Wafer carrier cleaning machine

Abstract

The application discloses a wafer carrier cleaning machine and belongs to the technical field of wafer carrier cleaning, which comprises a base, a turnover and water draining mechanism, an electric rotary disc, an automatic cover removing mechanism, a clamping groove bidirectional cleaning mechanism and a pre-flushing mechanism. The turnover and water draining mechanism is installed on the left side of the upper end of the base. The electric rotary disc is fixedly installed on the middle part of the base. The automatic cover removing mechanism is installed on the left side of the movable end of the electric rotary disc. The clamping groove bidirectional cleaning mechanism is installed on the right side of the movable end of the electric rotary disc. The clamping groove bidirectional cleaning mechanism comprises a second horizontal moving assembly, a synchronous bidirectional moving assembly, a cleaning assembly and a circular spray pipe. The pre-flushing mechanism is installed on the right side of the upper end of the base. In the above way, the clamping groove for placing wafers in the sealed box is exposed, so that the automatic cover opening operation of the front opening door plate is realized, and the manual labor is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer transfer tray cleaning technology, and more specifically to a wafer carrier cleaning machine. Background Technology

[0002] Wafers are the basic substrate for semiconductor chip manufacturing. Front-opening wafer carriers (FOUPs) are widely used as dedicated sealed containers for wafer storage and transportation in the entire semiconductor production process, including photolithography, etching, and coating. Wafer carriers need to be cleaned after injection molding to avoid damage during subsequent wafer transportation.

[0003] Chinese patent CN116967168B discloses a high-efficiency compatible cleaning machine, including a machine body and a water tank fixedly connected to the back of the machine body. Electric slide rails are fixedly connected to both sides of the inner wall of the machine body, and a placement frame is slidably connected between opposite sides of the two electric slide rails. A surface rinsing mechanism is provided on the top of the machine body, and a slit cleaning mechanism is provided inside the placement frame. The slit cleaning mechanism includes a fixed frame fixedly connected to the inside of the placement frame by a support member. However, this device still has the following problems during use:

[0004] Operators still need to use tools to unlock and separate the carrier door panel before placing the wafer carrier body into the placement frame for cleaning. At this time, the carrier door panel and the wafer carrier body need to be cleaned by different equipment, which can easily lead to contaminants still entering the wafer carrier when the cover is closed later, affecting the cleaning effect.

[0005] Based on this, the present invention designs a wafer carrier cleaning machine to solve the above problems. Summary of the Invention

[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a wafer carrier cleaning machine.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A wafer carrier cleaning machine includes a base, a flipping and draining mechanism, an electric rotary table, an automatic cap removal mechanism, a slot bidirectional cleaning mechanism, and a pre-rinsing mechanism.

[0009] The flip-over drainage mechanism for securing the front-opening wafer carrier body is installed on the upper left side of the base.

[0010] The electric rotary table is fixedly installed in the middle of the base;

[0011] An automatic lid-removing mechanism for separating the front-opening door panel from the sealed box is installed on the left side of the movable end of the electric rotary table.

[0012] A bidirectional cleaning mechanism for cleaning the slots inside the sealed housing is installed on the right side of the movable end of the electric rotary disc.

[0013] The card slot bidirectional cleaning mechanism includes a second transverse moving component, a synchronous bidirectional moving component, a cleaning component, and a circular spray pipe;

[0014] The second transverse component is connected to the movable end of the electric rotary disk; the synchronous bidirectional moving component is connected to the second transverse component; the cleaning component is connected to the synchronous bidirectional moving component; the circular spray pipe is connected to the synchronous bidirectional moving component; the circular spray pipe is connected to the external pump body through a pipe;

[0015] A pre-rinse mechanism for rinsing the cleaning components and front-opening door panels is installed on the upper right side of the base.

[0016] Furthermore, the automatic cap-removing mechanism includes a first lateral movement component and an unlocking component; the first lateral movement component is connected to the movable end of the electric rotary disk; the unlocking component is connected to the first lateral movement component;

[0017] Furthermore, the tilting and draining mechanism includes a stand, a tilting cylinder, a contouring fixing frame, and a clamping assembly; the stand is symmetrically fixedly installed on the front and rear sides of the upper end of the base; the tilting cylinder is fixedly installed on the front end of the front stand; the front and rear ends of the contouring fixing frame are rotatably connected to the front and rear stands.

