A multi-dimensional ion beam processing apparatus and a working method thereof

Abstract

The application discloses a multi-dimension ion beam processing equipment and a working method thereof. The processing equipment comprises a main chamber, a secondary chamber, a combined transport device, an ion source system, a motion shaft system and a control system. The combined transport device comprises an upright transport assembly and an inverted transport assembly. The ion source system comprises an ion source, a first rotating device and a second rotating device. The second rotating device is used for adjusting the beam direction of the ion source. The motion shaft system is used for driving the ion source system to move in the main chamber, so as to adjust the position of the ion source. The control system is used for controlling the transport of the optical element and adjusting the beam direction and the position of the ion source, so as to realize the switching of multiple processing modes. The application integrates the two transport assemblies in the same equipment, realizes the compatibility of the two clamping modes of the upright posture and the inverted posture of the optical element in the same equipment, greatly improves the universality of the equipment and reduces the investment cost of the equipment.

Description

Technical Field

[0001] This invention belongs to the field of precision machining technology for optical components, specifically relating to a multi-dimensional ion beam processing device and its working method. Background Technology

[0002] Ion beam polishing (IBF) is a non-contact precision machining method for optical components. It achieves high-precision material removal by bombarding the surface of the optical component with an accelerated ion beam, thus meeting the requirements for nanometer-level surface accuracy. This technology plays an irreplaceable role in fields such as large telescope mirrors, high-power laser optical components, and semiconductor lithography lenses.

[0003] In existing technologies, ion beam processing equipment typically employs one of the following two processing methods: The first method involves inverted clamping of the component, transporting it from the secondary chamber to the main chamber, with the ion source positioned below the component, and processing proceeding from bottom to top. This method requires a specialized mechanism for inverted clamping, making the clamping process complex. It demands high reliability for large, heavy components, and the inverted state makes the component susceptible to deformation due to gravity, affecting processing accuracy. Furthermore, inverted clamping is only suitable for specific types of components (such as plane mirrors and concave mirrors with small curvature), and has poor adaptability for processing convex mirrors or components with large curvature.

[0004] The second method involves vertically clamping the component and using a transport device to horizontally convey it to the main chamber. The ion source is located on the side of the component (e.g., the right side), and the component is processed from the side (e.g., from right to left). While this method avoids the problems associated with inverted clamping, it offers only one processing direction, allowing for ion beam incidence in only one direction. This method is unsuitable for components requiring multi-angle processing (e.g., different zones of a spherical mirror, or local shaping of aspherical components).

[0005] The two existing technical solutions mentioned above share the following drawbacks: (1) Poor equipment versatility: Different clamping methods and equipment configurations are required for different specifications and types of components, which makes the processing equipment unusable and increases the cost of equipment investment.

[0006] (2) Limited processing dimensions: The ion source installation method in traditional equipment is fixed, and only ion beam incidence in a single direction can be achieved. It is impossible to flexibly switch between vertical processing, horizontal processing and side processing in one processing station, which means that the processing of some complex surface components requires multiple equipment to work together, reducing processing efficiency.

[0007] Therefore, there is an urgent need for a polishing equipment that can achieve multi-directional ion beam processing. Summary of the Invention

[0008] The purpose of this invention is to provide a multi-dimensional ion beam processing device and its working method to solve the above-mentioned problems existing in the prior art.

[0009] To achieve the above objectives, in one respect, the present invention adopts the following technical solution: a multi-dimensional ion beam processing device, comprising: main chamber; The auxiliary chamber is connected to the main chamber, and a vacuum isolation valve is provided between the main chamber and the auxiliary chamber. A combined transport device includes an upright transport assembly and an inverted transport assembly. The upright transport assembly is used to fix the optical element in an upright position in the main chamber, and the inverted transport assembly is used to transport the optical element from the secondary chamber to the main chamber and keep it in an inverted position. An ion source system includes an ion source, a first rotating device, and a second rotating device. The first rotating device is used to drive the ion source to rotate around a first rotating axis, and the second rotating device is used to drive the first rotating device and the ion source to rotate together around a second rotating axis. The first rotating axis is set along the Z-axis, and the second rotating axis is set along the X-axis. The motion axis system, whose movable end is connected to the ion source system, is used to drive the ion source system to move within the main chamber to adjust the position of the ion source; and The control system is electrically connected to the combined transport device, the ion source system, and the motion axis system. The control system is used to control the transport of optical elements and adjust the beam direction and position of the ion source to achieve switching between multiple processing modes.

