Laser processing head pose control method, pose control device, mechanism and medium

Abstract

The application discloses a laser processing head pose control method, a pose control device, a mechanism and a medium. Height information of a first position point and a second position point on a workpiece surface along a running direction is acquired, and a local fluctuation trend of the workpiece surface is predicted. A current pitch angle is detected in combination with an inclinometer, a current relative height value is calculated according to the height information of the two position points, and a height control quantity is generated according to a deviation between the current relative height value and a preset height setting value, so as to control a lifting motion. Meanwhile, a local slope angle is calculated according to the height information of the two position points, and a pose control quantity is generated according to a deviation between the local slope angle and the current pitch angle, so as to control a pitch motion. In this way, when ascending, the laser processing head is actively lifted and the pitch angle is adjusted, and when descending, the laser processing head is actively lowered and the pitch angle is adjusted, so that the laser processing head can adaptively follow the change of the terrain, effectively avoid collision, ensure that the processing nozzle is kept perpendicular to the workpiece surface, and improve the processing quality and stability.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing head posture control method, posture control device, mechanism and medium. Background Technology

[0002] Existing laser processing systems use feedback control based on the height directly below the laser processing head to maintain a constant processing distance. This method is effective on flat workpieces, but when the workpiece is partially tilted, forming a steep upward or downward slope, the system cannot detect the terrain change in advance, and the actuator response is lagging. This causes the laser processing head to easily deviate from the set height or even collide when climbing or descending slopes at high speeds. Summary of the Invention

[0003] In view of the shortcomings of the prior art, this application provides a laser processing head posture control method, posture control device, mechanism and medium, which can realize the active prediction and posture self-adaptation of the laser processing head on complex curved surfaces, avoid collisions and improve processing quality.

[0004] To address the aforementioned technical problems, this application, in a first aspect, discloses a laser processing head pose control method, comprising: The height information of the first and second position points on the workpiece surface along the travel direction of the laser processing head, and the current pitch angle of the laser processing head are obtained, wherein the distance between the first and second position points is a preset distance; The current relative height of the laser processing head is calculated based on the height information of the first position point and the height information of the second position point. Based on the height information of the first position point and the height information of the second position point, calculate the local slope angle of the workpiece surface in front of the laser processing head; A height control value is generated based on the height deviation between the current relative height value and the preset height setting value; Based on the angular deviation between the local slope angle and the current pitch angle, attitude control parameters are generated; The laser processing head is controlled to perform lifting and lowering movements based on the height control amount, and to perform pitching movements based on the attitude control amount.

[0005] As an optional implementation, in this embodiment of the application, calculating the local slope angle of the workpiece surface in front of the laser processing head based on the height information of the first position point and the height information of the second position point includes: Obtain the first height value h1 of the first location point and the second height value h2 of the second location point; The local slope angle is calculated according to the ratio of the difference between the first height value h1 and the second height value h2 to the preset distance L, using the following formula:

[0006] As an optional implementation, in this embodiment of the application, the generation of attitude control quantities includes: A proportional-integral-derivative controller is used to perform closed-loop control calculations on the angle deviation to generate the attitude control quantity.

[0007] As an optional implementation, in this embodiment of the application, the use of a proportional-integral-derivative controller for closed-loop control calculation includes: The attitude control quantity Calculate using the following formula:

[0008] in, The angle deviation is... , , These are the preset attitude proportional gain, attitude integral gain, and attitude differential gain, respectively.

[0009] As an optional implementation, in this embodiment of the application, a lifting drive motor is disposed on the mounting base, and the output shaft of the lifting drive motor is connected to a sliding seat. Under the drive of the lifting drive motor, the sliding seat can move up and down relative to the mounting base. An attitude drive motor is mounted on the sliding base, and the output shaft of the attitude drive motor is connected to the laser processing head. Under the drive of the attitude drive motor, the laser processing head can rotate relative to the mounting base around a rotation axis perpendicular to the direction of travel. The lifting drive motor drives the laser processing head to move up and down in the vertical direction according to the height control amount; The attitude drive motor drives the processing nozzle of the laser processing head to rotate about a direction perpendicular to the direction of travel, according to the attitude control amount.

