Chip sorting into bin method and system

CN122999539APending Publication Date: 2026-10-30SHENZHEN SAIZHI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202611147193.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-30
Publication Date
2026-10-30

AI Technical Summary

Technical Problem

[0006]为了克服现有技术的不足,本发明提供一种芯片分选入BIN方法及系统,解决了现有芯片分选入Bin方法存在的自动化程度低、供盘效率低的问题

Benefits of technology

1、本发明通过设置第一输送线和第二输送线分别实现待分选料盘和空料盘的自动上料与传送,配合料盘分离机构实现堆叠料盘的自动分离,显著减少了人工干预环节,提高了分选过程的自动化程度;

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Abstract

The application discloses a chip sorting into BIN method and system, and relates to the technical field of semiconductor chip sorting. The method comprises the following steps: a first conveying line is used for conveying a tray to be sorted, and a second conveying line is used for conveying an empty tray; a line scanning mechanism scans a code to obtain chip information during the conveying process of the tray to be sorted, and communicates with an MES to generate Tray Mapping; a tray manipulator distributes the empty tray to a feeding position of three sorting lines; a sorting manipulator sorts the chips into the tray of the corresponding sorting line according to the Tray Mapping; after the sorting is completed, the empty tray is transferred from the first conveying line to the second conveying line for recycling; a full tray is unloaded from each sorting line, and the empty tray is recycled. The application further discloses a chip sorting into Bin system for realizing the above method. The application realizes the high automation of the whole process of the chip sorting into Bin, has high tray circulation efficiency, and effectively improves the sorting efficiency.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor chip sorting technology, and in particular to a chip sorting method and system for BIN. Background Technology

[0002] In the semiconductor chip manufacturing process, after testing, chips need to be classified according to their performance parameters (such as photoelectric performance, electrical characteristics, etc.), a process known as binning. Binning refers to grouping chips with the same or similar performance levels together to facilitate subsequent packaging, shipping, and application.

[0003] Currently, chip sorting into bins typically uses a sorting machine in conjunction with trays. The common chip sorting process in existing technology is roughly as follows: First, a manual person places the tray containing the chips to be sorted onto the feeding station of the sorting machine; then, the sorting machine picks up the chips one by one from the tray and places them into the corresponding bin according to the preset bin information; after all the chips in the sorting tray have been sorted, the manual person removes the empty tray and replaces it with a new tray. However, the above-mentioned existing technology has the following shortcomings: First, the level of automation is low. In the existing sorting process, most of the steps, such as loading the material trays to be sorted, replenishing empty trays, and unloading full trays, rely on manual operation. The high level of manual intervention not only results in high labor intensity but also easily leads to problems such as incorrect loading and untimely tray replenishment, which seriously affects sorting efficiency.

[0004] Secondly, the tray feeding efficiency of the sorting line is low. In the existing technology, empty trays need to be manually placed one by one at the loading position of each sorting line. When there are many sorting lines, the speed of manual tray replenishment is difficult to match the sorting speed of the sorting robot, resulting in frequent tray shortages and waiting situations, leading to low equipment utilization.

[0005] In view of this, the purpose of the present invention is to provide a new technical solution to solve the existing technical problems. Summary of the Invention

[0006] To overcome the shortcomings of existing technologies, this invention provides a chip sorting and binning method and system, which solves the problems of low automation and low disk supply efficiency in existing chip sorting and binning methods.

[0007] The technical solution adopted by this invention to solve its technical problem is: A chip sorting and binning method includes the following steps: S1. After power-on self-test, start the running program. At the same time, manually stack the sorting trays containing the chips to be sorted onto the first conveyor line, and stack the empty trays onto the second conveyor line. S2. The first conveyor line automatically separates single trays of material to be sorted and conveys them to the sorting station; the second conveyor line automatically separates single empty trays and conveys them to the empty tray loading station. S3. During the process of the material tray to be sorted being transported to the sorting station, the line scanning mechanism scans the material tray to be sorted to obtain the chip information of the chip in the material tray to be sorted, and communicates with the MES to generate Tray Mapping. S4. The material tray robot moves the single empty material tray sequentially to the loading position of the first sorting line, the second sorting line, and the third sorting line; the first sorting line, the second sorting line, and the third sorting line respectively convey the empty material tray to their respective sorting and receiving positions; S5. The sorting robot sorts the chips in the trays to be sorted on the first conveyor line according to the Tray Mapping information, and sorts the chips onto the trays of the first sorting line, the second sorting line, or the third sorting line. S6. After the chips on the sorting tray are sorted, the first conveyor line will transport the tray to the unloading position, and the tray robot will transfer the tray to the unloading position of the second conveyor line. S7. After the material trays on the first sorting line, the second sorting line, or the third sorting line are full, they are conveyed to their respective unloading positions, where the full trays are manually removed; the material tray robot moves the empty material trays on the unloading positions of the second conveyor line to the first sorting line, the second sorting line, or the third sorting line; S8. Repeat steps S2 to S7 until all the material trays to be sorted have been sorted.

