Semiconductor process exhaust gas purification treatment device
Patent Information
- Application Number
- CN202611225065.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-13
- Publication Date
- 2026-10-30
AI Technical Summary
[0019]一、本发明通过在排气管内设置叶轮,随着排气管内废气的流通,带动转轴转动,以带动三个推料板在下料筒内转动,并将存料箱内储存的干式吸附粉料通过送料管输入至排气管内,以使得干式吸附粉料与废气中的酸性气体产生化学反应,并将酸性气体变成无毒的CaF2颗粒,能够在废气进入洗涤塔之前对气体中的酸性气体进行中和处理,降低了后续洗涤塔工作时的负载,提高了废气净化处理的效率,并且干式吸附粉料的输送量与排气管内的废气流量呈正相关,无需外接电源或传感器即可自动按需投放干式吸附粉料,提升了半导体制程废气净化处理设备整体的净化效率。
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Figure CN122998932A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of waste gas purification technology, specifically to a semiconductor manufacturing waste gas purification and treatment device. Background Technology
[0002] With the rapid development of science and technology in my country, the semiconductor industry has become increasingly important in the national economy. However, the various chemical reactions generated during the semiconductor production process produce a large amount of waste gas. If this waste gas is discharged directly without treatment, it will cause serious harm to the environment.
[0003] Currently, most semiconductor component manufacturing workshops use simplified waste gas treatment equipment that introduces waste gas into a combustion chamber to decompose harmful substances (such as perfluorinated compounds) in the waste gas at high temperatures. The waste gas after high-temperature decomposition is then washed through a scrubbing tower before being discharged into the air.
[0004] However, the exhaust gas after high-temperature decomposition in the combustion chamber still contains some acidic gases (such as HF, HCl, etc.). If the acidic gases in the exhaust gas are not neutralized before entering the scrubbing tower, it will increase the burden on the subsequent scrubbing tower and reduce the efficiency of exhaust gas purification. Furthermore, after high-temperature decomposition in the combustion chamber, the salts generated in the exhaust gas (such as NH4F, CaSO4) are prone to forming scale on the exhaust pipe wall. If they are not treated in time, they will cause blockage of the exhaust pipe and affect the subsequent exhaust gas treatment. Summary of the Invention
[0005] The purpose of this invention is to provide a semiconductor manufacturing process waste gas purification and treatment device, which solves the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor process waste gas purification and treatment device, comprising a combustion chamber, an exhaust pipe fixedly connected to the surface of the combustion chamber, a storage box fixedly installed on the surface of the combustion chamber, two symmetrically arranged mounting blocks fixedly connected to the surface of the storage box, a drive box fixedly installed on the storage box via the two mounting blocks, a rotating rod rotatably connected to the inner wall of the drive box, a connecting plate fixedly connected to the surface of the rotating rod, a swing rod fixedly connected to the surface of the connecting plate, a striking ball fixedly installed at the end of the swing rod, a connecting pipe 1 fixedly connected to the lower surface of the storage box, an mounting plate 1 fixedly connected to the lower surface of the storage box, a feeding cylinder fixedly installed on the storage box via the mounting plate 1, an end of the connecting pipe 1 fixedly connected to the feeding cylinder, a second connecting pipe fixedly connected to the surface of the feeding cylinder, a feeding pipe fixedly connected to the surface of the second connecting pipe, and an end of the feeding pipe fixedly connected to the exhaust pipe;
[0007] The drive box is equipped with an auxiliary component for adjusting the feeding speed in the feeding cylinder according to the exhaust gas flow rate in the exhaust pipe;
[0008] The drive box is also equipped with a vibration component for driving the striking ball to repeatedly strike the outer wall of the exhaust pipe when the exhaust gas flow rate in the exhaust pipe reaches a threshold, so as to shake off the scale attached to the inner wall of the exhaust pipe.
[0009] Optionally, the auxiliary component includes a rotating shaft rotatably connected to the inner wall of the drive box, an impeller fixedly connected to the end of the rotating shaft extending into the exhaust pipe, and three pusher plates arranged in a circumferential array fixedly connected to the end of the rotating shaft extending into the feed cylinder.
[0010] Optionally, the inner wall of the storage box is fixedly connected with a guide plate one and a guide plate two, and the surface of the storage box is provided with a discharge port.