[0010] As an optional implementation, in this embodiment of the application, both the first linear motor and the second linear motor are connected between the laser processing head and the mounting base, and the output shafts of both the first linear motor and the second linear motor are rotatably connected to the laser processing head. The first linear motor and the second linear motor are spaced apart along the travel direction of the laser processing head. The first linear motor and the second linear motor drive the laser processing head to move relative to the mounting base in a vertical direction; The height control quantity and the attitude control quantity are superimposed and differentially calculated to generate the first motor control quantity and the second motor control quantity. The first linear motor controls the lifting and lowering according to the first motor control quantity, and the second linear motor controls the lifting and lowering according to the second motor control quantity, so as to control the laser processing head to perform lifting and lowering movements and pitching movements.

[0011] As an optional implementation, in this embodiment of the application, the first motor control quantity Second motor control quantity Calculate using the following formula:

[0012]

[0013] in, The height control amount, The attitude control quantity is denoted as .

[0014] As an optional implementation, in this embodiment of the application, obtaining the height information of the first and second position points on the workpiece surface along the travel direction of the laser processing head includes: Obtain the first height information of the first position point detected by the first sensor arranged on the laser processing head; and The second height information of the second position point detected by the second sensor arranged on the laser processing head is obtained.

[0015] Secondly, embodiments of this application disclose a laser processing head pose control device, including: Laser processing head; A height information acquisition module is disposed on the laser processing head and is used to acquire the height information of a first position point and a second position point on the workpiece surface along the traveling direction of the laser processing head. The distance between the first position point and the second position point is a preset distance. An inclinometer, mounted on the laser processing head, is used to detect the current pitch angle of the laser processing head; A drive assembly, connected between the laser processing head and the mounting base, is used to drive the laser processing head to perform lifting and pitching movements; The controller is connected to the height information acquisition module, the inclinometer, and the drive assembly, and is configured to execute the method described above.

[0016] Thirdly, embodiments of this application disclose a laser processing head mechanism, comprising: Laser processing head; Mounting base for connecting external motion mechanisms; A first capacitive sensor and a second capacitive sensor are fixedly disposed on the same side of the laser processing head and arranged at predetermined intervals along the traveling direction of the laser processing head. The first capacitive sensor is used to detect the first height information of a first position point on the workpiece surface, and the second capacitive sensor is used to detect the second height information of a second position point on the workpiece surface. The first height information and the second height information are used to calculate the local slope angle of the workpiece surface in front of the laser processing head. An inclinometer, fixedly mounted on the laser processing head, is used to detect the current pitch angle of the laser processing head; A drive assembly, connected between the mounting base and the laser processing head, is used to drive the laser processing head to perform lifting and lowering movements based on the deviation between the average value of the first height information and the second height information and a preset height setting value, and to drive the laser processing head to perform pitching movements based on the deviation between the local slope angle and the current pitch angle.

[0017] Fourthly, embodiments of this application disclose a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the method described above.

[0018] This application provides a laser processing head posture control method, posture control device, mechanism, and medium. By acquiring the height information of a first position point and a second position point on the workpiece surface along the travel direction of the laser processing head, the local undulation trend of the workpiece surface can be predicted in advance. Combined with the acquired current pitch angle of the laser processing head, the current relative height value is calculated based on the height information of the first and second position points. Then, a height control quantity is generated based on the height deviation between the current relative height value and a preset height setting value to control the laser processing head to perform lifting and lowering movements. Simultaneously, a local slope angle is calculated based on the height information of the first and second position points, and an attitude control quantity is generated based on the angular deviation between the local slope angle and the current pitch angle to control the laser processing head to perform pitch movements. In this way, when encountering an uphill slope, the laser processing head can actively raise and adjust the pitch angle; when descending a slope, it can actively lower and adjust the pitch angle accordingly, thereby effectively avoiding collisions between the laser processing head and the workpiece. Meanwhile, since the current pitch angle of the laser processing head can be corrected based on the local slope angle of the workpiece surface acquired in real time, the processing nozzle can always be kept perpendicular to the workpiece surface, thereby keeping the laser focus position and the auxiliary gas flow direction in the optimal state, significantly improving the processing quality and process stability of the slope or curved surface area. Attached Figure Description

