A CT detector and a method for assembling and positioning a multi-row CT detector module

Abstract

The application discloses a CT detection device and an assembling and positioning method of a multi-row CT detector module. The CT detection device comprises a plurality of detection units and a plurality of analog-digital conversion chips, is used for detecting X-rays and outputting analog signals respectively, and is used for converting the analog signals into digital signals. The CT detection device further comprises a bearing assembly, a heat dissipation assembly and a flexible signal transmission member. The mounting bracket of the bearing assembly bears the plurality of detection units. The heat dissipation assembly is provided with a heat dissipation surface and a heat conduction substrate. The plurality of analog-digital conversion chips are fixed on the other side of the heat conduction substrate. The flexible signal transmission member is connected between the bearing assembly and the heat dissipation assembly and is deformed to adapt to the relative displacement between the bearing assembly and the heat dissipation assembly. The bearing assembly and the heat dissipation assembly are independent components without rigid connection relationship. The assembling tolerance and thermal deformation stress of the heat dissipation assembly cannot be transmitted to the bearing assembly, so that the positioning accuracy of the detector unit is not interfered by the heat dissipation structure.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and more specifically, to a CT detector and a method for assembling and positioning a multi-slice CT detector module. Background Technology

[0002] With the widespread application of computed tomography (CT) technology in clinical diagnosis, CT equipment is rapidly developing towards wider coverage and higher image quality. As one of the core components of a CT system, the detector is responsible for receiving X-rays that penetrate the human body and converting them into digital signals. CT detectors typically consist of multiple detector modules arranged along the scanning plane, and each detector module is composed of multiple crystal units arranged along the long axis of the patient. The number of detector rows has evolved from the initial single row to the current mainstream 128 rows, with some reaching 256 or even 320 rows.

[0003] In CT detectors, the analog-to-digital converter (ADC) chip, a core component of the readout circuit, is one of the main heat sources. As the number of detector rows increases to 128, 256, or even higher, the number of ADC chips increases exponentially, leading to a sharp rise in heat flux density per unit area. Simultaneously, the detector module's compact spatial structure results in a power output of hundreds of watts, necessitating timely heat dissipation to prevent impact on detector performance. The operating temperature of the ADC chip directly affects its conversion accuracy, noise characteristics, and long-term reliability. Overheating can lead to a decrease in image signal-to-noise ratio, thermal drift artifacts, and in severe cases, chip damage. Therefore, efficient and reliable heat dissipation design has become a key technical challenge in the development of high-row CT detectors.

[0004] To address the heat dissipation issue of high-slice CT detectors, a common solution is forced air cooling. This involves placing multiple cooling fans above or around the detector to remove heat through air convection. However, forced air cooling suffers from uneven heat dissipation. Gaps between fans are unavoidable, potentially leading to poor heat dissipation in intermediate modules. Furthermore, the small gaps between detector modules and their long Z-axis length create significant airflow resistance, hindering effective heat removal. Another solution involves installing heat sinks within the detector module, ensuring close contact between the analog-to-digital converter (ADC) chip and the heat is then dissipated through the cooling fins and fans. Liquid cooling technology is another option. Liquid flow channels are placed on both sides of the detector module. The ADC chip conducts heat sequentially through a thermally conductive medium (thermal conductive silicone, graphite pads, or liquid metal) to a heat-conducting plate and a wedge-shaped thermal support, where it is then carried away by the coolant in the liquid flow channels.

[0005] However, CT detector cooling solutions still suffer from the following technical drawbacks: regardless of whether an air-cooled or liquid-cooled solution is used, a thermally conductive medium such as a silicone pad or liquid metal is typically required between the analog-to-digital converter chip and the heat dissipation structure. Silicone pads have low thermal conductivity, resulting in significant interfacial thermal resistance and limited heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of high-power-density detectors.

[0006] Liquid metal solutions are costly, structurally complex, and pose safety hazards. While liquid metals have high thermal conductivity, they are expensive and their electrical conductivity and fluidity place extremely high demands on the packaging structure. To prevent short circuits caused by liquid metal leakage, complex sealed cavities and dam structures are required, increasing manufacturing difficulty and cost, and leakage risks still exist during long-term operation.

[0007] Furthermore, the positioning components of the detector module, such as the crystal mounting bracket, and the heat dissipation structure, such as the liquid flow channel plate, are usually directly fixed and connected by fasteners to form an integrated structure. The assembly tolerance of the heat dissipation structure and the deformation stress caused by thermal expansion and contraction will be directly transmitted to the detector positioning components through the rigid connection, which will reduce the installation accuracy of the detector unit and affect the quality of CT images. Summary of the Invention

[0008] The main objective of this application is to provide an assembly and positioning method for a CT detection device and a multi-row CT detector module, so as to solve the technical problem that the positioning accuracy is affected by the heat dissipation structure due to the integrated integration of the detector positioning component and the heat dissipation component in the prior art.

[0009] To achieve the above objectives, a first aspect of this application provides a CT detection device, comprising: Multiple detection units are used to detect X-rays and output analog signals; Multiple analog-to-digital converter chips are used to convert the analog signal into a digital signal; The support assembly includes a mounting bracket and a guide rail. The mounting bracket supports the plurality of detection units and is fixed to the guide rail by a positioning structure to define the position of the plurality of detection units. A heat dissipation assembly is provided with a heat dissipation surface and a heat-conducting substrate. One side of the heat-conducting substrate is attached to the heat dissipation surface. The heat dissipation surface of the heat dissipation assembly is provided with a flow channel for the circulation of coolant. The plurality of analog-to-digital conversion chips are fixed on the other side of the heat-conducting substrate. A flexible signal transmission component is connected between the support component and the heat dissipation component and adapts to the relative displacement between the support component and the heat dissipation component through its own deformation. One end of the flexible signal transmission component is connected to the signal terminal of the detection unit, and the other end is connected to the signal input terminal of the analog-to-digital conversion chip.

[0010] By designing the carrier component and the heat dissipation component as independent parts with no rigid connection between them, and only bridging them through a flexible signal transmission component, the assembly tolerances and thermal deformation stress of the heat dissipation component cannot be transferred to the carrier component. This ensures that the positioning accuracy of the detector unit is not affected by the heat dissipation structure. Simultaneously, the analog-to-digital converter chip is directly mounted on the thermally conductive substrate, which is directly attached to the heat dissipation surface of the heat dissipation component. This achieves efficient heat dissipation without any thermal conductive medium, eliminating interface thermal resistance.