[0010] As an optional implementation of the above technical solution, the processing modes include horizontal processing mode, vertical processing mode, and side processing mode. In horizontal processing mode, the second rotating device adjusts the beam output direction of the ion source to vertically upward, and the ion beam processes the bottom surface of the optical element. In vertical processing mode, the second rotating device adjusts the beam output direction of the ion source to horizontal, and the ion beam processes the front surface of the optical element. In side processing mode, the first rotating device and the second rotating device adjust the beam output direction of the ion source to oblique, and the ion beam performs oblique incident processing on the side surface of the optical element.

[0011] As an optional embodiment of the above technical solution, the second rotating device is used to drive the ion source to rotate around the rotation axis in the range of 0° to 180°, so that the ion source can perform horizontal processing on the inverted optical element from bottom to top, front processing on the upright optical element from the horizontal direction, and oblique processing on the side of the upright optical element by angle deflection.

[0012] As an optional implementation of the above technical solution, both the first rotating device and the second rotating device are equipped with an angle encoder. The angle encoder is used to detect the current rotation angle of the ion source in real time and feed it back to the control system to realize closed-loop control of the ion source angle deflection.

[0013] As an optional implementation of the above technical solution, it also includes a probe, which is used to acquire the position and shape information of the optical element and feed the position and shape information of the optical element back to the control system in real time; the control system generates a processing trajectory based on the position and shape information of the optical element, and uses the processing trajectory to control the movement of the ion source, so that the ion beam is incident along the normal direction of the surface of the optical element and the processing distance is kept constant to perform scanning and polishing processing on the optical element; the processing trajectory includes the displacement of the motion axis system corresponding to each processing point and the rotation angle of the first rotating device and the second rotating device.

[0014] As an optional implementation of the above technical solution, the motion axis system includes an X-axis linear module, a Y-axis linear module and a Z-axis linear module. The movable end of the X-axis linear module is connected to the fixed end of the Y-axis linear module, the movable end of the Y-axis linear module is connected to the fixed end of the Z-axis linear module, and the movable end of the Z-axis linear module is connected to the fixed end of the second rotating device.

[0015] As an optional implementation of the above technical solution, it also includes a beam detection device, which is electrically connected to the control system. The beam detection device is used to collect the beam parameters of the ion beam and transmit them to the control system.

[0016] As an optional implementation of the above technical solution, the beam detection device includes a first Faraday cup and a second Faraday cup, with the first Faraday cup located near the inverted transport component and the second Faraday cup located near the upright transport component.

[0017] As an optional implementation of the above technical solution, the upright transport assembly includes a horizontal guide rail and an upright transport seat. The horizontal guide rail is disposed in the main cavity, and the upright transport seat slides with the horizontal guide rail, so that the upright transport seat transports the optical element in an upright posture.

[0018] As an optional implementation of the above technical solution, the inverted transport assembly includes an inverted transport vehicle, a first inverted guide rail, a second inverted guide rail, and a push-pull mechanism. The inverted transport vehicle transports the optical components in an inverted posture. The first inverted guide rail is located in the main chamber, and the second inverted guide rail is located in the auxiliary chamber. The first and second inverted guide rails are connected to form a continuous guide rail path when the vacuum isolation valve is opened. The push-pull mechanism is used to drive the inverted transport vehicle to move along the first and second inverted guide rails.

[0019] As an optional implementation of the above technical solution, the secondary chamber is provided with a flip door, and the flip door is equipped with a flip drive cylinder.