[0018] The output end of the tilting cylinder is fixedly connected to the contouring bracket; the clamping assembly is connected to the contouring bracket.

[0019] Furthermore, the clamping assembly includes a clamping cylinder, a clamping guide rod, and a contouring clamping plate; the clamping cylinder is fixedly installed at the front end of the contouring frame; the clamping guide rod is slidably installed at the rear end of the contouring frame.

[0020] The contouring clamp is fixedly connected to the output end of the clamping cylinder; the contouring clamp is fixedly connected to the clamping guide rod.

[0021] Furthermore, the first transverse component includes a first mounting plate, a first cylinder slide module, and a movable plate; the first mounting plate is fixedly mounted on the left side of the movable end of the electric rotary table; the first cylinder slide module is fixedly mounted on the first mounting plate; and the movable plate is fixedly connected to the movable end of the first cylinder slide module.

[0022] Unlock the connection between the component and the activity board;

[0023] Furthermore, the unlocking component includes an unlocking motor and an unlocking plug; the unlocking motor is symmetrically and fixedly installed on the front and rear sides of the right end of the movable plate; the unlocking plug is symmetrically and rotatably installed on the front and rear sides of the left end of the movable plate; the output end of the unlocking motor is fixedly connected to the unlocking plug.

[0024] The unlocking plug is inserted into the unlocking hole on the front-opening door panel;

[0025] Furthermore, the second transverse component includes a second mounting plate, a second cylinder slide module, and a positioning plate; the second mounting plate is fixedly mounted on the right side of the movable end of the electric rotary table; the second cylinder slide module is fixedly connected to the second mounting plate.

[0026] The positioning plate is fixedly connected to the moving end of the second cylinder slide module;

[0027] The synchronous bidirectional moving component is connected to the positioning disk;

[0028] The circular spray pipe is fixedly installed in the middle of the positioning plate; the circular spray pipe is provided with water spray holes; the circular spray pipe is connected to the external pump body through pipelines;

[0029] Furthermore, the synchronous bidirectional movement component includes a drive component and a driven component; the drive component is connected to the positioning disk; the driven component is connected to both the positioning disk and the drive component.

[0030] The drive assembly includes a servo slide module and a drive board; the servo slide module is fixedly installed at the lower end of the positioning disk; the drive board is fixedly connected to the moving end of the servo slide module.

[0031] The driver board is connected to the driven component;

[0032] The driven component includes a limiting guide rail, a pull rod, a driven plate, and a limiting roller; the front and rear sides of the positioning plate are symmetrically provided with arc-shaped guide grooves;

[0033] The limiting guide rails are symmetrically and fixedly installed on the front and rear sides of the positioning plate;

[0034] The driven plate is slidably connected to the limiting guide rail; the limiting roller is rotatably mounted on the upper end of the driven plate; the limiting roller is tumbledly connected to the arc-shaped guide groove.

[0035] There are two pull rods, one end of which is hinged to the drive plate; the other end of which is hinged to the driven plate.

[0036] Clean the connection between the assembly and the front and rear driven plates;

[0037] Furthermore, the cleaning components include an L-shaped mounting plate, an alignment plate, and a brush plate; the L-shaped mounting plate is fixedly mounted on the upper end of the driven plate; multiple alignment plates are fixedly mounted on the L-shaped mounting plate at equal intervals; the brush plate is fixedly connected to the alignment plate.

[0038] Furthermore, the pre-rinsing mechanism includes a secondary water baffle and a square spray pipe; the secondary water baffle is fixedly installed on the upper right side of the base.

[0039] Square spray pipes are fixedly installed on the front, rear, and right inner walls of the secondary water tank.

[0040] Compared with the prior art, the beneficial effects of this invention are as follows: 1. Open the sealing cover on the sealing cover, place the front-opening door panel of the front-opening wafer carrier body that needs to be cleaned upward in the flipping and draining mechanism, and then close the sealing cover; then, the flipping and draining mechanism drives the front-opening wafer carrier body to rotate to the right, so that the front-opening door panel is aligned with the unlocking component; then, the first lateral movement component pushes the front-opening door panel to the left to ensure that the unlocking component is aligned with the front-opening door panel, and then the unlocking component separates the front-opening door panel from the sealing box; the first lateral movement component controls the unlocking component to move to the right and reset, thereby completely separating the front-opening door panel from the sealing box, exposing the slots inside the sealing box used to place wafers, thereby realizing the automatic opening operation of the front-opening door panel and reducing manual labor.

