider 311, and the first worktable 312 can drive the first slider 311 to move and adjust its position in the vertical direction. That is, the first worktable 312 is equipped with a power mechanism such as a linear motor, which can provide power for moving and adjusting its position in the vertical direction. There are many specific methods, which will not be elaborated here. The actuator 313 is connected to the first worktable 312 or the first slider 311, and the actuator 313 can apply a downward bonding force to the first worktable 312. The force transmission element 33 is disposed at the bottom of the first worktable 312. Specifically, during actual operation, the first worktable 312 can drive the first slider 311 to slide in the vertical direction and then adjust its position. After the position is adjusted, the actuator 313 can provide bonding force to the first worktable 312, and the first worktable 312 transmits the bonding force to the second bonding head 32 below in the vertical direction through the force transmission member 33.

[0071] In some embodiments, the second bonding head 32 includes a second slider 321, a second worktable 322, and a bonding tool 323. The second slider 321 is slidably disposed on the second sliding frame 22 in the vertical direction. The second worktable 322 is connected to the second slider 321, and the second worktable 322 can drive the second slider 321 to move in the vertical direction to adjust its position. That is, the second worktable 322 is equipped with a power mechanism such as a linear motor, which can provide power for moving in the vertical direction to adjust its position. There are many specific methods, which will not be elaborated here. The force transmission component 33 is disposed on the top of the second worktable 322, and the bonding tool 323 is mounted on the bottom of the second worktable 322. The bonding tool 323 is used to attract and hold the electronic component 100. Specifically, in actual operation, the second worktable 322 can drive the second slider 321 to slide in the vertical direction, thereby adjusting the position of the bonding tool 323 in the vertical direction so that the bonding tool 323 can attract and hold the electronic component 100. After the electronic component 100 is held in place by the bonding tool 323 and the position of the first bonding head 31 is adjusted in the vertical direction, the first bonding head 31 provides bonding force to the second bonding head 32. The bonding force is transmitted to the electronic component 100 in the vertical direction through the bonding tool 323, so as to realize the bonding between the electronic component 100 and the substrate 200.

[0072] Based on the foregoing embodiments, the second bonding head 32 further includes a support 324 disposed between the second worktable 322 and the bonding tool 323. The support 324 is mounted on the bottom of the second worktable 322, and the bonding tool 323 is mounted on the support 324, that is, indirectly mounted on the second worktable 322.

[0073] Please see Figure 3 and Figure 4 In some embodiments, the first bonding head 31 further includes at least two off-axis vertical force applicators 314. Each off-axis vertical force applicator 314 is connected to at least one of the first slider 311 and the first worktable 312. The off-axis vertical force applicator 314 is offset from the central axis O of the first worktable 312, and the off-axis vertical force applicator 314 can apply a bonding force in the vertical direction to the first worktable 312. In this way, both the actuator 313 and the off-axis vertical force applicator 314 can apply a bonding force in the vertical direction to the first worktable 312, so that either the actuator 313 or the off-axis vertical force applicator 314 can be selected to work according to actual needs, or the actuator 313 and the off-axis vertical force applicator 314 can be selected to work simultaneously.

[0074] The bonding force applied by the actuator 313 in the vertical direction is greater than the bonding force applied by the off-axis vertical force applicator 314 in the vertical direction. The bonding forces that can be applied by the two are at two different levels, so one of them can be flexibly selected to work according to actual needs.

[0075] Based on the aforementioned embodiment, at least two off-axis vertical force applicators 314 are symmetrically arranged about the central axis O of the first worktable 312. Thus, when the at least two off-axis vertical force applicators 314 operate synchronously, the applied bonding force is transmitted along the central axis O of the first worktable 312 to the second worktable 322.

[0076] In some embodiments, the force transmitter 33 may be implemented as any one or any combination of the following: a voice coil motor (VCM), a linear motor, a flexible hinge, an elastomer, a pneumatic diaphragm force applicator, or a multi-degree-of-freedom linkage mechanism. In each case, the force transmitter 33 is selected and sized to satisfy: (i) sufficient stiffness in the bonding force direction to transmit the required bonding force with acceptable bonding force fidelity; and (ii) substantially compliant in the transverse direction perpendicular to the bonding force direction, without imposing any rigid mechanical constraints between the first bonding head 31 and the second bonding head 32 in the transverse direction.

[0077] For example, the ratio of the stiffness of the force transmission element 33 in the vertical direction to its stiffness in the horizontal direction is greater than 100, specifically, for example, 120, 150, 200, 300, or 1000, etc., without particular limitation, and can be flexibly adjusted and set according to actual needs. Furthermore, when the first bonding head 31 applies the maximum bonding force in the vertical direction, the deflection of the second bonding head 32 relative to the first bonding head 31 in the horizontal direction is less than 100 nm, specifically, for example, 90 nm, 80 nm, 60 nm, 40 nm, or 0, etc., without particular limitation, and can be flexibly adjusted and set according to actual needs.

[0078] To more clearly demonstrate the bonding apparatus of this application, the operation method of the bonding apparatus will be described below: During operation, the first sliding frame 21 and the second sliding frame 22 are independently translated along the first direction X, and the support structure 40 is translated along the second direction Y to position the bonding tool 323 above the target position on the substrate 200. Then, the actuator 313 of the first bonding head 31 is actuated, causing the bonding force to be transmitted vertically downwards to the second bonding head 32 via the laterally compliant force transmission member 33. The bonding force load path F is limited to the first bonding head 31, the first sliding frame 21, the first split beam 11, and the support structure 40. This path does not pass through the second sliding frame 22 or the second split beam 12. That is, the elastic deformation and thermal deformation of the upper structural chain will not be transmitted to the bonding tool 323 of the second bonding head 32 via any rigid mechanical path.

