imaging device

Abstract

An imaging device according to one embodiment of the present disclosure includes a substrate having a first surface and a second surface on an opposite side of the first surface, and an electronic component disposed on the first surface, wherein the substrate has a first heat transfer path portion intersecting the first surface, a second heat transfer path portion intersecting the second surface, and a third heat transfer path portion intersecting the first heat transfer path portion and the second heat transfer path portion.

Description

Technical Field

[0001] This disclosure relates to imaging apparatus. Background Technology

[0002] Typically, imaging devices such as automotive cameras include a substrate on which electronic components, such as imaging elements, are mounted. These electronic components are, for example, heat-generating components. Due to higher functionality, higher power, higher integration, etc., the heat generated by these electronic components tends to increase. For this reason, the heat density of the electronic components increases, which can lead to thermal problems in the imaging device. Therefore, in order to dissipate heat from the electronic components, for example, through-holes are provided directly beneath the electronic components (see, for example, Patent Document 1).

[0003] Reference List

[0004] Patent documents

[0005] [PTL 1] Japanese Patent Application Publication No. 2010-263138 Summary of the Invention

[0006] Technical issues

[0007] However, due to layout constraints of components, wiring, etc., there are situations where vias cannot be placed directly below electronic components, and it is difficult to place vias in suitable locations. For this reason, heat dissipation from electronic components becomes difficult, and the temperature of electronic components rises.

[0008] Therefore, this disclosure provides an imaging device capable of suppressing the temperature rise of electronic components.

[0009] Solution to the problem

[0010] An imaging apparatus according to one aspect of the present disclosure includes: a substrate including a first surface and a second surface located opposite to the first surface; and an electronic component disposed on the first surface, wherein the substrate has: a first heat transfer path portion intersecting the first surface; a second heat transfer path portion intersecting the second surface; and a third heat transfer path portion intersecting the first heat transfer path portion and the second heat transfer path portion. Attached Figure Description

[0011] Figure 1 This is an exploded perspective view showing an example configuration of an imaging apparatus according to an embodiment of the present disclosure.

[0012] Figure 2 This is a cross-sectional view illustrating an example configuration of an imaging apparatus according to an embodiment of the present disclosure.

[0013] Figure 3 This is a plan view showing the front side of the front substrate according to an embodiment of the present disclosure.

[0014] Figure 4 This is a plan view showing the back side of the front substrate according to an embodiment of the present disclosure.

[0015] Figure 5 This is a plan view showing the assembled state of the lens unit, front substrate, sealing member and substrate spacer according to an embodiment of the present disclosure.

[0016] Figure 6 This is a plan view showing the assembled state of the lens unit, front substrate, sealing member, substrate spacer and rear substrate according to an embodiment of the present disclosure.

[0017] Figure 7 This is a cross-sectional view showing the heat transfer path portion of the front substrate according to an embodiment of the present disclosure.

[0018] Figure 8 This is a plan view showing the heat transfer path portion of the fifth layer of the front substrate according to an embodiment of the present disclosure.

[0019] Figure 9 This is a cross-sectional view showing an example configuration of the front substrate of a modified embodiment 1 according to the present disclosure.

[0020] Figure 10 This is a cross-sectional view showing an example configuration of the front substrate according to a modified embodiment 2 of the present disclosure.

[0021] Figure 11 This is a cross-sectional view showing an example configuration of the front substrate of a variation 3 according to the present disclosure.

[0022] Figure 12 This is a block diagram illustrating a schematic configuration example of a vehicle control system.

[0023] Figure 13 This is an explanatory diagram showing an example of the installation location of the vehicle exterior information detection unit and the imaging unit. Detailed Implementation

[0024] Embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The embodiments also include examples and variations. Note that the apparatus, methods, systems, etc., according to the present disclosure are not limited to the embodiments. In the embodiments, substantially the same components are indicated by the same reference numerals, and repeated descriptions will be omitted.

[0025] This disclosure will be described in the following order of items.

[0026] 1. Example

[0027] 1-1. Example of Imaging Device Configuration

[0028] 1-2. Example of front substrate configuration

[0029] 1-3. Example of the assembly process of the imaging device

[0030] 1-4. Example of the configuration of the heat transfer path section of the front substrate

[0031] 1-5. Examples of deformation of the front substrate

[0032] 1-5-1. Variation Example 1

[0033] 1-5-2. Variation Example 2

[0034] 1-5-3. Variation Example 3

[0035] 1-6. Functions and Effects

[0036] 2. Other embodiments

[0037] 3. Application Examples

[0038] 4. Supplementary Explanation

[0039] <1. Example>

[0040] <1-1. Example of Imaging Device Configuration>

[0041] Reference Figure 1 and Figure 2 A configuration example of the imaging apparatus 1 according to this embodiment is described. Figure 1 This is an exploded perspective view showing an example configuration of the imaging apparatus 1 according to this embodiment. Figure 2 This is a cross-sectional view showing an example configuration of the imaging apparatus 1 according to this embodiment.

[0042] like Figure 1 and Figure 2 As shown, the imaging device 1 according to this embodiment includes a lens unit 10, a front substrate 20, a sealing member 30, a substrate spacer 40, a rear substrate 50, a plurality of heat dissipation members 60A and 60B, a connector unit 70, and a plurality of bonding members 80A and 80B.

[0043] The lens unit 10 has a lens barrel portion 11 and a retainer 12. The lens barrel portion 11 houses a plurality of lenses. Each lens may be, for example, a biconvex lens, a plano-convex lens, a biconcave lens, a plano-concave lens, a meniscus lens, etc. The retainer 12 holds the lens barrel portion 11. The retainer 12, for example, holds an end of the lens barrel portion 11. The end of the lens barrel portion 11 is fixed in close contact with the retainer 12. The retainer 12 may be, for example, a metal retainer, such as a retainer made of die-cast aluminum. Note that although the lens barrel portion 11 and the retainer 12 are formed as separate bodies, they may, for example, be formed integrally.

[0044] The front substrate 20 has an imaging element 21 and a connector 22 (see Figure 2 The front substrate 20 includes a front side 20A and a back side 20B (see...). Figure 2 The back surface 20B is the surface opposite to the front surface 20A, facing the front surface 20A. The imaging element 21 is disposed on the front surface 20A, and the connector 22 is disposed on the back surface 20B. Note that electronic components other than the imaging element 21 and the connector 22 (such as chips, resistors, and capacitors) can be mounted on either the front surface 20A or the back surface 20B. The front surface 20A serves as the first surface, and the back surface 20B serves as the second surface.

[0045] The front substrate 20 may be a printed circuit board, for example. The imaging element 21 may be a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, a CCD (Charge-Coupled Device) image sensor, or the like. The connector 51 may be a board-to-board connector, for example.

[0046] In this front substrate 20, the lens unit 10 is arranged to cover the imaging element 21. The lens unit 10 and the front substrate 20 form an internal space 10A for accommodating the imaging element 21 (see...). Figure 2 For example, the end of the retainer 12 of the lens unit 10 on the front substrate 20 side is fixed to the front surface 20A of the front substrate 20 by an adhesive. Thus, the end of the retainer 12 on the front substrate 20 side is in close contact with the front surface 20A of the front substrate 20. A through hole 20a is formed in the front substrate 20 (see...). Figure 2 The through-hole 20a connects the internal space 10A, which serves as a sealing space, and the external space of the internal space 10A.

[0047] However, foreign objects (e.g., tens of μm) intruding into the internal space 10A can cause defects such as reflection and glare on the imaging element 21. For this reason, a foreign object intrusion prevention structure is provided on the back surface 20B of the front substrate 20 at the through-hole 20a. As a foreign object intrusion prevention structure, for example, a breathable filter 23 is used (see...). Figure 2 The filter 23 is formed, for example, of a sealing material. The filter 23 is attached to the back surface 20B of the front substrate 20 to block the through hole 20a.

