A semiconductor copper sheet stamping apparatus

Abstract

The application relates to a semiconductor copper sheet stamping device, which comprises a workbench, a copper sheet feeding mechanism, a first transfer manipulator, a copper sheet positioning mechanism, a second transfer manipulator, a copper sheet blanking mechanism, a finished product discharging mechanism, a tray transfer device, a tray feeding mechanism, a tray taking manipulator, a tray discharging and carrying manipulator, a tray discharging conveying belt and a waste collecting device. The second transfer manipulator is configured to drive the copper sheet to move to a plurality of preset blanking positions in the copper sheet blanking mechanism in sequence during the blanking process, so that a plurality of finished products are blanked on the copper sheet in batches and finally form a waste frame. The device realizes batch blanking by driving the copper sheet to move multiple times through the transfer manipulator, effectively increases the punch pin spacing, improves the strength and service life of the punch pin structure, and cooperates with the finished product discharging mechanism to reliably take out the finished product after each blanking, thereby improving the production automation degree and the processing yield.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a stamping device for stamping semiconductor copper sheets. Background Technology

[0002] In the semiconductor packaging process, copper sheet stamping is a key manufacturing step, which involves stamping copper sheets into multiple small finished copper sheets that meet specific specifications.

[0003] For processing scenarios requiring the cutting of multiple finished products from the same copper sheet, traditional stamping equipment typically employs a one-time cutting method, where the stamping die completes the cutting of all finished products in a single stamping stroke. This method requires a dense arrangement of punches on the die, with small spacing between adjacent punches. However, when it is difficult to guarantee excessively small punch spacing, the structural strength of the punches will be severely affected, making them prone to breakage or wear during long-term use, thereby reducing punch lifespan and the yield rate of finished products.

[0004] To address these issues, the industry has attempted to increase the spacing between punches and employ a multi-stage punching method to process the entire copper sheet. However, in practical applications, existing equipment lacks effective means to achieve precise displacement and positioning of the copper sheet within the punching station, making it difficult to ensure consistency and accuracy in each punching operation. Furthermore, reliably removing and transferring the punched product without affecting subsequent processes during multi-stage punching is also a key challenge hindering the automation and efficiency of this type of equipment.

[0005] Therefore, how to achieve precise, multi-stage displacement of the copper sheet within the stamping station while ensuring sufficient spacing between the punches, and how to reliably complete the unloading of the finished product, is an urgent problem to be solved in the current semiconductor copper sheet stamping process. Summary of the Invention

[0006] The purpose of this application is to provide a semiconductor copper sheet stamping equipment to solve the problems that existing stamping equipment, after increasing the distance between the punches, is unable to accurately shift the copper sheet in multiple stages within the stamping station, and is unable to reliably complete the unloading of finished products.

[0007] To achieve the above objectives, this application provides the following technical solution:

[0008] A semiconductor copper sheet stamping machine includes: a worktable;

[0009] A copper sheet feeding mechanism is set on the worktable and is used to separate stacked copper sheets one by one and lift them to the discharge port;

[0010] The first transfer robot arm is used to pick up a single copper sheet from the discharge port; the copper sheet positioning mechanism is set on the worktable and is used to detect the position and adjust the posture of the copper sheet picked up by the first transfer robot arm.

[0011] The second transfer robot is used to pick up the copper sheet after it has been adjusted by the copper sheet positioning mechanism and transfer it to the copper sheet punching mechanism; the second transfer robot is also configured to drive the copper sheet to move sequentially to a number of different preset punching positions in the copper sheet punching mechanism during the punching process.

[0012] The copper sheet punching mechanism includes a punch press and a punching die, which is used to perform a punching action on the copper sheet when the second transfer robot moves the copper sheet to each of the preset punching positions, so as to punch out multiple finished products on the copper sheet in batches and finally form a waste frame.

[0013] The finished product unloading mechanism includes an unloading and picking device and a picking device; the unloading and picking device is used to pick up all finished products from the punching die at one time; the picking device is used to peel the finished products from the unloading and picking device into the tray on the tray transfer device at one time; the tray transfer device is used to carry and position the tray to receive the finished products peeled off by the picking device.

[0014] A tray feeding mechanism is used to stack and store empty trays; a tray picking robot is used to pick up empty trays from the tray feeding mechanism and transport them to the tray transfer device.

[0015] A material tray unloading and handling robot is used to transport a material tray loaded with finished copper sheets from the material tray transfer device to the material tray unloading conveyor belt;

[0016] The material tray unloading conveyor belt is used to output the material tray;

[0017] Waste collection device, used to collect the waste frames formed after punching.

