Laser cutting head collision buffer protection device and laser cutting device
Patent Information
- Application Number
- CN202611017351.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-09
- Publication Date
- 2026-10-30
AI Technical Summary
[0004]本申请提供了一种激光切割头碰撞缓冲保护装置及激光切割装置,旨在至少能够在一定程度上解决激光切割设备的切割头和机床等精密部件易碰撞损伤,以及电容检测信号突变剧烈,检测稳定性差,易损坏的技术问题
本申请实施例提供的激光切割头碰撞缓冲保护装置及激光切割装置,包括支撑框架、缓冲件、第一弹性件、接触件、第二弹性件;缓冲件承接碰撞载荷,缓冲件受压时第一弹性件优先形变完成一级吸能,缓冲件持续移动后再压缩第二弹性件实现二级缓冲,并驱动接触件的接触部靠近碰撞检测元件触发机床停机。其中,两级弹性件形成先一级、后二级的时序缓冲结构,使得碰撞冲击分两次逐级耗散,大幅削减传递至切割头与机床传动结构的瞬时冲击载荷,避免精密部件受刚性撞击产生永久形变,长期维持机床加工精度,延长设备使用寿命。另一方面,两级弹性缓冲结构也能够平缓推动接触件靠近碰撞检测元件,接触部平稳贴合检测元件,电容检测参数渐变而非骤变,有效缓解信号剧烈波动问题,降低误报、漏报概率,提升碰撞检测稳定性。其中,整套结构依靠两级弹性件自身预紧力实现自动复位,碰撞载荷移除后缓冲件、接触件可自主回归初始工位,无需人工校正调整,减少停机维护时长,提升连续加工效率。整体为纯机械装配结构,无需额外增设独立传感器、控制线路,可直接适配原有带碰撞检测元件的激光切割头,改装简单、零部件少,生产与运维成本更低。
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Figure CN123000254A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of laser cutting equipment technology, and particularly relates to a laser cutting head collision buffer protection device and a laser cutting device. Background Technology
[0002] The laser cutting equipment includes a gantry motion mechanism, a laser cutting head, and matching capacitive sensing sensors. During operation, the laser cutting head moves along the track of the sheet metal with the gantry, outputting laser light to complete the cut. The capacitive sensing sensors are correspondingly installed on the laser cutting head. When the laser cutting head contacts the workpiece, the capacitance value of the sensors will change significantly, thus detecting a collision. The gantry motion mechanism will then stop abruptly, thereby achieving collision protection.
[0003] Capacitive sensing sensors can only identify capacitance changes and trigger a shutdown after a collision occurs. However, there are minute time differences in sensor signal recognition, control system response, and servo motor braking. The impact load generated at the moment of collision will be transmitted to the nozzle and cutting head body before the machine tool stops, and then transmitted through the cutting head to the Z-axis slide, gantry guide rail, gear rack and pinion and other high-precision transmission structures. This will cause potential and cumulative mechanical damage and accuracy deviation, thus significantly reducing the service life and stability of the equipment. Summary of the Invention
[0004] This application provides a laser cutting head collision buffer protection device and a laser cutting device, aiming to at least partially solve the technical problems of easy collision damage to precision components such as the cutting head and machine tool of laser cutting equipment, as well as the drastic changes in capacitance detection signals, poor detection stability, and susceptibility to damage. Therefore, One aspect of this application provides a laser cutting head collision buffer protection device, comprising: The support frame has a mounting part that is compatible with the laser cutting head; A buffer element, movably disposed on the support frame, is used to absorb external collision loads; A first elastic element is disposed on the support frame and is disposed on the movement path of the buffer element to deform and buffer under the pressure of the buffer element. A contact element, connected to the buffer element, and the contact element is configured with a contact portion adapted to the collision detection element; A second elastic element is disposed between the buffer element and the contact element, so as to deform under the pressure of the buffer element and drive the contact portion to approach the collision detection element. The deformation buffering of the first elastic element precedes the deformation buffering of the second elastic element.
[0005] In some embodiments, the number of buffers is multiple, the movement directions of the multiple buffers intersect at a point, and the multiple buffers are evenly spaced along the circumference of the support frame.
[0006] In some embodiments, the buffer member is provided with a collision arc arm on the side opposite to the mounting portion, and a plurality of collision arc arms are sequentially connected and surround the circumferential outer side of the support frame.
[0007] In some embodiments, the first elastic element is a first helical spring, and two sets of the first helical springs are symmetrically arranged on both sides of the central axis of the collision arc arm.
