Substrate transport system

Abstract

Provided is a technology that can suppress contamination of a substrate caused by dust emission from a mechanical contact portion and has a simple structure in a substrate transport system. The substrate transport system includes a first substrate transport mechanism and a second substrate transport mechanism and a buffer unit. The first substrate transport mechanism has a first tubular guide rail, a first inner magnetic structure, a first drive unit, and a first substrate support unit. In the first substrate support unit, a first outer magnetic structure is movable in conjunction with movement of the first inner magnetic structure, and a first end effector is movable in a first direction. The second substrate transport mechanism has a second tubular guide rail, a second inner magnetic structure, a second drive unit, and a second substrate support unit. In the second substrate support unit, a second outer magnetic structure is movable in conjunction with movement of the second inner magnetic structure, and a second end effector is movable in a second direction. The buffer unit is capable of transporting a substrate between the first end effector and the second end effector.

Description

Technical Field

[0001] The exemplary embodiments of the present invention relate to a substrate delivery system. Background Technology

[0002] As a technology for making the transport unit magnetically levitate and move it, there are technologies described in Patent Documents 1 and 2.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2022-133867.

[0006] Patent document 2: U.S. Patent Publication No. 2023 / 0085667. Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] This invention provides a technique for suppressing substrate contamination caused by dust generation from mechanical contact parts in a substrate transport system, and has a simple structure.

[0009] Means for solving technical problems

[0010] An exemplary embodiment of the substrate transport system of the present invention includes a chamber, a first substrate transport mechanism, a second substrate transport mechanism, and a buffer unit. The first substrate transport mechanism has: two first tubular guide rails extending along a first direction at a first height within the chamber; a first inner magnet structure disposed within one of the two first tubular guide rails; a first drive unit capable of moving the first inner magnet structure within the first tubular guide rail along the first direction; and a first substrate support unit having a first end effector and a first outer magnet structure disposed in a manner surrounding one of the first tubular guide rails, the first outer magnet structure being movable following the movement of the first inner magnet structure; the first end effector being movable along the two first tubular guide rails in the first direction; and the second substrate transport mechanism having: two second... A tubular guide rail extends within the cavity at a second height different from the first height along a second direction intersecting the first direction; a second inner magnet structure is disposed within one of the two second tubular guide rails; a second drive unit is capable of moving the second inner magnet structure within one of the second tubular guide rails along the second direction; and a second substrate support unit having a second end effector and a second outer magnet structure disposed in a manner surrounding one of the second tubular guide rails, the second outer magnet structure being capable of moving following the movement of the second inner magnet structure, the second end effector being capable of moving along the two second tubular guide rails in the second direction, and a buffer unit disposed within the cavity in a top view in an intersecting area surrounded by the two first tubular guide rails and the two second tubular guide rails, capable of transporting the substrate between the first end effector and the second end effector.

[0011] Invention Effects

[0012] According to an exemplary embodiment of the present invention, a technique is provided that can suppress substrate contamination caused by dust generation from mechanical contact parts in a substrate transport system, and has a simple structure. Attached Figure Description

[0013] Figure 1 This is a diagram used to illustrate the structure of a substrate processing system.

[0014] Figure 2 This is a diagram used to illustrate a structural example of a substrate delivery system.

[0015] Figure 3 This is a diagram used to illustrate the internal structure of the first tubular guide rail and the structure of the first substrate support unit.

[0016] Figure 4 This is a diagram used to illustrate the internal structure of the second tubular guide rail and the structure of the second substrate support unit.

[0017] Figure 5 This is a diagram used to illustrate an example of the first end effector moving onto the substrate support of the buffer unit.

[0018] Figure 6 This is a diagram illustrating an example of the substrate support rising and receiving the substrate from the first end effector.

[0019] Figure 7 This is a diagram used to illustrate an example of the first end effector moving in the X direction and retracting from below the substrate.

[0020] Figure 8 This diagram illustrates an example of the substrate support being lowered and the substrate being transferred to the second end effector.

[0021] Figure 9 This is a diagram illustrating an example of how the stop position of the first end effector in the X direction is corrected.

[0022] Figure 10 This is a diagram illustrating an example of how the stop position of the second end effector in the Y direction is corrected. Detailed Implementation

[0023] The various embodiments of the present invention will now be described.

[0024] In one exemplary embodiment, a substrate transport system is provided, comprising a chamber, a first substrate transport mechanism, a second substrate transport mechanism, and a buffer unit. The first substrate transport mechanism has: two first tubular guide rails extending along a first direction at a first height within the chamber; a first inner magnet structure disposed within one of the two first tubular guide rails; a first drive unit capable of moving the first inner magnet structure within the first tubular guide rail along the first direction; and a first substrate support unit having a first end effector and a first outer magnet structure disposed surrounding one of the first tubular guide rails, the first outer magnet structure being movable following the movement of the first inner magnet structure, the first end effector being movable along the two first tubular guide rails in the first direction. The second substrate transport mechanism has: two first... Two tubular guide rails extend within the cavity at a second height different from the first height along a second direction intersecting the first direction; a second inner magnet structure is disposed within one of the two second tubular guide rails; a second drive unit is capable of moving the second inner magnet structure within one of the second tubular guide rails along the second direction; and a second substrate support unit having a second end effector and a second outer magnet structure disposed in a manner surrounding one of the second tubular guide rails, the second outer magnet structure being capable of moving following the movement of the second inner magnet structure, the second end effector being capable of moving along the two second tubular guide rails in the second direction, and a buffer unit disposed within the cavity in a top view in an intersecting area surrounded by the two first tubular guide rails and the two second tubular guide rails, capable of transporting the substrate between the first end effector and the second end effector.

[0025] In one exemplary embodiment, the first end effector is capable of delivering the substrate at a third height, and the second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

[0026] In one exemplary implementation, the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0027] In one exemplary embodiment, the buffer unit has a substrate support and a third drive unit, which is capable of moving the substrate support longitudinally so that the substrate on the substrate support moves longitudinally between a third height and a fourth height.

[0028] In one exemplary embodiment, the first substrate support unit has an additional first end effector integrally formed with the first end effector, the front end of the additional first end effector being located on the opposite side of the front end of the first end effector.

[0029] In one exemplary embodiment, the second substrate support unit has an additional second end effector integrally formed with the second end effector, the front end of the additional second end effector being located on the opposite side of the front end of the second end effector.

[0030] In one exemplary embodiment, the first substrate transport mechanism includes: an additional first inner magnet structure disposed within another of two first tubular guide rails; an additional first drive unit capable of moving the additional first inner magnet structure within the other first tubular guide rail along a first direction; and an additional first substrate support unit having an additional first end effector and an additional first outer magnet structure disposed surrounding the other first tubular guide rail, the additional first outer magnet structure being movable following the movement of the additional first inner magnet structure, and the additional first end effector being movable along the two first tubular guide rails in the first direction.

[0031] In one exemplary embodiment, the front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

[0032] In one exemplary embodiment, the second substrate transport mechanism includes: an additional second inner magnet structure disposed within another of the two second tubular guide rails; an additional second drive unit capable of moving the additional second inner magnet structure along a second direction within the other second tubular guide rail; and an additional second substrate support unit having an additional second end effector and an additional second outer magnet structure disposed in a manner surrounding the other second tubular guide rail, the additional second outer magnet structure being movable following the movement of the additional second inner magnet structure, and the additional second end effector being movable along the two second tubular guide rails in a second direction.