[0018] Furthermore, the blanking die includes an upper blanking die and a lower blanking die. The upper blanking die is provided with a punch fixing plate and a forming punch. The lower blanking die is correspondingly provided with an inner support ejector plate and an inner support ejector. The head of the inner support ejector is provided with a small hole for generating vacuum suction force. The cutting edge surface of the lower blanking die is provided with a hole for generating vacuum suction force, so as to adsorb the finished product and the remaining copper sheet material after blanking. The inner support ejector is also configured to lift the finished product upward to the cutting edge surface after one blanking operation. A cylinder is provided below the lower blanking die for pulling the inner support ejector to retract during stamping. After the punch returns to its original position, the cylinder releases the pressure, and the spring force rebounds to lift the finished product back to the cutting edge surface.

[0019] Furthermore, the material feeding and picking device includes a material feeding transverse module, a material feeding lifting module, and a material feeding suction platform. The bottom of the material feeding suction platform is provided with a plurality of suction heads arranged in an array, and each suction head is provided with an adsorption hole at its bottom. The material picking device includes a material picking transverse module, a material picking lifting module, and a material picking plate. The material picking plate is provided with a plurality of clearance grooves for avoiding the suction heads. The material feeding suction platform is configured to extend into the punching die and conform to the cutting edge surface of the lower die to pick up the finished product. The material picking plate is configured to be able to move below the material feeding suction platform and pass through the suction head through the clearance grooves to peel off the finished product when the suction head releases vacuum.

[0020] Furthermore, the copper sheet feeding mechanism includes a copper sheet hopper, a copper sheet lifting device, and an anti-blocking separation device; the side wall of the copper sheet hopper is provided with multiple limiting plates extending vertically, the limiting plates are provided with an anti-scratch coating, and the bottom is provided with bakelite blocks; the anti-blocking separation device is located at the outlet of the copper sheet hopper, including a passive blocking brush, an active blocking brush, and an air-blowing separation device; the passive blocking brush and the active blocking brush are symmetrically arranged on both sides of the outlet, and the active blocking brush is connected to a driving cylinder to drive them to move closer or further apart; the air-blowing separation device is located corresponding to the outlet; when the copper sheet is discharged, it is first separated by air-blowing separation device, and then further separated by passive blocking brush and active blocking brush to ensure that the copper sheet is a single piece.

[0021] Furthermore, the copper sheet lifting device includes a lifting motor, a lifting gear, a lifting rack, and a lifting plate. The lifting plate is used to place stacked copper sheets. The lifting gear is mounted on the lifting motor. The lifting motor drives the lifting rack through the lifting gear to drive the lifting plate to move up and down.

[0022] Furthermore, the copper sheet positioning mechanism includes a positioning platform, a light source, and a positioning camera; the positioning platform is made of transparent acrylic material, allowing light from the light source to pass through, and a vacuum cavity is formed inside the acrylic material to form a vacuum adsorption part for adsorbing the copper sheet; three motors are arranged below the positioning platform, which are used to drive the positioning platform to move back and forth, move left and right, and rotate, respectively, so as to adjust the copper sheet to the position set by the positioning camera.

[0023] Furthermore, the first transfer robot includes a first lateral movement module, a first lifting module, a first suction plate, and a first buffer. The first suction plate is mounted on the first lifting module, the first lifting module is mounted on the first lateral movement module, and the first buffer is mounted at the bottom of the lifting plate of the first lifting module. The first transfer robot also includes a double-sheet detection transmitter, and a double-sheet detection receiver is correspondingly provided on one side of the copper sheet positioning mechanism. The double-sheet detection transmitter cooperates with the double-sheet detection receiver to detect whether the first transfer robot has picked up double copper sheets.

[0024] Furthermore, the material tray feeding mechanism includes a material tray hopper and a material tray lifting device. The material tray hopper is used to stack and store material trays, and the material tray lifting device is located at the bottom of the material tray hopper to lift the material trays, making it convenient for the material tray picking robot to pick up the material.

[0025] Furthermore, the material tray picking robot includes a material tray picking traversing module, a material tray picking lifting module, and a material tray picking lifting plate. The material tray picking lifting plate is equipped with multiple sets of material tray picking suction cups. The material tray picking traversing module and the material tray picking lifting module drive the material tray picking lifting plate to move the material tray picking suction cups to the discharge port of the material tray hopper. The material tray picking suction cups pick up the material tray and move the material tray to the material tray transfer device.