[0008] In some embodiments, a push arm is provided on the side of the buffer member near the mounting portion, and a nested groove is provided on the contact member, with the push arm embedded in the nested groove; The end of the push arm is provided with a radial flange, and the inner wall of the groove of the nested slide is provided with an anti-detachment flange. The anti-detachment flange is blocked on the side where the radial flange is detached from the nested slide, and the second elastic member is located between the radial flange and the bottom of the nested slide.
[0009] In some embodiments, both the radial flange and the bottom of the nested groove are provided with limiting bosses, the second elastic element is a second helical spring, and the two ends of the second helical spring are respectively sleeved on the limiting bosses on the corresponding sides.
[0010] In some embodiments, the support frame is provided with a guide groove, and the contact member or the buffer member is slidably embedded in the guide groove.
[0011] In some embodiments, the support framework includes: The support tray has a mounting portion consisting of a mounting hole in the middle of the support plate, and the buffer and the contact are mounted on the support tray. A suspension tray is disposed on the support tray, and the first elastic element is disposed on the suspension tray.
[0012] In some embodiments, the support tray has heat dissipation holes, and the heat dissipation holes surround the circumferential side of the mounting hole.
[0013] Another aspect of the embodiments of this application provides a laser cutting apparatus, including: The aforementioned laser cutting head collision buffer protection device; A laser cutting head is mounted on the mounting portion; A capacitive sensor is connected to the laser cutting head, and the movement direction of the buffer and the contact is directed towards the capacitive sensor. The embodiments of this application have at least the following beneficial effects: The laser cutting head collision buffer protection device and laser cutting device provided in this application embodiment include a support frame, a buffer component, a first elastic component, a contact component, and a second elastic component. The buffer component bears the collision load. When the buffer component is compressed, the first elastic component deforms first to complete the first stage of energy absorption. After the buffer component continues to move, it compresses the second elastic component to achieve the second stage of buffering, and drives the contact part of the contact component to approach the collision detection element, triggering the machine tool to stop. The two stages of elastic components form a sequential buffer structure of first stage followed by second stage, allowing the collision impact to be dissipated in two stages, significantly reducing the instantaneous impact load transmitted to the cutting head and the machine tool transmission structure. This prevents permanent deformation of precision components due to rigid impact, maintains the machining accuracy of the machine tool for a long time, and extends the service life of the equipment. On the other hand, the two-stage elastic buffer structure can also smoothly push the contact component towards the collision detection element. The contact part smoothly adheres to the detection element, and the capacitance detection parameter changes gradually rather than abruptly, effectively mitigating the problem of drastic signal fluctuations, reducing the probability of false alarms and missed alarms, and improving the stability of collision detection. The entire structure relies on the pre-tension of two-stage elastic components to achieve automatic reset. After the collision load is removed, the buffer and contact components can autonomously return to their initial positions without manual correction or adjustment, reducing downtime for maintenance and improving continuous processing efficiency. The overall structure is a purely mechanical assembly structure, requiring no additional independent sensors or control circuits. It can be directly adapted to existing laser cutting heads with collision detection elements, making modification simple, reducing the number of parts, and lowering production and maintenance costs. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 An exploded view of the laser cutting head collision buffer protection device in an embodiment of this application is shown; Figure 2 It shows Figure 1 A three-dimensional structural diagram of the laser cutting head collision buffer protection device in the diagram; Figure 3 It shows Figure 1 A schematic diagram showing the arrangement of the support trays and the suspended trays; Figure 4 It shows Figure 1 A schematic diagram showing the arrangement of the buffer element and the first elastic element in the middle; Figure 5 It shows Figure 1 A schematic diagram of the supporting tray structure; Figure 6It shows Figure 1 A schematic diagram of the mating structure of the buffer and contact components; Figure 7 It shows Figure 1 A schematic diagram of the engagement state between the first elastic element and the suspension tray.
[0016] Figure label: 1-Support frame, 1a-Mounting part, 101-Support tray, 1011-Mounting hole, 1012-Heat dissipation hole, 102-Suspension tray, 1021-Suspension hole, 1022-Third limiting boss, 103-Guide groove, 104-Cover plate, 105-Support platform; 2-Buffer component, 201-Collision arc arm, 202-Push arm, 2021-Radial flange, 2022-First limiting boss; 3-First elastic element, 301-First helical spring; 4-Contact element, 401-Contact portion, 402-Nested groove, 4021-Anti-detachment flange, 4022-Second limiting boss; 5-Second elastic element, 501-Second helical spring; 6-Laser cutting head; 7-Collision detection element. Detailed Implementation
[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0018] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this application. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this application provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0019] This application is described below with reference to the accompanying drawings and specific embodiments: During laser cutting, conditions such as sheet warping, waste residue, and machining trajectory deviation can easily cause the cutting head to collide. Existing equipment relies solely on capacitive sensors to detect collisions, lacking a pre-buffering structure. The rigid impact force generated at the moment of collision is directly transmitted to the cutting head and ceramic sensing ring without attenuation, and then to high-precision transmission components such as the gantry guide rail and gear rack. Long-term cumulative impact can cause component deformation, permanent degradation of positioning accuracy, and a significant reduction in equipment lifespan. At the same time, hard impacts cause sudden and drastic changes in capacitance values, resulting in severe fluctuations in the detection signal. This leads to frequent false shutdowns and missed collision alarms. The ceramic sensing ring is also prone to plating peeling and cracking due to direct impacts, significantly increasing the cost of consumable replacement and equipment maintenance.
