Component mounting machine

Abstract

A component mounting machine includes: a base; a pair of columns provided to the base; a beam erected to the pair of columns; a plurality of mounting heads that respectively support a plurality of holding members that hold components so as to be able to be raised and lowered; a plurality of first sliders that respectively provide the plurality of mounting heads so as to independently move the plurality of mounting heads in a first direction that is horizontal and orthogonal to a direction in which the beam is erected; and a second slider that respectively supports the plurality of first sliders so as to be able to move in the first direction, is supported below the beam so as to be able to move in a second direction that is horizontal and in which the beam is erected, and moves the plurality of first sliders integrally in the second direction.

Description

Technical Field

[0001] This invention relates to a component mounting machine. Background Technology

[0002] Component mounting machines are used to produce product substrates. For example, a component mounting machine picks up components using a nozzle and mounts them to predetermined mounting positions on the substrate. The component mounting machine includes a mounting head that is movable within the machine, allowing the nozzle to be raised, lowered, and rotated for indication. Patent Document 1 discloses a structure in which two lifting devices are provided on the mounting head, enabling simultaneous picking operations for two components, thereby improving production efficiency.

[0003] Existing technical documents

[0004] Patent Document 1: International Publication No. 2019 / 229991 Summary of the Invention

[0005] The problem that the invention aims to solve

[0006] According to the structure of Patent Document 1, two components that are objects of a simultaneous pickup operation need to be supplied at intervals approximately equal to the interval between the movable suction nozzles. Therefore, the arrangement of components in the component supply device is constrained. Furthermore, the supply position of the components may contain errors. Therefore, when the component size becomes smaller, it is difficult to absorb the errors in the supply position within the suction range that allows contact between the suction nozzle and the component. Thus, the size and other dimensions of the components that are objects of a simultaneous pickup operation are constrained.

[0007] The purpose of this specification is to provide a component mounting machine that can increase the flexibility of component configuration in a component supply device, and alleviate the size and other conditions of components that can be processed to perform pick-up actions simultaneously, thereby improving production efficiency.

[0008] Methods for solving problems

[0009] This specification discloses a component mounting machine comprising: a base; a pair of columns disposed on the base; a beam supported on the pair of columns; a plurality of mounting heads that support a plurality of holding components for lifting and lowering; a plurality of first sliding members, each having a plurality of the mounting heads, such that the plurality of mounting heads can move independently in a first horizontal direction orthogonal to the direction in which the beam is erected; and a second sliding member that supports the plurality of first sliding members for moving in the first direction, and is supported below the beam for moving in a second horizontal direction in the direction in which the beam is erected, such that the plurality of first sliding members move integrally in the second direction.

[0010] This specification also discloses the technical ideas of changing "the component mounting machine of claim 3" to "the component mounting machine of claim 3 or 4" in claim 5 of the initial application; changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 4" in claim 6 of the initial application; and changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 6" in claim 7 of the initial application. This specification also discloses the technical ideas of changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 7" in claim 8 of the initial application; changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 5, 7-8" in claim 9 of the initial application; changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 9" in claim 10 of the initial application; and changing "the component mounting machine of claim 1 or 2" to "the component mounting machine of any one of claims 1 to 10" in claim 11 of the initial application.

[0011] Invention Effects

[0012] With this structure, the suspended structure supported by the second sliding member below the beam ensures a greater range of motion for the first sliding member relative to the component mounting machine in the first direction. Furthermore, the ability of multiple first sliding members to move independently allows for variations in the separation distance of multiple mounting heads to accommodate different production scenarios. Thus, for example, in processes involving simultaneous pick-up actions, the configuration freedom of the component feeder is increased, and errors in component supply position are absorbed, thereby mitigating conditions such as the size of components to which the aforementioned processing can be applied. As a result, production efficiency is improved. Attached Figure Description

[0013] Figure 1 It is a three-dimensional diagram showing a component mounting machine.

[0014] Figure 2 This is a schematic side view of the head moving device and the mounting head of the first embodiment.

[0015] Figure 3 It is a schematic front view showing the two mounting heads in the closest possible position.

[0016] Figure 4 This is a perspective view of one of the X-slider components in the head moving device.

[0017] Figure 5It is a top view that schematically shows two mounting heads approaching each other to a predetermined distance.

[0018] Figure 6 It is a top view schematically showing the closest possible position of the two mounting heads.

[0019] Figure 7 This is a schematic side view of the head moving device and the mounting head of the second method.

[0020] Figure 8 A top view schematically showing two mounting heads approaching each other to a predetermined distance.

[0021] Figure 9 It is a top view that schematically shows the deformation of the mounting head.

[0022] Figure 10 This is a flowchart illustrating the installation process of a component mounting machine.

[0023] Figure 11 It is a schematic top view of a multi-layered substrate composed of multiple unit substrates. Detailed Implementation

[0024] 1. Overview of Component Mounting Machine 10

[0025] The component mounting machine 10 is a substrate mounting machine that performs predetermined substrate mounting operations on the substrate 90, and performs mounting processes to mount components onto the substrate 90 as described above. The component mounting machine 10, together with multiple other substrate mounting machines arranged along the transport direction of the substrate 90, constitutes a production line. Each of the multiple substrate mounting machines is communicatively connected to the main computer 5 that controls the entire production line.

[0026] In addition to the component mounting machine 10, the substrate mounting machines constituting the production line also include a solder printing machine for printing solder onto the substrate 90, a reflow oven for heating and soldering the substrate 90 with components mounted, and an inspection machine for checking whether the appearance or function of the product substrate is normal. The production line can be appropriately added to or modified according to the type of product substrate being produced. Specifically, in multiple production lines, substrate mounting machines such as buffer devices for temporarily holding the conveyed substrate 90, substrate feeding devices, substrate reversing devices, various inspection devices, shielding device mounting devices, adhesive coating devices, and ultraviolet irradiation devices can be appropriately installed.