[0019] Figure 1 This is a flowchart illustrating the laser processing head pose control method provided in this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description of this application is provided with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining this application and are not intended to limit this application. Unless further described, elements, structures, and features in one embodiment may be advantageously combined with other embodiments.

[0021] It should be noted that when a metastructure is referred to as "fixed to" or "set on" another metastructure, it can be directly on or indirectly on that other metastructure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0022] The terms "length," "width," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this application and simplifying the description, and are not intended to constitute an infringement. The instruction or implication refers to a device or component that must have a specific orientation, be constructed and operated in a specific orientation.

[0023] Example 1 Please see Figure 1 This embodiment discloses a laser processing head pose control method. The laser processing head can be a laser cutting head, laser welding head, etc., and is not limited thereto. This embodiment uses a laser cutting head as an example, where the laser cutting head emits a laser beam to cut the workpiece. Pose adaptation specifically includes adaptive height position of the laser processing head (the vertical distance between the laser processing head's nozzle and the workpiece surface) and adaptive pitch posture (the angle between the laser processing head's axis and the workpiece normal). The laser processing head pose control method includes the following steps: Step S1: Obtain the height information of the first and second position points on the workpiece surface along the travel direction of the laser processing head, as well as the current pitch angle of the laser processing head, wherein the distance between the first and second position points is a preset distance.

[0024] By acquiring the height information of the first and second positions of the workpiece along the direction of travel of the laser processing head, at high speeds, it is possible not only to acquire the height and position information of the workpiece in a timely manner, but also to predict the local undulation trend of the workpiece surface in advance, that is, to anticipate the workpiece's climbing or descending, thereby timely and adaptively controlling the posture of the laser processing head to meet processing requirements.

[0025] In some embodiments, obtaining the height information of a first position point and a second position point on the workpiece surface along the travel direction of the laser processing head includes: Acquire the first height information of the first position point detected by the first sensor arranged on the laser processing head; and Acquire the second height information of the second position point detected by the second sensor arranged on the laser processing head.

[0026] The first sensor and the second sensor are fixedly mounted on the same side of the laser processing head and arranged at predetermined intervals along the traveling direction of the laser processing head.

[0027] Step S2: Calculate the current relative height of the laser processing head based on the height information of the first position point and the height information of the second position point.

[0028] Step S3: Calculate the local slope angle of the workpiece surface in front of the laser processing head based on the height information of the first position point and the height information of the second position point.

[0029] In some embodiments, the local slope angle of the workpiece surface in front of the laser processing head is calculated based on the height information of the first position point and the height information of the second position point, including: Obtain the first height value h1 of the first position point and the second height value h2 of the second position point; The local slope angle is calculated using the ratio of the difference between the first height value h1 and the second height value h2 to the preset distance L, according to the following formula:

[0030] Step S4: Generate a height control value based on the height deviation between the current relative height value and the preset height setting value.

[0031] In some embodiments, generating height control values ​​includes: Based on the average height of the first height value h1 and the second height value h2 and the preset height setting value The difference is used to calculate the average height error. The formula for calculating the average height error is as follows: Among them, the preset height setting value This represents the average height under ideal conditions.

[0032] A proportional-integral-derivative controller is used to perform closed-loop control calculations on the average height error to generate the height control quantity.

[0033] Furthermore, a proportional-integral-derivative controller is used for closed-loop control calculations, including: Height control amount Calculate using the following formula:

[0034] in, This represents the average height error. , , These are the preset height proportional gain, height integral gain, and height differential gain, respectively.

