Laser drilling processing system, control method and device, and laser drilling equipment

Abstract

The application relates to a laser drilling processing system, a control method and device and a laser drilling equipment, which comprises a controller, a laser, a light splitting assembly, a first light beam adjusting processing module and a second light beam adjusting processing module; the laser is used for emitting a laser beam; the light splitting assembly is used for dividing the laser beam into a first light beam and a second light beam, and distributing corresponding energy ratios of the first light beam and the second light beam according to a control instruction; the first light beam adjusting processing module and the second light beam adjusting processing module respectively perform laser drilling processing on a processed object through the first light beam and the second light beam, and at least one light beam adjusting processing module adjusts the spot size and transmission optical path of the light beam according to the control instruction. The laser drilling processing system provided by the application can adjust the energy ratio, spot size and transmission optical path of the double laser beams during the laser drilling processing, can adapt to complex processing scenes, can realize different types of hole processing at the same time, and can effectively improve the drilling efficiency.

Description

Technical Field

[0001] This application relates to the field of laser drilling technology, and in particular to a laser drilling system, control method, device and laser drilling equipment. Background Technology

[0002] In laser drilling applications, it is often necessary to process holes of different sizes. Existing laser drilling systems, when using a single laser for beam splitting, typically produce holes of the same diameter. When using a single laser for laser drilling, repeating the process is necessary to create holes of different sizes on the workpiece. With the continuous advancement of modern technology, drilling on workpieces presents complex processing requirements, necessitating the processing of holes of varying sizes. Furthermore, the more lasers used in the process, the higher the system cost.

[0003] Therefore, there is an urgent need for a single laser drilling solution that can adapt to complex processing requirements. Summary of the Invention

[0004] Therefore, it is necessary to provide a laser drilling system, control method, device, and laser drilling equipment that can simultaneously drill holes of different diameters in complex processing scenarios, thereby effectively improving drilling efficiency, in order to address the aforementioned technical problems.

[0005] In a first aspect, this application provides a laser drilling system, comprising: a controller, a laser, a beam splitting component, a first beam adjustment processing module, and a second beam adjustment processing module; the laser, the beam splitting component, the first beam adjustment processing module, and the second beam adjustment processing module are respectively connected to the controller, and perform laser drilling according to control commands sent by the controller;

[0006] The laser is used to emit a laser beam;

[0007] The beam splitting component is used to divide the laser beam into a first beam and a second beam, and to assign a corresponding energy ratio to the first beam and the second beam according to the control command. The first beam is sent to the first beam adjustment and processing module in a first direction, and the second beam is sent to the second beam adjustment and processing module in a second direction, wherein the first direction and the second direction are different directions.

[0008] The first beam adjustment processing module is used to perform laser drilling on the object being processed using the first beam.

[0009] The second beam adjustment processing module is used to perform laser drilling on the workpiece using the second beam; wherein at least one beam adjustment processing module is used to adjust the spot size and / or transmission optical path of the beam according to the control command.

[0010] In one embodiment, the first beam adjustment processing module and / or the second beam adjustment processing module include a shaping component, an optical path switching component, and a processing component arranged according to the beam propagation direction; the shaping component, the optical path switching component, and the processing component are respectively connected to the controller;

[0011] The shaping component is used to adjust the spot size of the laser beam according to the control command;

[0012] The optical path switching component is used to adjust the transmission optical path of the laser beam according to the control command;

[0013] The processing component is used to acquire laser processing parameters according to the control command, and to perform laser drilling on the object to be processed according to the laser processing parameters, wherein the laser processing parameters include processing position, number of processing times and processing time.

[0014] In one embodiment, the shaping component includes a shaping unit, a beam expanding and collimating unit, and an aperture stop; the aperture stop is connected to the controller;

[0015] The shaping unit is used to shape the laser beam;

[0016] The beam expanding and collimating unit is used for collimating the laser beam;

[0017] The aperture stop is used to change the light-transmitting aperture according to the control command, so as to adjust the spot size of the laser beam.

[0018] In one embodiment, the optical path switching component includes at least two fixedly arranged first and second reflectors, a driving structure, and a third reflector connected to the driving structure;

[0019] The first and second reflectors are arranged around the drive structure, and the drive structure is used to drive the third reflector to reciprocate between a first position and a second position according to the control command. The first position is located between the shaping component and the first reflector.

[0020] When the third reflector is in the first position, the light emitted by the shaping component is reflected by the third reflector to a preset position to form a first light path;

[0021] When the third reflector is in the second position, the light emitted by the shaping component is reflected sequentially by the first reflector and the second reflector to the preset position, forming a second optical path; the transmission optical path of the first optical path is less than the transmission optical path of the second optical path.

[0022] In one embodiment, the processing assembly includes a galvanometer scanning unit, a processing platform, and a position detector; the galvanometer scanning unit and the position detector are respectively connected to the controller;

[0023] The processing platform is movable and used to fix the object to be processed;

[0024] The position detector is used to detect the position movement of the processing platform and feed it back to the controller. The controller is used to control the galvanometer scanning unit to perform laser drilling on the object to be processed on the processing platform according to the position movement of the processing platform.

[0025] The galvanometer scanning unit performs laser drilling on the object to be processed on the processing platform according to the laser processing parameters.

[0026] In one embodiment, the beam-splitting assembly includes a beam-splitting modulator and a beam-splitting mirror;

[0027] The beam splitter includes a base, a substrate plate, a fourth reflector, a fifth reflector, and a sixth reflector; the substrate plate is rotatably connected to the base; the fourth reflector is movably disposed on the substrate plate; the fifth reflector is movably disposed on the substrate plate; and the sixth reflector is disposed on the substrate plate.

[0028] The laser beam emitted by the laser can be directed toward the beam splitter via the fourth, sixth and fifth reflecting mirrors in sequence. The fourth, fifth and sixth reflecting mirrors are used to adjust the incident direction of the laser beam directed toward the beam splitter and to adjust the energy ratio of the first beam and the second beam split by the beam splitter.

