A system and method for cleaning the interior walls of a blind hole

Abstract

The application discloses a kind of inner wall cleaning system and method of blind hole piece, it is related to the technical field of cleaning.Cleaning system includes shell, gas blowing assembly, first polar plate, second polar plate, power supply and mounting assembly, gas blowing assembly is communicated with import and export, and it is used to blow into process gas to internal cavity;First polar plate is provided with through hole that passes through first polar plate;Second polar plate is spaced apart from first polar plate;Power supply is electrically connected with first polar plate and second polar plate, to be able to excite plasma in internal cavity, directional particle beam with spatial directionality is formed when plasma passes through through hole;Mounting assembly is located between first polar plate and second polar plate, and mounting assembly is equipped with the mounting position of being able to install and fix blind hole piece, and the hole side of blind hole piece is towards first polar plate when being installed in mounting position, to be able to make directional particle beam be shot into the hole of blind hole piece.The application solves the technical problem that the existing blind hole piece inner wall cleaning effect is poor.

Description

Technical Field

[0001] This invention relates to the field of cleaning technology, and more particularly to a system and method for cleaning the inner wall of a blind hole component. Background Technology

[0002] In the field of medical device manufacturing, blind-hole components made of low surface energy materials (PP, PE, PEBAX, etc.) are common device components, and are usually assembled into components through internal bonding. Due to their low surface energy, special surface treatment is required to increase the surface energy for adhesive bonding. Common treatment methods include: 1) Traditional plasma treatment: such as using single-gas radio frequency / low frequency plasma treatment to clean the inner wall of the blind hole, removing surface dirt or introducing active functional groups to increase surface energy. However, the effect is poor, and the surface energy increase is limited, especially with uneven treatment at the bottom of the blind hole. To improve the treatment effect, the power or time can be increased, but this can easily cause temperature accumulation and overheating, resulting in collapse, deformation, or even melting of the blind-hole component. 2) Chemical treatment: such as soaking or wiping the inner wall with strong acid / alkali solutions, increasing roughness and exposing the material interior through reactive corrosion or introducing polar functional groups to increase surface energy. However, this method has problems such as easily damaging the mechanical properties of the material, difficulty in liquid wetting of the inner wall, poor treatment effect, difficulty in cleaning the inner wall of the blind hole after cleaning, and chemical waste. 3) Primer treatment method: This method improves the adhesive strength between the two parts to be bonded by introducing coupling agents. However, primers generally have problems such as harmful solvent volatilization, high requirements for process preparation (temperature, humidity, and pH value), uneven application, poor stability, and difficult chemical waste disposal. 4) Coating modification method: This method introduces hydrophilic substances into the coating process inside blind holes to improve surface energy and increase adhesive strength. However, the coating equipment and materials are expensive, the coating adhesion is weak, the process is complex, the cycle is long, and it is not economical and affects efficiency.

[0003] Based on the above analysis, the various surface treatment methods for the inner walls of blind holes generally suffer from drawbacks such as poor treatment effect, insufficient uniformity of cleaning at the bottom of the blind hole, complex process, poor environmental performance, and high cost. Summary of the Invention

[0004] In view of this, the present invention provides an inner wall cleaning system and method for blind hole components, which solves the problem of poor cleaning effect of existing technologies for the inner wall of blind hole components.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted by the present invention is as follows: A cleaning system for the inner wall of a blind hole component, the blind hole component including opposing perforated and non-perforated sides, the cleaning system comprising: A housing having a closed internal cavity and an inlet and an outlet that connect the internal cavity to an external space; A gas blowing assembly is connected to the inlet and the outlet and is used to blow process gas into the internal cavity; A first electrode plate is housed in the internal cavity, and a through hole is formed in the first electrode plate; The second electrode plate is housed in the internal cavity and is spaced apart from the first electrode plate. A power source is electrically connected to both the first and second electrode plates to generate plasma in the internal cavity, which forms a spatially directional particle beam when passing through the through-hole. The device includes an installation assembly located between the first electrode plate and the second electrode plate. The installation assembly has an installation position for installing and fixing the blind hole component. When the blind hole component is installed at the installation position, the perforated side faces the first electrode plate so that the directional particle beam can be injected into the hole of the blind hole component.