[0008] As a further improvement of the present invention, the line scanning mechanism is disposed on the conveying path of the first conveyor line and performs online scanning during the process of the material tray to be sorted being conveyed from the first conveyor line to the sorting station.

[0009] As a further improvement of the present invention, in step S3, the chip information includes the chip's BIN information and the chip's position information in the tray.

[0010] As a further improvement of the present invention, in step S4, the material tray robot dynamically allocates empty material trays to the loading positions of the first sorting line, the second sorting line and the third sorting line according to a preset order or according to the current empty material tray status of each sorting line, so as to replenish the empty material trays of each sorting line.

[0011] As a further improvement of the present invention, in step S5, the sorting robot obtains the BIN category of each chip according to the TrayMapping information, and sorts chips belonging to the same BIN category into the trays of the same sorting line.

[0012] As a further improvement of the present invention, in step S5, the sorting robot is a multi-nozzle parallel pick-and-place mechanism, which picks up multiple chips from the material tray to be sorted at the same time in one picking operation, and places the multiple chips into the corresponding positions of the material trays of different sorting lines according to the Tray Mapping information.

[0013] As a further improvement of the present invention, in step S6, after the material tray robot transfers the empty material tray on the first conveyor line to the unloading position of the second conveyor line, the material tray robot preferentially allocates the empty material tray to the sorting line where the material tray is empty.

[0014] As a further improvement of the present invention, in step S7, the unloading positions of the first sorting line, the second sorting line and the third sorting line are equipped with position sensors, and the position sensors will alarm when the material tray is full and transported to the unloading position.

[0015] As a further improvement of the present invention, in step S3, if the scanning mechanism fails to scan the code or cannot communicate normally with the MES, the first conveyor line will transfer the current material tray to be sorted to the abnormal discharge position and issue an alarm signal. If the scanning mechanism fails to scan a chip or cannot communicate normally with the MES, the sorting robot will not pick up the current chip and will issue an alarm signal.

[0016] The present invention also provides: A chip sorting system, comprising: The first conveyor line is used for loading and transporting the trays of materials to be sorted; The second conveyor line is used for loading and transporting empty material trays. Both the first and second conveyor lines are equipped with material tray separation mechanisms to automatically separate stacked material trays into individual trays. A line scanning mechanism is set on the conveying path of the first conveyor line and is used to scan the material tray to be sorted to obtain chip information. A tray robot is used to transfer trays between conveyor lines and sorting lines; The first sorting line, the second sorting line, and the third sorting line are used to receive chips carrying different BIN items, respectively. A sorting robot is used to sort chips in a sorting tray onto a tray of the first sorting line, the second sorting line, or the third sorting line. The control unit includes an MES communication module for communicating with the MES. The control unit is used to control the operation of the first conveyor line, the second conveyor line, the line scanning mechanism, the tray robot, the first sorting line, the second sorting line, the third sorting line, and the sorting robot to perform the chip sorting into Bin method as described above.

[0017] The beneficial effects of this invention are: 1. This invention achieves automatic feeding and conveying of the material trays to be sorted and the empty material trays by setting up a first conveyor line and a second conveyor line respectively, and achieves automatic separation of stacked material trays in conjunction with the material tray separation mechanism, which significantly reduces the manual intervention links and improves the automation level of the sorting process; 2. This invention uses a line scanning mechanism to automatically scan and generate Tray Mapping during the transfer of the material tray to be sorted, thereby realizing the online automatic acquisition of chip information and real-time communication with MES. This avoids the inconsistency problem caused by manual input or offline import, and improves the efficiency and accuracy of information flow. 3. This invention automatically transfers material trays between each conveyor line and the three sorting lines using a material tray robot, realizing automatic replenishment of empty material trays. This effectively solves the problem of waiting for empty trays on the sorting lines due to slow manual replenishment, and greatly improves equipment utilization and sorting efficiency. 4. This invention rationally plans the material tray flow path: the material trays to be sorted are supplied by the first conveyor line, the empty material trays are supplied by the second conveyor line, the empty material trays after sorting are returned to the second conveyor line, and the full trays are fed by each sorting line, forming a closed-loop material tray flow system with high material tray turnover efficiency and avoiding the problems of material tray accumulation or shortage.