[0029] In one embodiment, the first beam adjustment and processing module includes a first shaping component, a first optical path switching component, and a first processing component; the second beam adjustment and processing module includes a second shaping component, a second optical path switching component, and a second processing component.

[0030] The first shaping component is used to adjust the first spot size of the first beam according to the control command, and send the adjusted first beam to the first optical path switching component; the second shaping component is used to adjust the second spot size of the second beam according to the control command, and send the adjusted second beam to the second optical path switching component;

[0031] The first optical path switching component is used to adjust the transmission optical path of the first beam and send the first beam to the first processing component according to the first transmission optical path; the second optical path switching component is used to adjust the transmission optical path of the second beam and send the second beam to the second processing component according to the second transmission optical path.

[0032] The first processing component is used to output a laser beam according to the first laser processing parameters and apply it to the object being processed. The second processing component is used to output a laser beam according to the second laser processing parameters and apply it to the object being processed to achieve laser drilling. The energy ratio of the first beam and the second beam, the first spot size and the second spot size, the first transmission optical path and the second transmission optical path, and the first laser processing parameters and the second laser processing parameters are different.

[0033] Secondly, this application also provides a laser drilling system control method, applied to the laser drilling system described in the first aspect, comprising:

[0034] Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction;

[0035] The laser processing control command controls the laser to emit a laser beam, and controls the beam splitting component to divide the laser beam into a first beam and a second beam, and assigns a corresponding energy ratio to the first beam and the second beam.

[0036] According to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling on the object being processed through the first beam.

[0037] The second instruction controls the second beam adjustment processing module to perform laser drilling on the object being processed using the second beam; wherein at least one of the laser processing control instructions is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

[0038] Thirdly, this application also provides a laser drilling system control device, applied to the laser drilling system described in the first aspect, comprising:

[0039] An instruction generation module is used to generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction;

[0040] The beam splitting module is used to control the laser to emit a laser beam according to the laser processing control command, and to control the beam splitting component to divide the laser beam into a first beam and a second beam, and to assign corresponding energy ratio values ​​to the first beam and the second beam;

[0041] The first control module is used to control the first beam adjustment processing module to perform laser drilling processing on the object to be processed through the first beam according to the first instruction.

[0042] The second control module is used to control the second beam adjustment processing module to perform laser drilling on the object to be processed through the second beam according to the second instruction; wherein, at least one of the laser processing control instructions is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

[0043] Fourthly, this application also provides a laser drilling device, including the laser drilling processing system described in the first aspect.

[0044] In summary, this application proposes a laser drilling system, control method, apparatus, and laser drilling equipment, comprising: a controller, a laser, a beam splitting component, a first beam adjustment processing module, and a second beam adjustment processing module. The laser emits a laser beam; the beam splitting component divides the laser beam into a first beam and a second beam, and assigns corresponding energy ratios to the first and second beams according to control commands; the first and second beam adjustment processing modules respectively perform laser drilling on the workpiece using the first and second beams, and at least one beam adjustment processing module adjusts the spot size and optical path of the beam according to control commands. The laser drilling system proposed in this application can adjust the energy ratio, spot size, and optical path of the two lasers during laser drilling, adapting to complex processing scenarios and simultaneously enabling the processing of different types of holes, effectively improving drilling efficiency. Attached Figure Description

[0045] Figure 1 This is an application environment diagram of the laser drilling system control method in one embodiment;

[0046] Figure 2 This is a structural block diagram of the control system of a laser drilling system in one embodiment;

[0047] Figure 3 This is a structural block diagram of a beam adjustment processing module in one embodiment;

[0048] Figure 4 This is a schematic diagram of the structure of the shaping component in one embodiment;

[0049] Figure 5 This is a schematic diagram of the shaping component in another embodiment;

[0050] Figure 6 This is a schematic diagram illustrating the effect of the third reflector in the optical path switching component being in the first position in one embodiment.

[0051] Figure 7 This is a schematic diagram illustrating the effect of the third reflector in the optical path switching component being in the second position in one embodiment.

[0052] Figure 8 This is a schematic diagram of the processing component in one embodiment;

[0053] Figure 9 This is a structural block diagram of the control system of the laser drilling system in another embodiment;

[0054] Figure 10 This is a schematic diagram of the structure of a beam-splitting component in one embodiment;

[0055] Figure 11 This is a flowchart illustrating the control method of a laser drilling system in one embodiment;

[0056] Figure 12 This is a structural block diagram of the control device for a laser drilling system in one embodiment;

[0057] Figure 13 This is an internal structural diagram of a computer device in one embodiment.

[0058] Summary of attached image labels:

[0059] Controller-110; Laser-120; Beam Splitter-130; Beam Regulator-131; Beam Mirror-132; First Calibration Component-133; First Fixture-1331; Second Fixture-1332; Second Calibration Component-134; Third Fixture-1341; Fourth Fixture-1342; First Beam Adjustment Processing Module-140; First Shaping Component-141; First Optical Path Switching Component-142; First Processing Component-143; Second Beam Adjustment Processing Module-150; Second Shaping Component-151; Second Optical Path Switching Component-152; Second Processing Component-153; Shaping Component-2 10; Shaping unit - 211; Plano-concave lens - 2111; First plano-convex lens - 2112; Beam expander and collimator unit - 212; Second plano-convex lens - 2121; Third plano-convex lens - 2122; Aperture stop - 213; Optical path switching assembly - 220; First reflecting mirror - 221; Second reflecting mirror - 222; Drive structure - 223; Third reflecting mirror - 224; Processing assembly - 230; Galvanometer scanning unit - 231; Processing platform - 232; Position detector - 233; Reflector - 234; Positioning unit - 235; Focusing lens - 236; Dust removal module - 237; Workpiece - 300. Detailed Implementation

[0060] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0062] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0063] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0064] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0065] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0066] In related technologies, the laser beam emitted by a single laser is usually shaped and then split, resulting in two beams with identical energy and spot size. Consequently, the aperture size on the object being processed is also the same, leading to low efficiency when facing complex processing requirements. There is an urgent need for a laser drilling solution capable of handling complex processing scenarios.

