Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus includes a substrate processing unit that processes a substrate, a light source that irradiates a point light to a monitored object located inside the substrate processing unit or outside the substrate processing unit, an imaging section that captures an area including the monitored object irradiated with the point light and generates image data, and a control section that monitors the monitored object based on the image data.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Substrate processing apparatuses for processing substrates are already known. These apparatuses are well-suited for processing semiconductor substrates. Typically, the substrate processing apparatus uses a processing solution to process the substrate.

[0003] The industry has explored the possibility of filming and monitoring the conditions inside a substrate processing apparatus (see Patent Document 1). Patent Document 1 describes monitoring substrate processing based on video recording. In the monitoring apparatus of Patent Document 1, the resolution of the video recording when the processing liquid is sprayed from the nozzle toward the surface of the substrate is higher than the resolution of the video recording when a coating of the processing liquid is formed on the surface of the substrate, thereby reducing the processing load on the computer.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2021 / 095612 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in Patent Document 1, since no light source is provided in the substrate processing device, it is sometimes impossible to properly monitor the monitored object depending on the camera environment when the camera animation used for monitoring is obtained.

[0009] One of the objectives of this invention is to provide a substrate processing apparatus and a substrate processing method capable of highly accurate monitoring of the monitored object in a substrate processing apparatus.

[0010] Technical means for solving problems

[0011] According to one aspect of the present invention, a substrate processing apparatus includes: a substrate processing unit for processing a substrate; a light source for illuminating a monitored object located inside or outside the substrate processing unit with point light; a camera unit for capturing images of an area of ​​the monitored object illuminated by the point light and generating image data; and a control unit for monitoring the monitored object based on the image data.

[0012] In one embodiment, the camera unit captures an image of the area containing the monitored object from the direction in which the point light is emitted from the light source.

[0013] In one embodiment, the light source illuminates the monitored object from a position relative to one side of the substrate with the point light; and the camera unit captures an image of the area of ​​the monitored object that has been illuminated by the point light from a position relative to the other side of the substrate.

[0014] In one embodiment, the light source includes: a first light source that emits a first point light toward a first monitored object, which is the monitored object; and a second light source that emits a second point light toward a second monitored object, which is the monitored object.

[0015] In one embodiment, the first light source emits the first point light at a different time than the second light source emits the second point light.

[0016] In one embodiment, the second light source emits light of a different wavelength than the first point light during a period that repeats the period during which the first light source emits the first point light; and the camera unit selectively captures images of the area containing the first monitored object irradiated by the first point light and the second point light from the area irradiated by the first point light and generates the image data, and selectively captures images of the area containing the second monitored object irradiated by the second point light from the area irradiated by the first point light and the second point light and generates the image data.

[0017] In one embodiment, the substrate processing apparatus further includes: a first filter that selectively transmits the first point light; and a second filter that selectively transmits the second point light.

[0018] In one embodiment, the substrate processing unit includes: a chamber; a substrate holding section that holds the substrate in the chamber; and a processing liquid supply section that supplies processing liquid to the substrate held in the substrate holding section; and a light source irradiates the monitored object in the chamber with the spot light; and a camera section captures an image of the area of ​​the monitored object in the chamber illuminated by the light source.

[0019] In one embodiment, the substrate processing apparatus further includes a transport robot that transports the substrate toward the substrate processing unit; and the light source illuminates a portion of the transport robot with a point light; and the camera captures an area including a portion of the transport robot illuminated by the point light.

[0020] According to another aspect of the present invention, a substrate processing method includes the following steps: processing a substrate in a substrate processing unit; irradiating a monitored object located inside or outside the substrate processing unit with spot light; capturing an image of a region containing the monitored object irradiated with the spot light and generating image data; and monitoring the monitored object based on the image data.

[0021] According to at least one aspect of the present invention, the object being monitored can be monitored with high precision in a substrate processing apparatus. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0023] Figure 2 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0024] Figure 3 This is a block diagram of the substrate processing apparatus of this embodiment.

[0025] Figure 4A This is a schematic diagram of the interior of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0026] Figure 4B This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a point light within a substrate processing unit.

[0027] Figure 5 This is a flowchart of the substrate processing method of this embodiment.

[0028] Figure 6 This is a flowchart of the substrate processing method of this embodiment.

[0029] Figure 7 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0030] Figure 8A This is a schematic diagram of the interior of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0031] Figure 8B This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a point light within a substrate processing unit.

[0032] Figure 9 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0033] Figure 10AThis is a schematic diagram of the interior of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0034] Figure 10B This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a first point light within a substrate processing unit.

[0035] Figure 11A This is a schematic diagram of the interior of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0036] Figure 11B This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a second point light within a substrate processing unit.

[0037] Figure 12 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0038] Figure 13A This is a schematic diagram of the interior of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0039] Figure 13B This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a first point light within a substrate processing unit.

[0040] Figure 13C This is a schematic diagram illustrating the generation of image data in the substrate processing apparatus of this embodiment by capturing an area containing a monitored object illuminated by a second point light within a substrate processing unit.

[0041] Figure 14 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0042] Figure 15 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0043] Figure 16 This is a schematic side view of the wafer loading / unloading machine and transfer unit in the substrate processing apparatus of this embodiment.

[0044] Figure 17A This is a schematic side view of the hand of the transfer robot in the substrate processing apparatus of this embodiment.

[0045] Figure 17B This is a schematic side view of the hand of the transfer robot in the substrate processing apparatus of this embodiment. Detailed Implementation

[0046] Hereinafter, embodiments of the substrate processing apparatus and substrate processing method of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are indicated by the same reference numerals and are not described repeatedly. Additionally, in this specification, for ease of understanding of the invention, mutually orthogonal X-axis, Y-axis, and Z-axis are sometimes described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0047] First, refer to Figure 1 This describes the substrate processing apparatus 100 of this embodiment. Figure 1 This is a schematic top view of the substrate processing apparatus 100.

[0048] like Figure 1 As shown, the substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a portion of the film, and cleaning.

[0049] Substrate W is used as a semiconductor substrate. Substrate W contains a semiconductor wafer. For example, substrate W is generally circular. Substrate processing apparatus 100 processes substrate W one piece at a time.

[0050] The substrate processing apparatus 100 includes a plurality of substrate processing units 110 that process substrates W respectively. The substrate processing units 110 process substrates W one at a time.

[0051] Here, the substrate processing apparatus 100, in addition to a plurality of substrate processing units 110, also includes: a plurality of wafer load ports LP, a fluid cabinet 10A, a fluid tank 10B, an indexer unit 20, an indexer robot IR disposed within the indexer unit 20, a set-top table 30, a central robot CR, and a control device 101. The control device 101 controls the wafer load ports LP, the indexer robot IR, the central robot CR, and the substrate processing units 110.

[0052] In each of the wafer loading and unloading machines LP, multiple laminated substrates W are arranged.

[0053] A transfer unit 20 is configured adjacent to the wafer loader LP. A transfer robot IR is configured within the transfer unit 20. The transfer robot IR transfers substrate W between the wafer loader LP and the mounting stage 30. The transfer robot IR extracts substrate W from the wafer loader LP and places it on the mounting stage 30. Additionally, the transfer robot IR transports the substrate W placed on the mounting stage 30 to the wafer loader LP.

[0054] The mounting stage 30 is located between the transfer robot IR and the central robot CR. The mounting stage 30 temporarily holds the substrate W between the transfer robot IR and the central robot CR.

[0055] The central robot CR transfers substrate W between the mounting table 30 and the substrate processing unit 110. The central robot CR transports the substrate W placed on the mounting table 30 to the substrate processing unit 110. In addition, the central robot CR transports the substrate W processed in the substrate processing unit 110 to the mounting table 30.

[0056] Fluid cabinet 10A contains processing liquid. Additionally, fluid cabinet 10A may contain gas. The processing liquid and / or gas contained in fluid cabinet 10A is supplied to substrate processing unit 110.

[0057] Each substrate processing unit 110 sprays processing liquid toward the substrate W to process the substrate W. A plurality of substrate processing units 110 form a plurality of towers TW ( ) arranged, in top view, to surround the central robot CR. Figure 1 The middle section consists of four towers (TW). Each tower (TW) contains a substrate processing unit 110 with upper and lower layers (…). Figure 1 There are three substrate processing units 110 in the middle. Fluid tanks 10B correspond to a plurality of towers TW. The processing liquid in the fluid tank 10A is supplied to all substrate processing units 110 contained in the tower TW corresponding to any fluid tank 10B via any fluid tank 10B. In addition, the gas in the fluid tank 10A is supplied to all substrate processing units 110 contained in the tower TW corresponding to any fluid tank 10B via any fluid tank 10B.

[0058] The control device 101 controls various operations of the board processing device 100. The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 may have a central processing unit (CPU), for example. Alternatively, the control unit 102 may have a general-purpose computer.

[0059] Storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 104 may include a removable medium. Control unit 102 executes the computer program stored in storage unit 104 and performs board processing operations.

[0060] Storage unit 104 stores data. The data includes process recipe data. The process recipe data contains information representing multiple process recipes. Each of the multiple process recipes specifies the processing content and order of the substrate W.

[0061] Additionally, the storage unit 104 can store reference image data from previous captures of areas containing the monitored object. Alternatively, the storage unit 104 can store brightness values ​​from the reference image data. Alternatively, the storage unit 104 can store data extracted from the reference image data indicating the position or movement of the monitored object.

[0062] Secondly, refer to Figure 2 This section describes the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 2 This is a schematic diagram showing the substrate processing unit 110 in the substrate processing apparatus 100.

[0063] The substrate processing unit 110 includes: a chamber 112, a substrate holding section 120, a processing liquid supply section 130, a light source 140, and an imaging section 150. The chamber 112 houses at least a portion of the substrate holding section 120 and the processing liquid supply section 130.

[0064] The chamber 112 is generally box-shaped with an internal space. The chamber 112 houses the substrate W. Here, the substrate processing unit 110 is a monolithic type that processes the substrate W one piece at a time, and the substrate W is housed one piece at a time in the chamber 112. The substrate W is housed in the chamber 112 and processed within the chamber 112.

[0065] The substrate holding portion 120 holds the substrate W. The substrate holding portion 120 holds the substrate W horizontally with its upper surface (front side) Wa facing upwards and its back surface (lower surface) Wb facing vertically downwards. Furthermore, the substrate holding portion 120 rotates the substrate W while holding it. The upper surface Wa of the substrate W can be planarized. Alternatively, a device surface or a multilayer material with recessed columnar structures can be provided on the upper surface Wa of the substrate W. The substrate holding portion 120 rotates together with the substrate W while holding it.

[0066] For example, the substrate holding portion 120 may be a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding portion 120 may have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding portion 120 may be a vacuum type. In this case, the substrate holding portion 120 holds the substrate W horizontally by adsorbing the central portion of the back surface Wb of the substrate W (the non-device forming surface) onto the upper surface. Alternatively, the substrate holding portion 120 may combine a clamping type that contacts the peripheral end face of the substrate W with a vacuum type.

[0067] For example, the substrate holding portion 120 includes: a spin base 121, a clamping member 122, a shaft 123, an electric motor 124, and a housing 125. The clamping member 122 is disposed on the spin base 121. The clamping member 122 clamps the substrate W. Typically, a plurality of clamping members 122 are disposed on the spin base 121.

