A temperature-controlled printing system

Abstract

The present application relates to a kind of temperature control printing system, belong to 3D printing equipment technical field, solve the uneven distribution of large size substrate thermal field, product deformation and increase the risk of scrapping;Substrate size increases, the heat of substrate increases, affect the working stability of sensor, optical element in forming cabin, simultaneously cause energy waste problem.The temperature control printing system of the present application, including forming cabin, temperature control substrate system and refrigeration system;Forming cabin and refrigeration system form circulation loop, temperature control substrate system is set in forming cabin.The temperature control printing system of the present application, forming cabin and refrigeration system constitute circulation loop, can be recycled inert gas, reduce operating cost.Temperature control substrate system and refrigeration system jointly act, both can realize the substrate temperature condition required by printing piece, also can not be destroyed sensor, the working stability of optical element due to continuous heat accumulation in forming cabin, improve the working reliability of long time continuous operation of printing equipment.

Description

Technical Field

[0001] This invention relates to the field of 3D printing equipment technology, and in particular to a temperature-controlled printing system. Background Technology

[0002] In 3D printing equipment, the substrate serves as the supporting foundation for the forming process, and its temperature field distribution directly determines the stability of the molten metal pool, the internal stress level of the part, and the final quality of the formed part. During the printing process, the continuous scanning of the metal powder bed by a high-energy laser causes local areas to heat up rapidly, melt, and solidify quickly. A temperature gradient is generated between the molten part and the formed part. As the number of printed layers increases, the temperature gradient will continue to accumulate and increase, which can easily lead to problems such as warping, poor interlayer bonding, and even cracking of the part.

[0003] In existing technologies, heating the substrate reduces the temperature gradient between the molten and formed parts of the product. However, with the increasing demand for larger forming sizes, large-size substrates are prone to uneven thermal distribution, leading to inconsistent shrinkage in different areas of the formed part, increasing the risk of product deformation and scrap. Furthermore, as the substrate size increases, the heat generated by the substrate also increases, raising the temperature inside the forming chamber, affecting the operational stability of sensors and optical components within the forming chamber, and causing energy waste. Summary of the Invention

[0004] Based on the above analysis, the present invention aims to provide a temperature-controlled printing system to solve the problems of uneven thermal field distribution on large-size substrates, which leads to inconsistent shrinkage in different areas of the formed part, increasing the risk of product deformation and scrap; as the substrate size increases, the heat of the substrate increases, which raises the temperature inside the forming chamber, affecting the working stability of sensors and optical components inside the forming chamber, and also causing energy waste.

[0005] The objective of this invention is mainly achieved through the following technical solutions: A temperature-controlled printing system includes a forming chamber, a temperature-controlled substrate system, and a cooling system; the forming chamber and the cooling system form a circulation loop, and the temperature-controlled substrate system is disposed inside the forming chamber.

[0006] Furthermore, the temperature control substrate system is provided with evenly distributed heating wires, and the temperature control substrate system is used to provide a support base for uniform heating during the forming process.

[0007] Furthermore, the refrigeration system is used to deliver cooling inert gas to the forming chamber to cool and protect the interior of the forming chamber.

[0008] Furthermore, the temperature control substrate system includes a substrate, a heating component, and a piston system; the substrate, the heating component, and the piston system are fixedly connected in sequence.

[0009] Furthermore, the heating assembly includes a heating plate fixing plate, a heating plate, and a heat insulation protective plate.

[0010] Furthermore, the heating plate fixing plate is fixedly connected to the base plate.

[0011] Furthermore, the heating plate fixing plate, the heating plate, and the heat insulation plate are sequentially fixedly connected.

[0012] Furthermore, the heating plate is disposed within the cavity formed by the heating plate fixing plate and the heat insulation protective plate.

[0013] Furthermore, the heating wires are evenly distributed within the heating plate.

