A microfluidic chip clamp

Abstract

The application relates to the technical field of micro-fluidic chips, and relates to a micro-fluidic chip clamp. The clamp comprises a base for accommodating a chip, a flip cover hinged to the base, and a horizontal adjusting assembly. The base is provided with an accommodating groove for accommodating the chip, and a support plate for placing the chip is arranged in the accommodating groove. The horizontal adjusting assembly is installed on the base and connected with the support plate, and is used for adjusting the horizontal angle of the support plate. The horizontal angle of the support plate is adjusted through the horizontal adjusting assembly, the problem of local poor adhesion caused by uneven thickness of the chip is solved, the pressure on each part of the chip is uniform, and the risk of liquid leakage is reduced, so that the chip with uneven thickness is adapted, and the sealing reliability is improved. Through the pressure sensor, the pressure between the chip and the flip cover can be monitored in real time, human error and the risk of chip deformation are reduced. The pressure feedback ensures that the clamping degree is consistent between batches, and the repeatability and comparability of experimental results are improved.

Description

Technical Field

[0001] This application relates to the field of microfluidic chip technology, and more specifically, to a microfluidic chip fixture. Background Technology

[0002] Microfluidics is a technology that manipulates tiny volumes of fluid within micrometer-scale channels to achieve specific functions. After decades of development, it has been widely applied in fields such as biology, chemistry, and environmental monitoring. Microfluidic chips are the core components of microfluidics, and their performance directly affects experimental results. Currently, the main methods for fabricating micrometer-scale channels within chips include PDMS (polydimethylsiloxane) casting, injection molding, and imprinting based on soft lithography. Among these, PDMS chips are the most widely used in the pre-research and testing stages due to their advantages such as short fabrication cycle, good optical transparency, good biocompatibility, and low cost. PDMS chip peripherals mainly include fluid drive devices (such as syringe pumps, peristaltic pumps, diaphragm pumps, etc.), connecting pipes, chip connection interfaces, and reservoirs and waste reservoirs. The chip connection interface directly determines the connection method between the peripherals and the chip. Currently, there are two main methods for connecting PDMS chips: one is the steel pin insertion method, where one end of the connecting tube is connected to the pump, and the other end is directly inserted into the chip's punched hole via a steel pin, allowing liquid to be introduced into the chip; the other is the chip clamping method, where the chip is clamped in a clamp, and the connecting tube is connected to an interface on the clamp, relying on the elasticity of PDMS to press the chip and clamp together to form a seal. The main difference between the two methods lies in whether the connecting tube and the chip are directly connected via a steel pin, and whether a clamp is used to achieve the connection and seal. The steel pin insertion method has a simple structure and is easy to adjust, but as the number of chips increases in experiments and the tubing becomes intertwined, problems such as incorrect insertion and leakage are prone to occur. The chip clamping method can avoid repeated insertion, but existing flip-type chip clamps usually require the holes on the flip to correspond one-to-one with the punched positions on the chip, thus requiring a high degree of specialization in the clamp.

[0003] During PDMS chip fabrication, especially when using manual molding or spin coating processes, batch-to-batch thickness inconsistencies or uneven thickness within the same chip are common. Chip fixtures rely on the elasticity of PDMS for sealing. When these thickness differences exist, two problems arise: first, uneven thickness within the same chip makes it difficult to fully compress thinner areas, leading to leakage; second, inconsistent chip thickness between batches results in inconsistent clamping tightness after fixture closure, significantly impacting pressure-sensitive chips. Particularly for chips with large channel width-to-height ratios, excessive clamping can cause significant channel deformation, altering flow resistance and even causing blockages, thus affecting the consistency of experimental results or chip performance. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of existing chip fixtures that cannot adapt to uneven chip thickness, and to provide a microfluidic chip fixture that can adapt to uneven chip thickness, thereby improving the reliability of sealing and the consistency of chip performance.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A microfluidic chip fixture is provided, including a base for accommodating a chip and a flip cover hinged to the base; it also includes a horizontal adjustment component; the base is provided with a receiving groove for accommodating the chip, and a support plate for placing the chip is provided in the receiving groove; the horizontal adjustment component is installed on the base and connected to the support plate for adjusting the horizontal angle of the support plate.

