A laser cutting device for computer chassis panels

Abstract

The application provides a laser cutting device for computer case plates and belongs to the technical field of laser cutting equipment. The device comprises a rack, two sides of the rack are provided with moving seats, the inner side of the rack is provided with a supporting assembly, the supporting assembly is used for supporting plates, the moving seats are connected with a material collecting assembly and a flattening assembly, the material collecting assembly is used for collecting waste materials, and the flattening assembly is used for flattening plates. The device has the beneficial effects that: the pressing roller moves with the moving seat and adapts to plates with different thicknesses and local undulations by cooperating with the extension spring, the cutting area is rolled and flattened, the plate supporting and cutting stability are improved; the corresponding supporting rods are locally retracted by cooperating the pressing plate with the convex plate, the remaining supporting rods continuously support while avoiding the laser and high-temperature slag, the ablation of the supporting rods and the adhesion of the slag are reduced; the collecting frame dynamically receives small-size waste materials, the scraper synchronously cleans the slag and debris on the bearing plate, so that the cleaning and maintenance difficulty is reduced and the operation reliability of the device is improved.

Description

Technical Field

[0001] This invention relates to the field of laser cutting equipment technology, and more specifically, to a laser cutting device for computer chassis panels. Background Technology

[0002] Laser cutting equipment typically uses a high-power-density laser beam focused by an optical path system to irradiate the surface of a sheet metal, causing the sheet metal to melt or vaporize in the laser-acting area. With the help of auxiliary gas, the molten material is expelled, thereby forming a predetermined cut on the sheet metal. Computer chassis panels are generally made of relatively thin metal sheets, and their surfaces need to be processed with structures such as heat dissipation holes, mounting holes, interface holes, and outer contours. Therefore, laser cutting equipment is widely used in the forming and processing of computer chassis panels.

[0003] However, computer chassis panels are prone to localized warping, bulging, or wavy deformation during transportation, stacking, or loading. Existing laser cutting worktables typically use fixed serrated plates or support bars to support the panels, which cannot dynamically flatten the panels near the cutting area during the cutting process. When there are localized bulges on the panel surface, the distance between the laser cutting head and the panel can easily change, affecting not only the laser focus position and cut quality but also potentially increasing the risk of interference between the panel and the laser cutting head. Furthermore, since the fixed support structure is always below the panel, when the laser cutting trajectory passes through the support position, high-temperature molten slag can easily fall directly onto the support structure surface and solidify. As the slag gradually accumulates, the actual support height of the support structure can easily change, causing subsequent panel placement issues such as unevenness, localized lifting, or bottom surface scratches, and increasing the difficulty of cleaning and maintaining the support structure. How to invent a laser cutting device for computer chassis panels to solve these problems has become an urgent issue for those skilled in the art. Summary of the Invention

[0004] To overcome the above shortcomings, the present invention provides a laser cutting device for computer chassis panels, which aims to solve the problems that existing laser cutting devices are difficult to flatten plates with local warping or protrusions, that fixed support components are easily affected by laser and molten slag, and that the small-sized waste generated during cutting is not easy to collect.

[0005] This invention is implemented as follows:

[0006] This invention provides a laser cutting device for computer chassis panels, including a frame, movable seats on both sides of the frame, and a support component on the inner side of the frame. The support component is used to support the sheet metal. The movable seats are connected to a material collection component and a flattening component. The material collection component is used to collect waste material, and the flattening component is used to flatten the sheet metal.

[0007] Preferably, longitudinal guide rails are fixedly connected to both sides of the frame, the longitudinal guide rails are slidably connected with a moving base, the upper end of the moving base is fixedly connected with a transverse guide rail, the transverse guide rail is slidably connected with a driving base, one end of the driving base is provided with a vertical guide rail, and the vertical guide rail is slidably connected with a laser cutting head.

[0008] Preferably, the flattening assembly comprises two fixing frames, the two fixing frames are respectively and fixedly connected with the side walls of the corresponding moving bases, and the inner wall of each fixing frame is fixedly connected with a sliding rod.

[0009] Preferably, the outer wall of the sliding rod is slidably connected with a sliding plate, the side wall of the sliding plate is fixedly connected with a telescopic spring, one end of the telescopic spring away from the sliding plate is fixedly connected with the inner wall of the fixing frame, the side wall of the sliding plate is rotatably connected with a rotating shaft, and the outer wall of the rotating shaft is sleeved with a pressing roller.