[0014] Furthermore, the heating plate is used to heat the heating plate fixing plate, and the heating plate fixing plate transfers the heat generated by the heating plate to the substrate. The technical solution of the present invention can achieve at least one of the following effects: (1) In the temperature-controlled printing system of the present invention, the forming chamber and the cooling system form a loop, which can recycle inert gas without the need for continuous and large-scale replenishment of inert gas source, thereby reducing inert gas consumption and operating costs. The temperature-controlled substrate system is set in the forming chamber. The temperature-controlled substrate system heats the substrate to the process temperature required for the forming process, and the cooling system controls the ambient temperature in the forming chamber. The temperature-controlled substrate system and the cooling system work together to achieve the substrate temperature conditions required for the printed parts, and will not damage the working stability of sensors and optical components due to continuous heat accumulation in the forming chamber, thereby improving the working reliability of the printing equipment for long-term continuous operation.

[0015] (2) The temperature-controlled printing system of the present invention provides a uniform heating support for the forming process, which can reduce the temperature gradient between the molten part and the formed part, improve the shrinkage uniformity of each area of ​​the formed part, and reduce the risk of product deformation and scrap. The circulating cooling inert airflow can not only reduce the temperature in the forming chamber, but also remove the smoke and dust impurities generated in the forming chamber during the printing process, and form an inert atmosphere in the forming chamber to reduce the risk of explosion.

[0016] (3) In the temperature control printing system of the present invention, the heat generated by the heating wire first acts on the heating plate, and then is conducted to the substrate through the heating plate fixing plate. Through the multi-layer heat transfer method, the temperature gradient between the heating wires is reduced, so that the heat distribution on the substrate is more uniform.

[0017] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained from what is particularly pointed out in the description and drawings. Attached Figure Description

[0018] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0019] Figure 1 This is a schematic diagram of the temperature-controlled printing system according to Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the temperature control substrate system according to Embodiment 1 of the present invention; Figure 3 This is one of the structural schematic diagrams of the heating assembly according to Embodiment 1 of the present invention; Figure 4 This is a partial enlarged view of the first and second support bases according to Embodiment 1 of the present invention; Figure 5 This is a second schematic diagram of the heating assembly according to Embodiment 1 of the present invention; Figure 6 This is a partial enlarged view of the temperature control substrate system of Embodiment 1 of the present invention; Figure 7 This is a schematic diagram of the refrigeration system according to Embodiment 2 of the present invention; Figure 8 This is a partially enlarged view of the refrigeration system according to Embodiment 2 of the present invention; Figure 9 This is a schematic diagram of the homogenization component according to Embodiment 2 of the present invention; Figure 10 This is a schematic diagram of the homogenization component according to Embodiment 3 of the present invention.

[0020] Figure label: 1-Forming chamber; 2-Temperature control substrate system; 21-Substrate; 22-Heating assembly; 221-Heating plate fixing plate; 222-Heating plate; 223-Heat insulation plate; 224-First support; 225-Second support; 226-Temperature control unit; 227-Positioning pin; 228-Wire groove; 229-Set screw; 23-Piston system; 3-Refrigeration system; 31-Dust collector; 32-Driver; 33-Refrigerant forming chamber; 34-Pressure booster valve; 35-Homogeneous component; 351-Impeller; 352-Impeller shaft; 353-Bracket; 354-Rotating roller; 355-Oscillating blade; 356-Oscillating blade shaft; 357-Spiral blade assembly; 358-Gathering guide housing; 359-Paddle wheel; 3510-Dispersion guide housing. Detailed Implementation

[0021] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0022] Example 1 To address the issue of uneven thermal distribution on large-size substrates, which leads to inconsistent shrinkage across different areas of the molded part, increasing the risk of product deformation and scrap; and considering that increased substrate size results in increased heat, raising the temperature within the molding chamber and affecting the operational stability of sensors and optical components, while also causing energy waste, etc. Figure 1 As shown, a specific embodiment of the present invention discloses a temperature-controlled printing system, including a forming chamber 1, a temperature-controlled substrate system 2, and a cooling system 3; the forming chamber 1 and the cooling system 3 form a circulation loop, and the temperature-controlled substrate system 2 is disposed inside the forming chamber 1; the temperature-controlled substrate system 2 is provided with uniformly distributed heating wires, and the temperature-controlled substrate system 2 is used to provide a bearing base for uniform heating during the forming process, and the cooling system 3 is used to deliver cooling inert gas to the forming chamber 1 to cool and protect the interior of the forming chamber 1.

