A chip collection box, a chip recycling device and a control method

Abstract

The application discloses a chip collecting box, a chip collecting and recycling device and a control method. The chip collecting box comprises a box body; a box door is hingedly arranged on the box body to form a cavity, and a chip collecting assembly is arranged on the inner side of the cavity; a chip inlet is arranged on the box body and is communicated with the chip collecting assembly; and the box body is communicated with a vacuum pump through an interface, so that the inner side of the cavity is formed with a negative pressure through the vacuum pump, and the cutting chip enters the inner side of the chip collecting assembly through the chip inlet. Through the design of the chip collecting box and the chip collecting bag, the fine particles and dust can be effectively captured. The staff can complete the packaging of the chip collecting bag without contacting the cutting chip through the drawing plate, the contact with part of the harmful substances can be effectively avoided, the cutting chip projection data is monitored in real time through the photoelectric sensor, the processing parameter data is adjusted according to the correlation model, the air volume of the vacuum pump is adjusted, and it is ensured that the cutting chips with different forms and materials can be effectively collected.

Description

Technical Field

[0001] This invention relates to the field of metal cutting, and more particularly to a chip collection box, a chip recovery device, and a control method. Background Technology

[0002] High-performance alloys have low density, high specific strength, excellent corrosion resistance, and good thermal and electrical conductivity. Especially in high-cleanliness processing spaces, fully enclosed manufacturing units, or some special working environments, the controlled recycling of cutting waste is directly related to the operational reliability of equipment and the recycling rate of materials.

[0003] However, in confined spaces or special physical environments, chips often break free from traditional gravity constraints or move randomly, easily drifting into mechanical gaps or inside precision electronic components, causing equipment wear, electrical short circuits, or even catastrophic failures. Simultaneously, lightweight alloys are affected by thermal softening and process parameters during cutting, resulting in chip morphology that frequently fluctuates between long ribbons, coils, and fine particles. Existing methods for metal chip recycling mainly include hydraulic flushing, vibration-guided compaction, and heated roller pressing for volume reduction. However, these methods often fail under these conditions, and existing single recycling devices struggle to detect dynamic changes in the processing technology, failing to efficiently transport chips of different shapes. The large size or complex shape of the chips often leads to clogged recycling pipelines, high energy consumption, and low dust density, severely restricting the operational stability of clean production systems in complex environments. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip collection box, chip recycling device, and control method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip collection box, comprising: Box; A door is hinged to the box body to form a cavity, and a chip collection assembly is provided inside the cavity. The housing is provided with a chip inlet, which is connected to the chip collection assembly; The housing is connected to a vacuum pump via an interface. The vacuum pump creates a negative pressure inside the cavity, allowing the chips to enter the chip collection assembly through the chip inlet.

[0006] As a further description of the above technical solution: the chip collection assembly includes: a chip collection bag; a buckle is provided on the top of the chip collection bag, and the buckle is installed on the inner wall above the housing.

[0007] As a further description of the above technical solution: the chip inlet extends into the inner side of the housing and is connected to the buckle by a thread.

[0008] As a further description of the above technical solution: a drawer plate is provided on one side of the buckle, and a through hole is provided on the drawer plate, which communicates with the opening of the chip collection bag.

[0009] As a further description of the above technical solution: the housing and the vacuum pump are bolted together and mounted on the base, which is a stepped plate.

[0010] As a further description of the above technical solution: a gasket is provided between the vacuum pump and the base.

[0011] It also includes a chip recycling device, which is equipped with a chip collection box as described in any one of the above technical solutions, comprising: machine tool; The inner side of the machine tool is formed by a partition to create an upper cavity and a lower cavity; A base is provided in the lower cavity, and a chip collection box is provided on the base; At least one pneumatic nozzle is provided in the upper cavity of the machine tool, and a chip collection port is provided on the partition plate. The chip collection port is connected to the chip inlet of the chip collection box through a pipeline.

[0012] As a further description of the above technical solution: multiple photoelectric sensors are provided on the inner side of the upper cavity.

[0013] It also includes a chip recycling control method, the control method being applicable to the chip collection box and recycling device described in any of the above technical solutions, comprising: Acquire machining parameter data, and determine chip projection data based on the machining parameter data; The vacuum pump is controlled to adjust the airflow and perform negative pressure adsorption based on the chip projection data. The chip projection data is monitored by a photoelectric sensor, and the processing parameters are adjusted accordingly. The photoelectric sensor detects whether there are residual chips. If so, the pneumatic nozzle and the negative pressure pump are activated for secondary cleaning. If not, the chip collection bag is replaced by a pull plate.

