Wire bond array, maintenance station for wire bond array, and related methods

Abstract

A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bonding head assembly for bonding a wire to a workpiece and a support structure for supporting the workpiece. The wire bonding array further includes a wire bonding tool changer system configured to be installed on and removed from each of the plurality of wire bonding systems. The wire bonding array further includes a maintenance robot configured to install the wire bonding tool changer system on each of the plurality of wire bonding systems and to remove the wire bonding tool changer system from each of the plurality of wire bonding systems.

Description

Cross-reference to related applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 562,833, filed March 8, 2024, and U.S. Provisional Application No. 63 / 650,997, filed May 23, 2024, the contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to wire bonding arrays, maintenance stations for wire bonding arrays, and related methods. Background Technology

[0003] In the handling and packaging of semiconductor devices, wire bonding remains the primary method for providing electrical interconnections between two locations within a package (e.g., between die pads on a semiconductor die and pins on a leadframe). More specifically, wire bonds (also known as wire bonding systems) are used to form wire arcs between the respective locations to be electrically interconnected. The main methods for forming wire arcs are ball bonding and wedge bonding. Various types of bonding energies can be used when forming the bonding portion between (a) the end of the wire arc and (b) the bonding site (e.g., die pad, pin, etc.), including, for example, ultrasonic energy, thermoacoustic energy, thermo-pressure energy, etc. Wire bonding systems are also used to form conductive bumps from the portions of the leads and to form vertical lead structures (e.g., bonded at a single bonding site).

[0004] Replacing wire bonding tools / wire-chopping cutters (and / or other related maintenance) on wire bonding systems often results in significant delays or machine downtime, and requires operators to perform the replacement / maintenance. Therefore, there is a need for improved systems and methods to address this deficiency. Summary of the Invention

[0005] According to an exemplary embodiment of the present invention, a wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) a bonding head assembly for bonding wires to a workpiece and (ii) a support structure for supporting the workpiece. The wire bonding array also includes a wire bonding tool changing system configured to be mounted on each of the plurality of wire bonding systems and to be removed from each of the plurality of wire bonding systems. The wire bonding array further includes a maintenance robot configured to mount the wire bonding tool changing system on each of the plurality of wire bonding systems and to remove the wire bonding tool changing system from each of the plurality of wire bonding systems.

[0006] According to other embodiments of the present invention, the wire bonding array mentioned in the preceding paragraph may have any one or more of the following features: each of the plurality of wire bonding systems includes a docking station configured to receive the wire bonding tool replacement system; the docking station includes a connector for providing power and data to the wire bonding tool replacement system; the docking station includes a locating pin for aligning the wire bonding tool replacement system during installation; at least one additional wire bonding tool replacement system is configured to be mounted on and removed from each of the plurality of wire bonding systems; and the maintenance robot includes a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive the wire bonding tool replacement system.

[0007] According to another exemplary embodiment of the present invention, a wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) a bonding head assembly for bonding wires to a workpiece and (ii) a support structure for supporting the workpiece. The wire bonding array further includes a maintenance station comprising a plurality of wire bonding tool replacement systems, each of the plurality of wire bonding tool replacement systems being configured to be mounted on and removed from each of the plurality of wire bonding systems. The wire bonding array further includes a maintenance robot configured to move some of the wire bonding tool replacement systems between the maintenance station and some of the wire bonding systems in the plurality of wire bonding systems.

[0008] According to other embodiments of the present invention, the wire bonding array mentioned in the preceding paragraph may have any one or more of the following features: each of the plurality of wire bonding systems includes a docking station configured to receive each of the plurality of wire bonding tool replacement systems; the maintenance station includes a plurality of docking stations, each of which is configured to receive each of the plurality of wire bonding tool replacement systems; the maintenance station includes a replacement assembly configured to remove waste from each of the plurality of wire bonding tool replacement systems, the waste including at least one of: (i) an empty wire bonding tool tray configured to hold a plurality of wire bonding tools and (ii) at least one used wire bonding tool; the maintenance station further includes a receiving portion for receiving the waste from the plurality of wire bonding tool replacement systems from the replacement assembly. The maintenance station also includes a plurality of wire bonding tool trays, each of which includes a plurality of wire bonding tools; the maintenance station includes a replacement assembly configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems; the maintenance station also includes a charging station for the maintenance robot; the maintenance robot is further configured to move some of the wire bonding tool replacement systems between some of the plurality of wire bonding systems; and the maintenance robot includes a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

[0009] According to yet another exemplary embodiment of the present invention, a maintenance station for maintaining a wire bonding array is provided. The maintenance station includes a plurality of wire bonding tool replacement systems, each of which is configured to be mounted on and removed from the wire bonding system.

[0010] According to other embodiments of the present invention, the maintenance station mentioned in the preceding paragraph may have any one or more of the following features: a plurality of docking stations are configured to receive any one of the plurality of wire bonding tool replacement systems; a replacement component is configured to remove waste from each of the plurality of wire bonding tool replacement systems, the waste comprising at least one of: (i) an empty wire bonding tool tray configured to hold a plurality of wire bonding tools and (ii) at least one used wire bonding tool; a receiving portion for receiving the waste from the plurality of wire bonding tool replacement systems; a plurality of wire bonding tool trays, each of the plurality of wire bonding tool trays comprising a plurality of wire bonding tools; and a replacement unit. The component, the replacement component being configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems; a maintenance robot, the maintenance robot being configured to move some of the wire bonding tool replacement systems of the plurality of wire bonding tool replacement systems between the maintenance station and some of the wire bonding systems of the plurality of wire bonding systems; a charging station for the maintenance robot; and the maintenance robot including a base for movement relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

[0011] According to yet another exemplary embodiment of the present invention, a method for maintaining a wire bonding array is provided. The method includes the following steps: (a) providing a wire bonding array, the wire bonding array including (i) a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece, the bonding head assembly including a wire bonding tool; (ii) a wire bonding tool replacement system configured to be mounted on and removed from each of the plurality of wire bonding systems; and (iii) a maintenance robot configured to mount the wire bonding tool replacement system on and remove the wire bonding tool replacement system from each of the plurality of wire bonding systems; (b) using the maintenance robot to transport the wire bonding tool replacement system to one of the plurality of wire bonding systems; and (c) using the maintenance robot to mount the wire bonding tool replacement system on one of the plurality of wire bonding systems.