[0010] Preferably, the supporting assembly comprises a plurality of bearing plates, the plurality of bearing plates are detachably connected with the frame, a plurality of placement slot holes are formed in the side wall of each bearing plate, and a buffer sleeve is fixedly installed on the inner wall of each placement slot hole.

[0011] Preferably, a support rod is arranged inside the buffer sleeve, the support rod is arranged in a T shape, the support rod is slidably connected with the placement slot hole, one end of the support rod is provided with a guide surface, and one end of the support rod away from the buffer sleeve is fixedly connected with a protective pad.

[0012] Preferably, a pull rod is slidably connected to the placement slot hole, one end of the pull rod is fixedly connected with the end of the support rod away from the protective pad, the outer wall of the pull rod is sleeved with a return spring, and two ends of the return spring are respectively and fixedly connected with the inner wall of the placement slot hole and the side wall of the support rod.

[0013] Preferably, one end of the pull rod located outside the bearing plate is fixedly connected with a transverse plate, both ends of the transverse plate are fixedly connected with protruding plates, and one end of each protruding plate is arranged in an arc shape.

[0014] Preferably, the material collecting assembly comprises a follow-up plate, the follow-up plate is arranged in a U shape, two ends of the follow-up plate are respectively and fixedly connected with the moving bases, the side wall of the follow-up plate is fixedly connected with a plurality of support plates distributed in an array, one end of each support plate is provided with a pressing plate, and the arc surface of the pressing plate is in sliding connection with the protruding plate.

[0015] Preferably, the material collecting assembly further comprises a collecting frame, one end of the collecting frame is fixedly connected with the pressing plate, two ends of the collecting frame are fixedly connected with scraping plates, and two ends of each scraping plate are provided with avoiding inclined surfaces.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. This invention, by setting a flattening component on a movable seat and utilizing the sliding cooperation between the slide plate and the slide rod, as well as the elastic effect of the telescopic spring, enables the pressure roller to adapt to the thickness and surface undulation of the sheet material and continuously adhere to the sheet material surface. The pressure roller moves synchronously with the movable seat, rolling and pressing the sheet material near the laser cutting area. Multiple support rods provide dispersed support from below the sheet material, thereby reducing the changes in cutting spacing caused by local warping or protrusion of the sheet material and reducing the possibility of sheet material damage, dragging, or pressure roller jamming caused by rigid pressing. This is beneficial to improving the stability of the cutting position and cutting quality.

[0018] 2. This invention uses the sliding and pressing cooperation between the pressure plate and the convex plate to convert the longitudinal movement of the moving seat into the retraction movement of the pull rod and the support rod, so that the support rod located near the current cutting area actively retracts into the placement slot, thereby forming a local clearance space under the plate and reducing the direct action of the laser beam or high-temperature molten slag on the support rod and the protective pad.

[0019] 3. This invention, by setting a collection frame that moves synchronously with the moving seat, allows the collection frame to be located below the laser cutting area and to collect small-sized plates or cutting waste separated from the main body of the plate, reducing the possibility of waste scattering into the machine frame or getting stuck between adjacent support plates. The scrapers set at both ends of the collection frame can scrape off loose slag and cutting debris attached to the sides of the support plates during the movement, reducing the impact of slag accumulation on the extension and retraction of the support rod and the support height of the plate. This achieves coordinated operation of plate flattening, local support avoidance, waste collection, and cleaning of the support area. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the frame structure of a laser cutting device for computer chassis panels provided in an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the support component structure of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the material collection assembly structure of a laser cutting device for computer chassis panels provided in an embodiment of the present invention;

[0024] Figure 4This is a schematic diagram of the lower end structure of the support plate of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the flattening assembly structure of a laser cutting device for computer chassis panels provided in an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the collection frame structure of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the pressure plate structure of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the half-section structure of the support plate of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention;

[0029] Figure 9 This is a schematic diagram of the moving state of the pressure plate and the convex plate of a laser cutting device for a computer chassis panel provided in an embodiment of the present invention.

