Power module package including a pin holder and electrical pins

Abstract

An insulated, compact, and high voltage power module package is provided. The power module can include a substrate, a plurality of pin retainers, at least one bare semiconductor die, and a housing. The substrate can include a conductive top side. The plurality of pin retainers can be conductively coupled to the conductive top side of the substrate. Further, each of the plurality of pin retainers can be configured to receive an electrical pin in an interference fit connection. The at least one bare semiconductor die can be conductively coupled to the conductive top side of the substrate. The housing can at least partially enclose each of the substrate, the plurality of pin retainers, and the at least one bare semiconductor die.

Description

Technical Field

[0001] This disclosure relates to a power module package, and more specifically, to an insulated, compact, and high-voltage power module package. Background Technology

[0002] Power module packaging provides an assembly that includes a physical housing (i.e., a housing) and power or electrical components (typically power semiconductor devices) located within a single assembly. The power semiconductor devices (also called dies) are typically soldered onto a conductive substrate that carries power and provides heat dissipation and electrical insulation. Power module packages are the preferred components compared to traditional single power (discrete) semiconductors because they are more reliable and offer higher power density. Power module packages can be used for a variety of purposes, such as power conversion devices for motor drives, soldering equipment, and inverters for wind turbines, solar panels, and electric vehicles (EVs), as well as other applications not specifically listed.

[0003] Manufacturers of power module packages aim to produce improved power module packages, including compact packaging, improved electronic performance, and reduced manufacturing costs. Summary of the Invention

[0004] According to one aspect, this disclosure relates to a power module package. The power module may include a substrate, a plurality of pin holders, at least one bare semiconductor die, and a housing. The substrate may include a top-side conductor. The plurality of pin holders may be electrically coupled (connected, coupled) to the top-side conductor of the substrate. Each of the plurality of pin holders may be configured to connect to a receiving electrical pin with an interference fit. Each of the at least one bare semiconductor die may be electrically coupled to the top-side conductor of the substrate. The housing may at least partially enclose each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die.

[0005] In one aspect, at least one passive electronic device may be electrically coupled to a top-side conductor of a substrate, wherein a housing completely surrounds the at least one passive electronic device.

[0006] In one aspect, the at least one passive electronic device is at least one of a capacitor, a resistor, a thermistor, or a shunt.

[0007] In one aspect, the substrate further includes a metal base layer and an intermediate layer located between the metal base layer and the top-side conductor.

[0008] In one aspect, the top conductor is constructed of a metallic material such as copper; the metal substrate is constructed of copper or aluminum; and the intermediate layer is an insulating layer constructed of alumina, ceramic, or other composite or polymeric materials.

[0009] In one aspect, each of the plurality of pin holders and at least one bare semiconductor die is connected to the top-side conductor of the substrate by at least one of soldering, brazing, or sintering.

[0010] In one aspect, the axial end face of each of the multiple pin holders extends through the outer surface of the housing.

[0011] In one aspect, a portion of the substrate extends through the outer surface of the housing.

[0012] In one aspect, the housing includes at least one hole extending through the housing, the hole being adapted to receive fasteners.

[0013] In one aspect, the at least one bare semiconductor die includes a plurality of bare semiconductor dies, each bare semiconductor die being electrically coupled to a top-side conductor of a substrate.

[0014] In one aspect, each of the plurality of pin holders includes a wall defining a generally cylindrical axial opening that extends entirely through it; each electrical pin includes a generally rectangular cross-section; and there is an interference fit between the generally rectangular cross-section of the electrical pin and the wall of the generally cylindrical axial opening of the pin holder. The electrical pin may also have other polygonal cross-sections.

[0015] In one aspect, the inner diameter of the generally cylindrical axial opening of each of the plurality of pin holders is smaller than the diagonal distance between the angles of the generally rectangular cross-section of each electrical pin.

[0016] In one aspect, the shell is constructed of epoxy resin.