[0041] 2. The first lateral movement component controls the unlocking component to separate the front-opening door panel while the cleaning component is placed in the pre-rinsing mechanism. The pre-rinsing mechanism pre-cleans the cleaning component, removing any residual debris. After the front-opening door panel is completely separated from the sealed housing, the second lateral movement component moves the cleaning component out of the pre-rinsing mechanism. Then, the electric rotary table controls the first and second lateral movement components to rotate 180 degrees, ensuring that the cleaning component is aligned with the sealed housing and the front-opening door panel is aligned with the pre-rinsing mechanism. Subsequently, the second lateral movement component controls the synchronous bidirectional movement component to move to the left into the sealed housing. The synchronous bidirectional movement component then controls the cleaning component to clean the slots inside the sealed housing, and the circular spray pipe continuously applies high-pressure rinsing to the slots, ensuring that the device can clean debris from the dead corners of the slots, thereby improving the cleaning quality and avoiding affecting the subsequent storage of wafers.

[0042] 3. The first lateral movement component also controls the unlocking component and the front-opening door panel to move into the pre-rinsing mechanism, and the pre-rinsing mechanism rinses the end of the front-opening door panel near the inner wall of the sealing box, thereby ensuring that both the front-opening door panel and the sealing box can be cleaned inside the sealing cover, reducing the probability of contamination when the front-opening door panel and the sealing box are spliced ​​and reset after cleaning; after cleaning, the second lateral movement component controls the synchronous bidirectional movement component to reset to the right, and the flipping draining mechanism controls the sealing box to rotate downwards by 90 degrees, so that the opening of the sealing box faces downwards and aligns with the recycling trough on the left side of the base. At this time, the sealing box... The remaining water inside the body will flow into the recycling tank under its own weight; and the remaining water on the front-opening door panel after rinsing will also flow into the right-side recycling tank under its own weight; finally, the electric rotary disc controls the first and second transverse components to rotate 180 degrees to reset, so that the front-opening door panel is re-aligned with the sealed box. Then, the first transverse component controls the unlocking component to move to the left, and then the unlocking component reconnects and fixes the front-opening door panel to the sealed box. The flipping draining mechanism controls the front-opening wafer carrier body to rotate upward and reset. Then, the front-opening wafer carrier body can be taken out and dried. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0044] Figure 1 A three-dimensional representation of a wafer carrier cleaning machine according to the present invention. Figure 1 ;

[0045] Figure 2 This is a front view of a wafer carrier cleaning machine according to the present invention;

[0046] Figure 3 A three-dimensional representation of a wafer carrier cleaning machine according to the present invention. Figure 2 ;

[0047] Figure 4 For the partial three-dimensional tilting and draining mechanism Figure 1 ;

[0048] Figure 5 For the partial three-dimensional tilting and draining mechanism Figure 2 ;

[0049] Figure 6 A partial 3D view of the automatic cap-removing mechanism;

[0050] Figure 7A partial 3D view of the card slot bidirectional cleaning mechanism;

[0051] Figure 8 for Figure 3 Enlarged view of point A in the middle;

[0052] Figure 9 This is a partial 3D view of the pre-rinsing mechanism.

[0053] The labels in the diagram represent:

[0054] 1. Base; 11. Sealing cover; 2. Tilting and draining mechanism; 21. Stand; 22. Tilting cylinder; 23. Contouring fixing frame; 24. Clamping cylinder; 25. Clamping guide rod; 26. Contouring clamping plate; 3. Electric rotating disk; 4. Automatic cover removal mechanism; 41. First mounting plate; 42. First cylinder slide module; 43. Movable plate; 44. Unlocking motor; 45. Unlocking insert; 5. Card slot bidirectional cleaning mechanism; 51. Second mounting plate; 52. Second cylinder slide 53. Positioning plate; 54. Arc-shaped guide groove; 55. Limiting guide rail; 56. Servo slide module; 57. Drive board; 58. Pull rod; 59. Slave plate; 510. Limiting roller; 511. L-shaped mounting plate; 512. Alignment plate; 513. Brush plate; 514. Circular spray pipe; 6. Pre-rinse mechanism; 61. Secondary water baffle; 62. Square spray pipe; 7. Front-opening wafer carrier body; 71. Front-opening door panel; 72. Sealed box. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0056] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.