[0027] 2. Structure of component mounting machine 10

[0028] like Figure 1As shown, the component mounting machine 10 includes: a substrate transport device 20, a component supply device 30, a head moving device 40, and a control device 85. In the following description, the horizontal direction, i.e., the left-right direction of the component mounting machine 10 (from... Figure 1 The direction from the upper left to the lower right is set as the X direction (first direction), and the horizontal direction intersecting the X direction, i.e., the front-back direction of the component mounting machine 10 (from the upper left to the lower right), is set as the X direction. Figure 1 The direction from the lower left to the upper right is set as the Y direction (second direction), and the vertical direction orthogonal to both the X and Y directions is set as the Y direction (second direction). Figure 1 The vertical direction is set as the Z direction.

[0029] 2-1. Substrate conveying device 20

[0030] The substrate transport device 20 includes a conveyor belt 21, a pair of guide rails 22, and a support device 23. The conveyor belt 21 is an annular belt that transports a substrate 90 placed on its upper surface. The pair of guide rails 22 extend along the transport direction (X direction) of the substrate 90 and support the periphery of the substrate 90 transported by the conveyor belt 21. At least one of the pair of guide rails 22 is disposed on the base 11 in a manner that allows it to move in the Y direction.

[0031] The substrate conveying device 20 sequentially conveys the substrates 90 in the conveying direction and positions the substrates 90 at predetermined positions within the machine. For example... Figure 2 As shown, the support device 23 raises the support pin 24 via the pin lifting device 25, clamping the substrate 90, positioned at a predetermined position in the conveying direction, between a pair of guide rails 22. After performing the component mounting process, the substrate conveying device 20 moves the substrate 90 out of the component mounting machine 10.

[0032] 2-2. Component supply device 30

[0033] The component supply device 30 supplies components mounted on the substrate 90. The component supply device 30 has a feeder 31 arranged along a predetermined arrangement direction (X direction in this embodiment). The feeder 31 is, for example, a belt feeder that feeds components in a pick-up manner by feeding a carrier belt containing the components along the Y direction. The component supply device 30 supports a reel 32 wound with the carrier belt so that it can rotate.

[0034] The feeder 31 may include a rod feeder, a bulk feeder, etc. Alternatively, the component supply device 30 may supply larger components, for example, by arranging them on a tray placed on a pallet. In such a configuration, the component supply device 30 supplies components by pulling out a predetermined tray from a storage device that houses multiple trays according to the installation process.

[0035] 2-3. Head moving device 40

[0036] The head moving device 40 is an XY robot that horizontally moves a working head used in a predetermined substrate-mounting operation. In this embodiment, the head moving device 40 moves the mounting head 70, which serves as the working head. Figure 1 As shown, the head moving device 40 includes an X slider 50 and a Y slider 60, which serve as a moving stage for mounting the mounting head 70. The X slider 50 is a first slider that moves along the X direction via a direct-acting mechanism of the X drive device 41. The Y slider 60 is a second slider that supports the X slider 50 so that it can move along the X direction and moves along the Y direction via a direct-acting mechanism of the Y drive device 46.

[0037] In the head support portion 51 of the X slider 50 (see reference) Figure 2 The mounting head 70 is fixed in a replaceable manner by means of clamping components (not shown in the figure). Various retaining components are detachably mounted on the mounting head 70. The aforementioned retaining components include a suction nozzle 74 that adsorbs and retains the element by negative pressure air, a chuck that holds the element, and a pickup that retains the support pin 24.

[0038] In this embodiment, the component mounting machine 10 includes a plurality of mounting heads 70. A head moving device 40 moves the plurality of mounting heads 70 independently in the X direction and moves them integrally in the Y direction. Specifically, the head moving device 40 has a plurality of X-slider members 50 that respectively support the mounting heads 70. Detailed structures of the mounting heads 70 and the head moving device 40 will be described later.

[0039] 2-4. Component camera 81, substrate camera 82

[0040] like Figure 2 As shown, the component mounting machine 10 includes a component camera 81 and a substrate camera 82. The component camera 81 and the substrate camera 82 are digital imaging devices with imaging elements such as CMOS. The component camera 81 and the substrate camera 82 perform imaging based on control signals and transmit the image data acquired through the imaging.

[0041] In this embodiment, the component camera 81 is provided on the head body 71 of the mounting head 70. Additionally, the substrate camera 82 is provided on the X-slide member 50. With this structure, the component camera 81 and the substrate camera 82 move integrally with the mounting head 70 as the X-slide member 50 moves. The component camera 81 is configured to capture images of the component 98 held by the suction nozzle 74, which serves as a holding member, from below. The substrate camera 82 is configured to capture images of the reference mark 96 (see reference) attached to the substrate 90 from above. Figure 11 ).

[0042] In addition to the above, the component mounting machine 10 may also include a camera capable of photographing the component 98 held by the nozzle 74 from the side or above, and a camera capable of photographing the mounting surface of the substrate 90 before or after mounting the component 98. These cameras are used, for example, to check the presence or absence of the component 98, its posture, the type and shape of the component 98, the solder printing status on the substrate 90, and the proper mounting status of the component 98.

[0043] 2-5. Control device 85

[0044] The control device 85 mainly consists of a CPU, various memories, and control circuits. The control device 85 performs the mounting process of components onto the substrate 90. During the mounting process, the control device 85 controls the movement of the head moving device 40 based on information output from various sensors, image processing results, and pre-stored control programs. This controls the position and angle of the multiple suction nozzles 74 supported on the mounting head 70. Additionally, the control device 85 performs a configuration operation, which includes adding or removing support pins 24 used by the support device 23 to support the substrate 90 from below, and changing the position of the support pins 24.

[0045] 3. Detailed structure of mounting head 70

[0046] like Figure 2 As shown, the mounting head 70 includes a head body 71 that is detachably mounted to the X slider 50. The mounting head 70 has a rotating body 72 mounted on the head body 71 that is rotatable relative to the head body 71 about an R-axis extending in the vertical direction. The rotating body 72 supports a plurality of retaining members 73 arranged on a ring centered on the R-axis, enabling it to be raised and lowered and rotated about the central axis (Q-axis) of each retaining member 73. Each retaining member 73 is fitted with a suction nozzle 74, which serves as a retaining element 98. Thus, the rotating body 72 supports the suction nozzle 74 via the retaining members 73.