[0011] Optionally, a connecting ring is rotatably connected to the inner wall of the drive box, and a hollow disk is rotatably connected to the drive box through the connecting ring. A disc is fixedly connected to the surface of the rotating shaft, and two rectangular slots are symmetrically opened on the surface of the disc. A spring is provided on the inner wall of the rectangular slot, and an abutment block is fixedly connected to the end of the spring. Two symmetrically arranged abutment blocks are fixedly connected to the inner wall of the hollow disk. A clearance groove is opened on the surface of the drive box for the swing rod to extend and swing.
[0012] Optionally, the surface of the hollow disk is fixedly connected with a plurality of triangular teeth arranged in a circumferential array, and the surface of the connecting disk is fixedly connected with a toggle block.
[0013] Optionally, a circular housing is fixedly installed on the inner wall of the drive box, and a coil spring is provided at the end of the rotating rod that extends into the circular housing.
[0014] Optionally, the end of the exhaust pipe away from the combustion chamber is fixedly connected to a gas-gathering shroud, and two symmetrically arranged mounting plates are fixedly connected to the surface of the combustion chamber. A filter box is fixedly installed in the combustion chamber through the two mounting plates. A filter frame is fixedly installed on the inner wall of the filter box, and a filter screen is fixedly installed inside the filter frame. An exhaust pipe is fixedly connected to the surface of the filter box.
[0015] Optionally, the inner wall of the filter box is provided with two symmetrically arranged limiting grooves, and the inner walls of the two limiting grooves are slidably connected to limiting blocks. A rotating rod is rotatably connected between the two limiting blocks, and a cleaning cylinder is fixedly connected to the surface of the rotating rod.
[0016] Optionally, a motor is provided on the surface of the filter box, and a threaded rod is fixedly connected to the output shaft of the motor. The threaded rod passes through a limiting block and is threadedly connected to it. A gear is fixedly connected to the surface of the rotating rod, and a rack and pinion that meshes with the gear is fixedly connected to the inner wall of the filter box.
[0017] Optionally, the filter box has a drain outlet on its surface, a waste bin is fixedly connected to the lower surface of the filter box, a drawer is slidably connected to the inner wall of the waste bin, and a pull ring is fixedly connected to the surface of the drawer.
[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0019] I. This invention, by installing an impeller inside the exhaust pipe, drives the rotating shaft to rotate as the exhaust gas flows through the pipe, thereby rotating three pusher plates inside the feeding cylinder. The dry adsorption powder stored in the storage bin is then fed into the exhaust pipe through the feeding pipe. This allows the dry adsorption powder to chemically react with the acidic gases in the exhaust gas, transforming them into non-toxic CaF2 particles. This neutralizes the acidic gases in the exhaust gas before it enters the scrubbing tower, reducing the load on the subsequent scrubbing tower and improving the efficiency of exhaust gas purification. Furthermore, the amount of dry adsorption powder delivered is positively correlated with the exhaust gas flow rate in the exhaust pipe. The dry adsorption powder can be automatically added as needed without an external power supply or sensor, thus improving the overall purification efficiency of the semiconductor process exhaust gas purification equipment.
[0020] II. As the production speed of semiconductor components in the manufacturing workshop increases, the amount of waste gas generated will also increase. Therefore, the power of the combustion chamber will increase, thereby increasing the flow rate of waste gas in the exhaust pipe. When the flow rate of waste gas in the exhaust pipe reaches the threshold, under the linkage of multiple structures, the striking ball at the end of the swing rod can be driven to reciprocate to strike the exhaust pipe, causing it to vibrate. When the vibration is transmitted to the inner wall of the exhaust pipe, it can shake off the salt scale on the inner wall of the exhaust pipe. The scale shaken off will be discharged from the exhaust pipe with the high-velocity waste gas, avoiding the blockage of the exhaust pipe by salt scale, ensuring the exhaust effect of the exhaust pipe, and thus ensuring the long-term use of the waste gas purification and treatment equipment.
[0021] Third, this invention, by turning on the motor and driving the threaded rod to rotate, and through the linkage of multiple structures, drives the cleaning cylinder to move and rotate on the surface of the filter screen while cleaning. This effectively cleans the salt scale and large particulate impurities that fall onto the filter screen surface and pushes them into the drain outlet. This achieves the effect of conveniently cleaning the filter screen and centrally collecting waste materials, ensuring the long-term stable operation of the waste gas purification equipment, and realizing efficient, intelligent and low-maintenance waste gas purification treatment effect, which is worthy of promotion and use. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural diagram of a semiconductor process waste gas purification and treatment device provided by the present invention.
