Carrying device and gas supply method

Abstract

The present invention relates to a carrier device and a gas supply method, and is a carrier device that carries in and out a substrate to and from a processing device that processes the substrate, and has a main body portion that has a carrying space that provides a carrying robot that carries the substrate, and a storage space that is connected to the carrying space and supports the substrate. The main body portion has a first fan filter unit that is disposed above the carrying space and sends out a gas supplied to the carrying space, a second fan filter unit that is disposed separately from the first fan filter unit and sends out a gas supplied to the storage space, a gas supply passage that supplies the gas sent out from the second fan filter unit to the storage space, and an exhaust passage that exhausts the gas supplied to the storage space.

Description

Technical Field

[0001] This disclosure relates to a handling device and a gas supply method. Background Technology

[0002] Patent document 1 discloses an EFEM (Equipment Front End Module) device for transferring transported items between a transport robot located inside a housing and a processing device.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-22095

[0004] A semiconductor manufacturing apparatus includes a processing unit and a transport unit for handling substrates. The transport unit includes an EFEM device for transferring transported items such as substrates or consumable components (e.g., focusing rings) between the processing unit and the transport unit using a transport robot housed inside a housing; and a load port connected to the EFEM device for holding containers that house the substrates or consumable components. In this transport unit, gas is delivered from a fan filter unit (FFU) located above the transport space, forming a downward airflow, i.e., a downflow.

[0005] Sometimes, a storage space is provided that is connected to and supports the substrate in the transport space where the transport robot is located. In this case, for example, since corrosive gases are generated from the substrate supported in the storage space, it is necessary to form an airflow along the substrate.

[0006] However, in order to create such an airflow in the storage space, if the storage space is vented and a portion of the gas sent from the FFU to the transport space is used to create an airflow in the storage space, the amount of airflow sent from the FFU that is consumed for the airflow in the storage space will increase relatively.

[0007] Furthermore, in order to effectively capture particles originating from handling robots, it is generally desirable to form a uniform downward flow with a desired flow rate within the handling space of the EFEM device. However, when airflow is formed in the storage space, it may be difficult to form a relatively uniform downward flow within the handling space for the reasons mentioned above.

[0008] In addition, while increasing the air supply capacity of the FFU is also considered, in this case, it may lead to larger FFUs or an unnecessary increase in the intensity of the downflow in the transport space. Summary of the Invention

[0009] Therefore, the technology disclosed herein provides a transport device and a gas supply method that can form an appropriate airflow in both the transport space and the storage space adjacent to the transport space in a transport device for transporting substrates into and out of the processing apparatus for the processing substrate.

[0010] One aspect of this disclosure is a handling device for moving substrates in and out of a processing apparatus for processing substrates, comprising a main body, the main body having: a handling space for housing a handling robot for handling the substrates; and a storage space connected to the handling space and supporting the substrates. The main body includes: a first fan filter unit disposed above the handling space and supplying gas to the handling space; a second fan filter unit disposed separately from the first fan filter unit and supplying gas to the storage space; a gas supply passage for supplying gas from the second fan filter unit to the storage space; and an exhaust passage for discharging gas supplied to the storage space.

[0011] According to this disclosure, in a transport apparatus for moving substrates into and out of a processing apparatus for processing substrates, a suitable airflow can be formed in both the transport space and the storage space adjacent to the transport space. Attached Figure Description

[0012] Figure 1 A top view showing an outline of a wafer processing system equipped with the handling apparatus according to the first embodiment.

[0013] Figure 2 It is a side sectional view of the conveying device.

[0014] Figure 3 It is a side sectional view of the conveying device.

[0015] Figure 4 It is a side sectional view of the conveying device.

[0016] Figure 5 This is a top view of the main body.

[0017] Figure 6 It is a frontal sectional view of the conveying device.

[0018] Figure 7 This is a perspective view of the lower part of one end of the main body in the width direction of the device.

[0019] Figure 8 This is a cross-sectional view of the load port.

[0020] Figure 9 This is a side view of the rear of the load port.

[0021] Figure 10 This is a front view of the transport robot.

[0022] Figure 11 It is a three-dimensional sectional view used to illustrate the storage space.

[0023] Figure 12It is a three-dimensional diagram used to illustrate the components configured in the storage space.

[0024] Figure 13 This is a side view of the storage space side of the flow path forming component.

[0025] Figure 14 This is a partially enlarged side view of the storage space side of the rear column component.

[0026] Figure 15 It is a diagram used to illustrate the relationship between the air supply side and the exhaust side.

[0027] Figure 16 It is a diagram used to illustrate the relationship between the air supply side and the exhaust side.

[0028] Figure 17 This is an enlarged side view of the lower rear part of the conveying device.

[0029] Figure 18 This is a bottom view of the conveying device.

[0030] Figure 19 This is a side cross-sectional view of the conveying device according to the second embodiment.

[0031] Figure 20 yes Figure 19 A magnified view of a portion of the image.

[0032] Figure 21 This is a frontal cross-sectional view of the conveying device according to the second embodiment.

[0033] Figure 22 This is an exploded view of the auxiliary exhaust box. Detailed Implementation

[0034] Hereinafter, the conveying device according to this embodiment will be described with reference to the accompanying drawings. Furthermore, in this specification and the drawings, elements having substantially the same functional configuration are labeled with the same symbols and repeated descriptions are omitted. In the drawings, the X direction is the direction in which a pair of side surfaces 123a of the main body 102 of the conveying device 20 (described later) are arranged side-by-side, and is also the direction in which multiple load ports 101 are arranged side-by-side; that is, the device width direction (described later). The Y direction is the direction in which the front 121a and rear 122a of the main body 102 of the conveying device 20 (described later) are arranged side-by-side; that is, the device depth direction, with the negative side of the Y direction being the front side and the positive side of the Y direction being the rear side. The Z direction is the vertical direction, i.e., the height direction.

[0035] (First Implementation)

[0036] <Wafer Processing System 1>

[0037] Figure 1 This is a top view showing an outline of the wafer processing system 1 equipped with the handling device 20 according to the first embodiment.

[0038] like Figure 1 As shown, the wafer processing system 1 includes a processing unit 10 and a transport unit 20. The processing unit 10 and the transport unit 20 are arranged adjacent to each other.

[0039] The processing apparatus 10 is an apparatus for processing a semiconductor wafer (hereinafter referred to as "wafer") W, which serves as a substrate, and includes, for example, a processing module 30 and a vacuum transport module 40.

[0040] For example, multiple processing modules 30 are provided. Each processing module 30 processes the wafer W under a reduced pressure atmosphere, i.e., a vacuum atmosphere. The processing modules 30 perform processes such as film deposition, etching, and impurity diffusion. In addition, each processing module 30 has a vacuum processing chamber 31 in which the above-mentioned processes are performed on the wafer W under a vacuum atmosphere. Each vacuum processing chamber 31 is connected to the vacuum transport chamber 41 of the vacuum transport module 40 (described later) via a gate valve G1.

[0041] The vacuum transport module 40 has a vacuum transport chamber 41 maintained in a vacuum atmosphere. The vacuum transport chamber 41 is configured to be hermetically sealable, for example, formed as a generally polygonal shape (quadrilateral in the illustration) when viewed from above. The vacuum transport chamber 41, connected to each processing module 30, is also connected to the load locking module 50, described later. Specifically, the vacuum transport chamber 41 is connected to the load locking module 50's load locking chamber 51 (described later) via a gate valve (not shown). A transport mechanism 42 for transporting wafers W is provided within the vacuum transport chamber 41. The vacuum transport module 40 uses the transport mechanism 42 to move wafers W between the vacuum processing chamber 31 and the load locking chamber 51.

[0042] Furthermore, in the processing device 10, a load locking module 50 is provided at the end on the side of the conveying device 20. For example, multiple load locking modules 50 are provided.

[0043] Each load locking module 50 is used to transfer the wafer W between a vacuum atmosphere and a non-reduced pressure atmosphere, i.e., an atmospheric pressure atmosphere. Each load locking module 50 has a load locking chamber 51 configured to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load locking chamber 51 is configured to connect the vacuum transport module 40 and the transport device 20.

[0044] The transport device 20 is used to move wafers W into and out of the processing device 10. Specifically, the transport device 20 is configured to transfer wafers W between the container holding multiple wafers W, namely the FOUP (Front-Opening Unified Pod) 2000, and the processing device 10 without exposing them to the external atmosphere. The transport device 20 has a load port 101 and a main body 102, also referred to as an EFEM device.

[0045] The load port 101 is configured to accommodate FOUP2000, for example, multiple FOUP2000s are arranged along the width direction (X direction) of the device (five in the example).

[0046] The main body 102 is disposed on the rear side (positive side in the Y direction) of the load port 101. Specifically, the main body 102 is configured to be adjacent to the load port 101 on the rear side. Additionally, a load locking chamber 51 is connected to the main body 102; specifically, for example, a load locking chamber 51 is connected to its rear side (positive side in the Y direction). The interior of the main body 102 is at atmospheric pressure.

[0047] The main body 102 includes a housing 120 that forms a transport space S1 in which a transport robot 110 is provided to support and transport the wafer W. The number of transport robots 110 provided in the transport space S1 is one. The transport robot 110 enables the transfer of the wafer W between the FOUP 2000 placed at the load port 101 and the load locking chamber 51.

