Light emitting device, light emitting substrate, and display device

Abstract

Provided are a light-emitting device, a light-emitting substrate, and a display device. The light-emitting device comprises a bearing part, a light-emitting structure, an encapsulating part, and at least one condenser lens, the light-emitting structure is located on a bearing surface of the bearing part; the encapsulating part is located on the bearing surface and wraps the light-emitting structure, the encapsulating part comprises at least one encapsulating structure, the top surface of each encapsulating structure has one light-emitting area, the top surface of the encapsulating structure is a surface of the encapsulating structure away from the bearing part; each condenser lens is located on the side of one light-emitting area away from the light-emitting structure, each condenser lens is connected with the top surface of one encapsulating structure, and the condenser lens has a convex arc surface in the direction away from the light-emitting structure, wherein the ratio of the maximum thickness of the condenser lens to the reference size of the light-emitting area where the condenser lens is located is 0.5-1.1. The light-emitting device has a smaller light-emitting angle and a higher axial light-emitting intensity.

Description

Light-emitting devices, light-emitting substrates and display devices Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting device, a light-emitting substrate, and a display apparatus. Background Technology

[0002] Light-emitting devices are widely used in various aspects of life, such as lighting and displays.

[0003] In related technologies, a light-emitting device includes a packaging substrate, a light-emitting structure, and a packaging portion. The light-emitting structure is located on the bearing surface of the packaging substrate. The packaging portion is located on the bearing surface and encapsulates the light-emitting structure. The surface of the packaging portion that is away from the packaging substrate is the light-emitting surface of the light-emitting device and is parallel to the bearing surface; that is, the light-emitting surface of the light-emitting device is a plane parallel to the bearing surface.

[0004] However, the light-emitting device with a planar light-emitting surface has a large light-emitting angle, which makes it difficult to meet user needs. Summary of the Invention

[0005] This disclosure provides a light-emitting device, a light-emitting substrate, and a display device, which can reduce the light emission angle of the light-emitting device while ensuring a high light intensity. The technical solution is as follows:

[0006] In a first aspect, a light-emitting device is provided. The light-emitting device includes a carrier portion, a light-emitting structure, an encapsulation portion, and at least one condensing lens. The light-emitting structure is located on a carrier surface of the carrier portion; the encapsulation portion is located on the carrier surface and encapsulates the light-emitting structure, the encapsulation portion including at least one encapsulation structure, each encapsulation structure having a light-emitting region on its top surface, the top surface of the encapsulation structure being the surface of the encapsulation structure away from the carrier portion; each condensing lens is located on the side of a light-emitting region away from the light-emitting structure, each condensing lens being connected to the top surface of a encapsulation structure, the light-emitting region being the projection area of ​​the condensing lens onto the top surface of the encapsulation structure, or the light-emitting region being the top surface of the encapsulation structure containing the condensing lens; the condensing lens has an arcuate surface convex in a direction away from the light-emitting structure, wherein the ratio of the maximum thickness of the condensing lens to a reference dimension of the light-emitting region is 0.5-1.1; the outer contour of the light-emitting region is rectangular, the reference dimension being the side length of one side of the rectangle; or the outer contour of the light-emitting region is elliptical, the reference dimension being the semi-major axis or semi-minor axis of the ellipse. Alternatively, the outer contour of the light-emitting area is circular, and the reference dimension is a multiple of the radius of the circle. times.

[0007] Optionally, the light-emitting device further includes a dam, which is connected to the support portion and defines at least one mounting groove with the support surface of the support portion, wherein the encapsulation portion and the light-emitting structure are located in the at least one mounting groove.

[0008] Optionally, the angle between the sidewall of the mounting groove and the bearing surface is in the range of 90°-110°.

[0009] Optionally, the angle between the sidewall of the mounting groove and the bearing surface is 90°±2°, and the corresponding ratio is 0.9-1.1; or, the angle between the sidewall of the mounting groove and the bearing surface is 100°±2°, and the corresponding ratio is 0.6-0.9; or, the angle between the sidewall of the mounting groove and the bearing surface is 110°±2°, and the corresponding ratio is 0.5-0.7.

[0010] Optionally, the angle between the sidewall of the mounting groove and the bearing surface and the corresponding ratio satisfy the following formula: y = y0 - B × (α - 90)

[0011] Where y is the ratio, α is the included angle, y0 ranges from 0.9 to 1.1, and B ranges from 0.02 to 0.04.

[0012] Optionally, the dam has a top surface on the side away from the bearing portion, and the top surface of the dam has at least one first annular groove, each of the first annular grooves being arranged around one of the mounting slots.

[0013] Optionally, the top surface of the encapsulation portion has at least one first groove, the condensing lens is at least partially located within the first groove, and the bottom surface of each first groove has a light-emitting area.

[0014] Optionally, the thickness of the top surface of the dam is less than or equal to 0.21 mm.

[0015] Optionally, the bottom of the first groove has a second annular groove, which extends along the edge of the bottom surface of the first groove and forms a closed ring.

[0016] Optionally, the top surface of the encapsulation portion has at least one second groove, the condensing lens is at least partially located within the second groove, and the bottom surface of each second groove has a light-emitting area.

[0017] Optionally, the bottom of the second groove has a third annular groove, which extends along the edge of the bottom surface of the second groove and forms a closed ring.

[0018] Optionally, the encapsulation portion includes a bottom surface disposed opposite to the top surface of the encapsulation portion, and a side surface located between the top surface and the bottom surface, the side surface constituting a portion of the outer contour of the light-emitting device.

[0019] Optionally, the ratio is 0.65-0.85.

[0020] Optionally, the center of the bottom surface of the condensing lens coincides with the center of the light-emitting area.

[0021] Optionally, the light-emitting structure includes a light-emitting chip or a plurality of light-emitting chips spaced apart on the support surface, wherein the orthographic projection of each condenser lens on the support surface includes the orthographic projection of at least one of the light-emitting chips on the support surface.

[0022] Optionally, the light-emitting structure includes a plurality of light-emitting chips spaced apart on the support surface. The plurality of light-emitting chips includes a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip. The orthographic projections of the red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip on the support surface are located inside the orthographic projection of the same condenser lens on the support surface; or, the orthographic projections of the red light-emitting chip on the support surface are located inside the orthographic projection of the condenser lens on the support surface, and the orthographic projections of the blue light-emitting chip and the green light-emitting chip on the support surface are located inside the orthographic projection of another condenser lens on the support surface.

[0023] Optionally, the light-emitting device further includes a first reflective layer located between the condensing lens and the encapsulation portion, the first reflective layer being used to reduce the light emission angle of the light-emitting structure.

[0024] Optionally, the first reflective layer has only one slit, and the center of the bottom surface of the condensing lens is located in the slit; or, the first reflective layer has multiple parallel slits, and the center of the bottom surface of the condensing lens is located in one of the multiple slits.

[0025] Optionally, the width of the slit is greater than or equal to 0.1 mm and smaller than the size of the light-emitting area where the condenser lens is located in the width direction of the slit.

[0026] Optionally, the light-emitting structure further includes a second reflective layer, which at least covers the outer peripheral wall of at least one of the light-emitting chips.

[0027] Optionally, the light-emitting structure further includes an optical correction layer that covers at least one surface of the light-emitting chip away from the carrier portion, and the optical correction layer is used to increase the axial light emission intensity of the light-emitting chip.

[0028] Optionally, the encapsulation part is made of epoxy resin or silicone; and / or the condenser lens is made of epoxy resin or silicone.

[0029] Optionally, the refractive index of the encapsulation portion is between 1.4 and 1.6; and / or, the refractive index of the condenser lens is between 1.4 and 1.6.

[0030] Optionally, the light-emitting area is square.

[0031] In a second aspect, a light-emitting substrate is provided, the light-emitting substrate comprising a plurality of light-emitting devices arranged in an array, the light-emitting devices being any of the aforementioned light-emitting devices, the carrier portions of the plurality of light-emitting devices being connected to form a substrate and the encapsulation portions of the plurality of light-emitting devices being arranged at intervals, or the light-emitting substrate comprising a substrate and a plurality of light-emitting devices arranged in an array on the substrate, the light-emitting devices being any of the aforementioned light-emitting devices.

[0032] Thirdly, a display device is provided, the display device including the aforementioned light-emitting substrate, the light-emitting substrate being a display substrate.

[0033] Fourthly, a display device is provided, the display device including the aforementioned light-emitting substrate, the light-emitting substrate being a backlight panel, and the display device further including a liquid crystal display panel located on the light-emitting side of the light-emitting substrate.