[0026] The beneficial effects of this application are as follows:

[0027] The semiconductor copper sheet stamping equipment provided in this application uses a second transfer robot to sequentially move the copper sheet to multiple different preset stamping positions during the stamping process. This, combined with the copper sheet stamping mechanism, performs the stamping action sequentially, achieving multi-stage stamping of a single copper sheet. By distributing the punches, which would otherwise need to be densely arranged, to different stamping positions, the spacing between adjacent punches is effectively increased, thereby significantly improving the structural strength and fracture resistance of the punches, extending their service life, and ensuring a high yield of stamped finished products.

[0028] After each punching operation, the second transfer robot first removes the copper sheet from the mold to wait. The finished product unloading mechanism then removes the punched product from the mold. Subsequently, the second transfer robot moves the copper sheet back into the mold for the next punching and positioning. This "punch once, retrieve once" operation method ensures that the finished product produced by each punching operation can be retrieved promptly and reliably, avoiding positional shifts or interference with the mold during subsequent transfers. This ensures positioning accuracy and product integrity between each punching operation. Furthermore, since each punching operation produces only a small number of finished products, the unloading and reloading device only needs to pick up a small number of products each time, making the picking action more reliable and reducing the risk of missed or misaligned pickups.

[0029] After all four punching processes are completed, only the scrap frame remains on the copper sheet. The scrap frame is then removed by the second transfer robot or the finished product unloading mechanism and placed into the scrap collection device, thus achieving the separation of finished product and scrap and avoiding the impact of scrap accumulation on continuous operation.

[0030] Furthermore, the copper sheet positioning mechanism, through the cooperation of visual inspection and a vacuum adsorption platform, performs precise position detection and posture adjustment of the copper sheet to be punched, providing a consistent positioning benchmark for subsequent multiple shifting punching operations and ensuring the relative accuracy between the punching positions. The coordinated operation of the tray feeding mechanism, the tray picking robot, the tray transfer device, and the tray unloading robot enables automatic tray feeding, positioning, and unloading, further improving the overall automation level and production efficiency of the equipment. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the square copper sheet Q provided in this application;

[0032] Figure 2 This is a top view of the semiconductor copper sheet stamping equipment provided in this application;

[0033] Figure 3 This is a schematic diagram of the copper sheet feeding mechanism provided in this application;

[0034] Figure 4 This is a front view of the copper sheet feeding mechanism provided in this application;

[0035] Figure 5 A schematic diagram of the structure of the first transfer robot provided in this application;

[0036] Figure 6 This is a schematic diagram of the copper sheet positioning mechanism provided in this application;

[0037] Figure 7 A schematic diagram of the structure of the second transfer robot provided in this application;

[0038] Figure 8 This is a schematic diagram of the copper sheet punching mechanism provided in this application;

[0039] Figure 9 A schematic diagram of the structure of the blanking die provided in this application;

[0040] Figure 10 for Figure 9 A magnified view of a portion at point A;

[0041] Figure 11 A structural schematic diagram of the finished product feeding mechanism provided in this application;

[0042] Figure 12 A front view of the finished product feeding mechanism provided in this application;

[0043] Figure 13 for Figure 11 A magnified view of the area at point B;

[0044] Figure 14 This is a schematic diagram of the material tray feeding mechanism provided in this application;

[0045] Figure 15 A top view of the tray feeding mechanism provided in this application;

[0046] Figure 16 This is a schematic diagram of the material handling robot provided in this application;

[0047] Figure 17 This is a schematic diagram of the material tray transfer device provided in this application;

[0048] Figure 18 A schematic diagram of the material tray unloading and handling robot provided in this application; Detailed Implementation

[0049] Please see Figures 1 to 2 This application provides a semiconductor copper sheet stamping equipment in one embodiment. This equipment is used to stamp 85mm×85mm square copper sheets Q into multiple small finished copper sheets q arranged in an array. It mainly includes a worktable 100, a copper sheet feeding mechanism 200, a first transfer robot 300, a copper sheet positioning mechanism 400, a second transfer robot 500, a copper sheet stamping mechanism 600, a finished product unloading mechanism 700, a tray transfer device 800, a tray feeding mechanism 900, a tray picking robot 1000, a tray unloading and handling robot 1100, a tray unloading conveyor belt 1200, and a waste collection device 1300. The following provides a detailed description of each component, their connections, and their working principles.

[0050] like Figure 1 As shown, the workbench 100 serves as the mounting base for the entire equipment, supporting the aforementioned mechanisms and devices. The upper surface of the workbench 100 is horizontal, and the mechanisms are arranged sequentially on the workbench 100 according to the processing flow of the copper sheets.

