Heat dissipation mechanism and electronic device comprising same

Abstract

The present application relates to a heat dissipation mechanism and an electronic device including the same, the heat dissipation mechanism including: a housing body provided with a plurality of heat sink fins at a back surface portion; a heat dissipation portion in which a refrigerant flow space for flowing at least a changeable refrigerant is formed at a front surface of the housing body; and a thermoelectric element in which a heat generating surface as a positive junction portion is bonded in surface contact with a front portion of the heat dissipation portion, thereby providing an advantage of improving heat dissipation performance of the electronic device.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device and an electronic device including the same, and more specifically, to a heat dissipation device and an electronic device including the same that utilizes a phase-change refrigerant to cool the heat generated from the heating surface of a thermoelectric element more rapidly, thereby improving heat dissipation performance. Background Technology

[0002] Thermoelectric elements utilizing the Peltier phenomenon are semiconductor elements that, when a current is applied in one direction, dissipate heat (heat) at the forward junction and absorb heat (cool) at the reverse junction.

[0003] Because this thermoelectric element can be low-power and ultra-small, it can be used in various small household appliances such as small refrigerators, cosmetic refrigerators, and wine refrigerators.

[0004] Prior art for refrigerators utilizing such thermoelectric elements is disclosed in Korean Patent Publication No. 10-2002-0069909.

[0005] However, refrigerators using existing thermoelectric elements have a very small heat dissipation area and require fans to force airflow in order to achieve rapid heat dissipation. This not only increases power consumption but also generates operating noise. Furthermore, since the radiator fins are cooled by the thermal conductivity of materials such as aluminum, which have relatively good thermal conductivity among metals, there are significant limitations in improving heat dissipation performance. Summary of the Invention

[0006] Technical issues

[0007] The present invention is proposed to solve the above-mentioned technical problems. Its purpose is to provide a heat dissipation mechanism and an electronic device including the present invention, wherein the entire portion of the heating surface of the thermoelectric element is used as a heat dissipation surface for heat dissipation, and the active gas-liquid circulation is guided by the phase change of the refrigerant, thereby greatly improving the heat dissipation performance.

[0008] Meanwhile, another objective of the present invention is to provide a heat dissipation mechanism and an electronic device including the thereof, which can achieve ultra-thin manufacturing of a product by minimizing the front and rear thickness of the housing body.

[0009] Furthermore, another object of the present invention is to provide a heat dissipation mechanism and electronic devices including the thereof that, by ensuring excellent heat dissipation performance, eliminate the need for additional structures such as additional fans to promote external air circulation, and thus prevent an increase in power consumption and operating noise.

[0010] The technical problems of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0011] Solution to the problem

[0012] A heat dissipation mechanism according to an embodiment of the present invention includes: a housing body having a plurality of heat sink fins on the rear side; a heat dissipation section including a refrigerant flow space formed on the front side of the housing body for the flow of at least a phase-changeable refrigerant; and a thermoelectric element having a heating surface in contact with the front surface of the heat dissipation section as a positive joint.

[0013] The thermoelectric element can be disposed in the middle part of the front part of the heat dissipation section, on the lower side relative to the direction of gravity.

[0014] Furthermore, the heat dissipation portion corresponding to the back side of the thermoelectric element may be machined with scribe lines for delaying the flow of refrigerant.

[0015] Furthermore, the heat dissipation section may include a housing cover that is integrated with the housing body in a manner that covers the front portion of the refrigerant flow space, and has the scribed portion integrally formed on the back portion.

[0016] Furthermore, the outer shell body and the outer shell cover can be made of SUS material.

[0017] Furthermore, the heat dissipation section may also include: a refrigerant holding section, formed in the refrigerant flow space, and holding liquid refrigerant that has condensed and fallen towards gravity; and a refrigerant guiding section, formed in the refrigerant flow space, and guiding the liquid refrigerant to flow toward the refrigerant holding section.

[0018] Furthermore, the refrigerant-containing portion may be disposed in the front-rear region of the outer casing where the scribed portion is formed.

[0019] Furthermore, the refrigerant guide portion may be formed inclined downward toward the refrigerant holding portion located on the lower side.

[0020] Furthermore, the refrigerant receiving portion and the refrigerant guiding portion may be composed of protruding panels with a specified thickness and a specified width, so that each front end protrudes forward from the inner side of the outer casing body corresponding to the back portion in the refrigerant flow space at a specific position.

[0021] Furthermore, the protruding panel may include: a horizontal guide panel constituting the refrigerant holding portion; and an inclined guide panel constituting the refrigerant guiding portion.

[0022] Furthermore, the forward protrusion of the horizontal guide panel, which protrudes from the inner side of the outer casing, can be greater than the forward protrusion of the inclined guide panel.

[0023] Furthermore, the horizontal guide panel can be bent such that the two ends of the protruding panel are opposite each other on the upper side, so as to prevent the liquid refrigerant flowing in the direction of gravity by means of a surface forming a width in the front-back direction.