[0018] 5. This invention achieves parallel sorting of multiple BIN items by setting three sorting lines corresponding to different BIN item categories, thereby further improving sorting efficiency. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the overall structure of the system of the present invention; Figure 2 This is a side view of the system structure of the present invention; Figure 3 This is a flowchart of the method of the present invention.

[0021] Reference numerals in the attached drawings: 1. First conveyor line; 2. Second conveyor line; 3. Line scanning mechanism; 4. Material tray robot; 5. Sorting robot; 6. First sorting line; 7. Second sorting line; 8. Third sorting line; 9. Unloading line scanning mechanism. Detailed Implementation

[0022] The following is in conjunction with the appendix Figure 1-3 The present invention will be further described below.

[0023] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this invention can be combined interactively without contradicting each other.

[0024] Reference Figure 1 and Figure 2 This invention provides a chip sorting and binning system for automatically loading, sorting, and unloading chips, compatible with chips of various sizes. The chip sorting and binning system includes a first conveyor line 1, a second conveyor line 2, a line scanning mechanism 3, a MES communication module, a tray robot 4, a sorting and transfer module, a sorting robot 5, and a control unit; wherein the sorting and transfer module is located between the first conveyor line 1 and the second conveyor line 2, and the sorting and transfer module includes at least a first sorting line 6 and a second sorting line 7.

[0025] In this embodiment, the sorting and transmission module includes a first sorting line 6, a second sorting line 7, and a third sorting line 8, used to carry three different types of chips; the first sorting line 6, the second sorting line 7, and the third sorting line 8 adopt the same structural form. In other embodiments, the sorting and transmission module includes a first sorting line 6, a second sorting line 7, a third sorting line 8, and a fourth sorting line.

[0026] The first conveyor line 1 is used to transport trays containing chips to be sorted. One end of the first conveyor line is the loading end, used to receive manually placed stacked trays to be sorted; the other end is the unloading end, used to output empty trays after sorting. The first conveyor line 1 is equipped with a tray separation mechanism, used to automatically separate the stacked trays into individual trays and transport them towards the unloading end. The first conveyor line 1 is provided with a sorting station located between the loading end and the unloading end.

[0027] The second conveyor line 2 is used to transport empty trays. One end of the second conveyor line 2 is the loading end, used to receive manually placed stacked empty trays; the other end is the unloading end, used to collect sorted empty trays. The loading end of the second conveyor line 2 is located on the same side as the loading end of the first conveyor line 1. The second conveyor line 2 is also equipped with a tray separation mechanism to automatically separate stacked empty trays into individual trays.

[0028] The line scanning mechanism 3 is installed on the transmission path of the first conveyor line 1, located between the first loading end of the first conveyor line 1 and the sorting station. The line scanning mechanism 3 is used to scan the identification codes (such as QR codes, barcodes, etc.) on the tray to be sorted and the chip identification codes on the tray during the process of the tray being conveyed from the first conveyor line 1 to the sorting station, to obtain the chip information of the chips in the tray. This chip information includes, but is not limited to, the chip's BIN information, the chip's coordinates in the tray, and the chip's model information.

[0029] The MES communication module is connected to the line scanning mechanism 3 to receive chip information acquired by the line scanning mechanism 3 and communicate with the MES to form a Tray Mapping based on the chip information. The Tray Mapping records the position coordinates of each chip in the sorting tray and its corresponding BIN item category.

[0030] The first sorting line 6, the second sorting line 7, and the third sorting line 8 correspond to different BIN item categories. One end of each sorting line is a loading position, used to receive empty trays transferred by the tray robot 4, and the loading position of each sorting line is on the same side as the unloading end of the second transmission line; the other end is a unloading position, used to output trays full of chips for operators to remove, and the unloading position of each sorting line is on the same side as the loading end of the second transmission line. A sorting receiving position is set between the loading and unloading positions of each sorting line to receive chips sorted by the sorting robot 5. Each sorting line conveys empty trays from the loading position to the sorting receiving position, and after the tray is full, it continues to be conveyed to the unloading position.