[0012] According to other embodiments of the present invention, the method mentioned in the preceding paragraph may have any one or more of the following features: step (d), after step (c), removing the wire bonding tool replacement system from one of the plurality of wire bonding systems using the maintenance robot; step (e1), after step (d), transporting the wire bonding tool replacement system to another of the plurality of wire bonding systems using the maintenance robot; and step (f1), after step (e1), installing the wire bonding tool replacement system in the other of the plurality of wire bonding systems. The steps are as follows: Step (e2), after step (d), transporting the wire bonding tool replacement system to the maintenance station using the maintenance robot; and Step (f2), after step (e2), installing the wire bonding tool replacement system on the docking station of the maintenance station; and Step (a) includes providing a maintenance robot, the maintenance robot including a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive the wire bonding tool replacement system.

[0013] According to another exemplary embodiment of the present invention, a method for maintaining a wire bonding array is provided. The method includes the following steps: (a) providing a wire bonding array, the wire bonding array comprising (i) a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece, the bonding head assembly including a wire bonding tool; (ii) a maintenance station including a plurality of wire bonding tool replacement systems, each of the plurality of wire bonding tool replacement systems being configured to be mounted on each of the plurality of wire bonding systems and removed from each of the plurality of wire bonding systems; and (iii) maintenance. A robot configured to: (a) install some of the wire bonding tool replacement systems in each of the plurality of wire bonding tool replacement systems, and remove some of the wire bonding tool replacement systems from each of the plurality of wire bonding tool replacement systems; (b) transport one of the plurality of wire bonding tool replacement systems from the maintenance station to one of the plurality of wire bonding systems using the maintenance robot; and (c) install one of the plurality of wire bonding tool replacement systems in one of the plurality of wire bonding tool replacement systems using the maintenance robot.

[0014] According to other embodiments of the present invention, the method mentioned in the preceding paragraph may have any one or more of the following features: step (d), after step (c), removing one of the plurality of wire bonding tool replacement systems from one of the plurality of wire bonding systems using the maintenance robot; step (e1), after step (d), transporting one of the plurality of wire bonding tool replacement systems to another of the plurality of wire bonding systems using the maintenance robot; and step (f1), after step (e1), installing one of the plurality of wire bonding tool replacement systems into the other of the plurality of wire bonding systems. The steps are as follows: Step (e2), after step (d), using the maintenance robot to transport one of the plurality of wire bonding tool replacement systems to the maintenance station; and Step (f2), after step (e2), installing one of the plurality of wire bonding tool replacement systems on a docking station of the maintenance station; and Step (a) includes providing a maintenance robot, the maintenance robot including a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

[0015] According to another exemplary embodiment of the present invention, a method for operating a maintenance station for a wire bonding array is provided. The method includes the following steps: (a) providing a maintenance station, the maintenance station including (i) a plurality of wire bonding tool replacement systems, each of the plurality of wire bonding tool replacement systems being configured to be mounted on and removed from a wire bonding system; (ii) a plurality of wire bonding tool trays, each of the plurality of wire bonding tool trays including a plurality of wire bonding tools; and (iii) a replacement component configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems; and (b) using the replacement component to mount one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems.

[0016] According to other embodiments of the present invention, the method mentioned in the preceding paragraph may have any one or more of the following features: removing an empty wire bonding tool tray from one of the plurality of wire bonding tool replacement systems using the replacement component before step (b); and removing at least one used wire bonding tool from the used wire bonding tool receiving portion of one of the plurality of wire bonding tool replacement systems using the replacement component. Attached Figure Description

[0017] This invention is best understood by reading the following detailed description in conjunction with the accompanying drawings. It is emphasized that, as is customary, the features in the drawings are not drawn to scale. Instead, for clarity, the dimensions of the various features have been arbitrarily enlarged or reduced. The drawings include the following illustrations: Figures 1A to 1C A block diagram side view illustrating a wire bonding system according to an exemplary embodiment of the present invention; Figure 2A This is a top block view illustrating a docking station for a wire bonding tool replacement system according to an exemplary embodiment of the present invention; Figure 2B This illustrates an exemplary embodiment of the invention. Figure 2A A bottom view of the block diagram of the wire bonding tool replacement system corresponding to the docking station in the diagram. Figures 3A to 3B This is a block top view illustrating a wire bonding tool replacement system, which is used to illustrate various exemplary embodiments of the present invention; Figures 4A to 4E This is a block diagram illustrating a method for maintaining a wire bonding array according to an exemplary embodiment of the present invention; Figures 5A to 5E yes Figures 4A to 4E A block diagram of a wire bonding array illustrates another method for maintaining a wire bonding array according to another exemplary embodiment of the present invention; Figures 6A to 6D yes Figures 4A to 4E A block diagram of a wire bonding array illustrates another method for maintaining a wire bonding array according to another exemplary embodiment of the present invention; Figures 7A to 7E yes Figures 4A to 4E A block diagram of a wire bonding array illustrates another method for maintaining a wire bonding array according to another exemplary embodiment of the present invention; Figures 8A to 8C This is a block diagram of various wire bonding arrays according to exemplary embodiments of the present invention; Figures 9A to 9H This is a block diagram of a wire-bonded array maintenance station illustrating a method for operating the maintenance station according to various exemplary embodiments of the present invention; Figure 10 This is a flowchart illustrating a method for maintaining a wire bonding array according to an exemplary embodiment of the present invention; and Figure 11 This is a flowchart illustrating a method for operating a maintenance station for a wire bonding array according to another exemplary embodiment of the present invention. Detailed Implementation

[0018] As used herein, the term "wire bonding array" refers to a group of wire bonding systems (e.g., within a production environment such as a factory). The term "wire bonding array" can include wire bonding systems of different types (e.g., wedge bonders and ball bonders), different models, different manufacturers, different processes, etc. Furthermore, a wire bonding array can include wire bonding systems with different functions within the array (e.g., bonding different types of leads, different types of workpieces, etc.). Additionally, the term "wire bonding array" can include additional machines, systems, or arrays that support the wire bonding array (e.g., a computer for monitoring and / or controlling the factory environment, maintenance station, maintenance robots, etc.).