[0079] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0080] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0081] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0082] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0083] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A bonding device, characterized in that, include: The crossbeam includes a first split beam and a second split beam arranged at an interval between the upper and lower parts, with the first split beam located above the second split beam; The carriage includes a first sliding frame and a second sliding frame arranged at an interval between the upper and lower parts. The first sliding frame is slidably disposed on the first split beam along the length direction of the crossbeam, and the second sliding frame is slidably disposed on the second split beam along the length direction. and A bonding head, comprising a first bonding head and a second bonding head arranged sequentially in a vertical direction; the first bonding head is correspondingly disposed on the first sliding frame, and the second bonding head is correspondingly disposed on the second sliding frame; the first bonding head can transmit bonding force to the second bonding head in a vertical direction; the second bonding head can apply the bonding force to the electronic component below.

2. The bonding apparatus according to claim 1, characterized in that, The bonding head further includes a force transmission element; the force transmission element is disposed between the first bonding head and the second bonding head to transmit the bonding force applied by the first bonding head to the second bonding head in the vertical direction; and the force transmission element does not provide mechanical constraints in any other direction besides the vertical direction.

3. The bonding apparatus according to claim 2, characterized in that, The force transmission component includes a first limiting part and a second limiting part. The first limiting part is connected to the first bonding head, and the second limiting part is connected to the second bonding head. The first limiting part and the second limiting part are mutually limiting and engaging along the length direction. The first limiting part and the second limiting part can also abut against each other in the vertical direction to transmit the bonding force.

4. The bonding apparatus according to claim 3, characterized in that, One of the first limiting part and the second limiting part is provided with a limiting protrusion, and the other of the first limiting part and the second limiting part is provided with a limiting recess. The limiting protrusion is disposed in the limiting recess, and the limiting protrusion is in clearance fit with the limiting recess along the length direction.

5. The bonding apparatus according to claim 3, characterized in that, The bonding device further includes two first power mechanisms, which are mounted on the crossbeam. One of the first power mechanisms is connected to the first sliding frame, and the other is connected to the second sliding frame. One of the first power mechanisms is used to drive the first sliding frame to move along the first split beam, and the other is used to drive the second sliding frame to move along the second split beam. When the first sliding frame and the second sliding frame move under the power of their respective first power mechanisms, the first limiting part and the second limiting part always maintain synchronous movement and clearance fit.

6. The bonding apparatus according to any one of claims 1 to 5, characterized in that, The bonding device further includes a support structure, to which both the first split beam and the second split beam are connected.

7. The bonding apparatus according to claim 6, characterized in that, There are two support structures, and the two ends of the first split beam and the second split beam are respectively connected to the two support structures one by one.

8. The bonding apparatus according to claim 6, characterized in that, The support structure includes a first support member and a second support member spaced apart, the first support member being connected to the first split beam, and the second support member being connected to the second split beam.

9. The bonding apparatus according to claim 8, characterized in that, The bonding device further includes a slide, the bottom of the support structure is connected to the slide, and the top of the support structure is connected to the first split beam and the second split beam.

10. The bonding apparatus according to claim 9, characterized in that, The slide includes a first slide and a second slide arranged at intervals; the first support is connected to the first slide, and the second support is connected to the second slide.

11. The bonding apparatus according to any one of claims 2 to 5, characterized in that, The first bonding head includes a first slider, a first worktable, and an actuator. The first slider is slidably disposed on the first sliding frame along the vertical direction. The first worktable is connected to the first slider. The first worktable can drive the first slider to move and adjust its position along the vertical direction. The actuator is connected to the first worktable or the first slider. The actuator can apply a downward bonding force to the first worktable. The force transmission element is disposed at the bottom of the first worktable.

12. The bonding apparatus according to claim 11, characterized in that, The second bonding head includes a second slider, a second worktable, and a bonding tool; the second slider is slidably disposed on the second sliding frame along the vertical direction, the second worktable is connected to the second slider, the second worktable can drive the second slider to move and adjust its position along the vertical direction, the force transmission element is disposed on the top of the second worktable, the bonding tool is installed on the bottom of the second worktable, and the bonding tool is used to adsorb and hold the electronic component.

13. The bonding apparatus according to claim 11, characterized in that, The first bonding head further includes at least two off-axis vertical force applicators, each of which is connected to at least one of the first slider and the first worktable. The off-axis vertical force applicator is offset from the central axis of the first worktable and can apply a bonding force in the vertical direction to the first worktable.

14. The bonding apparatus according to claim 13, characterized in that, At least two of the off-axis vertical force applicators are symmetrically arranged about the central axis of the first worktable.

15. The bonding apparatus according to any one of claims 2 to 5, characterized in that, The force transmission component includes one or more combinations of voice coil motors, linear motors, flexible hinges, elastomers, pneumatic diaphragm force applicators, and multi-degree-of-freedom linkage mechanisms.

16. The bonding apparatus according to claim 15, characterized in that, The ratio of the stiffness of the force transmission component in the vertical direction to its stiffness in the horizontal direction is greater than 100, and when the first bonding head applies the maximum bonding force in the vertical direction, the deflection of the second bonding head relative to the first bonding head in the horizontal direction is less than 100 nm.

17. The bonding apparatus according to any one of claims 1 to 5, characterized in that, The bonding apparatus further includes a stage located below the second bonding head, the stage being used to support the substrate and electronic components.

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