[0047] The mounting head 70 has an R-axis rotation device 75 that rotates the rotating body 72 about an R-axis. The R-axis rotation device 75 indexes to a lifting position where a retainer 73 is raised or lowered using the lifting device 77 described later, by determining the angle of the rotating body 72 to a predetermined angle about the R-axis. The mounting head 70 also has a Q-axis rotation device 76 that rotates the retainer 73 about a Q-axis. In this embodiment, the Q-axis rotation device 76 has a mechanism that rotates multiple retainers 73 in conjunction, thus co-operating on the rotation of the multiple retainers 73. According to the above structure, when the angle of one retainer 73 is determined to be a predetermined angle about the Q-axis, the other multiple retainers 73 are also in conjunction with having their angles determined to be the predetermined angles.

[0048] The mounting head 70 has a lifting device 77 that raises and lowers one of the plurality of retainers 73, which is indexed to a lifting position by the rotation of the rotating body 72. The lifting device 77 lowers and raises the nozzle 74 mounted on the retainer 73 by lowering and raising the retainer 73. Alternatively, the mounting head 70 may have a structure with multiple lifting devices, each having two or more lifting positions, and each capable of being independently driven to raise and lower its respective retainer 73.

[0049] The number of retainers 73 supported by the mounting head 70 with the structure described above can vary depending on the type of mounting head 70. Furthermore, in addition to supporting multiple retainers 73 in a circular, equally spaced arrangement as in this embodiment, the mounting head 70 can also employ various other arrangements. For example, the mounting head 70 may support multiple retainers 73 arranged in a straight line or a matrix.

[0050] 4. Detailed structure of the head moving device 40

[0051] 4-1. Overall structure and driving device of head moving device 40

[0052] In this embodiment, such as Figure 1 As shown, the head moving device 40 is supported from above by a pair of columns 12 and a beam 13. The pair of columns 12 are portal-shaped structures located at the front and rear of the base 11, respectively. The beam 13 is mounted on the pair of columns 12. The beam 13 is a strength component that supports the head moving device 40 and improves the overall rigidity of the machine by connecting it to the pair of columns 12.

[0053] As described above, the head moving device 40 includes an X driving device 41 (see reference 41) that moves the X slider 50 relative to the Y slider 60 along the X direction. Figure 2 The X-drive device 41 and the Y-drive device 46 move the Y-slider 60 relative to the beam 13 along the Y direction. The X-drive device 41 and the Y-drive device 46 are composed of a linear motor or a ball screw or other direct-acting mechanism. In this embodiment, the X-drive device 41 is a linear motor and the Y-drive device 46 is a ball screw.

[0054] Here, as Figure 1 As shown, the Y-slider 60 has a guide block 65 that can slidably engage with a pair of guide rails 47 provided on the beam 13. The pair of guide rails 47 and the guide block 65 function as a Y-axis guide device to guide the movement of the Y-slider 60 in the Y direction. The Y-axis guide device supports the Y-slider 60, which is suspended from the pair of guide rails 47, in a suspended manner, enabling it to move along the Y direction, thus ensuring a large range of motion in the X direction.

[0055] The Y-drive device 46, which is a ball screw assembly, includes: a ball screw 461 disposed on the beam 13 and extending along the Y-axis; a nut 462 screwed onto the ball screw 461 and disposed on the Y-slider 60; and a motor 463 that rotates the ball screw 461. The Y-drive device 46 rotates the ball screw 461 in a predetermined direction by controlling the power supply to the motor 463, thereby moving the Y-slider 60 fixed to the nut 462 to a predetermined position in the Y direction.

[0056] like Figure 2 As shown, the X-slider 50 includes a plurality of carriages 52 supported for movement along a pair of guide rails 61 provided on the Y-slider 60. The pair of guide rails 61 and the carriages 52 function as an X-axis guiding device for guiding the movement of the X-slider 50 in the X direction. In this embodiment, as... Figure 2 As shown, the X drive device 41, which is a linear motor, includes a pair of stators 42, a mover 43, and a cooling device 44.

[0057] A pair of stators 42 are arranged opposite each other along the X direction at predetermined intervals. Each stator 42 is configured to include a yoke to which multiple permanent magnets are fixed and a base plate containing a non-magnetic body holding the yoke. The multiple permanent magnets are arranged such that the directions of the magnetic poles of adjacent permanent magnets are different. A mover 43 is disposed between the pair of stators 42 and located on the X-slider 50. The mover 43 is configured to include iron cores corresponding to the three phases (U, V, W) and coils wound around them.

[0058] The cooling device 44 cools the X drive unit 41, which is a linear motor, by dissipating heat conducted by multiple heat pipes in a radiator. The X drive unit 41 generates thrust by supplying power to the coil of the mover 43. By controlling the power supply to the coil, the X drive unit 41 moves the X slider 50, which is fixed to the mover 43, to a predetermined position in the X direction.

[0059] 4-2. Detailed structure of the head moving device 40

[0060] The component mounting machine 10 moves the mounting head 70 horizontally via a head moving device 40 configured as described above. To shorten the time required for component mounting, it is conceivable, for example, to provide multiple lifting devices 77 on the mounting head 70 to enable simultaneous pickup of two components. However, such a configuration introduces various constraints, such as the need to supply the two components to be picked up at intervals approximately equal to the intervals between the liftable nozzles 74.

[0061] Therefore, the component mounting machine 10 of this embodiment adopts a suspended type that can ensure a large range of motion in the X direction, and has a structure with multiple (two in this embodiment) mounting heads 70 that can move independently in the X direction (the conveying direction of the substrate 90 and the arrangement direction of the feeder 31). Hereinafter, when distinguishing between the upstream and downstream sides of the substrate conveying direction of the multiple X sliders 50 and the multiple mounting heads 70, the upstream side ( Figure 1 The component on the upper left side of the diagram is marked with "L" in the attached drawing, and is located on the downstream side in the substrate transport direction. Figure 1 The component (located on the lower right side of the diagram) is marked with "R" for explanation.

[0062] The head moving device 40 includes two X-slider members 50L and 50R that support the two mounting heads 70L and 70R, enabling them to move independently in the X direction. Additionally, a Y-slider 60 supports the two X-slider members 50L and 50R, enabling them to move in the X direction, and also allows the two X-slider members 50L and 50R to move integrally in the Y direction. In this embodiment, the Y-slider 60 supports the two X-slider members 50L and 50R in the X direction via a pair of upper and lower guide rails 61 arranged along the X direction, on the same plane (XZ plane) orthogonal to the Y direction.