[0024] The two bent ends of the horizontal guide panel can be connected to at least one of the inclined guide panels.

[0025] Furthermore, a plurality of liquid refrigerant supply slits may be formed at the front end of the horizontal guide panel forming the refrigerant receiving portion, and the plurality of liquid refrigerant supply slits are cut backward to communicate with the scribing portion.

[0026] Furthermore, the horizontal guide panel can be arranged horizontally in a position corresponding to the part where the scribing part and the thermoelectric element are arranged, and can include an upper protruding panel located at the top and a lower protruding panel located at the bottom.

[0027] Furthermore, the inclined guide panel can be inclined downward toward the horizontal guide panel at the left and right ends of the inner side of the housing body, respectively.

[0028] Furthermore, the refrigerant guiding section can guide the flow of liquid refrigerant from its upper end to its lower end by means of a surface with a thickness in the front-back direction for forming the inclined guide panel.

[0029] Furthermore, the heat dissipation portion may also include a plurality of joint portions formed in the refrigerant flow space and which engage the outer casing body with the back portion of the outer casing cover.

[0030] Furthermore, the heat dissipation section may also include a plurality of condensation protrusions formed in the refrigerant flow space and protruding in order to increase the surface area of ​​the refrigerant in thermal contact with the gaseous refrigerant.

[0031] Furthermore, at least a portion of the plurality of condensation protrusions may be formed on the inclined guide panel, and the remaining portions of the plurality of condensation protrusions may be formed on the inner side of the housing body.

[0032] Furthermore, the front end face of the plurality of condensation protrusions can be welded to the back face of the outer casing.

[0033] Furthermore, the scribing portion can be spaced out in the vertical direction to form multiple sections, and can be machined into a long groove shape on the back side of the outer casing in the horizontal direction.

[0034] Furthermore, the scribing portion can be spaced out in the left-right direction to form multiple sections, and can be processed in the vertical direction to form a long groove shape.

[0035] An electronic device according to an embodiment of the present invention may include: a housing having a cryogenic space for storing items at low temperatures; and a heat dissipation mechanism including a thermoelectric element disposed on the housing to expose a cooling surface as a reverse connection portion to the cryogenic space side, while a heating surface as a forward connection portion is in surface contact with a heat dissipation portion side having a refrigerant flow space for refrigerant flow. The heat dissipation mechanism may include: a housing body having a plurality of heat sink fins on its rear side; a heat dissipation portion including the refrigerant flow space formed on the front side of the housing body for at least a phase-changeable refrigerant to flow; and the thermoelectric element having a heating surface as the forward connection portion in surface contact with the front side of the heat dissipation portion.

[0036] The housing may also have a door at the front end for opening and closing the low-temperature space, and the outer shell body in the heat dissipation mechanism may be configured to cover the rear end of the housing.

[0037] Furthermore, it may also include a heat insulation panel disposed between the low-temperature space of the housing and the heat dissipation mechanism. The heat insulation panel is formed with the same front and rear thickness as the thermoelectric element and is provided with the thermoelectric element in such a way that the heat-generating surface of the thermoelectric element, which is the forward joint of the thermoelectric element, is exposed to the heat dissipation mechanism side, and the cooling surface of the thermoelectric element, which is the reverse joint of the thermoelectric element, is exposed to the low-temperature space of the housing.

[0038] The effects of the invention

[0039] The heat dissipation mechanism and the electronic device including it according to an embodiment of the present invention can achieve the following various effects.

[0040] First, the heat generated at the positive junction of the thermoelectric element, i.e. the heating surface, induces an active gas-liquid cycle through the phase change of the refrigerant, thereby significantly improving heat dissipation performance.

[0041] Secondly, it minimizes the front and back thickness of the outer shell, thereby enabling the product to be manufactured in an ultra-thin form.

[0042] Third, it can effectively transfer and dissipate heat through a phase-change refrigerant, thus eliminating the need for an additional exhaust fan and preventing further increases in power consumption and operating noise. Attached Figure Description

[0043] Figure 1This is a perspective view showing an embodiment of a heat dissipation mechanism and an applicable example of an electronic device including the same, according to an embodiment of the present invention.

[0044] Figure 2 This is a perspective view showing a heat dissipation mechanism according to an embodiment of the present invention.

[0045] Figure 3a and Figure 3b for Figure 2 An exploded perspective view of the front and rear sections.

[0046] Figure 4 for Figure 2 The front view (part (a)), top view (part (b)) and side view (part (c)).

[0047] Figure 5 and Figure 6 In order to be in Figure 2 The front view of the structure with the heat sink cover removed and the flow diagram based on the refrigerant's state changes.

[0048] Figure 7 For along Figure 4 A sectional view taken along line AA and a partially enlarged view.

[0049] Figure 8 This is a perspective view showing the airflow circulation state of a tester used to test the heat dissipation performance of a heat dissipation mechanism according to an embodiment of the present invention.

