Imaging apparatus and manufacturing method of imaging apparatus

Abstract

An imaging device according to one aspect of the present disclosure includes a substrate having an imaging element; a holder provided on the substrate, the holder holding a lens unit and forming, with the substrate and the lens unit, an internal space for accommodating the imaging element; a bonding portion that brings the substrate and the holder into close contact with each other; a through-hole formed in the substrate and opening to the internal space; an assembly spaced apart from the substrate and covering the through-hole; and a fixing portion provided on the substrate so as to avoid the through-hole and fixing the assembly to the substrate.

Description

Technical Field

[0001] This disclosure relates to imaging devices and methods for manufacturing imaging devices. Background Technology

[0002] Typically, in the manufacture of imaging devices such as automotive cameras, the following method is used to fix the retainer of the lens to the substrate on which the imaging element is mounted: the retainer is placed on the surface of the substrate via a UV (ultraviolet) curing adhesive, the positional relationship between the lens unit and the imaging element is adjusted (after alignment), the adhesive is irradiated with UV light to pre-cure it, and then the pre-cured adhesive is fully cured in a heat curing oven or the like.

[0003] During complete curing, the adhesive cannot withstand the increased pressure inside the holder, resulting in air bubbles that may shift the positional relationship between the lens unit and the imaging element (e.g., the focal point of the lens). To prevent this shift, a through-hole is provided in the substrate to allow pressure buildup inside the holder during complete curing to be released to the outside, ensuring that the internal pressure equalizes with the external pressure. However, foreign matter (e.g., dust, dirt, etc.) may enter the holder through the through-hole and adhere to the imaging element. To prevent this, the through-hole is blocked with a sheet such as breathable adhesive tape (see, for example, Patent Document 1).

[0004] [List of Citations]

[0005] [Patent Literature]

[0006] [PTL 1] International Publication No. 2021 / 020256 Summary of the Invention

[0007] [Technical Issues]

[0008] However, in techniques using sheet materials such as the aforementioned adhesive tape, it is necessary to ensure the area on the substrate used for bonding the sheet is adequate. Therefore, for example, it is difficult to apply the sheet to a substrate with many components. Typically, considering the sheet bonding displacement caused by manual or automatic bonding machines, the area used for bonding the sheet is often set to be relatively large. Ensuring such an area makes high-density mounting difficult.

[0009] Therefore, this disclosure provides an imaging device and a method for manufacturing an imaging device, which can achieve high-density mounting while suppressing the offset of the positional relationship between the lens unit and the imaging element and the entry of foreign objects.

[0010] [Solution to the problem]

[0011] An imaging apparatus according to one aspect of the present disclosure includes: a substrate having an imaging element; a retainer disposed on the substrate, the retainer holding a lens unit and forming an internal space together with the substrate and the lens unit for receiving the imaging element; an adhesive portion that causes the substrate and the retainer to be in close contact with each other; a through hole formed in the substrate and leading to the internal space; an assembly spaced apart from the substrate and covering the through hole; and a fixing portion disposed on the substrate, avoiding the through hole, and fixing the assembly to the substrate.

[0012] A method of manufacturing an imaging device according to one aspect of the present disclosure includes: disposing a retainer to a substrate having an imaging element by means of an adhesive, the retainer holding a lens unit and forming an internal space together with the substrate and the lens unit for receiving the imaging element; performing alignment between the lens unit and the imaging element; and curing the adhesive after performing the alignment, wherein the substrate has: a through hole formed in the substrate and leading to the internal space; an assembly spaced apart from the substrate and covering the through hole; and a fixing portion disposed on the substrate, avoiding the through hole, and fixing the assembly to the substrate. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view illustrating an example configuration of an imaging apparatus according to an embodiment of the present disclosure.

[0014] Figure 2 This is a cross-sectional view showing an example configuration of the cover according to an embodiment of the present disclosure.

[0015] Figure 3 This is a plan view illustrating an example configuration of the cover according to an embodiment of the present disclosure.

[0016] Figure 4 This is an explanatory diagram illustrating the manufacturing process of an imaging device according to an embodiment of the present disclosure.

[0017] Figure 5 This is a cross-sectional view illustrating a configuration example of an imaging device according to a comparative example of an embodiment of the present disclosure.

[0018] Figure 6 This is a cross-sectional view illustrating an example configuration of an imaging device according to a variant 1 of the present disclosure.

[0019] Figure 7 This is a cross-sectional view showing an example configuration of the cover of an imaging device according to a variant 2 of the present disclosure.

[0020] Figure 8 This is a plan view showing an example configuration of the cover of an imaging device according to a variant 2 of the present disclosure.

[0021] Figure 9 This is a block diagram illustrating a schematic configuration example of a vehicle control system.

[0022] Figure 10 This is an explanatory diagram showing an example of the installation location of the vehicle exterior information detection unit and the imaging unit. Detailed Implementation

[0023] Embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The embodiments also include examples, variations, etc. It should be noted that the devices, methods, systems, etc., according to the present disclosure are not limited to the embodiments. Furthermore, in the embodiments, repeated descriptions are omitted by assigning the same reference numerals to substantially the same parts.

[0024] This disclosure will be described in the following order.

[0025] 1. Example

[0026] 1-1. Example of Imaging Equipment Configuration

[0027] 1-2. Example of cover configuration

[0028] 1-3. Examples of processing in the manufacturing process of imaging equipment

[0029] 1-4. Variation 1

[0030] 1-5. Variation 2

[0031] 1-6. Actions and Effects

[0032] 2. Other embodiments

[0033] 3. Application Examples

[0034] 4. Supplementary Explanation

[0035] <1. Example>

[0036] <1-1. Example of Imaging Equipment Configuration>

[0037] Reference Figure 1 A configuration example of the imaging device 1 according to this embodiment is described. Figure 1 This is a cross-sectional view showing an example configuration of the imaging device 1 according to this embodiment.

[0038] like Figure 1 As shown, the imaging device 1 according to this embodiment includes a substrate 10, an imaging element 20, a lens unit 30, a holder 40, an adhesive portion 50, and a cover portion 60.

[0039] The substrate 10 has an inner surface (first surface) A1, an outer surface (second surface) A2, and a through hole 11. Each of the inner surface A1 and the outer surface A2 is planar, and the inner surface A1 and the outer surface A2 face each other. The through hole 11 is formed to extend from the inner surface A1 to the outer surface A2 along the Z-axis direction. For example, a through hole, a through-hole, or a via hole can be used as the through hole 11. Furthermore, for example, an organic substrate, an inorganic substrate, or the like can be used as the substrate 10.

[0040] Imaging element 20 is disposed on the inner surface A1 of substrate 10. For example, a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor or a CCD (Charge-Coupled Device) image sensor may be used as imaging element 20. It should be noted that, in addition to imaging element 20, various electronic components (e.g., chips, resistors, connectors, capacitors, etc.) are also mounted on substrate 10.

[0041] The lens unit 30 has multiple lenses 31 and 32 and a lens barrel portion 33. Each lens 31 and 32 is disposed inside the lens barrel portion 33. Figure 1 In the example, two lenses 31 and 32 are positioned at two ends of the lens barrel portion 33 in the Z-axis direction (optical axis direction). The lens barrel portion 33 holds each lens 31 and 32. Each lens 31 and 32 may be, for example, a biconvex lens, a plano-convex lens, a biconcave lens, a plano-concave lens, a meniscus lens, etc.