[0019] As used herein, the term “wire bonding tool tray” is intended to refer to any type of structure that holds multiple wire bonding tools.

[0020] Now refer to Figures 1A to 1C An exemplary wire bonding system 100 is shown in simplified form. The wire bonding system 100 includes a bonding head assembly 102, a support structure 104, and a docking station 112. The bonding head assembly 102 includes a wire clamp 110, a transducer 108, and a wire bonding tool 106 held by the transducer 108. A lead 114 passes through the wire bonding tool 106. The wire bonding tool 106 is configured to bond a portion of the lead 114 to a workpiece 120. The workpiece 120 can be any type of workpiece configured for wire bonding. Exemplary workpieces include semiconductor elements (e.g., semiconductor dies, LEDs, etc.) disposed on a substrate (e.g., a lead frame, another semiconductor die, a PCB, etc.). The workpiece 120 is supported by the support structure 104. The docking station 112 is configured to receive a wire bonding tool replacement system 130. The docking station 112 includes a locating pin 112b, which is configured to guide the wire bonding tool replacement system 130 to the correct position during the installation of the wire bonding tool replacement system 130 on the wire bonding system 100.

[0021] Figure 1B A wire bonding system 100, a wire bonding tool changing system 130, and a robotic arm 154 carrying the wire bonding tool changing system 130 are illustrated. The wire bonding tool changing system 130 is configured to remove and replace the wire bonding tool 106. A complete description of exemplary wire bonding tool changing systems can be found in U.S. Patent Application Nos. 18 / 947,365 and 18 / 947,209, the contents of which are incorporated herein by reference. Figures 3A to 3B A general description of the wire bonding tool replacement system can be found.

[0022] Figure 1BA wire bonding tool changing system 130 is shown, including a handle 130c and a connector 130a. The handle 130c can be engaged by a robotic arm 154. The robotic arm 154 is part of a maintenance robot 150, which is incorporated herein by reference to several series of figures (e.g., Figures 4A to 4E Detailed description. The robotic arm 154 is configured to engage the handle 130c for mounting and / or removing the wire bonding tool change system 130 from the wire bonding system 100. The connector 130a is capable of forming an electrical connection to utilize the corresponding connector 112a of the docking station 112 (see...). Figures 2A to 2B Transmit power and / or data (e.g., position information, execution instructions, information logs, etc.) between the wire bonding tool replacement system 130 and the wire bonding system 100. Figure 1C The wire bonding tool replacement system 130 is shown in its installation position on docking station 112.

[0023] Figures 2A to 2B Details related to the alignment and installation of the wire bonding tool replacement system 130 on the docking station 112 are shown. Figure 2A This is a top view of docking station 112, and Figure 2B This is a corresponding bottom view of an exemplary wire bonding tool replacement system 130. The docking station 112 includes a locating pin 112b (see, for example, see...). Figure 1A and Figure 1B The locating pins 112b are used to guide the wire bonding tool change system 130 to the correct position during installation, as they mate with corresponding locating holes 130b on the wire bonding tool change system 130. The locating pins 112b and locating holes 130b ensure alignment of the connector 130a of the wire bonding tool change system 130 with the connector 112a of the docking station 112. As shown, the wire bonding tool change system 130 has a male connector and the docking station 112 has a female connector, but the invention is not limited thereto. Furthermore, different and / or additional alignment structures (e.g., guide rails, alignment slots, navigation software, etc.) are also considered.

[0024] Although the wire bonding system 100 has been shown and described as including a docking station, the invention is not limited thereto. It is conceivable that the wire bonding system may have any suitable receiving portion configured to receive a wire bonding tool change system (e.g., a designated flat area, a shelf, a holder for holding the wire bonding tool change system, or any other structure capable of supporting the wire bonding tool change system).

[0025] Figures 3A to 3BAn exemplary wire bonding tool replacement system 130 is shown, which illustrates different features (for simplicity, Figures 3A to 3B Connector 130a, positioning hole 130b, and handle 130c are not shown. The wire bonding tool replacement system 130 includes a used wire bonding tool receiver 130d, a maintenance arm 130e, and a wire bonding tool tray holder 130f. The used wire bonding tool receiver 130d is configured to retain the used wire bonding tool 106' after it has been removed from the wire bonding system. The maintenance arm 130e is extendable to perform actions of removing and replacing wire bonding tools on the wire bonding system (e.g., clamping an installed wire bonding tool, releasing an installed wire bonding tool from a transducer, removing an installed wire bonding tool from a transducer, clamping a new wire bonding tool, installing a new wire bonding tool, etc.). The wire bonding tool tray holder 130f is configured to receive a wire bonding tool tray 140. The wire bonding tool tray 140 is configured to include a plurality of wire bonding tools 106. The wire bonding tool tray 140 may include a single type of wire bonding tool, or, depending on application requirements, it may include various types of wire bonding tools.

[0026] Figure 3A The wire bonding tool replacement system 130 is shown in a "ready" state, with the maintenance arm 130e extended. Figure 3A In this example "ready" state, the used wire bonding tool receiver 130d is empty, and the wire bonding tool tray 140 contains the maximum number of wire bonding tools 106 (e.g., eight, as shown). It should be understood that for the wire bonding tool replacement system 130 to be "ready," it does not need to have an empty used wire bonding tool receiver 130d, and / or it does not need to have a full wire bonding tool tray 140. For example, to be in a "ready" state, the wire bonding tool replacement system 130 only needs to include at least one wire bonding tool 106 in the wire bonding tool tray 140 to be provided to the wire bonding system.

[0027] Figure 3B A wire bonding tool replacement system 130 in a "depleted" state is shown, with the maintenance arm 130e retracted. Figure 3B In this "exhausted" state, the used wire bonding tool receiving portion 130d includes a plurality of used wire bonding tools 106', and the wire bonding tool tray 140 is empty (e.g., the plurality of wire bonding tool slots 142 of the wire bonding tool tray 140 are empty).