[0006] In some embodiments of the inner wall cleaning system for the blind hole component, when the blind hole component is mounted on the mounting assembly, the axis of its blind hole is collinear with the axis of the formed directional particle beam.

[0007] In some embodiments of the inner wall cleaning system for the blind hole component, the cleaning system further includes a drive assembly, the output end of which extends into the inner cavity, the output end of which is configured to rotate about an axis, and the mounting assembly is sleeved and fixed to the output end of the drive assembly. Both the number of through holes and the number of installation positions are multiple. The multiple through holes are evenly distributed along the circumference of the first electrode plate, and each installation position corresponds one-to-one with the position of each through hole.

[0008] In some embodiments of the inner wall cleaning system of the blind hole component, the through hole is a round hole or a tapered hole, and when the through hole is a tapered hole, its large diameter end is located on the side away from the second electrode plate.

[0009] In some embodiments of the inner wall cleaning system of the blind hole component, the angle between the normal of the first electrode plate and the extension direction of the through hole is greater than 30 degrees and less than 90 degrees; the blind hole component is installed at an inclined position.

[0010] In some embodiments of the inner wall cleaning system for the blind hole component, when the blind hole component is installed on the mounting assembly, the distance between the perforated side and the corresponding through hole is 5mm-15mm.

[0011] In some embodiments of the inner wall cleaning system for the blind hole component, the cleaning system further includes a heat dissipation assembly configured to absorb heat from the outer wall of the housing; And / or, the interior of the first electrode plate is provided with a flow channel that bypasses the through hole, and coolant flows in the flow channel.

[0012] To solve the above-mentioned technical problems, the second technical solution adopted by the present invention is as follows: A method for cleaning the inner wall of a blind hole component, applied to the inner wall cleaning system for blind hole components described in the above embodiment, the cleaning method comprising the following steps: Provide blind hole parts; The blind hole component is degreased and purified using a non-reactive solvent; After degreasing and cleaning the blind hole parts, dry the blind hole parts; Place the dried blind hole component in the corresponding installation position of the mounting assembly, with the perforated side of the blind hole component facing the first electrode plate; The internal cavity of the shell is evacuated to a vacuum and then process gas is introduced. Turn on the power to stimulate the plasma.

[0013] In some embodiments of the method for cleaning the inner wall of the blind hole component, the process gas is a mixture of argon and oxygen, or a mixture of nitrogen and oxygen.

[0014] In some embodiments of the method for cleaning the inner wall of the blind hole component, the cleaning system further includes a drive assembly, the output end of which extends into the internal cavity, the output end of which is configured to rotate about an axis, and the mounting assembly is sleeved and fixed to the output end of the drive assembly. The number of through holes and the number of installation positions are both multiple. The multiple through holes are evenly distributed along the circumference of the first electrode plate, and each installation position corresponds one-to-one with the position of each through hole. The cleaning method further includes the following steps: Install the multiple blind hole components one by one at their corresponding mounting positions on the mounting assembly; Start the driver component to drive the installation component rotation.

[0015] Implementing the embodiments of the present invention will have at least the following beneficial effects: The aforementioned cleaning system and method for the inner wall of blind hole components have the technical advantage of effectively cleaning the inner wall of blind hole components. Specifically, the cleaning system and method of the present invention can excite process gas into plasma through a power supply, a first electrode plate, and a second electrode plate. Through the through-hole on the first electrode plate, the physical aperture constraint allows the plasma to form a spatially directional particle beam when passing through the through-hole. The directional particle beam can perform plasma treatment on the blind hole by entering it, thus changing the diffusion mode of plasma in the blind hole from passive penetration to active transport, effectively solving the problem of insufficient plasma density at the bottom of the blind hole. This cleaning method can produce blind hole components with good cleaning effect, solving the technical problem of poor cleaning effect of existing blind hole components. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] in: Figure 1 A schematic diagram of the process of removing contaminants by oxygen and argon plasma cleaning. Figure 2 This is a partial structural diagram of the cleaning system in one embodiment; Figure 3 This is a schematic cross-sectional view of the first electrode plate in one embodiment; Figure 4 This is a schematic cross-sectional view of the first electrode plate in one embodiment; Figure 5 This is a top view of the first electrode plate in one embodiment; Figure 6 This is a comparison diagram between existing cleaning methods and the cleaning method of the present invention; Figure 7 This is a flowchart of a cleaning method in one embodiment.