[0042] The retainer 40 holds the lens unit 30. The retainer 40 holds, for example, one end of the lens barrel portion 33 of the lens unit 30 in the Z-axis direction. For example, one end of the lens barrel portion 33 in the Z-axis direction is inserted into the receiving hole 41 of the retainer 40, and the outer peripheral portion of this end is tightly secured to the receiving hole 41. The retainer 40 may be a metal retainer, such as one made of die-cast aluminum.

[0043] The retainer 40 of the lens unit 30 is disposed on the inner surface A1 of the substrate 10 via an adhesive portion 50, so as to form an internal space 42 for accommodating the imaging element 20 together with the substrate 10 and the lens unit 30. The internal space 42 is connected to the external space via a through hole 11 in the substrate 10. The retainer 40 is bonded and fixed to the inner surface A1 of the substrate 10 via the adhesive portion 50. Thus, the retainer 40 and the substrate 10 are in close contact (without gaps). Note that when there is no through hole 11 in the substrate 10, the imaging element 20 in the internal space 42 is in a sealed state.

[0044] An adhesive portion 50 is provided annularly on the inner surface A1 of the substrate 10. This adhesive portion 50 secures the retainer 40 in close contact with the inner surface A1 of the substrate 10. At this time, the outer peripheral region of the inner surface A1 of the substrate 10 and the lower surface of the outer peripheral wall of the retainer 40 ( Figure 1 The adhesive portion 50 is in close contact with the lower surface of the adhesive. The adhesive portion 50 may be formed, for example, by a hybrid adhesive (a light-curing and a heat-curing adhesive) having both light-curing and heat-curing properties.

[0045] The cover portion 60 has an assembly 61 and a fixing portion 62. The fixing portion 62 has a first retaining member 62a and a second retaining member 62b. The first retaining member 62a and the second retaining member 62b hold the assembly 61. The assembly 61 is spaced apart from the outer surface A2 of the substrate 10 and covers the through hole 11, and is fixed to the outer surface A2 of the substrate 10 by the fixing portion 62. Details of such a cover portion 60 will be described later.

[0046] Although the aforementioned through-hole 11 extends parallel to the Z-axis direction, it can extend obliquely relative to the Z-axis direction, or it can extend in a curved manner, such as in a stepped or zigzag shape. Furthermore, although the lens unit 30 and the retainer 40 are formed as separate bodies as described above, they can be formed integrally. In addition, besides hybrid adhesives, the adhesive portion 50 can also be formed with an adhesive that only has thermosetting properties (thermosetting adhesive).

[0047] <1-2. Example of cover configuration>

[0048] Reference Figure 2 and Figure 3 A configuration example of the cover 60 according to this embodiment is described. Figure 2 This is a cross-sectional view showing an example configuration of the cover 60 according to this embodiment. Figure 3 This is a plan view showing an example configuration of the cover 60 according to this embodiment.

[0049] like Figure 2 and Figure 3 As shown, the cover 60 has a component 61 and a fixing part 62. Figure 2 and Figure 3 In the example, multiple conductive layers 12a, 12b, 12c, 12d and multiple protective layers 13a, 13b are disposed on the outer surface A2 of the substrate 10.

[0050] Conductive layers 12a and 12d are, for example, pads. Conductive layers 12b and 12c are, for example, wiring patterns. Conductive layers 12b and 12c are provided with through-holes 11 therebetween. Conductive layers 12a and 12d are provided with through-holes 11, and conductive layers 12b and 12c are provided therebetween.

[0051] Protective layer 13a contacts and covers conductive layer 12b. Protective layer 13b contacts and covers conductive layer 12c. These protective layers 13a and 13b are in contact with component 61, for example. Each protective layer 13a and 13b may be formed, for example, by solder resist.

[0052] The via 11 has a conductive layer 11a. This conductive layer 11a includes pads 11b. For example, the via 11 is a through-hole having a conductive layer 11a, such as copper foil, on its inner peripheral surface. Note that, besides a through-hole, the via 11 can also be, for example, a via, a through-hole, etc., as described above. The diameter of the via 11 can be proportional to the thickness of the substrate 10, for example. For instance, when the thickness of the substrate 10 is 1 mm, the diameter of the via 11 can be approximately 0.5 mm.

[0053] Component 61 is spaced a predetermined distance from the outer surface A2 of substrate 10 and covers the through-hole 11 of substrate 10. Component 61 may be, for example, an electronic component such as a chip, or a substrate such as a copper plate. In addition to chips such as semiconductor chips and IC (integrated circuit) chips, electronic components may also include, for example, resistors, connectors, capacitors, etc.

[0054] The fixing part 62 has a first retaining member 62a and a second retaining member 62b. The first retaining member 62a and the second retaining member 62b are disposed on the outer surface A2 of the substrate 10, that is, on the conductive layer 12a and the conductive layer 12d, avoiding the through hole 11 of the substrate 10. The first retaining member 62a and the second retaining member 62b are formed of, for example, solder.

[0055] The first retaining member 62a and the second retaining member 62b together hold the assembly 61 and fix the held assembly 61 to the outer surface A2 of the substrate 10. The first retaining member 62a holds the first end 61a of the assembly 61, and the second retaining member 62b holds the second end 61b. The first end 61a and the second end 61b face each other. Therefore, the first retaining member 62a and the second retaining member 62b are also arranged to face each other.

[0056] Here, the separation distance B1 between the through-hole 11 and the component 61 is set according to the desired foreign object size (e.g., about 20 to 80 μm) to prevent it from entering the through-hole 11. For example, if the desired foreign object size is 50 μm, the separation distance B1 is set to 50 μm or less of the desired separation distance. Figure 2 In the example, the separation distance B1 is the length of the gap in the Z-axis direction between the end C1 on the component 61 side of the through hole 11 and the surface C2 on the substrate 10 side of the component 61.

[0057] Note that here, the desired foreign object size is the minimum size among foreign object sizes that prevent it from entering the through-hole 11. That is, the desired foreign object size is the maximum size among foreign object sizes that are considered acceptable (not causing problems) even if the foreign object enters the through-hole 11. The desired foreign object size can be expressed as the acceptable foreign object size. The minimum size among foreign object sizes that prevents it from entering the through-hole 11, or the maximum size among foreign object sizes that are considered acceptable (not causing problems) even if the foreign object enters the through-hole 11, is called the foreign object size threshold. The acceptable foreign object size is calculated based on the size of the light beam incident on a photoelectric conversion element of the imaging element 20, which is incident on the surface of the lens unit 30 side of the cover glass arranged on the upper surface of the imaging element 20. The size of the light beam incident on a photoelectric conversion element of the imaging element 20 is calculated based on the distance from the image plane of the imaging element 20 to the surface of the cover glass arranged on the upper surface of the imaging element 20 on the imaging element 20 side, the thickness of the cover glass, the distance from the image plane of the imaging element 20 to the surface of the lens unit 30 side of the cover glass, the incident angle of light incident on the cover glass from the space on the lens unit 30 side, and the exit angle of light when light incident on the cover glass from the space on the lens unit 30 side exits the cover glass from the space on the lens unit 30 side.

[0058] The separation distance B1 is changed to a desired separation distance by adjusting the thickness (length in the Z-axis direction) of each of the first retaining member 62a and the second retaining member 62b. The thickness of each of the first retaining member 62a and the second retaining member 62b is adjusted by adjusting the amount of solder to be applied or the area where the solder is applied and spread (e.g., each planar dimension of conductive layers 12a and 12d). For example, by adjusting the amount or area of ​​solder, the thickness of the solder present between the first end 61a of the component 61 and the conductive layer 12a changes, and the thickness of the solder present between the second end 61b of the component 61 and the conductive layer 12d also changes.

