Method for mounting chip components and mounting device for chip components

Abstract

Provided is a chip component mounting method and a chip component mounting apparatus capable of adjusting the parallelism of a holding surface of an attachment with respect to a substrate placement table with high precision. Specifically, there are a parallelism adjustment step (step S05) of adjusting the parallelism of a holding surface (43a) and a parallelism measurement step (step S06) of measuring the parallelism of the holding surface (43a), in which the measurement of the parallelism of the holding surface (43a) is performed by calculating, each time the position of a height reference rod (3) is displaced in the horizontal direction, the relationship between the positions of the holding surface (43a) in the vertical direction and the position of the height reference rod (3) at each measurement time when the holding surface (43a) is pressed against the height reference rod (3) from above, and in the parallelism adjustment step, the adjustment of the parallelism of the holding surface (43a) is performed by lowering a bonding head (42) in a state in which the height reference rod (3) is displaced to a position coordinate (a prescribed position) in the horizontal direction and pressing the holding surface (43a) against the height reference rod (3).

Description

Technical Field

[0001] The present invention relates to a method for mounting chip components at a predetermined location on the main surface of a substrate, and an apparatus for mounting chip components using the method. Background Technology

[0002] Previously, there were known mounting devices for mounting chip components at a predetermined location on the main surface of a substrate (for example, see "Patent Document 1").

[0003] The mounting device includes, for example, a substrate mounting stage that holds and maintains the substrate in a horizontal position; a bonding head that is vertically movable and positioned above the substrate mounting stage; and an accessory that is detachably fixed to the opposing surface (lower surface) of the bonding head that faces the substrate mounting stage.

[0004] Furthermore, with the aforementioned designated portion facing upwards, the substrate is placed and held on the substrate mounting stage. On the other hand, a chip component is supplied to and held on the opposing surface (hereinafter appropriately referred to as the "holding surface") of the accessory that faces the substrate mounting stage. Then, the bonding head is lowered and the chip component is pressed onto the substrate. Thus, the mounting device mounts the chip component to the designated portion of the main surface of the substrate.

[0005] In the field of manufacturing semiconductor devices, electronic components, etc., when mounting chip components, such as semiconductor chips, on a specified location on the main surface of a substrate made of wiring substrates, etc., a precision of micrometers is generally required. In addition, this required precision has been gradually increasing in recent years.

[0006] Therefore, it is necessary to maintain the parallelism of the holding surface of the accessory relative to the substrate stage with high precision. If this is ignored, it may become the main cause of chip misalignment, poor terminal connection, etc. when mounting the chip components on the substrate, making it difficult to mount the chip components with high precision.

[0007] Therefore, in existing mounting devices, the parallelism of the retaining surface of the accessory is maintained with high precision by periodically or irregularly measuring and appropriately adjusting the parallelism of the retaining surface relative to the substrate mounting stage.

[0008] For example, as one example, Figure 9(a) is an enlarged front view showing the state near the attachment 143 when adjusting the parallelism of the retaining surface 143a of the attachment 143 in the conventional mounting device 101. However, as shown in this figure, the key head 142 that fixes the attachment 143 in a detachable manner is supported on the lifting mechanism (not shown) via a spherical air bearing 141. The spherical air bearing 141 has a fixed part 141a having a spherical concave portion 141a1 and a movable part 141b having a spherical convex portion 141b1 along the concave portion 141a1. Regarding the spherical air bearing 141, the movable part 141b can swing three-dimensionally relative to the fixed part 141a by being supplied with compressed air. In addition, the movable part 141b is fixed relative to the fixed part 141a by attracting compressed air inside the bearing.

[0009] Furthermore, if the result of measuring the parallelism of the holding surface 143a of the attachment 143 relative to the substrate mounting stage 102 is that the parallelism exceeds the allowable value, the spherical air bearing 141 is made to a state in which the movable part 143b can swing relative to the fixed part 141a. Based on this, the bonding head 142 is lowered to press the holding surface 143a of the attachment 143 onto the upper surface 102a of the substrate mounting stage 102. After that, the spherical air bearing 141 is made to a state in which the movable part 141b is fixed relative to the fixed part 141a.

[0010] Therefore, the inclination of the holding surface 143a of the attachment 143 mimics the inclination of the upper surface 102a of the substrate stage 102, and the parallelism of the holding surface 143a of the attachment 143 relative to the substrate stage 102 is adjusted.

[0011] Existing technical documents

[0012] Patent documents

[0013] Patent Document 1: Japanese Patent No. 7219991 Summary of the Invention

[0014] The problem that the invention aims to solve

[0015] in addition, Figure 9 (b) is an enlarged schematic diagram showing the state of each attachment 143 and bonding head 142 when the holding surface 143a of attachment 143 is pressed at different positions on the substrate mounting stage 102. However, as shown in this figure, on the upper surface 102a of the actual substrate mounting stage 102, there are fine irregularities when viewed at the level of micrometers, which is the aforementioned required precision. Therefore, the tilt of the holding surface 143a varies on the substrate mounting stage 102 depending on the position of the holding surface 143a of the pressing attachment 143.

[0016] For example, when the holding surface 143a of the attachment 143 is pressed at the first position P1 on the substrate mounting stage 102, the inclination of the holding surface 143a becomes such that it is inclined in one direction (i.e., similar to the upper surface 102a of the substrate mounting stage 102 at the first position P1). Figure 9 (b) is the left side) and the slope is tilted upwards.

[0017] Furthermore, when the holding surface 143a of the attachment 143 is pressed at the second position P2 on the substrate mounting stage 102, the inclination of the holding surface 143a becomes such that it resembles the upper surface 102a of the substrate mounting stage 102 at the second position P2 in another direction (in... Figure 9 (b) is the right side) and the slope is tilted upwards.

[0018] Furthermore, when the holding surface 143a of the attachment 143 is pressed at the third position P3 on the substrate mounting stage 102, the inclination of the holding surface 143a is approximately horizontal, mimicking the upper surface of the substrate mounting stage 102 at the third position P3.

[0019] Therefore, as with the conventional mounting device 101 described above, in the method of adjusting the parallelism of the holding surface 143a by pressing the holding surface 143a of the attachment 143 onto the substrate mounting stage 102, the parallelism of the holding surface 143a can vary depending on the position of the holding surface 143a of the attachment 143 on the substrate mounting stage 102. Therefore, it is sometimes difficult to adjust the parallelism of the holding surface 143a of the attachment 143 relative to the substrate mounting stage 102 with high precision.

[0020] The present invention was made in view of the problems of the present situation described above. Its objective is to provide a chip component mounting method and a chip component mounting apparatus for implementing the mounting method. In the chip component mounting method, a chip component is supplied to and held on the holding surface of an accessory that is detachably fixed to a bonding head, and the bonding head is lowered, thereby mounting the chip component onto a substrate placed on a substrate mounting stage. The chip component mounting method and the chip component mounting apparatus can adjust the parallelism of the holding surface of the accessory relative to the substrate mounting stage with high precision.

[0021] Methods for solving problems

[0022] The problem to be solved by the present invention has been described above. The means for solving the problem will be described below.

