Cradle type five-axis machining ion beam polishing equipment and working method thereof

Abstract

The application discloses a cradle type five-axis machining ion beam polishing equipment and a working method thereof. The polishing equipment comprises an equipment cavity, a vacuum system, a workpiece motion system, an ion source, an ion source motion system and a control system. The workpiece motion system comprises an X-axis linear motion module, a B-axis rotation module and a C-axis rotation module. The ion source motion system comprises a Y-axis linear motion module and a Z-axis linear motion module. The control system is used for coordinately controlling the X-axis linear motion module, the B-axis rotation module, the C-axis rotation module, the Y-axis linear motion module and the Z-axis linear motion module linkage. The polishing machining of the workpiece is realized by adjusting the workpiece posture and the position of the ion source. The five-axis linkage effectively eliminates the machining blind area existing in the traditional three-axis equipment, and is especially suitable for high-precision polishing machining of various plane, spherical surface, aspherical surface, concave-convex curved surface and small-size optical elements.

Description

Technical Field

[0001] This invention belongs to the field of precision machining technology for optical components, specifically relating to a cradle-type five-axis machining ion beam polishing device and its working method. Background Technology

[0002] Ion beam polishing (IBF) utilizes the physical sputtering effect of high-energy ion beams to perform deterministic removal and reshaping of the surface of optical components. It has outstanding advantages such as no contact stress, stable material removal, and sub-nanometer surface accuracy, and is one of the core processing methods for high-precision optical systems.

[0003] Currently, most mainstream ion beam processing equipment adopts a three-axis linkage structure, which generally suffers from the following technical limitations: (1) Insufficient processing adaptability: The three-axis structure can only realize the linear translation of the workpiece or ion source in three-dimensional space. It cannot actively adjust the incident angle of the ion beam relative to the workpiece surface. The processing capability of large curvature concave and convex mirrors and complex irregular optical elements is limited, and there is a significant processing blind spot. (2) Weak workpiece posture adjustment capability: The workpiece table of traditional three-axis equipment only supports translation and cannot realize multi-angle posture adjustment of the workpiece. For workpieces that need to be processed from multiple angles, frequent re-clamping is required, which introduces clamping error. (3) It is difficult to guarantee the processing accuracy of small workpieces: Conventional ion beam equipment has a large beam spot size (usually several millimeters to tens of millimeters), which cannot meet the precision processing requirements of small optical components (such as small aperture lenses, optical microstructures, etc.).

[0004] Therefore, there is an urgent need for an ion beam polishing device that separates the multi-axis motion of the workpiece from the motion of the ion source. Summary of the Invention

[0005] The purpose of this invention is to provide a cradle-type five-axis ion beam polishing device and its working method to solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A cradle-type five-axis ion beam polishing device includes: Equipment cavity; A vacuum system, connected to the equipment cavity, is used to evacuate the equipment cavity to provide the vacuum environment required for processing; A workpiece motion system includes an X-axis linear motion module, a B-axis rotation module, and a C-axis rotation module. The output end of the C-axis rotation module is provided with a C-axis extending along the X-axis direction. The C-axis is used to connect to the workpiece, and the C-axis rotation module is used to drive the workpiece to rotate around the C-axis axis. The output end of the B-axis rotation module is provided with a B-axis extending along the Y-axis direction. The B-axis is connected to the C-axis rotation module, and the B-axis rotation module is used to drive the C-axis rotation module and the workpiece to rotate together around the B-axis axis. The output end of the X-axis linear motion module is connected to the B-axis rotation module, and the X-axis linear motion module is used to drive the B-axis rotation module, the C-axis rotation module, and the workpiece to move linearly along the X-axis direction. An ion source, located inside the equipment cavity, is used to emit an ion beam to polish the workpiece. An ion source motion system includes a Y-axis linear motion module and a Z-axis linear motion module. The output end of the Z-axis linear motion module is connected to the ion source, and the Z-axis linear motion module is used to drive the ion source to move linearly along the Z-axis direction. The output end of the Y-axis linear motion module is connected to the Z-axis linear motion module, and the Y-axis linear motion module is used to drive the Z-axis linear motion module and the ion source to move linearly together along the Y-axis direction. The control system coordinates the X-axis linear motion module, B-axis rotary module, C-axis rotary module, Y-axis linear motion module, and Z-axis linear motion module to achieve polishing of the workpiece by adjusting the workpiece posture and the position of the ion source.