[0017] In one aspect, each of the plurality of pin holders includes a conductive sleeve terminal having a tubular shape and a generally cylindrical axial opening.

[0018] In one aspect, each of the multiple pin holders is constructed of a copper alloy.

[0019] In one aspect, each of the plurality of pin holders includes a flange at each axial end having a diameter larger than the intermediate region extending between the flanges, and the flange at a first end of each of the plurality of pin holders is located on the outer surface of the housing.

[0020] In one aspect, the electrical pins connected to the pin holder are configured to insert through and couple to the printed circuit board.

[0021] According to another aspect, this disclosure relates to a method of constructing a power module. The method may include: providing a substrate including a top-side conductor; connecting at least one bare semiconductor die to the top-side conductor of the substrate by at least one of welding, brazing, or sintering; connecting a plurality of pin holders to the top-side conductor of the substrate by at least one of welding, brazing, or sintering; molding a housing around the substrate, the at least one bare semiconductor die, and each of the plurality of pin holders such that the housing at least partially surrounds each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die; and inserting and press-fitting electrical pins into axial ends extending through the outer surface of the housing of at least some of the plurality of pin holders.

[0022] In one aspect, the method further includes connecting passive electronic devices to a top-side conductor of a substrate by at least one of welding, brazing, or sintering before molding the housing.

[0023] In one aspect, after the housing is molded around the substrate, a portion of the substrate extends through the outer surface of the housing.

[0024] In one aspect, molding is a double-sided film-assisted transfer molding process.

[0025] In one aspect, the housing is molded from epoxy resin. Attached Figure Description

[0026] The foregoing description of the invention and the following detailed description will be best understood when read in conjunction with the accompanying drawings, which illustrate preferred embodiments of the present disclosure. In the drawings: Figure 1 This is a perspective view of an exemplary embodiment of the power module disclosed herein.

[0027] Figure 2A yes Figure 1 A bottom view of the power module.

[0028] Figure 2B yes Figure 1 A top view of the power module.

[0029] Figure 2C yes Figure 1 Side view of the power module.

[0030] Figure 3 This is a 3D view showing the power module housing separated from the power module's base plate.

[0031] Figure 4 It is a 3D view of the power module, in which the housing has been removed or hidden.

[0032] Figure 5A This is a side view of a first embodiment of the power module substrate, in which the housing is removed or hidden.

[0033] Figure 5B This is a side view of a second embodiment of the power module substrate, in which the housing has been removed or hidden.

[0034] Figure 6 It is a 3D view of a power module that includes multiple pins.

[0035] Figure 7 It is a 3D view of a power module with multiple pins, where the housing has been removed or hidden.

[0036] Figure 8A It is along Figure 7 The cross-sectional view of the power module taken from section 8A-8A shows the housing removed or hidden.

[0037] Figure 8B Is it like this? Figure 8A A magnified detail view of the pin holder and a portion of the pins indicated in the image.

[0038] Figure 8C It is along Figure 8B The cross-sectional view of the pin holder and pins is taken from section 8C-8C.

[0039] Figure 9A This is a 3D view of a power module that includes pins having a first end inserted into a pin holder and a second end coupled to a printed circuit board.

[0040] Figure 9B This is a side view of the power module, including the pins coupled to the printed circuit board.

[0041] Figure 10 It shows the production Figure 1 The flowchart shows the steps of the method for power module. Detailed Implementation

[0042] The use of certain terms in the following description is for convenience only and not restrictive. The words “front,” “back,” “up,” and “down” indicate directions in the referenced figures. The words “inward” and “outward” refer to directions toward and away from the referenced component in the figures. “Axial” refers to the direction along the axis of a shaft, pin, cylindrical object, or other similar feature. Reference to a list of items designated as “at least one of a, b, or c” (where a, b, and c represent the listed items) means to include any single item a, b, or c, or any combination thereof. The words “approximately” and “about” include deviations of + / - 10% from the stated value or from the path defined by the indicated shape. This term includes the words specifically mentioned above, their derivatives, and words with similar meanings.