[0023] That is, regarding the chip component mounting method of Embodiment 1 of the present invention, the chip component is supplied to and held on the holding surface of an accessory detachably fixed to a bonding head, the bonding head is lowered, and the chip component is mounted on a substrate placed on a substrate mounting stage. The chip component mounting method is characterized by a parallelism adjustment step, in which the parallelism of the holding surface of the accessory relative to the upper surface of the substrate mounting stage is adjusted. The parallelism adjustment step includes: a parallelism adjustment step for adjusting the parallelism of the holding surface; a parallelism measurement step for measuring the parallelism of the holding surface after adjustment by the parallelism adjustment step; and a parallelism determination step for determining the parallelism measured by the parallelism measurement step. Whether the parallelism of the holding surface is within the allowable range, in the parallelism measurement step, the parallelism of the holding surface is measured as follows: whenever the position of the height reference bar is shifted in the horizontal direction, the bonding head is lowered, and the vertical position of the holding surface when the holding surface is pressed against the height reference bar is measured respectively. The parallelism is calculated based on the relationship between the measured vertical positions of the holding surface and the position of the height reference bar at each measurement. In the parallelism adjustment step, the parallelism of the holding surface is adjusted as follows: with the height reference bar moved to a specified position in the horizontal direction, the bonding head is lowered, and the holding surface is pressed against the height reference bar.

[0024] Furthermore, regarding the chip component mounting apparatus of Embodiment 1 of the present invention, a chip component is supplied to and held on the holding surface of an accessory detachably fixed to a bonding head, causing the bonding head to descend, thereby mounting the chip component onto a substrate placed on a substrate mounting stage. The chip component mounting apparatus is characterized by comprising: a control unit that controls the operation of the mounting apparatus to perform a parallelism adjustment process that adjusts the parallelism of the holding surface of the accessory relative to the upper surface of the substrate mounting stage; and a height reference bar that can be moved in the horizontal direction. The parallelism adjustment process includes: a parallelism adjustment step for adjusting the parallelism of the holding surface; a parallelism measurement step for measuring the parallelism of the holding surface after adjustment by the parallelism adjustment step; and a parallelism determination step for determining the parallelism of the holding surface after adjustment by the parallelism adjustment step. To determine whether the parallelism of the holding surface measured in the parallelism measurement step is within the allowable range, the control unit performs the parallelism measurement of the holding surface as follows: whenever the position of the height reference bar is shifted in the horizontal direction, the bonding head is lowered, and the vertical position of the holding surface when the holding surface is pressed against the height reference bar is measured respectively. The control unit calculates the relationship between the measured vertical positions of the holding surface and the position of the height reference bar at each measurement. In the parallelism adjustment step, the control unit performs the parallelism adjustment of the holding surface as follows: with the height reference bar moved to a predetermined position in the horizontal direction, the bonding head is lowered, and the holding surface is pressed against the height reference bar.

[0025] Thus, in the chip component mounting method and chip component mounting apparatus of Embodiment 1 of the present invention, when adjusting the parallelism of the holding surface of the accessory relative to the substrate stage, a parallelism adjustment step is performed using a height reference bar used in the parallelism measurement step. Furthermore, in this parallelism adjustment step, the bonding head is lowered while the height reference bar is moved to a predetermined position in the horizontal direction, and the holding surface of the accessory is pressed against the height reference bar, thereby adjusting the parallelism of the holding surface.

[0026] Therefore, the chip component mounting method and chip component mounting apparatus according to Embodiment 1 of the present invention, compared with the conventional method of adjusting the parallelism of the holding surface of the accessory by directly pressing the holding surface of the accessory onto the substrate mounting stage, are not affected by the minute unevenness of the substrate mounting stage, and can adjust the parallelism of the holding surface of the accessory relative to the substrate mounting stage with high precision.

[0027] Furthermore, regarding the chip component mounting method of Embodiment 2 of the present invention, in the chip component mounting method of Embodiment 1, the parallelism determination step is characterized in that, if the parallelism of the holding surface is within the allowable value range, the parallelism adjustment step is terminated; if the parallelism of the holding surface is not within the allowable value range, the displacement direction and displacement amount with respect to the position of the height reference bar are calculated to make the parallelism of the holding surface approach the allowable value; and the parallelism adjustment step is performed again after the height reference bar has been moved to the calculated position.

[0028] Furthermore, regarding the chip component mounting apparatus of Embodiment 2 of the present invention, in the chip component mounting apparatus of Embodiment 2, the control unit ends the parallelism adjustment process when the parallelism of the holding surface is within the allowable value in the parallelism determination step; and when the parallelism of the holding surface is not within the allowable value, the control unit calculates the displacement direction and displacement amount of the height reference bar to make the parallelism of the holding surface approach the allowable value, and performs the parallelism adjustment step again when the height reference bar is moved to the calculated position.

[0029] With such a structure, the parallelism adjustment step, parallelism measurement step, and parallelism determination step can be repeated sequentially while the result determined by the parallelism determination step is fed back. This allows the parallelism of the holding surface of the accessory to reliably converge toward the allowable value, and enables more reliable and high-precision adjustment of the parallelism of the holding surface of the accessory relative to the substrate stage.

[0030] Furthermore, regarding the chip component mounting method of Embodiment 3 of the present invention, in the chip component mounting method of Embodiment 1 or Embodiment 2, the parallelism adjustment process is characterized by comprising: an initial parallelism measurement step, wherein after the parallelism adjustment process begins, the parallelism adjustment step is not performed, and the parallelism of the current holding surface is measured; and an initial parallelism determination step, wherein it is determined whether the parallelism of the holding surface measured by the initial parallelism measurement step is within half of the allowable value. In the initial parallelism determination step, if the parallelism of the holding surface is within half of the allowable value, the parallelism adjustment process is terminated. Alternatively, if the parallelism of the holding surface is not within half of the allowable value, the parallelism adjustment step is performed while the height reference bar is moved to a reference position coaxial with the bonding head.

[0031] Furthermore, regarding the chip component mounting apparatus of Embodiment 3 of the present invention, in the chip component mounting apparatus of Embodiment 1 or Embodiment 2, the parallelism adjustment process is characterized by comprising: an initial parallelism measurement step, wherein after the parallelism adjustment process begins, the parallelism adjustment step is not performed, and the parallelism of the current holding surface is measured; and an initial parallelism determination step, wherein it is determined whether the parallelism of the holding surface measured by the initial parallelism measurement step is within half of the allowable value. In the initial parallelism determination step, if the parallelism of the holding surface is within half of the allowable value, the control unit ends the parallelism adjustment process. Otherwise, if the parallelism of the holding surface is not within half of the allowable value, the control unit performs the parallelism adjustment step while moving the height reference bar to a reference position coaxial with the bonding head.

[0032] By performing such an initial parallelism measurement step and an initial parallelism determination step, when the parallelism of the holding surface of the accessory relative to the substrate stage is already within the allowable range, the time lost from repeatedly performing the parallelism adjustment step, the parallelism measurement step, and the parallelism determination step can be saved, and the parallelism of the holding surface of the accessory relative to the substrate stage can be adjusted more efficiently and with higher precision.

[0033] Furthermore, by setting the judgment criterion in the initial parallelism judgment step to 1 / 2 of the allowable value, for example, in the case of performing a parallelism adjustment process for adjusting the parallelism of the holding surface of the adjusting attachment, it is possible to prevent the parallelism adjustment process from being completed in a state where the parallelism of the holding surface is always tilted to the maximum extent within the allowable value, thus preventing the parallelism from converging to the desired parallelism.

[0034] Furthermore, regarding the chip component mounting method of Embodiment 4 of the present invention, in the chip component mounting method of any of Embodiments 1 to 3, the method is characterized in that, in the parallelism determination step, when the parallelism of the holding surface is within the allowable value range, the position of the height reference bar in the previously executed parallelism adjustment step is stored as the optimal position, and each time the parallelism adjustment step is executed again, the optimal position is updated to the position of the height reference bar when the parallelism of the holding surface is closer to the desired parallelism. A number of executions for which the parallelism adjustment step, the parallelism measurement step, and the parallelism determination step can be repeatedly executed is preset. In the parallelism determination step, when the parallelism of the holding surface is not within the allowable value range, the parallelism adjustment step is executed again while the height reference bar is moved to the optimal position.

