Single layer printed circuit board for lighting device

Abstract

A printed circuit board (PCB) assembly can include a PCB including a base layer, an electrical layout layer, and a dielectric between the base layer and the electrical layout layer. The electrical layout layer can include a plurality of electrical pads and a plurality of electrical traces. The PCB assembly can include an emitter assembly including a plurality of emitters configured to emit light. The plurality of emitters can be mounted to the PCB and electrically connected to the electrical pads via respective wire bonds. The PCB assembly can include a drive circuit configured to control power delivered to the plurality of emitters. The drive circuit can be mounted to the PCB and electrically connected to the electrical pads via respective solder connections. The PCB assembly can include a communication circuit configured to cause the drive circuit to control the emitters in response to a message received via a wireless signal.

Description

Cross-reference to related applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 559,085, filed February 28, 2024; U.S. Provisional Patent Application No. 63 / 642,439, filed May 3, 2024; and U.S. Provisional Patent Application No. 63 / 642,726, filed May 4, 2024, the entire disclosure of which is hereby incorporated herein by reference in its entirety. Background Technology

[0002] Lamps and displays using efficient light sources such as light-emitting diodes (LEDs) are becoming increasingly popular in many different markets. LED light sources offer many advantages over traditional light sources such as incandescent and fluorescent lamps. For example, LED light sources can consume less power and have a longer lifespan than traditional light sources. In addition, LED light sources may be free of harmful substances and can provide additional specific advantages for different applications. When used for general lighting, LED light sources offer the opportunity to adjust the color (e.g., from white to blue, green, etc.) or color temperature (e.g., from warm white to cool white) of the light emitted from the LED light source to produce different lighting effects. Summary of the Invention

[0003] As described herein, a printed circuit board assembly may include a transmitter assembly and drive circuitry for the transmitter assembly, both mounted to a printed circuit board (e.g., a single printed circuit board). The printed circuit board may have a base layer, an electrical layout layer, and a dielectric layer between the base layer and the electrical layout layer, wherein the electrical layout layer may include a plurality of electrical pads and a plurality of electrical traces. The transmitter assembly may include a plurality of transmitters configured to emit light and electrically connected to two or more of the plurality of electrical pads via respective wire bonds. The drive circuitry may be configured to control the power delivered to the plurality of transmitters of the transmitter assembly and may be electrically connected to two or more of the plurality of electrical pads via respective solder connections. The printed circuit board assembly may also include communication circuitry configured to transmit and receive wireless signals. The communication circuitry may be configured to cause the drive circuitry to control the transmitters in response to a message received via the wireless signals.

[0004] A printed circuit board assembly may include a metal-core printed circuit board. The metal-core printed circuit board may include a base layer, a single electrical layout layer, and / or a single dielectric layer between the base layer and the electrical layout layer. The electrical layout layer may include multiple electrical pads, multiple electrical traces, and / or a ground plane. A printed circuit board assembly may include a transmitter assembly. The transmitter assembly may include multiple transmitters configured to emit light. The multiple transmitters may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. A printed circuit board assembly may include drive circuitry configured to control the power delivered to the multiple transmitters of the transmitter assembly. The drive circuitry may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. A printed circuit board assembly may include communication circuitry configured to transmit and receive wireless signals. The communication circuitry may include a common terminal of a circuit electrically coupled to a ground plane of the printed circuit board. The communication circuitry may be configured to cause the drive circuitry to control the transmitters in response to a message received via the wireless signal. The communication circuitry may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. The printed circuit board assembly may include an antenna electrically coupled to communication circuitry, which, for example, may allow the communication circuitry to transmit messages via wireless signals transmitted and received by the antenna. The antenna may extend from the printed circuit board (e.g., into a plane outside the plane defined by the printed circuit board). The communication circuitry may include a matching network circuit coupled between the communication circuitry and the antenna. The matching network circuitry may be at least partially surrounded by a ground plane on an electrical layout layer, and the ground plane may be electrically coupled to the base layer of the printed circuit board.

[0005] Multiple emitters can be electrically connected to two or more electrical pads of a plurality of electrical pads via corresponding wire bonding. Drive circuitry and communication circuitry can be electrically connected to two or more electrical pads of a plurality of electrical pads via corresponding solder joints. The emitters of the emitter assembly can be packaged in an optical element. The optical element can include a first dome portion formed on a printed circuit board and encapsulating one or more emitters. The first dome portion can be made of a light-transmitting first material. The first dome portion can define an interface surface substantially parallel to and extending above the printed circuit board. The optical element can include a second dome portion located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board. The second dome portion can have a shape configured to guide light from one or more emitters in a particular direction. The second dome portion can be made of a light-transmitting second material. The second dome portion can define an interface surface adhered to the interface surface of the first dome portion.

[0006] The optical element may include a barrier located on the surface of a substrate. The barrier may surround the transmitter. The surfaces of the barrier and the substrate may define a recess, in which a first dome portion is located. The optical element may include a dome, and the transmitter is configured to emit light through the dome. The antenna may be a monopole antenna. The printed circuit board assembly may include an antenna connector mounted to the printed circuit board such that the monopole antenna is electrically connected to the antenna connector, and the monopole antenna extends from the printed circuit board. The printed circuit board assembly may include a via extending through the printed circuit board. The monopole antenna may be electrically connected to the via such that the monopole antenna extends from the printed circuit board.

[0007] The printed circuit board may include at least one opening extending through the printed circuit board and configured to receive a fastener. A ground plane on the electrical layout layer may be electrically coupled to the base layer of the printed circuit board via the fastener. The fastener may include at least one of a screw or a rivet.

[0008] A printed circuit board may include one or more vias located within a ground plane. Each via extends from the electrical layout layer, through the dielectric layer, and into the base layer. Each via may be filled with a conductive material to electrically connect the ground plane on the electrical layout layer to the base layer.

[0009] A lighting device assembly may include a printed circuit board assembly comprising a metal core printed circuit board. The metal core printed circuit board may include a substrate, a single electrical layout layer, and a single dielectric layer between the substrate and the electrical layout layer. The electrical layout layer may include a plurality of electrical pads, a plurality of electrical traces, and a ground plane. The printed circuit board assembly may include a transmitter assembly comprising a plurality of transmitters configured to emit light. The plurality of transmitters may be mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads. The printed circuit board assembly may include drive circuitry configured to control the power delivered to the plurality of transmitters of the transmitter assembly. The drive circuitry may be mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads. The printed circuit board assembly may include communication circuitry configured to transmit and receive wireless signals. The communication circuitry may be configured to cause the drive circuitry to control the transmitters in response to a message received via the wireless signals. The communication circuitry may be mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads. The communication circuitry may have a common terminal electrically coupled to a ground plane of the printed circuit board. The lighting device assembly may include a reflector having a first opening, a second opening, and a reflective inner surface. Multiple transmitters may be configured to emit light through the first opening of the reflector. The inner surface of the reflector may be configured to reflect light through the second opening. The printed circuit board assembly may include an antenna electrically coupled to communication circuitry to allow the communication circuitry to transmit messages via wireless signals transmitted and received by the antenna. The antenna may extend from the printed circuit board to the exterior of the reflector.

[0010] The antenna may be a monopole antenna. The lighting assembly may include an antenna holder for holding the monopole antenna, allowing the monopole antenna to extend from the printed circuit board to the outside of the reflector. The lighting assembly may include a lamp holder to which the reflector is attached. The antenna holder may be connected to the lamp holder and extend from the lamp holder to the outside of the reflector. The antenna holder may be connected to the printed circuit board of the printed circuit board assembly. The lighting assembly may include an antenna connector mounted to the printed circuit board. In such examples, the monopole antenna may be electrically connected to the antenna connector, allowing the monopole antenna to extend from the printed circuit board to the outside of the reflector. The lighting assembly may include a through-hole extending through the printed circuit board. In such examples, the monopole antenna may be electrically connected to the through-hole, allowing the monopole antenna to extend from the printed circuit board to the outside of the reflector.

[0011] A ground plane can be electrically coupled to the base layer of the printed circuit board (PCB) of the PCB assembly. The PCB of the PCB assembly may include at least one opening extending through the PCB and configured to receive a fastener. The ground plane on the electrical layout layer can be electrically coupled to the base layer of the PCB via a fastener. The fastener may include at least one of a screw or a rivet. The PCB of the PCB assembly may include one or more vias located within the ground plane, each via extending from the electrical layout layer, through a dielectric layer, and into the base layer. Each via may be filled with a conductive material for electrically connecting the ground plane on the electrical layout layer to the base layer. The communication circuitry of the PCB assembly may include a matching network circuitry coupled between the communication circuitry and an antenna. The matching network circuitry may be at least partially surrounded by the ground plane on the electrical layout layer.

[0012] Multiple emitters of the emitter assembly can be electrically connected to two or more electrical pads of a plurality of electrical pads on a printed circuit board via corresponding wire bonds. Drive circuitry and communication circuitry can be electrically connected to two or more electrical pads of a plurality of electrical pads on the printed circuit board via corresponding solder joints. The emitters of the emitter assembly can be packaged as optical elements. The optical element of the emitter assembly of the printed circuit board assembly can include a first dome portion formed on the printed circuit board and encapsulating one or more emitters. The first dome portion can be made of a light-transmitting first material. The first dome portion can define an interface surface substantially parallel to and extending above the printed circuit board. The optical element can include a second dome portion located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board. The second dome portion can have a shape configured to direct light from one or more emitters in a particular direction. The second dome portion can be made of a light-transmitting second material and / or define an interface surface adhered to the interface surface of the first dome portion. The optical element can include a barrier located on the surface of a substrate and surrounding one or more emitters. The surfaces of the barrier and the substrate may define a recess, in which a first dome portion is located. The optical element may include the dome, and the emitter is configured to emit light through the dome.

[0013] A printed circuit board assembly may include a printed circuit board comprising a substrate, an electrical layout layer, and a dielectric layer between the substrate and the electrical layout layer. The electrical layout layer may include a plurality of electrical pads and a plurality of electrical traces. The printed circuit board assembly may include a transmitter assembly comprising a plurality of transmitters configured to emit light. The plurality of transmitters may be mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads via corresponding wire bonds. The printed circuit board assembly may include drive circuitry configured to control the power delivered to the plurality of transmitters of the transmitter assembly. The drive circuitry may be mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads via corresponding solder joint connections. The printed circuit board may include communication circuitry configured to transmit and receive wireless signals. The communication circuitry may be configured to cause the drive circuitry to control the transmitters in response to a message received via the wireless signals.

[0014] The printed circuit board (PCB) may be a metal-core PCB. The PCB may include a single electrical layout layer and a single dielectric layer. Communication circuitry may be mounted to the PCB and electrically connected to two or more electrical pads of a plurality of electrical pads via corresponding solder joints. The communication circuitry may be electrically coupled to an antenna extending from the PCB. The communication circuitry may include a processor and a circuit common terminal electrically coupled to a ground plane on the electrical layout layer. The antenna may be electrically coupled to the processor via a matching network circuitry at least partially surrounded by the ground plane on the electrical layout layer. The ground plane on the electrical layout layer may be electrically coupled to a base layer of the PCB. The PCB may include at least one opening extending through the PCB and configured to receive a fastener. The ground plane on the electrical layout layer may be electrically coupled to the base layer of the PCB via a fastener. The fastener may include at least one of a screw or a rivet. The PCB may include one or more vias located within the ground plane, each of these vias extending from the electrical layout layer, through the dielectric layer, and into the base layer, each via being filled with a conductive material for electrically connecting the ground plane on the electrical layout layer to the base layer. Antennas may include monopole antennas extending from a printed circuit board.

[0015] The emitter of the emitter assembly may be encapsulated by an optical element. The optical element may include a first dome portion formed on a printed circuit board and encapsulating one or more emitters. The first dome portion may be made of a light-transmitting first material. The first dome portion may define an interface surface substantially parallel to and extending above the printed circuit board. The optical element may include a second dome portion located above the first dome portion, such that the first dome portion is positioned between the second dome portion and the printed circuit board. The second dome portion may have a shape configured to direct light from one or more emitters in a particular direction. The second dome portion may be made of a light-transmitting second material and may define an interface surface adhered to the interface surface of the first dome portion. The optical element may include a barrier located on a surface of a substrate and surrounding one or more emitters. The surfaces of the barrier and the substrate may define a recess in which the first dome portion is located. The optical element may include a dome through which the emitter is configured to emit light.

[0016] The printed circuit board (PCB) can be a first PCB, and the PCB assembly can include a second PCB. Communication circuitry can be mounted to the second PCB and electrically connected to two or more electrical pads of a plurality of electrical pads on the second PCB via corresponding solder joints. The first PCB can be a metal-core PCB. The first PCB can include a recess in which the second PCB is located. The communication circuitry can be electrically coupled to an antenna located on an electrical layout layer of the second PCB. The communication circuitry can be electrically coupled to an antenna, which can be a monopole antenna extending from the second PCB.

[0017] A printed circuit board assembly may include a metal-core printed circuit board. The metal-core printed circuit board may include a base layer, a single electrical layout layer, and a single dielectric layer between the base layer and the electrical layout layer. The electrical layout layer may include multiple electrical pads and multiple electrical traces. The printed circuit board assembly may include a transmitter assembly comprising multiple transmitters configured to emit light. The multiple transmitters may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. The printed circuit board assembly may include drive circuitry configured to control the power delivered to the multiple transmitters of the transmitter assembly. The drive circuitry may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. The printed circuit board assembly may include communication circuitry configured to transmit and receive wireless signals. The communication circuitry may be configured to cause the drive circuitry to control the transmitters in response to a message received via the wireless signals. The communication circuitry may be mounted to the printed circuit board and electrically connected to two or more of the multiple electrical pads. Attached Figure Description

[0018] Figure 1 This is a perspective view of an example lighting installation.

[0019] Figure 2 This is a perspective view of an example lighting fixture component that can be deployed as follows: Figure 1 Part of the lighting device shown.

[0020] Figure 3 yes Figure 2 An exploded view of the lighting fixture components.

[0021] Figure 4 It is a lighting fixture component (such as, Figure 2 A top view of an example emitter component (shown as a lighting device component).

[0022] Figure 5 yes Figure 4 A side-view cross-sectional view of the transmitter assembly taken through the center of the transmitter assembly.

[0023] Figures 6A to 6E This occurs during different steps in the assembly process of the transmitter components. Figure 5 A side cross-sectional view of the transmitter assembly (e.g., taken through the center of the transmitter module).

[0024] Figure 7 This is a top view of an example printed circuit board assembly.

[0025] Figure 8 yes Figure 7 An exploded top view of an example printed circuit board assembly.

[0026] Figure 9 This is a top view of another example printed circuit board assembly.

[0027] Figure 10 This is a top view of another example printed circuit board assembly.

[0028] Figure 11 Examples of lighting fixtures (such as, Figure 1 A simplified block diagram of the lighting device shown. Detailed Implementation

[0029] Figure 1This is a perspective view of an example lighting device, such as lighting fixture 100 (e.g., a downlight fixture). Lighting fixture 100 may include a housing 110 (e.g., a shell), a decoration 120, and a lighting fixture assembly 130. Housing 110 may be configured to surround at least a portion of the lighting fixture assembly 130 and the decoration 120. Housing 110 may be configured to be mounted within a structure (e.g., a ceiling). When housing 110 is mounted within a structure, at least a portion of decoration 120 may extend from the structure (e.g., be visible to a user). Decoration 120 may be configured to cover (e.g., conceal) an opening in housing 110. Housing 110 may be configured to receive various decorations (e.g., such as decoration 120) with different physical properties. Decoration 120 may define an aperture 122 of lighting fixture 100 through which lighting fixture assembly 130 may be configured to emit light. The aperture 122 of lighting fixture 100 may be characterized by an aperture size, which may be, for example, the diameter D of aperture 122. APERTURE (For example, about 2-3 inches).