[0048] Additionally, the main body 102 has a storage space S11 connected to the transport space S1 and supporting the wafer W. In this embodiment, the storage space S11 is connected to the rear side (positive side in the Y direction) of the transport space S1. Specifically, the storage space S11 is connected to the rear side of each of the two ends in the device width direction (X direction) of the transport space S1. The storage space S11 and the transport space are covered by the housing 120 together.

[0049] In addition, the storage space S11 is configured to accommodate multiple wafers W, for example, to accommodate more than the number of wafers W accommodated by FOUP2000.

[0050] In the wafer processing system 1 described above, at least one control device C is provided. The control device C processes computer-executable instructions that cause the wafer processing system 1 to execute the various processes described herein. The control device C may be configured to control various elements of the wafer processing system 1 to execute the various processes described herein. In one embodiment, part or all of the control device C may be included in the wafer processing system 1. The control device C may include a processing unit, a storage unit, and a communication interface. The control device C is implemented, for example, by a computer. The processing unit may read a program from the storage unit that provides logic or routines capable of performing various control actions, and perform various control actions by executing the read program. The program may be pre-stored in the storage unit or retrieved via a medium when needed. The retrieved program is stored in the storage unit and read from and executed by the processing unit. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing system 1 via communication lines such as LAN (Local Area Network).

[0051] <Wafer Processing>

[0052] Next, an example of wafer processing performed by the wafer processing system 1 configured as described above will be described. Furthermore, the following wafer processing is performed under the control of the control device C.

[0053] First, the handling robot 110 sequentially removes wafers W from FOUP 2000 and moves them into storage space S11. Then, the wafers W moved into storage space S11 are sequentially removed from FOUP 2000 and moved into load locking chamber 51 of load locking module 50.

[0054] Next, the load locking chamber 51 is sealed and becomes a vacuum atmosphere.

[0055] Then, the gate valve (not shown) on the vacuum transport chamber 41 side of the load locking chamber 51 is opened, and the wafer W is moved from the load locking chamber 51 to the vacuum transport chamber 41 by the transport mechanism 42.

[0056] Next, after closing the aforementioned gate valve, the gate valve G1 of the processing module 30 for target processing is opened. Then, the wafer W is moved by the transport mechanism 42 into the vacuum processing chamber 31 of the target processing module 30. Afterwards, the gate valve G1 is closed, and the wafer W undergoes the desired processing in the processing module 30.

[0057] After the desired processing is completed, wafer W returns from vacuum processing chamber 31 to FOUP2000 in the reverse order of its transfer from FOUP2000 to vacuum processing chamber 31. Specifically, after being transferred from vacuum processing chamber 31 to storage space S11, the processed wafer W returns to FOUP2000. Thus, a series of wafer processing steps are completed.

[0058] <Transportation Device 20>

[0059] Using the aforementioned Figure 1 and Figures 2 to 18 An example of the configuration of the conveying device 20 will be described. Figures 2-4 These are side sectional views of the conveying device 20. Figure 2 This indicates the central portion of the conveying device 20 in the width direction (X direction). Figure 3 This refers to a portion of the conveying device 20 in the width direction that includes the storage space S11. Figure 4 This refers to a portion of the conveying device 20 in the device width direction, including the column member described later. Figure 5 This is a top view of the main body 102. Figure 6 This is a frontal sectional view of the conveying device 20, showing a portion of the structure within the housing 120. Figure 7 This is a perspective view of the lower part of one end of the main body 102 in the device width direction. Figure 8 This is a cross-sectional view of load port 101. Figure 9 This is a side view of the rear of load port 101. Figure 10 This is a front view of the handling robot 110. Figure 11 This is a three-dimensional sectional view used to illustrate the storage space S11. Figure 12 This is a perspective view used to illustrate the components configured in the storage space S11. Figure 13 This is a side view of the storage space S11 side of the flow path forming component, which will be described later. Figure 14 This is a partially enlarged side view of the storage space S11 side of the rear column member. Figure 15 and Figure 16 These are diagrams used to illustrate the relationship between the air supply surface and the exhaust surface, which will be discussed later. Figure 17 This is an enlarged side view of the lower rear part of the conveying device 20. Figure 18 This is a bottom view of the conveying device 20.

[0060] like Figures 2-6As shown, the conveying device 20 has the aforementioned load port 101 and main body 102, and also has a lower receiving part 103 for accommodating various components.

[0061] The main body 102 has a shell 120 that is U-shaped when viewed from above. The shell 120 has a wall 120A, a plurality of column members 500, 510 and a beam member 520.

[0062] The wall portion 120A has: a front wall 121 including a front end 121a, a rear wall 122 including a rear end 122a, a pair of side walls 123 each including a side end 123a, a bottom wall 124, and a top wall 125.

[0063] When viewed from above on the front side (negative side in the Y direction) of the main body 102, the front 121a extends along the width direction (X direction) of the device.

[0064] The front 121a connects the load port 101 and the lower receiving section 103. The lower receiving section 103 is located below the load port 101. An opening 126 for the load port 101 is provided on the front 121a. In addition, an opening 127 is provided on the front 121a as a loading and unloading outlet for the wafer W relative to the lower receiving section 103.

[0065] The rear 122a is opposite the front 121a in the depth direction (Y direction) of the device. The central portion of the rear 122a in the width direction (X direction) extends along the width direction (X direction) when viewed from above the rear side (Y direction front side) of the main body 102. The load locking module 50 is connected to the central portion of the rear 122a in the width direction. An opening 128 is provided at the central portion of the rear 122a in the width direction, corresponding to the load locking chamber 51. The opening 128 is located in the rear 122a at a position approximately the same in the vertical direction as the junction position within the load locking chamber 51. The junction position within the load locking chamber 51 refers to the vertical position of the wafer W when it is transferred between the load locking chamber 51 and the handling robot 110.

[0066] In addition, the two ends of the device in the width direction of the rear 122a are located further back (positive side in the Y direction) than the central part in the width direction (X direction) of the device of the rear 122a in order to form a storage space S11 in the housing 120.

[0067] A pair of side surfaces 123a connect the front 121a and the rear 122a in the longitudinal direction (Y direction) of the device. In one embodiment, the pair of side surfaces 123a connect the front 121a and the rear 122a in the longitudinal direction of the device via the outer peripheral surfaces of the column members 500, 510. Additionally, the pair of side surfaces 123a are opposite each other in the width direction (X direction) of the device. In plan view, the side surfaces 123a extend along the longitudinal direction of the device.

[0068] The bottom wall 124 and the top wall 125 are opposite each other in the vertical direction and extend in the horizontal direction (X direction and Y direction), respectively.

[0069] The main body 102 has an internal space formed by a front wall 121, a rear wall 122, a side wall 123, a bottom wall 124, and a top wall 125. The internal space is divided vertically into a lower transport space S1 and an upper space (also called a receiving space) S2 at the center of the device's width direction (X direction) by a partition wall 131 provided between the bottom wall 124 and the top wall 125. Furthermore, at both ends of the internal space in the device's width direction, the internal space is also divided vertically by partition walls 131 into a lower transport space S1 and a storage space S11, and a receiving space S2. As described later, purified gas is supplied from the receiving space S2 to the transport space S1, and an opening 132A for supplying this gas is provided in the partition wall 131. Additionally, as described later, purified gas is supplied from the receiving space S2 to the storage space S11, and an opening 132B for supplying this gas is provided in the partition wall 131.

[0070] like Figure 5 As shown, column members 500 and 510 are connected to wall portion 120A respectively.

[0071] Column members 500 are respectively disposed at the corners of the housing 120 on the negative X-direction and front side (negative Y-direction side), and on the positive X-direction and front side (negative Y-direction side). The column members 500 disposed on the front side extend vertically. Here, as Figure 5 As shown, the column member 500 is configured to protrude towards the front (negative side in the Y direction) of the conveying device 20. This maximizes the volume of the conveying space S1.

[0072] The column members 510 are respectively disposed at the corners of the housing 120 on the negative and rearward side (positive side in the Y direction) and the positive and rearward side (positive side in the Y direction). Figure 4 and Figure 7 As shown, the column member 510 is composed, for example, an upper member 511 located above and a lower member 512 located below and continuous from the upper member 511.

[0073] The rear end 512a of the lower member 512 is positioned further forward (negative side in the Y direction) than the rear end 511a of the upper member 511. Specifically, the upper member 511 extends vertically, the upper part of the lower member 512 becomes an inclined portion 513 extending forward and diagonally downward, and the lower part of the lower member 512 extends vertically further downward than the inclined portion 513. That is, the column member 510 extends vertically downward from its upper end to the inclined portion 513, the inclined portion 513 extends forward and diagonally downward, and extends vertically downward from the inclined portion 513 to its lower end.

[0074] Thus, a space S21 is formed below the upper member 511 of the column member 510 (specifically below the inclined portion 513). Peripheral components (such as the storage exhaust pipe 750 described later) that are disposed outside the main body 102 are arranged in this space S21.

[0075] Furthermore, the two ends of the rear end 122a of the wall portion 120A in the device width direction may also have the same shape as the rear end 511a of the column member 510. Thus, a space S22, the same as space S21, is also formed below the rear end 122a of the wall portion 120A.

[0076] The lower rear portion of the beam member 520 in the main body 102 is connected to the wall portion 120A. For example, the beam member 520 is configured to extend in the width direction (X direction) of the rear wall 122.

[0077] like Figure 8 and Figure 9 As shown, the load port 101 has a connecting plate 140, an isolation cover 150, and a main cover 151.