[0033] In one exemplary embodiment, the front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

[0034] In one exemplary embodiment, a control unit is also included, which is capable of controlling the movement of the first end effector such that when the substrate is transferred from the first end effector to the substrate support of the buffer unit, the center of the substrate in the first direction coincides with the center of the substrate support.

[0035] In one exemplary embodiment, the control unit is able to control the movement of the second end effector so that when the substrate is transferred from the second end effector to the substrate support of the buffer unit, the center of the substrate in the second direction coincides with the center of the substrate support.

[0036] In one exemplary embodiment, a substrate transport system is provided, comprising a vacuum transport chamber, a plurality of first substrate transport mechanisms, a plurality of second substrate transport mechanisms, and a plurality of buffer units. Each of the plurality of first substrate transport mechanisms includes: a plurality of first tubular guide rails extending along a first direction at a first height within the vacuum transport chamber; a plurality of first inner magnet structures respectively disposed within the plurality of first tubular guide rails; a plurality of first drive units capable of moving the plurality of first inner magnet structures along the first direction; and a first substrate support unit having a first end effector and a plurality of first outer magnet structures disposed such that they surround the plurality of first tubular guide rails. The plurality of first outer magnet structures are movable following the movement of the plurality of first inner magnet structures, and the first end effector is movable in the first direction. Each of the plurality of second substrate transport mechanisms includes: a plurality of second tubular guide rails extending along a first direction at a first height within the vacuum transport chamber; a plurality of first inner magnet structures respectively disposed within the plurality of first tubular guide rails; a plurality of first drive units capable of moving the plurality of first inner magnet structures along the first direction; and a plurality of buffer units. The chamber extends at a second height different from the first height along a second direction intersecting the first direction; a plurality of second inner magnet structures are respectively disposed within a plurality of second tubular guide rails; a plurality of second drive units are respectively capable of moving the plurality of second inner magnet structures along the second direction; and a second substrate support unit, the second substrate support unit having a second end effector and a plurality of second outer magnet structures disposed in such a manner as to surround the plurality of second tubular guide rails, the plurality of second outer magnet structures being able to move following the movement of the plurality of second inner magnet structures, the second end effector being able to move in the second direction, and a plurality of buffer units, when viewed from above, are respectively disposed in a plurality of intersection areas where the plurality of first tubular guide rails included in the plurality of first substrate transport mechanisms and the plurality of second tubular guide rails included in the plurality of second substrate transport mechanisms intersect, and are able to transport substrates between the first end effector and the second end effector.

[0037] In one exemplary embodiment, the first end effector is capable of delivering the substrate at a third height, and the second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

[0038] In one exemplary implementation, the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0039] In one exemplary embodiment, each of the plurality of buffer units has a substrate support and a third drive unit, the third drive unit being capable of moving the substrate support longitudinally so that the substrate on the substrate support moves longitudinally between a third height and a fourth height.

[0040] In one exemplary embodiment, the first substrate support unit has an additional first end effector integrally formed with the first end effector, the front end of the additional first end effector being located on the opposite side of the front end of the first end effector.

[0041] In one exemplary embodiment, the second substrate support unit has an additional second end effector integrally formed with the second end effector, the front end of the additional second end effector being located on the opposite side of the front end of the second end effector.

[0042] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the same reference numerals are used to denote the same elements or identical elements in each drawing, and repeated descriptions are omitted. Unless otherwise specified, positional relationships such as up, down, left, and right are described based on the positional relationships shown in the drawings. The scale of the drawings does not represent an actual scale, and the actual scale is not limited to the scale shown.

[0043] <Example of a substrate processing system structure>

[0044] Reference Figure 1 A substrate processing system (hereinafter also referred to as "substrate processing system PS") according to one embodiment will be described. Figure 1 This is a diagram used to illustrate the structure of a substrate processing system (PS).

[0045] The substrate processing system PS includes: vacuum delivery module TM, processing modules PM1 to PM8, loading lock modules LL1 and LL2, atmospheric delivery module LM, loading ports LP1 to LP4, aligner AN, storage device SR, etc.

[0046] The vacuum transport module TM has a generally square shape when viewed from above. Processing modules PM1 to PM8 are connected to multiple sides of the vacuum transport module TM. Loading locking modules LL1 and LL2 are connected to a portion of the side of the vacuum transport module TM. In one embodiment, the vacuum transport module TM can be part of a substrate transport system 200. The substrate transport system 200 is capable of transporting substrates between the loading locking modules LL1 and LL2 and the processing modules PM1 to PM8. The substrate transport system 200 can transport substrates based on operation instructions output by the control unit CU (described later). Alternatively, the substrate transport system 200 can transport objects other than substrates. Detailed descriptions of the structural examples of the substrate transport system 200 will be provided later.

[0047] Furthermore, the substrate used as the transport object can be, for example, a semiconductor wafer, a dummy wafer, a sensor wafer, etc. The transport object may include consumable components. These consumable components are components that can be replaced and installed within the processing modules PM1 to PM8, and may be components that are consumed by various processes such as plasma processing performed within the processing modules PM1 to PM8. Consumable components may include, for example, components forming a ring assembly disposed around the substrate support portion of the plasma processing apparatus; and components forming a spray head for supplying processing gas to the plasma processing space.

[0048] Processing modules PM1 to PM8 each have a processing chamber and a substrate support disposed within it. At least one of the processing modules PM1 to PM8 may be a plasma processing module. In one embodiment, at least one of the processing modules PM1 to PM8 may be a processing module capable of depressurizing the interior and introducing processing gas after the substrate is disposed on the substrate support, supplying RF electrical power to generate plasma, and using the plasma to perform plasma processing on the substrate. The vacuum transport module TM may be separated from the processing modules PM1 to PM8 by an openable and closable gate valve.

[0049] Loading and locking modules LL1 and LL2 are configured between the vacuum transport module TM and the atmospheric transport module LM. Loading and locking modules LL1 and LL2 have variable internal pressure chambers capable of switching their internal pressure to vacuum or atmospheric pressure. Loading and locking modules LL1 and LL2 also have internal worktables (placement stages). When feeding a substrate from the atmospheric transport module LM to the vacuum transport module TM, loading and locking modules LL1 and LL2 can adjust their internal pressure to atmospheric pressure to receive the substrate from the atmospheric transport robot TR3 of the atmospheric transport module LM, and adjust their internal pressure to vacuum to transfer the substrate to the first substrate support unit 303 of the vacuum transport module TM (described later). Furthermore, when feeding a substrate from the vacuum transport module TM to the atmospheric transport module LM, loading and locking modules LL1 and LL2 can adjust their internal pressure to vacuum to receive the substrate from the first substrate support unit 303 of the vacuum transport module TM, and adjust their internal pressure to atmospheric pressure to transfer the substrate to the atmospheric transport robot TR3 of the atmospheric transport module LM. Loading and locking modules LL1 and LL2 and the vacuum transport module TM can be separated by an openable and closable gate valve. The loading locking modules LL1 and LL2 and the atmospheric delivery module LM can be separated by gate valves that can be opened and closed.

[0050] The atmospheric transport module LM is configured opposite the vacuum transport module TM, separated by loading locking modules LL1 and LL2. The atmospheric transport module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM is cuboid in shape and includes an FFU (Fan Filter Unit) with an atmospheric transport chamber maintained at atmospheric pressure. Two loading locking modules LL1 and LL2 and a storage device SR are connected to one side of the atmospheric transport module LM along its long side (Y direction). Loading ports LP1 to LP4 are connected to the other side of the atmospheric transport module LM along its long side (Y direction). An aligner AN is connected to one side of the atmospheric transport module LM along its short side (X direction). Furthermore, the connection positions of the storage device SR and the aligner AN relative to the atmospheric transport module LM are not limited to these and can be arbitrarily selected. Within the atmospheric transport module LM, an atmospheric transport robot TR3 is configured for transporting objects, including substrates.