[0048] The sealing member 30 is a component that maintains airtightness and liquid tightness. The sealing member 30 is disposed between the lens unit 10 and the connector unit 70. For example, the sealing member 30 is formed in an annular shape. This sealing member 30 is, for example, disposed in a groove 10a formed in the lens unit 10 (see...). Figure 2It is located within the lens unit 10 and the connector unit 70, and is in close contact with them. A sealing gasket is used, for example, as a sealing member 30.

[0049] The substrate spacer 40 is a component that ensures the space (e.g., separation distance) between the front substrate 20 and the rear substrate 50. For example, the substrate spacer 40 is formed in an annular shape. For example, the substrate spacer 40 is formed of a heat-dissipating resin material. For example, the substrate spacer 40 contacts the back surface 20B of the front substrate 20 and serves as a heat dissipation component for dissipating heat from the front substrate 20.

[0050] The rear substrate 50 has connectors 51 and 52 (see...) Figure 2 The rear substrate 50 includes a front side 50A and a back side 50B (see...). Figure 2 The back surface 50B is the surface opposite to the front surface 50A and faces the front surface 50A. Connector 51 is disposed on the front surface 50A, and connector 52 is disposed on the back surface 50B. For example, the rear substrate 50 contacts the substrate spacer 40 and serves as a heat dissipation member for heat dissipation from the substrate spacer 40. Note that electronic components (such as chips, resistors, and capacitors) other than connectors 51 and 52 can be mounted on either the front surface 50A or the back surface 50B of the rear substrate 50.

[0051] As the back substrate 50, a printed circuit board is used, for example. As the connector 51, a board-to-board connector is used, for example. As the connector 52, a PCB (printed circuit board) connector is used, for example.

[0052] Each heat dissipation component 60A and 60B is a component that dissipates heat from the rear substrate 50, etc. Each of these heat dissipation components 60A and 60B is disposed on the rear substrate 50 so as to contact the connector unit 70. As heat dissipation components 60A and 60B, for example, heat sinks, heat fins, etc. are used. As heat sinks, for example, metal plates such as heat spreaders are used.

[0053] The connector unit 70 has a housing 71 and a connector section 72. The housing 71 is a component that houses the front substrate 20, substrate spacers 40, rear substrate 50, and each heat dissipation component 60A and 60B, etc. The housing 71 may be a metal housing, such as one made of die-cast aluminum. The connector section 72 is a component that enables connection between the imaging device 1 and an external device. For example, when the imaging device 1 is connected to an external device via the connector section 72, the imaging element 21 is electrically connected to the external device.

[0054] Each of the joining members 80A and 80B (see Figure 1The lens unit 10 and the connector unit 70 are joined together via the sealing member 30 and the joining members 80A and 80B. Each of the joining members 80A and 80B is, for example, made of screw.

[0055] <1-2. Example of front substrate configuration>

[0056] Reference Figure 3 and Figure 4 A configuration example of the front substrate 20 according to this embodiment is described. Figure 3 This is a plan view showing the front side 20A of the front substrate 20 according to this embodiment. Figure 4 This is a plan view showing the back surface 20B of the front substrate 20 according to this embodiment.

[0057] like Figure 3 and Figure 4 As shown, an annular adhesive region B1 is provided on the front surface 20A of the front substrate 20 to surround the imaging element 21. The adhesive region B1 is an area where adhesive is applied to bond the lens unit 10 (e.g., the end of the retainer 12 on the front substrate 20 side) and the front substrate 20. As the adhesive, for example, a photocurable adhesive, a thermocurable adhesive, or a hybrid (photocurable and thermocurable) adhesive is used.

[0058] A predetermined region A1 is disposed within the annular adhesive region B1. The predetermined region A1 is located around and near the imaging element 21. A through-hole 20a is formed in this predetermined region A1. Note that the predetermined region A1 exists on each of the front side 20A and the back side 20B.

[0059] Multiple predetermined regions A2 are disposed outside the annular adhesive region B1. Each predetermined region A2 is formed in the outer peripheral region of the front substrate 20. Each predetermined region A2 is disposed facing each other, with the imaging element 21 located between them. Multiple through holes 20b are formed in each predetermined region A2. The number of through holes in each predetermined region A2 is greater than the number of through holes in the predetermined region A1. Note that each predetermined region A2 exists on each of the front side 20A and the back side 20B.

[0060] Through holes 20a and 20b are provided in a manner that avoids the bonding area B1. Through hole 20a serves to regulate the air pressure in the internal space 10A formed by the lens unit 10 and the front substrate 20. In addition, through holes 20a and each through hole 20b serve as heat transfer paths. Details of these heat transfer paths will be described later.

[0061] Note that although there is one through-hole 20a in the predetermined area A1, there may be multiple through-holes 20b, and although there may be multiple through-holes 20b for each predetermined area A2, there may be only one. However, in order to prevent foreign objects from entering the internal space 10A, it is desirable to reduce the number of through-holes 20a leading to the internal space 10A to as few as possible.

[0062] <1-3. Example of the assembly process of the imaging device>

[0063] Reference Figure 1 , Figure 2 , Figure 5 and Figure 6 An example of the assembly process of the imaging apparatus 1 according to this embodiment is described. Figure 5 This is a plan view showing the assembled state of the lens unit 10, the front substrate 20, the sealing member 30, and the substrate spacer 40 according to this embodiment. Figure 6 This is a plan view showing the assembled state of the lens unit 10, front substrate 20, sealing member 30, substrate spacer 40 and rear substrate 50 according to this embodiment.

[0064] like Figure 1 and Figure 2 As shown, first, after positioning (alignment) between the lens unit 10 and the imaging element 21, the lens unit 10 and the front substrate 20 are bonded and fixed using adhesive. For example, the sealing member 30 is inserted into the groove 10a of the lens unit 10, and the front substrate 20 is fixed to the lens unit 10 (see [link to documentation]). Figure 5 ).

[0065] In the alignment step, the optical axes of each lens and imaging element 21 in the lens barrel 11 of the lens unit 10 are aligned, and the positional relationship between each lens and imaging element 21 is determined. For example, alignment can be performed using a 6-axis alignment method based on the MTF (modulation transfer function) measurement method. The MTF measurement method is defined in ISO 12233 (International Organization for Standardization).

[0066] In the fixing step, the lens unit 10 and the front substrate 20 are placed in, for example, a thermosetting oven to cure the adhesive. At this time, since the through-hole 20a connects the internal space 10A of the lens unit 10 and the front substrate 20 to the external space, the pressure increase in the internal space 10A during adhesive curing is released to the outside, and the pressure in the internal space 10A is equalized with the external pressure. Therefore, since the generation of bubbles or the like in the adhesive can be suppressed, the displacement of the positional relationship between each lens and the imaging element 21 in the lens barrel 11 can be suppressed.

[0067] Next, the substrate spacer 40 is arranged to overlap with the front substrate 20 fixed to the lens unit 10 (see [link]). Figure 5Then, the rear substrate 50 is arranged to overlap with the substrate spacer 40 that overlaps the front substrate 20 (see...). Figure 6 At this time, the connector 51 on the front side 50A of the rear substrate 50 is connected to the connector 22 on the back side 20B of the front substrate 20.

[0068] Subsequently, the heat dissipation components 60A and 60B are arranged on the back surface 50B of the rear substrate 50, which overlaps the substrate spacer 40. Then, the connector unit 70 is combined with the lens unit 10 via the sealing member 30. At this time, the connector portion 72 of the connector unit 70 is connected to the connector 52 on the back surface 50B of the rear substrate 50. Finally, the combined lens unit 10 and connector unit 70 are joined by their respective joining members 80A and 80B.

[0069] Note that the substrate spacer 40 is shaped to contact only the outer peripheral region of the back surface 20B of the front substrate 20 and the outer peripheral region of the front surface 50A of the rear substrate 50 (see [reference]). Figure 2 Specifically, the substrate spacer 40 and each predetermined region A2 of the back surface 20B of the front substrate 20 (see...) Figure 4 (i.e., the outer peripheral region of each through hole 20b including the back side 20B) is in surface contact, and is also formed to be in surface contact with the outer peripheral region of the front side 50A of the rear substrate 50.