[0078] When connected to the main body 102, the connecting plate 140 is mounted on the front end 121a to cover the opening 126. The upper side of the connecting plate 140 extends further above the main cover 151. On the upper side of the connecting plate 140, above the isolation cover 150 and the main cover 151, an opening 141 serving as the loading and unloading outlet for the wafer W is provided. The lower side of the connecting plate 140 extends to cover the rear of the isolation cover 150 and the rear of the main cover 151. On the lower side of the connecting plate 140, a slit 142 for raising and lowering the arm 192 of the moving mechanism 190 (described later) extends vertically.

[0079] The isolation cover 150 forms a receiving space S3 for accommodating the moving mechanism 190 (described later) between itself and the front of the connecting plate 140. Furthermore, the isolation cover 150 covers the slit 142 from the front. By providing the isolation cover 150, gas leakage from the transport space S1 of the main body 102 to the outside of the transport device 20 can be prevented.

[0080] The main cover 151 forms a receiving space S4 between itself, the connecting plate 140, and the isolation cover 150 to accommodate the retraction mechanism 170 (described later). Furthermore, the main cover 151 covers both the retraction mechanism 170 and the isolation cover 150. In this embodiment, the main cover 151 covers the front and top walls of the isolation cover 150, but not the bottom wall.

[0081] The bottom wall of the isolation cover 150 and the bottom wall of the main cover 151 form the bottom surface of the load port 101. A sliding member 152 is provided on the bottom surface of the load port 101. When the load port 101 is installed on the main body 102, the sliding member 152 slides on the top surface of the first receiving portion 103A (described later) of the lower receiving portion 103. Furthermore, when the load port 101 is connected to the main body 102, the sliding member 152 is disposed separately from the top surface of the first receiving portion 103A.

[0082] In addition, the load port 101 has a worktable 160 and a forward / backward mechanism 170.

[0083] The worktable 160 includes a mounting surface 160a for housing the FOUP 2000 of the wafer W. Specifically, the upper surface of the worktable 160 is the mounting surface 160a for the FOUP 2000. The worktable 160 supports the FOUP 2000 on the mounting surface 160a. The FOUP 2000 mounted on the mounting surface 160a is arranged such that the door, i.e., cover 2001 of the FOUP 2000 is opposite to the opening 141 of the connecting plate 140. The worktable 160 is disposed on the upper surface of the main cover 151.

[0084] The worktable 160 is provided with a nozzle 161 for supplying gas to the FOUP 2000. Specifically, the nozzle 161 supplies an inert gas such as nitrogen into the FOUP 2000 placed on the worktable 160. The nozzle 161 is movable via a forward / reverse mechanism 170, and specifically, it is movable together with the worktable 160, which is also movable via the forward / reverse mechanism 170. Furthermore, the nozzle 161 protrudes from the bottom of the worktable 160, with its lower part protruding into the aforementioned receiving space S4.

[0085] The retraction mechanism 170 moves the worktable 160 forward and backward in the horizontal direction. Specifically, the retraction mechanism 170 moves the worktable 160 forward and backward relative to the opening 141. More specifically, the retraction mechanism 170 moves the worktable 160 between a forward position and a rearward position. The forward position is the position where the FOUP 2000 is transferred between the externally mounted transport device and the worktable 160. The rearward position is the position for transferring the wafer W between the FOUP 2000 and the main body 102 via the opening 141.

[0086] The retraction mechanism 170 includes, for example, a guide section 171 and a support member 172. The guide section 171 guides the worktable 160 to move in the depth direction of the device. Specifically, the guide section 171 guides the support member 172, which supports the worktable 160, to move in the rear-forward direction. The upper end of the support member 172 is connected to the worktable 160, and the lower end is connected to the guide section 171 in a manner that allows it to move in the depth direction of the device where the guide section 171 extends. Furthermore, the retraction mechanism 170 is housed within the aforementioned housing space S4.

[0087] Additionally, load port 101 has a door 180 and a moving mechanism 190.

[0088] Door 180 opens and closes to opening 141. Door 180 is configured to unlock the cover 2001 of FOUP 2000 and retain the cover 2001. With the door 180 holding the unlocked cover 2001, the cover 2001 is opened by opening door 180. When door 180 is opened and closed, it moves within main body 102 (specifically within transport space S1).

[0089] The moving mechanism 190 functions as a lifting mechanism to open, close, and raise / lower the door 180 and the cover 2001. The moving mechanism 190 includes, for example, an actuator 191, an arm 192, and a lifting body 193.

[0090] Actuator 191 drives the lifting and lowering of door 180. Specifically, actuator 191 drives the lifting body 193, which supports door 180 via arm 192, to lift and lower. Actuator 191 is configured to extend vertically (Z direction) inside load port 101. Actuator 191 can be an electro-pneumatic actuator such as a cylinder, or an electromechanical actuator.

[0091] Arm 192 supports door 180 and is driven by actuator 191. Arm 192 is, for example, as shown in... Figure 8 A pair of arms 192 are arranged along the width direction (X direction) of the device. The upper end of each arm 192 is connected to a door 180 located inside the main body 102 (specifically inside the transport space S1), and the lower end of each arm 192 is connected via a lifting body 193 to an actuator 191 located inside the load port 101, i.e., outside the main body 102. In order to enable the arms 192 to be raised and lowered in this connected state, a slit 142 is provided on the front wall 121 of the main body 102 as described above. That is, a slit 142 is provided on the front wall 121 of the main body 102 for the arm 192 to be inserted and for the arm 192 to pass through when it is raised and lowered. For example, a slit 142 is provided for each arm 192.

[0092] The lifting body 193 moves up and down along the actuator 191, that is, it moves in the vertical direction.

[0093] The moving mechanism 190 is configured to move the door 180 in the longitudinal direction (Y direction) of the device. For example, the arm 192 supporting the door 180 is connected to the lifting body 193 in a manner that allows it to move in the front-back direction.

[0094] The moving mechanism 190 is housed in the housing space S4 of the main cover 151. Specifically, the housing space S4 houses the portion of the moving mechanism 190 located outside the main body 102, namely the actuator 191, a part of the arm 192, and the lifting body 193 of the moving mechanism 190.

[0095] In addition, the moving mechanism 190 also has an actuator (not shown) that drives the door 180 to move back and forth. The moving mechanism 190 is controlled by a control device C, specifically, the aforementioned actuator and actuator 191 of the moving mechanism 190 are controlled by the control device C.

[0096] like Figures 2-4 As shown, the lower receiving section 103 has multiple receiving sections stacked in the vertical direction, such as the upper first receiving section 103A and the lower second receiving section 103B.

[0097] The first receiving portion 103A houses a functional expansion module, which comprises at least one of a measurement module for performing measurements related to the film on the wafer W, an inspection module for inspecting defects in the wafer W, and an alignment module for adjusting the orientation position of the substrate. The opening 127 is provided in the front wall 121 of the main body 102 at a position corresponding to the first receiving portion 103A.

[0098] The measurement or inspection module housed in the first housing section 103A includes, for example, a mounting stage (not shown) that holds the wafer W and is configured to move in the horizontal direction, and an imaging section (not shown) that captures images of the wafer W placed on the mounting stage and moving in the horizontal direction. Alternatively, or in addition to this module, the measurement or inspection module may also include a module configured to capture images of the wafer W, supported by a handling robot 110 inserted into the module via the opening 127 and moving in the horizontal direction, through the imaging section (not shown).

[0099] The second housing section 103B houses electrical components, including a power supply unit. The second housing section 103B does not have an opening like the opening 127. That is, in both the first housing section 103A and the second housing section 103B, only the upper housing section 103A has an opening serving as the loading / unloading point for the wafer W.

[0100] The main body 102 has a door 200 and a lifting mechanism 210.

[0101] Door 200 opens and closes the opening 128 of the rear wall 122. Lifting mechanism 210 raises and lowers door 200 to open and close the opening 128. Door 200 and lifting mechanism 210 are located inside the main body 102 (specifically inside the transport space S1).

[0102] Additionally, the lifting mechanism 210 has an actuator (not shown) that drives the door 200 to rise and fall. The lifting mechanism 210 is controlled by a control device C, specifically, the aforementioned actuator of the lifting mechanism 210 is controlled by the control device C.

[0103] Additionally, as described above, the main body 102 includes a transport robot 110 that supports and transports the wafer W. Specifically, the transport robot 110 transports the wafer W between the opening 141 and the storage space S11, or between the opening 128 and the storage space S11. The transport robot 110 is housed within the transport space S1 and placed on the bottom wall 124.

[0104] like Figure 10 As shown, the handling robot 110 has a horizontal arm 220 and a vertical multi-joint arm 230 as handling arms.

[0105] The horizontal arm 220 is configured to transport the wafer W in a horizontal direction. The horizontal arm 220 is, for example, a multi-jointed arm, having a fork-shaped member 221, a first arm 222, and a second arm 223.

[0106] The fork-shaped member 221 supports the wafer W at its front end. The fork-shaped member 221 is rotatably connected to the front end of the first arm 222 at its base end with an axis extending in the vertical direction (Z direction) (hereinafter referred to as the "vertical axis") as the center.

[0107] The first arm 222 is rotatably connected to the front end of the second arm 223 with its base side as the center of the vertical axis.

[0108] The second arm 223 is rotatably connected to the front end of the vertical multi-joint arm 230 with the vertical axis as the center.

