Processing apparatus and method of processing a substrate

Abstract

A processing apparatus includes a reservoir, a nozzle in fluid communication with the reservoir, a drum, and a pair of baffles. The nozzle is configured to dispense liquid from the reservoir to a portion of the drum. The pair of baffles bounds the portion of the drum. A method of processing a substrate includes conveying the substrate in a conveyance direction. The method also includes dispensing a processing liquid to a portion of a drum. The portion is bounded in a width direction by a pair of baffles, where the width direction is perpendicular to the conveyance direction. A width between the pair of baffles is less than half of a corresponding dimension of the substrate in the width direction. The method also includes transferring the processing liquid from the drum to a portion of a first major surface of the substrate as the substrate is conveyed in the conveyance direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Application Serial No. 63 / 569,955, filed March 26, 2024, pursuant to 35 USC § 119, the contents of which are based and are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure generally relates to processing apparatus and methods for processing substrates, and more specifically to processing apparatus and methods for processing substrates including dispensing processing liquid to rollers. Background Technology

[0004] Glass substrates are commonly used in display devices, such as liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light-emitting diode displays (OLEDs), and plasma display panels (PDPs).

[0005] Etching glass substrates is known. More generally, glass substrates can be selectively processed by masking other portions of the substrate to allow processing liquids to contact selected areas while preventing them from contacting other areas. However, applying a mask can be time-consuming and / or expensive, especially when different portions of the substrate need to be processed multiple times. Therefore, new methods for processing substrates that are faster and / or at a lower cost are needed. Summary of the Invention

[0006] This document describes apparatus and methods for processing substrates. Unlike conventional methods, this disclosure provides methods (and corresponding apparatus) for selectively processing portions of a substrate (e.g., a first primary surface) without applying any mask to the corresponding surface (or, in some respects, not at all). This can reduce processing complexity, processing time, processing costs, and / or increase process throughput. The processing apparatus can dispense a processing liquid from one or more nozzles into a portion of a roller defined by baffles to localize the application of the processing liquid. In various respects, the processing liquid can then be transferred from the roller to the substrate, for example, through a meniscus on the roller, without the roller directly contacting the substrate. Furthermore, the method is capable of simultaneously applying multiple processing liquids to different portions of the substrate. Additionally, the composition of the processing liquid can be adjusted (e.g., adjusted in real time during processing) using a mixer and manual adjustment or controller. In various respects, the applied processing liquid can be an etchant having an etch rate of 2 µm / min or less, 1.5 µm / min or less, or 1.0 µm / min or less, which can facilitate substantially uniform removal of material from the surface of the substrate, for example, to form recesses in the substrate. In various ways, the opposing surfaces can be protected from damage by stray treatment liquids. Providing at least one delivery roller in contact with the diluent can reduce (e.g., mitigate) the effects associated with any stray treatment liquids in contact with the delivery roller (e.g., from multiple nozzles and / or from the roller itself), which could otherwise alter the properties of the second primary surface (which was not treated at the time). Providing an etching mask on the untreated surface can protect said surface from damage and / or the effects of stray treatment liquids.

[0007] The following describes some example aspects of this disclosure. It should be understood that any feature of each aspect may be used alone or in combination with each other.

[0008] Aspect 1. A processing apparatus comprising:

[0009] Storage;

[0010] A nozzle, which is in fluid communication with the reservoir;

[0011] A roller, wherein the nozzle is configured to dispense liquid from the reservoir into a portion of the roller; and

[0012] A pair of baffles that define the portion of the roller.

[0013] Aspect 2. The processing apparatus according to aspect 1 further includes a conveyor configured to convey a substrate in a conveying direction toward the roller, the roller being configured to rotate about an axis extending in a width direction perpendicular to the conveying direction.

[0014] Aspect 3. The processing apparatus according to aspect 2, wherein the width between the pair of baffles in the width direction is configured to be less than half the dimension of the substrate in the width direction.

[0015] Aspect 4. The processing apparatus according to any one of Aspects 2 to 3, wherein the conveyor is configured to convey the substrate below the roller.

[0016] Aspect 5. The processing apparatus according to any one of Aspects 2 to 4, wherein the roller is confined between the pair of baffles.

[0017] Aspect 6. The processing apparatus according to aspect 5 further comprises a plurality of rollers including the rollers, the plurality of rollers being aligned in a row in the width direction, each of the plurality of rollers being separated from an adjacent roller of the plurality of rollers by a baffle of a plurality of baffles, and the plurality of baffles including the pair of baffles.

[0018] Aspect 7. The processing apparatus according to aspect 6 further includes a plurality of nozzles including the nozzle, the plurality of nozzles being configured to dispense corresponding liquids to corresponding rollers.

[0019] Aspect 8. The processing apparatus according to any one of Aspects 1 to 4, wherein the drum comprises a plurality of portions including the portion, adjacent portions of the plurality of portions being separated by baffles among a plurality of baffles, and the plurality of baffles including the pair of baffles.

[0020] Aspect 9. The processing apparatus according to aspect 8, wherein the section of the roller corresponding to the position of the baffle among the plurality of baffles is recessed relative to the outer periphery of the portion of the roller.

[0021] Aspect 10. The processing apparatus according to any one of Aspects 8 to 9, further comprising a plurality of nozzles including the nozzle, the plurality of nozzles being configured to dispense corresponding liquids to corresponding portions of the drum.

[0022] Aspect 11. A processing apparatus comprising:

[0023] Multiple reservoirs, the multiple reservoirs being configured to contain multiple liquids;

[0024] Multiple mixers are configured to receive fluids corresponding to the multiple liquids from the multiple reservoirs to produce corresponding multiple processed liquids;

[0025] A controller configured to control the amount of liquid flowing from at least one of the plurality of reservoirs to at least one of the plurality of mixers;

[0026] Multiple nozzles, the multiple nozzles being configured to dispense corresponding treatment liquids; and

[0027] At least one roller, the at least one roller being configured to transfer at least one of the plurality of processing liquids to a substrate.

[0028] Aspect 12. The processing apparatus according to aspect 11 further includes a conveyor configured to convey the substrate in a conveying direction toward a roller, the at least one roller being configured to rotate about an axis extending in a width direction perpendicular to the conveying direction.

[0029] Aspect 13. The processing apparatus according to aspect 12 further comprises a plurality of baffles, wherein a portion of the at least one roller is defined by a pair of the plurality of baffles, and the portion is configured to receive processing liquid dispensed by a nozzle of the plurality of nozzles.

[0030] Aspect 14. The processing apparatus according to any one of Aspects 12 to 13, wherein the controller is manually adjustable.

[0031] Aspect 15. The processing apparatus according to aspect 13, wherein the at least one roller comprises a plurality of rollers arranged in a row in the width direction, and each of the plurality of rollers is separated from an adjacent roller of the plurality of rollers by a baffle of the plurality of baffles.

[0032] Aspect 16. The processing apparatus according to aspect 15, wherein the plurality of nozzles are configured to dispense the corresponding processing liquids to corresponding rollers.

[0033] Aspect 17. The processing apparatus according to aspect 13, wherein the at least one roller comprises a roller, the roller comprising a plurality of portions including the portion, and adjacent portions of the plurality of portions are separated by baffles among the plurality of baffles.

[0034] Aspect 18. The processing apparatus according to aspect 17, wherein the section of the roller corresponding to the position of the baffle among the plurality of baffles is recessed relative to the outer periphery of the portion of the roller.

[0035] Aspect 19. The processing apparatus according to any one of Aspects 17 to 18, wherein the plurality of nozzles are configured to dispense the corresponding processing liquid to corresponding portions of the drum.

[0036] Aspect 20. The processing apparatus according to any one of aspects 12 to 19, further comprising:

[0037] At least one second roller, positioned downstream of the first roller in the conveying direction, is configured to rotate about a second axis extending in the width direction; and

[0038] The at least one second roller is configured to dispense the second liquid into the at least one second roller.

[0039] Aspect 21. The processing apparatus according to any one of Aspects 2 to 4 or 12 to 20 (including endpoints), further comprising a diluent reservoir, wherein the conveyor comprises a plurality of conveying rollers, one of the plurality of conveying rollers being aligned with the rollers, the conveying rollers being at least partially positioned in the diluent reservoir and configured to convey diluent in the diluent reservoir.

[0040] Aspect 22. The processing apparatus according to any one of Aspects 12 to 20, wherein the roller is configured to translate in a thickness direction perpendicular to the conveying direction and perpendicular to the width direction.

[0041] Aspect 23. The processing apparatus according to aspect 22, wherein the controller is further configured to control the translation of the roller in the thickness direction based at least on the position of the substrate.

[0042] Aspect 24. A method of processing a substrate, the method comprising:

[0043] The substrate is transported in the transport direction;

[0044] The processing liquid is dispensed into a portion of the drum, said portion being defined by a pair of baffles in a width direction perpendicular to the conveying direction, and the width between the pair of baffles being less than half the dimension of the substrate in that width direction; and

[0045] When the substrate is conveyed in the conveying direction, the processing liquid is transferred from the roller to a portion of a first main surface of the substrate, wherein the first main surface is opposite to a second main surface.

[0046] Aspect 25. The method according to aspect 24, wherein the transfer is achieved by the interaction of the meniscus of the processing liquid on the roller with the portion of the first main surface.

[0047] Aspect 26. The method according to any one of Aspects 24 to 25, wherein the transfer occurs when the substrate is conveyed below the roller in the conveying direction.

[0048] Aspect 27. The method according to any one of Aspects 24 to 26, wherein the portion of the first main surface to which the processing liquid is transferred is spaced apart by a first distance in the width direction from a first edge of the substrate and by a second distance in the width direction from a second edge of the substrate, the substrate width being defined between the first distance and the second distance, and the first distance and the second distance being equal to or greater than 10% of the substrate width.

[0049] Aspect 28. The method according to any one of Aspects 24 to 27, wherein the processing liquid is an etchant, and the processing liquid etches the portion of the first main surface to form a first central surface region recessed relative to the first main surface.

[0050] Aspect 29. The method according to any one of Aspects 24 to 28, wherein the substrate comprises a glass-based substrate or a ceramic-based substrate.

[0051] Aspect 30. The method according to any one of Aspects 24 to 29, wherein the roller is constrained between the pair of baffles.

[0052] Aspect 31. The method according to aspect 29, comprising a plurality of rollers of the rollers being aligned in a row in the width direction, each of the plurality of rollers being separated from an adjacent roller of the plurality of rollers by a baffle of a plurality of baffles, and the plurality of baffles including the pair of baffles.

[0053] Aspect 32. The method according to aspect 31 further comprises:

[0054] Dispensing a second processing liquid into a second roller among the plurality of rollers, the second roller being separated from the rollers at least by one of the plurality of baffles; and

[0055] While transferring the processing liquid from the roller to a first portion of the substrate, the second processing liquid is transferred from the second roller to a second portion of the first main surface of the substrate.

[0056] Aspect 33. The method according to aspect 32, wherein the composition of the second processing liquid is different from the composition of the processing liquid.

[0057] Aspect 34. The method according to any one of Aspects 24 to 33, wherein the minimum distance between the outer periphery of the roller and the first main surface of the substrate is 1 mm or more, the minimum distance being measured in a direction perpendicular to the conveying direction and perpendicular to the thickness direction of the substrate between the first main surface and the second main surface.

[0058] Aspect 35. The method according to any one of Aspects 24 to 30, wherein the roller comprises a plurality of portions including the portion, adjacent portions of the plurality of portions being separated by baffles of a plurality of baffles, and the plurality of baffles including the pair of baffles.

[0059] Aspect 36. The method according to aspect 35, wherein the section of the roller corresponding to the position of the baffle among the plurality of baffles is recessed relative to the outer periphery of the portion of the roller.