[0020] Therefore, this application provides a laser cutting head collision buffer protection device and a laser cutting device, which has a protective structure with graded time-sequential buffering function. It weakens the collision impact and stabilizes the detection signal from the mechanical structure level, solving the multiple defects of laser cutting equipment such as easy collision damage to precision components such as cutting heads and machine tools, as well as the drastic changes in capacitance detection signals, poor detection stability, and easy damage.
[0021] See Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 In some embodiments, the laser cutting head collision buffer protection device is installed in conjunction with the laser cutting head and the collision detection element to achieve collision buffering and smooth triggering of the collision detection element. The laser cutting head collision buffer protection device includes a support frame 1 and a buffer member 2, a first elastic member 3, a contact member 4, and a second elastic member 5 movably disposed on the support frame 1. The buffer member 2 and the contact member 4 are drivenly connected, the first elastic member 3 is configured as an elastic buffer of the buffer member 2, and the second elastic member 5 is disposed between the buffer member 2 and the contact member 4.
[0022] The support frame 1 serves as the load-bearing base for all components and is used to mount other components. The support frame 1 also includes a mounting section 1a for matching and mounting with the laser cutting head 6 and the collision detection element 7.
[0023] The buffer 2 is slidably mounted on the outer region of the support frame 1 and is a force-bearing component that directly bears the collision load of objects such as plates and waste materials; by moving relative to the support frame 1, it converts and guides the collision energy to be transmitted along a set path.
[0024] The first elastic element 3 is installed between the support frame 1 and the buffer element 2, arranged along the inward movement path of the buffer element 2. Thus, after the buffer element 2 is moved by an external impact, it establishes an interaction with the first elastic element, forcing the first elastic element 3 to undergo elastic deformation, thereby converting the collision energy into the elastic potential energy of the first elastic element 3, achieving the collision buffering function. After the buffer element 2 stops moving, it will retract and reset under the elastic restoring force of the first elastic element 3. In conventional designs, the elastic deformation of the first elastic element 3 under the drive of the buffer element 2 can be either compressive or tensile deformation, allowing for flexible design. This application describes an embodiment using compressive deformation as an example.
[0025] The contact element 4 is floatingly mounted inside the buffer element 2, and a contact portion 401 is provided on one end of the contact element 4, which faces the collision detection element 7 (such as a capacitive sensing ceramic ring) of the laser cutting head 6. The second elastic element 5 is sandwiched between the buffer element 2 and the contact element 4. After the buffer element 2 moves a certain distance, it will drive the second elastic element 5 and indirectly drive the contact element 4 to move towards the collision detection element 7.
[0026] In the initial or normal state, the first elastic element 3 is in an elastically deformed state and maintains elastic contact with the buffer element 2, pushing the buffer element 2 outward and ensuring a stable relative position between the buffer element 2 and the contact element 4. When the outer side of the buffer element 2 is subjected to external impact and compression, the buffer element 2 moves inward towards the support frame 1. During this movement, it first compresses the first elastic element 3, causing the first elastic element 3 to contract and deform under pressure, completing the first layer of impact energy absorption and achieving primary buffering.
[0027] In the initial or normal state, the second elastic element 5 can be in a non-deformable state and does not generate elastic force with the buffer elements 2 and the contact elements 4 on both sides. When the outer side of the buffer element 2 is compressed by an external collision, the first elastic element 3 is compressed to a certain stroke as the buffer element 2 continues to move inward. The buffer element 2 then transmits the residual impact force to the contact element 4 through the second elastic element 5. The second elastic element 4 is then compressed and deformed, achieving secondary buffering. During the compression process, the second elastic element 5 continuously pushes the contact element 4 to translate inward, causing the contact part 401 to gradually approach and adhere to the collision detection element 7.