[0007] As an optional implementation of the above technical solution, the B-axis rotation module drives the workpiece to rotate around the B-axis axis in an angle range of ±90° to achieve the pitch angle adjustment of the workpiece; the C-axis rotation module drives the workpiece to rotate around the C-axis axis in an angle range of 0-360° to achieve continuous orientation and rotation processing of the workpiece's azimuth angle.

[0008] As an optional implementation of the above technical solution, it also includes a beam detection device, which is located near the ion source and is used to collect the beam parameters of the ion beam and transmit them to the control system.

[0009] As an optional implementation of the above technical solution, the beam detection device is a Faraday cup.

[0010] As an optional implementation of the above technical solution, it also includes a probe, which is used to acquire the position and shape information of the workpiece and feed the position and shape information of the workpiece back to the control system in real time; the control system calculates the normal vector at each processing point of the workpiece based on the probe's detection data, generates the X-axis, B-axis and C-axis motion trajectories of the workpiece and the Y-axis and Z-axis position sequences of the ion source, and coordinates the X-axis linear motion module, B-axis rotation module, C-axis rotation module, Y-axis linear motion module and Z-axis linear motion module to make the ion beam incident along the normal direction of the workpiece surface and maintain a constant processing distance to perform scanning and polishing processing on the workpiece.

[0011] As an optional implementation of the above technical solution, the beam spot diameter of the ion source is less than 0.5 mm.

[0012] As an optional implementation of the above technical solution, the X-axis linear motion module, Y-axis linear motion module and Z-axis linear motion module all use linear guides and lead screw transmission mechanisms in conjunction with servo motors or linear motors to achieve linear motion; the B-axis rotation module and C-axis rotation module both use direct drive motors to achieve rotational motion.

[0013] As an optional implementation of the above technical solution, it also includes a workpiece fixture, which is mounted on the C-axis and is used to detachably fix the workpiece. The workpiece fixture is provided with a quick-change structure.

[0014] On the other hand, the present invention adopts the following technical solution: a working method of a cradle-type five-axis processing ion beam polishing device, comprising the following steps: Fix the workpiece onto the C-axis rotating module and start the vacuum system to bring the equipment cavity to the preset vacuum level. Perform in-situ scanning of the workpiece, establish a workpiece coordinate system, and obtain the workpiece's position and shape information; Based on the position and shape information of the workpiece, the axial motion at each processing point of the workpiece is calculated, and the X-axis, B-axis and C-axis motion trajectories of the workpiece and the Y-axis and Z-axis position sequences of the ion source are generated so that the ion beam is incident along the normal of the workpiece surface and the processing distance is kept constant. The ion source is activated, and based on the X-axis, B-axis, and C-axis motion trajectories of the workpiece and the Y-axis and Z-axis position sequences of the ion source, the X-axis linear motion module, B-axis rotation module, C-axis rotation module, Y-axis linear motion module, and Z-axis linear motion module are coordinated and controlled to perform scanning and polishing on the workpiece. After polishing, the workpiece is removed for surface shape inspection, and the inspection results are used to assess whether to proceed to the next round of iterative processing.

[0015] As an optional implementation of the above technical solution, during the scanning polishing process, the beam current parameters of the ion beam are collected in real time. When the beam current parameters deviate from the preset range, the working parameters of the ion source are adjusted or an alarm signal is issued. The position and morphology information of the workpiece are periodically detected, and the workpiece coordinate system is corrected in real time according to the detection results to compensate for the position drift caused by thermal deformation or vibration.

