Component mounting method, optimization method of mounting process, and component mounting machine

Abstract

The component mounting method includes: a pickup step of performing a pickup operation in which a plurality of mounting heads respectively use a plurality of nozzles to pick up the same number of the same components; a setting step of setting, among a plurality of unit substrates, object substrates that are to be targets of mounting of the components by the plurality of mounting heads; and a mounting step of sequentially performing, by the plurality of mounting heads, one time of a mounting operation in which the plurality of components are mounted in the same mounting order for each of the plurality of object substrates.

Description

Technical Field

[0001] This invention relates to a component mounting method, an optimized mounting process, and a component mounting machine. Background Technology

[0002] Component mounting machines are used for the production of product substrates. For example, a component mounting machine picks up components using a nozzle and mounts them to predetermined mounting positions on the substrate. The component mounting machine includes a mounting head that is movable within the machine, supporting the nozzle so that it can be raised, lowered, and rotated. Patent Document 1 discloses a structure that efficiently optimizes the mounting process for multi-unit substrates composed of multiple unit substrates. Patent Document 2 discloses a structure that achieves efficient mounting processing by using multiple mounting heads.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2021-001962

[0006] Patent Document 2: Japanese Patent Application Publication No. 2004-186391 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] In the component mounting process performed by the component mounting machine, there is room for further efficiency improvement by improving the operation sequence and movement path of multiple mounting heads, for example, based on the wiring pattern of the unit substrates constituting the multi-unit substrate, the type of components being mounted, and the distance between adjacent unit substrates.

[0009] The purpose of this specification is to provide a component mounting method, an optimized mounting method, and a component mounting machine that can achieve efficient mounting processing when using multiple mounting heads to perform mounting processing on multi-panel substrates.

[0010] Means for solving technical problems

[0011] This specification discloses a component mounting method, which is a component mounting method for a component mounting machine. The component mounting machine mounts components onto a substrate. The component mounting machine includes multiple mounting heads that each support a plurality of nozzles holding the components. The multiple mounting heads can move independently in a first horizontal direction and move uniformly in a second horizontal direction intersecting the first direction. When the substrate is a multi-unit substrate composed of multiple unit substrates having the same wiring pattern arranged in the first and second directions, the component mounting method includes: a picking step, in which the multiple mounting heads each use the multiple nozzles to pick up the same number of the same type of components; a setting step, in which object substrates among the multiple unit substrates are set as the mounting targets of the components by the multiple mounting heads; and an mounting step, in which the multiple mounting heads sequentially perform a mounting action on each of the multiple object substrates to mount the multiple components in the same mounting sequence.

[0012] This specification discloses an optimized mounting process in which a component mounting machine mounts components onto a substrate. The component mounting machine includes multiple mounting heads, each supporting a plurality of nozzles that hold the components. The mounting heads move independently in a first direction and move uniformly in a second direction horizontally intersecting the first direction. In the case where the substrate being mounted is a multi-unit substrate composed of multiple unit substrates with the same wiring pattern arranged in both the first and second directions, the optimized mounting process performs the following steps: a picking step, in which the multiple mounting heads each use the plurality of nozzles to pick up the same number of the same type of components; a setting step, in which object substrates among the multiple unit substrates are designated as mounting targets for the components by the multiple mounting heads; and an mounting step, in which the multiple mounting heads sequentially perform a mounting action on each of the multiple object substrates, mounting the multiple components in the same mounting sequence.

[0013] This specification provides a component mounting machine comprising: a plurality of mounting heads, each supporting a plurality of nozzles for holding components; and a control device that causes the plurality of mounting heads to move independently in a first horizontal direction and to move the plurality of mounting heads uniformly in a second horizontal direction intersecting the first direction. The control device performs a mounting process when the substrate on which the components are mounted is a multi-unit substrate composed of multiple unit substrates having the same wiring pattern arranged in the first and second directions. The mounting process includes: a pick-up step, in which the plurality of mounting heads each use the plurality of nozzles to pick up the same number of the same type of components; a setting step, in which object substrates among the plurality of unit substrates are designated as mounting targets for the components by the plurality of mounting heads; and an mounting step, in which the plurality of mounting heads sequentially perform a mounting action on each of the plurality of object substrates, mounting the plurality of components in the same mounting sequence.

[0014] This specification also discloses the technical concept of changing "the component mounting method according to any one of claims 1 to 3" to "the component mounting method according to any one of claims 1 to 4" in original claim 5, and the technical concept of changing "the component mounting method according to any one of claims 1 to 3" to "the component mounting method according to any one of claims 1 to 5" in original claim 6. This specification also discloses the technical concept of changing "the component mounting method according to any one of claims 1 to 3" to "the component mounting method according to any one of claims 1 to 8" in original claim 9, and the technical concept of changing "the component mounting method according to any one of claims 1 to 3" to "the component mounting method according to any one of claims 1 to 9" in original claim 10.

[0015] Invention Effects

[0016] With this structure, by performing mounting operations using multiple mounting heads on target substrates appropriately set according to multiple unit substrates, it is possible to achieve high efficiency in mounting processing of multi-unit substrates. Attached Figure Description

[0017] Figure 1 It is a three-dimensional diagram showing a component mounting machine.

[0018] Figure 2 This is a schematic side view of the mounting head.

[0019] Figure 3 It is a schematic top view of the component mounting machine.

[0020] Figure 4 This is a flowchart illustrating the installation process of a component mounting machine.

[0021] Figure 5 It is a schematic top view of a multi-unit substrate composed of multiple unit substrates.

[0022] Figure 6 It is a flowchart representing the preparation process, which includes setting up the process (steps).

[0023] Figure 7A Is with Figure 5 The diagram correspondingly represents the result of the first method of processing.

[0024] Figure 7B Is with Figure 5 The diagram correspondingly represents the result of the second method of processing.

[0025] Figure 8 This is a diagram showing the timing of the actions of the two installation heads in the installation cycle.

[0026] Figure 9 This is a top view showing an example of the positions of two mounting heads in a picking loop.

[0027] Figure 10 This is a diagram showing the timing of the actions of the two mounting heads in the picking loop.

[0028] Figure 11 Is with Figure 5 The diagram shows an example of the movement paths of two substrate cameras in a shooting loop.

[0029] Figure 12 This is a diagram showing the timing of the actions of two baseboard cameras in a shooting cycle.