[0060] Aspect 37. The method according to any one of aspects 35 to 36, further comprising:

[0061] The second processing liquid is dispensed into a second portion of the plurality of sections of the drum, the second portion being separated from the sections at least by one of the plurality of baffles; and

[0062] While transferring the processing liquid from the portion of the roller to the portion of the substrate, the second processing liquid is transferred from the second portion of the roller to the second portion of the first main surface of the substrate.

[0063] Aspect 38. The method according to aspect 37, wherein the composition of the second processing liquid is different from the composition of the processing liquid.

[0064] Aspect 39. The method according to any one of Aspects 24 to 38, further comprising, after the transfer of the processing liquid, rinsing at least said portion of the substrate by transferring another liquid from another roller.

[0065] Aspect 40. The method according to any one of Aspects 24 to 39, wherein the entire first main surface is exposed during the transport.

[0066] Aspect 41. The method according to any one of aspects 37 to 38, further comprising:

[0067] Fluid is drawn from at least one of a plurality of reservoirs; and

[0068] The fluid is mixed in a first mixer among a plurality of mixers to form the processed liquid.

[0069] The dispensing includes dispensing the treatment liquid from a first nozzle of a plurality of nozzles to the roller.

[0070] Aspect 42. The method according to aspect 41, further comprising mixing the fluid in a second mixer of the plurality of mixers to form the second processed liquid.

[0071] Aspect 43. The method according to any one of Aspects 24 to 42, wherein the second main surface of the substrate is masked.

[0072] Aspect 44. The method according to any one of Aspects 24 to 43, wherein the conveying comprises transporting the substrate across a plurality of conveying rollers, wherein one of the plurality of conveying rollers is aligned with the rollers, the conveying rollers being at least partially positioned in a diluent reservoir and configured to transport diluent in the diluent reservoir.

[0073] Aspect 45. The method according to aspect 44, wherein the diluent dilutes any of the processing liquids transferred to the conveying roller.

[0074] Aspect 46. The method according to any one of Aspects 24 to 45, wherein the roller is configured to translate from an initial position toward the first main surface when the substrate approaches, and to return to the initial position after the substrate has passed the roller.

[0075] Throughout this disclosure, the accompanying drawings are used to emphasize certain aspects. Therefore, unless explicitly indicated otherwise, the relative sizes of the different regions, portions, and substrates shown in the drawings should not be assumed to be proportional to their actual relative sizes. Attached Figure Description

[0076] The above and other features and advantages of various aspects of this disclosure will be better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0077] Figure 1 These are schematic diagrams of example processing devices according to various aspects of this disclosure;

[0078] Figure 2 It is based on the processing equipment along Figure 1 A cross-sectional view of an example processing device taken from line 2-2;

[0079] Figure 3 It depicts a roller divided by multiple baffles. Figure 3 The view Figure 3 A magnified view;

[0080] Figure 4 Another aspect of the processing equipment depicts a drum, wherein the sections corresponding to multiple baffles are recessed relative to the outer periphery of the rest of the drum.

[0081] Figure 5 Another aspect of the processing equipment depicts multiple rollers, each positioned between and limited by an adjacent pair of baffles.

[0082] Figure 6The mixer and nozzle according to various aspects of this disclosure are shown schematically;

[0083] Figure 7 A plurality of reservoirs in fluid communication with a mixer, which in turn is in fluid communication with a nozzle, are schematically shown according to various aspects of this disclosure;

[0084] Figure 8 A processing apparatus having conveyor rollers positioned in a reservoir is schematically shown according to various aspects of this disclosure;

[0085] Figure 9 Multiple rollers are schematically shown, wherein the rollers can translate in the thickness direction, for example, based on the position of the substrate;

[0086] Figure 10 A cross-sectional view of an example foldable device, including a tapered transition between a first portion and a central portion, is schematically shown according to various aspects of this disclosure.

[0087] Figure 11 A cross-sectional view of an example foldable device having a steep transition between a first part and a central part is schematically shown according to various aspects of this disclosure.

[0088] Figure 12 It is a schematic floor plan based on various examples of consumer electronics products;

[0089] Figure 13 yes Figure 12 A schematic perspective view of an example consumer electronics product;

[0090] Figure 14 This is a schematic perspective view of a foldable consumer electronics product.

[0091] Figure 15 The surface profile of an example substrate processed using a processing apparatus according to the methods and aspects of this disclosure is schematically shown. The surface profile has a position in mm on a horizontal axis (x-axis) and a relative distance in µm in the thickness direction shown on a vertical axis (y-axis).

[0092] Figure 16 The diagram illustrates an example of the relationship between processing time in minutes on the horizontal axis (x-axis) and variation in local thickness of the substrate in µm on the vertical axis (y-axis), according to various aspects of this disclosure.

[0093] Figures 17-19The surface profiles of example substrates are schematically shown after being processed for 10 minutes, 20 minutes and 30 minutes respectively using a processing apparatus according to the methods and aspects of this disclosure. The surface profiles have a position in mm on the horizontal axis (x-axis) and a relative distance in µm in the thickness direction shown on the vertical axis (y-axis).

[0094] Figure 20 A surface view schematically illustrating a top view of a foldable substrate manufactured according to the methods and aspects of this disclosure is shown; and

[0095] Figures 21-23 The illustration schematically shows the variation of the local thickness in µm on the vertical axis (y-axis) with the position in mm on the horizontal axis (x-axis) for different trajectories of the same foldable substrate manufactured according to the methods and aspects of this disclosure.

[0096] Throughout this disclosure, the accompanying drawings are used to emphasize certain aspects. Therefore, unless explicitly indicated otherwise, the relative sizes of the different regions, portions, and substrates shown in the drawings should not be assumed to be proportional to their actual relative sizes. Detailed Implementation

[0097] The aspects will now be described more fully below with reference to the accompanying drawings, in which example aspects are shown. Where possible, the same reference numerals are used throughout the drawings to refer to the same or similar parts. However, the claims may cover many different aspects of the aspects and should not be construed as limited to those set forth herein.

[0098] Figure 1-9 Schematic diagrams of processing devices 101, 801 and / or 901 according to various aspects of this disclosure are shown. Figure 10-11 Schematic cross-sectional views of foldable devices 1001 and / or 1101 including a foldable substrate 1002 according to various aspects of this disclosure are shown. Unless otherwise indicated, the discussion of features of various aspects of a processing apparatus, a method of processing a substrate, a foldable device, and / or a foldable substrate can be equally applied to corresponding features of any aspect of this disclosure. For example, the same part numbers throughout this disclosure may indicate that, in some aspects, identified features are identical to each other, and unless otherwise indicated, the discussion of identified features of one aspect can be equally applied to identified features of any other aspect of this disclosure.

[0099] First, the discussion will begin. Figure 1The processing apparatus 101 shown is analogous to other processing apparatuses, which will be discussed in more detail later. As shown, processing apparatus 101 includes a reservoir 123 fluidly connected to a nozzle 143, one or more conduits 125 and / or 135, wherein an optional mixer 133 is positioned between the one or more conduits. The nozzle 143 is configured to spray 151 of a processing liquid (e.g., from the reservoir 121 and / or optional mixer 133) onto a roller 161, which is configured to rotate about an axis 163 (e.g., clockwise 162 or counterclockwise 164—extending in the width direction). The roller 161 is configured to transfer the processing liquid to a substrate 103 conveyed and / or supported by a conveying device 171 (e.g., conveying rollers 173a and 173b around corresponding axes 177a-177b). Figure 8 (Extending in the width direction—rotating clockwise 174a and 174b), the conveying device can convey substrate 103 in the conveying direction 104. For example, as shown, conveying rollers 173a and 173b can convey substrate 103 and are configured to convey substrate 103 below roller 161. In various respects, as shown by dashed line 167, nozzle 143 can be configured to spray 151 a sufficient amount of processing liquid to form a meniscus (dashed line 167), which can be transferred to substrate 103 (e.g., first main surface 105) without the outer surface 165 of roller 161 contacting substrate 103.

[0100] like Figure 2 As shown, from Figure 1 Nozzle 143 may be part of a plurality of nozzles 141 (e.g., nozzles 143a-143c). Based on the upstream configuration of each of the plurality of nozzles 141 (e.g., one or more reservoirs 121, one or more optional mixers 131—discussed below), the composition of the corresponding processing liquid (e.g., spray 151) dispensed by each of the plurality of nozzles 141 can be controlled independently. For example, a first nozzle 143a may dispense a first processing liquid, while a second nozzle 143b and / or 143c may dispense another processing liquid with a different composition. In various aspects, a first group of one or more nozzles in the plurality of nozzles may dispense a common first processing liquid, while a second group of one or more nozzles may dispense a common second processing liquid. For example, the second processing liquid may contain a higher concentration of etchant than the first processing liquid (e.g., the second group of nozzles dispenses the second processing liquid, which corresponds to foldable devices 1001 and / or 1101 (see...)). Figure 10-11 The location of the recess 1011 generated by the processing of substrate 103 in the substrate.

[0101] In addition, such as Figure 2-5As shown, a plurality of nozzles 141 (e.g., nozzles 143a-143c) can be configured to dispense corresponding processing liquids into the roller 161. Figure 3-4 Different parts or different rollers 503a-503d Figure 5 In all aspects, such as Figure 3-5 As shown, the sprays 153a-153d from an adjacent pair of nozzles (e.g., nozzles 143a-143d) can be separated by baffles 203a-203c or 403a-403c. For example, spray 153a from nozzle 143a can be separated from spray 153b from nozzle 143b (adjacent to nozzle 143a) by baffles 203a or 403a. In a further aspect, baffles 203a-203c or 403a-403c can be positioned between each pair of adjacent nozzles 143a-143d to separate the corresponding sprays 153a-153d. In various aspects, such as Figure 3 As shown, one or more baffles 201 (e.g., baffles 203a-203c) can be configured to match the shape of the roller without substantially altering the size of the roller at the location. For example, a baffle may have a portion of a circle (e.g., a semicircle) removed from its bottom, wherein the radius of the removed circle is substantially equal to or slightly larger than (e.g., 0.1% to 10%, 0.5% to 5%, 1% to 3%, or any range or subrange therebetween) the radius of the roller (e.g., for a roller with a circular cross-section). In this configuration, the baffle can prevent the mixing of sprays from adjacent rollers and largely separate any menisci of the processed liquid on the outer surface 165 of the roller 161 from each other. Alternatively, in various aspects, such as Figure 4 As shown, one or more baffles 401 (e.g., baffles 403a-403c) can be configured to extend beyond the outermost periphery of the outer surface 165 (e.g., a line or surface connecting the outer surface rather than the portion corresponding to baffles 403a-403c). In a further aspect, as Figure 4 As shown, the roller 161 may include recessed portions 405a-405c (e.g., relative to the outer periphery of the outer surface 165), said recessed portions being configured to receive one or more baffles 401 (e.g., baffles 403a-403c). For example, as Figure 4 As shown, the roller 161 includes a recessed portion 405a, which is configured to receive a baffle 403a between the region associated with the first nozzle 143a (e.g., spray 153a) and an adjacent nozzle 143b (e.g., spray 153b). (Referring to the above references) Figure 2-4In terms of the discussion, the paired baffles may limit (e.g., define, separate, delineate) a section of the roller 161 associated with each nozzle and / or associated spray, and / or each baffle may separate a section of the roller 161 associated with an adjacent pair of nozzles and / or sprays.