[0028] In other words, the timing of the actions of the first elastic element 3 and the second elastic element 5 is inconsistent; the deformation buffering of the first elastic element 3 precedes the deformation buffering of the second elastic element 5. Specifically, in the initial stage of the collision, the impact load is small, and only the first elastic element 3 undergoes compression deformation, while the second elastic element is not yet under stress. As the buffer element 2 continues to move, it will compress the second elastic element 5 to a certain extent and drive the contact element 4 to move towards the collision detection element 7. If the collision energy is sufficient to drive the contact element 4 to contact the collision detection element 7, a collision alarm can be triggered. Upon receiving the corresponding collision alarm signal, the machine tool control system can then perform a shutdown or other actions. After the contact element 4 comes into contact with the collision detection element 7, the participating collision energy will continue to compress the second elastic element 5, thereby continuing to absorb collision energy, gradually increasing the pressure on the collision detection element 7, and reducing the risk of damage to the collision detection element 7.
[0029] In a conventional design, taking a capacitive sensor as an example, when the contact part 401 is attached to the collision detection element 7, the equivalent capacitance of the capacitive sensing circuit changes significantly. Upon recognizing this sudden capacitance change, the machine tool control system immediately issues an emergency stop command, cutting off all motion axis movements. When the external collision obstacle is removed and the external load disappears, the first elastic element 3 and the second elastic element 5 synchronously rebound and extend, pushing the buffer element outwards, causing the entire mechanism to automatically return to its initial working position. The contact element 4 also returns to its initial position under the traction of the buffer element 2. The contact part 401 then separates from the collision detection element, and the equipment can be directly restarted for processing.
[0030] This embodiment uses two-stage elastic elements to buffer the instantaneous rigid impact in stages, breaking it down into two gradual energy absorption processes. Most of the impact energy is dissipated by the elastic elements, with only a portion of residual stress being transmitted to the cutting head body. At the same time, the contact part smoothly approaches the collision detection elements such as the capacitive sensing element, and the capacitance value changes gradually rather than abruptly, which greatly reduces the probability of false alarms and missed alarms, and also reduces the risk of damage to the collision detection element 7.
[0031] In some embodiments, the impact location is random under collision conditions. To achieve all-round protection, a full-coverage buffer structure can be set along the circumference of the laser cutting head 6. Specifically, multiple buffer members 2 can be set, and the multiple buffer members 2 are evenly spaced along the circumference of the support frame 1 to cope with collision protection on the circumferential side of the equipment.
[0032] Considering that the multiple buffer components 2 surround the circumferential side of the laser cutting head 6, in order to improve space utilization, the extended lines of the moving directions of all the buffer components 2 can converge at the same center point, so that the arrangement and moving areas are distributed within a disc surface, significantly reducing the space occupation requirements of the entire device. Specifically, the convergence point of the extended lines of the moving directions of all the buffer components 2 can be located at the center of the mounting part 1a, that is, on the central axis of the laser cutting head 6.
[0033] It is worth noting that collisions during laser cutting operations do not only occur in the axial position directly below. Edge warping of the sheet metal and lateral scrap can easily scrape the cutting head nozzle from any angle around the perimeter. Multiple sets of buffer components are evenly arranged in a ring. When a collision occurs at any position within the 360° circumference of the equipment, the corresponding buffer component can absorb the load, eliminating blind spots and enhancing the overall protective comprehensiveness of the device. When a collision occurs on one side, only the corresponding buffer component moves inward to compress the first elastic element, while the remaining buffer components remain in their initial state, without interfering with each other. The buffering action is independent and highly responsive.
[0034] In some embodiments, the number of buffers 2 can be adjusted to 3, 4, 5, 6, 8, etc., depending on the size of the cutting head. As long as they are evenly arranged in the circumference and the moving axes converge at the center, the same full-circumference protection effect can be achieved.
[0035] Small and micro cutting heads can use two sets of symmetrical buffers to simplify the structure and reduce manufacturing costs; large-format, high-power cutting heads can add 10 or more sets of buffers to further improve the uniformity of circumferential protection.
[0036] In some embodiments, in order to balance the collision protection range and the degree of structural simplification, a collision arc arm 201 can be provided on the outside of the buffer member 2 away from the mounting part 1a of the support frame 1. The collision arc arms of the plurality of buffer members 2 are connected to each other in sequence, and together surround the outer perimeter of the support frame 1 to form a roughly complete annular anti-collision surface.
[0037] When the arc-shaped outer contour of the collision arc arm 201 comes into contact with the plate or waste material, the curved surface can disperse the locally concentrated impact force, avoiding deformation of the buffer component caused by single-point stress concentration. The connection gap between adjacent collision arc arms 201 is small, so that the collision load at any position in the circumference can be smoothly transmitted to the corresponding buffer component, and the risk of leakage through gaps is low.