[0035] Furthermore, regarding the chip component mounting apparatus of Embodiment 4 of the present invention, in the chip component mounting apparatus of any of Embodiments 1 to 3, the control unit stores the position of the height reference bar in the previously executed parallelism determination step as the optimal position when the parallelism of the holding surface is within the allowable value range. Each time the parallelism adjustment step is executed again, the optimal position is updated to the position of the height reference bar when the parallelism of the holding surface is closer to the desired parallelism. A preset number of executions is provided for the parallelism adjustment step, the parallelism measurement step, and the parallelism determination step. In the parallelism determination step, where the execution count is the last, if the parallelism of the holding surface is not within the allowable value range, the control unit, while moving the height reference bar to the optimal position, executes the parallelism adjustment step again.

[0036] Thus, in the chip component mounting method and chip component mounting apparatus of Embodiment 4 of the present invention, the configuration is such that, whenever a parallelism adjustment step for adjusting the parallelism of the holding surface of the attachment is performed, the position of the height reference bar when the parallelism of the holding surface is closer to the desired parallelism is sequentially updated and stored as the optimal position. Even if the parallelism adjustment step, parallelism measurement step, and parallelism determination step are repeated a predetermined number of times, and the parallelism of the holding surface of the attachment does not converge to the allowable range, the parallelism adjustment step is performed while the height reference bar is moved to the optimal position to adjust the parallelism of the holding surface. Therefore, the chip component mounting method and chip component mounting apparatus of Embodiment 4 of the present invention can prevent the parallelism adjustment step from ending before the parallelism of the holding surface of the attachment converges to the allowable range, and can adjust the parallelism of the holding surface more reliably and with higher precision.

[0037] Invention Effects

[0038] As a result of the present invention, the following effects are achieved.

[0039] That is, according to the chip component mounting method and chip component mounting apparatus of the present invention, the parallelism of the holding surface of the accessory relative to the substrate mounting stage can be adjusted with high precision. Attached Figure Description

[0040] Figure 1 This is a front view showing the overall structure of a chip component mounting device according to one embodiment of the present invention.

[0041] Figure 2 It is a diagram used to illustrate the parallelism adjustment steps, and is an enlarged front view showing the relationship between the bonding head and accessories and the height reference bar.

[0042] Figure 3 It is a diagram used to illustrate the parallelism measurement procedure, and is an enlarged front view showing the relationship between the bonding head and accessories and the height reference bar.

[0043] Figure 4 These are diagrams illustrating a method of mounting a chip component relative to a substrate having a cavity (recess). (a) is an enlarged front view showing the state near the attachment when the chip component is mounted in the cavity of the substrate, and (b) is an enlarged front view showing the state of the chip component mounted in a cavity with its bottom surface inclined relative to the upper surface of the substrate.

[0044] Figure 5 This is a schematic diagram showing the movable direction of the attachment.

[0045] Figure 6 This is a flowchart illustrating the overall process of parallelism adjustment.

[0046] Figure 7 This is a diagram showing the sequence of actions when setting the position coordinates of the height reference bar in the parallelism determination step. It is also a flowchart showing the sequence of actions when the measured count value is "0" and when the measured count value is equal to the set count value.

[0047] Figure 8 This diagram shows the sequence of actions when setting the position coordinates of the height reference bar in the parallelism determination step. It is also a flowchart showing the sequence of actions when the measured count value does not reach the set count value and when the measured count value exceeds the set count value.

[0048] Figure 9 The diagram illustrates the parallelism adjustment process performed by an existing mounting device. (a) is an enlarged front view showing the state near the attachment when the parallelism of the attachment's holding surface is adjusted. (b) is an enlarged schematic diagram showing the state of each attachment and bonding head when the holding surface of the attachment is pressed against different positions on the substrate mounting stage. Detailed Implementation

[0049] Next, use Figures 1 to 8 An embodiment of the present invention will be described.

[0050] In addition, for convenience, the following explanation is provided via... Figures 1 to 5 The direction of the arrows shown indicates the front-back, left-right, and up-down directions of the mounting device 1.

[0051] [Overall structure of the mounting device 1 for chip component W]

[0052] First, use Figures 1 to 5The overall structure of the mounting device 1 (hereinafter referred to as "mounting device 1") for the chip component W, which embodies the present invention, will be described.

[0053] The mounting device 1 in this embodiment is, for example, a device for mounting a chip component W, which is made of a semiconductor chip, or the like, at a predetermined position on a substrate L, which is made of a wiring substrate, or the like. It is configured to mount the electrode surface of the chip component W and the electrode surface of the substrate L in a state where they are facing the same direction to each other, with the surface facing upward.

[0054] However, the mounting device 1 is not limited to upward mounting, but can also be applied to downward mounting where the electrode surface of the chip component W and the electrode surface of the substrate L are mounted opposite each other.

[0055] Here, as Figure 4 As shown in (a), on the main surface of the substrate L on which the chip components W are mounted, multiple (in) along the planar shape of each chip component W Figure 4 (a) only records one cavity (recess) La, La... set as a matrix.

[0056] Furthermore, the substrate L is placed on the substrate mounting stage 2 (see reference 2) with these multiple cavities La, La… facing upwards. Figure 1 It is placed on the substrate and held by the substrate mounting stage 2.

[0057] On the other hand, a chip mounting film F, which serves as an adhesive, is pre-attached to one side of the chip component W.

[0058] Additionally, the chip component W is supplied to the lower surface (holding surface 43a) of the attachment 43 described later with the chip mounting film F facing downwards, and is detachably held by the attachment 43.

[0059] Furthermore, the bonding head 42, described later, is lowered, and the attachment 43 fixed to the bonding head 42 is pressed from above toward the desired cavity La on the substrate L, thereby installing the chip component W in the predetermined position on the substrate L (i.e., in the desired cavity La).

[0060] Furthermore, the structure of the chip component W is not limited to a semiconductor chip; for example, it can also be an electronic chip composed of other electronic components that only have wiring.

[0061] Furthermore, the method for fixing the chip component W relative to the substrate L is not limited to using the chip mounting film F; for example, other thermo-bonding methods can be employed.

[0062] Furthermore, the structure of the substrate L is not limited to this embodiment; for example, it can also be a flat plate shape without a cavity La.

[0063] Furthermore, as in the past, when the holding surface 43a of the attachment 43 is pressed against the upper surface 2a of the substrate stage 2 and the parallelism of the holding surface 43a of the attachment 43 relative to the substrate stage 2 is adjusted, although the parallelism of the holding surface 43a of the attachment 43 relative to the upper surface Lb of the substrate L placed on the substrate stage 2 is maintained with high precision, it is unclear whether the parallelism of the holding surface 43a relative to the bottom surface La1 of each cavity La is maintained with high precision.

[0064] Therefore, as Figure 4 As shown in (b), for example, when the bottom surface La1 of the cavity La is inclined relative to the upper surface Lb of the substrate L, the chip component W is mounted in the cavity La with a high degree of parallelism relative to the upper surface Lb of the substrate L. A gap is generated between the bottom surface La1 of the cavity La and the chip component W, which may become the main cause of so-called chip misalignment and voids at the bonding interface.