[0014] As a further description of the above technical solution: determining the chip projection data based on the processing parameter data includes: Construct a correlation model between the machining parameter data and the chip projection data: The chip projection data is represented as the sum of the product of the shape coefficient and the processing parameter data and the area compensation value, wherein the shape coefficient and the area compensation value are determined based on the material type.

[0015] The above technical solution has the following advantages or beneficial effects: By designing chip collection boxes and bags, particulate dust can be effectively captured. A sliding plate allows workers to seal and pack the chip bags without touching the chips, effectively preventing contact with some harmful substances. Photoelectric sensors monitor chip projection data in real time, adjusting processing parameters based on a correlation model and controlling the vacuum pump to regulate airflow, ensuring that chips of different shapes and materials can be effectively collected. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a perspective view of the chip collection box proposed in this invention; Figure 2 This is a schematic diagram of the chip collection box proposed in this invention; Figure 3 This is a schematic diagram of the base structure in this invention; Figure 4 This is a schematic diagram of the chip collection assembly in this invention; Figure 5 This is a schematic diagram of the structure of the drawer plate and the chip collection bag in this invention; Figure 6 This is a schematic diagram of the recycling device proposed in this invention. Figure 1 ; Figure 7 This is a schematic diagram of the structure of the recycling device proposed in this invention. Figure 2 ; Figure 8 This is a rear view of the control method proposed in this invention; Figure 9 This is a schematic diagram of the fluid dynamics simulation analysis in this invention.

[0018] Legend: 1. Housing; 2. Door; 3. Chip inlet; 4. Interface; 5. Vacuum pump; 6. Chip collection bag; 7. Buckle; 8. Draw plate; 9. Through hole; 10. Base; 11. Washer; 12. Machine tool; 13. Partition; 14. Chip collection port; 15. Photoelectric sensor; 16. Pneumatic nozzle. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Reference Figures 1-5 An embodiment of the present invention provides a chip collection box, comprising: a box body 1; a door 2 hinged to the box body 1 to form a cavity, and a chip collection assembly disposed inside the cavity; a chip inlet 3 disposed on the box body 1, which is connected to the chip collection assembly; and an interface 4 connected to a vacuum pump 5 on the box body 1, wherein the vacuum pump 5 creates a negative pressure inside the cavity, allowing the chips to enter the inside of the chip collection assembly through the chip inlet 3.

[0021] In this embodiment, chips are collected by a chip collection assembly inside the chip collection box. The box body 1 and the door 2 are hinged, allowing for flexible opening and closing. When the door 2 is closed, the cavity forms a sealed space, ensuring a stable negative pressure environment. After opening, the chip collection bag 6 of the chip collection assembly is replaced. The box body 1 is connected to a vacuum pump 5 via interface 4. The vacuum pump 5 operates to extract air from the cavity, creating a negative pressure inside the box body 1, drawing external chips into the chip collection assembly. This effectively captures particulate dust. The pull plate 8 allows workers to seal and pack the chip collection bag 6 without touching the chips, effectively avoiding contact with some harmful substances.

[0022] The chip collection assembly includes: a chip collection bag 6; a buckle 7 is provided above the chip collection bag 6, and the buckle 7 is installed on the inner wall above the housing 1.

[0023] In this embodiment, the chip collection bag 6 is a nano-sized mesh bag that intercepts and collects fine chips and dust; the buckle 7 is installed in the middle of the inner wall above the housing 1 by bolts, serving as the mounting base for the chip collection bag 6, and is threadedly connected to the chip inlet 3 to achieve alignment between the chip inlet 3 and the opening of the chip collection bag 6.

[0024] The chip inlet 3 extends into the inner side of the housing 1 and is connected to the buckle 7 by threads.

[0025] In this embodiment, the chip inlet 3 is the channel for chips to enter the cavity, penetrating the housing 1 and extending into the inner side of the cavity. The chip inlet 3 is provided with external threads and connected to the buckle 7. The connection has strong sealing performance and will not leak air under negative pressure, while also being easy to disassemble and assemble.

[0026] A drawer plate 8 is provided on one side of the buckle 7. A through hole 9 is provided on the drawer plate 8, and the through hole 9 is connected to the opening of the chip collection bag 6.

[0027] In this embodiment, the drawer plate 8 is slidably inserted into one side of the buckle 7. The drawer plate 8 is provided with a through hole 9, which is aligned with the opening of the chip collection bag 6, so that the chips adsorbed by negative pressure fall into the chip collection bag 6.

[0028] The housing 1 and the vacuum pump 5 are bolted together and mounted on the base 10, which is a stepped plate. A washer 11 is provided between the vacuum pump 5 and the base 10.