[0038] It is worth noting that the arc-shaped outer contour of the collision arc arm 201 can be set to a circular arc shape.
[0039] In some embodiments, considering that the buffer 2 requires a certain linear travel, in order to maintain the stability of the buffering action, the first elastic element 3 can be set as a first helical spring 301, and the central axis direction of the first helical spring 301 is approximately parallel to the moving direction of the buffer 2, so that the extension and contraction direction of the first helical spring 301 is parallel to the moving direction of the buffer 2, thereby achieving stable deformation buffering.
[0040] It is worth noting that, since the collision arc arm 201 has a certain arc length, two sets of first helical springs 301 are symmetrically arranged on both sides of the central axis of the collision arc arm 201 to ensure balanced force distribution and structural simplicity. In other words, the buffer 2 is supported by the two symmetrical sets of first helical springs 301. During the collision, the springs on both sides are compressed synchronously and uniformly, ensuring that the buffer 2 is balanced in force during translation and preventing unilateral tilting, offset, or jamming. On the other hand, the double-spring structure has a larger elastic deformation stroke and higher energy absorption capacity than the single-spring structure, and can withstand greater impact strength. After the collision is resolved, the springs on both sides rebound synchronously, ensuring that the buffer returns to its straight position without deflection.
[0041] In some embodiments, the first elastic element 3 may also be replaced by two parallel disc springs to meet the requirements of high impact conditions.
[0042] In some embodiments, given that the buffer 2 is the active component and the contact 4 is the passive component, in order to maintain the stability of their coordinated operation, the overall movement of the buffer 2 and the contact 4 is consistent and can form subtle differences in the timing of their actions.
[0043] The buffer member 2 is provided with a push arm 202 on the side near the mounting part 1a, and the contact member 4 is provided with a nested sliding groove 402. The push arm 202 is embedded in the nested sliding groove 402, so that they can slide relative to each other. That is, the buffer member 2 and the contact member 4 adopt a movable nested connection.
[0044] The contact member 4 has an inwardly recessed nested groove 402 inside, and the push arm 202 is slidably fitted inside the nested groove 402. The end of the push arm 202 away from the buffer member 2 is provided with a radially outwardly protruding radial flange 2021. The inner wall of the groove of the nested groove 402 extends inward to form a detachment flange 4021. The detachment flange 4021 is located on the moving path of the radial flange outwardly disengaging from the groove, preventing the radial flange 2021 from disengaging from the nested groove 402. The second elastic member 5 is integrally arranged between the radial flange 2021 and the bottom of the nested groove 402.
[0045] As the buffer 2 moves toward the collision detection element 7, the push arm 202 simultaneously slides deeper into the nested groove 402. The radial flange 2021 presses against the second elastic element 5 inside the nested groove 402, causing the second elastic element 5 to contract under pressure, thereby pushing the contact element 4 toward the collision detection element 7. As the buffer 2 moves away from the collision detection element 7, the radial flange 2021 slides outward with the push arm 202, and the second elastic element 5 rebounds and extends. When the radial flange 2021 abuts against the anti-detachment flange 4021, the relative movement of the buffer 2 and the contact element 4 ends, and they will continue to move synchronously away from the collision detection element 7. The abutment relationship between the radial flange 2021 and the anti-detachment flange 4021 prevents the push arm 202 from completely sliding out of the nested groove 402, avoiding the problem of the buffer 2 and the contact element 4 separating and the mechanism disintegrating.
[0046] It is worth noting that the axial floating connection between the buffer 2 and the contact 4 can meet the secondary buffering requirements between the two and the protection requirements of the collision detection element 7; the anti-detachment flange 4021 and the radial flange 2021 form a limiting and anti-detachment structure, ensuring that the two-stage buffer structure is always assembled as one unit, making disassembly and assembly convenient and reducing the risk of failure due to missing parts.
[0047] In some embodiments, the buffer 2 may include an integrally formed collision arc arm 201 and the push arm 202, which are generally T-shaped.
[0048] To reduce the overall structural size, the buffer element 2 and the contact element 4 can be configured as sheet-like components. Weight-reducing holes can also be formed on the collision arc arm 201 of the buffer element 2.
[0049] In some embodiments, the collision arc arm 201 may adopt an integral metal bending structure.
[0050] Alternatively, the collision arc arm 201 can also be a segmented detachable arc arm, which can be replaced individually when a single segment is damaged, without having to replace the entire set of buffer components, thus reducing maintenance and material costs.