[0016] The beneficial effects of this invention are as follows: 1. By setting up a workpiece motion system including an X-axis linear motion module, a B-axis rotary module, and a C-axis rotary module, and an ion source motion system including a Y-axis linear motion module and a Z-axis linear motion module, and arranging the X-axis linear motion module, the B-axis rotary module, and the C-axis rotary module in a cradle-like structure on the workpiece side, and arranging the Y-axis and Z-axis linear motion modules on the ion source side, the five-axis linkage realizes flexible adjustment of workpiece posture and independent motion control of ion source position, effectively eliminating the processing blind spots existing in traditional three-axis equipment, and is especially suitable for high-precision polishing of various planes, spheres, aspherical surfaces, concave and convex surfaces, and micro-sized optical components.

[0017] 2. The B-axis rotary module drives the workpiece to rotate around the B-axis within an angle range of ±90°, while the C-axis rotary module drives it to rotate around the C-axis within an angle range of 0-360°. The wide angle range of the two rotary axes allows the workpiece to face the ion source in any orientation, enabling continuous machining of the workpiece from multiple angles. For complex curved workpieces requiring machining from different directions, the entire machining area can be processed in a single setup, eliminating the need for frequent re-clamping and avoiding positioning errors introduced by multiple clamping operations, thus improving machining accuracy and efficiency.

[0018] 3. The beam spot diameter of the ion source is less than 0.5 mm. This small beam spot size enables the equipment to perform high-resolution local shaping and polishing of tiny optical components, expanding the application capabilities of ion beam polishing technology in the field of micro-optical component processing. Simultaneously, the small beam spot, combined with five-axis linkage and large-angle attitude adjustment, makes the equipment suitable for both surface correction of large-aperture optical components and precision machining of small-aperture, complex-shaped components, demonstrating excellent processing adaptability.

[0019] 4. The beam current detection device is located near the ion source, enabling real-time acquisition and monitoring of beam current parameters. The control system can adjust the ion source operating parameters or issue alarms in a timely manner based on the real-time feedback of beam current parameters, ensuring the stability of the ion beam state and the repeatability of the processing results during the polishing process, and avoiding changes in removal rate and surface shape errors caused by beam current fluctuations.

[0020] 5. The probe can perform in-situ scanning and detection of the workpiece, acquiring its position and shape information and feeding it back to the control system in real time. Before machining, the probe is used to establish the workpiece coordinate system and generate the machining trajectory; during machining, the probe periodically detects the workpiece position, and the control system corrects the workpiece coordinate system in real time accordingly, compensating for positioning deviations caused by factors such as thermal drift and mechanical deformation, improving the positional accuracy and machining stability during long-term machining, and reducing the frequency and additional errors of offline detection. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the cradle-type five-axis machining ion beam polishing equipment from one perspective in one embodiment of the present invention; Figure 2 This is a schematic diagram of the cradle-type five-axis machining ion beam polishing equipment from another perspective in one embodiment of the present invention; Figure 3 This is a schematic diagram of the workpiece motion system and the ion source motion system in one embodiment of the present invention; Figure 4 This is a diagram showing the workpiece installation state in one embodiment of the present invention.

[0022] In the diagram: 1-Equipment cavity; 2-Vacuum system; 3-Workpiece motion system; 4-Ion source; 5-Ion source motion system; 6-Beam detection device; 7-Probe; 8-Workpiece fixture; 9-Workpiece; 31-X-axis linear motion module; 32-B-axis rotary module; 33-C-axis rotary module; 51-Y-axis linear motion module; 52-Z-axis linear motion module. Detailed Implementation

[0023] like Figures 1-4 As shown, this embodiment provides a cradle-type five-axis ion beam polishing device, including a device cavity 1, a vacuum system 2, a workpiece motion system 3, an ion source 4, an ion source motion system 5, and a control system. The device cavity 1 is a sealed container used to provide the enclosed space required for ion beam processing. The vacuum system 2 is connected to the device cavity 1 (for example, connected to the extraction port on the device cavity 1 via a vacuum pipe) to evacuate the device cavity 1, providing the vacuum environment required for ion beam processing and preventing energy loss due to collisions and scattering of the ion beam with gas molecules during transmission. Specifically, the vacuum system 2 includes components such as a mechanical pump, a molecular pump, and a vacuum gauge. The vacuum system 2 maintains the internal gas pressure of the device cavity 1 at a level below 10⁻³ Pa to meet the vacuum conditions for normal operation of the ion beam.