[0050] Figure 9 For comparative examples and simplified diagrams of the thermoelectric element of the present invention,

[0051] Figure 10a and Figure 10b To indicate Figure 8 A chart showing the results of the tester.

[0052] Explanation of reference numerals in the attached figures

[0053] 1: Electronic equipment 100: Heat dissipation mechanism

[0054] 110: Outer shell body 120: Vent pipe

[0055] 150: Thermoelectric element; 200: Heat sink

[0056] 205: Refrigerant flow space; 210: Refrigerant holding section

[0057] 214, 215: Protruding panels; 214: Horizontal guide panel

[0058] 215: Inclined guide panel; 216 h: Liquid refrigerant supply slit

[0059] 220: Refrigerant guiding section; 230: Refrigerant diffusion section

[0060] 240: Joint 250: Condensation Protrusion

[0061] 260: Outer shell cover 263: Scribing section Detailed Implementation

[0062] Hereinafter, a heat dissipation mechanism and an electronic device including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0063] It should be noted that when assigning reference numerals to structural elements in the various figures, even if they are shown in different figures, the same reference numerals should be assigned to the same structural elements as much as possible. Furthermore, in describing embodiments of the present invention, detailed descriptions of related well-known structures or functions will be omitted if it is determined that such detailed descriptions may hinder understanding of the embodiments of the present invention.

[0064] In describing the structural elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish structural elements from other structural elements, and the nature, order, or sequence of related structural elements is not limited by these terms. Unless defined differently, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms commonly used that are identical to their dictionary definitions should be interpreted as having a meaning consistent with the literal meaning of the related art, and should not be interpreted as having an overly ideal or formal meaning unless explicitly defined in this application.

[0065] Figure 1 This is a perspective view showing an embodiment of a heat dissipation mechanism and an applicable example of an electronic device including the same, according to an embodiment of the present invention. Figure 2 This is a perspective view showing a heat dissipation mechanism according to an embodiment of the present invention. Figure 3a and Figure 3b for Figure 2 An exploded perspective view of the front and rear sections.

[0066] like Figures 1 to 3b As shown, an electronic device 1 according to an embodiment of the present invention may include: a housing 10 having a low-temperature space 1S for storing items that require refrigeration or freezing; a housing door D disposed at the front end of the housing 10 and for opening and closing the low-temperature space 1S of the housing 10; and a heat dissipation mechanism 100 disposed at the rear end of the housing 10, such that heat generated by the heating surface of the thermoelectric element 150 (described later) is dissipated toward the rear side of the housing 10.

[0067] The low-temperature space 1S formed in the shell 10 is a storage space for items (food) that can be formed within the cooling performance limits of the thermoelectric element 150. The thermoelectric element 150, described later, is generally low-power or ultra-small, and can therefore perform the function of storing items that require refrigeration, such as beverages, cosmetics, or wine.

[0068] However, if the thermoelectric element 150 described later is high-powered or large, it can also be configured to store food that can be stored in a regular refrigerator.

[0069] On the other hand, such as Figure 1 As shown, an electronic device 1 according to an embodiment of the present invention may further include a heat insulation panel 15 disposed between a low-temperature space 1S of the housing 10 and a heat dissipation mechanism 100.

[0070] The heat insulation panel 15 is formed with the same front and rear thickness as the thermoelectric element 150 described later, and is provided with the thermoelectric element 150 to perform the function of exposing the heat-generating surface of the thermoelectric element 150, which is the forward joint of the thermoelectric element 150, to the heat dissipation mechanism 100 side, and exposing the cooling surface of the thermoelectric element 150, which is the reverse joint of the thermoelectric element 150, to the low-temperature space 1S of the housing 10.

[0071] Among them, such as Figures 2 to 3b As shown, a heat dissipation mechanism 100 and an electronic device 1 including the present invention may include a thermoelectric element 150. The thermoelectric element 150 is disposed in the housing 10 to expose a cooling surface as a reverse joint to the low temperature space 1S side, while the heating surface as a forward joint is in surface contact with the heat dissipation portion 200 side of the refrigerant flow space 205 for refrigerant flow.

[0072] More specifically, a heat dissipation mechanism 100 according to an embodiment of the present invention may include: a housing body 110 having a plurality of heat sink fins 111 on the back side; a heat dissipation section 200 including a refrigerant flow space 205 formed on the front side of the housing body 110 for the flow of at least a phase-changeable refrigerant; and the aforementioned thermoelectric element 150 having a heating surface as a positive joint contacting and bonded to the front surface of the heat dissipation section 200.

[0073] Multiple heat sink fins 111 can be detachably attached to the back of the housing body 110. However, they do not necessarily have to be detachably attached; the multiple heat sink fins 111 can be integrally molded during the molding of the housing body 110.