[0018] in: 1. First electrode plate; 11. Through hole; 2. Second electrode plate; 3. Mounting assembly; 31. Mounting position; 4. Drive assembly; 5. Blind hole component. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] To enable those skilled in the art to better understand the present invention, the following will be described in conjunction with the accompanying drawings. Figure 1-7 The technical solutions in the embodiments of the present invention will be clearly and completely described.

[0023] like Figure 1-6As shown, in an embodiment of an inner wall cleaning system for a blind hole component 5, the blind hole component 5 includes opposing perforated and non-perforated sides. The cleaning system includes a housing, a gas blowing assembly, a first electrode plate 1, a second electrode plate 2, a power supply, and a mounting assembly 3. The housing has a closed internal cavity, and an inlet and outlet gas blowing assembly that connects the internal cavity to the external space. The gas blowing assembly is connected to the inlet and outlet and is used to blow process gas into the internal cavity. The first electrode plate 1 is housed within the internal cavity, and a through hole 11 is formed on the first electrode plate 1. The diode 2 is housed in the internal cavity and is spaced apart from the first electrode 1. The power supply is electrically connected to both the first electrode 1 and the second electrode 2 to generate plasma in the internal cavity. When the plasma passes through the through hole 11, it forms a spatially directional particle beam. The mounting assembly 3 is located between the first electrode 1 and the second electrode 2. The mounting assembly 3 is provided with a mounting position 31 for mounting and fixing the blind hole component 5. When the blind hole component 5 is installed at the mounting position 31, the perforated side faces the first electrode 1 so that the directional particle beam can be injected into the hole of the blind hole component 5.

[0024] In this embodiment, the process gas can be excited into plasma by the power supply, the first electrode plate 1, and the second electrode plate 2. Through the through hole 11 on the first electrode plate 1, the physical aperture constraint allows the plasma to form a spatially directional particle beam when passing through the through hole 11. The directional particle beam can be injected into the blind hole to perform plasma treatment on the blind hole, thus changing the diffusion mode of the plasma in the blind hole from passive penetration to active transport entry, effectively solving the problem of insufficient plasma density at the bottom of the blind hole. Such cleaning can obtain a blind hole part 5 with good cleaning effect, solving the technical problem of poor cleaning effect of the inner wall of the blind hole part 5 in the existing technology.

[0025] It should be emphasized that the first electrode plate 1 is not only an electrical excitation source, but the through hole 11 on it is also an ion flow collimator, which can guide the direction of plasma movement and form a directional particle beam with spatial orientation.

[0026] Specifically, a clamp can be set at the installation position 31 to fix the blind hole component 5. A clamp that can wrap around the blind hole component 5 is preferred, such as a cylindrical structure or a clamp. In order to avoid slippage, an anti-slip pad can be set between the clamp and the blind hole component 5 for clamping. For example, a clamp with silicone or rubber on the clamping surface can be selected.

[0027] In one embodiment of an inner wall cleaning system for a blind hole component 5, when the blind hole component 5 is mounted on the mounting assembly 3, the axis of its blind hole is collinear with the axis of the formed directional particle beam.

[0028] In this embodiment, the axis of the blind hole is collinear with the axis of the directional particle beam, so that the directional particle beam can directly hit the bottom of the blind hole component 5, resulting in a better cleaning effect.

[0029] In other embodiments, the angle between the axis of the blind hole and the direction of the directed particle beam is 0-30 degrees. When the angle is 0 degrees, the two are parallel. When there is only one blind hole 5, they can be collinear and can be directly injected into the bottom of the hole of the blind hole 5.

[0030] In one embodiment of an inner wall cleaning system for a blind hole component 5, the cleaning system further includes a drive component 4, the output end of which extends into the inner cavity. The output end of the drive component 4 is configured to rotate around an axis. The mounting component 3 is sleeved on and fixed to the output end of the drive component 4. The number of through holes 11 and the number of mounting positions 31 are both multiple. The multiple through holes 11 are evenly distributed along the circumference of the first electrode plate 1. Each mounting position 31 corresponds one-to-one with the position of each through hole 11.