[0030] In the diagram: 1. Frame; 2. Longitudinal guide rail; 3. Moving seat; 4. Collecting assembly; 41. Follower plate; 42. Collection frame; 43. Scraper; 431. Avoidance ramp; 44. Pressure plate; 45. Support plate; 5. Flattening assembly; 51. Fixed frame; 52. Pressure roller; 53. Rotating shaft; 54. Slide plate; 55. Slide rod; 56. Telescopic spring; 6. Laser cutting head; 7. Vertical guide rail; 8. Drive seat; 9. Transverse guide rail; 10. Support assembly; 101. Bearing plate; 102. Support rod; 1021. Guide surface; 103. Horizontal plate; 104. Protective pad; 105. Pull rod; 106. Protruding plate; 107. Buffer sleeve; 108. Return spring; 109. Placement slot. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example 1

[0033] Reference Figures 1-9A laser cutting device for computer chassis panels includes a frame 1, movable seats 3 on both sides of the frame 1, and a support component 10 on the inner side of the frame 1. The support component 10 is used to support the sheet metal. The movable seats 3 are connected to a material collection component 4 and a flattening component 5. The material collection component 4 is used to collect waste material, and the flattening component 5 is used to flatten the sheet metal.

[0034] Furthermore, longitudinal guide rails 2 are fixedly connected to both sides of the frame 1. The longitudinal guide rails 2 are slidably connected to the movable seat 3. A transverse guide rail 9 is fixedly connected to the upper end of the movable seat 3. A drive seat 8 is slidably connected to the transverse guide rail 9. A vertical guide rail 7 is provided at one end of the drive seat 8. A laser cutting head 6 is slidably connected to the vertical guide rail 7. The flattening assembly 5 includes a fixed frame 51. There are two fixed frames 51. The two fixed frames 51 are fixedly connected to the side wall of the corresponding movable seat 3. A slide rod 55 is fixedly connected to the inner wall of the fixed frame 51. A slide plate 54 is slidably connected to the outer wall of the slide rod 55. A telescopic spring 56 is fixedly connected to the side wall of the slide plate 54. The end of the telescopic spring 56 away from the slide plate 54 is fixedly connected to the inner wall of the fixed frame 51. A rotating shaft 53 is rotatably connected to the side wall of the slide plate 54. A pressure roller 52 is sleeved on the outer wall of the rotating shaft 53.

[0035] It should be noted that the plate is supported by the support rod 102 on the support plate 101, and the sliding of the slide plate 54 and the slide rod 55, as well as the elasticity of the telescopic spring 56, allows the pressure roller 52 to adjust for plates of different thicknesses. The pressure roller 52 also flattens the plate in the cutting area. Furthermore, when the laser cutting head 6 performs longitudinal cutting, the pressure roller 52 moves synchronously with the moving seat 3, and the protective pad 104 prevents the plate from moving, ensuring cutting quality. In use, the computer chassis panel to be cut is placed on multiple... Above the support rod 102, multiple support rods 102 form a distributed support from below the plate; the protective pad 104 at the top of the support rod 102 contacts the lower surface of the plate. The protective pad 104 can increase the contact friction between the support rod 102 and the plate and reduce the possibility of scratches on the plate surface caused by rigid contact, thereby limiting the plate from unexpected lateral movement during the rolling pressing of the pressure roller 52 and laser cutting; multiple support rods 102 jointly bear the load applied by the plate and the pressure roller 52, so that the plate has a stable support base below the corresponding area of ​​the pressure roller 52.

[0036] The pressure roller 52 is rotatably mounted on the slide plate 54 via the rotating shaft 53, allowing the pressure roller 52 to roll relative to the surface of the board while in contact with it. The slide plate 54 is slidably mounted on the slide rod 55 and connected to the fixed frame 51 via the telescopic spring 56. When the board enters between the pressure roller 52 and the support rod 102, the board exerts a reverse force on the pressure roller 52, causing the slide plate 54 to adaptively displace away from the board along the slide rod 55, and causing the telescopic spring 56 to elastically deform. Thus, when the board thickness is large, the pressure roller 52 can increase the avoidance distance through the movement of the slide plate 54; when the board thickness is small, the telescopic spring 56 can push the slide plate 54 and the pressure roller 52 back towards the board, thereby allowing the pressure roller 52 to continuously contact the board surface within a certain thickness range, without needing to adjust for uneven thickness. The fixed installation height of the pressure roller 52 is repeatedly adjusted for plates of the same thickness. The elastic holding force is provided to the pressure roller 52 by the aforementioned telescopic spring 56. The pressure roller 52 applies pressure from above the plate, and multiple support rods 102 support the plate from below, so that the local protruding areas of the plate approach the supporting plane formed by the support rods 102 under the action of the upper and lower sides. The pressure roller 52 adopts a rolling contact method, which can reduce the sliding friction between the pressure roller and the plate surface while flattening the plate, and avoid the pressure roller 52 dragging the plate when it moves with the moving seat 3. The telescopic spring 56 can also absorb the impact caused by plate thickness error, surface undulation and local protrusion, and prevent the pressure roller 52 from hitting the plate in a rigid manner, thereby reducing the possibility of the plate being indented or the pressure roller 52 getting stuck while maintaining the holding effect.

