An ultrasonic device

Abstract

The application discloses an ultrasonic equipment, which comprises an integrated board card assembly, the integrated board card assembly comprises an integrated board card, a first shielding cover and a second shielding cover, the integrated board card is located between the first shielding cover and the second shielding cover; the integrated board card is provided with an ultrasonic mainboard area and a probe board area which are separated by a shielding assembly, the shielding assembly is in electrical contact with the first shielding cover and / or the second shielding cover to realize electromagnetic shielding between the ultrasonic mainboard area and the probe board area. The ultrasonic board card and the probe board card which are originally arranged independently are integrated into an integrated board card, meanwhile, the ultrasonic mainboard area and the probe board area on the integrated board card are separated by the shielding assembly, the electrical contact between the shielding assembly and the first shielding cover and the second shielding cover can realize electromagnetic shielding between the ultrasonic mainboard area and the probe board area; the integrated board card assembly has the advantages of less shielding covers, low material cost and simple assembly steps.

Description

Technical Field

[0001] This application relates to the field of medical device technology, specifically to an ultrasound device. Background Technology

[0002] Ultrasound equipment, such as trolley-mounted ultrasound machines, is a medical device that uses ultrasound signals to examine patients and create images to assist doctors in medical diagnosis and treatment. The core technology of ultrasound equipment lies in the quality of the ultrasound images generated; only high-quality ultrasound images can help doctors make clear and accurate judgments about the structure of vital signs.

[0003] Existing ultrasound equipment consists of two independent PCBs: an ultrasound mainboard and a probe board. To prevent the probe board from interfering with the image quality of the ultrasound equipment, a probe board shield is required around its perimeter. Similarly, to prevent interference from external signals to the various functional modules on the ultrasound mainboard, a mainboard shield is needed. This necessitates two PCBs and two different shields within the ultrasound equipment, increasing material costs and assembly steps. Therefore, there is a need to design an ultrasound device with effective shielding, fewer materials, and fewer assembly steps. Summary of the Invention

[0004] Therefore, the technical problem to be solved by this application is to overcome the defects of existing ultrasonic equipment, which requires two sets of shielding covers to shield the ultrasonic main board and the probe board respectively, resulting in high material costs and many assembly steps, thereby providing an ultrasonic device.

[0005] To solve the above-mentioned technical problems, the technical solution of this application is as follows:

[0006] An ultrasound device includes an integrated board assembly, the integrated board assembly including an integrated board, a first shielding cover and a second shielding cover, the integrated board being located between the first shielding cover and the second shielding cover; the integrated board has an ultrasound main board area and a probe board area separated by the shielding assembly, the shielding assembly being in electrical contact with the first shielding cover and / or the second shielding cover to achieve shielding between the ultrasound main board area and the probe board area.

[0007] Furthermore, the shielding assembly includes a first grounding bracket and a second grounding bracket located on opposite sides of the integrated board. One end of the first grounding bracket is in contact with the integrated board and the other end is in contact with the first shielding cover. One end of the second grounding bracket is connected to the second shielding cover and the other end is in contact with the integrated board through an elastic conductive structure.

[0008] Furthermore, the first grounding bracket is a conductive metal bracket; the first grounding bracket includes a first panel that is in surface contact with the integrated board, a second panel that is in surface contact with the first shielding cover, and a third panel integrally connected between the first panel and the second panel.

[0009] Furthermore, the second grounding bracket is a conductive metal bracket; the second grounding bracket includes a fourth panel that is in contact with the second shielding cover and a fifth panel that is integrally connected to the fourth panel and extends toward the integrated board, and the elastic conductive structure is snapped between the fifth panel and the integrated board.

[0010] Furthermore, the elastic conductive structure is a conductive spring, which includes a spring body and an elastic part. The spring body is connected to the fifth panel, one end of the elastic part is connected to the spring body, and the other end extends toward the integrated circuit board. The elastic part is in contact with the integrated circuit board.