[0024] like Figure 4As shown, specifically, the workpiece motion system 3 includes an X-axis linear motion module 31, a B-axis rotary module 32, and a C-axis rotary module 33. The output end of the C-axis rotary module 33 has a C-axis extending along the X-axis direction, which is used to connect the workpiece 9. Preferably, the end of the C-axis has a workpiece clamp 8, which is used to detachably fix the workpiece 9. The workpiece clamp 8 has a quick-change structure, allowing workpieces 9 of different specifications to be quickly installed onto the C-axis rotary module 33, shortening the time for clamping and changing the workpiece 9. The C-axis rotary module 33 drives the workpiece 9 to rotate around the C-axis axis. The angle by which the C-axis rotary module 33 drives the workpiece 9 to rotate around the C-axis axis is n×360° (n is a positive integer), thus achieving continuous multi-turn rotation and meeting the requirements for continuous orientation and rotary machining of the workpiece 9.

[0025] The output end of the B-axis rotary module 32 is provided with a B-axis extending along the Y-axis direction. The B-axis is connected to the C-axis rotary module 33, meaning the C-axis rotary module 33 is fixedly mounted on the rotary output end of the B-axis rotary module 32. The B-axis rotary module 32 drives the C-axis rotary module 33 and the workpiece 9 mounted on it to rotate together around the B-axis axis. The angle range of the workpiece 9's rotation around the B-axis axis driven by the B-axis rotary module 32 is ±90°, to achieve the pitch angle adjustment of the workpiece 9. The output end of the X-axis linear motion module 31 is connected to the B-axis rotary module 32, meaning the B-axis rotary module 32 is fixedly mounted on the moving platform of the X-axis linear motion module 31. The X-axis linear motion module 31 drives the B-axis rotary module 32, the C-axis rotary module 33, and the workpiece 9 to move linearly along the X-axis direction. The B-axis rotary module 32 drives the workpiece 9 to pitch, resembling a cradle; therefore, the polishing equipment of this invention is called a cradle-type five-axis structure.

[0026] Ion source 4 is located inside the equipment cavity 1 and is used to emit ion beams to polish workpiece 9. Ion source 4 is connected to a power source outside the equipment cavity 1 via a power cord.

[0027] like Figure 3As shown, specifically, the ion source motion system 5 includes a Y-axis linear motion module 51 and a Z-axis linear motion module 52. The output end of the Z-axis linear motion module 52 is connected to the ion source 4, meaning the ion source 4 is fixedly mounted on the moving platform of the Z-axis linear motion module 52. The Z-axis linear motion module 52 is used to drive the ion source 4 to move linearly along the Z-axis direction. The output end of the Y-axis linear motion module 51 is connected to the Z-axis linear motion module 52, meaning the Z-axis linear motion module 52 is fixedly mounted on the moving platform of the Y-axis linear motion module 51. The Y-axis linear motion module 51 is used to drive the Z-axis linear motion module 52 and the ion source 4 mounted on it to move linearly along the Y-axis direction. The X-axis, Y-axis, and Z-axis are mutually perpendicular, forming a three-dimensional spatial coordinate system. The X-axis linear motion module 31, Y-axis linear motion module 51, and Z-axis linear motion module 52 all employ linear guides and lead screw transmission mechanisms in conjunction with servo motors or linear motors to achieve linear motion. The linear guides ensure the straightness and load-bearing capacity of the movement direction, while the lead screw transmission mechanism converts the rotational motion of the motor into high-precision linear displacement. The B-axis rotary module 32 and C-axis rotary module 33 both employ direct-drive motors (torque motors) to achieve rotary motion. Direct-drive motors have zero backlash, high rigidity, and high dynamic response performance, enabling precise angular positioning.

[0028] The control system is electrically connected to the X-axis linear motion module 31, the B-axis rotation module 32, the C-axis rotation module 33, the Y-axis linear motion module 51, and the Z-axis linear motion module 52, respectively, to coordinate and control the linkage of the five motion axes. By adjusting the posture of the workpiece 9 and the position of the ion source 4 in the Y-axis and Z-axis directions, the ion beam can perform scanning and polishing processing on the workpiece 9.