[0070] Additionally, the substrate spacer 40 is shaped to be as close as possible to the inner peripheral surface of the housing 71 of the connector unit 70, or to be shaped to contact the inner peripheral surface of the housing 71, so that heat can be easily transferred to the housing 71 (see [link]). Figure 2 ).

[0071] <1-4. Example of the configuration of the heat transfer path section of the front substrate>

[0072] Reference Figure 7 and Figure 8 An example configuration of the plurality of heat transfer path portions 91, 92a, 92b and 93a to 93d of the front substrate 20 according to this embodiment is described. Figure 7 This is a cross-sectional view showing each of the heat transfer path portions 91, 92a, 92b and 93a to 93d of the front substrate 20 according to this embodiment. Figure 8 This is a plan view showing each of the heat transfer path portions 91, 92a, 92b, 93c and 93d of the fifth layer of the front substrate 20 according to this embodiment.

[0073] like Figure 7 As shown, the front substrate 20 has multiple conductor layers (electrical conductor layers) C1 to C6. Figure 7 The example shows six conductor layers C1 to C6. There is no particular limitation on the number of conductor layers (conductive layers).

[0074] Imaging element 21 is attached to, for example, the front surface 20A of front substrate 20 via a BGA (ball grid array) (i.e., a plurality of solder balls 21a). Each solder ball 21a is a spherical solder. These solder balls 21a are arranged in a grid pattern on the bottom surface of imaging element 21 (the surface on the side of front substrate 20).

[0075] The lens unit 10 is disposed on the front surface 20A of the front substrate 20 to cover the imaging element 21 fixed to the front substrate 20. At this time, the end of the retainer 12 of the lens unit 10 on the front substrate 20 side is bonded and fixed to the front surface 20A of the front substrate 20 by means of the annular adhesive portion (adhesive) 12a.

[0076] The through-hole 20a serves to transfer heat from the imaging element 21, which is a heat-generating component, to the back side 20B of the front substrate 20 and to each of the conductor layers C1 to C6. This through-hole 20a functions as a heat transfer path (first heat transfer path) 91. That is, the heat transfer path 91, for example, is formed by the through-hole 20a, extends from the front side 20A of the front substrate 20 to the back side 20B, and intersects with both the front side 20A and the back side 20B.

[0077] Each through-hole 20b serves to transfer heat diffused from the imaging element 21 through the through-hole 20a and the conductor layers C1 to C6 of the front substrate 20 in the direction of the surface of the front substrate 20 along the direction of the back surface 20B of the front substrate 20. Each through-hole 20b serves as a heat transfer path (second heat transfer path) 92a, 92b. That is, each of the heat transfer paths 92a and 92b is formed, for example, by the through-hole 20b, extending from the front surface 20A of the front substrate 20 to the back surface 20B, and intersecting with both the front surface 20A and the back surface 20B. The heat transfer paths 92a and 92b are in contact with the substrate spacer 40, which serves as a heat dissipation member.

[0078] In conductor layers C1 to C6, for example, conductor layer C2 in the second layer has multiple heat transfer path portions (third heat transfer path portions) 93a and 93b, and conductor layer C5 in the fifth layer has multiple heat transfer path portions (third heat transfer path portions) 93c and 93d. Each of these heat transfer path portions 93a to 93d extends parallel (or substantially parallel) to the front surface 20A of the front substrate 20. Each heat transfer path portion 93a, 93c intersects with and connects heat transfer path portions 91 and 92a. Each heat transfer path portion 93b, 93d intersects with and connects heat transfer path portions 91 and 92b. Each of the heat transfer path portions 93a to 93d is formed, for example, by a metal foil (e.g., copper foil) for wiring or grounding.

[0079] Each conductor layer C1 to C6 has a plurality of signal lines 94a to 94f. The signal lines 94a to 94f are connected to each other to form a single signal line. These signal lines 94a to 94f are used as a signal line, for example, to connect to the imaging element 21. Each signal line 94a to 94f is formed, for example, by a metal foil (e.g., copper foil), via, etc., for wiring.

[0080] Here, as Figure 8 As shown, for example, in the fifth conductor layer C5, heat transfer path portions 93c and 93d are formed to avoid contact with each signal line 94d to 94f, that is, they do not contact each signal line 94d to 94f. Specifically, each of the heat transfer path portions 93a to 93d is formed to not contact each signal line 94a to 94f. Furthermore, each of the heat transfer path portions 91, 92a, and 92b (each through-hole 20a, 20b) is also formed to not contact each signal line 94a to 94f. Thus, the heat transfer path extending from the front side 20A to the back side 20B is formed to not contact each signal line 94a to 94f.

[0081] According to the front substrate 20 having such a configuration, such as Figure 7 As shown, heat from the imaging element 21, which is a heat-generating component, is transferred along the back surface 20B of the front substrate 20 via heat transfer path 91 (through hole 20a) and to each heat transfer path 93a to 93d (metal foil). Heat that diffuses from the imaging element 21 in the surface direction of the front substrate 20 through heat transfer path 91 and each heat transfer path 93a to 93d is transferred along the back surface 20B of the front substrate 20 via each heat transfer path 92a and 92b (each through hole 20b). Then, the heat transferred to the back surface 20B of the front substrate 20 via each heat transfer path 92a and 92b is transferred to the housing 71 and the rear substrate 50 via the substrate spacer 40, which serves as a heat dissipation member in contact with the back surface 20B.

[0082] Note that each heat transfer path portion 91, 92a, and 92b can be formed by a through hole or via, other than a via. Each of the through holes and vias has a metal foil (e.g., copper foil) on its inner circumferential surface. Examples of vias include through-holes and interlayer vias. Examples of interlayer vias include blind vias and buried vias. If each heat transfer path portion 91, 92a, and 92b is a blind via, it intersects with the front side 20A or back side 20B of the front substrate 20.

[0083] In addition, although each heat transfer path portion 91, 92a and 92b extends along a direction perpendicular to the front surface 20A of the front substrate 20, for example, any one or all of the heat transfer path portions 91, 92a and 92b may extend along a direction inclined relative to the front surface 20A of the front substrate 20.

[0084] In addition, although each heat transfer path portion 93a to 93d extends along a direction parallel to the front surface 20A of the front substrate 20, for example, any one or all of the heat transfer path portions 91, 92a and 92b may extend along a direction inclined relative to the front surface 20A of the front substrate 20, or may extend in a stepped or zigzag shape.

[0085] Furthermore, although each heat transfer path portion 91, 92a, 92b and 93a to 93d is arranged to avoid each signal line 94a to 94f, for example, when electronic components (such as resistors, capacitors, transistors, etc.) other than signal lines 94d to 94f are provided in the front substrate 20, any one or all of the heat transfer path portions 91, 92a, 92b and 93a to 93d can be arranged to avoid the aforementioned electronic components.

[0086] In addition, in order to suppress electrical influences on the front substrate 20, any one or all of the heat transfer path portions 91, 92a, 92b and 93a to 93d can be provided in the grounding area (the area of ​​grounding potential) of the front substrate 20.

[0087] Additionally, as the adhesive portion 12a, for example, an adhesive with a higher thermal conductivity than the surrounding components can be used. This adhesive portion 12a serves to transfer heat from the front surface 20A of the imaging element 21, which is a heat-generating component, from the front surface 20A of the front substrate 20 to the retaining member 12 of the lens unit 10. As a result, heat dissipation from the front substrate 20 side to the lens unit 10 side can be promoted.

[0088] Here, since the entire back side of the imaging element 21 is typically bonded to the front side 20A of the front substrate 20, there is no metal foil on the front side 20A in the bonding area, and the substrate is exposed on the front side 20A of the front substrate 20. For this reason, from the perspective of heat conduction in the planar direction of the front substrate 20, the imaging element 21 tends to be in a thermally suspended state. In addition, due to limitations such as BGA pitch, it is difficult to arrange the via 20a directly below the imaging element 21, making heat conduction to the back side 20B of the front substrate 20 even more difficult. For example, if the BGA pitch of the imaging element 21 is narrow and the BGA of the imaging element 21 is full grid, it is very difficult to arrange the via 20a directly below the imaging element 21.

