Waveform signal packaging for data analysis and processing control

Abstract

A method of processing control by waveform signal encapsulation at a processor device is provided. The processor device can receive time-based waveform data. The time-based waveform data can include waveform data corresponding to one or more waveform signals in a time domain. The processor device can process the time-based waveform data to convert the time-based waveform data to frequency-based waveform data. The frequency-based waveform data can include the waveform data in a frequency domain. The processor device can encapsulate the frequency-based waveform data (and / or the time-based waveform data) as one or more spectrogram image files. Each spectrogram image file can include two or more color channels to indicate the waveform data. The processor device can display the one or more spectrogram image files.

Description

[0001] Background Art of the Invention Technical Field

[0002] The embodiments of the present invention generally relate to methods and apparatus for waveform data analysis. More specifically, embodiments of the present invention relate to a method for encapsulating waveform data into a spectrogram image file. Background Technology

[0003] In electronics, acoustics, and related fields, a signal waveform is a graphical representation of the signal in wave form. Depending on the type of input that generates the wave, the waveform can be sinusoidal or square. The waveform depends on the properties defining the size and shape of the wave.

[0004] Waveform data can include vibration data, acoustic data, etc. Such waveform data can be time-based or frequency-based and may include features that can provide insights into the process or component (e.g., mechanical component) that generated the waveform data.

[0005] In semiconductor systems, controllers (e.g., semiconductor tool controllers) may process time-based or frequency-based waveform data to gain insights into the semiconductor process or the semiconductor system components that generate the waveform data. However, semiconductor tool controllers have certain limitations when processing time-based or frequency-based waveform data. For example, a semiconductor tool controller may only be able to process waveform data to gain insights that may only tend to be within upper and lower frequency limits, without addressing unique frequencies that might be revealed in the waveform data. Therefore, a semiconductor tool controller may not be able to process all time-based or frequency-based waveform data and provide the correct insights within the required time period.

[0006] Processing waveform data (such as time-based waveform data used for data analysis) also presents some additional challenges. For example, time-based waveform data often requires some form of data processing before data analysis can be performed. Such data processing can lead to additional costs and processing time.

[0007] Furthermore, the rate of waveform data is proportional to the frequency range of the captured signal. Therefore, any time interval between data samples can limit the frequency of waveform data that can be analyzed. Additionally, shorter intervals between data samples may proportionally require more storage space for waveform data, potentially increasing the burden on the central processing unit (CPU) during Fast Fourier Transform (FFT) / waveform data analysis. Therefore, capturing multiple time-based waveform data streams over long periods may be impractical for data analysis (e.g., because this could require a significant amount of storage space for waveform data).

[0008] Therefore, there is an urgent need for a device and method for analyzing waveform data to solve the above problems. Summary of the Invention

[0009] Embodiments of the present invention provide apparatus and methods for waveform data analysis. In one embodiment, an apparatus for waveform signal encapsulation is provided. The apparatus includes memory, including instructions, and one or more processors. The one or more processors may be individually or collectively configured to execute the instructions and enable the apparatus to: receive time-based waveform data, wherein the time-based waveform data includes waveform data corresponding to one or more waveform signals in the time domain; process the time-based waveform data to convert the time-based waveform data into frequency-based waveform data, wherein the frequency-based waveform data includes waveform data in the frequency domain; encapsulate at least one of the frequency-based waveform data or the time-based waveform data into one or more spectrogram image files, wherein each spectrogram image file includes two or more color channels to indicate the waveform data; and at least one of the following: display or process (e.g., analyze) the one or more spectrogram image files.

[0010] In another embodiment, a method is provided for processing control at a processor device by encapsulating waveform signals. The method includes receiving time-based waveform data, wherein the time-based waveform data includes waveform data corresponding to one or more waveform signals in the time domain. The method includes processing the time-based waveform data to convert it into frequency-based waveform data, wherein the frequency-based waveform data includes waveform data in the frequency domain. The method includes encapsulating at least one of the frequency-based waveform data or the time-based waveform data into one or more spectrogram image files, wherein each spectrogram image file includes two or more color channels to indicate the waveform data. The method includes at least one of displaying or processing (e.g., analyzing) the one or more spectrogram image files. Attached Figure Description

[0011] To enable a detailed understanding of how the above-described features of the present invention are obtained, a more specific description of the invention can be made by referring to embodiments (which have been briefly outlined above), some of which are illustrated in the accompanying drawings.

[0012] Figure 1 This is a partial cross-sectional view of one embodiment of a polishing station that can be used to practice embodiments of the present invention.

[0013] Figure 2 It is based on one or more implementation methods. Figure 1 A schematic plan view of the polishing station.

[0014] Figure 3A and Figure 3B Processes for waveform data encapsulation and analysis according to one or more implementations are described.

[0015] Figure 4 Spectrograms of accelerometer data according to one or more embodiments are depicted.

[0016] Figure 5 Spectrograms of example acoustic data according to one or more implementations are depicted.