[0030] Figure 13 This is a flowchart representing the optimization process for the applicable installation process. Detailed Implementation

[0031] 1. Overview of Component Mounting Machine 10

[0032] The component mounting machine 10 is a substrate mounting machine that performs predetermined substrate mounting operations on the substrate 90, and performs mounting processing to mount components onto the substrate 90 as described above. The component mounting machine 10, together with multiple other substrate mounting machines arranged in the transport direction of the substrate 90, constitutes a production line. The multiple substrate mounting machines are communicatively connected to the host computer 5 that uniformly controls the production line.

[0033] In addition to the component mounting machine 10, the substrate mounting machines constituting the production line also include a printer for printing solder onto the substrate 90, a reflow oven for heating and soldering the substrate 90 with components mounted, and an inspection machine for checking whether the appearance or function of the product substrate is normal. The production line can be appropriately added to or modified depending on the type of product substrate being produced. Specifically, multiple production lines can be appropriately equipped with substrate mounting machines such as buffer devices for temporarily holding the transported substrate 90, substrate supply devices, substrate flipping devices, various inspection devices, shielding mounting devices, adhesive application devices, and ultraviolet irradiation devices.

[0034] 2. Structure of component mounting machine 10

[0035] like Figure 1 and Figure 3 As shown, the component mounting machine 10 includes a substrate handling device 20, a component supply device 30, a head moving device 40, and a control device 85. In the following description, the horizontal direction, i.e., the left-right direction of the component mounting machine 10, will be referred to as the horizontal direction. Figure 1 From the upper left to the lower right direction, Figure 3 The left and right directions are set as the X direction (first direction), and the horizontal direction intersecting the X direction is the front and back direction of the component mounting machine 10. Figure 1 From the bottom left to the top right, Figure 3 The vertical direction (the direction above and below) is set as the Y direction (the second direction), and the vertical direction (which is orthogonal to both the X and Y directions) is set as the Y direction (the second direction). Figure 1 The up and down directions, Figure 3 The forward and backward directions are defined as the Z direction.

[0036] 2-1. Substrate handling device 20

[0037] The substrate handling device 20 includes a conveyor belt 21, a pair of guide rails 22, and a support device 23. The conveyor belt 21 is an annular belt that transports a substrate 90 placed on its upper surface. The pair of guide rails 22 extend in the transport direction (X direction) of the substrate 90 and support the periphery of the substrate 90 transported by the conveyor belt 21. At least one of the pair of guide rails 22 is disposed on the base 11 in a manner that allows it to move along the Y direction.

[0038] The substrate transport device 20 sequentially transports the substrates 90 in the transport direction and positions the substrates 90 at predetermined positions within the machine. For example... Figure 2 As shown, the support device 23 raises the support pin 24 via the pin lifting device 25, clamping the substrate 90, which is positioned at a predetermined position in the transport direction, between the support device 23 and a pair of guide rails 22. After performing the component mounting process, the substrate transport device 20 moves the substrate 90 out of the component mounting machine 10.

[0039] 2-2. Component supply device 30

[0040] The component supply device 30 supplies components mounted to the substrate 90. The component supply device 30 includes a feeder 31 arranged along a predetermined arrangement direction (X direction in this embodiment). The feeder 31 is, for example, a carrier tape 33 that holds the components (see reference 30). Figure 9 A belt feeder that can pick up and supply components by feeding along the Y direction. The component supply device 30 supports the reel 32, on which the carrier belt 33 is wound, so that it can rotate.

[0041] The feeder 31 may include a rod feeder, a bulk feeder, etc. Alternatively, the component supply device 30 may supply larger components arranged on a tray placed on a pallet. In such a configuration, the component supply device 30 supplies components by pulling out a predetermined tray from a storage device that holds multiple trays according to the installation process.

[0042] 2-3. Head moving device 40

[0043] The head moving device 40 is an XY robot used for the horizontal movement of a working head for a predetermined substrate operation. In this embodiment, the head moving device 40 moves the mounting head 70, which serves as the working head. Figure 1 As shown, the head moving device 40 includes an X slider 50 and a Y slider 60, which serve as a moving stage for mounting the mounting head 70. The X slider 50 moves in the X direction via a direct-acting mechanism of the X drive device 41. The Y slider 60 supports the X slider 50 so that it can move in the X direction, and moves in the Y direction via a direct-acting mechanism of the Y drive device 46.

[0044] At the head support portion 51 of the X slider 50 (see reference) Figure 2 The mounting head 70 is fixed in a replaceable manner by means of clamping components (not shown in the figure). Various retaining components are detachably mounted on the mounting head 70. The aforementioned retaining components include a suction nozzle 74 that adsorbs and retains the element by negative pressure air, a clamp that holds the element, and a pick-up device that retains the support pin 24.

[0045] In this embodiment, the component mounting machine 10 includes a plurality of mounting heads 70. A head moving device 40 moves the plurality of mounting heads 70 independently in the X direction and moves them integrally in the Y direction. Specifically, the head moving device 40 has a plurality of X-slider members 50 that respectively support the mounting heads 70. Detailed structures of the mounting heads 70 and the head moving device 40 will be described later.

[0046] 2-4. Component camera 81, substrate camera 82

[0047] like Figure 2As shown, the component mounting machine 10 includes a component camera 81 and a substrate camera 82. The component camera 81 and the substrate camera 82 are digital imaging devices with imaging elements such as CMOS. The component camera 81 and the substrate camera 82 perform imaging based on control signals and transmit the image data acquired through the imaging.

[0048] In this embodiment, a component camera 81 is disposed on the head body 71 of the mounting head 70. Additionally, a substrate camera 82 is disposed on the X-slide member 50. With this structure, both the component camera 81 and the substrate camera 82 move integrally with the mounting head 70 as the X-slide member 50 moves. The component camera 81 is configured to capture images of the component 98 held by the suction nozzle 74, which serves as a holding member, from below. The substrate camera 82 is configured to capture images of the reference mark 96 (see reference numeral) attached to the substrate 90 from above. Figure 5 ).

[0049] In addition to the above, the component mounting machine 10 may also be equipped with a camera capable of photographing the component 98 held in the nozzle 74 from the side or above, and a camera capable of photographing the mounting surface of the substrate 90 before or after mounting the component 98. These cameras are used, for example, to check the presence or absence of the component 98, its posture, the type and shape of the component 98, and the appropriateness of the solder printing status and mounting status of the component 98 on the substrate 90.