[0089] According to this embodiment, heat from the imaging element 21 is directly transferred along the back surface 20B of the front substrate 20 via the heat transfer path portion 91 (through hole 20a), and is transferred to each heat transfer path portion 93a to 93d of the front substrate 20 (e.g., metal foil for wiring or grounding), thereby diffusing heat in the planar direction of the front substrate 20. Furthermore, the diffused heat is transferred along the back surface 20B of the front substrate 20 via each heat transfer path portion 92a and 92b connected to each heat transfer path portion 93a to 93d. The substrate spacer 40, which is in surface contact with the heat transfer path portions 92a and 92b, efficiently receives heat and transfers it to the housing 71, the rear substrate 50, and each heat dissipation member 60A and 60B, etc., which are in contact with the substrate spacer 40.

[0090] By achieving such stepped heat conduction, heat dissipation can be improved even when upward heat dissipation of electronic components such as imaging element 21 is difficult (e.g., when thermally conductive materials cannot be physically arranged as in imaging element 21, or when the distance from the electronic component to the housing is long), or when thermally conductive holes (e.g., through-hole 20a) cannot be arranged directly below the electronic component. Furthermore, by contacting heat dissipation members such as substrate spacers 40 with each heat transfer path portion 92a and 92b, heat can be diffused to peripheral components such as housing 71 and rear substrate 50. Therefore, temperature rise in electronic components such as imaging element 21 can be suppressed.

[0091] <1-5. Examples of variations of the front substrate>

[0092] <1-5-1. Variation Example 1>

[0093] Reference Figure 9 A configuration example of the front substrate 20 according to a modified example 1 of this embodiment is described. Figure 9 This is a cross-sectional view showing an example configuration of the front substrate 20 according to a modified example 1 of this embodiment. Figure 9 In the example, the through hole 20a connecting the inner space 10A and the outer space is not shown.

[0094] like Figure 9 As shown, in the front substrate 20 of Modified Example 1, the heat transfer path portion 91 is formed by a blind via 20c, and only the fifth conductor layer C5 has each heat transfer path portion 93c and 93d. The blind via 20c is formed on the front surface 20A of the front substrate 20 and intersects with the front surface 20A. Other configurations are similar to those according to the above embodiment. In this Modified Example 1, effects similar to those of the above embodiment can be obtained.

[0095] Note that each heat transfer path portion 92a and 92b can also be formed by a blind via 20c. In this case, the blind via 20c is formed on the back surface 20B of the front substrate 20 and intersects with the back surface 20B. Since the blind via 20c does not extend to the front surface 20A of the front substrate 20, heat transfer to the front surface 20A side can be suppressed compared to the case where each heat transfer path portion 92a and 92b is a through-hole 20a, 20b.

[0096] <1-5-2. Variation Example 2>

[0097] Reference Figure 10 A configuration example of the front substrate 20 according to Modification 2 of this embodiment is described. Figure 10 This is a cross-sectional view showing an example configuration of the front substrate 20 according to a modified example 2 of this embodiment. Figure 10 In the example, the substrate spacer 40 and the rear substrate 50 are not shown.

[0098] like Figure 10 As shown, the front substrate 20 of Modification 2 has a configuration substantially similar to that of Modification 1, but in Modification 2, a chip assembly 24, such as an IC (integrated circuit) chip, is disposed on the back surface 20B of the front substrate 20. Similar to the imaging element 21, the chip assembly 24 is attached to the back surface 20B of the front substrate 20 by a plurality of solder balls 24a (BGA). These solder balls 24a are arranged in a grid pattern on the bottom surface (the surface on the side of the front substrate 20) of the chip assembly 24. The chip assembly 24 is an example of an electronic component.

[0099] Even in this modified example 2, effects similar to those of the above-described embodiments can be obtained. Furthermore, according to modified example 2, even when the chip assembly 24 exists on the back side 20B opposite to the imaging element 21 on the front side 20A of the front substrate 20 and the through hole 20a is not arranged directly below the imaging element 21, a heat transfer path extending from the front side 20A to the back side 20B is appropriately formed, so that heat from the imaging element 21 can be transferred to the back side 20B side of the front substrate 20.

[0100] <1-5-3. Variation Example 3>

[0101] Reference Figure 11 A configuration example of the front substrate 20 according to a variation 3 of this embodiment is described. Figure 11 This is a cross-sectional view showing an example configuration of the front substrate 20 according to a modified example 3 of this embodiment. Figure 11 In the example, such as Figure 10 Thus, the substrate spacer 40 and the rear substrate 50 are not shown.

[0102] like Figure 11As shown, the front substrate 20 of Modified Example 3 is basically similar to that of Modified Example 2, but in Modified Example 3, the heat-conducting member 25 is disposed inside each heat transfer path portion 91, 92a and 92b (see Figure 10 This refers to the portion disposed inside each of the blind holes 20c and through holes 20b. The thermally conductive member 25 is formed by filling the interior of the blind holes 20c and each through hole 20b with a thermally conductive material. The thermally conductive material may be, for example, a resin material such as an underfill.

[0103] Even in this modified example 3, effects similar to those of the above-described embodiments can be obtained. Furthermore, according to modified example 3, since the heat-conducting member 25 is disposed inside each of the blind holes 20c and through holes 20b constituting the respective heat transfer path portions 91, 92a and 92b, the heat transfer performance of each heat transfer path portion 91, 92a and 92b can be improved.

[0104] <1-6. Functions and Effects>

[0105] As described above, the imaging apparatus 1 according to this embodiment includes: a front substrate 20, including a front surface (first surface) 20A and a back surface (second surface) 20B located on the opposite side of the front surface 20A; and electronic components (e.g., imaging element 21) disposed on the front surface 20A, and the front substrate 20 has a first heat transfer path portion (e.g., heat transfer path portion 91) intersecting with the front surface 20A, a second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b) intersecting with the back surface 20B, and a third heat transfer path portion (e.g., each heat transfer path portion 93a to 93d) intersecting with the first heat transfer path portion and the second heat transfer path portion (see See Figures 7 to 11 Thus, the first heat transfer path section, the second heat transfer path section, and the third heat transfer path section are combined, and a heat transfer path extending from the front side 20A to the back side 20B is appropriately formed in the front substrate 20, so that heat from the electronic components can be reliably transferred from the front side 20A to the back side 20B, and the temperature rise of the electronic components can be suppressed.

[0106] Furthermore, the third heat transfer path portion (e.g., each heat transfer path portion 93a to 93d) may extend along the front side 20A and back side 20B of the front substrate 20 (see [reference]). Figures 7 to 11 Therefore, a heat transfer path extending from the front side 20A to the back side 20B can be appropriately formed in the front substrate 20.

[0107] Furthermore, one or both of the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b) can be a through hole, a through hole 20a, or a via (e.g., a blind hole 20c) (see [link]). Figures 7 to 11Therefore, one or both of the first heat transfer path section and the second heat transfer path section can be easily formed.

[0108] Furthermore, one or both of the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b) may have a heat-conducting member 25 disposed inside a through hole, through hole, or via (see Figure 11 This can improve the heat transfer performance of one or both of the first and second heat transfer path sections.

[0109] Furthermore, the first heat transfer path section (e.g., heat transfer path section 91) may be a blind hole 20c (see Figures 9 to 11 Therefore, the first heat transfer path section can be easily formed.

[0110] Furthermore, the third heat transfer path section (e.g., each heat transfer path section 93a to 93d) can be a metal foil (see Figures 7 to 11 Therefore, a third heat transfer path section can be easily formed.

[0111] Furthermore, a first heat transfer path portion (e.g., heat transfer path portion 91) is formed around the electronic components in the front substrate 20, and a second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b) may be formed in the outer peripheral region of the front substrate 20 (see [reference]). Figure 3 and Figure 4 Therefore, a heat transfer path extending from the front side 20A to the back side 20B can be appropriately formed in the front substrate 20, and heat from the electronic components can be reliably transferred from the front side 20A to the back side 20B.