[0023] Figure 2 This is a cross-sectional view of the exhaust pipe structure in a semiconductor manufacturing waste gas purification and treatment device provided by the present invention.
[0024] Figure 3 The present invention provides a semiconductor manufacturing process waste gas purification and treatment device. Figure 2 Enlarged view of point A in the middle.
[0025] Figure 4 This is a cross-sectional view of the material storage box structure in a semiconductor process waste gas purification and treatment device provided by the present invention.
[0026] Figure 5 A cross-sectional view of the drive box structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention. Figure 1 .
[0027] Figure 6 A cross-sectional view of the drive box structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention. Figure 2 .
[0028] Figure 7 The present invention provides a semiconductor manufacturing process waste gas purification and treatment device. Figure 6 Enlarged view of point B in the middle.
[0029] Figure 8 This is a cross-sectional view of the circular shell structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention.
[0030] Figure 9 A cross-sectional view of the filter box structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention. Figure 1 .
[0031] Figure 10 The present invention provides a semiconductor manufacturing process waste gas purification and treatment device. Figure 9 Enlarged view of point C in the middle.
[0032] Figure 11 A cross-sectional view of the filter box structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention. Figure 2 .
[0033] Figure 12 A cross-sectional view of the filter box structure in a semiconductor process exhaust gas purification and treatment device provided by the present invention. Figure 3 .
[0034] In the diagram: 1. Combustion chamber; 2. Exhaust pipe; 3. Storage bin; 4. Mounting block; 5. Drive box; 6. Feeding pipe; 7. Gas concentrator; 8. Filter box; 9. Gas outlet pipe; 10. Mounting plate two; 11. Waste bin; 12. Drawer; 13. Pull ring; 14. Striking ball; 15. Impeller; 16. Shaft; 17. Guide plate one; 18. Guide plate two; 19. Drain outlet; 20. Filter frame; 22. Filter screen; 23. Discharge port; 24. Connecting pipe one; 25. Mounting plate one; 26. Feeding cylinder; 27. 1. Connecting pipe II; 28. Push plate; 29. Hollow disc; 30. Circular disc; 31. Connecting disc; 32. Circular shell; 33. Actuating block; 34. Swing rod; 35. Rotating rod I; 36. Triangular tooth; 37. Connecting ring; 38. Abutting block II; 39. Spring; 40. Abutting block I; 41. Rectangular slot; 42. Coil spring; 43. Leaving groove; 44. Limiting block; 45. Limiting groove; 46. Threaded rod; 47. Rack and pinion; 48. Gear; 49. Cleaning cylinder; 50. Rotating rod II; 51. Motor. Detailed Implementation
[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0036] Example 1:
[0037] Please see Figures 1 to 12This invention provides a technical solution: a semiconductor process waste gas purification and treatment device, including a combustion chamber 1, an exhaust pipe 2 fixedly connected to the surface of the combustion chamber 1, a storage box 3 fixedly installed on the surface of the combustion chamber 1, two symmetrically arranged mounting blocks 4 fixedly connected to the surface of the storage box 3, a drive box 5 fixedly installed on the storage box 3 through the two mounting blocks 4, a rotating rod 35 rotatably connected to the inner wall of the drive box 5, a connecting plate 31 fixedly connected to the surface of the rotating rod 35, a swing rod 34 fixedly connected to the surface of the connecting plate 31, a striking ball 14 fixedly installed at the end of the swing rod 34, a connecting pipe 24 fixedly connected to the lower surface of the storage box 3, and the lower surface of the storage box 3... A mounting plate 25 is fixedly connected to the material storage box 3. A feeding cylinder 26 is fixedly installed on the material storage box 3 via the mounting plate 25. The end of the connecting pipe 24 is fixedly connected to the feeding cylinder 26. A connecting pipe 27 is fixedly connected to the surface of the feeding cylinder 26. A feeding pipe 6 is fixedly connected to the surface of the connecting pipe 27. The end of the feeding pipe 6 is fixedly connected to the exhaust pipe 2. An auxiliary component is provided in the drive box 5 for adjusting the feeding speed in the feeding cylinder 26 according to the exhaust gas flow rate in the exhaust pipe 2. A vibration component is also provided in the drive box 5 for driving the striking ball 14 to reciprocate to strike the outer wall of the exhaust pipe 2 when the exhaust gas flow rate in the exhaust pipe 2 reaches a threshold, so as to shake off the scale attached to the inner wall of the exhaust pipe 2.