[0109] The vertical articulated arm 230 is composed of an articulated arm and is configured to at least allow the horizontal arm 220 to be raised and lowered. In this embodiment, the vertical articulated arm 230 is configured to allow the horizontal arm 220 to move in the vertical direction (Z direction) and the device width direction (X direction). The vertical articulated arm 230 has an arm 231 that is rotatable in the vertical direction and a base 232 that is connected to the arm 231 and fixed to the support platform 240 described later.

[0110] Arm 231 includes, for example, a first arm 231A and a second arm 231B.

[0111] The first arm 231A is connected to a horizontal arm 220 at its front end. In addition, the first arm 231A is rotatably connected to the front end of the second arm 231B at its base end with regard to an axis extending in the longitudinal direction of the device (hereinafter referred to as the "front and rear axis").

[0112] The second arm 231B is rotatably connected to the upper end of the base 232 with its front and rear axes on its base side as the center.

[0113] The base 232 supports the horizontal arm 220 via the arm 231. The base 232 has a pair of plate-like members 233 and a bottom member 234.

[0114] A pair of plate-shaped members 233 are arranged in the longitudinal direction (Y direction) of the device. Specifically, of the pair of plate-shaped members 233, the first plate-shaped member 233A is arranged on the front side (negative side of the Y direction), and the second plate-shaped member 233B is arranged on the rear side (positive side of the Y direction). The second arm 231B is axially supported between the first plate-shaped member 233A and the second plate-shaped member 233B.

[0115] The plate-shaped member 233 extends vertically within the transport space S1. Furthermore, when viewed in the depth direction of the device, the plate-shaped member 233 is a roughly isosceles triangle comprising a pair of long sides extending vertically and a short side connecting the pair of long sides.

[0116] The bottom member 234 is configured to connect the lower end of the first plate member 233A and the lower end of the second plate member 233B. A plurality of, for example, two, locating pins (not shown) are provided on the bottom surface of the bottom member 234. The locating pins are inserted into pin holes provided in the support platform 240 described later.

[0117] like Figures 2-4 and Figure 6 As shown, the main body 102 has a support platform 240 and an exhaust box 250 as a pair of exhaust sections.

[0118] A support platform 240 and a pair of exhaust boxes 250 are disposed on the bottom wall 124 and arranged in the width direction (X direction) of the device. Specifically, the pair of exhaust boxes 250 are arranged on both sides of the support platform 240 in the width direction of the device.

[0119] The support platform 240 secures and supports the transport robot 110. On the support platform 240, multiple pin holes (not shown, for example, two holes) are provided at positions corresponding to the positioning pins of the transport robot 110. When the transport robot 110 is placed on the support platform 240, the positioning pins are inserted into the pin holes. Thus, the transport robot 110 is fixed in the desired position relative to the support platform 240.

[0120] The exhaust box 250 exhausts the gas within the transport space S1 into itself. For this purpose, the exhaust box 250 is equipped with a fan (not shown). The gas discharged from the transport space S1 into the exhaust box 250 is exhausted to the outside of the device, for example, via the transport space exhaust pipe 760 described later. The aforementioned fan may also be a fan filter unit (FFU) integrated with a gas filter. In this case, the gas filtered by the FFU in the exhaust box 250 can also be discharged outside the main body 102 (specifically, for example, the cleanroom where the transport device 20 is installed).

[0121] Alternatively, if the gas flowing into the exhaust box 250 is not discharged outside the main body 102 but is instead supplied back to the storage space S11 for circulation, a fan may not be installed in the exhaust box 250.

[0122] like Figure 2 and Figure 3 As shown, the main body 102 has a first FFU260, which serves as a first gas supply unit for supplying ambient gas (specifically, the ambient gas above it) to the transport space S1.

[0123] The first FFU 260 supplies gas to the transport space S1. Specifically, the first FFU 260 supplies purified gas, i.e., gas filtered of particulates, alkaline substances, acidic substances, organic matter, etc., from above to below in the transport space S1. The first FFU 260 is disposed in the aforementioned receiving space S2 above the transport space S1, and is supported, for example, by a partition wall 131. As described above, an opening 132A is formed in the partition wall 131, through which the first FFU 260 supplies purified gas to the transport space S1.

[0124] As previously described, the main body 102 has a storage space S11. The storage space S11 is, for example, as... Figure 3 , Figure 4 and Figure 6 As shown, the space is divided into multiple regions R along the vertical direction. Specifically, the storage space S11 is divided into five regions R arranged vertically by the partition plate 600. Hereinafter, the five regions R are sometimes referred to from top to bottom as the first region R1, the second region R2, the third region R3, the fourth region R4, and the fifth region R5.

[0125] In each region R, in order to accommodate multiple wafers W, such as Figure 10 and Figure 11 As shown, a plurality of (e.g., 25 sets) of a pair of support claws 610 are arranged side by side along the vertical direction. The pair of support claws 610 horizontally support the wafer W through the periphery of the support wafer W.

[0126] Additionally, the support claw 610 and the partition plate 600, as Figure 12As shown, it is supported by frame 620. By fixing frame 620, support claw 610 and partition plate 600 are fixed in the main body 102 (specifically in storage space S11).

[0127] In addition, the main body 102, as Figure 6 and Figure 11 As shown, it has a gas supply passage D for supplying gas to the storage space S11.

[0128] Each region R in the storage space S11 has an individual gas supply passage D1, through which gas is supplied individually to each region R. Hereinafter, the individual gas supply passages D1 corresponding to the first region R1, the second region R2, the third region R3, the fourth region R4, and the fifth region R5 will be referred to as the first individual gas supply passage D11, the second individual gas supply passage D12, the third individual gas supply passage D13, the fourth individual gas supply passage D14, and the fifth individual gas supply passage D15, respectively.

[0129] At least a portion of the gas supply passage D is formed within the wall 120A of the housing 120.

[0130] Specifically, the wall portion 120A has a wall body portion 630 including the rear end 122a of the housing 120, and an air supply passage forming member 640 forming a space between the wall body portion 630 and the air supply passage D.

[0131] like Figure 13 As shown, the gas supply passage forming member 640 has a flat plate portion 641 formed in the shape of a flat plate. In addition, the gas supply passage forming member 640 has first to fourth partition walls 651 to 654 extending from the flat plate portion 641 toward the wall body portion 630, respectively.

[0132] The first partition 651 forms a space between the flat plate portion 641 and the wall body portion 630, serving as a first separate air supply passage D11 and a space serving as a second separate air supply passage D12, and separates these spaces.

[0133] The second partition 652 forms a space between the flat plate portion 641 and the wall body portion 630, serving as a second separate air supply passage D12 and a space between the third separate air supply passage D13, and separates these spaces.

[0134] The third partition 653 forms a space between the flat plate portion 641 and the wall body portion 630, serving as a third separate air supply passage D13 and a space as a fourth separate air supply passage D14, and separates these spaces.

[0135] The fourth partition 654 forms a space between the flat plate portion 641 and the wall body portion 630, serving as a fourth individual air supply passage D14 and a space between the fifth individual air supply passage D15, and separates these spaces.

[0136] In addition, the main body 102 also has an air supply port 660 that is continuous with the air supply passage D.

[0137] For example, the air supply port 660 is formed in each region R within the storage space S11 by an air supply surface 641a facing the storage space side in the flat plate portion 641 of the air supply passage forming member 640.

[0138] In addition, the main body 102 has a baffle member 670 covering the air supply port 660. The baffle member 670 has a plurality of through holes 671 formed in the portion opposite to the air supply port 660.

[0139] In addition, such as Figure 6 and Figure 11 As shown, the main body 102 has an exhaust passage E for discharging the gas supplied to the storage space S11.

[0140] In this embodiment, the exhaust passage E is formed in the column member 510 on the rear side (positive side in the Y direction).

[0141] Furthermore, the main body 102 has an exhaust port 700 that is continuous with the exhaust passage E. For example... Figure 11 As shown, the exhaust port 700 is formed on the side of the rear column member 510 facing the storage space S11, i.e., the exhaust surface 510a facing the storage space S11. Specifically, the exhaust port 700 is as follows... Figure 4 and Figure 14 As shown, each region R within the storage space S11 is formed on the aforementioned exhaust surface 510a.

[0142] In addition, the main body 102 includes a baffle member 710 that covers the exhaust port 700. The baffle member 710 has a plurality of through holes 711 formed in the portion opposite to the exhaust port 700.

[0143] In this embodiment, the air supply port 660 and the exhaust port 700 are configured to satisfy the following conditions.

[0144] like Figure 15 As shown, the virtual normal L1 extending from the air supply surface 641a where the air supply port 660 is formed, and the virtual normal L2 extending from the exhaust surface 510a where the exhaust port 700 is formed, intersect the transport space S1 respectively.

[0145] The air supply surface 641a and the exhaust surface 510a are not parallel.

[0146] However, the air supply port 660 and the exhaust port 700 can also be like... Figure 16The configuration shown is such that the air supply surface 641a is parallel to the exhaust surface 510a. For example... Figure 15 and Figure 16 As shown, by configuring the air supply port 660 and the exhaust port 700, it is possible to more effectively suppress the downward flow from the first FFU 260 formed in the transport space S1 from being drawn into the exhaust port 700, while at the same time, it is possible to form an appropriate airflow in the storage space S11.

[0147] In addition, such as Figure 3 and Figure 6 As shown, the main body 102 also has a second FFU 720, which is different from the first FFU 260 and serves as a second gas supply unit.