[0035] Step S5: Generate attitude control quantities based on the angular deviation between the local slope angle and the current pitch angle.

[0036] In some embodiments, generating attitude control variables includes: A proportional-integral-derivative controller is used to perform closed-loop control calculations on the angle deviation to generate attitude control quantities.

[0037] Furthermore, a proportional-integral-derivative controller is used for closed-loop control calculations, including: Attitude control quantity Calculate using the following formula:

[0038] in, Due to angular deviation, , , These are the preset attitude proportional gain, attitude integral gain, and attitude differential gain, respectively.

[0039] Step S6: Control the laser processing head to perform lifting and lowering motion according to the height control amount, and control the laser processing head to perform pitching motion according to the attitude control amount.

[0040] By controlling the "height + pitch attitude" of the laser processing head in a coordinated manner, the laser processing head can not only maintain a constant height, but also actively adjust its own pitch attitude to "fit" the local slope of the warped workpiece.

[0041] As an optional implementation, the lifting drive motor is mounted on the mounting base, and the output shaft of the lifting drive motor is connected to the sliding seat. Under the drive of the lifting drive motor, the sliding seat can move up and down relative to the mounting base. The attitude drive motor is mounted on the sliding base, and the output shaft of the attitude drive motor is connected to the laser processing head. Under the drive of the attitude drive motor, the laser processing head can rotate relative to the mounting base around a rotation axis perpendicular to the direction of travel. The lifting drive motor controls the amount of height. This drives the laser processing head to move up and down vertically. The attitude drive motor is based on the attitude control quantity The processing nozzle of the laser processing head rotates about a direction perpendicular to the direction of travel.

[0042] As another optional implementation, the first linear motor and the second linear motor are both connected between the laser processing head and the mounting base, and the output shafts of the first linear motor and the second linear motor are both rotatably connected to the laser processing head. The first linear motor and the second linear motor are spaced apart along the travel direction of the laser processing head. The first linear motor and the second linear motor drive the laser processing head to move relative to the mounting base in the vertical direction; The height control quantity and attitude control quantity are superimposed and differentially calculated to generate the first motor control quantity and the second motor control quantity. The first linear motor controls the lifting and lowering according to the control input of the first motor, and the second linear motor controls the lifting and lowering according to the control input of the second motor, so as to control the laser processing head to perform lifting and pitching movements. Specifically, the first motor control quantity Second motor control quantity Calculate using the following formula:

[0043]

[0044] in, For height control, This is the attitude control variable.

[0045] This method acquires the height information of the first and second positions on the workpiece surface along the direction of the laser processing head's travel, enabling early prediction of local surface undulations. Combined with the acquired current pitch angle of the laser processing head, it calculates the current relative height value based on the height information of the first and second positions. Then, it generates a height control quantity based on the height deviation between the current relative height value and a preset height setting, controlling the laser processing head's lifting and lowering movements. Simultaneously, it calculates the local slope angle based on the height information of the first and second positions, and generates an attitude control quantity based on the angular deviation between the local slope angle and the current pitch angle, controlling the laser processing head's pitch movement. Thus, when encountering an uphill slope, the laser processing head can actively raise and adjust its pitch angle; when descending a slope, it can actively lower and adjust its pitch angle accordingly, effectively preventing collisions between the laser processing head and the workpiece. Furthermore, because the current pitch angle of the laser processing head can be corrected based on the real-time acquired local slope angle of the workpiece surface, it can always ensure that the processing nozzle remains perpendicular to the workpiece surface, thereby maintaining the laser focus position and auxiliary gas flow direction at their optimal state, significantly improving the processing quality and process stability in sloped or curved areas.