[0011] In one embodiment of the CT detection device of the present invention, the mounting bracket is provided with a positioning pin and a first mounting surface, the guide rail is provided with a positioning hole and a second mounting surface, the positioning pin is inserted into the positioning hole, and the first mounting surface is in contact with the second mounting surface.

[0012] The mounting bracket is coarsely positioned in the guide rail plane by the cooperation of the positioning pin and the positioning hole, and finely positioned in the height and angle directions by the fit between the first mounting plane and the second mounting plane. Together, they determine the unique and precise position of the mounting bracket in the guide rail coordinate system, so that the positional accuracy of multiple detection units is independently guaranteed by the positioning pin and the mounting plane.

[0013] In one embodiment of the CT detection device of the present invention, the heat dissipation assembly further includes a water-cooled plate, and the heat dissipation surface of the heat dissipation assembly is formed on the water-cooled plate; It also includes an elastic pre-tightening mechanism, which is disposed between the thermally conductive substrate and the water-cooled plate and is configured to apply a normal pressure toward the heat dissipation surface of the heat dissipation assembly to the thermally conductive substrate.

[0014] By setting an elastic pre-tightening mechanism between the thermally conductive substrate and the water-cooled plate, the heat dissipation surface of the thermally conductive substrate and the heat dissipation component are always kept in close contact, which effectively reduces the contact thermal resistance and ensures that heat can be efficiently conducted from the thermally conductive substrate to the water-cooled plate, while allowing for a certain degree of assembly deviation between the two.

[0015] In one embodiment of the CT detection device of the present invention, the water-cooled plate is a comb-shaped structure, the comb-shaped structure having multiple comb teeth, the multiple comb teeth being in contact with the heat-conducting substrate; and / or The comb-like structure is composed of multiple parallel convex teeth, and the grooves between adjacent convex teeth form part of the flow channel.

[0016] By setting the water-cooled plate as a comb-like structure, multiple comb teeth form multi-point discrete surface contact with the heat-conducting substrate. While ensuring large-area contact heat transfer, the coolant can flow in the grooves between adjacent comb teeth, carrying away heat from the top and sides of the comb teeth at the same time, which greatly increases the heat exchange area and heat exchange efficiency.

[0017] In one embodiment of the CT detection device of the present invention, the elastic preload mechanism includes an elastic preload member, the elastic preload member being used to provide the normal pressure; and / or, The extension / retraction of the elastic preload can be adjusted to regulate the normal pressure.

[0018] By setting an elastic preload with adjustable extension and retraction, the normal pressure can be adjusted according to the actual working conditions, which not only ensures a tight fit between the heat-conducting substrate and the water-cooling plate, but also avoids structural deformation caused by excessive pressure, thus keeping the heat dissipation contact state within the optimal range.

[0019] In one embodiment of the CT detection device of the present invention, a guide fastener is further included, and the elastic preload is sleeved on the guide fastener; The guide fastener passes through the thermally conductive substrate and is connected to the heat dissipation assembly.

[0020] By using guide fasteners, the expansion and contraction direction of the elastic preload is constrained to be perpendicular to the normal direction of the heat dissipation surface of the heat dissipation component. This ensures that the elastic preload acts along the normal direction on the heat-conducting substrate, so that the heat-conducting substrate is evenly attached to the heat dissipation surface of the heat dissipation component under the action of normal pressure, avoiding uneven attachment caused by lateral force.

[0021] In one embodiment of the CT detection device of the present invention, the flexible signal transmission component includes a flexible circuit board, one end of which is electrically connected to the photodiode of the detection unit, and the other end is electrically connected to the signal input terminal of the analog-to-digital converter chip.

[0022] Using a flexible circuit board as a signal transmission component not only enables electrical signal transmission between the detection unit and the analog-to-digital converter chip, but also utilizes the bendable nature of the flexible circuit board to adapt to relative displacement between the load-bearing component and the heat dissipation component through its own bending deformation, without transferring stress to the detection unit.

[0023] In one embodiment of the CT detection device of the present invention, the detection unit includes a photodiode and a scintillator, the scintillator being configured to convert X-rays into visible light, and the photodiode being configured to convert the visible light into an analog electrical signal.

[0024] In the above technical solution, the combination of scintillator and photodiode realizes a complete conversion path from X-rays to visible light and then to analog electrical signals, providing a standard analog signal input for analog-to-digital converter chips.

[0025] A second aspect of the present invention also provides an assembly and positioning method for a multi-row CT detector module, the assembly and positioning method being applied to a CT detection device as described in any of the preceding claims, comprising the following steps: The mounting bracket, which carries multiple detection units, is fixed to the guide rail using a positioning structure. The thermally conductive substrate on which the analog-to-digital converter chip is fixed is attached to the heat dissipation surface of the heat dissipation component, and the water-cooled plate has a flow channel for the circulation of coolant inside. An elastic pre-tightening mechanism is provided between the thermally conductive substrate and the water-cooled plate to keep the thermally conductive substrate and the heat dissipation surface of the heat dissipation assembly in close contact. The signal terminal of the detection unit is connected to the signal input terminal of the analog-to-digital converter chip by a flexible signal transmission component, which adapts to the relative displacement between the mounting bracket and the heat dissipation component through its own deformation.

[0026] By employing an assembly sequence that prioritizes positioning the load-bearing components, followed by installing the heat dissipation components, and finally bridging the gap with flexible signal transmission components, the positioning accuracy is ensured to remain unaffected by the installation of the heat dissipation components during assembly. Precise positioning followed by heat dissipation component installation prevents assembly tolerances from affecting the already determined detector unit positions; the flexible signal transmission components, installed last, can freely adapt to positional deviations between the two sets.

[0027] In one embodiment of the assembly and positioning method for the multi-row CT detector module of the present invention, "providing an elastic pre-tightening mechanism between the thermally conductive substrate and the water-cooled plate, so that the thermally conductive substrate and the heat dissipation surface of the heat dissipation component remain in close contact" further includes: Provide guide fasteners and flexible preloads; The guide fastener is passed through the through hole of the thermally conductive substrate; The elastic preload is fitted onto the guide fastener; Screw the end of the guide fastener into the threaded hole of the water-cooled plate; Adjust the compression of the elastic preload until the set value is reached.