[0051] In some embodiments, given that the second elastic member 5 is disposed between the radial flange 2021 and the bottom of the nested groove 402, and that the second elastic member 5 does not necessarily form an abutment relationship with the radial flange 2021 and the bottom of the nested groove 402, it is necessary to maintain the stability of its deformation posture in order to maintain the shape and functional stability of the second elastic member 5.
[0052] To this end, a first limiting boss 2022 can be provided on the side of the radial flange 2021 facing the bottom of the nested groove 402, and a second limiting boss 4022 can be provided at the center of the bottom of the nested groove 402; and the second elastic element 5 is a second helical spring 501, with the two ends of the second helical spring 501 respectively fitted on the outer sides of the corresponding first limiting boss 2022 and second limiting boss 4022 on both sides, so as to maintain the stability of the radial position of the end of the second helical spring 501, avoid radial displacement and irregular deformation caused therefrom, thereby ensuring the buffering effect.
[0053] In other words, the first limiting boss 2022 and the second limiting boss 4022 radially limit both ends of the second helical spring 501. The spring will not deviate radially, bend laterally, or come out during the entire process of compression and rebound. The spring force output is always along the central axis of the push arm, and the buffer transmission is stable. The two ends of the spring are constrained by the limiting bosses, so no additional fixing glue or buckles are needed during assembly, and disassembly and maintenance are simple.
[0054] In some embodiments, one or both of the first limiting boss 2022 and the second limiting boss 4022 may be provided with an annular boss structure to adapt to the second helical spring 501 with different wire diameters and inner diameters.
[0055] In some embodiments, in order to ensure the stability of the movement trajectory of the buffer 2 and the contact 4, a sliding guide structure can be added to the support frame 1 to constrain and limit the displacement of the buffer 2 and the contact 4 in directions other than those designed.
[0056] Specifically, the support frame 1 may have a guide groove 103 adapted to the buffer 2 and / or the contact 4, and the buffer 2 and / or the contact 4 are slidably embedded in the guide groove 103.
[0057] During operation, the direction of the collision force on the buffer 2 is random, which can easily cause the buffer 2 to move laterally. Under the constraint of the guide groove 103, the buffer 2 and the contact member 4 can only translate in the direction pointing to the collision detection element 7, which restricts other-direction displacement. When there is a collision, the buffer 2 will only compress the first elastic member 3 and the second elastic member 5 in a preset direction, which greatly reduces the risk of skewing, twisting and jamming.
[0058] In some embodiments, to balance structural strength and simplicity, the support frame 1 adopts a disc-type frame structure. Specifically, the support frame 1 may include a support tray 101 and a suspension tray 102. The support tray 1 has a through hole in its center as a mounting part 1a; in other words, the mounting part 1a is a mounting hole 1011 located in the center of the support tray 101. The buffer member 2, the contact member 4, and the second elastic member 5 are assembled on the support tray 1. The suspension tray 102 is fixedly connected to the inner side of the support tray 101, and the first elastic member 3 is uniformly assembled and fixed on the suspension tray 102.
[0059] The support tray 101 serves as the outer bearing base, providing an overall installation interface; the suspension tray 102 is recessed inward and fixed to one side of the support tray 101 by a support member, providing an independent mounting base for the first elastic member 3, so that the first elastic member 3 is located inside the buffer member 2 (on the side closer to the collision detection element 7).
[0060] In some embodiments, the support tray 101 and the suspension tray 102 are arranged substantially parallel to each other, and the first helical spring 301 can be suspended radially in a suspension hole 1021 opened on the suspension tray 102.
[0061] The suspension hole 1021 is an axial through hole that passes through the suspension tray, and third limiting bosses 1022 are provided on both sides of the hole wall for suspending the two ends of the first helical spring 301, thereby achieving fixation.
[0062] It is worth noting that suspending the suspension tray 102 based on the support tray 101 and suspending the first helical spring 301 based on the suspension tray 102 can significantly reduce the overall thickness of the support frame, thereby helping to reduce the risk of interference with the surrounding environment and equipment during use.
[0063] In some embodiments, considering that the laser cutting head 6 is a high-heat-generating element, in order to avoid the support tray 101 affecting heat dissipation, a heat dissipation structure such as a heat dissipation hole 1012 can be provided near the mounting hole 1021. There may be multiple heat dissipation holes 1012, and these multiple heat dissipation holes 1012 are evenly arranged circumferentially around the central mounting hole 1011.
[0064] It is worth noting that during the laser cutting process, the nozzle remains at a high temperature, and the heat is conducted upward to the buffer protection device. The circumferentially distributed heat dissipation holes form a convection channel, which quickly dissipates the heat accumulated in the support tray, reduces the working environment temperature of the first and second elastic components inside, and avoids the spring from experiencing elastic decay and fatigue failure due to long-term high temperature.