[0029] To enable real-time monitoring of the ion beam state, the polishing equipment also includes a beam current detection device 6. The beam current detection device 6 is located near the ion source 4 and is used to collect beam current parameters (such as beam current density and beam current uniformity) of the ion beam and transmit them to the control system. As a preferred implementation, the beam current detection device 6 is a Faraday cup. A Faraday cup measures the beam current intensity by collecting the charge in the ion beam, and it features a simple structure and accurate measurement.

[0030] like Figure 3As shown, to achieve in-situ position detection and morphology measurement of workpiece 9, the polishing equipment also includes a probe 7. The probe 7 is mounted on the movable end of the Z-axis linear motion module 52. The probe 7 is used to acquire the position and morphology information of workpiece 9 and feed this information back to the control system in real time. Based on the detection data from the probe 7, the control system calculates the normal vector at each processing point of workpiece 9, generates the X-axis, B-axis, and C-axis motion trajectories of workpiece 9 and the Y-axis and Z-axis position sequences of the ion source 4, and coordinates the operation of the X-axis linear motion module 31, B-axis rotation module 32, C-axis rotation module 33, Y-axis linear motion module 51, and Z-axis linear motion module 52 to ensure that the ion beam is incident along the normal direction of the workpiece 9 surface and maintains a constant processing distance, thus performing scanning polishing on workpiece 9.

[0031] In one specific embodiment, the beam spot diameter of the ion source 4 is less than 0.5 mm, meaning that the diameter of the area where the ion beam acts on the surface of the workpiece 9 is less than 0.5 mm. The small beam spot size enables the equipment to perform localized fine shaping on tiny optical elements, and is also suitable for high-resolution deterministic processing on large optical elements, thus broadening the application range of the polishing equipment.

[0032] The present invention also provides a working method for a cradle-type five-axis ion beam polishing device, comprising the following steps: Step 1: Fix the workpiece 9 onto the C-axis rotating module 33 using the workpiece clamp 8, and start the vacuum system 2 to make the equipment cavity 1 reach the preset vacuum level; Step 2: Perform in-situ scanning of workpiece 9 using probe 7 to establish a workpiece coordinate system and obtain the position and shape information of workpiece 9; Step 3: The control system calculates the axial motion at each processing point of workpiece 9 based on the position and shape information of workpiece 9, and generates the X-axis, B-axis and C-axis motion trajectories of workpiece 9 and the Y-axis and Z-axis position sequences of ion source 4, so that the ion beam is incident along the normal of the surface of workpiece 9 and the processing distance is kept constant. Step 4: Start the ion source 4. Based on the X-axis, B-axis, and C-axis motion trajectories of the workpiece 9 and the Y-axis and Z-axis position sequences of the ion source 4, coordinate and control the X-axis linear motion module 31, B-axis rotation module 32, C-axis rotation module 33, Y-axis linear motion module 51, and Z-axis linear motion module 52 to perform scanning and polishing on the workpiece 9. During the scanning and polishing process, the beam current parameters of the ion beam are collected in real time. When the beam current parameters deviate from the preset range, the working parameters of the ion source 4 are adjusted or an alarm signal is issued. At the same time, the probe 7 periodically detects the position and morphology information of the workpiece 9 during the polishing process. The control system corrects the workpiece coordinate system in real time based on the detection results to compensate for position drift caused by thermal deformation or vibration, so as to ensure the accuracy of the workpiece 9 positioning during the processing. Step 5: After polishing, turn off ion source 4. Once the equipment chamber 1 returns to normal pressure, remove workpiece 9 for surface shape inspection. Based on the inspection results, evaluate whether to proceed to the next round of iterative processing. If the accuracy of workpiece 9 does not meet the requirements, the next round of processing can be carried out until the accuracy of workpiece 9 meets the specifications.

[0033] When processing a spherical concave mirror, the C-axis rotary module 33 drives the workpiece 9 to rotate continuously to form a rotary motion, while the X-axis linear motion module 31 drives the workpiece 9 to feed radially, realizing a spiral scanning trajectory. The B-axis rotary module 32 adjusts the pitch angle of the workpiece 9 in real time according to the curvature mathematical model of the workpiece 9, so that the normal of the processing point always points to the ion source 4. In conjunction with the Z-axis linear motion module 52, the processing distance is adjusted synchronously to ensure that the ion beam is incident normally within the full aperture and the processing distance is constant, thereby ensuring the stability of the material removal function and obtaining excellent surface convergence effect.