[0067] In one embodiment, such as Figure 1 As shown, this application provides a laser drilling system, including: a controller 110, a laser 120, a beam splitter 130, a first beam adjustment processing module 140, and a second beam adjustment processing module 150. The laser 120, beam splitter 130, first beam adjustment processing module 140, and second beam adjustment processing module 150 are respectively connected to the controller 110 and perform laser drilling according to control commands sent by the controller 110. In this embodiment, the controller 110 is used to generate laser processing control commands for the object being processed based on the drilling requirements in the actual application scenario. It should be noted that the laser processing control commands include control parameters for the laser 120, beam splitter 130, first beam adjustment processing module 140, and second beam adjustment processing module 150 to ensure that each module, component, and device can execute the corresponding steps to achieve the drilling requirements for the object being processed.

[0068] like Figure 2 As shown, in this embodiment, the propagation direction of the optical path starts from the laser 120, passes sequentially through the beam splitting component 130, the first beam adjustment processing module 140 / second beam adjustment processing module 150, and finally acts on a designated position on the surface of the object being processed. It should be noted that this designated position is defined by control commands generated by the controller 110.

[0069] In this embodiment, laser 120 is used to emit a laser beam. Optionally, laser 120 is a carbon dioxide (CO2) laser. The laser 120 emits a laser beam with a wavelength in the infrared band, preferably 9.2 μm, 9.4 μm or 10.6 μm.

[0070] In this embodiment, the beam splitting component 130 is used to divide the laser beam into a first beam and a second beam, and to allocate corresponding energy ratios to the first beam and the second beam according to control commands. The first beam is sent to the first beam adjustment and processing module 140 in a first direction, and the second beam is sent to the second beam adjustment and processing module 150 in a second direction, wherein the first direction and the second direction are different directions.

[0071] In this embodiment, since the laser 120 is The laser beam emitted by the laser 120 is usually linearly polarized light. This laser beam can be decomposed into s-waves and p-waves with electric vectors perpendicular to and parallel to the incident plane. Typically, after one reflection by a mirror, the vibration direction of the s-wave will rotate 180°, while the vibration direction of the p-wave will not change.

[0072] In this embodiment, the beam splitting assembly 130 includes at least a beam splitter 131 and a beam splitter 132. After the beam passes through the beam splitter 132, the p-polarized beam is transmitted and the s-polarized beam is reflected, thereby forming a first beam and a second beam with different exit directions. The beam splitter 131 can be rotated about the beam propagation path to change the polarization state of the beam passing through the beam splitter 131, that is, to change the ratio of p-polarized light and s-polarized light emitted by the laser 120, thereby adjusting the energy ratio of the two beams after passing through the beam splitter 132, that is, allocating the first beam and the second beam with the corresponding energy ratio. Optionally, the beam splitter 131 can be a three-piece beam splitter 131, which consists of at least three reflectors.

[0073] In this embodiment, the first beam adjustment processing module 140 is used to perform laser drilling on the object being processed using a first beam.

[0074] The second beam adjustment processing module 150 is used to perform laser drilling on the workpiece using a second beam. At least one beam adjustment processing module is used to adjust the beam spot size and transmission path according to control commands.

[0075] In this embodiment, at least three operating conditions exist. In the first operating condition, the first beam adjustment processing module adjusts the spot size and / or transmission optical path of the first beam according to control commands, and then performs laser drilling on the workpiece using the first beam. The second beam adjustment processing module directly performs laser drilling on the workpiece using the second beam. In the second operating condition, the first beam adjustment processing module directly performs laser drilling on the workpiece using the first beam, and the second beam adjustment processing module adjusts the spot size and / or transmission optical path of the second beam according to control commands, and then performs laser drilling on the workpiece using the second beam. In the third operating condition, the first beam adjustment processing module adjusts the spot size and / or transmission optical path of the first beam according to control commands, and then performs laser drilling on the workpiece using the first beam. The second beam adjustment processing module adjusts the spot size and / or transmission optical path of the second beam according to control commands, and then performs laser drilling on the workpiece using the second beam.

[0076] In this embodiment, the first beam adjustment processing module 140 and the second beam adjustment processing module 150 correspond to two different optical path propagation paths. For example, the first beam adjustment processing module 140 corresponds to the optical path propagation path of the first beam, and the second beam adjustment processing module 150 corresponds to the optical path propagation path of the second beam. In practical applications, the beam adjustment processing modules can be used to achieve adaptive adjustment of the laser beam spot size and transmission optical path, and to complete laser drilling processing on the workpiece. It should be noted that the beam adjustment processing module proposed in this embodiment can achieve spot size adjustment and / or transmission optical path adjustment for the first beam and / or the second beam after the equipment has completed initial optical path debugging and device debugging, without disassembling or replacing the devices, to adapt to different processing conditions.

[0077] In a specific embodiment, the first beam adjustment processing module 140 and the second beam adjustment processing module 150 can act simultaneously on the same object to achieve hole diameter processing of different sizes and shapes for the same object, which greatly improves the efficiency of laser drilling and adapts the laser drilling system to different scenarios.

[0078] In one embodiment, the initial optical path debugging of the laser drilling system includes adjusting the output beam angle of the laser 120 and configuring a certain number of fixed mirror structures along the pipeline propagation path to ensure that the laser beam emitted by the laser 120 can sequentially pass through the beam splitter 130 and the first beam adjustment processing module 140, or sequentially pass through the beam splitter 130 and the second beam adjustment processing module 150, and finally act on the object being processed. The initial device debugging of the laser processing system includes configuring basic parameters for laser drilling of the object being processed, such as the mirror setting angle, the specific position of the movable mirror structure, and the aperture size. It should be noted that the specific content of the initial optical path debugging and initial device debugging can be adaptively configured according to the needs of the actual application scenario to ensure that the laser drilling system can operate normally.