[0050] 2-5. Control device 85

[0051] The control device 85 mainly consists of a CPU, various memories, and control circuits. The control device 85 performs the mounting process of components onto the substrate 90. During the mounting process, the control device 85 controls the movement of the head moving device 40 based on information output from various sensors, image processing results, and pre-stored control programs. This controls the position and angle of the multiple suction nozzles 74 supported on the mounting head 70. Additionally, the control device 85 performs a configuration operation, which includes adding or removing support pins 24 for supporting the device 23 from the substrate 90 below, and changing the position of the support pins 24 during the mounting process.

[0052] 3. Detailed structure of mounting head 70

[0053] like Figure 2As shown, the mounting head 70 includes a head body 71 that is detachably mounted to the X slider 50. The mounting head 70 has a rotating body 72 disposed on the head body 71 such that it can rotate relative to the head body 71 about an R-axis extending in the vertical direction. The rotating body 72 supports a plurality of retainers 73 arranged on a ring centered on the R-axis, enabling it to be raised and lowered and rotated about the central axis (Q-axis) of each retainer 73. Each retainer 73 is fitted with a suction nozzle 74, which serves as a retaining element 98. Thus, the rotating body 72 supports the suction nozzle 74 via the retainers 73.

[0054] The mounting head 70 has an R-axis rotation device 75 that rotates the rotating body 72 about an R-axis. The R-axis rotation device 75 indexes a retainer 73 to a lifting position via a lifting device 77 (described later) by determining the angle of the rotating body 72 to a predetermined angle about the R-axis. The mounting head 70 also has a Q-axis rotation device 76 that rotates the retainer 73 about a Q-axis. In this embodiment, the Q-axis rotation device 76 has a mechanism that rotates multiple retainers 73 in conjunction, thus co-operating in the rotation of the multiple retainers 73. According to the above structure, when one retainer 73 is angularly determined to be at a predetermined angle about the Q-axis, the other multiple retainers 73 are angularly determined to be at the predetermined angle in conjunction.

[0055] The mounting head 70 has a lifting device 77 that raises and lowers one of a plurality of retainers 73 that has been indexed to a lifting position by rotation of a rotating body 72. The lifting device 77 lowers and raises the nozzle 74 mounted on the retainer 73 by lowering and raising the retainer 73. Furthermore, the mounting head 70 can be structured with multiple lifting devices, which have two or more lifting positions and can independently drive the separately positioned retainers 73 to raise and lower.

[0056] The number of retainers 73 supported by the mounting head 70 constructed as described above can vary depending on the type of mounting head 70. Furthermore, the mounting head 70 can be configured in various ways besides supporting multiple retainers 73 in a circular shape at equal intervals, as in this embodiment. For example, the mounting head 70 can also support multiple retainers 73 arranged in a straight line or a matrix.

[0057] 4. Detailed structure of the head moving device 40

[0058] 4-1. Overall structure and driving device of head moving device 40

[0059] In this embodiment, such as Figure 1As shown, the head moving device 40 is supported from above by a pair of columns 12 and a beam 13. The pair of columns 12 are portal-shaped structures respectively located at the front and rear of the base 11. The beam 13 is supported by the pair of columns 12. The beam 13 is a strength component that supports the head moving device 40 and improves the overall rigidity of the machine by connecting it to the pair of columns 12.

[0060] As described above, the head moving device 40 includes an X driving device 41 (see reference 41) that moves the X slider 50 relative to the Y slider 60 in the X direction. Figure 2 The X-drive device 41 and the Y-drive device 46 move the Y-slider 60 relative to the beam 13 in the Y direction. The X-drive device 41 and the Y-drive device 46 are composed of linear motors, ball screws, or other direct-acting mechanisms. In this embodiment, the X-drive device 41 is a linear motor and the Y-drive device 46 is a ball screw device.

[0061] Here, as Figure 1 As shown, the Y-slider 60 has a guide block 65 that engages slidably with a pair of guide rails 47 disposed on the beam 13. The pair of guide rails 47 and the guide block 65 function as a Y-axis guide device to guide the Y-slider 60 to move in the Y direction. The Y-axis guide device supports the Y-slider 60, which is suspended from the pair of guide rails 47, in a suspended manner, enabling it to move in the Y direction, thus ensuring a large range of motion in the X direction.

[0062] The Y-drive device 46, which is a ball screw assembly, includes: a ball screw 461, disposed on the beam 13 and extending along the Y-axis; a nut 462, screwed onto the ball screw 461 and disposed on the Y-slider 60; and a motor 463, which rotates the ball screw 461. The Y-drive device 46 rotates the ball screw 461 in a predetermined direction by controlling the power supply to the motor 463, thereby moving the Y-slider 60, which is fixed to the nut 462, to a predetermined position in the Y direction.

[0063] like Figure 2 As shown, the X-slider 50 includes a plurality of carriages 52 supported for movement along a pair of guide rails 61 provided on the Y-slider 60. The pair of guide rails 61 and carriages 52 function as an X-axis guiding device for guiding the X-slider 50 to move in the X direction. In this embodiment, as... Figure 2 As shown, the X drive device 41, which is a linear motor, includes a pair of stators 42, a mover 43, and a cooling device 44.

[0064] A pair of stators 42 are arranged facing each other along the X direction at predetermined intervals. Each stator 42 is configured to include a yoke on which multiple permanent magnets are fixed and a base plate containing a non-magnetic body that holds the yoke. The multiple permanent magnets are arranged such that the magnetic poles of adjacent permanent magnets are oriented differently. A mover 43 is disposed between the pair of stators 42 and is located on the X-slider 50. The mover 43 is configured to include an iron core corresponding to the three phases (U, V, W) and a coil wound around the iron core.

[0065] The cooling device 44 cools the X drive unit 41, which is a linear motor, by dissipating heat in a radiator through heat conducted by multiple heat pipes. The X drive unit 41 generates thrust by supplying power to the coil of the mover 43. By controlling the power supply to the coil, the X drive unit 41 moves the X slider 50, which is fixed to the mover 43, to a predetermined position in the X direction.

[0066] 4-2. Detailed structure of the head moving device 40

[0067] The component mounting machine 10 moves the mounting head 70 horizontally via a head moving device 40 configured as described above. Here, to shorten the time required for component mounting, a structure is considered that allows simultaneous pickup of two components by providing multiple lifting devices 77 on the mounting head 70. However, such a structure introduces various constraints, such as the need to supply the two components to be picked up at intervals approximately equal to the intervals between the lifting nozzles 74.