[0059] The height position of assembly 61 is adjusted by changing the thickness of each of the first retaining member 62a and the second retaining member 62b, and the separation distance B1 is set to be equal to or less than the desired foreign object size (a predetermined foreign object size threshold). That is, by setting the separation distance B1 to the desired separation distance, foreign objects (dust, dirt, etc.) (e.g., foreign objects that adversely affect the imaging of the imaging element 20) that are to be prevented from entering the through hole 11 are suppressed from entering the internal space 42 of the retainer 40.

[0060] Note that although the desired separation distance B1 is set to be equal to or less than the desired foreign object size, in some cases the separation distance B1 can be greater than the desired foreign object size. For example, if the desired foreign object size is 50 μm, the separation distance B1 can be set to 55 μm. Even in this case, foreign objects can be prevented from entering the internal space 42 of the retainer 40.

[0061] Here, if component 61 completely blocks the via 11, it may cause internal pressure expansion. However, since each of the conductive layers 12b and 12c and each of the protective layers 13a and 13b are present between component 61 and substrate 10, the separation distance B1 can be ensured even when an external force is applied to component 61, and component 61 can be prevented from completely blocking the via 11.

[0062] For example, in the plan view, each of the conductive layers 12b and 12c is configured to have a through-hole 11 between them. Therefore, in the plan view, each of the protective layers 13a and 13b is also configured to have a through-hole 11 between them (see...). Figure 3 Each of the protective layers 13a and 13b is in contact with component 61.

[0063] The conductive layer 12b and the protective layer 13a constitute components that contact the surface C2 on the substrate 10 side of the assembly 61. Similarly, the conductive layer 12c and the protective layer 13b also constitute components that contact the surface C2 on the substrate 10 side of the assembly 61. These components contact the surface C2 on the substrate 10 side of the assembly 61 and serve as spacer portions for ensuring the separation distance B1. Furthermore, since these components are present around the through-hole 11, foreign matter can be prevented from entering the through-hole 11.

[0064] If component 61 is a non-conductive material, it is not electrically affected on the substrate 10. On the other hand, when component 61 is a conductive material such as an electronic component and component 61 is soldered to conductive layers 12a and 12d, component 61 is electrically affected on the substrate 10. During soldering, the first retaining member 62a and the second retaining member 62b are formed by solder.

[0065] To suppress the influence of electrical conduction on the substrate 10 of the aforementioned component 61, conductive layers 12a and 12d may be connected to the ground (GND) potential of the substrate 10, for example. That is, via 11 may be formed in the ground region (the region of ground potential) of the substrate 10, and component 61 may be disposed in the ground region of the substrate 10 to cover via 11.

[0066] Note that, for example, when component 61 is a non-conductive material, or when the component is not affected by electricity, the via 11 can be formed in an area outside the grounding area of ​​the substrate 10, and component 61 can be disposed in an area outside the grounding area of ​​the substrate 10 to cover the via 11.

[0067] <1-3. Examples of Processing in the Manufacturing of Imaging Equipment>

[0068] Reference Figure 4 and Figure 5 A processing example of the manufacturing process of the imaging device 1 according to this embodiment is described. Figure 4 This is an explanatory diagram showing the manufacturing process of the imaging device 1 according to this embodiment. Figure 5 This is a cross-sectional view showing a configuration example of the imaging device 1A according to a comparative example of this embodiment.

[0069] like Figure 4 As shown, the manufacturing process of the imaging device 1 according to this embodiment includes an adhesive application process (step S11), a retainer installation process (step S12), an alignment process (step S13), a pre-curing process (step S14), and a complete curing process (step S15).

[0070] In the adhesive application process of step S11, a mixed adhesive is applied to the inner surface A1 of the substrate 10 using an application needle or the like (see...). Figure 1 The adhesive is applied in a rectangular annular shape, for example, according to the planar shape of the outer peripheral wall of the retainer 40 (the planar shape of the entire circumference). A mixed-type adhesive is used, for example, as the adhesive. It should be noted that a through-hole 11 is formed in the substrate 10, and furthermore, a cover portion 60 is provided on the outer surface A2 of the substrate 10 (see...). Figure 1 ).

[0071] In the retainer mounting process of step S12, the retainer 40 of the retaining lens unit 30 is placed on the inner surface A1 of the substrate 10 via the aforementioned adhesive (see [link]). Figure 1 The adhesive is present between the inner surface A1 of the substrate 10 and the lower surface of the outer peripheral wall of the retainer 40. It should be noted that the lens unit 30 is provided and fixed to the retainer 40 prior to the retainer mounting process.

[0072] In the alignment process of step S13, alignment is performed between the lens unit 30 held by the retainer 40 provided on the inner surface A1 of the substrate 10 and the imaging element 20 mounted on the substrate 10 (see [link]). Figure 1Thus, the optical axes of the lens unit 30 and the imaging element 20 are aligned, and the positional relationship between the lens unit 30 and the imaging element 20 is determined. As an alignment method, six-axis alignment is performed, for example, by means of an MTF (modulation transfer function) measurement method.

[0073] The MTF measurement method is defined by ISO (International Organization for Standardization) 12233. In this method, a camera (e.g., imaging element 20) photographs a graph depicting the MTF measurement pattern, and the reproducibility of the contrast of the graph is evaluated. It is important to note that, regarding the adjustment of the positional relationship between the lens unit 30 and the imaging element 20, six-axis alignment has become mainstream due to the increased resolution and miniaturization of the imaging element 20.

[0074] In the pre-curing process of step S14, after the alignment described above, light such as UV light is irradiated onto the adhesive on the inner surface A1 of the substrate 10 (see...). Figure 1 Thus, the adhesive is pre-cured, and the substrate 10 and the retainer 40 are pre-fixed by the adhesive.

[0075] In the complete curing process of step S15, after the above pre-curing, heat is applied to the adhesive on the inner surface A1 of the substrate 10 (see...). Figure 1 For example, the pre-cured imaging device 1 is placed in a heat curing oven, and heat is applied to the adhesive on the inner surface A1 of the substrate 10. As a result, the adhesive is completely cured, and the substrate 10 and the holder 40 are completely fixed together by the adhesive (adhesive portion 50). At this time, the substrate 10 and the holder 40 are in close contact with each other.

[0076] Here, as Figure 5 As shown, in the comparative example imaging device 1A, the through-hole 11 is not present in the substrate 10, and the cover 60 is also absent. In this case, when complete curing is performed in step S15 above, the adhesive cannot withstand the pressure increase in the internal space 42 of the holder 40, and air bubbles 51 may be generated in the adhesive. Due to the generation of these air bubbles 51, the positional relationship between the lens unit 30 and the imaging element 20 (e.g., the focal position of the lens unit 30) may shift.

[0077] On the other hand, in the imaging device 1 of this embodiment, a through hole 11 is formed in the substrate 10 (see...). Figure 1Since the through-hole 11 connects the internal space 42 of the retainer 40 to the external space, the pressure rise in the internal space 42 of the retainer 40 during complete curing is released to the outside, and the pressure in the internal space 42 of the retainer 40 is equal to the external pressure. As a result, since the generation of air bubbles 51 in the adhesive, i.e., in the adhesive portion 50, becomes suppressable, the shift in the positional relationship between the lens unit 30 and the imaging element 20 can be suppressed.

[0078] Furthermore, the through hole 11 is covered by the cover portion 60 (see Figure 1 Therefore, since foreign objects such as dust and dirt can be prevented from entering the internal space 42 of the holder 40 through the through hole 11, foreign objects can be prevented from adhering to the imaging element 20. That is, foreign objects can be prevented from entering the imaging device 1. It should be noted that the cover 60 is provided, for example, on the outer surface A2 of the substrate 10, that is, on the surface of the substrate 10 opposite to the imaging element 20 side.