[0029] In this embodiment, the base 10 is formed by bending Q235 steel sheet metal or by welding multiple plates. The gasket 11 below the vacuum pump 5 is welded to the base 10, which plays a role in shock absorption, buffering and noise reduction, and prevents vibration from being transmitted to the housing 1 and causing the pipeline to loosen.

[0030] A hole is drilled in the base 10 using a drill bit to install the vacuum pump 5. The housing 1 and the door 2 are both made of Q235 steel sheet metal, bent and welded by argon arc welding. The negative pressure interface 4 of the vacuum pump 5 uses a standard diverter tube and is welded to the housing 1 by argon arc welding. The chip inlet 3 and the buckle 7 are both made by injection molding and the threaded holes are tapped. The chip collection bag 6 and the draw plate 8 are fixed with adhesive.

[0031] Reference Figures 6-7 The device also includes a chip recovery device, which is equipped with a chip collection box according to any of the above technical solutions, including: a machine tool 12; an upper cavity and a lower cavity are formed on the inner side of the machine tool 12 through a partition 13; a base 10 is provided in the lower cavity, and a chip collection box is provided on the base 10; at least one pneumatic nozzle 16 is provided in the upper cavity of the machine tool 12, and a chip collection port 14 is provided on the partition 13, which is connected to the chip inlet 3 of the chip collection box through a pipeline.

[0032] In this embodiment, the machine tool 12 is divided into an upper cavity and a lower cavity by a partition 13 to prevent large chips from falling directly. A chip collection port 14 is provided on the partition 13, which is connected to the chip inlet 3 of the chip collection box through a pipeline, so as to transport the chips downward to the chip collection bag 6. A pneumatic nozzle 16 is set in the upper cavity to blow away small chips that are electrostatically adsorbed or remain in dead corners through pulsed airflow, combined with negative pressure for secondary cleaning.

[0033] Multiple photoelectric sensors 15 are installed on the inner side of the upper cavity.

[0034] In this embodiment, multiple photoelectric sensors 15 are arranged inside the upper cavity to perform online monitoring and real-time identification of chip distribution, suspension state, residual amount, etc., and to collect chip projection data. Reference Figure 8 It also includes a chip recycling control method, which is applicable to the chip collection box and recycling device in any of the above technical solutions, including: S1. Obtain machining parameter data and determine chip projection data based on the machining parameter data; S2. Control the vacuum pump to adjust the air volume and negative pressure adsorption according to the chip projection data, and monitor the chip projection data through the photoelectric sensor to provide feedback and adjust the processing parameters. S3. Detect the presence of residual chips using a photoelectric sensor. If present, activate the pneumatic nozzle and negative pressure pump for secondary cleaning. If not, replace the chip collection bag using a pull plate.

[0035] In this embodiment, machine tool processing parameter data is acquired in real time, and the corresponding morphological coefficient and area compensation value are retrieved in combination with the workpiece material type. The chip projection data is then substituted into the correlation model to calculate the chip projection data. The photoelectric sensor continuously collects the actual chip projection data, controls the vacuum pump negative pressure and air volume, and adapts to the changes in chip morphology during processing in real time to ensure that the chips are completely recovered the moment they are generated. The photoelectric sensor also detects whether there are chip residues. If so, the pneumatic nozzle and vacuum pump are started simultaneously to perform secondary cleaning through high-pressure airflow purging and negative pressure adsorption, so that the chips that are difficult to recover and easy to adsorb are recovered again. If not, the box door is opened, the sliding plate moves the chip collection bag out of the buckle, and a new sliding plate and chip collection bag are replaced.

[0036] To address the unique cutting pattern evolution of lightweight alloy materials, a multi-dimensional mapping algorithm was used to perceive fluctuations in machining parameter data in real time. Experiments showed that when some machining parameter data changed, the chip area would change accordingly.

[0037] Determining chip projection data based on machining parameter data includes: Construct a correlation model between machining parameter data and chip projection data: Chip projection data is represented as the sum of the product of the shape coefficient and the machining parameter data and the area compensation value, where the shape coefficient and the area compensation value are determined based on the material type.

[0038] In this embodiment, the association model is: ; The detected chip projection data is expressed as the projected area of ​​a single chip. This is the shape factor of the material, such as 1.5 for common lightweight alloys, and 1.2 for titanium alloys. , These are machining parameter data, specifically the radial depth of cut and axial width of cut, respectively. The feed per tooth. The area compensation value is given according to the different properties of the material. Aluminum alloy has high toughness, and its long strip-like tendency will also cause the projected area to remain at a high level. Therefore, the value is set to 1.6. Titanium alloy chips have obvious serrations and are easily broken. The initial fragments formed are small. Therefore, its inherent base area is small. The value is set to 0.9.