[0068] Therefore, the component mounting machine 10 of this embodiment adopts a structure having multiple (two in this embodiment) mounting heads 70 that are suspended and can move independently in the X direction (the transport direction of the substrate 90 and the arrangement direction of the feeder 31) to ensure a large range of motion in the X direction. Hereinafter, when distinguishing between the upstream and downstream sides of the substrate transport direction of the multiple X sliders 50 and the multiple mounting heads 70, the upstream side of the substrate transport direction ( Figure 1 upper left side Figure 3 The component on the left side of the drawing is marked with "L" for components located on the downstream side in the substrate transport direction. Figure 1 The lower right side Figure 3 The part on the right side of the figure is marked with "R" for explanation.

[0069] The head moving device 40 includes two X-slider members 50L and 50R that support the two mounting heads 70L and 70R so that they can move independently along the X direction. Furthermore, a Y-slider 60 supports the two X-slider members 50L and 50R so that they can move along the X direction, and also allows the two X-slider members 50L and 50R to move together along the Y direction. In this embodiment, the Y-slider 60 supports the two X-slider members 50L and 50R so that they can move along the X direction on the same plane (XZ plane) orthogonal to the Y direction via a pair of upper and lower guide rails 61 arranged along the X direction.

[0070] 5. Installation process of component mounting machine 10

[0071] 5-1. Overview of Installation and Processing

[0072] Reference Figure 3 and Figure 4 The mounting process of the component mounting machine 10 will be described. Here, it is assumed that the component supply device 30 is equipped with multiple feeders 31. In the mounting process, firstly, as... Figure 4 As shown, the substrate transport device 20 of the component mounting machine 10 performs a substrate 90 loading process (S11). This loads the substrate 90 into the machine and positions it at a predetermined location within the machine.

[0073] Next, the control device 85 performs a preparation process (S12). This preparation process includes obtaining a reference mark 96 (see reference 96) for determining the position of the positioned substrate 90. Figure 5 The control device 85 identifies the substrate ID of the substrate 90 and reads the barcode 97. Specifically, the control device 85 controls the movement of the head moving device 40 to perform a shooting action, which moves the substrate camera 82 above the subject such as the reference mark 96 to take a picture. The control device 85 identifies the reference mark 96 and reads the barcode 97 by performing image processing on the image data acquired by the shooting.

[0074] Additionally, the preparation process may include determining the presence or absence of warping on the substrate 90, the status of already mounted components 98, and the status of printed solder. The control device 85 controls the movement of the head moving device 40 to move the substrate camera 82 to a predetermined position according to the required preparation process. Furthermore, the control device 85 obtains the type of the substrate 90 (standard / multi-unit substrate, etc.) by sending the substrate ID of the substrate 90 to the host computer 5, and sets the type of mounting process that should be performed on the substrate 90.

[0075] In the PP cycle, the control device 85 executes a pickup cycle (S13, pickup step) that repeatedly performs the pickup action of picking up components 98 using multiple nozzles 74. During this time, the control device 85 controls the movement of the head moving device 40 in the pickup action to sequentially position the mounting head 70 according to the position of the components 98 that can be picked up. In this embodiment, the control device 85 performs a recognition process (S14, recognition step) in parallel with the pickup cycle to identify the holding state of the components 98 held by the multiple nozzles 74 respectively.

[0076] In detail, when the rotating body 72 rotates around the R-axis during the execution of the pickup cycle and positions the nozzle 74 holding the component 98 above the component camera 81, the control device 85 sends a shooting command to the component camera 81. The control device 85 performs image processing on the image data acquired by the component camera 81 to identify the posture (position and angle) of the component 98 held by the nozzle 74.

[0077] After the pickup cycle (S13) ends, the control device 85 executes an installation cycle (S15, installation step) that repeatedly performs the installation action of mounting the element 98 using multiple nozzles 74. Furthermore, during the installation action of this installation cycle (S15), the control device 85 controls the movement of the mounting head 70 to install the element 98 into the installation position specified by the control program. Then, based on the result of the recognition processing (S14), the control device 85 controls the movement of the mounting head 70 to make the element 98 assume a predetermined posture relative to the installation position.

[0078] Based on the control program, the control device 85 determines whether all PP cycles have ended (S16). If all PP cycles have not ended (S16: No), the PP cycle is executed (S13-S15). If all PP cycles have ended (S16: Yes), the control device 85 executes the substrate 90 removal process (S17). In the substrate 90 removal process, the substrate transport device 20 releases the positioned substrate 90 and moves the substrate 90 out of the component mounting machine 10.

[0079] 5-2. Control of the head moving device 40 during installation

[0080] In the installation cycle (S15) of the installation process, as described above, the installation operation of the component 98 using multiple nozzles 74 is performed. In this embodiment, in order to achieve high efficiency in the installation cycle of the component 98, the installation operation using two installation heads 70 is performed. Here, as... Figure 5 As shown, substrate 90 is a multi-unit substrate 90A, with multiple unit substrates 91 arranged in the X direction.

[0081] Here, the multi-unit substrate 90A is constructed by arranging multiple unit substrates 91 with the same wiring pattern 92 in the X and Y directions. Furthermore, with the arrangement of the multiple unit substrates 91, multiple reference marks 96 are arranged in a matrix along the X and Y directions on the multi-unit substrate 90A.

[0082] The control device 85 performs a positioning action of the suction nozzle 74 in the X direction, so that the separation distance of the suction nozzles 74 supported by the two mounting heads 70 in the X direction is an integer multiple of the spacing between a pair of adjacent unit substrates 91 in the X direction. Furthermore, the control device 85 controls the two mounting heads 70 to sequentially perform a mounting action on each of the multiple unit substrates 91 designated as the mounting targets in the current PP cycle, mounting multiple components 98 in the same mounting sequence once.

[0083] In this embodiment, the target substrate described above is preset in the preparation process (S12). Specifically, as follows... Figure 6 As shown, the control device 85 captures an image of the barcode 97 on the substrate 90 and reads the barcode 97 by performing image processing on the image data acquired from the capture (S21). Thus, based on the substrate ID obtained through the reading processing, the control device 85 identifies the substrate 90 as a multi-unit substrate 90A and obtains substrate information including the arrangement of unit substrates 91, the presence or absence of unit substrates 91 that skip elements 98, etc. The control device 85 can also obtain substrate information by sending the substrate ID to the host computer 5.