[0023] In this embodiment, the temperature-controlled printing system uses a temperature-controlled substrate system 2 to provide a uniform heating base for the forming process. This reduces the temperature gradient between the molten and formed parts of the product, improves the uniformity of shrinkage across different areas of the formed part, and reduces the risk of product deformation and scrap. The circulating cooling inert gas not only lowers the temperature inside the forming chamber 1 but also removes dust and impurities generated during the printing process and creates an inert atmosphere within the forming chamber 1, reducing the risk of explosion. The forming chamber 1 and the cooling system 3 form a circulation loop, allowing for the reuse of inert gas without the need for continuous and large-scale replenishment, thus reducing inert gas consumption and operating costs. The temperature-controlled substrate system 2 is located inside the forming chamber 1. It heats the substrate to the required process temperature, while the cooling system 3 controls the ambient temperature within the forming chamber 1. The combined action of the temperature-controlled substrate system 2 and the cooling system 3 achieves the required substrate temperature for the printed part without compromising the operational stability of sensors and optical components due to continuous heat buildup within the forming chamber 1, thereby improving the reliability of the 3D printing equipment during long-term continuous operation.

[0024] Furthermore, to address the issue of insufficient thermal uniformity in the temperature control substrate system 2, such as... Figure 2 and Figure 3As shown, the temperature control substrate system 2 includes a substrate 21, a heating assembly 22, and a piston system 23; the substrate 21, heating assembly 22, and piston system 23 are sequentially fixedly connected. The heating assembly 22 includes a heating plate fixing plate 221, a heating plate 222, and a heat insulation plate 223. The heating plate fixing plate 221 is fixedly connected to the substrate 21. The heating plate fixing plate 221, heating plate 222, and heat insulation plate 223 are sequentially fixedly connected; the heating plate 222 is disposed in the cavity formed by the heating plate fixing plate 221 and the heat insulation plate 223, and uniformly distributed heating wires are disposed inside the heating plate 222. The heating plate 222 is used to heat the heating plate fixing plate 221, and the heating plate fixing plate 221 transfers the heat generated by the heating plate 222 to the substrate 21. The heat generated by the heating wires first acts on the heating plate 222, and then is conducted to the substrate 21 through the heating plate fixing plate 221. Through multi-layer heat transfer, the temperature gradient between the heating wires is reduced, making the heat distribution on the substrate 21 more uniform.

[0025] It should be noted that the substrate 21 is used to hold the printing powder and the printed components during the forming process, and the substrate 21 is set in accordance with the general design conventions in the field of 3D printing equipment. The piston system 23 is used to support the substrate 21 and the heating component 22, and to drive the substrate 21 and the heating component 22 to move up and down in the vertical direction. The piston system 23 is set in accordance with the general design conventions in the field of 3D printing equipment.

[0026] Furthermore, to address the problem that the heating component 22 expands upon heating, causing it to press against the piston system 23 and resulting in warping and deformation of the heating component 22 and / or the piston system 23, such as... Figure 3 and Figure 4 As shown, the heating assembly 22 also includes a first support 224 and a second support 225, which provide support between the heating plate fixing plate 221 and the piston system 23 at different heights. The first support 224 and the second support 225 allow for expansion space between the heating assembly 22 and the piston system 23, thereby reducing the problem of compression deformation caused by the expansion of the heating assembly 22 after being heated.

[0027] Furthermore, to address the problem that the heating plate 222 expands when heated, causing the heating assembly 22 to be compressed by the heating plate 222 and thus deform, such as... Figure 5 As shown, the heating plate fixing plate 221 is provided with a cavity, the volume of which is larger than the volume of the heating plate 222, so as to provide space for the heating plate 222 to expand under heat.

[0028] Furthermore, to address the problem of heat radiating from the heating plate 222 to the surrounding areas, disrupting the operational stability of components around the heating assembly 22, and causing heat waste, such as... Figure 5As shown, the wall thickness around the cavity of the heating plate fixing plate 221 is greater than the wall thickness of the top wall, so that the heat generated by the heating plate 222 radiates towards the top wall of the cavity, concentrating the heat on the substrate 21, reducing the heat radiation to the surrounding area of ​​the cavity, improving the working stability of the components around the heating assembly 22, and reducing heat waste.