[0065] On the other hand, in order to solve this problem, it is also considered to adjust the parallelism of the retaining surface 43a relative to the bottom surface La1 of the cavity La by directly pressing the retaining surface 43a of the attachment 43 against the bottom surface La1 of the cavity La. However, in general, the bottom surface La1 of the cavity La is smaller than the retaining surface 43a of the attachment 43, so it is difficult to insert the attachment 43 into the cavity La and press the retaining surface 43a of the attachment 43 against the bottom surface La1 of the cavity La.

[0066] In this embodiment, as described later, when adjusting the parallelism of the holding surface 43a of the attachment 43 relative to the substrate mounting stage 2, the holding surface 43a of the attachment 43 is pressed against the height reference bar 3 (see reference 3) used when measuring the parallelism of the holding surface 43a. Figure 1 The contact portion 3a of the attachment 43 is used for contact. Therefore, as described above, it is not necessary to directly press the retaining surface 43a of the attachment 43 onto the bottom surface La1 of the cavity La. The parallelism of the retaining surface 43a of the attachment 43 relative to the bottom surface La1 of each cavity La can be maintained with high precision.

[0067] like Figure 1 As shown, the mounting apparatus 1 includes a mounting area A1 for mounting the chip component W and a parallelism adjustment process Z01 (described later) (see reference). Figure 6 The mounting device 1 mainly includes: a substrate mounting stage 2 disposed in the mounting area A1, a height reference bar 3 disposed in the adjustment area A2, a mounting head 4 disposed above the substrate mounting stage 2 and the height reference bar 3 and capable of reciprocating between the mounting area A1 and the adjustment area A2, and a control device 5 for controlling the overall movement of the mounting device 1.

[0068] The substrate mounting stage 2 holds the substrate L on which the chip component W is mounted in a horizontal position.

[0069] The substrate mounting stage 2 has an upper surface 2a capable of mounting a substrate L, and an attraction mechanism (not shown) is provided on the upper surface 2a.

[0070] Additionally, a heater (not shown) is provided inside the substrate mounting stage 2.

[0071] Furthermore, the substrate mounting stage 2 places the substrate L on the upper surface 2a in a horizontal orientation with the multiple cavities La, La... facing upwards, and holds the substrate L in a detachable manner by the aforementioned suction mechanism.

[0072] In addition, the substrate stage 2 is heated by the heater mentioned above, thereby raising the temperature of the substrate L held by the upper surface 2a.

[0073] In addition, a drive mechanism (not shown) is provided on the substrate mounting stage 2, which enables the substrate mounting stage 2 to move at high speed in the horizontal direction (in this embodiment, the front-back direction and the left-right direction).

[0074] Furthermore, when performing the chip component W installation operation, the substrate mounting stage 2 is moved horizontally by the aforementioned drive mechanism so that the desired cavity La in the substrate L is located directly below the mounting head 3 (more specifically, the attachment 43 described later).

[0075] The height reference bar 3 adjusts the parallelism of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate stage 2, and measures the parallelism of the adjusted holding surface 43a.

[0076] The height reference bar 3 is, for example, composed of a component extending in the vertical direction, with an abutment portion 3a protruding upward at its upper end. This abutment portion 3a has a flat surface (upper surface) that is extremely small compared to the external dimensions of the chip component W.

[0077] Furthermore, the structure of the height reference bar 3 is not limited to this embodiment. For example, it may be a measuring bar that extends only in the vertical direction, a measuring element of a dial gauge, etc.

[0078] The height reference bar 3 is provided with a drive mechanism (not shown) that enables the height reference bar 3 to move in the horizontal direction (in this embodiment, the front-back direction and the left-right direction).

[0079] Furthermore, when the position of the height reference bar 3 is appropriately shifted (moved) in the horizontal direction by the aforementioned driving mechanism, the retaining surface 43a of the attachment 43 abuts against the upper surface of the contact portion 3a, thereby adjusting the parallelism of the retaining surface 43a to the desired parallelism.

[0080] In addition, whenever the height reference bar 3 is moved to a predetermined number of positions by the aforementioned drive mechanism, the holding surface 43a of the attachment 43 is brought into contact with the upper surface of the contact portion 3a, thereby measuring the parallelism of the holding surface 43a.

[0081] Furthermore, details regarding the adjustment steps (parallelism adjustment steps) for adjusting the parallelism of the retaining surface 43a of the attachment 43 using the height reference bar 3 and the measurement steps (parallelism measurement steps) for measuring the parallelism of the retaining surface 43a of the attachment 43 will be described later.

[0082] Mounting head 4 has a spherical air bearing 41, a key head 42, and an accessory 43 arranged sequentially from top to bottom.

[0083] Additionally, the mounting head 4 has a drive mechanism (not shown) through which the spherical air bearings 41, the bonding head 42, and the accessory 43 are configured to reciprocate as a whole in the horizontal direction and in one direction (left-right direction in this embodiment), and are configured to move as a whole in the vertical direction (capable of lifting and lowering).

[0084] The spherical air bearing 41 has a fixed part 41a located at the top and a movable part 41b located below the fixed part 41a.

[0085] A spherical recess 41a1 is formed on the lower surface of the fixing part 41a.

[0086] In addition, a spherical protrusion 41b1 is formed on the upper surface of the movable part 41b along the aforementioned concave part 41a1.

[0087] Furthermore, these fixed portions 41a and movable portions 41b are connected to each other in a state where the protrusion 41b1 is fitted into the recess 41a1 with a tiny gap. That is, the movable portion 41b is connected via the protrusion 41b1 in a manner that allows it to swing three-dimensionally along the recess 41a1 of the fixed portion 41a1.

[0088] Furthermore, the spherical air bearing 41 is able to perform a three-dimensional swinging motion of the movable part 41b relative to the fixed part 41a by supplying compressed air into the aforementioned gap (hereinafter, appropriately referred to as "free state"). In addition, the spherical air bearing 41 is also able to prevent the three-dimensional swinging motion of the movable part 41b relative to the fixed part 41a by attracting compressed air into the aforementioned gap (that is, the position of the movable part 41b relative to the fixed part 41a is fixed, hereinafter, appropriately referred to as "locked state").

[0089] Furthermore, the structure of the fixed part 41a and the movable part 41b is not limited to this embodiment. For example, a spherical protrusion may be provided on the lower surface of the fixed part 41a, and a spherical concave part may be provided on the upper surface of the movable part 41b.

[0090] The bonding head 42 is provided protruding downward on the lower surface of the movable part 41b.

[0091] Additionally, a heater (not shown) is provided at the lower end of the bonding head 42.

[0092] The lower surface of the heater is formed as a plane, constituting the lower end face 42a of the bonding head 42.

[0093] In addition, a suction mechanism (not shown) is provided on the lower end face 42a.

[0094] Furthermore, the bonding head 42 secures the accessory 43 at its lower end face 42a in a detachable manner via the aforementioned suction mechanism.

[0095] In addition, the bonding head 42 heats the accessory 43 via the aforementioned heater, thereby raising the temperature of the chip component W held by the accessory 43.

[0096] Appendix 43 serves as an auxiliary tool on the lower end face 42a of the bonding head 42 when holding the chip component W.

[0097] Annex 43 contains multiple varieties of chip components W prepared in advance, and Annex 43 will be changed whenever the variety of chip components W installed by the mounting device 1 is changed.

[0098] Appendix 43 is generally composed of a flat plate-shaped component whose external dimensions are larger than those of the chip component W to which it is to be placed, with one main surface serving as the holding surface 43a, on which the chip component W is held.

[0099] Specifically, the attachment 43 is detachably fixed to the lower end face 42a of the bonding head 42 with the retaining surface 43a facing downward.

[0100] Additionally, a suction mechanism (not shown) is provided on the holding surface 43a of Annex 43.

