A soldering device for PCB circuit board processing

Abstract

The application discloses a kind of welding devices for PCB circuit board processing, including welding table, the welding table top is provided with welder, the welding table top is provided with moving table, the welder bottom is provided with lifting head, the lifting head bottom is provided with welding mechanism, it is related to welding technical field, by setting welding mechanism, tin bar is quickly melted, and the tin liquid after tin bar melting is then guided to the specified point position on the surface of circuit board by high-temperature heating ring and flow block, then control welder drives lifting head to rise reset, the flow block is separated from circuit board at this time, after soldering tin liquid cools and solidifies, complete single welding operation, and by several high-temperature heating rings, flow block realizes multiple point position synchronous welding, greatly improves welding efficiency, while each point position is independently controlled, can be flexibly adjusted according to actual demand Welding position and soldering amount, without manual intervention, effectively reduce the operation difficulty and human error, further guarantee the stability and consistency of welding quality.

Description

Technical Field

[0001] This invention relates to the field of welding technology, specifically to a welding apparatus for PCB circuit board processing. Background Technology

[0002] PCB (Printed Circuit Board) is the support structure and electrical connection carrier for electronic components. It is known as the "mother of electronic products" and is widely used in communications, consumer electronics, automotive electronics, aerospace and other fields.

[0003] The patent application CN218050759U describes a welding device for PCB circuit board processing, which relates to the field of PCB circuit board welding technology. It is used to solve the problems that existing clamping devices cannot effectively clamp different circuit boards, and that circuit boards are easily damaged and dirty during the flipping process. The top of the frame plate has a groove, and an adjustment component is installed in the groove. The adjustment component includes a rack. The rack is symmetrically fixed inside the groove. Two push plates are slidably connected to the groove. A snap-fit ​​box is fixedly connected to one side of the push plate. Two limit blocks are slidably connected inside the snap-fit ​​box. A compression spring is fixed between the two limit blocks by spot welding. The limit blocks cooperate with the rack. A push plate is rotatably connected to the outside of the push plate.

[0004] Existing circuit board soldering equipment typically employs a single-point, one-by-one soldering method, where the lifting head can only solder one solder joint at a time before moving to the next. This point-by-point soldering method is inefficient, especially when dealing with circuit boards with dense and numerous solder joints. It requires repeated lifting and positioning, resulting in long soldering cycles and failing to meet the high-efficiency requirements of mass production. Furthermore, traditional soldering equipment relies heavily on external heating structures for solder bar feeding and melting. This results in long heat transfer paths, slow solder melting, and the solder flow is prone to deviation due to unstable guidance, leading to inconsistent solder joint formation and even defects such as cold solder joints and solder bridging. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a welding device for PCB circuit board processing, thereby achieving the purpose of solving the above-mentioned problems.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a welding device for PCB circuit board processing, comprising a welding table, a welding device disposed on the top of the welding table, a movable table disposed on the top of the welding table, a lifting head disposed at the bottom of the welding device, and a welding mechanism disposed at the bottom of the lifting head;

[0007] The welding mechanism includes:

[0008] A fixed sleeve, the top of which is fixedly connected to the bottom of the lifting head, and a sliding rod is slidably connected to the inner wall of the fixed sleeve, with a high-temperature heating ring provided at the bottom of the sliding rod;

[0009] The guide block has a frustum-shaped structure. The top of the guide block is fixedly connected to the bottom of the high-temperature heating ring. A solder rod is provided on the top of the high-temperature heating ring, and the top of the solder rod contacts the bottom of the lifting head.

[0010] Preferably, a spherical block is fixedly connected to the bottom of the guide block, and the spherical block has a hemispherical structure.

[0011] Preferably, the outer wall of the sliding rod is provided with a threaded groove, and the sliding rod is slidably connected to the inner wall of the fixed sleeve through the threaded groove.

[0012] Preferably, the inner wall of the solder rod does not contact the outer wall of the fixing sleeve and the sliding rod, and a spring is fixedly connected to the inner wall of the fixing sleeve.

[0013] Preferably, one end of the spring is rotatably connected to one end of the sliding rod via a bearing, and the sliding rod has a circular cylindrical structure.