[0029] Furthermore, to address the problem of thermal stress concentration and deformation at the corner positions within the cavity of the heating plate fixing plate 221 after heating, such as... Figure 5 As shown, a rounded corner groove is provided at the corner of the cavity of the heating plate fixing plate 221. The corner angle of the rounded corner groove is greater than 180°, so as to form a longer arc profile within the corner. Heat is evenly diffused along the arc profile, which can reduce local thermal stress concentration and provide deformation space for thermal expansion of the cavity corner. The rounded corner groove can release thermal stress at the corner position and reduce the risk of deformation of the heating plate fixing plate 221 at high temperature.

[0030] Furthermore, in order to solve the problem of uncontrollable temperature of heating plate 222, such as Figure 3 , Figure 5 and Figure 6 As shown, the heating assembly 22 also includes a temperature measuring unit 226, which is fixedly connected to the center of the heating plate 222. The probe of the temperature measuring unit 226 extends into the heating plate fixing plate 221, and the temperature measuring unit 226 is used to measure the temperature of the heating plate fixing plate 221. The heating temperature of the heating plate 222 is adjusted according to the measured temperature of the temperature measuring unit 226 so that the substrate 21 obtains a suitable heat. Exemplarily, the temperature control unit 226 is connected to a data processing system, which controls the heating temperature of the heating plate 222 according to the measurement signal from the temperature control unit 226. The data processing system is configured according to existing technology.

[0031] Furthermore, such as Figure 5 As shown, a temperature control unit cable tray 228 is provided on the side of the heat insulation plate 223 away from the heating plate 222. The cable tray 228 is used to organize the cable arrangement of the temperature measuring unit 226 and to provide heat insulation protection for the cable of the temperature measuring unit 226.

[0032] Furthermore, in order to solve the problem of the heating component 22 being difficult to install and connect with the substrate 21, such as... Figure 3 , Figure 4 and Figure 6 As shown, the heating assembly 22 also includes a positioning pin 227, and a positioning hole matching the positioning pin 227 is provided on the contact surface of the substrate 21 with the heating assembly 22. The positioning pin 227 cooperates with the positioning hole to reduce the difficulty of aligning the heating assembly 22 with the substrate 21 and facilitate installation.

[0033] Furthermore, in order to solve the problem that the substrate 21 is not easy to level, such as Figure 3As shown, the heating assembly 22 also includes a set screw 229. The substrate 21 is leveled by adjusting the height of the heating plate fixing plate 221 by unscrewing the set screw 229, and a gap is created between the heating plate fixing plate 221 and the substrate 21. The gap between the heating plate fixing plate 221 and the substrate 21 allows for further homogenization of the heating of the substrate 21 by the air in the gap, and also provides space for thermal expansion of the substrate 21 and the heating plate fixing plate 221.

[0034] Example 2 To address the issue of insufficient cooling effect in refrigeration system 3, this embodiment further improves refrigeration system 3 in embodiment 1.

[0035] like Figure 7 As shown, the cooling system 3 in this embodiment includes a dust collector 31 and a driver 32; the dust collector 31 and the driver 32 together with the forming chamber 1 form a first cooling loop. The driver 32 provides power for the gas circulation of the first cooling loop. The circulating gas continuously replaces the gas in the forming chamber 1 and continuously removes excess heat from the forming chamber 1, so that the forming chamber 1 maintains a suitable working temperature and ensures the stable operation of the 3D printing equipment.

[0036] Furthermore, to address the issue of insufficient cooling effect in the first cooling loop, such as... Figure 7 and Figure 8 As shown, a second cooling loop is provided between the actuator 32 and the forming chamber 1. A refrigerant forming chamber 33 is provided in the second cooling loop. The gas in the second cooling loop is cooled by the refrigerant forming chamber 33 and then enters the dust collector 31. The second cooling loop branches off from the first cooling loop, and after being cooled by the refrigerant forming chamber 33, it forms a cooling medium. This cooling medium enters the dust collector 31 and mixes with the gas in the first cooling loop to reduce the temperature of the gas in the first cooling loop, thereby cooling the forming chamber 1. The gas completes heat exchange inside the dust collector 31, ensuring that the gas enters the cooling process immediately after purification, resulting in timely cooling and high cooling efficiency.