[0037] When the laser cutting head 6 performs longitudinal cutting along the extension direction of the longitudinal guide rail 2, the two moving seats 3 move synchronously along the longitudinal guide rails 2 on both sides of the frame 1. Since the fixed frame 51 is fixedly connected to the corresponding moving seat 3, the fixed frame 51 can sequentially drive the slide bar 55, slide plate 54, rotating shaft 53 and pressure roller 52 to move longitudinally synchronously with the moving seat 3, so that the pressure roller 52 continuously rolls and presses the plate material near the area passed by the laser cutting head 6. The pressure roller 52 forms a relatively stable local flattening area near the laser cutting area, which can reduce the change in cutting distance caused by local warping of the plate material and reduce the bulging of the plate material. The possibility of interference between the part and the laser cutting head 6 is reduced, thereby improving the stability of the kerf position and cutting quality. The movement between the longitudinal guide rail 2 and the moving seat 3, between the transverse guide rail 9 and the drive seat 8, and between the vertical guide rail 7 and the laser cutting head 6 can be achieved by using servo motors with lead screw transmission mechanisms, gear and rack transmission mechanisms, or synchronous belt transmission mechanisms commonly used in existing laser cutting equipment. Each drive mechanism controls the corresponding component to move along the corresponding guide rail according to the preset cutting program. The specific drive form, installation method, and control method are all existing technologies in this field and will not be described in detail here.

[0038] Reference Figures 2-4Furthermore, the support assembly 10 includes a support plate 101, and there are several support plates 101. The several support plates 101 are detachably connected to the frame 1. The side wall of the support plate 101 has several placement slots 109. The inner wall of each placement slot 109 is fixedly installed with a buffer sleeve 107. The inner side of the buffer sleeve 107 is provided with a support rod 102. The support rod 102 is arranged in a "T" shape. The support rod 102 is slidably connected to the placement slot 109. One end of the support rod 102 has a guide surface 1021. The end of the support rod 102 away from the buffer sleeve 107 is fixedly connected with a protective pad 104.

[0039] It should be noted that: the multiple support rods 102 can support the board material, and the overall weight of the board material will not cause the support rods 102 to move, nor will it cause any impact during the movement of the pressure roller 52. The buffer sleeve 107 is made of rubber, which can absorb energy and prevent vibration during the subsequent reset of the support rods 102. The protective pad 104 increases the friction of the board material. The multiple support rods 102 are distributed at intervals along the bearing plate 101, and the protective pads 104 on the top of each support rod 102 together form a support plane for supporting the board material. This allows the weight of the board material itself and the local holding force applied by the pressure roller 52 to be distributed and transmitted to multiple support rods 102, preventing the load of the board material from being concentrated on a single support position. The support rods 102 are T-shaped. The support rod 102 is slidably installed in the placement slot 109. The return spring 108 on the outside of the pull rod 105 applies an elastic return force toward the plate direction to the support rod 102. In the above description, the preload and elastic stiffness of the return spring 108 are selected according to the weight of the plate, the number of support rods 102 and the pressing force of the pressure roller 52, so that the plate load borne by each support rod 102 is insufficient to overcome the elastic force of the return spring 108 and the sliding resistance between the support rod 102 and the placement slot 109. Therefore, during the normal placement of the plate and the rolling pressing of the plate by the pressure roller 52, the support rod 102 can remain in the extended support position and will not retract on its own due to the weight of the plate itself or the normal pressing action of the pressure roller 52.