[0051] like Figure 3 and Figure 4 As shown, the copper sheet feeding mechanism 200 is set on the worktable 100 and is used to separate the stacked copper sheets one by one and lift them to the discharge port 212 for the first transfer robot 300 to pick up.

[0052] The copper sheet feeding mechanism 200 includes a copper sheet hopper 210, a copper sheet lifting device 220, and an anti-blocking separation device 230.

[0053] The copper sheet hopper 210 is used to stack and store copper sheets to be processed. The side walls of the copper sheet hopper 210 are provided with multiple vertically extending limiting plates 211, which are used to circumferentially limit the stacked copper sheets and prevent them from tilting during lifting. The limiting plates 211 are coated with an anti-scratch coating to prevent scratches caused by friction between the copper sheets and the surface of the limiting plates 211 during lifting. The bottom of the copper sheet hopper 210 is provided with bakelite blocks to support the stacked copper sheets. The bakelite blocks have good insulation and wear resistance, preventing damage to the surface of the copper sheets. The top of the copper sheet hopper 210 is the discharge port 212, through which the copper sheets are removed one by one.

[0054] A copper sheet lifting device 220 is located below the copper sheet hopper 210 and is used to lift stacked copper sheets upwards to the discharge port 212. The copper sheet lifting device 220 includes a lifting motor 221, a lifting gear, a lifting rack 223, and a lifting plate 224. The lifting plate 224 is used to hold the stacked copper sheets. The lifting gear is mounted on the output shaft of the lifting motor 221. The lifting motor 221 drives the lifting rack 223 to move through the lifting gear, thereby causing the lifting plate 224 to move vertically up and down. As the lifting plate 224 gradually rises, the stacked copper sheets are pushed one by one to the discharge port 212.

[0055] An anti-blocking separation device 230 is installed at the outlet 212 of the copper sheet hopper 210 to separate the copper sheets lifted to the outlet 212 one by one, preventing multiple sheets from being sucked up at once due to adhesion between them. The anti-blocking separation device 230 includes a passive blocking brush 231, an active blocking brush 232, and an air-blowing separation device 234. The passive blocking brush 231 and the active blocking brush 232 are symmetrically arranged on both sides of the outlet 212. The active blocking brush 232 is connected to a drive cylinder 233, which can drive the active blocking brushes 232 on both sides to move closer or further apart. The air-blowing separation device 234 is installed corresponding to the outlet 212. When the copper sheet is discharged, air is first blown onto the lifted copper sheet by the air separation device 234 to initially separate the copper sheets that are stuck together. Then, the copper sheets are further separated by the mechanical scraping action of the passive material separation brush 231 and the active material separation brush 232 to ensure that the copper sheet that is finally taken out is a single piece.

[0056] like Figure 5 As shown, the first transfer robot 300 is positioned between the copper sheet feeding mechanism 200 and the copper sheet positioning mechanism 400, and is used to pick up a single copper sheet from the discharge port 212 and transfer it to the copper sheet positioning mechanism 400.

[0057] The first transfer robot 300 includes a first horizontal movement module 310, a first lifting module 320, a first suction plate 330, and a first buffer 340. The first suction plate 330 is mounted on the first lifting module 320, which in turn is mounted on the first horizontal movement module 310. The first horizontal movement module 310 drives the first suction plate 330 to move horizontally, and the first lifting module 320 drives the first suction plate 330 to move vertically. The first suction plate 330 is equipped with multiple suction cups for picking up copper sheets. The first buffer 340 is installed at the bottom of the lifting plate of the first lifting module 320 to provide cushioning when the first suction plate 330 descends and contacts the copper sheets, preventing damage to the copper sheets.

[0058] The first transfer robot 300 also includes a double-sheet detection transmitter 350, and a double-sheet detection receiver 440 is correspondingly provided on one side of the copper sheet positioning mechanism 400. When the first transfer robot 300 picks up a copper sheet and moves it above the copper sheet positioning mechanism 400, the double-sheet detection transmitter 350 and the double-sheet detection receiver 440 work together to determine whether double copper sheets have been picked up by detecting the thickness or light transmittance of the copper sheets. If double sheets are detected, an alarm is issued and the machine is stopped.

[0059] like Figure 6 As shown, the copper sheet positioning mechanism 400 is set on the worktable 100 and located on the moving path of the first transfer robot 300. It is used to perform precise position detection and attitude adjustment on the copper sheet picked up by the first transfer robot 300, so as to provide a unified positioning reference for subsequent stamping.