[0068] Shaft 123 is a hollow shaft. Shaft 123 extends vertically along the rotation axis Ax. Spin base 121 is attached to the upper end of shaft 123. The substrate W is placed above spin base 121.

[0069] The spin base 121 is circular. A clamping member 122 horizontally supports the substrate W. A shaft 123 extends downward from the center of the spin base 121. An electric motor 124 imparts rotational force to the shaft 123. The electric motor 124 rotates the substrate W and the spin base 121 around the rotation axis Ax by rotating the shaft 123 in the rotational direction. A housing 125 surrounds the shaft 123 and the electric motor 124.

[0070] The processing liquid supply unit 130 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W held in the substrate holding unit 120. In addition, the processing liquid supply unit 30 may supply a plurality of processing liquids to the substrate W.

[0071] The processing solution can be an etching solution for etching the substrate W. Examples of etching solutions include fluoronitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). There are no particular limitations on the type of etching solution; it can be acidic or alkaline.

[0072] Alternatively, the treatment solution can be a rinsing solution. Examples of rinsing solutions include deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., around 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0073] Alternatively, the treatment solution may be an organic solvent. Typically, organic solvents are more volatile than rinsing solutions. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol ethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0074] The processing fluid supply unit 130 includes: a piping 132, a valve 134, a nozzle 136, and a moving mechanism 138. Processing fluid is supplied from a supply source through the piping 132. The valve 134 opens and closes the flow path within the piping 132. The nozzle 136 is connected to the piping 132. The nozzle 136 sprays the processing fluid toward the upper surface Wa of the substrate W. The nozzle 136 is preferably configured to be movable relative to the substrate W.

[0075] Piping 132 and nozzle 136 may be made of resin. In this case, light emitted from light source 140 passes through piping 132 and nozzle 136, while light emitted from light source 140 is refracted by the liquid in piping 132 and / or nozzle 136.

[0076] The moving mechanism 138 moves the nozzle 136 in both the horizontal and vertical directions. Specifically, the moving mechanism 138 moves the nozzle 136 circumferentially about a rotation axis extending vertically. Additionally, the moving mechanism 138 causes the nozzle 136 to move vertically up and down.

[0077] The moving mechanism 138 has an arm 138a, a shaft portion 138b, and a drive portion 138c. The arm 138a extends horizontally. A nozzle 136 is disposed at the front end of the arm 138a. The nozzle 136 is disposed at the front end of the arm 138a in a position that allows for supplying processing liquid to the upper surface Wa of the substrate W held in the clamping member 122. Specifically, the nozzle 136 is attached to the front end of the arm 138a and protrudes downward from the arm 138a. The base end of the arm 138a is attached to the shaft portion 138b. The shaft portion 138b extends vertically.

[0078] The drive unit 138c includes a rotary drive mechanism and a lifting drive mechanism. The rotary drive mechanism of the drive unit 138c rotates the shaft 138b around the rotation axis, and rotates the arm 138a along the horizontal plane around the shaft 138b. As a result, the nozzle 136 moves along the horizontal plane. Specifically, the nozzle 136 moves circumferentially about the shaft 138b. The rotary drive mechanism of the drive unit 138c may include, for example, a forward / reverse rotatable motor.

[0079] The lifting drive mechanism of the drive unit 138c causes the shaft 138b to move up and down in the vertical direction. The lifting drive mechanism of the drive unit 138c causes the shaft 138b to move up and down, and the nozzle 136 moves up and down in the vertical direction. The lifting drive mechanism of the drive unit 138c includes a drive source such as a motor and a lifting mechanism. The drive source drives the lifting mechanism, causing the shaft 138b to rise or fall. The lifting mechanism includes, for example, a rack and pinion mechanism, a gear mechanism, or a ball screw.

[0080] Light source 140 emits spot light. Typically, light source 140 emits relatively parallel light toward the object being monitored. The light emitted from light source 140 partially illuminates at least a portion of the object being monitored. Here, light source 140 emits spot light toward the object being monitored within chamber 112, and the object being monitored is illuminated by the spot light.

[0081] Light source 140 can emit light of a specific wavelength. For example, light source 140 emits visible light. In one example, light source 140 can emit red, green, or blue light.

[0082] Alternatively, the light source 140 may emit near-infrared radiation. For example, the light source 140 emits near-infrared radiation with wavelengths ranging from at least 800 nm to 2.5 μm. Typically, the light source 140 emits near-infrared radiation with wavelengths ranging from at least 800 nm to 1.5 μm.

[0083] Alternatively, the light source 140 can be switched to emit light of a specific wavelength. Furthermore, there can be two or more light sources 140. In this case, the light source 140 can illuminate different monitored objects with spotlight. Additionally, the light source 140 can illuminate the monitored objects within the chamber 112 from different positions.

[0084] Alternatively, the light source 140 can emit light with different color temperatures. For example, the light source 140 can switch between emitting warm yellow (e.g., 2600–3200 K), neutral white (4600–5500 K), and cool white (5700–7100 K).

[0085] Furthermore, the light source 140 may also be capable of changing the emission direction of the point light. For example, the light source 140 may change the emission direction of the point light according to the movement of the monitored object and / or changes in the monitored object.

[0086] The camera unit 150 has a plurality of pixels. The camera unit 150 is sensitive to light emitted from the light source 140. The camera unit 150 captures an area containing the monitored object and generates image data.

[0087] The camera unit 150 captures an image of an area, including the object being monitored, within the chamber 112 by receiving components of the point light emitted from the light source 140 towards the object being monitored, which are reflected and / or scattered by the object. This generates image data. Here, the camera unit 150 receives components of the point light emitted from the light source 140 that are reflected in the object being monitored.

[0088] The camera unit 150 may include a charge-coupled device (CCD). Alternatively, the camera unit 150 may include a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0089] In camera unit 150, the frame rate can be 30 fps, 60 fps, or 120 fps.

[0090] The camera unit 150 receives visible light. The camera unit 150 can receive light of a specific wavelength. For example, the camera unit 150 can receive light of red, green, or blue wavelengths.

[0091] Alternatively, the camera unit 150 may receive near-infrared light. For example, the camera unit 150 may receive near-infrared light with wavelengths ranging from at least 800 nm to 2.5 μm. The camera unit 150 may include a SWIR (Short Wavelength Infrared) image sensor. In this case, the camera unit 150 detects near-infrared light with wavelengths ranging from at least 800 nm to 2.5 μm.

[0092] In addition, the camera unit 150 can switch to receive near-infrared light and visible light.

[0093] The camera unit 150 generates image data by capturing images of an area containing the monitored object illuminated by a spotlight within the chamber 112. The image data represents an image of the area including the monitored object within the chamber 112. The monitored object within the chamber 112 can be monitored using the image data.

[0094] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid that spills from the substrate W. The cup 180 rises and falls. For example, during the period when the processing liquid supply section 130 supplies processing liquid to the substrate W, the cup 180 rises vertically upward to the side of the substrate W. In this case, the cup 180 collects the processing liquid that spills from the substrate W due to the rotation of the substrate W. In addition, at the end of the period when the processing liquid supply section 130 supplies processing liquid to the substrate W, the cup 180 falls vertically downward from the side of the substrate W.

[0095] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the camera unit 150, and / or the cup 180. In one example, the control unit 102 controls the electric motor 124, the valve 134, the moving mechanism 138, the light source 140, the camera unit 150, and / or the cup 180.

[0096] According to the substrate processing apparatus 100 of this embodiment, the camera unit 150 captures images of at least a portion of a monitored object within a chamber 112 irradiated by point light emitted from the light source 140. Therefore, since image data representing an image containing the monitored object can be appropriately processed from the image data generated by the camera unit 150, the monitored object can be monitored with high precision.

[0097] Here, the object under monitoring is housed within chamber 112. The object under monitoring is capable of moving within chamber 112. Typically, the object under monitoring is associated with the characteristics of the processed substrate W, or with the movement of the substrate W.

[0098] For example, the object being monitored is nozzle 136. Nozzle 136 moves to a predetermined position above substrate W and sprays processing liquid toward substrate W. The object being monitored may be the position of nozzle 136 spraying processing liquid. Alternatively, the object being monitored may be the processing liquid sprayed from nozzle 136 toward substrate W.

[0099] Alternatively, the object being monitored is cup 180. During the supply of processing liquid from nozzle 136 to substrate W, and / or during the period when substrate W is held and rotated by substrate holding portion 120, cup 180 rises to a position covering the side of substrate W. On the other hand, when substrate W is moved into chamber 112, and / or when substrate W is moved out of chamber 112, cup 180 descends to a position lower than the side of substrate W. In one example, the object being monitored may be the height of cup 180 when substrate W is moved in and / or moved out.

[0100] In addition, Figure 2 In the substrate processing apparatus 100 shown, the light source 140 and the camera unit 150 are located at a position higher than the object being monitored in the vertical direction. Therefore, the light source 140 emits point light towards the object being monitored, which is located below the light source 140. In addition, the camera unit 150 captures images of the area including the object being monitored, which is located below the camera unit 150.

[0101] In addition, Figure 2 In the substrate processing apparatus 100 shown, the light source 140 and the camera unit 150 are disposed outside the chamber 112. By disposing the light source 140 and the camera unit 150 outside the chamber 112, the adhesion of processing liquid to the light source 140 and / or the camera unit 150 can be suppressed.

[0102] A housing 113 for housing the light source 140 and the camera unit 150 is provided on the side wall 112s of the chamber 112. The housing 113 is installed on the side wall 112s of the chamber 112. The housing 113 is box-shaped. The light source 140 and the camera unit 150 are housed inside the housing 113. The gas environment inside the housing 113 is isolated from the gas environment of the chamber 112.

[0103] Furthermore, the chamber 112 preferably has a window 112w. The window 112w is located between the light source 140 and the camera unit 150, and the object being monitored inside the chamber 112. For example, the window 112w is plate-shaped. The window 112w allows light to pass through. The window 112w is located above the side wall 112s of the chamber 112.

[0104] In the side wall 112s of chamber 112, a window 112w is provided in front of the light source 140 and the camera unit 150. For example, the window 112w is transparent. In one example, the window 112w is formed of a transparent material such as quartz glass.

[0105] The light source 140 emits point light to the monitored object through the window 112w. In addition, the camera unit 150 captures images of the area containing the monitored object through the window 112w.

[0106] In detail, the light source 140 emits point light into the monitored object inside the chamber 112 via the window 112w. The window 112w has high light transmittance for the wavelength of the light emitted from the light source 140. The transmittance of the window 112w within the emission wavelength range of the light source 140 is, for example, 60% or more, preferably 80% or more.

[0107] The camera unit 150 captures images of the area containing the monitored object within the chamber 112 via the window 112w. The window 112w has high light transmittance for the wavelength of light detected by the camera unit 150. The transmittance of the window 112w within the detection wavelength range of the camera unit 150 is, for example, 60% or more, preferably 80% or more.

[0108] The housing 113, together with the side wall 112s, forms the housing space for the light source 140 and the camera unit 150. By providing the window 112w, the light source 140 and the camera unit 150 can be protected from the processing liquid and its volatile components within the chamber 112.