[0074] That is, the heating surface of the thermoelectric element 150, which is the forward joint, can be arranged facing the rear, so that the heat generated can be directly dissipated to the rear through a plurality of heat sink fins 111 integrally formed on the back of the outer casing 110. The cooling surface of the thermoelectric element 150, which is the reverse joint, can be arranged facing the front, so as to cool the air in the low-temperature space 1S in front.

[0075] As for the outer casing 110, a plurality of heat sink fins 111 may be integrally formed on the back side, and a heat sink 200 may be provided on the front side, which is formed into a box shape with a very thin thickness in the front-to-back direction and includes the aforementioned refrigerant flow space 205.

[0076] The heat dissipation section 200 can be a concept encompassing all structures related to the gas-liquid circulation of a phase-change refrigerant filled in the refrigerant flow space 205 formed in the housing body 110.

[0077] The outer shell 110 and the plurality of heat sink fins 111 integrally formed therein can be made of a thermally conductive material that can exchange heat with the outside air (especially the outside air at the rear) by means of the thermal conductivity of the material itself, and perform heat dissipation.

[0078] In particular, the thermally conductive material forming the outer casing 110 and the plurality of heat sink fins 111 is preferably a metallic material, which can be formed from either aluminum (or aluminum alloy) or SUS (stainless steel). Generally, in heat dissipation mechanisms that utilize only the thermal conductivity of the material itself for heat transfer, aluminum (or aluminum alloy) is preferably chosen. However, as shown in this invention, when using a refrigerant as a heat transfer medium and transferring heat to the refrigerant, the outer casing 110 and the outer casing cover 260 described later can be made of SUS (stainless steel), which is cost-effective and has excellent machinability, within the limit of making it thin enough to overcome the limitations of the thermal conductivity of the material itself.

[0079] Preferably, the refrigerant filling the refrigerant flow space 205 in the heat dissipation section 200 is a refrigerant with a boiling point (vaporization temperature) within a range suitable for the final cooling temperature of the low-temperature space 1S to be cooled. More preferably, it may include Honeywell refrigerant or water (including ultrapure water). In particular, water as a refrigerant is suitable when the metal material forming the refrigerant flow space 205 is made of SUS material, which provides the advantage of minimizing the internal pressure change of the refrigerant flow space 205 caused by chemical reactions caused by aluminum material, and preventing environmental pollution caused by refrigerant outflow in advance.

[0080] In a heat dissipation mechanism 100 according to an embodiment of the present invention, the thermoelectric element 150 may be disposed in the middle part of the front part of the heat dissipation section 200 on the lower side relative to the direction of gravity. This is because the refrigerant in the liquid state that is condensed in the refrigerant flow space 205 (hereinafter referred to as "liquid refrigerant") is trapped in the direction of gravity, and it is advantageous to use the heat provided by the heating surface of the thermoelectric element 150 as the forward joint to change the liquid refrigerant into a gaseous refrigerant (hereinafter referred to as "gas refrigerant").

[0081] On the other hand, the heat dissipation unit 200 may also include a housing cover 260 that is combined with the housing body 110 in a manner that covers the front part of the refrigerant flow space 205 and has a scribing portion 263 integrally formed on the back part.

[0082] The scribing portion 263 can be formed such that it is recessed to a predetermined depth on the back side of the outer casing 260, which is made of a metal panel and is shaped as a heat-conducting material.

[0083] This scribed section 263 can perform the following function: in the refrigerant flowing through the refrigerant flow space 205 via gas-liquid circulation, the liquid refrigerant that has undergone heat exchange and condensation through the radiator fins 111 of the outer casing 110 stops or delays its flow towards the lower side in the direction of gravity.

[0084] In particular, the heating surface of the thermoelectric element 150, which serves as the forward contact portion, can be attached to the front surface of the outer casing 260 in a surface-contact manner. Preferably, the thermoelectric element 150 can be attached to the lower end of the portion on the front surface of the outer casing 260 that is mainly where the liquid refrigerant is stored, and can be joined to the front surface of the outer casing 260 at a position corresponding to the portion on which the scribe line 263 is integrally formed.

[0085] Therefore, when heat is received from the heating surface, which is the positive junction of the thermoelectric element 150, via the outer casing 260, the scribing portion 263 causes the liquid refrigerant to stop or delay its flow, thereby performing the function of phase change (i.e., evaporation) into gaseous refrigerant within a sufficient time.

[0086] The scribing section 263 can be formed into a shape composed of grooves in the form of multiple lines 265. However, the scribing section 263 can not only be precision machined with multiple lines 265 of the same size and dimensions using precision machining, but also, as long as it has the function of stopping or delaying the flow of liquid refrigerant in the scribing section 263, it can be processed by forming multiple scratches without finishing with a sharp tool (instrument), which is also reasonable.