[0101] Furthermore, the chip component W is used to mount the chip film F (refer to...) Figure 4 In a downward-facing state, the chip component W is supplied to the holding surface 43a of the attachment 43 by a supply device not shown, which holds the chip component W supplied by the aforementioned suction mechanism on the holding surface 43a.

[0102] Control device 5 is an example of the control unit of the present invention.

[0103] As described above, the control device 5 controls the overall operation of the mounting device 1. In the mounting area A1, it controls the operation of the mounting device 1 when the chip component W is being mounted, and in the adjustment area A2, it controls the operation of the mounting device 1 when the parallelism adjustment process Z01, which will be described later, is being performed.

[0104] The control device 5 includes an arithmetic processing unit 51 composed of a CPU (Central Processing Unit), a storage unit 52 composed of ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), etc. The storage unit 52 contains programs for performing the installation operation of the chip component W and programs for performing the parallelism adjustment process Z01.

[0105] In addition, the control device 5 may also include, for example, an input unit consisting of a touch panel, an output unit consisting of a monitor, etc.

[0106] Furthermore, in the mounting area A1, the control device 5 performs the mounting operation of the chip component W in the mounting device 1 by controlling the operation of the substrate mounting stage 2 and the mounting head 4, etc.

[0107] In addition, in the adjustment area A2, the control device 5 controls the actions of the height reference bar 3 and the mounting head 4, etc., according to the action sequence described later, to perform the parallelism adjustment process Z01 in the mounting device 1.

[0108] In the mounting device 1 with the structure described above, the parallelism of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate mounting stage 2 is appropriately adjusted by performing a parallelism adjustment process Z01 periodically or irregularly, thereby maintaining the parallelism of the holding surface 43a with high precision.

[0109] Here, as described above, the parallelism adjustment process Z01 is performed with the mounting head 4 moved to the specified position in the adjustment area A2. The parallelism adjustment process Z01 is mainly implemented by repeating the following steps in sequence: a parallelism adjustment step to adjust the parallelism of the holding surface 43a of the attachment 43, a parallelism measurement step to measure the parallelism of the holding surface 43a after the parallelism adjustment step, and a parallelism determination step to determine whether the parallelism of the holding surface 43a measured by the parallelism measurement step is within the allowable range.

[0110] In the parallelism adjustment steps described above, such as Figure 2As shown, after the height reference bar 3 is appropriately shifted (moved) to a predetermined position in the horizontal direction and held, the spherical air bearing 41 is made free and the mounting head 4 (more specifically, the bonding head 42) is lowered. The holding surface 43a of the attachment 43 fixed to the bonding head 42 is pressed against the abutting part 3a of the height reference bar 3, thereby arbitrarily changing the tilt angle of the holding surface 43a (i.e., the parallelism of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate mounting stage 2).

[0111] Then, after locking the spherical air bearing 41 to fix the tilt angle of the retaining surface 43a of the attachment 43, the mounting head 4 is raised to return to the specified upper limit position, thereby adjusting the parallelism of the retaining surface 43a of the attachment 43 relative to the upper surface 2a of the substrate mounting stage 2.

[0112] In the parallelism measurement steps described above, such as Figure 3 As shown in (a) and (b), whenever the position of the height reference bar 3 is oriented toward a plurality of predetermined locations (e.g., Figure 3 The first specified position P11 in (a) and Figure 3 When the second specified position P12 in (b) is moved (moved) in the horizontal direction, the mounting head 4 (more specifically, the key head 42) that locks the spherical air bearing 41 is lowered, and the retaining surface 43a of the accessory 43 fixed to the key head 42 is pressed against the abutting part 3a of the height reference bar 3, and the vertical position of the retaining surface 43a at this time is measured.

[0113] Then, based on the relationship between the measured positions in multiple vertical directions in the holding surface 43a and the position of the height reference bar 3 at each measurement, the control device 5 performs calculation processing to calculate the parallelism of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate mounting stage 2.

[0114] In the parallelism determination step described above, the control device 5 performs a comparison calculation between the parallelism of the holding surface 43a of the attachment 43 obtained through the parallelism measurement step described above and a pre-set allowable value related to the parallelism, thereby determining the quality of the parallelism of the holding surface 43a.

[0115] Furthermore, the specific details of the parallelism determination steps will be described later.

[0116] In addition, such as Figure 5 As shown, in the storage unit 52 of the control device 5 (refer to...) Figure 1 The system pre-stores data related to the horizontal coordinate axes (X-axis and Y-axis) used to represent the position on the holding surface 43a of the attachment 43, and the vertical coordinate axis (Z-axis) used to represent the tilt direction and tilt amount of the holding surface 43a.

[0117] Furthermore, the control device 5 determines the parallelism on the holding surface 43a of the attachment 43 based on the above data, and executes the above-mentioned parallelism adjustment step, parallelism measurement step, and parallelism judgment step.

[0118] [The sequence of operations for mounting device 1 during parallelism adjustment process Z01]

[0119] Next, use Figure 6 The sequence of operations of the installation device 1 during the parallelism adjustment process Z01 will be explained.

[0120] First, in control device 5 (refer to...) Figure 1 The storage unit 52 of the attachment 43 has a preset allowable value (N) for the parallelism of the holding surface 43a of the attachment 43 with respect to the upper surface 2a of the substrate stage 2.

[0121] In addition, the control device 5 has a function to count the number of times the parallelism of the aforementioned holding surface 43a is measured (i.e., the number of times the aforementioned parallelism measurement action is performed).

[0122] Furthermore, when the parallelism adjustment process Z01 begins, after the control device 5 resets the measurement count value (d) representing the number of measurements (d=0) (step S01), it immediately executes the parallelism measurement step described above to measure the parallelism (n) of the holding surface 43a of the attachment 43 (step S02).

[0123] Here, the parallelism measurement step S02 described above is an example of the initial parallelism measurement step of the present invention. It is a step that measures the parallelism of the holding surface 43a of the current attachment 43 without performing the aforementioned parallelism adjustment step after the parallelism adjustment process Z01 has just started.

[0124] After step S02 is completed, the control device 5 performs the parallelism determination step described above to determine whether the parallelism (n) of the holding surface 43a of the attachment 43 obtained through step S02 is the expected parallelism (step S03).

[0125] Here, the parallelism determination step in step S03 above is an example of the initial parallelism determination step of the present invention. It is a step to determine whether the parallelism (n) of the holding surface 43a of the attachment 43, as measured by step S02 above, is within half of the allowable value (N) (n≤N / 2).

[0126] Furthermore, if the determination result in step S03 above is that the parallelism (n) of the retaining surface 43a of the attachment 43 is within 1 / 2 of the allowable value (N) (determined as "yes"), the parallelism adjustment process Z01 ends.

[0127] On the other hand, if the determination result in step S03 above is that the parallelism (n) of the holding surface 43a of the attachment 43 is not within 1 / 2 of the allowable value (N) (determined as "no"), the control device 5 will set the position coordinates of the height reference bar 3 as the reference coordinates.

[0128] Here, the aforementioned “reference coordinates” refers to the position of the height reference bar 3, which is coaxial with the bonding head 42, and is set at the origin (X=0, Y=0) on the aforementioned horizontal coordinate axes (X-axis and Y-axis).

[0129] Furthermore, as described later, the control device 5 performs a parallelism adjustment step (refer to step S05 described later) while the height reference bar 3 is moved to the aforementioned reference position.