[0112] Furthermore, the number of first heat transfer path sections (e.g., heat transfer path section 91) is one, the number of second heat transfer path sections (e.g., each heat transfer path section 92a and 92b) is multiple, and the number of third heat transfer path sections (e.g., each heat transfer path section 93a to 93d) can be multiple (see [reference]). Figure 3 and Figure 4 Therefore, a heat transfer path extending from the front side 20A to the back side 20B can be reliably formed in the front substrate 20.

[0113] Furthermore, any one, two, or all of the first heat transfer path section (e.g., heat transfer path section 91), the second heat transfer path section (e.g., each heat transfer path section 92a and 92b), and the third heat transfer path section (e.g., each heat transfer path section 93a to 93d) can be disposed in the grounding region of the front substrate 20 (see [reference]). Figures 7 to 11 Therefore, the electrical influence of the first heat transfer path section, the second heat transfer path section, and the third heat transfer path section on the front substrate 20 can be suppressed.

[0114] Furthermore, the front substrate 20 has built-in signal lines (e.g., each signal line 94a to 94f), and the first heat transfer path portion (e.g., heat transfer path portion 91), the second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b), and the third heat transfer path portion (e.g., each heat transfer path portion 93a to 93d) can be arranged in a manner that avoids the signal lines (see...). Figures 7 to 11 Therefore, a heat transfer path extending from the front side 20A to the back side 20B can be appropriately formed in the front substrate 20.

[0115] Furthermore, the front substrate 20 may have signal lines (e.g., signal line 94e) and third heat transfer path portions (e.g., each heat transfer path portion 93c and 93d) in the same layer (e.g., conductor layer C5) without them intersecting (see [link]). Figure 8 Therefore, signal lines and heat transfer paths can be appropriately formed in the same layer of the front substrate 20.

[0116] Furthermore, the imaging device 1 may also include a heat dissipation component (e.g., a substrate spacer 40) disposed on the back surface 20B of the front substrate 20 and in contact with the second heat transfer path portions (e.g., each heat transfer path portion 92a and 92b) (see [link]). Figure 1 , Figure 2 , Figure 7 (etc.). As a result, the temperature rise of electronic components can be reliably suppressed.

[0117] In addition, the imaging device 1 may also include a rear substrate 50 that contacts a heat dissipation member (e.g., substrate spacer 40) (see Figure 1 , Figure 2 , Figure 7 (etc.). As a result, the temperature rise of electronic components can be reliably suppressed.

[0118] Alternatively, the heat dissipation component can be a substrate spacer 40, which contacts the front substrate 20 and the rear substrate 50 and ensures the space between the front substrate 20 and the rear substrate 50 (see [link]). Figure 1 , Figure 2 , Figure 7 (etc.). Thus, the temperature rise of the electronic components can be reliably suppressed while ensuring the space between the front substrate 20 and the rear substrate 50.

[0119] In addition, the imaging device 1 may also include a housing 71 that contacts a heat dissipation member (e.g., substrate spacer 40) and houses the front substrate 20 (see [link]). Figure 1 , Figure 2 , Figure 7 (etc.). As a result, the temperature rise of electronic components can be reliably suppressed.

[0120] Furthermore, the first heat transfer path section (e.g., heat transfer path section 91) can be arranged in a manner that avoids the mounting area of ​​electronic components in the front substrate 20 (see [reference]). Figure 3 , Figure 4 , Figure 7 (etc.). Thus, a heat transfer path extending from the front side 20A to the back side 20B can be appropriately formed in the front substrate 20.

[0121] Furthermore, the front substrate 20 has other electronic components (e.g., chip assembly 24) disposed on the back surface 20B, and the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., each heat transfer path portion 92a and 92b) can be disposed in a manner that avoids the mounting area of ​​one or both of the electronic components and other electronic components in the front substrate 20 (see [link]). Figure 10 (etc.). Thus, a heat transfer path extending from the front side 20A to the back side 20B can be appropriately formed in the front substrate 20.

[0122] Additionally, the electronic component may be an imaging element 21 (see Figure 1 , Figure 2 , Figure 7 (etc.). This can suppress the temperature rise of the imaging element 21.

[0123] Furthermore, the imaging device 1 may also include a lens unit 10, which is disposed on the front surface 20A of the front substrate 20 and faces the imaging element 21 (see [link]). Figure 1 , Figure 2 , Figure 7 Even in such a configuration, the temperature rise of the imaging element 21 can be suppressed.

[0124] Additionally, the front surface 20A of the lens unit 10 and the front substrate 20 forms an internal space 10A for accommodating the imaging element 21, and the first heat transfer path portion (e.g., heat transfer path portion 91) can be a through hole, a through hole 20a, or a through guide hole leading to the internal space 10A (see [link]). Figure 1 , Figure 2 , Figure 7 (etc.). Thus, the internal space 10A and the external space can be connected, and the air pressure in the internal space 10A can be adjusted.

[0125] <2. Other embodiments>

[0126] Each configuration, each process, etc., according to the above embodiments (including examples and variations) can be implemented in various forms other than the above embodiments. For example, each configuration, each process, etc., is not limited to the above examples and can adopt various patterns. In addition, for example, unless otherwise specified, the information shown in the above documents or drawings, including configurations, processes, specific names, or various data and parameters, can be arbitrarily changed.

[0127] Furthermore, each configuration, each process, etc., according to the above embodiments (including examples and variations) does not necessarily need to be physically configured as shown in the figures. That is, the specific distribution and integration pattern of each configuration, each process, etc. is not limited to the pattern shown in the figures, and all or part of them can be functionally or physically distributed or integrated in any unit according to various loads, usage conditions, etc.

[0128] Furthermore, each configuration, process, etc., according to the above embodiments (including examples and variations) can be appropriately combined. For example, at least a portion of an embodiment can be appropriately combined with at least a portion of other embodiments. Moreover, the effects in the embodiments are merely illustrative and not limiting, and other effects may exist.

[0129] <3. Application Examples>

[0130] The technology disclosed herein can be applied to a variety of products. For example, the technology disclosed herein can be implemented as a device (e.g., an electronic device) installed on any type of mobile body (such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobile devices, aircraft, drones, ships, robots, construction machinery, and agricultural machinery (tractors)). Furthermore, for example, the technology disclosed herein can be implemented as a device (e.g., an electronic device) installed on endoscopic surgical systems, microsurgical systems, etc.

[0131] Figure 12 This is a block diagram illustrating a schematic configuration example of a vehicle control system 7000, which is an example of a mobile body control system to which the technology according to this disclosure can be applied. The vehicle control system 7000 includes multiple electronic control units connected via a communication network 7010. Figure 12 In the example shown, the vehicle control system 7000 includes a drive system control unit 7100, a body system control unit 7200, a battery control unit 7300, an external information detection unit 7400, an internal information detection unit 7500, and an integrated control unit 7600. The communication network 7010 connecting these multiple control units can be any in-vehicle communication network conforming to standards such as CAN (Controller Area Network), LIN (Local Area Network), LAN (Local Area Network), or FlexRay (registered trademark).

[0132] Each control unit includes a microcomputer that performs arithmetic processing according to various programs, a storage unit that stores the programs executed by the microcomputer, parameters used for various calculations, etc., and drive circuits that drive various devices to be controlled. Each control unit includes a network interface for communicating with other control units via a communication network 7010, and also includes a communication interface for communicating with devices, sensors, etc., inside and outside the vehicle via wired or wireless communication. Figure 12 In the diagram, the integrated control unit 7600 is configured with the following components: a microcomputer 7610, a general communication interface 7620, a dedicated communication interface 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle equipment interface 7660, an audio / video output unit 7670, an in-vehicle network interface 7680, and a storage unit 7690. Other control units similarly include microcomputers, communication interfaces, and storage units.

[0133] The drive system control unit 7100 controls the operation of equipment related to the vehicle's drive system according to various programs. For example, the drive system control unit 7100 functions as a control device for: drive force generating equipment (such as an internal combustion engine or drive motor) for generating vehicle driving force, drive force transmission mechanism for transmitting driving force to the wheels, steering mechanism for adjusting the vehicle's steering angle, braking equipment for generating vehicle braking force, etc. The drive system control unit 7100 may also function as a control device such as ABS (anti-lock braking system) or ESC (electronic stability control).