[0079] Furthermore, since the cover portion 60 can cover the through-hole 11 in a smaller space compared to sheets such as adhesive tape, high-density mounting can be achieved. Moreover, even with miniaturized components 61 and 62 of the cover portion 60, component 61 can be more reliably fixed to the substrate 10 compared to sheets such as adhesive tape. Furthermore, while attaching sheets to the substrate 10 by manual or automatic adhesive bonding requires bonding processing, when mounting component 61 onto the substrate 10, component mounting can be performed in a normal component mounting process, simplifying the manufacturing process.

[0080] <1-4. Variation 1>

[0081] Reference Figure 6 A variation 1 of the imaging device 1 according to this embodiment is described. Figure 6 This is a cross-sectional view showing an example configuration of imaging device 1 according to variant 1 of this embodiment.

[0082] like Figure 6 As shown, in variant 1, the cover portion 60 is provided on the inner surface A1 of the substrate 10. The inner surface A1 is the surface of the substrate 10 on the side of the imaging element 20.

[0083] The component 61 of the cover 60 is spaced apart from the inner surface A1 of the substrate 10 by a predetermined distance and covers the through hole 11 of the substrate 10. The fixing portion 62, namely the first retaining member 62a and the second retaining member 62b, is provided on the inner surface A1 of the substrate 10, avoiding the through hole 11 of the substrate 10. These first retaining members 62a and the second retaining member 62b fix the component 61 to the inner surface A1 of the substrate 10.

[0084] In this variant 1, similar to the above embodiment, the offset of the positional relationship between the lens unit 30 and the imaging element 20 can be suppressed, the entry of foreign objects into the imaging device 1 can be suppressed, and in addition, high-density mounting can be achieved. It should be noted that, similar to the above embodiment, the other effects also mentioned above can be obtained.

[0085] <1-5. Variation 2>

[0086] Reference Figure 7 and Figure 8 A variation 2 of the imaging device 1 according to this embodiment is described. Figure 7 This is a cross-sectional view showing an example configuration of the cover 60 of the imaging device 1 according to variant 2 of this embodiment. Figure 8 This is a plan view showing an example configuration of the cover 60 of the imaging device 1 according to variant 2 of this embodiment.

[0087] like Figure 7 As shown, in Modified Example 2, protective layers 13a and 13b do not contact component 61. That is, there is a gap between each of protective layers 13a and 13b and component 61.

[0088] like Figure 8 As shown, conductive layers 12b and 12c are connected by conductive layers 12e and 12f. For example, these conductive layers 12b, 12c, 12e, and 12f are arranged in a rectangular annular shape, thereby surrounding the through-hole 11 in the plan view.

[0089] Protective layers 13a and 13b are connected by protective layers 13c and 13d. For example, these protective layers 13a, 13b, 13c, and 13d are arranged in a rectangular annular shape to surround the through hole 11 in a plan view.

[0090] Protective layer 13c covers conductive layer 12e, and protective layer 13d covers conductive layer 12f. Protective layers 13c and 13d do not contact component 61, similar to protective layers 13a and 13b. That is, there is a gap between each of protective layers 13c and 13d and component 61.

[0091] Conductive layer 12b and protective layer 13a constitute a component located around the via 11 of the substrate 10 and spaced apart from component 61. Similarly, conductive layer 12c and protective layer 13b also constitute a component located around the via 11 of the substrate 10 and spaced apart from component 61. Furthermore, conductive layer 12e and protective layer 13c also constitute a component located around the via 11 of the substrate 10 and spaced apart from component 61. Conductive layer 12f and protective layer 13d also constitute a component located around the via 11 of the substrate 10 and spaced apart from component 61.

[0092] In this modified example 2, similar to the above embodiment, the shift in the positional relationship between the lens unit 30 and the imaging element 20 can be suppressed, foreign objects entering the imaging device 1 can be suppressed, and high-density mounting can be achieved. Note that, similar to the above embodiment, the other effects described above can also be obtained.

[0093] In Modified Example 2, none of the protective layers 13a to 13d are in contact with component 61; however, for example, any one or more of the protective layers 13a to 13d may be in contact with component 61. Note that the separation distance between protective layer 13a and component 61 may be equal to, or smaller than, the separation distance B1 between via 11 and component 61. For example, if the separation distance B1 is equal to or less than the desired separation distance (e.g., 50 μm), then the separation distance between protective layer 13a and component 61 may be greater than 0. On the other hand, when the separation distance B1 is greater than the desired separation distance, it is desirable that the separation distance between protective layer 13a and component 61 is equal to or less than the desired separation distance. This also applies to the other protective layers 13b to 13d.

[0094] <1-6. Actions and Effects>

[0095] As described above, the imaging device 1 according to this embodiment includes: a substrate 10 having an imaging element 20; a holder 40 disposed on the substrate 10, holding a lens unit 30, and forming an internal space 42 together with the substrate 10 and the lens unit 30 for accommodating the imaging element 20; an adhesive portion 50 such that the substrate 10 and the holder 40 are in close contact with each other; a through hole 11 formed in the substrate 10 and leading to the internal space 42; an assembly 61 spaced apart from the substrate 10 and covering the through hole 11; and a fixing portion 62 disposed on the substrate 10 to avoid the through hole 11 and fix the assembly 61 to the substrate 10 (see See Figures 1 to 3 (etc.). Thus, the pressure rise during complete curing in the internal space 42 of the retainer 40 is released to the outside through the through-hole 11, and the generation of air bubbles 51 in the adhesive portion 50 becomes suppressed, thereby suppressing the shift in the positional relationship between the lens unit 30 and the imaging element 20. Furthermore, since foreign matter such as dust and dirt can be prevented from entering the internal space 42 of the retainer 40 through the through-hole 11, the entry of foreign matter into the imaging device 1 can be suppressed. Moreover, since the cover portion 60 can cover the through-hole 11 in a smaller space compared to a sheet such as tape, high-density mounting can be achieved.

[0096] In addition, component 61 may be an electronic component (see Figures 1 to 3 (etc.). This ensures that high-density installation can be achieved.

[0097] Furthermore, component 61 may be disposed on the surface of substrate 10 opposite to the imaging element 20 side (outer surface A2) (see [reference]). Figure 1 (etc.). This can increase design freedom.

[0098] Furthermore, component 61 may be disposed on the surface of substrate 10 on the side of imaging element 20 (inner surface A1) (see [reference]). Figure 6 This increases design freedom.

[0099] Furthermore, the separation distance B1 between the through-hole 11 and the component 61 can be set to be equal to or less than the foreign object size threshold (see [reference]). Figure 2 and Figure 3 Therefore, it is possible to reliably prevent foreign objects from entering the imaging device 1.

[0100] Furthermore, the fixing part 62 may have a first retaining member 62a and a second retaining member 62b, the first retaining member 62a retaining the first end 61a of the assembly 61, and the second retaining member 62b retaining the second end 61b (see [link]). Figure 2 and Figure 3 Thus, the component 61 located above the through hole 11 of the substrate 10 can be held, and the held component 61 can be fixed to the substrate 10.

[0101] Furthermore, the first retaining member 62a and the second retaining member 62b can be arranged opposite to each other (see [reference]). Figure 2 and Figure 3 Therefore, the component 61 located above the through hole 11 of the substrate 10 can be reliably maintained.

[0102] Furthermore, the first retaining member 62a and the second retaining member 62b can be formed of solder (see [link]). Figure 2 and Figure 3 Therefore, component 61 can be securely fixed to substrate 10.