[0148] The second FFU 720 supplies gas to the storage space S11. Specifically, the second FFU 720 supplies purified gas, i.e., gas filtered of particulates, to the gas supply passage D. Thus, the gas supply passage D supplies gas from the second FFU to the storage space S11.

[0149] The second FFU 720 is, for example, disposed in the aforementioned containment space S2 and supported by the partition wall 131. As described above, an opening 132B is formed in the partition wall 131, through which the second FFU 720 supplies purified gas to the gas supply passage D.

[0150] In this embodiment, all the gas supplied to the storage space S11 and exhausted to the exhaust passage E is exhausted to the outside of the device. Therefore, as Figure 4 As shown, the conveying device 20 also includes a storage exhaust pipe 750 for venting gas from the exhaust passage E of the rear column member 510 to the outside of the device. The storage exhaust pipe 750 is an external exhaust passage component that constitutes an external exhaust passage for venting gas from the exhaust passage E to the outside of the device.

[0151] One end of the storage exhaust pipe 750 is connected from the rear to the lower member 512 of the column member 510, for example, to the rear end 512a. The exhaust passage E is connected to the flow path inside the storage exhaust pipe 750 via the communication port 751 of the connection portion of the storage exhaust pipe 750 provided in the lower member 512.

[0152] like Figure 17 and Figure 18 As shown, the storage exhaust pipe 750 includes a storage exhaust pipe 750A connected to the column member 510 on the positive side in the X direction, and a storage exhaust pipe 750B connected to the column member 510 on the negative side in the X direction.

[0153] The storage exhaust pipe 750A of the column member 510 connected to the positive side in the X direction includes a switching valve 752, a flow regulating valve 753, a flexible exhaust pipe 754, an internal exhaust passage 755, and an exhaust pipe 756.

[0154] The switching valve 752 switches the start / stop of exhaust from exhaust passage E via storage exhaust pipe 750.

[0155] The flow regulating valve 753 regulates the amount of exhaust gas from the exhaust passage E via the storage exhaust pipe 750.

[0156] The flexible exhaust pipe 754 connects the flow regulating valve 753 and the exhaust passage 755 inside the beam.

[0157] The internal exhaust passage 755 is formed inside the central portion of the device in the width direction (X direction) of the beam member 520. The central portion of the device in the width direction of the beam member 520 is the part located in the area overlapping with the load locking chamber 51 in the width direction (X direction) of the device.

[0158] The exhaust pipe 756 connects the exhaust passage 755 inside the beam to the integrated box, which is located on the negative side in the X direction and will be described later.

[0159] In the exhaust passage within the storage exhaust pipe 750A (i.e., in the external exhaust passage formed by the storage exhaust pipe 750A as a component of the external exhaust passage), the portion of the area in the region where the position in the width direction (X direction) of the device overlaps with the load locking chamber 51 is formed by the internal exhaust passage of the beam.

[0160] On the other hand, the storage exhaust pipe 750B of the column member 510 connected to the negative side in the X direction is directly connected to the integrated box without passing through the exhaust passage 755 in the beam.

[0161] At least one end of the storage exhaust pipe 750 on the column member 510 side is housed in a space S21 below the upper member 511 of the column member 510 (specifically below the inclined portion 513). The space S21 may, for example, house the aforementioned switching valve 752 and flow regulating valve 753. Additionally, the space S21 may also house peripheral components other than the storage exhaust pipe 750, such as pipes supplying gas to the components of the conveying device 20 and power cables supplying power to these components.

[0162] Furthermore, the conveying device 20 has an exhaust duct 760 for the conveying space. The exhaust duct 760 exhausts the gas in the conveying space S1 to the outside of the device, specifically exhausting the gas in the exhaust box 250 to the outside of the device. The exhaust duct 760 for the conveying space is, for example, housed in the aforementioned space S22 on the negative side in the X direction.

[0163] In addition, the conveying device 20 also has an integrated box 770. The integrated box 770 is used to centrally connect the storage exhaust pipe 750 and the conveying space exhaust pipe 760 to an exhaust mechanism (not shown) outside the conveying device 20. The downstream ends of the storage exhaust pipe 750 and the conveying space exhaust pipe 760 are connected to the integrated box 770, and the other end of a main exhaust pipe (not shown) connected to the exhaust mechanism is also connected to it.

[0164] The integrated box 770 is housed, for example, in the manner described above in spaces S21 and S22 across the negative side of the X direction.

[0165] Additionally, although not shown in the figure, the storage exhaust pipe 750 or the handling space exhaust pipe 760 can also be connected to the factory-side exhaust line by extending downwards to the handling device 20.

[0166] In the conveying device 20 configured as described above, the gas supplied to the storage space S11 is discharged through the exhaust passage E formed in the column member 510 of the housing 120.

[0167] In addition, in the conveying device 20, gas delivered from the second FFU720, which is separately disposed from the first FFU260 in the main body 102, is supplied to the storage space S11.

[0168] <Main Effects of This Implementation>

[0169] As described above, in this embodiment, the main body 102 of the transport device 20, in addition to the first FFU 260 and the exhaust passage E, also includes a second FFU 720 separately disposed from the first FFU 260 and supplying gas to the storage space S11, and a gas supply passage D supplying gas from the second FFU 720 to the storage space S11. Therefore, even without increasing the flow rate of gas supplied from the first FFU 260, the required flow rate of gas can be supplied to the storage space S11. That is, within the flow rate range of gas that can be supplied from the first FFU 260, the flow rate of gas required to form a suitable airflow in both the transport space S1 and the storage space S11 can be supplied. Therefore, a suitable airflow can be formed in both the transport space S1 and the storage space S11. Therefore, the stirring of particles in the transport space S1 can be suppressed, and the generation of corrosive gases from the wafer W supported in the storage space S11 can be suppressed.

[0170] Furthermore, as described in this embodiment, by using a vertical articulated arm 230 in the handling robot 110, the floor area of ​​the handling space S1 can be reduced. Specifically, compared to using a module that moves a horizontal arm in both the vertical and device width directions by means of a lifting body that can move along a track extending in the device width direction (X direction) instead of the vertical articulated arm 230, the width of the handling space S1 in the device depth direction (Y direction) can be shortened. However, if the floor area of ​​the handling space S1 is reduced, the area of ​​the first FFU 260 in a top view becomes narrower, and therefore the flow rate of gas supplied from the first FFU 260 to the handling space S1 may decrease.

[0171] In this embodiment, even when the area of ​​the transport space S1 is small and the flow rate of gas supplied from the first FFU260 to the transport space S1 is relatively small, by also using the second FFU720, gas can be supplied to both the transport space S1 and the storage space S11 at the flow rate required to form an appropriate airflow in these spaces.

[0172] Furthermore, when the number of wafers W that can be accommodated in the storage space S11 is large, the gas flow rate required for the storage space S11 increases. Even when the gas flow rate required for the storage space S11 is large, as in this embodiment, by also using the second FFU720, it is possible to supply gas to both the transport space S1 and the storage space S11 at the flow rate required to form an appropriate airflow in these spaces.

[0173] Furthermore, in this embodiment, the exhaust passage E for discharging the gas supplied to the storage space S11 is formed within the column member 510 constituting the housing 120. Therefore, compared to the case where the exhaust passage E is provided outside the housing 120, it is possible to suppress the increase in the device's floor space, reduce the number of components, and also help to reduce manufacturing costs.

[0174] Furthermore, in this embodiment, the transport space S1 and the adjacent storage space S11 are covered together by the housing 120. Therefore, compared with the case where the transport space S1 and the storage space S11 are covered by their respective housings, the number of parts can be reduced, which helps to reduce manufacturing costs.

[0175] Furthermore, unlike this embodiment, in the configuration where the storage space S11 and the transport space S1 are connected in the width direction of the device, there is room for improvement regarding the maintenance of the transport robot 110 within the transport space S1 and the components surrounding the transport space S1 for operator access. Specifically, the path to access the transport space S1 is limited to the rear side of the transport space S1, or, in order to access the transport space S1 from the side, it is necessary to remove components of the storage space S11 (such as the partition plate 600 in this embodiment). Additionally, depending on the size of the transport robot 110, even when accessing the transport space S1 from the rear, it is sometimes impossible to remove the transport robot 110 from the housing 120 without disassembling it.

[0176] In contrast, in this embodiment, the column member 510 with an internal exhaust passage E is located on the rear side (rear 122a side), and the storage space S11 is connected to the rear side of the transport space S1. Therefore, during the aforementioned maintenance, the transport space S1 can be accessed from the side (side 123a side), and during this access, it is not necessary to remove the components of the storage space S11. Therefore, according to this embodiment, the maintainability of the transport device 20 is improved.

[0177] Furthermore, in this embodiment, the pillar member 510, which has an exhaust passage E formed inside, has an exhaust port 700 on its side side connected to the exhaust passage E on the storage space S11 side. Therefore, an airflow that flows through the storage space S11 and along the surface of the wafer W supported by the storage space S11 can be formed.

[0178] Furthermore, in this embodiment, the main body 102 also includes a gas supply passage D for supplying gas to the storage space S11, and at least a portion of the gas supply passage D is formed within the wall portion 120A of the housing 120. Therefore, according to this embodiment, compared to the method in this embodiment where the gas supply passage D is not formed within the wall portion 120A of the housing 120 but is provided separately, the increase in the number of components and the increase in manufacturing cost can be suppressed.