[0034] The beneficial effects of the technical solutions provided in this disclosure are:

[0035] In this embodiment of the present disclosure, the light emitted by the light-emitting structure is focused by a condensing lens, and the ratio of the maximum thickness of the condensing lens to the reference size of the light-emitting area is set to an appropriate range, which can improve the axial light emission intensity of the light-emitting device while reducing the light emission angle of the light-emitting device. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 is a schematic diagram of the structure of a light-emitting device provided in an embodiment of this disclosure;

[0038] Figure 2 is a top view of the structure of the light-emitting device in Figure 1;

[0039] Figure 3 is a schematic diagram of the horizontal light pattern of the light-emitting device in Figure 1 in the first direction;

[0040] Figure 4 is a schematic diagram of the horizontal light pattern of the light-emitting device in Figure 1 in the second direction;

[0041] Figure 5 is a schematic diagram of the light emission effect of the first type of light-emitting device;

[0042] Figure 6 is a schematic diagram of the light emission effect of the second type of light-emitting device;

[0043] Figure 7 is a schematic diagram of the light emission effect of the third type of light-emitting device;

[0044] Figure 8 is a schematic diagram of the light emission effect of the fourth type of light-emitting device;

[0045] Figure 9 is a schematic diagram of the light emission effect of the fifth type of light-emitting device;

[0046] Figure 10 is a schematic diagram of the light emission effect of the sixth type of light-emitting device;

[0047] Figure 11 is a schematic diagram showing the relationship between the included angle, ratio, and luminous intensity of the first to third types of light-emitting devices;

[0048] Figure 12 is a schematic diagram showing the relationship between the included angle, ratio and luminous intensity of the fourth to sixth types of light-emitting devices;

[0049] Figure 13 is a schematic diagram showing the relationship between the included angle, ratio, and emission angle of the first to third types of light-emitting devices;

[0050] Figure 14 is a schematic diagram showing the relationship between the included angle, ratio, and emission angle of the fourth to sixth types of light-emitting devices;

[0051] Figure 15 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure;

[0052] Figure 16 is a schematic diagram of the light pattern of the light-emitting device shown in Figure 15;

[0053] Figure 17 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0054] Figure 18 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0055] Figure 19 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0056] Figure 20 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0057] Figure 21 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0058] Figure 22 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0059] Figure 23 is a schematic diagram of the light pattern of the light-emitting device in Figure 21 when the angle of the groove wall of the annular groove is 90°;

[0060] Figure 24 is a schematic diagram of the light pattern of the light-emitting device in Figure 21 when the angle of the groove wall of the annular groove is 100°;

[0061] Figure 25 is a schematic diagram of the light pattern of the light-emitting device in Figure 21 when the angle of the groove wall of the annular groove is 100°;

[0062] Figure 26 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0063] Figure 27 is a top view of the first reflective layer of the light-emitting device in Figure 26.

[0064] Figure 28 is a schematic diagram of another type of first reflective layer;

[0065] Figure 29 is a schematic diagram of the light emission angle and light emission intensity of the light-emitting device corresponding to the first reflective layer in Figure 27 under different slit widths;

[0066] Figure 30 is a schematic diagram of the light emission angle and light emission intensity of the light-emitting device corresponding to the first reflective layer in Figure 27 under different slit widths;

[0067] Figure 31 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0068] Figure 32 is a schematic diagram of the structure of another light-emitting device provided in an embodiment of this disclosure;

[0069] Figure 33 is a schematic diagram of the structure of a light-emitting substrate provided in an embodiment of this disclosure;

[0070] Figure 34 is a flowchart of a method for fabricating a light-emitting device according to an embodiment of this disclosure;

[0071] Figure 35 is a schematic diagram of the fabrication process of a light-emitting device provided in an embodiment of this disclosure;

[0072] Figure 36 is a schematic diagram of the fabrication process of another light-emitting device provided in an embodiment of this disclosure;

[0073] Figure 37 is a schematic diagram of the fabrication process of another light-emitting device provided in the embodiments of this disclosure. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0075] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0076] Figure 1 is a schematic diagram of the structure of a light-emitting device provided in an embodiment of this disclosure. As shown in Figure 1, the light-emitting device includes a carrier part 1, a light-emitting structure 2, an encapsulation part 3, and a condensing lens 4.

[0077] The light-emitting structure 2 is located on the bearing surface 1a of the carrier portion 1. The encapsulation portion 3 is located on the bearing surface 1a and encapsulates the light-emitting structure 2. The encapsulation portion 3 includes at least one encapsulation structure (illustrated in FIG. 1 as the encapsulation portion 3 including one encapsulation structure), and each encapsulation structure has a light-emitting region 3a on its top surface, which is the surface of the encapsulation structure away from the carrier portion 1. Each condensing lens 4 is located on the side of a light-emitting region 3a away from the light-emitting structure 2, and each condensing lens 4 is connected to the top surface of an encapsulation structure. The condensing lens 4 has an arcuate surface that convexes away from the light-emitting structure 2. The ratio of the maximum thickness H of the condensing lens 4 to the reference dimension of the light-emitting region 3a is 0.5-1.1. In the embodiments of this disclosure, the thickness of the condensing lens 4 refers to the dimension of the condensing lens 4 in the direction perpendicular to the bearing surface 1a.

[0078] In this embodiment, the light-emitting region 3a is the projection area of ​​the condenser lens 4 onto the top surface of the encapsulation structure, or the light-emitting region 3a is the top surface of the encapsulation structure containing the condenser lens 4. In some examples, when the projection of the condenser lens 4 onto the support surface 1a falls within the projection of the top surface of the encapsulation structure onto the support surface 1a, the light-emitting region 3a is the projection area of ​​the condenser lens 4 onto the top surface of the encapsulation structure. In other examples, when the portion of the projection of the condenser lens 4 onto the support surface is located outside the projection of the top surface of the encapsulation structure onto the support surface 1a, the light-emitting region 3a is the top surface of the encapsulation structure. Optionally, in some embodiments, the light-emitting region 3a refers to the interface between the bottom surface 4b of the condenser lens 4 and the top surface of the encapsulation structure. In this case, the bottom surface 4b of the condenser lens 4 completely coincides with the light-emitting region 3a.

[0079] Optionally, the outer contour of the light-emitting region 3a can be rectangular, elliptical, or circular. When the outer contour of the light-emitting region 3a is rectangular, the reference dimension is the length of one side of the rectangle. That is, the rectangle includes two long sides and two short sides, and the reference dimension can be the length of one long side or the length of one short side. When the outer contour of the light-emitting region 3a is elliptical, the reference dimension is the semi-major axis or semi-minor axis of the ellipse. The semi-major axis is half the major axis, and the semi-minor axis is half the minor axis. When the outer contour of the light-emitting region 3a is circular, the reference dimension is the radius of the circle. times.

[0080] In implementation, the rectangle can be a rounded rectangle or a right rectangle. When the rectangle is a rounded rectangle, it is the same as a right rectangle, the length of the longer side is equal to the distance between the two shorter sides, and the length of the shorter side is equal to the distance between the two longer sides.

[0081] In this embodiment of the disclosure, the light emitted by the light-emitting structure is focused by a condensing lens, and the ratio of the maximum thickness of the condensing lens to the side length of the light-emitting area is set to this range, which can improve the axial luminous intensity of the light-emitting device while reducing the light emission angle of the light-emitting device.

[0082] Optionally, the outer contour of the light-emitting region 3a is a centrally symmetrical figure, such as a square or a circle. When the outer contour of the light-emitting region 3a is a rectangle and the long side of the rectangle is equal to the short side, the outer contour of the light-emitting region 3a is a square. In this case, the reference dimension is the side length of any side of the square.

[0083] In this embodiment of the disclosure, the connection between the condenser lens 4 and the top surface of the encapsulation structure includes direct connection or indirect connection. Direct connection means that there is no other structure between the condenser lens 4 and the top surface of the encapsulation structure, while indirect connection means that other structures (such as the first reflective layer mentioned below) are provided between the condenser lens 4 and the top surface of the encapsulation structure, and the condenser lens 4 and the top surface of the encapsulation structure are connected through other structures between them.

[0084] Optionally, the top surface of the encapsulation structure can be a flat surface or a slightly convex arc surface convex away from the bearing surface 1a. The shape of the top surface of the encapsulation structure depends on the manufacturing process. For example, when the encapsulation part 3 is formed using a dispensing process, the top surface of the encapsulation structure is a slightly convex arc surface convex away from the bearing surface 1a.

[0085] In some examples, the top surface 4a of the condenser lens 4 is spherical, that is, the condenser lens 4 is a spherical lens. The bottom surface 4b of the condenser lens 4 is connected to the top surface of the encapsulation part 3. In this case, the maximum thickness of the condenser lens 4 is the distance between the vertex of the sphere and the bottom surface of the condenser lens 4. Optionally, the center of the sphere and the center of the bottom surface 4b may or may not coincide.

[0086] Figure 2 is a top view of the light-emitting device in Figure 1, showing the positional relationship between the bottom surface of the condenser lens 4 and the light-emitting region 3a where the condenser lens 4 is located. As shown in Figure 2, the bottom surface 4b of the condenser lens 4 is circular, and a portion of the bottom surface 4b of the condenser lens 4 is located outside the top surface of the encapsulation structure (i.e., the projection of the bottom surface 4b of the condenser lens 4 onto the carrier surface is outside the projection of the top surface of the encapsulation structure onto the carrier surface). Therefore, the light-emitting region 3a is the top surface of the encapsulation structure. The outer contour of the light-emitting region 3a is square, with a reference dimension of the side length A of the square. The center of the bottom surface 4b of the condenser lens 4 coincides with the center of the light-emitting region 3a, for example, point O in Figure 2. The outer contour of the bottom surface 4b of the condenser lens 4 intersects every side of the outer contour of the light-emitting region 3a. In other embodiments, the outer contour of the bottom surface 4b of the condenser lens 4 includes the outer contour of the light-emitting region 3a.

[0087] In actual manufacturing, due to process errors, the center of the bottom surface 4b of the condenser lens 4 and the center of the light-emitting area 3a may not completely coincide, and there may be a certain deviation. In this embodiment, deviations within the allowable range of process errors are considered as coincidences. For example, the outer contour of the condenser lens 4 projected onto the supporting surface 1a is circular, and the allowable deviation range can be within 1 / 10 of the radius of the circle. When the outer contour of the condenser lens projected onto the supporting part is other shapes, the allowable deviation range can be defined with reference to this dimension.

[0088] Referring again to Figure 1, the light-emitting device also includes a dam 5, which is connected to the support portion 1 and defines a mounting groove with the support surface 1a of the support portion 1. The encapsulation portion 3 and the light-emitting structure 2 are located in the mounting groove.