[0031] In this embodiment, by setting the driving component 4, multiple blind hole components 5 installed on the mounting component 3 can rotate together. Under the cleaning of the directional particle beam corresponding to the through hole 11 on the first electrode plate 1, the consistency of processing multiple blind hole components 5 can be ensured at the same time. At the same time, the rotation can avoid the difference in processing caused by the difference in air flow rate, thus ensuring consistency. On the other hand, the driving component 4 drives the mounting component 3 and the blind hole components 5 to rotate together around the axis, which can make the heat space uniform. The rotation can disturb the airflow to remove the heat accumulated in the blind hole components 5 during processing, thereby enhancing heat convection and heat dissipation.

[0032] Understandably, by causing the blind hole component 5 to revolve around an axis, each blind hole component 5 alternately passes through various flow and electric field regions within the cavity with the same cycle during the cleaning process. The active particle dose received by each workpiece within the cleaning cycle achieves "equalization on the time integral," thereby completely avoiding differences in airflow or discharge caused by spatial position differences and ensuring consistency in batch processing. In addition, the diffusion of the process gas is non-uniform. When the process gas diffuses under low pressure, there are slight fluctuations in local pressure and gas density when it flows through the through-hole 11 of the first electrode plate 1 at different positions. These fluctuations can also be avoided and resolved by rotating to disturb the airflow.

[0033] Specifically, the first electrode plate 1 and the second electrode plate 2 may not be connected to the output end of the drive assembly 4. For example, the first electrode plate 1 and the second electrode plate 2 may both be fitted on the output end of the drive assembly 4 but without contact. They can be fixedly connected to the inner wall of the housing through a connecting bracket or other means. Alternatively, the first electrode plate 1 and the second electrode plate 2 may both be fitted on the output end of the drive assembly 4 but will not rotate with the output end of the drive assembly 4. Similarly, the first electrode plate 1 and the second electrode plate 2 may be connected to the inner wall of the housing through an insulating component. Any method can be used to ensure that the first electrode plate 1 and the second electrode plate 2 do not rotate and maintain their relative positions.

[0034] It is understood that the drive assembly 4 can be a motor combined with an output shaft, and the output shaft is the output end of the drive assembly 4. Preferably, the first electrode plate 1 and the second electrode plate 2 are arranged in parallel, and their normals are both parallel to the rotation axis of the drive assembly 4.

[0035] In conjunction with the previous embodiments, when the mounting assembly 3 and its plurality of blind holes 5 are rotatable, the axis of the blind holes is parallel to the axis of the directional particle beam, and remains parallel during rotation.

[0036] In one embodiment of a blind hole component 5 inner wall cleaning system, such as Figure 3-4 As shown, the through hole 11 is a round hole or a conical hole. When the through hole 11 is a conical hole, its large diameter end is located on the side away from the second electrode plate 2.

[0037] In this embodiment, as Figure 3-4 As shown, circular and conical holes each have their advantages. Using a uniform diameter circular hole (i.e., a straight hole) provides better physical constraint and collimation for gas flow, resulting in a more concentrated and directional particle beam. This facilitates deeper plasma transport and is particularly suitable for cleaning blind holes with high aspect ratios and narrow apertures. Conical nozzles, on the other hand, help generate expansion and acceleration of high-speed gas, and the transition at the outlet is smoother, significantly reducing boundary turbulence and energy loss when the gas enters the blind hole. Furthermore, their active particle beam has a slightly wider diffusion surface, making them suitable for workpieces with larger apertures and extremely high temperature sensitivity (to prevent localized overheating), resulting in a smoother and more uniform transition from the hole opening to the bottom.

[0038] In one embodiment of an inner wall cleaning system for a blind hole component 5, the angle between the normal of the first electrode plate 1 and the extension direction of the through hole 11 is greater than 30 degrees and less than 90 degrees, and the blind hole component 5 is installed at the installation position 31 at an inclination.