[0028] By cooperating with the guide fastener, the elastic preload and the threaded hole of the water-cooled plate, the elastic preload force can be quantitatively adjusted. By adjusting the compression of the elastic preload, the bonding pressure between the heat-conducting substrate and the water-cooled plate can be precisely controlled, so as to minimize the contact thermal resistance.

[0029] In summary, the assembly and positioning method of the CT detector and multi-slice CT detector module of the present invention has the following advantages: By setting the carrier component and the heat dissipation component as separate structures with no rigid connection, and using flexible signal transmission components to bridge them, the installation stress and thermal deformation stress of the heat dissipation component cannot be transmitted to the carrier component. The positioning accuracy of the detector unit is independently guaranteed by the carrier component, avoiding the interference of the heat dissipation structure on the positioning accuracy. The positioning repeatability can reach ±0.02mm, which is significantly better than the traditional integrated solution. By directly fixing the analog-to-digital converter chip to the thermally conductive substrate and directly attaching the thermally conductive substrate to the heat dissipation surface of the heat dissipation component, the intermediate thermal conductive mediums such as silicone pads and liquid metal are eliminated, completely eliminating the interface thermal resistance. Under the same operating conditions, the temperature of the analog-to-digital converter chip is reduced by 5~8℃, and the thermal resistance is only 12%~30% of that of the traditional silicone pad solution, effectively suppressing thermal drift artifacts and improving the signal-to-noise ratio of CT images. By adopting a direct contact heat dissipation solution without a heat-conducting medium, there is no need to purchase expensive liquid metal, design complex sealed cavities, or regularly replace aging silicone pads, which significantly reduces material and maintenance costs. At the same time, it completely avoids the risk of short circuits caused by liquid metal leakage and the hidden danger of silicone pad aging and failure, and significantly improves the long-term reliability of the system. The adjustable normal pressure provided by the elastic pre-tightening mechanism ensures that the heat-conducting substrate and the water-cooling plate are always in close contact. Even when the temperature changes cause the components to expand and contract, the contact state can still be maintained, which further ensures the consistency of heat dissipation performance. By assembling the load-bearing components first, then installing the heat dissipation components, and finally bridging the flexible signal transmission components, the assembly process is simplified so that each step does not interfere with the others. There is no need to control the thickness and uniformity of the heat transfer medium, and the assembly time is reduced by about 40%. Attached Figure Description

[0030] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 A schematic diagram of the structure of multiple detection units and analog-to-digital conversion chip of the CT detection device provided in this application; Figure 2 This is a schematic diagram of the CT detection device provided in this application; Figure 3 A schematic diagram of the structure of multiple detection units, analog-to-digital conversion chip, and heat dissipation components of the CT detection device provided in this application; Figure 4 A flowchart illustrating the assembly and positioning method for the multi-row CT detector module provided in this application; Figure 5 A flowchart illustrating the adjustment of elastic pre-tightening in the assembly and positioning method of the multi-row CT detector module provided in this application.

[0031] Figure label: 100. CT detection device; 110. Detection unit; 111. Photodiode; 112. Scintillator; 120. Analog-to-digital converter chip; 130. Load-bearing component; 131. Mounting bracket; 132. Guide rail; 133. Locating pin; 134. First mounting plane; 135. Locating hole; 136. Second mounting plane; 140. Heat dissipation components; 141. Thermally conductive substrate; 142. Water-cooled plate; 150. Flexible signal transmission components; 160. Elastic preload mechanism. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0033] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0034] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0035] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," and "socketing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] The CT detector of this application defines a three-dimensional spatial coordinate system in the Z, X and Y directions of CT imaging. The Z direction usually refers to the long axis of the patient, that is, the direction from the head to the feet. In CT scanning, the patient or examination table will move along this direction to complete the scanning of different body parts. The X direction usually refers to the left and right direction of the patient, and the Y direction usually refers to the abdominal and back direction of the patient. Furthermore, the "row number" of the CT detector refers to the number of physical arrangements of the detector in the Z direction.

[0038] Figure 1 This is a schematic diagram of the structure of multiple detection units and an analog-to-digital conversion chip in the CT detection device provided in this application. Figure 2 This is a schematic diagram of the overall structure of the CT detection device provided in this application, combined with the following... Figure 1 and Figure 2 This embodiment will be described in detail.

[0039] like Figure 2 As shown, the CT detection device 100 of the present invention generally includes multiple detection units 110, multiple analog-to-digital conversion chips 120, a support component 130, a heat dissipation component 140, and a flexible signal transmission component 150.

[0040] The support assembly 130 includes a mounting bracket 131 and a guide rail 132. Multiple detection units 110 are mounted on the mounting bracket 131 for detecting X-rays and outputting analog signals. The mounting bracket 131 is fixed to the guide rail 132 by a positioning structure, and the guide rail 132 defines the position of the mounting bracket 131 on the CT gantry, thereby indirectly defining the position of the multiple detection units 110.

[0041] Specifically, such as Figure 1 As shown, each detection unit 110 includes a scintillator 112 and a photodiode 111. The scintillator 112 is positioned above the photodiode 111 and is configured to convert incident X-rays into visible light. The photodiode 111 is configured to convert the received visible light into an analog electrical signal and output the analog electrical signal through a signal terminal. Multiple detection units 110 are arranged along the Z-axis on the mounting bracket 131.

[0042] See Figure 2The positioning structure between the mounting bracket 131 and the guide rail 132 specifically includes: the mounting bracket 131 is provided with a positioning pin 133 and a first mounting plane 134, and the guide rail 132 is provided with a corresponding positioning hole 135 and a second mounting plane 136. When the mounting bracket 131 is installed onto the guide rail 132, the positioning pin 133 is inserted into the positioning hole 135 to achieve coarse positioning of the mounting bracket 131 in the guide rail plane; at the same time, the first mounting plane 134 and the second mounting plane 136 are in contact with each other to achieve fine positioning of the mounting bracket 131 in the height and angle directions. Through the cooperation of the positioning pin 133 and the positioning hole 135 and the contact of the first mounting plane 134 and the second mounting plane 136, the unique and precise position of the mounting bracket 131 in the coordinate system of the guide rail 132 is determined. After tightening the mounting screws, the mounting bracket 131 is locked onto the guide rail 132, and the positioning repeatability can reach ±0.02mm.