[0102] Alternatively, such as Figure 5 As shown, the rollers can be a plurality of rollers 501 including rollers 503a-503d. In various aspects, baffle 403a (among the plurality of baffles 403a-403c) can be positioned between adjacent rollers 503a and 503b of the plurality of rollers 501. In a further aspect, each pair of adjacent rollers 503a-503d of the plurality of rollers 501 can be separated (e.g., located between) by baffles in the plurality of baffles 403a-403c. In various aspects, as shown, the plurality of rollers 501 (e.g., rollers 503a-503d) can be aligned in rows along axis 163 (e.g., single row - baffles in the plurality of baffles positioned between adjacent pairs of rollers). In various aspects, each roller 503a-503d can have an outer surface 505a-505d that forms a common outer periphery of the plurality of rollers 501. Furthermore, in various aspects, as Figure 5 As shown, baffle 403a may extend beyond the outermost periphery of outer surface 165 (e.g., a line or surface connecting the outer surface rather than the portion corresponding to baffles 403a-403c).

[0103] like Figure 3-4 As shown, the width 207a or 207b of a segment of roller 161 may be defined between adjacent baffles (e.g., baffles 203a and 203b or baffles 203b and 203d). In various aspects, the width 207a or 207b of the segment may be less than half of the corresponding dimension (e.g., width) of substrate 103, such that roller 161 may have at least three segments above substrate 103. In various aspects, the width 207a or 207b may be 5 mm or greater, 10 mm or greater, 15 mm or greater, 20 mm or greater, 25 mm or greater, 30 mm or greater, 40 mm or greater, 50 mm or greater, 80 mm or less, 60 mm or less, 40 mm or less, 35 mm or less, 30 mm or less, 25 mm or less, 20 mm or less, or 15 mm or less. In all respects, the width 207a or 207b can be 5 mm to 80 mm, 5 mm to 60 mm, 10 mm to 40 mm, 10 mm to 35 mm, 15 mm to 30 mm, 15 mm to 25 mm, 15 mm to 20 mm, or any range or subrange thereof. Similarly, although not shown, reference... Figure 5The widths of rollers 503a-503d in the plurality of rollers 501 may be within one or more of the ranges discussed above for the widths 207a or 207b of the sections. In all respects, roller 161 or the plurality of rollers 501 may comprise a sponge-like material (e.g., open-cell material, polyurethane foam), woven fleece (e.g., polyamide-nylon, polyester, natural fiber-lamb wool, mohair) or a substantially non-porous material (e.g., polystyrene, rubber, neoprene, polyethylene (PE)).

[0104] like Figure 3 As shown, the spray 153b from nozzle 143b can have a sweep angle 155. In various aspects, the sweep angle 155 can be controlled by adjusting the corresponding nozzle 143b. In various aspects, such as Figure 2 As shown, the distance 159 between the nozzle 143b (or multiple nozzles 141) and the outer surface 165 (e.g., outer periphery) of the roller 161 can be adjusted to control the diffusion of the corresponding spray 153b between and / or above the sections of the baffles 203b and / or 203c and the roller 161. In a further aspect, the sweep angle 155 and / or distance 159 of the spray 153b can be adjusted such that the spray substantially covers the entire width 207a of the corresponding section of the roller 161 without substantially impacting the baffles 203a and 203b, but other arrangements may be provided in other respects. Figure 2 As shown, the processing device 101 may have a support 261, which forms a rod 241 that can extend through a structure, for example, to adjust the distance 159.

[0105] In addition, now we will refer to Figure 6-7 The discussion covers various aspects of reservoirs and / or mixers. Mixers that can be connected to a single nozzle and multiple reservoirs will be discussed; it should be understood that other nozzles can be connected to similar mixers and / or multiple reservoirs. In various aspects, such as Figure 7As shown, the processing apparatus may include multiple reservoirs 121, such as reservoirs 123a-123d, which are fluidly connected to one or more mixers 131. In a further aspect, one or more of the reservoirs 123a-123d may be configured to contain a liquid different from the other reservoirs. In an even further aspect, each of the reservoirs 123a-123d in fluid communication with nozzle 143a may be different. In a further aspect, as shown, pumps 127a-127 and / or valves 129a-129d may be positioned between the corresponding reservoirs 123a-123d and at least one mixer 133 of the one or more mixers 131. For example, controller 701 may control one or more pumps 127a-127d and / or one or more valves 129a-129d to control which and / or how much fluid from each reservoir 123a-123d travels along the corresponding conduit 125a-125d to the mixer 133. Therefore, the composition of the processing liquid supplied to the nozzle 143a can be changed by adjusting the configuration and / or operation of pumps 127a-127d and / or valves 129a-129d. While the composition of the processing liquid supplied to the nozzle 143a can remain constant during substrate processing, the composition of the processing liquid may change throughout the substrate processing process. For example, the composition of the processing liquid may be an etchant used in the first stage of substrate processing, which may become a neutralizing or washing processing liquid in subsequent stages of substrate processing, but can be as described in reference... Figure 9 As discussed, multiple rollers and / or multiple sets of nozzles may be provided, or the single composition of the treatment liquid provided to nozzle 143a may remain unchanged.

[0106] In all aspects, such as Figure 6 As shown, various liquids can be supplied along corresponding pipes 125a-125d to a mixer 133, which is part of a processing device 601. Figure 6-7 As shown, mixer 133 can combine multiple liquids supplied along corresponding pipes 125a-125d to produce a processed liquid that can, for example, be supplied to nozzle 143 along pipe 135. Furthermore, in various aspects, valve 137 can be disposed between mixer 133 and nozzle 143a to control when and / or whether the processed liquid is supplied from mixer 133 to nozzle 143a along pipe 135. More generally, as Figure 2As shown, one or more mixers 131 may comprise a plurality of mixers 133a-133c. In various aspects, the plurality of mixers 133a-133c may be configured to receive liquids (e.g., in fluid communication with the same plurality of reservoirs) from the same plurality of reservoirs (e.g., providing different valves and / or pumps between the reservoirs and at least two of the corresponding plurality of mixers), but in some aspects, additional reservoirs may be provided for other mixers. Thus, the plurality of mixers 131 may be configured to receive fluids corresponding to a plurality of liquids from corresponding plurality of reservoirs 121 to produce corresponding plurality of processed liquids (e.g., one processed liquid per mixer). As discussed above, the controller 701 may be configured to allow a certain amount (e.g., when and / or whether) of liquid to flow from at least one of the plurality of reservoirs 121 to at least one mixer of the plurality of mixers 131. In various respects, the controller and / or one or more valves 129a-129d, 137 may be manually adjustable (e.g., defining the composition of the processing liquid and / or which parts of the substrate are processed with the processing liquid, directly or via manual settings on the controller), but in other respects, the controller 701 may be programmed and digitally operate one or more valves. In various respects, such as Figure 2 and 6 As shown in Figure 7, mixer 133 or 133a may be in fluid communication with a single nozzle 143a (e.g., supplying treatment liquid to a single nozzle 143a), but in other respects, the mixer may supply treatment liquid to more than one nozzle. (Refer to the above text.) Figure 1-2 As discussed, one or more rollers (e.g., roller 161 or multiple rollers 501) can receive the processing liquid from multiple nozzles 141 and transfer the processing liquid to the substrate 103, for example, because when one or more rollers (e.g., roller 161 or multiple rollers 501) can rotate about axis 163 (e.g., clockwise 162 or counterclockwise 164—extending in the width direction), the conveying device 171 can convey the substrate 103 in the conveying direction 104 (e.g., toward or below one or more rollers). Furthermore, multiple baffles 201, 401, or 501 can be disposed between the multiple nozzles 141 to define sections of roller 161, or between the rollers of the multiple rollers 501.

[0107] In all aspects, such as Figure 1-2 As shown, the roller 161 can be configured to translate 166 in the thickness direction of the substrate 103 (e.g., the direction of the substrate thickness 109 perpendicular to the conveying direction 104 and the axis 163), which can control a first distance 169 in the thickness direction between the outer surface 165 (e.g., the outer periphery) of the roller 161 and the first main surface 105 of the substrate 103. In a further aspect, as... Figure 2As shown, the first distance 169 can be substantially equal to the thickness of the meniscus to be formed on the roller (as shown by dashed line 167). In a further aspect, the first distance 169 can be 0.5 mm or greater, 0.7 mm or greater, 1 mm or greater, 5 mm or greater, 10 mm or greater, 15 mm or greater, 20 mm or greater, 50 mm or less, 30 mm or less, 20 mm or less, 15 mm or less, 10 mm or less, 8 mm or less, or 5 mm or less. In a further aspect, the first distance 169 can be from 0.5 mm to 50 mm, 0.7 mm to 30 mm, 1 mm to 30 mm, 5 mm to 20 mm, 10 mm to 15 mm, or any range or subrange thereof.

[0108] In all aspects, such as Figure 1 and 9 As shown, the roller 161 can be translated 166 based on the position of the substrate 103. In a further aspect, as... Figure 9 As shown, when the substrate 103 is located below the (corresponding) rollers 161 or 961, rollers 161 or 961 can be configured to have a first distance 169 discussed in the previous paragraph, and when the substrate 103 is not located below rollers 161 or 971, rollers 161 or 971 can be located at a second distance 179 or 979 greater than the first distance 169 (between the corresponding outer periphery of the roller and the substrate). Therefore, rollers 161, 961 and / or 971 can be configured to translate 166, 966 and / or 976 in the thickness direction (e.g., substrate thickness 109) at least based on the position of the substrate 103 (e.g., in the transport direction 104—from the second distance 179 and / or 979 to the first distance 169 and then back to the second distance 179 and / or 979).

[0109] In all aspects, such as Figure 9 As shown, the processing apparatus 901 may include multiple rollers 161, 961, and 971 positioned at different locations in the conveying direction 104. It should be understood that rollers 961 and 971 may be similar to roller 161, and / or the aspects discussed above with respect to roller 161 and associated baffles, multiple nozzles, optional one or more mixers, and one or more reservoirs also apply to rollers 961 and / or 971. In various aspects, when the second roller 961 can be positioned downstream of roller 161 (e.g., in the conveying direction 104), the processing liquid dispensed to roller 161 (and transferred to substrate 103) may be different from another processing liquid dispensed to the second roller 961 (and transferred to substrate 103). For example, roller 161 may selectively dispense an etchant (e.g., based on the position of the multiple nozzles, in conjunction with...). Figure 10-11At the location corresponding to the recess 1011 in the substrate, the second roller 161 can distribute (e.g., uniformly or selectively) the neutralizing or washing processing liquid onto the substrate 103, for example, to stop the etching process. Although not shown, it should be understood that for multiple processing steps (e.g., each pass or each group of passes corresponding to different processing steps), the substrate can travel back and forth (e.g., in the transport direction 104, and then in the opposite direction to the transport direction). Furthermore, although not shown, it should be understood that the substrate can be flipped (e.g., switching the first main surface and the second main surface) to process the second main surface after processing the first main surface.

[0110] In all aspects, such as Figure 8 As shown, the processing apparatus 801 may include a conveying device 171, wherein conveying rollers 173a and / or 173b are in contact with diluents 193a and / or 193b (e.g., at least partially positioned in diluent reservoirs 191a and / or 191b). In a further aspect, the diluent may comprise water and / or an alkaline detergent solution. In a further aspect, as shown, at least one conveying roller 173a and / or 173b may be configured to convey diluents 193a and / or 193b from diluent reservoirs 191a and / or 191b to substrate 103 (e.g., second main surface 107). In a further aspect, at least one conveying roller 173a and / or 173b in contact with diluents 193a and / or 193b may be positioned closest to roller 161 or multiple rollers 501. The conveying rollers may rotate about axes 177a and / or 177b that may be parallel to axis 163 (see [link to diagram]). Figure 1-2 Providing at least one conveyor roller in contact with the diluent can reduce (e.g., mitigate) the effects associated with any stray treatment liquids (e.g., from multiple nozzles and / or from the roller) in contact with the conveyor roller, which would otherwise have altered the properties of the second primary surface (which was not treated at the time).