[0084] Next, the control device 85 takes a picture of the positions of multiple reference marks 96 included in the substrate information, and performs image processing on the image data obtained by the picture to obtain the reference position of the multi-unit substrate 90A based on the multiple reference marks 96 and the reference position (e.g., origin) of each of the multiple unit substrates 91 (S22). Details of the picture processing targeting the multiple reference marks 96 will be described later.

[0085] Next, if the substrate 90 is a multi-unit substrate 90A (S23: Yes), the control device 85 executes the target substrate setting process (S30, setting step). Here, the "target substrate" refers to the unit substrate 91 that is set as the mounting target in each of the multiple execution PP cycles. In the target substrate setting process (S30), which mounting head 70 is assigned to each of the multiple unit substrates 91 to handle the mounting operation of the component 98 is determined, so that the mounting process can be performed efficiently using two mounting heads 70.

[0086] The substrate setting process can be applied in various ways. In this embodiment, the efficiency of the mounting process is improved by employing a setting process as follows. Specifically, the operating modes of the two mounting heads 70 in the mounting process are preset in the control device 85. These operating modes include a proximity mode and a partitioning mode. Figure 7A As shown, the proximity mode is an operating mode in which the two mounting heads 70 approach each other in a manner that prevents interference and ensures that the separation distance between them does not increase beyond a predetermined value. Figure 7B As shown, the partitioning mode is the operation mode of the mounting head 70, which performs the mounting action by imaginarily partitioning multiple unit substrates 91 in the X direction.

[0087] Here, Figure 7A and Figure 7B In the mounting head 70L, which is set to the left (upstream side in the substrate transport direction), the unit substrate 91 of the target substrate is marked "U1" and a slash, while the unit substrate 91 of the target substrate of the mounting head 70R, which is set to the right (downstream side in the substrate transport direction), is marked "U2" and a slash. Furthermore, the operating mode can be set by receiving operator input from the control device 85 during changeover adjustments in the mounting process, or it can be set via a control program. Alternatively, the operating mode can also be set by responding to the substrate ID sent to the host computer 5.

[0088] More specifically, when the action mode is proximity mode (S31: Yes), such as Figure 7A As shown, the control device 85 will use the first unit substrate 911 (e.g., one of a plurality of unit substrates 91) as an example. Figure 7A The upper left unit substrate 91) and the unit substrate 91 that is separated from the first unit substrate 911 in the X direction, allowing the two mounting heads 70 to approach each other at a minimum distance Dc and is closest to the first unit substrate 911 in the X direction. Figure 7A The second unit substrate 912 of the third unit substrate 91 from the top left is set as the target substrate (U1, U2 shown in the thick frame solid line) (S32).

[0089] Next, the control device 85 will select the unit substrate 91 that is not set as the target substrate ( Figure 7A The second unit substrate 91 from the top left (91) is designated as the first unit substrate 911, and similarly as the second unit substrate 912, and these are set as the target substrates (U1 and U2 shown in the bold dashed lines). By repeating this operation, each unit substrate 91 is assigned a mounting head 70 to perform the mounting operation. In proximity mode, the travel distance of the two mounting heads 70 can be shortened according to their relationship with the supply position of the component 98, thus shortening the time required for the mounting process.

[0090] Here, an example is shown where the minimum spacing Dc is larger than the spacing Dp of the plurality of unit substrates 91 arranged in the X direction but smaller than twice the spacing Dp (Dp < Dc < 2Dp). In such a case, as... Figure 7A As shown, each target substrate (U1, U2) is configured such that one unit substrate 91 is sandwiched between the target substrates in the X direction. In addition, when the minimum interval Dc is smaller than the spacing Dp of the multiple unit substrates 91, each target substrate (U1, U2) is configured to be adjacent in the X direction.

[0091] Furthermore, when the operating mode of the control device 85 is the partitioned mode (S31: No), such as Figure 7B As shown, multiple unit substrates 91 are divided into partitions 95 in the X direction, the same number as the number of mounting heads 70. Mounting heads 70 are assigned to each partition 95 to perform the mounting operation, and target substrates (U1, U2) are designated (S33). In this embodiment, the head moving device 40 has two mounting heads 70, and the multiple unit substrates 91 are divided into two partitions 95A and 95B in the X direction.

[0092] Furthermore, the multiple unit substrates 91 belonging to the left partition 95A are assigned to the target substrate U1 by means of a mounting operation performed by the left mounting head 70L. Similarly, the multiple unit substrates 91 belonging to the right partition 95B are assigned to the target substrate U2 by means of a mounting operation performed by the right mounting head 70R. As described above, in the preparation process (S12), the multiple unit substrates 91 are pre-set to be the target substrates U1 and U2, respectively, by the two mounting heads 70.

[0093] In the installation cycle (S15), the control device 85 controls the installation of a pair of target substrates U1 and U2, ensuring they are positioned as close as possible in the same Y direction as possible, using a pair of mounting heads 70L and 70R. This ensures that the separation distance in the X direction between the nozzles 74 supported by the two mounting heads 70 is an integer multiple of the interval between adjacent unit substrates 91 in the X direction. Then, the control device 85 controls the two mounting heads 70L and 70R to perform one installation operation on each of the target substrates U1 and U2 designated for installation in this PP cycle.

[0094] Specifically, such as Figure 8As shown, during the installation action (AL11) performed by one of the two mounting heads 70 (e.g., the left mounting head 70L), the control device 85 performs a positioning action (AR11x) of the nozzle 74 toward the X-direction position (first direction position) of the installation position corresponding to the installation action (AR11) of the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the installation action of the left mounting head 70L is completed, a positioning action (AR11y) is performed toward the Y-direction position (second direction position) of the installation position corresponding to the installation action of the right mounting head 70R. The aforementioned positioning actions (AR11x, AR11y) toward the installation position include a correction amount based on the result of the recognition processing (S14), namely the holding state of the element 98.

[0095] Therefore, mounting operations using two mounting heads 70 can be performed in parallel (at least the XY movement (AL11x, AL11y) of the left mounting head 70L and the X movement (AR11x) of the right mounting head 70R). The aforementioned pair of mounting operations (AL11, AR11) are operations that mount the same type of component 98 at relatively identical mounting positions relative to the reference positions (origin) of each object substrate U1, U2.

[0096] The control device 85 moves to the next pair of installation actions (AL12, AR12) according to the control program, and performs the same control. Then, after completing the installation cycle for the predetermined target substrate among the multiple unit substrates 91, the control device 85 sequentially performs the installation cycle for the other target substrates. By repeating this operation, the installation process of the multi-unit substrate 90A is completed.