[0046] Example 2 The laser processing head posture control device provided in this application includes a laser processing head, a height information acquisition module, an inclinometer, a drive assembly, and a controller. The height information acquisition module is disposed on the laser processing head and is used to acquire the height information of a first position point and a second position point on the workpiece surface along the travel direction of the laser processing head. The distance between the first position point and the second position point is a preset distance. The inclinometer is disposed on the laser processing head and is used to detect the current pitch angle of the laser processing head. The drive assembly is connected between the laser processing head and the mounting base and is used to drive the laser processing head to perform lifting and pitching movements. The controller is connected to the height information acquisition module, the inclinometer, and the drive assembly respectively, and the controller is configured to execute the method as described in Embodiment 1.

[0047] The laser processing head posture control device provided in this application acquires the height information of a first and second position point on the workpiece surface along the travel direction of the laser processing head through a height information acquisition module, and detects the current pitch angle of the laser processing head through an inclinometer. The controller calculates a height control amount based on the height information of the first and second position points, and calculates an attitude control amount based on the height information and the current pitch angle. The drive component drives the laser processing head to rise and fall vertically according to the height control amount, and drives the laser processing head to rotate around a rotation axis perpendicular to the travel direction according to the attitude control amount. Specifically, the laser processing head is driven to "raise its head" in advance before encountering an uphill slope and "lower its head" in advance before encountering a downhill slope, thereby adaptively adjusting the height and pitch attitude of the laser processing head according to the workpiece terrain, effectively avoiding collisions between the laser processing head and the workpiece. At the same time, the actual pitch angle of the laser processing head is fed back in real time by the inclinometer, and the controller can correct its motion pitch attitude accordingly, so that the processing nozzle of the laser processing head always remains perpendicular to the workpiece surface, ensuring that the laser focus position and the auxiliary gas flow direction are in the optimal state, thereby significantly improving the processing quality and process stability in inclined or curved areas.

[0048] In this embodiment, the height information acquisition module includes a first capacitive sensor and a second capacitive sensor installed in front of the processing nozzle of the laser processing head along the direction of travel of the laser processing head, which can detect the local slope of the workpiece in advance; the inclinometer is installed inside the laser processing head and can measure the actual pitch angle of the laser processing head in real time. Since the capacitive sensor has sub-micron level measurement accuracy, it can accurately maintain a constant gap between the laser processing head and the workpiece surface; its measurement is based on the electric field principle and is not affected by the workpiece color, reflectivity and material type, making it more adaptable, especially suitable for high-precision pose control under complex working conditions.

[0049] The distance between the center of the first capacitive sensor and the center of the second capacitive sensor can be set according to actual usage requirements, such as 10-20mm. This ensures that the prediction of the terrain ahead is sufficient, while avoiding distortion of terrain information due to excessive spacing, making the height control and attitude control values ​​calculated by the controller more accurate and reliable.

[0050] The inclinometer employs a MEMS inclinometer, which possesses excellent dynamic response characteristics. It can track the pitch angle changes of the laser processing head during high-speed movement in real time, and its measurement accuracy meets the requirements of laser cutting for attitude control (typically better than 0.1°). This provides the controller with high-precision current pitch angle feedback, ensuring accurate calculation of attitude control parameters. It is understood that in other embodiments, the inclinometer can also be replaced by an electrolyte inclinometer, a capacitive inclinometer, a photoelectric inclinometer, a fiber optic inclinometer, an inductive inclinometer, or a gyroscope; this is not a limitation.

[0051] The controller comprises a parallel height PID control unit and an attitude PID control unit. The height PID control unit generates the height control value for the laser processing head based on the height information from two position points, while the attitude PID control unit generates the attitude control value for the laser processing head based on the height information from the two position points and the current pitch angle of the laser processing head. This parallel design, with independent PID control units handling height and attitude control respectively, results in clear control logic, rapid response, and easy independent parameter tuning, making it suitable for control requirements with varying dynamic characteristics.