[0020] On the other hand, the present invention adopts the following technical solution: a working method of a multi-dimensional ion beam processing device, comprising the following steps: According to the type of optical element to be processed and the processing requirements, the optical element is clamped and fixed, and the processing mode is selected; if the vertical processing mode or the side processing mode is selected, the clamped and fixed optical element is fixed in the main cavity in an upright position; if the vertical-horizontal processing mode is selected, the clamped and fixed optical element is fixed in the main cavity in an upside-down position. According to the selected processing mode, the first and second rotating devices are controlled by the control system to adjust the ion source to the corresponding rotation angle and processing start position. The ion source is activated, and the motion axis system drives the ion source to scan and polish the optical element along a preset path. During the side processing mode, the angle encoder detects the current rotation angle of the ion source in real time and feeds it back to the control system. The control system calculates the surface normal direction at each processing point in real time based on the three-dimensional surface model of the optical element, and dynamically adjusts the rotation angle of the first and second rotating devices and the position of the motion axis system so that the ion beam is incident along the normal direction of the surface of the optical element and the processing distance is kept constant to scan and polish the optical element. After processing is completed, the control system controls the ion source to return to its original position and removes the processed optical components.

[0021] The beneficial effects of this invention are as follows: 1. By installing upright and inverted transport components within the main chamber and integrating both into the same device, compatibility between upright and inverted clamping methods for optical components is achieved within the same equipment. Operators can select the most suitable clamping method based on the type of optical component and processing requirements, eliminating the need for different processing equipment for different clamping methods. This significantly improves the equipment's versatility and reduces investment costs.

[0022] 2. The ion source system, through the cooperation of the second rotating device and the ion source mounting base, allows the ion source to rotate around the rotation axis within a range of 0° to 180°, achieving continuous adjustment of the ion source beam direction from vertically upward to horizontally. This beam direction adjustment, combined with both upright and inverted clamping methods, enables the equipment to flexibly switch between multiple processing modes, such as horizontal, vertical, and side processing, at a single processing station. This meets the multi-angle processing needs of different zones of spherical mirrors and local shaping of aspherical components, expanding the processing dimensions of the equipment.

[0023] 3. The angle encoder installed on the ion source mounting base can detect the current rotation angle of the ion source in real time and feed it back to the control system, realizing closed-loop control of the ion source angle deflection. In the side processing mode, the control system calculates the surface normal direction at each processing point in real time based on the three-dimensional surface model of the optical element, and dynamically adjusts the angles of the first and second rotating devices, so that the ion beam always incident along the normal direction of the optical element surface during the scanning and polishing process, ensuring the consistency of the removal function and improving the processing accuracy of complex curved surface elements.

[0024] 4. A vacuum isolation valve is installed between the main chamber and the auxiliary chamber, allowing the auxiliary chamber to be evacuated independently during the loading and unloading of optical components, while the main chamber remains under vacuum. This design reduces the time required for repeated evacuation of the main chamber each time an optical component is replaced, thus improving the operating efficiency of the equipment.

[0025] 5. The motion axis system adopts a structure in which X-axis linear modules, Y-axis linear modules and Z-axis linear modules are stacked in sequence, providing the ion source system with precise displacement capability in three-dimensional space. Combined with the angle adjustment of the first and second rotating devices, multi-dimensional adjustment of the ion source position and beam direction is realized. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a multi-dimensional ion beam processing device from one perspective in one embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a combined transport device in one embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an inverted transport component in one embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the flip door and the flip drive cylinder in one embodiment of the present invention.

[0027] In the diagram: 1-Main chamber; 2-Secondary chamber; 3-Vacuum isolation valve; 4-Upright transport assembly; 5-Inverted transport assembly; 6-Ion source system; 7-Motion axis system; 8-Beam detection device; 9-Optical element; 21-Flip door; 22-Flip drive cylinder; 41-Horizontal guide rail; 42-Upright transport seat; 51-Inverted transport vehicle; 52-First inverted guide rail; 53-Second inverted guide rail; 54-Push-pull mechanism; 61 - Ion source; 62 - First rotating device; 63 - Second rotating device; 71 - X-axis linear module; 72 - Y-axis linear module; 73 - Z-axis linear module. Detailed Implementation

[0028] like Figures 1-4 As shown, this embodiment provides a multi-dimensional ion beam processing device, including a main chamber 1, a secondary chamber 2, a combined transport device, an ion source system 6, a motion axis system 7, and a control system. The main chamber 1 serves as the primary working area for ion beam processing, accommodating optical components 9 and providing a closed space for the process. The secondary chamber 2 is connected to the main chamber 1 via a flange, and a vacuum isolation valve 3 is provided between them. When the vacuum isolation valve 3 is open, the main chamber 1 and the secondary chamber 2 are connected, allowing the optical components 9 to be transported between them; when the vacuum isolation valve 3 is closed, the main chamber 1 and the secondary chamber 2 are isolated from each other, maintaining their respective vacuum states. This ensures that loading and unloading of optical components 9 in the secondary chamber 2 does not affect the vacuum environment of the main chamber 1, reducing the time required for repeated vacuuming of the main chamber 1.