[0040] The controlled retraction of the support rod 102 is mainly achieved by the extrusion fit between the pressure plate 44 and the convex plate 106. The support rod 102 can switch between normal load-bearing state and active avoidance state without disorderly movement due to plate load. The buffer sleeve 107 is made of wear-resistant rubber or other heat-resistant elastic material and is set between the placement slot 109 and the support rod 102. On the one hand, the buffer sleeve 107 can guide the axial sliding of the support rod 102, reduce the rigid friction and fit clearance between the support rod 102 and the bearing plate 101, and reduce the possibility of radial sway of the support rod 102 under the action of plate cutting vibration. On the other hand, when the return spring 108 pushes the support rod 102 back to the supporting position, the buffer sleeve 107 can use its own elastic deformation to resist the return impact of the support rod 102. The protective pad 104 acts as a buffer to reduce the impact, noise, and vibration generated when the support rod 102 resets, and to prevent the reset impact from being directly transmitted to the plate through the protective pad 104, thus affecting the stability of the plate's position. In addition, the protective pad 104 is set between the support rod 102 and the lower surface of the plate, which can increase the friction between the two and limit the lateral movement of the plate during the rolling of the pressure roller 52 and the laser cutting process. The protective pad 104 can also increase the actual contact area between the support rod 102 and the plate, so that the support load is applied more evenly to the lower surface of the plate, reducing the possibility of the top of the support rod 102 scratching the plate or forming local indentations on the thin plate surface. The protective pad 104 is preferably made of heat-resistant rubber, high-temperature resistant silicone, or other friction materials with heat resistance and elasticity to adapt to the temperature environment near the laser cutting area.

[0041] With the above configuration, multiple support rods 102 can provide stable and distributed support for the plate under normal conditions. The pressure roller 52 can roll and flatten the locally protruding plate based on the support formed by the support rods 102. When the laser cutting head 6 and the corresponding material collection assembly 4 move to a specific position, only the corresponding support rod 102 driven by the pressure plate 44 retracts, while the other support rods 102 remain extended and continue to support the plate. This achieves local avoidance while preventing the plate from sinking, vibrating, or shifting due to a large area of ​​loss of support. Furthermore, the outer wall of the support rod 102 slides against the inner wall of the buffer sleeve 107, ensuring the normal movement of both.

[0042] Example 2

[0043] Reference Figures 6-9Further, a pull rod 105 is slidably connected in the placement slot hole 109, one end of the pull rod 105 is fixedly connected to the end of the support rod 102 away from the protective pad 104, the outer wall of the pull rod 105 is sleeved with a return spring 108, and two ends of the return spring 108 are fixedly connected to the inner wall of the placement slot hole 109 and the side wall of the support rod 102 respectively; the end of the pull rod 105 located outside the bearing plate 101 is fixedly connected with a transverse plate 103, two ends of the transverse plate 103 are both fixedly connected with convex plates 106, and one end of each convex plate 106 is arranged in an arc shape; the aggregate assembly 4 includes a follower plate 41, the follower plate 41 is arranged in a "U" shape, two ends of the follower plate 41 are respectively and fixedly connected to the moving base 3, the side wall of the follower plate 41 is fixedly connected with a plurality of support plates 45 distributed in an array, one end of each support plate 45 is provided with a pressing plate 44, and the arc surface of the pressing plate 44 is slidably connected with the convex plate 106.

[0044] It should be noted that: during the longitudinal movement and cutting process of the laser cutting head 6, through the action of the moving base 3 and the follower plate 41, a plurality of support plates 45 will be driven to move synchronously, so that the pressing plate 44 moves, and through the mutual sliding between the pressing plate 44 and the convex plate 106, the pull rod 105 can be driven to move downward, further driving the corresponding support rod 102 to retract into the placement slot hole 109 and compress the return spring 108. At this time, not only the support for the plate material is not lost, but also the slag generated during cutting at the corresponding position is prevented from adhering to the support rod 102. The mutual sliding between the pressing plate 44 and the convex plate 106 proceeds smoothly, thereby ensuring the slow expansion and contraction of the support rod 102 and avoiding affecting the plate material during the cutting process; when the laser cutting head 6 performs longitudinal cutting along the extending direction of the longitudinal guide rail 2, the moving bases 3 located on both sides of the frame 1 move synchronously. Since the two ends of the follower plate 41 are respectively and fixedly connected to the corresponding moving bases 3, the moving bases 3 can drive the follower plate 41 to move synchronously in the longitudinal direction, and the follower plate 41 further drives the plurality of support plates 45 and the pressing plates 44 arranged at the ends of the support plates 45 to move, so that the pressing plates 44 sequentially pass through the convex plates 106 below different bearing plates 101.

