Method for manufacturing a camera and camera for a motor vehicle

CN122996649APending Publication Date: 2026-10-27ROBERT BOSCH GMBH
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Patent Information

Application Number
CN202580023573.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-03-22
Filing Date
2025-03-13
Publication Date
2026-10-27

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[0029]应理解,上述特征和下文还将说明的特征不仅能够以分别说明的组合使用,而且也能够以其他组合使用或者单独使用,而不脱离本发明的范围。

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Abstract

A method (600) for manufacturing a video camera (100), the video camera (100) comprising a lens (101) having a lens housing (102) and at least one optical lens (103), a video camera housing (111) having at least two pins (106-1, 106-2) projecting in a direction away from the lens (103), and a circuit board (107) having an imager module (108) fixed thereon, the circuit board (107) being connected with the video camera housing (111) by means of the pins (106-1, 106-2); the method having the following steps: providing (601) the video camera housing (111); fixing (602) the imager module (108) on the circuit board (107), the imager module (108) comprising an image sensor; measuring (603) an active area (201) of the image sensor fixed on the circuit board (107) by means of an image recognition method; determining (605) positions of at least two receiving openings (109-1, 109-2) to be introduced in the circuit board (107) corresponding to the pins (106-1, 106-2) of the video camera housing (111) taking into account the measured active area (201) of the image sensor; introducing (606) the at least two receiving openings (109-1, 109-2) at the determined positions in the circuit board (107); inserting (607) the pins (106-1, 106-2) of the video camera housing (111 ) into the receiving openings (109-1, 109-2) of the circuit board (107); fixing (608) the circuit board (107) on the video camera housing (111).
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Description

Technical Field

[0001] This invention relates to a method for manufacturing a camera and a camera for a motor vehicle, according to the independent claims. Background Technology

[0002] DE 10 2021 212 985 A1 discloses a method for manufacturing a camera, the method comprising the steps of: joining a circuit carrier to a metal frame at a surface of the circuit carrier carrying an image sensor to provide a circuit carrier assembly; performing optical measurements on the circuit carrier assembly to determine the position of the image sensor on the circuit carrier; inserting a lens having a lens housing into a camera housing, wherein the camera housing has a camera housing flange extending into the camera housing, the camera housing flange having a pressing element disposed on a side facing the image sensor; and fixing the lens housing to the camera housing; performing optical measurements on the lens fixed to the camera housing to determine the focal point and image plane tilt of the lens; pressing the pressing element according to the optical measurements of the circuit carrier assembly and the lens fixed to the camera housing to adjust the orientation of the lens relative to the circuit carrier assembly to be disposed on the camera housing along one coordinate axis and along two rotation axes; arranging the circuit carrier assembly on the camera housing and aligning it along two other coordinate axes and another rotation axis; and connecting the circuit carrier assembly to the camera housing. Summary of the Invention

[0003] This invention is based on a method for manufacturing a camera. The camera to be manufactured includes a lens having a lens housing and at least one optical lens, a camera housing having at least two pins protruding in a direction away from the lens, and a circuit board having an imager module fixed thereon or potentially fixed thereon. The circuit board is connected to or can be connected to the camera housing by means of the pins.

[0004] The method comprises the following steps: providing a camera housing; fixing an imager module to a circuit board, wherein the imager module includes an image sensor; measuring the effective area of ​​the image sensor fixed to the circuit board using an image recognition method; determining, taking into account the measured effective area of ​​the image sensor, the positions of at least two receiving openings to be introduced into the circuit board, corresponding to pins of the camera housing; forming the at least two receiving openings in the circuit board at the determined positions; inserting the pins of the camera housing into the receiving openings of the circuit board; and fixing the circuit board to the camera housing.

[0005] Cameras manufactured using the method described above are particularly suitable for use in motor vehicles.

[0006] The imager module can be mounted on the circuit board, especially by soldering.

[0007] In circuit board manufacturing, multiple circuit boards can be manufactured simultaneously as a panel and then separated into individual boards. Measurements of the effective area of ​​an image sensor fixed to the circuit board using image recognition methods can be performed directly before, during, or after the separation of multiple circuit boards. For example, a light source can be used to illuminate the image sensor. Specifically, the light source is matched in terms of the wavelength and direction of the light illuminating the image sensor. An image is acquired from the illuminated image sensor. Clear features of the image sensor can be obtained. The light source can be matched to the image sensor such that, for example, clear features located beneath a protective film, glass cover, etc., on the image sensor can be acquired.