[0037] Furthermore, to address the problem of insufficient gas pressure in the second cooling loop, making it difficult for gas to enter the dust collector 31, such as... Figure 8As shown, the refrigeration system 3 includes a pressure boosting valve 34, which is installed in the inlet channel of the refrigerant forming chamber 33. Gas is pressurized by the pressure boosting valve 34 before entering the refrigerant forming chamber 33. The pressure boosting valve 34 is used to increase the gas pressure to the expansion cooling pressure, and the refrigerant forming chamber 33 provides the space required for expansion cooling. When the pressurized gas suddenly enters the refrigerant forming chamber 33, its volume increases, its internal energy decreases as it performs work on the outside, and its temperature decreases, achieving a cooling effect. The pressure boosting valve 34, installed in the inlet channel of the refrigerant forming chamber 33, serves two purposes: firstly, it utilizes the expansion cooling principle to cool the gas, eliminating the need for water cooling media, resulting in fewer parts and a simpler process; secondly, the gas pressure is increased and then decreased, ensuring that the reduced gas pressure is higher than the gas pressure inside the dust collector 31, allowing the gas in the second cooling loop to enter the dust collector 31.

[0038] Furthermore, to address the issue of low cooling efficiency in the second cooling loop, such as... Figure 7 As shown, after being cooled by the refrigerant forming chamber 33, the second cooling loop covers the outside of the pipe leading from the dust collector 31 to the forming chamber 1 and the external heating device connected to the pipe. The end of the second cooling loop is connected to the dust collector 31. The second cooling loop covers the outside of the pipe leading from the dust collector 31 to the forming chamber 1 and the external heating device connected to the pipe. On one hand, the external cooling of the pipe and the external heating device cooperates with the heat exchange inside the dust collector 31, cooling the pipe between the dust collector 31 and the forming chamber 1 and the actuator 32 from outside the first cooling loop, improving cooling efficiency. On the other hand, it reduces the heat radiation generated by the pipe and the actuator 32, thereby lowering the temperature inside the 3D printing equipment.

[0039] Furthermore, to address the problem that in traditional pipelines, the airflow is laminar, preventing sufficient heat exchange between the high-temperature airflow at the center of the pipeline and the low-temperature region of the pipe wall, leading to uneven inlet temperature and localized overheating within the forming chamber 1, resulting in defects in the formed parts, such as... Figure 9 As shown, the circulating filtration system for 3D printing equipment also includes a homogenization component 35. The homogenization component 35 is fixedly connected to the inner wall of the pipe enclosed by the second cooling loop. The homogenization component 35 includes an impeller 351, an impeller shaft 352, and a bracket 353. The bracket 353 is fixedly connected to the inner wall of the pipe; for example, the bracket 353 is strip-shaped, with both ends fixedly connected to the inner wall of the pipe. One end of the impeller shaft 352 is rotatably connected to the center of the bracket 353, and the other end of the impeller shaft 352 is fixedly connected to the impeller 351. The impeller 351, impeller shaft 352, and bracket 353 are all coaxially arranged with the pipe. The impeller 351 is used to rotate under the blowing of the airflow, thereby disturbing the airflow direction.

[0040] In this embodiment, the homogenization component 35, on the one hand, drives the impeller 351 to rotate continuously as the gas flows within the pipe, eliminating the need for additional external power components such as motors, resulting in a simple structure. On the other hand, the rotating impeller 351 disrupts the original stable laminar airflow structure within the pipe, fully disturbing the laminar airflow and transforming it into a disordered turbulent airflow. This promotes rapid mixing of gases at different locations and temperatures within the pipe, resulting in more thorough and uniform heat exchange within the gas. The homogenization component 35 improves the uniformity of gas cooling, thereby maintaining a stable gas temperature in the forming chamber 1. This avoids problems such as localized overheating within the forming chamber 1 and defects in the formed parts caused by uneven inlet gas temperature, effectively improving the quality and yield of products formed by selective laser melting.