[0017] Figure 6 Spectrograms of vibration data according to one or more embodiments are depicted.

[0018] Figure 7 Methods for waveform data encapsulation and analysis according to one or more embodiments are described.

[0019] For ease of understanding, the same reference numerals have been used as much as possible to indicate the same elements in the figures. It is foreseeable that elements and features of one embodiment may be beneficially incorporated into other embodiments without further reiteration. Detailed Implementation

[0020] The embodiments described herein relate to apparatuses and methods for capturing and analyzing large amounts of waveform data (e.g., accelerometer waveform data, audio waveform data) collected during one or more activities (such as semiconductor processing activities). In some embodiments, these apparatuses and methods include transforming the large amounts of waveform data into Fast Fourier Transform (FFT) spectrogram image files, which may have a low data storage footprint. FFT spectrogram image files are lossless image files, which may allow multiple channels or streams of waveform data (e.g., four channels) to be embedded into a single spectrogram image file. Therefore, the apparatuses and methods described herein may facilitate the storage and analysis of multiple channels or streams of waveform data with minimal data storage requirements and a low central processing unit (CPU) processing burden (e.g., because multiple channels or streams of waveform data can be embedded into a single spectrogram image file with one or more color channels).

[0021] Example of a chemical mechanical polishing (CMP) system

[0022] Figure 1This is a partial cross-sectional view of one embodiment of a polishing station 100 configured to perform polishing processes, such as chemical mechanical polishing (CMP), abrasive polishing, or electrochemical mechanical polishing (ECMP). Polishing station 100 may be a standalone unit or part of a larger processing system. Examples of larger processing systems that can be adapted to utilize polishing station 100 include REFLEXION from Applied Materials, Inc., Santa Clara, California. ® REFLEXION ® LK, REFLEXION ® LK ECMP TM REFLEXION GT TM AND MIRRA MESA ® Polishing systems and other polishing systems.

[0023] Polishing station 100 includes a platform 105 rotatably supported on base 110. Platform 105 is operatively coupled to an actuator or drive motor 115 adapted to rotate platform 105 about axis of rotation A. In one embodiment, the polishing material 122 of polishing pad 120 is a commercially available pad material, such as polymer-based pad materials commonly used in CMP processes. This polymer material may be polyurethane, polycarbonate, fluoropolymer, polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), or combinations thereof. Polishing material 122 may further comprise open or closed foam polymers, elastomers, felts, impregnated felts, plastics, or other materials compatible with the processing chemicals. In another embodiment, polishing material 122 is a felt impregnated with a porous coating. In other embodiments, polishing material 122 comprises at least partially conductive material. Polishing pad 120 is considered a consumable and can be releasably coupled to platform 105 for easy replacement.

[0024] Platform 105 is used during processing to rotate polishing pad 120, such that when substrate 135 contacts polishing material 122, polishing pad 120 can planarize or polish the surface of substrate. In some embodiments, a first measuring device 138, such as a platform rotation sensor, can be used to acquire a measurement indicating the force required to rotate platform 105 and polishing pad 120. The first measuring device 138 may be a torque or other rotational force sensor coupled to drive motor 115 or to the output shaft of drive motor 115. In some embodiments, the first measuring device 138 may include an accelerometer, temperature sensor, acoustic sensor, friction sensor, and pressure sensor, or other useful sensors or data collection devices.

[0025] A carrier head 130 is positioned over the polishing surface 125 of the polishing pad 120. The carrier head 130 holds the substrate 135 and controllably advances the substrate 135 towards the polishing surface 125 of the polishing pad 120 (along the Z-axis) during processing. In one embodiment, the carrier head 130 includes one or more pressurizable bladders (not shown) adapted to apply pressure or force to one or more regions on the back side of the substrate 135 to advance the substrate 135 towards the polishing surface 125. The carrier head 130 is mounted to a support member 140, which supports the carrier head 130 and facilitates movement of the carrier head 130 relative to the polishing pad 120. The support member 140 may be coupled to a base 110 or mounted to a polishing station 100 in a manner that suspends the carrier head 130 above the polishing pad 120. In one embodiment, the support member 140 is a circular track mounted above or adjacent to the polishing station 100.

[0026] A support head 130 is coupled to a drive system 145 that provides at least rotational movement of the support head 130 about a rotation axis B. The drive system 145 may additionally be configured to move the support head 130 laterally (X-axis and / or Y-axis) relative to the polishing pad 120 along the support member 140. In one embodiment, in addition to lateral movement, the drive system 145 also moves the support head 130 vertically (Z-axis) relative to the polishing pad 120. For example, the drive system 145 may be used to move the substrate 135 toward the polishing pad 120 while providing rotational and / or lateral movement of the substrate 135 relative to the polishing pad 120. The lateral movement of the support head 130 may be linear, arcuate, or oscillating. A second measuring device 148 may be coupled to the support head 130. In some embodiments, the second measuring device 148 may be a rotation sensor of the support head 130 for measuring the force required to rotate the substrate 135 against the polishing pad 120. The second measuring device 148 may be a torque or other rotational force sensor coupled to the drive system 145 or to the output shaft of the drive system 145. In some embodiments, the second measuring device 148 may include an accelerometer, a temperature sensor, an acoustic sensor, a friction sensor, a pressure sensor, and other useful sensors or data collection devices.