[0006] This invention discloses a microfluidic chip clamp, employing a flip-top type. The base has a receiving groove, within which a support plate is positioned horizontally. A horizontal adjustment component is mounted on the base and connected to the bottom of the support plate. Adjusting the horizontal adjustment component allows for adjustment of the support plate's horizontal tilt angle. In use, the chip is placed on the support plate, and the flip-top is closed and pressed tightly. The flip-top and support plate together clamp the chip, utilizing the elasticity of the PDMS chip to achieve a seal. When chip thickness varies due to manufacturing processes, the horizontal adjustment component can be adjusted to change the tilt direction and horizontal angle of the support plate, compensating for localized poor adhesion caused by uneven chip thickness. This allows for adaptation to chips with varying thicknesses, improving the reliability of the seal.

[0007] Furthermore, the horizontal adjustment assembly includes a support ball, several springs, and several adjusting screws. The support ball is mounted on the base, with its top abutting against the bottom of the support plate. The several springs are spaced apart between the base and the support plate, with both ends of each spring connected to the base and the support plate respectively. The adjusting screws are threadedly connected to the base, with their tops abutting against the bottom of the support plate. The support ball maintains a constant distance between the base and the support plate, serving as a support point for angle adjustment. The springs provide a limit to prevent horizontal displacement of the support plate. By rotating the adjusting screws at different positions, the distance between the support plate and the base at that position is changed, thereby changing the tilt direction and tilt angle of the support plate.

[0008] Furthermore, at least three adjusting screws are provided, and each adjusting screw is surrounded by at least one spring, which is in a stretched state. The support ball and the three adjusting screws form four support points of the support plate, and the line connecting the four support points forms a quadrilateral. A spring is placed next to each adjusting screw, and the spring is always in a stretched state, ensuring that the support plate always has a downward pulling force, thereby guaranteeing that the support plate is always in contact with the upper end of the adjusting screw. The support ball and the three adjusting screws are located at the four corners of the quadrilateral. The support ball acts as a corner support, and by adjusting the three adjusting screws, the height at the three corners can be changed, thereby achieving adjustment of the horizontal angle and tilt direction of the support plate.

[0009] Furthermore, the support plate has a rectangular structure, and the support ball and the three adjusting screws are located at the four corners of the support plate; a gap is provided between the perimeter of the support plate and the inner wall of the receiving groove. The gap between the support plate and the inner wall of the receiving groove facilitates the adjustment of the tilt angle of the support plate.

[0010] Furthermore, a first threaded through hole is provided on the base, and the adjusting screw passes through the first threaded through hole and is threadedly connected to the first threaded through hole; the top end of the adjusting screw has a spherical structure.

[0011] Furthermore, the upper surface of the support plate and the lower surface of the flip cover are both smooth planar structures.

[0012] Furthermore, a pressure sensor is provided on the lower surface of the flip cover. The thin-film pressure sensor on the lower surface of the flip cover is used to detect the bonding pressure between the chip and the lower surface of the flip cover. Preferably, pressure sensors can be placed at at least four corners of the support plate to ensure that the pressure at each corner remains equal. The use of the pressure sensor in conjunction with the leveling adjustment component can better adapt to chips with uneven thickness, ensuring that all positions of the chip maintain the same pressure, and also guaranteeing the performance consistency of different batches of chips.

[0013] Furthermore, the lower surface of the flip cover is provided with a platform for pressing the chip; multiple through holes are spaced apart on the flip cover, and a second threaded through hole communicating with the through hole is provided on the upper surface of the flip cover at the position of the through hole; an annular boss is provided on the platform on the lower surface of the flip cover along the through hole. The platform protrudes slightly downward, and when the flip cover is closed, the platform is located in the receiving groove, which can better clamp the chip. The second threaded through hole is used to connect to an external pipe. When closed, the through hole corresponds to the hole on the chip. An annular boss is provided around the through hole, and the inner diameter of the annular boss is slightly larger than the inner diameter of the hole on the chip. This setting can better fit tightly with the hole on the chip, achieve airtightness, and provide redundancy for chip clamp adjustment.

[0014] Furthermore, it also includes a locking component for locking the base and the flip cover when the flip cover is closed.