[0043] Figure 1 This is a perspective view of an exemplary embodiment of the power module 10 disclosed herein. Figure 2A This is a bottom view of power module 10. Figure 2B This is a top view of power module 10. Figure 2C This is a side view of power module 10. Figure 3 This is a perspective view of the power module 10, in which the housing 12 is shown as separate from the substrate 14 of the power module 10. Figure 1-3 They will be discussed together.

[0044] As shown, in some examples, power module 10 may have a generally rectangular shape, and power module 10 may have a height or thickness that is generally relatively thin relative to the width and length of power module 10. In other examples, power module 10 may include a shape other than a generally rectangular shape. Power module 10 may include a housing 12 and a substrate 14. Housing 12 may be a component of power module 10 configured to at least partially surround other components of power module 10, protecting these components from debris and other environmental hazards that may adversely affect the electrical components (electrical assemblies) of power module 10. In some examples, housing 12 may typically be a sealing component to prevent dust, water, and other debris from entering housing 12.

[0045] Furthermore, in some examples, the housing 12 may be constructed from epoxy resin, polymeric material, metallic material, or other similar materials (preferably cast or molded), which will be discussed further below. The housing 12 may include at least one hole 16 extending fully through the housing 12. In the illustrated example, the housing 12 includes two holes 16 extending through the housing 12. In other examples, the housing 12 may include more or fewer than two holes 16 extending through the housing 12. Furthermore, in examples including two holes 16, one hole 16 may be located near an end in the longitudinal direction of the housing 12 and approximately centered in the width direction of the housing 12. The other of the two holes 16 may be located at the same or similar position at opposite ends in the longitudinal direction of the housing 12. Each hole 16 of the housing 12 may be configured to receive a fastener for securing the power module 10 to a desired external device or component. In some examples, the hole 16 may be a circular hole, while in other examples, the hole 16 may be a non-circular hole or a through hole.

[0046] The substrate 14 may be at least partially positioned within the housing 12 of the power module 10, such that the housing 12 at least partially surrounds the substrate 14. More specifically, relative to Figure 1 As shown in the orientation, the housing 12 may surround, cover, or enclose the top surface of the substrate 14 and all four side surfaces of the substrate 14. Furthermore, as... Figure 2AAs shown, the bottom surface 14A of the substrate 14 extends through the outer surface of the housing 12 or is otherwise exposed such that the housing 12 does not surround, cover, or enclose the bottom surface 14A of the substrate 14. In some examples, as shown, the exposed bottom surface 14A of the substrate 14 may have an exposed rectangular shape positioned within the periphery of the housing 12. In other examples, the exposed bottom surface 14A of the substrate 14 may have a shape other than rectangular. The exposed bottom surface 14A of the substrate 14 is configured for heat dissipation. In other words, the exposed bottom surface 14A is adapted to transfer heat away from the substrate 14, the housing 12, and other components positioned within the housing 12.

[0047] Now for reference Figure 1 , Figure 2B and Figure 3 A plurality of pin holders 18 may be coupled (connected, coupled) to the substrate 14. Furthermore, each of the plurality of pin holders 18 may be at least partially surrounded and enclosed by a housing 12. Specifically, an axial end face of each of the plurality of pin holders 18 may extend through an outer surface of the housing 12. More specifically, an axial end face of each of the plurality of pin holders 18 may extend through a top or upper surface of the housing 12 opposite to (opposite to) a surface of the housing 12 through which the bottom surface 14A of the substrate 14 extends. Thus, an axial end face of each of the plurality of pin holders 18 may be exposed on an upper or top side of the housing 12 opposite to the exposed bottom surface 14A of the substrate 14. Each of the plurality of pin holders 18 may be configured to receive an electrical pin, as will be discussed further below.