[0103] Furthermore, the separation distance B1 between the through hole 11 and the component 61 can be determined by the thickness of each of the first retaining member 62a and the second retaining member 62b (see [reference]). Figure 2 and Figure 3 Therefore, the separation distance B1 can be easily adjusted.

[0104] Furthermore, even when the separation distance B1 is determined by the thickness of each of the first retaining member 62a and the second retaining member 62b, the separation distance B1 can be set to be equal to or less than the foreign object size threshold (see [link to relevant documentation]). Figure 2 and Figure 3 Therefore, it is possible to reliably prevent foreign objects from entering the imaging device 1.

[0105] Furthermore, the imaging device 1 may also include components (e.g., conductive layer 12b, protective layer 13a, conductive layer 12c, protective layer 13b, etc.) disposed on the substrate 10 to avoid the through-hole 11 and to contact the surface C2 of the component 61 on the substrate 10 side (see See Figure 2 and Figure 3 Therefore, for example, even when an external force is applied to component 61, the separation distance B1 can be ensured, and component 61 can be prevented from completely blocking the through hole 11. Furthermore, since the aforementioned component is present around the through hole 11, foreign objects can be prevented from entering the through hole 11.

[0106] Furthermore, the component that contacts the surface C2 on the substrate 10 side of the component 61 may have a conductive layer 12b (or conductive layer 12c) disposed on the substrate 10 and a protective layer 13a (or protective layer 13b) disposed on the substrate 10 and covering the conductive layer 12b (see See). Figure 2 and Figure 3 Therefore, the above-mentioned components can be formed using a simple construction.

[0107] Furthermore, the imaging device 1 may also include components disposed on the substrate 10 to avoid the through-hole 11 and located around the through-hole 11 and spaced apart from the component 61 (e.g., conductive layer 12b, protective layer 13a, conductive layer 12c, protective layer 13b, etc.) (see See Figure 7 and Figure 8 Therefore, since the aforementioned components are present around the through hole 11, foreign objects can be prevented from entering the through hole 11.

[0108] Furthermore, components spaced apart from component 61 can be directly disposed below component 61 (see [reference]). Figure 7 and Figure 8 Thus, for example, even when an external force is applied to component 61, the separation distance B1 can be ensured, and component 61 can be prevented from completely blocking the through hole 11.

[0109] Furthermore, the components spaced apart from component 61 can be formed to surround the through hole 11 in the plan view (see Figure 7 and Figure 8 Therefore, since the aforementioned components are present around the through hole 11 to surround the through hole 11, foreign objects can be reliably prevented from entering the through hole 11.

[0110] Furthermore, components spaced apart from component 61 may have a conductive layer 12b (or conductive layer 12c) disposed on substrate 10 (see [reference]). Figure 7 and Figure 8 Therefore, the above-mentioned components can be formed using a simple construction.

[0111] Furthermore, components spaced apart from component 61 may have a protective layer 13a (or protective layer 13b) disposed on substrate 10 and covering conductive layer 12b (see [link]). Figure 7 and Figure 8 Therefore, the above-mentioned components can be formed using a simple construction.

[0112] Furthermore, via 11 can be formed in the ground region of substrate 10 (see [reference]). Figure 1 (etc.). Thus, for example, even when component 61 is a conductive material such as an electronic component, the electrical influence of component 61 on substrate 10 can be suppressed.

[0113] Furthermore, the adhesive portion 50 can be formed from a hybrid adhesive having both photocurable and thermocurable properties (see [link]). Figure 1 (etc.). Thus, the substrate 10 and the retainer 40 can be reliably and tightly contacted and fixed.

[0114] <2. Other embodiments>

[0115] Each construct, each process, etc., according to the above embodiments (including examples and variations) can be implemented in various different forms than the above embodiments. For example, each construct, each process, etc., is not limited to the above examples and can be in various aspects. Furthermore, for example, unless otherwise specifically indicated, information including the construct, process, specific name, or various data and parameters shown in the above documents and figures can be arbitrarily changed.

[0116] Furthermore, each construct, each process, etc., according to the above embodiments (including examples and variations) need not be physically configured as shown in the figures. That is, the specific distribution and integration of each construct, each process, etc., is not limited to the form shown in the figures, and can be configured in any unit as all or part of the functionally or physically distributed or integrated, depending on various loads, usage conditions, etc.

[0117] Furthermore, each construction, each process, etc., according to the above embodiments (including examples and variations) can be appropriately combined. For example, a portion of at least one embodiment can be appropriately combined with a portion of at least another embodiment. Moreover, the effects in the embodiments are merely illustrative and not limiting, and other effects may exist.

[0118] <3. Application Examples>

[0119] The technology disclosed herein can be applied to a variety of products. For example, the technology disclosed herein can be implemented as a device installed on any type of mobile body such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, aircraft, drones, ships, robots, construction machinery, agricultural machinery (tractors), etc. Furthermore, for example, the technology disclosed herein can be implemented as a device installed on endoscopic surgical systems, microsurgical systems, etc.

[0120] Figure 9 This is a block diagram illustrating a schematic construction example of a vehicle control system 7000, which is an example of a mobile body control system to which the technology according to this disclosure can be applied. The vehicle control system 7000 includes multiple electronic control units connected via a communication network 7010. Figure 9 In the example shown, the vehicle control system 7000 includes a drive system control unit 7100, a body system control unit 7200, a battery control unit 7300, an external information detection unit 7400, an internal information detection unit 7500, and an integrated control unit 7600. The communication network 7010 connecting these multiple control units can be, for example, an in-vehicle communication network conforming to any standard such as CAN (Controller Area Network), LIN (Local Interconnect Network), LAN (Local Area Network), or FlexRay (registered trademark).

[0121] Each control unit includes a microcomputer that performs arithmetic processing according to various programs, a storage unit that stores programs executed by the microcomputer or parameters used for various calculations, and drive circuits that drive various devices to be controlled. Each control unit includes a network I / F for communicating with other control units via a communication network 7010, and also includes a communication I / F for communicating with devices or sensors inside or outside the vehicle via wired or wireless communication. Figure 9 The functional structure of the integrated control unit 7600 is shown, including a microcomputer 7610, a general communication I / F 7620, a dedicated communication I / F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle equipment I / F 7660, an audio / video output unit 7670, an in-vehicle network I / F 7680, and a storage unit 7690. Similarly, other control units also include microcomputers, communication I / Fs, and storage units.

[0122] The drive system control unit 7100 controls the operation of devices related to the vehicle's drive system according to various programs. For example, the drive system control unit 7100 functions as a drive force generating device for generating vehicle driving force such as an internal combustion engine or drive motor, a drive force transmission mechanism for transmitting driving force to the wheels, a steering mechanism for adjusting the vehicle's steering angle, and a braking device for generating vehicle braking force. The drive system control unit 7100 may also function as a control device such as ABS (Anti-lock Braking System) or ESC (Electronic Stability Control).

[0123] The vehicle status detection unit 7110 is connected to the drive system control unit 7100. The vehicle status detection unit 7110 includes, for example, at least one sensor for detecting the angular velocity of the vehicle body axis rotation, an acceleration sensor for detecting vehicle acceleration, or sensors for detecting accelerator pedal operation, brake pedal operation, steering wheel angle, engine speed, wheel speed, etc. The drive system control unit 7100 performs arithmetic processing using signals input from the vehicle status detection unit 7110 and controls the internal combustion engine, drive motor, electric power steering, braking system, etc.