[0015] Furthermore, the locking assembly includes a limiting slot on the flip cover, a threaded hole on the base corresponding to the position of the limiting slot, and a locking bolt. Multiple limiting slots are spaced apart along the edge of the flip cover, and multiple threaded holes are correspondingly provided on the base. After the flip cover is closed, the locking screw passes through the limiting slots and threaded holes in sequence to lock the flip cover and the base.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. The microfluidic chip fixture of the present invention solves the problem of poor local bonding caused by uneven chip thickness by setting a horizontal adjustment component to adjust the horizontal angle of the support plate, thereby making the chip uniformly pressurized and reducing the risk of leakage; thus adapting to chips with uneven thickness and improving sealing reliability.

[0017] 2. The microfluidic chip fixture of the present invention, by setting a pressure sensor, can monitor the pressure between the chip and the flip cover in real time, avoiding reliance solely on the locking status of the latches or the operator's experience to judge the clamping degree, thus reducing human error and the risk of chip deformation. Pressure feedback ensures consistent clamping degree between batches, improving the repeatability and comparability of experimental results; it can also be used in conjunction with a horizontal adjustment component to ensure equal pressure at different locations on the chip. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a microfluidic chip fixture in one embodiment; Figure 2 This is a schematic diagram of the flip cover from a first-view perspective in one embodiment; Figure 3 This is a schematic diagram of the second-view structure of the flip cover in one embodiment; Figure 4 This is a schematic diagram of the base structure in another embodiment; Figure 5 This is a schematic diagram of the installation of the support plate and the horizontal adjustment assembly in one embodiment; Figure 6 This is a schematic diagram of the installation of the horizontal adjustment component in one embodiment; Figure 7 This is a schematic diagram of the bottom structure of the base in one embodiment.

[0019] In the attached diagram: 1. Base; 2. Flip cover; 3. Support plate; 4. Support ball; 5. Adjusting screw; 6. Spring; 7. Second threaded through hole; 8. Annular boss; 9. Platform; 10. Limiting slot; 11. Threaded hole; 12. Pressure sensor. Detailed Implementation

[0020] The present invention will be further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only, representing schematic diagrams rather than actual physical objects, and should not be construed as limiting the invention. To better illustrate the embodiments of the invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0021] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] Example 1 This embodiment is a first embodiment of a microfluidic chip fixture, such as... Figures 1 to 7 As shown, the device includes a base 1, a flip cover 2, a horizontal adjustment assembly, a thin-film pressure sensor 12, and a locking assembly. The base 1 has a receiving groove for holding the PDMS chip, and a support plate 3 is horizontally arranged within the receiving groove. The horizontal adjustment assembly is mounted on the base 1, located between the base 1 and the support plate 3, and is used to adjust the horizontal tilt angle of the support plate 3 to accommodate chips with uneven thickness. The flip cover 2 is rotatably connected to the base 1 via a pivot. When closed, the flip cover 2 and the support plate 3 together clamp the chip, and the elasticity of the PDMS chip itself achieves a seal. The locking assembly is used to lock the flip cover 2 and the base 1 after the flip cover 2 is closed. A through hole is also provided on the flip cover 2, corresponding to the position of the hole on the chip. The pressure sensor 12 is located on the lower surface of the flip cover 2 and is used to detect the contact pressure between the chip and the lower surface of the flip cover 2.

[0023] like Figures 1 to 3 As shown, the flip cover 2 is rectangular in shape and made of aluminum alloy, with its planar dimensions slightly larger than the chip size. One side of the flip cover 2 is hinged to the base 1 via a pivot, and a locking assembly is installed on the other side.

[0024] In this embodiment, both the upper and lower surfaces of the flip cover 2 are flat. Through holes are spaced apart on the flip cover 2. At the location of each through hole, a threaded hole 11 for connecting an external pipe is provided on the upper surface of the flip cover 2, allowing connection to the external pipe via a threaded adapter. An annular boss 8 is provided around the through holes on the lower surface of the flip cover 2. The inner hole of the boss communicates with the through holes and the threaded hole 11, and its size is slightly larger than the chip drilling size, ensuring a tight fit with the chip drilling area and achieving an airtight seal.