[0028] The wire bonding tool replacement system 130 can be installed on a single wire bonding system for an extended period to automatically replace the wire bonding tool of the individual wire bonding system when needed. However, the wire bonding tool replacement system 130 can also serve an array of wire bonding systems (e.g., an array comprising multiple wire bonding systems 100) in a factory setup. Wire bonding systems in an exemplary wire bonding array can be configured to calculate the intervals at which wire bonding tools need to be replaced (e.g., using a computer on the wire bonding system). This calculation may include factors such as the number of bonding segments, time duration, changes in process type / step, expected tool life, bonding segment performance evaluation, environmental factors, etc. The wire bonding array also includes a maintenance robot configured to install the wire bonding tool replacement system on each wire bonding system and remove the wire bonding tool replacement system from each wire bonding system. The maintenance robot is able to move the wire bonding tool replacement system directly between wire bonding systems and / or between wire bonding systems and a central wire bonding tool replacement system storage area (e.g., the maintenance station described herein).

[0029] For example, when a wire bonding system requires a new wire bonding tool, it can (i) send a signal to the central computer of the wire bonding array, (ii) send a signal to the maintenance station, which will then instruct the maintenance robot, and / or (iii) send a signal directly to the maintenance robot. The central computer, maintenance station, or maintenance robot can store the identification and / or location information of each wire bonding system (along with the status of each wire bonding tool replacement system, i.e., "ready" or "out of stock"). Such a central computer, maintenance station, or maintenance robot may also be able to send instructions to and receive instructions from components of the wire bonding array (e.g., wire bonding systems, maintenance robots, maintenance stations, etc.). When a signal to change the wire bonding tool is received, the maintenance robot can bring the wire bonding tool replacement system (known as "ready") to the wire bonding system requiring a replacement. After the wire bonding tool is replaced, the wire bonding tool replacement system can then be moved to another wire bonding system that requires wire bonding tool replacement, or returned to a centralized location for storing and / or maintaining the wire bonding tool replacement system (e.g., the maintenance station described herein).

[0030] Figures 4A to 4E , Figures 5A to 5E , Figures 6A to 6D and Figures 7A to 7E An exemplary process is illustrated using a maintenance robot 150 to maintain a wire bonding array with a multiple wire bonding tool replacement system 130. Specifically, Figures 4A to 4EThe diagram shows a maintenance robot 150 moving one of a plurality of wire bonding tool replacement systems 130 from a maintenance station 118 to one of a plurality of wire bonding systems 100. Figures 5A to 5E The diagram shows a maintenance robot 150 moving directly between several wire bonding systems 100 and one of several wire bonding tool replacement systems 130. Figures 6A to 6D The diagram shows a maintenance robot 150 moving one of a plurality of wire bonding tool replacement systems 130 from one of a plurality of wire bonding systems 100 to a maintenance station 118. Figures 7A to 7E The diagram shows a maintenance robot 150 moving one of a plurality of wire bonding tool replacement systems 130 to another of a plurality of wire bonding systems 100.

[0031] Reference Figure 4A An exemplary wire bonding array 10 is shown. The wire bonding array 10 includes a plurality of wire bonding systems 100, a maintenance station 118, and a maintenance robot 150. Each of the plurality of wire bonding systems 100 includes a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece (e.g., see [reference]). Figures 1A to 1C Each of the multiple wire bonding systems 100 also includes a docking station 112 (see, for example, see...). Figures 2A to 2B Each docking station 112 is configured to receive any one of a plurality of wire bonding tool replacement systems 130. Maintenance station 118 includes a plurality of wire bonding tool replacement systems 130 (e.g., see...). Figures 3A to 3B Maintenance station 118 also includes multiple wire bonding tool trays 140. Maintenance station 118 also includes a robot charging station 180. Maintenance robot 150 includes a robot base 152 and a robot arm 154. Robot base 152 carries maintenance robot 150 relative to multiple wire bonding systems 100. Maintenance robot 150 is configured to move throughout wire bonding array 10 via robot base 152, for example by tracks, wheels, overhead cables, tracks, etc.

[0032] exist Figure 4B In the middle, maintenance robot 150 has moved away from robot charging station 180. Maintenance robot 150 is using the handle of wire bonding tool replacement system 130 (e.g., by gripping the handle) Figure 1B and Figure 1C The handle 130c) is used by the robot arm 154 to fix the wire bonding tool during the replacement system 130. Figure 4CIn this process, the maintenance robot 150, together with the wire bonding tool changing system 130, has moved to a location adjacent to one of the plurality of wire bonding systems 100. The maintenance robot 150 aligns the wire bonding tool changing system 130 with the docking station 112 of the wire bonding system 100. It is conceivable that the maintenance robot 150 can carry the wire bonding tool changing system 130 in any manner during transport (e.g., by gripping the handle 130c during transport, by placing the wire bonding tool changing system 130 on the robot base 152 during transport, etc.). Figure 4C In this configuration, the removal of the wire bonding tool replacement system 130 exposes docking stations 112 of maintenance station 118. Maintenance station 118 includes a plurality of docking stations 112 corresponding to the number of wire bonding tool replacement systems 130. Each of the plurality of docking stations 112 of maintenance station 118 can be configured to receive each of the wire bonding tool replacement systems 130. Each of the plurality of docking stations 112 of maintenance station 118 may include power and / or data connections to facilitate communication between each of the plurality of wire bonding tool replacement systems 130 and a computer included in the wire bonding array 10.

[0033] exist Figure 4D In the process, maintenance robot 150 installs wire bonding tool replacement system 130 on docking station 112 of wire bonding system 100. Figure 4E In this configuration, the wire bonding tool replacement system 130 has been installed on the docking station 112 of the wire bonding system 100, and the maintenance robot 150 has returned to the robot charging station 180. The wire bonding tool replacement system 130 can begin the wire bonding tool replacement operation (i.e., the process of replacing the wire bonding tool installed on the wire bonding system with a different wire bonding tool 106).