[0041] Furthermore, to address the problem of insufficient gas turbulence and inadequate cooling effect within the pipeline, such as... Figure 9 As shown, the homogenizing component 35 also includes a rotating roller 354, a sway vane 355, and a swaying blade shaft 356. The rotating roller 354 is fixedly connected to the impeller shaft 352 and extends radially outward from the impeller shaft 352. The rotating roller 354 is used to sway the sway vane 355. The sway vane 355 is rotatably connected to the swaying blade shaft 356, and the center of gravity of the sway vane 355 is located below the swaying blade shaft 356. The swaying blade shaft 356 is fixedly connected to the pipe wall. Since the center of gravity of the sway vane 355 is located below the swaying blade shaft 356, the sway vane 355 can return to its original position under its own gravity after deflection. When the refrigeration system 3 is running, the impeller 351 drives the impeller shaft 352 to rotate continuously, which in turn drives the rotating roller 354 to rotate around the impeller shaft 352. During the rotation of the rotating roller 354, it periodically actuates the oscillating blade 355, causing the oscillating blade 355 to oscillate back and forth around the oscillating blade shaft 356, thereby continuously disturbing the airflow close to the pipe wall. At the same time, based on the structural design with the center of gravity lowered, after being deflected, the oscillating blade 355 can return to its original position under its own gravity, achieving continuous reciprocating oscillation and preventing the oscillating blade 355 from stopping and failing. The oscillating blade 355 compensates for the shortcoming of the single impeller 351, which can only disturb the central airflow, by disrupting the static laminar flow state of the airflow at the edge of the pipe wall, achieving sufficient disturbance of the airflow from the center to the edge of the pipe, resulting in more thorough disturbance of the gas and better cooling effect.

[0042] Furthermore, to address the issues of low gas cooling efficiency caused by a single gas flow path, small contact area between gas and cooling pipe wall, and short heat exchange time in pipelines, such as... Figure 9As shown, the homogenization component 35 also includes a spiral blade assembly 357; the spiral blade assembly 357 includes multiple spiral guide blades, one side of which is fixedly connected to the impeller shaft 352, and the other side of which extends towards the pipe wall; the multiple guide blades are evenly distributed and rotated along the axis of the impeller shaft 352, with adjacent guide blades forming a spiral groove. During the rotation of the impeller shaft 352, the impeller shaft 352 drives the spiral blade assembly 357 to rotate. On the one hand, the rotating guide blades form a moving stirring surface, cutting and stirring the gas in the pipeline, further increasing the mixing uniformity of hot and cold gases, while fanning the gas in the center of the pipeline towards the pipe wall, increasing the contact between the gas and the cooling pipe wall, and increasing the frequency of heat exchange between the gas and the pipe wall; on the other hand, the gas flowing through the spiral blade assembly 357 will change its original straight flow path under the guidance of the spiral groove, and move forward along the spiral trajectory, effectively extending the flow heat exchange path and residence time of the gas in the cooling pipeline, and increasing the effective heat exchange area between the gas and the cooling pipe wall. Compared to traditional straight-line airflow structures, the spiral vane assembly 357 can simultaneously increase the heat exchange time, heat exchange area, and heat exchange uniformity of the gas in the pipeline, thereby improving the cooling efficiency of the gas in the pipeline.

[0043] In this embodiment, the homogenization component 35, impeller 351, vane 355, and spiral blade assembly 357 work together without the need for an additional external power mechanism. The gas flow within the cooling system 3 alone is sufficient to agitate the gas in the pipe from the center to the pipe wall, improving the cooling uniformity of the gas within the pipe. This, in turn, maintains the temperature within the forming chamber 1 within an appropriate range, reducing the risk of overheating in the 3D printing equipment and improving the forming quality of laser selective melting products.

[0044] Example 3 This embodiment provides a temperature-controlled printing system. The difference between this embodiment and Embodiment 2 lies only in the structure of the homogenization component 35. For example... Figure 10 As shown, the homogenization component 35 includes an impeller 351, an impeller shaft 352, and a bracket 353. The arrangement and function of the impeller 351, impeller shaft 352, and bracket 353 in this embodiment are the same as those in Embodiment 2, and will not be described again in this embodiment.