[0043] In another embodiment, the positioning structure between the mounting bracket 131 and the guide rail 132 can also adopt a keyway fit. Positioning is achieved by opening a keyway at the bottom of the mounting bracket 131 and setting a corresponding positioning key on the guide rail 132. The positioning structure can also adopt a combination of a conical positioning sleeve and a positioning pin. That is, a conical positioning sleeve is set on the mounting bracket 131 and a conical positioning pin is set on the guide rail 132. The two achieve self-centering positioning through the conical surface fit.

[0044] Multiple analog-to-digital converter chips 120 are fixed on the thermally conductive substrate 141 of the heat dissipation assembly 140 to convert analog signals output by multiple detection units 110 into digital signals. There is no thermally conductive medium between the analog-to-digital converter chips 120 and the thermally conductive substrate 141; the two are directly attached to each other to ensure that heat can be conducted from the analog-to-digital converter chips 120 to the thermally conductive substrate 141 with minimal thermal resistance.

[0045] The analog-to-digital converter chip 120 and the detection unit 110 are connected by a flexible signal transmission component 150. One end of the flexible signal transmission component 150 is electrically connected to the signal terminal of the photodiode 111 of the detection unit 110, and the other end is electrically connected to the signal input terminal of the analog-to-digital converter chip 120. The flexible signal transmission component 150 spans between the support component 130 and the heat dissipation component 140. Due to its flexible and bendable characteristics, the flexible signal transmission component 150 can adapt to the relative displacement between the support component 130 and the heat dissipation component 140 through its own deformation, thereby isolating the installation stress and thermal deformation stress of the heat dissipation component 140 from being transmitted to the multiple detection units 110 on the support component 130, ensuring that the positional accuracy of the multiple detection units 110 is not affected by the heat dissipation component 140.

[0046] In this embodiment, the flexible signal transmission component 150 can be a flexible printed circuit board (FPC). The flexible signal transmission component 150 can also be implemented using flexible ribbon cables, flexible flat cables, or wire harnesses. The flexible signal transmission component 150 can also use a stretchable conductive spring wire, whose spiral structure adapts to the relative displacement between the two groups through expansion and contraction.

[0047] like Figure 1 and Figure 2 As shown, the heat dissipation component 140 and the support component 130 are spatially independent and have no rigid connection; they are only connected via a flexible signal transmission component 150. The heat dissipation component 140 is used to conduct and dissipate the large amount of heat generated by the analog-to-digital converter chip 120 during operation. Specifically, the heat dissipation component 140 includes a thermally conductive substrate 141 and a water-cooled plate 142. The water-cooled plate 142 has a heat dissipation surface, i.e., the surface of the water-cooled plate 142 facing the thermally conductive substrate 141. One side of the thermally conductive substrate 141 is attached to the heat dissipation surface of the heat dissipation component 140, and multiple analog-to-digital converter chips 120 are fixed on the other side of the thermally conductive substrate 141, i.e., the side facing away from the water-cooled plate 142. The interior of the water-cooled plate 142 has channels for the circulation of coolant, which circulates in the channels to remove heat.

[0048] In another embodiment, the heat dissipation component 140 may also be an air-cooled heat sink, that is, the thermally conductive substrate 141 is attached to the heat dissipation fin base and heat dissipation is forced by a cooling fan; the heat dissipation component 140 may also be a semiconductor cooling chip, which actively cools through the Peltier effect.

[0049] Through the above structure, the support component 130 independently undertakes the positioning function of multiple detection units 110, and the heat dissipation component 140 independently undertakes the heat dissipation function of the analog-to-digital conversion chip 120. The two are connected by a flexible signal transmission component 150 to achieve a soft connection of electrical signals, without any hard connection to transmit force. As a result, the assembly tolerance of the heat dissipation component 140 and the deformation stress caused by thermal expansion and contraction will not be transmitted to the multiple detection units 110 on the support component 130. The positional accuracy of the multiple detection units 110 is independently guaranteed by the support component 130, fundamentally solving the technical problem of positioning accuracy being interfered with by the heat dissipation structure in the prior art.

[0050] Figure 3 A schematic diagram of the structure of the multiple detection units, analog-to-digital conversion chip, and heat dissipation components of the CT detection device provided in this application is shown below. Figure 3As shown, in the specific structure of the heat dissipation assembly 140 in this embodiment, the water-cooled plate 142 forms the heat dissipation surface of the heat dissipation assembly facing the surface of the heat-conducting substrate 141. The heat-conducting substrate 141 is made of a metal material with high thermal conductivity, such as copper, aluminum alloy, or copper-aluminum alloy. A plurality of analog-to-digital converter chips 120 are fixed on the upper surface of the heat-conducting substrate 141, that is, the side facing away from the water-cooled plate 142, and the lower surface of the heat-conducting substrate 141, that is, the side facing the water-cooled plate 142, is attached to the heat dissipation surface of the heat dissipation assembly 140.

[0051] An elastic pre-tightening mechanism 160 is provided between the water-cooled plate 142 and the heat-conducting substrate 141. The elastic pre-tightening mechanism 160 is disposed between the heat-conducting substrate 141 and the water-cooled plate 142 and is configured to apply a normal pressure toward the heat dissipation surface of the heat dissipation assembly to the heat-conducting substrate 141, so that the lower surface of the heat-conducting substrate 141 and the heat dissipation surface of the heat dissipation assembly 140 are always kept in close contact, thereby reducing contact thermal resistance and ensuring that heat is efficiently conducted from the heat-conducting substrate 141 to the water-cooled plate 142.

[0052] Specifically, the elastic preload mechanism 160 includes an elastic preload element such as a compression spring and a guide fastener such as a guide screw. The guide fastener passes through a through hole in the heat-conducting substrate 141, the elastic preload element is sleeved on the guide fastener, and the end of the guide fastener is screwed into a threaded hole in the water-cooling plate 142. By adjusting the screwing depth of the guide fastener, the compression amount of the elastic preload element can be adjusted, thereby adjusting the magnitude of the normal pressure applied to the heat-conducting substrate 141.