[0124] The body system control unit 7200 controls the operation of various devices installed on the vehicle body according to various programs. For example, the body system control unit 7200 is used as a control device for keyless entry systems, smart key systems, power window devices, or various lights such as headlights, taillights, brake lights, turn signals, or fog lights. In this case, the body system control unit 7200 can receive radio waves or signals from various switches transmitted from a portable device that replaces the key. The body system control unit 7200 accepts these radio wave or signal inputs and controls the vehicle's door locking devices, power window devices, lights, etc.

[0125] The battery control unit 7300 controls the secondary battery 7310, which serves as a power source for the drive motor, according to various programs. For example, the battery control unit 7300 receives information such as battery temperature, battery output voltage, or remaining battery capacity from the battery device equipped with the secondary battery 7310. The battery control unit 7300 uses these signals to perform arithmetic processing and control the temperature regulation of the secondary battery 7310 or the cooling device equipped in the battery device, etc.

[0126] The exterior information detection unit 7400 detects information about the exterior of the vehicle installed in the vehicle control system 7000. For example, at least one of the imaging unit 7410 and the exterior information detection section 7420 is connected to the exterior information detection unit 7400. The imaging unit 7410 includes at least one of a TOF (Time-of-Flight) camera, a stereo camera, a monocular camera, an infrared camera, and other cameras. The exterior information detection section 7420 includes at least one of, for example, an environmental sensor for detecting current weather or meteorological conditions, or a surrounding information detection sensor for detecting other vehicles, obstacles, pedestrians, etc., around the vehicle installed in the vehicle control system 7000.

[0127] The environmental sensor can be at least one of, for example, a rain sensor for detecting rain, a fog sensor for detecting fog, a sunlight sensor for detecting sunlight intensity, and a snow sensor for detecting snowfall. The ambient information detection sensor can be at least one of an ultrasonic sensor, a radar device, and a LiDAR (light detection and ranging, laser imaging detection and ranging) device. These imaging units 7410 and the external information detection section 7420 can be provided as independent sensors or devices, or they can be provided as a device in which multiple sensors or devices are integrated.

[0128] here, Figure 10 An example of the mounting positions of the imaging unit 7410 and the vehicle exterior information detection unit 7420 is shown. Imaging units 7910, 7912, 7914, 7916, and 7918 are disposed at at least one of the following locations: the front nose of the vehicle 7900, the side mirrors, the rear bumper, the rear door, and the upper part of the windshield inside the vehicle. Imaging unit 7910 disposed at the front nose and imaging unit 7918 disposed at the upper part of the windshield inside the vehicle primarily acquire images of the front of the vehicle 7900. Imaging units 7912 and 7914 disposed at the side mirrors primarily acquire images of the sides of the vehicle 7900. Imaging unit 7916 disposed at the rear bumper or rear door primarily acquires images of the rear of the vehicle 7900. Imaging unit 7918 disposed at the upper part of the windshield inside the vehicle is primarily used to detect vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc., ahead.

[0129] Notice, Figure 10Examples of the imaging ranges of the various imaging units 7910, 7912, 7914, and 7916 are shown. Imaging range a shows the imaging range of imaging unit 7910 located on the front nose; imaging ranges b and c show the imaging ranges of imaging units 7912 and 7914 located on the side mirrors, respectively; and imaging range d shows the imaging range of imaging unit 7916 located on the rear bumper or rear door. For example, by superimposing the image data captured by imaging units 7910, 7912, 7914, and 7916, a top-down view of the vehicle 7900 is obtained.

[0130] The exterior information detection units 7920, 7922, 7924, 7926, 7928, and 7930, located at the front, rear, sides, corners, and above the windshield inside the vehicle 7900, can be, for example, ultrasonic sensors or radar devices. The exterior information detection units 7920, 7926, and 7930, located at the front nose, rear bumper, rear door, and above the windshield inside the vehicle 7900, can be, for example, LiDAR devices. These exterior information detection units 7920 to 7930 are primarily used to detect vehicles, pedestrians, obstacles, etc., ahead.

[0131] return Figure 9 Continuing the description, the exterior information detection unit 7400 enables the imaging unit 7410 to capture images of the exterior of the vehicle and receives the captured image data. Furthermore, the exterior information detection unit 7400 receives detection information from the connected exterior information detection section 7420. When the exterior information detection section 7420 is an ultrasonic sensor, radar device, or LiDAR device, the exterior information detection unit 7400 causes it to emit ultrasonic waves or electromagnetic waves, and receives information about the reflected waves. Based on the received information, the exterior information detection unit 7400 can perform object detection processing or distance detection processing for identifying people, vehicles, obstacles, signs, characters on the road surface, etc. Based on the received information, the exterior information detection unit 7400 can perform environmental recognition processing for identifying rain, fog, road conditions, etc. Based on the received information, the exterior information detection unit 7400 can calculate the distance to objects outside the vehicle.

[0132] Furthermore, the exterior information detection unit 7400 can perform image recognition processing or distance detection processing based on the received image data to identify people, vehicles, obstacles, signs, characters on the road surface, etc. The exterior information detection unit 7400 can perform processing such as distortion correction or alignment on the received image data and synthesize image data captured by different imaging units 7410 to generate a top-down view or panoramic image. The exterior information detection unit 7400 can perform viewpoint transformation processing using image data captured by different imaging units 7410.

[0133] The in-vehicle information detection unit 7500 detects information inside the vehicle. For example, a driver state detection unit 7510 for detecting the driver's state is connected to the in-vehicle information detection unit 7500. The driver state detection unit 7510 may include a camera that captures an image of the driver, a biosensor that detects the driver's biological information, a microphone that picks up in-vehicle sounds, etc. The biosensor is disposed, for example, on the seat surface, steering wheel, etc., and detects the biological information of passengers sitting in the seat or drivers holding the steering wheel. The in-vehicle information detection unit 7500 may calculate the driver's fatigue level or concentration level based on the detection information input from the driver state detection unit 7510, or may determine whether the driver is dozing off. The in-vehicle information detection unit 7500 may perform processing such as noise cancellation on the picked-up audio signals.

[0134] The integrated control unit 7600 controls the overall operation within the vehicle control system 7000 according to various programs. An input unit 7800 is connected to the integrated control unit 7600. The input unit 7800 is implemented by a passenger-operable device, such as a touch panel, button, microphone, switch, or lever. Data obtained from voice recognition of sound input via the microphone can be input to the integrated control unit 7600. The input unit 7800 can be, for example, a remote control device utilizing infrared or other radio waves, or an external connection device such as a mobile phone or PDA (personal digital assistant) corresponding to the operation of the vehicle control system 7000. The input unit 7800 can be, for example, a camera, in which case the passenger can input information via gestures. Alternatively, data obtained by detecting the movement of a wearable device worn by the passenger can be input. Furthermore, the input unit 7800 may include, for example, an input control circuit that generates an input signal based on the information input using the aforementioned input unit 7800 and outputs it to the integrated control unit 7600. Passengers and others input various data or instruct processing operations to the vehicle control system 7000 by operating the input unit 7800.

[0135] The storage unit 7690 may include a ROM (Read-Only Memory) for storing various programs executed by a microcomputer and a RAM (Random Access Memory) for storing various parameters, calculation results, sensor values, etc. Furthermore, the storage unit 7690 may be implemented using magnetic storage devices such as HDDs (Hard Disk Drives), semiconductor storage devices, optical storage devices, magneto-optical storage devices, etc.