[0097] Based on this structure, mounting operations using two mounting heads 70 are performed on target substrates U1 and U2, which are appropriately set according to multiple unit substrates 91, thereby achieving efficient mounting processing for multi-unit substrates 90A. Furthermore, in this embodiment, the operating modes of the two mounting heads 70 during the mounting process are preset. In contrast, the operating mode can be fixed to either one, or it can be set according to the mounting process and the type of multi-unit substrate 90A.

[0098] 5-3. Head movement device 40 control during the picking action

[0099] As described above, the control of the head moving device 40, which uses two mounting heads 70, performed in the mounting cycle (S15), can also be applied to the pick-up operation of the component 98. Here, in the pick-up cycle (S13) of the mounting process, the pick-up operation of the component 98 using multiple suction nozzles 74 is performed. Figure 9As shown, the picking action is an action of picking up the element 98 supplied by a plurality of feeders 31 arranged at predetermined intervals Vs in the X direction. The control device 85 performs a positioning action of the suction nozzle 74 in the X direction so that the separation distance in the X direction between the suction nozzles 74 respectively supported on the two mounting heads 70 is an integer multiple of the aforementioned predetermined interval Vs (in Figure 9 (The middle is 2 times).

[0100] Here, when the substrate 90 is a multi-unit substrate 90A and multiple unit substrates 91 with two mounting heads 70 positioned in the same Y direction are designated as target substrates U1 and U2, the control device 85 executes a picking operation in which the two mounting heads 70 each use multiple suction nozzles 74 to pick up the same number of the same type of components 98 in the same order. Furthermore, in the component supply device 30, the same type of components 98 are supplied in a pickable manner (in... Figure 9 Two belt feeders 31A (indicated by slashes in the middle) are equipped in a manner that allows the two mounting heads 70 to approach each other at a minimum interval Dc or more along the X direction (see reference). Figure 9 Furthermore, the two mounting heads 70 are equipped with multiple nozzles 74 of various types capable of picking up the aforementioned components 98, and the multiple nozzles 74 are arranged identically to each other.

[0101] In the pickup cycle (S13), during the pickup action (PL11) performed by one of the two mounting heads 70 (e.g., the left mounting head 70L), the control device 85 performs a positioning action (PR11x) of the nozzle 74 toward the pickup position corresponding to the pickup action (PR11) performed by the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the pickup action of the left mounting head 70L is completed, a positioning action (PR11y) is performed toward the pickup position corresponding to the pickup action performed by the right mounting head 70R. Thus, the pickup actions using the two mounting heads 70 can be performed in parallel (at least the XY movement (PL11x, PL11y) of the left mounting head 70L and the X movement (PR11y) of the right mounting head 70R).

[0102] Here, in the component supply device 30, when multiple feeders 31 are respectively equipped, individual configuration errors sometimes occur in the feeders 31 due to differences in the feeders 31, slots, etc. The control device 85 can identify the configuration errors by obtaining, for example, a reference mark attached to the upper surface of the feeder 31 after equipping the feeder 31. It should be noted that, in the example above, sometimes the pickup position corresponding to the pickup action of the right mounting head 70R sometimes converges within the allowable range of the pickup action of the nozzle 74 of the right mounting head 70R, even considering the configuration error of the feeder 31.

[0103] At this time, the control device 85 can also position and perform a picking action on the two mounting heads 70L and 70R in such a way that the two mounting heads 70L and 70R can simultaneously pick up the two components 98 that are separately arranged in the X direction. That is, the control device 85 can also perform a picking action that lowers the nozzle 74 of the right mounting head 70R without waiting for the picking action of the left mounting head 70L to end, provided that the positional relationship of the pair of feeders 31, including the configuration error, converges within the allowable range.

[0104] On the other hand, even if the positional relationship of a pair of feeders 31 does not converge to the allowable range due to the configuration error of the feeders 31, if the feeders 31 are belt feeders 31A, the control device 85 can still perform an effective picking operation by cooperating the belt feeders 31A with the mounting heads 70. Specifically, the control device 85 first obtains the configuration error of the pair of belt feeders 31A supplying the element 98 to be picked up by the two mounting heads 70L and 70R.

[0105] like Figure 10 As shown, the control device 85 then adjusts the X-direction positions of the two mounting heads 70L and 70R in a manner that corrects for the X-direction configuration error (X-direction error in the configuration error) of the pair of belt feeders 31A, and performs the positioning action (PL11x, PL11y, PR11x, PR11y) of the suction nozzle 74 at the pickup position. At this time, in parallel with the above-mentioned positioning action, the control device 85 feeds the carrier belt 33 to move in a manner that corrects for the configuration error (Y-direction error in the configuration error) of each pair of belt feeders 31A, and adjusts the Y-direction position of the supplied element 98.

[0106] Thus, when the two mounting heads 70 perform pick-up actions respectively, the control device 85 corrects the X-direction configuration error of the multiple belt feeders 31A by moving the two mounting heads 70L and 70R from their current positions, and corrects the Y-direction configuration error of the multiple belt feeders 31A by feeding the carrier belt 33. As a result, the suction nozzles 74, each supported on the two mounting heads 70, are positioned at predetermined pick-up positions. Therefore, pick-up actions (PL11, PR11) can be performed simultaneously by the two mounting heads 70L and 70R.

[0107] The control device 85 moves to the next pair of pickup actions (PL12, PR12) according to the control program, and performs the same control. With this structure, the pickup action of picking up the same type of component 98 is performed in parallel by the two mounting heads 70L and 70R, thus achieving high efficiency in the mounting process that includes this pickup cycle.

[0108] 5-4. Control of the head movement device 40 during filming

[0109] As described above, the control of the head moving device 40 using the two mounting heads 70, performed in the pickup cycle (S13) and mounting cycle (S15), can also be applied to the shooting operation using two substrate cameras 82 that move integrally with the two mounting heads 70. Here, in the preparation process (S12) of the mounting process, as described above, the shooting steps (shooting steps) are performed using the substrate cameras 82 to capture reference marks 96, barcodes 97, etc. In particular, as Figure 5 As shown, when the substrate 90 is a multi-unit substrate 90A, the number of reference marks 96 that become the subject of the photograph is sometimes more than that of a normal substrate 90.