[0109] The substrate processing apparatus 100 of this embodiment is suitably used for the fabrication of semiconductor devices in which semiconductors are disposed. Typically, in a semiconductor device, a conductive layer and an insulating layer are stacked on a substrate. The substrate processing apparatus 100 is suitably used during the fabrication of semiconductor devices for cleaning and / or processing (e.g., etching, property modification, etc.) of the conductive layer and / or the insulating layer.

[0110] Secondly, refer to Figures 1-3 This describes the substrate processing apparatus 100 of this embodiment. Figure 3 This is a block diagram of the substrate processing apparatus 100.

[0111] like Figure 3As shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the transfer robot IR, the central robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the camera unit 150, and the cup 180. Specifically, the control device 101 controls the transfer robot IR, the central robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the camera unit 150, and the cup 180 by sending control signals to them. Furthermore, in this specification, the transfer robot IR and the central robot CR are sometimes collectively referred to as robots or transport robots.

[0112] In addition, the storage unit 104 stores computer programs and data. The data includes process condition data. The process condition data contains information representing a plurality of process conditions. Each of the plurality of process conditions specifies the processing content, processing order, and substrate processing conditions for the substrate W. The control unit 102 executes the computer program stored in the storage unit 104 to perform substrate processing actions.

[0113] The control unit 102 controls the transfer robot IR and transfers the substrate W through the transfer robot IR.

[0114] The control unit 102 controls the central robot CR and transfers substrate W through the central robot CR. For example, the central robot CR receives the unprocessed substrate W and moves it into any of the several chambers 112. In addition, the central robot CR receives the processed substrate W from the chamber 112 and moves the substrate W out.

[0115] The control unit 102 controls the substrate holding unit 120, and controls the start of rotation of the substrate W, the change of rotation speed, and the stop of rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 120 and change the rotation speed of the substrate holding unit 120. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 124 of the substrate holding unit 120.

[0116] The control unit 102 can control the valve 134 of the processing fluid supply unit 130, switching the state of the valve 134 between an open state and a closed state. Specifically, by controlling the valve 134 of the processing fluid supply unit 130 to the open state, the control unit 102 allows the processing fluid flowing from the piping 132 to the nozzle 136 to pass through. Conversely, by controlling the valve 134 of the processing fluid supply unit 130 to the closed state, the control unit 102 can stop the supply of processing fluid from the piping 132 to the nozzle 136.

[0117] The control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136. Specifically, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 above the upper surface Wa of the substrate W. In addition, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 to a retracted position away from the upper surface Wa of the substrate W.

[0118] The control unit 102 controls the light source 140 to emit spot light towards the monitored object. For example, the control unit 102 controls the light source 140 to illuminate at least a portion of the monitored object within the chamber 112 with spot light. Alternatively, the control unit 102 can control the light source 140 to illuminate at least a portion of the monitored object outside the substrate processing unit 110 with spot light.

[0119] The control unit 102 controls the camera unit 150 to capture images of the area containing the monitored object and generate image data. The control unit 102 also controls the camera unit 150 to capture images of at least a portion of the monitored object within the chamber 112 and generate image data. Additionally, the control unit 102 controls the camera unit 150 to capture images of at least a portion of the monitored object outside the substrate processing unit 110 and generate image data.

[0120] Thus, the control unit 102 controls the light source 140 and the camera unit 150 to illuminate a monitored object located inside or outside the substrate processing unit 110 with point light, generating image data. Specifically, the control unit 102 controls the light source 140 and the camera unit 150 in a manner that the light emitted from the light source 140 towards the monitored object is received in the camera unit 150, and the brightness value is measured. Additionally, the control unit 102 controls the light source 140 and the camera unit 150 in a manner that the light emitted from the light source 140 towards the monitored object is received in the camera unit 150, and the brightness value is measured.

[0121] The control unit 102 processes image data. For example, the control unit 102 determines the outer edge of a monitored object in a specific image data based on the brightness value within the image data. In the image data, the outer edge of the monitored object is determined based on the difference between the brightness value of the monitored object and the brightness values ​​of other objects. Alternatively, in one example, the control unit 102 determines the outer edge of the monitored object in a specific image data by referring to the brightness value of a reference image data stored in the storage unit 104. Or, the control unit 102 determines the outer edge of the monitored object in a specific image data based on the image data generated in the camera unit 150 and the reference image data.

[0122] Furthermore, the control unit 102 can identify the monitored object in a specific image data based on the brightness values ​​within the image data. The control unit 102 identifies the monitored object in the specific image data based on the brightness values ​​within the image data and the brightness values ​​of the reference image data stored in the storage unit 104. Then, the control unit 102 monitors the monitored object in the image data based on the reference image data. For example, the control unit 102 compares the position of the monitored object in the image data with the position of the monitored object shown in the reference image data; if the position difference is large, the monitored object is determined to be abnormal. Additionally, the control unit 102 compares the movement of the monitored object in the image data with the movement of the monitored object shown in the reference image data; if the movement difference is large, the monitored object is determined to be abnormal.

[0123] In image data, a portion of the monitored object illuminated by a point light represents a higher brightness value. Conversely, the background of the monitored object and other components surrounding it represent a lower brightness value.

[0124] For example, the camera unit 150 captures the area including the nozzle 136 of the processing liquid supply unit 130. Alternatively, the camera unit 150 captures the processing liquid supplied from the processing liquid supply unit 130 to the substrate W and / or the area where the processing liquid within the processing liquid supply unit 130 is located.

[0125] In addition, the control unit 102 can control the light source 140 and the camera unit 150, so that the light source 140 and the camera unit 150 move relative to the substrate W.

[0126] The control unit 102 can control the cup 180 to move relative to the substrate W. Specifically, during the period when the processing liquid supply unit 130 supplies processing liquid to the substrate W, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W. In addition, at the end of the period when the processing liquid supply unit 130 supplies processing liquid to the substrate W, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0127] The control unit 102 monitors the monitored object based on image data. This allows it to determine whether any anomalies have occurred in the monitored object.

[0128] For example, the object being monitored is nozzle 136, the processing liquid ejected from nozzle 136, cup 180, and / or substrate W. In this case, control unit 102 monitors the object being monitored based on image data generated by capturing an area containing nozzle 136, the processing liquid ejected from nozzle 136, cup 180, and / or substrate W.

[0129] The control unit 102 can monitor the position of the nozzle 136, the type of processing liquid ejected from the nozzle 136, the ejection time of the processing liquid ejected from the nozzle 136, the liquid splash of the processing liquid ejected from the nozzle 136 onto the substrate W, the processing liquid unintentionally ejected from the nozzle 136 toward the substrate W (dripping), the processing liquid unintentionally and continuously ejected from the nozzle 136 due to the malfunction of the valve 134 (flowing out), and the collision between the central robot CR and the cup 180, etc.

[0130] If, as a result of monitoring, the monitored object is determined to be abnormal, the processing of the board W can be interrupted. Alternatively, image data from the image data generated when monitoring the monitored object that indicates the monitored object is abnormal can be selectively saved. Alternatively, the processing status of the board W related to the monitored object that is determined to be abnormal in the image data generated when monitoring the monitored object can be stored in the storage unit 104. For example, the processing status of the board W can be used for abnormal determination of the board W.

[0131] The substrate processing apparatus 100 of this embodiment is suitably used to form semiconductor elements. For example, the substrate processing apparatus 100 is suitably used to process a substrate W that is used as a semiconductor element in a multilayer structure. The semiconductor element is a so-called 3D-structured memory (storage device). As an example, the substrate W is preferably used for NAND flash memory.

[0132] The following is for reference Figures 1 to 4B This describes the substrate processing apparatus 100 of this embodiment. Figure 4A This is a schematic diagram of the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 4B This is a schematic diagram showing image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a monitored object illuminated by a point light within the substrate processing unit 110.

[0133] like Figure 4A As shown, a substrate W is housed within the chamber 112 of the substrate processing unit 110. The substrate W is held in the substrate holding portion 120. Figure 2 The substrate W is surrounded by a cup 180. A nozzle 136 is located above the substrate W surrounded by the cup 180, and sprays the processing liquid toward the substrate W. When the light source 140 is off, the interior of the chamber 112 appears darker.

[0134] like Figure 4BAs shown, when the light source 140 is lit, the spot light emitted from the light source 140 illuminates the nozzle 136. Here, the nozzle 136 is the object being monitored, and the nozzle 136 is illuminated by the spot light. Because of the spot light emitted from the light source 140, the tip of the nozzle 136 is bright, but on the other hand, the spot light does not illuminate the area outside the nozzle 136 within the chamber 112. Therefore, only the tip of the nozzle 136 appears bright.

[0135] Within the camera's field of view captured by camera unit 150, the area of ​​the monitored object that appears bright due to point lighting can be 20% or less. Within the camera's field of view, the area of ​​the monitored object can be 10% or less, or even 5% or less.

[0136] Here, the camera unit 150 images the monitored object from the same direction as the light source 140. Therefore, light reflected from the spot light emitted from the light source 140 and then from the monitored object reaches the camera unit 150. The camera unit 150 images the area including the nozzle 136 irradiated by the spot light emitted from the light source 140. Specifically, the camera unit 150 images the area including the nozzle 136 within the chamber 112 and the area outside the nozzle 136. In this case, the brightness value of the tip portion of the nozzle 136 is high in the image captured by the camera unit 150, while the brightness value of the area outside the nozzle 136 within the chamber 112 is low.

[0137] When spot light emitted from light source 140 is shone onto nozzle 136, the spot light is strongly reflected by nozzle 136, so nozzle 136 represents a high brightness value in the image data. On the other hand, since the spot light emitted from light source 140 in chamber 112 does not illuminate the area around nozzle 136 in the image data, the area around nozzle 136 represents a low brightness value.

[0138] Thus, in the image data, the nozzle 136 illuminated by the spotlight represents a high brightness value, while the area outside the nozzle 136 within the chamber 112 does not represent a high brightness value. Therefore, based on the image data, the control unit 102 can precisely target the outer edge of the nozzle 136 in the image data. Consequently, the control unit 102 can monitor the nozzle 136 with high precision.

[0139] In addition, Figure 4B In this context, nozzle 136 is the object being monitored, and point light is shone onto the nozzle 136 of the object being monitored. However, the object being monitored can be anything other than nozzle 136.

[0140] In this situation, when the spot light emitted from the light source 140 is shone onto the monitored object, the spot light is also strongly reflected by the monitored object. Therefore, in the image data, the monitored object represents a high brightness value. On the other hand, in the image data, the area within the chamber 112 where the spot light emitted from the light source 140 does not reach the monitored object represents a low brightness value.

[0141] In the image data, the monitored object illuminated by the spotlight represents a high brightness value, while the area outside the monitored object within chamber 112 does not represent a high brightness value. Therefore, based on the image data, the control unit 102 can precisely target the outer edge of the monitored object in the image data. Thus, the control unit 102 can monitor the monitored object with high precision.

[0142] Furthermore, if the light source uniformly illuminates the entire imaging area of ​​the camera unit, even if the object being monitored is included within the imaging area, not only the object being monitored but also areas outside the object being monitored will be bright, indicating high brightness. In this case, the control unit may sometimes be unable to accurately pinpoint the outer edge of the object being monitored, making it impossible to monitor the object being monitored with high precision.