[0030] Figure 2 This is a perspective view of an example lighting fixture component 200 for use in a lighting device, which can be deployed as follows: Figure 1 The lighting device assembly 130 of the lighting device 100 shown. Figure 3This is an exploded view of the lighting device assembly 200. The lighting device assembly 200 may include an optical structure 210 (e.g., a lens), a reflector 220, and a light generating module 230. The light generating module 230 may include a printed circuit board (PCB) assembly 232, a heat sink 234, and a lamp holder 236. The PCB assembly 232 may include a printed circuit board 240 and may be located between the heat sink 234 and the lamp holder 236. The lamp holder 236 may at least partially surround the PCB assembly 232, such as partially surrounding the upper surface of the PCB assembly 232. The reflector 220 may be connected (e.g., mounted) to the lamp holder 236. The lamp holder 236 may define two or more connectors 238, each defining a corresponding slot 239 in which a corresponding tab 227 of the reflector 220 may be received to connect the reflector 220 to the light generating module 230. Therefore, the reflector 220 may include two or more tabs 227 distributed on the outer periphery of the reflector. The lighting assembly 200 may define a central axis 202, around which the optical structure 210 and reflector 220 may be centered (e.g., substantially centered). The lighting assembly 200 (e.g., printed circuit board assembly 232, heat sink 234, and lamp holder 236) may be held together (e.g., fastened together) by one or more fasteners 235 (e.g., screws) extending through the lamp holder 236, printed circuit board assembly 232, and heat sink 234. For example, the lighting assembly 200 may include two screws (e.g., as shown in the image). Figure 3 (As shown). Fastener 235 can also be used to mount the lighting assembly 200 to a lighting device. In some examples, the lighting assembly 200 can be held together by one or more rivets.

[0031] The light generating module 230 (e.g., printed circuit board assembly 232) may include an emitter assembly 250 (e.g., an emitter module) having an array 251 of emitters 252, such as light-emitting diodes (LEDs). The array 251 of emitters 252 may be centered (e.g., substantially centered) around the central axis 202 of the lighting device assembly 200. The array 251 of emitters 252 may have a size d. ARRAY In some examples, transmitter assembly 250 may also include (e.g., optionally) one or more detectors 254 (e.g., detecting LEDs) located adjacent to or near (e.g., around) the array 251 of transmitters 252. Transmitter assembly 250 may include, for example, 16 transmitters 252 and 8 detectors 254, but other variations are possible. In some examples, transmitter assembly 250 may include more than... Figure 3 As shown and Figure 4Further illustrations show more or fewer transmitters 252 and more or fewer detectors 254. For example, transmitter assembly 250 may include a single transmitter. In some examples, detectors 254 may be omitted. Additionally, different configurations of transmitters 252 and / or detectors 254 may be used. Transmitters 252 and / or detectors 254 may be mounted to (e.g., directly to) the printed circuit board 240 of printed circuit board assembly 232. In some examples, transmitter assembly 250 may include any combination of an array 251 of transmitters 252, printed circuit board 240, one or more detectors 254, and / or dome 256.

[0032] In some examples, emitter assembly 250 may include an optical element such as dome 256 configured to surround (e.g., encapsulate) emitter 252 and detector 254 mounted to printed circuit board 240. Although described as a dome, the optical element or dome can be of any shape or size. That is, dome 256 is not limited to any particular shape. Dome 256 can have any of a variety of different shapes, such as hemispherical, rectangular, square, or non-uniform shapes. In some examples, dome 256 may include multiple sections, and in such examples, each section of dome 256 may have the same shape or different shapes. As described herein, dome 256 may encapsulate one or more components of light generation module 230, or a dome may be formed on one or more components of light generation module. Emitter 252 of emitter assembly 250 may be configured to emit light (e.g., through dome 256). In some examples, dome 256 may be omitted. Emitter 252 of emitter assembly 250 may be thermally coupled to heat sink 234 via printed circuit board 240. Heat sink 234 can be configured to dissipate heat generated by the emitter of emitter assembly 250.

[0033] The optical structure 210 may include a body 212 having a light inlet portion 214, a light outlet portion 216, and a sidewall 218. For example, the sidewall 218 may define a total internal reflection (TIR) ​​surface (not shown) within the body 212 of the optical structure 210. The sidewall 218 may be smooth and / or may have facets, such as... Figure 3 As shown, but other variations are possible. Reflector 220 may include a body 222 (e.g., a tapered body) having a first opening 224 (e.g., which is located in...). Figure 3 The first opening 224 (shown as dashed lines), the second opening 226, and the sidewall 228 extending between the first opening 224 and the second opening 226. The body 222 of the reflector 220 may define a chamber 225. Figure 3 The optical structure 210 can be housed within the cavity (e.g., as shown in the image). Figure 2(As shown in the diagram). Reflector 220 may have an inner surface 223 that may be reflective. Optical structure 210 may include a tab 219 configured to be received in a corresponding recess 229 formed in reflector 220 for retaining optical structure 210 within cavity 225 of reflector 220. For example, reflector 220 may include one or more recesses 229 defined in body 222, and optical structure 210 may include one or more tabs 219 located outside the housing of optical structure 210.

[0034] When assembling the lighting device assembly 200 (e.g., as Figure 2 As shown, the emitter 252 of the emitter assembly 250 can be configured to emit light through the dome 256 and the first opening 224 of the reflector 220 to the light inlet portion 214 of the optical structure 210. The optical structure 210 can be configured to conduct or guide the light received by the light inlet portion 214 toward the light outlet portion 216, such that the light can be emitted through the second opening 226 of the reflector 220. For example, the light outlet portion 216 of the optical structure 210 can be circular to match the circular shape of the second opening 226 of the reflector 220. The TIR surface defined by the sidewall 218 of the optical structure 210 can be configured to reflect light toward the light outlet portion 216. Additionally, the inner surface 223 of the reflector 220 can be configured to reflect light toward the light outlet portion 216 of the optical structure 210.

[0035] Printed circuit board assembly 232 may include drive circuitry 242, which may be mounted to printed circuit board 240 and may control the amount of power delivered to transmitter 252 of transmitter assembly 250. For example, drive circuitry 242 mounted to printed circuit board 240 may include multiple electrical components, such as one or more drive circuits for controlling transmitter 252, and one or more control circuits for controlling drive circuits. Drive circuitry 242 (e.g., one or more control circuits) may be configured to control transmitter 252 of transmitter assembly 250 and thereby adjust the intensity level and / or color of the accumulated light emitted by light generation module 230. For example, drive circuitry 242 may be configured to control transmitter 252 to adjust the intensity level of the accumulated light emitted by light generation module 230 between an upper intensity level (e.g., a maximum intensity level, such as approximately 100%) and a lower intensity level (e.g., a minimum intensity level, such as approximately 0.1% to 1.0%). Additionally, the driving circuit 242 can be configured to control the emitter 252 to adjust the current color temperature (e.g., correlated color temperature (CCT)) of the accumulated light emitted by the light generation module 230. Furthermore, the driving circuit 242 can be configured to control the emitter 252 to adjust the current color value (e.g., which can be determined by the current x-chromaticity coordinate X) of the accumulated light emitted by the light generation module 230. PRES(and the current y-chromaticity coordinates are defined). Although the lighting device component 200 is described here with the current color value defined by the current x-chromaticity coordinates and the current y-chromaticity coordinates, the current color value can be defined by other color values ​​(e.g., as defined in other color spaces). For example, the current color value can be a red-green-blue (RGB) color value (e.g., defined by red, green, and blue values ​​and / or hexadecimal values ​​in the RGB color space), a UVW color value (e.g., defined by u-chromaticity values, v-chromaticity values, and luminance index (e.g., w) values ​​in the UVW color space), wavelength, and / or other suitable color values.

[0036] Printed circuit board assembly 232 may also include communication circuitry 244 for transmitting messages to devices external to lighting device assembly 200 via signals such as wireless signals (e.g., radio frequency (RF) signals). For example, communication circuitry 244 may include multiple electrical components, such as one or more communication circuits for transmitting messages via wireless signals, and one or more control circuits for interfacing between communication circuitry and drive circuitry 242. In one example, communication circuitry 244 may be mounted to printed circuit board 240. In another example, printed circuit board assembly 232 may include two printed circuit boards (e.g., instead of one printed circuit board 240), wherein transmitter assembly 250 (e.g., transmitter 252 and detector 254) and drive circuitry 242 may be mounted to a first printed circuit board, and communication circuitry 244 may be mounted to a second printed circuit board. Communication circuitry 244 may be configured to control drive circuitry 242 in response to messages received via wireless signals (e.g., directly or indirectly via one or more control circuits) to control transmitter 252 of transmitter assembly 250.

[0037] For example, the printed circuit board assembly 232 of the light generating module 230 may also include an antenna 246 electrically coupled to one or more communication circuits mounted to the communication circuitry 244 of the printed circuit board 240. The one or more communication circuits may be configured to wirelessly communicate with external devices (e.g., devices outside the lighting device assembly 200) via the antenna 246. For example, the one or more communication circuits may include an RF transceiver coupled to the antenna 246 for transmitting and / or receiving messages in radio frequency (RF) signals. Alternatively, the one or more communication circuits may include an RF transmitter for transmitting messages in RF signals via the antenna 246 and / or an RF receiver for receiving messages in RF signals via the antenna. The antenna 246 may extend from the printed circuit board 240 to a location outside, for example, the reflector 220 (e.g., outside the chamber 225 and / or not inside the chamber). In other words, the antenna 246 may not enter or pass through the chamber 225 of the reflector 220. Antenna 246 can be held in place by antenna bracket 248, such that antenna 246 extends from printed circuit board 240 to the exterior of reflector 220. Antenna bracket 248 can be connected to and / or extend from lamp holder 236. Antenna 246 can extend through lamp holder 236 and / or antenna bracket 248, such that antenna 246 is located outside reflector 220. In some examples, antenna bracket 248 can be connected to printed circuit board 240.

[0038] The goal is to design a printed circuit board assembly (e.g., comprising a transmitter assembly, drive circuitry, and communication circuitry, such as wireless communication circuitry) that can be used in a variety of lighting fixtures for general lighting, such as relatively small lighting fixtures (e.g., track lighting fixtures and other lighting fixtures with small aperture sizes, such as approximately 2 inches or less in diameter), lighting fixtures with housings approximately the same size as the aperture size (e.g., fixtures approximately 2.5 inches in size), and / or lighting fixtures including mechanisms for tilting and / or rotating the transmitter assembly to allow the light emitted by the transmitter assembly to be directed in various directions (e.g., such as...). Figure 1The lighting device 100 is shown. The lighting device can be used to provide general lighting (e.g., having a lumen output in the range of at least 1,100 to 1,800 lumens), and therefore the printed circuit board assembly should be able to support a rated power of approximately 30 watts (e.g., in the range of at least 18 to 28 watts) for powering the emitters in the printed circuit board assembly. It is also desirable to provide a lighting device that can provide advanced color control functions (e.g., warm light dimming, white light dimming, color temperature (CCT) control, full color control, and / or color grading), and / or a lighting device that includes emitters of different colors and can be configured to emit light with high quality (e.g., light characterized by presenting uniform and / or mixed colors compared to light characterized by presenting pixelated or unmixed colors). This functionality may require the emitters to be positioned very close to each other.

[0039] When designs are configured for use in various lighting installations while still being configured to provide advanced color control and / or high-quality light output using printed circuit board (PCB) components, certain variables (e.g., PCB size, heat dissipation of driver circuitry and LEDs, and interference with communication circuitry (e.g., RF circuitry)) become design constraints. For example, constraints on PCB size may require a smaller PCB diameter, necessitating that emitters on the PCB be mounted relatively close together (e.g., as mentioned above, this is especially true when these emitters have different colors that need to be mixed to provide advanced color control and / or high-quality light output). Using PCBs with multiple dielectric and electrical layout layers constituting the PCB can lead to heat dissipation problems for the emitters, as the dielectric layers may impede heat transfer from the emitter to the heat sink, and these emitters need to be closely packed together on a smaller diameter PCB to provide advanced color control and / or high-quality (e.g., uniform) light output. Such heat dissipation problems in lighting installations can adversely affect luminous performance (e.g., color output may vary with temperature) and the lifespan of the emitters (e.g., LEDs).

[0040] According to the lighting device described herein, in order to effectively manage heat on the printed circuit board and components of the printed circuit board assembly, the printed circuit board assembly can have a reduced number of dielectric layers. Specifically, the printed circuit board described herein minimizes the number of dielectric layers to a single dielectric layer—that is, the printed circuit board is a single-layer board (e.g., having a base layer, a single electrical layout layer, and a single dielectric layer between the base layer and the electrical layout layer). However, mounting the transmitter's drive circuitry and RF circuitry (according to the example described herein) onto a small single-layer printed circuit board can lead to problems with interference with wireless communication circuitry (e.g., the wireless communication circuitry may encounter communication errors). For example, with a single-layer printed circuit board (e.g., having a single dielectric layer), capacitance problems may exist between contacts on the board (e.g., this can lead to communication errors). Furthermore, a smaller single-layer board can result in less space for a ground plane (e.g., resulting in a smaller ground plane) (e.g., especially because there is only a single layer), which can increase communication errors. The printed circuit board as described herein can be configured such that the circuit common terminal of the wireless communication circuitry (e.g., the portion of the circuit common terminal of the wireless communication circuitry near the antenna and matching network of the wireless communication circuitry) can be coupled to a ground plane on the electrical layout layer. In addition, the ground plane can be electrically coupled to the substrate of the printed circuit board.

[0041] As described herein, printed circuit board assembly 232 (e.g., in addition to other printed circuit board assemblies described herein) provides a solution to the aforementioned problems by providing a printed circuit board assembly that can be used in a variety of lighting installations. In some examples, the printed circuit board 240 of printed circuit board assembly 232 (e.g., and other printed circuit board assemblies described herein) may be a single-layer board with a diameter of approximately 2 inches, and printed circuit board assembly 232 may include an emitter, drive circuitry, and communication circuitry. Furthermore, printed circuit board assembly 232 may be configured to provide a light output of at least 1,100 lumens to 1,800 lumens, may be able to support a rated power of at least 30 watts (e.g., at least in the range of 18 watts to 28 watts), and may provide advanced color control features (e.g., warm light dimming, white light dimming, color temperature (CCT) control, full color control, and / or color grading) and / or high-quality light output, among other advantages.

[0042] Figure 4 This is a top view of the transmitter assembly 250 of the printed circuit board 240 mounted to the printed circuit board assembly 232. Figure 5 It is the center of the transmitter assembly 250 (e.g., through the center of the transmitter assembly 250). Figure 4The image shows a side cross-sectional view taken by the line shown. Emitter assembly 250 may include multiple “chains” (e.g., series-coupled emitters) of emitter 252. Emitters 252 in each chain may be series-coupled and may conduct the same drive current. Each chain may include emitters 252 that produce illumination at the same peak emission wavelength (e.g., emit light of the same color). Emitters 252 in different chains may emit different colors of light. For example, emitter assembly 250 may include three or four chains of emitters 252 of different colors (e.g., red, green, blue, and white (e.g., substantially white), mint green, and / or yellow). In some examples, emitter assembly 250 may include a chain of four red emitters, a chain of four green emitters, a chain of four blue emitters, and a chain of four white (e.g., or yellow or mint green) emitters. Individual emitters 252 in each chain may be distributed around array 251 (such as a square array) and arranged such that the color does not appear twice in any row, column, or diagonal of the array to improve color mixing within emitter assembly 250. Other variations are possible, such as the number of emitters 252 per chain, the color of the emitters 252, the number of colors of the emitters 252, and the number of chains of the emitters 252. According to one example, the emitters can be configured to occupy an area of ​​approximately 18 to 20 square millimeters. Patterns other than square arrays can be used. Other variations are possible.