[0025] like Figure 1 , Figures 4 to 7 As shown, the base 1 is rectangular, made of aluminum alloy, and its length and width are the same as the flip cover 2. A perimeter fence surrounds the upper surface of the base 1, forming a receiving groove for limiting the chip's position. The support plate 3 is placed horizontally within the receiving groove and is fixed in place using a leveling adjustment assembly. A certain gap is provided between the support plate 3 and the perimeter fence to accommodate adjustments to the horizontal angle. The upper surface of the support plate 3 is also a smooth plane.

[0026] It should be noted that the specific shapes of the base 1, the receiving groove, the support plate 3, and the flip cover 2 are not limited to rectangles. Those skilled in the art can make changes according to the chip or actual needs. For example, when the chip has a circular structure, the receiving groove, the support plate 3, and the flip cover 2 can be set to be circular to adapt to the shape of the chip.

[0027] like Figure 5 and Figure 6 As shown, the horizontal adjustment assembly includes a support ball 4, several springs 6, and several adjusting screws 5. The support ball 4 is mounted on the base 1, with its top abutting against the bottom of the support plate 3. The several springs 6 are spaced apart between the base 1 and the support plate 3, with both ends of the springs 6 connected to the base 1 and the support plate 3 respectively. The adjusting screws 5 are threadedly connected to the base 1, with their tops abutting against the bottom of the support plate 3. The support ball 4 is used to maintain a constant distance between the base 1 and the support plate 3, serving as a support point for angle adjustment. The springs 6 provide a limit to prevent horizontal displacement of the support plate 3. By rotating the adjusting screws 5 at different positions, the distance between the support plate 3 and the base 1 at that position is changed, thereby changing the tilt direction and tilt angle of the support plate 3.

[0028] In this embodiment, the support ball 4 is located at one corner of the support plate 3, and an adjusting screw 5 and a spring 6 are respectively provided at the other three corners of the support plate 3. A first threaded through hole is provided on the base 1, through which the adjusting screw 5 passes and is threadedly connected. The top end of the adjusting screw 5 abuts against the bottom of the support plate 3, and the top end of the adjusting screw 5 has a spherical structure. The two ends of the spring 6 are respectively connected to the base 1 and the support plate 3, providing a pulling force to bring the support plate 3 and the base 1 closer together. When the adjusting screw 5 is rotated, the distance between the support plate 3 and the base 1 is adjusted, and horizontal displacement of the support plate 3 is prevented. The support ball 4 is used to maintain the distance between the support plate 3 and the base 1 at that corner. During operation, the horizontal angle of the support plate 3 can be adjusted by rotating the adjusting screws 5 at the other three corners.

[0029] In this embodiment, a limiting crossbar is provided at each end of the spring 6. Through-hole limiting grooves are provided on the support plate 3 and the base 1 respectively. The spring 6 is passed through the through hole and the limiting crossbar is placed in the limiting groove to realize the installation and fixation of the spring 6. For those skilled in the art, the spring 6 can also be installed in other ways, such as setting hooks on the support plate 3 and the base 1, and the spring 6 is directly hung on the hooks.

[0030] When the adjusting screw 5 is rotated, the spherical tip of the adjusting screw 5 contacts the lower surface of the support plate 3, changing the distance between the base 1 and the support plate 3 at that corner. Due to the tension of the spring 6, the support plate 3 always maintains contact with the upper spherical surface of the adjusting screw 5, thus preventing any relative horizontal displacement. The adjusting screws 5 at the three corners can be adjusted independently, allowing the support plate 3 to tilt in different directions. A support ball 4 is provided at the remaining corner of the support plate 3 to maintain a constant distance between the base 1 and the support plate 3 at that corner, serving as a support point for angle adjustment. With this structure, the operator can fine-tune the horizontal angle of the support plate 3 to compensate for localized poor bonding caused by uneven chip thickness, thus improving the reliability of chip sealing.