[0029] like Figure 1 As shown, the combined transport device includes an upright transport assembly 4 and an inverted transport assembly 5. The upright transport assembly 4 is disposed inside the main chamber 1 and is used to fix the optical element 9 in an upright position (i.e., the front of the optical element 9 is vertically facing the ion source 61) inside the main chamber 1. Specifically, the upright transport assembly 4 includes a horizontal guide rail 41 and an upright transport seat 42. The horizontal guide rail 41 is fixedly disposed inside the main chamber 1 and extends horizontally. The upright transport seat 42 is slidably engaged with the horizontal guide rail 41. When the hatch of the main chamber 1 is opened, the optical element 9 is installed in an upright position on the upright transport seat 42. The upright transport seat 42 transports the optical element 9 in an upright position along the horizontal guide rail 41 to the predetermined processing position inside the main chamber 1.

[0030] like Figure 3 As shown, the inverted transport assembly 5 is used to transport the optical element 9 from the secondary chamber 2 to the main chamber 1 and maintain it in an inverted position. Specifically, the inverted transport assembly 5 includes an inverted transport cart 51, a first inverted guide rail 52, a second inverted guide rail 53, and a push-pull mechanism 54. The inverted transport cart 51 carries the optical element 9 and transports it in an inverted position. The first inverted guide rail 52 is located inside the main chamber 1, and the second inverted guide rail 53 is located inside the secondary chamber 2. The first inverted guide rail 52 and the second inverted guide rail 53 are connected to form a continuous guide rail path when the vacuum isolation valve 3 is opened. The push-pull mechanism 54 drives the inverted transport cart 51 to move along the first inverted guide rail 52 and the second inverted guide rail 53, causing the inverted transport cart 51 to reciprocate between the secondary chamber 2 and the main chamber 1. The push-pull mechanism 54 includes a linear module, a push-pull head, and an electromagnetic component. The push-pull head is provided at the movable end of the linear module, and the electromagnetic component is provided at the push-pull head. When the electromagnetic component is energized, it can attract the inverted transport vehicle 51, and when the electromagnetic component is de-energized, it releases the inverted transport vehicle 51.

[0031] like Figure 4As shown, the sub-chamber 2 is provided with a flip door 21, and the flip door 21 is equipped with a flip drive cylinder 22. The movable end of the flip drive cylinder 22 is connected to the flip door 21. The flip drive cylinder 22 is used to drive the flip door 21 to open or close, so as to install or remove the optical element 9 into or out of the sub-chamber 2.

[0032] like Figure 2 As shown, the ion source system 6 includes an ion source 61, a first rotating device 62, and a second rotating device 63. The first rotating device 62 drives the ion source 61 to rotate around a first rotating axis, and the second rotating device 63 drives the first rotating device 62 and the ion source 61 to rotate together around a second rotating axis. The first rotating axis is set along the Z-axis, and the second rotating axis is set along the X-axis. The first rotating device 62 and the second rotating device 63 drive the ion source 61 to move, thereby adjusting the beam direction of the ion source 61. Both the first rotating device 62 and the second rotating device 63 are equipped with angle encoders. The angle encoders are used to detect the current rotation angle of the ion source 61 in real time and feed it back to the control system to achieve closed-loop control of the ion source 61's angle deflection. The second rotating device 63 is used to drive the ion source 61 to rotate around the rotation axis within the range of 0° to 180°, so that the ion source 61 can perform horizontal processing on the inverted optical element 9 from bottom to top (0° position, beam direction vertically upward), perform front processing on the upright optical element 9 from the horizontal direction (90° position, beam direction horizontal), and perform oblique processing on the side of the upright optical element 9 by angle deflection (any angle between 0° and 90°).