[0008] The receiving opening should be understood in particular as a receiving hole. In other words, "determining and introducing the receiving opening while taking into account the effective area to be measured by the image sensor" can be understood as adaptively introducing the receiving opening. The receiving opening can, for example, be cut into the circuit board. Introducing the receiving opening in the circuit board can be combined with separating multiple circuit boards from a panel. The receiving opening can be introduced in the circuit board when separating multiple circuit boards from a panel. In such a combination, it is advantageous to also adapt the position and orientation of the outer contour of the circuit board.

[0009] The camera housing may have two or more pins. In particular, the camera housing may have two pins. Specifically, the camera housing may have four pins. Receiving openings, as many as the pins of the camera housing of the camera to be manufactured, are introduced into the circuit board. Inserting the pins of the camera housing into the receiving openings of the circuit board is particularly useful for connecting the camera housing and the circuit board.

[0010] The advantages of this invention lie particularly in the sequence of steps of the method.

[0011] If the method is designed in other ways, such as fixing the imager module to a circuit board with pre-drilled receiving openings, the lateral position of the effective area of ​​the image sensor within the camera housing may have certain tolerances along the first axis (x-direction) and the second axis (y-direction) due to a certain tolerance chain. Consequently, the concentricity of the effective area within the camera housing may not be guaranteed or ideally guaranteed, and therefore the concentricity of the subsequently aligned lens within the camera housing may not be guaranteed or ideally guaranteed. Furthermore, due to the tolerance chain, a roll angle (torsion) of the effective area of ​​the image sensor relative to a reference edge of the camera housing may also occur. In this case, factors affecting the tolerance chain include: the orientation of the effective area of ​​the image sensor relative to the imager module; the possible floating of the imager module on the solder balls when it may be soldered to the circuit board; the position of the pre-drilled receiving opening relative to the pad position; the centering of the pre-drilled receiving opening around the pin of the camera housing; and the position of the pin relative to the lens side of the camera housing.

[0012] The method presented here is advantageous in that the imager module is secured to the circuit board before at least two receiving openings are adaptively introduced into the circuit board. When the circuit board is finally secured to the camera housing, it can be nearly ideally aligned within the camera housing by means of the adaptively introduced receiving openings. Thus, the effective area of ​​the image sensor is positioned almost perfectly within the camera housing. This enables a significantly reduced tolerance chain with respect to the concentricity of the lens within the camera housing, as well as a significantly reduced tolerance chain with respect to the roll angle.

[0013] In one advantageous configuration, when measuring the effective region, the orientation of the effective region along a first axis (x-axis, the vertical direction of the image), the orientation of the effective region along a second axis (y-axis, the horizontal direction of the image), and the rotation angle of the effective region about a third axis (y-axis) are determined. In other words, the rotation angle of the effective region involves the twist of the effective region relative to a reference edge of the circuit board. The rotation angle is formed by the reference edge of the circuit board and one edge of the effective region.

[0014] The advantage of this configuration is that the measurement results obtained in this way allow for precise determination of the location of the receiving opening in the circuit board to be introduced, resulting in a camera with particularly good concentricity and a particularly small roll angle.

[0015] In one advantageous configuration, the method includes the additional step of determining the positions of at least two pins relative to at least one edge of the camera housing using an image recognition method. Here, the determined positions of the at least two pins are considered when determining the location of the receiving opening in the circuit board.

[0016] For example, the positions of the at least two pins can be determined by clamping the camera housing against a reference surface and measuring the positions of the at least two pins relative to reference marks on the reference surface in a single image using an image recognition method. For measurement, the camera housing can be illuminated with a light source. Here, the light source is matched, particularly in terms of the wavelength and direction of the light illuminating the camera housing. An image is acquired from the illuminated camera housing. Features of the camera housing can then be obtained. The light source can be matched to the camera housing in such a way that clear features of the camera housing can be acquired. The positions of the pins can be deduced from the centers of the identified pins.

[0017] This step is particularly advantageous when the circuit board has already been matched to the specific camera housing during the camera manufacturing process. The advantage of this configuration is that, in the tolerance chain, the position of the pin relative to the lens side of the camera housing, as a potential source of error, can be eliminated or significantly reduced. This allows the manufactured camera to achieve further significant improvements in concentricity and further reductions in roll angle.