[0051] The atmospheric transport robot TR3 is configured to move along the long side of the atmospheric transport module LM, and is also configured to rotate, extend, and lift. The atmospheric transport robot TR3 can transport objects based on motion instructions output by the control unit CU (described later). For example, the atmospheric transport robot TR3 can place and hold the object on the end effector EE3 located at the front end, and transport the object between loading ports LP1-LP4, loading locking modules LL1 and LL2, the aligner AN, and the storage device SR.

[0052] Loading ports LP1 to LP4 are configured to accommodate multiple containers C. Container C can be a container capable of holding multiple (e.g., 25) substrates. Container C can be, for example, a FOUP (Front-Opening Unified Pod).

[0053] The aligner AN can be a device capable of detecting the position (orientation and centering) of the substrate. The aligner AN may include a rotating support stage, an optical sensor (neither shown), etc. In one embodiment, the support stage can support the substrate and rotate about a central axis extending in the vertical direction. The support stage can be rotated by a drive device (not shown). The drive device can be controlled by a control unit CU. When the power from the drive device causes the support stage to rotate, the substrate placed on the support stage also rotates.

[0054] In one embodiment, the optical sensor is capable of detecting the edge of the substrate during substrate rotation. Based on the edge detection results, the optical sensor can detect the offset of the substrate's center position relative to a reference position and the offset of the angular position of a notch (or other mark) on the substrate relative to a reference angular position. The optical sensor can output the offset of the substrate's center position and the offset of the notch's angular position to the control unit CU.

[0055] Storage device SR can be a storage device capable of storing and keeping transported objects, including consumable parts.

[0056] The substrate processing system (PS) can be connected to the control unit (CU) via a communication interface. In one embodiment, the control unit (CU) may be part or all of the substrate processing system (PS). The control unit (CU) may be, for example, a computer. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage devices, etc. The CPU can operate based on programs stored in the ROM or auxiliary storage devices to control various parts of the substrate processing system (PS).

[0057] <Example of a substrate delivery system structure>

[0058] In one embodiment, the substrate delivery system 200 includes a chamber 250, a plurality of first substrate delivery mechanisms 251, a plurality of second substrate delivery mechanisms 252, and a plurality of buffer units 253. Figure 1 In the example shown, the substrate transport system 200 includes: a chamber 250; two first substrate transport mechanisms 251a and 251b; three second substrate transport mechanisms 252a, 252b and 252c; and six buffer units 253a, 253b, 253c, 253d, 253e and 253f.

[0059] Chamber 250 is a vacuum chamber with a vacuum atmosphere. A vacuum delivery module TM can be an example of chamber 250. In one embodiment, in the first direction of chamber 250 ( Figure 1 The loading and locking modules LL1 and LL2 are connected to one side of the chamber 250 in the X direction. In one embodiment, in the first direction of the chamber 250 (in the X direction), the loading and locking modules LL1 and LL2 are connected to one side of the chamber 250. Figure 1 Processing modules PM7 and PM8 are connected to the other side (in the X direction). Loading locking modules LL1 and LL2 are configured opposite to processing modules PM7 and PM8 in the X direction, separated by chamber 250.

[0060] In one embodiment, in the second direction of chamber 250 ( Figure 1 Processing modules PM1 to PM3 are connected to one side of the chamber 250 in the Y direction. In one embodiment, in the second direction of the chamber 250 (…), processing modules PM1 to PM3 are connected to one side of the chamber 250 in the Y direction. Figure 1 Processing modules PM4 to PM6 are connected to the other side of the chamber (in the Y direction). Processing modules PM1 to PM3 are configured opposite to processing modules PM4 to PM6 in the Y direction, separated by a chamber 250.

[0061] In one embodiment, two first substrate transport mechanisms 251 (251a, 251b) are disposed within chamber 250. The first substrate transport mechanisms 251 (251a, 251b) are capable of moving the substrate in the X direction and transporting the substrate between chamber 250 and loading locking modules LL1, LL2, and between chamber 250 and processing modules PM7, PM8.

[0062] like Figure 1 and Figure 2 As shown, each of the first substrate transport mechanisms 251 (251a, 251b) has: two first tubular guide rails 300; a first inner magnet structure 301 disposed in each of the first tubular guide rails 300; a first drive unit 302 disposed in each of the first tubular guide rails 300; and a first substrate support unit 303 capable of moving along the two first tubular guide rails 300.

[0063] Two first tubular guide rails 300 are located within chamber 250 at a first height along a first direction ( Figure 1 and Figure 2 Extending in the X direction. Two first tubular guide rails 300 are arranged parallel to each other in the horizontal direction. (e.g.) Figure 1 As shown, two first tubular guide rails 300 extend from one side wall of the chamber 250 connected to the loading locking modules LL1 and LL2 to the other side wall connected to the processing modules PM7 and PM8.

[0064] Figure 3This diagram illustrates an example of the internal structure of the first tubular guide rail 300 and an example of the structure of the first substrate support unit 303. A first inner magnet structure 301 and a first drive unit 302 are disposed within the first tubular guide rail 300. The first drive unit 302 includes a threaded shaft 350 extending along the X direction and a motor 351 capable of rotating the threaded shaft 350 about the shaft. The first inner magnet structure 301 is mounted on the threaded shaft 350. The rotation of the threaded shaft 350 by the motor 351 causes the first inner magnet structure 301 to move in the X direction. In one embodiment, the first inner magnet structure 301 has a cylindrical shape with its central axis aligned with the threaded shaft 350. A permanent magnet (first inner magnet) 360 is mounted on the outer circumferential surface of the cylinder of the first inner magnet structure 301. The permanent magnet 360 may have a ring shape along the circumferential direction of the outer circumferential surface of the cylinder. Furthermore, the permanent magnet 360 can be composed of multiple arc-shaped portions and evenly arranged in the circumferential direction on the outer circumferential surface of the cylinder. The first tubular guide rail 300 has an atmospheric chamber inside that is isolated from the external vacuum chamber, and the threaded shaft 350, the motor 351, and the first inner magnet structure 301 are arranged in the atmospheric chamber.

[0065] like Figures 1-3 As shown, the first substrate support unit 303 has: two first end effectors 370; two first outer magnet structures 371 arranged to surround each of the two first tubular guide rails 300; and a first connector 372 connecting the first end effectors 370 to the first outer magnet structures 371.

[0066] The first end effector 370 is also referred to as a pick, fork, or conveyor arm. In one embodiment, the first end effector 370 extends in the horizontal X direction and has a U-shaped double-fork shape at its front end. The first end effector 370 is capable of placing and holding a substrate on its front end. Two first end effectors 370 are formed as a single unit and are arranged with their front ends facing opposite sides. That is, one first end effector 370 faces the loading locking modules LL1 and LL2 side in the X direction, and the other first end effector 370 faces the processing modules PM7 and PM8 side in the X direction.

[0067] The first outer magnet structure 371 is positioned at the center of the two first end effectors 370 in the X direction. The first outer magnet structure 371 is arranged to surround the first tubular guide rail 300. (As shown...) Figure 3As shown, the first outer magnet structure 371 has a cylindrical shape, and the first tubular guide rail 300 passes through the hollow part of the cylinder. The inner diameter of the inner circumferential surface of the first outer magnet structure 371 is larger than the outer diameter of the outer circumferential surface of the first tubular guide rail 300. A permanent magnet (first outer magnet) 380 is mounted on the inner circumferential surface of the first outer magnet structure 371. The permanent magnet 380 may have a ring shape along the circumferential direction of the inner circumferential surface of the cylinder. Furthermore, the permanent magnet 380 may be composed of multiple arcuate portions and uniformly arranged in the circumferential direction of the inner circumferential surface of the cylinder. In one embodiment, the polarity of the permanent magnet 380 is different from that of the permanent magnet 360. The first outer magnet structure 371 is capable of moving along with the movement of the first inner magnet structure 301.