[0045] When the pressure plate 44 moves to the corresponding protruding plate 106, the arc surface of the pressure plate 44 first contacts the arc-shaped end of the protruding plate 106. As the pressure plate 44 continues to move, the relative sliding between the pressure plate 44 and the protruding plate 106 gradually converts the longitudinal movement of the pressure plate 44 into the downward displacement of the protruding plate 106. This causes the protruding plate 106 to drive the horizontal plate 103 and the pull rod 105 to move downward. The pull rod 105 further drives the support rod 102 connected to it to retract into the placement slot 109, and compresses the return spring 108. Because the pressure plate 44 and the protruding plate 106 use arc-shaped contact, their contact position and depth of action can gradually change with the movement of the pressure plate 44, thereby avoiding instantaneous movement of the support rod 102. The retraction of the support rod 102 reduces the impact and vibration on the plate when it moves. After the support rod 102 retracts into the placement slot 109, a local clearance space is formed between its top and the lower surface of the plate. This allows the support rod 102, which is located near the cutting position of the laser cutting head 6, to temporarily leave the main area of ​​action of the laser beam and high-temperature molten slag. This reduces the possibility of the laser beam directly acting on the support rod 102 and causing it to be ablated. At the same time, it prevents the molten metal generated during cutting from directly adhering to and solidifying on the surface of the support rod 102 and the protective pad 104. This reduces the problems of changes in support height, scratches on the lower surface of the plate, or obstruction of subsequent extension and retraction of the support rod 102 due to the continuous accumulation of molten slag.

[0046] During the retraction of the corresponding support rod 102, only the support rod 102 located near the current cutting area and driven by the pressure plate 44 moves. The other support rods 102 that do not form a transmission cooperation with the pressure plate 44 remain extended and continue to provide distributed support to the plate from below. Therefore, the retraction of some support rods 102 does not cause the plate to lose its overall support. The load on the plate can be transferred to the adjacent support rods 102, thereby providing clearance for the laser cutting position and reducing the possibility of the plate sinking, swaying, or shifting in position. As the pressure plate 44 continues to move and gradually passes the protrusion 106, the downward pressure exerted by the pressure plate 44 on the protrusion 106 gradually decreases. The return spring 108, which is in a compressed state, releases its elastic potential energy and pushes... The support rod 102, pull rod 105, horizontal plate 103, and convex plate 106 gradually reset, allowing the support rod 102 to extend again and resume supporting the plate. Through the cooperation between the arc surfaces on both sides of the pressure plate 44 and the arc-shaped ends of the convex plate 106, the retraction and extension of the support rod 102 can be completed gradually as the pressure plate 44 approaches and moves away, avoiding the support rod 102 from rapidly resetting and impacting the plate, thus ensuring the stability of the plate support during the laser cutting process. Furthermore, when the laser cutting head 6 moves laterally between adjacent support rods 102, the cutting path is staggered from the support rods 102, and there is no interference. When the laser cutting head 6 moves laterally above the support rod 102, the corresponding support rod 102 has already retracted to the avoidance position under the action of the pressure plate 44, so it will not affect the lateral cutting.

[0047] Furthermore, the material collection assembly 4 also includes a collection frame 42, one end of which is fixedly connected to the pressure plate 44, and scrapers 43 are fixedly connected to both ends of the collection frame 42. The scrapers 43 have avoidance slopes 431 at both ends.

[0048] It should be noted that: the collection frame 42 is located below the laser cutting head 6, and the collection frame 42 is set along the extension direction of the transverse guide rail 9. The upper opening of the collection frame 42 covers the transverse cutting stroke of the laser cutting head 6. During the cutting process of the laser cutting head 6, small pieces of plate that are cut off will be caught by the collection frame 42 to avoid subsequent cleaning. The scraper 43 and the side wall of the collection frame 42 will scrape and clean the side wall of the support plate 101 as the moving seat 3 moves, reducing the adhesion of slag. By avoiding the setting of the inclined surface 431 and the guide surface 1021, the collision between the scraper 43 and the support rod 102 can be avoided. The squeezing area of ​​the pressure plate 44 covers the cutting position corresponding to the laser cutting head 6 in the longitudinal direction. Before the laser cutting head 6 reaches the corresponding support rod 102, the pressure plate 44 has already pushed the support rod 102 to retract, and its upper end is lower than the lower surface of the plate to form a safety gap. After the laser cutting head 6 passes the support rod 102, the pressure plate 44 gradually releases the squeezing of the protruding plate 106.