[0060] The copper sheet positioning mechanism 400 includes a positioning platform 410, a light source 420, and a positioning camera 430. The positioning platform 410, preferably made of transparent acrylic, supports the copper sheet, allowing light emitted from the light source 420 to pass through, thus facilitating the positioning camera 430 to capture images of the copper sheet from below or above. A vacuum cavity is formed within the acrylic material to constitute a vacuum adsorption section, used to adsorb the copper sheet placed on it, preventing displacement during posture adjustment. Three motors are located below the positioning platform 410, respectively driving the platform to move forward and backward, move left and right, and rotate. The positioning camera 430 captures images of the copper sheet's position and controls the three motors based on the image processing results, adjusting the copper sheet to a preset shooting position for precise positioning.

[0061] The first transfer robot 300 moves the copper sheet onto the positioning platform 410. After the positioning camera 430 and the light source 420 perform visual positioning of the copper sheet, the second transfer robot 500 picks up the positioned copper sheet and transfers it to the copper sheet punching mechanism 600.

[0062] like Figure 7As shown, the second transfer robot 500 is used to pick up the copper sheet adjusted by the copper sheet positioning mechanism 400 and transfer it to the copper sheet punching mechanism 600. The difference is that the suction holes of the inner and outer rings of the suction cup of the second transfer robot can be independently controlled to open and close. This can prevent the material in the middle of the copper sheet from collapsing during the punching process when it is not completely punched. After the punching is completed, the material in the middle is completely hollowed out and there are no suction points. It is necessary to close the middle suction hole separately to prevent air leakage.

[0063] Unlike the first transfer robot 300, which moves forward and backward and up and down, the second transfer robot 500 is also configured to move forward and backward, left and right and up and down during the punching process, so as to drive the copper sheet to change to multiple different preset punching positions in the punching die 620 in sequence, so as to complete the entire finished punching of a copper sheet in four punchings.

[0064] like Figures 8 to 10 As shown, the copper sheet punching mechanism 600 includes a punch press 610 and a punching die 620, which is used to perform a punching action on the copper sheet when the second transfer robot 500 moves the copper sheet to each preset punching position, so as to punch out multiple finished products on the copper sheet in batches and finally form a scrap frame.

[0065] The blanking die 620 includes an upper blanking die 621 and a lower blanking die 622. The upper blanking die 621 is provided with a punch fixing plate 6211 and a forming punch 6212, and the forming punch 6212 is mounted on the upper blanking die 621 via the punch fixing plate 6211. The lower blanking die 622 is correspondingly provided with an inner support ejector plate 6221 and an inner support ejector pin 6222.

[0066] Considering that the spacing of the forming punches 6212 should not be too small, otherwise it will affect the structural strength and service life of the punches, this embodiment makes the punch spacing larger. By using the function of the second transfer robot 500 to move back and forth and left and right, the position is adjusted to place the finished product of a copper sheet into the punching die 620 in four batches.

[0067] During punching, the copper sheet T is placed between the upper punching die 621 and the lower punching die 622. The head of the inner ejector pin 6222 has a small hole W for generating vacuum suction force. The small hole W extends out of the cutting edge surface 6223 of the lower punching die 622, and this small hole W communicates with the air extraction channel R of the inner ejector pin push plate 6221. A cylinder 623 is located below the lower punching die 622. During punching, the cylinder 623 pulls the inner ejector pin 6222 to retract, making way for the downward pressure of the forming punch 6212. After punching is completed, the forming punch 6212 returns to its original position, and the finished copper sheet remains in the cutting edge groove of the head of the inner ejector pin 6222, and is vacuum-adsorbed by the small hole at the head of the inner ejector pin 6222; the remaining material of the copper sheet T remains on the cutting edge surface 6223, and is adsorbed by the vacuum suction hole Y on the cutting edge surface 6223. Vacuum adsorption holes on the blade face 6223 are distributed on the four sides of the blade face 6223, and the vacuum adsorption on each side can be independently controlled to be turned on and off. In each stamping position, the two sides that do not leak vacuum are adsorbed to ensure that the remaining material of the copper sheet is reliably fixed.

[0068] Subsequently, the cylinder 623 releases the pressure, and the spring E rebounds, lifting the inner support pin 6222 upwards, thus lifting the finished copper sheet back to the cutting edge 6223.