[0045] Furthermore, to address the issue of the complex structure of the homogenization component 35, such as... Figure 10As shown, the homogenizing component 35 in this embodiment also includes a converging guide housing 358; the converging guide housing 358 is fixedly connected to the pipe wall and is disposed on the leeward side of the impeller 351; the converging guide housing 358 is a through-hole bowl-shaped cover, and the side of the converging guide housing 358 near the impeller 351 is the wide part; the converging guide housing 358 causes the airflow to converge towards the central axis of the pipe wall, promoting uniform airflow mixing and improving heat exchange efficiency, while the narrow part of the converging guide housing 358 throttles the airflow and increases the flow velocity. Compared with Embodiment 2, the homogenizing component 35 in this embodiment has fewer moving parts and a simpler structure.

[0046] Furthermore, to address the issue of insufficient contact between the airflow and the pipe wall after throttling, such as... Figure 10 As shown, the homogenization component 35 also includes a paddle wheel 359, which is located on the leeward side of the converging guide housing 358. One side of the paddle wheel 359 is fixedly connected to the impeller shaft 352, and the other side of the paddle wheel 359 extends toward the pipe wall. The impeller 351 drives the paddle wheel 359 to rotate, and the airflow moves toward the pipe wall under the fanning of the impeller 351, so that the airflow contacts the cooled pipe wall more fully and the cooling effect is better.

[0047] Furthermore, to address the issue of short contact time between the airflow and the pipe wall after the airflow is fanned by the impeller 359 and rebounds upon contact, such as... Figure 10 As shown, the homogenization component 35 also includes a dispersion guide housing 3510, which is fixedly connected to the pipe wall and is located on the leeward side of the impeller 359. The dispersion guide housing 3510 is a through bowl-shaped cover, with the narrow part of the dispersion guide housing 3510 facing the impeller 351. A gap is provided between the dispersion guide housing 3510 and the pipe wall to allow the airflow to flow close to the pipe wall, increase the contact time between the airflow and the pipe wall, and improve the cooling effect.

[0048] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature-controlled printing system, characterized in that, It includes a molding chamber (1), a temperature control substrate system (2), and a refrigeration system (3); the molding chamber (1) and the refrigeration system (3) form a circulation loop, and the temperature control substrate system (2) is disposed inside the molding chamber (1).

2. The temperature-controlled printing system according to claim 1, characterized in that, The temperature control substrate system (2) is provided with uniformly distributed heating wires, and the temperature control substrate system (2) is used to provide a support base for uniform heating during the forming process.

3. The temperature-controlled printing system according to claim 1 or 2, characterized in that, The refrigeration system (3) is used to deliver cooling inert gas to the forming chamber (1) to cool and protect the interior of the forming chamber (1).

4. The temperature-controlled printing system according to claim 2, wherein the temperature-controlled substrate system (2) includes a substrate (21), a heating component (22) and a piston system (23); the substrate (21), the heating component (22) and the piston system (23) are fixedly connected in sequence.

5. The temperature-controlled printing system according to claim 4, characterized in that, The heating assembly (22) includes a heating plate fixing plate (221), a heating plate (222), and a heat insulation and protection plate (223).

6. The temperature-controlled printing system according to claim 5, characterized in that, The heating plate fixing plate (221) is fixedly connected to the base plate (21).

7. The temperature-controlled printing system according to claim 6, characterized in that, The heating plate fixing plate (221), the heating plate (222), and the heat insulation plate (223) are fixedly connected in sequence.

8. The temperature-controlled printing system according to claim 7, characterized in that, The heating plate (222) is disposed in the cavity formed by the heating plate fixing plate (221) and the heat insulation protection plate (223).

9. The temperature-controlled printing system according to claim 8, characterized in that, The heating wires are evenly distributed within the heating plate (222).

10. The temperature-controlled printing system according to any one of claims 5-9, characterized in that, The heating plate (222) is used to heat the heating plate fixing plate (221), and the heating plate fixing plate (221) transfers the heat generated by the heating plate (222) to the substrate (21).

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