[0034] For localized reshaping of minute optical components, ion source 4 employs a special small beam spot design with a beam spot diameter less than 0.5 mm, comparable to the size of workpiece 9, enabling precise localized removal. During polishing, probe 7 first performs a full in-situ scan of workpiece 9, establishing a workpiece coordinate system and acquiring a high-resolution surface shape error map of workpiece 9. Based on the position and shape information of workpiece 9, the control system generates the X-axis, B-axis, and C-axis motion trajectories of workpiece 9 and the Y-axis and Z-axis position sequences of ion source 4, and calculates the axial motion at each processing point to ensure that the ion beam is incident along the normal direction of workpiece 9 and the processing distance is constant. Small-step helical scanning is achieved through precise X-axis feed and continuous C-axis rotation, while the B-axis maintains a suitable pitch posture for workpiece 9 to adapt to its curved surface, and the Y-axis and Z-axis maintain the processing distance between ion source 4 and workpiece 9. After starting ion source 4, the control system coordinates the five-axis linkage to scan and polish workpiece 9, with beam current detection device 6 monitoring the beam current throughout the process to ensure a stable removal rate. After processing, probe 7 scans workpiece 9 again, comparing the data with the initial data to evaluate the improvement in surface shape and guide the next round of iterative processing. During the scanning and polishing process, the control system collects the beam parameters of the beam detection device 6 in real time. When the beam parameters deviate from the preset range, the operating parameters of the ion source 4 are automatically adjusted or an alarm signal is issued. At the same time, probe 7 periodically detects the position and morphology information of workpiece 9, and the control system corrects the workpiece coordinate system in real time based on the detection results to compensate for position drift caused by thermal deformation or vibration.

[0035] For large-curvature aspherical optical elements, the rotation range of the B-axis (±90°) ensures that the workpiece 9 can be tilted to the required pitch angle at the maximum curvature. Combined with the continuous rotation of the C-axis and the radial feed of the X-axis, full-aperture blind-zone-free scanning processing is achieved. In the ion source motion system 5, the Z-axis compensates for the height in real time according to the sag changes at each ring of the aspherical surface, and the Y-axis adjusts the lateral position of the ion source 4. The linkage between the two keeps the processing distance constant during full-aperture scanning, effectively avoiding the removal function drift problem caused by changes in processing distance.

[0036] Compared with existing technologies, the cradle-type five-axis ion beam polishing equipment provided by this invention has the following advantages: 1. By setting up a workpiece motion system 3 including an X-axis linear motion module 31, a B-axis rotation module 32, and a C-axis rotation module 33, and an ion source motion system 5 including a Y-axis linear motion module 51 and a Z-axis linear motion module 52, and arranging the X-axis linear motion module 31, the B-axis rotation module 32, and the C-axis rotation module 33 in a cradle-like structure on the side of the workpiece 9, and arranging the Y-axis and Z-axis linear motion modules 52 on the side of the ion source 4, the flexible adjustment of the workpiece 9's posture and the independent motion control of the ion source 4's position are realized through five-axis linkage, effectively eliminating the processing blind spots existing in traditional three-axis equipment, and is especially suitable for high-precision polishing of various planes, spheres, aspherical surfaces, concave and convex surfaces, and micro-sized optical components.

[0037] 2. The B-axis rotation module 32 drives the workpiece 9 to rotate around the B-axis within an angle range of ±90°, while the C-axis rotation module 33 drives the workpiece 9 to rotate around the C-axis within an angle range of 0-360°. The large angle range of the two rotation axes allows the workpiece 9 to face the ion source 4 in any orientation, enabling continuous processing of the workpiece 9 from multiple angles. For complex curved surface workpieces 9 that need to be processed from different directions, the entire processing area can be completed in a single clamping, eliminating the need for frequent re-clamping and avoiding positioning errors introduced by multiple clamping, thus improving processing accuracy and efficiency.