[0130] Thus, in this embodiment, the parallelism adjustment process Z01, after it begins, includes: an initial parallelism measurement step (step S02), which measures the parallelism (n) of the holding surface 43a of the current attachment 43 without performing the parallelism adjustment step; and an initial parallelism determination step (step S03), which determines whether the parallelism (n) of the holding surface 43a measured by the initial parallelism measurement step (step S02) is within half of the allowable value (N) (n≤N / 2).

[0131] Furthermore, in the initial parallelism determination step (step S03), the configuration is such that if the parallelism (n) of the holding surface 43a of the attachment 43 is within half of the allowable value (N), the parallelism adjustment process Z01 is ended. In addition, if the parallelism (n) of the holding surface 43a of the attachment 43 is not within half of the allowable value, the parallelism adjustment step (step S05) is performed while the height reference bar 3 is moved to a reference position coaxial with the bonding head 42.

[0132] By performing such an initial parallelism measurement step (step S02) and an initial parallelism determination step (step S03), when the parallelism (n) of the holding surface 43a of the attachment 43 relative to the substrate stage 2 is already within the allowable value (N), the time lost from sequentially repeating the parallelism adjustment step (step S05), parallelism measurement step (step S06), and parallelism determination step (step S07) described later can be saved, and the parallelism (n) of the holding surface 43a of the attachment 43 relative to the substrate stage 2 can be adjusted more efficiently and with higher precision.

[0133] Furthermore, by setting the determination criterion in the initial parallelism determination step (step S03) to 1 / 2 of the allowable value (N), for example, when performing the parallelism adjustment process Z01 of adjusting the parallelism (n) of the holding surface 43a of the adjustment attachment 43, it is possible to prevent the parallelism adjustment process Z01 from being completed in a state where the parallelism (n) of the holding surface 43a is always tilted to the maximum extent within the allowable value (N) (n=N), thus preventing the parallelism (n) from converging to the desired parallelism.

[0134] After the above step S03 is determined to be "no" and ends, the control device 5 performs an addition operation (d=+1) on the measured count value (d) (step S04), and then executes the aforementioned parallelism adjustment step to move the height reference bar 3 to the position set by step S03 (the aforementioned reference position), and adjusts the parallelism (n) of the holding surface 43a of the attachment 43 (step S05).

[0135] When step S05 is completed, the control device 5 performs the parallelism measurement step described above and measures the parallelism (n) of the holding surface 43a of the attachment 43 again (step S06).

[0136] After step S06 is completed, the control device 5 performs the parallelism determination step described above to determine whether the parallelism (n) of the holding surface 43a of the attachment 43 obtained through step S06 is the expected parallelism (step S07).

[0137] In addition, in step S07, unlike step S03 above, it is determined whether the parallelism (n) of the holding surface 43a of the attachment 43 obtained through step S06 above is within the range of the allowable value (N) (n≤N).

[0138] Furthermore, if the determination result in step S07 above is that the parallelism (n) of the retaining surface 43a of the attachment 43 is within the allowable value (N) range (determined as "yes"), the parallelism adjustment process Z01 ends.

[0139] On the other hand, if the determination result in step S07 above is that the parallelism (n) of the holding surface 43a of the attachment 43 is not within the range of the allowable value (N) (determined as "no"), the control device 5 sets the position coordinates for moving the height reference bar 3.

[0140] Specifically, the control device 5 calculates the displacement direction and displacement amount of the height reference bar 3 so that the parallelism (n) of the holding surface 43a of the attachment 43 is close to the allowable value (N), and sets the above position coordinates based on the calculation result.

[0141] Furthermore, after the control device 5 performs the above step S04 again to add the measured count value (d) (d=+1), it performs the parallelism adjustment step (step S05) again while the height reference bar 3 is moved to the position coordinate set by the above step S07. Then, it repeats the series of actions of the above steps S06 and S07.

[0142] Thus, in this embodiment, in the parallelism determination step (step S07), if the parallelism (n) of the holding surface 43a of the attachment 43 is within the allowable value (N), the parallelism adjustment process Z01 ends. If the parallelism (n) of the holding surface 43a of the attachment 43 is not within the allowable value (N), the displacement direction and displacement amount of the height reference bar 3 are calculated so that the parallelism (n) of the holding surface 43a is close to the allowable value (N). After the height reference bar 3 is moved to the calculated position (position coordinates), the parallelism adjustment step (step S05) is performed again.

[0143] With such a structure, while feeding back the result determined by the parallelism determination step (step S07), the parallelism adjustment step (step S05), the parallelism measurement step (step S06), and the parallelism determination step (step S07) are repeated sequentially, so that the parallelism (n) of the holding surface 43a of the attachment 43 reliably converges toward the allowable value (N), and the parallelism (n) of the holding surface 43a of the attachment 43 relative to the substrate mounting stage 2 can be adjusted more reliably and with higher precision.

[0144] In addition, in the storage unit 52 of the control device 5, a preset count value (D) is preset as the maximum number of times the parallelism adjustment step (step S05), the parallelism measurement step (step S06), and the parallelism determination step (step S07) can be repeatedly executed.

[0145] Furthermore, in the initial parallelism determination step (step S03) and the parallelism determination step (step S07), the control device 5 performs a comparison calculation between the measured count value (d) and the set count value (D). Based on the calculation result, it sets the above-mentioned position coordinates of the height reference bar 3. If the measured count value (d) exceeds the set count value (D), it immediately ends the parallelism adjustment process Z01.

[0146] Furthermore, in the parallelism determination step (step S07), if the parallelism (n) of the holding surface 43a of the attachment 43 is within the allowable value (N), the control device 5 stores the position of the height reference bar 3 on the horizontal coordinate axes (X-axis and Y-axis) in the previously executed step 05 as the "optimal position" in the storage unit 52, and whenever step S05 is executed again, the optimal position is updated to the position of the height reference bar 3 when the parallelism (n) of the holding surface 43a is closer to the desired parallelism.

[0147] Furthermore, the details of the sequence of actions for setting the position coordinates of the height reference bar 3 in the initial parallelism determination step (step S03) and the parallelism determination step (step S07) will be described later.

[0148] [Sequence of operation of mounting device 1 when the position coordinates of height reference bar 3 are set]

[0149] Next, use Figure 7 and Figure 8 The sequence of operations of the installation device 1 when the position coordinates of the height reference bar 3 are set in the aforementioned initial parallelism determination step (step S03) and parallelism determination step (step S07) will be explained.

[0150] First, such as Figure 7 As shown, the control device 5 determines whether the current measurement count value (d) is the value after being reset (d=0) (step S11).

[0151] That is, the control device 5 determines whether the determination step in this step is the initial parallelism determination step (step S03) or the parallelism determination step (step S07).

[0152] Furthermore, if the determination result in step S11 is that the current measured count value (d) is the value after the reset (determined as "yes"), that is, if the determination step in this step is determined to be the initial parallelism determination step (step S03), the control device 5 will set the position coordinates of the height reference bar 3 to the above-mentioned "reference coordinates" (step S12) and end this action sequence.

[0153] On the other hand, if the determination result in step S11 is that the current measurement count value (d) is not the value after the reset (determined as "no"), that is, if the determination step in this step is determined to be the parallelism determination step (step S07), the control device 5 determines whether the current measurement count value (d) is equal to the above-mentioned set count value (D) (d=D) (step S13).

[0154] If the determination result in step S13 is that the current measured count value (d) is equal to the set count value (D) (determined as "yes"), the control device 5 will set the position coordinate of the height reference bar 3 to the "optimal position" mentioned above (step S14) and end this action sequence.