[0179] Furthermore, in this embodiment, the storage space S11 is divided into multiple regions R. Moreover, the gas supply passage D has an individual gas supply passage D1 provided in each region R of the storage space S11. Therefore, it is possible to suppress differences in the flow rate of gas supplied from the second FFU720, which serves as a single gas supply source to the gas supply passage D, to each region R of the storage space S11 via the gas supply passage D, between the regions R.

[0180] Furthermore, in this embodiment, the main body 102 has an air supply port 660 that is continuous with the air supply passage D, and the air supply port 660 is covered by a baffle member 670 having multiple through holes 671. Therefore, it is possible to suppress the unevenness of the airflow intensity formed by the gas supplied from the air supply passage D through the air supply port 660 within the storage space S11.

[0181] Furthermore, in this embodiment, the main body 102 has an exhaust port 700 that is continuous with the exhaust passage E, and the exhaust port 700 is covered by a baffle member 710 with multiple through holes 711. Therefore, it is possible to suppress the unevenness of the airflow intensity formed by the exhaust through the exhaust port 700 and the exhaust passage E within the storage space S11.

[0182] Furthermore, in this embodiment, the virtual normal L1 extending from the gas supply surface 641a that forms the gas supply port 660 and faces the storage space intersects the transport space S1. Therefore, the flow of gas from the transport space S1 into the storage space S11 can be suppressed by the airflow formed by the gas supplied from the gas supply port 660, and the outflow of corrosive gases and particles generated from the processed wafer into the transport space S1 can be prevented.

[0183] Furthermore, the virtual normal L2 extending from the exhaust surface 510a that forms the exhaust port 700 and faces the storage space S11 intersects the transport space S1, and when viewed from above, the air supply surface 641a and the exhaust surface 510a are arranged in a figure-eight shape (an inverted V with a gap at the front end) to sandwich the wafer W supported by the storage space S11 in the middle.

[0184] Therefore, the airflow formed by the gas supplied from the gas supply port 660 and exhausted through the exhaust port 700 can be supplied to a larger area of ​​the surface of the wafer W supported by the storage space S11. Furthermore, since the exhaust port 700 is positioned in the direction of air intake from the transport space S1, it can more effectively prevent corrosive gases originating from the wafer from flowing out of the transport space. In addition, particularly when the gas supply surface 641a and the exhaust surface 510a are not parallel, the gas supply path can be extended, and the airflow velocity can be reduced. If the airflow velocity is too high, the gas supply airflow may bounce off the wafer or other surfaces and fail to be drawn into the exhaust port 700. However, by configuring the gas supply surface 641a and the exhaust surface 510a non-parallel, the airflow velocity is reduced, and the airflow formed in the storage space S11 can be effectively discharged.

[0185] Furthermore, in this embodiment, the column member 510 disposed at the rear among the plurality of column members is composed of an upper member 511 and a lower member 512, and the rear end 512a of the lower member 512 is disposed further forward than the rear end 511a of the upper member. Specifically, the column member 510 extends vertically downward from its upper end to an inclined portion 513, the inclined portion 513 faces forward and extends obliquely downward, and extends vertically downward from the inclined portion 513 to its lower end. Therefore, the space below the upper member 511 (specifically below the inclined portion 513) (i.e., the space behind the rear end 512a of the lower member 512) S21 can be used as a storage space for accommodating and storing exhaust pipes and the like. Unlike this embodiment, when the rear end 512a of the lower member 512 of the rear column member 510 is located at the same position as the rear end 511a of the upper member 511, if a storage exhaust pipe 750 or the like is provided in the space behind the rear end 512a of the lower member 512, the device footprint of the conveying device 20 will correspondingly expand rearward. According to this embodiment, since the storage exhaust pipe 750 or the like can be accommodated in the space S21 below the upper member 511 of the rear column member 510, it helps to reduce the device footprint; specifically, it can suppress the rearward expansion of the device footprint of the conveying device 20.

[0186] Furthermore, in this embodiment, an internal exhaust passage 755 is formed inside the central portion of the beam member 520 of the housing 120, located in the region overlapping with the load locking chamber 51 in the device width direction (X direction). The portion of the exhaust passage within the storage exhaust pipe 750A located in the aforementioned overlapping region is also formed by the internal exhaust passage 755. Therefore, according to this embodiment, unlike the storage exhaust pipe being located behind the housing 120, in the aforementioned overlapping region, it is not necessary to move the load locking chamber 51 away from the transport device 20 to avoid interference between the storage exhaust pipe and components (such as components of the load locking module 50) located below the load locking chamber 51. Additionally, since it is not necessary to narrow the storage exhaust pipe to shorten the distance the load locking chamber 51 moves away from the transport device 20, the exhaust capacity via the storage exhaust pipe can be ensured. Therefore, according to this embodiment, damage to exhaust via the storage exhaust pipe can be suppressed, while simultaneously helping to reduce the footprint of the wafer processing system 1, which includes the transport device 20 and the processing device 10.

[0187] Furthermore, in this embodiment, an integrated box 770 is provided, which is connected to an external exhaust mechanism of the conveying device 20. The storage exhaust pipe 750 and the conveying space exhaust pipe 760 are connected together to the external exhaust mechanism via the integrated box 770. Therefore, according to this embodiment, compared to the case where the storage exhaust pipe 750 and the conveying space exhaust pipe 760 are individually connected to the external exhaust mechanism, the piping for connecting the storage exhaust pipe 750 and the conveying space exhaust pipe 760 to the external exhaust mechanism is easier. As a result, it helps to reduce manufacturing costs.

[0188] Furthermore, the integrated box 770 is housed in the space S21 below the upper member 511 of the column member 510 that forms the rear side. Therefore, the increase in the device floor space caused by the installation of the integrated box 770 can be suppressed.

[0189] (Second Implementation)

[0190] Figure 19 This is a side cross-sectional view of the conveying device 20 according to the second embodiment. Figure 20 yes Figure 19 A magnified view of a portion of the image. Figure 21 This is a frontal cross-sectional view of the conveying device 20 according to the second embodiment. Figure 22 This is an exploded view of the auxiliary exhaust box, which will be described later.

[0191] In the conveying device according to the first embodiment, all the gas supplied to the storage space S11 and discharged to the exhaust passage E is exhausted to the outside of the device. In the conveying device 20 according to the second embodiment, the gas supplied to the storage space S11 and discharged to the exhaust passage E is circulated by supplying it back to the storage space S11.

[0192] like Figure 19 As shown, the transport device 20 according to the second embodiment has a return passage B formed in the column member 500 on the front side (negative side in the Y direction) to return gas supplied from the receiving space S2 (the upper space of the transport space S1) where the first FFU 260 is provided to the receiving space S2 to the receiving space S2. The transport device 20 according to the second embodiment uses this return passage B to circulate the gas supplied to the storage space S11 and exhausted to the exhaust passage E. Hereinafter, it will be described in more detail. In addition, the configuration of the main body 102 of the transport device 20 according to the second embodiment on the positive side in the X direction will be described below. The configuration of the negative side in the X direction is the same as that of the positive side in the X direction, so its description is omitted.

[0193] In this embodiment, on the X-direction positive side of the main body 102, the exhaust passage E is formed in the rear column member 510, and the return passage B is formed in the front column member 500. That is, in this embodiment, the column member 510 with the exhaust passage E formed inside and the column member 500 with the return passage B formed inside are arranged along the depth direction (Y direction) of the device and are opposite to each other.

[0194] An outlet 701 communicating with the exhaust passage E of the rear column member 510 is formed on the front 510b of the lower end of the rear column member 510. The front 510b extends in the width direction (X direction) of the device. In addition, a fan 800 is provided in the exhaust passage E in the lower end of the rear column member 510 to guide the gas supplied to the storage space S11 into the exhaust passage E. The fan 800 can send the gas in the exhaust passage E to the outlet 701, that is, the gas in the exhaust passage E can be sent into the auxiliary exhaust box 810 described later through the outlet 701. Specifically, the fan 800 is located in the portion of the exhaust passage E that is lower than the inclined portion 513 of the column member 510. The fan 800 may also be provided in the auxiliary exhaust box 810 described later.

[0195] In addition, the exhaust passage E is formed along the shape of the column member 510 with the inclined portion 513 on the rear side.

[0196] An intake 702 communicating with the return passage B is formed at the rear end 500a of the lower end of the front column member 500. The rear end 500a extends in the width direction (X direction) of the device. In this embodiment, the exhaust port 701 is formed at a first height position, and the intake 702 is formed at a second height position different from the first height position (in the illustration, the second height position is higher than the first height position). A fan (not shown) may also be provided in the return passage B of the front column member 500 to guide the gas around the intake 702 into the return passage B.

[0197] Furthermore, as a component that guides the gas discharged from the exhaust passage E of the rear column member 510 to the return passage B of the front column member 500, such as Figure 20 and Figure 21 As shown, a secondary exhaust box 810 is provided inside the housing 120 for supplying gas from the exhaust passage E.

[0198] On the X-direction positive side of the main body 102, the auxiliary exhaust box 810 is provided on the bottom wall 124. Specifically, the auxiliary exhaust box 810 is provided on the bottom wall 124 in a manner that is parallel to the exhaust box 250 (hereinafter, sometimes referred to as "main exhaust box 250") in the width direction (X direction) of the device.

[0199] Furthermore, the auxiliary exhaust box 810 is configured to connect the rear column member 510 and the front column member 500. Specifically, the auxiliary exhaust box 810 is configured to connect the exhaust port 701 of the rear column member 510 and the intake port 702 of the front column member 500.