[0048] Figure 4 This is a perspective view of the power module 10, with the housing 12 removed or hidden. Similar to the housing 12, in some examples, the substrate 14 may have a generally rectangular shape. In other examples, the substrate 14 may have a shape different from a generally rectangular shape. Relative to Figure 4 In the orientation shown, substrate 14 may include a top-side conductor 20 coupled to the top surface 14B of substrate 14. The top-side conductor 20 may be coupled to the substrate via bonding processes such as diffusion or high-temperature brazing, and other processes not specifically listed. The top-side conductor 20 may be constructed of a conductive material such that it can conduct and allow current flow. In some examples, the top-side conductor 20 may be constructed of copper, a copper alloy, aluminum, or silver. In other examples, the top-side conductor 20 may be constructed of different conductive materials. As shown, the top-side conductor 20 may be offset from and positioned within the outer periphery of the top surface 14B of substrate 14.

[0049] Each of the plurality of pin holders 18 may be electrically coupled to the top conductor 20 such that current may flow between each of the plurality of pin holders 18 and the top conductor 20. Therefore, each of the plurality of pin holders 18 is constructed of a conductive material. In some examples, each of the plurality of pin holders 18 may be constructed of copper, a copper alloy, aluminum, or silver. In other examples, each of the plurality of pin holders 18 may be constructed of a different conductive material. Furthermore, each of the plurality of pin holders 18 may be coupled to the top conductor 20 by at least one of a soldering, brazing, or sintering metal joining process. The pattern or position of the plurality of pin holders 18 may vary depending on the specific application or device utilizing the power module 10.

[0050] The power module 10 may further include at least one bare semiconductor die 22 electrically coupled to the top-side conductor 20, such that current can flow between the at least one bare semiconductor die 22 and the top-side conductor 20. The at least one bare semiconductor die 22 may be electrically coupled to the top-side conductor 20 via at least one of a soldering, brazing, or sintering metal bonding process. Furthermore, in some examples, the at least one bare semiconductor die 22 may include a plurality of bare semiconductor dies 22, each electrically coupled to the top-side conductor 20. In the illustrated example, the power module 10 includes four bare semiconductor dies 22 electrically coupled to the top-side conductor 20. In other examples, the power module 10 may include more or fewer than four bare semiconductor dies 22 electrically coupled to the top-side conductor 20. Each of the at least one bare semiconductor die 22 may include a silicon, silicon carbide, or gallium nitride wafer on which and / or in the silicon, silicon carbide, or gallium nitride wafer, electronic circuitry is formed. In addition, depending on the intended application, these circuits may include transistors, resistors, capacitors and other active or passive electronic components, wherein conductive paths or pads are formed at least on their bottom surface for connection to the top conductor 20.

[0051] The power module 10 may further include at least one passive electronic device 24 electrically coupled to the top-side conductor 20, such that current can flow between the at least one passive electronic device 24 and the top-side conductor 20. The at least one passive electronic device 24 may be electrically coupled to the top-side conductor 20 via at least one of a soldering, brazing, or sintering metal connection process. In some examples, the at least one passive electronic device 24 may be at least one of a capacitor, resistor, thermistor, or shunt. The at least one passive electronic device 24 may be positioned within the housing 12 such that the housing 12 completely surrounds the at least one passive electronic device 24. Similarly, at least one bare semiconductor die 22 may be positioned within the housing 12 such that the housing 12 completely surrounds the at least one bare semiconductor die 22.

[0052] Figure 5A This is a side view of a first embodiment of the substrate 14 of the power module 10, wherein the housing 12 is removed or hidden. See also [reference needed]. Figure 5A As shown in the orientation, each of the plurality of pin holders 18 and at least one passive electronic device 24 can be coupled to the upper surface of the top-side conductor 20. The substrate 14 may also include a metal base layer 26 and an intermediate layer 28 located between the metal base layer 26 and the top-side conductor 20. Figure 5A In the illustrated embodiment, the metal base layer 26 may be a copper base layer, and the intermediate layer 28 may be an electrically insulating layer, such as an aluminum oxide layer.