[0155] In other words, in this embodiment, if the determination step determined by the above step S13 is that the number of times the parallelism adjustment step (step S05), the parallelism measurement step (step S06), and the parallelism determination step (step S07) can be repeatedly executed is the last parallelism determination step (step S07) (determined as "yes"), and the parallelism (n) of the holding surface 43a of the attachment 43 is not within the allowable value (N), the control device 5, while moving the height reference bar 3 to the optimal position, executes the parallelism adjustment step (step S05) again.

[0156] Thus, in this embodiment, as described above, the configuration is such that whenever the parallelism adjustment step Z01 of adjusting the parallelism (n) of the holding surface 43a of the attachment 43 is performed, the position of the height reference bar 3, which is closer to the desired parallelism of the holding surface 43a, is successively updated to the optimal position and stored. Even if the parallelism adjustment step (step S05), the parallelism measurement step (step S06), and the parallelism determination step (step S07) are repeated a predetermined number of times, and the parallelism (n) of the holding surface 43a of the attachment 43 does not converge to the range of the allowable value (N), the parallelism adjustment step (step S05) is performed while the height reference bar 3 is moved to the optimal position, and the parallelism (n) of the holding surface 43a is adjusted.

[0157] Therefore, according to this embodiment, the parallelism adjustment process Z01 can be terminated before the parallelism (n) of the holding surface 43a of the attachment 43 fails to converge within the range of the allowable value (N), and the parallelism (n) of the holding surface 43a can be adjusted more reliably and with higher precision.

[0158] On the other hand, if the determination result in step S13 above is that the current measured count value (d) is different from the set count value (D) (determined as "No"), such as Figure 8 As shown, the control device 5 determines whether the current measured count value (d) exceeds the set count value (D) (d>D) (step S15).

[0159] If the determination result in step S15 is that the current measured count value (d) does not exceed the set count value (D) (determined as "No"), as described above, the control device 5 calculates the displacement direction and displacement amount of the height reference bar 3 so that the parallelism (n) of the holding surface 43a of the attachment 43 is close to the allowable value (N), sets the optimal position coordinates based on the calculation result (step S16), and then ends this action sequence.

[0160] On the other hand, if the determination result in step S15 above is that the current measured count value (d) exceeds the set count value (D) (determined as "yes"), the control device 5 determines that the parallelism measurement step that was just executed has been passed (step S06, see reference). Figure 6 Whether the parallelism (n) of the retaining surface 43a of the obtained attachment 43 is within the allowable value (N) (n≤N) (step S17).

[0161] Furthermore, if the determination result in step S17 above is that the parallelism (n) of the holding surface 43a of the attachment 43 is within the allowable value (N) range (determined as "yes"), the control device 5 does not set the position coordinates of the height reference bar 3 and ends this action sequence.

[0162] On the other hand, if the determination result in step S17 is that the parallelism (n) of the holding surface 43a of the attachment 43 exceeds the allowable value (N) (determined as "No"), the control device 5 will not set the position coordinates of the height reference bar 3 and will perform an error display (step S18), and end this action sequence.

[0163] As described above, the chip component W mounting method in this embodiment is to supply and hold the chip component W to the holding surface 43a of the attachment 43 which is detachably fixed to the bonding head 42, and to lower the bonding head 42, thereby mounting the chip component W onto the substrate L placed on the substrate stage 2. The method includes a parallelism adjustment step Z01, which adjusts the parallelism (n) of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate stage 2.

[0164] Here, the parallelism adjustment process Z01 includes: a parallelism adjustment step (step S05) to adjust the parallelism (n) of the holding surface 43a; a parallelism measurement step (step S06) to measure the parallelism (n) of the holding surface 43a after adjustment by the parallelism adjustment step (step S05); and a parallelism determination step (step S07) to determine whether the parallelism (n) of the holding surface 43a measured by the parallelism measurement step (step S06) is within the range of the allowable value (N) (n≤N).

[0165] Furthermore, in the parallelism measurement step (step S06), the parallelism (n) of the holding surface 43a is measured as follows: whenever the position of the height reference bar 3 is shifted in the horizontal direction, the bonding head 42 is lowered, and the vertical position of the holding surface 43a when it is pressed against the height reference bar 3 is measured. The relationship between the measured vertical positions of the holding surface 43a and the position of the height reference bar 3 at each measurement is calculated.

[0166] In addition, in the parallelism adjustment step (step S05), the parallelism (n) of the holding surface 43a is adjusted as follows: the bonding head 42 is lowered while the height reference bar 3 is moved to the horizontal position coordinate (prescribed position), and the holding surface 43a is pressed against the height reference bar 3.

[0167] On the other hand, the chip component W mounting device in this embodiment is a chip component mounting device that supplies and holds the chip component W to the holding surface 43a of the attachment 43 which is detachably fixed to the bonding head 42, so that the bonding head 42 is lowered, thereby mounting the chip component W onto the substrate L placed on the substrate stage 2. It includes: a control device (control unit) 5, which performs a parallelism adjustment process Z01 by controlling the operation of the mounting device 1 to adjust the parallelism (d) of the holding surface 43a of the attachment 43 relative to the upper surface 2a of the substrate stage 2; and a height reference bar 3, which can be moved in the horizontal direction.

[0168] Here, the parallelism adjustment process Z01 includes: a parallelism adjustment step (step S05) to adjust the parallelism (n) of the holding surface 43a; a parallelism measurement step (step S06) to measure the parallelism (n) of the holding surface 43a after adjustment by the parallelism adjustment step (step S05); and a parallelism determination step (step S07) to determine whether the parallelism (n) of the holding surface 43a measured by the parallelism measurement step (step S06) is within the range of the allowable value (N) (n≤N).

[0169] Furthermore, the control device 5 is configured such that, in the parallelism measurement step (step S06), whenever the position of the height reference bar 3 is shifted in the horizontal direction, the bonding head 42 is lowered, and the vertical position of the holding surface 43a when it is pressed against the height reference bar 3 is measured. The parallelism (n) of the holding surface 43a is then measured based on the relationship between the measured vertical positions of the holding surface 43a and the position of the height reference bar 3 at each measurement.

[0170] Furthermore, the control device 5 is configured such that, in the parallelism adjustment step (step S05), while the height reference bar 3 is moved to the horizontal position coordinate (prescribed position), the bonding head 42 is lowered to press the holding surface 43a against the height reference bar 3, thereby performing the adjustment of the parallelism (n) of the holding surface 43a.

[0171] Thus, in the chip component W mounting method and chip component W mounting device 1 of this embodiment, when adjusting the parallelism (n) of the holding surface 43a of the attachment 43 relative to the substrate stage 2, a parallelism adjustment step (step S05) is performed using the height reference bar 3 used in the parallelism measurement step (step S06). In this parallelism adjustment step (step S05), the bonding head 42 is lowered while the height reference bar 3 is moved to a predetermined coordinate (predetermined position) in the horizontal direction, and the holding surface 43a of the attachment 43 is pressed against the height reference bar 3, thereby adjusting the parallelism of the holding surface 43a.

[0172] Therefore, according to the chip component W mounting method and the chip component W mounting device 1 in this embodiment, compared with the conventional method of adjusting the parallelism (n) of the holding surface 43a of the attachment 43 by directly pressing the holding surface 43a of the attachment 43 onto the substrate mounting stage 2, it is not affected by the fine unevenness on the substrate mounting stage 2, and the parallelism (n) of the holding surface 43a of the attachment 43 relative to the substrate mounting stage 2 can be adjusted with high precision.

[0173] The foregoing has described one embodiment of the present invention, but the present invention is not limited to such an embodiment in any way, but is merely illustrative. It can of course be further implemented in various ways without departing from the spirit of the present invention. The scope of the present invention is indicated by the description in the claims, and also includes all modifications that are equivalent in meaning and scope to the description in the claims.