[0053] In this embodiment, the expansion and contraction of the elastic preload is adjustable, thereby allowing the normal pressure to be adjusted according to actual working conditions, such as the degree of thermal expansion and contraction of each component under different temperature conditions. This ensures a tight fit between the heat-conducting substrate 141 and the water-cooling plate 142, while avoiding structural deformation due to excessive pressure or poor contact due to insufficient pressure. The elastic preload is a compression spring, but it can also be a disc spring, an elastic washer, a wave spring, or a rubber elastomer.

[0054] The elastic preload mechanism 160 can also be pneumatic or hydraulic, that is, applying normal pressure to the heat-conducting substrate 141 through a cylinder or hydraulic cylinder. A pressure sensor can also be set between the heat-conducting substrate 141 and the water-cooling plate 142 to monitor the contact pressure in real time, and automatically adjust the compression of the elastic preload member according to the monitoring results to achieve closed-loop control of the contact pressure.

[0055] There is no thermally conductive medium between the analog-to-digital converter chip 120 and the thermally conductive substrate 141; the two are directly bonded. Specifically, the bottom surface of the analog-to-digital converter chip 120 directly contacts the upper surface of the thermally conductive substrate 141. Heat conduction is achieved through direct contact of highly thermally conductive metals, thus completely eliminating the interfacial thermal resistance caused by thermally conductive media such as silicone pads and liquid metals, significantly improving heat conduction efficiency. Experimental results show that under the same operating conditions, the temperature of the analog-to-digital converter chip 120 can be reduced by 5-8°C, and the thermal resistance is only 12%-30% of that of traditional silicone pad solutions.

[0056] A very thin layer of thermal interface material, such as thermal paste, can be coated between the analog-to-digital converter chip 120 and the thermally conductive substrate 141 to fill the tiny gaps between the microscopic surfaces and further reduce the contact thermal resistance.

[0057] The analog-to-digital converter chip 120 can also be directly mounted on the thermally conductive substrate 141 by soldering methods such as reflow soldering, achieving both electrical and thermal connections. Alternatively, the analog-to-digital converter chip 120 can be bonded to the thermally conductive substrate 141 using thermally conductive adhesive.

[0058] In another embodiment, the water-cooled plate 142 adopts a comb-like structure with multiple parallel and spaced-apart teeth. Each tooth extends along its length, and the top surfaces of all teeth together form the heat dissipation surface of the heat dissipation assembly that contacts the heat-conducting substrate 141. The lower surface of the heat-conducting substrate 141 simultaneously adheres to the top surfaces of multiple teeth, forming multi-point discrete surface contact. The grooves between adjacent teeth form part of the coolant flow channel, allowing the coolant to flow in the grooves on both sides of the teeth, simultaneously carrying away heat from the top and sides of the teeth, significantly increasing the heat exchange area and heat exchange efficiency.

[0059] In one embodiment, the comb-like structure is formed by machining parallel grooves into a metal substrate, with the protrusions between the grooves forming the comb teeth. The comb-like structure can also be integrally formed by casting or 3D printing. Alternatively, the comb-like structure can be assembled from multiple independent heat sinks arranged side-by-side.

[0060] In another embodiment, the heat dissipation surface of the heat dissipation component 140 can also be a flat plate structure, that is, the side of the water-cooled plate 142 facing the heat-conducting substrate 141 is a complete flat surface, the coolant flow channels are disposed inside the flat plate, and the heat-conducting substrate 141 contacts the heat dissipation surface of the flat plate structure in a large-area flat bonding manner. The heat dissipation surface of the heat dissipation component 140 can also be a microchannel structure, that is, dense microchannels are processed on the heat dissipation surface of the heat dissipation component to further improve heat exchange efficiency.

[0061] The comb-like structure of the water-cooled plate 142 can employ parallel, equally spaced comb teeth, each extending along the length of the water-cooled plate 142. The grooves between adjacent comb teeth form flow channels for the coolant to flow. The coolant enters from one end of the water-cooled plate 142, is diverted through the flow channels, and flows out from the other end, continuously carrying away the heat conducted from the heat-conducting substrate 141 to the comb teeth during the flow process.

[0062] The comb teeth can also be arranged with unequal spacing, that is, the comb teeth are more densely arranged in the area directly below the analog-to-digital converter chip 120 to enhance the heat dissipation effect in this area; while the comb teeth are relatively sparsely arranged in the area away from the analog-to-digital converter chip 120 to reduce flow resistance.

[0063] In another embodiment, the surface of the comb teeth can also be machined with microstructures, such as microprotrusions, micropits, or microgrooves, to increase the contact area between the comb teeth and the coolant and further enhance convective heat transfer.

[0064] In another embodiment, the heat dissipation surface of the heat dissipation component 140 can be replaced by a porous metal structure or a foam metal structure instead of a comb-like structure. The porous metal has a large number of interconnected channels inside, in which the coolant can flow and exchange heat fully with the skeleton wall of the porous metal, resulting in extremely high specific surface area and heat exchange efficiency.

[0065] In another embodiment, the heat dissipation surface of the heat dissipation assembly 140 may also adopt a needle-fin structure, that is, multiple columnar or needle-shaped heat dissipation fins are densely arranged on the heat dissipation surface, and the coolant flows around each needle fin to exchange heat with the side and top surfaces of the needle fins.

[0066] In another embodiment, the water-cooled plate 142 can also be connected to a liquid cooling control component, which includes a liquid chiller. The liquid chiller provides circulating coolant to the water-cooled plate 142 through pipes and controls the flow rate and temperature of the coolant, so that the heat dissipation component 140 works in the optimal heat dissipation state.

[0067] Figure 4 A flowchart of the assembly and positioning method for the multi-slice CT detector module provided in this application is shown below. Figure 4 As shown, this embodiment provides an assembly and positioning method for the above-mentioned CT detection device, including the following steps S1 to S4.

[0068] Step S1: Fix the mounting bracket 131, which carries multiple detection units 110, to the guide rail 132 using a positioning structure. Specifically, insert the positioning pin 133 on the mounting bracket 131 into the positioning hole 135 on the guide rail 132, so that the first mounting plane 134 and the second mounting plane 136 are in contact, and then tighten the mounting screws to lock the mounting bracket 131 onto the guide rail 132.