[0043] Detectors 254 may be located in pairs near each edge (e.g., or one or more edges) of the array 251 of transmitters 252 (e.g., as shown in the image). Figure 4(as shown), and / or located at the center of the array 251 of emitters 252. Similar to emitters 252, detectors 254 can be LEDs that can be used to emit or receive optical or electrical signals. When detectors 254 are coupled to receive optical signals and emit electrical signals, the detectors can generate a current indicating incident light from, for example, a single emitter, multiple emitters, or a chain of emitters 252. Detectors 254 can be any device that generates a current indicating incident light, such as a silicon photodiode or an LED. For example, detectors 254 can each be LEDs having a peak emission wavelength in the range of approximately 550 nm to 700 nm, such that the detectors can generate photocurrents without responding to infrared light (e.g., to reduce interference from ambient light). For example, the first detector in each pair of detectors 254 can include a small red, orange, or yellow LED that can be used to measure the luminous flux of light emitted by the red LED of emitter 252. The second detector in each pair of detectors 254 can include a green LED that can be used to measure the corresponding luminous flux of light emitted by each of the green and blue LEDs of emitters 252. Both the first and second detectors 254 can be used to measure the luminous flux of the white LED (e.g., or other LEDs, such as a yellow LED, a light green LED, or a mint green LED) of the emitter 252 at different wavelengths (e.g., to characterize the spectrum of light emitted by the white LED). Although described in the context of a white LED, in some examples, the emitter 252 may include an LED of another color, such as yellow or mint green. Furthermore, in some examples, the white LED may be a phosphor-converted white LED. The first detector in each pair of detectors 254 may be coupled in parallel in the emitter assembly 250. Similarly, the second detector in each pair of detectors 254 may be coupled in parallel in the emitter assembly 250. Other variations are possible.

[0044] For example, dome 256 may comprise an optically transmissive material such as silicon (e.g., a translucent and / or transparent material) and may be formed by a molding process. Dome 256 may have an outer periphery 258 surrounding emitter 252 and detector 254 (e.g., as shown in the image). Figure 4(As shown in the diagram). Dome 256 may be a solid structure comprising an optically transmissive material filling the space between the printed circuit board 240 and the outer surface 259 of dome 256. The outer surface 259 of dome 256 may be textured (e.g., slightly textured), for example, to increase light scattering and promote color mixing, and to reflect a portion (e.g., a small amount) of the light emitted by emitter 252 back to detector 254 mounted on printed circuit board 240, for example, about 5% (e.g., when detector 254 is included). Emitter 252, detector 254, dome 256, and printed circuit board 240 may form an optical system. Emitters 252 in the array 251 of emitters are positioned as close as possible to each other and near the central axis 202 of the illumination device assembly 200, so as to approximate a centrally located point light source.

[0045] The emitter 252 of the emitter assembly 250 can be thermally coupled to the heat sink 234 via a printed circuit board 240. For example, the printed circuit board 240 may include a metal-core printed circuit board that can provide higher thermal conductivity and lower thermal resistance between the emitter 252 and the heat sink 234 (e.g., compared to a printed circuit board made of a more standard substrate such as an FR4 substrate). For example, the metal-core printed circuit board may be a printed circuit board having a base layer made of a metal such as aluminum (as opposed to an FR4 substrate). For example, the metal-core printed circuit board may include a conductive base layer. Figure 5 As shown, the printed circuit board 240 may include a substrate 260, which may be, for example, a thermally conductive substrate such as copper, aluminum, alumina, ceramic, or a combination thereof.

[0046] Printed circuit board 240 may have multiple electrical traces and / or electrical pads formed of a conductive material (e.g., copper) on electrical layout layer 262. Printed circuit board 240 may include a dielectric layer 264, which may be a thermally conductive dielectric (e.g., an organic resin having ceramic fillers (e.g., Al2O3, AlN, BN, etc.)). Dielectric layer 264 may be disposed between base layer 260 and electrical layout layer 262 to provide electrical isolation between the base layer 260 and electrical layout layer 262. Electrical layout layer 262 may have a solder mask layer 266 disposed thereon, which may cover the electrical traces of electrical layout layer 262 while exposing the electrical pads of electrical layout layer 262 (e.g., electrical layout layer 262 may be located between solder mask layer 266 and dielectric layer 264).

[0047] Although the dielectric layer 264 has some thermal conductivity, the presence of the dielectric layer 264 on the printed circuit board 240 can increase the thermal resistance between the emitter 252 and the heat sink 234 (e.g., reduce thermal conductivity) (e.g., compared to when no dielectric layer is provided). For example, the thickness of the dielectric layer 264 can be reduced to decrease the thermal resistance between the emitter 252 and the heat sink 234. Furthermore, to further reduce the thermal resistance between the emitter 252 and the heat sink 234, the printed circuit board 240 may include (e.g., only) a single dielectric layer 264 (e.g., on one side of the printed circuit board 240). Therefore, the printed circuit board 240 may include (e.g., only) a single electrical layout layer 262 (e.g., the printed circuit board 240 may be a "single-layer" printed circuit board having all electrical traces and electrical pads on a single electrical layout layer 262). When the light generating module 230 is assembled, the base layer 260 of the printed circuit board 240 may contact (e.g., directly contact) the heat sink 234 (e.g., as shown in the image). Figure 5 (As shown). For example, a thermally conductive material (e.g., thermal grease) may be disposed between the printed circuit board 240 (e.g., base layer 260) and the heat sink 234. According to one example, the dielectric layer 264 may be 50 μm thick (e.g., or approximately 50 μm thick (but other thicknesses such as 50 μm to 150 μm thick can be used)) and / or made of a dielectric material having a withstand voltage of approximately 100V and high thermal conductivity (e.g., greater than 3 W / m / K). For example, the dielectric layer may be made of an organic resin with ceramic fillers (e.g., Al2O3, AlN, BN) to enhance thermal conductivity.

[0048] The drive circuitry 242 and communication circuitry 244 mounted to the printed circuit board 240 can be electrically connected to the electrical traces and / or electrical pads of the electrical layout layer 262 using a first electrical connection technique (such as soldering). For example, the electrical components of the drive circuitry 242 and communication circuitry 244 may include surface mount technology (SMT) packages and may be electrically and mechanically coupled to the electrical pads of the electrical layout layer 262 via solder joints. Solder joint connections can be made using, for example, SMT soldering processes such as reflow soldering. In one example, the emitter 252 of the emitter assembly 250 (e.g., and detector 254, when included) may also include (e.g., be housed in) an SMT package and be electrically and mechanically coupled to the electrical pads of the electrical layout layer 262 using a first electrical connection technique (e.g., via solder joints). However, the SMT package and / or solder joint connection of the emitter 252 may increase the thermal resistance (e.g., reduce thermal conductivity) between the emitter 252 and the heat sink 234.

[0049] In another example, the drive circuitry 242 and communication circuitry 244 mounted to the printed circuit board 240 may be electrically connected to the electrical traces and / or electrical pads of the electrical layout layer 262 using a first electrical connection technique (e.g., soldering), while the transmitter 252 (e.g., and detector 254, when included) may be electrically connected to the electrical traces and / or electrical pads of the electrical layout layer 262 using a second electrical connection technique (e.g., wire bonding). For example, the transmitter 252 (e.g., the semiconductor die of the corresponding transmitter 252) may be mounted (e.g., directly mounted) to the printed circuit board 240 (e.g., as shown in the image). Figure 3 and Figure 5 As shown), this can reduce the thermal resistance between emitter 252 and heatsink 234 (e.g., increase thermal conductivity) (e.g., compared to mounting an emitter with an SMT package using soldering techniques). For example, emitter 252 can be mechanically attached to printed circuit board 240 using a die-attach process (e.g., via eutectic die-attach, which can provide enhanced heat dissipation to the heatsink). Figure 5 As shown, transmitter 252 (and detector 254, when included) can be electrically connected to electrical pads of electrical layout layer 262 via wire bonding 255 (e.g., wire connection) using a wire bonding process. Therefore, printed circuit board 240 can have electrical components mounted thereon and electrically connected to electrical layout layer 262 via two different electrical connection technologies.

[0050] Figures 6A to 6E The transmitter assembly 250 is illustrated at different steps during the assembly process of mounting the dome 256 onto the printed circuit board 240. Figures 6A to 6E It is a side cross-sectional view of the transmitter assembly 250 taken through the center of the transmitter assembly 250 (e.g., similar to...). Figure 5 (Cross-sectional view). For example... Figure 6A As shown, the assembly process can begin at transmitter assembly 250, which has transmitter 252 and detector 254 mounted to printed circuit board 240, and wire bonding 255 electrically connected to electrical pads of transmitter 252, detector 254 and electrical layout layer 262 of printed circuit board 240.

[0051] like Figure 6BAs shown, a barrier 270 (e.g., also referred to herein as a dam) may be formed on a printed circuit board 240 (e.g., on a solder mask layer 266) surrounding the transmitter 252 and detector 254 (when present). For example, the barrier 270 may be formed of a high-viscosity, fast-curing epoxy resin. The barrier 270 may be formed in shapes surrounding the transmitter 252 and detector 254, such as elliptical (e.g., circular or oval) or polygonal (e.g., square, rectangular, or complex polygonal). For example, the barrier 270 may be formed in a circular shape (e.g., as shown in the diagram). Figures 7 to 9 As shown, which will be described in more detail below). The height H of barrier 270. B The height H can be greater than that of the devices and leads (e.g., transmitter 252, detector 254, and wire bond 255) mounted to the printed circuit board 240. D Barrier 270 may have a recess 272 (e.g., an open volume) formed between barrier 270 and the surface of printed circuit board 240. When barrier 270 is formed as a circle, barrier 270 may be composed of a diameter D. B (For example, the outer diameter of barrier 270) is used to characterize it.

[0052] like Figure 6C As shown, a first material 274 can be deposited (e.g., filled or cast) into a recess 272 formed by the barrier 270 and the printed circuit board 240. The first material 274 in the recess 272 can be configured to form a first dome portion 280 (e.g., after curing the first material 274, as described in more detail below). For example, the first material 274 can comprise a thermosetting material, such as optical liquid silicone rubber. The first material 274 can be filled to such a level that it completely surrounds and covers the emitter 252, the detector 254, and the wire bonding 255 (e.g., such that the first dome portion 280 can have a sufficiently large height H). DOME1 This ensures that the first dome portion 280 completely surrounds and covers (e.g., encapsulates) the emitter 252, detector 254, and wire bonding 255. In some examples, the first material 274 may be filled to approximately the height H of the barrier 270. B (For example, making the height H of the first dome portion 280) DOME1 It can be approximated by the height H of the barrier 270. B And the diameter D of the first dome portion 280 DOME1 It can be approximated by the diameter D of barrier 270. B The first dome portion 280 can define the interface surface 282.

[0053] like Figure 6DAs shown, the second dome portion 290 can be placed on the barrier 270 and / or the first material 274 within the recess 272. For example, the second dome portion 290 can be manufactured during a separate manufacturing process (e.g., injection molding) from the process used to manufacture the first dome portion 280 (e.g., a curing process, described in more detail below). The second dome portion 290 can be fully or partially cured (e.g., 70% cured) during the injection molding process. The second dome portion 290 can be translucent (e.g., transparent and / or translucent). The second dome portion 290 can be made of a second material, which can be a transparent or diffuse material. For example, the second material can be the same as the first material (e.g., a translucent thermosetting material, such as one formed from optical liquid silicone rubber). In some examples, the second material of the second dome portion 290 can be different from the first material (e.g., the second material of the second dome portion 290 can be glass, while the first material of the first dome portion 810 can be optical liquid silicone rubber). The second dome portion 290 may have a defined outer surface 294 and operate to direct light from the emitter 252 in a desired and / or optimal direction (e.g., toward a lens of an illumination device in which the emitter assembly 250 is mounted) and reduce the amount of light reflected back into the dome 256. For example, the second dome portion 290 may have a hemispherical shape and an outer surface 294 that may have a smooth or textured finish.

[0054] The second dome portion 290 may define an interface surface 292, which may have a smooth or textured finish. For example, the interface surface 292 of the second dome portion 290 may be substantially flat. The interface surface 292 of the second dome portion 290 may have a circular periphery and may have a diameter D. DOME2 The diameter is the same as the diameter D of barrier 270. B Essentially the same (e.g., the diameter D of the first dome portion 280) DOME1 (Essentially the same). For example, the periphery of the interface surface 292 of the second dome portion 290 may be aligned with the barrier 270 (e.g., aligned with the centerline of the barrier 270 and / or fall within the area defined by the width of the barrier 270), such as... Figure 6E As shown. The transmitter 252 and detector 254 can be located around the periphery of the interface surface 282 of the first dome portion 280 and within the periphery of the interface surface 292 of the second dome portion 290. In some examples, the diameter D of the interface surface 292 of the second dome portion 290 is... DOME2 The diameter D can be smaller than that of the barrier 270. B .

[0055] The second dome portion 290 may include one or more support members 296 (e.g., legs) configured to support the second dome portion 290 relative to the first dome portion 280 (e.g., above and on top of the first dome portion 280). In some examples, the one or more support members 296 may contact the surface of the printed circuit board 240 to support the second dome portion 290 relative to the first dome portion 280. The one or more support members 296 may extend from the interface surface 292 of the second dome portion 290 into a recess defined by the barrier 270. The one or more support members 296 may include one or more corresponding lugs 298 that can be supported on the barrier 270 when the one or more support members 296 are received in the recess 272. The one or more support members 296 may include, for example, a single support member extending around the periphery of the interface surface 292 of the second dome portion 290 or a plurality of support members spaced apart around the periphery of the interface surface 292 of the second dome portion 290. In some examples, one or more corresponding lug portions 298 may be continuous, such that they form a single lug portion.

[0056] like Figure 6E As shown, once the second dome portion 290 is placed on the barrier 270 and / or the first dome portion 280, the first material 274 can be cured to form a dome 256 (e.g., a complete dome) from the first dome portion 280 and the second dome portion 290. Prior to the curing process, the first material 274 may include a liquid material. For example, the interface surface 292 of the second dome portion 290 may bond to the first material 274 of the first dome portion 280 during the curing process. After the curing process, the first dome portion 280 may include a cured form of liquid material (e.g., the first material 274) deposited in the recess 272 defined by the barrier 270. When the dome 256 is fully formed, the second dome portion 290 may be positioned above the first dome portion 280, such that the first dome portion 280 is positioned between the second dome portion 290 and the printed circuit board 240. The transmitter 252 and the detector 254 may be encapsulated in the first dome portion 280 after the curing process. During the curing process, the first dome portion 280 can be fixed to the printed circuit board 240, while the second dome portion 290 can be fixed to the first dome portion 280.

[0057] For example, the first dome portion 280 and the second dome portion 290 can be made of the same or similar materials, such that light from the emitter 252 can be transmitted through the dome 256 (e.g., as if the dome 256 were manufactured from a single material during a single-step manufacturing process). While the first dome portion 280 and the second dome portion 290 can be manufactured as separate components, they can be made of sufficiently similar materials and can come into contact at an appropriate stage of the curing process, such that molecular crosslinking across the component boundary may occur at the intersection 276 (e.g., the interface) between the first dome portion 280 and the second dome portion 290. In some examples, the second dome portion 290 can be partially cured upon contact with the first dome portion 280. For example, partial curing of the second dome portion 290 during the injection molding process of the second dome portion 290 can allow for stronger molecular crosslinking at the intersection 276 between the first dome portion 280 and the second dome portion 290. At the end of the assembly process of dome 256, the first dome portion 280 and the second dome portion 290 can, for example, be completely cured.

[0058] Figure 7 This is a top view of an example printed circuit board assembly 300, which can be deployed as follows: Figure 2 and Figure 3 The printed circuit board assembly 232 of the light generating module 230 shown. Figure 8 This is an exploded top view of the printed circuit board assembly 300. The printed circuit board assembly 300 may include a first printed circuit board 340 (e.g., a transmitter printed circuit board) and a second printed circuit board 341 (e.g., a communication printed circuit board). The first printed circuit board 340 and the second printed circuit board 341 may be configured to be mechanically and electrically connected to each other. The first printed circuit board 340 may include a notch 365 in which the second printed circuit board 341 may be located when the first printed circuit board 340 and the second printed circuit board 341 are mechanically and electrically connected together.