[0014] Preferably, the inner wall of the sliding rod is provided with a magnetic groove, and the inner wall of the magnetic groove is provided with a flow guiding mechanism. The flow guiding mechanism includes a vertical rod, and a magnetic connecting block is fixedly connected to the top of the vertical rod. The magnetic connecting block and the magnetic groove are opposite poles that attract each other.

[0015] Preferably, the outer wall of the vertical rod and the magnetic connecting block is slidably connected to the inner wall of the magnetic groove, one end of the vertical rod is fixedly connected to the outer wall of the guide block, the inner wall of the high-temperature heating ring is provided with a circular through groove, the circular through groove is not in contact with the outer wall of the vertical rod, the outer wall of the high-temperature heating ring is provided with a first guide groove, and the outer wall of the guide block is provided with a second guide groove.

[0016] Preferably, a heat-conducting plate is fixedly connected to the outer wall of the high-temperature heating ring. The heat-conducting plate has a plate-like structure, and the top of the heat-conducting plate is in contact with the bottom of the solder rod.

[0017] Preferably, a support frame is fixedly connected to the top of the welding table.

[0018] This invention provides a soldering apparatus for PCB circuit board processing. It has the following beneficial effects:

[0019] 1. This invention features a welding mechanism where a high-temperature heating ring is activated to rapidly melt the solder rod. The molten solder then flows through the high-temperature heating ring and guide block to a designated point on the circuit board surface. Subsequently, the welding device is controlled to lift and reset the lifting head, at which point the guide block separates from the circuit board. After the solder cools and solidifies, a single welding operation is completed. Furthermore, multiple high-temperature heating rings and guide blocks enable simultaneous welding at multiple points, significantly improving welding efficiency. Each point can be independently controlled, allowing for flexible adjustment of the welding position and amount of solder according to actual needs, eliminating the need for manual intervention. This effectively reduces operational difficulty and human error, further ensuring the stability and consistency of welding quality.

[0020] 2. By setting up a welding mechanism, the molten solder flows along the outer wall of the guide block to the surface of the circuit board through the high-temperature heating ring and the guide block. The inclined surface of the guide block can guide the molten solder and concentrate it to a designated point on the surface of the circuit board, avoiding the molten solder from shifting or splashing during the flow, thereby ensuring that the solder joint is accurately positioned and has a regular shape.

[0021] 3. This invention, through the setting of a welding mechanism, utilizes a sliding rod connected to the guide block and a threaded groove to slide and rotate within a fixed sleeve. The thread helix angle of the threaded groove is greater than 45 degrees. Thus, when the guide block and the high-temperature heating ring are pushed upward under pressure, the sliding rod and the threaded groove slide and rotate within the fixed sleeve. Utilizing the characteristic that the thread helix angle is greater than 45 degrees, the high-temperature heating ring and the guide block automatically rotate. As the high-temperature heating ring and the guide block rotate, the heat melting efficiency of the solder rod above is further improved, making the molten solder melt more uniform and complete, and shortening the welding cycle. Furthermore, the rotation helps to evenly coat the molten solder on the surface of the solder joint, avoiding local accumulation or depressions, further ensuring the fullness and conductivity of the solder joint.

[0022] 4. By setting up a welding mechanism, the present invention utilizes the bottom arc surface of the ball block to reduce the risk of friction and scratching to the circuit board below when the high-temperature heating ring and the guide block rotate. The arc surface structure forms point contact rather than surface contact at the moment of contact, resulting in a small contact area. Combined with the elastic material of the ball block itself, even if the guide block and the circuit board make slight contact, the impact can be absorbed through elastic deformation, avoiding damage to the surface of the circuit board.

[0023] 5. By setting up a flow guiding mechanism, the rotation of the high-temperature heating ring drives the rotation of several surrounding heat-conducting plates, further increasing the contact area with the solder bar. The heat is conducted to the solder bar by the heat-conducting plates, completing the stable and uniform hot-melting of the solder bar. At the same time, the rotation of the heat-conducting plates can also form a weak stirring effect on the surface of the molten solder, preventing the molten solder from generating pores or inclusions due to localized rapid cooling, ensuring that the internal structure of the solder joint is dense and free from the risk of poor soldering.