[0034] Figure 5A It shows the relationship with Figure 4E Wire bonding array 10 in the same state. However, in Figure 5A In this context, the wire bonding tool replacement system 130, placed on the wire bonding system 100, has completed the replacement of the wire bonding tool and is ready to be removed. Additionally, another of the multiple wire bonding systems 100 requires replacement of its wire bonding tool. Figure 5B The maintenance robot 150 is shown using a robotic arm 154 to fix a wire bonding tool replacement system 130. Figure 5C This illustrates the alignment of a maintenance robot 150 with a wire bonding tool change system 130, one of a plurality of wire bonding systems 100. Figure 5D In this process, maintenance robot 150 installs wire bonding tool replacement system 130 on docking station 112 of another of multiple wire bonding systems 100. Figure 5EIn this configuration, the wire bonding tool replacement system 130 has been installed on docking station 112 of another of the multiple wire bonding systems 100, and the maintenance robot 150 has returned to robot charging station 180. The wire bonding tool replacement system 130 can then begin wire bonding tool replacement.

[0035] Figure 6A It shows the relationship with Figure 5E The wire bonding array 10 is in the same state. However, the wire bonding tool replacement system 130 has completed the replacement of the wire bonding tool and is ready to be removed. Figure 6B The diagram illustrates a maintenance robot 150 using a robotic arm 154 to secure a wire bonding tool replacement system 130. Figure 6C In the process, maintenance robot 150 has removed wire bonding tool replacement system 130 from wire bonding system 100. Maintenance robot 150 places wire bonding tool replacement system 130 onto docking station 112 of maintenance station 118. Figure 6D In this process, the wire bonding tool replacement system 130 has returned to docking station 112 of maintenance station 118, and the maintenance robot 150 has returned to robot charging station 180. The wire bonding tool replacement system 130 can wait until another of the multiple wire bonding systems 100 is ready for wire bonding tool replacement, or it can be maintained via maintenance station 118 (e.g., see...). Figures 9A to 9H (This will be discussed in more detail in this article).

[0036] Figure 7A It shows the relationship with Figure 4E The wire bonding array 10 is in the same state. However, the wire bonding tool replacement system 130 has not yet completed the replacement of the wire bonding tool of the wire bonding system 100. Furthermore, another of the multiple wire bonding systems 100 is preparing to replace its wire bonding tool. Figure 7B In the middle, maintenance robot 150 is fixing another wire bonding tool replacement system (i.e., wire bonding tool replacement system 130). Figure 7C The image shows a maintenance robot 150 aligning a wire bonding tool change system 130 with a wire bonding system 100. Figure 7D In the process, maintenance robot 150 installs wire bonding tool replacement system 130 on docking station 112 of wire bonding system 100. Figure 7E In the middle, the wire bonding tool replacement system 130 has been installed on the wire bonding system 100, and the maintenance robot 150 has been returned to the robot charging station 180.

[0037] although Figures 4A to 4E , Figures 5A to 5E , Figures 6A to 6D as well as Figures 7A to 7EA wire bonding array with a trackless maintenance robot is shown (e.g., where maintenance robot 150 uses wheels, tracks, etc. to move around wire bonding array 10), but the invention is not limited thereto. It is conceivable that a tracked maintenance robot (e.g., a track on a factory floor, an elevated track, etc.) could be beneficial in reducing the footprint of the wire bonding array. For example, Figures 8A to 8C Various embodiments of the invention are shown, in which a maintenance robot travels along a track.

[0038] In particular, Figure 8A A top view of an exemplary wire bonding array 20 is shown. The wire bonding array 20 includes multiple wire bonding systems 100, a robot support structure 168, and a maintenance station 118. The robot support structure 168 supports a maintenance robot 160 on a track 166. Similar to the maintenance robot 150, the maintenance robot 160 includes a robot base 162 and a robot arm 164. The robot arm 164 is configured to engage a handle 130c (e.g., see...). Figure 1B and Figure 1C This allows for the installation and / or removal of the wire bonding tool replacement system 130 from the wire bonding system 100. A maintenance robot 160 travels along track 166. The maintenance robot 160 is configured to move at least one wire bonding tool replacement system 130 between each of the plurality of wire bonding systems 100 and maintenance station 118. Maintenance station 118 is described in further detail here.

[0039] Figure 8B A side view of the wire bonding array 20 is shown. Specifically, Figure 8B The track 166 is raised such that it supports the robot base 162 above at least a portion of each of the plurality of wire bonding systems 100 (e.g., above docking station 112, or above any other receiving portion configured to receive a wire bonding tool changing system). Figure 8B In this configuration, the robot support structure 168 resembles an I-beam positioned between the wire bonding systems 100, which are arranged back-to-back (although the invention is not limited to a back-to-back arrangement). By raising the maintenance robot 160, multiple wire bonding systems 100 can be arranged such that a minimum amount of space exists between each of the multiple wire bonding systems 100. The maintenance station 118 can also be placed closer to the multiple wire bonding systems 100.

[0040] Furthermore, by suspending the robot support structure above the multiple wire bonding systems 100, the space between each of the multiple wire bonding systems 100 can be further reduced. Figure 8CThis wire bonding array 30 is shown, comprising a plurality of wire bonding systems 100 and a robot support structure 178. The robot support structure 178 includes a track 176 suspended above the plurality of wire bonding systems 100 (e.g., suspended from the ceiling of a plant via cables, trusses, or other structures). The robot support structure 178 supports a maintenance robot 170, which includes a robot base 172 and a robot arm 174 on the track 176. The track 176 supports the robot base 172 above at least a portion of each of the plurality of wire bonding systems 100 (e.g., above docking station 112, or any other receiving portion configured to receive a wire bonding tool replacement system). The wire bonding array 30 may also include a maintenance station (e.g., see...). Figure 8A (Maintenance station 118). By suspending the maintenance robot 170 above the remainder of the wire bonding array 30, each of the multiple wire bonding systems 100 can be placed at a minimum distance from each other.