[0038] The auxiliary components include a rotating shaft 16 rotatably connected to the inner wall of the drive box 5, an impeller 15 fixedly connected to the end of the rotating shaft 16 that extends into the exhaust pipe 2, and three pusher plates 28 arranged in a circular array fixedly connected to the end of the rotating shaft 16 that extends into the feed cylinder 26.
[0039] The inner wall of the storage box 3 is fixedly connected with a guide plate 17 and a guide plate 28, and the surface of the storage box 3 is provided with a discharge port 23.
[0040] A connecting ring 37 is rotatably connected to the inner wall of the drive box 5. A hollow disk 29 is rotatably connected to the drive box 5 via the connecting ring 37. A disc 30 is fixedly connected to the surface of the rotating shaft 16. Two rectangular slots 41 are symmetrically opened on the surface of the disc 30. A spring 39 is provided on the inner wall of the rectangular slot 41. An abutment block 40 is fixedly connected to the end of the spring 39. Two symmetrically arranged abutment blocks 38 are fixedly connected to the inner wall of the hollow disk 29. A clearance groove 43 is opened on the surface of the drive box 5 for the swing rod 34 to extend and swing.
[0041] The surface of the hollow disc 29 is fixedly connected with a plurality of triangular teeth 36 arranged in a circular array, and the surface of the connecting disc 31 is fixedly connected with a toggle block 33.
[0042] A circular housing 32 is fixedly installed on the inner wall of the drive box 5, and a coil spring 42 is provided at the end of the rotating rod 35 that extends into the circular housing 32.
[0043] The end of the exhaust pipe 2 away from the combustion chamber 1 is fixedly connected to a gas-concentrating shroud 7. Two symmetrically arranged mounting plates 10 are fixedly connected to the surface of the combustion chamber 1. A filter box 8 is fixedly installed in the combustion chamber 1 through the two mounting plates 10. A filter frame 20 is fixedly installed on the inner wall of the filter box 8. A filter screen 22 is fixedly installed inside the filter frame 20. An exhaust pipe 9 is fixedly connected to the surface of the filter box 8.
[0044] More specifically, in this embodiment, when used: as follows Figure 1 and Figure 2 As shown, the waste gas generated during the semiconductor manufacturing process first enters the combustion chamber 1 for high-temperature decomposition. After being decomposed at high temperature in the combustion chamber 1, the waste gas passes through the exhaust pipe 2 and the filter box 8, and finally enters the scrubbing tower through the exhaust pipe 9 for washing. The high-temperature decomposition of the waste gas in the combustion chamber 1 and the washing operation in the scrubbing tower are relatively mature existing technologies in the field of waste gas treatment, and will not be described in detail here.
[0045] As the exhaust gas flows through the exhaust pipe 2, it drives the impeller 15 and the shaft 16 to rotate, such as Figure 3 and Figure 4 As shown, with the rotation of the shaft 16, the three pusher plates 28 in the feed cylinder 26 will rotate, so that the dry adsorption powder (such as quicklime Ca(OH)2 powder) stored in the storage box 3 can be fed into the exhaust pipe 2 through the feed pipe 6 and react with the acidic gas in the exhaust pipe 2 as follows: 2HF + Ca(OH)2 → CaF2 + 2H2O, so that the acidic gas in the exhaust gas is chemically converted into non-toxic CaF2 particles, so that the acidic gas in the gas can be neutralized before the exhaust gas enters the scrubbing tower, thereby reducing the load on the subsequent scrubbing tower and improving the efficiency of exhaust gas purification.
[0046] It should be noted that the guide plate 17 and guide plate 18 installed in the storage box 3 allow the dry adsorption powder in the storage box 3 to slide down into the discharge cylinder 26 through the discharge port 23 and the connecting pipe 24 under the action of gravity. As the production speed of semiconductor components in the manufacturing workshop increases, the amount of waste gas generated will increase. Therefore, the power of the combustion chamber 1 will increase, so as to increase the flow rate of waste gas in the exhaust pipe 2 and drive the impeller 15 and the rotating shaft 16 to increase the rotation speed of the three pusher plates 28. Thus, more dry adsorption powder can be delivered into the exhaust pipe 2 per unit time to neutralize the waste gas in the exhaust pipe 2. That is, the amount of dry adsorption powder delivered is positively correlated with the flow rate of waste gas in the exhaust pipe 2. There is no need to manually adjust the valve, realizing mechanical "automatic tracking" feeding.