[0111] Alternatively, in various aspects, such as Figure 1-2 As shown, the etching mask 183 can be disposed on the second main surface 107 of the substrate 103, but an etching mask is not required on the first main surface 105. As shown, the first surface region 185 of the etching mask 183 can contact the second main surface 107, and the second surface region 187 can contact the outer surfaces 175a and / or 175b of the conveyor rollers 173a and / or 173b. Providing an etching mask on the untreated surface can protect the surface from damage and / or the effects of stray processing liquids.

[0112] Processing apparatuses 101, 801, and / or 901 can be used to produce foldable substrate 1002, which can be used as part of foldable apparatuses 1001 and / or 1101. It should be understood that other products can be produced using the processing apparatuses discussed herein. Figure 10-11 As shown, example aspects of the foldable devices 1001 and / or 1101 may include a foldable substrate 1002 in an unfolded (e.g., flat) configuration according to aspects of this disclosure. The foldable substrate 1002 can be manufactured using methods according to this disclosure, such as using the processing equipment discussed herein. In aspects, as Figure 10-11 As shown, foldable devices 1001 and / or 1101 may include a foldable substrate 1002. In various aspects, such as Figure 11 As shown, the foldable device 1101 may include a layer (e.g., release liner 1071, PET sheet 1102) attached to the foldable substrate 1002 by an adhesive layer 1061. It should be understood that other layers (e.g., release liner, display device) may be used alternatively or in lieu of other layers.

[0113] Throughout this disclosure, the length of the foldable devices 1001 and / or 1101 is considered to be the dimension of the foldable devices 1001 and / or 1101 obtained between their opposite edges in a direction 1006 perpendicular to the folding axis 1016 of the foldable devices. In various aspects, such as Figure 10-11 As shown, any foldable device according to any aspect of this disclosure may include a folding plane 1018, which, when the foldable device is in a flat configuration, includes a folding axis 1016 and a substrate thickness 1007 direction (see [reference]). Figure 10 The folding plane 1018 may include the central axis of the foldable device, which is located, for example, at the second main surface 1005 of the foldable devices 1001 and 1101 (see...). Figure 10-11 In all respects, the foldable device can be folded around the folding axis 1016. In all respects, such as Figure 10-11 As shown, the foldable device 1001 and / or 1101 and / or the foldable substrate 1002 may include a substantially flat first main surface 1003 and / or a second main surface 1005, wherein the central portion of the foldable device is indistinguishable from adjacent portions. Figure 10-11 As shown, a foldable device may include a single folding axis to allow the foldable device to include a double fold, wherein, for example, the foldable device can be folded in half. In a further aspect, the foldable device may include two or more folding axes, for example, wherein each folding axis includes a corresponding central portion similar to or the same as the central portion discussed herein.

[0114] The foldable devices 1001 and / or 1101 disclosed herein include a foldable substrate 1002. In various aspects, the foldable substrate 1002 may comprise a glass-based substrate having a pencil hardness of 8H or greater, such as 9H or greater. In various aspects, the foldable substrate 1002 may comprise a glass-based substrate. As used herein, “glass-based” includes both glass and glass-ceramic, wherein the glass-ceramic has one or more crystalline phases and an amorphous residual glass phase. The glass-based material (e.g., the glass-based substrate) may comprise an amorphous material (e.g., glass) and optionally one or more crystalline materials (e.g., ceramic). The amorphous material and the glass-based material may be strengthened. As used herein, the term “strengthened” may refer to a chemically strengthened material, for example, by exchanging smaller ions with larger ions in the surface of the substrate, as discussed below. However, other strengthening methods may also be used, such as thermal tempering, or by utilizing the mismatch in the coefficients of thermal expansion between different portions of the substrate to create compressive stress and a central tension region, thereby forming a strengthened substrate. Exemplary glass-based materials, which may contain or not contain lithium oxide, include soda-lime glass, alkali aluminosilicate glass, alkali borosilicate glass, alkali aluminoborosilicate glass, alkali phosphosilicate glass, and alkali aluminophosphosilicate glass. In one or more aspects, the glass-based material may contain, in molar percentages (mol%): 40 mol% to 80 mol% SiO2, 5 mol% to 30 mol% Al2O3, 0 mol% to 10 mol% B2O3, 0 mol% to 5 mol% ZrO2, 0 mol% to 15 mol% P2O5, 0 mol% to 2 mol% TiO2, 0 mol% to 20 mol% R2O, and 0 mol% to 15 mol% RO. As used herein, R2O may refer to alkali metal oxides such as Li2O, Na2O, K2O, Rb2O, and Cs2O. As used herein, RO can refer to MgO, CaO, SrO, BaO, and ZnO. In various respects, the glass substrate may also optionally contain 0 mol% to 2 mol% of each of the following: Na₂SO₄, NaCl, NaF, NaBr, K₂SO₄, KCl, KF, KBr, As₂O₃, Sb₂O₃, SnO₂, Fe₂O₃, MnO, MnO₂, MnO₃, Mn₂O₃, Mn₃O₄, and Mn₂O₇. "Glass-ceramics" include materials produced through the controlled crystallization of glass. In various respects, glass-ceramics have a crystallinity of 1% to 99%.Examples of suitable glass-ceramics may include Li₂O-Al₂O₃-SiO₂ (i.e., LAS-based) glass-ceramics, MgO-Al₂O₃-SiO₂ (i.e., MAS-based) glass-ceramics, ZnO × Al₂O₃ × nSiO₂ (i.e., ZAS-based) glass-ceramics and / or glass-ceramics comprising a host crystalline phase, said host crystalline phase comprising β-quartz solid solution, β-spodumene, cordierite, petalite, and / or lithium disilicate. The glass-ceramic substrate may be strengthened using a chemical strengthening process.

[0115] The foldable substrate 1002 may comprise a glass substrate, and the first main surface 1003 and / or the second main surface 1005 may comprise one or more compressive stress regions, such as those generated by chemical strengthening. Chemical strengthening may include an ion exchange process, wherein ions in the surface layer are replaced or exchanged by larger ions having the same valence or oxidation state. The compressive stress regions may extend into a portion of the first and / or second portions, reaching a depth referred to as the compression depth. As used herein, compression depth means the depth to which the stress in the chemically strengthened substrate and / or portion described herein changes from compressive stress to tensile stress. The compression depth can be measured using a surface stress meter or a scattered light polarizer (SCALP, where the values ​​reported herein are obtained using a SCALP-5 manufactured by Glassstress Co., Estonia), depending on the ion exchange treatment and the thickness of the article being measured. If the stress in the substrate and / or portion is generated by the exchange of potassium ions into the substrate, the compression depth is measured using a surface stress meter, such as the FSM-6000 (Orihara Industrial Co., Ltd., Japan). Unless otherwise stated, compressive stress (including surface CS) is measured by a surface stress meter (FSM) using a commercially available instrument, such as the FSM-6000 manufactured by Orihara. Surface stress measurement relies on the accurate measurement of the stress optical coefficient (SOC), which is related to the birefringence of the glass. Unless otherwise stated, SOC is measured according to Procedure C (glass disk method) as described in ASTM Standard C770-16. In cases where the stress is generated by the exchange of sodium ions into the substrate and the thickness of the article being measured is greater than 400 µm, the compression depth and center tension (CT) are measured using a SCALP. When the stress in the substrate and / or portion is generated by the exchange of both potassium and sodium ions into the substrate and / or portion, and the thickness of the article being measured is greater than 400 µm, the compressibility depth is measured by SCALP. Where it is not desirable to be bound by theory, the sodium exchange depth can indicate the compressibility depth, while the potassium ion exchange depth can indicate the change in the magnitude of compressive stress (rather than the change from compressive stress to tensile stress). A graphical representation of the stress distribution can also be obtained using the refractive near-field method (RNF; the RNF method is described in U.S. Patent No. 8,854,623, which is incorporated herein by reference in its entirety).

[0116] In various aspects, the first main surface 1003 of the foldable substrate 1002 may include a first compressive stress region extending from the first main surface 1003 to a first compression depth. In various aspects, the second main surface 1005 of the foldable substrate 1002 may include a second compressive stress region extending from the second main surface to a second compression depth. The compression depth corresponds to the boundary of the corresponding compressive stress region, wherein the stress distribution changes from compression to tension (and vice versa).

[0117] like Figure 10-11As shown, the foldable substrate 1002 may include a first main surface 1003 and a second main surface 1005 opposite to the first main surface 1003. In various respects, the first main surface 1003 may extend along a first plane 1004a, and / or the second main surface 1005 may extend along a second plane 1004b. As used herein, the substrate thickness 1007 of the foldable substrate 1002 is defined as the average distance between the first main surface 1003 and the second main surface 1005. In all aspects, the substrate thickness 1007 can be 10 micrometers (µm) or greater, 20 µm or greater, 30 µm or greater, 40 µm or greater, 50 µm or greater, 60 µm or greater, 70 µm or greater, 100 µm or greater, 200 µm or greater, 400 µm or greater, 600 µm or greater, 1 mm or greater, 2 mm or greater, 5 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 750 µm or less, 500 µm or less, 250 µm or less, 200 µm or less, 150 µm or less, 100 µm or less, 95 µm or less, 90 µm or less, 85 µm or less, 80 µm or less, 75 µm or less, 70 µm or less, 60 µm or less, 50 µm or less, 40 µm or less, 30 µm or less, or 25 µm. The substrate thickness 1007 can be 10 µm or less, for example, 10 µm to 5 mm, 20 µm to 3 mm, 30 µm to 2 mm, 40 µm to 1 mm, 50 µm to 750 µm, 60 µm to 500 µm, 70 µm to 250 µm, 100 µm to 200 µm, 100 µm to 150 µm, or any range or subrange thereof. The substrate thickness 1007 can be 100 µm or less, for example, 10 µm to 100 µm, 15 µm to 95 µm, 20 µm to 80 µm, 25 µm to 75 µm, 30 µm to 70 µm, 40 µm to 60 µm, 40 µm to 50 µm, or any range or subrange thereof. In all respects, the substrate thickness 1007 can be from 50 µm to 100 µm, which can exhibit greater impact and / or puncture resistance and reasonable foldability than even thinner foldable substrates, such as 50 µm to 100 µm, 50 µm to 95 µm, 50 µm to 90 µm, 60 µm to 80 µm, 70 µm to 75 µm, or any range or subrange thereof. The foldable substrate 1002 may include the substrate thickness 1007 in the first portion 1021 and / or the second portion 1031.

[0118] like Figure 10-11As shown, the foldable substrate 1002 may include a first central surface region 1013 in a central portion 1081 of the foldable substrate 1002 (e.g., positioned between a first portion 1021 and a second portion 1031), the first central surface region being recessed relative to a first main surface 1003 (e.g., a first plane 1004a) and defining a recess 1011 (between the first central surface region 1013 and the first plane 1004a). In various respects, as shown, at least a portion of the first central surface region 1013 may extend along a third plane 1004c that may be parallel to the first plane 1004a. The central thickness 1009 is defined as the average distance between the first central surface region 1013 and a second central surface region 1043 opposite to the first central surface region 1013. In all respects, the center thickness 1009 can be 5 µm or greater, 10 µm or greater, 20 µm or greater, 25 µm or greater, 40 µm or greater, 60 µm or greater, 100 µm or greater, 300 µm or greater, 500 µm or greater, 1 mm or less, 800 µm or less, 500 µm or less, 300 µm or less, 200 µm or less, 160 µm or less, 120 µm or less, 100 µm or less, 80 µm or less, 60 µm or less, or 50 µm or less. In all respects, the center thickness 1009 may be in the range of 5 µm to 1 mm, 10 µm to 800 µm, 20 µm to 500 µm, 25 µm to 300 µm, 40 µm to 200 µm, 60 µm to 160 µm, 100 µm to 120 µm, or any range or subrange thereof. In all respects, the percentage of the center thickness 1009 to the substrate thickness 1007 may be 0.5% or greater, 1% or greater, 2% or greater, 5% or greater, 7% or greater, 10% or greater, 40% or less, 35% or less, 30% or less, 25% or less, 20% or less, 15% or less, 13% or less, 10% or less, or 8% or less. In all respects, the percentage of the center thickness 1009 to the substrate thickness 1007 can be in the range of 0.1% to 40%, 0.5% to 40%, 1% to 35%, 2% to 30%, 5% to 25%, 7% to 20%, 10% to 15%, or any range or subrange thereof. In all respects, the percentage of the center thickness 1009 to the substrate thickness 1007 can be 15% or less, for example, in the range of 0.1% to 20%, 0.5% to 15%, 0.5% to 13%, 1% to 13%, 1% to 10%, 2% to 10%, 2% to 8%, 5% to 8%, or any range or subrange thereof.In various respects, as shown in the figure, the second central surface region 1043 may be coplanar with and / or a part of the second main surface 1005, but in other respects, the second central surface region may be recessed relative to the second main surface.