[0134] The vehicle status detection unit 7110 is connected to the drive system control unit 7100. The vehicle status detection unit 7110 includes at least one of, for example, a gyroscope sensor, an accelerometer sensor, and sensors for detecting the amount of operation of the accelerator pedal, the amount of operation of the brake pedal, the steering angle of the steering wheel, engine speed, wheel speed, etc. The gyroscope sensor detects the angular velocity of the axial rotational motion of the vehicle body, and the accelerometer sensor detects the acceleration of the vehicle. The drive system control unit 7100 uses signals input from the vehicle status detection unit 7110 to perform arithmetic processing and control the internal combustion engine, drive motor, electric power steering system, braking system, etc.

[0135] The body system control unit 7200 controls the operation of various devices equipped on the vehicle body according to various programs. For example, the body system control unit 7200 is used as a control device for keyless entry systems, smart key systems, power window devices, or various lights such as headlights, taillights, brake lights, turn signals, or fog lights. In this case, radio waves or signals from various switches transmitted from a portable device that replaces the key can be input to the body system control unit 7200. The body system control unit 7200 receives these radio wave or signal inputs and controls the vehicle's door locking devices, power window devices, lights, etc.

[0136] The battery control unit 7300 controls the secondary battery 7310, which serves as a power source for the drive motor, according to various programs. For example, information such as battery temperature, battery output voltage, or remaining battery capacity is input from a battery device including the secondary battery 7310 to the battery control unit 7300. The battery control unit 7300 uses these signals to perform arithmetic processing and to control the temperature regulation of the secondary battery 7310 or the cooling devices installed in the battery device.

[0137] The exterior information detection unit 7400 detects information about the exterior of the vehicle equipped with the vehicle control system 7000. For example, at least one of the imaging unit 7410 and the exterior information detection unit 7420 is connected to the exterior information detection unit 7400. The imaging unit 7410 includes at least one of a ToF (Time-of-Flight) camera, a stereo camera, a monocular camera, an infrared camera, and other cameras. The exterior information detection unit 7420 includes at least one of, for example, an environmental sensor for detecting current weather or meteorological conditions, or a surrounding information detection sensor for detecting other vehicles, obstacles, pedestrians, etc., around the vehicle equipped with the vehicle control system 7000.

[0138] The environmental sensor can be at least one of, for example, a raindrop sensor for detecting rain, a fog sensor for detecting fog, a sunlight sensor for detecting sunlight intensity, and a snow sensor for detecting snow. The ambient information detection sensor can be at least one of an ultrasonic sensor, a radar device, and a LiDAR (light detection and ranging, laser imaging detection and ranging) device. These imaging units 7410 and the exterior information detection unit 7420 can be configured as independent sensors or devices, or as a device integrating multiple sensors or devices.

[0139] here, Figure 13Examples of the mounting positions of imaging unit 7410 and vehicle exterior information detection unit 7420 are shown. Imaging units 7910, 7912, 7914, 7916, and 7918 are installed at at least one of the following locations: the front nose, side mirrors, rear bumper, rear door, and the upper part of the windshield inside the vehicle 7900. Imaging unit 7910 installed at the front nose and imaging unit 7918 installed at the upper part of the windshield inside the vehicle compartment primarily acquire images of the front of the vehicle 7900. Imaging units 7912 and 7914 installed at the side mirrors primarily acquire images of the sides of the vehicle 7900. Imaging unit 7916 installed at the rear bumper or rear door primarily acquires images of the rear of the vehicle 7900. Imaging unit 7918 installed at the upper part of the windshield inside the vehicle compartment is mainly used to detect vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc., ahead.

[0140] Notice, Figure 13 Examples of the imaging ranges of the various imaging units 7910, 7912, 7914, and 7916 are shown. Imaging range a represents the imaging range of imaging unit 7910 located at the front nose; imaging ranges b and c represent the imaging ranges of imaging units 7912 and 7914 located at the side mirrors, respectively; and imaging range d represents the imaging range of imaging unit 7916 located at the rear bumper or rear door. For example, by superimposing the image data captured by imaging units 7910, 7912, 7914, and 7916, a top-view image of the vehicle 7900 viewed from above is obtained.

[0141] The exterior information detection units 7920, 7922, 7924, 7926, 7928, and 7930, located at the front, rear, sides, corners, and upper part of the windshield inside the vehicle 7900, can be, for example, ultrasonic sensors or radar devices. The exterior information detection units 7920, 7926, and 7930, located at the front nose, rear bumper, rear door, and upper part of the windshield inside the vehicle 7900, can be, for example, LiDAR devices. These exterior information detection units 7920 to 7930 are mainly used to detect vehicles, pedestrians, obstacles, etc., ahead.

[0142] Return to Figure 12The description continues. The exterior information detection unit 7400 enables the imaging unit 7410 to capture images of the exterior of the vehicle and receives the captured image data. Additionally, the exterior information detection unit 7400 receives detection information from a connected exterior information detection unit 7420. When the exterior information detection unit 7420 is an ultrasonic sensor, radar device, or LiDAR device, the exterior information detection unit 7400 transmits ultrasonic waves, electromagnetic waves, etc., and receives information about the received reflected waves. The exterior information detection unit 7400 can perform object detection processing or distance detection processing, such as for people, vehicles, obstacles, signs, or characters on the road surface, based on the received information. The exterior information detection unit 7400 can perform environmental recognition processing, such as identifying rain, fog, road conditions, etc., based on the received information. The exterior information detection unit 7400 can calculate the distance to objects outside the vehicle based on the received information.

[0143] Additionally, the exterior information detection unit 7400 can perform image recognition processing or distance detection processing based on the received image data to identify people, vehicles, obstacles, signs, characters on the road surface, etc. The exterior information detection unit 7400 performs processing such as distortion correction or alignment on the received image data and synthesizes image data captured by different imaging units 7410 to generate a top-down or panoramic image. The exterior information detection unit 7400 can use image data captured by different imaging units 7410 to perform viewpoint switching processing.

[0144] The in-vehicle information detection unit 7500 detects information inside the vehicle. For example, a driver state detection unit 7510, which detects the driver's state, is connected to the in-vehicle information detection unit 7500. The driver state detection unit 7510 may include a camera that images the driver, a biosensor that detects the driver's biological information, a microphone that picks up sound inside the vehicle, etc. The biosensor is located on, for example, the seat surface, the steering wheel, etc., and detects the biological information of passengers sitting in the seat or the driver holding the steering wheel. The in-vehicle information detection unit 7500 can calculate the driver's fatigue level or concentration level based on the detection information input from the driver state detection unit 7510, or it can determine whether the driver is dozing off. The in-vehicle information detection unit 7500 can perform processing such as noise reduction on the picked-up audio signals.

[0145] The integrated control unit 7600 controls the overall operation of the vehicle control system 7000 according to various programs. An input unit 7800 is connected to the integrated control unit 7600. The input unit 7800 may be implemented, for example, by a device that can be operated by a passenger for input (such as a touch panel, button, microphone, switch, or lever). Data obtained through voice recognition of voice input via a microphone can be input to the integrated control unit 7600. The input unit 7800 may be, for example, a remote control device using infrared or other radio waves, or an external connection device corresponding to the operation of the vehicle control system 7000 (such as a mobile phone or PDA (personal digital assistant)). The input unit 7800 may be, for example, a camera, in which case the passenger can input information via gestures. Alternatively, data obtained by detecting movement of a wearable device worn by the passenger can be input. Furthermore, the input unit 7800 may include, for example, an input control circuit that generates an input signal based on information input by the passenger or others using the aforementioned input unit 7800, and outputs the input signal to the integrated control unit 7600. Passengers can operate the input unit 7800 to input various data or instructions for processing into the vehicle control system 7000.

[0146] The storage unit 7690 includes a ROM (Read-Only Memory) for storing various programs executed by a microcomputer and a RAM (Random Access Memory) for storing various parameters, calculation results, sensor values, etc. Furthermore, the storage unit 7690 can be implemented using a magnetic storage device such as an HDD (Hard Disk Drive), a semiconductor storage device, an optical storage device, or a magneto-optical storage device.