[0033] It also includes a probe, which is used to acquire the position and shape information of the optical element 9 and feed the position and shape information of the optical element 9 back to the control system in real time; the control system generates a processing trajectory based on the position and shape information of the optical element 9, and uses the processing trajectory to control the movement of the ion source, so that the ion beam is incident along the normal direction of the surface of the optical element 9 and the processing distance is kept constant to perform scanning and polishing processing on the optical element 9; the processing trajectory includes the displacement of the motion axis system corresponding to each processing point and the rotation angle of the first rotating device 62 and the second rotating device 63.

[0034] The movable end of the motion axis system 7 is connected to the ion source system 6. Specifically, the fixed end of the second rotating device 63 in the ion source system 6 is mounted on the movable output end of the motion axis system 7. The motion axis system 7 drives the ion source system 6 to move within the main chamber 1 to adjust the position of the ion source 61. Specifically, the motion axis system 7 includes an X-axis linear module 71, a Y-axis linear module 72, and a Z-axis linear module 73. The movable end of the X-axis linear module 71 is connected to the fixed end of the Y-axis linear module 72, the movable end of the Y-axis linear module 72 is connected to the fixed end of the Z-axis linear module 73, and the movable end of the Z-axis linear module 73 is connected to the fixed end of the second rotating device 63. The three linear modules are stacked sequentially to form a series-connected three-dimensional moving structure, driving the ion source system 6 to move independently in the X, Y, and Z directions.

[0035] The control system is electrically connected to the combined transport device, the ion source system 6 and the motion axis system 7 respectively. The control system is used to control the transport of the optical element 9 between the main chamber 1 and the auxiliary chamber 2, and to adjust the beam output direction and spatial position of the ion source 61 to achieve the switching of multiple processing modes.

[0036] To achieve real-time monitoring of the ion beam status, the processing equipment also includes a beam current detection device 8, which is electrically connected to the control system. The beam current detection device 8 is used to collect the beam current parameters of the ion beam and transmit them to the control system. Specifically, the beam current detection device 8 includes a first Faraday cup and a second Faraday cup. The first Faraday cup is positioned near the inverted transport assembly 5, such as near the horizontal guide rail 41, and collects the beam current parameters of the ion beam in both vertical and side-mounted processing modes. The second Faraday cup is positioned near the upright transport assembly 4, such as near the first inverted guide rail 52, and collects the beam current parameters of the ion beam in horizontal processing mode. When the optical element 9 is positioned in either an upright or inverted posture, the corresponding Faraday cup monitors the beam current parameters.

[0037] To enable automatic identification and switching of processing modes, the equipment also includes an automatic identification device, which is electrically connected to the control system. The automatic identification device (e.g., a vision sensor) is used to identify the clamping posture (upright or inverted) of the optical element 9, so that the control system can automatically switch to the corresponding processing mode based on the identification result.

[0038] Specifically, the processing modes include horizontal processing mode, vertical processing mode, and side processing mode. In horizontal processing mode, the second rotating device 63 adjusts the beam output direction of the ion source 61 to vertically upward, and the ion beam processes the bottom surface of the inverted optical element 9 from bottom to top. In vertical processing mode, the second rotating device 63 adjusts the beam output direction of the ion source 61 to horizontal, and the ion beam processes the front surface of the upright optical element 9. In side processing mode, the first rotating device 62 and the second rotating device 63 adjust the beam output direction of the ion source 61 to an oblique angle (an angle between 0° and 90°), and the ion beam performs oblique incident processing on the side surface of the upright optical element 9 at a certain tilt angle.

[0039] This embodiment also provides a working method for a multi-dimensional ion beam processing device, including the following steps: According to the type and processing requirements of the optical element 9 to be processed, the optical element 9 is clamped and fixed, and a processing mode is selected. If a vertical processing mode or a side processing mode is selected, the clamped and fixed optical element 9 is fixed in an upright position within the main chamber 1; if a horizontal processing mode is selected, the clamped and fixed optical element 9 is fixed in an inverted position within the main chamber 1. According to the selected processing mode, the first rotating device 62 and the second rotating device 63 are controlled by the control system to adjust the ion source 61 to the corresponding rotation angle and processing starting position. The ion source 61 is started, and the motion axis 7 drives the ion source 61 to scan and polish the optical element 9 along a preset path. During the side-mounted processing mode, the angle encoder detects the current rotation angle of the ion source 61 in real time and feeds it back to the control system. The control system calculates the surface normal direction at each processing point in real time based on the three-dimensional surface model of the optical element 9, and dynamically adjusts the rotation angle of the first rotating device 62 and the second rotating device 63 and the position of the motion axis system 7 to ensure that the ion beam is incident along the normal direction of the surface of the optical element 9 and maintains a constant processing distance for scanning and polishing the optical element 9. After processing is completed, the control system controls the ion source 61 to return to its original position and removes the processed optical element 9.