[0143] In particular, when the substrate W is mirrored, when light reflected from the substrate W (excluding the object being monitored) is captured by the camera, not only the object being monitored but also areas outside the object become brighter. Consequently, the control unit may be unable to accurately pinpoint the outer edge of the object being monitored, hindering high-precision monitoring. Even if machine learning is used for image processing and monitoring of the object being monitored, there is a concern about potential misjudgments in such cases.

[0144] According to this embodiment, since the object being monitored is illuminated by point light within the imaging range of the camera unit 150, the object being monitored can be monitored with high precision based on image data containing an image of the object being monitored in the substrate processing apparatus 100.

[0145] Secondly, refer to Figures 1-5 This describes the substrate processing method of this embodiment. It is a flowchart of the substrate processing method of this embodiment.

[0146] like Figure 5 As shown, in step SA, the substrate W is moved into the substrate processing apparatus 100. Specifically, the substrate W is moved into the chamber 112 of the substrate processing unit 110 via the transfer robot IR and the central robot CR.

[0147] In step SB, the substrate W is held. Specifically, the substrate holding part 120 holds the substrate W. When the substrate W is moved into the chamber 112, the substrate W is held by the substrate holding part 120.

[0148] In step SC, substrate W is processed. Substrate W is processed in substrate processing unit 110. Typically, substrate holding unit 120 rotates while holding substrate W in its original position, and processing liquid supply unit 130 supplies processing liquid to substrate W.

[0149] In step SD, the substrate W is released from holding. Specifically, the substrate holding section 120 releases the substrate W from holding.

[0150] In step SE, substrate W is removed from substrate processing unit 110. Substrate W is removed from substrate processing apparatus 100. Specifically, substrate W is removed from chamber 112 of substrate processing unit 110 via central robot CR and transfer robot IR.

[0151] According to this embodiment, the monitored object is monitored during at least any period from when the substrate W is moved into the substrate processing apparatus 100 to when it is processed and removed from the substrate processing apparatus 100. For example, during the period from when the substrate W is moved into the substrate processing unit 110 in step SA to when the substrate W is removed from the substrate processing unit 110 in step SE, the camera unit 150 captures an image of a region within the chamber 112, including the monitored object after it has been illuminated by the light source 140, and generates image data. Therefore, the monitored object can be monitored with high precision based on the image data representing an image of the monitored object within the substrate processing apparatus 100.

[0152] In this embodiment, the light source 140 emits a spot light towards the object being monitored. The object being monitored within the chamber 112 is illuminated by the spot light emitted from the light source 140. For example, if the object being monitored is a nozzle 136 that sprays processing liquid towards the substrate W, the nozzle 136 within the chamber 112 is illuminated by the spot light emitted from the light source 140. Alternatively, if the object being monitored is a cup 180 that is being moved into or out of the substrate W, the cup 180 is illuminated by the spot light emitted from the light source 140.

[0153] The camera unit 150 captures an area within the chamber 112, including the monitored object illuminated by the spotlight. For example, the camera unit 150 captures an area containing the monitored object illuminated by the spotlight. By capturing an area containing the monitored object within the chamber 112, the camera unit 150 can capture an image of the monitored object with high precision.

[0154] For example, when the substrate W is moved into the substrate processing unit 110 in step SA, the object to be monitored can be a cup 180, with the monitoring cup 180 positioned below to avoid collision with the central robot CR. In this case, the light source 140 emits spot light towards the cup 180. The cup 180 inside the chamber 112 is illuminated by the spot light emitted from the light source 140. The camera unit 150 captures an image of the area inside the chamber 112, including the cup 180 illuminated by the spot light, and generates image data. Thus, it is possible to monitor the cup 180 to prevent it from colliding with the central robot CR that moves the substrate W into the chamber 112.

[0155] Alternatively, when the substrate holding part 120 holds the substrate W in step SB, the object to be monitored can be set as the substrate holding part 120, and the clamping member 122 of the monitoring substrate holding part 120 can reliably clamp the substrate W. In this case, the light source 140 emits spot light to the clamping member 122. The clamping member 122 inside the chamber 112 is illuminated by the spot light emitted from the light source 140. The camera unit 150 captures an image of the area inside the chamber 112, including the clamping member 122 illuminated by the spot light, and generates image data. Thus, the monitoring clamping member 122 can be monitored to properly clamp the monitoring substrate W.

[0156] Alternatively, when processing the substrate W in step SC, the object to be monitored can be a nozzle 136, which sprays processing liquid from an appropriate position above the substrate W. In this case, the light source 140 can emit a spot light towards the nozzle 136 that sprays the processing liquid. The nozzle 136 inside the chamber 112 is illuminated by the spot light emitted from the light source 140. The camera unit 150 captures an image of the area inside the chamber 112, including the nozzle 136 that has been illuminated by the spot light, and generates image data. Thus, it is possible to monitor the nozzle 136 spraying processing liquid from an appropriate position above the substrate W.

[0157] Alternatively, when processing substrate W in step SC, the monitored objects can be pipes 132 and nozzles 136, and the backflow of the processing liquid within pipes 132 and nozzles 136 can be monitored. In this case, light source 140 emits spotlights towards the backflowed pipes 132 and nozzles 136. The pipes 132 and nozzles 136 within chamber 112 are illuminated by the spotlights emitted from light source 140. Camera unit 150 captures an image of the area within chamber 112, including the illuminated pipes 132 and nozzles 136, and generates image data. Thus, the backflow of the processing liquid within pipes 132 and nozzles 136 can be monitored.

[0158] Alternatively, when the substrate holding part 120 releases the substrate W in step SD, the object to be monitored can be the substrate holding part 120, and the clamping member 122 of the substrate holding part 120 can be monitored to appropriately release the substrate W from its clamping position. In this case, the light source 140 emits a spot light towards the clamping member 122. The clamping member 122 inside the chamber 112 is illuminated by the spot light emitted from the light source 140. The camera unit 150 captures an image of the area inside the chamber 112, including the clamping member 122 illuminated by the spot light, and generates image data. Thus, the clamping member 122 can be monitored to appropriately release the substrate W from its clamping position.

[0159] Alternatively, when the substrate W is removed from the substrate processing unit 110 in step SE, the object to be monitored can be a cup 180, with the monitoring cup 180 positioned below to avoid collision with the central robot CR. In this case, the light source 140 emits a spot light towards the cup 180. The cup 180 inside the chamber 112 is illuminated by the spot light emitted from the light source 140. The camera unit 150 captures an image of the area within the chamber 112, including the cup 180 illuminated by the spot light, and generates image data. Thus, it is possible to monitor the cup 180 to prevent it from colliding with the central robot CR that removes the substrate W from the chamber 112.

[0160] Secondly, refer to Figures 1-6 This describes the substrate processing method of this embodiment. Figure 6 This is a flowchart of the substrate processing method of this embodiment.

[0161] like Figure 6 As shown, in step S202, the substrate W is moved into the substrate processing apparatus 100. Specifically, the substrate W is moved into the wafer loading and unloading machine LP. Then, the substrate W is moved into the chamber 112 of the substrate processing unit 110 via the transfer robot IR, the setting stage 30 and the central robot CR. After being moved into the chamber 112, the substrate W is held by the substrate holding part 120.

[0162] In step S204, processing of the substrate W begins. Specifically, the control unit 102 begins processing of the substrate W according to process condition information. First, the substrate holding unit 120 holds the substrate W and begins to rotate it. Then, the substrate W is processed according to the process condition information.

[0163] In step S206, it is determined whether the monitored object has started the prescribed operation. Specifically, the control unit 102 determines whether the monitored object has started the prescribed operation based on process condition information.

[0164] If the monitored object has not started the prescribed action (no in step S206), the process returns to step S206. This process repeats until the monitored object starts the prescribed action. Conversely, if the monitored object starts the prescribed action (yes in step S206), the process proceeds to step S208.

[0165] In step S208, the light source 140 illuminates the monitored object with a point light. The point light illuminates at least a portion of the monitored object. Conversely, the background and surrounding area of ​​the monitored object are not illuminated by the point light.

[0166] In step S210, the camera unit 150 captures an image of the area containing the monitored object. As a result, the camera unit 150 generates image data representing the area containing the monitored object.

[0167] In step S212, image data is processed. Through image data processing, the monitored object is monitored. For example, based on the image data, specifically the outer edge of the monitored object shown in the image data, the position or movement of the monitored object is monitored.

[0168] Specifically, based on image data generated by the camera unit 150, the monitored object is located within a specific image data. The control unit 102, based on the image data, also detects the monitored object within the specific image data. For example, the control unit 102 detects the outer edge of the monitored object within the specific image data.

[0169] In one example, the control unit 102 determines the outer edge of the monitored object in a specific image data based on the brightness value within the image data. For instance, the control unit 102 determines the outer edge of the monitored object in a specific image data based on the brightness value within the image data and the brightness value of the reference image data stored in the storage unit 104.

[0170] In step S214, the monitored object is determined to be abnormal based on the image data. Specifically, the control unit 102 determines whether the monitored object is abnormal based on the image data and the reference image data.

[0171] If the monitored object is determined to be non-abnormal (no in step S214), the process proceeds to step S216. On the other hand, if the monitored object is determined to be abnormal (yes in step S214), the process proceeds to step S218.

[0172] In step S216, the process conditions are processed, and normal processing continues. Then, the process proceeds to step S220.

[0173] In step S218, anomaly handling is performed. During anomaly handling, the processing of the substrate W may be interrupted. Alternatively, image data from image data generated when monitoring a monitored object may be selectively saved, indicating that the monitored object is determined to be abnormal. Alternatively, the processing status of the substrate W related to a monitored object determined to be abnormal in the image data generated when monitoring a monitored object may be stored in the storage unit 104. For example, the processing status of the substrate W can be used for anomaly determination of the substrate W. Afterward, the process proceeds to step S220.

[0174] In step S220, it is determined whether the prescribed action has ended. Specifically, the control unit 102 determines whether the prescribed action has ended based on process condition information.

[0175] If the specified action has not ended (no in step S220), the process returns to step S208. On the other hand, if the specified action has ended (yes in step S220), the process proceeds to step S222.

[0176] In step S222, it is determined whether the processing of the substrate W should be terminated. Specifically, the control unit 102 determines whether the processing of the substrate W should be terminated based on the process condition information.

[0177] If the processing of substrate W is not completed (no in step S222), the process returns to step S206. This process repeats until the monitored object begins the prescribed action. Conversely, if the processing of substrate W is completed (yes in step S222), the process proceeds to step S224.

[0178] In step S224, the substrate W is removed from the substrate processing apparatus 100. For example, the control unit 102 releases the substrate holding unit 120 from holding the substrate W. Next, the substrate W is transferred into the wafer loading and unloading machine LP via the central robot CR, the setting stage 30, and the transfer robot IR. After that, the substrate W is removed from the substrate processing apparatus 100.

[0179] As described above, the substrate processing apparatus 100 processes the substrate W in the substrate processing unit 110. According to this embodiment, the monitored object can be monitored with high precision based on image data representing an image of the monitored object in the substrate processing apparatus 100.