[0024] 6. By setting up a flow guiding mechanism, the flow guiding block is magnetically attracted to the inner wall of the sliding rod through the vertical rod and magnetic connecting block. This magnetic connection method not only realizes the quick disassembly and maintenance of the flow guiding block, but also maintains a tight fit naturally through the squeezing force during the pressing process, ensuring that the flow guiding channel does not deform or misalign under high pressure. At the same time, it is easy to replace flow guiding blocks of different specifications to adapt to different welding point requirements, and no additional fasteners are required, simplifying the assembly process. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a top view of the lifting head structure of the present invention;

[0027] Figure 3 This is a bottom view of the lifting head structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the structure of the solder rod of the present invention;

[0029] Figure 5 For the present invention Figure 4 Enlarged view of point A;

[0030] Figure 6 This is a schematic diagram of the disassembly structure of the welding mechanism of the present invention. Figure 1 ;

[0031] Figure 7 This is a schematic diagram of the disassembly structure of the welding mechanism of the present invention. Figure 2 ;

[0032] Figure 8 This is a schematic diagram of the flow guiding mechanism of the present invention.

[0033] In the diagram: 1. Welding table; 2. Welding machine; 3. Welding mechanism; 301. Fixing sleeve; 302. Sliding rod; 303. Threaded groove; 304. Solder rod; 305. Spring; 306. High-temperature heating ring; 307. Guide block; 308. Ball block; 4. Guide mechanism; 401. Vertical rod; 402. Magnetic connecting block; 403. Circular through slot; 404. First guide slot; 405. Second guide slot; 406. Heat-conducting plate; 5. Lifting head; 6. Moving table. Detailed Implementation

[0034] Example 1: Please refer to Figure 1-3 The present invention provides a technical solution: a welding device for PCB circuit board processing, including a welding table 1, a welding device 2 is provided on the top of the welding table 1, a moving table 6 is provided on the top of the welding table 1, a lifting head 5 is provided at the bottom of the welding device 2, and a welding mechanism 3 is provided at the bottom of the lifting head 5.

[0035] Welding mechanism 3 includes:

[0036] The top of the fixed sleeve 301 is fixedly connected to the bottom of the lifting head 5. A sliding rod 302 is slidably connected to the inner wall of the fixed sleeve 301. A high-temperature heating ring 306 is provided at the bottom of the sliding rod 302.

[0037] The guide block 307 has a frustum-shaped structure. The top of the guide block 307 is fixedly connected to the bottom of the high-temperature heating ring 306. A solder rod 304 is provided on the top of the high-temperature heating ring 306. The top of the solder rod 304 is in contact with the bottom of the lifting head 5.

[0038] In use, the circuit board to be soldered is placed on the moving platform 6. Then, the soldering machine 2 is activated to control the lifting head 5 to descend and perform soldering work on the designated points of the circuit board on the moving platform 6. When the lifting head 5 descends, the guide block 307 below the lifting head 5 contacts and holds the circuit board on the moving platform 6. As the lifting head 5 continues to descend, the guide block 307 and the high-temperature heating ring 306 are subjected to a squeezing reaction force that pushes the solder rod 304 upward. At the same time, the high-temperature heating ring 306 is activated to heat the solder rod 304 at high temperature, thereby quickly melting the solder rod 304. The molten solder rod 304 is then melted. The solder flows to a designated point on the circuit board surface through the high-temperature heating ring 306 and the guide block 307. Then, the welding machine 2 drives the lifting head 5 to rise and reset. At this time, the guide block 307 separates from the circuit board. After the solder cools and solidifies, a single welding operation is completed. Multiple points can be welded simultaneously through several high-temperature heating rings 306 and guide blocks 307, which greatly improves welding efficiency. At the same time, each point can be controlled independently, and the welding position and amount of solder can be flexibly adjusted according to actual needs without manual intervention. This effectively reduces the difficulty of operation and human error, and further ensures the stability and consistency of welding quality.