[0119] In all aspects, such as Figure 10 As shown, the central portion 1081 may include one or more transition regions 1053 and / or 1055, wherein the first transition surface region 1015 and / or the second transition surface region 1017 extend between the first main surface 1003 and the first central surface region 1013. For example, the thickness of one or more transition regions 1053 and / or 1055 may gradually increase, smoothly increase, and / or linearly increase from the central thickness 1009 to the substrate thickness 1007 within the corresponding transition widths 1054 and / or 1056. Alternatively, as Figure 11 As shown, there may be no transition region between the center thickness 1009 and the substrate thickness 1007, where abrupt changes occur within a distance of less than 50 µm. The center width 1052 of the center portion 1081 includes a first center surface region 1013 and any transition regions 1053 and / or 1055, which may be at least the minimum parallel plate distance achieved by configuring the foldable substrate 1002.

[0120] In all aspects, such as Figure 10 As shown, coating 1082 can be disposed above the second main surface 1005 of the foldable substrate 1002. In various aspects, coating 1082 may include a third main surface 1083 and a fourth main surface 1085 opposite to the third main surface 1083, wherein coating thickness 1087 is defined as the average distance between them. In further aspects, as... Figure 10As shown, coating 1082 (e.g., third main surface 1083) may contact foldable substrate 1002 (e.g., second main surface 1005). In a further aspect, coating 1082 may have the following coating thicknesses 1087: 0.1 µm or greater, 1 µm or greater, 5 µm or greater, 10 µm or greater, 15 µm or greater, 20 µm or greater, 25 µm or greater, 40 µm or greater, 60 µm or greater, 80 µm or greater, 200 µm or less, 100 µm or less, or 50 µm or less, 30 µm or less, 25 µm or less, 20 µm or less, 20 µm or less, 15 µm or less, or 10 µm or less. In all aspects, the coating thickness 1087 can be from 0.1 µm to 200 µm, 1 µm to 100 µm, 5 µm to 50 µm, 10 µm to 30 µm, 15 µm to 25 µm, 15 µm to 20 µm, or any range or subrange thereof. In all aspects, the coating 1082 can comprise a polymeric hard coating. In a further aspect, the polymeric hard coating can comprise one or more of the following: ethylene-acid copolymers, polyurethane-based polymers, acrylate resins, and mercaptoester resins. Examples of ethylene-acid copolymers include ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, and ethylene-acrylic acid-methacrylic acid terpolymers (e.g., Nucrel (DuPont)), ionomers of ethylene-acid copolymers (e.g., Surlyn (DuPont)), and ethylene-acrylic acid copolymer amine dispersions (e.g., Aquacer (BYK)). Examples of polyurethane-based polymers include water-modified polyurethane dispersions (e.g., Eleglas (Axalta)). Examples of UV-curable acrylate resins include acrylate resins (e.g., Uvekol resin (Allinex)), cyanoacrylate adhesives (e.g., Permabond UV620 (Krayden)), and UV-radical acrylate resins (e.g., Ultrabond windshield repair resin). Examples of mercaptoester resins include mercaptoester triallyl isocyanurate (e.g., Norland optical adhesive NOA 61). In a further aspect, the polymer hard coating may comprise ethylene-acrylic acid copolymers and ethylene-methacrylic acid copolymers, which can be formed by ionizing carboxylic acid residues, typically with alkali metal ions (e.g., sodium and potassium) and zinc, to neutralize them to form ionomer resins. By providing a coating comprising a polymer coating, foldable devices can incorporate low-energy fracture. In various aspects, the coating may comprise a polymer hard coating comprising an optically transparent polymer hard coating.Materials suitable for optically transparent polymer hard coatings include, but are not limited to, cured acrylate resins (e.g., polymethyl methacrylate (PMMA) and aliphatic or aromatic hexafunctional polyurethane acrylates), polyimides, polyethylene terephthalate (PET), polycarbonate (PC), inorganic-organic hybrid polymers, aliphatic or aromatic hexafunctional polyurethane acrylates, siloxane hybrids, and nanocomposites, such as epoxy resins and polyurethane materials having nanosilicates. In all respects, optically transparent polymer hard coatings may consist substantially of one or more of these materials. As used herein, “inorganic-organic hybrid polymer” refers to a polymer material comprising monomers having both inorganic and organic components. Inorganic-organic hybrid polymers are obtained through polymerization reactions between monomers having both inorganic and organic groups. Inorganic-organic hybrid polymers are not nanocomposites comprising separate inorganic and organic components or phases, such as inorganic particles dispersed within an organic matrix.

[0121] like Figure 10-11 As shown, foldable devices 1001 and / or 1101 may include an adhesive layer 1061 having a first contact surface 1063 and a second contact surface 1065 opposite to the first contact surface 1063. In various aspects, as shown, the first contact surface 1063 of the adhesive layer 1061 may include a planar surface, and / or the second contact surface 1065 of the adhesive layer 1061 (… Figure 11 The adhesive layer 1061 may include planar surfaces. The adhesive thickness 1067 of the adhesive layer 1061 may be defined as the average distance between the first contact surface 1063 and the second contact surface 1065, excluding any portion located in the recess 1011. In various aspects, the adhesive thickness 1067 of the adhesive layer 1061 may be 1 µm or greater, 5 µm or greater, 10 µm or greater, 100 µm or less, 60 µm or less, 30 µm or less, or 20 µm or less (e.g., 1 µm to 100 µm, 5 µm to 60 µm, 10 µm to 30 µm, 10 µm to 20 µm). In various aspects, such as Figure 3 As shown, the second contact surface 1065 of the adhesive layer 1061 can face and / or contact the first main surface 1003 of the foldable substrate 1002.

[0122] In various aspects, adhesive layer 1061 may comprise one or more of the following: polyolefins, polyamides, halogenated polymers (e.g., polyvinyl chloride or fluoropolymers), elastomers, polyurethanes, phenolic resins, parylene, PET, and polyetheretherketone (PEEK). Examples of polyolefins include PE and polypropylene (PP). Examples of elastomers include rubbers (e.g., polybutadiene, polyisoprene, chloroprene rubber, butyl rubber, nitrile rubber) and block copolymers (e.g., styrene-butadiene, high-impact polystyrene, poly(dichlorophosphazene)). In a further aspect, adhesive layer 1061 may comprise an optically transparent adhesive. In a further aspect, the optically transparent adhesive may comprise one or more optically transparent polymers: acrylic (e.g., PMMA), epoxy resins, silicone, and / or polyurethane. Examples of epoxy resins include bisphenol A epoxy resins, phenolic epoxy resins, alicyclic epoxy resins, and glycidylamine epoxy resins. In a further aspect, optically clear adhesives may include, but are not limited to, acrylic adhesives, such as 3M 8212 adhesive, or optically clear liquid adhesives, such as LOCTITE optically clear liquid adhesive. Exemplary aspects of optically clear adhesives include clear acrylics, epoxy resins, silicones, and polyurethanes. For example, optically clear liquid adhesives may include LOCTITE AD 8650, LOCTITE AA 3922, LOCTITE EA E-05MR, and / or LOCTITE UK U-09LV (available from Henkel).

[0123] In all aspects, such as Figure 10 As shown, adhesive layer 1061 can be positioned in recess 1011. Alternatively, as... Figure 11 As shown, the foldable device 1101 may include a polymer-based portion 1091, which is positioned (at least partially in the recess 1011). Figure 11 As shown, the polymer base portion 1091 can be positioned between the first portion 1021 and the second portion 1031. In various aspects, the polymer base portion 1091 can be at least partially positioned in and / or fill the recess 1011, but the recess may not be completely filled, for example, leaving space for electronic and / or mechanical devices. The polymer thickness of the polymer base portion 1091 is defined as the average distance between the third contact surface 1093 and the fourth contact surface 1095 opposite to the third contact surface 1093. In various aspects, as shown, the polymer thickness can be substantially equal to the distance of the first central surface region 1013 relative to the recess of the first main surface 1003. In a further aspect, as shown, the polymer base portion 1091 can be positioned between the first central surface region 1013 and the adhesive layer 1061.

[0124] In all aspects, such as Figure 10 As shown, the foldable device 1001 may include a release liner 1071, but in a further aspect, other substrates (e.g., glass-based substrates and / or ceramic-based substrates) may be used instead of the shown release liner 1071. The release liner includes a first surface region 1073 and a second surface region 1075 opposite to the first surface region 1073. In a further aspect, as shown, the second surface region 1075 of the release liner 1071 may be disposed over and / or in contact with an adhesive layer 1061 (e.g., the first contact surface 1063). The substrate including the release liner 1071 may contain paper and / or polymers, such as polyesters (e.g., PET) and polyolefins.

[0125] In all aspects, such as Figure 11 As shown, a layer (e.g., PET sheet 1102) may be disposed over a first main surface 1003 of the foldable substrate 1002, and / or the layer (e.g., PET sheet 1102) may be attached to the foldable substrate 1002 via an adhesive layer 1061. As shown, the PET sheet includes a fifth main surface 1103 and a sixth main surface 1105 opposite to the fifth main surface 1103. In a further aspect, the layer (e.g., the sixth main surface 1105 of the PET sheet 1102) may be disposed over and / or in contact with a first contact surface 1063 of the adhesive layer 1061. In other aspects, the layer may comprise a polymeric material (not limited to PET), such as polyester and polyolefins. Additionally or alternatively, the layer may comprise a display device (e.g., a liquid crystal display (LCD), an electrophoretic display (EPD), an organic light-emitting diode (OLED) display, or a plasma display panel (PDP)). The display device may be part of a portable electronic device (e.g., a consumer electronics product, a smartphone, a tablet computer, a wearable device, or a laptop computer).

[0126] The foldable devices disclosed herein can be incorporated into another article, such as an article having a display (or a display article) (e.g., consumer electronics, including mobile phones, tablets, computers, navigation systems, wearable devices (e.g., watches)), building articles, transport articles (e.g., automobiles, trains, airplanes, ships, etc.), electrical articles, or any article that may benefit from some kind of transparency, scratch resistance, abrasion resistance, or a combination thereof. Figure 10-11 The illustration shows exemplary articles comprising any of the foldable devices 1001 and / or 1101 and / or foldable substrates 1002 disclosed herein. Specifically, Figure 12-13A consumer electronic device 1200 is shown, comprising a housing 1202 having a front surface 1204, a rear surface 1206, and side surfaces 1208. Although not shown, the consumer electronic device may include electrical components at least partially or entirely located within the housing. For example, the electrical components include at least a controller, memory, and a display. Figure 12-13 As shown, the display 1210 may be located on or adjacent to the front surface of the housing 1202. A consumer electronic device may include a cover plate substrate 1212 on or above the front surface of the housing 1202, such that the cover plate substrate is positioned above the display 1210. In various aspects, at least one of the cover plate substrate 1212 or a portion of the housing 1202 may include any foldable device disclosed herein, such as foldable device 1001 and / or 1101 and / or foldable substrate 1002.