[0041] Although maintenance robots 160 and 170 are shown and described as being supported by rails, the invention is not limited thereto. It is conceivable that the base of the maintenance robot can be lifted and supported by any other structure (such as cables or multiple cables, gantry cranes, conveyor belts, linear motors, ball screws, etc.).

[0042] Because wire bonding tool replacement systems perform maintenance on wire bonding arrays, they exhaust their supply of new wire bonding tools and collect used wire bonding tools (e.g., see...). Figure 3B Once the wire bonding tool replacement system has run out of new wire bonding tools, it can be reloaded. This reloading can be done manually by an operator or automatically (e.g., at a maintenance station). For example, once the idle wire bonding tool replacement system is returned to the maintenance station (e.g., as...), Figures 6A to 6D As shown in the diagram, the replacement component is installed on the docking station of the maintenance station by the maintenance robot. The replacement component can (i) remove the used wire bonding tool from the wire bonding tool replacement system and / or (ii) provide a new wire bonding tool to the wire bonding tool replacement system. Figures 9A to 9H This process is illustrated.

[0043] Figure 9A Maintenance station 118 is shown. Maintenance station 118 includes multiple wire bonding tool replacement systems 130, multiple wire bonding tool trays 140, replacement assembly 118a, and waste container 118b. Each of the multiple wire bonding tool replacement systems 130 is mounted on one of a plurality of docking stations 112 (not shown). One of the wire bonding tool replacement systems 130 is shown in a “depleted” state (e.g., see the description herein). Figure 3BEach of the multiple wire bonding tool replacement systems 130 is configured to be mounted on and removed from the wire bonding system (e.g., see [reference]). Figure 1B , Figure 1C , Figure 2A , Figure 2B as well as Figures 4A to 4E Each of the plurality of wire bonding tool trays 140 includes a plurality of wire bonding tools 106.

[0044] Replacement component 118a is configured to remove waste from each of the multiple wire bonding tool replacement systems 130. Such waste may include (i) used wire bonding tools 106' stored in the used wire bonding tool receiving portion 130d, and / or (ii) empty wire bonding tool trays 140. Replacement component 118a may include grippers, clamps, suction devices, or other structures known in the art for selectively moving articles.

[0045] exist Figure 9B In this process, replacement component 118a has been moved to wire bonding tool replacement system 130 to remove the empty wire bonding tool tray 140 from wire bonding tool replacement system 130. Figure 9C In this process, replacement component 118a has removed the empty wire bonding tool tray 140 from the wire bonding tool replacement system 130 and moved it to the waste container 118b. Figure 9D In this process, the wire bonding tool tray 140 has been deposited in the waste container 118b, and the replacement assembly 118a has been returned to the wire bonding tool replacement system 130 to remove the used wire bonding tool 106'. Figure 9E In this process, replacement component 118a removes the used wire bonding tool 106' (e.g., with or without a used wire bonding tool receiving portion 130d) from the wire bonding tool replacement system 130 and takes it to the waste receiving portion 118b. Figure 9F In the process, the used wire bonding tool 106′ has been deposited in the waste container 118b.

[0046] in addition, Figure 9F The replacement component 118a is shown in the process of picking up one of a plurality of wire bonding tool trays 140 for loading into the wire bonding tool replacement system 130. Figure 9G The image shows a replacement component 118a loading a wire bonding tool tray 140 into a wire bonding tool replacement system 130. Figure 9H The replacement component 118a in its original position and the wire bonding tool replacement system 130 in a "ready" state are shown.

[0047] As those skilled in the art will recognize, replacement component 118a may include multiple different mechanisms for performing the purpose of removing scrap and / or loading the wire bonding tool tray (e.g., one or more mechanisms for performing the purpose of removing scrap from the used wire bonding tool receiving portion 130d; removing an empty wire bonding tool tray 140; and / or loading the wire bonding tool tray 140).

[0048] Although maintenance station 118 has been shown and described using replacement components for specific functions (e.g., waste disposal, maintenance and / or refurbishment of wire bonding tool replacement system 130, etc.), the invention is not limited thereto. For example, an operator may perform specific functions among these. Therefore, the replacement components may differ from those shown herein and may actually be omitted in certain applications.

[0049] Although maintenance station 118 has been shown and described as comprising only a wire bonding tool changing system and a wire bonding tool tray, the invention is not limited thereto. It is conceivable that the maintenance station may include additional elements for wire bonding operations. For example, the maintenance station may include workpieces (e.g., workpieces to be bonded, finished workpieces, hoppers for holding multiple workpieces to be bonded or finished workpieces, etc.), lead spools, or other consumables, each of which can be distributed by a maintenance robot to multiple wire bonding systems (e.g., where a single maintenance robot is configured to move and / or install each consumable stored in the maintenance station).

[0050] Figures 10 to 11 This is a flowchart describing a method related to the wire bonding array described above. As those skilled in the art will understand, certain steps included in the flowchart may be omitted; specific additional steps may be added; and the order of the steps may be changed from the order shown, all of which are within the scope of this invention.

[0051] Now refer to Figure 10 In step 1000, a wire bonding array is provided (e.g., Figures 4A to 4E , Figures 5A to 5E , Figures 6A to 6D as well as Figures 7A to 7E Wire bonding array 10, Figure 8A and Figure 8B Wire bonding array 20, Figure 8C (e.g., wire bonding array 30). The wire bonding array includes multiple wire bonding systems, each of which includes a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece. The bonding head assembly includes wire bonding tools (e.g., see...). Figures 1A to 1CThe wire bonding system 100 in the array also includes a wire bonding tooling replacement system configured to be mounted on each of the plurality of wire bonding systems and to be removed from each of the plurality of wire bonding systems (e.g., see [reference]). Figures 3A to 3B The wire bonding tool replacement system 130. The wire bonding array also includes a maintenance robot configured to install the wire bonding tool replacement system on each of the plurality of wire bonding systems and to remove the wire bonding tool replacement system from each of the plurality of wire bonding systems (e.g., see [reference]). Figures 4A to 4E , Figures 5A to 5E , Figures 6A to 6D as well as Figures 7A to 7E 150 maintenance robots.