[0011] Furthermore, the main body of the spring sheet includes a first connecting piece, a second connecting piece, and a third connecting piece located on different surfaces. The second connecting piece is in contact with the end face of the fifth panel. One end of the elastic part is connected to the second connecting piece, and multiple elastic parts are arranged side by side along the length direction of the second connecting piece. The first connecting piece and the third connecting piece are respectively located on two sides in the thickness direction of the fifth panel, and the first connecting piece and the third connecting piece elastically clamp the fifth panel along the thickness direction of the fifth panel.

[0012] Furthermore, the integrated board is provided with multiple positioning holes, and the second shielding cover is provided with multiple positioning posts extending into the corresponding positioning holes on the side facing the integrated board; the part of the first grounding bracket that contacts the integrated board is fixed to the positioning posts by a connector.

[0013] Furthermore, the integrated board has an exposed copper area on one side facing the first shield, located between the ultrasound motherboard area and the probe board area, and one end of the first grounding bracket is connected to the exposed copper area.

[0014] Furthermore, the exposed copper area divides the integrated board into an ultrasonic mainboard area and a probe board area distributed along the height direction, with the probe board area located above the exposed copper area and the ultrasonic mainboard area located below the exposed copper area.

[0015] Furthermore, the ultrasound motherboard area is equipped with a digital processing module, an ultrasound front-end analog signal processing module, a power supply module, and a signal processing controller; the probe board area is equipped with a probe socket.

[0016] The technical solution of this application has the following advantages: It integrates the originally independently set ultrasonic circuit board and probe board into a single integrated circuit board, using a first shielding cover and a second shielding cover to achieve electromagnetic shielding of the entire integrated circuit board; simultaneously, it uses a shielding component to separate the ultrasonic mainboard area and the probe board area on the integrated circuit board. The contact between the shielding component and the first and / or second shielding cover achieves electromagnetic shielding between the ultrasonic mainboard area and the probe board area, ensuring that the electromagnetic shielding performance of the integrated circuit board assembly meets the requirements of ultrasonic equipment for high-quality ultrasonic signals. Compared with the prior art, where the independently set ultrasonic circuit board and probe board are each shielded by a separate set of shielding covers, this method can reduce the number of shielding covers, material costs, and assembly steps while achieving the same shielding effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the ultrasonic device in the embodiments of this application;

[0019] Figure 2 This is a schematic diagram of the overall structure of the ultrasound host in the embodiments of this application;

[0020] Figure 3 This is a schematic diagram showing the connection relationship between the chassis, front housing, rear housing, rear handle upper housing, main frame, and integrated board assembly in an embodiment of this application.

[0021] Figure 4 This is a schematic diagram of the integrated board assembly in an embodiment of this application;

[0022] Figure 5 This is an exploded view of the integrated board assembly in the embodiments of this application;

[0023] Figure 6 This is a cross-sectional view of the integrated board assembly in an embodiment of this application;

[0024] Figure 7 for Figure 6 Enlarged view of point D in the middle;

[0025] Figure 8 This is a schematic diagram showing the connection relationship between the first grounding bracket, the second grounding bracket, the conductive spring, the positioning post, and the connecting post in an embodiment of this application.

[0026] Figure 9 This is a schematic diagram of the structure of the first grounding bracket in the embodiments of this application;

[0027] Figure 10 This is a schematic diagram of the structure of the second grounding bracket and conductive spring in the embodiments of this application.

[0028] Explanation of reference numerals in the attached drawings: A. Ultrasonic main unit; B. Display device; C. Operating device; 1. Chassis; 2. Front housing; 3. Rear housing; 4. Rear handle upper housing; 5. Main frame; 6. Integrated board assembly; 61. Integrated board; 611. Ultrasonic main board area; 612. Probe board area; 613. Exposed copper area; 614. Positioning hole; 62. First shielding cover; 63. Second shielding cover; 64. First grounding bracket; 641. First panel; 642. Second panel 643. Third panel; 644. Connecting ear plate; 6441. First connecting hole; 65. Second grounding bracket; 651. Fourth panel; 6511. Second connecting hole; 652. Fifth panel; 66. Conductive spring; 661. Spring body; 6611. First connecting piece; 6612. Second connecting piece; 6613. Third connecting piece; 662. Elastic part; 671. Positioning pin; 672. Positioning post; 68. Connector; 69. Probe socket. Detailed Implementation

[0029] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] like Figure 1 The image shows an ultrasound device that uses ultrasound signals to detect patients and form images to assist doctors in medical diagnosis and treatment. The ultrasound device mainly includes an ultrasound main unit A, a display device B, and an operating device C.