[0127] also, Figure 14 A perspective view of a foldable consumer electronics product 1401 is shown. The consumer electronics product 1401 may include foldable devices 1001 and / or 1101 and / or foldable substrate 1002. The consumer electronics product 1401 may include a front surface 1403 and side surfaces 1405. The consumer electronics product 1401 may include electronic components, including a display 1402 (e.g., viewed through the front surface 1403). In various aspects, the consumer electronics product 1401 can be folded in direction 1412 to form a folded configuration that brings the first end 1427 and the second end 1437 (opposite to the first end 1427) closer together (compared to an unfolded configuration) (e.g., folding such that the front surface 1403 and / or the display 1402 face itself, but the consumer electronics product can also be folded in the opposite direction to direction 1412 such that in the folded configuration the front surface 1403 is on the outside of the consumer electronics product). The folding axis 1016 may correspond to a central portion 1481 located between a first portion 1421 including a first end 1427 and a second portion 1431 including a second end 1437, wherein the position of the folding axis 1016 may determine a first distance 1413 between the first end 1427 and the folding axis 1016 (e.g., in direction 1004) relative to a second distance 1415 between the second end 1437 and the folding axis 1016 (e.g., in direction 1408). The total length of the consumer electronics product may be the sum of the first distance 1413 and the second distance 1415. Furthermore, the consumer electronics product is depicted in a folded or partially folded configuration, wherein the front surface 1403 forms an angle A around the folding axis 1016. The consumer electronics product 1401 may include a width 1423 in direction 1424, which may be substantially equal to the width of the foldable substrate 1002.

[0128] As used herein, “foldable” includes the ability to fold completely, partially, bend, flex, or a combination thereof. As used herein, the terms “fail” and “failure” refer to breakage, damage, delamination, or crack propagation. If a foldable device resists failure when held at a parallel plate distance “X” for 10 minutes at 25°C and 50% relative humidity, then the foldable device achieves or withstands a parallel plate distance “X”. In all respects, the foldable substrate and / or foldable device may be rollable. As used herein, a foldable substrate or foldable device is “rollable” if the threshold parallel plate distance achievable within the length of the corresponding foldable substrate or foldable device is the greater of 10 mm or 10% of the length of the corresponding foldable substrate or foldable device. As used herein, the “parallel plate distance” of the foldable device and / or foldable substrate is measured by placing the foldable device or foldable substrate as is (without modification) between a pair of parallel rigid stainless steel plates, with the distance between the parallel plates decreasing at a rate of 1 millimeter per second (mm / sec) until the parallel plate distance equals the “parallel plate distance” to be tested. The parallel plates are then held at the “parallel plate distance” to be tested at 25°C and 50% relative humidity for 10 minutes. As used herein, the “minimum parallel plate distance” is the minimum parallel plate distance that the foldable device can withstand without failure under the conditions and configuration described above.

[0129] In all aspects, the foldable device 1001 and / or 1101 and / or the foldable substrate 1002 can achieve a parallel plate distance of 20 mm or less, 10 mm or less, 7 mm or less, 5 mm or less, 3 mm or less, 2 mm or less, or 1 mm or less. In all aspects, the foldable device 1001 and / or 1101 and / or the foldable substrate 1002 can have the following minimum parallel plate distances: 5 mm or less, 4 mm or less, 3 mm or less, 2 mm or less, or 1 mm or less (e.g., 0.5 mm to 5 mm, 0.5 mm to 4 mm, 0.5 mm to 3 mm, 0.5 mm to 2 mm, 1 mm to 2 mm).

[0130] Various aspects of the methods for processing a substrate according to various aspects of this disclosure will now be discussed, for example, to form Figure 10-11 The foldable substrate 1002 shown herein (e.g., in methods of manufacturing foldable devices 1001 and / or 1101) allows for selective processing of portions of a substrate (e.g., a first main surface) without masking the surface of the substrate being processed. This can reduce processing complexity, processing time, processing costs, and / or increase process yield.

[0131] The method can begin by providing a substrate 103. In various aspects, the substrate 103 can be provided by purchasing or otherwise obtaining the substrate, or by forming the substrate. In various aspects, the substrate 103 can comprise a glass substrate, which can be provided by forming them using various strip forming processes, such as slot drawing, downward drawing, fusion downward drawing, upward drawing, roll forming, redrawing, or float forming. In a further aspect, a glass substrate comprising ceramic crystals can be provided by heating the glass substrate to crystallize one or more ceramic crystals. In various aspects, such as Figure 1-2 As shown in 8-9, prior to processing, substrate 103 may comprise a planar (e.g., monolithic) substrate. In various aspects, substrate 103 may have a composition within one or more ranges discussed above for glass-based substrates. In various aspects, substrate 103 may be substantially unstrengthened. As used herein, substantially unstrengthened means that the substrate does not contain a compression depth or has a compression depth of 0% to about 5% of the substrate thickness. Alternatively, substrate 103 may be chemically strengthened, for example, having a compression depth within one or more corresponding ranges discussed above. In various aspects, as Figure 1-2 As shown, the etching mask 183 can be placed on the second main surface 107, while the first main surface 105 can be left unmasked (e.g., the entire first main surface can be exposed), but in other respects, the second main surface can be left unmasked.

[0132] like Figure 1 and 8 As shown in Figure 9, the method may include conveying the substrate 103 in a conveying direction 104 toward one or more rollers (e.g., roller 161 and / or rollers 961 and / or 971). In various respects, as referenced above... Figure 8 Discussed, the substrate may be conveyed by a conveying device 171 comprising conveying rollers 173a-173b, wherein one or more of these conveying rollers (e.g., the one or more rollers closest to each other) may come into contact with diluent 193a-193b (e.g., at least partially positioned in diluent reservoirs 191a-191b containing diluent 193a-193b), which may dilute any processing liquid transferred (e.g., incidentally, stray) to the corresponding conveying roller (e.g., transferred from one or more rollers).

[0133] In all aspects, as referenced above Figure 1-2 As discussed in 9, one or more rollers (e.g., roller 161, Figure 5Multiple rollers 501 and / or 961 and / or 971 can be translated 166, 966, and / or 976 based on the position of the substrate 103. For example, when the substrate 103 is conveyed toward roller 161 (e.g., within a predetermined proximity of the roller), the roller can be translated 166 toward the substrate 103 (e.g., in the thickness direction of the substrate thickness 109—forming a second distance 179) to a first distance 169, which can be within one or more of the corresponding ranges discussed above. Similarly, once the substrate 103 has passed under one or more corresponding rollers (e.g., beyond a predetermined proximity, which can be the same as or different from a predetermined proximity used to determine when to reduce the roller's position), the corresponding one or more rollers can be translated 166, 966, and / or 976 away from the substrate (e.g., from the first distance 169 to the second distance 179). Alternatively, throughout the method, one or more rollers can be maintained at a constant distance (e.g., the first distance 169 in the thickness direction). In all respects, the first distance 169 may be within one or more of the corresponding ranges discussed above (e.g., 0.5 mm or greater, 1 mm or greater). In all respects, the transport speed of the substrate in the transport direction 104 may be 0.2 mm / s or greater, 0.5 mm / s or greater, 1 mm / s or greater, 2 mm / s or greater, 5 mm / s or greater, 50 mm / s or less, 20 mm / s or less, 10 mm / s or less, 5 mm / s or less, 2 mm / s or less, or 1 mm / s or less (e.g., 0.2 mm / s to 50 mm / s, 0.5 mm / s to 20 mm / s, 1 mm / s to 10 mm / s, 1 mm / s to 5 mm / s).

[0134] In various aspects, the method can form a process liquid to be supplied to multiple nozzles 141. In further aspects, as referenced above... Figure 6-7The discussion is ongoing. For example, a method may draw multiple liquids from corresponding multiple reservoirs 121, mix the multiple liquids in a first mixer 133 (e.g., in multiple mixers 131) to form a process liquid, which is then supplied to one or more nozzles 143a of a plurality of nozzles 141. As discussed above, the configuration of mixers 133, pumps 127a-129 and / or valves 129a-129 and / or 137 may be manually controlled and / or controlled by controller 701. As discussed above, the process liquid may be supplied to one or more nozzles of a plurality of nozzles, but in other respects, the process liquid may be supplied to a single nozzle. Additionally, in a further aspect, a second mixer may draw liquid from a reservoir (e.g., the same or different reservoir in fluid communication with the first mixer) to form a second process liquid, which is then supplied to another one or more nozzles (different from one or more nozzles receiving (the first) process liquid from the first mixer), the second process liquid having a different composition from the (first) process liquid. Alternatively, the treatment liquid (e.g., a pre-mixed or stock solution) can be drawn from the reservoir to the nozzle (e.g., without a mixer). In various respects, the treatment liquid can be an etchant, water, a detergent solution, and / or a neutralizing solution (e.g., a neutralized etchant).

[0135] like Figure 1-5 As shown, the method can be carried out to dispense the treatment liquid from one or more nozzles 143a-143d of a plurality of nozzles 141 into a portion of the drum, for example, in the form of sprays 153a-153d and / or 151. In various respects, as discussed above, the drum 161 ( Figure 3-4 One or more portions of rollers 501 may be defined by a pair of baffles 203a-203c and / or 403a-403c from a plurality of baffles 201, 401 and / or 501 (e.g., defined, separated, or restricted in the width direction perpendicular to the thickness direction of the conveying direction 104 and the substrate thickness 109). As discussed above, the widths 207a, 207b of sections (e.g., portions) of roller 161 may be less than half of the corresponding dimensions of roller 161 (e.g., the width measured perpendicular to the conveying direction 104 and in the vertical direction (e.g., translation 166) or along axis 163), and / or within one or more of the corresponding ranges discussed above. In a further aspect, as Figure 4 As shown, the roller 161 may include recessed portions 405a-405c (e.g., relative to the outer periphery of the outer surface 165), said recessed portions being configured to receive one or more extending baffles 401 (e.g., baffles 403a-403c). For example, as Figure 4As shown, the roller 161 includes a recessed portion 405a configured to receive a baffle 403a between the region associated with the first nozzle 143a (e.g., spray 153a) and an adjacent nozzle 143b (e.g., spray 153b). Alternatively, as... Figure 5 As shown, roller 161 (from Figure 2 The plurality of rollers 501 may include rollers 503a-503d that are aligned in a row (e.g., a single row – baffles in a plurality of baffles are positioned between adjacent pairs of rollers) in the width direction (e.g., axis 163). In a further aspect, baffle 403a (among the plurality of baffles 403a-403c) may be positioned between adjacent rollers 503a and 503b of the plurality of rollers 501. Furthermore, as... Figure 5 As shown, baffle 403a can be configured to extend beyond the outermost periphery of outer surface 165 (e.g., a line or surface connecting the outer surface rather than the portion corresponding to baffles 403a-403c).

[0136] In various respects, the first nozzle 143a can dispense (e.g., spray 153a) a first processing liquid, while the second nozzle 143b (separated from the first nozzle by a baffle 203a or 403a) can dispense (e.g., spray 153b) a second processing liquid, wherein the composition of the first processing liquid differs from that of the second processing liquid. For example, the etchant concentration in the first processing liquid may differ from (e.g., higher, lower) the corresponding etchant concentration in the second processing liquid, which can selectively etch portions of the substrate corresponding to the second nozzle and the corresponding segment or roller (or rollers among multiple rollers). Reference Figure 2 and 10 -11, a second processing liquid containing etchant can be dispensed into one or more sections or rollers through one or more nozzles in an intermediate section (e.g., one or more segments, or one or more rollers among a plurality of rollers), and then the processing liquid is transferred to the central portion of the first main surface 105 or 1003 (see...). Figure 10-11 The central portion 1081 is used to form a recess 1011 in the resulting foldable substrate 1002; simultaneously, a first processing liquid that is not an etchant solution (or has no processing liquid at all) can be dispensed through one or more nozzles in other portions to one or more segments or rollers corresponding to the first portion 1021 and / or the second portion 1031 of the resulting foldable substrate 1002. In a further aspect, the central portion may correspond to the edges of the substrate (e.g., the first edge and the second edge—in Figure 2At the end of the view shown—in the width direction of axis 163 perpendicular to the transport direction 104—there is an offset by a certain amount, which is a percentage of the corresponding width of substrate 103 greater than or equal to 10%, greater than or equal to 15%, greater than or equal to 20%, greater than or equal to 25%, or greater than or equal to 35% (e.g., 10% to 45%, 15% to 40%, 20% to 35%, 25% to 30%, or any range or subrange thereof).