[0063] Here, for the component mounting machine 10, there is a requirement to improve the productivity relative to the area occupied by the component mounting machine 10 in the factory or similar facility where it is installed. Therefore, as Figure 5 and Figure 6 As shown, the component mounting machine 10 of this embodiment ensures a larger movable range Mr of the mounting head 70 relative to the device width in the X direction by employing a suspended head moving device 40. Furthermore, by making the width Hw of the mounting head 70 smaller than before, the movable ranges MrL and MrR of the two mounting heads 70L and 70R are expanded respectively.

[0064] Furthermore, for the component mounting machine 10, there is a requirement to shorten the time required for mounting processing, necessitating efficient movement and increased movement speed of the mounting head 70. However, reducing the width Hw of the mounting head 70, for example, by reducing the width of the X-slider 50 supporting the mounting head 70, raises concerns about a decrease in the supporting force of the Y-slider 60 relative to the X-slider 50. If the maximum speed or maximum acceleration of the mounting head 70 in the X direction is increased under such conditions, vibration may occur, potentially affecting mounting accuracy. Therefore, in this embodiment, by employing a head moving device 40 as described below, the movable range Mr of the multiple mounting heads 70 is ensured, and reliable support for each mounting head 70 is achieved.

[0065] 4-2-1. First method of head moving device 40

[0066] The first embodiment of the head moving device 40 includes a wide carriage 52W, which is wide enough to cover at least a portion of a carriage 52 supported by a pair of guide rails 61. Furthermore, the support range Cr of the wide carriages 52W supporting the pair of X-sliding members 50 in the X direction is set such that, when the pair of mounting heads 70 approach each other to a predetermined distance in the X direction due to relative movement of the pair of X-sliding members 50, the state of the Y-sliding member 60 when viewed from above in the Y direction (see reference...) Figure 3 The two overlap. Additionally, Figure 3 The head support 51 is indicated by a dashed line, and the head support 51 of the right-side X slider 50R before movement is indicated by a solid line.

[0067] like Figure 3 and Figure 4 As shown, a pair of guide rails 61L supporting the left-side (upstream side in the substrate transport direction) X-slider 50L are respectively disposed on the upper side relative to a pair of guide rails 61R supporting the right-side (downstream side in the substrate transport direction) X-slider 50R. Furthermore, in this embodiment, as... Figure 5 As shown, the two carriages 52 are wide carriages 52W, which are supported by guide rails 61 and are wider in the X direction than the width Hw of the mounting head 70 supported by the X sliding member 50.

[0068] More specifically, such as Figure 5 As shown, the two wide slides 52W of the left X-slide member 50L protrude from the X-direction end of the head support portion 51 of the X-slide member 50L toward the right X-slide member 50R. Similarly, the two wide slides 52W of the right X-slide member 50R protrude from the X-direction end of the head support portion 51 of the X-slide member 50R toward the left X-slide member 50L.

[0069] In addition, such as Figure 3 and Figure 4 As shown, each pair of X-sliders 50 has a receiving portion 55 for accommodating the wide carriage 52W of the adjacent X-slider 50. Specifically, the head support portion 51 of the left X-slider 50L has two receiving portions 55L for accommodating the upper wide carriage 52W1 and the lower wide carriage 52W2 of the right X-slider 50R. The head support portion 51 of the right X-slider 50R has a receiving portion 55R for accommodating the lower wide carriage 52W2 of the left X-slider 50L.

[0070] The receiving section 55 extends parallel to the guide rail 61 along the X direction, forming a groove shape to avoid interference with the carriage 52. According to the structure described above, as... Figure 5As shown, when the two mounting heads 70L and 70R approach each other to a predetermined distance in the X direction due to the relative movement of the two X sliders 50L and 50R, a portion of the wide carriage 52W of one of the two X sliders 50L and 50R is housed in a receiving portion 55 provided on the other side of the pair of X sliders 50. Thus, the support ranges CrL and CrR of the wide carriages 52W of the two X sliders 50L and 50R, respectively supported on the guide rail 61 in the X direction, overlap.

[0071] Here, the two X-slider members 50L and 50R move in the X direction via an X-drive device 41, which is a linear motor. As described above, the two X-slider members 50L and 50R are individually supported by a pair of guide rails 61 consisting of two sets, while sharing a pair of stators 42 in the X-drive device 41. The X-drive device 41 controls the power supply to a plurality of movers 43 respectively provided on the two X-slider members 50L and 50R, causing the X-slider members 50 to move.

[0072] In addition, the two mounting heads 70L and 70R are set with a minimum spacing Dc that allows the mounting heads 70L and 70R to approach each other, taking into account their respective width Hw in the X direction and the distance required to prevent interference. Figure 6 This indicates the closest possible state of the two mounting heads 70L and 70R. In the first configuration of the head moving device 40, the two mounting heads 70 are of the same type and are interchangeable. That is, the two X-slider members 50L and 50R are of different types, but on the other hand, they support mounting heads 70 of the same type.

[0073] As described above, the mounting heads 70L and 70R, supported by two X-slider members 50L and 50R respectively, are arranged along the X-direction on the same plane (XZ plane) orthogonal to the Y-direction. That is, the Y-direction positions of the suction nozzles 74 that can be raised and lowered by each of the pair of mounting heads 70L and 70R are consistent. Furthermore, as... Figure 6 As shown, mounting heads 70L and 70R of the same type have a shape in which the length Hn in the Y direction is greater than the width Hw in the X direction. Furthermore, when a pair of mounting heads 70L and 70R are closest in the X direction due to the relative movement of a pair of X sliders 50L and 50R, the width Ws occupied by a pair of X sliders 50 in the X direction is smaller than the width Wh occupied by a pair of mounting heads 70.

[0074] To shorten the installation time, it is conceivable to reduce the number of pick-and-place cycles (hereinafter referred to as "PP cycles"). Therefore, increasing the number of components that the mounting head 700 can hold in one PP cycle is effective. However, increasing the number of nozzles 74 supported by the mounting head 70 would increase the size of the mounting head 70, which could be a major reason for reducing the range of motion of the mounting head 70.