[0033] The ultrasound main unit A, as a crucial component of the ultrasound equipment, primarily functions as the core controller, processing ultrasound data and generating ultrasound images. The display device B, including a monitor, is mainly used to display ultrasound images and other relevant information. The operating device C mainly includes an operation panel with buttons, knobs, or a touchscreen, allowing users to input commands to control the ultrasound equipment. The ultrasound main unit A is located at the bottom of the entire device, while the display device B and operating device C are supported above it. The bottom of the ultrasound main unit A is equipped with four casters with brake pads for movement and positioning of the ultrasound equipment.

[0034] like Figure 2 and Figure 3 As shown, the ultrasound main unit A mainly includes a chassis 1, a front housing 2, a rear housing 3, a rear handle upper housing 4, a main frame 5, and an integrated board assembly 6. The chassis 1 is connected above four casters, and the main frame 5 is fixed to the chassis 1. The front housing 2 is located in front of the main frame 5, and the rear housing 3 is located behind the main frame 5. The front housing 2 and the rear housing 3 together form a mounting cavity on the chassis 1, within which the main frame 5 and the integrated board assembly 6 are located. The integrated board assembly 6 is installed on the front side of the main frame 5 facing the front housing 2, and the rear handle upper housing 4 is connected above the front housing 2 and the rear housing 3. The front side is the side of the ultrasound equipment where the display device B faces the operator, and the rear side is the side of the ultrasound equipment where the display device B faces away from the operator.

[0035] like Figure 4 and Figure 5As shown, the integrated board assembly 6 includes an integrated board 61, a first shielding cover 62, and a second shielding cover 63. The integrated board 61 is located within the space enclosed by the first shielding cover 62 and the second shielding cover 63. The integrated board 61 has an ultrasound mainboard area 611 and a probe board area 612 separated by the shielding assembly. The shielding assembly is in electrical contact with the first shielding cover 62 and / or the second shielding cover 63 to achieve shielding between the ultrasound mainboard area 611 and the probe board area 612.

[0036] The ultrasonic motherboard area 611 includes functional modules such as a digital processing module, an ultrasonic front-end analog signal processing module, a power supply module, and a signal processing controller. The probe board area 612 has multiple probe sockets 69, where external ultrasonic probes are plugged in. Ultrasonic signals acquired by the probes are transmitted to the integrated circuit board 61 via the probe sockets 69. The ultrasonic front-end analog signal processing module and signal processing controller on the integrated circuit board 61 analyze and process the ultrasonic signals to generate ultrasonic images and other information. When only one side of the integrated circuit board 61 has functional modules that are easily interfered with by external electromagnetic signals or that easily generate electromagnetic interference signals, the shielding assembly can only ground the integrated circuit board 61 and the first shielding cover 62 or the second shielding cover 63 covering that side. When both sides of the integrated circuit board 61 have functional modules that are easily interfered with by external electromagnetic signals or that easily generate electromagnetic interference signals, the shielding assembly needs to ground the integrated circuit board 61 simultaneously with both the first shielding cover 62 and the second shielding cover 63 to achieve a good electromagnetic shielding effect.

[0037] This integrated board assembly 6 integrates the originally independent ultrasonic board and probe board into a single integrated board 61. Electromagnetic shielding of the integrated board 61 is achieved using a first shielding cover 62 and a second shielding cover 63. Simultaneously, the shielding assembly separates the ultrasonic mainboard area 611 and the probe board area 612 on the integrated board 61. The shielding assembly is in electrical contact with the first shielding cover 62 and / or the second shielding cover 63, ensuring electromagnetic shielding between the ultrasonic mainboard area 611 and the probe board area 612. This ensures that the electromagnetic shielding performance of the integrated board assembly 6 meets the requirements of ultrasonic equipment for high-quality ultrasonic signals. Compared to the prior art where each independently configured ultrasonic board and probe board is shielded by a separate set of shielding covers, this method reduces the number of shielding covers while maintaining the same shielding effect, thus reducing material costs and assembly steps.