[0059] Printed circuit board assembly 300 may include emitter assembly 350 (e.g., emitter assembly 250) having an array 351 of emitters 352 (e.g., LEDs). The array 351 of emitters 352 may be formed in a square and may be located at the center (or substantially the center) of the first printed circuit board 340. In some examples, emitter assembly 350 may also include (e.g., optionally include) one or more detectors 354 (e.g., for detecting LEDs) located adjacent to the array 351 of emitters 352. For example, emitter assembly 350 may include sixteen emitters 352 and eight detectors 354, but other variations are possible. In some examples, emitter assembly 350 may include more than Figure 7 The diagram shows more or fewer transmitters 352 and more or fewer detectors 354. Additionally, different configurations of transmitters 352 and / or detectors 354 can be used. Transmitters 352 and / or detectors 354 can be mounted to (e.g., directly to) a first printed circuit board 340.

[0060] Emitter assembly 350 may include multiple “chains” (e.g., series-coupled emitters) of emitter 352. Emitters 352 in a given chain may be series-coupled and may conduct the same drive current. Each corresponding chain may include emitters 352 that produce illumination at the same peak emission wavelength (e.g., emit light of the same color). Emitters 352 in different chains may emit light of different colors from other chains. For example, emitter assembly 350 may include three or four chains of emitters 352 of different colors (e.g., red, green, blue, and white, yellow, or mint green). Emitter assembly 350 may include a chain of four red emitters, a chain of four green emitters, a chain of four blue emitters, and a chain of four white or yellow emitters. Individual emitters 352 in each chain may be distributed around array 351 and arranged such that no color appears twice in any row, column, or diagonal to improve color mixing within emitter assembly 350. Other variations can be used, such as the number of emitters 352 per chain, the color of the emitters 352, the number of colors of the emitters 352, and the number of chains of emitters 352. According to one example, the array 351 of emitters 352 can be configured to occupy approximately 18 to 20 square millimeters (mm²). 2 The area of ​​the array 351 of transmitter 352. In this example, the size d of the array 351 of transmitter 352. ARRAY It can be an area (i.e., 18 to 20 mm). 2 The square root of (). Patterns other than square arrays can be used. Other variations are possible.

[0061] Detectors 354 may be located in pairs near each edge (e.g., one or more edges) of the array 351 of transmitters 352 and / or in the middle or center of the array 351 of transmitters 352, such as Figure 7As shown in the diagram. Similar to emitter 352, detector 354 can be an LED that can be used to emit or receive optical or electrical signals. When detector 354 is coupled to receive optical signals and emit electrical signals, the detector can generate a current indicating the incident light from, for example, one emitter 352, multiple emitters, or a chain of emitters. Detector 354 can be any device that generates a current indicating the incident light, such as a silicon photodiode or LED. For example, detector 354 can each be an LED having a peak emission wavelength in the range of approximately 550 nm to 700 nm, such that the detector can generate a photocurrent without responding to infrared light (e.g., to reduce interference from ambient light). For example, the first detector in each pair of detectors 354 can include a small red, orange, or yellow LED that can be used to measure the luminous flux of light emitted by the red LED of emitter 352. The second detector in each pair of detectors 354 can include a green LED that can be used to measure the corresponding luminous flux of light emitted by each of the green and blue LEDs of emitter 352. Both the first and second detectors 354 can be used to measure the luminous flux of the white LED (e.g., or other LEDs, such as yellow or mint green LEDs) of the emitter 352 at different wavelengths (e.g., to characterize the spectrum of light emitted by the white LED). The first detector in each pair of detectors 354 can be coupled in parallel in the emitter assembly 350. Similarly, the second detector in each pair of detectors 354 can be coupled in parallel in the emitter assembly 350. Other variations are possible.

[0062] Emitter assembly 350 may include optical elements such as dome 356 (e.g., dome 256) configured to surround (e.g., encapsulate) the emitter 352 and detector 354 mounted to the first printed circuit board 340. Emitter 352 of emitter assembly 350 may be configured to emit light (e.g., via dome 356). Dome 356 may (e.g., via a similar...) Figures 6A to 6E The assembly process shown for forming dome 256 is formed on the first printed circuit board 340. For example, dome 356 can be formed using a barrier 370 (e.g., barrier 270). According to one example, printed circuit board assembly 300 can be configured to provide advanced color control functions (e.g., warm light dimming, CCT control, full-color control, and / or color correction) and generate light in a CCT range, for example, 1400 K to 5500 K or 1400 K to 5000 K, for CCT control. Printed circuit board assembly 300 can be further configured to provide at least 1100 lumens, for example, at 18W of power. Printed circuit board assembly 300 can be further configured to provide at least 1800 lumens, for example, at 28W of power. Other examples are possible.

[0063] Printed circuit board assembly 300 may include drive circuitry 342, which may be mounted to the first printed circuit board 340 and may control the amount of power delivered to the transmitter 352 of transmitter assembly 350. For example, drive circuitry 342 mounted to the first printed circuit board 340 may include multiple electrical components, such as one or more drive circuits for controlling transmitter 352, and one or more control circuits for controlling drive circuits. Drive circuitry 342 (e.g., one or more control circuits) may be configured to control transmitter 352 of transmitter assembly 350 and thereby adjust the intensity level and / or color of the accumulated light emitted by printed circuit board assembly 300. For example, drive circuitry 342 may be configured to control transmitter 352 to adjust the intensity level of the accumulated light emitted by printed circuit board assembly 300 between an upper intensity level (e.g., a maximum intensity level, such as approximately 100%) and a lower intensity level (e.g., a minimum intensity level, such as approximately 0.1% to 1.0%). Additionally, the drive circuit 342 can be configured to control the emitter 352 to adjust the current color temperature (e.g., correlated color temperature (CCT)) of the accumulated light emitted by the printed circuit board assembly 300. Furthermore, the drive circuit 342 can be configured to control the emitter 352 to adjust the current color value of the accumulated light emitted by the printed circuit board assembly 300 (e.g., which may be defined by the current x-chromaticity coordinates and the current y-chromaticity coordinates). Although the printed circuit board assembly 300 is described herein with a current color value defined by the current x-chromaticity coordinates and the current y-chromaticity coordinates, the current color value can be defined by other color values ​​(e.g., as defined in other color spaces). For example, the current color value can be a red-green-blue (RGB) color value (e.g., defined by the red, green, and blue values ​​and / or hexadecimal values ​​in the RGB color space), a UVW color value (e.g., defined by the u-chromaticity value, v-chromaticity value, and luminance index (e.g., w) value in the UVW color space), wavelength, and / or other suitable color values.

[0064] The printed circuit board assembly 300 may also include communication circuitry 344, which may be mounted to the second printed circuit board 341 and configured to transmit messages via signals such as wireless signals (e.g., RF signals) to means external to / separated from the printed circuit board assembly 300. For example, communication circuitry 344 may include multiple electrical components, such as one or more communication circuits for transmitting messages, for example, via wireless signals, and one or more control circuits for interfacing between the communication circuitry and drive circuitry 342. Communication circuitry 344 may include, for example, a processor mounted to the second printed circuit board 341. The processor may include, for example, a microprocessor, microcontroller, programmable logic device (PLD), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other suitable processing device or controller. Communication circuitry 344 (e.g., the processor) may be configured to control drive circuitry 342 (e.g., directly or indirectly via one or more control circuits) in response to messages received via, for example, wireless signals, to control transmitter 352 of transmitter assembly 350.

[0065] The emitter 352 of the emitter assembly 350 can be thermally coupled to a heat sink (e.g., heat sink 234) of the light generating module via a first printed circuit board 340, such that the heat sink is configured to dissipate heat generated by the emitter 352 of the emitter assembly 350. For example, the first printed circuit board 340 may include a metal core printed circuit board that can provide higher thermal conductivity and lower thermal resistance between the emitter 352 and the heat sink (e.g., compared to printed circuit boards made from more standard substrates such as FR4 substrates). The printed circuit board 340 can be attached to the heat sink and / or lamp holder (e.g., lamp holder 236) of the light generating module via one or more fasteners (e.g., fastener 235) received through an opening 343 in the printed circuit board 340 and a corresponding opening in the heat sink and / or lamp holder. For example, the fasteners may include screws and / or rivets. The heat sink may be made of aluminum, but steel, copper, or other metals may also be used. In some examples, the heat sink may be approximately 0.25 inches thick, but other thicknesses may also be used.

[0066] Although Figure 7 and Figure 8 Not shown, but the first printed circuit board 340 may include a base layer (e.g., base layer 260), an electrical layout layer (e.g., electrical layout layer 262), a dielectric layer (e.g., dielectric layer 264), and a solder mask layer (e.g., solder mask layer 266), for example, having a... Figure 5The printed circuit board 240 shown has a similar layer configuration. For example, the base layer can be a thermally conductive substrate such as copper, aluminum, alumina, ceramic, or a combination thereof. The base layer can have a thickness of 1 mm (e.g., but other thicknesses can be used). The base layer can be physically and / or thermally connected to the heat sink, such as by thermal grease. Since the presence of the dielectric layer can increase the thermal resistance between the emitter 352 and the heat sink (e.g., reduce thermal conductivity), the thickness of the dielectric layer of the first printed circuit board 340 can be reduced to reduce the thermal resistance between the emitter 352 and the heat sink. In addition, the first printed circuit board 340 may include (e.g., only) a single dielectric layer (e.g., to further reduce the thermal resistance between the emitter 352 and the heat sink), and therefore include a single (e.g., only a single) electrical layout layer (e.g., the first printed circuit board 340 may be a "single-layer" printed circuit board with all electrical traces and electrical pads on a single electrical layout layer). According to one example, the dielectric layer may be approximately 50 micrometers thick (e.g., or approximately 50 micrometers thick (e.g., but other thicknesses such as approximately 50 micrometers to 150 micrometers may be used)) and / or made of a dielectric material having a breakdown voltage of approximately 100 volts (e.g., a breakdown voltage of approximately 100 volts) and high thermal conductivity (e.g., greater than approximately 3 W / m / K). For example, the dielectric layer may be made of an organic resin having ceramic fillers (e.g., alumina (Al2O3), aluminum nitride (AlN), boron nitride (BN), etc.) to enhance thermal conductivity. When the first printed circuit board 340 is mounted in the light-generating module, the base layer of the first printed circuit board 340 may contact (e.g., directly contact) a heat sink (e.g., to contact with, for example, a heat sink). Figure 5 The printed circuit board 240 shown contacts the heat sink 234 in a similar manner. Furthermore, in some examples, a thermally conductive material (e.g., thermal grease) may be disposed between the printed circuit board 340 and the heat sink.

[0067] The drive circuit 342 mounted to the first printed circuit board 340 can be electrically connected to electrical traces and / or electrical pads of the electrical layout layer of the first printed circuit board 340 using a first electrical connection technique (such as soldering). For example, the electrical components of the drive circuit 342 may include an SMT package and can be electrically and mechanically coupled to electrical pads of the electrical layout layer via solder joints. Solder joint connections can be made using, for example, SMT soldering processes such as reflow soldering. The emitter 352 (e.g., and detector 354, when included) may not be configured as, for example, an SMT package and can be electrically connected to electrical traces and / or electrical pads of the electrical layout layer of the first printed circuit board 340 using a second electrical connection technique (e.g., wire bonding). For example, the emitter 352 (e.g., the semiconductor die of the corresponding emitter 352) can be mounted (e.g., directly mounted) to the first printed circuit board 340, which can reduce the thermal resistance between the emitter 352 and the heat sink (e.g., increase thermal conductivity) (e.g., compared to mounting an emitter with an SMT package using soldering). For example, transmitter 352 can be mechanically attached to the first printed circuit board 340 using a die-attach process (e.g., via eutectic die-attach, which can provide enhanced heat dissipation to a heat sink). Transmitter 352 (and detector 354, when included) can be electrically connected to electrical pads of the electrical layout layer of the first printed circuit board 340 via wire bonding (e.g., wire bond 255) using a wire bonding process. Therefore, the first printed circuit board 340 can have electrical components mounted thereon and electrically connected to the electrical layout layer via two different electrical connection technologies.

[0068] like Figure 8As shown, the second printed circuit board 341 can be configured to be mounted into a recess 365 in the first printed circuit board 340. The second printed circuit board 341 can be electrically and mechanically coupled to the first printed circuit board 340 via a plurality of electrical pads 369 on the second printed circuit board 341, which can be soldered to corresponding electrical pads 368 on the first printed circuit board 340. Because the transmitter 352 is not attached to the second printed circuit board 341, for example, the second printed circuit board 341 may not be a metal core printed circuit board (e.g., but a metal core printed circuit board can be used), and may include a more standard substrate, such as an FR4 substrate. Additionally, the second printed circuit board 341 may include a multilayer printed circuit board (e.g., a two- or four-layer electrical layout printed circuit board), but in other examples, a single-layer printed circuit board may be used. Electrical components of the communication circuit 344 can be mounted to the front side 345 of the second printed circuit board 341. Additionally and / or alternatively, electrical components of the communication circuit 344 may also be mounted to the bottom side of the second printed circuit board 341. The communication circuit 344 mounted to the second printed circuit board 341 can be electrically connected to the electrical traces and / or electrical pads of the second printed circuit board 341 using a first electrical connection technique (e.g., soldering technique). For example, the electrical components of the communication circuit 344 may include SMT packages and may be electrically and mechanically coupled to electrical pads of the electrical layout layer via solder joints. Solder joint connections can be made using, for example, SMT soldering processes such as reflow soldering. When the second printed circuit board 341 is a multilayer printed circuit board, one or more layers of the second printed circuit board 341 may include a ground plane that can be coupled to a common circuit terminal on the communication circuit 344.

[0069] The printed circuit board assembly 300 may also include an antenna (not shown) for transmitting and / or receiving wireless signals. One or more communication circuits in the communication circuitry 344 mounted to the second printed circuit board 341 may be electrically coupled to the antenna for transmitting / receiving wireless signals to / from an external device. For example, the communication circuitry may include an RF transceiver coupled to the antenna for transmitting and / or receiving radio frequency (RF) signals. Additionally and / or alternatively, the communication circuitry may be an RF transmitter for transmitting RF signals and / or an RF receiver for receiving RF signals via the antenna. In some examples, since the second printed circuit board 341 is located in a recess 365 in the first printed circuit board 340, the antenna may be located on one or more layers of the second printed circuit board 341. In some examples, since the second printed circuit board 341 is separate from the first printed circuit board 340 and may be a multilayer printed circuit board, the antenna may be located on one or more layers of the printed circuit board. According to another example (e.g., regardless of whether the second printed circuit board 341 is single-layer or multilayer), the antenna may include, for example, leads soldered to, for example, through a via 347 extending through the second printed circuit board 341. The antenna can extend from the second printed circuit board 341 and can be held in place by an antenna holder (e.g., such as antenna holder 248). As a further example (e.g., regardless of whether the second printed circuit board 341 is single-layer or multi-layer), the antenna may include leads connected to an antenna connector mounted to the second printed circuit board 341. The antenna can extend from the second printed circuit board 341 and can be held in place by an antenna holder (e.g., such as antenna holder 248).

[0070] Figure 9 This is a top view of another example printed circuit board assembly 400, which can be deployed as... Figure 2 and Figure 3 The light generating module 230 shown is a printed circuit board assembly 232. The printed circuit board assembly 400 may include a printed circuit board 440 (e.g., a single printed circuit board) and an emitter assembly 450 (e.g., emitter assembly 250) having an array 451 of one or more emitters such as emitters 452 (e.g., LEDs). The array 451 of emitters 452 may be formed as an emitter square and may be located at the center or substantially the center of the printed circuit board 440. In some examples, the emitter assembly 450 may also include (e.g., optionally) one or more detectors 454 (e.g., LED detectors) located adjacent to the array 451 of emitters 452. For example, the emitter assembly 450 may include sixteen emitters 452 and eight detectors 454, but other variations are possible. In some examples, the emitter assembly 450 may include more than... Figure 9The diagram shows more or fewer transmitters 452 and more or fewer detectors 454. Additionally, different configurations of transmitters 452 and / or detectors 454 can be used. Transmitters 452 and / or detectors 454 can be mounted to (e.g., directly to) a printed circuit board 440.