[0180] In addition, Figure 2 In the substrate processing apparatus 100 described above, the camera unit 150 is located within the same housing 113 as the light source 140. The camera unit 150 captures images of the area containing the monitored object from the same direction as the light source 140 that illuminates the spot light, but this embodiment is not limited to this. The camera unit 150 may be located in a different area from the light source 140, and the camera unit 150 may capture images of the area containing the monitored object from a different direction than the light source 140 that illuminates the spot light. For example, the light source 140 may be located on one side relative to the substrate W and / or the substrate holding portion 120, and the camera unit 150 may be located on the other side relative to the substrate W and / or the substrate holding portion 120.

[0181] Secondly, refer to Figures 1 to 7 This describes the substrate processing apparatus 100 of this embodiment. Figure 7 This is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 7 The substrate processing unit 110 in the substrate processing apparatus 100 has, except for the point where the light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120, a ..., a point where the light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side, and the imaging portion 110 has, except for the point where the light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side, and the imaging portion 110 is located Figure 2 The substrate processing unit 110 in the substrate processing apparatus 100 is also configured in the same way, and repeated descriptions are omitted for the purpose of avoiding redundancy.

[0182] like Figure 7 As shown, the light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120. For example, the light source 140 and the imaging portion 150 are located on the X-axis passing through the center of the substrate W and / or the substrate holding portion 120. The imaging portion 150 captures images of the area containing the monitored object from a direction different from that of the light source 140 illuminating the point light.

[0183] The substrate processing unit 110 includes a first receiving portion 113a and a second receiving portion 113b, which serve as receiving portions for housing the light source 140 and the camera portion 150. The first receiving portion 113a and the second receiving portion 113b are mounted on the side wall 112s of the chamber 112. The first receiving portion 113a and the second receiving portion 113b are box-shaped.

[0184] The light source 140 is housed inside the first housing section 113a. The gas environment inside the first housing section 113a is isolated from the gas environment of the chamber 112.

[0185] The camera unit 150 is housed inside the second containment unit 113b. The gas environment inside the second containment unit 113b is isolated from the gas environment of the chamber 112.

[0186] Alternatively, the first receiving part 113a may be located on one side relative to the chamber 112, and the second receiving part 113b may be located on the other side relative to the chamber 112.

[0187] Furthermore, the chamber 112 preferably has windows 112wa and 112wb as windows. For example, windows 112wa and 112wb allow light to pass through. Window 112wa is located above the side of the chamber 112. For example, the light source 140 emits point light to the monitored object through window 112wa. In addition, the camera unit 150 captures images of the area containing the monitored object through window 112wb.

[0188] The light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120. Therefore, light scattered by the monitored object from the spot light emitted from the light source 140 reaches the imaging portion 150. Thus, the imaging portion 150 can capture an image of the area containing the monitored object illuminated by the spot light using the spot light scattered by the monitored object.

[0189] Furthermore, in the processing liquid supply unit 130, if the processing liquid remains at the tip of the nozzle 136 after the processing liquid is supplied to the substrate W from the nozzle 136 and then the supply of processing liquid is stopped, there is a concern that unintentional processing liquid may fall from the tip of the nozzle 136 into the substrate W, the substrate holding unit 120, and / or the chamber 112. Therefore, it is preferable that when the supply of processing liquid is stopped after the processing liquid is supplied to the substrate from the nozzle 136, the processing liquid at the tip of the nozzle 136 is drawn back, causing the position of the processing liquid in the piping 132 to move from the tip of the nozzle 136 to the deeper part of the nozzle 136. Such movement of the position of the processing liquid in the nozzle 136 and the piping 132 is also referred to as back suction.

[0190] According to this embodiment, when the light source 140 illuminates the tip of the nozzle 136 and the pipe 132 with spot light, the light is scattered in the parts of the tip of the nozzle 136 and the pipe 132 where the treated liquid is not located. Furthermore, at the parts of the tip of the nozzle 136 and the pipe 132 where the treated liquid is located, the light is refracted in different directions. Therefore, by photographing the tip of the nozzle 136 and the pipe 132 illuminated by the spot light from the light source 140, the camera unit 150 can specifically determine whether the backflow is adequate and the position of the treated liquid within the nozzle 136 and the pipe 132. For example, if the backflow of the treated liquid is insufficient, the control unit 102 can backflow the treated liquid again.

[0191] The following is for reference Figures 1 to 8B This describes the substrate processing apparatus 100 of this embodiment. Figure 8A This is a schematic diagram of the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 8B This is a schematic diagram showing image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a monitored object illuminated by a point light within the substrate processing unit 110.

[0192] like Figure 8A As shown, a substrate W is housed within the chamber 112 of the substrate processing unit 110. The substrate W is held in the substrate holding portion 120. Figure 2 The substrate W is surrounded by a cup 180. A nozzle 136 is located above the substrate W surrounded by the cup 180. After the nozzle 136 finishes spraying the processing liquid onto the substrate W, the processing liquid is drawn back and returns to the nozzle 136 and piping 132. When the light source 140 is off, the interior of the chamber 112 appears darker.

[0193] like Figure 8BAs shown, when the light source 140 is lit, the spot light emitted from the light source 140 illuminates the nozzle 136 and the tip of the pipe 132. Here, the tip of the nozzle 136 and the tip of the pipe 132 are the objects being monitored, and the tip of the nozzle 136 and the tip of the pipe 132 are illuminated by the spot light. The tip of the nozzle 136 and the tip of the pipe 132 is illuminated by the spot light emitted from the light source 140, but on the other hand, the spot light is not illuminating the area outside the nozzle 136 within the chamber 112. Furthermore, at the portion of the pipe 132 where the treated liquid is located, the light is refracted in different directions. Therefore, only the tip of the nozzle 136 and the tip of the pipe 132 appears bright.

[0194] Here, the light source 140 is located on one side relative to the substrate W and / or the substrate holding portion 120, and the imaging portion 150 is located on the other side relative to the substrate W and / or the substrate holding portion 120. Therefore, light scattered by the monitored object from the spot light emitted from the light source 140 reaches the imaging portion 150. The imaging portion 150 captures an image of the area including the nozzle 136 and the tip of the pipe 132 that are irradiated by the spot light emitted from the light source 140. Specifically, the imaging portion 150 captures an image including the nozzle 136 within the chamber 112 and the area outside the nozzle 136. In this case, the brightness values ​​of the nozzle 136 and the tip of the pipe 132 are high in the image captured by the imaging portion 150, while the brightness values ​​of the area outside the nozzle 136 and the tip of the pipe 132 within the chamber 112 are low.

[0195] Thus, the point light emitted from the light source 140 is scattered by the nozzle 136 and the piping 132. Consequently, in the image data, the nozzle 136 and the piping 132 represent high brightness values. On the other hand, in the image data, since the point light emitted from the light source 140 within the chamber 112 does not illuminate the area around the nozzle 136, the area around the nozzle 136 represents low brightness values. Furthermore, the point light emitted from the light source 140 within the chamber 112 is refracted by the processing liquid within the piping 132, so the processing liquid portion within the piping 132 represents a low brightness value.

[0196] Therefore, in the image data, the nozzle 136 and piping 132 that are illuminated by the spotlight represent high brightness values, while the areas within the chamber 112 that are not illuminated by the spotlight and the portion of the processing liquid within the piping 132 do not represent high brightness values. Thus, based on the image data, the control unit 102 can precisely pinpoint the outer edge of the processing liquid within the piping 132 in the image data. Consequently, the control unit 102 can monitor backflow with high precision.

[0197] In addition, Figure 8B In this context, nozzle 136 is the object being monitored, and point light is shone onto nozzle 136 and piping 132 of the object being monitored. However, the object being monitored may be something other than nozzle 136 and piping 132.

[0198] In addition, Figure 7 In the substrate processing apparatus 100 shown, the light source 140 and the camera unit 150 are located at a position higher than the monitored object along the vertical direction, but this embodiment is not limited to this. The light source 140 and the camera unit 150 may be at approximately the same height as the monitored object along the vertical direction. In this case, the camera unit 150 can receive the components passing through the monitored object and its surroundings from the point light emitted from the light source 140, and capture an image of the area containing the monitored object.

[0199] Furthermore, the light source 140 and the camera unit 150 are positioned at different heights along the vertical direction, and the light source 140, the monitored object, and the camera unit 150 can be arranged in a straight line parallel to the point light emitted from the light source 140 as parallel light. In this case, the camera unit 150 can receive components of the monitored object and its surroundings from the point light emitted from the light source 140 as parallel light, and capture an image of the area containing the monitored object.

[0200] In addition, Figure 7 In the substrate processing apparatus 100 shown, the light source 140 and the imaging unit 150 are located on one side and the other side relative to the substrate W and / or the substrate holding unit 120, respectively, but this embodiment is not limited to this. The light source 140 and the imaging unit 150 may be located in a cross direction relative to the center of the substrate W and / or the substrate holding unit 120. For example, the light source 140 may be located on the X-axis relative to the center of the substrate W and / or the substrate holding unit 120, and the imaging unit 150 may be located on the Y-axis relative to the center of the substrate W and / or the substrate holding unit 120.

[0201] In addition, Figure 1 and Figure 7 In the substrate processing apparatus 100 shown, the interior of the chamber 112 of the substrate processing unit 110 is illuminated by a point light emitted from a light source 140 and captured by a camera unit 150, but this embodiment is not limited to this. The interior of the chamber 112 of the substrate processing unit 110 may be captured by two or more camera units 150.

[0202] In addition, Figure 1 and Figure 7 In the substrate processing apparatus 100 shown, the monitored object in the chamber 112 of the substrate processing unit 110 is illuminated by a spot light emitted from a light source 140, but this embodiment is not limited to this. Two or more monitored objects in the chamber 112 of the substrate processing unit 110 may be illuminated by spot light emitted from two or more light sources 140.

[0203] Secondly, refer to Figures 1-9 This describes the substrate processing apparatus 100 of this embodiment. Figure 9 This is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 9 The substrate processing unit 110 in the substrate processing apparatus 100, in addition to illuminating the monitored object with point light emitted from the first light source 140a and the second light source 140b, has the same... Figure 2 The substrate processing unit 110 in the substrate processing apparatus 100 is also configured in the same way, and repeated descriptions are omitted for the purpose of avoiding redundancy.

[0204] like Figure 9 As shown, the substrate processing unit 110 includes a first light source 140a and a second light source 140b as light sources. The first light source 140a illuminates a point light onto a first monitored object within the chamber 112. The second light source 140b illuminates a point light onto a second monitored object within the chamber 112, which is different from the first monitored object.

[0205] The first light source 140a is located on one side relative to the substrate W and / or the substrate holding portion 120, and the second light source 140b is located on the other side relative to the substrate W and / or the substrate holding portion 120. For example, the first light source 140a and the second light source 140b are located on the X-axis that passes through the center of the substrate W and / or the substrate holding portion 120. The imaging unit 150 captures images of the cavity 112 from the same direction as the first light source 140a.

[0206] The substrate processing unit 110 includes a first receiving portion 113a and a second receiving portion 113b, which serve as receiving portions for housing a light source and a camera unit. The first receiving portion 113a and the second receiving portion 113b are mounted on the side wall 112s of the chamber 112. The first receiving portion 113a and the second receiving portion 113b are box-shaped.