[0075] In contrast, in a structure with multiple mounting heads 70 as in this embodiment, the number of mounting heads 70 that can be supported by one mounting head 70 can be reduced while supporting the same number of suction nozzles 74 overall, thus enabling miniaturization of the mounting heads 70. In the first embodiment of the head moving device 40, the width Hw in the X direction of the two mounting heads 70 is set to be less than 20% relative to the movable range Mr of the mounting head 70, which is set based on the minimum distance Dc that allows the two mounting heads 70 to approach each other. As a result, a large number of suction nozzles 74 can be used as a whole, and on the other hand, the movable range Mr of the mounting head 70 can be increased.

[0076] According to the first embodiment of the head moving device 40, compared to the case where the slide 52 is set to be the same length as the width Hw of the mounting head 70, the X slide member 50 is supported by the support range Cr of the wide slide 52W. Therefore, the supporting force of the Y slide member 60 can be increased, and the generation of vibration caused by the movement of the X slide member 50 can be suppressed. As a result, the maximum speed and maximum acceleration of the movement of the mounting head 70 in the X direction can be increased, and consequently, the time required for the installation process can be shortened.

[0077] Furthermore, compared to structures that use only wide slides and reduce the range of motion to prevent interference, in the first embodiment of the head moving device 40, the support ranges CrL and CrR of the pair of wide slides 52W in the left-right direction overlap. As a result, the mounting heads 70 supported on the pair of X-slide members 50 can approach each other more closely than before, thus ensuring a greater range of motion MrL and MrR.

[0078] 4-2-2. Second method of head moving device 40

[0079] The second embodiment of the head moving device 40 includes three parallel guide rails 61 that support two X sliders 50L and 50R respectively. The three guide rails 61 on the Y slider 60 are provided at three or more different support positions Ps in a plane including the vertical direction (Z direction) and the Y direction (YZ plane) to support the X slider 50 so that it can move along the X direction.

[0080] Specifically, such as Figure 7 As shown, the Y-slider 60 has a first support surface 62 and a second support surface 63. The first support surface 62 is a plane orthogonal to the Y direction (XZ plane), and at least two guide rails 61 are provided parallel to each other along the X direction. The second support surface 63 is a plane different from the first support surface 62, and at least one guide rail 61 is arranged parallel to the plurality of guide rails 61 mounted on the first support surface 62.

[0081] The second support surface 63 can be any surface where the third guide rail 613 is arranged parallel to the two guide rails 611 and 612 provided on the first support surface 62, or it can be a non-parallel surface after rotation about the X-axis relative to the first support surface 62. In this embodiment, the second support surface 63 is a surface parallel to the first support surface 62. In addition, the second support surface 63 is formed by separating the length Hn of the mounting head 70 from the first support surface 62 in the Y direction by about half (Dh≈Hn / 2).

[0082] Furthermore, the support position Ps3 of the guide rail 613 on the second support surface 63 is set to the same height Sh as the support positions Ps1 of the guide rail 611 on the upper side and Ps2 of the guide rail 612 on the lower side of the first support surface 62. Thus, in the second embodiment of the head moving device 40, the three carriages 52k of the X slider 50k engage with the three guide rails 611, 612, and 613 when viewed in the X direction, and the X slider 50k is supported at three points.

[0083] In the first embodiment of the head moving device 40, two X-slider members 50L and 50R are supported by a pair of guide rails 61 consisting of two sets of guide rails. In contrast, in the second embodiment of the head moving device 40, the two X-slider members 50L and 50R are respectively arranged on the first support surface 62 by sharing at least one (two in this embodiment) guide rail 611 and 612 (corresponding carriages 52 engage on the same guide rail 61). Furthermore, in this embodiment, the two X-slider members 50L and 50R also share a guide rail 613 provided on the second support surface 63.

[0084] According to the second configuration of the head moving device 40, the X slider 50 is supported in three or more different support positions Ps, therefore, as Figure 8 As shown, the supporting force of the Y-slider 60 can be increased without using a wide slide 52W that widens the slide 52 relative to the head support 51 in the X direction. This ensures the movable range Mr of the mounting head 70 and reliably supports the mounting head 70.

[0085] Furthermore, by setting the support positions Ps2 and Ps3 of the lower guide rails 612 and 613 to the same height Sh, the support force at the part closer to the nozzle 74 can be improved, reducing the impact of vibration that may be caused by the movement of the mounting head 70 in the X direction. Moreover, by sharing three guide rails 61 and not using a wide slide 52W, the two X sliding members 50L and 50R can be of the same type, enabling interchangeability.

[0086] 4-3. Other methods of head moving device 40

[0087] In addition to the first and second embodiments illustrated, various other methods can be applied to the head moving device 40. For example, the head moving device 40 can also be configured to combine the first and second methods. Specifically, it can be configured as in the second embodiment, where the X-slider 50 is supported by three guide rails 61, and at least a portion of the carriage 52 that engages with the three guide rails 61 is a wide carriage 52W.

[0088] This allows for further improvement in the supporting force of the Y-slider 60. Consequently, it enables an increase in the maximum speed and maximum acceleration of the mounting head 70 in the X direction. Alternatively, it allows for a reduction in the width of the mounting head 70 and the X-slider 50, achieving miniaturization, and expanding the movable range Mr of the mounting head 70.

[0089] Furthermore, in both the first and second embodiments of the head moving device 40, the two mounting heads 70 are of the same type and interchangeable. This improves the versatility of the mounting heads 70. Such mounting heads 70 are as follows: Figure 5 and Figure 8 As shown, the lifting device 77 that raises and lowers the nozzle 74 is located at the center of the width direction (X direction) of the mounting head 70. Therefore, when the mounting head 70 is moved to the end of the movable range Mr on the X direction side, even if the substrate 90 is present in the range from the end edge of the mounting head 70 on the X direction side to the center of the width direction where the lifting device 77 is located, it is impossible to use the nozzle 74 in that range.

[0090] In contrast, at least one of the two mounting heads 70 of the head moving device 40 may also include a lifting device 77, which is provided on the X sliding member 50 located at one end in the X direction and configured to be offset from the center of the mounting head 70 in the width direction. Specifically, as Figure 9 As shown, the two mounting heads 70 are of different types. A lifting device 77L is arranged on the left side (one end in the X direction) of the left mounting head 70L, and a lifting device 77R is arranged on the right side (the other end in the X direction) of the right mounting head 70R.