[0137] In all respects, as discussed above, one or more of the multiple nozzles 141, nozzles 143a-143d, can dispense sufficient processing liquid to form and / or maintain a meniscus on one or more rollers (e.g., roller 161, multiple rollers 501). Figure 1 The dashed line 167 in the diagram allows the processing liquid to be transferred from the meniscus to a corresponding portion of the substrate 103. For example, one or more nozzles can pulse the liquid at the following rates: approximately every 10 seconds or more, every 15 seconds or more, every 18 seconds or more, every 20 seconds or more, every 25 seconds or more, every 30 seconds or less, every 25 seconds or less, every 22 seconds or less, or every 20 seconds or less. Therefore, as... Figure 1 As shown, the method may include transferring a processing liquid from one or more rollers (e.g., roller 161, multiple rollers 501—including menisci formed thereon) to a portion of a first primary surface 105 of the substrate 103 while conveying the substrate 103 in the transport direction 104. In a further aspect, as... Figure 1 As shown, the transfer of the processing liquid occurs (e.g., primarily occurs, substantially occurs) through the interaction of the meniscus (e.g., dashed line 167) on one or more rollers (e.g., roller 161, multiple rollers 501) with the corresponding portion of the first main surface 105 of the substrate 103. In a further aspect, as... Figure 1 As shown, the transfer of the processing liquid occurs when the substrate 103 is located below one or more rollers (e.g., roller 161, multiple rollers 501), for example, when the substrate is conveyed (e.g., continuously conveyed) in the conveying direction 104.

[0138] In various aspects, the etchant may comprise an acidic or alkaline solution. In a further aspect, the acidic solution may comprise one or more inorganic acids. In a further aspect, the acidic solution may comprise fluoride ions (e.g., HF, ammonium fluoride, ammonium bifluoride, or combinations thereof). In a further aspect, the alkaline solution may comprise hydroxide ions, for example, from alkali metal hydroxides (e.g., NaOH, KOH). In all respects, the etching rate of the etchant (i.e., the rate at which material is removed from the surface of the substrate) can be 2 µm / min or less, 1.7 µm / min or less, 1.5 µm / min or less, 1.2 µm / min or less, 1.0 µm or less, 0.9 µm / min or less, 0.8 µm / min or less, 0.7 µm / min or less, 0.6 µm / min or less, 0.5 µm / min or less, 0.4 µm / min or less, 0.1 µm / min or more, 0.2 µm / min or more, 0.3 µm / min or more, 0.4 µm / min or more, 0.5 µm / min or more, 0.7 µm / min or more, 0.9 µm / min or more, 1.1 µm / min or more, or 1.3 µm / min or more. In all respects, the etching rate can be from 0.1 µm / min to 2 µm / min, 0.2 µm / min to 1.7 µm / min, 0.3 µm / min to 1.5 µm / min, 0.4 µm / min to 1.2 µm / min, 0.5 µm / min to 1.0 µm / min, or any range or subrange thereof. In all respects, the etching rate can be 1.0 µm / min or less, for example, 0.1 µm / min to 1.0 µm / min, 0.2 µm / min to 0.9 µm / min, 0.3 µm / min to 0.8 µm / min, 0.4 µm / min to 0.7 µm / min, or any range or subrange thereof. Providing an etching rate of 2 µm / min or less can facilitate substantially uniform removal of material from the surface of the substrate, for example, to form a recess in the substrate. Furthermore, an etching rate of 2 µm / min can remove a relatively uniform thickness and some compressive stress from the surface to reduce the occurrence of ripples and / or warping, which can cause optical distortion that can be seen by users of consumer electronics in which the foldable substrate can be incorporated.

[0139] As used herein, the pH of the solution was measured at 25°C according to ASTM E70-90. In all respects, the etchant can be an acidic solution with the following HF concentrations: 1 mol (M) or greater, 2 M or greater, 3 M or greater, 4 M or greater, 5 M or greater, 7 M or less, 5 M or less, 4 M or less, 3.5 M or less, 3 M or less, or 2.5 M or less (e.g., 1 M to 7 M, 2 M to 5 M, 3 M to 4 M, or any range or subrange thereof). Alternatively, the etchant is an acidic solution containing a buffered HF solution and / or an acidic aqueous solution. As used herein, buffered HF means the solution contains NH4F or produces F in the acidic solution. - Anionic analogs. In all respects, the acidic solution may contain the following amounts of HF, expressed as a percentage of the acidic solution: 0.5 wt% or more, 0.6 wt% or more, 1.5 wt% or less, 1.25 wt% or less, 1.0 wt% or less, or 0.75 wt% or less (e.g., 0.5 wt% to 1.5 wt%, 0.5 wt% to 1.25 wt%, 0.5 wt% to 1.0 wt%, 0.6 wt% to 0.75 wt%). In all respects, the acidic solution may contain the following amounts of NH4F, expressed as a percentage of the acidic solution: 0.75 wt% or more, 0.85 wt% or more, 0.9 wt% or more, 0.95 wt% or more, 1.0 wt% or more, 1.1 wt% or more, 2.5 wt% or less, 2.0 wt% or less, 1.5 wt% or less, 1.3 wt% or less, or 1.0 wt% or less (e.g., 0.75 wt% to 2.5 wt%, 0.8 wt% to 2.0 wt%, 0.9 wt% to 1.5 wt%, 1.0 wt% to 1.3 wt%).

[0140] In all aspects, the time period during which the substrate 103 (e.g., the first primary surface 105) is in contact with the etchant (e.g., from one or more rollers—including transfer from the meniscus formed thereon) can be 30 seconds or longer, 45 seconds or longer, 60 seconds or longer, 90 seconds or longer, 2 minutes or longer, 5 minutes or longer, 10 minutes or longer, 15 minutes or longer, 1 hour or less, 45 minutes or less, 30 minutes or less, 20 minutes or less, 15 minutes or less, 10 minutes or less, 8 minutes or less, 6 minutes or less, 4 minutes or less, 3 minutes or less, 2 minutes or less, 1.5 minutes or less, or 1.0 minute or less. In all aspects, the time period can be from 30 seconds to 1 hour, 60 seconds to 45 minutes, 2 minutes to 45 minutes, 5 minutes to 30 minutes, 10 minutes to 20 minutes, 15 minutes to 20 minutes, or any range or subrange thereof. In various aspects, the time period may be less than 5 minutes, for example, 30 seconds to 4 minutes, 45 seconds to 3 minutes, 60 seconds to 2 minutes, 75 seconds to 1.5 minutes, or any range or subrange thereof. In various aspects, during said time period, the substrate may pass under one or more additional rollers to ensure effective etchant supply to the substrate and / or replenishment (e.g., renewal) of etchant at predetermined portions. Alternatively, in various aspects, the etchant dispensed at the beginning of said time period may be retained on the substrate for said time period (e.g., when the substrate is held after passing under one or more rollers or when the substrate is continuously conveyed along a path corresponding to the time period before the etchant is removed and / or neutralized and / or the substrate is rinsed after passing under one or more rollers). In various aspects, as discussed in the next paragraph, the method may also include conveying the substrate through another one or more rollers (but the same one or more rollers may be used) to dispense different one or more processing liquids onto at least a portion of the substrate, wherein these processing liquids are different from the corresponding processing liquid (e.g., etchant) previously dispensed onto the corresponding portion.

[0141] In all aspects, such as Figure 9 As shown, the method may further include conveying the substrate 103 to one or more additional rollers 961 and / or 971 (and under said one or more additional rollers) in the processing apparatus 901. In a further aspect, the one or more additional rollers 961 and / or 971 may be part of a larger apparatus, which includes components referenced above. Figure 2-5The multiple nozzles and / or multiple baffles discussed are similar to and / or identical to corresponding multiple nozzles and / or multiple baffles. In a further aspect, one or more additional rollers 961 and / or 971 may dispense another processing liquid to at least a portion of the substrate 103, but in other aspects, nozzles (e.g., without one or more rollers) may be used to rinse the substrate and / or neutralize the etchant. For example, this can be achieved through a meniscus (referring to the above reference). Figure 1 (The process discussed in dashed line 167 is similar and / or identical) transfers the processing liquid from one or more additional rollers 961 and / or 971 to substrate 103. In a further aspect, another processing liquid may comprise water (e.g., purified, filtered, deionized, distilled), a neutralizing solution (e.g., neutralizing an etchant), a detergent solution, or a combination thereof. In an even further aspect, the detergent solution may be an alkaline detergent solution having a pH of 11 or higher (e.g., 11 to 14, 12 to 14, 12.5 to 13.5, or any range or subrange thereof), such as SemiClean KG (Yokohama Oils & Fats Industry Co.). Therefore, in a further aspect, the additional processing liquid may stop the etching of the etchant, but in other aspects, other combinations of processing liquids may be used.

[0142] In various respects, the method may also include assembling a foldable device from a foldable substrate produced by processing the substrate using the methods discussed herein. For example, an adhesive layer 1061, a polymer base portion 1091, a release liner 1071, a PET sheet 1102, a display device, or other components may be disposed on and / or on the foldable substrate.

[0143] Example

[0144] The following examples will further illustrate these aspects. Unless otherwise stated, the processing equipment contains multiple rollers (see...). Figure 5 Eight rollers correspond to the width of the substrate (160 mm), with baffles (corresponding to a width of approximately 20 mm 207a) between each pair of adjacent rollers. A first distance of 0.5 mm 169 (see...) Figure 1-2 The liquid is held between the outer periphery of the roller and the substrate. The processing liquid is 3 M HF, which is applied to a single roller (the fourth of eight rollers in the row) corresponding to the central portion formed in the substrate (corresponding to the recess in the resulting foldable substrate). The nozzle of this roller pulses for 0.5 seconds every 18 seconds to maintain the meniscus on the roller. The substrate (with a substrate thickness of 100 µm) is transported at a rate of 1 mm / s.

[0145] The substrate is conveyed through the rollers in the first direction for 5 minutes, and then the conveying direction is reversed to pass through the rollers again in another 5 minutes, with the entire round trip taking a total of 10 minutes. Samples are etched by 1 round trip (10 minutes), 2 round trips (20 minutes), 3 round trips (30 minutes), and 4 round trips (40 minutes). Figure 16 The etching depth Δt, in µm (corresponding to the distance of the first central surface region relative to the first main surface recess) on the vertical axis 1603 (e.g., the y-axis), is shown as a change in processing time T, in minutes (min), on the horizontal axis 1601 (e.g., the x-axis). Point 1605, corresponding to 1-4 round trips, is plotted using an S-shaped curve 1607 (Gompertz function) fitted to point 1605. As shown, the etching depth increases with increasing processing time.

[0146] Figure 15 The surface profile 1505 of the sample, measured after four round trips (40 minutes), is shown. This surface profile has a position in mm on a horizontal axis 1501 (e.g., the x-axis) and a relative distance in µm along the thickness direction shown on a vertical axis 1503 (e.g., the y-axis). As shown, the etching depth of the first central surface region is approximately 47 µm (47.1 µm). The width of the central portion is approximately 18 mm, including a transition region with a width of approximately 2 mm. As shown, the interior angle of the transition region, approximately 178° (e.g., 177.74° and 178.18°), is measured by linear fitting of a portion near the top of the transition region relative to a reference plane (nominally corresponding to the idealized plane, the first main surface).