[0027] An adjustment device 150 and a fluid applicator 155 are shown above the polishing surface 125 of the polishing pad 120. The fluid applicator 155 includes one or more nozzles 160 adapted to deliver polishing fluid to a portion of the polishing pad 120. The fluid applicator 155 is rotatably coupled to a base 110. In some aspects, the fluid applicator 155 may not be rotatably coupled to the base 110. In one embodiment, the fluid applicator 155 is adapted to rotate about a rotation axis C and provide polishing fluid directed toward the polishing surface 125. The polishing fluid may be a chemical solution, water, a polishing compound, a cleaning solution, or a combination thereof.

[0028] The adjustment device 150 typically includes an adjustment head 151, a rotatable shaft 152, and an arm 153 configured to extend from the rotatable shaft 152 over the polishing pad 120 and support the adjustment head 151. The adjustment head 151 holds an adjustment disc 154 that selectively contacts the polishing surface 125 of the polishing pad 120 to adjust the polishing surface 125. The adjustment disc 154 is considered a consumable and is detachably coupled to the adjustment head 151 for easy replacement.

[0029] A rotatable shaft 152 is positioned through a base 110 of the polishing station 100. The rotatable shaft 152 is rotatable relative to the base 110 about a rotation axis D. Rotation of the rotatable shaft 152 can be facilitated by a bearing 156 between the base 110 and the rotatable shaft 152, causing the arm 153 to rotate the adjusting head 151 relative to the base 110 and the polishing pad 120. In one embodiment, an actuator or motor 157 is coupled to the rotatable shaft 152 to rotate the rotatable shaft 152 and propel the arm 153 and the adjusting head 151 with a sweeping motion on the polishing surface 125 of the polishing pad 120.

[0030] The adjustment device 150 further includes a third measuring device 158 for monitoring the rotation of the rotatable shaft 152. In one embodiment, the third measuring device 158 is a rotation sensor used with the rotatable shaft 152 and / or arm 153, adapted to detect the rotational force or torque required to move the adjustment disk 154 in a sweeping motion on the polishing surface 125 of the polishing pad 120. In some exemplary embodiments, the third measuring device 158 may be a torque or other rotational force sensor coupled to the motor 157 or the output shaft of the motor 157. In other embodiments, the third measuring device 158 may be a current sensor or a pressure sensor coupled to the motor 157. The current sensor may detect changes in the current drawn by the motor 157 when the frictional force between the adjustment disk 154 and the polishing surface 125 of the polishing pad 120 changes. The pressure sensor may interface with the motor 157 to detect changes in the pressure used to actuate the motor 157 when the frictional force between the adjustment disk 154 and the polishing surface 125 of the polishing pad 120 changes. In yet other embodiments, the third measuring device 158 may be any other sensor suitable for providing a measurement of the force required to move the adjusting disc 154 on the polished surface 125 of the polishing pad 120.

[0031] An adjusting head 151 rotates the adjusting disk 154 about a rotation axis E vertically disposed through it. An actuator or motor 161 is used to rotate the adjusting disk 154 relative to the arm 153 and / or the polishing surface 125 of the polishing pad 120. In one embodiment, the motor 161 is housed in a housing 162 at the distal end of the arm 153. The adjusting disk 154 is made of a material suitable for adjusting the polishing pad 120. The adjusting disk 154 may be a brush with bristles made of a polymer material, or may include an abrasive surface comprising abrasive particles. In one embodiment, the adjusting disk 154 includes a surface containing abrasive particles, such as diamond or other relatively hard particles attached to a base substrate.

[0032] The adjustment device 150 further includes a fourth measuring device 163 for sensing the rotational force or torque required to rotate the adjustment disk 154 about the rotation axis E when the adjustment disk 154 contacts the polishing pad 120. In one embodiment, the fourth measuring device 163 may be a torque sensor for sensing the torque experienced by the adjustment head 151. In one aspect, the fourth measuring device 163 is housed within a housing 162. In one embodiment, the fourth measuring device 163 may be a current sensor coupled to the motor 161 or to an output shaft coupled between the motor 161 and the adjustment disk 154. The current sensor can detect changes in the current drawn by the motor 161 when the frictional force between the adjustment disk 154 and the polished surface 125 of the polishing pad 120 changes. In another embodiment, the fourth measuring device 163 may be a torque sensor, deflection sensor, or strain gauge positioned in the drive system between the motor and the adjustment head to measure the force on the drive system caused by friction between the adjustment disk 154 and the polished surface 125 of the polishing pad 120.