[0053] refer to Figure 5A The first embodiment of the substrate 14 shown and discussed can be referred to as a direct-bonded copper (DBC) substrate, which includes a wafer structure consisting of two copper layers separated by an insulating alumina or other insulating ceramic compound layer (intermediate layer 28). As shown, the insulating alumina layer (intermediate layer 28) has a greater thickness than the top-side conductor 20 and the metal base layer 26, thereby providing the necessary electrical insulation between the components. Furthermore, the metal base layer 26 acts as a substrate, while the top-side conductor 20 is etched to enable electrical connections between the components.

[0054] Figure 5B This is a side view of a second embodiment of the substrate 14 of the power module 10, wherein the housing 12 is removed or hidden. See also... (as discussed). Figure 5B As shown in the orientation, each of the plurality of pin holders 18 and at least one passive electronic device 24 can be coupled to the upper surface of the top-side conductor 20. The substrate 14 may also include a metal base layer 26 and an intermediate layer 28 located between the metal base layer 26 and the top-side conductor 20. Figure 5B In the illustrated embodiment, the metal base layer 26 may be a copper or aluminum base layer, and the intermediate layer 28 may be a polymer layer.

[0055] refer to Figure 5B A second embodiment of the substrate 14 shown and discussed may be referred to as an insulating metal substrate (IMS), comprising a wafer structure consisting of a metal base layer 26 (copper or aluminum), a dielectric insulating polymer (intermediate layer 28), and a copper top-side conductor 20. In some examples, the dielectric insulating polymer may include a ceramic filler. The specific thickness of the intermediate layer 28 constructed of the dielectric insulating polymer may vary depending on the specific application. Similar to the first embodiment, the metal base layer 26 of the second embodiment acts as a substrate, while the top-side conductor 20 is etched to enable electrical connections between components. Either of the first or second embodiments discussed above may be used in the power module 10 of this disclosure.

[0056] Figure 6 This is a perspective view of a power module 10 including multiple electrical pins 30. Figure 7This is a perspective view of a power module 10 including multiple electrical pins 30, with the housing 12 removed or hidden. As shown, each of the multiple pin holders 18 can be configured to receive an electrical pin 30. More specifically, each of the multiple pin holders 18 can be configured to connect to the receiving electrical pin 30 with an interference fit, which will be discussed further below. Figure 6-7 As shown, each of the plurality of pin holders 18 is adapted to receive and hold one of the plurality of electrical pins 30, such that each individual pin holder 18 is fitted with a single electrical pin 30. The unfitted ends of each of the plurality of electrical pins 30 within the pin holder 18 are configured to couple to an electrical component, which will be discussed further below.

[0057] Figure 8A It is along Figure 7 The power module 10 is a cross-sectional view taken from sections 8A-8A, where the housing 12 is removed or hidden. Figure 8B Is it like this? Figure 8A A magnified detail view of a portion of the pin holder 18 and electrical pin 30 indicated in the image. Figure 8C It is along Figure 8B The cross-sectional view of pin holder 18 and electrical pin 30 taken from section 8C-8C. Figures 8A-8C They will be discussed together.

[0058] As shown, each of the plurality of pin holders 18 includes a conductive sleeve terminal having a tubular shape and a generally cylindrical axial opening 32. More specifically, each of the plurality of pin holders 18 may include a wall 34 defining the generally cylindrical axial opening 32, which extends entirely through it. Each of the plurality of pin holders 18 may include a flange 36 at each axial end of the pin holder 18. Each flange 36 has a larger diameter than the intermediate region 38 extending between the flanges 36, and the generally cylindrical axial opening 32 has a smaller diameter than the diameter of the intermediate region 38. Furthermore, the flange 36 at a first end of each of the plurality of pin holders 18 is located at or extends outward from the outer surface of the housing 12, while the flange 36 at a second end of each of the plurality of pin holders 18 is located within the housing 12 and is electrically coupled to the top-side conductor 20.