[0087] Furthermore, multiple scribing portions 263 can be formed on the back of the outer casing 260 in a vertical direction, and can also be machined into a long groove shape on the back of the outer casing 260 in a horizontal direction. However, it is not limited to the scribing portions 263 being formed in a horizontal direction (i.e., laterally), but multiple scribing portions 263 can be formed on the back of the outer casing 260 in a horizontal direction, and can also be machined into a long groove shape on the back of the outer casing 260 in a vertical direction (i.e., vertically).

[0088] Although not shown in the accompanying drawings, the applicant of this invention conducted its own tests on the flowability of the liquid refrigerant based on the formation direction of the scribe lines 263. The results showed that when multiple lines 265 are formed laterally in the horizontal direction, the refrigerant diffuses to the left and right, and after filling without gaps, flows downwards. This means that the liquid refrigerant sequentially fills the upper scribe lines 263 and the lower scribe lines 263, and during this repeated process, the liquid refrigerant completely transforms into a gaseous phase, and the gas-liquid circulation cycle can be shortened so that the liquid refrigerant does not reach the scribe lines 263 near the final lower end.

[0089] Conversely, when multiple lines 265 are formed vertically in the up-down direction, it can be observed that the liquid refrigerant can easily flow downwards. In this case of multiple lines 265 forming vertically, it is preferable to select an application where the heat provided by the heating surface of the thermoelectric element 150 is sufficient, so that refrigerant circulation can be carried out rapidly.

[0090] The more the amount of liquid refrigerant stagnation or delay is increased by the scribing section 263 with this function, the more the amount of refrigerant evaporation caused by the heat supplied by the heating surface of the thermoelectric element 150 can be promoted.

[0091] Figure 5 and Figure 6 In order to be in Figure 2 The front view of the structure with the heat sink cover removed and the flow diagram based on the refrigerant's state changes. Figure 7 For along Figure 4 A sectional view taken along line AA and a partial enlarged view.

[0092] like Figures 5 to 7As shown, the heat dissipation section 200 may include: a refrigerant holding section 210, formed in the refrigerant flow space 205, and having liquid refrigerant that has condensed and fallen in the direction of gravity; a refrigerant guiding section 220, formed in the refrigerant flow space 205, and guiding the liquid refrigerant to flow toward the refrigerant holding section 210; and a refrigerant diffusion section 230, providing space for the flow and diffusion of gaseous refrigerant that has evaporated from the refrigerant holding section 210.

[0093] The refrigerant housing portion 210 may be formed at a position corresponding to the portion where the scribed portion 263 and the thermoelectric element 150 are disposed. Preferably, the refrigerant housing portion 210 may be provided in the front-rear region of the outer casing 260 where the scribed portion 263 is formed.

[0094] The refrigerant guide portion 220 may be formed inclined downward toward the refrigerant holding portion 210 located on the lower side. When the refrigerant holding portion 210 is located in the middle of the lower side portion in the front part of the outer casing 110, the refrigerant guide portion 220 may be formed inclined downward toward the middle portion of the outer casing 110 in the left and right ends of the outer casing 110, respectively.

[0095] In particular, the refrigerant housing 210 and the refrigerant guiding housing 220 may be composed of protruding panels 214 and 215, which have a specified thickness and a specified width, such that each front end protrudes forward from the inner side of the outer casing body 110 corresponding to the back side in the refrigerant flow space 205 to a specific position.

[0096] The protruding panels 214 and 215 can be formed elongated along the length direction and can be configured as panels with a specified thickness and width. Hereinafter, the "width" of the protruding panels 214 and 215 refers to the portion that is greater than their "thickness". The refrigerant holding portion 210 can be configured such that the surface forming the thickness contacts the inner surface of the refrigerant flow space 205, and the refrigerant guiding portion 220 can be configured such that the surface forming the width contacts the inner surface of the refrigerant flow space 205.

[0097] More specifically, the protruding panels 214 and 215 may include: a horizontal guide panel 214, formed horizontally to define the refrigerant holding portion 210; and an inclined guide panel 215, formed inclined to define the refrigerant guiding portion 220.

[0098] Regarding the horizontal guide panel 214 that constitutes the refrigerant holding section 210 in the protruding panels 214 and 215, the surface forming its thickness can contact the refrigerant flow space 205 in order to hold and store more liquid refrigerant.

[0099] Furthermore, regarding the inclined guide panel 215 that constitutes the refrigerant guiding section 220 in the protruding panels 214 and 215, the liquid refrigerant flowing down along the inner side of the outer casing 110 can be guided from its upper end to its lower end by a surface with a thickness in the front-to-back direction. Since the inclined guide panel 215 only needs to guide the flow of liquid refrigerant through its surface, the surface with a width can contact the refrigerant flow space 205.

[0100] Therefore, the forward protrusion of the horizontal guide panel 214 constituting the refrigerant housing 210 protruding from the inner side of the housing body 110 can be greater than the forward protrusion of the inclined guide panel 215 constituting the refrigerant guide section 220.