[0071] Emitter assembly 450 may include multiple “chains” (e.g., series-coupled emitters) of emitter 452. Emitters 452 in a given chain may be series-coupled and may conduct the same drive current. Each corresponding chain may include emitters 452 that produce illumination at the same peak emission wavelength (e.g., emit light of the same color). Emitters 452 in different chains may emit light of different colors. For example, emitter assembly 450 may include four chains of emitters 452 of different colors (e.g., red, green, blue, and white, yellow, or mint green emitters). Emitter assembly 450 may include a chain of four red emitters, a chain of four green emitters, a chain of four blue emitters, and a chain of four white, yellow, or mint green emitters. Individual emitters 452 in each chain may be distributed around array 451 and arranged such that no color appears twice in any row, column, or diagonal to improve color mixing within emitter assembly 450. Other variations are possible, such as the number of emitters 452 per chain, the color of the emitters 452, the number of colors of the emitters 452, and the number of chains of emitters 452. According to one example, the emitters can be configured to occupy an area of ​​approximately 18 to 20 square millimeters. Patterns other than square arrays can be used. Other variations are possible.

[0072] Detectors 454 may be located in pairs near each edge (e.g., one or more edges) of the array 451 of transmitters 452 and / or in the middle of the array 451 of transmitters 452, such as Figure 9As shown in the diagram. Similar to emitter 452, detector 454 can be an LED that can be used to emit or receive optical or electrical signals. When detector 454 is coupled to receive optical signals and emit electrical signals, the detector can generate a current indicating the incident light from, for example, a single emitter, multiple emitters, or a chain of emitters. Detector 454 can be any device that generates a current indicating the incident light, such as a silicon photodiode or LED. For example, detector 454 can each be an LED having a peak emission wavelength in the range of approximately 550 nm to 700 nm, such that the detector can generate a photocurrent without responding to infrared light (e.g., to reduce interference from ambient light). For example, the first detector in each pair of detectors 454 can include a small red, orange, or yellow LED that can be used to measure the luminous flux of light emitted by the red LED of emitter 452. The second detector in each pair of detectors 454 can include a green LED that can be used to measure the corresponding luminous flux of light emitted by each of the green and blue LEDs of emitter 452. Both the first and second detectors 454 can be used to measure the luminous flux of the white LED (e.g., or other LEDs, such as yellow, light green, or mint green LEDs) of the emitter 452 at different wavelengths (e.g., to characterize the spectrum of light emitted by the white LED). The first detector in each pair of detectors 454 can be coupled in parallel in the emitter assembly 450. Similarly, the second detector in each pair of detectors 454 can be coupled in parallel in the emitter assembly 450. Other variations are possible. According to one example, the printed circuit board assembly 400 can be configured as a warm light dimming module, a CCT control module, a full-color control module, and / or a color tuning module, and can produce light in a CCT range of, for example, 1400 K to 5000 K for CCT control. The printed circuit board assembly 400 can be further configured to provide at least 1100 lumens, for example, at a power of 18W. According to another example, the printed circuit board assembly 400 can be configured as a warm light dimming module, a full-color control module, a CCT control module, and / or a color tuning module, and can generate light in a CCT range of, for example, 1400 K to 5500 K for CCT control. In either example, the printed circuit board assembly 400 can be further configured to provide at least 1800 lumens, for example, at a power of 28W. Other examples are possible.

[0073] Emitter assembly 450 may include optical elements such as dome 456 (e.g., dome 256) configured to surround (e.g., encapsulate) the emitter 452 and detector 454 mounted to printed circuit board 440. Emitter 452 of emitter assembly 450 may be configured to emit light (e.g., via dome 456). Dome 456 may (e.g., via a similar...) Figures 6A to 6EThe assembly process shown for forming dome 256 is formed on the surface of printed circuit board 440 located on the front side 445. For example, dome 456 can be formed using barrier 470 (e.g., barrier 270).

[0074] Printed circuit board assembly 400 may include drive circuitry 442, which may be mounted to printed circuit board 440 (e.g., mounted to the front side 445 of printed circuit board 440) and may control the amount of power delivered to transmitter 452 of transmitter assembly 450. For example, drive circuitry 442 mounted to printed circuit board 440 may include multiple electrical components, such as one or more drive circuits for controlling transmitter 452, and one or more control circuits for controlling drive circuits. Drive circuitry 442 (e.g., one or more control circuits) may be configured to control transmitter 452 of transmitter assembly 450 and thereby adjust the intensity level and / or color of accumulated light emitted by light generation module 430. For example, drive circuitry 442 may be configured to control transmitter 452 to adjust the intensity level of accumulated light emitted by light generation module 430 between an upper intensity level (e.g., a maximum intensity level, such as approximately 100%) and a lower intensity level (e.g., a minimum intensity level, such as approximately 0.1% to 1.0%). Additionally, the driving circuit 442 can be configured to control the emitter 452 to adjust the current color temperature (e.g., correlated color temperature (CCT)) of the accumulated light emitted by the light generation module. Furthermore, the driving circuit 442 can be configured to control the emitter 452 to adjust the current color value (e.g., which can be determined by the current x-chromaticity coordinate X) of the accumulated light emitted by the light generation module. PRES (and the current y-chromaticity coordinates are defined). Although the printed circuit board assembly 400 is described here with the current color value defined by the current x-chromaticity coordinates and the current y-chromaticity coordinates, the current color value can be defined by other color values ​​(e.g., as defined in other color spaces). For example, the current color value can be a red-green-blue (RGB) color value (e.g., defined by red, green, and blue values ​​and / or hexadecimal values ​​in the RGB color space), a UVW color value (e.g., defined by u-chromaticity values, v-chromaticity values, and luminance index (e.g., w) values ​​in the UVW color space), wavelength, and / or other suitable color values.

[0075] The printed circuit board assembly 400 may also include communication circuitry 444, which may be mounted to the printed circuit board 440 (e.g., mounted to the front side 445) and configured to transmit messages via signals such as wireless signals (e.g., RF signals) to means external to / separated from the printed circuit board assembly 400. For example, communication circuitry 444 may include multiple electrical components, such as one or more communication circuits for transmitting messages via signals such as wireless signals, and one or more control circuits for interfacing between the communication circuitry and drive circuitry 442. Communication circuitry 444 may include, for example, a processor 441 mounted to the front side 445 of the printed circuit board 440. Processor 441 may include, for example, a microprocessor, microcontroller, programmable logic device (PLD), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other suitable processing device or controller. The communication circuit 444 (e.g., processor 441) can be configured to control the drive circuit 442 in response to a message received via a signal received through the communication circuit 444 (e.g., directly or indirectly via one or more control circuits) to control the transmitter 452 of the transmitter assembly 450.

[0076] The emitter 452 of the emitter assembly 450 can be thermally coupled to a heat sink (e.g., heat sink 234) of the light generating module via a printed circuit board 440, such that the heat sink is configured to dissipate heat generated by the emitter 452 of the emitter assembly 450. For example, the printed circuit board 440 may include a metal core printed circuit board that can provide higher thermal conductivity and lower thermal resistance between the emitter 452 and the heat sink 434 (e.g., compared to a printed circuit board made from a more standard substrate such as an FR4 substrate). The printed circuit board 440 can be attached to the heat sink and / or lamp holder (e.g., lamp holder 236) of the light generating module via one or more fasteners (e.g., fastener 235) received through an opening 443 in the printed circuit board 440 and a corresponding opening in the heat sink and / or lamp holder. For example, the fasteners may include screws and / or rivets. The heat sink may be made of aluminum, but steel, copper, or other metals may also be used. In some examples, the heat sink may be approximately 0.25 inches thick, but other thicknesses may also be used.

[0077] Although Figure 9 Not shown, but the printed circuit board 440 may include a base layer (e.g., base layer 260), an electrical layout layer (e.g., electrical layout layer 262), a dielectric layer (e.g., dielectric layer 264), and a solder mask layer (e.g., solder mask layer 266), for example, having a... Figure 5The printed circuit board 240 shown has a similar layer configuration. The base layer can be a thermally conductive substrate such as copper, aluminum, alumina, ceramic, or a combination thereof. The base layer can have a thickness of 1 mm (e.g., but other thicknesses can be used). The base layer can be physically and / or thermally connected to the heat sink, such as by thermal grease. Since the presence of the dielectric layer can increase the thermal resistance between the emitter 452 and the heat sink (e.g., reduce thermal conductivity), the thickness of the dielectric layer of the printed circuit board 440 can be reduced to decrease the thermal resistance between the emitter 452 and the heat sink. Additionally, the printed circuit board 440 may include (e.g., only) a single dielectric layer (e.g., to further reduce the thermal resistance between the emitter 452 and the heat sink), and therefore include a single (e.g., only a single) electrical layout layer (e.g., the printed circuit board 440 may be a "single-layer" printed circuit board with all electrical traces and electrical pads on a single electrical layout layer). According to one example, the dielectric layer may be 50 μm thick (e.g., or approximately 50 μm thick (e.g., but other thicknesses such as 50 μm to 150 μm thick can be used)) and / or made of a dielectric material having a withstand voltage of approximately 100 V and high thermal conductivity (e.g., greater than 3 W / m / K). For example, the dielectric layer may be made of an organic resin with ceramic fillers (e.g., Al2O3, AlN, BN) to enhance thermal conductivity. When the printed circuit board 440 is mounted in the light-generating module, the base layer of the printed circuit board 440 may contact (e.g., in direct contact) the heat sink (e.g., to contact with, for example, a heat sink). Figure 5 The printed circuit board 240 shown contacts the heat sink 234 in a similar manner, such as via thermal grease. According to this example, the printed circuit board 440 can be shaped as a disk, as shown, with a diameter of 2 inches (e.g., or approximately 2 inches), but other sizes can be used.

[0078] The drive circuitry 442 and communication circuitry 444 mounted to the printed circuit board 440 can be electrically connected to electrical traces and / or electrical pads of the electrical layout layer using a first electrical connection technique (such as soldering). For example, the electrical components of the drive circuitry 442 and communication circuitry 444 may include SMT packages and can be electrically and mechanically coupled to electrical pads of the electrical layout layer via solder joints. Solder joint connections can be made using, for example, SMT soldering processes such as reflow soldering. The emitter 452 (e.g., and detector 454, when included) can be electrically connected to electrical traces and / or electrical pads of the electrical layout layer using a second electrical connection technique (e.g., wire bonding). For example, the emitter 452 (e.g., the semiconductor die of the corresponding emitter 452) can be mounted (e.g., directly mounted) to the printed circuit board 440, which can reduce the thermal resistance between the emitter 452 and the heat sink (e.g., increase thermal conductivity) (e.g., compared to mounting an emitter with an SMT package using soldering). For example, transmitter 452 can be mechanically attached to the first printed circuit board 340 using a die-attach process (e.g., via eutectic die-attachment, which can, for example, provide enhanced heat dissipation to a heat sink). Transmitter 452 (and detector 454, when included) can be electrically connected to electrical pads of the electrical layout layer of printed circuit board 440 via wire bonding (e.g., wire bond 255) using a wire bonding process. Therefore, printed circuit board 440 can have electrical components mounted thereon and electrically connected to the electrical layout layer via two different electrical connection technologies.

[0079] Because printed circuit board 440 is a "single-layer" printed circuit board, the layout of electrical traces and electrical pads on the electrical layout layer of printed circuit board 440 can be complex. For example, some electrical traces may extend below electrical components mounted to printed circuit board 440 (e.g., between electrical pads to which the respective electrical components are mounted). In some examples, when two electrical traces may need to cross each other without being electrically connected, a jumper (e.g., a resistor with approximately zero ohms (Ω)) may be included in series with one of the electrical traces, allowing the second electrical trace to be routed below the jumper. For example, the amount of current conducted through an electrical trace in series with a jumper may be less than the amount of current conducted through an electrical trace routed below the jumper. In some examples, larger-sized jumpers may be used, allowing multiple electrical traces to be routed below the jumper. In other and / or additional examples, electrical traces routed under the jumper may conduct static signals (e.g., power voltage rails, circuit common terminals, etc.) or low-frequency signals, while electrical traces connected in series with the jumper may conduct non-static / changing signals, or signals with a higher frequency value than the signal running under the jumper.

[0080] Because the communication circuit 444 is sensitive to noise that may be generated by other signals on the printed circuit board 440 (e.g., signals generated by the drive circuit 442), the drive circuit 442 may be mounted on the side of the printed circuit board 440 opposite to the front side 445 where the communication circuit 444 is located (e.g., to prevent crosstalk between the communication circuit 444 and the remaining circuitry on the printed circuit board 440 (e.g., the drive circuit 442 and / or the transmitter assembly 450)). For example, assuming the printed circuit board 440 is divided into two halves (e.g., two semicircles) through the transmitter assembly 450, the communication circuit 444 may be positioned on one half, and the drive circuit 442 on the other opposite half. Furthermore, the communication circuit 444 and the drive circuit 442 may be positioned toward the peripheral edges of the printed circuit board 440 of their respective halves.

[0081] While the thickness of the dielectric layer of printed circuit board 440 can be minimized to reduce the thermal resistance between transmitter 452 and heat sink (e.g., as previously mentioned), reducing the thickness of the dielectric layer can also increase the capacitance between the electrical layout layer (e.g., electrical layout layer 262) and the base layer (e.g., base layer 260). This can lead to increased capacitance at nodes (e.g., connection points) of communication circuitry 444, which may be detrimental to the operation of communication circuitry 444. Therefore, the thickness of the dielectric layer can be minimized to reduce the thermal resistance between transmitter 452 and heat sink, but not to a value that would cause malfunction of communication circuitry 444. For example, the thickness of the dielectric layer can be approximately 50 µm to 150 µm. In some examples, transmitter assembly 450 may include four chains of different colors of transmitter 452 (e.g., chains of four red transmitters, chains of four green transmitters, chains of four blue transmitters, and chains of four white, yellow, or mint green transmitters) and produce a lumen output of 1,800 lumens. In such examples, a dielectric layer with a thickness of approximately 50 µm to 150 µm can provide a balance between heat dissipation and communication interference (e.g., when communicating at 2.4 MHz).

[0082] The printed circuit board assembly 400 may also include an antenna (not shown) for transmitting messages to an external device via wireless signals. One or more wireless communication circuits in the communication circuitry 444 mounted to the printed circuit board 440 may be electrically coupled (e.g., directly or indirectly) to the antenna for transmitting and / or receiving messages to / from the external device via wireless signals. Because the printed circuit board 440 is a metal-core printed circuit board, the antenna may not be formed on a single electrical layout layer of the printed circuit board 440 (e.g., because such an antenna cannot generate RF signals through the base layer of a metal-core printed circuit board). According to this example, the antenna may extend from the printed circuit board 440 (e.g., from the electrical layout layer of the printed circuit board 440). The antenna may be electrically and mechanically connected to an antenna connector 447 mounted to the printed circuit board 440 (e.g., mounted to the front side 445), which may be electrically coupled (e.g., directly or indirectly) to the communication circuitry 444. Additionally and / or alternatively, the antenna may be soldered to pads and / or vias on a single electrical layout layer (e.g., Figure 9 (Not shown, but the via can be similar to via 347), the pad and / or via can be (e.g., directly or indirectly) electrically coupled to communication circuitry 444. For example, the antenna can include a monopole antenna (e.g., such as...) extending from printed circuit board 440. Figure 2 and Figure 3 Antenna 246 is shown in the diagram. The antenna can be held in a position extending from the printed circuit board 440 by an antenna holder (e.g., antenna holder 248). For example, the antenna can extend outward away from the plane defined by the printed circuit board 440. In some examples, the antenna can be tuned to 2.4 MHz.