[0174] For example, in this embodiment, the mounting head 4 is configured to be able to move back and forth in a horizontal direction and in one direction (left and right) between the mounting area A1 and the adjustment area A2, so that the mounting head 4 moves to each area to perform the chip component W mounting operation and the parallelism adjustment process Z01 respectively. However, it is not limited to this. The mounting head 4 may also be configured not to move back and forth in a horizontal direction and in one direction (left and right). The chip component W mounting operation and the parallelism adjustment process Z01 may be performed by appropriately moving the substrate stage 2 and the height reference bar 3 to a position directly below the mounting head 4.

[0175] Label Explanation

[0176] 1: Installation device; 2: Substrate mounting stage; 2a: Upper surface; 3: Height reference bar; 42: Bonding head; 43: Attachments; 43a: Maintain surface; 5: Control device (control unit); L: substrate; S02: Initial parallelism measurement procedure; S03: Initial parallelism determination steps; S05: Parallelism Adjustment Steps; S06: Parallelism Measurement Procedure; S07: Parallelism determination steps; W: Chip component; Z01: Parallelism adjustment process.

Claims

1. A method for mounting a chip component, comprising supplying and holding the chip component to a holding surface of an accessory detachably fixed to a bonding head, thereby lowering the bonding head and mounting the chip component onto a substrate placed on a substrate mounting stage. The method for mounting the chip component is characterized in that, The system includes a parallelism adjustment process, in which the parallelism of the holding surface of the accessory relative to the upper surface of the substrate mounting stage is adjusted. The parallelism adjustment process includes: The parallelism adjustment step involves adjusting the parallelism of the maintaining surfaces. The parallelism measurement step measures the parallelism of the maintaining surface after adjustment through the parallelism adjustment step; and The parallelism determination step determines whether the parallelism of the maintaining surface, as measured by the parallelism measurement step, is within the allowable range. In the parallelism measurement step, the parallelism of the holding surface is measured as follows: whenever the position of the height reference bar is shifted in the horizontal direction, the bonding head is lowered, and the vertical position of the holding surface in the holding surface when it is pressed against the height reference bar is measured. A calculation is then performed based on the relationship between the measured vertical positions of the holding surface and the position of the height reference bar at each measurement. In the parallelism adjustment step, the parallelism of the holding surface is adjusted as follows: with the height reference bar moved to a specified position in the horizontal direction, the bonding head is lowered, and the holding surface is pressed against the height reference bar.

2. The method for mounting chip components according to claim 1, characterized in that, In the parallelism determination step, if the parallelism of the holding surface is within the allowable range, the parallelism adjustment process ends. If the parallelism of the holding surface is not within the allowable range, the displacement direction and displacement amount with respect to the position of the height reference bar are calculated to make the parallelism of the holding surface closer to the allowable value. With the height reference bar moved to the calculated position, the parallelism adjustment step is performed again.

3. The method for mounting chip components according to claim 1 or 2, characterized in that, The parallelism adjustment process also includes: The initial parallelism measurement step involves measuring the parallelism of the holding surface without performing the parallelism adjustment step immediately after the parallelism adjustment process begins; and The initial parallelism determination step determines whether the parallelism of the maintaining surface, as measured in the initial parallelism measurement step, is within half of the allowable value. In the initial parallelism determination step, if the parallelism of the holding surface is within 1 / 2 of the allowable value, the parallelism adjustment process ends. Otherwise, if the parallelism of the holding surface is not within 1 / 2 of the allowable value, the parallelism adjustment step is performed while the height reference bar is moved to a reference position coaxial with the bonding head.

4. The method for mounting chip components according to claim 1 or 2, characterized in that, In the parallelism determination step, if the parallelism of the holding surface is within the allowable range, the position of the height reference bar from the previously executed parallelism adjustment step is stored as the optimal position. Each time the parallelism adjustment step is executed again, this optimal position is updated to the position of the height reference bar when the parallelism of the holding surface is closer to the desired parallelism. The number of times the parallelism adjustment step, the parallelism measurement step, and the parallelism determination step can be repeatedly executed is preset. In the parallelism determination step, which is executed for the last time, if the parallelism of the maintaining surface is not within the allowable range, the parallelism adjustment step is executed again while the height reference bar is moved to the optimal position.

5. A chip component mounting apparatus that supplies and holds a chip component to and holds an attachment detachably fixed to a bonding head, thereby lowering the bonding head and mounting the chip component onto a substrate placed on a substrate mounting stage. The mounting device for the chip component is characterized by having: The control unit, by controlling the operation of the mounting device, performs a parallelism adjustment process to adjust the parallelism of the holding surface of the accessory relative to the upper surface of the substrate mounting stage; and A height reference bar that can be moved in the horizontal direction. The parallelism adjustment process includes: The parallelism adjustment step involves adjusting the parallelism of the maintaining surfaces. The parallelism measurement step measures the parallelism of the maintaining surface after adjustment through the parallelism adjustment step; and The parallelism determination step determines whether the parallelism of the maintaining surface, as measured by the parallelism measurement step, is within the allowable range. In the parallelism measurement step, the control unit performs the parallelism measurement of the holding surface as follows: whenever the position of the height reference bar is shifted in the horizontal direction, the bonding head is lowered, and the vertical position of the holding surface in the holding surface when the holding surface is pressed against the height reference bar is measured. A calculation is then performed based on the relationship between the measured vertical positions of the holding surface and the position of the height reference bar at each measurement. In the parallelism adjustment step, the control unit performs the adjustment of the parallelism of the holding surface as follows: while the height reference bar is moved to a predetermined position in the horizontal direction, the bonding head is lowered and the holding surface is pressed against the height reference bar.

6. The chip component mounting apparatus according to claim 5, characterized in that, In the parallelism determination step, if the parallelism of the holding surface is within the allowable value, the control unit ends the parallelism adjustment process. If the parallelism of the holding surface is not within the allowable value, the control unit calculates the displacement direction and displacement amount with respect to the position of the height reference bar so that the parallelism of the holding surface is close to the allowable value. After the height reference bar is moved to the calculated position, the parallelism adjustment step is executed again.

7. The chip component mounting apparatus according to claim 5 or 6, characterized in that, The parallelism adjustment process also includes: The initial parallelism measurement step involves measuring the parallelism of the holding surface without performing the parallelism adjustment step immediately after the parallelism adjustment process begins; and The initial parallelism determination step determines whether the parallelism of the maintaining surface, as measured in the initial parallelism measurement step, is within half of the allowable value. In the initial parallelism determination step, if the parallelism of the holding surface is within 1 / 2 of the allowable value, the control unit ends the parallelism adjustment process. Otherwise, if the parallelism of the holding surface is not within 1 / 2 of the allowable value, the control unit performs the parallelism adjustment step while moving the height reference bar to a reference position coaxial with the bonding head.

8. The chip component mounting apparatus according to claim 5 or 6, characterized in that, In the parallelism determination step, if the parallelism of the holding surface is within the allowable range, the control unit stores the position of the height reference bar from the previously executed parallelism adjustment step as the optimal position, and updates this optimal position to the position of the height reference bar when the parallelism of the holding surface is closer to the desired parallelism each time the parallelism adjustment step is executed again. The number of times the parallelism adjustment step, the parallelism measurement step, and the parallelism determination step can be repeatedly executed is preset. In the parallelism determination step, which is the last one to be executed, if the parallelism of the maintaining surface is not within the allowable range, the control unit performs the parallelism adjustment step again while the height reference bar is moved to the optimal position.

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