[0040] In practical applications, the multi-dimensional ion beam processing equipment of the present invention first determines the processing mode according to the type and processing requirements of the optical element 9 to be processed, and then performs corresponding clamping and transportation operations.

[0041] If the vertical or side processing mode is selected: The operator clamps the optical element 9 in an upright position onto the vertical transport seat 42, opens the hatch of the main chamber 1, and fixes the optical element 9 onto the vertical transport seat 42. The vertical transport seat 42 moves along the horizontal guide rail 41, transporting the optical element 9 to the predetermined processing position in the main chamber 1. Then, the hatch is closed, and the vacuum system is activated to evacuate the main chamber 1 to a preset vacuum level. The automatic identification device identifies the upright position of the optical element 9 and transmits the signal to the control system. Based on the identification result, the control system switches the ion source system 6 to either the vertical or side processing mode. In the vertical processing mode, the control system controls the second rotating device 63 to drive the ion source 61 to rotate around the rotation axis to a 90° position, adjusting the beam output direction of the ion source 61 to a horizontal direction, and the ion beam processes the front side of the upright optical element 9. In side-processing mode, the control system calculates the angle between the beam output direction of the ion source 61 and the horizontal plane in real time based on the three-dimensional surface model of the optical element 9 and the processing path. The first rotating device 62 and the second rotating device 63 adjust the ion source 61 to the corresponding oblique angle (between 0° and 90°), and the ion beam is obliquely incident on the side of the optical element 9 at this tilt angle. During side-processing, the angle encoder detects the current rotation angle of the ion source 61 in real time and feeds it back to the control system. The control system performs closed-loop correction based on the deviation between the feedback value and the target value to ensure the accuracy of the beam output direction.

[0042] If the horizontal processing mode is selected: The operator clamps the optical element 9 in an inverted position onto the inverted transport vehicle 51, closes the flip door 21, and evacuates the secondary chamber 2 until the vacuum levels in the secondary chamber 2 and the main chamber 1 are consistent. Then, the vacuum isolation valve 3 is opened, and the push-pull mechanism 54 drives the inverted transport vehicle 51 to move along the second inverted guide rail 53 and the first inverted guide rail 52, moving the optical element 9 from the secondary chamber 2 to the predetermined processing position in the main chamber 1. The vacuum isolation valve 3 is closed, and the control system switches the ion source system 6 to the horizontal processing mode. The second rotating device 63 drives the ion source 61 to rotate around the rotation axis to the 0° position, adjusting the beam output direction of the ion source 61 to vertically upward. The ion beam processes the bottom surface of the inverted optical element 9 from bottom to top.

[0043] During processing, the beam current detection device 8 collects the beam current parameters of the ion beam in real time and transmits them to the control system. When the beam current parameters deviate from the preset range, the control system adjusts the operating parameters of the ion source 61 (such as accelerating voltage, emission current, etc.) or issues an alarm signal. After processing is completed, the control system controls the ion source 61 to return to its original position and shuts it down.

[0044] Compared with existing technologies, the multi-dimensional ion beam processing equipment provided by this invention has the following advantages: 1. By installing an upright transport assembly 4 and an inverted transport assembly 5 within the main chamber 1 and integrating the two transport assemblies into the same device, compatibility between the upright and inverted clamping methods of the optical element 9 is achieved within the same device. Operators can select the most suitable clamping method according to the type of optical element 9 and processing requirements, without needing to configure different processing equipment for different clamping methods, greatly improving the versatility of the equipment and reducing equipment investment costs.

[0045] 2. The ion source system 6, through the cooperation of the second rotating device 63 and the ion source mounting base 62, enables the ion source 61 to rotate around the rotation axis within a range of 0° to 180°, achieving continuous adjustment of the beam output direction of the ion source 61 from vertically upward to horizontally. The adjustment of the beam output direction, combined with both upright and inverted clamping methods, allows the equipment to flexibly switch between multiple processing modes, such as horizontal processing, vertical processing, and side processing, at a single processing station. This meets the multi-angle processing needs of different zones of spherical mirrors and local shaping of aspherical components, expanding the processing dimensions of the equipment.