[0089] In this embodiment, the sidewall 5a of the mounting groove has a reflective function, capable of reflecting the light emitted by the light-emitting structure. In implementation, the dam 5 can be made of a reflective material (e.g., reflective particles such as titanium dioxide or barium sulfate particles can be doped into the dam's material), thus giving the sidewall 5a of the mounting groove a reflective function. Alternatively, the dam 5 can be made of a non-reflective or reflective material, and the sidewall 5a of the mounting groove can be provided with a reflective layer (not shown), thus giving the sidewall of the mounting groove a reflective function. Here, the reflective layer can be a metallic reflective layer or a dielectric film reflective layer. A metallic reflective layer includes a silver layer or an aluminum layer, etc. A dielectric film reflective layer includes multiple alternating layers of high refractive index and low refractive index layers.

[0090] Optionally, the angle between the sidewall 5a of the mounting groove and the bearing surface 1a is typically in the range of 90°-110°. By setting the angle between the sidewall 5a of the mounting groove and the bearing surface 1a within this range, it facilitates the manufacturing of the light-emitting device (e.g., makes demolding easier) and also allows the sidewall of the mounting groove to reflect the light emitted by the light-emitting structure, thereby allowing more light to exit from the front of the light-emitting device and improving the light extraction efficiency.

[0091] For example, the included angle between the sidewall 5a of the mounting groove and the bearing surface 1a can be 90°, 100° or 110°.

[0092] In this embodiment, the ratio of the maximum thickness of the condenser lens 4 to the reference size of the light-emitting area is determined by the angle α between the sidewall 5a of the mounting groove and the bearing surface 1a. The larger the angle, the smaller the ratio. In practical applications, the maximum thickness of the condenser lens 4 can be determined according to this rule based on the reference size of the light-emitting area in the mounting groove and the angle α between the sidewall 5a of the mounting groove and the bearing surface 1a, thereby reducing the light emission angle of the light-emitting device and increasing the axial light intensity of the light-emitting device.

[0093] Optionally, the ratio of the angle α between the sidewall 5a of the mounting groove and the bearing surface 1a to the maximum thickness of the condenser lens 4 corresponding to the mounting groove and the reference dimension of the light-emitting area in the mounting groove satisfies the following formula: y=y0-B×(α-90)

[0094] Where y is the aforementioned ratio, α is the angle between the side wall of the mounting groove and the bearing surface, y0 ranges from 0.9 to 1.1, and B is a set variable coefficient, ranging from 0.02 to 0.04.

[0095] When the included angle is 90°±2°, the corresponding ratio is 0.9-1.1. When the included angle is 100°±2°, the corresponding ratio is 0.6-0.9. When the included angle is 110°±2°, the corresponding ratio is 0.5-0.7. When the ratios for different included angles are within the corresponding ranges, the axial luminous intensity of the light-emitting device is higher.

[0096] In practice, the included angle can also be other angle values, such as an angle between 90° and 100°, or an angle between 100° and 110°. In this case, the corresponding ratio can be determined according to the formula above.

[0097] For example, the light-emitting structure 2 includes a plurality of light-emitting chips arranged at intervals on the support surface 1a. These plurality of light-emitting chips include a red light-emitting chip 2c, a blue light-emitting chip 2a, and a green light-emitting chip 2b, the orthographic projections of the red light-emitting chip 2c, the blue light-emitting chip 2a, and the green light-emitting chip 2b on the support surface 1a are located inside the orthographic projection of the same condenser lens 4 on the support surface 1a.

[0098] In other embodiments, the light-emitting structure 2 may include only one light-emitting chip.

[0099] In this embodiment of the disclosure, the light-emitting chip can be a light-emitting diode (LED) chip. LED chips are low in cost and have a relatively simple manufacturing process, which helps to reduce the cost of light-emitting devices. Optionally, the light-emitting chip can be a mini LED chip or a micro LED chip.

[0100] Optionally, the light-emitting chip can be an LED chip with a conventional structure, a flip-chip structure, or a vertical structure, and the embodiments disclosed herein do not impose any limitations on this.

[0101] In one possible implementation, the light-emitting chips of different colors can be LED chips with the same structure. For example, the light-emitting chips of each color can all be upright LED chips, or all be flip-chip LED chips, or all be vertical LED chips.

[0102] In another possible implementation, the light-emitting chips of different colors can be LED chips with different structures. For example, some colors of light-emitting chips are upright LED chips, while others are vertical LED chips. For instance, blue and green light-emitting chips are upright LED chips, and red light-emitting chips are vertical LED chips.

[0103] When the light-emitting chip is a conventional LED chip, its electrodes can be connected to the carrier through two wires (also known as wire bonding or wire bonding); when the light-emitting chip is a flip-chip LED chip, its electrodes can be connected to the carrier through solder; when the light-emitting chip is a vertical LED chip, one electrode is connected to the carrier through solder, and the other electrode is connected to the carrier through a wire.

[0104] Optionally, multiple light-emitting chips are arranged along a first direction. In this case, the light-emitting device will exhibit color shift when viewed from both sides of the first direction.

[0105] For example, in Figure 1, blue light-emitting chip 2a, green light-emitting chip 2b, and red light-emitting chip 2c are arranged sequentially from left to right. Figure 3 is a schematic diagram of the horizontal light pattern of the light-emitting device in Figure 1 in the first direction, and Figure 4 is a schematic diagram of the horizontal light pattern of the light-emitting device in Figure 1 in the second direction. The second direction is perpendicular to the first direction, and both the first and second directions are parallel to the supporting surface 1a. In Figure 1, the first direction is the left-right direction, and the second direction is the direction perpendicular to the paper.

[0106] In Figures 3 and 4, the horizontal axis represents the viewing angle, and the vertical axis represents the normalized luminous intensity, which is the ratio of the luminous intensity at any angle to the luminous intensity at 0°. Curve 31 represents blue light, curve 32 represents green light, and curve 33 represents red light. As shown in Figure 3, at a 20° viewing angle on the left side of Figure 1, the blue light intensity is higher than the red light intensity; at a 20° viewing angle on the right side of Figure 1, the red light intensity is higher than the blue light intensity. As shown in Figure 4, in the direction perpendicular to the paper in Figure 1, the emission angles of red, blue, and green are basically the same. Therefore, when this light-emitting device is applied to a display substrate, the display substrate exhibits color shift in the left-right direction, but no color shift in the direction perpendicular to the paper. Therefore, the display substrate made using this light-emitting device can be used in scenarios where the display effect in one direction is less critical, and the color shift phenomenon can be eliminated by adjusting the viewing position.

[0107] Optionally, the carrier portion 1 may include a substrate, including but not limited to a glass substrate and a bismaleimide triazine (BT) substrate. An electrical connection structure is provided on the substrate for electrically connecting the light-emitting structure to other components.

[0108] Exemplarily, the electrical connection structure includes a first pad located on the bearing surface of the substrate, a second pad located on the bottom surface of the substrate (the surface opposite to the bearing surface), and a via penetrating both the bearing surface and the bottom surface of the substrate. The first pad is connected to the light-emitting structure, and the second pad is used to connect to other components (such as printed circuit boards (PCBs) or flexible printed circuit (FPC) boards). The via electrically connects the corresponding first and second pads. In one possible implementation, both ends of the via are connected to the first and second pads, respectively; in another possible implementation, at least one end of the via is connected to the corresponding pad via a trace. The light-emitting device corresponding to this electrical connection structure can be called a surface-mount device (SMD). These devices have high integration, small size, and light weight, and are widely used.

[0109] Optionally, the materials used to manufacture the encapsulation section 3 include, but are not limited to, epoxy resin or silicone. Depending on actual needs, additional substances for modifying the brightness and light pattern of the light-emitting device, such as diffusing agents and expanders, can be added to the material of the encapsulation section.

[0110] Optionally, the refractive index of the encapsulation portion 3 is between 1.4 and 1.6. The encapsulation portion 3 can be formed by dispensing or molding, and can be formed in one step or in multiple steps.

[0111] Optionally, the materials used to manufacture the focusing lens 4 include, but are not limited to, silicone, epoxy resin, or acrylic.

[0112] Optionally, the refractive index of the condenser lens 4 is between 1.4 and 1.6, and may be the same as or different from the refractive index of the encapsulation part 3.

[0113] In practice, the condenser lens 4 and the encapsulation part 3 can be made of the same or different materials. When the condenser lens 4 and the encapsulation part 3 are made of the same material, they can be integrally formed or formed separately. When the condenser lens 4 and the encapsulation part 3 are formed separately, making them of the same material facilitates their bonding and avoids the influence of the interface on light emission.

[0114] Optionally, the materials used to construct the dam 5 include, but are not limited to, polyphthalamide (PPA) (also known as high-temperature resistant nylon), poly1,4-cyclohexylene dimethylene terephthalate (PCT), BT, and epoxy molding compound (EMC). In practical applications, the combination of the dam 5 and the load-bearing component 1 can be referred to as a support structure.

[0115] In this embodiment, when the angle between the sidewall 5a of the mounting groove and the bearing surface 1a is different, the corresponding ratio will affect the light emission effect of the light-emitting device. The light emission effect of the light-emitting device shown in Figure 1 will be explained below with reference to experimental data. This embodiment has conducted simulation experiments on the light emission effect of light-emitting devices of various sizes, and the corresponding light pattern diagrams are shown in Figures 5 to 10.

[0116] The structure and dimensions of the light-emitting device used in the simulation experiment are as follows:

[0117] The overall height (dimension perpendicular to the support surface) of the light-emitting device, excluding the condenser lens 4, is 0.56mm-1.0mm; the thickness of the support portion is 0.5mm-0.6mm; and the height of the light-emitting chip (dimension perpendicular to the support surface) is approximately 100μm. The thickness of the packaging portion 3 is 0.4mm-0.5mm. The outer contour of the light-emitting region 3a is square, with the reference dimension being the side length of the square. The top surface of the condenser lens 4 is spherical.