[0018] In one advantageous configuration, a rectangle spanned by the at least two pins is determined in the plane containing the pins. Here, the orientation of the rectangle along a first axis (x-axis), its orientation along a second axis (y-axis), and the rotation angle of the rectangle about a third axis (z-axis) are determined. In other words, the rotation angle of the rectangle involves the twist of the rectangle relative to a reference edge of the camera housing. This rotation angle is formed by the reference edge of the camera housing and one edge of the rectangle.

[0019] The advantage of this configuration is that the measurements obtained in this way can further and better determine the location of the receiving opening to be introduced into the circuit board, so that the manufactured camera has further improved concentricity and further reduced roll angle.

[0020] In one advantageous configuration, the at least two receiving openings are introduced into the circuit board by laser cutting.

[0021] The advantage of this configuration is that it allows for very precise positioning of the receiving opening and very precise adjustment of its diameter. For example, the cutting process can be accurate to approximately 150 μm. In some cases, the accuracy can be even higher. This, in turn, results in improved concentricity and a smaller roll angle for the camera being manufactured.

[0022] In one advantageous configuration, the circuit board is fixed to the camera housing by either a press-fit or soldering process. With a press-fit, the circuit board can be aligned with and advantageously positioned near-ideally relative to a pin in the camera housing via an adaptively introduced receiving opening. With a soldering process, the adaptively introduced receiving opening for the solder joint can be advantageously constructed to be as small as possible. This makes the design of the solder joint more robust.

[0023] In one advantageous configuration, the method includes the additional steps of: inserting the lens into the camera housing; optically aligning the lens relative to the image sensor; and securing the lens in the camera housing.

[0024] Therefore, it is advantageous to manufacture cameras with very good optical properties, especially with very good concentricity and very small roll angle.

[0025] The present invention also takes as a starting point a camera for a motor vehicle. Here, the camera includes a lens having a lens housing and at least one optical lens; a camera housing having at least two pins projecting away from the lens; and a circuit board having an imager module fixed thereon, wherein the imager module includes an image sensor, wherein the circuit board is connected to the camera housing by means of the pins, wherein the pins are inserted into at least two receiving openings in the circuit board; and wherein the receiving openings in the circuit board are positioned to correspond to the effective area of ​​the image sensor.

[0026] In particular, a camera manufactured using the above method is proposed here.

[0027] The camera may also have a housing cover. The housing cover may be attached to the camera housing on the side facing away from the lens. This connection between the camera housing and the housing cover protects the camera from intrusion by media from the surrounding environment. The camera housing and housing cover may be connected by a material-locking or shape-locking mechanism.

[0028] The camera described herein may also include an electrical plug configured to electrically connect to the circuit board. The circuit board is particularly configured to carry an image sensor. The circuit board may also carry other components, such as the camera's plug and other electronic components.

[0029] It should be understood that the above features and the features described below can be used not only in the combinations described separately, but also in other combinations or individually, without departing from the scope of the invention. Attached Figure Description

[0030] Embodiments of the present invention will be further described below with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or equivalent elements. In the drawings: Figure 1 An embodiment of the camera is shown; Figure 2 An example is shown for measuring the effective area of ​​an image sensor; Figure 3 An example is shown for determining the positions of at least two pins on a camera housing; Figure 4 An exemplary circuit board is shown, in which two receiving openings have been incorporated; Figure 5 A top view of the camera to be manufactured is shown, in which the pins of the camera housing are inserted into the receiving opening of the circuit board; Figure 6 An embodiment of a method for manufacturing a camera is shown. Detailed Implementation

[0031] Figure 1 An exemplary camera 100 for a motor vehicle is shown. The camera 100 includes a lens 101, which in turn has a lens housing 102 and at least one optical lens 103. The camera 100 also includes a camera housing 111 having at least two pins 106-1 and 106-2 projecting away from the lens 103. Furthermore, the camera 100 includes a circuit board 107 having an imager module 108 fixed thereto, wherein the imager module includes an image sensor, and the circuit board 107 is connected to the camera housing 111 by means of the pins 106-1 and 106-2. For this purpose, the pins are inserted into at least two receiving openings 109-1 and 109-2 of the circuit board 107.

[0032] In the embodiment shown here, the lens 101 is inserted into the camera housing 111 and optically aligned with respect to the image sensor. Furthermore, the lens 101 is fixed within the camera housing 111. For this purpose, an adhesive portion 105 may be constructed, for example.