[0031] like Figure 2 As shown, multiple thin-film pressure sensors 12 are spaced apart on the lower surface of the flip cover 2, preferably with pressure sensors 12 located at at least four corners. The pressure sensors 12 are thin-film, attached to or embedded in the lower surface of the flip cover 2, with their detection surfaces coplanar with or slightly protruding from the lower surface of the flip cover 2, so as to contact the upper surface of the chip when the flip cover 2 is closed. The thin-film pressure sensors 12 are communicatively connected to an external reading device or control unit to output the real-time pressure reading between the chip and the lower surface of the flip cover 2. The thin-film pressure sensors 12 can be thin-film resistive, capacitive, or piezoelectric pressure sensors 12, capable of sensing minute pressure changes. The introduction of this sensor allows the adhesion state between the chip and the flip cover 2 to be quantified, eliminating the need for the operator to rely solely on experience to judge the clamping degree.

[0032] Working principle: During use, the PDMS chip is placed in the receiving slot of the base 1, located on the support plate 3, and the flip cover 2 is closed and initially locked by the locking assembly. At this time, the annular protrusion 8 on the lower surface of the flip cover 2 fits against the perforated area of ​​the chip, forming an initial airtight seal. Due to the possibility of uneven chip thickness, the contact pressure distribution between the upper surface of the chip and the lower surface of the flip cover 2 is uneven. Local areas may leak due to insufficient compression, or the chip channels may deform due to excessive compression.

[0033] The operator observes the reading of the thin-film pressure sensor 12. If the pressure in a certain area is too low, it indicates that the fit is not tight. The operator then rotates the adjusting screw 5 at the corresponding position in that area, raising the support plate 3 on that side and changing the contact state between the upper surface of the chip and the lower surface of the flip cover 2, until the pressure sensor 12 reading reaches the preset range or the pressure across the entire contact surface is uniform. During adjustment, the spring 6 keeps the support plate 3 in constant contact with the spherical surface at the top of the adjusting screw 5. The spherical surface at the top of the adjusting screw 5 supports the support plate 3, preventing horizontal relative displacement of the support plate 3. After the horizontal angle adjustment is completed, the flip cover 2 and the base 1 are locked together using the locking assembly to secure and seal the chip.

[0034] In batch experiments, the locking component is fixed in position. The operator can record the reading of the thin-film pressure sensor 12 in each experiment and adjust the bottom horizontal adjustment component in subsequent batches to make the reading the same or similar values, thereby ensuring that the clamping degree of different batches of chips is consistent. This is especially suitable for microfluidic chips that are sensitive to clamping pressure, such as chips with a large width-to-height ratio of the channel. It can effectively reduce the changes in channel flow resistance caused by different clamping degrees and improve the consistency and repeatability of experimental results.

[0035] Example 2 This embodiment is a second embodiment of a microfluidic chip fixture. This embodiment is similar to the first embodiment, except that, as shown in the following... Figures 1 to 3 As shown, in this embodiment, the lower surface of the flip cover 2 is provided with a platform 9 for pressing the chip; multiple through holes are spaced apart on the flip cover 2, and a second threaded through hole 7 communicating with the through hole is provided on the upper surface of the flip cover 2 at the position of the through hole; an annular boss 8 is provided along the through hole on the platform 9 on the lower surface of the flip cover 2. The platform 9 protrudes slightly downward, and when the flip cover 2 is closed, the platform 9 is located in the receiving groove, which can better clamp the chip. The second threaded through hole 7 is used to connect to an external pipe. When closed, the through hole corresponds to the hole on the chip. An annular boss 8 is provided around the through hole. The inner diameter of the annular boss 8 is slightly larger than the inner diameter of the hole on the chip. This setting can better fit tightly with the hole on the chip and achieve airtightness.

[0036] It should be noted that the number, position and connection method of the through holes 7 on the flip cover 2 are not limited to those in this embodiment. The number, position and connection method of the through holes can be changed according to specific experiments and chip structures.

[0037] Example 3 This embodiment is a third embodiment of a microfluidic chip fixture. This embodiment is similar to Embodiment 1, except that, as Figures 1 to 4 As shown, in this embodiment, the locking assembly includes a limiting slot 10 on the flip cover 2, a threaded hole 11 on the base 1 corresponding to the position of the limiting slot 10, and a locking bolt. Multiple limiting slots 10 are spaced apart along the edge of the flip cover 2, and multiple threaded holes 11 are correspondingly provided on the base 1. After the flip cover 2 is closed, the locking screw passes through the limiting slots 10 and the threaded holes 11 in sequence, thereby locking the flip cover 2 and the base 1.