[0200] Furthermore, in this embodiment, the auxiliary exhaust box 810 is configured to supply gas to the transport space S1. Specifically, the auxiliary exhaust box 810 is connected to the main exhaust box 250, such as... Figure 22 As shown, an opening 811 is formed on the surface of the main exhaust box 250. More specifically, the auxiliary exhaust box 810 is configured such that the first box 821, described later, is adjacent to the main exhaust box 250 in the width direction (X direction) of the device, and an opening 811 is formed on the surface 821a of the first box 821 on the side of the main exhaust box 250.

[0201] An opening 251 is formed on the end face 250a of the main exhaust box 250 on the side of the auxiliary exhaust box 810, i.e., the exhaust passage E and the return passage B, in the width direction (X direction) of the device when viewed from above. The internal space of the main exhaust box 250 and the internal space of the auxiliary exhaust box 810 are connected through the opening 811 and the opening 251. In addition, the aforementioned end face 250a extends in the depth direction (Y direction) of the device.

[0202] The auxiliary exhaust box 810 may have, for example, a first box 821 and a second box 822 disposed at different height positions. For example, the first box 821 is disposed below the second box 822.

[0203] The first box 821 and the second box 822 are both hollow, specifically hollow cuboids.

[0204] The first box 821 is connected to the portion of the rear column member 510 that has the outlet 701.

[0205] The surface 821a on the side of the main exhaust box 250 of the first box 821 becomes the first surface connected to the aforementioned end face 250a of the main exhaust box 250. This surface 821a extends in the longitudinal direction (Y direction) of the device and has an opening 811 formed as described above. The internal space of the main exhaust box 250 and the internal space of the first box 821 are connected via the opening 811 and the opening 251.

[0206] Furthermore, the rear end 821b of the first housing 821 becomes a second surface connected to the end face of the return passage B side of the column member 510, which has an internal exhaust passage E, when viewed from above, i.e., the front end 510b. This rear end 821b extends in the width direction (X direction) of the device and has an opening 812. The internal space of the first housing 821 communicates with the exhaust passage E formed in the column member 510 via the opening 812 and the exhaust outlet 701.

[0207] Furthermore, the upper part 821c of the first box 821 is connected to the lower part 822a of the second box 822. The upper part 821c extends horizontally and has an opening 813.

[0208] The lower part 822a of the second box 822 extends horizontally in the same way as the upper part 821c of the first box 821, and forms an opening 814.

[0209] The internal space of the first box 821 and the internal space of the second box 822 are connected through openings 813 and 814.

[0210] Furthermore, the front face 822b of the second housing 822 becomes the third surface connected to the end face of the exhaust passage E side of the column member 500, which has a return passage B formed inside, when viewed from above, i.e., the rear face 500a. This front face 822b extends in the width direction (X direction) of the device and has an opening 815. The internal space of the second housing 822 communicates with the return passage B formed in the column member 500 via the opening 815 and the access port 702.

[0211] Alternatively, the auxiliary exhaust box 810 may also be equipped with a fan 830 that supplies gas from the main exhaust box 250 into the auxiliary exhaust box 810. The fan 830 may be installed, for example, inside the first box 821.

[0212] In this embodiment, the gas in the containment space S2 is supplied to the transport space S1 and the storage space S11 respectively, and the gas discharged from the exhaust passage E and the gas in the transport space S1, which are supplied to the auxiliary exhaust box 810 provided in the housing 120, are returned to the containment space S2 via the return passage B. Thus, the gas in the containment space S2 can be supplied to the storage space S11 and the transport space S1 again.

[0213] In addition, in the conveying device 20 of this embodiment, a portion of the gas exhausted to the exhaust passage E can be circulated, while the remainder is exhausted to the outside of the device via the storage exhaust pipe 750.

[0214] In addition, such as Figure 21 As shown, one end of a supply pipe 270 for supplying an inert gas such as nitrogen to the containment space S2 can also be connected to the housing 120. A gas supply mechanism 271 is connected to the other end of the supply pipe 270. The gas supply mechanism 271 includes, for example, an inert gas supply source, a switching valve for switching the inert gas supply on / off, and a flow regulating valve for adjusting the flow rate of the inert gas.

[0215] By providing the supply pipe 270 as described above, purified inert gas can be supplied from the first FFU 260 and the second FFU 720, and the inert gas can be circulated inside the main body 102.

[0216] Alternatively, dry air can be circulated inside the main body 102. In this case, for example, dry air is supplied to the containment space S2 from the gas supply mechanism 271 via the supply pipe 270.

[0217] <Main Effects of This Implementation>

[0218] According to this embodiment, even when the gas used for storage space S11 is circulated, due to the provision of the second FFU720 and the gas supply passage D, a suitable airflow can be formed in both the transport space S1 and the storage space S11.

[0219] Furthermore, in this embodiment, the return passage B is formed within the column member 500. Moreover, the column member 510 with the exhaust passage E formed inside and the column member 500 with the return passage B formed inside are arranged along the longitudinal direction (Y direction) of the device and are opposite to each other. Therefore, the distance from the column member 510 with the exhaust passage E to the column member 500 with the return passage B is shorter. Therefore, as in this embodiment, when the gas supplied from the housing space S2 to the storage space S11 and discharged via the exhaust passage E is returned to the housing space S2 via the return passage B for circulation, the large size of the component (specifically, the auxiliary exhaust box 810) that guides the gas discharged from the exhaust passage E of the column member 510 to the return passage B of the column member 500 can be suppressed. Therefore, it helps to reduce the manufacturing cost of the auxiliary exhaust box 810, which in turn helps to reduce the manufacturing cost of the handling device 20.

[0220] Furthermore, in this embodiment, the gas discharged from the exhaust passage E is supplied to the return passage B via the auxiliary exhaust box 810. Therefore, it is possible to suppress the disturbance of the downflow formed in the transport space S1 by the gas discharged from the exhaust passage E. As a result, it is possible to suppress the formation of eddies in the transport space S1 caused by the disturbance of the downflow, thereby preventing the stirring of particles.

[0221] Furthermore, in this embodiment, the auxiliary exhaust box 810 has a hollow first box 821 and a second box 822 disposed at different height positions. The first box 821 and the second box 822 are connected by their hollow portions communicating with each other. A first surface (surface 821a) connected to the end face 250a of the exhaust passage E and return passage B side when viewed from above of the main exhaust box 250, and a second surface (rear face 821b) connected to the end face (front face 510b) of the return passage B side when viewed from above of the column member 510 in which the exhaust passage E is formed, are disposed in the first box 821. In addition, a third surface (front face 822b) connected to the end face (rear face 500a) of the column member 500 in which the return passage B is formed, when viewed from above, is disposed in the second box 822.

[0222] Unlike this embodiment, in the configuration where the auxiliary exhaust box 810 is constructed from a single cuboid box, it is sometimes difficult to ensure that the first to third surfaces are tightly connected to the end faces (surface 821a, front face 510b, rear face 500a) of the corresponding components. In contrast, in this embodiment, since the auxiliary exhaust box 810 is constructed as described above, the first to third surfaces can be tightly connected to the end faces of the corresponding components. Therefore, leakage of gas from the connection between the auxiliary exhaust box 810 and the main exhaust box 250, and from the connection between the auxiliary exhaust box 810 and the column components 500, 510, into the transport space S1 can be suppressed. As a result, the downflow formed in the transport space can be prevented from being disturbed by gas leaking from the connection. Furthermore, in this embodiment, the shapes of the first box 821 and the second box 822 can be simple cuboid shapes. Therefore, according to this embodiment, it is helpful to reduce the manufacturing cost of the auxiliary exhaust box 810, which in turn helps to reduce the manufacturing cost of the transport device 20.

[0223] Furthermore, in this embodiment, the column member 510 disposed on the rear side extends downward from its upper end to the inclined portion 513, the inclined portion 513 faces forward and extends obliquely downward, and extends downward from the inclined portion 513 to its lower end. Moreover, the exhaust passage E is formed inside the column member 510 along the shape of the column member 510. Therefore, the space S21 below the inclined portion 513 can be used as a receiving space for the exhaust pipe 750 and the like. As a way to form the receiving space in the same position as in this embodiment, it is possible to form the rear column member 510 and the exhaust passage E in a crank shape, but compared with this method, according to this embodiment, the gas flow in the exhaust passage E can be smoother.

[0224] Furthermore, in this embodiment, a fan 800 is provided to guide the gas supplied to the storage space S11 into the exhaust passage E. Therefore, the exhaust flow rate from the storage space S11 can be adjusted. In addition, the flow rate of gas supplied from the containment space S2 to the storage space S11 and discharged through the exhaust passage E can be ensured to return to the containment space S2 via the return passage B.

[0225] <Modifications of the Second Embodiment>

[0226] In the above example, the first side set in the first box 821 can also be set in the second box 822.

[0227] <Modifications of the First and Second Embodiments>

[0228] The first FFU260 and the second FFU720 can be housed in the same housing space S2, but they can also be housed in separate, independent spaces.

[0229] As in the second embodiment, in a manner where the gas discharged from the exhaust passage E returns to the space housing the first FFU 260 via the return passage B, thereby circulating the gas from the second FFU 720, when the first FFU 260 and the second FFU 720 are housed in separate, independent spaces, for example, the configuration is as follows: The space housing the first FFU 260 and the space housing the second FFU 720 are connected by a gas supply pipe.