[0039] Example 2: Please refer to Figure 1-5 Based on Embodiment 1, the present invention provides a technical solution: a ball block 308 is fixedly connected to the bottom of the flow guide block 307, and the ball block 308 has a hemispherical structure.

[0040] The outer wall of the sliding rod 302 is provided with a threaded groove 303, and the sliding rod 302 is slidably connected to the inner wall of the fixed sleeve 301 through the threaded groove 303.

[0041] The inner wall of the solder rod 304 does not contact the outer wall of the fixed sleeve 301 and the sliding rod 302. A spring 305 is fixedly connected to the inner wall of the fixed sleeve 301.

[0042] One end of the spring 305 is rotatably connected to one end of the sliding rod 302 via a bearing. The sliding rod 302 has a circular cylindrical structure.

[0043] The molten solder flows along the outer wall of the guide block 307 to the surface of the circuit board through the high-temperature heating ring 306 and the guide block 307. The inclined surface of the guide block 307 can guide the molten solder and concentrate it to a designated point on the surface of the circuit board, preventing the molten solder from shifting or splashing during the flow, thereby ensuring that the solder joint is accurately positioned and has a regular shape.

[0044] Simultaneously, after the guide block 307 and the high-temperature heating ring 306 are pushed and squeezed upwards to press against the solder rod 304, the solder rod 304 is melted. At this time, the sliding rod 302 connected to the guide block 307 and the threaded groove 303 slide and rotate threadedly in the fixed sleeve 301. The thread helix angle of the threaded groove 303 is greater than 45 degrees. Thus, when the guide block 307 and the high-temperature heating ring 306 are pushed upwards by the pressure, the sliding rod 302 and the threaded groove 303 slide and rotate threadedly in the fixed sleeve 301. Utilizing the characteristic that the thread helix angle is greater than 45 degrees, the high-temperature heating ring 306 and the guide block 307 will automatically rotate. As the high-temperature heating ring 306 and the guide block 307 rotate, the melting efficiency of the solder rod 304 above is further improved, making the molten solder melt more evenly and fully, and shortening the welding cycle. Moreover, the rotation helps to evenly spread the molten solder on the surface of the solder joint, avoiding local accumulation or depression, and further ensuring the fullness and conductivity of the solder joint.

[0045] Furthermore, by utilizing the bottom arc surface of the ball block 308, the risk of friction and scratching to the circuit board below is reduced when the high-temperature heating ring 306 and the flow guide block 307 rotate. The arc surface structure forms point contact rather than surface contact at the moment of contact, resulting in a small contact area. Combined with the elastic material of the ball block 308 itself, even if the flow guide block 307 makes slight contact with the circuit board, it can absorb the impact through elastic deformation, thus avoiding damage to the surface of the circuit board.

[0046] Example 3: Please refer to Figure 1-8 Based on Embodiment 1 and Embodiment 2, the present invention provides a technical solution: a magnetic groove is provided on the inner wall of the sliding rod 302, and a flow guiding mechanism 4 is provided on the inner wall of the magnetic groove. The flow guiding mechanism 4 includes a vertical rod 401, and a magnetic connecting block 402 is fixedly connected to the top of the vertical rod 401. The magnetic connecting block 402 and the opposite side of the magnetic groove are attracted by opposite poles.

[0047] The outer walls of the vertical rod 401 and the magnetic connecting block 402 are slidably connected to the inner wall of the magnetic groove. One end of the vertical rod 401 is fixedly connected to the outer wall of the guide block 307. A circular through groove 403 is opened on the inner wall of the high-temperature heating ring 306. The circular through groove 403 does not contact the outer wall of the vertical rod 401. A first guide groove 404 is opened on the outer wall of the high-temperature heating ring 306. A second guide groove 405 is opened on the outer wall of the guide block 307.

[0048] A heat-conducting plate 406 is fixedly connected to the outer wall of the high-temperature heating ring 306. The heat-conducting plate 406 has a plate-shaped structure, and the top of the heat-conducting plate 406 is in contact with the bottom of the solder rod 304.