[0038] like Figure 5As shown, in some embodiments, the integrated board 61 has an exposed copper area 613 on one side facing the first shielding cover 62. The exposed copper area 613 is the separating area between the ultrasonic mainboard area 611 and the probe board area 612. The exposed copper area 613 specifically refers to the metal area on the circuit board that is not covered by the insulating layer and is therefore exposed. The exposed metal element on the exposed copper area 613 is not limited to copper, but can also be gold.

[0039] like Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the shielding assembly includes a first grounding bracket 64 and a second grounding bracket 65 located on opposite sides of the integrated circuit board 61. One end of the first grounding bracket 64 is in contact with the exposed copper area 613, and the other end is in contact with the first shielding cover 62. The exposed copper area 613 can serve as part of a grounding layer, effectively shielding electromagnetic interference between modules in different areas of the integrated circuit board 61 and transmitting electromagnetic interference signals to the first shielding cover 62 via the first grounding bracket 64 for grounding. One end of the second grounding bracket 65 is connected to the second shielding cover 63, and the other end is in contact with the integrated circuit board 61 through an elastic conductive structure. In some embodiments, the other end of the second grounding bracket 65 elastically abuts against the integrated circuit board 61 through an elastic conductive structure. By providing the first grounding bracket 64 and the second grounding bracket 65 on opposite sides of the integrated circuit board 61, electromagnetic signal shielding on both sides of the integrated circuit board 61 can be achieved, ensuring that the electromagnetic shielding performance of the integrated circuit board assembly 6 meets the requirements of the ultrasonic equipment. The elastic conductive structure is disposed between the integrated board 61 and the second grounding bracket 65. It deforms under the pressure of the integrated board 61 and the second grounding bracket 65 to maintain stable contact between the integrated board 61 and the second grounding bracket 65.

[0040] like Figure 7 and Figure 9 As shown, in some embodiments, both the first grounding bracket 64 and the second grounding bracket 65 are conductive metal brackets. The first grounding bracket 64 includes a first panel 641 that is surface-to-surface connected to the integrated board 61, a second panel 642 that is surface-to-surface connected to the first shielding cover 62, and a third panel 643 integrally connected between the first panel 641 and the second panel 642. The first panel 641, the second panel 642, and the third panel 643 are a single integrated structure. The second grounding bracket 65 is a conductive metal bracket. Figure 7 and Figure 10As shown, the second grounding bracket 65 includes a fourth panel 651 that is in surface contact with the second shielding cover 63, and a fifth panel 652 integrally connected to the fourth panel 651 and extending towards the integrated board 61. The elastic conductive structure is specifically a conductive spring 66 that is elastically snapped between the fifth panel 652 and the integrated board 61. In other alternative embodiments, the elastic conductive structure can also be a conductive material with elasticity, such as conductive foam or conductive cloth.

[0041] like Figure 5 , Figure 7 - Figure 10 As shown, in some embodiments, the first grounding bracket 64 further includes a plurality of connecting ear plates 644 located in the same plane as the first panel 641, the plurality of connecting ear plates 644 extending outward from one end of the first panel 641. The integrated board 61 is provided with a plurality of positioning holes 614; the connecting ear plates 644 are provided with first connecting holes 6441, the first connecting holes 6441 on the plurality of connecting ear plates 644 corresponding to the positions of the plurality of positioning holes 614; the fourth panel 651 of the second grounding bracket 65 is provided with a plurality of second connecting holes 6511, the plurality of second connecting holes 6511 corresponding to the positions of the plurality of positioning holes 614. The second shielding cover 63 is provided with a positioning pin 671 on the side facing the integrated board 61, the positioning pin 671 passing sequentially through the second connecting hole 6511, the positioning hole 614, and the first connecting hole 6441, the positioning pin 671 being used to position the first grounding bracket 64, the integrated board 61, and the second grounding bracket 65. The second shielding cover 63 is also provided with multiple positioning posts 672 on the side facing the integrated board 61. The positioning posts 672 pass through the second connection hole 6511 on the fourth panel 651. The positioning posts 672 are provided with connection post holes. The first grounding bracket 64 is fixed to the positioning post 672 by a connector 68 that passes through the first connection hole 6441 and is threaded into the connection post hole, so as to fix the first grounding bracket 64 and the second shielding cover 63. Since the first grounding bracket 64 and the first shielding cover 62 are also fixedly connected, the double fixed connection method of the first grounding bracket 64 is conducive to improving the connection reliability, thereby ensuring that the first grounding bracket 64 can always remain grounded.