[0039] In this embodiment, when the deflection angle is less than 30°, the constraint length of the through hole 11 along the axial direction of the drive component 4 is too short relative to its aperture, which will cause the divergence angle of the ejected active particle beam to be too large. This will cause the active particles to prematurely recombine and extinguish due to lateral thermal motion and collision with the sidewall before entering the blind hole, and will not be able to overcome the "shadow effect" at the bottom of the high aspect ratio blind hole. When the deflection angle is in the range of 30°-90°, the geometric constraint capability of the through hole 11 is significantly enhanced, forming a "collimated pipe" with a high aspect ratio to shield particles moving in the non-axial direction. Only near-parallel active particles are allowed to be ejected in a strong direction in a ballistic manner. The small-angle flow component force generated by the oblique injection can effectively assist in the replacement of the gas remaining at the bottom of the blind hole. Combined with the tilted deflection of the blind hole component 5, i.e., the collinear setting with the through hole 11, it can ensure that the directional particle beam is shot towards the bottom of the blind hole component 5 without obstruction and with high throughput, so as to achieve uniform activation of the inner wall of the blind hole component 5 within the entire length range. In addition, this tilted arrangement can make fuller and more rational use of the three-dimensional space inside the vacuum chamber, thereby freeing up more workpiece placement space on the rotating fixture, enabling more compact and larger batch loading in a single operation, and greatly improving the conversion efficiency of batch cleaning.

[0040] In one embodiment, such as Figure 5 As shown, multiple through holes 11 form multiple groups, and each group of through holes 11 is evenly distributed along the circumference of the first electrode plate 1. Different groups of through holes 11 form rings of different sizes, and each blind hole component 5 is provided corresponding to each through hole 11.

[0041] In one embodiment of an inner wall cleaning system for a blind hole component 5, the process gas is a mixture of argon and oxygen, or a mixture of nitrogen and oxygen.

[0042] In this embodiment, in the mixed gas, argon or nitrogen plasma is mainly used to physically bombard the inner wall of the blind hole 5, combined with the chemical reaction of oxygen plasma to remove organic pollutants, and the activation of the surface by oxygen-containing groups. The cleaning effect is significantly stronger than that of single-path process gas.

[0043] In one embodiment of an inner wall cleaning system for a blind hole component 5, the power supply has a pulse duty cycle of 10%-50% and a power of 100-500W. The cleaning time for a single cleaning cycle is less than 20 minutes, and the rotational speed of the drive component 4 is 5-60 rpm. Specifically, taking pulsed radio frequency plasma cleaning as an example: the pulse duty cycle is 50%, the frequency is 13.56 MHz, the power is 300W, the cleaning time is 10 minutes, the oxygen gas concentration is 200 sccm, the argon gas concentration is 200 sccm, and the rotational speed is 40 rpm.

[0044] It should be noted that the selection of plasma cleaning process parameters such as pulse duty cycle, discharge power, processing time and process gas ratio is primarily based on empirical values ​​that ensure stable low-temperature discharge and easy plasma excitation, and ensures a clear one-to-one correspondence between discharge current and output power under specific electrical conditions. In specific settings, these parameters need to be optimized in conjunction with the following key factors: First, the temperature sensitivity of the blind hole component 5. For materials with low Vicat softening or melting points, such as PEBAX and other temperature-sensitive substrates with a softening point of only 58°C, a low pulse duty cycle and low discharge power are usually used to prevent workpiece deformation, so as to allow sufficient thermal convection cooling intervals for the workpiece. Second, the geometric dimensions and depth-to-diameter ratio of the blind hole. The deeper the blind hole and the narrower the inner diameter, the greater the transport resistance of active particles and the greater the probability of boundary collision recombination. This requires the use of higher discharge power and matching current intensity, or a relatively longer cleaning time to ensure that the bottom of the hole receives a sufficient dose of active particles. Third, the type and thickness of surface contaminants. For example, if the workpiece surface is mainly composed of organic oil contaminants, the proportion of oxygen with strong chemical reactivity needs to be appropriately increased. For micro-dust or inert oxide layers, the proportion of argon needs to be increased to enhance physical bombardment removal. Through a comprehensive balance of the above factors, high-efficiency and high-quality surface activation can be achieved. The parameter settings in this embodiment, combined with the effect of directional particle beams directly hitting the bottom of the blind hole, can achieve a high-efficiency and high-quality cleaning effect.