[0101] In particular, the refrigerant holding section 210 can be bent such that the two ends of the horizontal guide panel 214 are positioned opposite each other on the upper side, so that the liquid refrigerant flowing in the direction of gravity can be blocked by the surface forming the width of the horizontal guide panel 214 in the front-back direction, so as to hold it for a specified time. The two ends of the horizontal guide panel 214 can be connected to at least one of the inclined guide panels 215.

[0102] Such horizontal guide panels 214 can be formed in at least two vertically spaced units within the limit of overlap of the areas occupied by the aforementioned scribing portion 263 and the thermoelectric element 150 in the front-to-back direction (see reference). Figure 5 and Figure 6 (Referring to the reference numerals "214-U" and "214-D" in the accompanying drawings). That is, the horizontal guide panel 214 is arranged horizontally in a manner corresponding to the position where the scribing portion 263 and the thermoelectric element 150 are arranged, and may include an upper protruding panel 214-U located at the top and a lower protruding panel 214-D located at the bottom.

[0103] The front end of the horizontal guide panel 214 can be closely attached to the back of the outer cover 260, and can be formed with a rearward cut to allow multiple liquid refrigerant supply slits 216h to communicate with the refrigerant holding portion 210 and the scribing portion 263.

[0104] By supplying multiple liquid refrigerant slits 216h, liquid refrigerant guided by the refrigerant guide 220 can flow into the scribed portion 263 side, and liquid refrigerant that has condensed throughout the entire area of ​​the refrigerant flow space 205 can be continuously supplied to the scribed portion 263. Meanwhile, the inclined guide panel 215, which forms the protruding panel of the refrigerant guide 220, can be formed by tilting downwards towards the center from the left and right ends of the inner side of the outer casing body 110.

[0105] This refrigerant guide section 220 can guide the flow of liquid refrigerant from its upper end to its lower end by forming a surface of the thickness of the inclined guide panel 215. Therefore, it performs the function of capturing the liquid refrigerant in the entire area of ​​the refrigerant flow space 205 at the location of the scribing section 263 and the thermoelectric element 150 to achieve condensation.

[0106] On the other hand, such as Figures 5 to 7 As shown, the heat dissipation section 200 may also include a plurality of joints 240 formed in the refrigerant flow space 205 and engaged with the back side of the housing cover 260.

[0107] Multiple joints 240 are formed in the form of protrusions on the refrigerant flow space 205, and each can be formed with a joint receiving hole 241 that is joined to the outer casing 260 by any of the welding methods, including laser welding, through the joint hole 261 formed on the outer casing 260.

[0108] Meanwhile, a joint hole 261 can also be formed in the outer cover 260, which is through in the forward and backward direction at a position corresponding to the joint receiving hole 241 in order to achieve the above-mentioned welding joint.

[0109] On the other hand, the heat dissipation section 200 may also include a plurality of condensation protrusions 250 formed in the refrigerant flow space 205 and protruding in order to make thermal contact with the gaseous refrigerant in the refrigerant.

[0110] like Figures 5 to 7 As shown, a plurality of condensation protrusions 250 are arranged to protrude approximately to the extent that they contact the back of the outer casing 260 in front of the refrigerant flow space 205. Some of them may be formed on the inclined guide panel 215 in the protruding panel constituting the refrigerant guide portion 220, or the remainder may be formed on the inner side of the outer casing body 110, which is a part independent of the refrigerant guide portion 220.

[0111] When the gaseous refrigerant that has vaporized in the refrigerant flow space 205 diffuses through the refrigerant diffuser 230, these multiple condensation protrusions 250 can cause flow interference and increase the thermal contact surface area, thereby shortening the gas-liquid circulation cycle time.

[0112] The front end faces of the multiple condensation protrusions 250 can also be welded to the back side of the outer casing 260.

[0113] Meanwhile, at the upper end of the outer casing 110, the vent pipe 120 can be connected to the refrigerant flow space 205.

[0114] The vent pipe 120 can be configured to connect a vacuuming tool or a refrigerant filling tool (not shown) during the vacuuming process of the refrigerant flow space 205 or during refrigerant filling, and can be provided in the pipe connection hole 120h of the housing body 110.

[0115] If the above-mentioned vacuuming process or refrigerant filling is completed, the exposed part of the vent pipe 120 to the outside of the pipe connection hole 120h can be cut and removed, and then the refrigerant flow space 205 can be sealed by the slit closing process.

[0116] Figure 8 This is a perspective view showing the airflow circulation state of a tester used to test the heat dissipation performance of a heat dissipation mechanism according to an embodiment of the present invention. Figure 9 Here are simplified diagrams of the thermoelectric elements of the comparative example (100A) and the present invention (100). Figure 10a and Figure 10b To indicate Figure 8 A chart showing the results of the tester.

[0117] To compare and confirm the heat dissipation performance of the heat dissipation mechanism 100 of an embodiment of the present invention configured as described above, it is possible to set up, for example... Figure 9 After showing the thermoelectric element 150A of the comparative example (100A), the following results were obtained: Figure 10a and Figure 10b The results are shown.