[0207] The first housing section 113a houses the first light source 140a and the camera section 150. The first light source 140a and the camera section 150 are fixed in a predetermined direction within the first housing section 113a.

[0208] The second containment section 113b contains the second light source 140b. The second light source 140b is fixed within the second containment section 113b in a predetermined direction.

[0209] The chamber 112 may have windows 112wa and 112wb. For example, windows 112wa and 112wb allow light to pass through.

[0210] Window portions 112wa and 112wb are preferably disposed on opposite sidewalls 112s of chamber 112. Window portion 112wa is located on one side relative to substrate W and / or substrate holding portion 120, and window portion 112wb is located on the other side relative to substrate W and / or substrate holding portion 120. For example, a first light source 140a emits point light to a first monitored object via window portion 112wa. A second light source 140b emits point light to a second monitored object via window portion 112wb. Additionally, the camera unit 150 captures images of the area containing both the first and second monitored objects via window portion 112wa.

[0211] Secondly, refer to Figures 1 to 11B This describes the substrate processing apparatus 100 of this embodiment. Figure 10A This is a schematic diagram showing the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 10B This is a schematic diagram showing the image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a first monitored object illuminated by a first point light within the substrate processing unit 110. Figure 11A This is a schematic diagram of the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 11B This is a schematic diagram showing image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a second monitored object contained in the substrate processing unit 110 illuminated by a second point light.

[0212] like Figure 10A As shown, a substrate W is housed within a chamber 112 of the substrate processing unit 110. The substrate W is surrounded by a cup 180. A processing liquid supply unit 130 supplies processing liquid to the substrate W surrounded by the cup 180. When the first light source 140a and the second light source 140b are turned off, the interior of the chamber 112 appears darker.

[0213] like Figure 10B As shown, when the first light source 140a is lit, the spot light emitted from the first light source 140a illuminates the nozzle 136. Here, the nozzle 136 is the object being monitored. Because of the spot light emitted from the light source 140a, the tip of the nozzle 136 is lit, but on the other hand, the spot light is not irradiated into the area outside the nozzle 136 within the chamber 112. Therefore, only the tip of the nozzle 136 appears to be lit.

[0214] The camera unit 150 captures an image of the area containing the nozzle 136 illuminated by point light emitted from the first light source 140a. Specifically, the camera unit 150 captures an image of the area including the nozzle 136 within the chamber 112 and the area outside the nozzle 136. In this case, the brightness value of the leading edge portion of the nozzle 136 is high in the image captured by the camera unit 150, while the brightness value of the area outside the nozzle 136 within the chamber 112 is low. Therefore, the control unit 102 can precisely target the outer edge of the nozzle 136 in the image data based on the image data. Thus, the control unit 102 can monitor the nozzle 136 with high precision.

[0215] Subsequently, when the supply of processing liquid to substrate W ends, substrate W is removed from chamber 112. Before the central robot CR enters chamber 112 to remove substrate W from chamber 112, cup 180 descends downwards.

[0216] like Figure 11A As shown, when the cup 180 descends downwards, the side of the substrate W is exposed. When the first light source 140a and the second light source 140b are turned off, the interior of the chamber 112 appears darker.

[0217] like Figure 11B As shown, when the second light source 140b is lit, the spot light emitted from the second light source 140b illuminates a portion of the upper end of the cup 180. Here, the cup 180 is the object being monitored. Due to the spot light emitted from the second light source 140b, a portion of the upper edge of the cup 180 is illuminated, while on the other hand, the spot light is not illuminating the area within the chamber 112 other than that portion of the upper edge of the cup 180. Therefore, only the portion of the upper edge of the cup 180 appears to be illuminated.

[0218] The camera unit 150 captures an image of a region including a portion of the upper edge of the cup 180 illuminated by point light emitted from the second light source 140b. Specifically, the camera unit 150 captures an image of the region including a portion of the upper edge of the cup 180 and the area outside of it. In this case, the brightness value of the portion of the upper edge of the cup 180 in the image captured by the camera unit 150 is high, while the brightness value of other areas within the chamber 112 is low. Therefore, based on the image data, the control unit 102 can precisely target the outer edge of the cup 180 in the image data. Thus, the control unit 102 can monitor the cup 180 with high precision.

[0219] According to this embodiment, different light sources are illuminated depending on the operation performed on the substrate W. Therefore, the monitored object can be monitored with high precision based on the operation within the chamber 112.

[0220] In addition, Figure 9In the substrate processing apparatus 100 shown, the first light source 140a and the second light source 140b emit point light toward different monitored objects, but this embodiment is not limited to this. Alternatively, the emission destination of one light source 140 may be changed by moving the point light's illumination destination from the first monitored object to the second monitored object.

[0221] In addition, in reference Figures 9 to 11B In the aforementioned substrate processing apparatus 100, the first light source 140a and the second light source 140b illuminate the spotlight at different times, but this embodiment is not limited to this. The first light source 140a and the second light source 140b illuminate the spotlight at the same time, and the camera unit 150 can selectively capture images of different monitored objects illuminated by the spotlights from the first light source 140a and the second light source 140b.

[0222] Secondly, refer to Figures 1-12 This describes the substrate processing apparatus 100 of this embodiment. Figure 12 This is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 12 The substrate processing unit 110 in the substrate processing apparatus 100, in addition to the camera unit 150 capturing images of a first monitored object after being illuminated by a first point light from a first light source 140a via a filter 152a, and capturing images of a second monitored object after being illuminated by a second point light from a second light source 140b via a filter 152b, has the same... Figure 9 The substrate processing unit 110 in the substrate processing apparatus 100 is also configured in the same way, and repeated descriptions are omitted for the purpose of avoiding redundancy.

[0223] like Figure 12 As shown, the substrate processing unit 110 includes a first light source 140a and a second light source 140b as light sources. The first light source 140a is located on one side relative to the substrate W and / or the substrate holding portion 120, and the second light source 140b is located on the other side relative to the substrate W and / or the substrate holding portion 120. The first light source 140a and the second light source 140b are located on the X-axis that passes through the center of the substrate W and / or the substrate holding portion 120. The imaging unit 150 captures images of the cavity 112 from the same direction as the first light source 140a.

[0224] The first light source 140a illuminates a point light onto the first monitored object inside the chamber 112. Additionally, the second light source 140b illuminates a point light onto a second monitored object inside the chamber 112, which is different from the first monitored object.

[0225] The first light source 140a emits light of a different wavelength than the second light source 140b. For example, the first light source 140a emits red light (with a peak wavelength of 600 nm to 700 nm), while the second light source 140b emits blue light (with a peak wavelength of 400 nm to 500 nm).

[0226] The camera unit 150 captures images of the monitored object via a filter 152a or a filter 152b. The filters 152a and 152b are replaceable relative to the camera unit 150. Preferably, the filters 152a and 152b are capable of automatically switching according to operation.

[0227] For example, one of the filters 152a and 152b allows light emitted from the first light source 140a to pass through while blocking light emitted from the second light source 140b. The other of the filters 152a and 152b blocks light emitted from the first light source 140a while allowing light emitted from the second light source 140b to pass through.

[0228] In one example, filter 152a allows light emitted from the first light source 140a to selectively pass through. Filter 152a is red.

[0229] Additionally, filter 152b allows light emitted from the second light source 140b to selectively pass through. Filter 152b is blue.

[0230] The camera unit 150 can capture images of a first monitored object illuminated by spot light emitted from the first light source 140a via filter 152a. Additionally, the camera unit 150 can capture images of a second monitored object illuminated by spot light emitted from the second light source 140b via filter 152b. At this time, both the first light source 140a and the second light source 140b can be illuminated.

[0231] In addition, in reference Figure 12 In the above description, the monitored object captured by the camera unit 150 is switched between the first monitored object and the second monitored object by switching the filters 152a and 152b configured in front of the camera unit 150, but this embodiment is not limited to this.

[0232] By switching the filter within the camera unit 150, the monitored object captured by the camera unit 150 can be switched between a first monitored object and a second monitored object. For example, the camera unit 150 can switch the monitored object captured by the camera unit 150 between a first monitored object and a second monitored object by switching the filter located between the opening and the imaging element.

[0233] Alternatively, the camera unit 150 may have a plurality of imaging elements with different sensitivities to light of different wavelengths. In this case, by changing the type of imaging element used to generate image data, the monitored object captured by the camera unit 150 can be switched between a first monitored object and a second monitored object.

[0234] Secondly, refer to Figures 1 to 13C This describes the substrate processing apparatus 100 of this embodiment. Figure 13A This is a schematic diagram of the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 13B This is a schematic diagram showing image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a first monitored object illuminated by a first point light within the substrate processing unit 110. Figure 13C This is a schematic diagram showing image data generated in the substrate processing apparatus 100 of this embodiment by capturing an area of ​​a second monitored object contained in the substrate processing unit 110 illuminated by a second point light.

[0235] like Figure 13A As shown, a substrate W is housed within a chamber 112 of the substrate processing unit 110. The substrate W is held in a substrate holding portion 120 and is surrounded by a cup 180. The nozzle 136 of the processing liquid supply portion 130 is located above the substrate W surrounded by the cup 180. When the light source 140 is off, the interior of the chamber 112 appears darker.

[0236] like Figure 13B As shown, when the first light source 140a is lit, the spot light emitted from the first light source 140a illuminates the nozzle 136. At this time, the second light source 140b is lit, and the spot light emitted from the second light source 140b illuminates a portion of the upper end of the cup 180.

[0237] In this case, the camera unit 150 captures an image of the area including the nozzle 136 illuminated by the point light emitted from the first light source 140a via the filter 152a. Specifically, the camera unit 150 captures an image including the nozzle 136 within the chamber 112 and the area outside the nozzle 136. In this case, the brightness value of the leading edge portion of the nozzle 136 is high in the image captured by the camera unit 150, while the brightness value of the area outside the nozzle 136 within the chamber 112 is low. Therefore, the control unit 102 can precisely target the outer edge of the nozzle 136 in the image data based on the image data. Thus, the control unit 102 can monitor the nozzle 136 with high precision.

[0238] like Figure 13CAs shown, when the second light source 140b is lit, the spot light emitted from the second light source 140b illuminates a portion of the upper end of the cup 180. At this time, the first light source 140a is lit, and the spot light emitted from the first light source 140a illuminates the nozzle 136.

[0239] In this scenario, the camera unit 150 captures an image of a portion of the upper edge of the cup 180, illuminated by point light emitted from the second light source 140b, via the filter 152b. Specifically, the camera unit 150 captures an image of the area including the upper edge of the cup 180 and the area outside of it. In this case, the brightness value of the portion of the upper edge of the cup 180 in the image captured by the camera unit 150 is high, while the brightness value of other areas within the chamber 112 is low. Therefore, the control unit 102 can precisely target the outer edge of the cup 180 in the image data based on the image data. Thus, the control unit 102 can monitor the cup 180 with high precision.

[0240] Thus, the camera unit 150 switches between filters 152a and 152b to capture images of the first monitored object and the second monitored object. Therefore, even when the second light source 140b is lit, the camera unit 150 can capture images of the area containing the first monitored object with high precision using the point light emitted from the first light source 140a. Furthermore, even when the first light source 140a is lit, the camera unit 150 can capture images of the area containing the second monitored object with high precision using the point light emitted from the second light source 140b.