[0118] The first type has an included angle of 90° and a side length of 0.64mm, and the maximum thickness of the condenser lens 4 is increased from 0.1mm to 0.9mm;

[0119] The second type has an included angle of 100°, a side length of 0.83mm, and the maximum thickness of the condenser lens 4 is increased from 0mm to 1mm;

[0120] The third type has an included angle of 110°, a side length of 0.94mm, and the thickness of the condenser lens 4 is increased from 0.1mm to 1mm;

[0121] The fourth type has an included angle of 90 degrees and a side length of 0.45 mm, with the thickness of the condenser lens 4 increasing from 0.1 mm to 0.6 mm.

[0122] The fifth type has an included angle of 100°, a side length of 0.55mm, and the maximum thickness of the condenser lens 4 is increased from 0mm to 0.6mm;

[0123] The sixth type has an included angle of 110°, a side length of 0.66mm, and the thickness of the condenser lens 4 is increased from 0.1mm to 0.9mm.

[0124] This embodiment of the invention uses the top surface of the condenser lens as an example, but similar effects can be achieved with other curved surfaces.

[0125] In Figures 5 to 10, the horizontal axis represents the viewing angle, and the vertical axis represents the normalized luminous intensity. The normalized luminous intensity is the ratio of the luminous intensity at any angle to the luminous intensity corresponding to 0°. The light emission effect of each of the above-mentioned light-emitting devices will be explained below with reference to Figures 5 to 10.

[0126] In Figure 5, curve 51 represents a light-emitting device using a condenser lens with a maximum thickness of 0.1 mm, curve 52 represents a light-emitting device using a condenser lens with a maximum thickness of 0.3 mm, curve 53 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, curve 54 represents a light-emitting device using a condenser lens with a maximum thickness of 0.6 mm, curve 55 represents a light-emitting device using a condenser lens with a maximum thickness of 0.7 mm, and curve 56 represents a light-emitting device using a condenser lens with a maximum thickness of 0.9 mm.

[0127] As can be seen from Figure 5, for the first type of light-emitting device, when the maximum thickness of the condenser lens increases from 0.1 mm to 0.6 mm, the condenser lens enhances its ability to converge light, thereby increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0128] In Figure 6, curve 61 represents a light-emitting device without a condenser lens, curve 62 represents a light-emitting device with a condenser lens with a maximum thickness of 0.2 mm, curve 63 represents a light-emitting device with a condenser lens with a maximum thickness of 0.4 mm, curve 64 represents a light-emitting device with a condenser lens with a maximum thickness of 0.5 mm, curve 65 represents a light-emitting device with a condenser lens with a maximum thickness of 0.6 mm, curve 66 represents a light-emitting device with a condenser lens with a maximum thickness of 0.7 mm, curve 67 represents a light-emitting device with a condenser lens with a maximum thickness of 0.8 mm, and curve 68 represents a light-emitting device with a condenser lens with a maximum thickness of 1 mm.

[0129] As can be seen from Figure 6, for the second type of light-emitting device, when the maximum thickness of the condenser lens increases from 0.1 mm to 0.6 mm, the condenser lens enhances its ability to converge light, thereby increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0130] In Figure 7, curve 71 represents a light-emitting device using a condenser lens with a maximum thickness of 0.1 mm, curve 72 represents a light-emitting device using a condenser lens with a maximum thickness of 0.3 mm, curve 73 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, curve 74 represents a light-emitting device using a condenser lens with a maximum thickness of 0.7 mm, curve 75 represents a light-emitting device using a condenser lens with a maximum thickness of 0.9 mm, and curve 76 represents a light-emitting device using a condenser lens with a maximum thickness of 1 mm.

[0131] As can be seen from Figure 7, for the aforementioned third type of light-emitting device, when the maximum thickness of the condenser lens increases from 0.1 mm to 0.5 mm, the condenser lens's ability to converge light is enhanced, thus increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0132] In Figure 8, curve 81 represents a light-emitting device using a condenser lens with a maximum thickness of 0.1 mm, curve 82 represents a light-emitting device using a condenser lens with a maximum thickness of 0.2 mm, curve 83 represents a light-emitting device using a condenser lens with a maximum thickness of 0.4 mm, curve 84 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, and curve 85 represents a light-emitting device using a condenser lens with a maximum thickness of 0.7 mm.

[0133] As can be seen from Figure 8, for the aforementioned fourth type of light-emitting device, when the maximum thickness of the condenser lens increases from 0.1 to 0.4 mm, the condenser lens's ability to converge light is enhanced, thus increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0134] In Figure 9, curve 91 represents a light-emitting device without a condenser lens, curve 92 represents a light-emitting device with a condenser lens with a maximum thickness of 0.2 mm, curve 93 represents a light-emitting device with a condenser lens with a maximum thickness of 0.4 mm, curve 94 represents a light-emitting device with a condenser lens with a maximum thickness of 0.6 mm, curve 95 represents a light-emitting device with a condenser lens with a maximum thickness of 0.5 mm, and curve 96 represents a light-emitting device with a condenser lens with a maximum thickness of 0.45 mm.

[0135] As can be seen from Figure 9, for the fifth type of light-emitting device mentioned above, when the maximum thickness of the condenser lens increases from 0 to 0.5 mm, the condenser lens's ability to converge light is enhanced, thus increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0136] In Figure 10, curve 101 represents a light-emitting device using a condenser lens with a maximum thickness of 0.1 mm, curve 102 represents a light-emitting device using a condenser lens with a maximum thickness of 0.3 mm, curve 103 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, curve 104 represents a light-emitting device using a condenser lens with a maximum thickness of 0.7 mm, and curve 105 represents a light-emitting device using a condenser lens with a maximum thickness of 0.9 mm.

[0137] As can be seen from Figure 10, for the aforementioned sixth type of light-emitting device, when the maximum thickness of the condenser lens increases from 0 to 0.3 mm, the condenser lens enhances its ability to converge light, thereby increasing the luminous intensity at the positive viewing angle; however, when the maximum thickness of the condenser lens continues to increase, some light loss and scattering occur, resulting in a decrease in luminous intensity.

[0138] Figure 11 is a schematic diagram showing the relationship between the included angle, ratio, and luminous intensity of the first to third types of light-emitting devices. Figure 12 is a schematic diagram showing the relationship between the included angle, ratio, and luminous intensity of the fourth to sixth types of light-emitting devices. In Figures 11 and 12, the horizontal axis represents the ratio of the maximum thickness of the condenser lens to the side length of the square light-emitting area, the vertical axis represents the luminous intensity, and the stars represent the strongest luminous point, that is, the point with the greatest luminous intensity.

[0139] In Figure 11, curve 111 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 90°; curve 112 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 100°; and curve 113 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 110°.

[0140] In Figure 12, curve 121 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 90°; curve 122 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 100°; and curve 123 shows the relationship between the luminous intensity of the light-emitting device and the aforementioned ratio when the included angle is 110°.

[0141] As can be seen from Figures 11 and 12, as the included angle increases, the ratio corresponding to the highest point of luminous intensity of the light-emitting device decreases.

[0142] Figure 13 is a schematic diagram showing the relationship between the included angle, ratio, and emission angle of the first to third types of light-emitting devices. Figure 14 is a schematic diagram showing the relationship between the included angle, ratio, and emission angle of the fourth to sixth types of light-emitting devices. In Figures 13 and 14, the horizontal axis represents the ratio of the maximum thickness of the condenser lens to the side length of the square light-emitting area, the vertical axis represents the emission angle, and the stars represent the minimum emission angle.

[0143] In Figure 13, curve 131 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 90°; curve 132 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 100°; and curve 133 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 110°.

[0144] In Figure 14, curve 141 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 90°; curve 142 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 100°; and curve 143 shows the relationship between the light-emitting angle of the light-emitting device and the aforementioned ratio when the included angle is 110°.

[0145] As can be seen from Figures 13 and 14, the emission angle of the light-emitting device changes with the maximum thickness and included angle of the lens. The emission angle first decreases and then increases as the ratio increases.

[0146] Referring to Figures 5 to 14, it can be seen that when the included angle is 90°, with a corresponding ratio of 0.9-1.1, a light-emitting device with good light directionality can be obtained; when the included angle is 100°, with a corresponding ratio of 0.6-0.9, a light-emitting device with good light directionality can be obtained; and when the included angle is 110°, with a corresponding ratio of 0.5-0.7, a light-emitting device with good light directionality can be obtained. Here, "good directionality" means that the light emission angle is narrow and the luminous intensity is high.

[0147] Figure 15 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. As shown in Figure 15, the difference from the light-emitting device shown in Figure 1 is that the dam 5 and the bearing surface 1a of the bearing portion 1 define multiple mounting slots. The encapsulation portion 3 and the light-emitting structure are located in these multiple mounting slots. The encapsulation portion 3 includes multiple encapsulation structures, each encapsulation structure being located in one mounting slot. The top surface of each encapsulation structure is a light-emitting region 3a. Each light-emitting region 3a is provided with a condensing lens 4.

[0148] In this embodiment, each light-emitting structure includes a plurality of light-emitting chips spaced apart on a support surface, with each light-emitting chip located in a mounting slot. The orthographic projection of each light-emitting chip on the support surface lies within the orthographic projection of the condensing lens 4 disposed in the mounting slot onto the support surface.

[0149] For example, the light-emitting structure includes a red light-emitting chip 2c, a blue light-emitting chip 2a, and a green light-emitting chip 2b. The orthographic projections of the red light-emitting chip 2c, the blue light-emitting chip 2a, and the green light-emitting chip 2b onto the supporting surface 1a are respectively located inside the orthographic projection of a condensing lens 4 onto the supporting surface 1a. That is, a condensing lens 4 is correspondingly disposed above each light-emitting chip.