[0136] The Universal Communication I / F 7620 is a universal communication I / F for communication between various devices existing in the external environment 7750. The Universal Communication I / F 7620 can implement cellular communication protocols such as GSM (Global System for Mobile Communications), WiMAX, LTE (Long Term Evolution), or LTE-A (LTE-Advanced), or other wireless communication protocols such as Wireless LAN (also known as Wi-Fi) or Bluetooth. The Universal Communication I / F 7620 can connect to devices (e.g., application servers or control servers) existing on external networks (e.g., the Internet, cloud networks, or carrier-specific networks) via, for example, a base station or access point. Furthermore, the Universal Communication I / F 7620 can use, for example, P2P (peer-to-peer) technology to connect to terminals existing near the vehicle (e.g., terminals of drivers, pedestrians, or shops, or MTC (machine-type communication) terminals).

[0137] The Dedicated Communication I / F 7630 is a communication I / F that supports communication protocols developed for use in vehicles. The Dedicated Communication I / F 7630 can implement standard protocols such as WAVE (Wireless Access in a Vehicle Environment), a combination of the lower-layer IEEE 802.11p and the higher-layer IEEE 1609, DSRC (Dedicated Short Range Communication), or cellular communication protocols. The Dedicated Communication I / F 7630 typically performs V2X communication, which includes one or more of the following concepts: vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication.

[0138] The positioning unit 7640 performs positioning by receiving GNSS signals, such as those from GNSS (Global Navigation Satellite System) satellites (e.g., GPS signals from GPS (Global Positioning System) satellites), and generates location information including the vehicle's latitude, longitude, and altitude. Note that the positioning unit 7640 can specify its current location by exchanging signals with a wireless access point, or it can obtain location information from a terminal with positioning capabilities, such as a mobile phone, PHS, or smartphone.

[0139] The beacon receiving unit 7650 receives radio waves or electromagnetic waves transmitted from, for example, a broadcasting station installed on the road, and acquires information such as current location, traffic congestion, road closure, or estimated time. Note that the functionality of the beacon receiving unit 7650 may be included in the aforementioned dedicated communication I / F 7630.

[0140] The vehicle-mounted device I / F 7660 is a communication interface between the microcomputer 7610 and various vehicle-mounted devices 7760 present in the vehicle. The vehicle-mounted device I / F 7660 can establish a wireless connection using wireless communication protocols such as Wireless LAN, Bluetooth (registered trademark), NFC (Near Field Communication), or WUSB (Wireless USB). Furthermore, the vehicle-mounted device I / F 7660 can establish a wired connection such as USB (Universal Serial Bus), HDMI (registered trademark) (High-Definition Multimedia Interface), or MHL (Mobile High Definition Link) via connection terminals not shown (or via cable if necessary). The vehicle-mounted device 7760 may include at least one of, for example, a passenger-owned mobile device or wearable device, or an information device carried into or attached to the vehicle. Additionally, the vehicle-mounted device 7760 may include a navigation device that performs route searching to any destination. The vehicle-mounted device I / F 7660 exchanges control signals or data signals with these vehicle-mounted devices 7760.

[0141] The vehicle network I / F 7680 is a communication interface between the microcomputer 7610 and the communication network 7010. The vehicle network I / F 7680 sends and receives signals according to a predetermined protocol supported by the communication network 7010.

[0142] The microcomputer 7610 of the integrated control unit 7600 controls the vehicle control system 7000 according to various programs based on information acquired via at least one of the following: general communication I / F 7620, dedicated communication I / F 7630, positioning unit 7640, beacon receiving unit 7650, in-vehicle equipment I / F 7660, and in-vehicle network I / F 7680. For example, the microcomputer 7610 can calculate control target values ​​for the drive force generating device, steering mechanism, or braking device based on information acquired inside and outside the vehicle, and output control commands to the drive system control unit 7100. For example, the microcomputer 7610 can perform cooperative control for the purpose of realizing ADAS (Advanced Driver Assistance System) functions (including vehicle collision avoidance or impact mitigation, following based on vehicle distance, vehicle speed maintenance, vehicle collision warning, vehicle lane departure warning, etc.). Furthermore, the microcomputer 7610 can perform cooperative control for the purpose of realizing autonomous driving, etc., in which the vehicle drives autonomously by controlling the drive force generating device, steering mechanism, braking device, etc., based on information acquired around the vehicle, without relying on the driver's operation.

[0143] The microcomputer 7610 can generate three-dimensional distance information between the vehicle and surrounding objects such as structures or people based on information acquired via at least one of a general communication I / F 7620, a dedicated communication I / F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device I / F 7660, and an in-vehicle network I / F 7680, and create local map information including surrounding information such as the vehicle's current position. Furthermore, the microcomputer 7610 can predict hazards such as vehicle collisions, pedestrians approaching or entering closed roads, etc., based on the acquired information, and generate warning signals. These warning signals may be, for example, signals used to generate warning sounds or illuminate warning lights.

[0144] The audio-visual output unit 7670 transmits an output signal of at least one of audio and visual signals to an output device capable of visually or audibly informing passengers of information about the outside of the vehicle. Figure 9 In the example, audio speaker 7710, display unit 7720, and dashboard 7730 are illustrated as output devices. Display unit 7720 may include at least one of, for example, an in-vehicle display and a head-up display. Display unit 7720 may have AR (augmented reality) display functionality. Output devices may be devices other than these, such as headphones, wearable devices worn by passengers (e.g., goggle-type displays), projectors, or lights. When the output device is a display device, the display device visually displays, in various formats (such as text, images, tables, and graphics), the results obtained from various processes performed by microcomputer 7610 or information received from other control units. Furthermore, when the output device is an audio output device, the audio output device converts an audio signal composed of reproduced audio data or sound data into an analog signal and audibly outputs the analog signal.

[0145] It is important to note that, Figure 9 In the example shown, at least two control units connected via communication network 7010 can be integrated as a single control unit. Alternatively, each control unit can consist of multiple control units. Furthermore, the vehicle control system 7000 may include another control unit (not shown). Additionally, as described above, some or all of the functions performed by any control unit can be provided to other control units. That is, if information needs to be sent and received via communication network 7010, predetermined arithmetic processing can be performed by any control unit. Similarly, sensors or devices connected to any control unit can be connected to other control units, and multiple control units can send and receive detection information to each other via communication network 7010.

[0146] It is important to note that this is used to achieve [the desired effect] based on usage. Figure 1The computer program for each function (e.g., imaging function) of the imaging device 1 described in this embodiment can be implemented in any control unit or the like. Alternatively, a computer-readable recording medium storing such a computer program can also be provided. Examples of recording media include magnetic disks, optical disks, magneto-optical disks, flash memory, etc. Furthermore, the aforementioned computer program can be distributed, for example, via a network without using a recording medium.

[0147] In the aforementioned vehicle control system 7000, according to the user Figure 1 The imaging device 1 described in this embodiment can be applied to... Figure 9 The application examples shown are related to devices such as the external information detection unit 7400 and the internal information detection unit 7500. For example, the imaging device 1 can be applied to the imaging unit 7410, the external information detection section 7420, the driver state detection unit 7510, etc.

[0148] In addition, according to usage Figure 1 At least some components of the imaging device 1 described in this embodiment (e.g., a control unit associated with the imaging element 20, etc.) can be used for... Figure 9 The integrated control unit 7600 shown is implemented in a module (e.g., an integrated circuit module consisting of a single die). Alternatively, depending on the use... Figure 1 At least some components of the imaging device 1 described in this embodiment can be derived from... Figure 9 The vehicle control system 7000 shown is implemented by multiple control units.

[0149] <4. Supplementary Explanation>

[0150] It should be noted that this technology can also be configured as follows.