[0057] Example 1: In some embodiments, please refer to the accompanying drawings. Figures 1-9 A wafer carrier cleaning machine includes a base 1, a flipping and draining mechanism 2, an electric rotating disk 3, an automatic cover removal mechanism 4, a slot bidirectional cleaning mechanism 5, and a pre-rinsing mechanism 6.

[0058] The flipping and draining mechanism 2, used to fix the front-opening wafer carrier body 7 and control the rotation of the front-opening wafer carrier body 7, is installed on the upper left side of the base 1.

[0059] The electric rotating disk 3 is fixedly installed in the middle of the base 1;

[0060] An automatic lid removal mechanism 4 for separating the front-opening door panel 71 from the sealed box 72 is installed on the left side of the movable end of the electric rotary table 3.

[0061] The automatic cap-removing mechanism 4 includes a first horizontal movement component and an unlocking component; the first horizontal movement component is connected to the movable end of the electric rotary disk 3; the unlocking component is connected to the first horizontal movement component.

[0062] A two-way cleaning mechanism 5 for cleaning the slots inside the sealed housing 72 is installed on the right side of the movable end of the electric rotary table 3.

[0063] The card slot bidirectional cleaning mechanism 5 includes a second transverse component, a synchronous bidirectional moving component, a cleaning component, and a circular spray pipe 514;

[0064] The second transverse component is connected to the movable end of the electric rotary disk 3; the synchronous bidirectional moving component is connected to the second transverse component; the cleaning component is connected to the synchronous bidirectional moving component; the circular spray pipe 514 is connected to the synchronous bidirectional moving component; the circular spray pipe 514 is connected to the external pump body through a pipe.

[0065] A pre-rinsing mechanism 6 for rinsing the cleaning components and the front-opening door panel 71 is installed on the upper right side of the base 1.

[0066] A sealing cover 11 for blocking dust is fixedly installed on the upper end of the base 1; a sealing cap that can be flipped open is rotatably installed on the upper end of the sealing cover 11.

[0067] The base 1 has recycling tanks on both the left and right sides for collecting cleaning wastewater.

[0068] In this invention, the sealing cover on the sealing cover 11 is opened, the front opening door panel 71 of the front opening wafer carrier body 7 that needs to be cleaned is placed upward in the flipping and draining mechanism 2, and then the sealing cover is closed.

[0069] Then, the flipping and draining mechanism 2 drives the front-opening wafer carrier body 7 to rotate to the right, so that the front-opening door panel 71 is aligned with the unlocking component; then, the first lateral movement component pushes the front-opening door panel 71 to the left to ensure that the unlocking component is aligned with the front-opening door panel 71, and then the unlocking component separates the front-opening door panel 71 from the sealed box 72; the first lateral movement component controls the unlocking component to move to the right and reset, thereby completely separating the front-opening door panel 71 from the sealed box 72, exposing the slots inside the sealed box 72 used to place wafers, thereby realizing the automatic opening operation of the front-opening door panel 71 and reducing manual labor.

[0070] Furthermore, while the first lateral movement component controls the unlocking component to separate the front-opening door panel 71, the cleaning component is placed in the pre-rinsing mechanism 6, and the cleaning component is pre-cleaned by the pre-rinsing mechanism 6, thereby removing the residual debris on the cleaning component.

[0071] After the front-opening door panel 71 is completely separated from the sealed box 72, the second lateral movement component moves the cleaning component out of the pre-rinsing mechanism 6. Then, the electric rotary disk 3 controls the first lateral movement component and the second lateral movement component to rotate 180 degrees to ensure that the cleaning component is aligned with the sealed box 72 and the front-opening door panel 71 is aligned with the pre-rinsing mechanism 6.

[0072] Subsequently, the second transverse moving component controls the synchronous bidirectional moving component to move to the left into the sealed box 72. Then, the synchronous bidirectional moving component controls the cleaning component to clean the slots inside the sealed box 72, and the circular spray pipe 514 will continuously perform high-pressure rinsing on the slots to ensure that the device can clean the debris in the dead corners of the slots, thereby improving the cleaning quality and avoiding affecting the subsequent storage of wafers.