[0033] The adjusting device 150 also includes a pressure actuator 164 for advancing the adjusting disk 154 against the polishing surface 125 of the polishing pad 120. The pressure actuator 164 is configured to selectively control the force applied by the adjusting disk 154 against the polishing surface 125 of the polishing pad 120. In one embodiment, the pressure actuator 164 may be positioned between the arm 153 and the shaft 152, or in other suitable locations. In other embodiments (not shown), the arm 153 is statically coupled to the rotatable shaft 152, and the pressure actuator 164 is positioned between the distal end of the arm 153 and the adjusting head 151 to control the force applied by the adjusting disk 154 against the polishing surface 125 of the polishing pad 120.

[0034] A fifth measuring device 165 is coupled to a downforce actuator 164 and can be used to measure the downforce applied by the adjusting disc 154 against the polished surface 125 of the polishing pad 120. In one embodiment, the fifth measuring device 165 is a downforce sensor that can be positioned or coupled to the downforce actuator 164 in a line-oriented or other suitable location. This downforce sensor is used to detect stress or deformation of the downforce actuator 164 relative to a rotatable shaft 152 or other mounting position.

[0035] Each of the drive system 145, the pressure actuator 164, the motors 115, 157, and 161, and the measuring devices 138, 148, 158, 163, and 165 is coupled to one or more controllers. In some cases, motors 115, 157, and 161 may be controlled by a tool controller, while different controllers may be used to collect data from one or more sensors. In some cases, one or more controllers may relay data between each other. Generally, the controllers are used to control one or more components and processes performed in the polishing station 100. In one embodiment, the controller uses sensed data to control the rate at which material is removed from the substrate 135 during processing. The controller transmits control signals to the drive system 145, the pressure actuator 164, and the motors 115, 157, and 161, and receives signals corresponding to one or more measured process characteristics, such as temperature, acceleration, or force detected by the measuring devices 138, 148, 158, 163, and 165. The controller is typically designed to facilitate the control and automation of the polishing station 100 and usually includes a central processing unit (CPU), memory, and support circuitry (or I / O). The CPU can be any type of computer processor used in industrial environments to control various system functions, substrate movement, polishing processes, process timing, and supporting hardware (e.g., sensors, robots, motors, timing devices, etc.), and to monitor processes (e.g., chemical concentrations, processing variables, process times, I / O signals, etc.). Memory is connected to the CPU and can be one or more readily available memory types, such as random access memory (RAM), read-only memory (ROM), disks, hard disks, or any other form of digital storage device, whether local or remote. Software instructions and data can be encoded and stored in memory to instruct the CPU. Support circuitry is also connected to the CPU to support the processor in a conventional manner. Support circuitry may include caches, power supplies, clock circuits, input / output circuits, subsystems, etc. Programs or computer instructions that can be read by the controller determine which tasks can be performed on the substrate. Preferably, the program is software readable by the controller, including code that performs and monitors tasks related to the movement, support, and / or positioning of the substrate in the polishing station 100. In one embodiment, the controller is used to control the robotic device to control the strategic movement, scheduling, and operation of the polishing station 100, thereby allowing for process repeatability, resolving queuing time issues, and preventing over- or under-processing of the substrate.

[0036] Figure 2 yes Figure 1 Schematic plan view of the polishing station 100. Bearing head 130 ( Figure 1(Not shown) This is to illustrate an embodiment of the polishing sweep pattern 205 of the substrate 135 on the polishing pad 120 when the substrate 135 is held by the carrier head 130. The carrier head moves the substrate 135 linearly or in an arcuate manner on the polishing surface 125 while rotating the substrate 135 relative to the rotating polishing pad 120 to remove material from the substrate 135. An adjustment device 150 with an adjustment disk 154 is also shown to illustrate one embodiment of the adjustment sweep pattern 210 on the polishing pad 120. The adjustment disk 154 sweeps across the polishing surface 125 to adjust and / or refresh the polishing surface 125 to facilitate an increased rate of material removal from the substrate 135.

[0037] like Figure 2 As shown, during operation, polishing fluid 215 is delivered by polishing fluid applicator 155 to the polishing surface 125 of polishing pad 120. In one embodiment, platform 105 rotates at a speed of approximately 85 revolutions per minute (RPM) to approximately 100 RPM, such as approximately 93 RPM. A carrier head 130 (not shown) advances substrate 135 against the polishing surface 125 of polishing pad 120. In one embodiment, carrier head 130 rotates relative to platform 105 at a speed of approximately 80 RPM to 95 RPM, such as approximately 87 RPM. One or more pressurized bladders within carrier head 130 can apply pressure to the back of substrate 135 to advance substrate 135 toward polishing pad 120. In one embodiment, the average pressure is approximately 3.5 pounds per square inch (psi) to 5.5 psi, such as approximately 4.5 psi. In the presence of polishing fluid 215, contact with the polishing surface 125 of the rotating polishing pad 120 can remove excess metal, dielectric and / or barrier material from the substrate and planarize the surface of the substrate 135 in contact with the polishing pad 120.