[0069] like Figures 11 to 13 As shown, the finished product unloading mechanism 700 includes an unloading and picking device 710 and a picking device 720. The unloading and picking device 710 is used to pick up the finished copper sheet from the punching die 620; the picking device 720 is used to peel the finished copper sheet from the unloading and picking device 710 into the tray on the tray transfer device 800.

[0070] The material feeding and picking device 710 includes a material feeding transverse module 711, a material feeding lifting module 712, and a material feeding suction platform 713. The bottom of the material feeding suction platform 713 is provided with multiple arrayed suction heads 714, each suction head 714 having a suction hole at its bottom. The material feeding device 720 includes a material feeding transverse module 721, a material feeding lifting module 722, and a material feeding plate 723. The material feeding plate 723 is provided with multiple clearance grooves 724 for avoiding the suction heads 714. The material feeding plate 723 is mounted on the material feeding lifting module 722, and the material feeding lifting module 722 is mounted on the material feeding transverse module 721.

[0071] After each blanking cycle, the second transfer robot 500 removes the remaining copper sheet material from the mold and waits for it to finish. The finished product unloading mechanism 700 then begins operation. The unloading and picking device 710's unloading suction platform 713 extends into the blanking mold 620, fitting against the lower die cutting edge 6223. The suction head 714 activates vacuum suction to pick up the finished copper sheet. Simultaneously, the small hole at the head of the inner support pin 6222 breaks the vacuum, completing the vacuum suction interaction, and the finished copper sheet is reliably adsorbed onto the suction head 714. The unloading suction platform 713 then removes the finished copper sheet from the blanking mold 620 via the unloading transverse module 711 and the unloading lifting module 712.

[0072] Subsequently, the unloading and suction platform 713 transfers the finished copper sheet to the material tray on the material tray transfer device 800, and the material feeding device 720 starts. The material feeding lateral movement module 721 drives the material feeding plate 723 to move below the unloading and suction platform 713, and the material feeding lifting module 722 drives the material feeding plate 723 to rise, inserting the suction head 714 from one side. After passing through the clearance groove 724 to avoid the finished copper sheet, it is inserted between the suction heads 714. Then, the material feeding lifting module 722 drives the material feeding plate 723 to descend, the suction head 714 stops sucking up the copper sheet, and the material feeding plate 723 simultaneously peels the finished copper sheet from the suction head 714 onto the material tray of the material tray transfer device 800.

[0073] After the current finished product is cut, the second transfer robot 500 moves the remaining copper sheet material into the punching die 620, adjusts it to the next preset punching position, and performs the next punching. The above actions are repeated to complete four punching operations in sequence. After each punching operation, the finished product is removed, and the remaining copper sheet material is finally formed into a scrap frame.

[0074] like Figures 14 to 15 As shown, the tray loading mechanism 900 is used to stack and store empty trays and eject the empty trays P one by one. The tray loading mechanism 900 includes a tray hopper 910 and a tray lifting device (not shown in the figure). The tray lifting device has the same structure as the copper sheet lifting device 220. The tray hopper 910 is used to stack and store trays, which are used to hold the finished copper sheets after punching. The tray lifting device is located at the bottom of the tray hopper 910 and is used to lift the trays, making it convenient for the tray unloading robot 1000 to pick up the materials from the outlet of the tray hopper 910.

[0075] like Figure 16As shown, the tray-retrieving robot 1000 is used to pick up empty trays from the tray loading mechanism 900 and transport them to the tray transfer device 800. The tray-retrieving robot 1000 includes a tray-retrieving lateral movement module 1010, a tray-retrieving lifting module 1020, and a tray-retrieving lifting plate 1030. The tray-retrieving lifting plate 1030 is equipped with multiple sets of tray-retrieving suction cups 1040. The tray-retrieving lateral movement module 1010 and the tray-retrieving lifting module 1020 drive the tray-retrieving lifting plate 1030 to move the tray-retrieving suction cups 1040 to the discharge port of the tray hopper 910. The tray-retrieving suction cups 1040 pick up the tray and move it onto the tray transfer device 800.

[0076] like Figure 17 As shown, the tray transfer device 800 is used to carry and position the tray to receive the finished copper sheets peeled off by the finished product unloading mechanism 700. The tray transfer device 800 includes a transfer traversing module 810 and a transfer platform 820. Pneumatic positioning devices 830 are provided around the transfer platform 820 to position and fix the tray placed on the transfer platform 820, ensuring that the tray is accurately positioned when receiving the finished copper sheets.