[0065] In some embodiments, the first elastic element 3 and the second elastic element 5 may also be elastic components such as disc springs, polyurethane elastic columns, wave-shaped elastic sheets, and rubber buffer rings.
[0066] For cutting thick plates and heavy machine tools, a single spring can be replaced with a parallel structure of multiple springs to increase the energy absorption limit; for delicate thin plates with small impact conditions, a micro spring with fine steel wire can be used to balance lightweight and sensitive triggering.
[0067] In some embodiments, to prevent external environment from interfering with the function of the first helical spring 301, a cover plate 104 may be provided on the side of the suspended paper tray 102 away from the support tray 101 to cover and protect the first helical spring 301.
[0068] In some embodiments, since the support tray 101, the suspension tray 102 and the cover plate 103 are spaced apart along the thickness direction, in order to ensure the arrangement spacing, a support platform 105 can be provided on the side surface of the support tray 101 and the cover plate 103 near the suspension tray 102 to maintain the spacing between the support tray 101 and the suspension tray 102 and between the cover plate 103 and the suspension tray 102, and to be tightened by fasteners such as bolts.
[0069] Another aspect of this application embodiment also provides a laser cutting device, including the laser cutting head collision buffer protection device, a laser cutting head 6, and a capacitive sensor (collision detection element 7); the buffer protection device is assembled and fixed on the laser cutting head 6 through the mounting hole 1011 in the center of the support tray 101; the capacitive sensor is fixedly installed above the buffer protection device; the axial movement direction of the buffer member 2 and the contact member 4 points towards the capacitive sensor.
[0070] During normal cutting, the buffer 2 and the contact 4 are in their initial positions, and the contact 401 maintains a safe insulating gap with the capacitance sensor, resulting in a stable capacitance value. After the workpiece collides with and squeezes the buffer 2, the first elastic element 3 and the second elastic element 5 are compressed in sequence. The contact 4 adheres to the ceramic ring of the capacitance sensor through the contact 401, causing a sudden change in capacitance value, and the machine tool immediately stops. After the obstacle is removed, the two-stage springs rebound, the contact 401 separates from the capacitance sensor, and the equipment returns to normal cutting status.
[0071] The entire buffer device can be directly matched with existing laser cutting heads with capacitance detection without modifying the original sensing and control systems of the machine tool. It has strong versatility for modification, reduces collision impact from the source, and protects the cutting head and the entire machine's transmission system in all aspects.
[0072] The embodiments of this application have at least the following beneficial effects: The laser cutting head collision buffer protection device and laser cutting device provided in this application embodiment, by setting up a first elastic element and a second elastic element with two-stage timing coordination, utilizes a step-by-step deformation logic of first-stage energy absorption and second-stage transmission triggering to dissipate the instantaneous rigid impact step by step, significantly weakening the impact load transmitted to the laser cutting head and the precision transmission structure of the machine tool, effectively avoiding component deformation, accuracy deviation and structural damage. At the same time, by relying on the smooth contact of the contact element to achieve a gradual change in capacitance parameters, it eliminates the drastic signal jump caused by hard impact, significantly reducing the probability of false alarms and missed alarms, and protecting the detection element from impact damage. This application adopts a circumferentially uniformly converging arrangement of multiple sets of buffer elements, with the movement direction of all buffer elements converging at the central axis of the cutting head, so that the collision load at any circumferential angle is transmitted axially inward, without lateral force interference, effectively avoiding the skew, twisting and jamming of the buffer elements, achieving 360° balanced buffer protection without dead angles, and has a compact structure, small space occupation, adaptable to the narrow installation area of the cutting head, and has extremely strong versatility. The collision arc arm structure with ring connection eliminates protective gaps, and the curved surface can disperse concentrated impact stress, further improving the structural impact resistance stability; the single buffer component is equipped with a double-sided symmetrical first helical spring, so that the force is balanced during the buffer translation process and the return is straight, improving the upper limit of energy absorption and structural stability.
[0073] Meanwhile, this application utilizes the nested sliding cooperation of the push arm and the nested slide groove, combined with the radial flange and the anti-disengagement flange to form an axial anti-disengagement limiting structure, ensuring that the buffer component and the contact component are always linked as one, preventing the mechanism from disintegrating and failing, and ensuring the stable and reliable timing action of the two-stage buffer. The upper and lower limiting bosses provide radial positioning constraint for the second helical spring, preventing the spring from bending, shifting, or disengaging, ensuring that the elastic force output is always coaxial and stable, and improving long-term operational consistency. The support frame is equipped with guide grooves to precisely constrain the sliding trajectory of the components, further avoiding offset and jamming failures. The separate layout of the support tray and the suspension tray allows for independent layering and installation of the elastic components, resulting in a compact structure and convenient disassembly and maintenance. Combined with circumferentially arranged heat dissipation holes, it effectively dissipates high temperatures from cutting, preventing high-temperature fatigue failure and elasticity attenuation of the elastic components, and significantly extending the service life of the device.