[0052] As an optional implementation, the drive assembly includes a lifting drive motor and a posture drive motor. The lifting drive motor is mounted on the mounting base, and its output shaft is connected to a sliding base. Driven by the lifting drive motor, the sliding base can move up and down relative to the mounting base. The posture drive motor is mounted on the sliding base, and its output shaft is connected to the laser processing head. Driven by the posture drive motor, the laser processing head can rotate relative to the mounting base about an axis perpendicular to the direction of travel. The lifting drive motor drives the laser processing head to move up and down vertically according to the height control value. The posture drive motor drives the processing nozzle of the laser processing head to rotate about an axis perpendicular to the direction of travel according to the posture control value. With this design, height control and posture control are executed by two independent motors, resulting in clear control logic that does not interfere with each other. Furthermore, the two control loops can be independently optimized, making it suitable for applications requiring high control precision.

[0053] As an alternative implementation, the drive assembly includes a first linear motor and a second linear motor. Both the first and second linear motors are connected between the laser processing head and the mounting base, and their output shafts are rotatably connected to the laser processing head. The first and second linear motors are spaced apart along the travel direction of the laser processing head. The first and second linear motors drive the laser processing head to move relative to the mounting base in the vertical direction. The controller performs superposition and differential calculations on the height control and attitude control values ​​to generate the first motor control value and the second motor control value. The first linear motor controls the lifting and lowering according to the first motor control value, and the second linear motor controls the lifting and lowering according to the second motor control value, thereby controlling the laser processing head to perform lifting and pitching movements. Specifically, when the first motor control value is greater than the second motor control value, the laser processing head tilts forward ("head up"); when the first motor control value is less than the second motor control value, the laser processing head tilts backward ("head down"). This design eliminates the need for an additional independent attitude drive motor, resulting in a more compact overall structure, making it particularly suitable for applications with limited installation space.

[0054] It is understandable that the lifting drive motor, posture drive motor, first linear motor and second linear motor can be servo motors, voice coil motors or linear motors, etc., and there are no restrictions on them, as long as they can achieve the corresponding driving function.

[0055] Example 3 The laser processing head mechanism provided in this application includes a laser processing head, a mounting base, a first capacitive sensor and a second capacitive sensor, an inclinometer, and a drive assembly. The mounting base is used to connect an external motion mechanism. The first and second capacitive sensors are fixedly disposed on the same side of the laser processing head and arranged at predetermined intervals along the travel direction of the laser processing head. The first capacitive sensor is used to detect the first height information of a first position point on the workpiece surface, and the second capacitive sensor is used to detect the second height information of a second position point on the workpiece surface. The first and second height information are used to calculate the local slope angle of the workpiece surface in front of the laser processing head. The inclinometer is fixedly disposed on the laser processing head and is used to detect the current pitch angle of the laser processing head. The drive assembly is connected between the mounting base and the laser processing head and is used to drive the laser processing head to perform lifting and lowering movements based on the deviation between the average value of the first and second height information and a preset height setting value, and to drive the laser processing head to perform pitching movements based on the deviation between the local slope angle and the current pitch angle.

[0056] The laser processing head mechanism provided in this application uses a first capacitive sensor and a second capacitive sensor, fixedly mounted on the same side of the laser processing head and spaced apart along the direction of travel, to detect the first height information of a first position point on the workpiece surface and the second height information of a second position point, respectively, and calculates the local slope angle of the workpiece surface in front of the laser processing head based on this information. An inclinometer fixedly mounted on the laser processing head detects the current pitch angle of the laser processing head. The drive assembly drives the laser processing head to perform lifting and lowering movements based on the deviation between the average value of the first and second height information and a preset height setting value, thereby maintaining a constant gap between the processing nozzle of the laser processing head and the workpiece surface. Simultaneously, it drives the laser processing head to perform pitching movements based on the deviation between the local slope angle and the current pitch angle, ensuring that the processing nozzle remains perpendicular to the workpiece surface. In this way, the laser processing head mechanism can "raise its head" before encountering an uphill slope and "lower its head" before encountering a downhill slope, adaptively adjusting its height and pitch attitude according to the workpiece terrain, effectively avoiding collisions between the laser processing head and the workpiece. At the same time, it ensures that the laser focal position and the auxiliary gas flow direction are always in optimal condition, significantly improving the processing quality and process stability in sloping or curved areas. In addition, the capacitive sensor has sub-micron level measurement accuracy and can accurately maintain a constant gap between the laser processing head and the workpiece surface; its measurement is based on the electric field principle and is not affected by the workpiece color, reflectivity and material type, making it more adaptable and especially suitable for high-precision pose control under complex working conditions.