[0068] like Figure 2 As shown, in one embodiment, the first connector 372 has two vertical portions 390 extending downward from the two first outer magnet structures 371; and a horizontal portion 391 extending inward from the two vertical portions 390. The base of the first end effector 370 is connected to the horizontal portion 391. Therefore, the third height at which the first end effector 370 transports the substrate is lower than the first height of the first tubular guide rail 300.

[0069] As described above, the first substrate support unit 303 is configured such that the first outer magnet structure 371 can move along with the movement of the first inner magnet structure 301, and the first end effector 370 can move in the X direction.

[0070] like Figure 1 As shown, two first substrate transport mechanisms 251 (251a, 251b) are arranged in the Y direction within the chamber 250. That is, two pairs of first tubular guide rails 300 are arranged within the chamber 250, and two first substrate support units 303 are movable in the X direction. In one embodiment, the first substrate support unit 303 of one first substrate transport mechanism 251a can transport substrates to the loading locking module LL1 and the processing module PM7, while the first substrate support unit 303 of the other first substrate transport mechanism 251b can transport substrates to the loading locking module LL2 and the processing module PM8.

[0071] In one embodiment, three second substrate transport mechanisms 252 (252a, 252b, 252c) are disposed within the chamber 250. The second substrate transport mechanisms 252 (252a, 252b, 252c) are capable of moving the substrate in the Y direction orthogonal to the X direction, transporting the substrate between the chamber 250 and the processing modules PM1 to PM6.

[0072] like Figure 1 and Figure 2As shown, each of the second substrate transport mechanisms 252 (252a, 252b, 252c) has: two second tubular guide rails 400; a second inner magnet structure 401 disposed within each second tubular guide rail 400; a second drive unit 402 disposed within each second tubular guide rail 400; and a second substrate support unit 403 capable of moving along the two second tubular guide rails 400.

[0073] Two second tubular guide rails 400 are located in chamber 250 at a second height different from the first tubular guide rail 300, along a second direction orthogonal to the first direction (X direction). Figure 1 and Figure 2 The second tubular guide rail 400 extends in the Y direction (as shown in the image). It extends at a lower position than the first tubular guide rail 300. The second tubular guide rail 400 is orthogonal to the first tubular guide rail 300 when viewed from above. The two second tubular guide rails 400 are arranged parallel to each other in the horizontal direction. Figure 1 As shown, two second tubular guide rails 400 extend from one side wall of the chamber 250 connected to the processing modules PM1 to PM3 to the other side wall connected to the processing modules PM4 to PM6.

[0074] Figure 4 This diagram illustrates an example of the internal structure of the second tubular guide rail 400 and an example of the structure of the second substrate support unit 403. A second inner magnet structure 401 and a second drive unit 402 are disposed within the second tubular guide rail 400. The second drive unit 402 includes a threaded shaft 450 extending along the Y direction and a motor 451 capable of rotating the threaded shaft 450 about the shaft. The second inner magnet structure 401 is mounted on the threaded shaft 450. The rotation of the threaded shaft 450 by the motor 451 causes the second inner magnet structure 401 to move in the Y direction. In one embodiment, the second inner magnet structure 401 has a cylindrical shape with its central axis aligned with the threaded shaft 450. A permanent magnet (second inner magnet) 460 is mounted on the outer circumferential surface of the cylinder of the second inner magnet structure 401. The permanent magnet 460 may have a ring shape along the circumferential direction of the outer circumferential surface of the cylinder. Furthermore, the permanent magnet 460 can be composed of multiple arcuate portions and evenly arranged circumferentially on the outer circumferential surface of the cylinder. The second tubular guide rail 400 has an atmospheric chamber inside that is isolated from the external vacuum chamber, and the threaded shaft 450, the motor 451, and the second inner magnet structure 401 are disposed in the atmospheric chamber.

[0075] like Figure 1 , Figure 2 and Figure 4As shown, the second substrate support unit 403 has: two second end effectors 470; two second outer magnet structures 471 arranged to surround each of the two second tubular guide rails 400; and a second connector 472 connecting the second end effectors 470 to the second outer magnet structures 471.

[0076] The second end effector 470 is also referred to as a pick-up device, a fork component, or a conveyor arm. In one embodiment, the second end effector 470 extends in the horizontal Y direction and has a U-shaped double-fork shape at its front end. The second end effector 470 is capable of placing and holding a substrate on its front end. Two second end effectors 470 are formed as a single unit and are arranged such that their front ends face opposite sides. That is, one second end effector 470 faces the Y-direction processing modules PM1 to PM3, and the other second end effector 470 faces the Y-direction processing modules PM4 to PM6.

[0077] The second outer magnet structure 471 is positioned at the center of the two second end effectors 470 in the Y direction. The second outer magnet structure 471 is arranged to surround the second tubular guide rail 400. (As shown...) Figure 4 As shown, the second outer magnet structure 471 has a cylindrical shape, and the second tubular guide rail 400 passes through the hollow part of the cylinder. The inner diameter of the inner circumferential surface of the second outer magnet structure 471 is larger than the outer diameter of the outer circumferential surface of the second tubular guide rail 400. A permanent magnet (second outer magnet) 480 is mounted on the inner circumferential surface of the second outer magnet structure 471. The permanent magnet 480 may have a ring shape along the circumferential direction of the inner circumferential surface of the cylinder. Furthermore, the permanent magnet 480 may be composed of multiple arcuate portions and uniformly arranged in the circumferential direction of the inner circumferential surface of the cylinder. The polarity of the permanent magnet 480 is different from that of the permanent magnet 460. The second outer magnet structure 471 is capable of moving along with the movement of the second inner magnet structure 401.

[0078] like Figure 2 As shown, in one embodiment, the second connector 472 has two vertical portions 490 extending upward from the two second outer magnet structures 471, and a horizontal portion 491 extending inward from the two vertical portions 490. The base of the second end effector 470 is connected to the horizontal portion 491. Therefore, the fourth height at which the second end effector 470 transports the substrate is higher than the second height of the second tubular guide rail 400.

[0079] As described above, the second substrate support unit 403 is configured such that the second outer magnet structure 471 can move along with the movement of the second inner magnet structure 401, and the second end effector 470 can move in the Y direction.

[0080] like Figure 1As shown, three second substrate transport mechanisms 252 (252a, 252b, 252c) are arranged in the X direction within the chamber 250. That is, three pairs of second tubular guide rails 400 are arranged within the chamber 250, and three second substrate support units 403 are movable in the Y direction. In one embodiment, the second substrate support unit 403 of one second substrate transport mechanism 252a can transport substrates to processing modules PM1 and PM4 opposite to each other, the second substrate support unit 403 of one second substrate transport mechanism 252b can transport substrates to processing modules PM2 and PM5 opposite to each other, and the second substrate support unit 403 of one second substrate transport mechanism 252c can transport substrates to processing modules PM3 and PM6 opposite to each other.