[0110] In this embodiment, in order to achieve high efficiency in the shooting operation targeting the reference mark 96 as described above, a preparation process using two substrate cameras 82 is performed. The control device 85 may also, as exemplified in the control of the head moving device 40 during the mounting operation, divide the X-direction into multiple unit substrates 91 and assign substrate cameras 82 to each of the multiple partitions 95 to perform the shooting operation. Specifically, as... Figure 11 As shown, the left-hand substrate camera 82L is responsible for photographing the reference mark 96 of the partition 95A located on the left-right side of the multi-unit substrate 90A. Meanwhile, the right-hand substrate camera 82R is responsible for photographing the reference mark of the partition 95B located on the right-right side of the multi-unit substrate 90A.

[0111] In addition, such as Figure 11 As indicated by the arrow, the control device 85 sets the movement paths of the two substrate cameras 82L and 82R. Moreover, during the shooting action of shooting multiple reference marks 96, the control device 85 performs a positioning action to the X-direction position of the shooting position corresponding to the shooting action performed by the other of the multiple substrate cameras 82 (e.g., the left substrate camera 82L) while the shooting action is performed by one of the two substrate cameras 82 (e.g., the left substrate camera 82L).

[0112] Then, after the shooting action performed by the left substrate camera 82L is completed, a positioning action is performed to the Y-direction position of the shooting position corresponding to the shooting action performed by the right substrate camera 82R. Thus, shooting actions using both substrate cameras 82 can be performed in parallel (at least the XY movement and shooting processing of the left substrate camera 82L and the X movement of the right substrate camera 82R). Furthermore, in the example above, when the shooting position corresponding to the shooting action of the right substrate camera 82R is within the camera field of view of the substrate camera 82R, the control device 85 moves multiple substrate cameras 82 so that a pair of reference marks 96 separated in the X-direction can be simultaneously captured by the two substrate cameras 82L and 82R.

[0113] Specifically, such as Figure 12 As shown, the control device 85 uses two reference marks 96, which are identical in the Y direction and separated in the X direction, as shooting positions to position the two substrate cameras 82L and 82R (ML11xy, MR11xy). Then, the control device 85 takes pictures of the reference marks 96 at each shooting position and ends the first shooting action (ML11, MR11). Afterwards, the control device 85 moves the two substrate cameras 82L and 82R along a pre-set moving path to repeatedly perform positioning and shooting (ML12, MR12, ...).

[0114] Therefore, multiple reference marks 96 arranged in a matrix can be photographed efficiently, reducing the time required for recognition of the reference marks 96. It should be noted that the photographing operation described above is also applicable to processes such as reading barcodes 97, determining the presence or absence of warping on the substrate 90, the status of installed components 98, and the status of printed solder. This reduces the time required for preparation processing (S12).

[0115] 6. Effects of the structure of the implementation method

[0116] According to the structure of the embodiment, the suspended structure supported by the Y-slider 60 below the beam 13 can ensure a large range of motion Mr of the X-slider 50 relative to the X-direction dimension of the component mounting machine 10. In addition, the structure in which multiple X-slider 50s can move independently along the X-direction allows for variation in the separation distance of multiple mounting heads 70 to accommodate various production methods.

[0117] Therefore, by performing mounting operations using multiple mounting heads 70 on target substrates appropriately set according to multiple unit substrates 91, the mounting process for multi-unit substrates 90A can be highly efficient. Furthermore, by controlling the same head movement device 40, the picking and shooting operations can be highly efficient. As a result, production efficiency can be improved.

[0118] 7. Variations of the implementation method

[0119] In one embodiment, the head moving device 40 is configured to have two X-slider members 50, which move the separately mounted mounting heads 70. Alternatively, the head moving device 40 may be configured to have three or more X-slider members 50 and three or more mounting heads 70 mounted on them. In such a configuration, by enabling three or more mounting heads 70 to move independently in the X direction, the same control as in the embodiment can be applied, improving production efficiency.

[0120] Furthermore, in this embodiment, the plurality of mounting heads 70 are configured to move independently along the X direction. In contrast, when the horizontal direction in which the plurality of mounting heads 70 can move independently is designated as the first direction, and the horizontal direction intersecting the first direction is designated as the second direction, the first and second directions are not limited to the X and Y directions. The embodiment illustrated can be applied as long as it has a structure of a head moving device 40 that allows the plurality of mounting heads 70 to move independently along the first direction and move integrally along the second direction in a predetermined coordinate system.

[0121] 8. Optimization method for installation and handling

[0122] In this embodiment, the component mounting method for the mounting process includes a setting step (S30) in the preparation process (S12), a picking step (S13) in the PP cycle, and an mounting step (S15). Alternatively, the component mounting method may also include an image capturing step in the preparation process (S12) and an identification step (S14) in the PP cycle. Furthermore, the control device 85 of the component mounting machine 10 controls the operation of the head moving device 40, which has multiple mounting heads 70, using the aforementioned component mounting method to achieve high efficiency in the mounting process.

[0123] As described above, in addition to identifying the substrate 90 as a multi-unit substrate 90A during the execution of the installation process and controlling it to achieve high efficiency in the setting step (S30), picking step (S13), and installation step (S15), the control device 85 can also optimize the installation process in advance. For example, an optimization device that is assembled into an external device of the component mounting machine 10, such as the host computer 5, can be used to improve the structure of the control program and the instruction information for changeover adjustments.

[0124] Specifically, such as Figure 13 As shown, the optimization apparatus performs optimization processing for the mounting process (S40). The optimization apparatus first obtains the predetermined control program and substrate information (S41). Then, the optimization apparatus sets the configuration of the feeders 31, which supply the same type of component 98, in such a way that they are arranged with a minimum spacing Dc or more in the X direction, to correspond to the mounting process performed by the component mounting machine 10 (S42). The configuration position of the feeders 31 is reflected in the changeover adjustment instruction information.

[0125] Next, the optimization device sets the operating modes of the multiple mounting heads 70 and the shooting sequence of the multiple reference marks 96 during the mounting process (S43). These settings are reflected in the control program and the response when the substrate ID is input from the component mounting machine 10. With this structure, the predetermined mounting process can be optimized, and the mounting, picking, and shooting actions during the mounting process can be made more efficient. As a result, production efficiency can be improved.