[0045] In one specific embodiment, the power supply can be a DC pulse power supply, a low-frequency pulse power supply, a radio frequency pulse power supply, or a microwave pulse power supply, etc. Due to the presence of pulse gaps, the heat accumulation of the workpiece during plasma cleaning is significantly reduced, thereby reducing the temperature rise after cleaning.

[0046] Preferably, in one embodiment of the inner wall cleaning system for a blind hole component 5, the cleaning system further includes a vacuum generating assembly used to evacuate the internal cavity to a vacuum. By evacuating to a vacuum, interference can be reduced, achieving a better cleaning effect.

[0047] In one embodiment of an inner wall cleaning system for a blind hole component 5, when the blind hole component 5 is installed on the mounting assembly 3, the distance between the perforated side and the corresponding through hole 11 is 5mm-15mm.

[0048] In this embodiment, by setting the distance between the perforated side and the corresponding through hole 11 to 5mm-15mm, within this range, it is possible to ensure that the directional particle beam can be efficiently injected into the hole, and to effectively prevent arcing discharge between electrodes.

[0049] In one embodiment of an internal wall cleaning system for a blind hole component 5, the cleaning system further includes a heat dissipation assembly configured to absorb heat from the outer wall of the housing. And / or, the interior of the first electrode plate 1 is provided with a flow channel bypassing the through hole 11, and coolant flows within the flow channel.

[0050] In this embodiment, the heat dissipation component can dissipate heat from the casing by air cooling, liquid cooling by encircling the casing, or by using a semiconductor cooling chip. The first substrate has internal channels and coolant, which can extract the heat accumulated during discharge in situ. It is understood that the first electrode plate 1 is fixed and does not rotate. The coolant can be circulated by connecting a circulation pipeline and using components such as a water pump to dissipate heat from the first electrode plate 1.

[0051] Referring to the preceding embodiments, Figure 6 As shown, Figure 6 The upper image shows the cleaning effect of the present invention, and the lower image shows the cleaning effect of the prior art. After cleaning, the blind hole part 5 is cut open and tested with a dyne pen. Figure 6 The image above shows that the dyne pen is better moistened at the bottom of the blind hole (no obvious droplets appear, and it can be spread out completely), indicating that the cleaning effect is better.

[0052] This invention also relates to a method for cleaning the inner wall of a blind hole component 5, such as... Figure 7 As shown, the cleaning system applied in the previous embodiments, The cleaning method includes the following steps: S10, Provide 5 blind hole parts.

[0053] S20. The blind hole component 5 is degreased and purified using a non-reactive solvent.

[0054] S30. After degreasing and cleaning the blind hole part 5, dry the blind hole part 5.

[0055] S40. Place the dried blind hole component 5 on the mounting position 31 corresponding to the mounting assembly 3, and make the perforated side of the blind hole component 5 face the first electrode plate 1.

[0056] S50. Evacuate the internal cavity of the shell to a vacuum and introduce process gas.

[0057] S60. Start the power supply and stimulate the plasma.

[0058] In this embodiment, the physical aperture constraint of the through-hole 11 on the first electrode plate 1 allows the plasma to form a spatially directional particle beam when passing through the through-hole 11. This directional particle beam, injected into the blind hole, can perform plasma treatment on the blind hole, thus changing the plasma diffusion mode within the blind hole from passive penetration to active transport. This effectively solves the problem of insufficient plasma density at the bottom of the blind hole. Such cleaning results in a well-cleaned blind hole component 5, solving the existing technical problem of poor cleaning effect on the inner wall of the blind hole component 5. The process gas is a mixture of argon and oxygen, or a mixture of nitrogen and oxygen.

[0059] Alternatively, non-reactive solvents can be organic solvents or cleaning agents, and the organic solvents can be selected from one or more of lower alcohols, alkanes, or ketones. Preferably, to avoid swelling damage to PP, PE, or PEBAX materials, the organic solvent can be anhydrous ethanol, isopropanol (IPA), n-hexane, n-heptane, or petroleum ether.

[0060] In one embodiment of a method for cleaning the inner wall of a blind hole component 5, such as Figure 7 As shown, the cleaning method also includes the following steps: S70. Install the multiple blind hole parts 5 one by one on the mounting positions 31 of the mounting assembly 3.

[0061] S80, Startup driver component 4, drive installation component 3 rotate.