[0049] As the high-temperature heating ring 306 rotates, it drives several surrounding heat-conducting plates 406 to rotate, further increasing the contact area with the solder bar 304. The heat-conducting plates 406 conduct heat to the solder bar 304, completing the stable and uniform hot melting of the solder bar 304. At the same time, the rotation of the heat-conducting plates 406 can also form a weak stirring effect on the surface of the molten solder, preventing the molten solder from generating pores or inclusions due to localized rapid cooling, ensuring that the internal structure of the solder joint is dense and free from the risk of poor soldering.

[0050] Furthermore, the flow guide block 307 is magnetically attracted to the inner wall of the sliding rod 302 via the vertical rod 401 and the magnetic connecting block 402. This magnetic connection method not only enables quick disassembly and maintenance of the flow guide block 307, but also ensures a tight fit through the squeezing force during the pressing process, ensuring that the flow guide channel does not deform or misalign under high pressure. At the same time, it is convenient to replace the flow guide block 307 of different specifications to adapt to different welding point requirements, and no additional fasteners are required, simplifying the assembly process.

[0051] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A welding device for PCB circuit board processing, comprising a welding table (1), a welding device (2) disposed on the top of the welding table (1), a moving stage (6) disposed on the top of the welding table (1), and a lifting head (5) disposed on the bottom of the welding device (2), characterized in that: The bottom of the lifting head (5) is provided with a welding mechanism (3); The welding mechanism (3) includes: A fixed sleeve (301) is fixedly connected to the bottom of the lifting head (5) at its top. A sliding rod (302) is slidably connected to the inner wall of the fixed sleeve (301). A high-temperature heating ring (306) is provided at the bottom of the sliding rod (302). The guide block (307) has a frustum-shaped structure. The top of the guide block (307) is fixedly connected to the bottom of the high-temperature heating ring (306). A solder rod (304) is provided on the top of the high-temperature heating ring (306). The top of the solder rod (304) is in contact with the bottom of the lifting head (5).

2. The welding apparatus for PCB circuit board processing according to claim 1, characterized in that: The bottom of the guide block (307) is fixedly connected to a ball block (308), which is a hemispherical structure.

3. The welding apparatus for PCB circuit board processing according to claim 2, characterized in that: The outer wall of the sliding rod (302) is provided with a threaded groove (303), and the sliding rod (302) is slidably connected to the inner wall of the fixed sleeve (301) through the threaded groove (303).

4. The welding apparatus for PCB circuit board processing according to claim 3, characterized in that: The inner wall of the solder rod (304) does not contact the outer wall of the fixed sleeve (301) and the sliding rod (302), and a spring (305) is fixedly connected to the inner wall of the fixed sleeve (301).

5. The welding apparatus for PCB circuit board processing according to claim 4, characterized in that: One end of the spring (305) is rotatably connected to one end of the sliding rod (302) via a bearing, and the sliding rod (302) is a circular cylindrical structure.

6. The welding apparatus for PCB circuit board processing according to claim 5, characterized in that: The inner wall of the sliding rod (302) is provided with a magnetic groove, and the inner wall of the magnetic groove is provided with a flow guiding mechanism (4). The flow guiding mechanism (4) includes a vertical rod (401), and a magnetic connecting block (402) is fixedly connected to the top of the vertical rod (401). The magnetic connecting block (402) and the opposite side of the magnetic groove are attracted to each other.

7. A welding apparatus for PCB circuit board processing according to claim 6, characterized in that: The outer wall of the vertical rod (401) and the magnetic connecting block (402) are slidably connected to the inner wall of the magnetic groove. One end of the vertical rod (401) is fixedly connected to the outer wall of the guide block (307). A circular through groove (403) is opened on the inner wall of the high-temperature heating ring (306). The circular through groove (403) does not contact the outer wall of the vertical rod (401). A first guide groove (404) is opened on the outer wall of the high-temperature heating ring (306). A second guide groove (405) is opened on the outer wall of the guide block (307).

8. A welding apparatus for PCB circuit board processing according to claim 7, characterized in that: A heat-conducting plate (406) is fixedly connected to the outer wall of the high-temperature heating ring (306). The heat-conducting plate (406) has a plate-like structure, and the top of the heat-conducting plate (406) is in contact with the bottom of the solder rod (304).

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