[0073] At this time, the first transverse component will also control the unlocking component and the front-opening door panel 71 to move into the pre-rinsing mechanism 6, and rinse the end of the front-opening door panel 71 near the inner wall of the sealing box 72 through the pre-rinsing mechanism 6, thereby ensuring that both the front-opening door panel 71 and the sealing box 72 can be cleaned inside the sealing cover 11, reducing the probability of contamination when the front-opening door panel 71 and the sealing box 72 are spliced ​​and reset after cleaning;

[0074] After cleaning, the second transverse component controls the synchronous bidirectional moving component to reset to the right, and the flipping draining mechanism 2 controls the sealing box 72 to rotate downwards by 90 degrees, so that the opening of the sealing box 72 faces downwards and is aligned with the recycling tank on the left side of the base 1. At this time, the water remaining in the sealing box 72 will flow into the recycling tank under its own weight.

[0075] Furthermore, the water remaining on the front-opening door panel 71 after rinsing will flow into the right-side recycling tank under its own weight.

[0076] Finally, the electric rotary disk 3 controls the first and second transverse components to rotate 180 degrees to reset, so that the front-opening door panel 71 is aligned with the sealed box 72 again. Then, the first transverse component controls the unlocking component to move to the left, and then the unlocking component reconnects and fixes the front-opening door panel 71 to the sealed box 72. The flipping and draining mechanism 2 controls the front-opening wafer carrier body 7 to rotate upward and reset. Then, the front-opening wafer carrier body 7 can be taken out and dried.

[0077] Example 2: In some embodiments, such as Figures 1-9As shown, in a preferred embodiment of the present invention, the flipping drainage mechanism 2 includes a stand 21, a flipping cylinder 22, a contouring fixing frame 23, a clamping cylinder 24, a clamping guide rod 25, and a contouring clamping plate 26; the stand 21 is symmetrically fixedly installed on the front and rear sides of the upper end of the base 1; the flipping cylinder 22 is fixedly installed on the front end of the front stand 21; the front and rear ends of the contouring fixing frame 23 are rotatably connected to the front and rear stands 21;

[0078] The output end of the tilting cylinder 22 is fixedly connected to the contour fixing bracket 23;

[0079] The clamping cylinder 24 is fixedly installed at the front end of the contouring frame 23; the clamping guide rod 25 is slidably installed at the rear end of the contouring frame 23.

[0080] The contouring clamp 26 is fixedly connected to the output end of the clamping cylinder 24; the contouring clamp 26 is fixedly connected to the clamping guide rod 25.

[0081] In this invention, the sealing cover on the sealing cover 11 is opened, and the front opening door plate 71 of the front opening wafer carrier body 7 that needs to be cleaned is placed upward on the upper end of the contour fixing frame 23, and then the sealing cover is closed.

[0082] Then, the clamping cylinder 24 controls the contour clamping plate 26 to move to the right following the clamping guide rod 25. At this time, the left and right ends of the sealed box 72 are respectively pressed against the inner walls of the contour clamping plate 26 and the contour fixing frame 23 to fix the front-opening wafer carrier body 7. Then, the flipping cylinder 22 controls the contour fixing frame 23 to rotate, so that the front-opening door plate 71 of the front-opening wafer carrier body 7 is aligned with the unlocking component.

[0083] The first transverse component includes a first mounting plate 41, a first cylinder slide module 42, and a movable plate 43; the first mounting plate 41 is fixedly mounted on the left side of the movable end of the electric rotary disk 3; the first cylinder slide module 42 is fixedly mounted on the first mounting plate 41; and the movable plate 43 is fixedly connected to the movable end of the first cylinder slide module 42.

[0084] Unlock the connection between the component and the activity board 43;

[0085] The unlocking assembly includes an unlocking motor 44 and an unlocking plug 45; the unlocking motor 44 is symmetrically fixedly installed on the front and rear sides of the right end of the movable plate 43; the unlocking plug 45 is symmetrically rotatably installed on the front and rear sides of the left end of the movable plate 43; the output end of the unlocking motor 44 is fixedly connected to the unlocking plug 45.

[0086] The unlocking plug 45 is inserted into the unlocking hole on the front-opening door panel 71;

[0087] The second transverse component includes a second mounting plate 51, a second cylinder slide module 52, and a positioning plate 53; the second mounting plate 51 is fixedly mounted on the right side of the movable end of the electric rotary table 3; the second cylinder slide module 52 is fixedly connected to the second mounting plate 51.