[0069] By engaging the positioning pin 133 with the positioning hole 135 and fitting the first mounting plane 134 with the second mounting plane 136, the mounting bracket 131 obtains a unique and precise position on the guide rail 132, thereby determining the final position of the multiple detection units 110. In this step, the positioning accuracy of the mounting bracket 131 is independently guaranteed by the positioning pin 133 and the first mounting plane 134, and is not affected by the subsequent installation of the heat dissipation component 140.

[0070] In one specific embodiment, step S1 further includes using a laser rangefinder or dial indicator to detect the position of the mounting bracket 131 before tightening the mounting screws, and confirming that its positional accuracy meets the requirements before tightening the screws. In another embodiment, a shim can also be provided between the mounting bracket 131 and the guide rail 132 to compensate for minor deviations in the height direction.

[0071] Step S2: Attach the thermally conductive substrate 141, on which the analog-to-digital converter chip 120 is mounted, to the heat dissipation surface of the heat dissipation assembly 140. The water-cooled plate 142 has been pre-installed at a designated position on the CT gantry and has internal channels for coolant circulation. Place the thermally conductive substrate 141 on the heat dissipation surface of the heat dissipation assembly 140, with the lower surface of the thermally conductive substrate 141 facing the heat dissipation surface of the heat dissipation assembly 140.

[0072] In this step, the analog-to-digital converter chip 120 is pre-fixed on the other side of the thermally conductive substrate 141, and there is no thermally conductive medium between the analog-to-digital converter chip 120 and the thermally conductive substrate 141; the two are directly bonded together. There is also no need to apply thermally conductive grease or other thermally conductive medium between the thermally conductive substrate 141 and the heat dissipation surface of the heat dissipation assembly 140; the two are kept tightly bonded solely by subsequent elastic pre-tightening force.

[0073] In step S2, a thermally conductive pad or thermally conductive paste may be provided between the thermally conductive substrate 141 and the heat dissipation surface of the heat dissipation assembly 140 to further reduce the contact thermal resistance.

[0074] Step S3: Provide an elastic preload mechanism 160 between the thermally conductive substrate 141 and the water-cooled plate 142 to ensure that the thermally conductive substrate 141 and the heat dissipation surface of the heat dissipation assembly 140 are in close contact. Specifically, pass a guide fastener, such as a guide screw, through the through hole on the thermally conductive substrate 141, sleeve an elastic preload member, such as a compression spring, on the guide fastener, and then screw the end of the guide fastener into the threaded hole on the water-cooled plate 142, adjusting the compression amount of the elastic preload member until the set value is reached.

[0075] The normal pressure of the elastic pre-tightening mechanism 160 ensures that the lower surface of the thermally conductive substrate 141 is in close contact with the heat dissipation surface of the heat dissipation assembly 140, significantly reducing the contact thermal resistance. Because the elastic pre-tightening component has a certain elastic deformation capability, it can maintain a stable contact state even when temperature changes cause thermal expansion and contraction of the components, ensuring consistent heat dissipation performance.

[0076] In step S3, multiple elastic pre-tightening mechanisms 160 can be evenly arranged at multiple positions on the heat-conducting substrate 141 to achieve uniform bonding between each area of ​​the heat-conducting substrate 141 and the water-cooling plate 142.

[0077] Step S4: Connect the signal terminal of the detection unit 110 to the signal input terminal of the analog-to-digital converter chip 120 via the flexible signal transmission component 150. Specifically, one end of the flexible signal transmission component 150 (such as a flexible circuit board) is electrically connected to the signal terminal of the photodiode 111 of the detection unit 110, and the other end is electrically connected to the signal input terminal of the analog-to-digital converter chip 120. The flexible signal transmission component 150 spans between the support component 130 and the heat dissipation component 140, and adapts to the relative displacement between the mounting bracket 131 and the heat dissipation component 140 through its own deformation.

[0078] In this embodiment, the flexible signal transmission component 150 is connected to the photodiode 111 and the analog-to-digital converter chip 120 by soldering or plugging. The flexible signal transmission component 150 can also be electrically connected by crimping or connectors.

[0079] In step S4, the bending shape of the flexible signal transmission component 150 can also be checked after the connection is completed to ensure that it has sufficient bending allowance to accommodate the possible relative displacement between the load-bearing component 130 and the heat dissipation component 140.

[0080] This assembly sequence—first positioning the support component 130, then installing the heat dissipation component 140, and finally bridging the flexible signal transmission component 150—ensures that the positioning accuracy of the detection unit 110 is not affected by the installation of the heat dissipation component 140 during assembly. Precise positioning is completed before installing the heat dissipation component 140, ensuring that the assembly tolerances of the heat dissipation component 140 do not affect the already determined position of the detection unit 110; the flexible signal transmission component 150 is connected last, allowing it to freely adapt to positional deviations between the two sets.

[0081] The order of steps S3 and S4 can be interchanged, i.e., the flexible signal transmission component 150 is connected first, and then the elastic pre-tightening mechanism 160 is installed.

[0082] Steps S2 and S3 can be performed together, that is, first attach the thermally conductive substrate 141 to the heat dissipation surface of the heat dissipation assembly 140 and at the same time install the elastic pre-tightening mechanism 160.

[0083] Figure 5 A flowchart illustrating the adjustment of elastic pre-tightening in the assembly and positioning method for the multi-slice CT detector module provided in this application is shown below. Figure 5 As shown, this embodiment further refines the adjustment method of the elastic preload mechanism in step S3, including the following steps: Step S31: Provide a guide fastener and a resilient preload. The guide fastener is preferably a guide screw, and the resilient preload is preferably a compression spring.

[0084] Step S32: Pass the guide fastener through the through hole opened on the thermally conductive substrate 141. The inner diameter of the through hole is slightly larger than the outer diameter of the guide fastener to allow the guide fastener to move freely in the hole, while providing guidance for the small displacement of the thermally conductive substrate 141 in the normal direction.

[0085] Step S33: Fit the elastic preload onto the guide fastener. One end of the elastic preload abuts against the upper surface of the thermally conductive substrate 141, while the other end is constrained by the guide fastener during use.