[0147] Figure 17-19 The data shows that each process took 10 minutes (1 round trip). Figure 17 ), 20 minutes (2 round trips) Figure 18 ) and 30 minutes (3 round trips, Figure 19 The example substrate has a surface profile having a position X in mm on horizontal axes 1701, 1801, 1901 (e.g., x-axis) and a relative distance t in µm in the thickness direction shown on vertical axes 1703, 1803, 1903 (e.g., y-axis). As shown, from... Figures 17 to 19 The etching depth increased (from less than 5 mm after 10 minutes to approximately 25 mm after 20 minutes to approximately 41 mm after 30 minutes) — with Figure 16(This trend is consistent with what was observed in the previous analysis). Furthermore, as the etching depth increases, the inner angle of the transition region decreases with increasing processing time (e.g., from approximately 179.9° after 10 minutes to approximately 169.6° after 20 minutes to approximately 179.0° after 30 minutes). For the specific conditions tested, the surface profile appeared rough after 10 minutes, but this profile smoothed out over a longer period. Additionally, excessive etchant dripping from the roller was observed, suggesting that the nozzle pulse schedule might be too frequent. A longer pulse schedule is expected to eliminate this and potentially produce a flatter etched surface (e.g., the first central surface area).

[0148] Figure 20 A schematic top view of the surface of the foldable substrate after 30 minutes (3 round trips) is shown. Contour lines are drawn to represent the shape of the surface. The main surface has a peripheral portion 2007 with a substrate thickness of 100 µm; and a portion 2005 closer to the center with a slightly reduced thickness of approximately 97 µm. This slight reduction is believed to be caused by excessive processing liquid and / or splashing in this test configuration, and is thought to be rectified by minor adjustments to the nozzle and relative pulse timing. The transition region 2003 is relatively narrow across the entire test substrate, with a thickness ranging from approximately 97 µm to less than 75 µm (except for the edge portion 2002). The edge portion 2002 has a thickness of approximately 78 µm, which is believed to be a result of a slight misalignment of the substrate (which can be corrected). The majority of the center portion 2001 has a thickness of 62 µm to less than 70 µm (see also...). Figure 19 The surface profile shown in the figure.

[0149] Figure 21-23 The diagram schematically illustrates the variation (in mm) of local thickness trajectories 2105, 2205, 2305 in µm along the vertical axes 2103, 2203, 2303 (e.g., the y-axis) with the positions (in mm) of different equally spaced trajectories along the horizontal axes 2101, 2201, 2301 (e.g., the x-axis) of a sample substrate processed for 30 minutes (3 round trips). These are raw (uncorrected surface profiles) measured at a left edge set to 100 µm, which is why the local thicknesses are not necessarily aligned between these figures and those discussed above. As shown, trajectories 2105, 2205, and 2305 generally have the same shape. As discussed above, shoulders leading to transition regions can be eliminated with minor process adjustments. Furthermore, the deeper right side of the recesses 2107, 2207, and 2307 in the thickness trajectories (especially trajectory 2305) can be reduced by adjusting the nozzle pulse schedule and substrate alignment.

[0150] The above observations can be combined to provide apparatus and methods for processing substrates. Unlike conventional methods, this disclosure provides methods (and corresponding apparatus) for selectively processing portions of a substrate (e.g., a first main surface) without applying any mask to the corresponding surface (or, in some respects, not at all). This can reduce processing complexity, processing time, processing costs, and / or increase process throughput. The processing apparatus can dispense a processing liquid from one or more nozzles into a portion of a roller defined by baffles to localize the application of the processing liquid. In various respects, the processing liquid can then be transferred from the roller to the substrate, for example, through a meniscus on the roller, without the roller directly contacting the substrate. Furthermore, the method is capable of simultaneously applying multiple processing liquids to different portions of the substrate. Additionally, the composition of the processing liquid can be adjusted (e.g., adjusted in real time during processing) using a mixer and manual adjustment or a controller. In various aspects, the applied processing liquid can be an etchant having an etching rate of 2 µm / min or less, 1.5 µm / min or less, or 1.0 µm / min or less, which can facilitate substantially uniform removal of material from the surface of the substrate, for example, to form a recess in the substrate. In various aspects, the opposing surfaces can be protected from damage by stray processing liquids. Providing at least one transport roller in contact with a diluent can reduce (e.g., mitigate) the effects associated with any stray processing liquids contacting the transport roller, effects that might otherwise alter the properties of the second primary surface (which was not then processed). Providing an etching mask on the untreated surface can protect said surface from damage and / or the effects of stray processing liquids.

[0151] As used herein, directional terms (e.g., up, down, right, left, front, back, top, bottom) are formulated only with reference to the accompanying drawings and are not intended to imply absolute orientation. It should also be understood that, as used herein, the terms “the” and “a / an” mean “at least one (type)” and should not be limited to “only one (type)” unless explicitly indicated otherwise. For example, unless the context explicitly indicates otherwise, reference to “component” includes aspects having two or more such components. Similarly, “a plurality of (types)” means “more than one (type).”

[0152] As used herein, the terms “substantial,” “substantially,” and their variations are intended to indicate that the described feature is equal to or approximately equal to a certain value or description. For example, a “substantially flat” surface means a flat or approximately flat surface. Furthermore, “substantially similar” means that two values ​​are equal or approximately equal, for example, differing from each other by less than 10% (±10%), less than 5% (±5%), or less than 2% (±2%).

[0153] Unless explicitly stated otherwise, it is not intended to interpret any method herein as requiring its steps to be performed in a particular order. Therefore, no particular order is intended to be inferred unless the method claims actually describe an order to be followed or otherwise specifically specify that the steps are limited to a particular order. While the transitional phrase “comprising” may be used to disclose various features, elements, or steps of a particular aspect, it should be understood that alternative aspects are implied, including those described using the transitional phrases “consisting of” or “consisting essentially of.” For example, the implied alternative aspects of a device comprising A+B+C include the aspect that the device is composed of A+B+C and the aspect that the device is substantially composed of A+B+C. Unless otherwise stated, the terms “comprising” and “including” should be interpreted as synonymous and open-ended.

[0154] It should be understood that the disclosed aspects may relate to features, elements, or steps described in conjunction with said aspects. It should also be understood that although a feature, element, or step is described with respect to one aspect, said feature, element, or step may be interchanged or combined with alternative aspects in various combinations or arrangements not shown. The foregoing aspects and features of those aspects are exemplary and may be provided alone or in combination with any one or more features of other aspects provided herein without departing from the scope of this disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from the spirit and scope of this disclosure. Therefore, this disclosure is intended to cover modifications and variations of the aspects herein, provided they are within the scope of the appended claims and their equivalents.

Claims

1. A processing apparatus comprising: Storage; A nozzle, which is in fluid communication with the reservoir; A roller, wherein the nozzle is configured to dispense liquid from the reservoir into a portion of the roller; and A pair of baffles that define the portion of the roller.

2. The processing apparatus of claim 1, further comprising a conveyor configured to convey a substrate in a conveying direction toward the roller, the roller being configured to rotate about an axis extending in a width direction perpendicular to the conveying direction.

3. The processing apparatus according to claim 2, wherein the width between the pair of baffles in the width direction is configured to be less than half the dimension of the substrate in the width direction.

4. The processing apparatus according to any one of claims 2 to 3, wherein the conveyor is configured to convey the substrate below the drum.

5. The processing apparatus according to any one of claims 2 to 4, wherein the roller is confined between the pair of baffles.

6. The processing apparatus of claim 5, further comprising a plurality of rollers including the roller, the plurality of rollers being aligned in a row in the width direction, each of the plurality of rollers being separated from an adjacent roller of the plurality of rollers by a baffle of a plurality of baffles, and the plurality of baffles including the pair of baffles.

7. The processing apparatus of claim 6, further comprising a plurality of nozzles including the nozzle, the plurality of nozzles being configured to dispense corresponding liquids to corresponding rollers.

8. The processing apparatus according to any one of claims 1 to 4, wherein the drum comprises a plurality of portions including the portion, adjacent portions of the plurality of portions being separated by baffles of a plurality of baffles, and the plurality of baffles including the pair of baffles.

9. The processing apparatus of claim 8, wherein the section of the roller corresponding to the position of one of the plurality of baffles is recessed relative to the outer periphery of the portion of the roller.

10. The processing apparatus according to any one of claims 8 to 9, further comprising a plurality of nozzles including the nozzle, the plurality of nozzles being configured to dispense corresponding liquids to corresponding portions of the drum.

11. A method for processing a substrate, the method comprising: The substrate is conveyed in a conveying direction, and the substrate comprises a glass-based material or a ceramic-based material. The processing liquid is dispensed into a portion of the drum, said portion being defined in a width direction perpendicular to the conveying direction by a pair of separate baffles, and the width between said baffles being less than half the dimension of the substrate in that width direction; and When the substrate is conveyed in the conveying direction, the processing liquid is transferred from the roller to a portion of a first main surface of the substrate, wherein the first main surface is opposite to a second main surface.

12. The method of claim 11, wherein the transfer is achieved by the interaction of the meniscus of the processing liquid on the roller with the portion of the first main surface.

13. The method according to any one of claims 11 to 12, wherein the portion of the first main surface to which the processing liquid is transferred is spaced apart from a first edge of the substrate by a first distance in the width direction and spaced apart from a second edge of the substrate by a second distance in the width direction, the substrate width being defined between the first distance and the second distance, and the first distance and the second distance being equal to or greater than 10% of the substrate width.

14. The method according to any one of claims 11 to 13, wherein the processing liquid is an etchant, and the processing liquid etches the portion of the first main surface to form a first central surface region recessed relative to the first main surface.

15. The method according to any one of claims 11 to 14, wherein the roller is limited between the pair of baffles, wherein a plurality of rollers including the roller are aligned in a row in the width direction, each of the plurality of rollers is separated from an adjacent roller of the plurality of rollers by a baffle of the plurality of baffles, and the plurality of baffles includes the pair of baffles.

16. The method according to any one of claims 11 to 15, wherein the minimum distance between the outer periphery of the roller and the first main surface of the substrate is 1 mm or more, the minimum distance being measured in a direction perpendicular to the conveying direction and perpendicular to the thickness direction of the substrate between the first main surface and the second main surface.

17. The method according to any one of claims 11 to 16, wherein the roller comprises a plurality of portions including the portion, adjacent portions of the plurality of portions being separated by baffles of a plurality of baffles, and the plurality of baffles including the pair of baffles.

18. The method according to any one of claims 11 to 17, further comprising: The second processing liquid is dispensed into a second portion of the plurality of sections of the drum, the second portion being separated from the sections at least by one of the plurality of baffles; and While transferring the processing liquid from the portion of the roller to the portion of the substrate, the second processing liquid is transferred from the second portion of the roller to the second portion of the first main surface of the substrate.

19. The method according to any one of claims 11 to 18, further comprising rinsing at least said portion of the substrate by transferring another liquid from another roller after the transfer of the processing liquid.

20. The method of any one of claims 11 to 19, wherein the conveying comprises transporting the substrate across a plurality of conveying rollers, one of the plurality of conveying rollers being aligned with the rollers, the conveying rollers being at least partially positioned in a diluent reservoir and configured to transport diluent in the diluent reservoir, and wherein the diluent dilutes any of the processing liquids transferred to the conveying rollers.

21. The method of any one of claims 11 to 20, wherein the roller is configured to translate from an initial position toward the first main surface when the substrate approaches, and to return to the initial position after the substrate has passed the roller.

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