[0081] In one embodiment, the first tubular guide rail 300 extends in the X direction within the chamber 250, allowing the first substrate support unit 303 to standby in an area that does not overlap with the second tubular guide rail 400 when viewed from above. In another embodiment, the chamber 250 has a standby area 250a on the processing modules PM7 and PM8 side, where no processing modules are connected in the Y direction. The standby area 250a is the area where the second tubular guide rail 400 is not present when viewed from above, and the first tubular guide rail 300 extends into the standby area 250a. Thus, the first substrate support unit 303 can standby in the standby area 250a.

[0082] In one embodiment, six buffer units 253 (253a, 253b, 253c, 253d, 253e, 253f) are disposed within a chamber 250. The buffer units 253, when viewed from above, are disposed in an intersection region 600 within the chamber 250 where two first tubular guide rails 300 and two second tubular guide rails 400 intersect. The intersection region 600 is the area surrounded by the two first tubular guide rails 300 and the two second tubular guide rails 400 when viewed from above. In one embodiment, the buffer unit 253 is disposed at the intersection of the centerline between the two first tubular guide rails 300 and the centerline between the two second tubular guide rails 400. The buffer unit 253 is capable of transporting the substrate between the first end effector 370 and the second end effector 470. Therefore, when viewed from above, the buffer unit 253 is disposed in multiple intersection areas 600 where multiple first tubular guide rails 300 and multiple second tubular guide rails 400 intersect within the chamber 250. That is, multiple buffer units 253a, 253b, 253c, 253d, 253e, and 253f are respectively disposed in multiple intersection areas 600 where multiple first tubular guide rails 300 included in each of multiple first substrate transport mechanisms 251a and 251b intersect with multiple second tubular guide rails 400 included in each of multiple second substrate transport mechanisms 252a, 252b, and 252c within the vacuum transport chamber 250. Specifically, the first buffer unit 253a is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251a and the two second tubular guide rails 400 included in the second substrate transport mechanism 252a. The second buffer unit 253b is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251a and the two second tubular guide rails 400 included in the second substrate transport mechanism 252b. The third buffer unit 253c is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251a and the two second tubular guide rails 400 included in the second substrate transport mechanism 252c. The fourth buffer unit 253d is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251b and the two second tubular guide rails 400 included in the second substrate transport mechanism 252a. The fifth buffer unit 253e is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251b and the two second tubular guide rails 400 included in the second substrate transport mechanism 252b. The sixth buffer unit 253f is disposed in the portion (intersection area) surrounded by the two first tubular guide rails 300 included in the first substrate transport mechanism 251b and the two second tubular guide rails 400 included in the second substrate transport mechanism 252c.

[0083] In one implementation, such as Figure 2As shown, the buffer unit 253 includes a substrate support portion 500 and a drive portion 501. The drive portion 501 is an example of a third drive unit. The drive portion 501 is capable of moving the substrate support portion 500 longitudinally, thereby enabling the substrate on the substrate support portion 500 to move longitudinally between a third height and a fourth height. Therefore, it can also be said that the substrate support portion 500 is capable of moving longitudinally between a position higher than the third height at which the first end effector 370 transports the substrate and a position lower than the fourth height at which the second end effector 470 transports the substrate. The substrate support portion 500 may have a horizontal upper surface for supporting the substrate, on which the substrate can be adsorbed and held.

[0084] <An example of substrate processing>

[0085] An example of substrate processing performed in a substrate processing system (PS) will be described. In one embodiment, substrate processing is performed by a control unit (CU). [The system is] housed in... Figure 1 The substrates in containers C of loading ports LP1-LP4 shown are transported to loading and locking modules LL1 and LL2 by the atmospheric transport robot TR3 of the atmospheric transport module LM. At this time, the interiors of loading and locking modules LL1 and LL2 are maintained at atmospheric pressure. Then, the interiors of loading and locking modules LL1 and LL2 are made into a vacuum. Alternatively, the substrates can be transported to the alignment device AN, and after detecting the center position of the substrates, the substrates are transported to loading and locking modules LL1 and LL2.

[0086] Next, the first substrate support unit 303 within the vacuum transport module TM (chamber 250) moves in the X direction, and the first end effector 370 enters the loading locking modules LL1 and LL2. The first end effector 370 receives the substrate, and then, as... Figure 5 As shown, the first end effector 370 moves onto the substrate support 500 of the buffer unit 253 within the chamber 250. Then, as... Figure 6 As shown, the substrate support 500 rises to receive and support the substrate W from the first end effector 370. Then, as... Figure 7 As shown, the first end effector 370 moves in the X direction, retracting from below the substrate W. Then, as... Figure 8 As shown, the substrate support 500 descends, and the substrate W is transferred to the second end effector 470 of the second substrate support unit 403, which is waiting below. Then, the second substrate support unit 403 moves in the Y direction, and the second end effector 470 enters the processing modules PM1 to PM6 and transfers the substrate W. After transferring the substrate W, the second end effector 470 retracts from the processing modules PM1 to PM6 and returns to the chamber 250.

[0087] In processing modules PM1 to PM6, plasma treatments such as etching are performed on the substrate.

[0088] When the processing of the substrate in processing modules PM1 to PM6 is completed, the second end effector 470 enters processing modules PM1 to PM6. The second end effector 470 receives the substrate W, and then, as... Figure 8 As shown, the second end effector 470 moves onto the substrate support 500 within the chamber 250. Then, as... Figure 7 As shown, the substrate support 500 rises to receive and support the substrate W from the second end effector 470. Then, as... Figure 6 As shown, the first end effector 370 moves in the X direction and enters below the substrate W. Then, as... Figure 5 As shown, the substrate support 500 descends, and the substrate W is transferred to the first end effector 370. Then, Figure 1 The first substrate support unit 303 shown moves in the X direction, and the substrate W is transported to the loading locking modules LL1 and LL2. Alternatively, the substrate W is transported by the first substrate support unit 303, the second substrate support unit 403 and the buffer unit 253 to other processing modules PM1 to PM8, where it is processed and then transported to the loading locking modules LL1 and LL2.

[0089] When the substrate is transported to the loading and locking modules LL1 and LL2, the interiors of the loading and locking modules LL1 and LL2 are maintained under vacuum. Then, the interiors of the loading and locking modules LL1 and LL2 are brought to atmospheric pressure. The substrate is then transported from the loading and locking modules LL1 and LL2 back to the containers C at the loading ports LP1 to LP4 by the atmospheric transport robot TR3 of the atmospheric transport module LM.

[0090] In the aforementioned substrate processing, the movement of the first end effector 370 can be controlled so that when the substrate is transferred from the first end effector 370 to the substrate support 500, the center of the substrate in the X direction coincides with the center of the substrate support 500. Furthermore, the movement of the second end effector 470 can be controlled so that the center of the substrate in the Y direction coincides with the center of the substrate support 500.

[0091] For example, when the center of the substrate W is offset by L1mm in the X direction relative to the correct position (reference position), it can be done as follows: Figure 9 As shown, the stop position of the first end effector 370 when transferring the substrate W to the substrate support 500 is corrected by L1mm in the X direction from the set position. Furthermore, if the center of the substrate W is offset by L2mm in the Y direction relative to the correct position (reference position), it can be corrected as follows: Figure 10As shown, the stop position of the second end effector 470 when transferring the substrate W to the substrate support 500 is adjusted by L2mm in the Y direction from the set position. As a result, the substrate W can be supported on the substrate support 500 in such a way that the center P1 of the substrate support 500 and the center P2 of the substrate W are aligned.

[0092] The offset of the center position of the substrate W can be detected by the aligner AN. The control unit CU can control the movement of the first end effector 370 and the second end effector 470 based on the offset of the center position of the substrate W detected by the aligner AN.