[0088] The positioning plate 53 is fixedly connected to the moving end of the second cylinder slide module 52;

[0089] The synchronous bidirectional moving component is connected to the positioning disk 53;

[0090] A circular spray pipe 514 is fixedly installed in the middle of the positioning plate 53; the circular spray pipe 514 is provided with water spray holes; the circular spray pipe 514 is connected to the external pump body through a pipeline.

[0091] The synchronous bidirectional movement component includes a drive component and a driven component; the drive component is connected to the positioning disk 53; the driven component is connected to both the positioning disk 53 and the drive component.

[0092] The drive assembly includes a servo slide module 56 and a drive board 57; the servo slide module 56 is fixedly installed at the lower end of the positioning disk 53; the drive board 57 is fixedly connected to the moving end of the servo slide module 56.

[0093] The driver board 57 is connected to the driven component;

[0094] The driven component includes a limiting guide rail 55, a pull rod 58, a driven plate 59, and a limiting roller 510; the positioning disk 53 has symmetrical arc-shaped guide grooves 54 on its front and rear sides;

[0095] The limiting guide rails 55 are symmetrically fixedly installed on the front and rear sides of the positioning plate 53;

[0096] The driven plate 59 is slidably connected to the limiting guide rail 55; the limiting roller 510 is rotatably mounted on the upper end of the driven plate 59; the limiting roller 510 is slidably connected to the arc-shaped guide groove 54.

[0097] There are two pull rods 58, and one end of the pull rod 58 is hinged to the drive plate 57; the other end of the pull rod 58 is hinged to the driven plate 59.

[0098] The cleaning component is connected to the front and rear driven plates 59;

[0099] The cleaning assembly includes an L-shaped mounting plate 511, an alignment plate 512, and a brush plate 513; the L-shaped mounting plate 511 is fixedly mounted on the upper end of the driven plate 59; multiple alignment plates 512 are fixedly mounted on the L-shaped mounting plate 511 at equal intervals; the brush plate 513 is fixedly connected to the alignment plate 512.

[0100] In this invention, after the front-opening door panel 71 is aligned with the unlocking plug 45, the first cylinder slide module 42 controls the movable plate 43 to move to the left. During the movement, the unlocking plug 45 will be inserted into the unlocking hole on the front-opening door panel 71. Then the unlocking motor 44 controls the unlocking plug 45 to rotate, thereby releasing the connection between the front-opening door panel 71 and the sealed box 72.

[0101] Subsequently, the first cylinder slide module 42 controls the movable plate 43 to reset to the right, and the unlocking block 45 drives the front opening door panel 71 to move to the right together, thereby completely separating the front opening door panel 71 from the sealed box 72 and exposing the slot inside the sealed box 72 used to place the wafer.

[0102] Subsequently, the electric rotary disk 3 controls the first mounting plate 41 and the second mounting plate 51 to rotate 180 degrees, ensuring that the circular spray pipe 514 is aligned with the sealed box 72 and the front-opening door panel 71 is aligned with the pre-rinsing mechanism 6.

[0103] Subsequently, the second cylinder slide module 52 controls the positioning plate 53 to move to the left into the sealed box 72. Then, the servo slide module 56 controls the drive plate 57 to move to the left. The leftward movement of the drive plate 57 will push the driven plate 59 and the limiting roller 510 to move to the left along the limiting guide rail 55 and the arc-shaped guide groove 54 via the pull rod 58. During the movement, the alignment plate 512 installed on the driven plate 59 will enter the slot of the sealed box 72. At this time, the brush plate 513 will sweep out the debris in the dead corner of the slot, and the circular spray pipe 514 will continuously spray the slot area with high pressure to ensure that the device can clean the debris in the dead corner of the slot, thereby improving the cleaning quality and avoiding affecting the subsequent storage of wafers.