[0079] Based on the above steps, this embodiment provides a laser drilling system. After completing the initial debugging steps of the system, the controller 110 generates corresponding control commands according to the drilling requirements, and then sends control commands to the corresponding modules, components and devices to adjust the energy ratio of the light sources of the two laser drilling worktables. The system also adjusts the spot size and transmission optical path of the beam on the corresponding optical path according to the actual processing requirements. Thus, laser drilling of different hole diameters can be achieved on the object being processed by a single laser. By adjusting the processing hole diameter in real time according to the requirements, it can be adapted to various complex processing scenarios, greatly improving the working efficiency and applicability of the laser drilling system.

[0080] In one embodiment, such as Figure 3As shown, the first beam adjustment processing module 140 and / or the second beam adjustment processing module 150 include a shaping component 210, an optical path switching component 220, and a processing component 230 arranged according to the beam propagation direction, wherein the shaping component 210, the optical path switching component 220, and the processing component 230 are respectively connected to the controller 110. In this embodiment, the beam adjustment processing module includes at least the shaping component 210 and the processing component 230 arranged according to the beam propagation direction to ensure that laser drilling processing of the object being processed can be achieved based on the laser beam provided by the light source.

[0081] In this embodiment, the beam adjustment processing module adjusts the beam spot size and transmission optical path based on the shaping component 210, the optical path switching component 220 and the processing component 230 connected in sequence.

[0082] In this embodiment, the shaping component 210 is used to adjust the spot size of the laser beam according to control commands. The optical path switching component 220 is used to adjust the transmission optical path of the laser beam according to control commands. The processing component 230 is used to acquire laser processing parameters according to control commands and perform laser drilling on the workpiece according to the laser processing parameters, wherein the laser processing parameters include processing position, number of processing operations, and processing time.

[0083] In this embodiment, the configuration of laser processing parameters can be adaptively configured according to the actual structural settings of the processing component 230. The specific values ​​of processing position, number of processing times and processing time can be set according to the actual processing requirements of the object being processed in the actual application scenario, and no specific limitations are made here.

[0084] Based on the above steps, this embodiment provides a shaping component 210, an optical path switching component 220, and a processing component 230 connected in sequence. When acquiring laser beams with the same / different energy ratios, the laser beam can be shaped first through control commands to achieve spot size adjustment for different beams. The optical path propagation of the laser drilling system provided in this embodiment is first processed by the beam splitting component 130, and then shaped by the shaping component 210, which can achieve the allocation of different spot sizes. Furthermore, this embodiment can further freely change the transmission optical path of the laser beam through the optical path switching component 220, providing different light sources with different transmission optical paths for different processing components 230, thereby achieving workpiece processing with different hole diameters.

[0085] In one embodiment, such as Figure 4 and Figure 5 As shown, the shaping component 210 includes a shaping unit 211, a beam expanding and collimating unit 212, and an aperture stop 213. The aperture stop 213 is connected to the controller 110. The shaping unit 211, the beam expanding and collimating unit 212, and the aperture stop are arranged sequentially along the optical path direction.

[0086] In this embodiment, the shaping unit 211 is used to shape the laser beam. For example, the shaping unit 211 can be used to change the laser beam a emitted by the laser 120 into a flat-top laser beam b, so that the cross-sectional energy density distribution of the laser beam is uniform. Optionally, as... Figure 4 As shown, the shaping unit 211 includes a plano-concave lens 2111 and a first plano-convex lens 2112 arranged sequentially along the optical path. The plane of the plano-concave lens 2111 is opposite to the plane of the first plano-convex lens 2112, and the concave surface of the plano-concave lens 2111 faces the convex surface of the first plano-convex lens 2112. The shaping unit 211, composed of the plano-concave lens 2111 and the first plano-convex lens 2112, has a simple structure, is easy to control the laser beam, and is easy to implement.

[0087] In this embodiment, as Figure 5 As shown, the beam expanding and collimating unit 212 is used to collimate the laser beam. For example, the beam expanding and collimating unit 212 expands and collimates the flat-top laser beam b emitted from the shaping unit 211, including a second plano-convex lens 2121 and a third plano-convex lens 2122 arranged sequentially along the optical path direction. The convex surfaces of the second plano-convex lens 2121 and the third plano-convex lens 2122 are opposite to each other, and the planes of the second plano-convex lens 2121 and the third plano-convex lens 2122 face each other. Optionally, the distance between the second plano-convex lens 2121 and the third plano-convex lens 2122 is adjustable.

[0088] In this embodiment, the beam expanding and collimating unit 212 achieves laser beam expanding and collimation through the cooperation between the second plano-convex lens 2121 and the third plano-convex lens 2122, which has the advantages of simple structure, strong controllability, and ease of implementation. In particular, the distance between the second plano-convex lens 2121 and the third plano-convex lens 2122 is adjustable. When the distance between the second plano-convex lens 2121 and the third plano-convex lens 2122 is shortened, the diameter of the laser beam emitted from the third plano-convex lens 2122 becomes smaller; when the distance between the second plano-convex lens 2121 and the third plano-convex lens 2122 is increased, the diameter of the laser beam emitted from the third plano-convex lens 2122 becomes larger, thereby achieving laser beam expanding and collimation.

[0089] In this embodiment, the aperture stop 213 is used to change the light transmission aperture according to control commands to adjust the spot size of the laser beam. The aperture stop 213 has an aperture hole for limiting the diameter of the laser beam emitted from the beam expander and collimator 212 and directing the emitted laser beam c to the optical path switching component 220. Optionally, the aperture stop 213 has multiple aperture holes of different sizes. In actual operation, the operator can select different aperture holes as needed to obtain a laser beam c of a certain diameter.