[0147] The universal communication interface 7620 is a general-purpose communication interface that mediates communication between various devices present in the external environment 7750. The universal communication interface 7620 can implement cellular communication protocols such as GSM (Global System for Mobile Communications), WiMAX, LTE (Long Term Evolution), or LTE-A (LTE Advanced), or other wireless communication protocols such as Wireless LAN (also known as Wi-Fi) and Bluetooth. The universal communication interface 7620 can, for example, connect to devices (e.g., application servers or control servers) existing on external networks (e.g., the Internet, cloud networks, or carrier-dedicated networks) via base stations or access points. Additionally, the universal communication interface 7620 can, for example, connect to terminals existing near the vehicle using P2P (peer-to-peer) technology (e.g., terminals of drivers, pedestrians, or shops, or MTC (machine-type communication) terminals).

[0148] The Dedicated Communication Interface 7630 is a communication interface that supports communication protocols developed for use in vehicles. The Dedicated Communication Interface 7630 can implement standard protocols such as WAVE (Wireless Access in a Vehicle Environment), DSRC (Dedicated Short Range Communication), or cellular communication protocols. WAVE is a combination of the lower-layer IEEE 802.11p and the upper-layer IEEE 1609. The Dedicated Communication Interface 7630 typically performs V2X communication, which includes one or more of the following concepts: vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication.

[0149] The positioning unit 7640 receives GNSS signals, such as those from GNSS (Global Navigation Satellite System) satellites (e.g., GPS signals from GPS (Global Positioning System) satellites), to perform positioning and generates location information including the vehicle's latitude, longitude, and altitude. Note that the positioning unit 7640 can identify its current location by exchanging signals with a wireless access point, or it can obtain location information from a terminal with positioning capabilities, such as a mobile phone, PHS, or smartphone.

[0150] The beacon receiving unit 7650 receives radio waves or electromagnetic waves, for example, from a wireless station installed on the road, and acquires information such as current location, traffic congestion, road closure, or estimated time. Note that the functionality of the beacon receiving unit 7650 may be included in the dedicated communication interface 7630 described above.

[0151] The in-vehicle device interface 7660 is a communication interface that mediates the connection between the microcomputer 7610 and various in-vehicle devices 7760 present in the vehicle. The in-vehicle device interface 7660 can establish a wireless connection using wireless communication protocols such as Wireless LAN, Bluetooth (registered trademark), NFC (Near Field Communication), or WUSB (Wireless USB). Alternatively, the in-vehicle device interface 7660 can establish a wired connection such as USB (Universal Serial Bus), HDMI (registered trademark), or MHL (Mobile High Definition Link) via a connection terminal (and, if necessary, a cable) (not shown). The in-vehicle devices 7760 may include at least one of, for example, mobile devices or wearable devices owned by passengers, or information devices brought into or attached to the vehicle. Additionally, the in-vehicle devices 7760 may include a navigation device that performs route searching to any destination. The in-vehicle device interface 7660 exchanges control signals or data signals with these in-vehicle devices 7760.

[0152] The vehicle network interface 7680 is an interface that mediates communication between the microcomputer 7610 and the communication network 7010. The vehicle network interface 7680 sends and receives signals according to a predetermined protocol supported by the communication network 7010.

[0153] The microcomputer 7610 of the integrated control unit 7600 controls the vehicle control system 7000 according to various programs based on information acquired via at least one of the following: a general communication interface 7620, a dedicated communication interface 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device interface 7660, and an in-vehicle network interface 7680. For example, the microcomputer 7610 can calculate control target values ​​for the drive force generating device, steering mechanism, or braking device based on the acquired information inside and outside the vehicle, and output control commands to the drive system control unit 7100. For example, the microcomputer 7610 can perform cooperative control for the purpose of achieving ADAS (Advanced Driver Assistance Systems) functions, including collision avoidance or impact mitigation, following based on inter-vehicle distance, constant speed driving, collision warning, and lane departure warning. In addition, the microcomputer 7610 can perform cooperative control for purposes such as autonomous driving by controlling the drive force generating device, steering mechanism, braking device, etc., based on the acquired information around the vehicle, in which the vehicle drives autonomously without relying on the driver's operation.

[0154] The microcomputer 7610 can generate three-dimensional distance information between the vehicle and objects such as surrounding structures or people based on information acquired via at least one of the following: a general communication interface 7620, a dedicated communication interface 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device interface 7660, and an in-vehicle network interface 7680. It also creates local map information including surrounding information such as the vehicle's current position. Furthermore, the microcomputer 7610 can predict hazards such as vehicle collisions, pedestrians approaching or entering closed roads based on the acquired information and generate warning signals. These warning signals can be, for example, signals used to generate warning sounds or to illuminate warning lights.

[0155] The audio-visual output unit 7670 sends an output signal of at least one of audio and visual signals to an output device capable of visually or audibly notifying passengers of the vehicle or the outside of the vehicle. Figure 12In the example, audio speaker 7710, display unit 7720, and instrument panel 7730 are shown as output devices. Display unit 7720 may include at least one of, for example, an in-vehicle display and a head-up display. Display unit 7720 may have AR (augmented reality) display functionality. Output devices may be other devices besides these, such as headphones, wearable devices worn by passengers (such as goggle-style displays), projectors, or lights. When the output device is a display device, the display device visually displays the results obtained through various processes performed by microcomputer 7610 or information received from other control units in various formats such as text, images, tables, and charts. Additionally, when the output device is an audio output device, the audio output device converts an audio signal composed of reproduced audio data, acoustic data, etc., into an analog signal and outputs the analog signal audibly.

[0156] Note that in Figure 12 In the example shown, at least two control units connected via communication network 7010 can be integrated into a single control unit. Alternatively, each control unit can consist of multiple control units. Furthermore, the vehicle control system 7000 may include other control units not shown. Additionally, as described above, some or all of the functions performed by any control unit can be assigned to other control units. That is, if information is sent and received via communication network 7010, predetermined arithmetic processing can be performed by any control unit. Similarly, sensors or devices connected to any control unit can be connected to other control units, and multiple control units can send and receive detection information to each other via communication network 7010.

[0157] Note that this is used to implement the usage according to this embodiment. Figure 1 The computer program for each function (e.g., imaging function) of the described imaging apparatus 1 can be implemented in any control unit or the like. Alternatively, a computer-readable recording medium storing such a computer program can also be provided. The recording medium can be, for example, a magnetic disk, optical disk, magneto-optical disk, flash memory, etc. Furthermore, the aforementioned computer program can be distributed, for example, via a network without using a recording medium.

[0158] In the aforementioned vehicle control system 7000, according to the usage of this embodiment Figure 1 The described imaging device 1 can be applied to... Figure 12 The application examples shown include the vehicle exterior information detection unit 7400, the vehicle interior information detection unit 7500, and related equipment. For example, the imaging device 1 can be applied to the imaging unit 7410, the vehicle exterior information detection unit 7420, the driver state detection unit 7510, etc.

[0159] Furthermore, according to the use of this embodiment Figure 1At least a portion of the constituent elements of the described imaging apparatus 1 (e.g., the control unit associated with the imaging element 21, etc.) can be used for... Figure 12 This is implemented in a module (e.g., an integrated circuit module consisting of a die) of the integrated control unit 7600 shown. Alternatively, according to this embodiment, the use... Figure 1 At least a portion of the constituent elements of the imaging device 1 described can be derived from... Figure 12 This is achieved through multiple control units in the vehicle control system 7000 shown.

[0160] <4. Supplementary Explanation>

[0161] Note that this technology can also be configured as follows.

[0162] (1) An imaging device, comprising: The substrate includes a first surface and a second surface located opposite to the first surface; and Electronic components are mounted on the first surface; The substrate has the following characteristics: The first heat transfer path intersects with the first surface. The second heat transfer path intersects with the second surface, and The third heat transfer path section intersects with the first heat transfer path section and the second heat transfer path section.