[0042] The design of the first grounding bracket 64 and the second grounding bracket 65 in this application also fully considers the assembly and disassembly requirements of the integrated circuit board assembly 6. During the assembly of the integrated circuit board assembly 6, the fourth panel 651 of the second grounding bracket 65 is first fixed to the second shielding cover 63. Then, the conductive spring 66 is clipped onto the fifth panel 652 of the second grounding bracket 65. Next, the integrated circuit board 61 is vertically installed on the second grounding bracket 65. The positioning pin 671 on the second shielding cover 63 guides the integrated circuit board 61, ensuring that it does not wobble during installation and preventing damage to the components on the integrated circuit board 61 during installation. The side of the integrated circuit board 61 facing the second shielding cover 63 is grounded sequentially through the conductive spring 66, the second grounding bracket 65, and the second shielding cover 63. Next, a first grounding bracket 64 is installed on the exposed copper area 613 on the other side of the integrated circuit board 61. The first grounding bracket 64 is locked to the integrated circuit board 61 by a connecting post 672 extending from the second shielding cover 63. Finally, the first shielding cover 62 is closed, and screws are used to lock the first shielding cover 62 and the first grounding bracket 64, completing the assembly of the integrated circuit board assembly 6. This integrated circuit board assembly 6 has fewer assembly steps and is simple to assemble. The conductive spring 66 can avoid poor contact caused by the tolerance of the second grounding bracket 65, ensuring the reliability of electromagnetic shielding.

[0043] like Figure 10 As shown, in some embodiments, the conductive spring 66 is made of conductive copper. The conductive spring 66 includes a spring body 661 and an elastic portion 662. The spring body 661 is connected to the fifth panel 652. One end of the elastic portion 662 is connected to the spring body 661, and the other end extends towards the integrated circuit board 61, where the elastic portion 662 contacts the integrated circuit board 61. In some embodiments, the other end of the elastic portion 662 extends towards the integrated circuit board 61, and the elastic portion 662 elastically abuts against the integrated circuit board 61. The spring body 661 includes a first connecting piece 6611, a second connecting piece 6612, and a third connecting piece 6613 located on different surfaces. The first connecting piece 6611 and the third connecting piece 6613 are respectively located on two sides of the fifth panel 652 along its thickness direction, and the first connecting piece 6611 and the third connecting piece 6613 elastically clamp the fifth panel 652 along its thickness direction. The second connecting piece 6612 is attached to the end face of the fifth panel 652. One end of the elastic part 662 is integrally connected to the second connecting piece 6612, and the other end extends obliquely toward the integrated board 61. Multiple elastic parts 662 are arranged side by side along the length of the second connecting piece 6612. When the integrated board 61 is elastically snapped onto the fifth panel 652 by the conductive spring 66, the multiple elastic parts 662 are bent and deformed to ensure good contact between the integrated board 61 and the second grounding bracket 65.

[0044] In summary, the ultrasonic device provided in this application integrates the originally independently set ultrasonic board and probe board into a single integrated board 61. The ultrasonic main board area 611 and the probe board area 612 on the integrated board 61 are separated by a first grounding bracket 64 and a second grounding bracket 65. The first grounding bracket 64 is electrically in contact with the first shielding cover 62, and the second grounding bracket 65 is electrically in contact with the second shielding cover 63. This achieves electromagnetic shielding between the ultrasonic main board area 611 and the probe board area 612, ensuring that the electromagnetic shielding performance of the integrated board assembly 6 meets the requirements of the ultrasonic device for high-quality ultrasonic signals. It also reduces the number of shielding covers, thereby reducing material costs and shielding cover assembly steps.