[0086] Step S34: Screw the end of the guide fastener into the threaded hole on the water-cooling plate 142. At this time, the guide fastener is fixed on the water-cooling plate 142, and the elastic preload is compressed between the heat-conducting substrate 141 and the head of the guide fastener.

[0087] Step S35: Adjust the compression of the elastic preload until the set value is reached. By rotating the guide fastener to change the depth of its screwing into the threaded hole, the compression of the elastic preload can be changed, thereby adjusting the normal pressure applied to the heat-conducting substrate 141.

[0088] Specifically, the greater the screw-in depth of the guide fastener, the greater the compression of the elastic preload, and the greater the normal pressure applied to the heat-conducting substrate 141; conversely, the smaller the screw-in depth of the guide fastener, the smaller the compression of the elastic preload, and the smaller the normal pressure applied to the heat-conducting substrate 141. By precisely controlling the screw-in depth of the guide fastener, the normal pressure reaches a predetermined value, thereby optimizing the contact thermal resistance between the heat-conducting substrate 141 and the heat dissipation surface of the heat dissipation assembly 140.

[0089] In this embodiment, the set value for adjusting the compression amount of the elastic preload is determined based on the contact area between the thermally conductive substrate 141 and the water-cooled plate 142, the rigidity of the thermally conductive substrate 141, and the required contact thermal resistance. In another embodiment, a pressure sensor can be provided between the thermally conductive substrate 141 and the water-cooled plate 142 to monitor the contact pressure in real time and adjust it according to the monitoring results, so that the contact pressure is precisely controlled within the target range.

[0090] In another embodiment, step S35 can use a torque wrench or a torque screwdriver to rotate the guide fastener, thereby indirectly controlling the compression of the elastic preload by controlling the torque. In yet another embodiment, step S35 can also use an electrically controlled tightening device with a displacement sensor, thereby precisely controlling the compression of the elastic preload by controlling the displacement of the guide fastener.

[0091] In yet another embodiment, the adjustment method of the elastic pretensioning mechanism 160 can also be hydraulic or pneumatic, that is, the normal pressure is adjusted by applying hydraulic or pneumatic pressure to the elastic pretensioning member.

[0092] In one embodiment, the flexible signal transmission component 150 is specifically a flexible printed circuit board (FPC). One end of the flexible printed circuit board is electrically connected to the signal terminal of the photodiode 111 of the detection unit 110 by soldering, and the other end is electrically connected to the signal input terminal of the analog-to-digital converter chip 120 by soldering. The middle section of the flexible printed circuit board is in a naturally curved state, spanning between the support component 130 and the heat dissipation component 140. Its bending radius and bending angle are determined according to the actual spatial distance between the support component 130 and the heat dissipation component 140 and the possible relative displacement.

[0093] In another embodiment, the two ends of the flexible circuit board can be connected to the photodiode 111 and the analog-to-digital converter chip 120 by plugging in, that is, pluggable connection is achieved by using board-to-board connectors or wire-to-board connectors.

[0094] In another embodiment, the flexible signal transmission device 150 may also employ multiple independent flexible wire bundles, each wire being connected to a corresponding signal channel. The wire bundles are covered with flexible sheaths to protect the wires and maintain overall flexibility.

[0095] In another embodiment, the flexible signal transmission component 150 may also be a flexible flat cable (FFC), which has multiple parallel flat conductors covered with a flexible insulation layer, providing good bending and signal transmission performance. Reinforcing plates are provided at both ends of the flexible flat cable for easy mating with connectors or direct soldering.

[0096] In another embodiment, the flexible signal transmission component 150 may also employ an elastic conductive structure, such as a conductive spring wire or a helical wire, which adapts to the relative displacement between the carrier component 130 and the heat dissipation component 140 through the expansion and contraction of its helical structure. Compared to an FPC, a conductive spring wire has a larger range of expansion and contraction in the axial direction, making it more suitable for applications where there may be significant relative displacement.

[0097] The specific structure of the detection unit is described below.

[0098] In one embodiment, the detection unit 110 includes a scintillator 112 and a photodiode 111. The scintillator 112, which is made of a scintillating crystal material, is disposed above the photodiode 111 and is used to convert incident X-rays into visible light. The photodiode 111, which is disposed below the scintillator 112 and is optically coupled to the scintillator 112, is used to convert visible light into an analog electrical signal.

[0099] Multiple detection units 110 are arranged along the Z direction on the mounting bracket 131. The signal terminals of the photodiodes 111 of the detection units 110 are connected to the signal input terminals of the analog-to-digital converter chip 120 through the flexible signal transmission component 150.

[0100] In another embodiment, the detection unit 110 may also employ a direct conversion X-ray detector, that is, a semiconductor material such as amorphous selenium (a-Se) is used to directly convert X-rays into electrical signals without the intermediate step of converting them into visible light through a scintillator.

[0101] In yet another embodiment, the detection unit 110 may further include a collimator, such as an anti-scattering grating, disposed above the scintillator 112 to block scattered X-rays and allow only X-rays propagating in a straight line to reach the scintillator 112.

[0102] In another embodiment, the multiple detection units 110 can be arranged in a two-dimensional array on the mounting bracket 131, that is, arranged simultaneously along the Z and X directions to cover a larger detection area.

[0103] The following explains the bonding between the analog-to-digital converter chip and the thermally conductive substrate: In one embodiment, there is no thermally conductive medium between the analog-to-digital converter chip 120 and the thermally conductive substrate 141. The two are directly bonded together. Specifically, the bottom surface of the analog-to-digital converter chip 120, which faces the surface of the thermally conductive substrate 141, and the top surface of the thermally conductive substrate 141, which faces the surface of the analog-to-digital converter chip 120, are both finely machined surfaces with a surface roughness Ra of no more than 0.8 μm. The two achieve heat conduction through direct contact.

[0104] The analog-to-digital converter chip 120 is fixed to the thermally conductive substrate 141 by thermally conductive adhesive or soldering. In the embodiment where thermally conductive adhesive is used, the thermally conductive adhesive is only applied to the bottom edge area of ​​the analog-to-digital converter chip 120 to ensure that there is no adhesive layer between the central area of ​​the bottom surface of the analog-to-digital converter chip 120 and the upper surface of the thermally conductive substrate 141, and the two are in direct contact.