[0046] 3. The angle encoder installed on the ion source mounting base 62 can detect the current rotation angle of the ion source 61 in real time and feed it back to the control system, realizing closed-loop control of the ion source 61 angle deflection. In the side processing mode, the control system calculates the surface normal direction at each processing point in real time based on the three-dimensional surface model of the optical element 9, and dynamically adjusts the angles of the first rotating device 62 and the second rotating device 63, so that the ion beam always incident along the normal direction of the surface of the optical element 9 during the scanning and polishing process, ensuring the consistency of the removal function and improving the processing accuracy of complex curved surface elements.

[0047] 4. A vacuum isolation valve 3 is installed between the main chamber 1 and the auxiliary chamber 2, allowing the auxiliary chamber 2 to be evacuated independently when loading and unloading optical components 9, while the main chamber 1 remains under vacuum. This design reduces the time required for repeated vacuuming of the main chamber 1 each time optical components 9 are replaced, thus improving the operating efficiency of the equipment.

[0048] 5. The motion axis system 7 adopts a structure in which the X-axis linear module 71, the Y-axis linear module 72 and the Z-axis linear module 73 are stacked in sequence, which provides the ion source system 6 with precise displacement capability in three-dimensional space. Combined with the angle adjustment of the first rotating device 62 and the second rotating device 63, the position and beam direction of the ion source 61 can be adjusted in multiple dimensions.

[0049] In the description of this invention, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. They can refer to fixed connections, detachable connections, or integral connections; they can be mechanical or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this invention. Furthermore, the specific features and structures described in the embodiments are included in at least one implementation method. Those skilled in the art can combine features from different implementation methods without contradiction. The scope of protection of this invention is not limited to the specific implementation methods described above. Based on the basic technical concept of this invention, implementation methods that can be conceived by those skilled in the art without creative effort are all within the scope of protection of this invention.

Claims

1. A multi-dimensional ion beam processing device, characterized in that, include: main chamber(1); A secondary chamber (2) is connected to the main chamber (1), and a vacuum isolation valve (3) is provided between the main chamber (1) and the secondary chamber (2). The combined transport device includes an upright transport assembly (4) and an inverted transport assembly (5), wherein the upright transport assembly (4) is used to fix the optical element (9) in an upright position in the main chamber (1), and the inverted transport assembly (5) is used to transport the optical element (9) from the auxiliary chamber (2) to the main chamber (1) and keep it in an inverted position; An ion source system (6) includes an ion source (61), a first rotating device (62) and a second rotating device (63). The first rotating device (62) is used to drive the ion source (61) to rotate around a first rotating axis, and the second rotating device (63) is used to drive the first rotating device (62) and the ion source (61) to rotate together around a second rotating axis. The first rotating axis is set along the Z-axis, and the second rotating axis is set along the X-axis. The motion shaft system (7) has its movable end connected to the ion source system (6). The motion shaft system (7) is used to drive the ion source system (6) to move within the main chamber (1) to adjust the position of the ion source (61). as well as The control system is electrically connected to the combined transport device, the ion source system (6) and the motion axis system (7), respectively. The control system is used to control the transport of the optical element (9) and adjust the beam direction and position of the ion source (61) to achieve the switching of multiple processing modes.

2. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The processing modes include horizontal processing mode, vertical processing mode and side processing mode. In horizontal processing mode, the second rotating device (63) adjusts the beam output direction of the ion source (61) to vertically upward, and the ion beam processes the bottom surface of the optical element (9). In vertical processing mode, the second rotating device (63) adjusts the beam output direction of the ion source (61) to horizontal, and the ion beam processes the front surface of the optical element (9). In side processing mode, the first rotating device (62) and the second rotating device (63) adjust the beam output direction of the ion source (61) to oblique, and the ion beam performs oblique incident processing on the side surface of the optical element (9).

3. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The second rotating device (63) is used to drive the ion source (61) to rotate around the rotation axis in the range of 0° to 180°, so that the ion source (61) can perform horizontal processing on the inverted optical element (9) from bottom to top, perform front processing on the upright optical element (9) from the horizontal direction, and perform oblique processing on the side of the upright optical element (9) by angle deflection.

4. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The first rotating device (62) and the second rotating device (63) are both equipped with angle encoders. The angle encoders are used to detect the current rotation angle of the ion source (61) in real time and feed it back to the control system to realize closed-loop control of the angle deflection of the ion source (61). It also includes a probe, which is used to acquire the position and shape information of the optical element (9) and feed back the position and shape information of the optical element (9) to the control system in real time; the control system generates a processing trajectory based on the position and shape information of the optical element (9) and uses the processing trajectory to control the movement of the ion source (61), so that the ion beam is incident along the normal direction of the surface of the optical element (9) and the processing distance is kept constant to perform scanning and polishing processing on the optical element (9); the processing trajectory includes the displacement of the motion axis system corresponding to each processing point and the rotation angle of the first rotating device (62) and the second rotating device (63).

5. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The motion axis system (7) includes an X-axis linear module (71), a Y-axis linear module (72), and a Z-axis linear module (73). The movable end of the X-axis linear module (71) is connected to the fixed end of the Y-axis linear module (72), the movable end of the Y-axis linear module (72) is connected to the fixed end of the Z-axis linear module (73), and the movable end of the Z-axis linear module (73) is connected to the fixed end of the second rotating device (63).

6. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, It also includes a beam detection device (8), which is electrically connected to the control system. The beam detection device (8) is used to collect the beam parameters of the ion beam and transmit them to the control system. The beam detection device (8) includes a first Faraday cup and a second Faraday cup. The first Faraday cup is located near the inverted transport assembly (5), and the second Faraday cup is located near the upright transport assembly (4).

7. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The upright transport assembly (4) includes a horizontal guide rail (41) and an upright transport seat (42). The horizontal guide rail (41) is located in the main chamber (1). The upright transport seat (42) is slidably engaged with the horizontal guide rail (41) and transports the optical element (9) in an upright posture.

8. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The inverted transport assembly (5) includes an inverted transport vehicle (51), a first inverted guide rail (52), a second inverted guide rail (53), and a push-pull mechanism (54). The inverted transport vehicle (51) transports the optical element (9) in an inverted posture. The first inverted guide rail (52) is located in the main chamber (1), and the second inverted guide rail (53) is located in the auxiliary chamber (2). The first inverted guide rail (52) and the second inverted guide rail (53) are connected to form a continuous guide rail path when the vacuum isolation valve (3) is opened. The push-pull mechanism (54) is used to drive the inverted transport vehicle (51) to move along the first inverted guide rail (52) and the second inverted guide rail (53).

9. The multi-dimensional ion beam processing equipment according to claim 1, characterized in that, The secondary chamber (2) is provided with a flip door (21), and the flip door (21) is equipped with a flip drive cylinder (22).

10. A method of operating the multi-dimensional ion beam processing equipment as described in any one of claims 1-9, characterized in that, Includes the following steps: According to the type of optical element (9) to be processed and the processing requirements, the optical element (9) is clamped and fixed, and the processing mode is selected; if the vertical processing mode or the side processing mode is selected, the clamped and fixed optical element (9) is fixed in the main cavity (1) in an upright position; if the vertical and horizontal processing mode is selected, the clamped and fixed optical element (9) is fixed in the main cavity (1) in an upside-down position. According to the selected processing mode, the first rotating device (62) and the second rotating device (63) are controlled by the control system to adjust the ion source (61) to the corresponding rotation angle and processing start position; The ion source (61) is started, and the motion axis (7) drives the ion source (61) to scan and polish the optical element (9) according to the processing trajectory. In the side processing mode, the angle encoder detects the current rotation angle of the ion source (61) in real time and feeds it back to the control system. The control system calculates the surface normal direction at each processing point in real time according to the three-dimensional surface model of the optical element (9), and dynamically adjusts the rotation angle of the first rotating device (62) and the second rotating device (63) and the position of the motion axis (7) so that the ion beam is incident along the normal direction of the surface of the optical element (9) and the processing distance is kept constant to scan and polish the optical element (9). After processing is completed, the control system controls the ion source (61) to return to its original position and removes the processed optical element (9).

Images