[0039] Large-scale orthogonal milling experiments were conducted on lightweight alloy materials such as aluminum and titanium alloys to determine the influence of machining parameters on chip geometry evolution characteristics. The results showed that during milling, the macroscopic projected area of ​​a single chip mainly depends on the dynamic combination of cutting layer parameters. Specifically, the radial depth of cut... and axial width The instantaneous cross-sectional area of ​​the generated chips is directly determined, and it is the most significant key factor affecting the force boundary and projected area of ​​the chips within the air duct. Furthermore, acquire real-time detected chip projection data. Then, through a preset flow field matching algorithm, dynamic commands are sent to control the vacuum pump frequency converter to adjust the output frequency, achieving millisecond-level response and adjusting the negative pressure value of the air duct. This ensures that wide strip-shaped chips can maintain smooth suspension and transmission within complex bends in the pipe, thereby achieving on-demand control of the negative pressure environment within the air duct. Figure 9 As shown, fluid dynamics simulation analysis of the flow channel within the upper cavity using ANSYS Fluent software reveals that optimized layout of the housing structure and the location of the negative pressure interface 4 results in an efficient and directional flow trajectory. The simulated flow field trace diagram clearly demonstrates that, under the adaptive airflow control strategy, the high-speed airflow can completely envelop chips with different mass flow rates, effectively eliminating vortex stagnation in dead corners within the upper cavity. This ensures stable and continuous chip transport from the chip collection port to the nanoscale chip collection bag, thereby achieving a high standard of clean production in complex processing environments.

[0040] It should be noted that, through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the prior art, can be embodied in the form of software products. These computer software products can be stored in computer-readable storage media, such as ROM / RAM, magnetic disks, optical disks, etc., and include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform the methods described in the various embodiments or certain portions of the embodiments. In this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip collection box, characterized in that, include: Box (1); A door (2) is hinged to the box body (1) to form a cavity, and a chip collection assembly is provided inside the cavity. The housing (1) is provided with a chip inlet (3), which is connected to the chip collection assembly; The housing (1) is connected to a vacuum pump (5) via an interface (4). The vacuum pump (5) creates a negative pressure inside the cavity, allowing the chips to enter the inside of the chip collection assembly through the chip inlet (3).

2. The chip collection box according to claim 1, characterized in that: The chip collection assembly includes: a chip collection bag (6); a buckle (7) is provided on the top of the chip collection bag (6), and the buckle (7) is installed on the inner wall above the box (1).

3. The chip collection box according to claim 2, characterized in that: The chip inlet (3) extends into the inner side of the housing (1) and is connected to the buckle (7) by a thread.

4. The chip collection box according to claim 2, characterized in that: A drawer plate (8) is provided on one side of the buckle (7), and a through hole (9) is provided on the drawer plate (8), which is connected to the opening of the chip collection bag (6).

5. The chip collection box according to claim 1, characterized in that: The housing (1) and the vacuum pump (5) are bolted together on the base (10), which is a stepped plate.

6. The chip collection box according to claim 5, characterized in that: A gasket (11) is provided between the vacuum pump (5) and the base (10).

7. A chip recycling device, characterized in that, The chip recovery device is equipped with a chip collection box as described in any one of claims 1-6, comprising: Machine tools (12); The inner side of the machine tool (12) is formed by a partition (13) to form an upper cavity and a lower cavity; A base (10) is provided in the lower cavity, and a chip collection box is provided on the base (10); At least one pneumatic nozzle is provided in the upper cavity of the machine tool (12), and a chip collection port (14) is provided on the partition plate (13). The chip collection port (14) is connected to the chip inlet (3) of the chip collection box through a pipeline.

8. The recycling device according to claim 7, characterized in that: Multiple photoelectric sensors (15) are provided on the inner side of the upper cavity.

9. A chip recycling control method, characterized in that, The control method is applicable to the chip collection box of any one of claims 1-6 and the recycling device of any one of claims 7-8, comprising: Acquire machining parameter data, and determine chip projection data based on the machining parameter data; The vacuum pump is controlled to adjust the airflow and perform negative pressure adsorption based on the chip projection data. The chip projection data is monitored by a photoelectric sensor, and the processing parameters are adjusted accordingly. The photoelectric sensor detects whether there are residual chips. If so, the pneumatic nozzle and the negative pressure pump are activated for secondary cleaning. If not, the chip collection bag is replaced by a pull plate.

10. The control method according to claim 9, characterized in that: Determining the chip projection data based on the processing parameter data includes: Construct a correlation model between the machining parameter data and the chip projection data: The chip projection data is represented as the sum of the product of the shape coefficient and the processing parameter data and the area compensation value, wherein the shape coefficient and the area compensation value are determined based on the material type.

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