[0031] The tray robot 4 moves between the first conveyor line 1 and the second conveyor line 2 to transfer trays between the conveyor lines and the sorting lines. Specifically, the tray robot 4 is used to move a single empty tray conveyed to the unloading end of the second conveyor line 2 sequentially to the loading position of the first sorting line 6, the second sorting line 7, and the third sorting line 8; it is also used to transfer empty trays from the unloading end of the first conveyor line 1 to the unloading end of the second conveyor line 2, so as to realize the circulation of trays.

[0032] The sorting robot 5 is positioned between the sorting station of the first conveyor line 1 and the sorting receiving stations of the first sorting line 6, the second sorting line 7, and the third sorting line 8. Based on Tray Mapping information, the sorting robot 5 picks up chips one by one from the trays on the first conveyor line 1 and places them into the corresponding trays on the sorting lines (first sorting line 6, second sorting line 7, or third sorting line 8) according to the BIN category of each chip.

[0033] The control unit is connected to the first conveyor line 1, the second conveyor line 2, the line scanning mechanism 3, the material tray robot 4, the first sorting line 6, the second sorting line 7 (i.e., the sorting robot 5) for communication control of the coordinated operation of each part.

[0034] Reference Figures 1 to 3 Based on the above, the chip sorting and BIN method provided by the present invention includes the following steps: Step S1: Power-on self-test and material loading.

[0035] After the system is powered on, the control unit first executes a self-test program, performing self-tests on each component, including the first conveyor line 1, the second conveyor line 2, the line scanning mechanism 3, the first sorting line 6, the second sorting line 7, the third sorting line 8, the sorting robot 5, and the tray robot 4, to confirm that each component is in normal working order and to start the operating program. Simultaneously, the operator stacks trays containing chips to be sorted onto the loading end of the first conveyor line 1 and stacks empty trays onto the loading end of the second conveyor line 2.

[0036] Step S2: Automatic disk partitioning and transfer.

[0037] The tray separation mechanism on the first conveyor line 1 automatically separates a single tray from the stacked trays to be sorted and conveys the single tray to the sorting station. The tray separation mechanism on the second conveyor line 2 automatically separates a single empty tray from the stacked empty trays and conveys the single empty tray to the upward feeding end.

[0038] Step S3: Scan the code and generate a Tray Mapping.

[0039] During the process of the material tray to be sorted being conveyed from the first transmission line to the sorting station, when it passes through the line scanning mechanism 3, the line scanning mechanism 3 scans the identification code of the chips on the material tray to obtain the chip information (including BIN information and the chip's position information in the material tray). The line scanning mechanism 3 sends the obtained chip information to the MES communication module. The MES communication module communicates with the MES system, generates a Tray Mapping based on the chip information, and sends the Tray Mapping to the control unit and the sorting robot 5.

[0040] Step S4: Empty material tray allocation.

[0041] The material tray robot 4 sequentially picks up single empty material trays from the loading end of the second conveyor line 2 and moves them to the loading positions of the first sorting line 6, the second sorting line 7, and the third sorting line 8 in a preset order. The first sorting line 6, the second sorting line 7, and the third sorting line 8 respectively convey the empty material trays from the loading positions to their respective sorting receiving positions, waiting to receive the sorted chips.

[0042] For example, a single empty tray is separated from the feeding end of the second conveyor line 2 and the empty tray is transferred to the feeding end. The tray robot 4 moves the empty tray to the first sorting line 6. The feeding end of the second conveyor line 2 continues to separate a second empty tray and transfers the second empty tray to the feeding end. The tray robot 4 moves above the second conveyor line 2 again and moves the second empty tray to the second sorting line 8. A third empty tray is then separated from the second conveyor line 2 and transferred to the feeding end. The tray robot 4 transfers the third empty tray to the third sorting line 8.

[0043] Step S5: Chip sorting.

[0044] Based on the Tray Mapping information provided by the control unit, the sorting robot 5 obtains the BIN category of each chip in the tray to be sorted and its coordinate position in the tray. The sorting robot 5 picks up the chips one by one from the tray according to their coordinate positions and sorts them onto the trays corresponding to the sorting lines according to the chip's BIN category.

[0045] For example, the sorting robot 5 places chips belonging to the first BIN category into the tray of the first sorting line 6; places chips belonging to the second BIN category into the tray of the second sorting line 7; and places chips belonging to the third BIN category into the tray of the third sorting line 8.

[0046] S6. Empty material tray recycling.