[0083] The communication circuitry 444 mounted to the printed circuit board 440 may include a matching network circuitry 449. The matching network circuitry 449 may be electrically coupled between the antenna (e.g., antenna connector 447) and the processor 441. For example, the matching network circuitry 449 may be configured to match the impedance of the antenna to the impedance of the communication circuitry 444 (e.g., electrical components of the communication circuitry 444 excluding the matching network circuitry 449) to achieve maximum power transfer between the antenna and the communication circuitry 444 (e.g., optimizing the performance of the antenna and the communication circuitry 444). The matching network circuitry 449 may include, for example, a multi-stage inductor-capacitor (LC) filter circuit. The antenna connector 447 and the matching network circuitry 449 may be surrounded (e.g., at least partially surrounded) by a ground plane 461 on the electrical layout layer of the printed circuit board 440. The ground plane 461 may extend through an area on the front side 445 of the printed circuit board 440. The ground plane 461 may be electrically coupled to a common terminal of the communication circuitry 444.

[0084] Ground plane 461 may also be electrically coupled to the substrate of printed circuit board 440 (e.g., substrate 260) (e.g., in addition to ground plane 461 being electrically coupled to the circuit common terminal of communication circuit 444). In some examples, ground plane 461 may be electrically coupled to the substrate of printed circuit board 440 through one or more vias 463. One or more vias 463 of printed circuit board 440 may be located in the area surrounding antenna connector 447 and mating network circuit 449 of ground plane 461. Vias 463 may each include a hole drilled into printed circuit board 440 (e.g., extending from front side 445, through solder mask, electrical layout layer, dielectric layer, and into substrate). In some examples, one or more of vias 463 may not extend completely through printed circuit board 440. Vias 463 may be filled with a conductive material such as silver epoxy resin and may be used to electrically connect ground plane 461 on electrical layout layer to substrate. Additionally and / or alternatively, ground plane 461 may be electrically coupled to the substrate of printed circuit board 440 via other electrical connections (e.g., not via via 463). Ground plane 461 may be electrically coupled to the substrate of printed circuit board 440 via fasteners (e.g., screws and / or rivets) received through opening 443. For example, opening 443 may be plated and / or coated with a conductive material. In other examples, matching network circuitry 449 may be connected to a circuit common terminal, and the circuit common terminal may be connected to a metal core / substrate (e.g., which may allow the metal core / substrate to also act as a ground plane).

[0085] Figure 10 This is a top view of another example printed circuit board assembly 500, which can be deployed as... Figure 2 and Figure 3 The light generating module 230 shown is a printed circuit board assembly 232. The printed circuit board assembly 500 may include a printed circuit board 540 (e.g., a single printed circuit board) and an emitter assembly 550 (e.g., emitter assembly 250) having an arrangement 551 (e.g., an array) of emitters 552 (e.g., LEDs). The arrangement 551 of emitters 552 may be located at the center (e.g., substantially the center) of the printed circuit board 540. For example, the emitter assembly 550 may include nineteen emitters 552 (e.g., as shown in the diagram). Figure 10 (as shown), but other variations are also possible. In some examples, transmitter component 550 may include more than Figure 10 The number of transmitters 552 may be increased or decreased. Different configurations of transmitter 552 may also be used. Transmitter 552 may be mounted (e.g., directly to) printed circuit board 540.

[0086] Emitter assembly 550 may include multiple “chains” (e.g., series-coupled emitters) of emitter 552. Emitters 552 in each respective chain may be series-coupled and may conduct the same drive current. Each respective chain may include emitters 552 that produce illumination at the same peak emission wavelength (e.g., emit light of the same color). Emitters 552 in different chains may emit light of different colors. For example, emitter assembly 550 may include three chains of emitters 552 of different colors (e.g., warm white, cool white, and / or mint green). Emitter assembly 550 may include chains of warm white emitters, chains of cool white emitters, and chains of mint green emitters, wherein each chain need not have the same number of LEDs. Individual emitters 552 in each chain may be distributed around emitter assembly 550 (e.g., mixed with emitters 552 in other chains of emitter 552) and arranged to improve color mixing within emitter assembly 550. For example, the emitters may be configured to occupy an area of ​​approximately 18 to 20 square millimeters. Other variations can be used, such as the number of emitters 552 per chain, the color of the emitters 552, the number of colors of the emitters 552, the number of chains of emitters 552, and the pattern of the arrangement 551 of the emitters 552. For example, emitter assembly 550 may include three chains of emitters 552 of different colors, wherein each corresponding chain has nine or fewer LEDs. According to one example, printed circuit board assembly 500 can be configured as a warm light dimming and white light dimming module that produces light in a CCT range, for example, from 1800 K to 5500 K, for CCT control. Printed circuit board assembly 500 can be further configured to provide at least 1100 lumens, for example, at a power of 18W.

[0087] like Figure 10 As shown, transmitter assembly 550 may not include any detectors (e.g., detectors 254, 354, 454). However, in some examples, transmitter assembly 550 may include one or more detectors, which may be located next to arrangement 551 of transmitter 552.

[0088] like Figure 10 As shown, transmitter assembly 550 may not include optical elements, such as domes (e.g., domes 256, 356, 456). However, in some examples, transmitter assembly 550 may include a dome configured to surround (e.g., encapsulate) the transmitter 552 and any detector mounted to printed circuit board 540, and may function in a manner similar to domes 256, 356, 456. The dome may (e.g., via a method similar to...) Figures 6A to 6E The assembly process shown for forming the dome 256 is formed on the printed circuit board 540.

[0089] Printed circuit board assembly 500 may include drive circuitry 542, which may be mounted to printed circuit board 540 (e.g., mounted to the front side 545 of printed circuit board 540). Drive circuitry 542 may control the amount of power delivered to transmitter 552 of transmitter assembly 550. For example, drive circuitry 542 mounted to printed circuit board 540 may include multiple electrical components, such as one or more drive circuits for controlling transmitter 552, and one or more control circuits for controlling drive circuits. Drive circuitry 542 (e.g., one or more control circuits) may be configured to control transmitter 552 of transmitter assembly 550, and thereby adjust the intensity level and / or color of accumulated light emitted by light generation module 530. For example, drive circuitry 542 may be configured to control transmitter 552 to adjust the intensity level of accumulated light emitted by light generation module 530 between an upper intensity level (e.g., a maximum intensity level, such as approximately 100%) and a lower intensity level (e.g., a minimum intensity level, such as approximately 0.1% to 1.0%). Additionally, the driving circuit 542 can be configured to control the emitter 552 to adjust the current color temperature (e.g., correlated color temperature (CCT)) of the accumulated light emitted by the light generation module. Furthermore, the driving circuit 542 can be configured to control the emitter 552 to adjust the current color value (e.g., which can be determined by the current x-chromaticity coordinate X) of the accumulated light emitted by the light generation module. PRES (and the current y-chromaticity coordinates are defined). Although the printed circuit board assembly 500 is described here with the current color value defined by the current x-chromaticity coordinates and the current y-chromaticity coordinates, the current color value can be defined by other color values ​​(e.g., as defined in other color spaces). For example, the current color value can be a red-green-blue (RGB) color value (e.g., defined by red, green, and blue values ​​and / or hexadecimal values ​​in the RGB color space), a UVW color value (e.g., defined by u-chromaticity values, v-chromaticity values, and luminance index (e.g., w) values ​​in the UVW color space), wavelength, and / or other suitable color values.

[0090] The printed circuit board assembly 500 may also include communication circuitry 544, which may be mounted to the printed circuit board 540 (e.g., mounted to the front side 545) and configured to transmit messages via signals (e.g., RF wireless signals) to means external to / separated from the printed circuit board assembly 500. For example, communication circuitry 544 may include multiple electrical components, such as one or more wireless communication circuits for transmitting messages via wireless signals, and one or more control circuits for interfacing between the wireless communication circuits and drive circuitry 542. Communication circuitry 544 may include, for example, a processor 541 mounted to the front side 545 of the printed circuit board 540. Processor 541 may include, for example, a microprocessor, microcontroller, programmable logic device (PLD), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other suitable processing device or controller. Communication circuitry 544 (e.g., processor 541) may be configured to, in response to a message received via wireless signals, cause drive circuitry 542 (e.g., directly or indirectly via one or more control circuits) to control (e.g., directly or indirectly) the transmitter 552 of transmitter assembly 550.

[0091] The emitter 552 of the emitter assembly 550 can be thermally coupled to a heat sink (e.g., heat sink 234) of the light generating module via a printed circuit board 540, such that the heat sink is configured to dissipate heat generated by the emitter 552 of the emitter assembly 550. For example, the printed circuit board 540 may include a metal core printed circuit board that can provide higher thermal conductivity and lower thermal resistance between the emitter 552 and the heat sink (e.g., compared to a printed circuit board made from a more standard substrate such as an FR4 substrate). The printed circuit board 540 can be attached to the heat sink and / or lamp holder (e.g., lamp holder 236) of the light generating module via one or more fasteners (e.g., fastener 235) received through an opening 543 in the printed circuit board 540 and a corresponding opening in the heat sink and / or lamp holder. For example, the fasteners may include screws and / or rivets. The heat sink may be made of aluminum, but steel, copper, or other metals may also be used. In some examples, the heat sink may be approximately 0.25 inches thick, but other thicknesses may also be used.

[0092] Although Figure 10 Not shown, but the printed circuit board 540 may include a base layer (e.g., base layer 260), an electrical layout layer (e.g., electrical layout layer 262), a dielectric layer (e.g., dielectric layer 264), and a solder mask layer (e.g., solder mask layer 266), for example, having a... Figure 5The printed circuit board 240 shown has a similar layer configuration. The base layer can be a thermally conductive substrate such as copper, aluminum or alumina, ceramic, or a combination thereof. The base layer can have a thickness of 1 mm (e.g., but other thicknesses can be used). The base layer can be physically and / or thermally connected to the heat sink, such as by thermal grease. Since the presence of the dielectric layer can increase the thermal resistance between the emitter 552 and the heat sink (e.g., reduce thermal conductivity), the thickness of the dielectric layer of the printed circuit board 540 can be reduced to decrease the thermal resistance between the emitter 552 and the heat sink. Additionally, the printed circuit board 540 may include (e.g., only) a single dielectric layer (e.g., to further reduce the thermal resistance between the emitter 552 and the heat sink), and therefore include a single (e.g., only a single) electrical layout layer (e.g., the printed circuit board 540 may be a "single-layer" printed circuit board with all electrical traces and electrical pads on a single electrical layout layer). According to one example, the dielectric layer may be 50 μm thick (e.g., or approximately 50 μm thick (e.g., but other thicknesses such as 50 μm to 150 μm thick can be used)) and / or made of a dielectric material having a withstand voltage of approximately 100 V and high thermal conductivity (e.g., greater than 3 W / m / K). For example, the dielectric layer may be made of an organic resin with ceramic fillers (e.g., Al2O3, AlN, BN) to enhance thermal conductivity. When the printed circuit board 540 is mounted in the light-generating module, the base layer of the printed circuit board 540 may contact (e.g., in direct contact) the heat sink (e.g., to contact with, for example,...). Figure 5 The printed circuit board 240 shown contacts the heat sink 234 in a similar manner. According to this example, the printed circuit board 540 can be shaped as a disk, as shown, with a diameter of 2 inches (e.g., or approximately 2 inches), but other sizes can be used.

[0093] The driver circuitry 542, communication circuitry 544, and transmitter 552 of transmitter assembly 550 mounted to printed circuit board 540 can be electrically connected to electrical traces and / or electrical pads on the electrical layout layer using electrical connection techniques such as soldering (e.g., all driver circuitry 542, communication circuitry 544, and transmitter 552 of transmitter assembly 550 can be electrically connected to electrical traces and / or electrical pads on the electrical layout layer using the same electrical connection techniques). For example, the electrical components of driver circuitry 542, communication circuitry 544, and transmitter 552 of transmitter assembly 550 may include SMT packages and can be electrically and mechanically coupled to electrical pads on the electrical layout layer via solder joints. Solder joint connections can be made using, for example, SMT soldering processes such as reflow soldering. Depending on other variations as described herein, two electrical connection techniques may be used. For example, the drive circuit 542 and communication circuit 544 mounted to the printed circuit board 540 can be electrically connected to the electrical traces and / or electrical pads of the electrical layout layer using a first electrical connection technique (e.g., soldering technique), while the transmitter 452 can be electrically connected to the electrical traces and / or electrical pads of the electrical layout layer using a second electrical connection technique (e.g., wire bonding technique).

[0094] Because printed circuit board 540 is a "single-layer" printed circuit board, the layout of electrical traces and electrical pads on the electrical layout layer of printed circuit board 540 can be complex. For example, some electrical traces may extend below electrical components mounted to printed circuit board 540 (e.g., between electrical pads to which the respective electrical components are mounted). In some examples, when two electrical traces may need to cross each other without being electrically connected, a jumper (e.g., with a resistance of approximately zero ohms) may be included in series with one of the electrical traces, allowing the second electrical trace to be routed below the jumper. For example, the amount of current conducted through an electrical trace in series with a jumper may be less than the amount of current conducted through an electrical trace routed below the jumper. In some examples, larger-sized jumpers may be used, allowing multiple electrical traces to be routed below the jumper. In other and / or additional examples, electrical traces routed below jumpers may conduct static signals (e.g., power supply voltage rails, circuit common terminals, etc.), while electrical traces in series with jumpers may conduct signals at frequencies higher than the static signals.

[0095] Because the communication circuit 544 is sensitive to noise that may be generated by other signals on the printed circuit board 540 (e.g., signals generated by the drive circuit 542), the drive circuit 542 may be mounted on the side of the printed circuit board 540 opposite to the communication circuit 544 (e.g., to prevent crosstalk between the communication circuit 544 and the remaining circuitry on the printed circuit board 540 (e.g., the drive circuit 542 and / or the transmitter assembly 550)). For example, assuming the printed circuit board 540 is bisected into two halves (e.g., two semicircles) through the transmitter assembly 550, the communication circuit 544 may be positioned on one half, and the drive circuit 542 on the other opposite half. Furthermore, the communication circuit 544 and the drive circuit 542 may be positioned toward the peripheral edges of the printed circuit board 540 of their respective halves. While the thickness of the dielectric layer of the printed circuit board 540 can be minimized to reduce the thermal resistance between the transmitter 552 and the heat sink (e.g., as previously mentioned), reducing the thickness of the dielectric layer can also increase the capacitance between the electrical layout layer and the base layer. This could lead to increased capacitance at the nodes of communication circuit 544, which could be detrimental to the operation of communication circuit 544. Therefore, the thickness of the dielectric layer can be minimized to reduce the thermal impedance between transmitter 552 and the heat sink, but not to a value that would cause malfunction of communication circuit 544. For example, the thickness of the dielectric layer could be approximately 50 µm to 150 µm, which provides a balance between heat dissipation and communication interference (e.g., when communicating at 2.4 MHz). Printed circuit board assembly 500 may also include an antenna (not shown) for transmitting messages via wireless signals. One or more wireless communication circuits in communication circuit 544 mounted to printed circuit board 540 can be electrically coupled to the antenna for sending / receiving messages to / from an external device via wireless signals. Because printed circuit board 540 is a metal core printed circuit board, the antenna may not be formed on a single electrical layout layer of printed circuit board 540 (e.g., because such an antenna cannot generate RF signals through the base layer of a metal core printed circuit board). Therefore, the antenna can extend from printed circuit board 540 (e.g., from the electrical layout layer of printed circuit board 540). The antenna can be electrically and mechanically connected to an antenna connector 547 mounted to a printed circuit board 540 (e.g., mounted to the front side 545). Additionally and / or alternatively, the antenna can be soldered to a via (e.g., not shown, but may be similar to via 347) and / or a pad on a single electrical layout layer. For example, the antenna may include a monopole antenna (e.g., such as...) extending from the printed circuit board 540. Figure 2 and Figure 3 Antenna 246 is shown in the diagram. The antenna can be held in place by an antenna bracket (e.g., antenna bracket 248) extending from the printed circuit board 540. In some examples, the antenna can be tuned to 2.4 MHz.