[0074] This device is a purely mechanical structure, requiring no modification to the original laser cutting head capacitance detection system and control program. It can be directly adapted, resulting in low modification costs and wide compatibility. After the collision load is removed, the two-stage elastic components work together to automatically spring back and reset, eliminating the need for manual correction. This effectively reduces equipment downtime for maintenance and improves the continuous processing stability and overall service life of the laser cutting equipment.
[0075] In this application, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" a first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" a first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0076] In the description of this application, it should be understood that the terms center, longitudinal, transverse, length, width, thickness, upper, lower, front, back, left, right, vertical, horizontal, top, bottom, inner, outer, clockwise, and counterclockwise indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0077] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indication will also change accordingly. In this application, unless otherwise explicitly specified and limited, the terms connection, fixation, etc., should be interpreted broadly. For example, fixation can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction relationship between two components, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances. In addition, the descriptions of "first," "second," etc., in this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of the aforementioned features. In the description of this application, "multiple" means two or more, unless otherwise explicitly and specifically limited.
[0078] In the description of this specification, the references to the terms "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0079] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0080] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A laser cutting head collision buffer protection device, characterized in that, include: The support frame has a mounting part that is compatible with the laser cutting head; A buffer element, movably disposed on the support frame, is used to absorb external collision loads; A first elastic element is disposed on the support frame and is disposed on the movement path of the buffer element to deform and buffer under the pressure of the buffer element. A contact element, connected to the buffer element, and the contact element is configured with a contact portion adapted to the collision detection element; A second elastic element is disposed between the buffer element and the contact element, so as to deform under the pressure of the buffer element and drive the contact portion to approach the collision detection element. The deformation buffering of the first elastic element precedes the deformation buffering of the second elastic element.
2. The laser cutting head collision buffer protection device as described in claim 1, characterized in that, The number of buffer components is multiple, the movement directions of the multiple buffer components intersect at a point, and the multiple buffer components are evenly spaced along the circumference of the support frame.
3. The laser cutting head collision buffer protection device as described in claim 2, characterized in that, The buffer component has a collision arc arm on the side opposite to the mounting part, and multiple collision arc arms are connected in sequence and surround the circumferential outer side of the support frame.
4. The laser cutting head collision buffer protection device as described in claim 3, characterized in that, The first elastic element is a first helical spring, and two sets of the first helical springs are symmetrically arranged on both sides of the central axis of the collision arc arm.
5. The laser cutting head collision buffer protection device as described in claim 1, characterized in that, The buffer member is provided with a push arm on the side near the mounting part, and the contact member is provided with a nested sliding groove, and the push arm is embedded in the nested sliding groove; The end of the push arm is provided with a radial flange, and the inner wall of the groove of the nested slide is provided with an anti-detachment flange. The anti-detachment flange is blocked on the side where the radial flange is detached from the nested slide, and the second elastic member is located between the radial flange and the bottom of the nested slide.
6. The laser cutting head collision buffer protection device as described in claim 5, characterized in that, Both the radial flange and the bottom of the nested groove are provided with limiting bosses. The second elastic element is a second helical spring, and the two ends of the second helical spring are respectively sleeved on the limiting bosses on the corresponding sides.
7. The laser cutting head collision buffer protection device as described in claim 1, characterized in that, The support frame is provided with a guide groove, and the contact member or the buffer member is slidably embedded in the guide groove.
8. The laser cutting head collision buffer protection device as described in any one of claims 1-7, characterized in that, The supporting framework includes: The support tray has a mounting portion consisting of a mounting hole in the middle of the support plate, and the buffer and the contact are mounted on the support tray. A suspension tray is disposed on the support tray, and the first elastic element is disposed on the suspension tray.
9. The laser cutting head collision buffer protection device as described in claim 8, characterized in that, The support tray has heat dissipation holes, and the heat dissipation holes surround the circumferential side of the mounting hole.
10. A laser cutting device, characterized in that, include: The laser cutting head collision buffer protection device as described in any one of claims 1-9; A laser cutting head is mounted on the mounting portion; A capacitive sensor is connected to the laser cutting head, and the movement direction of the buffer and the contact is directed towards the capacitive sensor.