[0047] After all the chips on the sorting tray have been sorted, the first conveyor line 1 transfers the empty tray to the unloading position. The tray robot 4 then transfers the empty tray from the unloading position of the first conveyor line 1 to the unloading end of the second conveyor line 2 for later use. After the trays on the first sorting line 6, the second sorting line 7, or the third sorting line 8 are full and unloaded, the tray robot 4 can transfer the tray to the sorting line to realize the circulation of empty trays.

[0048] Step S7: Discharge the full tray and reuse the empty tray.

[0049] When the trays on the first sorting line 6, the second sorting line 7, or the third sorting line 8 are full of chips (i.e., full trays), the sorting line will transport the full trays to their respective unloading positions, where operators will remove the full trays for subsequent processing. Simultaneously, the tray robot 4 will move the empty trays from the unloading end of the first conveyor line 1 to the loading position of the sorting line that needs to replenish the empty trays, thus achieving the recycling of empty trays. The empty trays are then transported by the sorting line to the sorting receiving position to continue receiving subsequent chips.

[0050] For example, when the tray on the first sorting line 6 is full, it is conveyed to the unloading position, where a person manually removes the full tray. The tray robot 4 then transfers a spare empty tray from the unloading end of the second conveyor line 2 to the first sorting line 6, which then conveys the tray to the sorting receiving position for continued sorting. If there is no spare empty tray at the unloading end of the second conveyor line 2, the second conveyor line 2 will again separate a single empty tray and convey it to the unloading position for the tray robot 4 to transfer.

[0051] Step S8: Repeat the cycle until sorting is complete.

[0052] Repeat steps S2 to S7 until all trays to be sorted are sorted. Once all trays to be sorted on the first conveyor line 1 have been sorted, the operator can continue to replenish new trays to be sorted; when there are not enough empty trays on the second conveyor line 2, the operator can continue to replenish new empty trays.

[0053] Example 2 In another embodiment of the present invention, in step S7, the unloading positions of the first sorting line 6, the second sorting line 7 and the third sorting line 8 are equipped with position sensors. When the full trays on each sorting line are transported to the unloading position, the corresponding position sensors issue an alarm to signal the operator to unload the material.

[0054] For example, after the tray at the sorting receiving position of the first sorting line 6 is full, the first sorting line 6 transmits the full tray to the unloading position. The arrival sensor senses that the tray has arrived and issues an alarm, and the operator unloads the full tray.

[0055] This setup allows operators to promptly monitor the tray's condition and remove full trays, ensuring consistent production speed.

[0056] Example 3 In another embodiment of the present invention, the sorting robot with a 5-position multi-nozzle parallel pick-and-place mechanism can simultaneously pick up multiple chips from the material tray to be sorted during a single material picking operation, and place the multiple chips at the corresponding positions of the material trays on different sorting lines according to the Tray Mapping information.

[0057] For example, in this embodiment, the sorting robot's 5-position six-nozzle parallel pick-and-place mechanism can pick up six chips from the material tray to be sorted during the sequential material picking operation, and place the six chips into the material trays of the first sorting line 6, the second sorting line 7, or the third sorting line 8 respectively according to the Tray Mapping information.

[0058] Example 4 In another embodiment of the present invention, a feeding line scanning mechanism 9 is provided. This mechanism is used to detect the status of chips on full trays of materials on the first sorting line 6, the second sorting line 7, and the third sorting line 8. The feeding line scanning mechanism 9 is positioned between the sorting receiving position and the feeding position of each sorting line. During the feeding process of a full tray, the feeding line scanning mechanism 9 takes pictures of the tray for detection. When an abnormal chip status is detected, transmission is stopped and an alarm is issued.

[0059] Example 5 In another embodiment of the present invention, after the chips on the sorting tray are sorted, the first conveyor line 1 transmits the tray to the unloading position, and the tray robot 4 transfers the tray to the unloading position of the second conveyor line 2. During the transfer of the tray by the tray robot 4, the tray is flipped and vibrated to shake off chips that were missed in sorting or abnormal chips that were not successfully identified by the line scanning mechanism 3 and were not sorted.