[0096] The communication circuitry 544 mounted to the printed circuit board 540 may include a matching network circuitry 549. The matching network circuitry 549 may be electrically coupled between an antenna (e.g., antenna connector 547) and a processor 541. For example, the matching network circuitry 549 may be configured to match the impedance of the antenna to the impedance of the communication circuitry 544 (e.g., electrical components of the communication circuitry 544 excluding the matching network circuitry 549) to achieve maximum power transfer between the antenna and the communication circuitry 544 (e.g., optimizing the performance of the antenna and the communication circuitry 544). The matching network circuitry 549 may include, for example, a multi-stage inductor-capacitor (LC) filter circuit. The antenna connector 547 and the matching network circuitry 549 may be surrounded (e.g., at least partially surrounded) by a ground plane 561 on the electrical layout layer of the printed circuit board 540. The ground plane 561 may extend through an area on the front side 545 of the printed circuit board 540. The ground plane 561 may be electrically coupled to a common terminal of the communication circuitry 544.

[0097] Ground plane 561 may also be electrically coupled to the substrate of printed circuit board 540 (e.g., in addition to being electrically coupled to the circuit common terminal of communication circuit 544). In some examples, ground plane 561 may be electrically coupled to the substrate of printed circuit board 540 through one or more vias 563. One or more vias 563 of printed circuit board 540 may be located in the area surrounding antenna connector 547 and mating network circuit 549 of ground plane 561. One or more vias 563 may each include a hole drilled into printed circuit board 540 (e.g., extending from front side 545, through solder mask, electrical layout layer, dielectric layer, and into substrate). In some examples, one or more of the vias 563 may not extend completely through printed circuit board 540. Vias 563 may be filled and / or lined with a conductive material such as silver epoxy resin and may be used to electrically connect ground plane 561 on electrical layout layer to substrate. Additionally and / or alternatively, ground plane 561 may be electrically coupled to the substrate of printed circuit board 540 via other electrical connections (e.g., instead of via via 563). Ground plane 561 may be electrically coupled to the substrate of printed circuit board 540 via fasteners (e.g., screws and / or rivets) received through opening 543. For example, opening 543 may be plated and / or coated with a conductive material. In some examples, matching network circuitry 549 may be connected to a circuit common terminal, and the circuit common terminal may be connected to a metal core / substrate (e.g., which may allow the metal core / substrate to also act as a ground plane).

[0098] According to another example, the printed circuit board assembly 500 can be configured as two circuit boards, for example, as described with respect to the printed circuit board assembly 300.

[0099] Figure 11Example lighting device 600, such as a controllable lighting device (e.g., Figure 1 A simplified block diagram of the lighting device 600 shown. The lighting device 600 may include one or more emitter components 610 (e.g., Figures 3 to 5 The transmitter assembly 250 shown is shown. Figures 7 to 8 The transmitter assembly 350 shown is shown. Figure 9 The transmitter assembly 450 shown, and / or Figure 10 The transmitter assembly 550 shown. For example, the lighting device 600 may include a transmitter assembly 610, which may include one or more transmitters 611, 612, 613, 614 (e.g., as shown). Figure 11 (The four transmitters shown). In some examples, transmitter component 610 may include more or fewer transmitters (e.g., such as... Figure 10 The transmitter assembly 550 shown has three transmitters. Each of the transmitters 611, 612, 613, and 614 is in... Figure 11 The LED is shown as a single LED, but may comprise multiple LEDs connected in series (e.g., chains of LEDs), multiple LEDs connected in parallel, or suitable combinations thereof, depending on the specific lighting system. Additionally, each of emitters 611, 612, 613, and 614 may include one or more organic light-emitting diodes (OLEDs). For example, the first emitter 611 may represent a chain of red LEDs (e.g., one or more), the second emitter 612 may represent a chain of blue LEDs (e.g., one or more), the third emitter 613 may represent a chain of green LEDs (e.g., one or more), and the fourth emitter 614 may represent a chain of white, amber, or mint green LEDs (e.g., one or more). For example, each respective emitter 611, 612, 613, and 614 may include a different number of LEDs or OLEDs than the other emitters. As another example, two or more emitters may contain LEDs / OLEDs of the same color (e.g., multiple chains of red LEDs). As another example, a given emitter may contain chains of LEDs / OLEDs of mixed colors. Emitters 611, 612, 613, and 614 can be controlled to adjust the brightness (e.g., luminous flux or intensity) and / or color (e.g., color temperature) of the cumulative light output of the illumination device 600. Emitter assembly 610 may also include one or more detectors 616, 618 (e.g., photodiodes) that can generate a corresponding photodiode current I in response to incident light. PD1 I PD2(For example, detector signals). For example, the first detector 616 may represent a single red, orange, or yellow LED or multiple red, orange, or yellow LEDs connected in parallel (e.g., the first detector 316 of emitter assembly 350 and / or the first detector 416 of emitter assembly 450), and the second detector 618 may represent a single green LED or multiple green LEDs connected in parallel (e.g., the second detector 318 of emitter assembly 350 and / or the second detector 418 of emitter assembly 450). The emitter assembly 610 may be mounted on a printed circuit board of the lighting assembly of the lighting device 600 (e.g., the printed circuit board 240 of the light generating module 230 of the lighting assembly 200, the printed circuit board 440 of the printed circuit board assembly 400, and / or the printed circuit board 540 of the printed circuit board assembly 500).

[0100] The lighting fixture 600 may include a power conversion stage 620. The power conversion stage 620 may include a power converter circuit 622 that can receive a source voltage, such as AC mains voltage V, via a thermal connection H and a neutral connection N. AC The power converter circuit 622 can cross the bus capacitor C. BUS Generate DC bus voltage V BUS (For example, approximately 15V to 20V). The power converter circuit 622 may include, for example, a boost converter, a buck converter, a buck-boost converter, a flyback converter, or a single-ended primary inductor converter (SEPIC). A converter or any other suitable power converter circuit is used to generate an appropriate bus voltage. Power converter circuit 622 can provide electrical isolation between the AC power supply and transmitters 611, 612, 613, 614, and can act as a power factor correction (PFC) circuit to adjust the power factor of lighting fixture 600 toward power factor 1. The circuitry of power conversion stage 620 can be mounted on a power printed circuit board external to the lighting fixture assembly, which includes a printed circuit board on which transmitter assembly 610 is mounted.

[0101] The lighting device 600 may include a light generating module level 630. The light generating module level 630 may include driving circuitry 602 (e.g., driving circuitry 242, 342, 442, 542) and communication circuitry 604 (e.g., communication circuitry 244, 344, 444, 544). For example, the driving circuitry 602 and communication circuitry 604 of the light generating module level 630 may be mounted on a printed circuit board on which the emitter assembly 610 is also mounted (e.g., printed circuit board 240 of the light generating module 230 of the lighting device assembly 200, printed circuit board 440 of the printed circuit board assembly 400, and / or printed circuit board 540 of the printed circuit board assembly 500). In some examples, the driving circuitry 602 may be mounted on a first printed circuit board on which the emitter assembly 610 is also mounted (e.g., the first printed circuit board 340 of the printed circuit board assembly 300), and the communication circuitry 604 may be mounted on a second printed circuit board (e.g., the second printed circuit board 341 of the printed circuit board assembly 300).

[0102] The driving circuit 602 may include an LED driving circuit 632, a receiver circuit 634, and a transmitter control circuit 636. The LED driving circuit 632 may be configured to control (e.g., individually control) the power delivered to each of the transmitters 611, 612, 613, and 614 of the transmitter assembly 610, as well as the luminous flux of the light emitted therefrom. The LED driving circuit 632 may receive a bus voltage V. BUS Furthermore, the corresponding LED driving current I conducted through transmitters 611, 612, 613, and 614 can be adjusted. LED1 I LED2 I LED3 I LED4 The value of the LED driving current I. The LED driving circuit 632 may include one or more regulating circuits (e.g., four regulating circuits), such as those for controlling the corresponding LED driving current I. LED1 to I LED4 A switching regulator (e.g., a buck converter) for the magnitude of the signal. An example of the LED driver circuit 632 is described in more detail in U.S. Patent No. 9,485,813, issued November 1, 2016, entitled ILLUMINATION DEVICE AND METHOD FORAVOIDING AN OVER-POWER OR OVER-CURRENT CONDITION IN A POWER CONVERTER, the entire disclosure of which is hereby incorporated by reference.

[0103] Receiver circuit 634 can be electrically coupled to detectors 616, 618 of transmitter assembly 610 for response to photodiode current I. PD1 I PD2Generates the corresponding optical feedback signal V FB1 V FB2 The receiver circuit 634 may include one or more transimpedance amplifiers (e.g., two transimpedance amplifiers) for converting the corresponding photodiode current I. PD1 I PD2 Converted into optical feedback signal V FB1 V FB2 For example, the optical feedback signal V FB1 V FB2 It can have a DC value, which indicates the corresponding photodiode current I. PD1 I PD2 The value of.

[0104] The transmitter control circuit 636 can be configured to control the LED driver circuit 632 to control the intensity of the transmitters 611, 612, 613, and 614 of the transmitter assembly 610. The transmitter control circuit 636 may include, for example, a microprocessor, microcontroller, programmable logic device (PLD), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other suitable processing device or controller. The transmitter control circuit 636 can generate one or more drive signals V. DR1 V DR2 V DR3 V DR4 This is used to control the corresponding adjustment circuit in the LED driver circuit 632. The transmitter control circuit 636 can receive the optical feedback signal V from the receiver circuit 634. FB1 V FB2 To determine the luminous flux L of the light emitted by transmitters 611, 612, 613, and 614. E .

[0105] The transmitter control circuit 636 can receive multiple transmitter positive voltage feedback signals V from the LED driver circuit 632. FE1 V FE2 V FE3 V FE4 And receive multiple detector positive voltage feedback signals V from receiver circuit 634. FD1 V FD2 Transmitter positive voltage feedback signal V FE1 -V FE4 This can represent the magnitude of the positive voltage of the corresponding transmitters 611, 612, 613, and 614, and this magnitude can indicate the temperature T of the corresponding transmitter. E1 T E2 T E3 T E4If each transmitter 611, 612, 613, 614 includes multiple LEDs connected in series, then the transmitter positive voltage feedback signal V FE1 -V FE4 This can represent the magnitude of the forward voltage across a single LED or the cumulative forward voltage formed by multiple LEDs across a chain (e.g., all LEDs coupled in series in a chain). The detector forward voltage feedback signal V FD1 V FD2 This can represent the magnitude of the positive voltage of the corresponding detector 616, 618, which can indicate the temperature T of the corresponding detector. D1 T D2 For example, the detector's positive voltage feedback signal V FD1 V FD2 It can be equal to the positive voltage V of the corresponding detectors 616 and 618. FD .

[0106] The communication circuit 604 may include a lighting device control circuit 640, a communication circuit 644, and a memory 646. The lighting device control circuit 640 may be connected via a communication bus 642 (e.g., I...). 2 The lighting device control circuit 640 is electrically coupled to the transmitter control circuit 636 via a C-communication bus. The lighting device control circuit 640 can be configured (e.g., via the transmitter control circuit 636) to control the transmitter assembly 610 to control the brightness (e.g., luminous flux) and / or color (e.g., color temperature) of the accumulated light emitted by the lighting device 600. The lighting device control circuit 640 may include, for example, a microprocessor, microcontroller, programmable logic device (PLD), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other suitable processing device or controller. The lighting device control circuit 640 can be configured (e.g., via the transmitter control circuit 636) to control the current intensity L of the accumulated light emitted by the lighting device 600. PRES (For example, current brightness) toward target intensity L TRGT (For example, target brightness) adjustment (e.g., dimming), the adjustment range can span the dimming range of the controllable lighting device, for example, at the lower intensity L LE (For example, minimum strength, such as about 0.1%-1.0%) and upper strength L HE (For example, maximum intensity, such as approximately 100%). The lighting device control circuit 640 can be configured (e.g., via emitter control circuit 636) to control the current color temperature T of the accumulated light emitted by the lighting device 600. PRES Towards the target color temperature T TRGT The adjustment range can be between cool white temperature (e.g., about 3100-4500 K) and warm white temperature (e.g., about 2000-3000 K), but other temperature ranges are also possible.

[0107] Communication circuit 644 may be coupled to lighting device control circuit 640. Communication circuit 644 may include communication circuitry such as, for example, wireless communication circuitry such as a radio frequency (RF) transceiver coupled to antenna 645 (e.g., antenna 246) for transmitting and / or receiving RF signals. Alternatively, communication circuitry may be an RF transmitter for transmitting RF signals and an RF receiver for receiving RF signals. Communication circuit 604 may also include matching network circuitry 648 (e.g., matching network circuitry 449, 549). Communication circuitry 644 (e.g., communication circuitry 604) may be configured to electrically communicate with antenna 645 via matching network circuitry 648 (e.g., electrically coupled to the antenna) (e.g., matching network circuitry 648 is electrically coupled between communication circuitry 644 and antenna 645). Matching network circuitry 648 may be configured to optimize the performance of communication circuitry 644 and / or antenna 645. For example, matching network circuit 648 can be configured to match the impedance of antenna 645 with the impedance of communication circuit 644 (e.g., electrical components of communication circuit 644 excluding matching network circuit 648) to achieve maximum power transfer between communication circuit 644 and antenna 645. Matching network circuit 648 may include, for example, an inductor-capacitor matching network, such as an inductor-capacitor (LC) filter circuit. In some examples, communication circuit 644 may be coupled to the thermal connection H and neutral connection N of lighting device 600 to transmit control signals via electrical wiring using, for example, power line carrier (PLC) communication technology. Lighting device control circuit 640 can be configured to determine the target intensity L of lighting device 600 in response to a message (e.g., a digital message) received via communication circuit 644. TRGT .

[0108] Memory 646 can be configured to store the operating characteristics of the lighting device 600 (e.g., target intensity L). TRGT Target color temperature T TRGT Lower end strength L LE Upper end strength L HE (etc.). The memory 646 can be implemented as an external integrated circuit (IC) or as internal circuitry of the lighting device control circuit 640. The lighting device 600 may include a power supply 650 (e.g., which may be mounted on a printed circuit board of the lighting device assembly of the lighting device 600 (e.g., the printed circuit board 240 of the light generating module 230 of the lighting device assembly 200, the printed circuit board 440 of the printed circuit board assembly 400, and / or the printed circuit board 540 of the printed circuit board assembly 500)), which may receive a bus voltage V. BUS And generate power supply voltage V CC It is used to supply power to the lighting control circuit 640 and other low-voltage circuits of the lighting device.

[0109] When the illumination device 600 is turned on, the illumination device control circuit 640 can be configured (e.g., via the emitter control circuit 636) to control the emitter assembly 610 to emit light substantially all the time. The illumination device control circuit 640 can be configured to control the emitter assembly 610 to interrupt normal light emission to measure one or more operating characteristics of the emitter assembly during periodic measurement intervals. For example, during the measurement intervals, the emitter control circuit 636 can be configured to individually turn on each of the different colored emitters 611, 612, 613, 614 of the emitter assembly 610 (e.g., simultaneously turning off the other emitters) and use one of the two detectors 616, 618 to measure the luminous flux of the light emitted by that emitter. For example, the emitter control circuit 636 can turn on the first emitter 611 of the emitter assembly 610 (e.g., simultaneously turning off the other emitters 612, 613, 614) and respond to a first optical feedback signal V generated from the first detector 616. FB1 The luminous flux L of the light emitted by the first transmitter 611 is determined. E Additionally, the transmitter control circuit 636 can be configured to drive transmitters 611, 612, 613, 614 and detectors 616, 618 to generate a transmitter positive voltage feedback signal V during the measurement interval. FE1 To V FE4 and detector positive voltage feedback signal V FD1 V FD2 .

[0110] For example, calibration values ​​for various operating characteristics of the lighting device 600 can be stored in memory 646 as part of a calibration process performed during the manufacture of the lighting device 600. Calibration values ​​can be stored for each of the emitters 611, 612, 613, 614 and / or detectors 616, 618 of the emitter assembly 610. For example, calibration values ​​for measurements of luminous flux (e.g., in lumens), x-chromaticity, y-chromaticity, emitter forward voltage, photodiode current, and detector forward voltage can be stored. For example, luminous flux, x-chromaticity, and y-chromaticity measurements can be obtained from emitters 611, 612, 613, 614 using an external calibration tool (such as a spectrophotometer). The values ​​of emitter forward voltage, photodiode current, and detector forward voltage can be measured internally within the lighting device 600. The calibration values ​​of each of the transmitters 611, 612, 613, 614 and / or detectors 616, 618 can be measured at multiple different drive currents and / or multiple different operating temperatures.