[0091] With this structure, the suction nozzle 74, whose angle is determined at the center in the width direction, is not raised or lowered by the rotation of the rotating body 72. Instead, the suction nozzle 74 located at the end side of the mounting head 70 can be raised or lowered. Thus, although the movable ranges MrL and MrR of the two mounting heads 70L and 70R remain unchanged, the area in which the suction nozzle 74 can be used is substantially expanded when the two mounting heads 70 are moved to the end of their movable ranges Mr.

[0092] To further explain, the mounting head 70 sometimes replaces the nozzle 74 to mount a pick-up device that holds the support pin 24, performing the configuration operation of the support pin 24. In this case, by applying the above method, the area where the support pin 24 can be configured can be substantially expanded. As a result, the configuration freedom of the support pin 24 can be improved; for example, the support pin 24 corresponding to the component 98 already mounted on the substrate 90 can be configured, and the substrate 90 can be supported more reliably.

[0093] Furthermore, the same method described above can also be applied to the substrate camera 82. That is, the two substrate cameras 82 of the head moving device 40 can also be arranged, in the same way as the lifting device 77, offset to one side in the X direction relative to the center of the width direction of the X slider 50. Specifically, the substrate camera 82L of the X slider 50L located on the left side (one end side in the X direction) of the two X sliders 50 is configured to be able to photograph the substrate 90 from the left side (one end side in the X direction) of the mounting head 70L supported by the X slider 50L.

[0094] Similarly, the substrate camera 82R located on the right side (the other end in the X direction) of the two X-sliders 50 is configured to capture images of the substrate 90 from the right side (the other end in the X direction) of the mounting head 70R supported by the X-slider 50R, which is positioned in a width direction greater than the center of the mounting head 70R supported by the X-slider 50R. With this configuration, the area that can be captured by the two substrate cameras 82L and 82R can be substantially expanded. In particular, a reference mark 96 or a barcode 97 (see reference) will be attached to the end in the X direction. Figure 11 When the substrate 90 is the subject of the photograph, it is useful even if the X-direction dimension of the substrate 90 is large.

[0095] 5. Mounting process based on component mounting machine 10

[0096] 5-1. Overview of Installation and Processing

[0097] Reference Figure 10 The mounting process of the component mounting machine 10 will now be described. Here, the component supply device 30 is equipped with multiple feeders 31. In the mounting process, firstly, as... Figure 10 As shown, the substrate transport device 20 of the component mounting machine 10 performs a substrate 90 loading process (S11). As a result, the substrate 90 is loaded into the machine and positioned at a predetermined position within the machine.

[0098] Next, the control device 85 performs a preparation process (S12). This preparation process includes identifying a reference mark 96 for determining the position of the positioned substrate 90 and reading a barcode 97 representing the substrate ID of the substrate 90. Specifically, the control device 85 performs a shooting action by controlling the movement of the head moving device 40 to move the substrate camera 82 above the reference mark 96 and other objects to be photographed. The control device 85 identifies the reference mark 96 and reads the barcode 97 by performing image processing on the image data acquired through the shooting.

[0099] Additionally, the preparation process may include obtaining information such as whether the substrate 90 is warped, the status of the installed components 98, and the status of the printed solder. The control device 85 controls the operation of the head moving device 40 to move the substrate camera 82 to a predetermined position according to the required preparation process. Furthermore, the control device 85 obtains the type of the substrate 90 (general / multi-layer substrate, etc.) by sending the substrate ID of the substrate 90 to the host computer 5, and sets the type of installation process that should be performed on the substrate 90.

[0100] In the PP cycle, the control device 85 executes a pickup cycle (S13) that repeatedly performs the pickup action of picking up the element 98 using multiple suction nozzles 74. During this time, the control device 85 controls the movement of the head moving device 40 in the pickup action to sequentially position the mounting head 70 according to the position of the pickable element 98. In this embodiment, the control device 85 performs the identification processing (S14) in parallel with the pickup cycle to determine the holding state of the element 98 held by the multiple suction nozzles 74.

[0101] In detail, when the rotator 72 rotates around the R-axis during the execution of the pickup cycle, thereby positioning the nozzle 74 holding the component 98 above the component camera 81, the control device 85 sends a shooting command to the component camera 81. The control device 85 performs image processing on the image data acquired by the component camera 81 to identify the orientation (position and angle) of the component 98 held by the nozzle 74.

[0102] After the pickup cycle (S13) ends, the control device 85 executes an installation cycle (S15) that repeatedly performs the installation action of installing the component 98 using multiple nozzles 74. Furthermore, during the installation action of this installation cycle (S15), the control device 85 controls the movement of the installation head 70 to install the component 98 at the installation positions specified by the control program. Additionally, based on the result of the recognition processing (S14), the control device 85 controls the movement of the installation head 70 to position the component 98 in a predetermined posture relative to the installation position.

[0103] Based on the control program, the control device 85 determines whether all PP cycles have ended (S16). If all PP cycles have not ended (S16: No), the PP cycle is executed (S13-S15). If all PP cycles have ended (S16: Yes), the control device 85 executes the substrate 90 removal process (S17). In the substrate 90 removal process, the substrate transport device 20 releases the positioned substrate 90 and moves the substrate 90 out of the component mounting machine 10.

[0104] 5-2. Control of the head movement device 40 during filming

[0105] In the preparation process (S12) of the installation process, as described above, the following are performed: capturing reference marks 96 and barcodes 97 using the substrate camera 82. Specifically, as... Figure 11 As shown, when the substrate 90 is a multi-layer substrate 90A, the number of reference marks 96 that are the subject of photography is sometimes greater than that of a typical substrate 90. Here, the multi-layer substrate 90A is constructed by arranging multiple unit substrates 91 with the same wiring pattern 92 in the X and Y directions. Furthermore, along with the arrangement of the multiple unit substrates 91, multiple reference marks 96 are provided in a matrix along the X and Y directions on the multi-layer substrate 90A.