[0052] In step 1002, a maintenance robot transports the wire bonding tool replacement system to one of the multiple wire bonding systems (e.g., see...). Figure 4C In step 1004, a maintenance robot is used to install the wire bonding tool replacement system on one of the plurality of wire bonding systems (e.g., see...). Figure 4D In optional step 1006, the wire bonding tool replacement system is removed from one of the multiple wire bonding systems by a maintenance robot after step 1004 (see, for example, see...). Figure 5B and Figure 6B ).

[0053] In optional step 1006, after removing the wire bonding tool replacement system from the wire bonding system, one of two scenarios may occur: either optional steps 1008 and 1010 or optional steps 1012 and 1014. In optional step 1008, after optional step 1006, the wire bonding tool replacement system is transported using a maintenance robot to another of the multiple wire bonding systems (e.g., see...). Figure 5C In optional step 1010, the wire bonding tool replacement system is installed on another of the plurality of wire bonding systems after optional step 1008 (e.g., see...). Figure 5D In optional step 1012, the wire bonding tool replacement system is transported to the maintenance station by a maintenance robot after optional step 1006 (see, for example, see...). Figure 6C In optional step 1014, the wire bonding tool replacement system is installed on the docking station of the maintenance station after step 1012 (e.g., see...). Figure 6C and Figure 6D ).

[0054] Now refer to Figure 11 In step 1100, a maintenance station is provided (for example, see...). Figures 9A to 9HThe maintenance station includes multiple wire bonding tool replacement systems, each configured to be mounted on and removed from the wire bonding system. The maintenance station also includes multiple wire bonding tool trays, each containing multiple wire bonding tools (e.g., Figures 9A to 9H Multiple wire bonding tool trays 140). The maintenance station also includes a replacement component configured to load one of the multiple wire bonding tool trays into one of multiple wire bonding tool replacement systems (e.g., Figures 9A to 9H Replacement component 118a). In step 1102, the replacement component is used to install one of the multiple wire bonding tool trays into one of the multiple wire bonding tool replacement systems (see, for example, replacement component 118a). Figures 9F to 9G In optional step 1104, prior to step 1102, the empty wire bonding tool tray is removed from one of the multiple wire bonding tool replacement systems using a replacement component (e.g., see...). Figures 9B to 9C In optional step 1106, at least one used wire bonding tool is removed from the used wire bonding tool receptacle of one of the plurality of wire bonding tool replacement systems using a replacement component (e.g., see...). Figures 9D to 9E ).

[0055] Although the invention is shown and described herein as including only one type of wire bonding tool replacement system, the invention is not limited thereto. As those skilled in the art will recognize, the wire bonding tool replacement system can be configured in different ways, including compatibility with different wire bonding tools, or including additional features, and each wire bonding tool replacement system included in the wire bonding array need not be identical.

[0056] Although the invention is shown and described herein as comprising only a single maintenance robot, the invention is not limited thereto. A single maintenance robot has been illustrated and described for clarity and brevity only. It is conceivable that a wire bonding array may comprise multiple maintenance robots.

[0057] Although the invention has been illustrated and described herein with reference to specific embodiments, it is not intended to be limited to the details shown. Rather, various modifications to the details may be made within the scope and equivalent of the claims without departing from the invention.

Claims

1. A wire bonding array, comprising: A plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) a bonding head assembly for bonding wires to a workpiece and (ii) a support structure for supporting the workpiece. A wire bonding tool replacement system configured to be installed on each of the plurality of wire bonding systems and to be removed from each of the plurality of wire bonding systems; as well as A maintenance robot configured to install the wire bonding tool replacement system on each of the plurality of wire bonding systems and to remove the wire bonding tool replacement system from each of the plurality of wire bonding systems.

2. The wire bonding array of claim 1, wherein each of the plurality of wire bonding systems includes a docking station configured to receive the wire bonding tool changing system.

3. The wire bonding array of claim 2, wherein the docking station includes a connector for providing power and data to the wire bonding tool changing system.

4. The wire bonding array of claim 2, wherein the mating station includes a locating pin for aligning the wire bonding tool changing system during installation.

5. The wire bonding array of claim 1, further comprising at least one additional wire bonding tool replacement system configured to be mounted on each of the plurality of wire bonding systems and to be removed from each of the plurality of wire bonding systems.

6. The wire bonding array of claim 1, wherein the maintenance robot includes a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive the wire bonding tool replacement system.

7. A wire bonding array, comprising: A plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) a bonding head assembly for bonding wires to a workpiece and (ii) a support structure for supporting the workpiece. A maintenance station includes multiple wire bonding tool replacement systems, each of which is configured to be installed on and removed from each of the multiple wire bonding systems. as well as A maintenance robot configured to move some of the wire bonding tool replacement systems between the maintenance station and some of the multiple wire bonding systems.

8. The wire bonding array of claim 7, wherein each of the plurality of wire bonding systems includes a docking station configured to receive each of the plurality of wire bonding tool replacement systems.

9. The wire bonding array of claim 7, wherein the maintenance station comprises a plurality of docking stations, each of the plurality of docking stations being configured to receive each of the plurality of wire bonding tool replacement systems.

10. The wire bonding array of claim 7, wherein the maintenance station includes a replacement component configured to remove scrap from each of the plurality of wire bonding tool replacement systems, the scrap including at least one of: (i) an empty wire bonding tool tray configured to hold a plurality of wire bonding tools and (ii) at least one used wire bonding tool.

11. The wire bonding array of claim 10, wherein the maintenance station further includes a receiving portion for receiving the waste from the plurality of wire bonding tool replacement systems from the replacement assembly.

12. The wire bonding array of claim 7, wherein the maintenance station further comprises a plurality of wire bonding tool trays, each of the plurality of wire bonding tool trays comprising a plurality of wire bonding tools.

13. The wire bonding array of claim 12, wherein the maintenance station includes a replacement component configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems.

14. The wire bonding array of claim 7, wherein the maintenance station further includes a charging station for the maintenance robot.

15. The wire bonding array of claim 7, wherein the maintenance robot is further configured to move some of the wire bonding tool replacement systems of the plurality of wire bonding systems directly between some of the wire bonding systems of the plurality of wire bonding systems.