[0111] After installation, the lighting control circuit 640 of the lighting device 600 can use the calibration values ​​stored in the memory 646 to maintain a constant light output from the transmitter assembly 610. The lighting control circuit 640 can determine the target intensity L of the lighting device 600 to achieve the desired light output. TRGT and / or target color temperature T TRGT The target values ​​of the luminous flux emitted by transmitters 611, 612, 613, and 614 are determined. The lighting device control circuit 640 can determine the corresponding drive current I of transmitters 611, 612, 613, and 614 based on the determined target values ​​of the luminous flux emitted by transmitters 611, 612, 613, and 614. LED1 to I LED4 The value of the quantity. When the lifespan of the lighting device 600 is zero, the corresponding drive current I of the transmitters 611, 612, 613, and 614 can be adjusted. LED1 to I LED4 The quantity control is the initial quantity value I. LED-INITIAL .

Claims

1. A printed circuit board assembly comprising: A metal core printed circuit board, the metal core printed circuit board comprising a base layer, a single electrical layout layer and a single dielectric layer located between the base layer and the electrical layout layer, the electrical layout layer comprising a plurality of electrical pads, a plurality of electrical traces and a ground plane; A transmitter assembly comprising a plurality of transmitters configured to emit light, the plurality of transmitters being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; A drive circuit configured to control the power delivered to the plurality of transmitters of the transmitter assembly, the drive circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; A communication circuit configured to transmit and receive wireless signals, the communication circuit including a common terminal electrically coupled to the ground plane of the printed circuit board, the communication circuit being configured to cause the drive circuit to control the transmitter in response to a message received via the wireless signal, the communication circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; as well as An antenna, electrically coupled to the communication circuitry to allow the communication circuitry to transmit messages via wireless signals transmitted and received by the antenna, the antenna extending from the printed circuit board; The communication circuit further includes a matching network circuit coupled between the communication circuit and the antenna, the matching network circuit being at least partially surrounded by the ground plane on the electrical layout layer, the ground plane being electrically coupled to the base layer of the printed circuit board.

2. The printed circuit board assembly of claim 1, wherein the plurality of transmitters are electrically connected to two or more of the plurality of electrical pads via respective wire bonds, and the drive circuit and the communication circuit are electrically connected to the two or more of the plurality of electrical pads via respective solder joints.

3. The printed circuit board assembly of claim 2, wherein the transmitter of the transmitter assembly is encapsulated by optical elements.

4. The printed circuit board assembly of claim 3, wherein the optical element comprises: A first dome portion is formed on the printed circuit board and encapsulates the one or more emitters. The first dome portion is made of a light-transmitting first material and defines an interface surface that is substantially parallel to and extends above the printed circuit board. as well as A second dome portion is located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board. The second dome portion has a shape configured to direct light from the one or more emitters in a specific direction. The second dome portion is made of a light-transmitting second material and defines an interface surface that adheres to the interface surface of the first dome portion.

5. The printed circuit board assembly of claim 4, wherein the optical element further comprises a barrier located on the surface of the metal core printed circuit board and surrounding the one or more emitters, the barrier and the surface of the metal core printed circuit board defining a recess therein where the first dome portion is located.

6. The printed circuit board assembly of claim 3, wherein the optical element includes a dome, and the emitter is configured to emit light through the dome.

7. The printed circuit board assembly of claim 1, wherein the antenna comprises a monopole antenna.

8. The printed circuit board assembly of claim 7, further comprising: An antenna connector, which is mounted to the printed circuit board; The monopole antenna is electrically connected to the antenna connector such that the monopole antenna extends from the printed circuit board.

9. The printed circuit board assembly of claim 7, further comprising: Through-hole, the through-hole extending through the printed circuit board; The monopole antenna is electrically connected to the via, such that the monopole antenna extends from the printed circuit board.

10. The printed circuit board assembly of claim 1, wherein the printed circuit board includes at least one opening extending through the printed circuit board and configured to receive a fastener, and wherein the ground plane on the electrical layout layer is electrically coupled to the base layer of the printed circuit board via the fastener.

11. The printed circuit board assembly of claim 10, wherein the fastener comprises at least one of a screw or a rivet.

12. The printed circuit board assembly of claim 1, wherein the printed circuit board includes one or more vias located within the ground plane, each of the vias extending from the electrical layout layer, through the dielectric layer, and into the base layer, each of the vias being filled with a conductive material for electrically connecting the ground plane on the electrical layout layer to the base layer.

13. A lighting device assembly comprising: Printed circuit board assembly, the printed circuit board assembly comprising: A metal core printed circuit board, the metal core printed circuit board comprising a base layer, a single electrical layout layer and a single dielectric layer located between the base layer and the electrical layout layer, the electrical layout layer comprising a plurality of electrical pads, a plurality of electrical traces and a ground plane; A transmitter assembly comprising a plurality of transmitters configured to emit light, the plurality of transmitters being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; A drive circuit configured to control the power delivered to the plurality of transmitters of the transmitter assembly, the drive circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; and A communication circuit configured to transmit and receive wireless signals, the communication circuit configured to cause the drive circuit to control the transmitter in response to a message received via the wireless signals, the communication circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads, the communication circuit including a common terminal electrically coupled to the ground plane of the printed circuit board; and A reflector having a first opening, a second opening, and a reflective inner surface, wherein a plurality of emitters are configured to emit light through the first opening of the reflector, and the inner surface of the reflector is configured to reflect light through the second opening of the reflector; The printed circuit board assembly further includes an antenna electrically coupled to the communication circuitry to allow the communication circuitry to transmit messages via wireless signals transmitted and received by the antenna, which extends from the printed circuit board to the outside of the reflector.

14. The lighting device assembly of claim 13, wherein the antenna comprises a monopole antenna.

15. The lighting device assembly of claim 14, further comprising: An antenna bracket for holding the monopole antenna such that the monopole antenna extends from the printed circuit board to the outside of the reflector.

16. The lighting device assembly of claim 15, further comprising: A lamp holder, to which the reflector is attached; The antenna bracket is connected to the lamp holder and extends from the lamp holder to the outside of the reflector.

17. The lighting device assembly of claim 15, wherein the antenna bracket is connected to the printed circuit board of the printed circuit board assembly.

18. The lighting device assembly of claim 14, further comprising: An antenna connector, which is mounted to the printed circuit board; The monopole antenna is electrically connected to the antenna connector such that the monopole antenna extends from the printed circuit board to the outside of the reflector.

19. The lighting device assembly of claim 14, further comprising: Through-hole, the through-hole extending through the printed circuit board; The monopole antenna is electrically connected to the via, such that the monopole antenna extends from the printed circuit board to the outside of the reflector.

20. The lighting device assembly of claim 13, wherein the ground plane is electrically coupled to the substrate of the printed circuit board of the printed circuit board assembly.

21. The lighting device assembly of claim 20, wherein the printed circuit board of the printed circuit board assembly includes at least one opening extending through the printed circuit board and configured to receive a fastener, and wherein the ground plane on the electrical layout layer is electrically coupled to the base layer of the printed circuit board via the fastener.

22. The lighting device assembly of claim 21, wherein the fastener comprises at least one of a screw or a rivet.

23. The lighting device assembly of claim 20, wherein the printed circuit board of the printed circuit board assembly includes one or more vias located in the ground plane, each of the vias extending from the electrical layout layer, through the dielectric layer, and into the base layer, each of the vias being filled with a conductive material for electrically connecting the ground plane on the electrical layout layer to the base layer.

24. The lighting device assembly of claim 20, wherein the communication circuit of the printed circuit board assembly further includes a matching network circuit coupled between the communication circuit and the antenna, the matching network circuit being at least partially surrounded by the ground plane on the electrical layout layer.

25. The lighting device assembly of claim 13, wherein the plurality of transmitters of the transmitter assembly are electrically connected to two or more electrical pads of the plurality of electrical pads of the printed circuit board via respective wire bonds, and the drive circuit and the communication circuit are electrically connected to the two or more electrical pads of the plurality of electrical pads of the printed circuit board via respective solder joints.

26. The lighting device assembly of claim 25, wherein the emitter of the emitter assembly is encapsulated in optical elements.

27. The lighting device assembly of claim 26, wherein the optical element of the emitter assembly of the printed circuit board assembly comprises: A first dome portion is formed on the printed circuit board and encapsulates the one or more emitters. The first dome portion is made of a light-transmitting first material and defines an interface surface that is substantially parallel to and extends above the printed circuit board. as well as A second dome portion is located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board. The second dome portion has a shape configured to direct light from the one or more emitters in a specific direction. The second dome portion is made of a light-transmitting second material and defines an interface surface that adheres to the interface surface of the first dome portion.

28. The lighting device assembly of claim 27, wherein the optical element further comprises a barrier located on the surface of the metal core printed circuit board and surrounding the one or more emitters, the barrier and the surface of the metal core printed circuit board defining a recess therein where the first dome portion is located.

29. The lighting device assembly of claim 26, wherein the optical element comprises a dome, and the emitter is configured to emit light through the dome.

30. A printed circuit board assembly comprising: A printed circuit board, the printed circuit board including a base layer, an electrical layout layer and a dielectric located between the base layer and the electrical layout layer, the electrical layout layer including a plurality of electrical pads and a plurality of electrical traces; A transmitter assembly comprising a plurality of transmitters configured to emit light, the plurality of transmitters being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads via respective wire bonds; A drive circuit configured to control the power delivered to the plurality of transmitters of the transmitter assembly, the drive circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads via corresponding solder joints; as well as A communication circuit configured to transmit and receive wireless signals, the communication circuit being configured to cause the drive circuit to control the transmitter in response to a message received via the wireless signals.

31. The printed circuit board assembly of claim 30, wherein the printed circuit board comprises a metal core printed circuit board.

32. The printed circuit board assembly of claim 31, wherein the printed circuit board includes a single electrical layout layer and a single dielectric layer.

33. The printed circuit board assembly of claim 32, wherein the communication circuit is mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads via corresponding solder joint connections.

34. The printed circuit board assembly of claim 33, wherein the communication circuit is electrically coupled to an antenna extending from the printed circuit board.

35. The printed circuit board assembly of claim 34, wherein the communication circuitry includes a processor and a common circuit terminal electrically coupled to a ground plane on the electrical layout layer.

36. The printed circuit board assembly of claim 35, wherein the antenna is electrically coupled to the processor via a matching network circuit, the matching network circuit being at least partially surrounded by the ground plane on the electrical layout layer.

37. The printed circuit board assembly of claim 36, wherein the ground plane on the electrical layout layer is electrically coupled to the base layer of the printed circuit board.

38. The printed circuit board assembly of claim 37, wherein the printed circuit board includes at least one opening extending through the printed circuit board and configured to receive a fastener, and wherein the ground plane on the electrical layout layer is electrically coupled to the base layer of the printed circuit board via the fastener.

39. The printed circuit board assembly of claim 38, wherein the fastener comprises at least one of a screw or a rivet.

40. The printed circuit board assembly of claim 37, wherein the printed circuit board includes one or more vias located within the ground plane, each of the vias extending from the electrical layout layer, through the dielectric layer, and into the base layer, each of the vias being filled with a conductive material for electrically connecting the ground plane on the electrical layout layer to the base layer.

41. The printed circuit board assembly of claim 34, wherein the antenna comprises a monopole antenna extending from the printed circuit board.

42. The printed circuit board assembly of claim 30, wherein the transmitter of the transmitter assembly is encapsulated in optical elements.

43. The printed circuit board assembly of claim 42, wherein the optical element comprises: A first dome portion is formed on the printed circuit board and encapsulates the one or more emitters. The first dome portion is made of a light-transmitting first material and defines an interface surface that is substantially parallel to and extends above the printed circuit board. as well as A second dome portion is located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board. The second dome portion has a shape configured to direct light from the one or more emitters in a specific direction. The second dome portion is made of a light-transmitting second material and defines an interface surface that adheres to the interface surface of the first dome portion.

44. The printed circuit board assembly of claim 43, wherein the optical element further comprises a barrier located on the surface of the metal core printed circuit board and surrounding the one or more emitters, the barrier and the surface of the metal core printed circuit board defining a recess therein where the first dome portion is located.

45. The printed circuit board assembly of claim 42, wherein the optical element includes a dome, and the emitter is configured to emit light through the dome.

46. ​​The printed circuit board assembly of claim 30, wherein the printed circuit board includes a first printed circuit board, and the printed circuit board assembly includes a second printed circuit board, the communication circuit being mounted to the second printed circuit board and electrically connected to two or more of a plurality of electrical pads of the second printed circuit board via corresponding solder joint connections.

47. The printed circuit board assembly of claim 46, wherein the first printed circuit board comprises a metal core printed circuit board.

48. The printed circuit board assembly of claim 47, wherein the first printed circuit board includes a recess therein in which the second printed circuit board is located.

49. The printed circuit board assembly of claim 48, wherein the communication circuitry is electrically coupled to an antenna located on the electrical layout layer of the second printed circuit board.

50. The printed circuit board assembly of claim 47, wherein the communication circuitry is electrically coupled to the antenna, and the antenna comprises a monopole antenna extending from the second printed circuit board.

51. A printed circuit board assembly comprising: A metal core printed circuit board, the metal core printed circuit board comprising a base layer, a single electrical layout layer and a single dielectric layer located between the base layer and the electrical layout layer, the electrical layout layer comprising a plurality of electrical pads and a plurality of electrical traces; A transmitter assembly comprising a plurality of transmitters configured to emit light, the plurality of transmitters being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; A drive circuit configured to control the power delivered to the plurality of transmitters of the transmitter assembly, the drive circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads; as well as A communication circuit configured to transmit and receive wireless signals, the communication circuit configured to cause the drive circuit to control the transmitter in response to a message received via the wireless signals, the communication circuit being mounted to the printed circuit board and electrically connected to two or more of the plurality of electrical pads.

52. The printed circuit board assembly of claim 51, wherein the transmitter of the transmitter assembly is encapsulated by optical elements.

53. The printed circuit board assembly of claim 52, wherein the optical element comprises: A first dome portion is formed on the printed circuit board and encapsulates the one or more transmitters. The first dome portion defines an interface surface that is substantially parallel to the printed circuit board and extends over the printed circuit board. as well as A second dome portion is located above the first dome portion, such that the first dome portion is located between the second dome portion and the printed circuit board, and the second dome portion defines an interface surface that adheres to the interface surface of the first dome portion.

54. The printed circuit board assembly of claim 53, wherein the first dome portion is made of a light-transmitting first material, and the second dome portion is made of a light-transmitting second material, wherein the second material is different from the first material.

55. The printed circuit board assembly of claim 53, wherein the optical element further comprises a barrier located on the surface of the metal core printed circuit board and surrounding the one or more emitters, the barrier and the surface of the metal core printed circuit board defining a recess therein where the first dome portion is located.

56. The printed circuit board assembly of claim 51, further comprising: A monopole antenna electrically coupled to the communication circuit to allow the communication circuit to transmit messages via wireless signals transmitted and received by the antenna, the antenna extending from the printed circuit board; as well as An antenna connector, which is mounted to the printed circuit board; The monopole antenna is electrically connected to the antenna connector such that the monopole antenna extends from the printed circuit board.

57. The printed circuit board assembly of claim 51, further comprising: A monopole antenna electrically coupled to the communication circuit to allow the communication circuit to transmit messages via wireless signals transmitted and received by the antenna, the antenna extending from the printed circuit board; as well as Through-hole, the through-hole extending through the printed circuit board; The monopole antenna is electrically connected to the via, such that the monopole antenna extends from the printed circuit board.

58. The printed circuit board assembly of claim 51, further comprising: A matching network circuit is coupled between the communication circuit and the antenna, and the matching network circuit is at least partially surrounded by a ground plane on the electrical layout layer, the ground plane being electrically coupled to the base layer of the printed circuit board.

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