[0151] (1) An imaging device, comprising: A substrate with an imaging element; A retainer disposed on the substrate holds the lens unit and, together with the substrate and the lens unit, forms an internal space for accommodating the imaging element; An adhesive portion that allows the substrate and the retainer to be in close contact with each other; Through-holes formed in the substrate and leading to the internal space; An assembly spaced apart from the substrate and covering the through-hole; and A fixing part is disposed on the substrate, avoiding the through hole, and the component is fixed to the substrate.

[0152] (2) The imaging device according to (1), wherein the component is an electronic component.

[0153] (3) The imaging device according to (1) or (2), wherein the component is disposed on the surface of the substrate on the side opposite to the imaging element side.

[0154] (4) The imaging device according to (1) or (2), wherein the component is disposed on the surface of the substrate on the imaging element side.

[0155] (5) The imaging device according to any one of (1)-(4), wherein the separation distance between the through hole and the component is set to be equal to or less than the foreign object size threshold.

[0156] (6) The imaging device according to any one of (1)-(5), wherein the fixing part comprises: The first retaining member that holds the first end of the component; and A second retaining member that holds the second end of the component.

[0157] (7) The imaging device according to (6), wherein the first holding member and the second holding member are arranged to face each other.

[0158] (8) The imaging device according to (6) or (7), wherein the first holding member and the second holding member are formed of solder.

[0159] (9) The imaging device according to any one of (6)-(8), wherein the separation distance between the through hole and the component is determined by the thickness of each of the first retaining member and the second retaining member.

[0160] (10) The imaging device according to (9), wherein the separation distance is set to be equal to or less than the foreign object size threshold.

[0161] (11) The imaging device according to any one of (1)-(10) further includes: a component disposed on the substrate and in contact with the substrate side of the component, avoiding the through hole.

[0162] (12) The imaging device according to (11), wherein the component has: The conductive layer disposed on the substrate; and A protective layer disposed on the substrate and covering the conductive layer.

[0163] (13) The imaging apparatus according to any one of (1)-(10) further includes: a member disposed on the substrate and located around the through hole and spaced apart from the component, avoiding the through hole.

[0164] (14) The imaging device according to (13), wherein the component is disposed directly below the assembly.

[0165] (15) The imaging device according to (13) or (14), wherein the component is formed to surround the through hole in a plan view.

[0166] (16) The imaging device according to any one of (13)-(15), wherein the component has a conductive layer disposed on the substrate.

[0167] (17) The imaging device according to (16), wherein the component has a protective layer disposed on the substrate and covering the conductive layer.

[0168] (18) The imaging device according to any one of (1)-(17), wherein the through hole is formed in the grounding region of the substrate.

[0169] (19) The imaging device according to any one of (1)-(18), wherein the adhesive portion is formed of a hybrid adhesive having photocurable and thermocurable properties.

[0170] (20) A method for manufacturing an imaging device, comprising: A retainer is attached to a substrate having an imaging element by means of an adhesive. The retainer holds a lens unit and together with the substrate and the lens unit forms an internal space for accommodating the imaging element. Perform alignment between the lens unit and the imaging element; and The adhesive is cured after the alignment is performed. The substrate described herein has: Through-holes formed in the substrate and leading to the internal space; An assembly spaced apart from the substrate and covering the through-hole; and A fixing part is disposed on the substrate, avoiding the through hole, and the component is fixed to the substrate.

[0171] (21) An electronic device comprising an imaging device according to any one of (1) to (19).

[0172] (22) A method of manufacturing an imaging device, comprising manufacturing an imaging device according to any one of (1) to (19).

[0173] [List of reference numerals]

[0174] 1 Imaging equipment

[0175] 1A Imaging Equipment

[0176] 10 substrate

[0177] 11 Through Holes

[0178] 11a conductive layer

[0179] 11b pad

[0180] 12a conductive layer

[0181] 12b conductive layer

[0182] 12c conductive layer

[0183] 12d conductive layer

[0184] 12e conductive layer

[0185] 12f conductive layer

[0186] 13a Protective layer

[0187] 13b Protective layer

[0188] 13c protective layer

[0189] 13d protective layer

[0190] 20 Imaging elements

[0191] 30 lens units

[0192] 31 Lenses

[0193] 32 Lenses

[0194] 33 Lens tube section

[0195] 40 Retainer

[0196] 41 Receiver hole

[0197] 42 Interior Space

[0198] 50 Adhesive Part

[0199] 51 bubbles

[0200] 60 Coverage Area

[0201] 61 components

[0202] 61a First end

[0203] 61b Second end

[0204] 62 Fixing part

[0205] 62a First retaining member

[0206] 62b Second retaining member

[0207] A1 Inner Surface

[0208] A2 outer surface

[0209] B1 Separation Distance

[0210] C1 end

[0211] C2 surface

Claims

1. An imaging device, comprising: A substrate with an imaging element; A retainer disposed on the substrate holds the lens unit and, together with the substrate and the lens unit, forms an internal space for accommodating the imaging element; An adhesive portion that allows the substrate and the retainer to be in close contact with each other; Through-holes formed in the substrate and leading to the internal space; An assembly spaced apart from the substrate and covering the through-hole; as well as A fixing part is disposed on the substrate, avoiding the through hole, and the component is fixed to the substrate.

2. The imaging device according to claim 1, wherein The component is an electronic component.

3. The imaging device according to claim 1, wherein... The component is disposed on the surface of the substrate on the side opposite to the imaging element side.

4. The imaging device according to claim 1, wherein The component is disposed on the surface of the substrate on the imaging element side.

5. The imaging device according to claim 1, wherein... The separation distance between the through-hole and the component is set to be equal to or less than the foreign object size threshold.

6. The imaging device according to claim 1, wherein The fixing part has: The first retaining member that holds the first end of the component; and A second retaining member that holds the second end of the component.

7. The imaging device according to claim 6, wherein The first retaining member and the second retaining member are arranged to face each other.

8. The imaging device according to claim 6, wherein The first retaining member and the second retaining member are formed of solder.

9. The imaging device according to claim 6, The separation distance between the through hole and the component is determined by the thickness of each of the first retaining member and the second retaining member.

10. The imaging device according to claim 9, wherein The separation distance is set to be equal to or less than the foreign object size threshold.

11. The imaging device according to claim 1, further comprising: A component disposed on the substrate and in contact with the substrate side surface of the assembly, avoiding the through-hole.

12. The imaging device according to claim 11, wherein the component comprises: The conductive layer disposed on the substrate; and A protective layer disposed on the substrate and covering the conductive layer.

13. The imaging device according to claim 1, further comprising: A component disposed on the substrate, surrounding the through-hole, and spaced apart from the assembly.

14. The imaging device according to claim 13, wherein The component is positioned directly below the assembly.

15. The imaging device according to claim 13, The component is formed to surround the through hole in a plan view.

16. The imaging device according to claim 13, wherein The component has a conductive layer disposed on the substrate.

17. The imaging device according to claim 16, wherein The component has a protective layer disposed on the substrate and covering the conductive layer.

18. The imaging device according to claim 1, wherein The through-hole is formed in the grounding region of the substrate.

19. The imaging device according to claim 1, wherein The adhesive portion is formed by a hybrid adhesive having both photocurable and thermocurable properties.

20. A method for manufacturing an imaging device, comprising: A retainer is attached to a substrate having an imaging element by means of an adhesive. The retainer holds a lens unit and together with the substrate and the lens unit forms an internal space for accommodating the imaging element. Perform alignment between the lens unit and the imaging element; as well as The adhesive is cured after the alignment is performed. The substrate described herein has: Through-holes formed in the substrate and leading to the internal space; An assembly spaced apart from the substrate and covering the through-hole; and A fixing part is disposed on the substrate, avoiding the through hole, and the component is fixed to the substrate.

Images