[0062] In this embodiment, by rotating multiple blind hole components 5, each blind hole component 5 alternately passes through various flow field and electric field regions within the cavity at the same cycle during the cleaning process. The active particle dose received by each workpiece within the cleaning cycle achieves "equalization on the time integral," thereby completely avoiding airflow or discharge differences caused by spatial position differences and ensuring consistency in batch processing. In addition, the diffusion of process gas is non-uniform. When the process gas diffuses under low pressure, there are slight fluctuations in local pressure and gas density when it flows through the through holes 11 of the first electrode plate 1 at different positions. This can also be avoided and resolved by rotating to disturb the airflow.

[0063] The above description discloses only preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A cleaning system for the inner wall of a blind hole component, characterized in that, The blind hole component includes opposing perforated and non-perforated sides, and the cleaning system includes: A housing having a closed internal cavity and an inlet and an outlet that connect the internal cavity to an external space; A gas blowing assembly is connected to the inlet and the outlet and is used to blow process gas into the internal cavity; A first electrode plate is housed in the internal cavity, and a through hole is formed in the first electrode plate; The second electrode plate is housed in the internal cavity and is spaced apart from the first electrode plate. A power source is electrically connected to both the first and second electrode plates to generate plasma in the internal cavity, which forms a spatially directional particle beam when passing through the through-hole. The device includes an installation assembly located between the first electrode plate and the second electrode plate. The installation assembly has an installation position for mounting and fixing the blind hole component. When the blind hole component is installed at the installation position, the perforated side faces the first electrode plate so that the directional particle beam can be injected into the hole of the blind hole component.

2. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, When the blind hole component is installed on the mounting assembly, the axis of its blind hole is collinear with the axis of the formed directional particle beam.

3. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, The cleaning system also includes a drive assembly, the output end of which extends into the internal cavity and is configured to rotate around an axis, and the mounting assembly is sleeved on and fixed to the output end of the drive assembly. Both the number of through holes and the number of installation positions are multiple. The multiple through holes are evenly distributed along the circumference of the first electrode plate, and each installation position corresponds one-to-one with the position of each through hole.

4. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, The through hole is either a round hole or a tapered hole. When the through hole is a tapered hole, its larger diameter end is located on the side away from the second electrode plate.

5. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, The angle between the normal of the first electrode plate and the extension direction of the through hole is greater than 30 degrees and less than 90 degrees; the blind hole component is installed at an angle at the installation position.

6. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, When the blind hole component is installed on the mounting assembly, the distance between the perforated side and the corresponding through hole is 5mm-15mm.

7. The inner wall cleaning system for blind hole components as described in claim 1, characterized in that, The cleaning system also includes a heat dissipation component, which is configured to absorb heat from the outer wall of the housing; And / or, the interior of the first electrode plate is provided with a flow channel that bypasses the through hole, and coolant flows in the flow channel.

8. A method for cleaning the inner wall of a blind hole component, characterized in that, Applied to the cleaning system as described in any one of claims 1-7, the cleaning method includes the following steps: Provide blind hole parts; The blind hole component is degreased and purified using a non-reactive solvent; After degreasing and cleaning the blind hole parts, dry the blind hole parts; Place the dried blind hole component in the corresponding installation position of the mounting assembly, with the perforated side of the blind hole component facing the first electrode plate; The internal cavity of the shell is evacuated to a vacuum and then process gas is introduced. Turn on the power to stimulate the plasma.

9. The method for cleaning the inner wall of a blind hole component as described in claim 8, characterized in that, The process gas is a mixture of argon and oxygen, or a mixture of nitrogen and oxygen.

10. The method for cleaning the inner wall of a blind hole component as described in claim 8, characterized in that, The cleaning system also includes a drive assembly, the output end of which extends into the internal cavity and is configured to rotate around an axis, and the mounting assembly is sleeved on and fixed to the output end of the drive assembly. The number of through holes and the number of installation positions are both multiple. The multiple through holes are evenly distributed along the circumference of the first electrode plate, and each installation position corresponds one-to-one with the position of each through hole. The cleaning method further includes the following steps: Install the multiple blind hole components one by one at their corresponding mounting positions on the mounting assembly; Start the driver component to drive the installation component rotation.

Images