[0038] 3. The beam spot diameter of ion source 4 is less than 0.5 mm. This small beam spot size enables the equipment to perform high-resolution local shaping and polishing of tiny optical components, expanding the application capabilities of ion beam polishing technology in the field of micro-optical component processing. Simultaneously, the small beam spot, combined with five-axis linkage and large-angle attitude adjustment, makes the equipment suitable for both surface correction of large-aperture optical components and precision machining of small-aperture, complex-shaped components, demonstrating excellent processing adaptability.

[0039] 4. The beam current detection device 6 is located near the ion source 4, which realizes real-time acquisition and monitoring of beam current parameters. The control system can adjust the working parameters of the ion source 4 or issue an alarm in a timely manner based on the real-time feedback of the beam current parameters, ensuring the stability of the ion beam state and the repeatability of the processing results during the polishing process, and avoiding changes in removal rate and surface shape errors caused by beam current fluctuations.

[0040] 5. Probe 7 can perform in-situ scanning and detection of workpiece 9, acquire the position and shape information of workpiece 9, and feed it back to the control system in real time. Before processing, probe 7 is used to establish the workpiece coordinate system and generate the processing trajectory; during processing, probe 7 periodically detects the position of workpiece 9, and the control system corrects the workpiece coordinate system in real time accordingly, compensating for positioning deviations caused by factors such as thermal drift and mechanical deformation, improving the positional accuracy and processing stability during long-term processing, and reducing the frequency of offline detection and additional errors.

[0041] In the description of this invention, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. They can refer to fixed connections, detachable connections, or integral connections; they can be mechanical or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this invention. Furthermore, the specific features and structures described in the embodiments are included in at least one implementation method. Those skilled in the art can combine features from different implementation methods without contradiction. The scope of protection of this invention is not limited to the specific implementation methods described above. Based on the basic technical concept of this invention, implementation methods that can be conceived by those skilled in the art without creative effort are all within the scope of protection of this invention.

Claims

1. A cradle-type five-axis ion beam polishing device, characterized in that, include: Equipment cavity (1); Vacuum system (2), connected to equipment cavity (1), is used to evacuate equipment cavity (1) to provide the vacuum environment required for processing; The workpiece motion system (3) includes an X-axis linear motion module (31), a B-axis rotation module (32), and a C-axis rotation module (33). The output end of the C-axis rotation module (33) is provided with a C-axis extending along the X-axis direction. The C-axis is used to connect the workpiece (9), and the C-axis rotation module (33) is used to drive the workpiece (9) to rotate around the C-axis axis. The output end of the B-axis rotation module (32) is provided with a B-axis extending along the Y-axis direction. The B-axis is connected to the C-axis rotation module (33), and the B-axis rotation module (32) is used to drive the C-axis rotation module (33) and the workpiece (9) to rotate together around the B-axis axis. The output end of the X-axis linear motion module (31) is connected to the B-axis rotation module (32), and the X-axis linear motion module (31) is used to drive the B-axis rotation module (32), the C-axis rotation module (33), and the workpiece (9) to move linearly along the X-axis direction. An ion source (4) is set inside the equipment cavity (1) and is used to emit an ion beam to polish the workpiece (9); The ion source motion system (5) includes a Y-axis linear motion module (51) and a Z-axis linear motion module (52). The output end of the Z-axis linear motion module (52) is connected to the ion source (4), and the Z-axis linear motion module (52) is used to drive the ion source (4) to move linearly along the Z-axis direction. The output end of the Y-axis linear motion module (51) is connected to the Z-axis linear motion module (52), and the Y-axis linear motion module (51) is used to drive the Z-axis linear motion module (52) and the ion source (4) to move linearly together along the Y-axis direction. The control system is used to coordinate the linkage of the X-axis linear motion module (31), B-axis rotation module (32), C-axis rotation module (33), Y-axis linear motion module (51) and Z-axis linear motion module (52), and to achieve the polishing process of the workpiece (9) by adjusting the posture of the workpiece (9) and the position of the ion source (4).