[0163] (2) The imaging apparatus according to (1), wherein the third heat transfer path extends along the first surface and the second surface.

[0164] (3) The imaging device according to (1) or (2), wherein one or both of the first heat transfer path portion and the second heat transfer path portion are through holes, through holes or via holes.

[0165] (4) The imaging device according to (3), wherein one or both of the first heat transfer path portion and the second heat transfer path portion have a heat-conducting member disposed inside the through hole, the through hole or the via hole.

[0166] (5) The imaging apparatus according to any one of (1) to (4), wherein the first heat transfer path portion is a blind hole.

[0167] (6) The imaging apparatus according to any one of (1) to (5), wherein the third heat transfer path is a metal foil.

[0168] (7) The imaging apparatus according to any one of (1) to (6), wherein, The first heat transfer path is formed around the electronic components in the substrate, and The second heat transfer path is formed in the outer peripheral region of the substrate.

[0169] (8) The imaging apparatus according to (7), wherein, The number of the first heat transfer path sections is one. The number of second heat transfer path sections is multiple, and There are multiple third heat transfer path sections.

[0170] (9) The imaging apparatus according to any one of (1) to (8), wherein any one, two or all of the first heat transfer path portion, the second heat transfer path portion and the third heat transfer path portion are disposed in the grounding region of the substrate.

[0171] (10) The imaging apparatus according to any one of (1) to (9), wherein, The substrate has built-in signal lines, and The first heat transfer path section, the second heat transfer path section, and the third heat transfer path section are arranged in a manner that avoids the signal line.

[0172] (11) The imaging apparatus according to (10), wherein the substrate has a signal line and a third heat transfer path in the same layer.

[0173] (12) The imaging apparatus according to any one of (1) to (11) further includes a heat dissipation member disposed on the second surface and in contact with the second heat transfer path portion.

[0174] (13) The imaging apparatus according to (12) further includes other substrates in contact with the heat dissipation member.

[0175] (14) The imaging apparatus according to (13), wherein the heat dissipation member is a substrate spacer that contacts the substrate and other substrates and ensures the space between the substrate and other substrates.

[0176] (15) The imaging apparatus according to any one of (12) to (14) further includes a housing that contacts the heat dissipation member and houses the substrate.

[0177] (16) The imaging apparatus according to any one of (1) to (15), wherein the first heat transfer path portion is provided in such a way as to avoid the mounting area of ​​electronic components in the substrate.

[0178] (17) The imaging apparatus according to (16), wherein, The substrate has other electronic components disposed on the second surface, and The first heat transfer path section and the second heat transfer path section are arranged in a manner that avoids the mounting area of ​​one or both of the electronic components and other electronic components in the substrate.

[0179] (18) The imaging apparatus according to any one of (1) to (17), wherein the electronic component is an imaging element.

[0180] (19) The imaging apparatus according to (18) further includes a lens unit disposed on the first surface and facing the imaging element.

[0181] (20) The imaging apparatus according to (19), wherein, The lens unit and the first surface form an internal space to accommodate the imaging element, and The first heat transfer path is a through hole, through hole, or through guide hole leading to the internal space.

[0182] (21) An electronic device comprising an imaging apparatus according to any one of (1) to (20).

[0183] [List of Reference Markers]

[0184] 1 Imaging device

[0185] 10 lens units

[0186] 10a slot

[0187] 10A Interior Space

[0188] 11 Lens tube section

[0189] 12 Retaining parts

[0190] 12a Adhesive part

[0191] 20 front base plate

[0192] 20A Front

[0193] 20B Back

[0194] 20a Through Hole

[0195] 20b through hole

[0196] 20c blind hole

[0197] 21 Imaging elements

[0198] 21a Welding Ball

[0199] 22 connectors

[0200] 23 Filters

[0201] 24 Chip Components

[0202] 24a solder ball

[0203] 25 Thermally conductive components

[0204] 30 Sealing components

[0205] 40 Substrate spacers

[0206] 50-year-old substrate

[0207] 50A Front

[0208] 50B Back

[0209] 51 connector

[0210] 52 connector

[0211] 60A heat dissipation component

[0212] 60B heat dissipation component

[0213] 70 Connector Unit

[0214] 71 Casing

[0215] 72 Connector Section

[0216] 80A Joint Component

[0217] 80B Joint Member

[0218] 91 Heat transfer path section

[0219] 92a Heat transfer path section

[0220] 92b Heat transfer path section

[0221] 93a Heat transfer path section

[0222] 93b Heat transfer path section

[0223] 93c heat transfer path section

[0224] 93d heat transfer path section

[0225] 94a signal line

[0226] 94b signal line

[0227] 94c signal cable

[0228] 94d signal line

[0229] 94e signal line

[0230] 94F signal cable

[0231] A1 Reservation Area

[0232] A2 Reservation Area

[0233] B1 Adhesion Area

[0234] C1 conductor layer

[0235] C2 conductor layer

[0236] C3 conductor layer

[0237] C4 conductor layer

[0238] C5 conductor layer

[0239] C6 conductor layer

Claims

1. An imaging device, comprising: The substrate includes a first surface and a second surface located on the opposite side of the first surface; as well as Electronic components are mounted on the first surface; The substrate has the following characteristics: The first heat transfer path intersects with the first surface. The second heat transfer path intersects with the second surface, and The third heat transfer path section intersects with the first heat transfer path section and the second heat transfer path section.

2. The imaging device according to claim 1, wherein, The third heat transfer path extends along the first and second surfaces.

3. The imaging device according to claim 1, wherein, One or both of the first heat transfer path section and the second heat transfer path section are through holes, through holes, or via holes.

4. The imaging device according to claim 3, wherein, One or both of the first heat transfer path section and the second heat transfer path section have a heat-conducting member disposed inside the through hole, the through hole, or the via hole.

5. The imaging apparatus according to claim 1, wherein, The first heat transfer path is a blind hole.

6. The imaging apparatus according to claim 1, wherein, The third heat transfer path is a metal foil.

7. The imaging apparatus according to claim 1, wherein, The first heat transfer path is formed around the electronic components in the substrate, and The second heat transfer path is formed in the outer peripheral region of the substrate.

8. The imaging apparatus according to claim 7, wherein, The number of the first heat transfer path sections is one. The number of second heat transfer path sections is multiple, and There are multiple third heat transfer path sections.

9. The imaging apparatus according to claim 1, wherein, One, two, or all of the first heat transfer path section, the second heat transfer path section, and the third heat transfer path section are disposed in the grounding area of ​​the substrate.

10. The imaging apparatus according to claim 1, wherein, The substrate has built-in signal lines, and The first heat transfer path section, the second heat transfer path section, and the third heat transfer path section are arranged in a manner that avoids the signal line.

11. The imaging apparatus according to claim 10, wherein, The substrate has signal lines and a third heat transfer path in the same layer.

12. The imaging apparatus according to claim 1, further comprising a heat dissipation member disposed on the second surface and in contact with the second heat transfer path portion.

13. The imaging apparatus of claim 12 further includes other substrates in contact with the heat dissipation member.

14. The imaging apparatus according to claim 13, wherein, The heat dissipation component is a substrate spacer that contacts the substrate and other substrates, and ensures the space between the substrate and other substrates.

15. The imaging apparatus of claim 12, further comprising a housing that contacts the heat dissipation member and accommodates the substrate.

16. The imaging apparatus according to claim 1, wherein, The first heat transfer path is configured to avoid the mounting area of ​​electronic components in the substrate.

17. The imaging apparatus according to claim 16, wherein, The substrate has other electronic components disposed on the second surface, and The first heat transfer path section and the second heat transfer path section are arranged in a manner that avoids the mounting area of ​​one or both of the electronic components and other electronic components in the substrate.

18. The imaging apparatus according to claim 1, wherein, Electronic components are imaging elements.

19. The imaging apparatus of claim 18, further comprising a lens unit disposed on the first surface and facing the imaging element.

20. The imaging apparatus according to claim 19, wherein, The lens unit and the first surface form an internal space to accommodate the imaging element, and The first heat transfer path is a through hole, through hole, or through guide hole leading to the internal space.

Images