[0033] If, in the method of manufacturing camera 100, the imager module 108 is fixed to a circuit board 107 having pre-drilled receiving openings 109-1 and 109-2, the lateral position of the effective area of ​​the image sensor in the camera housing 111 may have certain tolerances along the first axis (x-axis) and along the second axis (y-axis). Therefore, the concentricity of the lens 101, indicated by line 110, in the camera housing 111 may not be guaranteed or ideally guaranteed. Furthermore, a roll angle (torsion) of the effective area of ​​the image sensor relative to the reference edge of the camera housing 111 may also occur.

[0034] To significantly reduce the tolerance chain of concentricity of lens 101 within camera housing 111 and the tolerance chain of roll angle, the method proposed herein can be adopted. Figure 6 The method 600 for manufacturing a camera 100 is schematically illustrated herein. Figures 2 to 5 The various method steps of method 600 are shown more clearly. In the camera 100 manufactured using method 600, in particular, the positions of the receiving openings 109-1 and 109-2 in the circuit board 107 are adapted to the effective area of ​​the image sensor.

[0035] In method 600, a camera housing 101 is provided in the first step 601. In step 602, an imager module 108 is fixed to a circuit board 107. Here, the imager module 108 includes an image sensor. In step 603, the effective area of ​​the image sensor fixed to the circuit board 107 is measured using an image recognition method. Subsequently, in step 605, taking into account the measured effective area of ​​the image sensor, the positions of at least two receiving openings 109-1 and 109-2 to be introduced into the circuit board 107, corresponding to the pins 106-1 and 106-2 of the camera housing 111, are determined. In other words, the ideal positions of the at least two receiving openings 109-1 and 109-2 are calculated taking into account the measurement data of the effective area of ​​the image sensor. The positions of the at least two receiving openings 109-1 and 109-2 in the circuit board 107 can be advantageously adapted to the effective area of ​​the image sensor. In the next step 606, the at least two receiving openings 109-1 and 109-2 are introduced into the circuit board 107 at previously determined locations. Therefore, the positions of the at least two receiving openings 109-1 and 109-2 in the circuit board 107 are advantageously adapted to the effective area of ​​the image sensor. Subsequently, in step 607, pins 106-1 and 106-2 of the camera housing 111 are inserted into the corresponding receiving openings 109-1 and 109-2 in the circuit board 107. In step 608, the circuit board 107 is secured to the camera housing 111. This securing 608 can be performed, for example, by riveting or welding.

[0036] Alternatively, method 600 may include the following additional steps: inserting lens 101 into camera housing 111; optically aligning lens 101 relative to image sensor 610; and fixing lens 101 611 in camera housing 111.

[0037] Figure 2Step 603 describes the measurement of the effective region 201 of the image sensor. The figure exemplarily illustrates how to determine the orientation 202 of the effective region 201 along a first axis (y-axis), the orientation 203 of the effective region 201 along a second axis (y-axis), and the rotation angle 204 of the effective region 201 about a third axis (z-axis). In other words, the rotation angle 204 of the effective region 201 involves the twisting of the effective region 201 relative to the reference edge of the circuit board 107, indicated by arrow 205. The rotation angle 204 is formed by the reference edge 205 of the circuit board 107 and an edge of the effective region 201, indicated by arrow 206.

[0038] Figure 3 An example of step 604 for determining the positions of at least two pins 106-1 and 106-2 of camera housing 111 is shown. Method 600 may optionally include this step 604. Here, the positions of the at least two pins 106-1 and 106-2 relative to at least one housing edge of camera housing 111, indicated by arrow 304, are determined using an image recognition method. In this case, the determined positions of the at least two pins 106-1 and 106-2 are taken into account when determining the positions of receiving openings 109-1 and 109-2 in circuit board 107 605.

[0039] In the embodiment of step 604 shown here, a rectangle 305 formed by the at least two pins 106-1 and 106-2 is determined in the plane containing the at least two pins 106-1 and 106-2. The orientation 301 of the rectangle 305 along the first axis (x-axis), the orientation 302 of the rectangle 305 along the second axis (y-axis), and the rotation angle 303 of the rectangle 305 about the third axis (z-axis) are determined. In other words, the rotation angle 303 of the rectangle 305 relates to the twist of the rectangle 305 relative to the reference edge indicated by arrow 304 of the camera housing 111. The rotation angle 303 is formed by the reference edge 304 of the camera housing 111 and one edge of the rectangle 305 indicated by arrow 306.