[0047] like Figure 5 , such as 6 and Figure 7As shown, when the amount of exhaust gas discharged from the exhaust pipe 2 is small, the amount of exhaust gas can only drive the impeller 15 and the rotating shaft 16 to rotate at a low speed. As the rotating shaft 16 rotates, it drives the disc 30 to rotate synchronously. However, at this time, the centrifugal force received by the two abutting blocks 40 is insufficient to overcome the elastic potential energy of the spring 39. At this time, the abutting block 40 will not extend into the hollow disc 29 to abut against the abutting block 38. That is, the hollow disc 29 will not rotate at this time.
[0048] As the power of combustion chamber 1 increases, when the exhaust gas flow rate in exhaust pipe 2 reaches the threshold, the rotation speed of impeller 15, shaft 16 and disc 30 increases. As the rotation speed of disc 30 increases, the centrifugal force on the two abutting blocks 40 can overcome the elastic potential energy of spring 39. At this time, the two abutting blocks 40 will extend to the position of abutting block 38 inside hollow disc 29 under the action of centrifugal force. At this time, the rotation of shaft 16 can drive hollow disc 29 to rotate synchronously.
[0049] As the hollow disc 29 rotates, it drives multiple triangular teeth 36 to rotate in a circle around the center of the hollow disc 29. As the triangular teeth 36 rotate, they move the actuating block 33. As the actuating block 33 moves, it drives the connecting disc 31 and the rotating rod 35 to rotate slightly. At the same time, the coil spring 42, which extends into the circular housing 32, begins to store energy. When a triangular tooth 36 disengages from the actuating block 33, the elastic potential energy of the coil spring 42 causes the connecting disc 31 and the rotating rod 35 to rotate in the opposite direction and reset, so that the actuating block 33 contacts the next triangular tooth 36 again, and the above motion process is repeated.
[0050] That is, as the hollow disc 29 rotates, the connecting disc 31 and the rotating rod 35 will reciprocate, which will cause the striking ball 14 at the end of the swing rod 34 to reciprocate to strike the exhaust pipe 2, so as to shake off the salt scale on the inner wall of the exhaust pipe 2. Since the exhaust gas velocity in the exhaust pipe 2 is high at this time, the shaken-off salt scale will be discharged from the exhaust pipe 2 along with the high-velocity exhaust gas, so as to avoid such substances adhering to the inner wall of the exhaust pipe 2 and blocking the exhaust pipe 2, thus affecting the exhaust effect.
[0051] It should be noted that when the exhaust gas flow rate in exhaust pipe 2 increases, the high temperature will also increase the amount of salt scale formation on the pipe wall of exhaust pipe 2. Therefore, simply tapping when the exhaust gas flow rate in exhaust pipe 2 reaches the threshold can effectively remove the scale on the pipe wall of exhaust pipe 2, avoiding unnecessary mechanical wear.
[0052] like Figure 2 and Figure 9As shown, the salt scale that is shaken off will enter the filter box 8 along with the high-velocity exhaust gas and adhere to the surface of the filter screen 22. Under the filtering action of the filter screen 22, other large particulate impurities in the exhaust gas can also be filtered, and the exhaust gas will pass through the filter screen 22 and be discharged to the next purification process through the exhaust pipe 9.
[0053] Furthermore, the inner wall of the filter box 8 is provided with two symmetrically arranged limiting grooves 45. The inner walls of the two limiting grooves 45 are slidably connected to limiting blocks 44. The two limiting blocks 44 are rotatably connected to a rotating rod 50. A cleaning cylinder 49 is fixedly connected to the surface of the rotating rod 50.
[0054] A motor 51 is mounted on the surface of the filter box 8. The output shaft of the motor 51 is fixedly connected to a threaded rod 46. The threaded rod 46 passes through a limit block 44 and is threadedly connected to it. A gear 48 is fixedly connected to the surface of the rotating rod 50. A rack 47 that meshes with the gear 48 is fixedly connected to the inner wall of the filter box 8.
[0055] The filter box 8 has a drain port 19 on its surface. The lower surface of the filter box 8 is fixedly connected to a waste box 11. The inner wall of the waste box 11 is slidably connected to a drawer 12. The surface of the drawer 12 is fixedly connected to a pull ring 13.