[0118] More specifically, the size of the outer shell body 110 of the comparative example (100A) and the present invention (100) is 186.0*250.0 (unit: mm), and the left and right width and the top and bottom length are the same. The front and back thickness including the heat sink fins 111 is 26.0 (unit: mm) in the comparative example (100A) and 40.0 (unit: mm) in the present invention (100). The number of heat sink fins 111 is a total of 61 in the comparative example (100A), while in the case of the present invention (100), 40 are used.

[0119] like Figure 8 As shown, after attaching the outer casing 110 of the comparative example (100A) and the present invention (100) to the same tester, the measured temperature value and the flow rate of the liquid refrigerant were confirmed by volumetric flow rate (CFM) to the result of forcibly blowing air upward with a specified air force using the lower fan.

[0120] As a result, the temperature value of the comparative example (100A) was 39°C, while the temperature value of the present invention (100) was 32.3°C, exhibiting a lower value of approximately 6.7°C. Furthermore, as... Figure 10a and Figure 10bAs shown, in the case of the present invention (100), although the number of radiator fins 111 is 21 fewer than that of the comparative example (100A), the refrigerant flow rate (CFM) is 32.7, which is 12.3 higher than that of the comparative example (100A).

[0121] This means that compared to gas-liquid circulation without the aid of a phase-change refrigerant, the heat dissipation section 200 of the present invention (100), which is a heat dissipation structure that relies on a gas-liquid circulation of a refrigerant (especially water, which is the refrigerant filled between the SUS material housing body 110 and the housing cover 260), provides better heat dissipation, thereby further improving heat dissipation performance.

[0122] In particular, in the structure of the heat dissipation section 200, a scribing section 263 is formed on the outer casing 260 that receives heat directly from the thermoelectric element 150, thereby slightly stagnating (delaying) the flow of liquid refrigerant in the part corresponding to the evaporation area and guiding active gas-liquid circulation.

[0123] like Figure 1 As shown, the electronic device 1 of an embodiment of the present invention configured as described above may further include a housing door D disposed at the front end of the housing 10.

[0124] Therefore, the housing 10 is formed into a cuboid shape with openings facing the front and rear respectively. The opening at the front can be opened and closed by means of the housing door D. The opening at the rear is provided with a heat dissipation mechanism 100 of an embodiment of the present invention for quickly dissipating heat generated from the heating surface of the thermoelectric element 150 in a manner that closes the low temperature space 1S.

[0125] According to an embodiment of the present invention, the heat dissipation mechanism 100 and the electronic device 1 including it, configured as described above, overcome the limitations of heat dissipation performance that simply depends on the thermal conductivity of the material of the heat sink fins 111, and maximize the heat dissipation performance by rapidly increasing the number of gas-liquid circulation cycles of the internal refrigerant.

[0126] The heat dissipation mechanism and electronic device including the same according to an embodiment of the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described embodiment, and it is natural that those skilled in the art can implement the invention in various modifications and equivalents. Therefore, the true scope of protection of the present invention is specified by the claims.

Claims

1. A heat dissipation mechanism, characterized in that, include: The outer casing has multiple heat sink fins on the back. The heat dissipation section includes a refrigerant flow space formed on the front side of the housing body for the flow of at least a phase-changeable refrigerant; and The thermoelectric element has a heating surface that is in contact with the front surface of the heat dissipation part as a positive joint.

2. The heat dissipation mechanism according to claim 1, characterized in that, The thermoelectric element is disposed in the middle part of the front part of the heat dissipation section, on the lower side relative to gravity.

3. The heat dissipation mechanism according to claim 2, characterized in that, The heat dissipation portion corresponding to the back side of the thermoelectric element has scribbled sections formed to delay the flow of refrigerant.

4. The heat dissipation mechanism according to claim 3, characterized in that, The heat dissipation section includes a housing cover that is integrated with the housing body in a manner that covers the front portion of the refrigerant flow space, and has the scribed portion integrally formed on the back portion.

5. The heat dissipation mechanism according to claim 4, characterized in that, The outer shell body and the outer shell cover are made of SUS material.

6. The heat dissipation mechanism according to claim 4, characterized in that, The heat dissipation unit also includes: A refrigerant possession section is formed in the refrigerant flow space, and includes a liquid refrigerant phase that condenses and falls towards gravity; and A refrigerant guide is formed in the refrigerant flow space and guides the liquid refrigerant to flow toward the refrigerant-owning side.

7. The heat dissipation mechanism according to claim 6, characterized in that, The refrigerant-containing portion is disposed in the front-rear region of the outer casing where the scribed portion is formed.

8. The heat dissipation mechanism according to claim 7, characterized in that, The refrigerant guide portion is formed inclined downward toward the refrigerant holding portion located on the lower side.