[0093] According to this exemplary embodiment, the substrate transport system 200 includes a chamber 250, a first substrate transport mechanism 251 (251a, 251b), a second substrate transport mechanism 252 (252a, 252b, 252c), and a buffer unit 253 (253a, 253b, 253c, 253d, 253e, 253f). The first substrate transport mechanism 251 (251a, 251b) has a first tubular guide rail 300, a first inner magnet structure 301, a first drive unit 302, and a first substrate support unit 303. The first substrate support unit 303 has a first end effector 370 and a first outer magnet structure 371. The first outer magnet structure 371 is movable following the movement of the first inner magnet structure 301. The first end effector 370 is movable in the X direction. The second substrate transport mechanism 252 (252a, 252b, 252c) has a second tubular guide rail 400, a second inner magnet structure 401, a second drive unit 402, and a second substrate support unit 403. The second substrate support unit 403 has a second end effector 470 and a second outer magnet structure 471. The second outer magnet structure 471 can move along with the movement of the second inner magnet structure 401. The second end effector 470 can move in the Y direction. The buffer unit 253 (253a, 253b, 253c, 253d, 253e, 253f) is disposed in the intersection area 600 of the first tubular guide rail 300 and the second tubular guide rail 400 within the chamber 250, and can transport the substrate between the first end effector 370 and the second end effector 470.

[0094] According to this exemplary embodiment, in the first substrate transport mechanism 251, the first inner magnet structure 301 and the first drive unit 302 are disposed within the first tubular guide rail 300. Therefore, substances that cause contamination can be suppressed from flowing out of the first inner magnet structure 301 and the first drive unit 302 to the outside of the first tubular guide rail 300. The first outer magnet structure 371 of the first substrate support unit 303 can move along with the movement of the first inner magnet structure 301 within the first tubular guide rail 300. The first end effector 370 of the first substrate support unit 303 can move in the X direction. Therefore, the first substrate support unit 303 can move relative to the first tubular guide rail 300 in a non-contact manner. Similarly, in the second substrate transport mechanism 252, the second inner magnet structure 401 and the second drive unit 402 are disposed within the second tubular guide rail 400. Therefore, substances that cause contamination can be prevented from flowing out of the second inner magnet structure 401 and the second drive unit 402 to the outside of the second tubular guide rail 400. The second outer magnet structure 471 of the second substrate support unit 403 can move along with the movement of the second inner magnet structure 401 within the second tubular guide rail 400. The second end effector 470 of the second substrate support unit 403 can move in the Y direction. Therefore, the second substrate support unit 403 can move relative to the second tubular guide rail 400 in a non-contact manner. Furthermore, the substrate can be transported between the first end effector 370 and the second end effector 470 via the buffer unit 253. Therefore, in the substrate transport system 200, contamination of the substrate due to dust from mechanical contact parts can be prevented. In addition, the number and area of ​​magnets are small, thus enabling the realization of an inexpensive substrate delivery system 200 with a simple structure.

[0095] In the above-described embodiments, the first substrate transport mechanism 251 has a first inner magnet structure 301, a first drive unit 302, and a first outer magnet structure 371 in both of the two first tubular guide rails 300. However, it is also possible that only one of the two first tubular guide rails 300 has the first inner magnet structure 301, the first drive unit 302, and the first outer magnet structure 371. The other first tubular guide rail 300 may be a guide for the first end effector 370. Similarly, in the above-described embodiment, the second substrate transport mechanism 252 has a second inner magnet structure 401, a second drive unit 402, and a second outer magnet structure 471 in both of the two second tubular guide rails 400. However, it is also possible that only one of the two second tubular guide rails 400 has the second inner magnet structure 401, the second drive unit 402, and the second outer magnet structure 471. The other second tubular guide rail 400 may be a guide for the second end effector 470.

[0096] In the above-described embodiment, the two first end effectors 370 can also be separated to allow for independent control. In this case, one of the two first end effectors can be referred to as the "first end effector," and the other as the "additional first end effector." Furthermore, in this case, the first substrate transport mechanism includes: a first inner magnet structure disposed within one of the two first tubular guide rails; and a first drive unit capable of moving the first inner magnet structure along a first direction within one of the first tubular guide rails. Additionally, the first substrate support unit includes: a first end effector; and a first outer magnet structure disposed to surround one of the first tubular guide rails. Furthermore, the first substrate transport mechanism includes: an additional first inner magnet structure disposed within another of the two first tubular guide rails; an additional first drive unit capable of moving the additional first inner magnet structure along a first direction within the other first tubular guide rail; and an additional first substrate support unit. Additionally, the additional first substrate support unit includes: an additional first end effector; and an additional first outer magnet structure disposed to surround the other first tubular guide rail. Moreover, the additional first outer magnet structure can move following the movement of the additional first inner magnet structure, and the additional first end effector can move along the two first tubular guide rails in the first direction. In one embodiment, the first end effector is configured to be guided by the other first tubular guide rail without the accompanying magnet structure, and the additional first end effector is configured to be guided by one first tubular guide rail without the accompanying magnet structure. That is, the first end effector and the additional first end effector can be driven by magnet structures configured in different first tubular guides. In one embodiment, the front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

[0097] In the above embodiment, the two second end effectors 470 can also be separated so that they can be controlled independently. In this case, one of the two second end effectors can be referred to as the "second end effector" and the other as the "additional second end effector". In this case, the second substrate transport mechanism has: a second inner magnet structure disposed within one of the two second tubular guide rails; and a second drive unit capable of moving the second inner magnet structure along a second direction within one of the second tubular guide rails. In addition, the second substrate support unit has: a second end effector; and a second outer magnet structure disposed in a manner surrounding one of the second tubular guide rails. Furthermore, the second substrate transport mechanism includes: an additional second inner magnet structure disposed within another of the two second tubular guide rails; an additional second drive unit capable of moving the additional second inner magnet structure along a second direction within the other second tubular guide rail; and an additional second substrate support unit. Additionally, the additional second substrate support unit includes: an additional second end effector; and an additional second outer magnet structure disposed to surround the other second tubular guide rail. Moreover, the additional second outer magnet structure can move following the movement of the additional second inner magnet structure, and the additional second end effector can move along the two second tubular guide rails in a second direction. In one embodiment, the second end effector is configured to be guided by the other second tubular guide rail without the accompanying magnet structure, and the additional second end effector is configured to be guided by one second tubular guide rail without the accompanying magnet structure. That is, the second end effector and the additional second end effector can be driven by magnet structures configured in different second tubular guides. In one embodiment, the front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

[0098] The embodiments of the present invention also include the following technical solutions.

[0099] (Note 1)

[0100] A substrate delivery system, characterized in that it comprises:

[0101] Chamber;

[0102] First substrate conveying mechanism;

[0103] Second substrate conveying mechanism; and

[0104] Buffer unit,

[0105] The first substrate conveying mechanism has:

[0106] Two first tubular guide rails extend along a first direction at a first height within the cavity;

[0107] The first inner magnet structure is disposed within one of the two first tubular guide rails;

[0108] A first driving unit, which enables the first inner magnet structure to move within a first tubular guide rail along the first direction; and

[0109] First substrate support unit

[0110] The first substrate support unit has a first end effector and a first outer magnet structure configured to surround the first tubular guide rail. The first outer magnet structure is movable following the movement of the first inner magnet structure. The first end effector is movable along the two first tubular guide rails in the first direction.