[0104] At this time, the first cylinder slide module 42 will also control the front-opening door panel 71 to move into the pre-rinsing mechanism 6, and rinse the end of the front-opening door panel 71 near the inner wall of the sealing box 72 through the pre-rinsing mechanism 6, thereby ensuring that both the front-opening door panel 71 and the sealing box 72 can be cleaned inside the sealing cover 11, reducing the probability of contamination when the front-opening door panel 71 and the sealing box 72 are spliced ​​and reset after cleaning;

[0105] After cleaning, the second cylinder slide module 52 controls the positioning plate 53 to reset to the right, and the flip cylinder 22 controls the sealing box 72 to rotate downwards by 90 degrees, so that the opening of the sealing box 72 faces downwards and is aligned with the recycling tank on the left side of the base 1. At this time, most of the water remaining in the sealing box 72 will flow into the recycling tank under its own weight.

[0106] Furthermore, most of the water remaining on the front-opening door panel 71 after the rinsing operation will flow into the right-side recycling tank under its own weight;

[0107] Finally, the electric rotary table 3 controls the first mounting plate 41 and the second mounting plate 51 to rotate 180 degrees to reset, so that the front-opening door panel 71 is re-aligned with the sealed box 72. Then, the first cylinder slide module 42 controls the front-opening door panel 71 to move to the left. Then, the unlocking motor 44 controls the unlocking plug 45 to rotate and reset, so that the front-opening door panel 71 is reconnected and fixed to the sealed box 72. The flipping cylinder 22 controls the front-opening wafer carrier body 7 to rotate upward and reset. Then, the front-opening wafer carrier body 7 can be taken out and dried.

[0108] Example 3: In some embodiments, such as Figure 9 As shown, in a preferred embodiment of the present invention, the pre-rinsing mechanism 6 includes a secondary water baffle 61 and a square spray pipe 62; the secondary water baffle 61 is fixedly installed on the upper right side of the base 1.

[0109] Square spray pipes 62 are fixedly installed on the front, rear, and right inner walls of the secondary water baffle 61; the square spray pipes 62 are connected to the external pump body through pipelines.

[0110] In this invention, the square spray pipes 62 on the front and rear sides can pre-clean the brush plate 513, remove the residual debris on the brush plate 513, and ensure the quality of cleaning of the subsequent sealing box 72 slot by the brush plate 513.

[0111] The square spray pipe 62 on the right side can rinse the end of the front-opening door panel 71 near the inner wall of the sealed box 72, thereby improving the cleaning quality of the front-opening wafer carrier body 7.

[0112] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer carrier cleaning machine, comprising a base (1), characterized in that: It also includes a flipping and draining mechanism (2), an electric rotating disc (3), an automatic cap removal mechanism (4), a card slot bidirectional cleaning mechanism (5), and a pre-rinsing mechanism (6). The flipping and draining mechanism (2) for fixing the front-opening wafer carrier body (7) is installed on the upper left side of the base (1); The electric rotating disk (3) is fixedly installed in the middle of the base (1); An automatic lid-removing mechanism (4) for separating the front-opening door panel (71) from the sealed box (72) is installed on the left side of the movable end of the electric rotary table (3); A two-way cleaning mechanism (5) for cleaning the slots inside the sealed housing (72) is installed on the right side of the movable end of the electric rotary table (3); The card slot bidirectional cleaning mechanism (5) includes a second transverse component, a synchronous bidirectional moving component, a cleaning component, and a circular spray pipe (514). The second transverse component is connected to the movable end of the electric rotary disk (3); the synchronous bidirectional moving component is connected to the second transverse component; the cleaning component is connected to the synchronous bidirectional moving component; the circular spray pipe (514) is connected to the synchronous bidirectional moving component; the circular spray pipe (514) is connected to the external pump body through a pipe; A pre-rinse mechanism (6) for rinsing the cleaning components and the front-opening door panel (71) is installed on the upper right side of the base (1).

2. The wafer carrier cleaning machine according to claim 1, characterized in that, The automatic cap removal mechanism (4) includes a first transverse component and an unlocking component; the first transverse component is connected to the movable end of the electric rotary disk (3); the unlocking component is connected to the first transverse component.

3. The wafer carrier cleaning machine according to claim 2, characterized in that, The flipping drainage mechanism (2) includes a stand (21), a flipping cylinder (22), a contour fixing frame (23), and a clamping assembly; the stand (21) is symmetrically fixed on the front and rear sides of the upper end of the base (1); the flipping cylinder (22) is fixedly installed on the front end of the front stand (21); the front and rear ends of the contour fixing frame (23) are rotatably connected to the front and rear stands (21); The output end of the tilting cylinder (22) is fixedly connected to the contouring bracket (23); the clamping assembly is connected to the contouring bracket (23).