[0105] In another embodiment, the analog-to-digital converter chip 120 and the thermally conductive substrate 141 can also be connected by eutectic welding or silver sintering to form a metallurgical interface, further reducing contact thermal resistance.

[0106] In another embodiment, a boss structure can be provided in the area where the thermally conductive substrate 141 contacts the analog-to-digital converter chip 120. The upper surface of the boss is a finished surface that directly contacts the bottom surface of the analog-to-digital converter chip 120. The height of the boss is slightly higher than other areas of the thermally conductive substrate 141 to ensure reliable direct contact between the bottom surface of the analog-to-digital converter chip 120 and the thermally conductive substrate 141.

[0107] The CT detection device provided by this invention can also be applied to other medical imaging equipment, such as PET / CT equipment (i.e., positron emission tomography and X-ray computed tomography system) and SPECT / CT equipment (i.e., single photon emission tomography and X-ray computed tomography system). In these devices, there is also a contradiction between the positioning accuracy and heat dissipation efficiency of the detector module.

[0108] In the aforementioned CT detection device 100, the support assembly 130 may include multiple mounting brackets 131, each mounting bracket 131 supporting multiple detection units 110. The multiple mounting brackets 131 are arranged sequentially along the guide rail 132 to form a complete detector array. Each mounting bracket 131 is independently positioned with the guide rail 132 through a positioning pin 133 and a first mounting plane 134. An assembly gap is left between each mounting bracket 131 to absorb manufacturing errors and thermal deformation.

[0109] The positioning structure between the mounting bracket 131 and the guide rail 132 can also adopt other matching methods, such as dovetail groove matching, T-slot matching or ball guide rail matching, to achieve precise positioning and fixation of the mounting bracket 131 on the guide rail 132.

[0110] The analog-to-digital converter chip 120 can be a multi-channel analog-to-digital converter chip, that is, a single chip integrates multiple analog-to-digital conversion channels, which can simultaneously process the analog signals output by multiple detection units 110, thereby reducing the number of chips and simplifying the circuit layout.

[0111] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A CT detection device, characterized in that, include: Multiple detection units are used to detect X-rays and output analog signals; Multiple analog-to-digital converter chips are used to convert the analog signal into a digital signal; The support assembly includes a mounting bracket and a guide rail. The mounting bracket supports the plurality of detection units and is fixed to the guide rail by a positioning structure to define the position of the plurality of detection units. A heat dissipation assembly is provided with a heat dissipation surface and a heat-conducting substrate. One side of the heat-conducting substrate is attached to the heat dissipation surface. The heat dissipation surface of the heat dissipation assembly is provided with a flow channel for the circulation of coolant. The plurality of analog-to-digital conversion chips are fixed on the other side of the heat-conducting substrate. A flexible signal transmission component is connected between the support component and the heat dissipation component and adapts to the relative displacement between the support component and the heat dissipation component through its own deformation. One end of the flexible signal transmission component is connected to the signal terminal of the detection unit, and the other end is connected to the signal input terminal of the analog-to-digital conversion chip.

2. The CT detection device according to claim 1, characterized in that, The mounting bracket is provided with a positioning pin and a first mounting surface, and the guide rail is provided with a positioning hole and a second mounting surface. The positioning pin is inserted into the positioning hole, and the first mounting surface is in contact with the second mounting surface.

3. The CT detection device according to claim 1, characterized in that, The heat dissipation component also includes a water-cooled plate, and the heat dissipation surface of the heat dissipation component is formed on the water-cooled plate; It also includes an elastic pre-tightening mechanism, which is disposed between the thermally conductive substrate and the water-cooled plate and is configured to apply a normal pressure toward the heat dissipation surface of the heat dissipation assembly to the thermally conductive substrate.

4. The CT detection device according to claim 3, characterized in that, The water-cooled plate has a comb-like structure with multiple comb teeth that are in contact with the thermally conductive substrate; and / or The comb-like structure is composed of multiple parallel convex teeth, and the grooves between adjacent convex teeth form part of the flow channel.

5. The CT detection device according to claim 3, characterized in that, The elastic preload mechanism includes an elastic preload element, which is used to provide the normal pressure; and / or, The extension / retraction of the elastic preload can be adjusted to regulate the normal pressure.

6. The CT detection device according to claim 5, characterized in that, It also includes a guide fastener, on which the elastic preload is sleeved; The guide fastener passes through the thermally conductive substrate and is connected to the heat dissipation assembly.

7. The CT detection device according to any one of claims 1-6, characterized in that, The flexible signal transmission device includes a flexible circuit board, one end of which is electrically connected to the photodiode of the detection unit, and the other end is electrically connected to the signal input terminal of the analog-to-digital converter chip.

8. The CT detection device according to claim 7, characterized in that, The detection unit includes a photodiode and a scintillator, the scintillator being configured to convert X-rays into visible light, and the photodiode being configured to convert the visible light into an analog electrical signal.

9. A method for assembling and positioning a multi-row CT detector module, characterized in that, The CT detection device according to any one of claims 1-8 comprises the following steps: The mounting bracket, which carries multiple detection units, is fixed to the guide rail using a positioning structure. The thermally conductive substrate on which the analog-to-digital converter chip is fixed is attached to the heat dissipation surface of the heat dissipation component, and the water-cooled plate has a flow channel for the circulation of coolant inside. An elastic pre-tightening mechanism is provided between the thermally conductive substrate and the water-cooled plate to keep the thermally conductive substrate and the heat dissipation surface of the heat dissipation assembly in close contact. The signal terminal of the detection unit is connected to the signal input terminal of the analog-to-digital converter chip by a flexible signal transmission component, which adapts to the relative displacement between the mounting bracket and the heat dissipation component through its own deformation.

10. The assembly and positioning method for a multi-row CT detector module according to claim 9, characterized in that, "Providing an elastic pre-tightening mechanism between the thermally conductive substrate and the water-cooled plate to keep the thermally conductive substrate and the heat dissipation surface of the heat dissipation assembly in close contact" further includes: Provide guide fasteners and flexible preloads; The guide fastener is passed through the through hole of the thermally conductive substrate; The elastic preload is fitted onto the guide fastener; Screw the end of the guide fastener into the threaded hole of the water-cooled plate; Adjust the compression of the elastic preload until the set value is reached.

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