[0150] Figure 16 is a schematic diagram of the light pattern of the light-emitting device shown in Figure 15. As shown in Figure 16, curve 161 represents the light pattern of blue light, curve 162 represents the light pattern of green light, and curve 163 represents the light pattern of red light. In the first and second directions, the light patterns of various colors are basically the same, and there is basically no viewing angle distortion problem. It can be seen that by independently setting the focusing lens 4 for each color of light-emitting chip, the viewing angle distortion problem in the first direction mentioned above can be improved.

[0151] Figure 17 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. As shown in Figure 17, the difference between this device and the one shown in Figure 16 is that the dam 5 and the bearing surface 1a of the support portion 1 define two mounting slots. The encapsulation portion 3 and the light-emitting structure are located in these two mounting slots. The encapsulation portion 3 includes two encapsulation structures, each located in one mounting slot. The top surface of each encapsulation structure is a light-emitting region 3a.

[0152] In this embodiment, the light-emitting structure 2 includes a plurality of light-emitting chips spaced apart on the bearing surface 1a, with one light-emitting chip disposed in one mounting slot and a plurality of light-emitting chips disposed in another mounting slot.

[0153] For example, the plurality of light-emitting chips include a red light-emitting chip 2c, a blue light-emitting chip 2a, and a green light-emitting chip 2b. The red light-emitting chip 2c is located in a separate mounting slot, and the orthographic projection of the red light-emitting chip 2c on the support surface 1a is located inside the orthographic projection of the condenser lens 4 on the support surface 1a; the blue light-emitting chip 2a and the green light-emitting chip 2b are located in another mounting slot, and the orthographic projections of the blue light-emitting chip 2a and the green light-emitting chip 2b on the support surface 1a are located inside the orthographic projection of the condenser lens 4 on the support surface 1a.

[0154] In practical applications, the materials and structures of blue light-emitting chip 2a and green light-emitting chip 2b are usually quite similar, while the materials and structures of red light-emitting chip 2c are quite different. Therefore, blue light-emitting chip 2a and green light-emitting chip 2b can share a single condensing lens 4, while red light-emitting chip 2c has its own separate condensing lens 4.

[0155] In the embodiment shown in Figure 17, the mounting slots containing the blue and green light-emitting chips 2a and 2b have larger opening areas, resulting in larger top surface areas for the corresponding encapsulation structure. Conversely, the mounting slot containing the red light-emitting chip 2c has a smaller opening area, leading to smaller top surface areas for the corresponding encapsulation structure. Therefore, when the top surface of the encapsulation structure is the light-emitting region, the reference size of the light-emitting region containing the focusing lenses above the blue and green light-emitting chips 2a and 2b is larger, while the reference size of the light-emitting region containing the focusing lenses above the red light-emitting chip 2c is smaller. The ratio of the maximum thickness of the focusing lenses above the blue and green light-emitting chips 2a to the reference size of their respective light-emitting regions, as well as the ratio of the maximum thickness of the focusing lenses above the red light-emitting chip 2c to the reference size of their respective light-emitting regions, must both be within the aforementioned range of 0.5-1.1, but they can be equal or unequal.

[0156] Furthermore, the ratio of the maximum thickness of the focusing lens above the blue light-emitting chip 2a and the green light-emitting chip 2b to the reference size of the light-emitting area, as well as the ratio of the maximum thickness of the focusing lens above the red light-emitting chip 3c to the reference size of the light-emitting area, must satisfy the aforementioned formula.

[0157] Figure 18 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. As shown in Figure 18, the difference from the light-emitting device shown in Figure 1 is that the dam 5 has a top surface away from the supporting part 1, and the top surface of the dam 5 has a first annular groove 5b. Each first annular groove 5b is arranged around a mounting groove. Since there is a light-emitting area 3a in each mounting groove, and a condensing lens 4 is provided in each light-emitting area 3a, each first annular groove 5b is arranged around a condensing lens 4. The first annular groove 5b can prevent material from flowing out of the condensing lens 4 during the manufacturing process.

[0158] In practical applications, the inner edge of the first annular groove 5b is arranged around the bottom surface of the condensing lens 4, and there is a partial overflow structure in the first annular groove 5b. This overflow structure is connected to the condensing lens 4 and is formed by solidifying the material used to make the condensing lens 4.

[0159] It should be noted that the overflow structure is not shown in the figure for ease of illustration.

[0160] To facilitate the formation of the first annular groove 5b on the top surface of the cofferdam 5, the thickness of the top surface of the cofferdam 5 is typically greater than 0.21 mm. In this embodiment, the thickness of the top surface of the cofferdam 5 is the minimum wall thickness of the cofferdam 5.

[0161] For example, the depth of the first annular groove 5b is 0.04mm-0.06mm.

[0162] For light-emitting devices where the thickness of the top surface of the dam is less than or equal to 0.21 mm, for example, for small-sized light-emitting devices where the thickness of the top surface of the dam is around 0.1 mm, it is difficult to set an annular groove on the top surface of the dam. In this case, a groove can be formed on the top surface of the encapsulation part 3 first, and then a focusing lens 4 can be formed on the bottom surface of the groove.

[0163] Figure 19 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. As shown in Figure 19, the difference between this device and the one shown in Figure 1 is that in Figure 1, the top surface of the encapsulation part 3 is basically flush with the top surface of the dam 5, and the inner wall of the mounting groove and the top surface of the encapsulation structure constitute the light-emitting area 3a; while in Figure 19, the top surface of the encapsulation part 3 has a first groove 3b, that is, each encapsulation structure has a first groove on its top surface, and each first groove 3b has a light-emitting area 3a on its bottom surface. A condensing lens 4 is disposed in the first groove 3b, and at least a portion of the condensing lens 4 is located within the first groove 3b. It should be noted that the number of first grooves 3b is the same as the number of mounting grooves, and each mounting groove contains one first groove 3b.

[0164] In this embodiment, the projection of the condenser lens 4 onto the carrier surface 1a is located within the projection of the top surface of the encapsulation structure onto the carrier surface 1a. Therefore, the projection area of ​​the condenser lens 4 onto the top surface of the encapsulation structure is the light-emitting area 3a.

[0165] Optionally, the depth of the first groove 3b is 50μm-100μm.

[0166] In the embodiment shown in Figure 19, the bottom surface of the first groove 3b is a plane, and the shape and size of the bottom surface of the first groove 3b match the shape and size of the bottom surface of the condenser lens 4 so as to form the condenser lens 4 in the first groove 3b. For example, if the outer contour of the bottom surface of the condenser lens 4 is circular, then the shape of the bottom surface of the first groove 3b is circular, and its size is substantially the same as the size of the bottom surface of the condenser lens 4.

[0167] In Figure 19, the highest point of the top surface of the condenser lens 4 is higher than the top surface of the dam 5 to facilitate the fabrication and inspection of the condenser lens 4. In other embodiments, the highest point of the top surface of the condenser lens 4 may be flush with or lower than the top surface of the dam 5.

[0168] Figure 20 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. As shown in Figure 20, the difference from the embodiment shown in Figure 19 is that the top surface of the encapsulation part 3 has a first groove 3b, the bottom of the first groove 3b has a second annular groove 3c, and the second annular groove 3c extends along the edge of the bottom surface of the first groove 3b and forms a closed ring.

[0169] In this embodiment, the second annular groove 3c can be used to accommodate excess material during the fabrication of the condenser lens 4.

[0170] In practical applications, the inner edge of the second annular groove 3c is arranged around the bottom surface of the condensing lens 4, and there is a partial overflow structure in the second annular groove 3c. This overflow structure is connected to the condensing lens 4 and is formed by solidifying the material used to make the condensing lens 4.

[0171] It should be noted that the overflow structure is not shown in the figure for ease of illustration.

[0172] Optionally, the depth of the second annular groove 3c is 40μm-60μm. The width of the bottom surface of the second annular groove 3c can be 0.6μm-0.7μm, and the minimum distance between the edge of the second annular groove 3c and the edge of the second groove 3b is 0-0.7μm, for example, 0.6μm-0.7μm.

[0173] In this embodiment, the projection of the condenser lens 4 onto the carrier surface 1a is located within the projection of the top surface of the encapsulation structure onto the carrier surface 1a. Therefore, the projection area of ​​the condenser lens 4 onto the top surface of the encapsulation structure is the light-emitting area 3a.

[0174] Figure 21 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. The difference between this light-emitting device and the one shown in Figure 1 is that the light-emitting device in Figure 21 does not include the dam 5. The top surface of the encapsulation portion 3 has at least one second groove 3d, and the bottom surface of each second groove 3d has a light-emitting region 3a.

[0175] In the embodiment shown in Figure 21, the bottom surface of the second groove 3d is a light-emitting region 3a. Details regarding the bottom surface of the second groove 3d can be found in the description of the first groove 3b in Figure 19, and are omitted here.

[0176] For example, the depth of the second groove 3d can be 50μm-100μm. The depth of the second groove 3d can be set according to actual needs, and is usually slightly less than the maximum thickness of the condenser lens 4.

[0177] In this embodiment, since the light-emitting device does not include the dam 5, the condenser lens 4 will not extend beyond the top surface of the packaging structure. That is, the projection of the condenser lens 4 on the bearing surface 1a is located within the projection of the top surface of the packaging structure onto the bearing surface 1a. Therefore, the projection area of ​​the condenser lens 4 on the top surface of the packaging structure is the light-emitting area 3a.