[0106] In this embodiment, in order to achieve high efficiency in the shooting operation targeting the reference mark 96 as described above, a preparation process using two substrate cameras 82 is performed. Specifically, during the shooting operation of shooting multiple reference marks 96, the control device 85 performs a positioning operation to the X-direction position of the shooting position corresponding to the shooting position of the other of the multiple substrate cameras 82 (e.g., the right substrate camera 82R) during the shooting operation of one of the two substrate cameras 82 (e.g., the left substrate camera 82L).

[0107] Furthermore, after the left substrate camera 82L finishes its shooting action, a positioning action is performed to the Y-direction position of the shooting position corresponding to the shooting action of the right substrate camera 82R. This allows for the parallel execution of shooting actions using both substrate cameras 82 (at least the XY movement and shooting processing of the left substrate camera 82L and the X movement of the right substrate camera 82R). Additionally, in the example described above, when the shooting position corresponding to the shooting action of the right substrate camera 82R is within the camera's field of view, the control device 85 moves multiple substrate cameras 82 to simultaneously capture a pair of reference marks 96 separated in the X-direction using both substrate cameras 82L and 82R.

[0108] Therefore, multiple reference marks 96 arranged in a matrix can be photographed efficiently, reducing the time required for recognition of the reference marks 96. Furthermore, the photographing operation described above can also be applied to processes such as reading barcodes 97, checking for warping of the substrate 90, assessing the status of installed components 98, and determining the status of printed solder. This reduces the time required for preparation processing (S12).

[0109] 5-3. Control of the head movement device 40 during the picking action

[0110] In the pick-up cycle (S13) of the mounting process, as described above, a pick-up operation using multiple nozzles 74 is performed. In this embodiment, a pick-up operation using two mounting heads 70 is performed to achieve high efficiency in the pick-up cycle of the component 98. The pick-up operation is the action of picking up the component 98 supplied by multiple feeders 31 arranged at predetermined intervals in the X direction. The control device 85 performs a positioning operation of the nozzles 74 in the X direction such that the separation distance between the nozzles 74 supported on the two mounting heads 70 in the X direction is an integer multiple of the aforementioned predetermined interval.

[0111] Specifically, during the pickup action of one of the two mounting heads 70 (e.g., the left mounting head 70L), the control device 85 performs a positioning action of the nozzle 74 towards the X-direction position of the pickup position corresponding to the pickup action of the other of the two mounting heads 70 (e.g., the right mounting head 70R). Furthermore, after the pickup action of the left mounting head 70L is completed, a positioning action is performed towards the Y-direction position of the pickup position corresponding to the pickup action of the right mounting head 70R. Thus, pickup actions using both mounting heads 70 can be performed in parallel (at least the XY movement and pickup processing of the left mounting head 70L and the X movement of the right mounting head 70R).

[0112] Here, in the component supply device 30, when multiple feeders 31 are respectively equipped, individual differences in feeders 31 and slots may sometimes result in configuration errors in the feeders 31. After the feeders 31 are equipped, the control device 85 obtains, for example, a reference mark attached to the upper surface of the feeder 31, thereby identifying the configuration error. In addition, in the above example, even considering the configuration error of the feeder 31, the pick-up position corresponding to the pick-up action of the right mounting head 70R is sometimes within the allowable range of the pick-up action of the nozzle 74 of the right mounting head 70R.

[0113] At this time, the control device 85 can also position and pick up multiple mounting heads 70L and 70R, so that two components 98 arranged separately in the X direction can be picked up simultaneously by the two mounting heads 70L and 70R. In addition, even if the components are not contained within the allowable range due to the configuration error of the feeder 31, the X-direction position of the right mounting head 70R can be adjusted, and the Y-direction position of the component 98 can be adjusted by the conveyor belt transported by the feeder 31, thereby bringing the supply position of the component 98 into the aforementioned allowable range, and performing the pick-up operation simultaneously by the two mounting heads 70L and 70R.

[0114] 5-4. Control of the head moving device 40 during installation

[0115] In the installation cycle (S15) of the installation process, as described above, the installation operation of the component 98 using multiple nozzles 74 is performed. In this embodiment, in order to achieve high efficiency in the installation cycle of component 98, the installation operation using two installation heads 70 is performed. Here, as... Figure 11 As shown, substrate 90 is a multi-layer substrate 90A, and multiple unit substrates 91 are arranged in the X direction.

[0116] The control device 85 performs a positioning action on the nozzle 74 in the X direction, so that the separation distance of the nozzles 74 supported on the two mounting heads 70 in the X direction is an integer multiple of the interval between a pair of adjacent unit substrates 91 in the X direction. Furthermore, the control device 85 controls the two mounting heads 700 to sequentially perform a mounting action once on each of the plurality of unit substrates 91 that is designated as the object substrate for mounting in this PP cycle.

[0117] Specifically, during the installation operation of one of the two mounting heads 70 (e.g., the left mounting head 70L), the control device 85 performs a positioning operation of the nozzle 74 towards the X-direction position of the mounting position corresponding to the installation operation of the other of the two mounting heads 70 (e.g., the right mounting head 70R). Furthermore, after the installation operation of the left mounting head 70L is completed, a positioning operation is performed towards the Y-direction position of the mounting position corresponding to the installation operation of the right mounting head 70R.

[0118] Therefore, mounting operations using two mounting heads 70 can be performed in parallel (at least the XY movement of the left mounting head 70L and the X movement of the right mounting head 70R). After completing the mounting cycle for a predetermined target substrate among multiple unit substrates 91, the control device 85 sequentially performs the mounting cycle for other target substrates. By repeating this operation, the mounting process for the multi-layer substrate 90A is completed.

[0119] 6. Effects of the structure based on the implementation method

[0120] According to the structure of the embodiment, the suspended structure supported by the Y-slider 60 below the beam 13 can ensure a relatively large range of motion Mr of the X-slider 50 in the X direction relative to the component mounting machine 10. In addition, the structure in which multiple X-slider 50s can move independently in the X direction allows for variations in the separation distance of multiple mounting heads 70 to accommodate various production methods.

[0121] Therefore, for example, in processing where simultaneous picking operations are performed, the configuration freedom of the feeder 31 supplying the element 98 can be increased. Furthermore, errors in the supply position of the element 98 in the feeder 31 can be absorbed, thus mitigating conditions such as the size of the element 98 to which the above-described processing can be applied. As a result, production efficiency can be improved.