[0090] Furthermore, the aperture stop 213 includes a rotating screen with various aperture holes of different sizes arranged circumferentially on the screen. In operation, by rotating the screen, different aperture holes can be positioned on the laser beam path to limit the diameter of the laser beam, thus allowing adjustment of the laser beam spot size.

[0091] In one embodiment, such as Figure 6 and Figure 7 As shown, the optical path switching assembly 220 includes at least two fixedly arranged first reflectors 221 and second reflectors 222, a drive structure 223, and a third reflector 224 connected to the drive structure 223. The first reflectors 221 and second reflectors 222 are arranged around the drive structure 223. The drive structure 223 is used to drive the third reflector 224 to reciprocate between a first position and a second position according to control commands. The first position is located between the shaping assembly 210 and the first reflector 221.

[0092] In this embodiment, as Figure 6 As shown, when the third reflector 224 is in the first position, the light emitted by the shaping component 210 is reflected by the third reflector 224 to a preset position, forming a first optical path. Specifically, the first optical path includes optical path L1 and optical path L5.

[0093] In this embodiment, as Figure 7 As shown, when the third reflector 224 is in the second position, the light emitted by the shaping component 210 is reflected sequentially by the first reflector 221 and the second reflector 222 to a preset position, forming a second optical path. Specifically, the second optical path includes optical path L1, optical path L2, optical path L3, and optical path L4.

[0094] In this embodiment, the transmission optical path of the first optical path is shorter than that of the second optical path.

[0095] The driving structure 223 includes a driving body, a driving slider, a driving slide rail, a first limiting member, and a second limiting member. The driving body is mounted on a worktable and positioned between the shaping assembly 210 and the first reflector 221. The driving slide rail is mounted on the driving body, and the driving slider is slidably connected to the driving slide rail and connected to the driving body. The sliding direction of the driving slider forms a 45° angle with the optical path L1. A third reflector 224 is connected to the driving slider. The driving body drives the driving slider to slide relative to the driving slide rail, causing the third reflector 224 on the driving slider to reciprocate between a first position and a second position, thereby achieving the switching between the first optical path and the second optical path.

[0096] In this embodiment, the first and second limiting members are mounted on the drive body, and are located on opposite sides of the drive slide rail along its extension direction. When the third reflector 224 is in the first position, the drive slider abuts against the first limiting member. When the third reflector 224 is in the second position, the drive slider abuts against the second limiting member. The first and second limiting members can limit the sliding of the drive slider, preventing it from disengaging from the drive slide rail.

[0097] In one embodiment, the driving body of the driving structure 223 is a driving cylinder. It should be noted that the angle between the sliding direction of the driving slider and the optical path L1, as well as the setting angles of the first reflector 221 and the second reflector 222, can be adaptively configured according to the needs of the actual application scenario, and are not limited to a single configuration here.

[0098] In one embodiment, the optical path switching component 220 may further include more fixed reflectors and a driving structure 223 set at a certain angle to the fixed reflectors, and each driving structure 223 is provided with a movable reflector, so that optical paths with different transmission optical paths can be realized when the movable reflectors move.

[0099] In one embodiment, such as Figure 8 As shown, the machining assembly 230 includes a galvanometer scanning unit 231, a machining platform 232, and a position detector 233. The galvanometer scanning unit 231 and the position detector 233 are respectively connected to the controller 110.

[0100] In this embodiment, the processing platform 232 is movably configured to fix the workpiece 300. The position detector 233 detects the amount of position movement of the processing platform 232 and feeds it back to the controller 110. The controller 110 controls the galvanometer scanning unit 231 to perform laser drilling on the workpiece 300 on the processing platform 232 based on the amount of position movement of the processing platform 232. The galvanometer scanning unit 231 performs laser drilling on the workpiece 300 on the processing platform 232 according to laser processing parameters.

[0101] Optionally, the processing assembly 230 further includes a reflector 234 to receive the laser beam output from the optical path switching assembly 220. The processing assembly 230 also includes a focusing lens 236 and a dust removal module 237. The focusing lens 236 is used to focus the laser beam emitted by the galvanometer scanning unit 231. The focusing lens 236 is a flat-field focusing lens (f-theta). The focusing lens 236 can focus the laser beam, thereby achieving a high energy density at the laser beam focal point to ensure the quality of laser drilling. The dust removal module 237 is used to remove dust generated during the laser drilling process in a timely manner to ensure that the laser beam can perform precise drilling of small apertures.

[0102] In this embodiment, the processing component 230 includes a galvanometer scanning unit 231, a processing platform 232, and a positioning unit 235. Optionally, the processing platform 232 can be a vacuum adsorption processing platform 232, which can adsorb the workpiece 300 to fix it in place. The positioning unit 235 is used to obtain the position of the workpiece 300 on the processing platform 232 and feed it back to the controller 110. The controller 110 controls the galvanometer scanning unit 231 to perform laser drilling on the workpiece 300 according to the position of the workpiece 300. Specifically, the positioning unit 235 includes a CCD (Charge Coupled Device) camera, a coaxial light source, and a ring light source. The CCD camera is used to obtain the position of the workpiece 300 on the processing platform 232 and feed it back to the controller 110. The coaxial light source and the ring light source provide light to the CCD camera so that the position of the workpiece 300 can be identified. Equipping a ring light source improves the identification of outer targets, while equipping a coaxial light source improves the identification of inner targets. Using both simultaneously can meet the needs of various situations. The positioning unit 235 can accurately determine the position of the workpiece 300 and feed it back to the controller 110 to achieve automated and controlled laser drilling.