[0111] The second substrate conveying mechanism has:

[0112] Two second tubular guide rails extend within the cavity at a second height different from the first height along a second direction intersecting the first direction;

[0113] The second inner magnet structure is disposed within one of the two second tubular guide rails;

[0114] A second driving unit, which enables the second inner magnet structure to move along the second direction within a second tubular guide rail; and

[0115] Second substrate support unit

[0116] The second substrate support unit has a second end effector and a second outer magnet structure configured to surround the first second tubular guide rail. The second outer magnet structure is movable following the movement of the second inner magnet structure. The second end effector is movable along the two second tubular guide rails in the second direction.

[0117] The buffer unit, when viewed from above, is positioned in the intersection area within the cavity surrounded by the two first tubular guide rails and the two second tubular guide rails, and is capable of transporting the substrate between the first end effector and the second end effector.

[0118] (Note 2)

[0119] The substrate delivery system according to Appendix 1 is characterized in that:

[0120] The first end effector is capable of delivering the substrate at a third height.

[0121] The second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

[0122] (Note 3)

[0123] The substrate transport system according to Appendix 2 is characterized in that:

[0124] The fourth height is greater than the second height.

[0125] The third height is greater than the fourth height.

[0126] The first height is greater than the third height.

[0127] (Note 4)

[0128] The substrate delivery system according to Appendix 2 or 3 is characterized in that:

[0129] The buffer unit has a substrate support portion and a third drive unit, the third drive unit being capable of moving the substrate support portion longitudinally, thereby moving the substrate on the substrate support portion longitudinally between the third height and the fourth height.

[0130] (Note 5)

[0131] The substrate transport system according to any one of Appendices 1 to 4 is characterized in that:

[0132] The first substrate support unit has an additional first end effector integrally formed with the first end effector.

[0133] The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

[0134] (Note 6)

[0135] The substrate transport system according to any one of Appendices 1 to 5 is characterized in that:

[0136] The second substrate support unit has an additional second end effector integrally formed with the second end effector.

[0137] The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

[0138] (Note 7)

[0139] The substrate transport system according to any one of Appendices 1 to 6 is characterized in that:

[0140] The first substrate conveying mechanism has:

[0141] An additional first inner magnet structure is added, which is disposed within the other of the two first tubular guide rails;

[0142] An additional first drive unit is added, which enables the additional first inner magnet structure to move along the first direction within the other first tubular guide rail; and

[0143] Add a first substrate support unit.

[0144] The additional first substrate support unit has an additional first end effector and an additional first outer magnet structure configured to surround the other first tubular guide rail. The additional first outer magnet structure is movable following the movement of the additional first inner magnet structure. The additional first end effector is movable along the two first tubular guide rails in the first direction.

[0145] (Postscript 8)

[0146] The substrate transport system according to Appendix 7 is characterized in that:

[0147] The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

[0148] (Note 9)

[0149] The substrate transport system according to any one of Appendices 1 to 8 is characterized in that:

[0150] The second substrate conveying mechanism has:

[0151] A second inner magnet structure is added, which is disposed in the other of the two second tubular guide rails;

[0152] A second drive unit is added, which enables the additional second inner magnet structure to move along the second direction within the other second tubular guide rail; and

[0153] Add a second substrate support unit.

[0154] The additional second substrate support unit has an additional second end effector and an additional second outer magnet structure configured to surround the other second tubular guide rail. The additional second outer magnet structure is movable following the movement of the additional second inner magnet structure. The additional second end effector is movable along the two second tubular guide rails in the second direction.

[0155] (Postscript 10)

[0156] The substrate transport system according to Appendix 9 is characterized in that:

[0157] The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

[0158] (Postscript 11)

[0159] The substrate transport system according to any one of Appendices 1 to 10 is characterized in that:

[0160] It also includes the control unit,

[0161] The control unit is capable of controlling the movement of the first end effector so that when the substrate is transferred from the first end effector to the substrate support of the buffer unit, the center of the substrate in the first direction coincides with the center of the substrate support.

[0162] (Postscript 12)

[0163] The substrate transport system according to Appendix 11 is characterized in that:

[0164] The control unit is capable of controlling the movement of the second end effector so that when the substrate is transferred from the second end effector to the substrate support of the buffer unit, the center of the substrate in the second direction coincides with the center of the substrate support.

[0165] (Postscript 13)

[0166] A substrate delivery system, characterized in that it comprises:

[0167] Vacuum transport chamber;

[0168] Multiple first substrate delivery mechanisms;

[0169] Multiple second substrate delivery mechanisms; and

[0170] Multiple buffer units,

[0171] Each of the plurality of first substrate conveying mechanisms has:

[0172] Multiple first tubular guide rails extend along a first direction at a first height within the vacuum delivery chamber;

[0173] Multiple first inner magnet structures are respectively disposed within the multiple first tubular guide rails;

[0174] Multiple first driving units, each capable of moving the multiple first inner magnet structures along the first direction; and

[0175] First substrate support unit

[0176] The first substrate support unit has a first end effector and a plurality of first outer magnet structures arranged to surround the plurality of first tubular guide rails, the plurality of first outer magnet structures being movable following the movement of the plurality of first inner magnet structures, and the first end effector being movable in the first direction.

[0177] Each of the plurality of second substrate conveying mechanisms has:

[0178] Multiple second tubular guide rails extend within the vacuum delivery chamber at a second height different from the first height along a second direction intersecting the first direction;

[0179] Multiple second inner magnet structures are respectively disposed within the multiple second tubular guide rails;

[0180] Multiple second driving units, each capable of moving the multiple second inner magnet structures along the second direction; and

[0181] Second substrate support unit

[0182] The second substrate support unit has a second end effector and a plurality of second outer magnet structures arranged to surround the plurality of second tubular guide rails, the plurality of second outer magnet structures being movable following the movement of the plurality of second inner magnet structures, and the second end effector being movable in the second direction.

[0183] The plurality of buffer units, when viewed from above, are respectively arranged in the plurality of intersection areas where the plurality of first tubular guide rails included in the plurality of first substrate transport mechanisms and the plurality of second tubular guide rails included in the plurality of second substrate transport mechanisms intersect in the vacuum transport chamber, and are capable of transporting substrates between the first end effector and the second end effector.

[0184] (Postscript 14)

[0185] The substrate transport system according to Appendix 13 is characterized in that:

[0186] The first end effector is capable of delivering the substrate at a third height.

[0187] The second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

[0188] (Postscript 15)

[0189] The substrate delivery system according to Appendix 14 is characterized in that:

[0190] The fourth height is greater than the second height.

[0191] The third height is greater than the fourth height.

[0192] The first height is greater than the third height.

[0193] (Postscript 16)

[0194] The substrate transport system according to any one of Appendices 13 to 15 is characterized in that:

[0195] Each of the plurality of buffer units has a substrate support portion and a third drive unit, the third drive unit being capable of moving the substrate support portion longitudinally, thereby moving the substrate on the substrate support portion longitudinally between the third height and the fourth height.

[0196] (Postscript 17)

[0197] The substrate transport system according to any one of Appendices 13 to 16 is characterized in that:

[0198] The first substrate support unit has an additional first end effector integrally formed with the first end effector.

[0199] The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

[0200] (Postscript 18)

[0201] The substrate transport system according to any one of Appendices 13 to 17 is characterized in that:

[0202] The second substrate support unit has an additional second end effector integrally formed with the second end effector.

[0203] The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

[0204] The embodiments described above are for illustrative purposes only and are not intended to limit the scope of the invention. Various modifications can be made to the embodiments described above without departing from the scope and spirit of the invention. For example, some of the constituent elements of one embodiment can be added to another embodiment. Additionally, some of the constituent elements of one embodiment can be replaced with corresponding constituent elements in another embodiment.