[0126] Explanation of reference numerals in the attached figures

[0127] 5: Main computer; 10: Component mounting machine; 20: Substrate handling device; 30: Component supply device; 31: Feeder; 31A: Belt feeder; 32: Reel; 33: Carrier tape; 40: Head moving device; 70, 70L, 70R: Mounting head; 74: Nozzle; 81, 81L, 81R: Component camera; 82, 82L, 82R: Substrate camera; 85: Control device; 90: Substrate; 90A: Multi-unit substrate; 91: Unit substrate; 92: Wiring pattern; 911: First unit substrate; 912: Second unit substrate; 95, 95A, 95B: Partition; 96: Reference mark; 97: Barcode; 98: Component.

Claims

1. A component mounting method, which is a component mounting method of a component mounting machine, wherein the component mounting machine mounts components onto a substrate, wherein, The component mounting machine has multiple mounting heads that respectively support multiple nozzles for holding the components, allowing the multiple mounting heads to move independently in a first horizontal direction, and to move integrally in a second horizontal direction intersecting the first direction. When the substrate is a multi-unit substrate formed by arranging multiple unit substrates with the same wiring pattern in the first direction and the second direction, The component mounting method includes: The picking step involves performing a picking action whereby multiple mounting heads use multiple nozzles to pick up the same number of the same type of components. The setting step involves setting an object substrate among the multiple unit substrates, with each of the multiple mounting heads serving as the mounting object of the element; and In the installation step, the plurality of mounting heads sequentially perform an installation action on each of the plurality of object substrates, installing the plurality of components in the same installation sequence.

2. The component mounting method according to claim 1, wherein, During the installation step, while the installation action is performed by one of the plurality of installation heads, the nozzle is positioned in a first direction relative to the installation position corresponding to the installation action performed by another of the plurality of installation heads.

3. The component mounting method according to claim 2, wherein, The component mounting method further includes the following identification step: identifying holding states, wherein the holding state represents the posture of the component relative to the nozzle as picked up by the plurality of mounting heads through the picking step. During the installation step, as the installation action is performed by one of the plurality of mounting heads, a positioning action of the suction nozzle toward the first direction is performed based on the holding state corresponding to the suction nozzle of another of the plurality of mounting heads. In the installation step, after the component is installed by one of the plurality of mounting heads, a positioning action is performed on the nozzle toward a second directional position corresponding to the installation action performed by another of the plurality of mounting heads.

4. The component mounting method according to claim 1, wherein, In the setting step, a first unit substrate and a second unit substrate are set as the target substrate. The first unit substrate is one of a plurality of unit substrates, and the second unit substrate is the unit substrate that is separated from the first unit substrate in the first direction by a minimum spacing that allows the plurality of mounting heads to approach each other and is closest to the first unit substrate in the first direction.

5. The component mounting method according to any one of claims 1 to 3, wherein, In the setting step, the plurality of unit substrates are divided into a number of partitions in the first direction that are the same as the number of the plurality of mounting heads, and the mounting heads that perform the mounting action are assigned to the plurality of partitions respectively, thereby setting the target substrate.

6. The component mounting method according to any one of claims 1 to 3, wherein, In the picking step, during the picking action performed by one of the plurality of mounting heads, the nozzle is positioned in a first direction relative to the picking position corresponding to the picking action performed by another of the plurality of mounting heads.

7. The component mounting method according to claim 6, wherein, The picking action is the action of picking up the element supplied by a plurality of feeders arranged at predetermined intervals in the first direction. In the picking step, the nozzle is positioned in the first direction so that the separation distance of the nozzles supported by the plurality of mounting heads in the first direction is an integer multiple of the predetermined interval.

8. The component mounting method according to claim 7, wherein, The feeder is a belt feeder that feeds the component by moving the carrier belt containing the component forward in the second direction. In the picking step, when the multiple mounting heads perform the picking action respectively, based on the configuration error of the second direction of the multiple belt feeders and the current position of the second direction of the multiple mounting heads, the belt feeders feed the carrier belt to position the suction nozzles supported by the multiple mounting heads at the picking position.

9. The component mounting method according to any one of claims 1 to 3, wherein, In the picking step, the picking action of one of the multiple mounting heads and the picking action of another of the multiple mounting heads are performed simultaneously.

10. The component mounting method according to any one of claims 1 to 3, wherein, The component mounting machine includes multiple substrate cameras that are configured to move integrally with the multiple mounting heads and are capable of capturing images of the substrate. The component mounting method includes the following shooting steps: during the shooting action of shooting multiple reference marks attached to the substrate, while one of the multiple substrate cameras is performing the shooting action, a positioning action is performed to a first direction position corresponding to the shooting position performed by another substrate camera among the multiple substrate cameras.

11. The component mounting method according to claim 10, wherein, Multiple reference marks are arranged in a matrix on the substrate along the first direction and the second direction. In the shooting step, multiple substrate cameras are moved so that a pair of reference marks separated in the first direction can be simultaneously captured by the multiple substrate cameras.

12. An optimized method for a mounting process, wherein a component mounting machine mounts components onto a substrate, wherein, The component mounting machine has multiple mounting heads that respectively support multiple nozzles for holding the components, allowing the multiple mounting heads to move independently in a first direction and to move integrally in a second direction horizontally intersecting the first direction. In the case where the substrate to be installed is a multi-unit substrate formed by arranging multiple unit substrates having the same wiring pattern in the first and second directions, the substrate being installed is used as the object of the installation process. The optimized installation process is implemented as follows: The picking step involves performing a picking action whereby multiple mounting heads use multiple nozzles to pick up the same number of the same type of components. The setting step involves setting an object substrate among the multiple unit substrates, with each of the multiple mounting heads serving as the mounting object of the element; and In the installation step, the plurality of mounting heads sequentially perform an installation action on each of the plurality of object substrates, installing the plurality of components in the same installation sequence.

13. A component mounting machine, comprising: Multiple mounting heads, each supporting a nozzle with multiple retaining elements; and The control device causes the plurality of mounting heads to move independently in a first horizontal direction, and to move the plurality of mounting heads uniformly in a second horizontal direction intersecting the first direction. The control device performs a mounting process when the substrate on which the component is mounted is a multi-unit substrate composed of multiple unit substrates having the same wiring pattern arranged in the first and second directions. The mounting process includes: The picking step involves performing a picking action whereby multiple mounting heads use multiple nozzles to pick up the same number of the same type of components. The setting step involves setting an object substrate among the multiple unit substrates, with each of the multiple mounting heads serving as the mounting object of the element; and In the installation step, the plurality of mounting heads sequentially perform an installation action on each of the plurality of object substrates, installing the plurality of components in the same installation sequence.

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