2. The cradle-type five-axis ion beam polishing equipment according to claim 1, characterized in that, The B-axis rotation module (32) drives the workpiece (9) to rotate around the B-axis in an angle range of ±90° to achieve the pitch angle adjustment of the workpiece (9); the C-axis rotation module (33) drives the workpiece (9) to rotate around the C-axis in an angle range of 0-360° to achieve the azimuth angle continuous orientation and rotation processing of the workpiece (9).

3. The cradle-type five-axis ion beam polishing equipment according to claim 1, characterized in that, It also includes a beam detection device (6), which is located near the ion source (4) and is used to collect the beam parameters of the ion beam and transmit them to the control system.

4. The cradle-type five-axis ion beam polishing equipment according to claim 3, characterized in that, The beam detection device (6) is a Faraday cup.

5. The cradle-type five-axis ion beam polishing equipment according to claim 1, characterized in that, It also includes a probe (7), which is used to acquire the position and shape information of the workpiece (9) and feed back the position and shape information of the workpiece (9) to the control system in real time. The control system calculates the normal vector at each processing point of the workpiece (9) based on the detection data of the probe (7), generates the X-axis, B-axis and C-axis motion trajectories of the workpiece (9) and the Y-axis and Z-axis position sequences of the ion source (4), and coordinates the control of the X-axis linear motion module (31), B-axis rotation module (32), C-axis rotation module (33), Y-axis linear motion module (51) and Z-axis linear motion module (52) to make the ion beam incident along the normal direction of the surface of the workpiece (9) and maintain a constant processing distance to perform scanning and polishing processing on the workpiece (9).

6. The cradle-type five-axis machining ion beam polishing equipment according to claim 1, characterized in that, The beam spot diameter of the ion source (4) is less than 0.5 mm.

7. The cradle-type five-axis ion beam polishing equipment according to claim 1, characterized in that, The X-axis linear motion module (31), Y-axis linear motion module (51) and Z-axis linear motion module (52) all use linear guides and lead screw transmission mechanisms in conjunction with servo motors or linear motors to achieve linear motion; the B-axis rotation module (32) and C-axis rotation module (33) both use direct drive motors to achieve rotational motion.

8. The cradle-type five-axis machining ion beam polishing equipment according to claim 1, characterized in that, It also includes a workpiece fixture (8), which is mounted on the C-axis and is used to detachably fix the workpiece (9). The workpiece fixture (8) is provided with a quick-change structure.

9. A method of operating the cradle-type five-axis machining ion beam polishing equipment as described in any one of claims 1-8, characterized in that, Includes the following steps: Fix the workpiece (9) on the C-axis rotating module (33) and start the vacuum system (2) to make the equipment cavity (1) reach the preset vacuum level; Perform in-situ scanning on the workpiece (9), establish the workpiece coordinate system, and obtain the position and shape information of the workpiece (9); Based on the position and shape information of the workpiece (9), the axial motion amount at each processing point of the workpiece (9) is calculated, and the X-axis, B-axis and C-axis motion trajectories of the workpiece (9) and the Y-axis and Z-axis position sequences of the ion source (4) are generated so that the ion beam is incident along the normal direction of the surface of the workpiece (9) and the processing distance is kept constant. The ion source (4) is started. Based on the X-axis, B-axis and C-axis motion trajectories of the workpiece (9) and the Y-axis and Z-axis position sequence of the ion source (4), the X-axis linear motion module (31), B-axis rotation module (32), C-axis rotation module (33), Y-axis linear motion module (51) and Z-axis linear motion module (52) are coordinated and controlled to perform scanning and polishing on the workpiece (9). After polishing, the workpiece (9) is removed for surface shape inspection, and the inspection results are used to evaluate whether to proceed with the next round of iterative processing.

10. The working method of the cradle-type five-axis machining ion beam polishing equipment according to claim 9, characterized in that, During the scanning polishing process, the beam current parameters of the ion beam are collected in real time. When the beam current parameters deviate from the preset range, the working parameters of the ion source (4) are adjusted or an alarm signal is issued. The position and morphology information of the workpiece (9) are periodically detected, and the workpiece coordinate system is corrected in real time according to the detection results to compensate for the position drift caused by thermal deformation or vibration.

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