[0077] like Figure 18 As shown, the tray unloading and handling robot 1100 is used to transport trays loaded with finished copper sheets from the tray transfer device 800 to the tray unloading conveyor belt 1200. The tray unloading and handling robot 1100 includes a tray unloading traversing module 1110, a tray unloading lifting module 1120, and a tray unloading lifting plate 1130, on which multiple sets of tray unloading suction cups 1140 are provided. When the trays on the tray transfer device 800 are full of finished copper sheets, the tray unloading and handling robot 1100 picks up the tray from the transfer platform 820 and transports it to the tray unloading conveyor belt 1200.

[0078] like Figure 1 As shown, the tray unloading conveyor belt 1200 is used to output trays loaded with finished copper sheets to the next work station or packaging area.

[0079] like Figure 1 As shown, the waste collection device 1300 is used to collect the waste frame formed after punching. The waste collection device 1300 includes a waste box, which is disposed on one side of the copper sheet punching mechanism 600. After four punching operations, the remaining copper sheet material forms a waste frame. The second transfer robot 500 or the finished product unloading mechanism 700 removes the waste frame from the punching die 620 and places it into the waste box.

[0080] The following is a general description of the overall working process of the semiconductor copper sheet stamping equipment of this application.

[0081] First, the operator places the stacked copper sheets into the copper sheet hopper 210, and the copper sheet lifting device 220 gradually lifts the copper sheets to the discharge port 212. At the discharge port 212, the air-blowing separation device 234 and the separation brush work together to separate the copper sheets one by one.

[0082] The first transfer robot arm 300 moves to above the discharge port 212, and the first suction plate 330 descends to pick up the single copper sheet and transfer it to the positioning platform 410 of the copper sheet positioning mechanism 400. The positioning camera 430 performs visual inspection on the copper sheet, and the positioning platform 410 moves back and forth, left and right, and rotates according to the inspection results to adjust the copper sheet to the preset position.

[0083] After positioning, the second transfer robot 500 picks up the copper sheet and transfers it to the punching die 620 of the copper sheet punching mechanism 600, moving it to the first preset punching position. The punch press 610 drives the upper punching die 621 to press down, completing the first punching. After punching, the second transfer robot 500 removes the remaining copper sheet material from the die and waits for it to finish. The finished product unloading mechanism 700 extends into the die to pick up the finished product and transfers it to the top of the material tray. The material feeding device 720 peels the finished product into the material tray on the material tray transfer device 800.

[0084] Subsequently, the second transfer robot 500 moves the remaining copper sheet material into the mold, adjusts it to the second preset punching position of the copper sheet, and performs a second punching and finished product cutting. This cycle is repeated to complete four punching and four finished product cutting processes.

[0085] After all the punching is completed, the scrap box is removed by the second transfer robot 500 or the finished product unloading mechanism 700 and placed into the scrap box 1310. The tray unloading and handling robot 1100 transports the tray loaded with finished copper sheets to the tray unloading conveyor belt 1200, and the tray is output by the tray unloading conveyor belt 1200, completing a complete work cycle.

[0086] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A semiconductor copper sheet stamping equipment, characterized in that, include: Workbench; A copper sheet feeding mechanism is set on the worktable and is used to separate stacked copper sheets one by one and lift them to the discharge port; The first transfer robot is used to pick up a single copper sheet from the discharge port; A copper sheet positioning mechanism is set on the worktable and is used to detect the position and adjust the attitude of the copper sheet picked up by the first transfer robot arm. The second transfer robot is used to pick up the copper sheet after it has been adjusted by the copper sheet positioning mechanism and transport it to the copper sheet punching mechanism. The second transfer robot is also configured to move the copper sheet sequentially to multiple different preset punching positions within the copper sheet punching mechanism during the punching process; The copper sheet punching mechanism includes a punch press and a punching die, which is used to perform a punching action on the copper sheet when the second transfer robot moves the copper sheet to each of the preset punching positions, so as to punch out multiple finished products on the copper sheet in batches and finally form a waste frame. The finished product unloading mechanism includes an unloading and picking device and a picking device; the unloading and picking device is used to pick up all finished products from the punching die at one time; the picking device is used to peel the finished products from the unloading and picking device into the material tray on the material tray transfer device at one time; The material tray transfer device is used to carry and position the material tray to receive the finished product peeled off by the material feeding device; The material tray feeding mechanism is used to stack and store empty material trays; A material tray handling robot is used to pick up an empty material tray from the material tray feeding mechanism and transport it to the material tray transfer device. A material tray unloading and handling robot is used to transport a material tray loaded with finished copper sheets from the material tray transfer device to the material tray unloading conveyor belt; The material tray unloading conveyor belt is used to output the material tray; Waste collection device, used to collect the waste frames formed after punching.

2. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The blanking die includes an upper blanking die and a lower blanking die. The upper blanking die is provided with a punch fixing plate and a forming punch. The lower blanking die is correspondingly provided with an inner support ejector plate and an inner support ejector. The head of the inner support pin is provided with a small hole for generating vacuum suction force, and the cutting edge of the punching die is provided with a hole for generating vacuum suction force, so as to adsorb the finished product and the remaining copper sheet material respectively after punching. The inner support pin is also configured to lift the finished product upward to the cutting edge surface after one punching operation; A cylinder is provided below the lower die for retracting the inner ejector pin during stamping. After the punch returns to its original position, the cylinder releases pressure, and the spring force rebounds to lift the finished product back to the cutting edge surface.

3. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The feeding and picking device includes a feeding transverse module, a feeding lifting module and a feeding suction platform. The bottom of the feeding suction platform is provided with a plurality of suction heads arranged in an array, and each suction head is provided with a suction hole at its bottom. The feeding device includes a feeding horizontal movement module, a feeding lifting module, and a feeding plate. The feeding plate is provided with multiple clearance grooves for avoiding the suction head. The material feeding platform is configured to extend into the blanking die and conform to the cutting edge of the lower die to pick up the finished product; the material ejector plate is configured to move below the material feeding platform and pass through the suction head through the clearance groove to peel off the finished product when the suction head releases vacuum.

4. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The copper sheet feeding mechanism includes a copper sheet hopper, a copper sheet lifting device, and an anti-blocking separation device. The side wall of the copper sheet hopper is provided with multiple limiting plates extending in the vertical direction. The limiting plates are provided with an anti-scratch coating and a bakelite block is provided at the bottom. The anti-blocking separation device is installed at the outlet of the copper sheet hopper and includes a passive blockage separation brush, an active blockage separation brush, and an air-blowing separation device. The passive material separation brush and the active material separation brush are symmetrically arranged on both sides of the discharge port. The active material separation brush is connected to a drive cylinder to drive them to move closer or further apart. The air blowing separation device is arranged corresponding to the discharge port. When the copper sheet is discharged, it is first separated by the air blowing separation device, and then further separated by the passive material separation brush and the active material separation brush to ensure that the copper sheet is a single piece.

5. The semiconductor copper sheet stamping equipment according to claim 4, characterized in that, The copper sheet lifting device includes a lifting motor, a lifting gear, a lifting rack, and a lifting plate. The lifting plate is used to place stacked copper sheets. The lifting gear is mounted on the lifting motor. The lifting motor drives the lifting rack through the lifting gear to move the lifting plate up and down.

6. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The copper sheet positioning mechanism includes a positioning platform, a light source, and a positioning camera; The positioning platform is made of transparent acrylic material, which allows the light from the light source to pass through. A vacuum cavity is formed inside the acrylic material to form a vacuum adsorption part for adsorbing copper sheets. Three motors are installed below the positioning platform, which are used to drive the positioning platform to move forward and backward, move left and right, and rotate, respectively, so as to adjust the copper sheet to the position set by the positioning camera.

7. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The first transfer robot includes a first lateral movement module, a first lifting module, a first suction plate, and a first buffer. The first suction plate is mounted on the first lifting module, the first lifting module is mounted on the first lateral movement module, and the first buffer is mounted on the bottom of the lifting plate of the first lifting module. The first transfer robot also includes a double-sheet detection transmitter, and a double-sheet detection receiver is correspondingly provided on one side of the copper sheet positioning mechanism. The double-sheet detection transmitter and the double-sheet detection receiver cooperate to detect whether the first transfer robot has picked up double copper sheets.

8. The semiconductor copper sheet stamping equipment according to claim 1, characterized in that, The material tray feeding mechanism includes a material tray hopper and a material tray lifting device. The material tray hopper is used to stack and store material trays, and the material tray lifting device is located at the bottom of the material tray hopper to lift the material trays, making it convenient for the material tray unloading robot to pick up the material.

9. The semiconductor copper sheet stamping equipment according to claim 8, characterized in that, The material tray picking robot includes a material tray picking lateral movement module, a material tray picking lifting module, and a material tray picking lifting plate. The material tray picking lifting plate is equipped with multiple sets of material tray picking suction cups. The material tray picking lateral movement module and the material tray picking lifting module drive the material tray picking lifting plate to move the material tray picking suction cups to the discharge port of the material tray hopper. The material tray picking suction cups pick up the material tray and move the material tray to the material tray transfer device.

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