[0178] In practice, multiple light-emitting structures 2 encapsulated by a package 3 are typically formed on a large substrate, and then the light-emitting device shown in Figure 21 is obtained by cutting. Due to the limitations of the manufacturing process of this type of light-emitting device, in order to make the structure and performance of multiple light-emitting devices similar, the angle between the outer wall of the package 3 and the bearing surface 1a is usually 90°.

[0179] Optionally, in this embodiment, the ratio of the maximum thickness of the condenser lens 4 to the reference size of the light-emitting area is 0.65-0.85. Within this ratio range, the luminous intensity of the light-emitting device is relatively high.

[0180] Optionally, the encapsulation portion 3 includes a bottom surface disposed opposite to the top surface of the encapsulation portion 3, and a side surface located between the top surface and the bottom surface.

[0181] In one possible implementation, the light-emitting device further includes a reflective layer located on the side of the package portion 3 to improve the front light emission intensity of the light-emitting device. Optionally, the reflective layer includes a metal reflective layer or a dielectric film reflective layer.

[0182] In another possible implementation, the reflective layer is not provided on the side of the encapsulation portion 3, meaning that the side of the encapsulation portion constitutes part of the outer contour of the light-emitting device. In this case, both the top and side surfaces of the light-emitting device can emit light.

[0183] In some examples, the light-emitting device is a five-sided light-emitting body, meaning that the top surface and four sides of the light-emitting device can emit light. When a condenser lens 4 is provided, the axial luminous intensity of the light-emitting device (i.e., the luminous intensity of the top surface) is significantly stronger than the luminous intensity of the four sides.

[0184] Figure 22 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. The difference from the light-emitting device shown in Figure 21 is that the bottom of the second groove 3d in Figure 22 has a third annular groove 3e, which extends along the edge of the bottom surface of the second groove 3d and forms a closed ring. Each third annular structure 3e is arranged around a condensing lens 4.

[0185] In this embodiment, the projection of the condenser lens 4 onto the carrier surface 1a is located within the projection of the top surface of the encapsulation structure onto the carrier surface 1a. Therefore, the projection area of ​​the condenser lens 4 onto the top surface of the encapsulation structure is the light-emitting area 3a.

[0186] For details regarding the third annular groove 3e, please refer to the aforementioned second annular groove 3c, which will not be described in detail here.

[0187] For example, the depth of the third annular groove 3e is 40μm-60μm. The width of the bottom surface of the third annular groove 3e can be 0.6μm-0.7μm, and the minimum distance between the third annular groove 3e and the edge of the second groove 3d is 0-0.7μm, for example, 0.6μm-0.7μm.

[0188] The light-emitting devices in Figures 21 and 22 can be called chip-type light-emitting devices.

[0189] The following tests were conducted on a 0707-sized chip-type light-emitting device, with a square light-emitting area having a side length of 0.6mm.

[0190] Figure 23 is a schematic diagram of the light pattern of the light-emitting device in Figure 22 when the angle of the groove wall in the annular groove is 90°. Figure 24 is a schematic diagram of the light pattern of the light-emitting device in Figure 22 when the angle of the groove wall in the annular groove is 100°. Figure 25 is a schematic diagram of the light pattern of the light-emitting device in Figure 22 when the angle of the groove wall in the annular groove is 110°. In Figures 23-25, the horizontal axis represents the viewing angle, and the vertical axis represents the normalized luminous intensity.

[0191] In Figure 23, curve 231 represents a light-emitting device using a condenser lens with a maximum thickness of 0.2 mm, curve 232 represents a light-emitting device using a condenser lens with a maximum thickness of 0.3 mm, curve 233 represents a light-emitting device using a condenser lens with a maximum thickness of 0.4 mm, curve 234 represents a light-emitting device using a condenser lens with a maximum thickness of 0.45 mm, curve 235 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, and curve 236 represents a light-emitting device using a condenser lens with a maximum thickness of 0.6 mm.

[0192] As shown in Figure 23, the luminous intensity continuously increases when the maximum thickness of the condenser lens increases to 0.45 mm, but decreases as the maximum thickness of the condenser lens continues to increase. The luminous intensity is highest when the maximum thickness of the condenser lens is between 0.4 mm and 0.5 mm.

[0193] In Figure 24, curve 241 represents a light-emitting device using a condenser lens with a maximum thickness of 0.2 mm, curve 242 represents a light-emitting device using a condenser lens with a maximum thickness of 0.3 mm, curve 243 represents a light-emitting device using a condenser lens with a maximum thickness of 0.4 mm, curve 244 represents a light-emitting device using a condenser lens with a maximum thickness of 0.45 mm, curve 245 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, curve 246 represents a light-emitting device using a condenser lens with a maximum thickness of 0.55 mm, and curve 247 represents a light-emitting device using a condenser lens with a maximum thickness of 0.6 mm.

[0194] As shown in Figure 24, the luminous intensity continuously increases when the maximum thickness of the condenser lens increases to 0.4 mm, but decreases as the maximum thickness of the condenser lens continues to increase. The luminous intensity is highest when the maximum thickness of the condenser lens is between 0.4 mm and 0.5 mm.

[0195] In Figure 26, curve 261 represents a light-emitting device without a condenser lens, curve 262 represents a light-emitting device using a condenser lens with a maximum thickness of 0.15 mm, curve 263 represents a light-emitting device using a condenser lens with a maximum thickness of 0.25 mm, curve 264 represents a light-emitting device using a condenser lens with a maximum thickness of 0.35 mm, curve 265 represents a light-emitting device using a condenser lens with a maximum thickness of 0.4 mm, curve 266 represents a light-emitting device using a condenser lens with a maximum thickness of 0.45 mm, curve 267 represents a light-emitting device using a condenser lens with a maximum thickness of 0.5 mm, and curve 268 represents a light-emitting device using a condenser lens with a maximum thickness of 0.55 mm.

[0196] As shown in Figure 26, the luminous intensity continuously increases when the maximum thickness of the condenser lens increases to 0.5 mm, but decreases with further increases in the maximum thickness. The luminous intensity is highest when the maximum thickness of the condenser lens is between 0.4 mm and 0.5 mm. The ratio range corresponding to 0.4 mm - 0.5 mm is basically consistent with that of 0.65 - 0.85.

[0197] Furthermore, as can be seen from Figures 23-25, the angle of the annular groove wall has little effect on the light emission effect of the light-emitting device and can be ignored.

[0198] Figure 26 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. The difference between the light-emitting device shown in Figure 1 and the light-emitting device shown in Figure 26 is that the light-emitting device further includes a first reflective layer 6, which is located between the condensing lens 4 and the encapsulation part 3. The first reflective layer 6 is used to reduce the light emission angle of the light-emitting structure 2.

[0199] By setting a first reflective layer 6 between the condensing lens 4 and the encapsulation part 3, the light emitted from the light-emitting structure 2 passes through the first reflective layer 6 before entering the condensing lens 4, which can further reduce the light emission angle of the light-emitting device.

[0200] Optionally, the first reflective layer 6 has one or more slits, and the light emission angle of the light-emitting structure can be reduced by setting the slits.

[0201] Figure 27 is a schematic diagram of the structure of the first reflective layer. As shown in Figure 27, optionally, the first reflective layer 6 has only one slit 6a, and the center of the bottom surface of the condenser lens 4 is located in the slit 6a.

[0202] Figure 28 is a schematic diagram of another type of first reflective layer. As shown in Figure 28, the first reflective layer 6 has multiple parallel slits 6a, and the center of the bottom surface of the focusing lens 4 is located in one of the slits 6a. The widths of any two slits 6a can be the same or different. For example, the first reflective layer 6 has three parallel slits 6a, with the width of the middle slit 6a being greater than the widths of the two side slits 6a.

[0203] Optionally, when the first reflective layer 6 has only one slit 6a, the width of the slit 6a is greater than or equal to 0.1 mm and smaller than the size of the light-emitting region 3a where the condenser lens 4 is located in the width direction of the slit 6a.

[0204] Optionally, when the first reflective layer 6 has only one slit 6a, the width of the slit 6a is greater than or equal to one-third of the size of the light-emitting region 3a where the condenser lens 4 is located in the width direction of the slit 6a and less than the size of the light-emitting region 3a where the condenser lens 4 is located in the width direction of the slit 6a.

[0205] In some examples, when the first reflective layer 6 has only one slit 6a, the width of the slit 6a is greater than or equal to half the size of the light-emitting region 3a where the condenser lens 4 is located in the width direction of the slit 6a and less than the size of the light-emitting region 3a where the condenser lens 4 is located in the width direction of the slit 6a.

[0206] With the outer contour of the light-emitting region 3a being square and having a side length of 0.84 mm, the luminous intensity and luminous angle of the light-emitting device were simulated when there was no first reflective layer and when the first reflective layer had a single slit with a slit width of 0.1 mm to 0.6 mm, respectively, resulting in Figure 29.

[0207] In part (a) of Figure 29, the horizontal axis represents the emission angle, and the vertical axis represents the emission intensity. The emission angle corresponding to an emission intensity of 0.5 is the emission angle of the light-emitting device. Curve 291 represents a light-emitting device without a first reflective layer, curve 292 represents a light-emitting device with a slit width of 0.6 mm in the first reflective layer, curve 293 represents a light-emitting device with a slit width of 0.5 mm in the first reflective layer, curve 294 represents a light-emitting device with a slit width of 0.4 mm in the first reflective layer, curve 295 represents a light-emitting device with a slit width of 0.3 mm in the first reflective layer, curve 296 represents a light-emitting device with a slit width of 0.2 mm in the first reflective layer, and curve 297 represents a light-emitting device with a slit width of 0.1 mm in the first reflective layer.

[0208] As can be seen from part (a) of Figure 29, the smaller the slit width, the narrower the emission angle, and the correspondingly narrower the viewing angle.