[0038] Before, during, and / or after the polishing process on substrate 135, polishing pad 120 is adjusted to regenerate roughness, remove polishing byproducts and pad debris, and refresh the polished surface 125. During adjustment, adjustment head 151 is advanced against polishing pad 120 against adjustment disc 154 with a predetermined downward pressure. Adjustment disc 154 rotates relative to the polished surface 125 of polishing pad 120 while sweeping back and forth on polishing pad 120 with an adjusted sweep pattern 210.

[0039] Example waveform data encapsulation

[0040] The implementation described herein relates to a method for storing waveform data with a low data footprint, which can be encapsulated as Fast Fourier Transform (FFT) spectrogram image files. Encapsulating waveform data as FFT spectrogram image files enables large-scale FFT data collection for analysis and improved retrieval of historical data.

[0041] In some respects, using lossless image file types, such as the Portable Network Graphics Format (PNG), multiple waveform data channels or streams (e.g., up to four waveform data streams) can be encoded into each spectrogram image file. Lossless compression can be a category of data compression that allows the original data to be perfectly reconstructed from the compressed data without losing any information.

[0042] Using spectrogram image files to present large amounts of waveform data can facilitate the utilization and processing of long-term trend waveform data to detect anomalies (e.g., based on comparison of different spectrogram image files and / or using image / object detection algorithms trained with artificial intelligence (AI)).

[0043] For example, during a chemical mechanical polishing (CMP) process, multiple polishing cycle cycles may be performed. A data logging device may monitor and collect waveform data (e.g., vibration data) corresponding to at least one component of the polishing station during each polishing cycle / run. The waveform data collected for each cycle may be packaged into different spectrogram image files. By comparing the different spectrogram image files, similarities or differences in forces, vibrations, or other dynamic movements of the components at the polishing station during each cycle can be determined, and potential sources of failure in the components of the polishing station may be detected, and / or the need to modify some components (e.g., polishing pads) may be determined based on the current vibration behavior.

[0044] Specific aspects of the subject matter described in this disclosure can be implemented to achieve one or more of the following potential advantages. In some instances, the described implementations may provide a reduced or significantly smaller data storage footprint for waveform data (e.g., an 80-fold reduction in data storage). For example, large amounts of waveform data (e.g., hours of waveform data) can be packaged into spectrogram image files that are only a few kilobytes in size.

[0045] For reference Figures 3A to 7 Understand the technique proposed in this paper for encapsulating waveform data into spectrogram image files.

[0046] Figure 3A and Figure 3B The process for waveform data encapsulation and analysis is described (e.g., it can be used with...). Figure 1 and Figure 2 (The polishing station 100 is used or implemented together). The process described herein can encapsulate one or more waveform data signals / channels / streams into a single spectrogram image file (e.g., it may include up to four waveform data signals / channels / streams) for data analysis, data heuristics, and / or data metrology.

[0047] At 310, the device (e.g., a sensing device) can monitor and collect waveform data (e.g., time-based waveform data, which could be) at a certain sampling rate (e.g., a high sampling rate such as two kilohertz (kHz)) or at a certain sampling frequency. Figure 3B The accelerometer data shown in the image is 340.

[0048] Waveform data can be obtained from pairs (e.g., Figure 1 and Figure 2 The vibration and acoustic monitoring of one or more components of the polishing station 100 is derived. The sampling rate can indicate the average number of samples acquired per second (e.g., samples per second). Time-based waveform data can include waveform data corresponding to one or more waveform signals in the time domain.

[0049] The sensing device can be an accelerometer, such as a 3-axis accelerometer. A 3-axis accelerometer is a type of accelerometer capable of measuring acceleration in three orthogonal directions (or three perpendicular planes, such as the X, Y, and Z planes). Therefore, a 3-axis accelerometer can measure time-based waveform data in the X-plane, time-based waveform data in the Y-plane, and time-based waveform data in the Z-plane, respectively. In some cases, a 3-axis accelerometer can also measure root mean square (RMS) data. In another example, the device can be a sensor. In yet another example, the device can be a microphone. In still another example, the device can be a strain gauge.

[0050] The sensing device can send time-based waveform data to a processor device. In one instance, the processor device can be an external computer associated with the sensing device. In another instance, the processor device can be a localized central processing unit (CPU) coupled to or communicating with the sensing device.

[0051] At 320, the processor device may receive time-based waveform data (e.g., in all planes and / or RMS data). The processor device may process this time-based waveform data. For example, the processor device may process the time-based waveform data to convert the time-based waveform data into frequency-based waveform data. The frequency-based waveform data may include waveform data in the frequency domain (e.g., in all planes and / or RMS data).