[0059] As in Figures 8B-8CAs best illustrated, each of the plurality of pin holders 18 can be configured to receive an electrical pin 30 in an interference fit connection. Specifically, a first end of each of the plurality of electrical pins 30 configured to be inserted into the plurality of pin holders 18 includes a generally rectangular cross-sectional shape, while each of the plurality of pin holders 18 includes a cylindrical axial opening 32 with a generally circular cross-sectional shape. Thus, the interference fit occurs between the generally rectangular cross-section of the electrical pin 30 and the generally circular wall 34 of the cylindrical axial opening 32 of the pin holder 18. To achieve the interference fit between the components, the inner diameter of the generally cylindrical axial opening 32 of each of the plurality of pin holders 18 is smaller than the diagonal distance between the angles of the generally rectangular cross-section of each electrical pin 30. The electrical pin may have other polygonal cross-sections, and the diameter defined by its outer angles may be larger than the diameter of the generally circular cross-section of the pin holder 18.

[0060] Therefore, as each of the plurality of electrical pins 30 is pressed into each of the plurality of pin holders 18, the electrical pins 30 and / or the pin holders 18 deform slightly as the electrical pins 30 are inserted, thereby creating an interference fit that secures the electrical pins 30 within the pin holders 18. Although Figure 8C A variation of electrical pin 30 is not shown, but it should be understood that... Figure 8C The shape before deformation is shown, and the electrical pin 30 and / or pin holder 18 will deform when the electrical pin 30 is inserted into the pin holder 18. Furthermore, it should be understood that in some examples, the pin holder 18 may deform when the electrical pin 30 is inserted, while the electrical pin 30 may retain its shape, resulting in an interference fit. Additionally, it should be understood that in some examples, both the pin holder 18 and the electrical pin 30 may deform when the electrical pin 30 is inserted into the pin holder 18, resulting in an interference fit between the components. In any example, it should be understood that an interference or frictional fit exists between the pin holder 18 and the electrical pin 30, thereby securely holding the components together during operation and use of the power module 10.

[0061] Figure 9A This is a perspective view of a power module 10, which includes electrical pins 30 coupled to a printed circuit board 40. Figure 9B This is a side view of the power module 10, including the electrical pins 30 coupled to the printed circuit board 40. Figures 9A-9BThese will be discussed together. As shown, when the power module 10 is in use, a first end of each electrical pin 30 may be coupled to a pin holder 18, and a second end of each electrical pin 30 may be configured to insert through and couple to the printed circuit board 40. More specifically, each of the plurality of electrical pins 30 may be inserted through and coupled to a hole or electrical connector of the printed circuit board 40 so that current can be transmitted through the electrical pin 30 to the printed circuit board 40. Thus, the electrical pins 30 can be used to transmit current for use by the printed circuit board 40 and the overall components or systems assembled therein. The power module 10 and the printed circuit board 40 can be used for a variety of purposes, such as power conversion devices for motor drives, welding equipment, and inverters for wind turbines, solar panels, and electric vehicles (EVs), as well as other uses not specifically listed.

[0062] Figure 10 It is shown as being used for construction or production Figure 1-9B The flowchart illustrates the steps of method 100 for power module 10. In the illustrated example, method 100 includes steps 102-110, but it should be understood that in other examples, method 100 may include more or fewer steps 102-110. Generally, method 100 describes a molded power module 10 in which electrical pins 30 are soldered to one side of substrate 14, while the electrical pins 30 do not extend through the other side of substrate 14. Method 100 does not involve soldering the electrical pins 30 to pin holders 18 as is done in existing power modules; instead, the electrical pins 30 are press-fitted into pin holders 18 after the molding process has occurred. Using a thin-film assisted transfer molding technique, the power module 10 can be molded while leaving the pin holders 18 open on one side or surface of the power module 10 and exposing substrate 14 on the other side or surface of the power module 10. Then, after the molding and curing processes, the electrical pins 30 are inserted into the pin holders 18 to create a complete power module 10 package.