[0241] Therefore, even if the second light source 140b emits light of a different wavelength as the second point light during a period that overlaps with the period during which the first light source 140a emits the first point light, the imaging unit 150 can selectively capture images of the area containing the first monitored object irradiated by the first point light from the area irradiated by both the first and second point lights, and generate image data. Furthermore, the imaging unit 150 can selectively capture images of the area containing the second monitored object irradiated by the second point light from the area irradiated by both the first and second point lights, and generate image data.

[0242] In addition, in reference Figures 1 to 13C In the above description, the light source 140 and the camera unit 150 are located outside the chamber 112 of the substrate processing unit 110, and point light is irradiated from outside the chamber 112 onto the monitored object inside the chamber 112 to capture the area containing the monitored object. However, this embodiment is not limited to this. At least one of the light source 140 and the camera unit 150 may be disposed inside the chamber 112 of the substrate processing unit 110.

[0243] Secondly, refer to Figures 1 to 14 This describes the substrate processing apparatus 100 of this embodiment. Figure 14This is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 14 The substrate processing unit 110 in the substrate processing apparatus 100, except for the light source 140 and the camera unit 150 located in the chamber 112, has a connection with... Figure 2 The substrate processing unit 110 in the substrate processing apparatus 100 is also configured in the same way, and repeated descriptions are omitted for the purpose of avoiding redundancy.

[0244] like Figure 14 As shown, the light source 140 and the camera unit 150 are located inside the chamber 112. The light source 140 illuminates the monitored object inside the chamber 112 with a spot light. The camera unit 150 captures images of the area of ​​the monitored object that has been illuminated by the spot light within the chamber 112.

[0245] The light source 140 and the camera unit 150 are surrounded by a cover member 162. The cover member 162 is box-shaped, and the light source 140 and the camera unit 150 are disposed inside the cover member 162. For example, the cover member 162 is transparent. The cover member 162 can prevent the processing liquid in the processing substrate W from adhering to the light source 140 and the camera unit 150.

[0246] As described above, light source 140 can emit parallel light. Alternatively, light source 140 can emit light throughout its surroundings, functioning as a point light source. Even if light source 140 is a point light source, by being located near the object being monitored, light source 140 can still illuminate the object being monitored with point light.

[0247] Furthermore, the light source 140 and the camera unit 150 may also be movable relative to the substrate W. For example, the light source 140 and the camera unit 150 are preferably movable in the horizontal and / or vertical directions by a moving mechanism controlled by the control unit 102. When the light source 140 and the camera unit 150 move, the light source 140 and the camera unit 150 may also be able to move independently of each other. Alternatively, the light source 140 and the camera unit 150 may also be able to move as a single unit.

[0248] In reference Figures 1 to 14 In the above description, the light source 140 illuminates a spot light onto the monitored object inside the chamber 112 of the substrate processing unit 110, and the camera unit 150 captures an image of the area containing the monitored object inside the chamber 112 of the substrate processing unit 110. However, this embodiment is not limited to this. Alternatively, the light source 140 may illuminate a spot light onto the monitored object outside the substrate processing unit 110, and the camera unit 150 may capture an image of the area containing the monitored object outside the substrate processing unit 110.

[0249] Secondly, refer to Figures 1 to 15 This describes the substrate processing apparatus 100 of this embodiment. Figure 15 This is a schematic diagram of the substrate processing apparatus 100 of this embodiment. Figure 15 The substrate processing apparatus 100, in addition to mounting the light source 140 and the camera unit 150 at the point of the transfer robot IR, has the same characteristics as the reference. Figure 1 The same configuration as the substrate processing apparatus 100 described above is omitted for the purpose of avoiding redundant description.

[0250] like Figure 15 As shown, in the substrate processing apparatus 100, a light source 140 and a camera unit 150 are mounted on a transfer robot IR. Here, the object being monitored is the transfer robot IR. The transfer robot IR is configured in the transfer unit 20.

[0251] The transfer robot IR holds the substrate W. As described above, the transfer robot IR transfers the substrate W between the wafer loader LP and the mounting stage 30. The transfer robot IR extracts the substrate W from the wafer loader LP and places it on the mounting stage 30. In addition, the transfer robot IR transports the substrate W placed on the mounting stage 30 to the wafer loader LP.

[0252] Here, a light source 140 and a camera unit 150 are mounted on the transfer robot IR. The light source 140 illuminates the transfer robot IR, which is held on the substrate W, with a spot light. The camera unit 150 generates image data by capturing an area including the transfer robot IR illuminated by the spot light. The image data represents an image of the area including the transfer robot IR. The transfer robot IR can be monitored using the image data.

[0253] In detail, when the transfer robot IR holds the substrate W, the light source 140 illuminates a spot light onto the contact portion of the transfer robot IR holding the substrate W. The camera unit 150 generates image data by capturing an area including the contact portion of the transfer robot IR illuminated by the spot light from the light source 140. Furthermore, when the transfer robot IR hands over the substrate W, the light source 140 is turned off, and the camera unit 150 stops capturing images.

[0254] Furthermore, even when the transfer robot IR continuously holds the substrate W, the light source 140 can be turned off and the imaging of the camera unit 150 can be ended after a predetermined period has elapsed since the transfer robot IR began holding the substrate W.

[0255] Additionally, when the transfer robot IR is handed over to the substrate processing unit 110 or the mounting stage 30, the light source 140 illuminates a point light. The camera unit 150 can capture images of the area including the contact portion of the transfer robot IR.

[0256] Furthermore, the light source 140 can illuminate two contact portions of the carrier robot IR holding substrate W with point light. The camera unit 150 can generate image data by capturing the areas containing the two contact portions of the carrier robot IR illuminated by the point light from the light source 140.

[0257] Secondly, refer to Figures 1 to 16 This describes the substrate processing apparatus 100 of this embodiment. Figure 16 This is a schematic side view of the wafer loading / unloading machine LP and the transfer unit 20 in the substrate processing apparatus 100 of this embodiment.

[0258] like Figure 16 As shown, the transfer unit 20 is configured adjacent to the wafer loader LP. Additionally, the transfer unit 20 is configured adjacent to the mounting platform 30. The transfer unit 20 is located between the wafer loader LP and the mounting platform 30.

[0259] The transfer robot IR is housed within the transfer unit 20. The transfer robot IR operates within the transfer robot IR.

[0260] The transfer unit 20 has a bottom 21, side walls 22, and a top 23. The bottom 21, side walls 22, and top 23 form a defined space within which the transfer robot IR moves. The gas environment inside the transfer unit 20 is isolated from the external gas environment to maintain a clean environment.

[0261] The transfer robot IR is fixed to the bottom 21.

[0262] In the portion of the sidewall 22 that connects to the wafer loading / unloading machine LP, a through hole 22a is provided for the substrate W to pass through.

[0263] The wafer loading and unloading machine LP has: a mounting platform 31, a carrier platform 32, a wall 33, and a wafer loading and unloading machine opening and closing mechanism 34. The mounting platform 31 is configured adjacent to the side wall 22.

[0264] The setting platform 31 is box-shaped. The lower part of the setting platform 31 houses the drive mechanism, such as an electric motor, which is connected to and driven by the wafer loading and unloading machine opening and closing mechanism 34.

[0265] The platform 32 is positioned above the setting platform 31. The platform 32 is configured to move relative to the setting platform 31 in a horizontal direction that allows it to approach and separate from the transfer unit 20.

[0266] A substrate storage container Sh is placed on a stage 32. The substrate storage container Sh is configured to hold a plurality of substrates W. The substrates W are placed inside the substrate storage container Sh.

[0267] A substrate storage container, such as a FOUP (FRONT Opening Unified Pod), is a sealed container for storing substrates. It can replace the FOUP as an SMIF (Standard Mechanical Interface) container, OC (Open Cassette), etc.

[0268] The substrate storage container Sh has a frame Sha, a cover Shb, and a plurality of substrate guide portions Shc. The cover Shb can be removed from the front of the frame Sha. By installing the cover Shb on the front of the frame Sha, the frame Sha is sealed. When the cover Shb is removed, the opening B on the front of the frame Sha is exposed.

[0269] Viewed from the cover Shb side, the substrate guide sections Shc are horizontally arranged in pairs on the inner wall of the substrate storage container Sh. The substrate guide sections Shc support the lower surface end of the substrate W. For example, in the case where the substrate storage container Sh stores 25 substrates W, 25 substrate guide sections Shc are provided.

[0270] When the stage 32 moves toward the transfer unit 20 and approaches it, the substrate storage container Sh can be connected to the transfer unit 20.

[0271] The wall portion 33 extends vertically along the side wall 22 from the upper surface of the mounting platform 31. A wafer loading / unloading machine opening L communicating with the through hole 22a is provided in the wall portion 33.

[0272] The wafer loading / unloading machine opening / closing mechanism 34 opens and closes the cover Shb of the substrate receiving container Sh. For example, the wafer loading / unloading machine opening / closing mechanism 34 removes the cover Shb from the housing Sha. Alternatively, the wafer loading / unloading machine opening / closing mechanism 34 installs the cover Shb onto the housing Sha.

[0273] The wafer loading / unloading machine opening / closing mechanism 34 includes a gate member 34a and a gate drive unit 34b. The gate member 34a closes the wafer loading / unloading machine opening L by engaging with it. The gate member 34a holds the cover Shb of the substrate storage container Sh. When the wafer loading / unloading machine LP is not equipped with a substrate storage container Sh, the gate member 34a engages with the wafer loading / unloading machine opening L, and the wafer loading / unloading machine opening L is closed.

[0274] The gate drive unit 34b is connected to the gate member 34a. The gate drive unit 34b and the gate member 34a move together in the horizontal and vertical directions.

[0275] Specifically, the gate drive unit 34b moves the gate member 34a from the wafer loading / unloading machine LP toward the transfer unit 20 (arrow D connecting the two points) while the gate member 34a holds the cover Shb, thereby detaching the cover Shb from the substrate storage container Sh. Furthermore, by moving in the vertical direction (arrow E connecting the two points), the substrate storage container Sh is connected to the transfer unit 20, enabling the transfer robot IR to enter the interior of the substrate storage container Sh.

[0276] Typically, the gate drive unit 34b consists of an electric motor and a ball screw. When the substrate storage container Sh is closed, the opposite action to the aforementioned action is performed: the cover Shb closes the opening B, and the gate member 34a closes the wafer loading / unloading machine opening L.

[0277] The transfer robot IR extracts substrate W from substrate storage container Sh, which is located on the wafer loading and unloading machine LP. Then, the transfer robot IR stores substrate W in substrate storage container Sh, which is also located on the wafer loading and unloading machine LP.

[0278] The transfer robot IR has: two hands 210, a base 222, a lifting part 224, a connecting part 226, and a telescopic part 228. The two hands 210 are arranged in the vertical direction. The base 222 is fixed to the bottom 21 of the transfer unit 20. The base 222 forms the base of the transfer robot IR.

[0279] The lifting section 224 extends vertically upward from the base section 222. The lifting section 224 has a lifting mechanism. The lifting mechanism consists of a motor, an encoder, and a ball screw. However, the lifting mechanism may also be composed of a cylinder.