[0209] In part (b) of Figure 29, the horizontal axis represents the slit width, and the vertical axis represents the luminous intensity. As can be seen from part (b) of Figure 29, the larger the slit width, the greater the luminous intensity.

[0210] With the outer contour of the light-emitting area being square and having a side length of 1.32 mm, the luminous intensity and luminous angle of the light-emitting device were simulated for the cases without a slit and with a single slit in the first reflective layer having a slit width of 0.1 mm to 0.9 mm, respectively, as shown in Figure 30.

[0211] In part (a) of Figure 30, the horizontal axis represents the emission angle, and the vertical axis represents the emission intensity. The emission angle corresponding to an emission intensity of 0.5 is the emission angle of the light-emitting device. Curve 301 represents a light-emitting device without a first reflective layer, curve 302 represents a light-emitting device with a slit width of 0.9 mm in the first reflective layer, curve 303 represents a light-emitting device with a slit width of 0.7 mm in the first reflective layer, curve 304 represents a light-emitting device with a slit width of 0.5 mm in the first reflective layer, curve 305 represents a light-emitting device with a slit width of 0.3 mm in the first reflective layer, and curve 306 represents a light-emitting device with a slit width of 0.1 mm in the first reflective layer.

[0212] As can be seen from part (a) of Figure 30, the smaller the slit width, the narrower the emission angle, and the correspondingly narrower the viewing angle.

[0213] In part (b) of Figure 30, the horizontal axis represents the slit width, and the vertical axis represents the luminous intensity. It can be seen from part (b) of Figure 30 that the larger the slit width, the greater the luminous intensity. Part (b) also shows that when the slit width is greater than or equal to one-third of the side length of the light-emitting region, the luminous intensity is relatively high; when the slit width is greater than or equal to one-half of the side length of the light-emitting region, the luminous intensity approaches 100%.

[0214] It is evident that a narrower slit is beneficial for reducing the viewing angle, but may lead to insufficient light intensity; while a larger slit has less impact on luminous intensity, but weaker light-gathering effect, which is not conducive to reducing the viewing angle. Therefore, an appropriate slit width can be selected within the above range as needed.

[0215] With narrow slits, narrower viewing angles, and reduced brightness, light-emitting devices can be used in applications with low brightness and small viewing angles, such as high-end cinemas and virtual reality (VR) devices.

[0216] Optionally, the first reflective layer can be a dielectric film reflective layer. The dielectric film reflective layer may include alternating layers of high refractive index and low refractive index. The materials of the high refractive index layer and the low refractive index layer can be selected according to actual needs, and this disclosure does not limit them.

[0217] Figure 31 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. The difference between the light-emitting device shown in Figure 15 and the light-emitting device shown in Figure 31 is that the light-emitting device further includes an optical correction layer 7, which covers the surface of at least one light-emitting chip away from the support portion 1 and is used to improve the axial light emission intensity of the light-emitting chip.

[0218] In Figure 31, the optical correction layer 7 covers the surface of each light-emitting chip that is away from the support portion 1. In other embodiments, the optical correction layer 7 may cover only a portion of the surface of the light-emitting chip that is away from the support portion 1.

[0219] Optionally, the optical correction layer 7 is a photonic crystal layer. The photonic crystal layer can control the propagation direction of the light emitted by the light-emitting chip through periodic nanostructures. By utilizing effects such as Bragg diffraction, photonic band gap, and mode coupling, more light can be guided to the axial direction (e.g., guiding the lateral light emitted by the light-emitting chip to the axial direction), thereby improving the axial luminous intensity of the light-emitting chip.

[0220] A photonic crystal layer is a structure formed by arranging two or more materials with different dielectric constants (refractive indices) in a periodic order in space. In its implementation, a medium material with appropriate refractive index and optical properties can be selected based on the different wavelengths of red, blue, and green light, and a background material with a significantly different refractive index can be chosen to form the periodic structure of the photonic crystal. The larger the ratio of the dielectric constants of the two media, the stronger the Bragg diffraction, and the more likely a photonic bandgap will appear.

[0221] This disclosure does not limit the specific types of dielectric and background materials; any materials from related technologies can be used, as long as they can increase the axial luminous intensity of the attached light-emitting chip. In this disclosure, axial luminous intensity refers to the luminous intensity in the direction perpendicular to the bearing surface.

[0222] It should be noted that the optical correction layer 7 can be combined with the light-emitting chip in the light-emitting device in any of the aforementioned figures.

[0223] Figure 32 is a schematic diagram of another light-emitting device provided in an embodiment of this disclosure. The difference between this light-emitting device and the one shown in Figure 15 is that, in Figure 32, the light-emitting device further includes a second reflective layer 8, which covers the outer peripheral wall of at least one light-emitting chip.

[0224] In Figure 32, the second reflective layer 8 covers the outer peripheral wall of each light-emitting chip. In other embodiments, the second reflective layer 8 may only cover a portion of the outer peripheral wall of the light-emitting chip.

[0225] Optionally, the second emitting layer 8 also covers the edge of the surface of the light-emitting chip away from the carrier surface (i.e., the top surface of the light-emitting chip) and defines an opening so that the light emitted by the light-emitting chip can be emitted from the opening. That is, the second reflective layer 8 includes an annular portion located at the edge of the top surface of the light-emitting chip and a cylindrical portion located on the outer peripheral wall of the light-emitting chip, with one end of the cylindrical portion connected to the outer edge of the annular portion.

[0226] For example, the other end of the cylindrical portion is located at the bottom surface of the light-emitting chip. That is, the second reflective layer 8 covers the entire outer peripheral wall of the light-emitting chip.

[0227] The second reflective layer 8 can be a distributed Bragg reflection (DBR) layer, which includes alternating layers of high-refractive-index and low-refractive-index layers. The materials of the high-refractive-index and low-refractive-index layers can be selected according to actual needs, and this disclosure does not limit this.

[0228] By setting a second reflective layer on the outer wall of the light-emitting chip, the forward light emission efficiency of the light-emitting chip can be improved, thereby improving the light emission efficiency of the light-emitting device.

[0229] It should be noted that the second reflective layer 8 can be combined with the light-emitting chip in the light-emitting device in any of the aforementioned figures.

[0230] This disclosure also provides a light-emitting substrate, which includes a plurality of light-emitting devices arranged in an array. The light-emitting devices are any of the aforementioned light-emitting devices. The carrier portions of the plurality of light-emitting devices are connected to form a substrate, and the encapsulation portions 3 of the plurality of light-emitting devices are arranged at intervals.

[0231] Figure 33 is a schematic diagram of a light-emitting substrate provided in an embodiment of this disclosure. As shown in Figure 33, the light-emitting substrate includes three light-emitting devices 10, and the support portions 1 of the three light-emitting devices 10 are connected to form a substrate. Figure 33 illustrates the light-emitting device 10 as an example of the light-emitting device in Figure 22 above, but it can be replaced with any of the aforementioned light-emitting devices.

[0232] Optionally, the light-emitting substrate can be used in lighting devices or display devices.

[0233] This disclosure also provides another light-emitting substrate, which includes a substrate and a plurality of light-emitting devices arranged in an array on the substrate. The light-emitting devices can be any of the aforementioned light-emitting devices.

[0234] In one possible implementation, the light-emitting substrate is a backlight panel or a display substrate. In this case, the light-emitting substrate can be used in a display device.

[0235] In another possible implementation, the light-emitting substrate is applied to a lighting device.

[0236] This disclosure also provides a display device, which includes any of the aforementioned display substrates and a power supply, wherein the display substrate is electrically connected to the power supply.

[0237] This disclosure also provides another display device, which includes any of the aforementioned light-emitting substrates and a liquid crystal display panel, wherein the light-emitting substrate is a backlight panel and the liquid crystal display panel is located on the light-emitting side of the light-emitting substrate.

[0238] Optionally, the display device can be any product or component with display function, such as a laptop, mobile phone, tablet, television, monitor, wearable device, or navigator.

[0239] This disclosure also provides a method for fabricating a light-emitting device, which can be used to prepare any of the aforementioned light-emitting devices. Figure 34 is a schematic flowchart of a method for fabricating a light-emitting device provided in this disclosure. As shown in Figure 34, the fabrication method includes:

[0240] In S341, a light-emitting structure is formed on the bearing surface of the bearing part.

[0241] In S342, an encapsulation portion is formed on the bearing surface, and the encapsulation portion encapsulates the light-emitting structure.

[0242] The encapsulation part includes at least one encapsulation structure, and each encapsulation structure has a light-emitting area on its top surface. The top surface of the encapsulation structure is the surface of the encapsulation structure that is away from the carrier part.

[0243] In S343, at least one focusing lens is formed on the top surface of the package portion.

[0244] Each condenser lens is located on the side of a light-emitting area away from the light-emitting structure. Each condenser lens is connected to the top surface of a packaging structure. The light-emitting area is the projection area of ​​the condenser lens onto the top surface of the packaging structure, or the light-emitting area is the top surface of the packaging structure where the condenser lens is located.

[0245] Each condenser lens has an arcuate surface that convexes away from the light-emitting structure, wherein the ratio of the maximum thickness of the condenser lens to the reference dimension of the light-emitting region is 0.5-1.1. When the outer contour of the light-emitting region is rectangular, the reference dimension is the side length of one side of the rectangle; or, when the outer contour of the light-emitting region is elliptical, the reference dimension is the semi-major axis or semi-minor axis of the ellipse. Multiples; or, when the outer contour of the emitted light region is circular, the reference size is the radius of the circle. times.

[0246] Optionally, when the light-emitting device also includes a dam, the method further includes, prior to step S341, forming a dam on the bearing surface such that the dam and the bearing surface define at least one mounting groove.