[0063] In step 102, a substrate 14 is provided, and the substrate 14 includes a top-side conductor 20. In step 104, at least one bare semiconductor die 22 is connected to the top-side conductor 20 of the substrate 14 by at least one of soldering, brazing, or sintering. In step 106, each of a plurality of lead holders 18 is connected to the top-side conductor 20 of the substrate 14 by at least one of soldering, brazing, or sintering. In step 108, a housing 12 is molded around the substrate 14, the at least one bare semiconductor die 22, and each of the plurality of lead holders 18, such that the housing 12 at least partially surrounds the substrate 14, the plurality of lead holders 18, and each of the at least one bare semiconductor die 22. More specifically, after molding the housing 12 around the substrate 14, a portion of the substrate 14 may extend through the outer surface of the housing 12, for example, through the bottom surface of the housing 12. In some examples, the molding process may be a double-sided thin-film assisted transfer molding process. Furthermore, in some examples, the housing 12 may be molded from epoxy resin. In step 110 of method 100, at least some of the electrical pins 30 are inserted and press-fitted into the axial ends of at least some of the pin holders 18, which extend through the outer surface of housing 12.

[0064] Although not shown, in some examples, method 100 may also include connecting the passive electronics 24 to the top-side conductor 20 of the substrate 14 by soldering, brazing, or sintering before molding the housing 12 and before connecting the plurality of lead holders 18 to the top-side conductor 20 of the substrate 14 by soldering, brazing, or sintering. Furthermore, in such examples, in step 108, the housing 12 is molded around each of the substrate 14, at least one bare semiconductor die 22, at least one passive electronics 24, and the plurality of lead holders 18, such that the housing 12 at least partially surrounds each of the substrate 14, the plurality of lead holders 18, at least one bare semiconductor die 22, and at least one passive electronics 24. Additionally, in some examples, method 100 may also include applying post-molding curing to the molded housing 12, which includes the substrate 14, the plurality of lead holders 18, at least one bare semiconductor die 22, and at least one passive electronics 24. Post-molding curing can be used to accelerate the curing process and optimize the physical properties of the molding material.

[0065] As discussed, method 100 includes steps 102-110 as disclosed above; however, it should be understood that in other examples, method 100 may include more or fewer steps 102-110. Furthermore, method 100 is suitable for constructing or producing... Figure 1-9B The method of the power module 10 shown is a non-limiting example. Those skilled in the art will understand that other methods can be used to construct or manufacture it. Figure 1-9B The power module 10 shown.

[0066] The power module 10 disclosed herein provides a novel power package for high-voltage, molded power modules including an insulating substrate. Compared to previous power module packages, power module 10 offers improvements in size, reliability, pin configurability, and assembly robustness at a lower cost. More specifically, compared to previous power module packages, the power module 10 of this disclosure reduces the size of the power package, maintains a configurable pin arrangement with high reliability and robustness, and reduces manufacturing costs by utilizing thin-film assisted transfer molding technology. The foregoing are merely a few advantages of the power module 10 of this disclosure, and many other undisclosed advantages of power module 10 will be appreciated by those skilled in the art.

[0067] Having described this embodiment in such detail, it should be understood and will be apparent to those skilled in the art that many physical changes can be made without altering the inventive concept and principles embodied therein, only a few of which are exemplified in the specific embodiments of this disclosure. It should also be understood that many embodiments comprising only a portion of the preferred embodiments are possible, which do not alter the inventive concept and principles embodied therein in those partial respects. Therefore, this embodiment and optional configurations should be considered in all respects as exemplary and / or illustrative rather than restrictive, and the scope of this disclosure is indicated by the appended claims rather than by the foregoing description, and thus all alternative embodiments and modifications to this embodiment falling within the meaning and equivalent scope of the claims are included therein.

Claims

1. A power module comprising: A substrate, the substrate including a top-side conductor; Multiple pin holders, the multiple pin holders being electrically coupled to a top-side conductor of the substrate, each of the multiple pin holders being configured to connect to a receiving electrical pin in an interference fit; At least one bare semiconductor die, the at least one bare semiconductor die being electrically coupled to a top-side conductor of the substrate; as well as A housing that at least partially surrounds each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die.