[0280] The vertical position of the hand 210 can be changed by raising and lowering the lifting unit 224. Specifically, when removing the substrate W from the substrate storage container Sh, the lifting unit 224 moves to a position where the uppermost part of the hand 210 is lower than the lower surface of the substrate W to be removed, i.e., the picking position (lower position). Conversely, when placing the substrate W into the substrate storage container Sh, the lifting unit 224 moves to a position where the lower surface of the hand 210 is higher than the upper surface of the substrate guide part Shc, i.e., the placement position (upper position).

[0281] The connecting part 226 connects the lifting part 224 and the telescopic part 228. The connecting part 226 transmits the lifting action of the lifting part 224 to the telescopic part 228. Specifically, the upper part of the connecting part 226 is connected to the telescopic part 228. In addition, the upper part of the telescopic part 228 is connected to the support part 211 of the supporting hand 210. The telescopic part 228 and the support part 211 are respectively connected to each hand 210, allowing the two hands 210 to move independently.

[0282] The telescopic part 228 can extend and retract in a predetermined direction. The telescopic part 228 has a plurality of joints. The telescopic part 228 extends and retracts in the predetermined direction by being driven to rotate through the joints. The horizontal position of the hand 210 changes by extending and retracting the telescopic part 228.

[0283] For example, the position of the hand 210 changes between the state where the telescopic part 228 is retracted in the horizontal direction and the state where the telescopic part 228 is extended in the horizontal direction. In this specification, the position of the hand 210 when the telescopic part 228 is retracted in the horizontal direction is sometimes described as the starting position (retracted position), and the position of the hand 210 when the telescopic part 228 is extended in the horizontal direction is sometimes described as the forward position (advanced position). The starting position is the reference position of the hand 210 in the horizontal direction.

[0284] exist Figure 16 In the diagram, the upper hand 210 is shown with a solid line indicating the position of the telescopic part 228 when it is retracted horizontally, i.e., the starting position HM (retracted position), and the position of the telescopic part 228 when it is extended horizontally, i.e., the forward position FW (advance position), with a line connecting two points. The starting position HM is the horizontal reference position of the hand 210. The telescopic part 228 extends and retracts by bending through multiple joints, which reduces the installation space. Similarly, the lower hand 210 extends and retracts between the starting position (retracted position) and the forward position (advance position).

[0285] A light source 140 and a camera unit 150 are mounted on the hand 210. The light source 140 illuminates a point light onto the contact portion of the holding substrate W of the hand 210. The camera unit 150 generates image data by capturing images of the area of ​​the contact portion of the hand 210 that has been illuminated by the point light from the light source 140.

[0286] Secondly, refer to Figures 1 to 17B This describes the substrate processing apparatus 100 of this embodiment. Figure 17A This is a schematic top view of the hand 210 of the transfer robot IR in the substrate processing apparatus 100 of this embodiment. Figure 17B This is a schematic side view of the hand 210 of the transfer robot IR in the substrate processing apparatus 100 of this embodiment. Figure 17A and Figure 17B In each of these, the substrate W is represented by a line connecting two points.

[0287] like Figure 17A As shown, the hand part 210 has a support part 211, a body 212, two claw guide parts 213, two rear guide parts 214, and a pusher part 215. The support part 211 consists of a telescopic part 228 ( Figure 16 The upper support of the main body 212. The support part 211 supports the main body 212.

[0288] The body 212 holds the substrate W in a horizontal position. Viewed from above by the hand 210, the body 212 is a flat, plate-like member in the horizontal direction. One end of the body 212 is connected to the support 211, and the other end of the body 212 holds the substrate W. Furthermore, the body 212 has a hollow shape that does not support at least a portion of the substrate W when holding it. For example, the hollow shape is a V-shape. The body 212 is formed, for example, from a lightweight and strong component such as ceramic or aluminum.

[0289] Claw guides 213 are respectively disposed at the front end of the V-shaped body 212. The claw guides 213 are L-shaped when viewed from the side. When the body 212 supports the substrate W in the horizontal direction, the substrate W is guided by the claw guides 213 and supported by the claw guides 213.

[0290] The rear guide portion 214 is located on the side of the claw guide portion 213 closer to the support portion 211 than the surface of the body 212. The rear guide portion 214 is positioned at a certain distance to support the substrate W. In top view, the rear guide portion 214 is generally cylindrical. More specifically, the rear guide portion 214 has an inclined shape that tapers upwards from the middle of the cylinder. The rear guide portion 214 supports the peripheral end of the substrate W with its inclined portion.

[0291] The substrate W is supported at four points: two claw guides 213 and two rear guides 214. Therefore, compared with the case where the substrate W is directly supported by the entire surface of the body 212, the contact area with the back and ends of the substrate W can be reduced, and damage and contamination to the back of the substrate W can be suppressed.

[0292] The pusher section 215 presses against the substrate W, which is supported at four points by the two claw guide sections 213 and the two rear guide sections 214. The substrate W can be fixed and held by the pusher section 215.

[0293] The feeder unit 215 has a movable part 215a and a fixed part 215b. The movable part 215a is movable relative to the fixed part 215b. The movable part 215a is connected to the fixed part 215b. The fixed part 215b is fixed to the support part 211.

[0294] The movable part 215a extends and retracts horizontally relative to the fixed part 215b. The movable part 215a includes, for example, a spring, a cylinder, or a motor.

[0295] like Figure 17B As shown, the claw guide portion 213 has a flat portion 213a and a side portion 213b. In the claw guide portion 213, the flat portion 213a supports the substrate W from below. The side portion 213b supports the peripheral end portion of the substrate W.

[0296] The lower surface of the substrate W is held by the claw guide portion 213 and the rear guide portion 214. The upper surface of the substrate W is lower than the uppermost part of the claw guide portion 213 and the rear guide portion 214, thereby preventing the substrate W from easily falling off the hand portion 210.

[0297] When the substrate W is placed on the hand portion 210, the substrate W is supported by the claw guide portion 213 and the rear guide portion 214. In this state, the movable portion 215a of the pusher portion 215 extends toward the substrate W to clamp the substrate W, thus fixing and holding the substrate W. For example, by extending the movable portion 215a toward the substrate W and clamping the end of the substrate W, the end of the substrate W is pressed against the side portion 213b of the claw guide portion 213, thereby fixing and holding the substrate W in a clamping manner. Conversely, when the movable portion 215a retracts, the side portion 213b of the claw guide portion 213 moves away from the end of the substrate W, releasing the fixing and holding of the substrate W.

[0298] A light source 140 and a camera unit 150 are mounted on a support unit 211. The light source 140 illuminates a spot light onto the claw guide 213 of the hand holding the substrate W. The camera unit 150 generates image data by capturing images of the area including the claw guide 213 illuminated by the spot light from the light source 140.

[0299] In addition, in reference Figures 15-17B In the above description, the light source 140 and the camera unit 150 are mounted on the transport robot IR, but this embodiment is not limited to this. The light source 140 and the camera unit 150 may be mounted on the central robot CR. Alternatively, the light source 140 and the camera unit 150 may be mounted on both the transport robot IR and the central robot CR. In this way, the light source 140 and the camera unit 150 may be mounted on a transport robot.

[0300] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described above and can be implemented in various ways without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the above embodiments. For example, several constituent elements can be removed from all the constituent elements shown in the embodiments. Furthermore, constituent elements applicable to different embodiments can be appropriately combined. The accompanying drawings schematically represent each constituent element for ease of understanding; the thickness, length, number, spacing, etc., of each constituent element shown may sometimes differ from reality for ease of drawing creation. Additionally, the material, shape, size, etc., of each constituent element shown in the above embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effects of the present invention.

[0301] In addition, in reference Figures 1 to 17BIn the above description, the substrate processing apparatus 100 captures images of an area containing one or more monitored objects using one camera unit 150, but it can capture images of an area containing two or more monitored objects using two or more camera units 150. Alternatively, the camera unit 150 can capture images of an area containing two or more monitored objects by changing its orientation.

[0302] In addition, in reference Figures 1 to 17B In the above description, the substrate W is treated with a processing liquid in the substrate processing unit 110 of the substrate processing apparatus 100, but this embodiment is not limited to this. In the substrate processing unit 110, the substrate W may not be treated with a processing liquid. For example, in the substrate processing unit 110, the substrate W may be subjected to exposure treatment. Alternatively, in the substrate processing unit 110, the substrate W may be subjected to heat treatment.

[0303] The present invention is suitably used in substrate processing apparatus and substrate processing method.

[0304] This invention application claims priority based on Japanese Patent Application No. 2024-043338, filed on March 19, 2024, all the contents of which are incorporated herein by reference.

Claims

1. A substrate processing apparatus, comprising: A substrate processing unit, wherein the substrate processing unit processes a substrate; A light source that illuminates a monitored object located inside or outside the substrate processing unit with point light. The camera unit captures images of the area containing the monitored object illuminated by the point light and generates image data; and The control unit monitors the monitored object based on the image data.

2. The substrate processing apparatus of claim 1, wherein, The camera unit emits the point light from the light source in the direction of the light source, and captures an image of the area containing the monitored object.

3. The substrate processing apparatus as claimed in claim 1 or 2, wherein, The light source illuminates the monitored object from a position relative to one side of the substrate; and The camera unit captures an image of the area containing the monitored object illuminated by the point light from a position opposite to the substrate.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein, The light source includes: A first light source emits a first point light toward the first monitored object, which is the monitored object. and The second light source emits a second point light toward the second object being monitored, which is the object being monitored.

5. The substrate processing apparatus of claim 4, wherein, The first light source emits the first point light at a different time than the second light source emits the second point light.

6. The substrate processing apparatus of claim 4 or 5, wherein, The second light source emits light of a different wavelength than the first point light during a period that repeats the period during which the first light source emits the first point light; and The camera selectively captures images of the area containing the first monitored object illuminated by the first point light and the second point light, and generates the image data. The camera selectively captures images of the area containing the second monitored object illuminated by the second point light from the area illuminated by the first point light and the second point light, and generates the image data.

7. The substrate processing apparatus of claim 6, wherein, The substrate processing apparatus further includes: A first filter, which allows selective transmission of the first point light; and A second filter allows the second point light to selectively pass through.

8. The substrate processing apparatus according to any one of claims 1 to 7, wherein, The substrate processing unit includes: Chamber; A substrate holding portion holds the substrate within the cavity; and The processing liquid supply unit supplies processing liquid to the substrate held in the substrate holding unit; and The light source illuminates the monitored object within the cavity with the point light; The camera unit captures an area within the cavity containing the monitored object illuminated by the point light.

9. The substrate processing apparatus according to any one of claims 1 to 7, wherein, The substrate processing apparatus further includes a transport robot that transports the substrate toward the substrate processing unit; and The light source illuminates a portion of the transport robot with the spot light; The camera captures an area including a portion of the transport robot illuminated by the spotlight.

10. A substrate processing method, wherein, The substrate processing method includes the following steps: The substrate is processed in the substrate processing unit; Illuminate the monitored object located inside or outside the substrate processing unit with point light. Capture an image of the area containing the monitored object illuminated by the point light and generate image data; and Based on the image data, the monitored object is monitored.

Images