[0052] Processor devices can use Fast Fourier Transform (FFT) to convert time-based waveform data (e.g., in all planes and / or RMS data) into frequency-based waveform data (e.g., such as...). Figure 3BThe FFT data shown in the image is 350. The FFT can be an algorithm for computing the Discrete Fourier Transform (DFT) of a sequence or its inverse IDFT. Fourier analysis transforms a waveform signal from its original domain (e.g., the time domain) to a frequency domain representation, and vice versa. The DFT is obtained by decomposing a series of values ​​into components of different frequencies.

[0053] The processor device can encapsulate (or convert) frequency-based waveform data into one or more spectrogram image files (e.g., including those containing...). Figure 3B The encapsulated spectrogram 360 shows multiple color channels. For example, a spectrogram image file can be a visual representation of the frequency spectrum of one or more waveform signals as a function of time.

[0054] In some respects, the Y-axis of a spectrogram image file can represent the amplitude of the frequency of the waveform data, while the X-axis of a spectrogram image file can represent the time when the corresponding frequency of the waveform data was captured.

[0055] In some aspects, such as Figure 3B As shown, each spectrogram image file may include two or more color channels to indicate multiple channels or streams of waveform data. For example, by using different color channels, such as a red channel (e.g., as shown in the left box of the upper column in data extraction step 370), a green channel (e.g., as shown in the left box of the middle column in data extraction step 370), a blue channel (e.g., as shown in the left box of the lower column in data extraction step 370), and / or an alpha channel (e.g., not shown in data extraction step 370), multiple FFT data streams (e.g., up to four waveform data streams) can be encapsulated into a spectrogram image file (e.g., such as a lossless image file).

[0056] In some respects, spectrogram image data (e.g., 8-bit, 10-bit, or 12-bit data) can be encoded with red, green, blue, and alpha data, which can allow multiple (e.g., ≥4x) FFT data streams / spectrums. Figure 1 Embedding is possible. For example, data measured by an accelerometer, such as time-based waveform data in the X-plane, time-based waveform data in the Y-plane, time-based waveform data in the Z-plane, and RMS data, can be encapsulated into a single spectrogram image file. Based on the image data structure of the spectrogram image file, the red channel of the spectrogram image file can represent the FFT data of the accelerometer in the X-plane, the green channel can represent the FFT data of the accelerometer in the Y-plane, the blue channel can represent the FFT data of the accelerometer in the Z-plane, and the alpha channel can represent the RMS FFT data of the accelerometer.

[0057] In some respects, spectrogram image files can be depicted as heatmaps, that is, as images where intensity is represented by variations in color or brightness, such as... Figure 3B or Figure 4 The right side of the encapsulated spectrogram 360 is schematically illustrated. For example, the magnitude of the intensity (or image bit rate) of the spectrogram image file can be set to an absolute or relative scale and represented by the color intensity of the image pixels (e.g., a single color channel or a combination of color channels).

[0058] In some respects, each spectrogram image file may include a header. This header may include information such as timestamps, metadata for various processing tools, and other details.

[0059] The processor device may transmit one or more spectrogram image files to a semiconductor tool controller (e.g., it could be...). Figure 1 and Figure 2 (part of or associated with polishing station 100 in the process).

[0060] At 330, the semiconductor tool controller can receive one or more spectrogram image files. Each spectrogram image file can represent a specific time scale (e.g., a one-minute spectrogram image file can be equal to 60 pixels in image width) and / or spectrogram data amplitude (e.g., waveform data amplitude (Y-axis)).

[0061] A semiconductor tool controller can store one or more spectrogram image files. For example, a semiconductor tool controller can store one or more spectrogram image files in a database (e.g., it could be a...). Figure 1 and Figure 2 (Part of or associated with polishing station 100 in the system) as historical telemetry data.

[0062] Semiconductor tool controllers can process and analyze one or more spectrogram image files. For example, a semiconductor tool controller can perform image analysis on one or more spectrogram image files (i.e., packaged FFT images) to monitor trends and track objects in one or more spectrogram image files.

[0063] In another example, a semiconductor tool controller can process one or more spectrogram image files to extract different color channels (e.g., red channel, green channel, blue channel, and / or alpha channel, such as...). Figure 3B The data extraction step 370 in the process is shown to identify different waveform streams with frequency anomalies and / or offsets.

[0064] In another instance, a semiconductor tool controller can process one or more spectrogram image files to perform tracking of FFT changes in wafer process control and / or changes in process consumable behavior.

[0065] Figure 4 Figure 400 depicts an acoustic spectrogram of accelerometer data, which can be represented using different color channels. A semiconductor tool controller can process the accelerometer data spectrogram to track frequency and / or vibration variations based on consumable lifespan. In some cases, the semiconductor tool controller can process the accelerometer data spectrogram to monitor the health of the accelerometer device, achieved by identifying sudden and / or gradual changes in the accelerometer device's spectrogram output. In one example, such as... Figure 4 As indicated and emphasized by the middle arrow, one or more trends in the sensed data include a gradual decrease in the amplitude of the plotted spectrogram data, which illustrates the drift of the measured properties within a processing chamber (e.g., a polishing station) over a time period.