[0205] Explanation of reference numerals in the attached figures

[0206] PS…Substrate processing system, CU…Control unit, TM…Vacuum transport module, 200…Substrate transport system, 250…Cavity, 251 (251a, 251b, 251c)…First substrate transport mechanism, 252 (252a, 252b, 252c)…Second substrate transport mechanism, 253 (253a, 253b, 253c, 253d, 253e, 253f)…Buffer unit, 300…First tubular guide rail, 3 01……First inner magnet structure, 302……First drive unit, 303……First substrate support unit, 370……First end effector, 371……First outer magnet structure, 400……Second tubular guide rail, 401……Second inner magnet structure, 402……Second drive unit, 403……Second substrate support unit, 470……Second end effector, 471……Second outer magnet structure, 600……Intersection area, W…Substrate.

Claims

1. A substrate delivery system, characterized in that, include: Chamber; First substrate conveying mechanism; Second substrate conveying mechanism; and Buffer unit, The first substrate conveying mechanism has: Two first tubular guide rails extend along a first direction at a first height within the cavity; The first inner magnet structure is disposed within one of the two first tubular guide rails; The first drive unit is capable of moving the first inner magnet structure within the first tubular guide rail along the first direction. and First substrate support unit The first substrate support unit has a first end effector and a first outer magnet structure configured to surround the first tubular guide rail. The first outer magnet structure is movable following the movement of the first inner magnet structure. The first end effector is movable along the two first tubular guide rails in the first direction. The second substrate conveying mechanism has: Two second tubular guide rails extend within the cavity at a second height different from the first height along a second direction intersecting the first direction; The second inner magnet structure is disposed within one of the two second tubular guide rails; A second driving unit, which enables the second inner magnet structure to move along the second direction within a second tubular guide rail; and Second substrate support unit The second substrate support unit has a second end effector and a second outer magnet structure configured to surround the first second tubular guide rail. The second outer magnet structure is movable following the movement of the second inner magnet structure. The second end effector is movable along the two second tubular guide rails in the second direction. The buffer unit, when viewed from above, is positioned in the intersection area within the cavity surrounded by the two first tubular guide rails and the two second tubular guide rails, and is capable of transporting the substrate between the first end effector and the second end effector.

2. The substrate transport system according to claim 1, characterized in that: The first end effector is capable of delivering the substrate at a third height. The second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

3. The substrate transport system according to claim 2, characterized in that: The fourth height is greater than the second height. The third height is greater than the fourth height. The first height is greater than the third height.

4. The substrate transport system according to claim 3, characterized in that: The buffer unit has a substrate support portion and a third drive unit, the third drive unit being capable of moving the substrate support portion longitudinally, thereby moving the substrate on the substrate support portion longitudinally between the third height and the fourth height.

5. The substrate transport system according to claim 1, characterized in that: The first substrate support unit has an additional first end effector integrally formed with the first end effector. The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

6. The substrate transport system according to claim 5, characterized in that: The second substrate support unit has an additional second end effector integrally formed with the second end effector. The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

7. The substrate transport system according to claim 1, characterized in that: The first substrate conveying mechanism has: An additional first inner magnet structure is added, which is disposed within the other of the two first tubular guide rails; An additional first driving unit is added, which enables the additional first inner magnet structure to move along the first direction within the other first tubular guide rail; and Add a first substrate support unit. The additional first substrate support unit has an additional first end effector and an additional first outer magnet structure configured to surround the other first tubular guide rail. The additional first outer magnet structure is movable following the movement of the additional first inner magnet structure. The additional first end effector is movable along the two first tubular guide rails in the first direction.

8. The substrate transport system according to claim 7, characterized in that: The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

9. The substrate transport system according to claim 7 or 8, characterized in that: The second substrate conveying mechanism has: A second inner magnet structure is added, which is disposed in the other of the two second tubular guide rails; A second drive unit is added, which enables the added second inner magnet structure to move along the second direction within the other second tubular guide rail; and Add a second substrate support unit. The additional second substrate support unit has an additional second end effector and an additional second outer magnet structure configured to surround the other second tubular guide rail. The additional second outer magnet structure is movable following the movement of the additional second inner magnet structure. The additional second end effector is movable along the two second tubular guide rails in the second direction.

10. The substrate transport system according to claim 9, characterized in that: The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

11. The substrate transport system according to claim 4, characterized in that: It also includes the control unit, The control unit is capable of controlling the movement of the first end effector so that when the substrate is transferred from the first end effector to the substrate support of the buffer unit, the center of the substrate in the first direction coincides with the center of the substrate support.

12. The substrate transport system according to claim 11, characterized in that: The control unit is capable of controlling the movement of the second end effector so that when the substrate is transferred from the second end effector to the substrate support of the buffer unit, the center of the substrate in the second direction coincides with the center of the substrate support.

13. A substrate delivery system, characterized in that, include: Vacuum transport chamber; Multiple first substrate delivery mechanisms; Multiple second substrate delivery mechanisms; and Multiple buffer units, Each of the plurality of first substrate conveying mechanisms has: Multiple first tubular guide rails extend along a first direction at a first height within the vacuum delivery chamber; Multiple first inner magnet structures are respectively disposed within the multiple first tubular guide rails; A plurality of first driving units, each capable of moving the plurality of first inner magnet structures along the first direction; and First substrate support unit The first substrate support unit has a first end effector and a plurality of first outer magnet structures arranged to surround the plurality of first tubular guide rails, the plurality of first outer magnet structures being movable following the movement of the plurality of first inner magnet structures, and the first end effector being movable in the first direction. Each of the plurality of second substrate conveying mechanisms has: Multiple second tubular guide rails extend within the vacuum delivery chamber at a second height different from the first height along a second direction intersecting the first direction; Multiple second inner magnet structures are respectively disposed within the multiple second tubular guide rails; Multiple second driving units, each capable of moving the multiple second inner magnet structures along the second direction; and Second substrate support unit The second substrate support unit has a second end effector and a plurality of second outer magnet structures arranged to surround the plurality of second tubular guide rails, the plurality of second outer magnet structures being movable following the movement of the plurality of second inner magnet structures, and the second end effector being movable in the second direction. The plurality of buffer units, when viewed from above, are respectively arranged in the plurality of intersection areas where the plurality of first tubular guide rails included in the plurality of first substrate transport mechanisms and the plurality of second tubular guide rails included in the plurality of second substrate transport mechanisms intersect in the vacuum transport chamber, and are capable of transporting substrates between the first end effector and the second end effector.

14. The substrate transport system according to claim 13, characterized in that: The first end effector is capable of delivering the substrate at a third height. The second end effector is capable of delivering the substrate at a fourth height, which is different from the third height.

15. The substrate transport system according to claim 14, characterized in that: The fourth height is greater than the second height. The third height is greater than the fourth height. The first height is greater than the third height.

16. The substrate transport system according to any one of claims 13 to 15, characterized in that: Each of the plurality of buffer units has a substrate support portion and a third drive unit, the third drive unit being capable of moving the substrate support portion longitudinally, thereby moving the substrate on the substrate support portion longitudinally between the third height and the fourth height.

17. The substrate transport system according to any one of claims 13 to 15, characterized in that: The first substrate support unit has an additional first end effector integrally formed with the first end effector. The front end of the additional first end effector is located on the opposite side of the front end of the first end effector.

18. The substrate transport system according to claim 17, characterized in that: The second substrate support unit has an additional second end effector integrally formed with the second end effector. The front end of the additional second end effector is located on the opposite side of the front end of the second end effector.

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