[0103] Furthermore, the galvanometer scanning unit 231 moves along the X and Y axes for scanning and processing, and the processing platform 232 can also move along the X and Y axes. In this embodiment, the X and Y axes are perpendicular to each other and lie in the same plane. In this embodiment, when the galvanometer scanning unit 231 moves along the X and Y axes for scanning and processing, the laser beam spot point deviates from its original position by a certain distance S. The processing platform 232 can move in the opposite direction along the X and Y axes to compensate for the distance S that the laser beam spot point in the galvanometer scanning unit 231 deviates from its original position. This allows the galvanometer scanning unit 231 to repeatedly perform laser drilling processing on the same processing point on the same workpiece 300.

[0104] In multiple laser scanning drilling processes, precise and repeatable positioning of the machining points on the workpiece 300 is crucial, especially in high-density, high-precision drilling processes. In this embodiment, the machining component 230 also includes a position detector 233. The position detector 233 is used to detect the positional movement of the machining platform 232 and feed it back to the controller 110. The controller 110 can control the galvanometer scanning unit 231 to perform laser drilling on the workpiece 300 on the machining platform 232 based on the positional movement of the machining platform 232.

[0105] In one embodiment, when the linear drive mechanism drives the machining platform 232 to move along the X and Y axes, the linear encoder outputs a pulse whenever the machining platform 232 moves by a small distance unit. The position detector 233 counts these pulses and feeds the count value back to the controller 110, thereby detecting the position movement of the machining platform 232. In another embodiment, when the servo motor converts rotary motion into linear motion to drive the machining platform 232 to move along the X and Y axes, the rotary encoder outputs a pulse whenever the servo motor rotates by a small angle unit. The position detector 233 counts these pulses and feeds the count value back to the controller 110, thereby detecting the position movement of the machining platform 232.

[0106] In a specific system architecture, other forms of position detectors 233 can still be used to detect the positional movement of the processing platform 232. In this embodiment, a position detector 233 is added to the processing module to detect the positional movement of the processing platform 232, thereby enabling the controller 110 to better control the galvanometer scanning unit 231 to repeatedly perform laser drilling on the same processing point on the workpiece 300 multiple times, so as to achieve precise laser drilling.

[0107] In one embodiment, such as Figure 9 As shown, the beam splitting assembly 130 includes a beam splitter 131 and a beam splitter 132. In this embodiment, the beam splitter 131 can be a three-piece beam splitter 131, and the beam splitter can be a thin film polarizer (TFP) beam splitter 132.

[0108] In this embodiment, the beam splitter 131 includes a base, a substrate plate, a fourth reflector, a fifth reflector, and a sixth reflector. The substrate plate is rotatably connected to the base. The fourth reflector is movably disposed on the substrate plate; the fifth reflector is movably disposed on the substrate plate; and the sixth reflector is disposed on the substrate plate.

[0109] The laser beam emitted by the laser 120 can be directed toward the beam splitter 132 by passing through the fourth, sixth and fifth reflectors in sequence. The fourth, fifth and sixth reflectors are used to adjust the incident direction of the laser beam directed toward the beam splitter 132 and to adjust the energy ratio of the first beam and the second beam split by the beam splitter 132.

[0110] In this embodiment, the controller 110 can send control commands to the driving device of the substrate plate and control the driving device to adjust the angle between the fourth and fifth reflectors and the substrate plate, thereby adjusting the incident direction of the laser beam directed towards the beam splitter 132, thereby changing the S-wave direction and P-wave direction split by the beam splitter 132, so as to adjust the energy ratio of the first beam and the second beam.

[0111] In this embodiment, the beam splitting assembly 130 further includes a first calibration assembly 133 and a second calibration assembly 134. A beam splitter 131 is disposed on the optical path between the laser 120 and the beam splitter 132. The first calibration assembly 133 is disposed on the optical path between the laser 120 and the beam splitter 131, and the second calibration assembly 134 is disposed on the optical path between the beam splitter 131 and the beam splitter 132. During laser processing, the laser 120 emits a laser beam. The beam splitter 131 adjusts the direction of the laser beam incident on the beam splitter 132 and adjusts the energy ratio of the first and second beams split by the beam splitter 132. The first calibration assembly 133 and the second calibration assembly 134 calibrate whether the laser beam incident on the beam splitter 131 and the laser beam emitted from the beam splitter 131 are on the same straight line.

[0112] Continue to refer to Figure 9 As shown, the first calibration component 133 includes a first fixture 1331 and a second fixture 1332, and the second calibration component 134 includes a third fixture 1341 and a fourth fixture 1342. The first fixture 1331 and the second fixture 1332 are arranged sequentially at the incident end of the beam splitter 131 along the incident direction of the beam splitter 131, and the third fixture 1341 and the fourth fixture 1342 are arranged sequentially at the exit end of the beam splitter 131 along the exit direction of the beam splitter 131. Since two points determine a straight line, the transmission direction of the beam can be adjusted according to the principle that two points determine a straight line. Thus, the incident direction of the beam incident on the beam splitter 131 can be determined by the first fixture 1331 and the second fixture 1332, and the exit direction of the beam emitted from the beam splitter 131 can be determined by the third fixture 1341 and the fourth fixture 1342. Among them, the first fixture 1331, the second fixture 1332, the third fixture 1341 and the fourth fixture 1342 are all provided with precision holes to ensure accuracy.

[0113] In one embodiment, such as Figure 10 As shown, the first beam adjustment and processing module 140 includes a first shaping component 141, a first optical path switching component 142, and a first processing component 143; the second beam adjustment and processing module 150 includes a second shaping component 151, a second optical path switching component 152, and a second processing component 153.

[0114] The first shaping component 141 is used to adjust the first spot size of the first beam according to the control command, and send the adjusted first beam to the first optical path switching component 142; the second shaping component 151 is used to adjust the second spot size of the second beam according to the control command, and send the adjusted second beam to the second optical path switching component 152.

[0115] The first optical path switching component 142 is used to adjust the transmission optical path of the first beam and send the first beam to the first processing component 143 according to the first transmission optical path; the second optical path switching component 152 is used to adjust the transmission optical path of the second beam and send the second beam to the second processing component 153 according to the second transmission optical path.