[0040] Figure 4 The circuit board 111 after step 606 is shown exemplarily, in which two receiving openings 109-1 and 109-2 have been introduced. The positions of receiving openings 109-1 and 109-2 were previously determined in step 605. For this purpose, the measurement results of the effective area 201 obtained according to step 603 are taken into account. Alternatively, when determining (605) the positions of receiving openings 109-1 and 109-2, the positions of at least two pins 106-1 and 106-2 of the camera housing 111, as determined in step 604, may also be taken into account. Accordingly, the rectangle 305 from the previously optionally performed step 604 is still shown schematically. The introduction 606 of the at least two receiving openings 109-1 and 109-2 can be performed, for example, by laser cutting.

[0041] Figure 5 A top view of the camera 100 to be manufactured is shown, wherein pins 106-1 and 106-2 of the camera housing 111 are inserted into receiving openings 109-1 and 109-2 of the circuit board 107. In this view, pins 106-1 and 106-2 and receiving openings 109-1 and 109-2 are not actually visible and are therefore shown only schematically. The rectangle 305 from the previously optionally performed step 604 is also shown schematically.

Claims

1. A method (600) for manufacturing a camera (100), wherein, The camera (100) includes: a lens (101) having a lens housing (102) and at least one optical lens (103), a camera housing (111) having at least two pins (106-1, 106-2) protruding away from the lens (103), and a circuit board (107) having an imager module (108) fixed thereon, wherein the circuit board (107) is connected to the camera housing (111) by means of the pins (106-1, 106-2); wherein the method includes the following steps: Provide (601) the camera housing (111); The imager module (108) is fixed (602) on the circuit board (107), wherein the imager module (108) includes an image sensor; The effective area (201) of the image sensor fixed on the circuit board (107) is measured (603) by means of an image recognition method. Taking into account the measured effective area (201) of the image sensor, determine (605) the positions of at least two receiving openings (109-1, 109-2) to be introduced into the circuit board (107) and corresponding to the pins (106-1, 106-2) of the camera housing (111); At the determined location, introduce (606) the at least two receiving openings (109-1, 109-2) into the circuit board (107). Insert the pins (106-1, 106-2) of the camera housing (111) into the receiving openings (109-1, 109-2) in the circuit board (107) (607); and The circuit board (107) is fixed (608) on the camera housing (111).

2. The method (600) according to claim 1, wherein, When measuring the effective region (201) (603), the orientation (202) of the effective region (201) along the first axis (x), the orientation of the effective region (201) along the second axis (y), and the rotation angle (204) of the effective region (201) around the third axis (z) are determined.

3. The method (600) according to claim 1 or 2, further comprising the step of: determining (604) the position of the at least two pins (106-1, 106-2) relative to at least one housing edge (304) of the camera housing (111) by means of an image recognition method; and wherein, When determining the location of the receiving openings (109-1, 109-2) in the circuit board (107) of (605), the desired locations of the at least two pins (106-1, 106-2) are taken into consideration.

4. The method (600) according to claim 3, wherein, In the plane containing the at least two pins (106-1, 106-2), a rectangle (305) formed by the at least two pins (106-1, 106-2) is determined; and wherein, the orientation (301) of the rectangle (305) along the first axis (x), the orientation (302) of the rectangle (305) along the second axis (y), and the rotation angle (303) of the rectangle (305) about the third axis (z) are determined.

5. The method (600) according to any one of the preceding claims, wherein, The at least two receiving openings (109-1, 109-2) are introduced into the circuit board (107) by laser cutting (606).

6. The method (600) according to any one of the preceding claims, wherein, The circuit board (107) is fixed to the camera housing (111) by riveting or welding (608).

7. The method (600) according to any one of the preceding claims, wherein, The method (600) has the following additional steps: Insert the lens (101) into the camera housing (111) (609); Optically align the lens (101) with respect to the image sensor (610); and The lens (101) is fixed (611) in the camera housing (111).

8. A camera (100) for a motor vehicle, comprising: A lens (101) having a lens housing (102) and at least one optical lens (103). A camera housing (111) having at least two pins (106-1, 106-2) protruding in a direction away from the lens (103); and A circuit board (107) having an imager module (108) fixed thereon, wherein the imager module (108) includes an image sensor, wherein the circuit board (107) is connected to the camera housing (111) by means of pins (106-1, 106-2), wherein the pins (106-1, 106-2) are inserted into at least two receiving openings (109-1, 109-2) of the circuit board (107); and The positions of the receiving openings (109-1, 109-2) in the circuit board (107) are adapted to the effective area (201) of the image sensor.

Citation Information

Patent Citations

  • Method for manufacturing a camera and camera

    DE102021212985A1