[0045] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. An ultrasonic device, characterized in that, The system includes an integrated board assembly (6), which includes an integrated board (61), a first shielding cover (62), and a second shielding cover (63). The integrated board (61) is located between the first shielding cover (62) and the second shielding cover (63). The integrated board (61) has an ultrasound main board area (611) and a probe board area (612) separated by the shielding assembly. The shielding assembly is in electrical contact with the first shielding cover (62) and / or the second shielding cover (63) to achieve shielding between the ultrasound main board area (611) and the probe board area (612).

2. The ultrasonic device according to claim 1, characterized in that, The shielding assembly includes a first grounding bracket (64) and a second grounding bracket (65) located on opposite sides of the integrated board (61). One end of the first grounding bracket (64) is in contact with the integrated board (61) and the other end is in contact with the first shielding cover (62). One end of the second grounding bracket (65) is connected to the second shielding cover (63) and the other end is in contact with the integrated board (61) through an elastic conductive structure.

3. The ultrasonic device according to claim 2, characterized in that, The first grounding bracket (64) is a conductive metal bracket; the first grounding bracket (64) includes a first panel (641) that is in surface contact with the integrated board (61), a second panel (642) that is in surface contact with the first shield (62), and a third panel (643) integrally connected between the first panel (641) and the second panel (642).

4. The ultrasonic device according to claim 2, characterized in that, The second grounding bracket (65) is a conductive metal bracket; the second grounding bracket (65) includes a fourth panel (651) that is in surface contact with the second shield (63), and a fifth panel (652) that is integrally connected to the fourth panel (651) and extends toward the integrated board (61), and the elastic conductive structure is snapped between the fifth panel (652) and the integrated board (61).

5. The ultrasonic device according to claim 4, characterized in that, The elastic conductive structure is a conductive spring (66), which includes a spring body (661) and an elastic part (662). The spring body (661) is connected to the fifth panel (652). One end of the elastic part (662) is connected to the spring body (661), and the other end extends toward the integrated board (61). The elastic part (662) is in contact with the integrated board (61).

6. The ultrasonic device according to claim 5, characterized in that, The main body of the spring clip (661) includes a first connecting piece (6611), a second connecting piece (6612), and a third connecting piece (6613) located on different surfaces. The second connecting piece (6612) is attached to the end face of the fifth panel (652). One end of the elastic part (662) is connected to the second connecting piece (6612), and multiple elastic parts (662) are arranged side by side along the length direction of the second connecting piece (6612). The first connecting piece (6611) and the third connecting piece (6613) are respectively located on two sides of the fifth panel (652) in the thickness direction, and the first connecting piece (6611) and the third connecting piece (6613) elastically clamp the fifth panel (652) along the thickness direction of the fifth panel (652).

7. The ultrasonic device according to claim 2, characterized in that, The integrated board (61) is provided with a plurality of positioning holes (614), and the second shield (63) is provided with a plurality of positioning posts (672) on the side facing the integrated board (61) respectively extending into the corresponding positioning holes (614); the part of the first grounding bracket (64) that contacts the integrated board (61) is fixed on the positioning posts (672) by a connector (68).

8. The ultrasonic device according to any one of claims 2-7, characterized in that, The integrated board (61) has an exposed copper area (613) on one side facing the first shield (62) between the ultrasonic motherboard area (611) and the probe board area (612), and one end of the first grounding bracket (64) is connected to the exposed copper area (613).

9. The ultrasonic device according to claim 8, characterized in that, The exposed copper area (613) divides the integrated board (61) into an ultrasonic main board area (611) and a probe board area (612) distributed along the height direction. The probe board area (612) is located above the exposed copper area (613), and the ultrasonic main board area (611) is located below the exposed copper area (613).

10. The ultrasonic device according to any one of claims 1-7, characterized in that, The ultrasound motherboard area (611) is provided with a digital processing module, an ultrasound front-end analog signal processing module, a power supply module and a signal processing controller; the probe board area (612) is provided with a probe socket (69).

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