[0066] Figure 5 Figure 500 depicts an example of an acoustic data spectrogram, which uses different color channels to represent acoustic data associated with motor noise and other environmental acoustics. A semiconductor tool controller can process the acoustic data spectrogram to detect various hardware offsets that may be detectable but not immediately apparent when directly measuring motor torque or other telemetry feedback. The ability to compare data from multiple sensors over time will allow for rapid and simple comparisons that can detect anomalies in the function of similar devices. Figure 5 As shown, the signals detected by motors 1 to 4 and processed using the techniques provided herein to form a spectrogram illustrate the performance differences between motor 4 and other motors 1 to 3. The data presented in the spectrogram will allow the user to quickly check the spectrogram (if it is being displayed) or notify the user by the controller that motor 4 may have a problem, allowing it to be inspected and / or replaced.

[0067] Figure 6 Figure 600 depicts a spectrogram of vibration data, which can use different color channels to represent one or more components (e.g., it could be with...). Figure 1 and Figure 2 The vibration data (i.e., frequency and time) associated with the components associated with polishing station 100 in the semiconductor tool controller can be processed into a spectrogram to observe different vibration modes associated with different components at different times. Figure 6 As shown, over time, the detected signals include an increasing presentation or intensity of signals collected at various frequencies, such as around 300 Hz. The data presented in the vibration data spectrogram will allow users to quickly understand whether one or more devices within the system may have problems and require inspection and / or replacement.

[0068] Figure 7This is a flowchart depicting an implementation of method 700, which involves processing and controlling a waveform signal encapsulated at a processor device (e.g., it can be used with...). Figure 1 and Figure 2 (The polishing station 100 in the middle is used or implemented together).

[0069] Method 700 begins at step 710, wherein time-based waveform data is received. The time-based waveform data may include waveform data corresponding to one or more waveform signals in the time domain. In some embodiments, the time-based data will include changes in measurement properties over time.

[0070] In one instance, time-based waveform data may include waveform data corresponding to two waveform signals in the time domain. In another instance, time-based waveform data may include waveform data corresponding to four waveform signals in the time domain.

[0071] In some respects, time-based waveform data can be received from one or more accelerometer devices. In such cases, the time-based waveform data can be associated with the sampling rate of one or more accelerometer devices.

[0072] In some respects, time-based waveform data can be received from one or more microphone devices. In such cases, the time-based waveform data can be associated with the sampling rate of one or more microphone devices.

[0073] In some respects, time-based waveform data can be received from one or more sensor devices. In such cases, the time-based waveform data can be correlated with the sampling rate of one or more sensor devices.

[0074] In one instance, time-based waveform data includes measurements of the magnitude of changes in acceleration, vibration, temperature, force, or other desired detection parameters over time.

[0075] Method 700 then proceeds to step 720, where the time-based waveform data is processed to convert it into frequency-based waveform data. The frequency-based waveform data includes waveform data in the frequency domain.

[0076] In some respects, time-based waveform data can be converted into frequency-based waveform data using the Fast Fourier Transform (FFT) algorithm.

[0077] Method 700 then proceeds to step 730, wherein at least one of frequency-based waveform data or time-based waveform data is encapsulated into one or more spectrogram image files.

[0078] In some respects, each spectrogram image file may include two or more color channels to indicate waveform data.

[0079] In some respects, each spectrogram image file can be a lossless compressed image file. The first axis of a lossless compressed image file can represent the amplitude of the frequency associated with the waveform data, and the second axis can represent the time at which the corresponding frequency was captured.

[0080] In some aspects, two or more color channels may include a first color (e.g., red) channel, a second color (e.g., green) channel, a third color (e.g., blue) channel, and / or an alpha channel. In some aspects, two or more color channels may include a cyan channel, a magenta channel, a yellow channel, and / or a black channel. In some aspects, two or more color channels may include any other color channels.

[0081] In some respects, one or more color channels in each spectrogram image file may indicate waveform data associated with the same or different axes of an accelerometer device, microphone device, strain gauge device, and / or sensor device.

[0082] In some aspects, encapsulating at least one of frequency-based waveform data or time-based waveform data into one or more spectrogram image files may include encoding one or more FFT streams corresponding to the waveform data into two or more color channels of one or more spectrogram image files.

[0083] In some aspects, each of one or more spectrogram image files may include a header indicating spectrogram timestamps, chip identification (ID), telemetry data, or other relevant metadata.

[0084] Method 700 then proceeds to step 740, wherein at least one of the following is performed: displaying or processing (e.g., analyzing) one or more spectrogram image files on a display device.

[0085] In some respects, the processor device can transmit one or more spectrogram image files to a controller (e.g., a semiconductor tool controller) for image processing / analysis (e.g., anomaly detection, signal processing, etc.).

[0086] In some respects, the processor device can set the amplitude of the color intensity of one or more spectrogram image files on an absolute scale.

[0087] In some respects, the processor device can set the amplitude of the color intensity of one or more spectrogram image files on a relative scale.