[0057] As an optional implementation, the drive assembly includes a lifting drive motor and a posture drive motor. The lifting drive motor is mounted on the mounting base, and its output shaft is connected to a sliding seat. Driven by the lifting drive motor, the sliding seat can move up and down relative to the mounting base. The posture drive motor is mounted on the sliding seat, and its output shaft is connected to the laser processing head. Driven by the posture drive motor, the laser processing head can rotate relative to the mounting base about an axis perpendicular to the direction of travel. The lifting drive motor drives the laser processing head to move up and down vertically based on the deviation between the average of the first and second height information and a preset height setting. The posture drive motor drives the processing nozzle of the laser processing head to rotate about an axis perpendicular to the direction of travel based on the deviation between the local slope angle and the current pitch angle. With this design, height control and posture control are executed by two independent motors, resulting in clear control logic that does not interfere with each other. Furthermore, the two control loops can be independently optimized, making it suitable for applications requiring high control precision.

[0058] As an alternative implementation, the drive assembly includes a first linear motor and a second linear motor. Both the first and second linear motors are connected between the laser processing head and the mounting base, and their output shafts are rotatably connected to the laser processing head. The first and second linear motors are spaced apart along the travel direction of the laser processing head. The controller performs superposition and differential calculations on the deviation between the average value and the preset height setting, as well as the deviation between the local slope angle and the current pitch angle, to generate a first motor control quantity and a second motor control quantity. The first linear motor controls the lifting and lowering according to the first motor control quantity, and the second linear motor controls the lifting and lowering according to the second motor control quantity, thereby controlling the laser processing head to perform lifting and pitching movements. Specifically, when the first motor control quantity is greater than the second motor control quantity, the laser processing head tilts forward ("head up"); when the first motor control quantity is less than the second motor control quantity, the laser processing head tilts backward ("head down"). This design eliminates the need for an additional independent attitude drive motor, resulting in a more compact overall structure, making it particularly suitable for applications with limited installation space.

[0059] Example 4 Embodiment 4 of this application discloses a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it causes the processor to perform the compensation method described above. The storage medium can be used to store the laser processing height compensation method disclosed in this application.

[0060] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and concept of this application, and all such substitutions or changes should fall within the protection scope of the appended claims.

Claims

1. A method for controlling the pose of a laser processing head, characterized in that, include: The height information of the first and second position points on the workpiece surface along the travel direction of the laser processing head, and the current pitch angle of the laser processing head are obtained, wherein the distance between the first and second position points is a preset distance; The current relative height of the laser processing head is calculated based on the height information of the first position point and the height information of the second position point. Based on the height information of the first position point and the height information of the second position point, calculate the local slope angle of the workpiece surface in front of the laser processing head; A height control value is generated based on the height deviation between the current relative height value and the preset height setting value; Based on the angular deviation between the local slope angle and the current pitch angle, attitude control parameters are generated; The laser processing head is controlled to perform lifting and lowering movements based on the height control amount, and to perform pitching movements based on the attitude control amount.

2. The laser processing head pose control method according to claim 1, characterized in that, The step of calculating the local slope angle of the workpiece surface in front of the laser processing head based on the height information of the first position point and the height information of the second position point includes: Obtain the first height value h1 of the first location point and the second height value h2 of the second location point; The local slope angle is calculated according to the ratio of the difference between the first height value h1 and the second height value h2 to the preset distance L, using the following formula:

3. The laser processing head pose control method according to claim 1, characterized in that, The generated attitude control variables include: A proportional-integral-derivative controller is used to perform closed-loop control calculations on the angle deviation to generate the attitude control quantity.