[0049] The collection frame 42 is positioned below the laser cutting head 6 and is connected to the moving base 3 via the pressure plate 44, support plate 45, and follower plate 41. This allows the collection frame 42 to move synchronously with the moving base 3 along the longitudinal guide rail 2. During movement, the collection frame 42 remains below the corresponding cutting area of ​​the laser cutting head 6. When the laser cutting head 6 cuts through holes, corners, or other small contours on the sheet metal, small pieces of sheet metal or cutting waste separated from the main body of the sheet metal can fall into the collection frame 42 under its own gravity. This reduces the likelihood of small pieces of waste falling directly into the frame 1 or getting stuck between adjacent support plates 101, facilitating the centralized removal and cleaning of waste after cutting. The collection frame 42... The receiving range corresponds to the predetermined cutting range of the laser cutting head 6, and a gap is maintained between the collection frame 42 and the lower surface of the plate to allow the support rod 102 to extend and retract and for the cutting slag to fall. For cutting waste smaller than the opening of the collection frame 42 and which can be completely separated from the main body of the plate, the collection frame 42 can receive it. For larger cutting parts or those still partially connected to the plate, they can be removed separately after cutting. Therefore, the collection frame 42 is mainly used to reduce the scattering of small cutting waste inside the frame 1, rather than collecting all cutting parts indiscriminately. The collection frame 42 is made of heat-resistant metal material and has a ceramic heat insulation layer on the inner wall to prevent it from being ablated by the laser. The collection frame 42 can be disassembled and cleaned.

[0050] Scraper 43 is disposed at both ends of the collection frame 42 and can move synchronously with the collection frame 42. When the collection frame 42 passes the support plate 101, the working edge of the scraper 43 approaches the side wall of the support plate 101, so that the loose slag and cutting debris attached to the side wall of the support plate 101 or located at the edge of the gap between adjacent support plates 101 are scraped off from the surface of the support plate 101 by the scraper 43 and fall into the collection frame 42 or the slag collection area under the frame 1. Through the reciprocating movement of the collection frame 42, the support plate 101 near the laser cutting area can be continuously cleaned, reducing the possibility that the long-term accumulation of slag will affect the extension and retraction of the support rod 102, change the support height of the plate, or scratch the lower surface of the plate. The scraper 43 is provided with avoidance slopes at both ends. The surface 431 is used to form a progressive guiding engagement with the guide surface 1021 at the end of the support rod 102. When the scraper 43 moves to the vicinity of the support rod 102, which has not yet fully retracted or is in the process of resetting, the clearance slope 431 first contacts the guide surface 1021. As the scraper 43 continues to move, the scraper 43 and the support rod 102 are gradually offset along the inclined surface to avoid direct collision between their right-angled edges. Thus, even if the support rod 102 does not fully enter the predetermined position due to manufacturing errors, slag obstruction, or delay in the action of the reset spring 108, the clearance slope 431 and the guide surface 1021 can still provide a certain amount of movement clearance space, reducing the possibility of the scraper 43 getting stuck, the support rod 102 bending, or the collection frame 42 being obstructed.

[0051] In addition, the scraping action of the scraper 43 on the side wall of the support plate 101 is mainly used to remove loose attached materials. A small gap can be maintained between the scraper 43 and the support plate 101 or an elastic contact method can be adopted to avoid the large movement resistance caused by long-term rigid friction between the scraper 43 and the support plate 101. The scraper 43 can be formed by heat-resistant metal sheet, elastic wear-resistant sheet or metal plate and elastic connector combination, so that it can give way appropriately when encountering local hard molten slag, thereby maintaining the cleaning effect while reducing the impact on the normal movement of the moving seat 3 and the stability of laser cutting. With the above settings, the collection frame 42 can move with the laser cutting head 6 and receive small-sized waste materials falling from the cutting area. The scraper 43 can simultaneously clean the molten slag and debris attached to the side of the support plate 101. The cooperation between the avoidance slope 431 and the guide surface 1021 can prevent the scraper 43 from rigidly colliding with the support rod 102, thereby realizing the synergistic effect of waste material collection, carrying area cleaning and movement avoidance.