[0038] It should be noted that the locking component is not limited to the method of this embodiment, and can also be other structures. For example, by setting a buckle on the flip cover 2 and a slot on the base 1, the buckle is engaged in the slot after the flip cover 2 is closed, thereby locking the flip cover 2 and the base 1.

[0039] Example 4 This embodiment is a fourth embodiment of a microfluidic chip fixture. This embodiment is similar to the first embodiment, except that in this embodiment, the horizontal adjustment component does not have a support ball 4, but at least four sets of adjusting screws 5. The four sets of adjusting screws 5 are located at the four corners of the support plate 3. Normally, one corner adjusting screw 5 is not used as a support point to ensure a constant distance between the support plate 3 and the base 1. The other three corner adjusting screws 5 adjust the horizontal tilt angle of the support plate 3 to adapt to uneven thickness at different parts of the chip. When the overall thickness changes between different batches, the adjusting screws 5 at the four corners can be adjusted simultaneously to raise or lower the support plate 3 as a whole. Then, according to the pressure at different parts of the chip, each adjusting screw 5 is adjusted separately to adapt to uneven thickness of a single chip.

[0040] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0041] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A microfluidic chip fixture, comprising a base (1) for receiving a chip and a flip cover (2) hinged to the base (1); characterized in that, It also includes a horizontal adjustment component; the base (1) is provided with a receiving groove for accommodating the chip, and a support plate (3) for placing the chip is provided in the receiving groove. The horizontal adjustment component is installed on the base (1) and connected to the support plate (3) for adjusting the horizontal angle of the support plate (3).

2. The microfluidic chip fixture according to claim 1, characterized in that, The horizontal adjustment assembly includes a support ball (4), several springs (6) and several adjusting screws (5). The support ball (4) is installed on the base (1), and the top of the support ball (4) abuts against the bottom of the support plate (3). Several springs (6) are spaced apart between the base (1) and the support plate (3), and the two ends of the springs (6) are respectively connected to the base (1) and the support plate (3). The adjusting screws (5) are threadedly connected to the base (1), and the top of the adjusting screws (5) abuts against the bottom of the support plate (3).

3. The microfluidic chip fixture according to claim 2, characterized in that, At least three adjusting screws (5) are provided, and at least one spring (6) is provided around each adjusting screw (5). The spring (6) is in a stretched state. The support ball (4) and the three adjusting screws (5) form four support points of the support plate (3), and the line connecting the four support points is a quadrilateral.

4. The microfluidic chip fixture according to claim 2, characterized in that, The support plate (3) has a rectangular structure, and the support ball (4) and the three adjusting screws (5) are located at the four corners of the support plate (3); there is a gap between the support plate (3) and the inner wall of the receiving groove.

5. The microfluidic chip fixture according to claim 2, characterized in that, The base (1) is provided with a first threaded through hole, and the adjusting screw (5) passes through the first threaded through hole and is threadedly connected to the first threaded through hole; the top of the adjusting screw (5) is a spherical structure.

6. The microfluidic chip fixture according to claim 2, characterized in that, The upper surface of the support plate (3) and the lower surface of the flip cover (2) are both smooth planar structures.

7. The microfluidic chip fixture according to any one of claims 2 to 6, characterized in that, A pressure sensor (12) is provided on the lower surface of the flip cover (2).

8. The microfluidic chip fixture according to claim 7, characterized in that, The lower surface of the flip cover (2) is provided with a platform (9) for pressing the chip; multiple through holes are provided at intervals on the flip cover (2), and a second threaded through hole (7) communicating with the through hole is provided on the upper surface of the flip cover (2) at the position of the through hole; an annular boss (8) is provided on the platform (9) on the lower surface of the flip cover (2) along the through hole.

9. The microfluidic chip fixture according to claim 7, characterized in that, It also includes a locking component for locking the base (1) and the flip cover (2) when the flip cover (2) is closed.

10. The microfluidic chip fixture according to claim 9, characterized in that, The locking assembly includes a limiting slot (10) on the flip cover (2), a threaded hole (11) on the base (1) corresponding to the position of the limiting slot (10), and a locking bolt.

Images