[0116] The first processing component 143 is used to output a laser beam according to the first laser processing parameters and apply it to the object being processed. The second processing component 153 is used to output a laser beam according to the second laser processing parameters and apply it to the object being processed, so as to realize laser drilling processing.

[0117] In this embodiment, the energy ratio of the first beam and the second beam, the first spot size and the second spot size, the first transmission optical path and the second transmission optical path, the first laser processing parameter and the second laser processing parameter have different values.

[0118] In this embodiment, the first beam adjustment processing module 140 and the second beam adjustment processing module 150, through two completely different sets of shaping components 210, optical path switching components 220 and processing components 230, can achieve simultaneous processing of holes of different depths and sizes, thereby maximizing the efficiency of laser drilling.

[0119] In summary, this embodiment provides a control system for a laser drilling system. By configuring a first optical path switching component and a second optical path switching component, a cylinder can be used to conveniently switch between long and short optical paths, forming a dual-optical path system. This design improves the compatibility of machine processing, enabling a single laser to process holes of two different sizes. Furthermore, the two optical paths can switch back and forth between processing large and small holes. After initial debugging, subsequent optical path switching does not require re-adjustment, allowing for very convenient switching between long and short optical paths. This significantly improves the efficiency of laser drilling.

[0120] In one embodiment, such as Figure 11 As shown, a control method for a laser drilling system is provided, which is applied to... Figure 1 Taking the control system of a laser drilling processing system as an example, the following steps are included:

[0121] S1101, Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction.

[0122] S1102 controls the laser to emit a laser beam according to the laser processing control command, and controls the beam splitting component to divide the laser beam into a first beam and a second beam, and assigns a corresponding energy ratio to the first beam and the second beam.

[0123] S1103, according to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling processing on the object to be processed through the first beam.

[0124] S1104, according to the second instruction, the second beam adjustment processing module is controlled to perform laser drilling on the object to be processed through the second beam; wherein, at least one laser processing control instruction is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

[0125] In this embodiment, the specific implementation method of the laser drilling processing system control method can be referred to the specific implementation method of the above system embodiment, and will not be repeated here.

[0126] In summary, this embodiment provides a control method for a laser drilling system. After completing the initial debugging steps of the system, the controller generates corresponding control commands according to the drilling requirements, and then sends control commands to the corresponding modules, components, and devices to adjust the energy ratio, spot size, and transmission optical path of the light sources of the two laser drilling worktables. This enables laser drilling of different hole diameters on the workpiece. By adjusting the processing hole diameter in real time according to the requirements, it can adapt to various complex processing scenarios, greatly improving the working efficiency and applicability of the laser drilling system.

[0127] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0128] Based on the same inventive concept, this application also provides a laser drilling system control device for implementing the laser drilling system control method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the laser drilling system control device provided below can be found in the limitations of the laser drilling system control method described above, and will not be repeated here.

[0129] In one embodiment, such as Figure 12 As shown, a laser drilling system control device 1200 is provided, comprising: an instruction generation module 1210, a beam division module 1220, a first control module 1230, and a second control module 1240, wherein:

[0130] The instruction generation module 1210 is used to generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction;

[0131] The beam splitting module 1220 is used to control the laser to emit a laser beam according to the laser processing control command, and to control the beam splitting component to divide the laser beam into a first beam and a second beam, and to assign corresponding energy ratio values ​​to the first beam and the second beam.

[0132] The first control module 1230 is used to control the first beam adjustment processing module to perform laser drilling processing on the object to be processed by the first beam according to the first instruction.

[0133] The second control module 1240 is used to control the second beam adjustment processing module to perform laser drilling on the workpiece through the second beam according to the second instruction; wherein, at least one laser processing control instruction is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

[0134] Each module in the aforementioned laser drilling system control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0135] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 13As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a control method for a laser drilling system. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0136] Those skilled in the art will understand that Figure 13 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0137] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0138] Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction.

[0139] The laser is controlled to emit a laser beam according to the laser processing control command, and the beam splitting component is controlled to divide the laser beam into a first beam and a second beam, and to assign a corresponding energy ratio to the first beam and the second beam.

[0140] According to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling on the object being processed through the first beam.

[0141] According to the second instruction, the second beam adjustment processing module is controlled to perform laser drilling on the object being processed through the second beam.

[0142] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0143] Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction.

[0144] The laser is controlled to emit a laser beam according to the laser processing control command, and the beam splitting component is controlled to divide the laser beam into a first beam and a second beam, and to assign a corresponding energy ratio to the first beam and the second beam.

[0145] According to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling on the object being processed through the first beam.

[0146] According to the second instruction, the second beam adjustment processing module is controlled to perform laser drilling on the object being processed through the second beam.

[0147] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0148] Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction.

[0149] The laser is controlled to emit a laser beam according to the laser processing control command, and the beam splitting component is controlled to divide the laser beam into a first beam and a second beam, and to assign a corresponding energy ratio to the first beam and the second beam.

[0150] According to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling on the object being processed through the first beam.

[0151] According to the second instruction, the second beam adjustment processing module is controlled to perform laser drilling on the object being processed through the second beam.

[0152] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0153] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0154] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A laser drilling system, characterized in that, include: The system includes a controller, a laser, a beam splitter, a first beam adjustment processing module, and a second beam adjustment processing module. The laser, the beam splitter, the first beam adjustment processing module, and the second beam adjustment processing module are respectively connected to the controller and perform laser drilling according to the control commands sent by the controller. The laser is used to emit a laser beam; The beam splitting component is used to divide the laser beam into a first beam and a second beam, and to assign a corresponding energy ratio to the first beam and the second beam according to the control command. The first beam is sent to the first beam adjustment and processing module in a first direction, and the second beam is sent to the second beam adjustment and processing module in a second direction, wherein the first direction and the second direction are different directions. The first beam adjustment processing module is used to perform laser drilling on the object being processed using the first beam. The second beam adjustment processing module is used to perform laser drilling on the workpiece using the second beam; wherein at least one beam adjustment processing module is used to adjust the spot size and / or transmission optical path of the beam according to the control command.