4. The wafer carrier cleaning machine according to claim 3, characterized in that, The clamping assembly includes a clamping cylinder (24), a clamping guide rod (25), and a contour clamping plate (26); the clamping cylinder (24) is fixedly installed at the front end of the contour fixing frame (23); the clamping guide rod (25) is slidably installed at the rear end of the contour fixing frame (23); The contour clamp (26) is fixedly connected to the output end of the clamping cylinder (24); the contour clamp (26) is fixedly connected to the clamping guide rod (25).

5. The wafer carrier cleaning machine according to claim 4, characterized in that, The first transverse component includes a first mounting plate (41), a first cylinder slide module (42), and a movable plate (43); the first mounting plate (41) is fixedly mounted on the left side of the movable end of the electric rotary disk (3); the first cylinder slide module (42) is fixedly mounted on the first mounting plate (41); the movable plate (43) is fixedly connected to the movable end of the first cylinder slide module (42); Unlock the connection between the component and the activity board (43).

6. The wafer carrier cleaning machine according to claim 5, characterized in that, The unlocking assembly includes an unlocking motor (44) and an unlocking plug (45); the unlocking motor (44) is symmetrically fixedly installed on the front and rear sides of the right end of the movable plate (43); the unlocking plug (45) is symmetrically rotated and installed on the front and rear sides of the left end of the movable plate (43); the output end of the unlocking motor (44) is fixedly connected to the unlocking plug (45); The unlocking plug (45) is inserted into the unlocking hole on the front-opening door panel (71).

7. The wafer carrier cleaning machine according to claim 6, characterized in that, The second transverse component includes a second mounting plate (51), a second cylinder slide module (52), and a positioning plate (53); the second mounting plate (51) is fixedly mounted on the right side of the movable end of the electric rotary table (3); the second cylinder slide module (52) is fixedly connected to the second mounting plate (51); The positioning plate (53) is fixedly connected to the moving end of the second cylinder slide module (52); The synchronous bidirectional moving component is connected to the positioning disk (53); A circular spray pipe (514) is fixedly installed in the middle of the positioning plate (53); the circular spray pipe (514) is provided with water spray holes; the circular spray pipe (514) is connected to the external pump body through a pipeline.

8. The wafer carrier cleaning machine according to claim 7, characterized in that, The synchronous bidirectional movement component includes a drive component and a driven component; the drive component is connected to the positioning disk (53); the driven component is connected to both the positioning disk (53) and the drive component; The drive assembly includes a servo slide module (56) and a drive board (57); the servo slide module (56) is fixedly installed at the lower end of the positioning disk (53); the drive board (57) is fixedly connected to the moving end of the servo slide module (56); The drive board (57) is connected to the driven component; The driven component includes a limiting guide rail (55), a pull rod (58), a driven plate (59), and a limiting roller (510); the positioning plate (53) has symmetrical arc-shaped guide grooves (54) on its front and rear sides. The limiting guide rails (55) are symmetrically fixed on the front and rear sides of the positioning plate (53); The driven plate (59) is slidably connected to the limiting guide rail (55); the limiting roller (510) is rotatably mounted on the upper end of the driven plate (59); the limiting roller (510) is slidably connected to the arc-shaped guide groove (54); Two pull rods (58) are provided, and one end of the pull rod (58) is hinged to the drive plate (57); the other end of the pull rod (58) is hinged to the driven plate (59); The cleaning component is connected to the front and rear driven plates (59).

9. The wafer carrier cleaning machine according to claim 8, characterized in that, The cleaning assembly includes an L-shaped mounting plate (511), an alignment plate (512), and a brush plate (513); the L-shaped mounting plate (511) is fixedly mounted on the upper end of the driven plate (59); multiple alignment plates (512) are fixedly mounted on the L-shaped mounting plate (511) at equal intervals; the brush plate (513) is fixedly connected to the alignment plate (512).

10. The wafer carrier cleaning machine according to claim 9, characterized in that, The pre-rinsing mechanism (6) includes a secondary water baffle (61) and a square spray pipe (62); the secondary water baffle (61) is fixedly installed on the upper right side of the base (1); Square spray pipes (62) are fixedly installed on the front and rear inner walls and the right inner wall of the secondary water tank (61).

Images