4. The laser processing head pose control method according to claim 3, characterized in that, The method of using a proportional-integral-derivative controller for closed-loop control calculations includes: The attitude control quantity Calculate using the following formula: in, The angle deviation is... , , These are the preset attitude proportional gain, attitude integral gain, and attitude differential gain, respectively.

5. The laser processing head pose control method according to claim 1, characterized in that, A lifting drive motor is mounted on the mounting base, and the output shaft of the lifting drive motor is connected to a sliding seat. Under the drive of the lifting drive motor, the sliding seat can move up and down relative to the mounting base. An attitude drive motor is mounted on the sliding base, and the output shaft of the attitude drive motor is connected to the laser processing head. Under the drive of the attitude drive motor, the laser processing head can rotate relative to the mounting base around a rotation axis perpendicular to the direction of travel. The lifting drive motor drives the laser processing head to move up and down in the vertical direction according to the height control amount; The attitude drive motor drives the processing nozzle of the laser processing head to rotate about a direction perpendicular to the travel direction according to the attitude control amount.

6. The laser processing head pose control method according to claim 1, characterized in that, The first linear motor and the second linear motor are both connected between the laser processing head and the mounting base, and the output shafts of the first linear motor and the second linear motor are both rotatably connected to the laser processing head. The first linear motor and the second linear motor are spaced apart along the travel direction of the laser processing head. The first linear motor and the second linear motor drive the laser processing head to move relative to the mounting base in a vertical direction; The height control quantity and the attitude control quantity are superimposed and differentially calculated to generate the first motor control quantity and the second motor control quantity. The first linear motor controls the lifting and lowering according to the first motor control quantity, and the second linear motor controls the lifting and lowering according to the second motor control quantity, so as to control the laser processing head to perform lifting and lowering movements and pitching movements.

7. The laser processing head pose control method according to claim 6, characterized in that, The first motor control quantity Second motor control quantity Calculate using the following formula: in, The height control amount, The attitude control variable is denoted as .

8. The laser processing head pose control method according to claim 1, characterized in that, The process of acquiring the height information of the first and second position points on the workpiece surface along the travel direction of the laser processing head includes: Obtain the first height information of the first position point detected by the first sensor arranged on the laser processing head; and The second height information of the second position point detected by the second sensor arranged on the laser processing head is obtained.

9. A laser processing head posture control device, characterized in that, include: Laser processing head; A height information acquisition module is disposed on the laser processing head and is used to acquire the height information of a first position point and a second position point on the workpiece surface along the traveling direction of the laser processing head. The distance between the first position point and the second position point is a preset distance. An inclinometer, mounted on the laser processing head, is used to detect the current pitch angle of the laser processing head; A drive assembly, connected between the laser processing head and the mounting base, is used to drive the laser processing head to perform lifting and pitching movements; A controller is connected to the height information acquisition module, the inclinometer, and the drive assembly, respectively, and the controller is configured to perform the method as described in any one of claims 1 to 8.

10. A laser processing head mechanism, characterized in that, include: Laser processing head; Mounting base for connecting external motion mechanisms; A first capacitive sensor and a second capacitive sensor are fixedly disposed on the same side of the laser processing head and arranged at predetermined intervals along the traveling direction of the laser processing head. The first capacitive sensor is used to detect the first height information of a first position point on the workpiece surface, and the second capacitive sensor is used to detect the second height information of a second position point on the workpiece surface. The first height information and the second height information are used to calculate the local slope angle of the workpiece surface in front of the laser processing head. An inclinometer, fixedly mounted on the laser processing head, is used to detect the current pitch angle of the laser processing head; A drive assembly, connected between the mounting base and the laser processing head, is used to drive the laser processing head to perform lifting and lowering movements based on the deviation between the average value of the first height information and the second height information and a preset height setting value, and to drive the laser processing head to perform pitching movements based on the deviation between the local slope angle and the current pitch angle.

11. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1 to 8.

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