[0060] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A chip sorting and BIN method, characterized in that, Includes the following steps: S1. After power-on self-test, start the running program. At the same time, manually stack the sorting trays containing the chips to be sorted onto the first conveyor line, and stack the empty trays onto the second conveyor line. S2. The first conveyor line automatically separates single trays of material to be sorted and conveys them to the sorting station; the second conveyor line automatically separates single empty trays and conveys them to the empty tray loading station. S3. During the process of the material tray to be sorted being transported to the sorting station, the line scanning mechanism scans the material tray to be sorted to obtain the chip information of the chip in the material tray to be sorted, and communicates with the MES to generate Tray Mapping. S4. The material tray robot moves the single empty material tray sequentially to the loading position of the first sorting line, the second sorting line, and the third sorting line; the first sorting line, the second sorting line, and the third sorting line respectively convey the empty material tray to their respective sorting and receiving positions; S5. The sorting robot sorts the chips in the trays to be sorted on the first conveyor line according to the Tray Mapping information, and sorts the chips onto the trays of the first sorting line, the second sorting line, or the third sorting line. S6. After the chips on the sorting tray are sorted, the first conveyor line will transport the tray to the unloading position, and the tray robot will transfer the tray to the unloading position of the second conveyor line. S7. After the material trays on the first sorting line, the second sorting line, or the third sorting line are full, they are conveyed to their respective unloading positions, where the full trays are manually removed; the material tray robot moves the empty material trays on the unloading positions of the second conveyor line to the first sorting line, the second sorting line, or the third sorting line; S8. Repeat steps S2 to S7 until all the material trays to be sorted have been sorted.

2. The chip sorting and BIN method according to claim 1, characterized in that, The scanning mechanism is located on the conveying path of the first conveyor line and performs online scanning during the process of the material tray to be sorted being conveyed from the first conveyor line to the sorting station.

3. The chip sorting and BIN method according to claim 1, characterized in that, In step S3, the chip information includes the chip's BIN information and the chip's position information in the tray.

4. The chip sorting and BIN method according to claim 1, characterized in that, In step S4, the material tray robot dynamically allocates empty material trays to the loading positions of the first sorting line, the second sorting line, and the third sorting line according to a preset sequence or based on the current empty material tray status of each sorting line, so as to replenish empty material trays to each sorting line.

5. The chip sorting and BIN method according to claim 1, characterized in that, In step S5, the sorting robot obtains the BIN category of each chip based on the Tray Mapping information and sorts chips belonging to the same BIN category into the trays of the same sorting line.

6. The chip sorting and BIN method according to claim 1, characterized in that, In step S5, the sorting robot is a multi-nozzle parallel pick-and-place mechanism. In one picking operation, it picks up multiple chips from the material tray to be sorted at the same time, and places the multiple chips into the corresponding positions of the material trays of different sorting lines according to the Tray Mapping information.

7. The chip sorting and BIN method according to claim 1, characterized in that, In step S6, after the material tray robot transfers the empty material tray on the first conveyor line to the unloading position of the second conveyor line, the material tray robot preferentially allocates the empty material tray to the sorting line where the material tray is empty.

8. The chip sorting and BIN method according to claim 1, characterized in that, In step S7, the unloading positions of the first sorting line, the second sorting line and the third sorting line are equipped with position sensors. When a full tray of material is transferred to the unloading position, the position sensor will sound an alarm.

9. A chip sorting and BIN method according to claim 1, characterized in that, In step S3, if the scanning mechanism fails to scan the code or cannot communicate normally with the MES, the first conveyor line will transfer the current material tray to be sorted to the abnormal discharge position and issue an alarm signal. If the scanning mechanism fails to scan a chip or cannot communicate normally with the MES, the sorting robot will not pick up the current chip and will issue an alarm signal.

10. A chip sorting system, characterized in that, include: The first conveyor line is used for loading and transporting the trays of materials to be sorted; The second conveyor line is used for loading and transporting empty material trays. Both the first and second conveyor lines are equipped with material tray separation mechanisms to automatically separate stacked material trays into individual trays. A line scanning mechanism is set on the conveying path of the first conveyor line and is used to scan the material tray to be sorted to obtain chip information. A tray robot is used to transfer trays between conveyor lines and sorting lines; The first sorting line, the second sorting line, and the third sorting line are used to receive chips carrying different BIN items, respectively. A sorting robot is used to sort chips in a sorting tray onto a tray of the first sorting line, the second sorting line, or the third sorting line. The control unit includes an MES communication module for communicating with the MES, the control unit being used to control the operation of the first conveyor line, the second conveyor line, the line scanning mechanism, the tray robot, the first sorting line, the second sorting line, the third sorting line and the sorting robot to perform the chip sorting into Bin method as described in any one of claims 1 to 9.