16. The wire bonding array of claim 7, wherein the maintenance robot includes a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

17. A maintenance station for maintaining wire bonding arrays, the maintenance station comprising: Multiple wire bonding tool replacement systems, each of which is configured to be mounted on and removed from the wire bonding system.

18. The maintenance station of claim 17 further includes a plurality of docking stations configured to receive any one of the plurality of wire bonding tool replacement systems.

19. The maintenance station of claim 17 further includes a replacement component configured to remove scrap from each of the plurality of wire bonding tool replacement systems, the scrap including at least one of: (i) an empty wire bonding tool tray configured to hold the plurality of wire bonding tools and (ii) at least one used wire bonding tool.

20. The maintenance station of claim 19 further includes a receiving section for receiving the waste from the plurality of wire bonding tool replacement systems.

21. The maintenance station of claim 17 further includes a plurality of wire bonding tool trays, each of the plurality of wire bonding tool trays including a plurality of wire bonding tools.

22. The maintenance station of claim 21, further comprising a replacement component configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems.

23. The maintenance station of claim 17 further includes a maintenance robot configured to move some of the wire bonding tool replacement systems in the plurality of wire bonding tool replacement systems between the maintenance station and some of the wire bonding systems in the plurality of wire bonding systems.

24. The maintenance station according to claim 23 further includes a charging station for the maintenance robot.

25. The maintenance station of claim 23, wherein the maintenance robot includes a base for movement relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

26. A method for maintaining a wire bonding array, the method comprising the following steps: (a) Providing a wire bonding array, the wire bonding array comprising (i) a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece, the bonding head assembly including a wire bonding tool; and (ii) a wire bonding tool replacement system configured to be mounted on each of the plurality of wire bonding systems and to be removed from each of the plurality of wire bonding systems. (iii) a maintenance robot configured to install the wire bonding tool replacement system on each of the plurality of wire bonding systems and remove the wire bonding tool replacement system from each of the plurality of wire bonding systems; (b) Using the maintenance robot, transport the wire bonding tool replacement system to one of the plurality of wire bonding systems; and (c) Using the maintenance robot, the wire bonding tool replacement system is installed on one of the plurality of wire bonding systems.

27. The method of claim 26, further comprising step (d) after step (c), using the maintenance robot to remove the wire bonding tool replacement system from one of the plurality of wire bonding systems.

28. The method of claim 27, further comprising, after step (d), step (e), using the maintenance robot to transport the wire bonding tool replacement system to another of the plurality of wire bonding systems, and further comprising, after step (e), step (f), installing the wire bonding tool replacement system on the other of the plurality of wire bonding systems.

29. The method of claim 27, further comprising step (e) after step (d), using the maintenance robot to transport the wire bonding tool replacement system to the maintenance station, and step (f) after step (e), installing the wire bonding tool replacement system on the docking station of the maintenance station.

30. The method of claim 26, wherein step (a) includes providing a maintenance robot, the maintenance robot including a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive the wire bonding tool replacement system.

31. A method for maintaining a wire bonding array, the method comprising the following steps: (a) Providing a wire bonding array, the wire bonding array comprising (i) a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bonding head assembly for bonding wires to a workpiece and a support structure for supporting the workpiece, the bonding head assembly including a wire bonding tool; (ii) a maintenance station including a plurality of wire bonding tool replacement systems, each of the plurality of wire bonding tool replacement systems being configured to be mounted on each of the plurality of wire bonding systems and removed from each of the plurality of wire bonding systems; (iii) a maintenance robot configured to install some of the wire bonding tool replacement systems in each of the plurality of wire bonding tool replacement systems, and to remove some of the wire bonding tool replacement systems from each of the plurality of wire bonding tool replacement systems. (b) Using the maintenance robot, transporting one of the plurality of wire bonding tool replacement systems from the maintenance station to one of the plurality of wire bonding systems; and (c) Using the maintenance robot, one of the plurality of wire bonding tool replacement systems is installed on one of the plurality of wire bonding systems.

32. The method of claim 31, further comprising step (d) after step (c), using the maintenance robot to remove one of the plurality of wire bonding tool replacement systems from one of the plurality of wire bonding systems.

33. The method of claim 32, further comprising, after step (d), step (e), using the maintenance robot to transport one of the plurality of wire bonding tool replacement systems to another of the plurality of wire bonding systems, and further comprising, after step (e), step (f), installing one of the plurality of wire bonding tool replacement systems onto the other of the plurality of wire bonding systems.

34. The method of claim 32, further comprising, after step (d), step (e), using the maintenance robot to transport one of the plurality of wire bonding tool replacement systems to the maintenance station, and further comprising, after step (e), step (f), installing one of the plurality of wire bonding tool replacement systems on a docking station of the maintenance station.

35. The method of claim 31, wherein step (a) includes providing a maintenance robot, the maintenance robot including a base for moving the maintenance robot relative to the plurality of wire bonding systems, the base being positioned above a receiving portion of each of the plurality of wire bonding systems, the receiving portion being configured to receive each of the plurality of wire bonding tool replacement systems.

36. A method for operating a maintenance station of a wire bonding array, the method comprising the following steps: (a) Providing a maintenance station, the maintenance station comprising (i) a plurality of wire bonding tool replacement systems, each of the plurality of wire bonding tool replacement systems being configured to be mounted on and removed from a wire bonding system, (ii) a plurality of wire bonding tool trays, each of the plurality of wire bonding tool trays including a plurality of wire bonding tools, and (iii) a replacement assembly configured to load one of the plurality of wire bonding tool trays into one of the plurality of wire bonding tool replacement systems; as well as (b) Using the replacement component, one of the plurality of wire bonding tool trays is installed in one of the plurality of wire bonding tool replacement systems.

37. The method of claim 36, further comprising, prior to step (b), removing an empty wire bonding tool tray from one of the plurality of wire bonding tool replacement systems using the replacement component.

38. The method of claim 36, further comprising the step of removing at least one used wire bonding tool from the used wire bonding tool receptacle of one of the plurality of wire bonding tool replacement systems using the replacement component.

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