[0056] More specifically, in this embodiment, when used: as follows Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the motor 51 is periodically turned on, driving the threaded rod 46 to rotate. Since the limiting block 44 is limited, it can only slide within the limiting groove 45. As the threaded rod 46 rotates, it will drive the limiting block 44, the rotating rod 50, and the cleaning cylinder 49 to slide horizontally above the filter screen 22. As the rotating rod 50 moves, under the meshing action of the gear 48 and the rack 47, it will drive the cleaning cylinder 49 to rotate while moving, thereby cleaning the salt scale and large particles of impurities attached to the surface of the filter screen 22. As the cleaning cylinder 49 moves, when the cleaning cylinder 49 is separated from the filter screen 22, it can push the salt scale and large particles of impurities into the drain port 19. The salt scale and large particles of impurities will fall into the waste bin 11 under the action of gravity. By pulling the pull ring 13, the drawer 12 can be pulled out from the waste bin 11, so that the salt scale and large particles of impurities can be collected and treated uniformly.
[0057] It should be noted that: all the above-mentioned electrical equipment is electrically connected to the control terminal via wires, and the control terminal can be set as a PLC logic controller. This is existing technology. The specific structure, working principle, and possible control methods and spatial arrangement of these technical features can be selected using conventional methods in this field. This technical solution will not be further elaborated in detail.
[0058] Working Principle: This semiconductor manufacturing process waste gas purification equipment operates by rotating the impeller 15 and shaft 16 as waste gas flows through the exhaust pipe 2. This, in turn, rotates the three pusher plates 28 within the feeding cylinder 26, feeding the dry adsorption powder stored in the storage bin 3 into the exhaust pipe 2 via the feeding pipe 6. This process chemically reacts the acidic gases in the waste gas into non-toxic CaF2 particles, neutralizing the acidic gases before they enter the scrubbing tower. This reduces the load on the subsequent scrubbing tower and improves the efficiency of waste gas purification. Furthermore, the method of feeding the powder into the feeding cylinder 26 via the impeller 15 ensures a positive correlation between the amount of dry adsorption powder delivered and the flow rate of the waste gas in the exhaust pipe 2. The equipment can automatically and on-demand dispensing of dry adsorption powder without the need for an external power supply or sensors, precisely neutralizing acidic gases and improving the overall purification efficiency of the equipment.
[0059] As the power in combustion chamber 1 increases, when the exhaust gas flow rate in exhaust pipe 2 reaches the threshold, the connecting plate 31 and rotating rod 35 are driven to reciprocate under the linkage of multiple structures. This causes the striking ball 14 at the end of the swing rod 34 to reciprocate to strike the exhaust pipe 2, causing the exhaust pipe 2 to vibrate. When the vibration is transmitted to the inner wall of the exhaust pipe 2, it can shake off the salt scale on the inner wall of the exhaust pipe 2. The shaken-off salt scale will be discharged from the exhaust pipe 2 along with the high-velocity exhaust gas, so as to avoid blockage of the exhaust pipe 2 wall, ensure the exhaust effect of the exhaust pipe 2, and thus ensure the long-term use of the exhaust gas purification and treatment equipment.
[0060] By periodically turning on the motor 51, the threaded rod 46 is driven to rotate, causing the cleaning cylinder 49 to slide above the filter screen 22. Under the meshing action of the gear 48 and the rack and pinion 47, the cleaning cylinder 49 rotates while moving, thus cleaning the salt scale and large particulate impurities attached to the surface of the filter screen 22 and pushing them into the drain port 19. This achieves the effect of conveniently cleaning the filter screen 22 and centrally collecting waste materials, further ensuring the long-term stable operation of the exhaust gas purification equipment and realizing efficient, intelligent and low-maintenance exhaust gas purification effect.