[0088] In some implementations, after performing image analysis, the controller is configured to send notification data (e.g., text messages, warning lights, etc.) to a display device (e.g., a banner on a display screen) or a user based on attributes detected in the spectrogram image file.

[0089] While the foregoing description pertains to embodiments of the present invention, other and further embodiments of the present invention may be devised without departing from its basic scope, the scope of which is defined by the foregoing claims.

[0090] The patent or application document contains at least one color drawing. Upon request and payment of the necessary fees, we will provide a color copy of the publication of this patent or patent application.

Claims

1. A method for processing and controlling a device by encapsulating a waveform signal at a processor, the method comprising: Receive time-based waveform data, wherein the time-based waveform data includes waveform data corresponding to one or more waveform signals in the time domain; The time-based waveform data is processed to convert the time-based waveform data into frequency-based waveform data, wherein the frequency-based waveform data includes the waveform data in the frequency domain. The frequency-based waveform data or the time-based waveform data are encapsulated into one or more spectrogram image files, wherein each spectrogram image file includes two or more color channels to indicate the waveform data. as well as Display one or more spectrogram image files.

2. The method of claim 1, wherein: Each spectrogram image file is a lossless compressed image file; and The first axis of the lossless compressed image file represents the amplitude of the frequency associated with the waveform data, and the second axis of the lossless compressed image file represents the time at which the corresponding frequency was captured.

3. The method of claim 1, wherein the two or more color channels include at least a first color channel, a second color channel, a third color channel, and an alpha channel.

4. The method of claim 1, wherein receiving the time-based waveform data includes receiving the time-based waveform data from at least one of: one or more accelerometer devices, one or more microphone devices, one or more strain gauge devices, or one or more sensor devices.

5. The method of claim 4, wherein the time-based waveform data is associated with a sampling rate of at least one of the following: the one or more accelerometer devices, the one or more microphone devices, or the one or more sensor devices.

6. The method of claim 4, wherein one or more color channels in each spectrogram image file indicate the waveform data associated with the same or different axes of the accelerometer device, microphone device, or sensor device.

7. The method of claim 1, wherein the processing includes converting the time-based waveform data into the frequency-based waveform data using a Fast Fourier Transform (FFT) algorithm.

8. The method of claim 7, wherein the encapsulation further comprises encoding two or more FFT streams corresponding to the waveform data into the two or more color channels of the one or more spectrogram image files.

9. The method of claim 1, further comprising transmitting the one or more spectrogram image files to a semiconductor controller for image analysis.

10. The method of claim 1, further comprising setting the amplitude of the color intensity of the one or more spectrogram image files on an absolute or relative scale.

11. The method of claim 1, wherein each of the one or more spectrogram image files includes a header indicating at least one of the following: spectrogram timestamp, chip identification (ID), or telemetry data.

12. An apparatus for waveform signal encapsulation, the apparatus comprising: Memory, the memory including instructions; and One or more processors, individually or collectively configured to execute the instructions and enable the device to: Receive time-based waveform data, wherein the time-based waveform data includes waveform data corresponding to one or more waveform signals in the time domain; The time-based waveform data is processed to convert it into frequency-based waveform data, wherein the frequency-based waveform data includes waveform data in the frequency domain. The frequency-based waveform data or the time-based waveform data are encapsulated into one or more spectrogram image files, wherein each spectrogram image file includes two or more color channels to indicate the waveform data. as well as Display one or more spectrogram image files.

13. The device as claimed in claim 12, wherein: Each spectrogram image file is a lossless compressed image file; and The first axis of the lossless compressed image file represents the amplitude of the frequency associated with the waveform data, and the second axis of the lossless compressed image file represents the time it took to capture the corresponding frequency.

14. The device of claim 12, wherein the two or more color channels include at least a first color channel, a second color channel, a third color channel, and an alpha channel.

15. The device of claim 12, wherein receiving the time-based waveform data includes receiving the time-based waveform data from at least one of: one or more accelerometer devices, one or more microphone devices, one or more strain gauge devices, or one or more sensor devices.

16. The device of claim 15, wherein the time-based waveform data is associated with a sampling rate of at least one of the following: the one or more accelerometer devices, the one or more microphone devices, or the one or more sensor devices.

17. The device of claim 16, wherein one or more color channels in each spectrogram image file indicate the waveform data associated with the same or different axes of the accelerometer device, microphone device, or sensor device.

18. The apparatus of claim 12, wherein the processing includes converting the time-based waveform data into the frequency-based waveform data using a Fast Fourier Transform (FFT) algorithm.

19. The device of claim 18, wherein the encapsulation further includes encoding one or more FFT streams corresponding to the waveform data into the two or more color channels of the one or more spectrogram image files.

20. The device of claim 12, wherein the one or more processors are individually or collectively configured to execute instructions and enable the device to transmit the one or more spectrogram image files to a semiconductor controller for image analysis.

Images