[0247] Figure 35 is a schematic diagram of the fabrication process of a light-emitting device according to an embodiment of this disclosure. This process can be used to fabricate the light-emitting device shown in Figure 19 above. As shown in Figure 35, firstly, a dam 5 is provided on the bearing surface 1a of the bearing portion 1 to form a mounting groove. Multiple light-emitting chips are sequentially die-bonded in the mounting groove to form a light-emitting structure 2, and the light-emitting chips are encapsulated by an encapsulation portion 3. Then, a first groove 3b is etched on the top surface of the encapsulation portion 3. Next, a focusing lens 4 is formed in the first groove 3b. Finally, a single light-emitting device is fabricated through cutting and trimming processes.

[0248] Figure 36 is a schematic diagram of the fabrication process of another light-emitting device provided in this embodiment of the present disclosure. This process can be used to fabricate the light-emitting device shown in Figure 20 above. As shown in Figure 36, firstly, a dam 5 is provided on the bearing surface 1a of the bearing portion 1 to form a mounting groove. Multiple light-emitting chips are sequentially die-bonded in the mounting groove to form a light-emitting structure 2. The light-emitting chips are then encapsulated by an encapsulation portion 3. The top surface of the encapsulation portion 3 is lower than the top surface of the dam 5 (for example, it can be 20 μm higher than the top surface of the light-emitting chip). Then, a first groove 3b is etched on the top surface of the encapsulation portion 3, and a second annular groove 3c is etched on the bottom surface of the first groove 3b. Next, a focusing lens 4 is formed in the first groove 3b. Finally, a single light-emitting device is fabricated by cutting and trimming processes.

[0249] Figure 37 is a schematic diagram of the fabrication process of another light-emitting device provided in this embodiment. This process can be used to fabricate the light-emitting device shown in Figure 22 above. As shown in Figure 37, firstly, multiple light-emitting chips are sequentially die-bonded on the carrier surface 1a of the carrier portion 1 to form multiple light-emitting structures 2 (only three light-emitting chips in one light-emitting structure 2 are shown in Figure 37); then, the light-emitting chips are encapsulated using an encapsulation portion 3; a second groove 3d is etched on the top surface of the encapsulation portion 3, and a third annular groove 3e is etched on the bottom surface of the second groove 3d; then, a focusing lens 4 is formed in the second groove 3d; finally, a single light-emitting device is fabricated through cutting and trimming processes.

[0250] For example, the packaging unit 3 can be used to package the light-emitting chip using processes such as dispensing or film pressing.

[0251] Optionally, during the above preparation process, after the condensing lens 4 is formed in the first groove 3c or the second groove 3d, the difference in height (i.e. the maximum thickness difference) can be used to control the rejection of unqualified products.

[0252] The above description is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A light-emitting device, comprising: The light-emitting structure includes a carrier, a light-emitting structure, an encapsulation part, and at least one focusing lens. The light-emitting structure is located on the bearing surface of the bearing portion; The encapsulation portion is located on the support surface and encapsulates the light-emitting structure. The encapsulation portion includes at least one encapsulation structure. Each encapsulation structure has a light-emitting area on its top surface. The top surface of the encapsulation structure is the surface of the encapsulation structure that is away from the support portion. Each of the condensing lenses is located on the side of a light-emitting area away from the light-emitting structure, and each of the condensing lenses is connected to the top surface of a packaging structure. The light-emitting area is the projection area of ​​the condensing lens on the top surface of the packaging structure, or the light-emitting area is the top surface of the packaging structure where the condensing lens is located. The condensing lens has an arcuate surface that convexes away from the light-emitting structure, wherein the ratio of the maximum thickness of the condensing lens to the reference size of the light-emitting region is 0.5-1.1; The outer contour of the light-emitting region is rectangular, and the reference dimension is the side length of one side of the rectangle; or, the outer contour of the light-emitting region is elliptical, and the reference dimension is the semi-major axis or semi-minor axis of the ellipse. Alternatively, the outer contour of the light-emitting area is circular, and the reference dimension is a multiple of the radius of the circle. times.

2. The light-emitting device according to claim 1, characterized in that, It also includes a dam, which is connected to the support portion and defines at least one mounting groove with the support surface of the support portion, wherein the encapsulation portion and the light-emitting structure are located in the at least one mounting groove.

3. The light-emitting device according to claim 2, characterized in that, The angle between the sidewall of the mounting groove and the bearing surface is in the range of 90°-110°.

4. The light-emitting device according to claim 2, characterized in that, The angle between the sidewall of the mounting groove and the bearing surface is 90°±2°, and the corresponding ratio is 0.9-1.1; or, the angle between the sidewall of the mounting groove and the bearing surface is 100°±2°, and the corresponding ratio is 0.6-0.9; or, the angle between the sidewall of the mounting groove and the bearing surface is 110°±2°, and the corresponding ratio is 0.5-0.

7.

5. The light-emitting device according to claim 2, characterized in that, The angle between the sidewall of the mounting groove and the bearing surface and the corresponding ratio satisfy the following formula: y = y0 - B × (α - 90) Where y is the ratio, α is the included angle, y0 ranges from 0.9 to 1.1, and B ranges from 0.02 to 0.

04.

6. The light-emitting device according to any one of claims 2-5, characterized in that, The dam has a top surface on the side away from the bearing portion, and the top surface of the dam has at least one first annular groove, each of the first annular grooves being arranged around one of the mounting slots.

7. The light-emitting device according to any one of claims 2-5, characterized in that, The top surface of the encapsulation portion has at least one first groove, the condensing lens is at least partially located in the first groove, and the bottom surface of each first groove has a light-emitting area.

8. The light-emitting device according to claim 7, characterized in that, The thickness of the top surface of the dam is less than or equal to 0.21 mm.

9. The light-emitting device according to claim 7, characterized in that, The bottom of the first groove has a second annular groove, which extends along the edge of the bottom surface of the first groove and forms a closed ring.

10. The light-emitting device according to claim 1, characterized in that, The top surface of the encapsulation portion has at least one second groove, the condensing lens is at least partially located within the second groove, and the bottom surface of each second groove has a light-emitting area.

11. The light-emitting device according to claim 10, characterized in that, The bottom of the second groove has a third annular groove, which extends along the edge of the bottom surface of the second groove and forms a closed ring.

12. The light-emitting device according to claim 10, characterized in that, The encapsulation portion includes a bottom surface disposed opposite to the top surface of the encapsulation portion, and a side surface located between the top surface and the bottom surface, the side surface forming part of the outer contour of the light-emitting device.

13. The light-emitting device according to any one of claims 10-12, characterized in that, The ratio is 0.65-0.

85.

14. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The center of the bottom surface of the condenser lens coincides with the center of the light-emitting area.

15. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The light-emitting structure includes a light-emitting chip or a plurality of light-emitting chips spaced apart on the bearing surface, and the orthographic projection of each condenser lens on the bearing surface includes the orthographic projection of at least one of the light-emitting chips on the bearing surface.

16. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The light-emitting structure includes a plurality of light-emitting chips spaced apart on the support surface. The plurality of light-emitting chips include a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip. The orthographic projections of the red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip on the support surface are located inside the orthographic projection of the same condenser lens on the support surface. Alternatively, the orthographic projections of the red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip on the support surface are respectively located inside the orthographic projection of a condensing lens on the support surface; Alternatively, the orthographic projection of the red light-emitting chip on the support surface is located inside the orthographic projection of a condenser lens on the support surface, and the orthographic projections of the blue and green light-emitting chips on the support surface are located inside the orthographic projection of another condenser lens on the support surface.

17. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, Also includes: A first reflective layer is located between the condensing lens and the encapsulation portion, and the first reflective layer is used to reduce the light emission angle of the light-emitting structure.

18. The light-emitting device according to claim 17, characterized in that, The first reflective layer has only one slit, and the center of the bottom surface of the condensing lens is located in the slit, or... The first reflective layer has multiple parallel slits, and the center of the bottom surface of the focusing lens is located in one of the multiple slits.

19. The light-emitting device according to claim 18, characterized in that, The width of the slit is greater than or equal to 0.1 mm and smaller than the size of the light-emitting area where the condenser lens is located in the width direction of the slit.

20. The light-emitting device according to claim 15, characterized in that, The light-emitting structure also includes A second reflective layer, wherein the second reflective layer covers at least one of the outer peripheral walls of the light-emitting chip.

21. The light-emitting device according to claim 15, characterized in that, The light-emitting structure further includes an optical correction layer that covers at least one surface of the light-emitting chip away from the support portion, and the optical correction layer is used to increase the axial light emission intensity of the light-emitting chip.

22. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The encapsulation part is made of epoxy resin or silicone; and / or, The material of the focusing lens includes epoxy resin or silicone.

23. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The refractive index of the encapsulation portion is between 1.4 and 1.6; and / or, The refractive index of the condenser lens is between 1.4 and 1.

6.

24. The light-emitting device according to any one of claims 1-5 and 10-12, characterized in that, The light-emitting area is square.

25. A light-emitting substrate, characterized in that, It includes a plurality of light-emitting devices arranged in an array, wherein the light-emitting devices are the light-emitting devices according to any one of claims 1 to 24, wherein the carrier portions of the plurality of light-emitting devices are connected to form a substrate and the encapsulation portions of the plurality of light-emitting devices are arranged at intervals, or, It includes a substrate and a plurality of light-emitting devices arranged in an array on the substrate, wherein the light-emitting devices are the light-emitting devices according to any one of claims 1 to 24.

26. A display device, characterized in that, Includes the light-emitting substrate of claim 25, wherein the light-emitting substrate is a display substrate, or, The display device includes the light-emitting substrate as described in claim 25, wherein the light-emitting substrate is a backlight panel, and the display device further includes a liquid crystal display panel located on the light-emitting side of the light-emitting substrate.

Images