9. The heat dissipation mechanism according to claim 6, characterized in that, The refrigerant housing and the refrigerant guide are composed of protruding panels with a specified thickness and a specified width, so that each front end protrudes forward from the inner side of the outer casing body corresponding to the rear side in the refrigerant flow space at a specific position.

10. The heat dissipation mechanism according to claim 9, characterized in that, The protruding panel includes: A horizontal guide panel constitutes the refrigerant housing; and An inclined guide panel constitutes the refrigerant guide section.

11. The heat dissipation mechanism according to claim 10, characterized in that, The horizontal guide panel, which protrudes from the inner side of the housing body, has a greater forward protrusion than the inclined guide panel.

12. The heat dissipation mechanism according to claim 10, characterized in that, The horizontal guide panel is bent with its two ends facing each other on the upper side, so as to prevent the liquid refrigerant from flowing in the direction of gravity by means of a surface that forms a width in the front-to-back direction.

13. The heat dissipation mechanism according to claim 12, characterized in that, The two ends of the bend in the horizontal guide panel are connected to at least one of the inclined guide panels.

14. The heat dissipation mechanism according to claim 12, characterized in that, A plurality of liquid refrigerant supply slits are formed at the front end of the horizontal guide panel forming the refrigerant receiving portion. The plurality of liquid refrigerant supply slits are cut backward to connect with the scribing portion.

15. The heat dissipation mechanism according to claim 10, characterized in that, The horizontal guide panel is arranged horizontally in a manner corresponding to the position where the scribing part and the thermoelectric element are arranged, and includes an upper protruding panel located at the top and a lower protruding panel located at the bottom.

16. The heat dissipation mechanism according to claim 10, characterized in that, The inclined guide panel is formed by tilting downwards towards the horizontal guide panel at the left and right ends of the inner side of the housing body.

17. The heat dissipation mechanism according to claim 16, characterized in that, The refrigerant guides guide the flow of liquid refrigerant from their respective upper ends to their respective lower ends by means of the surfaces forming the thickness in the front-back direction of the inclined guide panels.

18. The heat dissipation mechanism according to claim 6, characterized in that, The heat dissipation section also includes a plurality of joints formed in the refrigerant flow space and which engage the outer casing body with the back side of the outer casing cover.

19. The heat dissipation mechanism according to claim 6, characterized in that, The heat dissipation section also includes a plurality of condensation protrusions formed in the refrigerant flow space and protruding in order to increase the surface area of ​​the refrigerant that comes into thermal contact with the gaseous refrigerant.

20. The heat dissipation mechanism according to claim 19, characterized in that, At least a portion of the plurality of condensation protrusions are formed on the inclined guide panel. The remainder of the plurality of condensation protrusions are formed on the inner surface of the outer casing body.

21. The heat dissipation mechanism according to claim 19, characterized in that, Among the plurality of condensation protrusions, the front end face is welded to the back side of the outer casing.

22. The heat dissipation mechanism according to claim 3, characterized in that, The scribing sections are spaced apart in the vertical direction to form multiple sections, and are machined into long grooves in the horizontal direction on the back side of the outer casing.

23. The heat dissipation mechanism according to claim 3, characterized in that, The scribing section is spaced out in the left-right direction to form multiple sections, and is processed in the vertical direction to form a long groove shape.

24. The heat dissipation mechanism according to claim 1, characterized in that, The plurality of radiator fins are detachably attached to the back of the housing body.

25. The heat dissipation mechanism according to claim 1, characterized in that, The plurality of radiator fins are formed as one unit on the back side of the housing body.

26. An electronic device, characterized in that, include: The shell forms a low-temperature space for storing items at low temperatures; as well as The heat dissipation mechanism includes a thermoelectric element disposed in the housing, which exposes a cooling surface as a reverse joint to the low-temperature space side, while the heating surface as a forward joint is in surface contact with the heat dissipation section side, which forms a refrigerant flow space for refrigerant flow. The heat dissipation mechanism includes: The outer casing has multiple heat sink fins on the back. The heat dissipation section includes a refrigerant flow space formed on the front side of the housing body for the flow of at least a phase-changeable refrigerant; and The thermoelectric element has a heating surface that serves as the forward joint portion, which is in contact with the front surface of the heat dissipation portion.

27. The electronic device according to claim 26, characterized in that, A door for opening and closing the cryogenic space is also provided at the front end of the housing. The outer casing of the heat dissipation mechanism is configured to cover the rear end of the casing.

28. The electronic device according to claim 26, characterized in that, It also includes a heat insulation panel disposed between the low-temperature space of the housing and the heat dissipation mechanism. The heat insulation panel is formed with the same front and rear thickness as the thermoelectric element, and the thermoelectric element is provided in such a way that the heat-generating surface of the thermoelectric element, which is the forward joint of the thermoelectric element, is exposed to the heat dissipation mechanism side, and the cooling surface of the thermoelectric element, which is the reverse joint of the thermoelectric element, is exposed to the low-temperature space of the housing.

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