2. The laser drilling system according to claim 1, characterized in that, The first beam adjustment and processing module and / or the second beam adjustment and processing module include a shaping component, an optical path switching component, and a processing component arranged according to the beam propagation direction; the shaping component, the optical path switching component, and the processing component are respectively connected to the controller; The shaping component is used to adjust the spot size of the laser beam according to the control command; The optical path switching component is used to adjust the transmission optical path of the laser beam according to the control command; The processing component is used to acquire laser processing parameters according to the control command, and to perform laser drilling on the object to be processed according to the laser processing parameters, wherein the laser processing parameters include processing position, number of processing times and processing time.

3. The laser drilling system according to claim 2, characterized in that, The shaping assembly includes a shaping unit, a beam expanding and collimating unit, and an aperture stop; the aperture stop is connected to the controller. The shaping unit is used to shape the laser beam; The beam expanding and collimating unit is used for collimating the laser beam; The aperture stop is used to change the light-transmitting aperture according to the control command, so as to adjust the spot size of the laser beam.

4. The laser drilling system according to claim 2, characterized in that, The optical path switching component includes at least two fixedly arranged first and second reflectors, a driving structure, and a third reflector connected to the driving structure. The first and second reflectors are arranged around the drive structure, and the drive structure is used to drive the third reflector to reciprocate between a first position and a second position according to the control command. The first position is located between the shaping component and the first reflector. When the third reflector is in the first position, the light emitted by the shaping component is reflected by the third reflector to a preset position to form a first light path; When the third reflector is in the second position, the light emitted by the shaping component is reflected sequentially by the first reflector and the second reflector to the preset position, forming a second optical path; the transmission optical path of the first optical path is less than the transmission optical path of the second optical path.

5. The laser drilling system according to claim 2, characterized in that, The processing assembly includes a galvanometer scanning unit, a processing platform, and a position detector; the galvanometer scanning unit and the position detector are respectively connected to the controller. The processing platform is movable and used to fix the object to be processed; The position detector is used to detect the position movement of the processing platform and feed it back to the controller. The controller is used to control the galvanometer scanning unit to perform laser drilling on the object to be processed on the processing platform according to the position movement of the processing platform. The galvanometer scanning unit performs laser drilling on the object to be processed on the processing platform according to the laser processing parameters.

6. The laser drilling system according to claim 1, characterized in that, The beam-splitting assembly includes a beam-splitting modulator and a beam-splitting mirror; The beam splitter includes a base, a substrate plate, a fourth reflector, a fifth reflector, and a sixth reflector; the substrate plate is rotatably connected to the base; the fourth reflector is movably disposed on the substrate plate; the fifth reflector is movably disposed on the substrate plate; and the sixth reflector is disposed on the substrate plate. The laser beam emitted by the laser can be directed toward the beam splitter via the fourth, sixth and fifth reflecting mirrors in sequence. The fourth, fifth and sixth reflecting mirrors are used to adjust the incident direction of the laser beam directed toward the beam splitter and to adjust the energy ratio of the first beam and the second beam split by the beam splitter.

7. The laser drilling system according to claim 2, characterized in that, The first beam adjustment and processing module includes a first shaping component, a first optical path switching component, and a first processing component; the second beam adjustment and processing module includes a second shaping component, a second optical path switching component, and a second processing component. The first shaping component is used to adjust the first spot size of the first beam according to the control command, and send the adjusted first beam to the first optical path switching component; the second shaping component is used to adjust the second spot size of the second beam according to the control command, and send the adjusted second beam to the second optical path switching component; The first optical path switching component is used to adjust the transmission optical path of the first beam and send the first beam to the first processing component according to the first transmission optical path; the second optical path switching component is used to adjust the transmission optical path of the second beam and send the second beam to the second processing component according to the second transmission optical path. The first processing component is used to output a laser beam according to the first laser processing parameters and apply it to the object being processed. The second processing component is used to output a laser beam according to the second laser processing parameters and apply it to the object being processed to achieve laser drilling. The energy ratio of the first beam and the second beam, the first spot size and the second spot size, the first transmission optical path and the second transmission optical path, and the first laser processing parameters and the second laser processing parameters are different.

8. A control method for a laser drilling system, characterized in that, The laser drilling system according to any one of claims 1-7 comprises: Generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction; The laser processing control command controls the laser to emit a laser beam, and controls the beam splitting component to divide the laser beam into a first beam and a second beam, and assigns a corresponding energy ratio to the first beam and the second beam. According to the first instruction, the first beam adjustment processing module is controlled to perform laser drilling on the object being processed through the first beam. The second instruction controls the second beam adjustment processing module to perform laser drilling on the object being processed using the second beam; wherein at least one of the laser processing control instructions is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

9. A control device for a laser drilling system, characterized in that, The laser drilling system according to any one of claims 1-7 comprises: An instruction generation module is used to generate laser processing control instructions, wherein the laser processing control instructions include at least a first instruction and a second instruction; The beam splitting module is used to control the laser to emit a laser beam according to the laser processing control command, and to control the beam splitting component to divide the laser beam into a first beam and a second beam, and to assign corresponding energy ratio values ​​to the first beam and the second beam; The first control module is used to control the first beam adjustment processing module to perform laser drilling processing on the object to be processed through the first beam according to the first instruction. The second control module is used to control the second beam adjustment processing module to perform laser drilling on the object to be processed through the second beam according to the second instruction; wherein, at least one of the laser processing control instructions is used to instruct the beam adjustment processing module to adjust the spot size and / or transmission optical path of the beam.

10. A laser drilling device, characterized in that, Includes the laser drilling system according to any one of claims 1-7.

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