[0061] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A semiconductor manufacturing process waste gas purification and treatment device, comprising a combustion chamber (1), characterized in that: An exhaust pipe (2) is fixedly connected to the surface of the combustion chamber (1). A storage box (3) is fixedly installed on the surface of the combustion chamber (1). Two symmetrically arranged mounting blocks (4) are fixedly connected to the surface of the storage box (3). A drive box (5) is fixedly installed on the storage box (3) through the two mounting blocks (4). A rotating rod (35) is rotatably connected to the inner wall of the drive box (5). A connecting plate (31) is fixedly connected to the surface of the rotating rod (35). A swing rod (34) is fixedly connected to the surface of the connecting plate (31). A swing rod (34) is fixedly installed at the end of the swing rod (34). The lower surface of the storage box (3) is fixedly connected to the connecting pipe (24), the lower surface of the storage box (3) is fixedly connected to the mounting plate (25), the storage box (3) is fixedly installed with the discharge cylinder (26) through the mounting plate (25), the end of the connecting pipe (24) is fixedly connected to the discharge cylinder (26), the surface of the discharge cylinder (26) is fixedly connected to the connecting pipe (27), the surface of the connecting pipe (27) is fixedly connected to the feeding pipe (6), and the end of the feeding pipe (6) is fixedly connected to the exhaust pipe (2). The drive box (5) is equipped with an auxiliary component for adjusting the feeding speed in the feeding cylinder (26) according to the exhaust gas flow rate in the exhaust pipe (2); The drive box (5) is also provided with a vibration component for driving the striking ball (14) to repeatedly strike the outer wall of the exhaust pipe (2) when the exhaust gas flow rate in the exhaust pipe (2) reaches a threshold, so as to shake off the scale attached to the inner wall of the exhaust pipe (2).
2. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 1, characterized in that: The auxiliary components include a rotating shaft (16) rotatably connected to the inner wall of the drive box (5), an impeller (15) fixedly connected to the end of the rotating shaft (16) extending into the exhaust pipe (2), and three pusher plates (28) arranged in a circular array fixedly connected to the end of the rotating shaft (16) extending into the feed cylinder (26).
3. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 1, characterized in that: The inner wall of the storage box (3) is fixedly connected with a guide plate one (17) and a guide plate two (18), and the surface of the storage box (3) is provided with a discharge port (23).
4. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 2, characterized in that: The inner wall of the drive box (5) is rotatably connected to a connecting ring (37). The drive box (5) is rotatably connected to a hollow disk (29) via the connecting ring (37). A disc (30) is fixedly connected to the surface of the rotating shaft (16). Two rectangular slots (41) are symmetrically opened on the surface of the disc (30). A spring (39) is provided on the inner wall of the rectangular slot (41). An abutment block (40) is fixedly connected to the end of the spring (39). Two abutment blocks (38) are fixedly connected to the inner wall of the hollow disk (29). A clearance groove (43) is opened on the surface of the drive box (5) for the swing rod (34) to extend and swing.
5. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 4, characterized in that: The surface of the hollow disk (29) is fixedly connected with a plurality of triangular teeth (36) arranged in a circumferential array, and the surface of the connecting disk (31) is fixedly connected with a toggle block (33).
6. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 5, characterized in that: A circular housing (32) is fixedly installed on the inner wall of the drive box (5), and a coil spring (42) is provided at the end of the rotating rod (35) that extends into the circular housing (32).
7. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 1, characterized in that: The exhaust pipe (2) is fixedly connected to a gas-gathering shroud (7) at the end away from the combustion chamber (1). Two symmetrically arranged mounting plates (10) are fixedly connected to the surface of the combustion chamber (1). A filter box (8) is fixedly installed in the combustion chamber (1) through the two mounting plates (10). A filter frame (20) is fixedly installed on the inner wall of the filter box (8). A filter screen (22) is fixedly installed inside the filter frame (20). An exhaust pipe (9) is fixedly connected to the surface of the filter box (8).
8. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 7, characterized in that: The filter box (8) has two symmetrically arranged limiting grooves (45) on its inner wall. The inner walls of the two limiting grooves (45) are slidably connected to limiting blocks (44). The two limiting blocks (44) are rotatably connected to a rotating rod (50). A cleaning cylinder (49) is fixedly connected to the surface of the rotating rod (50).
9. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 8, characterized in that: The surface of the filter box (8) is provided with a motor (51), the output shaft of the motor (51) is fixedly connected with a threaded rod (46), the threaded rod (46) passes through a limiting block (44) and is threadedly connected to it, the surface of the rotating rod (50) is fixedly connected with a gear (48), and the inner wall of the filter box (8) is fixedly connected with a rack (47) that meshes with the gear (48).
10. The semiconductor manufacturing process waste gas purification and treatment equipment according to claim 9, characterized in that: The filter box (8) has a drain port (19) on its surface. The lower surface of the filter box (8) is fixedly connected to a waste box (11). The inner wall of the waste box (11) is slidably connected to a drawer (12). The surface of the drawer (12) is fixedly connected to a pull ring (13).