2. The power module of claim 1, further comprising at least one passive electronic device, said at least one passive electronic device being electrically coupled to a top-side conductor of the substrate, wherein, The housing completely surrounds the at least one passive electronic device.

3. The power module according to claim 2, wherein, The at least one passive electronic device is at least one of a capacitor, a resistor, a thermistor, or a shunt.

4. The power module according to claim 1, wherein, The substrate further includes a metal base layer and an intermediate layer located between the metal base layer and the top conductor.

5. The power module according to claim 4, wherein: The top-side conductor is made of copper; The metal base layer is constructed of copper or aluminum; and The intermediate layer is an insulating layer constructed of alumina or polymeric materials.

6. The power module according to claim 1, wherein, Each of the plurality of pin holders and the at least one bare semiconductor die are connected to the top-side conductor of the substrate by at least one of soldering, brazing, or sintering.

7. The power module according to claim 1, wherein, The axial end face of each of the plurality of pin holders extends through the outer surface of the housing.

8. The power module according to claim 1, wherein, A portion of the substrate extends through the outer surface of the housing.

9. The power module according to claim 1, wherein, The housing includes at least one hole extending through the housing, adapted to receive fasteners.

10. The power module according to claim 1, wherein, The at least one bare semiconductor die includes a plurality of bare semiconductor dies, each of which is electrically coupled to a top-side conductor of the substrate.

11. The power module according to claim 1, wherein: Each of the plurality of pin holders includes a wall defining a generally cylindrical axial opening that extends entirely through it; Each of the electrical pins comprises a generally rectangular cross-section; and The interference fit is located between the generally rectangular cross-section of the electrical pin and the wall of the generally cylindrical axial opening of the pin holder.

12. The power module according to claim 11, wherein, The inner diameter of the generally cylindrical axial opening of each of the plurality of pin holders is smaller than the diagonal distance between the angles of the generally rectangular cross-section of each of the electrical pins.

13. The power module according to claim 1, wherein, The housing is constructed of epoxy resin.

14. The power module according to claim 1, wherein, Each of the plurality of pin holders includes a conductive sleeve terminal having a tubular shape and a generally cylindrical axial opening.

15. The power module according to claim 1, wherein, Each of the plurality of pin holders is constructed of a copper alloy.

16. The power module according to claim 1, wherein, Each of the plurality of pin holders includes a flange at each axial end, the flange having a larger diameter than the intermediate region extending between the flanges, and the flange at a first end of each of the plurality of pin holders is located on the outer surface of the housing.

17. The power module according to claim 1, wherein, The electrical pins connected to the pin holder are configured to insert through and couple to the printed circuit board.

18. A method for constructing a power module, the method comprising: A substrate including a top-side conductor is provided; At least one bare semiconductor die is connected to the top-side conductor of the substrate by at least one of welding, brazing, or sintering; Multiple pin holders are connected to the top-side conductor of the substrate by at least one of soldering, brazing, or sintering; A housing is molded around each of the substrate, the at least one bare semiconductor die, and the plurality of lead holders, such that the housing at least partially surrounds each of the substrate, the plurality of lead holders, and the at least one bare semiconductor die; as well as Electrical pins are inserted and press-fitted into the axial ends of at least some of the plurality of pin holders that extend to the outer surface of the housing.

19. The method of claim 18, further comprising, prior to molding the housing, connecting passive electronic devices to a top-side conductor of the substrate by at least one of welding, brazing, or sintering.

20. The method according to claim 18, wherein, After the housing is molded around the substrate, a portion of the substrate extends through the outer surface of the housing.

21. The method according to claim 18, wherein, The molding process is a double-sided thin film-assisted transfer molding process.

22. The method according to claim 1, wherein, The housing is molded from epoxy resin.

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