[0052] It should be noted that the specific model and specifications of the electrical components need to be selected and determined based on the actual specifications of the device. The specific selection and calculation methods adopt existing technologies in this field, so they will not be described in detail here.

[0053] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A laser cutting device for computer chassis panels, comprising a frame (1), wherein movable seats (3) are provided on both sides of the frame (1), characterized in that, The inner side of the frame (1) is provided with a support component (10), which is used to support the plate. The movable seat (3) is connected to a material collection component (4) and a flattening component (5). The material collection component (4) is used to collect waste materials, and the flattening component (5) is used to flatten the plate.

2. The laser cutting device for computer chassis panels according to claim 1, characterized in that, The frame (1) is fixedly connected to longitudinal guide rails (2) on both sides. The longitudinal guide rails (2) are slidably connected to the moving seat (3). The upper end of the moving seat (3) is fixedly connected to a transverse guide rail (9). The transverse guide rail (9) is slidably connected to a drive seat (8). One end of the drive seat (8) is provided with a vertical guide rail (7). The vertical guide rail (7) is slidably connected to a laser cutting head (6).

3. The laser cutting device for computer chassis panels according to claim 1, characterized in that, The flattening component (5) includes a fixed frame (51), and there are two fixed frames (51). The two fixed frames (51) are respectively fixedly connected to the side wall of the corresponding movable seat (3). A slide rod (55) is fixedly connected to the inner wall of the fixed frame (51).

4. The laser cutting device for computer chassis panels according to claim 3, characterized in that, The outer wall of the slide rod (55) is slidably connected to a slide plate (54), and the side wall of the slide plate (54) is fixedly connected to a telescopic spring (56). The end of the telescopic spring (56) away from the slide plate (54) is fixedly connected to the inner wall of the fixed frame (51). The side wall of the slide plate (54) is rotatably connected to a rotating shaft (53), and the outer wall of the rotating shaft (53) is fitted with a pressure roller (52).

5. The laser cutting device for computer chassis panels according to claim 1, characterized in that, The support assembly (10) includes a support plate (101), and there are several support plates (101). Several support plates (101) are detachably connected to the frame (1). Several placement slots (109) are opened on the side wall of the support plate (101), and a buffer sleeve (107) is fixedly installed on the inner wall of each placement slot (109).

6. The laser cutting device for computer chassis panels according to claim 5, characterized in that, The inner side of the buffer sleeve (107) is provided with a support rod (102), the support rod (102) is T-shaped, the support rod (102) is slidably connected to the placement slot (109), one end of the support rod (102) is provided with a guide surface (1021), and the end of the support rod (102) away from the buffer sleeve (107) is fixedly connected with a protective pad (104).

7. The laser cutting device for computer chassis panels according to claim 6, characterized in that, The placement slot (109) is slidably connected to a pull rod (105). One end of the pull rod (105) is fixedly connected to the end of the support rod (102) away from the protective pad (104). A return spring (108) is sleeved on the outer wall of the pull rod (105). The two ends of the return spring (108) are fixedly connected to the inner wall of the placement slot (109) and the side wall of the support rod (102), respectively.

8. The laser cutting device for computer chassis panels according to claim 7, characterized in that, The tie rod (105) is fixedly connected to a horizontal plate (103) at one end outside the bearing plate (101). Both ends of the horizontal plate (103) are fixedly connected to a convex plate (106), and one end of the convex plate (106) is arc-shaped.

9. The laser cutting device for computer chassis panels according to claim 8, characterized in that, The aggregate assembly (4) comprises a follow-up plate (41), which is arranged in a "C" shape, two ends of the follow-up plate (41) are respectively fixedly connected with the moving base (3), the side wall of the follow-up plate (41) is fixedly connected with a plurality of support plates (45) distributed in an array, one end of the support plate (45) is provided with a pressing plate (44), and the arc surface of the pressing plate (44) is in sliding connection with the convex plate (106).

10. The laser cutting device for computer chassis panels according to claim 9, characterized in that, The aggregate assembly (4) further comprises a collection frame (42), one end of the collection frame (42) is fixedly connected with the pressing plate (44), two ends of the collection frame (42) are fixedly connected with scraping plates (43), and two ends of the scraping plate (43) are provided with avoidance inclined surfaces (431).

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