[0122] Furthermore, in the first embodiment of the head moving device 40, since the support range Cr of the pair of wide slides 52W overlaps with each other, the mounting heads 70 supported on the pair of X slides 50 can be brought closer together than before, ensuring their range of motion Mr. In addition, by having a pair of wide slides 52W, a larger support range Cr can be ensured in the X direction, thus reliably supporting each mounting head 70.

[0123] Furthermore, in the second embodiment of the head moving device 40, the X-slider 50 is supported at three or more different support positions Ps, thus ensuring the movable range Mr of the mounting head 70 and reliably supporting the mounting head 70. Moreover, according to the structure combining the first and second embodiments of the head moving device 40, the supporting force of the Y-slider 60 can be further increased. Therefore, the maximum speed and maximum acceleration of the mounting head 70 in the X direction can be increased.

[0124] 7. Variations of the implementation method

[0125] In one embodiment, the head moving device 40 is configured to have two X-slide members 50, and to move the mounting head 70 mounted on each X-slide member 50. Alternatively, the head moving device 40 may be configured to have three or more X-slide members 50 and three or more mounting heads 70 mounted on them. In such a configuration, production efficiency can be improved by allowing three or more mounting heads 70 to move independently in the X direction, applying the same control as in the embodiment.

[0126] Furthermore, in this embodiment, the component mounting machine 10 employs a suspended head moving device 40. In contrast, the first type of feature (wide carriage) and the second type of feature (three or more guide rails) of the head moving device 40 can also be applied to configurations other than a suspended type. Moreover, since the multiple X-sliders 50 are supported by Y-sliders 60 at the same Y-direction position, the head moving device 40 is configured to share a stator 42 of the X-drive device 41, which is a linear motor. In contrast, the X-drive device 41 can also be configured to have a linear action mechanism other than a linear motor for each of the multiple X-sliders 50.

[0127] In this embodiment, a component mounting machine 10 that performs mounting processes is illustrated as the substrate mounting machine. In contrast, the substrate mounting machine can be any structure that performs various substrate operations by moving the work head in the XY direction, or it can be a structure other than a component mounting machine. Specifically, the substrate mounting machine can also be a solder printer, a bonding material coating device, or an inspection device that can be used together with the component mounting machine 10 to form a production line.

[0128] Explanation of reference numerals in the attached figures

[0129] 5: Main unit; 10: Component mounting machine (substrate mounting machine); 11: Base; 12: Pair of columns; 13: Beam; 20: Substrate conveying device; 30: Component supply device; 31: Feeder; 40: Head moving device; 41: X drive device; 46: Y drive device; 47: Guide rail; 50, 50L, 50R: X slider (first slider); 51: Head support; 52: Carriage; 52W, 52W1, 52W2: Wide carriage; 55, 55L, 55R: Reception part; 60: Y slider. (Second sliding member), 61: guide rail, 62: first support surface, 63: second support surface, 70, 70L, 70R: mounting head (working head), 71: head body, 72: rotating body, 74: suction nozzle (holding component), 77, 77L, 77R: lifting device, 81: component camera, 82, 82L, 82R: substrate camera, 85: control device, 90: substrate, 90A: multi-layer substrate, 91: unit substrate, 92: wiring pattern, 96: reference mark, 97: barcode, 98: component.

Claims

1. A component mounting machine, comprising: abutment; A pair of uprights are provided on the base; The beam is supported by the pair of columns; Multiple mounting heads support the multiple retaining components of the retaining element so that they can be raised and lowered; Multiple first sliding members are each provided with multiple mounting heads, so that the multiple mounting heads can move independently in a first horizontal direction orthogonal to the direction in which the beam is erected; and The second sliding member supports the plurality of first sliding members respectively so that they can move in the first direction, and is supported below the beam so that they can move in the second direction, which is horizontal, in the direction in which the beam is erected, so that the plurality of first sliding members move together in the second direction.

2. The component mounting machine according to claim 1, wherein, The second slider supports multiple first sliders on the same plane orthogonal to the second direction via a guide rail arranged along the first direction, enabling them to move in the first direction.

3. The component mounting machine according to claim 1 or 2, wherein, The mounting head has: Head body; and The rotating body is configured to rotate relative to the head body about an R-axis extending in the vertical direction and to support a plurality of the retaining members arranged on a ring centered on the R-axis.

4. The component mounting machine according to claim 3, wherein, The component mounting machine also includes a component camera located on the head body, capable of capturing images of the component held by the holding member at a predetermined angle around the R-axis.

5. The component mounting machine according to claim 3, wherein, The mounting head closest to one end in the first direction among the plurality of mounting heads has a lifting device that allows the retaining member of the plurality of supported retaining members to be raised or lowered about the R-axis and closest to one end in the first direction.

6. The component mounting machine according to claim 1 or 2, wherein, The multiple mounting heads are of the same type and are interchangeable.

7. The component mounting machine according to claim 1 or 2, wherein, The component mounting machine also includes a component supply device, which is equipped with feeders for supplying the components arranged in a predetermined arrangement direction. The first direction is the arrangement direction of the feeder.

8. The component mounting machine according to claim 1 or 2, wherein, The component mounting machine also includes a linear motor that moves the first slider relative to the second slider in the first direction. The linear motor has: A pair of stators are arranged opposite each other along the first direction; and Multiple movers are disposed between a pair of stators and are respectively located on multiple first sliders.

9. The component mounting machine according to claim 1 or 2, wherein, The component mounting machine also includes a substrate camera, which is disposed on the first slider that is closest to the first direction among a plurality of first sliders, and is capable of taking pictures of the substrate at the end of the first slider that is closer to the first direction than the width of the mounting head supported by the first slider.

10. The component mounting machine according to claim 1 or 2, wherein, The component mounting machine also includes a drive device for moving the second sliding member relative to the beam in the second direction.

11. The component mounting machine according to claim 1 or 2, wherein, The width of the plurality of mounting heads in the first direction is set to less than 20% of the movable range of the mounting heads, the movable range of the mounting heads being set based on the minimum interval that allows the plurality of mounting heads to approach each other.

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