[0230] In the above example, the exhaust passage E is shared among multiple areas R of the storage space S11. However, an exhaust passage E can also be provided in each area R, and each exhaust passage can be formed within a single column member. Alternatively, two exhaust passages can be formed within the column member, with one exhaust passage venting from a portion of the area (e.g., the area on the upper three floors) and the other exhaust passage venting from other areas (e.g., the area on the lower two floors). When multiple exhaust passages are formed within a single column member, storage exhaust pipes 750 and fans 800 can be provided for each exhaust passage. Furthermore, when multiple exhaust passages are formed within a single column member, for example, an exhaust outlet 701 can be provided in each exhaust passage, and a secondary exhaust box 810 can be shared among the exhaust passages.

[0231] In the above example, the storage space S11 is connected to the rear side of the transport space S1, but it can also be connected to the front side of the transport space S1. In this case, an exhaust passage E is formed in the front column member, and a return passage B is formed in the rear column member. However, connecting the storage space S11 to the rear side of the transport space S1 is more conducive to maintaining the number of load ports 101 and reducing the footprint of the device.

[0232] Furthermore, the storage space S11 located at one end of the device width direction may be different from the storage space S11 located at the other end of the device width direction. For example, the number of regions R, i.e. the number of divisions of the storage space S11, may be different between the storage space S11 located at one end of the device width direction and the storage space S11 located at the other end of the device width direction.

[0233] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The above embodiments may be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit. For example, the constituent elements of the above embodiments can be arbitrarily combined. Such arbitrary combinations can, of course, achieve the effects and functions of each constituent element involved in the combination, and can achieve other effects and functions that are obvious to those skilled in the art from the description herein.

[0234] Furthermore, the effects described in this specification are illustrative or exemplary only and are not restrictive. That is, the technology involved in this disclosure may produce other effects besides those described above, or in place of those described above, that are obvious to those skilled in the art from the description in this specification.

[0235] In addition, the following configuration examples also fall within the technical scope of this disclosure.

[0236] (1) A conveying device for moving substrates into and out of a processing device for processing substrates.

[0237] The device has a main body comprising: a transport space for housing a transport robot for transporting the substrate; and a storage space connected to the transport space and supporting the substrate.

[0238] The aforementioned main body possesses:

[0239] The first fan filter unit is disposed above the transport space and delivers the gas supplied to the transport space.

[0240] The second fan filter unit is set separately from the first fan filter unit and sends out the gas supplied to the storage space.

[0241] The gas supply passage supplies the gas from the second fan filter unit to the storage space; and

[0242] The exhaust passage discharges the gas supplied to the aforementioned storage space.

[0243] (2) According to the conveying device described in (1) above, wherein,

[0244] The aforementioned storage space is divided into multiple zones.

[0245] (3) The conveying device described in (1) or (2) above, wherein,

[0246] The main body also includes a housing constituting the transport space. The housing has a wall and a column member connected to the wall. The wall is formed to connect to the front of a load port for holding a container for receiving the substrate, to the rear of a load lock provided in the processing device, and to a pair of side surfaces connecting the front and the rear.

[0247] (4) According to the conveying device described in (3) above, wherein,

[0248] At least a portion of the aforementioned gas supply passage is formed within the aforementioned wall portion of the aforementioned housing.

[0249] (5) The conveying device as described in (3) or (4), wherein,

[0250] The aforementioned exhaust passage is formed within the aforementioned column member of the aforementioned housing.

[0251] (6) The conveying device described in any one of (1) to (5) above, wherein,

[0252] The aforementioned main body also possesses:

[0253] The gas supply port is continuous with the aforementioned gas supply passage; and

[0254] The baffle component has multiple through holes and covers the aforementioned air supply port.

[0255] (7) The conveying device described in (1) or (2) above, wherein,

[0256] The aforementioned main body also possesses:

[0257] The exhaust port is continuous with the aforementioned exhaust passage; and

[0258] The baffle component has multiple through holes and covers the aforementioned exhaust port.

[0259] (8) The conveying device described in any one of (1) to (7) above, wherein,

[0260] The aforementioned main body also possesses:

[0261] The gas supply surface forms a gas supply port that is continuous with the aforementioned gas supply passage and faces the aforementioned storage space; and

[0262] The exhaust surface forms an exhaust port that is continuous with the aforementioned exhaust passage and faces the aforementioned storage space.

[0263] The virtual normals extending from the aforementioned air supply surface and the aforementioned exhaust surface intersect with the aforementioned transport space, respectively.

[0264] The aforementioned air supply surface is not parallel to the aforementioned air exhaust surface.

[0265] (9) The conveying device described in any one of (1) to (7) above, wherein,

[0266] The aforementioned main body also possesses:

[0267] The gas supply surface forms a gas supply port that is continuous with the aforementioned gas supply passage and faces the aforementioned storage space; and

[0268] The exhaust surface forms an exhaust port that is continuous with the exhaust passage and faces the storage space.

[0269] The virtual normals extending from the aforementioned air supply surface and the aforementioned exhaust surface intersect with the aforementioned transport space, respectively.

[0270] The aforementioned air supply surface is parallel to the aforementioned exhaust surface.

[0271] (10) A gas supply method, wherein a gas is supplied to a storage space in a transport device for moving a substrate into and out of a processing device for processing a substrate, wherein the storage space is connected to and supports the substrate in a transport space, and a transport robot for moving the substrate is provided in the transport space.

[0272] The aforementioned conveying device has a main body, which has the aforementioned conveying space and the aforementioned storage space.

[0273] The aforementioned main body possesses:

[0274] A first fan filter unit is disposed above the aforementioned transport space and supplies gas to the aforementioned transport space; and

[0275] The exhaust passage discharges the gas supplied to the aforementioned storage space.

[0276] The gas delivered by the second fan filter unit is supplied to the storage space, wherein the second fan filter unit is provided separately from the first fan filter unit in the main body.

[0277] Explanation of reference numerals in the attached figures

[0278] 10…processing device; 20…transfer device; 101…load port; 102…main body; 110…transfer robot; 260…first FFU; 720…second FFU; D…air supply passage; E…exhaust passage; S1…transfer space; S11…storage space; W…wafer.

Claims

1. A conveying device for moving substrates into and out of a processing device for processing substrates. The device has a main body comprising: a transport space for housing a transport robot for transporting the substrate; and a storage space connected to the transport space and supporting the substrate. The aforementioned main body possesses: The first fan filter unit is disposed above the transport space and delivers the gas supplied to the transport space. The second fan filter unit is set separately from the first fan filter unit and sends out the gas supplied to the storage space. The gas supply passage supplies the gas delivered from the second fan filter unit to the storage space. as well as The exhaust passage discharges the gas supplied to the aforementioned storage space.

2. The conveying device according to claim 1, wherein, The aforementioned storage space is divided into multiple zones.

3. The conveying device according to claim 1 or 2, wherein, The main body also includes a housing constituting the transport space. The housing has a wall and a column member connected to the wall. The wall is formed to connect to the front of a load port for holding a container for receiving the substrate, to the rear of a load lock provided in the processing device, and to a pair of side surfaces connecting the front and the rear.

4. The conveying device according to claim 3, wherein, At least a portion of the aforementioned gas supply passage is formed within the aforementioned wall portion of the aforementioned housing.

5. The conveying device according to claim 3, wherein, The aforementioned exhaust passage is formed within the aforementioned column member of the aforementioned housing.

6. The conveying device according to claim 1 or 2, wherein, The aforementioned main body also possesses: The gas supply port is continuous with the aforementioned gas supply passage; and The baffle component has multiple through holes and covers the aforementioned air supply port.

7. The conveying device according to claim 1 or 2, wherein, The aforementioned main body also possesses: The exhaust port is continuous with the aforementioned exhaust passage; and The baffle component has multiple through holes and covers the aforementioned exhaust port.

8. The conveying device according to claim 1 or 2, wherein, The aforementioned main body also possesses: The gas supply surface forms a gas supply port that is continuous with the aforementioned gas supply passage and faces the aforementioned storage space; and The exhaust surface forms an exhaust port that is continuous with the aforementioned exhaust passage and faces the aforementioned storage space. The virtual normals extending from the aforementioned air supply surface and the aforementioned exhaust surface intersect with the aforementioned transport space, respectively. The aforementioned air supply surface is not parallel to the aforementioned air exhaust surface.

9. The conveying device according to claim 1 or 2, wherein, The aforementioned main body also possesses: The gas supply surface forms a gas supply port that is continuous with the aforementioned gas supply passage and faces the aforementioned storage space; and The exhaust surface forms an exhaust port that is continuous with the exhaust passage and faces the storage space. The virtual normals extending from the aforementioned air supply surface and the aforementioned exhaust surface intersect with the aforementioned transport space, respectively. The aforementioned air supply surface is parallel to the aforementioned exhaust surface.

10. A gas supply method, comprising supplying gas to a storage space in a conveying device for moving a substrate into and out of a processing apparatus, wherein, The aforementioned storage space is connected to and supports the aforementioned substrate, and a transport robot for transporting the aforementioned substrate is installed in the aforementioned transport space. The aforementioned conveying device has a main body, which has the aforementioned conveying space and the aforementioned storage space. The aforementioned main body possesses: A first fan filter unit is disposed above the aforementioned transport space and supplies gas to the aforementioned transport space; and The exhaust passage discharges the gas supplied to the aforementioned storage space. The gas delivered by the second fan filter unit is supplied to the storage space, wherein the second fan filter unit is provided separately from the first fan filter unit in the main body.

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